FYPF1010DN FYPF1010DN Features • Low forward voltage drop • High frequency properties and switching speed • Guard ring for over-voltage protection Applications • Switched mode power supply • Freewheeling diodes TO-220F 1 2 3 1. Anode 2.Cathode 3. Anode SCHOTTKY BARRIER RECTIFIER Absolute Maximum Ratings TC=25°°C unless otherwise noted Symbol VRRM Parameter Maximum Repetitive Reverse Voltage VR Maximum DC Reverse Voltage IF(AV) Average Rectified Forward Current IFSM Non-repetitive Peak Surge Current (per diode) 60Hz Single Half-Sine Wave TJ, TSTG Operating Junction and Storage Temperature @ TC = 125°C Value 100 Units V 100 V 10 A 100 A -40 to +150 °C Value 4.0 Units °C/W Value Units V Thermal Characteristics Symbol RθJC Parameter Maximum Thermal Resistance, Junction to Case (per diode) Electrical Characteristics (per diode) Symbol VFM * IRM * Parameter Maximum Instantaneous Forward Voltage IF = 5A IF = 5A IF = 10A IF = 10A Maximum Instantaneous Reverse Current @ rated VR TC = 25 °C TC = 125 °C TC = 25 °C TC = 125 °C 0.75 0.65 0.95 0.73 TC = 25 °C TC = 125 °C 1 30 mA * Pulse Test: Pulse Width=300µs, Duty Cycle=2% ©2001 Fairchild Semiconductor Corporation Rev. B, November 2001 FYPF1010DN Typical Characteristics 100 o 10 Reverse Current, I R [mA] Forward Current, I F [A] TJ=150 C 1 o TJ=125 C o TJ=75 C 0.1 10 o TJ=125 C 1 o TJ=75 C 0.1 0.01 o TJ=25 C o TJ=25 C 0.001 0.01 0 1 2 0 3 20 40 60 80 100 Reverse Voltage, VR [V] Forward Voltage Drop, VF [V] Figure 1. Typical Forward Voltage Characteristics (per diode) Figure 2. Typical Reverse Current vs. Reverse Voltage (per diode) Transient Thermal Impedance [ C/W] 10 o Junction Capacitance, C J [pF] o TJ=25 C 100 0 20 40 60 80 100 1 100µ Figure 3. Typical Junction Capacitance (per diode) 10m 100m 1 10 Figure 4. Thermal Impedance Characteristics (per diode) 12 120 Max. Forward Surge Current, I FSM [A] Average Forward Current, IF(AV) [A] 1m Pulse Duration [s] Reverse Voltage, VR [V] DC 10 8 6 4 2 0 0 20 40 60 80 100 120 140 160 o Case Temperature, TC [ C] Figure 5. Forward Current Derating Curve ©2001 Fairchild Semiconductor Corporation 100 80 60 40 20 0 1 10 100 Number of Cycles @ 60Hz Figure 6. Non-Repetive Sureg Current (per diode) Rev. B, November 2001 FYPF1010DN Package Dimensions 3.30 ±0.10 TO-220F 10.16 ±0.20 2.54 ±0.20 ø3.18 ±0.10 (7.00) (1.00x45°) 15.87 ±0.20 15.80 ±0.20 6.68 ±0.20 (0.70) 0.80 ±0.10 ) 0° (3 9.75 ±0.30 MAX1.47 #1 +0.10 0.50 –0.05 2.54TYP [2.54 ±0.20] 2.76 ±0.20 2.54TYP [2.54 ±0.20] 9.40 ±0.20 4.70 ±0.20 0.35 ±0.10 Dimensions in Millimeters ©2001 Fairchild Semiconductor Corporation Rev. B, November 2001 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DenseTrench™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT™ FACT Quiet Series™ FAST® FASTr™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ LittleFET™ MicroFET™ MicroPak™ MICROWIRE™ OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerTrench® QFET™ QS™ QT Optoelectronics™ Quiet Series™ SLIENT SWITCHER® SMART START™ STAR*POWER™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TruTranslation™ TinyLogic™ UHC™ UltraFET® VCX™ STAR*POWER is used under license DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. ©2001 Fairchild Semiconductor Corporation Rev. H4