EVER BRIGHT OPTOELECTRONICS CORP. EC04-1206QRC/E-AV ● Features: ●Package Dimensions: 1. Emitted Color : Super Red 2. Lens Appearance: Water Clear. 3. Mono-color type. 4. 3.2x1.6x1.1mm (1206) standard package. 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn’t contain restriction Substance, comply ROHS standard. ● Applications: 1. Automotive : Dashboards, stop lamps, turn signals. 2. Backlighting : LCDs, Key pads advertising. 3. Status indicators : Comsumer & industrial NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ±0.10mm (0.004”) unless otherwise specified. 3.Specifications are subject to change without notice. electronics. 4. General use. ● Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Rating Unit Power Dissipation Pd 52 mW Forward Current IF 20 mA Peak Forward Current ＊1 IFP 100 mA Reverse Volage VR 5 V Operating Temperature Topr -40℃~85℃ - Storage Temperature Tstg -40℃~85℃ - Soldering Temperature Tsol See Page6 - ＊1 Condition for IFP is pulse of 1/10 duty and 0.1msec width. ONE THREE SIX ZERO ZERO TWO FIVE NINE SEVEN DOUBLE NINE,MR.CHEN Ver.1.1 Page 1 of 7 EVER BRIGHT OPTOELECTRONICS CORP. EC04-1206QRC/E-AV ● Electrical and optical characteristics(Ta=25℃) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage Vf IF=20mA - 2.2 2.6 V Luminous Intensity Iv IF=20mA 63 100 - mcd Reverse Current IR VR=5V - - 100 µA Peak Wave Length λp IF=20mA - 644 - nm Dominant Wave Length λd IF=20mA 625 - 635 nm Spectral Line Half-width Δλ IF=20mA - 20 - nm Veiwing Angle 2θ1/2 IF=20mA - 120 - deg ● Typical Electro-Optical Characteristics Curves Fig.2 Forward current derating curve Fig.1 Relative intensity vs. wavelength vs. ambient temperature 1.0 60 Forward current (mA) Relative radiant intensity 50 0.5 40 30 20 10 0 0 594 644 694 20 Wavelength (nm) 80 100 3.0 2.5 Relative Luminous intensity (Normalized @20mA) 40 Forward current (mA) 60 Fig.4 Relative luminous intensity vs. ambient temperature Fig.3 Forward current vs. forward voltage 50 30 20 10 0 40 Ambient temperature Ta( C) 1 2 3 4 2.0 1.5 1.0 0.5 0 -40 5 -20 Forward voltage(V) 0 20 40 60 Ambient temperature Ta( C) A Fig.6 Radiation diagram Fig.5 Relative luminous intensity vs. forward current 0 10 20 30 Relative radiant intensity Relative luminous intensity (@20mA) 2.0 1.5 1.0 0.5 40 1.0 0.9 50 0.8 60 70 0.7 80 90 0 0.5 10 20 30 40 0.3 0.1 0.2 0.4 0.6 50 Forward current (mA) ONE THREE SIX ZERO ZERO TWO FIVE NINE SEVEN DOUBLE NINE,MR.CHEN Ver.1.0 Page 2 of 7 EVER BRIGHT OPTOELECTRONICS CORP. EC04-1206QRC/E-AV ● Tapping and packaging specifications(Units: mm) USER DIRECTION OF FEED 13.0± 0.5 1.27± 0.1 1.5± 0.1 2.0± 0.05 4.0 ± 0.1 TRAILER 179± 1 13.0± 0.5 3.5± 0.1 8.0 ± 0.3 3.5 ± 0.05 CATHODE 4.0 ± 0.1 71.0± 0.1 END 5.3 ± 0.05 START 1.75 ± 0.1 ANODE 1.88± 0.1 LEADER 0.3 FIXING TAPE NOTE: 3000 pcs PER REEL ●Package Method:(unit: mm)Vacuum 12 bag/box 3000 pcs/reel 220 Bar Code Label 245 200 220 Aluminum Foil Bag 185 645 6 box/carton 210 470 ONE THREE SIX ZERO ZERO TWO FIVE NINE SEVEN DOUBLE NINE,MR.CHEN Ver.1.0 Page 3 of 7 EVER BRIGHT OPTOELECTRONICS CORP. EC04-1206QRC/E-AV ● Bin Limits I n t e n s i t y B i n L i m i ts ( A t 2 0 m A ) BIN CODE Min. (mcd) Max. (mcd) P 63 94 Q 94 140 R 140 210 S 210 317 To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 5 % . C o l o r B i n L i m i ts ( A t 2 0 m A ) BIN CODE Min. (nm) Max. (nm) 625 635 * To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 n m . V F B i n L i m i ts ( A t 2 0 m A ) BIN CODE Min.