LH1525ACD/ACDTR 1 Form A SOP Solid-State Relay FEATURES • • • • • • • • • Package Dimensions in Inches (mm) High-speed Operation 1500 VRMS I/O Isolation Current-limit Protection High Surge Capability Linear, ac/dc Operation Clean, Bounce-free Switching Extremely Low Power Consumption High-reliability Monolithic Receptor Surface-mountable 8 1 S 2 S 3 S' 4 .336 ±.010 (8.53 ±.25) .291 ±.010 (7.39 ±.25) .015 ±.002 (.38 ±.05) .042 (1.07) ref. • UL – File No. E52744 • CSA – Certification 093751 • FIMKO Approval S' 5 S AGENCY APPROVALS .0365 ±.002 (.93 ±.05) 40° .092 (3.62) .074 (1.88) APPLICATIONS .043 (1.09) .033 (0.84) 10° • • • • PCMCIA Type 2 Cards Battery Powered Switch Applications General Telecom Switching Telephone Line Interface – On/off Hook – Ring Relay – Ground Start • Programmable Controllers • Instrumentation DESCRIPTION NC Heat Sink S .006 (.15) typ. 10° .050 (1.27) typ .016 (.41) typ 10° 0° to 10° 10° Pin 1 I.D. 1 8 .230 (5.84) 2 .220 (5.59) 3 7 4 5 6 .000 (.000) .005 (.005) Lead coplanarity .003 (.08) max. .225 (5.72) .215 (5.46) Part Identification The LH1525 relay is an SPST normally open switch (1 Form A and Dual 1 Form A respectively) in small-outline packages (SOP). They require a minimal amount of LED drive current to operate, making them ideal for battery powered and power consumption sensitive applications. Part Number Description LH1525ACD 8-pin SOP, Tubes LH1525ACDTR 8-pin SOP, Tape and Reel The relays are constructed using a GaAlAs LED for actuation control and an integrated monolithic die for the switch output. The die, fabricated in a high-voltage dielectrically isolated BCDMOS technology, is comprised of a photodiode array, switch-control circuitry, and MOSFET switches. In addition, the relays employ current-limiting circuitry enabling it to pass FCC 68.302 and other regulatory surge requirements when overvoltage protection is provided. 2000 Infineon Technologies Corp. • Optoelectronics Division • San Jose, CA www.infineon.com/opto • 1-888-Infineon (1-888-463-4636) OSRAM Opto Semiconductors GmbH & Co. OHG • Regensburg, Germany www.osram-os.com • +49-941-202-7178 1 April 2, 2000-00 Absolute Maximum Ratings, TA=25°C RECOMMENDED OPERATING CONDITIONS Parameter Sym. Min. Typ. Max. Unit LED Forward Current for Switch Turn-on (TA=–40°C to +85°C) IFon — 20 1.5 mA Ambient Operating Temperature Range, TA ................... –40° to +85°C Storage Temperature Range, Tstg ................................. –55° to +150°C Pin Soldering Temperature, t=5.0 s max, TS ................................260°C Input/Output Isolation Voltage, VISO .................................... 1500 VRMS LED Input Ratings: Continuous Forward Current, IF .............................................. 50 mA Reverse Voltage, VR .................................................................. 5.0 V Output Operation: dc or Peak ac Load Voltage, IL≤50 µA, VL ................................ 400 V Continuous dc Load Current: One pole operating, IL ........................................................... 110 mA Power Dissipation, PDISS .........................................................550 mW Thermal Resistance, Junction to Ambient, RΘJA ...................... 20 C/W Recommended Operating Conditions Load Current (mA) 120 100 2.5 mA 80 2.0 mA 60 40 20 1.5 mA 1.0 mA ILED=0.3 mA 0 –40 –20 0 20 40 Stresses in excess of the absolute Maximum Ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute Maximum Ratings for extended periods of time can adversely affect reliability. 60 80 Temperature (°C) Electrical Characteristics, TA=25°C Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluations. Typical values are for information purposes only and are not part of the testing requirements. Parameter Symbol Min. Typ. Max. Unit Test Condition LED Forward Current for Switch Turn-on IFon — 0.3 0.5 mA IL=100 mA, t=10 ms LED Forward Current for Switch Turn-off IFoff 0.01 0.1 — mA VL=±350 V, t=100 ms LED Forward Voltage VF 0.80 1.15 1.40 V IF=1.5 mA ON-resistance: Pin 5 (±) to 8 (±) RON 17 25 36 Ω IF=1.5 mA, IL=±50 mA Current Limit ILMT 170 210 270 mA IF=1.5 mA, t=5.0 ms, VL=7.0 V Output Off-state Leakage Current — — — 0.04 — 200 1.0 nA µA IF=0 mA, VL=±100 V VL=±400 V Turn-on Time ton — — 1.0 0.5 — 1.0 ms ms IF=1.5 mA, IL=50 mA IF=5.0 mA, IL=50 mA Turn-off Time toff — — 0.2 0.4 — 0.9 ms ms IF=1.5 mA, IL=50 mA IF=5.0 mA, IL=50 mA 2000 Infineon Technologies Corp. • Optoelectronics Division • San Jose, CA www.infineon.com/opto • 1-888-Infineon (1-888-463-4636) OSRAM Opto Semiconductors GmbH & Co. OHG • Regensburg, Germany www.osram-os.com • +49-941-202-7178 LH1525ACD/ACDTR 2 April 2, 2000-00 Functional Description Figure 1 shows the switch characteristics of the relays. The relay exhibits an ON-resistance that is exceptionally linear through the origin and up to the knee current (IK). Beyond IK , the incremental resistance decreases, minimizing internal power dissipation. Overload currents are clamped at ILMT by the internal current-limit circuitry. The current-limiting circuitry exhibits a negative temperature coefficient, thereby reducing the current-limit value when relay temperature is increased. An extended clamp condition, which increases relay temperature, decreases the current-limit value, resulting in a current foldback characteristic. When the overload is removed, the relay resumes its normal ONresistance characteristic. Figure 1. Typical AC/DC ON Characteristics +I 210 mA ILMT 10 Ω IK 60 mA 16 Ω −1.5 V −V 16 Ω 1.5 V IK +V −60 mA 10 Ω ILMT −210 mA −I In a 1 Form A relay, to turn the relay on, forward current is applied to the LED. The amount of current applied determines the amount of light produced for the photodiode array. This photodiode array develops a drivevoltage for the MOSFET switch outputs. For hightemperature or high-load current operations, more LED current is required. Thermal Considerations To minimize thermal resistance, pins 6 and 7 of the LH1525ACD are formed into a tab. This tab should be soldered to a printed circuit board land pattern of equal or greater size. Do Not run metal underneath the device or the input-to-output isolation could be jeopardized. 2000 Infineon Technologies Corp. • Optoelectronics Division • San Jose, CA www.infineon.com/opto • 1-888-Infineon (1-888-463-4636) OSRAM Opto Semiconductors GmbH & Co. OHG • Regensburg, Germany www.osram-os.com • +49-941-202-7178 LH1525ACD/ACDTR 3 April 2, 2000-00