Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Features The QW Series Power Modules use advanced, surface-mount technology and deliver high-quality, efficient, and compact dc-dc conversion. Applications ■ Distributed power architectures ■ Workstations ■ Computer equipment ■ Communications equipment ■ Small size: 36.8 mm x 57.9 mm x 12.7 mm (1.45 in. x 2.28 in. x 0.50 in.) ■ High power density ■ High efficiency: 81% typical ■ Low output noise ■ Constant frequency ■ Industry-standard pinout ■ Metal baseplate ■ 2:1 input voltage range ■ Overvoltage and overcurrent protection ■ Remote on/off ■ Remote sense ■ Adjustable output voltage ■ Overtemperature protection ■ ISO* 9001 Certified manufacturing facilities ■ ■ Options ■ Heat sinks available for extended operation ■ Auto-restart after overcurrent shutdown UL†1950 Recognized, CSA ‡ C22.2 No. 950-95 Certified, and VDE § 0805 (EN60950, IEC950) Licensed CE mark meets 73/23/EEC and 93/68/EEC directives** * ISO is a registered trademark of the International Organization for Standardization. † UL is a registered trademark of Underwriters Laboratories, Inc. ‡ CSA is a registered trademark of Canadian Standards Association. § VDE is a trademark of Verband Deutscher Elektrotechniker e.V. ** This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should be followed. (The CE mark is placed on selected products.) Description The QW050F1 and QW075F1 Power Modules are dc-dc converters that operate over an input voltage range of 36 Vdc to 75 Vdc and provide a precisely regulated dc output. The outputs are fully isolated from the inputs, allowing versatile polarity configurations and grounding connections. The modules have maximum power ratings from 33 W to 50 W at a typical full-load efficiency of 81%. The sealed modules offer a metal baseplate for excellent thermal performance. Threaded-through holes are provided to allow easy mounting or addition of a heat sink for high-temperature applications. The standard feature set includes remote sensing, output trim, and remote on/off for convenient flexibility in distributed power applications. Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Input Voltage: Continuous Transient (100 ms) Operating Case Temperature (See Thermal Considerations section.) Storage Temperature I/O Isolation Voltage (for 1 minute) Symbol Min Max Unit VI VI, trans TC — — –40 75 100 100 Vdc V °C Tstg — –55 — 125 1500 °C Vdc Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Table 1. Input Specifications Parameter Operating Input Voltage Maximum Input Current (VI = 0 V to 75 V; IO = IO, max; see Figures 1 and 2): QW050F1 QW075F1 Inrush Transient Input Reflected-ripple Current, Peak-to-peak (5 Hz to 20 MHz, 12 µH source impedance; see Figure 13.) Input Ripple Rejection (120 Hz) Symbol VI Min 36 Typ 48 Max 75 Unit Vdc II, max II, max i2t II — — — — — — — 10 2.5 3.5 1.3 — A A A2s mAp-p — — 60 — dB Fusing Considerations CAUTION: This power module is not internally fused. An input line fuse must always be used. This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a normal-blow fuse with a maximum rating of 3 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data for further information. 2 Lucent Technologies Inc. Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Electrical Specifications (continued) Table 2. Output Specifications Parameter Output Voltage Set Point (VI = 48 V; IO = IO, max; TC = 25 °C) Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life. See Figure 15.) Output Regulation: Line (VI = 36 V to 75 V) Load (IO = IO, min to IO, max) Temperature (TC = –40 °C to +100 °C) Output Ripple and Noise Voltage (See Figure 14.): RMS Peak-to-peak (5 Hz to 20 MHz) External Load Capacitance Output Current (At IO < IO, min, the modules may exceed output ripple specifications.) Output Current-limit Inception (VO = 90% of VO, nom) Efficiency (VI = 48 V; IO = IO, max; TC = 70 °C) Switching Frequency Dynamic Response (∆IO/∆t = 1 A/10 µs, VI = 48 V, TC = 25 °C; tested with a 1000 µF aluminum and a 1.0 µF ceramic capacitor across the load.): Load Change from IO = 50% to 75% of IO, max: Peak Deviation Settling Time (VO < 10% of peak