SN74ALVCF162834 3.3-V CMOS 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES409B – AUGUST 2002 – REVISED OCTOBER 2004 FEATURES • • • • • • • • • • • DGG, DGV, OR DL PACKAGE (TOP VIEW) Member of the Texas Instruments Widebus™ Family Ideal for Use in PC133 Register DIMM Typical Output Skew . . . <250 ps VCC = 3.3 V ± 0.3 V . . . Normal Range VCC = 2.7 V to 3.6 V . . . Extended Range VCC = 2.5 V ± 0.2 V Rail-to-Rail Output Swing for Increased Noise Margin Balanced Output Drivers . . . ±18 mA Low Switching Noise Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) NC NC Y1 GND Y2 Y3 VCC Y4 Y5 Y6 GND Y7 Y8 Y9 Y10 Y11 Y12 GND Y13 Y14 Y15 VCC Y16 Y17 GND Y18 OE LE DESCRIPTION/ORDERING INFORMATION This 18-bit universal bus driver is designed for 2.3-V to 3.6-V VCC operation. Data flow from A to Y is controlled by the output-enable (OE) input. The device operates in the transparent mode when the latch-enable (LE) input is low. When LE is high, the A data is latched if the clock (CLK) input is held at a high or low logic level. If LE is high, the A data is stored in the latch/flip-flop on the low-to-high transition of CLK. When OE is high, the outputs are in the high-impedance state. 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 GND NC A1 GND A2 A3 VCC A4 A5 A6 GND A7 A8 A9 A10 A11 A12 GND A13 A14 A15 VCC A16 A17 GND A18 CLK GND NC − No internal connection The ALVCF162834 has series damping resistors in the device output structure that reduce switching noise in 128-MB and 256-MB SDRAM modules. Designed with a drive capability of ±18 mA, this device is a midway drive between the ALVC162834 (±12 mA) and ALVC16834 (±24 mA). The SN74ALVCF162834 is a faster version of the SN74ALVC162834. It is suitable for PC133 applications, particularly for SDRAM modules clocked at 133 MHz. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION PACKAGE (1) TA (1) TOP-SIDE MARKING Tube SN74ALVCF162834DL Tape and reel SN74ALVCF162834DLR TSSOP - DGG Tape and reel SN74ALVCF162834GR ALVCF162834 TVSOP - DGV Tape and reel SN74ALVCF162834VR VF162834 SSOP - DL -40°C to 85°C ORDERABLE PART NUMBER ALVCF162834 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2002–2004, Texas Instruments Incorporated SN74ALVCF162834 3.3-V CMOS 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES409B – AUGUST 2002 – REVISED OCTOBER 2004 FUNCTION TABLE INPUTS (1) OE LE CLK A OUTPUT Y H X X X Z L L X L L L L X H H L H ↑ L L L H ↑ H H L H L or H X Y0 (1) Output level before the indicated steady-state conditions were established LOGIC DIAGRAM (POSITIVE LOGIC) OE CLK LE A1 27 30 28 54 1D C1 CLK To 17 Other Channels 2 3 Y1 SN74ALVCF162834 3.3-V CMOS 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES409B – AUGUST 2002 – REVISED OCTOBER 2004 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range -0.5 4.6 V VI Input voltage range (2) -0.5 4.6 V VO Output voltage range (2) (3) -0.5 VCC + 0.5 IIK Input clamp current VI < 0 IOK Output clamp current VO < 0 IO Continuous output current Continuous current through each VCC or GND θJA Package thermal impedance (4) Tstg (1) (2) (3) (4) mA -50 mA ±50 mA ±100 mA DGG package 64 DGV package 48 DL package 56 Storage temperature range -65 V -50 °C/W °C 150 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V maximum. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage MIN MAX 2.3 3.6 VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 UNIT V VIH High-level input voltage VIL Low-level input voltage VI Input voltage 0 VCC V VO Output voltage 0 VCC V VCC = 2.3 V to 2.7 V 0.7 VCC = 2.7 V to 3.6 V 0.8 High-level output current -8 -6 VCC = 2.7 V -8 -18 6 VCC = 2.3 V Low-level output current 8 6 VCC = 2.7 V Input transition rise or fall rate TA Operating free-air temperature (1) mA 12 8 VCC = 3 V ∆t/∆v mA -12 VCC = 3 V IOL V -6 VCC = 2.3 V IOH V 18 -40 10 ns/V 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 3 SN74ALVCF162834 3.3-V CMOS 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES409B – AUGUST 2002 – REVISED OCTOBER 2004 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -0.1 mA VCC 2.3 V to 3.6 V IOH = -6 mA IOH = -6 mA IOH = -8 mA IOL = 0.1 mA V 2 2.4 2 0.2 0.4 2.3 V IOL = 8 mA VOL 2.2 2.3 V to 3.6 V IOL = 6 mA IOL = 6 mA 0.55 0.4 2.7 V IOL = 12 mA IOL = 8 mA VIK VCC = 2.3 V, II = -18 mA 3.6 V Vhys VCC = 3.6 V 3.6 V II VI = VCC or GND 3.6 V IOZ VO = VCC or GND 3.6 