ETC LH1525ACD

LH1525ACD/ACDTR
1 Form A
SOP Solid-State Relay
FEATURES
•
•
•
•
•
•
•
•
•
Package Dimensions in Inches (mm)
High-speed Operation
1500 VRMS I/O Isolation
Current-limit Protection
High Surge Capability
Linear, ac/dc Operation
Clean, Bounce-free Switching
Extremely Low Power Consumption
High-reliability Monolithic Receptor
Surface-mountable
8
1
S
2
S
3
S'
4
.336 ±.010
(8.53 ±.25)
.291 ±.010
(7.39 ±.25)
.015 ±.002
(.38 ±.05)
.042
(1.07)
ref.
• UL – File No. E52744
• CSA – Certification 093751
• FIMKO Approval
S'
5
S
AGENCY APPROVALS
.0365 ±.002
(.93 ±.05)
40°
.092 (3.62)
.074 (1.88)
APPLICATIONS
.043 (1.09)
.033 (0.84)
10°
•
•
•
•
PCMCIA Type 2 Cards
Battery Powered Switch Applications
General Telecom Switching
Telephone Line Interface
– On/off Hook
– Ring Relay
– Ground Start
• Programmable Controllers
• Instrumentation
DESCRIPTION
NC
Heat Sink
S
.006
(.15)
typ.
10°
.050
(1.27)
typ
.016
(.41)
typ
10°
0° to 10°
10°
Pin 1 I.D.
1
8
.230 (5.84) 2
.220 (5.59) 3
7
4
5
6
.000 (.000)
.005 (.005)
Lead
coplanarity
.003 (.08)
max.
.225 (5.72)
.215 (5.46)
Part Identification
The LH1525 relay is an SPST normally open switch (1
Form A and Dual 1 Form A respectively) in small-outline
packages (SOP). They require a minimal amount of LED
drive current to operate, making them ideal for battery
powered and power consumption sensitive applications.
Part Number
Description
LH1525ACD
8-pin SOP, Tubes
LH1525ACDTR
8-pin SOP, Tape and Reel
The relays are constructed using a GaAlAs LED for
actuation control and an integrated monolithic die for
the switch output. The die, fabricated in a high-voltage
dielectrically isolated BCDMOS technology, is comprised of a photodiode array, switch-control circuitry,
and MOSFET switches. In addition, the relays employ
current-limiting circuitry enabling it to pass FCC 68.302
and other regulatory surge requirements when overvoltage protection is provided.
 2000 Infineon Technologies Corp. • Optoelectronics Division • San Jose, CA
www.infineon.com/opto • 1-888-Infineon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG • Regensburg, Germany
www.osram-os.com • +49-941-202-7178
1
April 2, 2000-00
Absolute Maximum Ratings, TA=25°C
RECOMMENDED OPERATING CONDITIONS
Parameter
Sym. Min.
Typ.
Max. Unit
LED Forward Current
for Switch Turn-on
(TA=–40°C to +85°C)
IFon
—
20
1.5
mA
Ambient Operating Temperature Range, TA ................... –40° to +85°C
Storage Temperature Range, Tstg ................................. –55° to +150°C
Pin Soldering Temperature, t=5.0 s max, TS ................................260°C
Input/Output Isolation Voltage, VISO .................................... 1500 VRMS
LED Input Ratings:
Continuous Forward Current, IF .............................................. 50 mA
Reverse Voltage, VR .................................................................. 5.0 V
Output Operation:
dc or Peak ac Load Voltage, IL≤50 µA, VL ................................ 400 V
Continuous dc Load Current:
One pole operating, IL ........................................................... 110 mA
Power Dissipation, PDISS .........................................................550 mW
Thermal Resistance, Junction to Ambient, RΘJA ...................... 20 C/W
Recommended Operating Conditions
Load Current (mA)
120
100
2.5 mA
80
2.0 mA
60
40
20
1.5 mA
1.0 mA
ILED=0.3 mA
0
–40 –20
0
20
40
Stresses in excess of the absolute Maximum Ratings can cause permanent
damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of
those given in the operational sections of this document. Exposure to absolute
Maximum Ratings for extended periods of time can adversely affect reliability.
60
80
Temperature (°C)
Electrical Characteristics, TA=25°C
Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result
of engineering evaluations. Typical values are for information purposes only and are not part of the testing requirements.
Parameter
Symbol
Min.
Typ.
Max.
Unit
Test Condition
LED Forward Current for Switch Turn-on
IFon
—
0.3
0.5
mA
IL=100 mA, t=10 ms
LED Forward Current for Switch Turn-off
IFoff
0.01
0.1
—
mA
VL=±350 V, t=100 ms
LED Forward Voltage
VF
0.80
1.15
1.40
V
IF=1.5 mA
ON-resistance:
Pin 5 (±) to 8 (±)
RON
17
25
36
Ω
IF=1.5 mA, IL=±50 mA
Current Limit
ILMT
170
210
270
mA
IF=1.5 mA, t=5.0 ms,
VL=7.0 V
Output Off-state Leakage Current
—
—
—
0.04
—
200
1.0
nA
µA
IF=0 mA, VL=±100 V
VL=±400 V
Turn-on Time
ton
—
—
1.0
0.5
—
1.0
ms
ms
IF=1.5 mA, IL=50 mA
IF=5.0 mA, IL=50 mA
Turn-off Time
toff
—
—
0.2
0.4
—
0.9
ms
ms
IF=1.5 mA, IL=50 mA
IF=5.0 mA, IL=50 mA
 2000 Infineon Technologies Corp. • Optoelectronics Division • San Jose, CA
www.infineon.com/opto • 1-888-Infineon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG • Regensburg, Germany
www.osram-os.com • +49-941-202-7178
LH1525ACD/ACDTR
2
April 2, 2000-00
Functional Description
Figure 1 shows the switch characteristics of the relays.
The relay exhibits an ON-resistance that is exceptionally linear through the origin and up to the knee current
(IK). Beyond IK , the incremental resistance decreases,
minimizing internal power dissipation. Overload currents are clamped at ILMT by the internal current-limit
circuitry. The current-limiting circuitry exhibits a negative temperature coefficient, thereby reducing the current-limit value when relay temperature is increased.
An extended clamp condition, which increases relay
temperature, decreases the current-limit value, resulting in a current foldback characteristic. When the overload is removed, the relay resumes its normal ONresistance characteristic.
Figure 1. Typical AC/DC ON Characteristics
+I
210 mA
ILMT
10 Ω
IK
60 mA
16 Ω
−1.5 V
−V
16 Ω
1.5 V
IK
+V
−60 mA
10 Ω
ILMT
−210 mA
−I
In a 1 Form A relay, to turn the relay on, forward current
is applied to the LED. The amount of current applied
determines the amount of light produced for the photodiode array. This photodiode array develops a drivevoltage for the MOSFET switch outputs. For hightemperature or high-load current operations, more LED
current is required.
Thermal Considerations
To minimize thermal resistance, pins 6 and 7 of the
LH1525ACD are formed into a tab. This tab should be
soldered to a printed circuit board land pattern of
equal or greater size. Do Not run metal underneath the
device or the input-to-output isolation could be jeopardized.
 2000 Infineon Technologies Corp. • Optoelectronics Division • San Jose, CA
www.infineon.com/opto • 1-888-Infineon (1-888-463-4636)
OSRAM Opto Semiconductors GmbH & Co. OHG • Regensburg, Germany
www.osram-os.com • +49-941-202-7178
LH1525ACD/ACDTR
3
April 2, 2000-00