deviation) Load Change from IO = 50% to 25% of IO, max: Peak Deviation Settling Time (VO < 10% of peak deviation) Device All Symbol VO, set Min 3.25 Typ 3.3 Max 3.35 Unit Vdc All VO 3.20 — 3.40 Vdc All All All — — — — — — 0.01 0.05 15 0.1 0.2 50 %VO %VO mV All All — — — — — — 40 150 mVrms mVp-p All — QW050F1 QW075F1 IO IO 0 0.5 0.5 — — — * 10 15 µF A A QW050F1 QW075F1 QW050F1 QW075F1 All All IO, cli IO, cli η η — — — — — — 15 20 81 81 380 20† 26† — — — A A % % kHz — — — — 5 700 — — %VO, set µs — — — — 5 700 — — %VO, set µs * Consult your sales representative or the factory. † These are manufacturing test limits. In some situations, results may differ. Table 3. Isolation Specifications Parameter Isolation Capacitance Isolation Resistance Lucent Technologies Inc. Min — 10 Typ 2500 — Max — — Unit pF MΩ 3 Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W General Specifications Parameter Calculated MTBF (IO = 80% of IO, max; TC = 40 °C): QW050F1 QW075F1 Weight Min Typ — 4,000,000 3,600,000 — Max Unit 75 (2.7) hours hours g (oz.) Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Remote On/Off Signal Interface (VI = 0 V to 75 V; open collector or equivalent compatible; signal referenced to VI(–) terminal; see Figure 16 and Feature Descriptions.): Logic Low—Module On Logic High—Module Off Logic Low: At Ion/off = 1.0 mA At Von/off = 0.0 V Logic High: At Ion/off = 0.0 µA Leakage Current Turn-on Time (See Figures 11 and 12.) (IO = 80% of IO, max; VO within ±1% of steady state) Output Voltage Adjustment (See Feature Descriptions.): Output Voltage Remote-sense Range Output Voltage Set-point Adjustment Range (trim) Output Overvoltage Protection Overtemperature Protection Symbol Min Typ Max Unit Von/off Ion/off 0 — — — 1.2 1.0 V mA Von/off Ion/off — — — — — — 20 15 50 35 V µA ms — — VO, sd TC — 60 3.8* — — — 0.5 110 4.5* V %VO, nom V — 105 — °C * These are manufacturing test limits. In some situations, results may differ. Solder, Cleaning, and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical testing. The result of inadequate circuit-board cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning, and drying procedures, refer to Lucent Technologies Board-Mounted Power Modules Soldering and Cleaning Application Note (AP97-021EPS). 4 Lucent Technologies Inc. Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Characteristic Curves The following figures provide typical characteristics for the power modules. The figures are identical for both on/off configurations. 82 1.4 1.0 80 EFFICIENCY, η (%) INPUT CURRENT, II (A) 81 IO = 10 A IO = 6 A IO = 1 A 1.2 0.8 0.6 0.4 79 78 77 76 75 VI = 36 V VI = 48 V VI = 75 V 74 0.2 73 72 0.0 20 25 30 35 40 45 50 55 60 65 SEE NOTE 3 2 70 75 4 5 6 7 8 9 10 OUTPUT CURRENT, IO (A) INPUT VOLTAGE, VI (V) 8-2960 (F) 8-2959 (F) Figure 1. Typical QW050F1 Input Characteristics at Room Temperature Note: Pending improvement will add 1% to the above curves. Figure 3. Typical QW050F1 Converter Efficiency vs. Output Current at Room Temperature 2.5 82 80 EFFICIENCY, η (%) INPUT CURRENT, II (A) 81 2.0 IO = 15.0 A IO = 8.0 A IO = 1.5 A 1.5 1.0 0.5 0.0 20 79 78 77 76 75 VI = 36 V VI = 48 V VI = 75 V 74 25 30 35 40 45 50 55 60 65 70 75 73 72 SEE NOTE 2 3 4 5 6 7 8 9 10 11 12 13 14 15 INPUT VOLTAGE, VI (V) OUTPUT CURRENT, IO (A) 8-3032 (F) Figure 2. Typical QW075F1 Input Characteristics at Room Temperature Lucent Technologies Inc. 8-2961 (F) Note: Pending improvement will add 1% to the above curves. Figure 4. Typical QW075F1 Converter Efficiency vs. Output Current at Room Temperature 5 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W OUTPUT CURRENT, IO (A) OUTPUT VOLTAGE, VO (V) (1 A/div) (50 mV/div) Characteristic Curves (continued) OUTPUT VOLTAGE, VO (V) (50 mV/div) VI = 75 V VI = 54 V VI = 36 V Data Sheet May 2000 5A 2.5 A TIME, t (200 µs/div) 8-2962 (F) Note: Tested with a 1000 µF aluminum and a 1.0 µF ceramic capacitor across the load. TIME, t (1 µs/div) 8-2070 (C) Note: See Figure 14 for test conditions. OUTPUT CURRENT, IO (A) OUTPUT VOLTAGE, VO (V) (1 A/div) (50 mV/div) Figure 5. Typical QW050F1 Output Ripple Voltage at Room Temperature and 10 A Output OUTPUT VOLTAGE, VO (V) (50 mV/div) VI = 75 V VI = 54 V VI = 36 V TIME, t (1 µs/div) 8-3033 (F) Note: See Figure 14 for test conditions. Figure 6. Typical QW075F1 Output Ripple Voltage at Room Temperature and 10 A Output 6 Figure 7. Typical QW050F1 Transient Response to Step Decrease in Load from 50% to 25% of IO, max at Room Temperature and 54 Vdc Input (Waveform Averaged to Eliminate Ripple Component.) 