V ICC VI = VCC or GND, IO = 0 3.6 V ∆ICC One input at VCC - 0.6 V, Other inputs at VCC or GND V 0.6 0.55 3V IOL = 18 mA UNIT 1.7 3V IOH = -18 mA MAX 1.9 2.7 V IOH = -12 mA TYP (1) VCC - 0.2 2.3 V IOH = -8 mA VOH MIN 0.8 -1.2 100 V mV 0.1 3 V to 3.6 V ±5 µA ±10 µA 40 µA 750 µA Ci Inputs VI = 0 V 3.3 V 3 pF Co Outputs VO = 0 V 3.3 V 4 pF (1) All typical values are at VCC = 3.3 V, TA = 25°C. TIMING REQUIREMENTS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 and Figure 2) VCC = 2.5 V ± 0.2 V MIN fclock Clock frequency tw Pulse duration tsu Setup time 4 Hold time MIN 150 MAX VCC = 3.3 V ± 0.3 V MIN 150 3.3 3.3 3.3 CLK high or low 3.3 3.3 3.3 Data before LE↑ 1.8 1.5 1 CLK high 1.9 1.6 1.5 CLK low 1.3 1.1 1 0.6 0.6 0.6 1.4 1.7 1.4 Data after CLK↑ Data after LE↑ CLK high or low UNIT MAX 150 LE low Data before CLK↑ th MAX VCC = 2.7 V MHz ns ns ns SN74ALVCF162834 3.3-V CMOS 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES409B – AUGUST 2002 – REVISED OCTOBER 2004 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 and Figure 2) PARAMETER FROM (INPUT) TO (OUTPUT) fmax VCC = 2.5 V ± 0.2 V MIN MAX MIN 150 A tpd LE Y CLK VCC = 3.3 V ± 0.3 V VCC = 2.7 V MAX 150 MIN UNIT MAX 150 MHz 1 4 4.6 1 3.5 1.3 5.5 5.4 1.3 4.6 1.4 5.9 5.6 1.4 3.5 5 ns 4.2 ns 500 ps ten OE Y 1.4 5.9 6 1.1 tdis OE Y 1 4.7 4.6 1.3 tsk(o) ns SWITCHING CHARACTERISTICS from 0°C to 65°C, CL = 50 pF PARAMETER tpd FROM (INPUT) TO (OUTPUT) CLK Y VCC = 3.3 V ± 0.15 V UNIT MIN MAX 1.8 3.5 ns OPERATING CHARACTERISTICS TA = 25°C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS Outputs enabled Outputs disabled CL = 0, f = 10 MHz VCC = 2.5 V VCC = 3.3 V TYP TYP 28 33 16 21 UNIT pF 5 SN74ALVCF162834 3.3-V CMOS 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES409B – AUGUST 2002 – REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 2.5 V ± 0.2 V 2 × VCC S1 500 Ω From Output Under Test Open TEST tpd tPLZ/tPZL tPHZ/tPZH GND CL = 30 pF (see Note A) 500 Ω S1 Open 2 × VCC GND LOAD CIRCUIT tw VCC Timing Input VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VCC/2 VCC/2 0V tPLH Output Control (low-level enabling) VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPLZ VCC VCC/2 tPZH VOH VCC/2 0V Output Waveform 1 S1 at 2 × VCC (see Note B) tPHL VCC/2 VCC VCC/2 tPZL VCC Input VOLTAGE WAVEFORMS PULSE DURATION th VCC Data Input VCC/2 0V 0V tsu Output VCC VCC/2 Input Output Waveform 2 S1 at GND (see Note B) VOL + 0.15 V VOL tPHZ VCC/2 VOH VOH − 0.15 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 6 SN74ALVCF162834 3.3-V CMOS 18-BIT UNIVERSAL BUS DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES409B – AUGUST 2002 – REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION VCC = 2.7 V AND 3.3 V ± 0.3 V 6V S1 500 Ω From Output Under Test GND CL = 50 pF (see Note A) TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 6V GND Open 500 Ω tw LOAD CIRCUIT 2.7 V 2.7 V Timing Input 1.5 V Input 1.5 V 1.5 V 0V 0V tsu VOLTAGE WAVEFORMS PULSE DURATION th 2.7 V Data Input 1.5 V 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 2.7 V Output Control (low-level enabling) 1.5 V 0V tPZL 2.7 V Input 1.5 V 1.5 V 0V tPLH 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES tPLZ 3V 1.5 V VOL + 0.3 V VOL tPZH VOH Output Output Waveform 1 S1 at 6 V (see Note B) tPHL 1.5 V Output Waveform 2 S1 at GND (see Note B) tPHZ 1.5 V VOH − 0.3 V VOH 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 2. Load Circuit and Voltage Waveforms 7 PACKAGE OPTION ADDENDUM www.ti.com 20-Aug-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp 74ALVCF162834DLG4 ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCF162834GRE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCF162834GRG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCF162834DL ACTIVE SSOP DL 56 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCF162834GR ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 20-Aug-2011 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74ALVCF162834GR Package Package Pins Type Drawing TSSOP DGG 56 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 24.4 Pack Materials-Page 1 8.6 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 15.6 1.8 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ALVCF162834GR TSSOP DGG 56 2000 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. 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