(v) Max.(v) B 1.8 2.0 C 2.0 2.2 D 2.2 2.4 E 2.4 2.6 To l e r a n c e f o r e a c h B i n l i m i t i s ± 0 . 0 5 V. ● B IN： x x x VF BIN CODE Color BIN CODE Intensity BIN CODE ONE THREE SIX ZERO ZERO TWO FIVE NINE SEVEN DOUBLE NINE,MR.CHEN Ver.1.0 Page 4 of 7 EVER BRIGHT OPTOELECTRONICS CORP. EC04-1206QRC/E-AV ● Reliability Test Classification Test Item Reference Standard Operation Life MIL-STD-750D:1026 MIL-STD-883D:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202F:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low Temperature JIS-C-7021 :B-11 Storage Temperature MIL-STD-202F:107D Cycling MIL-STD-750D:1051 MIL-STD-883D:1010 JIS-C-7021 :A-2 Thermal Shock MIL-STD-202F:107D Environmental MIL-STD-750D:1051 Test MIL-STD-883D:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1 Test Conditions Connect with a power If=20mA Ta=Under room temperature Test time=1,000hrs Ta=+85℃±5℃ RH=90%-95% Test time=240hrs Result 0/20 0/20 High Ta=+100℃±5℃ Test time=1,000hrs 0/20 Low Ta=-40℃±5℃ Test time=1,000hrs 0/20 -35℃±5℃~+25℃~+85℃±5℃~+25℃ 30min 5min 30min 5min Test Time=10cycle -40℃±5℃ ~+85℃±5℃ 20min 20min Test Time=10cycle Preheating： 140℃-160℃,within 2 minutes. Operation heating： 260℃(Max.), within 10seconds. (Max.) 0/20 0/20 0/20 ● Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Note: Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA Judgement criteria for failure Initial Level*1.1 Over U*2 Initial Level*0.7 1.U means the upper limit of specified characteristics. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. ONE THREE SIX ZERO ZERO TWO FIVE NINE SEVEN DOUBLE NINE,MR.CHEN Ver.1.0 Page 5 of 7 EVER BRIGHT OPTOELECTRONICS CORP. EC04-1206QRC/E-AV ● Soldering : 1. Manual Of Soldering The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3 seconds per solder-land is to be observed. 2. Reflow Soldering Preheating : 140℃~160℃±5℃,within 2 minutes. Operation heating : 260℃(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching). 10 SEC. MAX. Temperature 140~160℃ 260℃ MAX. 4℃ /SEC. MAX. 4℃ /SEC. MAX. OVER 2 MIN. Time 3. DIP soldering (Wave Soldering) : Preheating : 120℃~150℃,within 120~180 sec. Operation heating : 245℃±5℃ within 5 sec.260℃ (Max) Gradual Cooling (Avoid quenching). Temperature Soldering heat Max. 260 ℃ 245 ±5℃ within 5 sec. 120~150℃ Preheat 120~180 sec. Time ● Handling : Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. ONE THREE SIX ZERO ZERO TWO FIVE NINE SEVEN DOUBLE NINE,MR.CHEN Ver.1.0 Page 6 of 7 EVER BRIGHT OPTOELECTRONICS CORP. EC04-1206QRC/E-AV ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 168 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 48 hours at 60℃±3℃. ● Package and Label of Products: (1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) Label: EVER BRIGHT LOGO Part No. Quantity BIN. Sealing Date x xx xx Year Month xx Day Manufacture Location ONE THREE SIX ZERO ZERO TWO FIVE NINE SEVEN DOUBLE NINE,MR.CHEN Ver.1.0 Page 7 of 7