7.5 A 3.75 A TIME, t (200 µs/div) 8-2963 (F) Note: Tested with a 1000 µF aluminum and a 1.0 µF ceramic capacitor across the load. Figure 8. Typical QW075F1 Transient Response to Step Decrease in Load from 50% to 25% of IO, max at Room Temperature and 54 Vdc Input (Waveform Averaged to Eliminate Ripple Component.) Lucent Technologies Inc. Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W REMOTE ON/OFF, VON/OFF (V) OUTPUT VOLTAGE, VO (V) (1 V/div) 7.5 A 5A TIME, t (5 ms/div) 8-3034 (F) Note: Tested with a 1000 µF aluminum and a 1.0 µF ceramic capacitor across the load. TIME, t (200 µs/div) 8-2964 (F) Note: Tested with a 1000 µF aluminum and a 1.0 µF ceramic capacitor across the load. OUTPUT VOLTAGE, VO (V) (1 V/div) OUTPUT CURRENT, IO (A) OUTPUT VOLTAGE, VO (V) (1 A/div) (50 mV/div) Figure 9. Typical QW050F1 Transient Response to Step Increase in Load from 50% to 75% of IO, max at Room Temperature and 54 Vdc Input (Waveform Averaged to Eliminate Ripple Component.) Figure 11. QW050F1 Typical Start-Up from Remote On/Off; IO = IO, max REMOTE ON/OFF, VON/OFF (V) OUTPUT CURRENT, IO (A) OUTPUT VOLTAGE, VO (V) (1 A/div) (50 mV/div) Characteristic Curves (continued) 11.25 A TIME, t (2 ms/div) 8-2966 (F) 7.5 A Note: Tested with a 1000 µF aluminum and a 1.0 µF ceramic capacitor across the load. TIME, t (200 µs/div) 8-2965 (F) Note: Tested with a 1000 µF aluminum and a 1.0 µF ceramic capacitor across the load. Figure 10. Typical QW075F1 Transient Response to Step Increase in Load from 50% to 75% of IO, max at Room Temperature and 54 Vdc Input (Waveform Averaged to Eliminate Ripple Component.) Lucent Technologies Inc. Figure 12. QW075F1 Typical Start-Up from Remote On/Off; IO = IO, max 7 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Test Configurations Design Considerations Input Source Impedance TO OSCILLOSCOPE CURRENT PROBE LTEST V I (+) 12 µH CS 220 µF ESR < 0.1 Ω 33 µF @ 20 °C, 100 kHz ESR < 0.7 Ω @ 100 kHz BATTERY V I (–) 8-203 (C).l Note: Measure input reflected-ripple current with a simulated source inductance (LTEST) of 12 µH. Capacitor CS offsets possible battery impedance. Measure current as shown above. Figure 13. Input Reflected-Ripple Test Setup COPPER STRIP V O (+) 1.0 µF 10 µF RESISTIVE LOAD SCOPE V O (–) 8-513 (C).d Note: Use a 1.0 µF ceramic capacitor and a 10 µF aluminum or tantalum capacitor. Scope measurement should be made using a BNC socket. Position the load between 51 mm and 76 mm (2 in. and 3 in.) from the module. Figure 14. Peak-to-Peak Output Noise Measurement Test Setup SENSE(+) VI(+) CONTACT AND DISTRIBUTION LOSSES VO(+) IO II LOAD SUPPLY VI(–) CONTACT RESISTANCE Data Sheet May 2000 VO(–) SENSE(–) 8-749 (C) Note: All measurements are taken at the module terminals. When socketing, place Kelvin connections at module terminals to avoid measurement errors due to socket contact resistance. [ V O (+) – V O (–) ] I O η = ------------------------------------------------ x 100 [ V I (+) – V I (–) ] I I % The power module should be connected to a low ac-impedance input source. Highly inductive source impedances can affect the stability of the power module. For the test configuration in Figure 13, a 33 µF electrolytic capacitor (ESR < 0.7 Ω at 100 kHz) mounted close to the power module helps ensure stability of the unit. For other highly inductive source impedances, consult the factory for further application guidelines. Safety Considerations For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL1950, CSA C22.2 No. 950-95, and VDE 0805 (EN60950, IEC950). If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75 Vdc), for the module’s output to be considered meeting the requirements of safety extra-low voltage (SELV), all of the following must be true: ■ The input source is to be provided with reinforced insulation from any hazardous voltages, including the ac mains. ■ One VI pin and one VO pin are to be grounded, or both the input and output pins are to be kept floating. ■ The input pins of the module are not operator accessible. ■ Another SELV reliability test is conducted on the whole system, as required by the safety agencies, on the combination of supply source and the subject module to verify that under a single fault, hazardous voltages do not appear at the module’s output. Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pin and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a maximum 3 A normal-blow fuse in the ungrounded lead. Figure 15. Output Voltage and Efficiency Measurement Test Setup 8 Lucent Technologies Inc. Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Feature Descriptions Ion/off Overcurrent Protection To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting for up to one second. If overcurrent exists for more than one second, the unit will shut down. At the point of current-limit inception, the unit shifts from voltage control to current control. If the output voltage is pulled very low during a severe fault, the currentlimit circuit can exhibit either foldback or tailout characteristics (output current decrease or increase). The module is available in two overcurrent configurations. In one configuration, when the unit shuts down it will latch off. The overcurrent latch is reset by either cycling the input power or by toggling the ON/OFF pin for one second. In the other configuration, the unit will try to restart after shutdown. If the output overload condition still exists when the unit restarts, it will shut down again. This operation will continue indefinitely until the overcurrent condition is corrected. Remote On/Off Negative logic remote on/off turns the module off during a logic high and on during a logic low. To turn the power module on and off, the user must supply a switch to control the voltage between the on/off terminal and the VI(–) terminal (Von/off). The switch can be an open collector or equivalent (see Figure 16). A logic low is Von/off = 0 V to 1.2 V. The maximum Ion/off during a logic low is 1 mA. The switch should maintain a logic-low voltage while sinking 1 mA. During a logic high, the maximum Von/off generated by the power module is 15 V. The maximum allowable leakage current of the switch at Von/off = 15 V is 50 µA. If not using the remote on/off feature, short the ON/OFF pin to VI(–). + ON/OFF Von/off SENSE(+) – VO(+) LOAD VI(+) VI(–) VO(–) SENSE(–) 8-720 (C).c Figure 16. Remote On/Off Implementation Remote Sense Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections. The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table, i.e.: [VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V The voltage between the VO(+) and VO(–) terminals must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage setpoint adjustment (trim). See Figure 17. If not using the remote-sense feature to regulate the output at the point of load, then connect SENSE(+) to VO(+) and SENSE(–) to VO(–) at the module. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. Consult the factory if you need to increase the output voltage more than the above limitation. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power. Lucent Technologies Inc. 9 Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Feature Descriptions (continued) point adjustment (trim). See Figure 17. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. Consult the factory if you need to increase the output voltage more than the above limitation. Remote On/Off (continued) SENSE(+) SENSE(–) VI(+) SUPPLY VO(+) IO II VI(–) CONTACT RESISTANCE LOAD VO(–) CONTACT AND DISTRIBUTION LOSSES 8-651 (C).m Figure 17. Effective Circuit Configuration for Single-Module Remote-Sense Operation The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power. Output Voltage Set-Point Adjustment (Trim) VI(+) Output voltage trim allows the user to increase or decrease the output voltage set point of a module. This is accomplished by connecting an external resistor between the TRIM pin and either the SENSE(+) or SENSE(–) pins. The trim resistor should be positioned close to the module. ON/OFF CASE VO(+) SENSE(+) TRIM RLOAD Radj-down VI(–) SENSE(–) VO(–) If not using the trim feature, leave the TRIM pin open. R adj-down = 510 – 10.2 k Ω --------- ∆% The test results for this configuration are displayed in Figure 19. This figure applies to all output voltages. With an external resistor connected between the TRIM and SENSE(+) pins (Radj-up), the output voltage set point (VO, adj) increases (see Figure 20). The following equation determines the required external-resistor value to obtain a percentage output voltage change of ∆%. 5.1V O ( 100 + ∆% ) 510 R adj-up = ----------------------------------------------- – ---------- – 10.2 k Ω ∆% 1.225∆% The test results for this configuration are displayed in Figure 21. The voltage between the VO(+) and VO(–) terminals must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set10 8-748 (C).b Figure 18. Circuit Configuration to Decrease Output Voltage ADJUSTMENT RESISTOR VALUE (Ω) With an external resistor between the TRIM and SENSE(–) pins (Radj-down), the output voltage set point (VO, adj) decreases (see Figure 18). The following equation determines the required external-resistor value to obtain a percentage output voltage change of ∆%. 1M 100k 10k 1k 0 10 20 30 40 % CHANGE IN OUTPUT VOLTAGE (∆%) 8-2579 (C) Figure 19. Resistor Selection for Decreased Output Voltage Lucent Technologies Inc. Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Feature Descriptions (continued) Overtemperature Protection Output Voltage Set-Point Adjustment (Trim) (continued) These modules feature an overtemperature protection circuit to safeguard against thermal damage. The circuit shuts down and latches off the module when the maximum case temperature is exceeded. The module can be restarted by cycling the dc input power for at least 1.0 second or by toggling the primary or secondary referenced remote on/off signal for at least 1.0 second. VO(+) VI(+) ON/OFF SENSE(+) Radj-up CASE VI(–) Thermal Considerations RLOAD TRIM SENSE(–) Introduction VO(–) 8-715 (C).b ADJUSTMENT RESISTOR VALUE (Ω) Figure 20. Circuit Configuration to Increase Output Voltage 10M The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation of the unit. Heat-dissipating components inside the unit are thermally coupled to the case. Heat is removed by conduction, convection, and radiation to the surrounding environment. Proper cooling can be verified by measuring the case temperature. Peak temperature (TC) occurs at the position indicated in Figure 22. 33 (1.30) 1M 14 (0.55) VI(+) ON/OFF 100k VI(–) VO(+) (+)SENSE TRIM (–)SENSE VO(–) 8-2104 (C) 10k 0 2 4 6 8 10 % CHANGE IN OUTPUT VOLTAGE (∆%) 8-2580 (C) Note: Top view, pin locations are for reference only. Measurements shown in millimeters and (inches). Figure 22. Case Temperature Measurement Location Figure 21. Resistor Selection for Increased Output Voltage Output Overvoltage Protection The output overvoltage protection consists of circuitry that monitors the voltage on the output terminals. If the voltage on the output terminals exceeds the overvoltage protection threshold, then the module will shut down and latch off. The overvoltage latch is reset by either cycling the input power for 1.0 second or by toggling the on/off signal for 1.0 second. Lucent Technologies Inc. The temperature at this location should not exceed 100 °C. The output power of the module should not exceed the rated power for the module as listed in the Ordering Information table. Although the maximum case temperature of the power modules is 100 °C, you can limit this temperature to a lower value for extremely high reliability. 11 Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Thermal Considerations (continued) Increasing airflow over the module enhances the heat transfer via convection. Figure 25 shows the maximum power that can be dissipated by the module without exceeding the maximum case temperature versus local ambient temperature (TA) for natural convection through 4 m/s (800 ft./min.). Note that the natural convection condition was measured at 0.05 m/s to 0.1 m/s (10 ft./min. to 20 ft./min.); however, systems in which these power modules may be used typically generate natural convection airflow rates of 0.3 m/s (60 ft./min.) due to other heat dissipating components in the system. The use of Figure 25 is shown in the following example. Example POWER DISSIPATION, PD (W) Heat Transfer Without Heat Sinks 10 Determine PD (Use Figure 23.): PD = 8.8 W Determine airflow (v) (Use Figure 25.): v = 1.1 m/s (220 ft./min.) Note: Pending improvement will lower the power dissipation and reduce the airflow needed. 7 6 5 VI = 36 V VI = 48 V VI = 75 V 4 3 SEE NOTE 1 2 3 4 5 6 7 8 9 10 OUTPUT CURRENT, IO (A) 8-2967 (F) Note: Pending improvement will lower the power dissipation. Figure 23. QW050F1 Power Dissipation vs. Output Current at Room Temperature 14 POWER DISSIPATION, PD (W) Given: VI = 54 V IO = 10 A TA = 40 °C 8 2 What is the minimum airflow necessary for a QW050F1 operating at VI = 54 V, an output current of 10 A, and a maximum ambient temperature of 40 °C? Solution 9 12 10 8 6 VI = 36 V VI = 54 V VI = 75 V 4 SEE NOTE 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 OUTPUT CURRENT, IO (A) 8-2968 (F) Note: Pending improvement will lower the power dissipation. Figure 24. QW075F1 Power Dissipation vs. Output Current at Room Temperature 12 Lucent Technologies Inc. Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Thermal Considerations (continued) Heat Transfer Without Heat Sinks (continued) POWER DISSIPATION, PD (W) 20 4.0 m/s (800 ft./min.) 3.5 m/s (700 ft./min.) 3.0 m/s (600 ft./min.) 2.5 m/s (500 ft./min.) 2.0 m/s (400 ft./min.) 1.5 m/s (300 ft./min.) 1.0 m/s (200 ft./min.) 0.5 m/s (100 ft./min.) 0.1 m/s (20 ft./min.) NATURAL CONVECTION 15 CASE-TO-AMBIENT THERMAL RESISTANCE, CA (°C/W) 11 10 NO HEAT SINK 1/4 IN. HEAT SINK 1/2 IN. HEAT SINK 1 IN. HEAT SINK 9 8 7 6 5 4 3 2 1 10 0 NAT CONV 0.5 (100) 5 1.0 (200) 1.5 (300) 2.0 (400) 2.5 (500) 3.0 (600) AIR VELOCITY, m/s (ft./min.) 8-2107 (C) 0 0 10 20 30 40 50 60 70 80 90 100 Figure 26. Case-to-Ambient Thermal Resistance Curves; Transverse Orientation LOCAL AMBIENT TEMPERATURE, TA (°C) 8-2306 (C).a Heat Transfer with Heat Sinks The power modules have through-threaded, M3 x 0.5 mounting holes, which enable heat sinks or cold plates to attach to the module. The mounting torque must not exceed 0.56 N-m (5 in.-lb.). For a screw attachment from the pin side, the recommended hole size on the customer’s PWB around the mounting holes is 0.130 ± 0.005 inches. If a larger hole is used, the mounting torque from the pin side must not exceed 0.25 N-m (2.2 in.-lbs.). Thermal derating with heat sinks is expressed by using the overall thermal resistance of the module. Total module thermal resistance (θca) is defined as the maximum case temperature rise (∆TC, max) divided by the module power dissipation (PD): 11 10 CASE-TO-AMBIENT THERMAL RESISTANCE, CA (°C/W) Figure 25. Forced Convection Power Derating with No Heat Sink; Either Orientation NO HEAT SINK 1/4 IN. HEAT SINK 1/2 IN. HEAT SINK 1 IN. HEAT SINK 9 8 7 6 5 4 3 2 1 0 NAT CONV 0.5 (100) 1.0 (200) 1.5 (300) 2.0 (400) 2.5 (500) 3.0 (600) AIR VELOCITY, m/s (ft./min.) 8-2108 (C) Figure 27. Case-to-Ambient Thermal Resistance Curves; Longitudinal Orientation (TC – TA) ∆T C, max = -----------------------θ ca = --------------------PD PD The location to measure case temperature (TC) is shown in Figure 22. Case-to-ambient thermal resistance vs. airflow is shown, for various heat sink configurations and heights, in Figures 26 and 27. Longitudinal orientation is defined as the long axis of the module that is parallel to the airflow direction, whereas in the transverse orientation, the long axis is perpendicular to the airflow. These curves were obtained by experimental testing of heat sinks, which are offered in the product catalog. Lucent Technologies Inc. 13 Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W POWER DISSIPATION, PD (W) Heat Transfer with Heat Sinks (continued) 20 18 1 IN. HEAT SINK 1/2 IN. HEAT SINK 1/4 IN. HEAT SINK NO HEAT SINK 16 14 12 10 POWER DISSIPATION, PD (W) Thermal Considerations (continued) 8 20 18 16 14 12 10 8 1 IN. HEAT SINK 1/2 IN. HEAT SINK 1/4 IN. HEAT SINK NO HEAT SINK 6 4 2 0 0 6 10 4 20 30 40 50 60 70 80 90 100 LOCAL AMBIENT TEMPERATURE, TA (°C) 8-2382 (C) 2 0 0 10 20 30 40 50 60 70 80 90 100 LOCAL AMBIENT TEMPERATURE, TA (°C) Figure 30. Heat Sink Power Derating Curves; 1.0 m/s (200 lfm); Transverse Orientation 8-2380 (C) POWER DISSIPATION, PD (W) POWER DISSIPATION, PD (W) Figure 28. Heat Sink Power Derating Curves; Natural Convection; Transverse Orientation 20 18 1 IN. HEAT SINK 1/2 IN. HEAT SINK 1/4 IN. HEAT SINK NO HEAT SINK 16 14 12 10 20 18 16 14 12 10 8 1 IN. HEAT SINK 1/2 IN. HEAT SINK 1/4 IN. HEAT SINK NO HEAT SINK 6 4 2 0 0 8 6 10 20 30 40 50 60 70 80 90 100 LOCAL AMBIENT TEMPERATURE, TA (°C) 8-2383 (C) 4 2 0 0 10 20 30 40 50 60 70 80 90 100 LOCAL AMBIENT TEMPERATURE, TA (°C) Figure 31. Heat Sink Power Derating Curves; 1.0 m/s (200 lfm); Longitudinal Orientation 8-2381 (C) Figure 29. Heat Sink Power Derating Curves; Natural Convection; Longitudinal Orientation 14 These measured resistances are from heat transfer from the sides and bottom of the module as well as the top side with the attached heat sink; therefore, the case-to-ambient thermal resistances shown are generally lower than the resistance of the heat sink by itself. The module used to collect the data in Figures 26 and 27 had a thermal-conductive dry pad between the case and the heat sink to minimize contact resistance. The use of Figures 26 and 27 are shown in the following example. Lucent Technologies Inc. Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Thermal Considerations (continued) Custom Heat Sinks Heat Transfer with Heat Sinks (continued) A more detailed model can be used to determine the required thermal resistance of a heat sink to provide necessary cooling. The total module resistance can be separated into a resistance from case-to-sink (θcs) and sink-to-ambient (θsa) as shown in Figure 32. Example If an 85 °C case temperature is desired, what is the minimum airflow necessary? Assume the QW075F1 module is operating at VI = 54 V and an output current of 10 A, transverse orientation, maximum ambient air temperature of 40 °C, and the heat sink is 1/2 inch. PD TC TS cs Solution TA sa 8-1304 (C) Given: VI = 54 V IO = 10 A TA = 40 °C TC = 85 °C Heat sink = 1/2 inch Determine PD by using Figure 24: PD = 8.8 W Then solve the following equation: (TC – TA) θ ca = ----------------------PD 85 – 40 ) θ ca = (----------------------8.8 θ ca = 5.1 °C/W Use Figure 26 to determine air velocity for the 1/2 inch heat sink. The minimum airflow necessary for the QW050F1 module is 0.4 m/s (70 ft./min.). Note: Pending improvement will lower the power dissipation and reduce the airflow needed. Figure 32. Resistance from Case-to-Sink and Sink-to-Ambient For a managed interface using thermal grease or foils, a value of θcs = 0.1 °C/W to 0.3 °C/W is typical. The solution for heat sink resistance is: (TC – TA) θsa = ------------------------ – θcs PD This equation assumes that all dissipated power must be shed by the heat sink. Depending on the userdefined application environment, a more accurate model, including heat transfer from the sides and bottom of the module, can be used. This equation provides a conservative estimate for such instances. EMC Considerations For assistance with designing for EMC compliance, please refer to the FLTR100V10 data sheet (DS99-294EPS). Layout Considerations Copper paths must not be routed beneath the power module mounting inserts. For additional layout guidelines, refer to the FLTR100V10 data sheet (DS99-294EPS). Lucent Technologies Inc. 15 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Data Sheet May 2000 Outline Diagram Dimensions are in millimeters and (inches). Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) x.xx mm ± 0.25 mm (x.xxx in. ± 0.010 in.) Top View 36.8 (1.45) 57.9 (2.28) Side View 12.7 (0.50) SIDE LABEL* 0.51 (0.020) 4.1 (0.16) MIN, 2 PLACES 4.1 (0.16) MIN, 6 PLACES 3.5 (0.14) MIN 1.57 (0.062) DIA SOLDER-PLATED BRASS, 2 PLACES 1.02 (0.040) DIA SOLDER-PLATED BRASS, 6 PLACES Bottom View RIVETED CASE PIN (OPTIONAL) 1.09 x 0.76 (0.043 x 0.030) 3.6 (0.14) 5.3 (0.21) 10.9 (0.43) 50.80 (2.000) VO(–) VI(–) 15.24 (0.600) 26.16 (1.030) 7.62 (0.300) 5.3 (0.21) – SENSE ON/OFF MOUNTING INSERTS M3 x 0.5 THROUGH, 4 PLACES 3.81 11.43 (0.150) (0.450) 12.7 (0.50) 11.2 (0.44) TRIM 7.62 (0.300) 15.24 (0.600) + SENSE VO(+) VI(+) 47.2 (1.86) 8-1769 (F).b * Side labels include Lucent logo, product designation, safety agency markings, input/output voltage and current ratings, and bar code. 16 Lucent Technologies Inc. Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Recommended Hole Pattern Component-side footprint. Dimensions are in millimeters and (inches). 5.3 (0.21) 7.62 (0.300) 26.16 (1.030) 15.24 (0.600) 47.2 (1.86) VI(+) VO(+) + SENSE TRIM ON/OFF 7.62 (0.300) – SENSE VI(–) 15.24 (0.600) VO(–) 3.81 (0.150) 5.3 (0.21) 10.9 (0.43) 3.6 (0.14) 11.2 (0.44) 50.80 (2.000) 12.7 (0.50) 11.43 (0.450) MOUNTING INSERTS M3 x 0.5 THROUGH, 4 PLACES CASE PIN (OPTIONAL) 8-1769 (F).b Ordering Information Table 4. Device Codes Input Voltage 48 V 48 V Output Voltage 3.3 V 3.3 V Output Power 33 W 50 W Remote On/Off Logic Negative Negative Device Code QW050F1 QW075F1 Comcode 108153677 108152133 Optional features can be ordered using the suffixes shown in Table 5. The suffixes follow the last letter of the device code and are placed in descending order. For example, the device codes for a QW050F1 module with the following options are shown below: Auto-restart after overcurrent shutdown QW050F41 Table 5. Device Options Option Suffix Auto-restart after overcurrent shutdown 4 Lucent Technologies Inc. 17 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Data Sheet May 2000 Ordering Information (continued) Table 6. Device Accessories Accessory Comcode 1/4 in. transverse kit (heat sink, thermal pad, and screws) 1/4 in. longitudinal kit (heat sink, thermal pad, and screws) 1/2 in. transverse kit (heat sink, thermal pad, and screws) 1/2 in. longitudinal kit (heat sink, thermal pad, and screws) 1 in. transverse kit (heat sink, thermal pad, and screws) 1 in. longitudinal kit (heat sink, thermal pad, and screws) 848060992 848061008 848061016 848061024 848061032 848061040 Dimensions are in millimeters and (inches). 1/4 IN. 2.280 ± 0.015 (57.91 ± 0.38) 1.450 ± 0.015 (36.83 ± 0.38) 1/2 IN. 1/4 IN. 1/2 IN. 1 IN. 1 IN. 1.850 ± 0.005 (47.24 ± 0.13) 1.030 ± 0.005 (26.16 ± 0.13) 8-2473 (F) 8-2472 (F) Figure 33. Longitudinal Heat Sink Figure 34. Transverse Heat Sink 18 Lucent Technologies Inc. Data Sheet May 2000 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Notes Lucent Technologies Inc. 19 QW050F1 and QW075F1 Power Modules: dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 33 W to 50 W Data Sheet May 5, 2000 For additional information, contact your Lucent Technologies Account Manager or the following: POWER SYSTEMS UNIT: Network Products Group, Lucent Technologies Inc., 3000 Skyline Drive, Mesquite, TX 75149, USA +1-800-526-7819 (Outside U.S.A.: +1-972-284-2626, FAX +1-888-315-5182) (product-related questions or technical assistance) INTERNET: http://www.lucent.com/networks/power E-MAIL: [email protected] ASIA PACIFIC: Lucent Technologies Singapore Pte. Ltd., 750D Chai Chee Road #07-06, Chai Chee Industrial Park, Singapore 469004 Tel. (65) 240 8041, FAX (65) 240 8438 CHINA: Lucent Technologies (China) Co. Ltd., SCITECH Place No. 22 Jian Guo Man Wai Avenue, Beijing 100004, PRC Tel. (86) 10-6522 5566 ext. 4187, FAX (86) 10-6512 3694 JAPAN: Lucent Technologies Japan Ltd., Mori Building No. 21, 4-33, Roppongi 1-chome, Minato-ku, Tokyo 106-8508, Japan Tel. (81) 3 5561 5831, FAX (81) 3 5561 1616 LATIN AMERICA: Lucent Technologies Inc., Room 416, 2333 Ponce de Leon Blvd., Coral Gables, FL 33134, USA Tel. +1-305-569-4722, FAX +1-305-569-3820 EUROPE: Technical Inquiries: GERMANY: (49) 89 95086 0 (Munich), UNITED KINGDOM: (44) 1344 865 900 (Ascot), FRANCE: (33) 1 40 83 68 00 (Paris), SWEDEN: (46) 8 594 607 00 (Stockholm), FINLAND: (358) 9 4354 2800 (Helsinki), ITALY: (39) 02 6608131 (Milan), SPAIN: (34) 91 807 1441 (Madrid) Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. Copyright © 2000 Lucent Technologies Inc. All Rights Reserved Printed in U.S.A. May 2000 DS00-177EPS (Replaces DS99-028EPS) Printed On Recycled Paper