PMC PM25LV512

PMC
Pm25LV512 / Pm25LV010
512 Kbit / 1 Mbit 3.0 Volt-only, Serial Flash Memory
With 25 MHz SPI Bus Interface
FEATURES
• Block Write Protection
- The Block Protect (BP1, BP0) bits allow part or entire
of the memory to be configured as read-only.
• Single Power Supply Operation
- Low voltage range: 2.7 V - 3.6 V
• Memory Organization
- Pm25LV512: 64K x 8 (512 Kbit)
- Pm25LV010: 128K x 8 (1 Mbit)
• Hardware Data Protection
- Write Protect (WP#) pin will inhibit write operations
to the status register
• Cost Effective Sector/Block Architecture
- Uniform 4 Kbyte sectors
- Uniform 32 Kbyte blocks (8 sectors per block)
- Two blocks with 32 Kbytes each (512 Kbit)
- Four blocks with 32 Kbytes each (1 Mbit)
- 128 pages per block
• Page Program (up to 256 Bytes)
- Typical 2 ms per page program time
• Sector, Block and Chip Erase
- Typical 40 ms sector/block/chip erase time
• Single Cycle Reprogramming for Status Register
- Build-in erase before programming
• Serial Peripheral Interface (SPI) Compatible
- Supports SPI Modes 0 (0,0) and 3 (1,1)
• High Product Endurance
- Guarantee 100,000 program/erase cycles per single
sector (preliminary)
- Minimum 20 years data retention
• High Performance Read
- 25 MHz clock rate (maximum)
• Page Mode for Program Operations
- 256 bytes per page
• Industrial Standard Pin-out and Package
- 8-pin JEDEC SOIC
- 8-contact WSON
- Optional lead-free (Pb-free) packages
GENERAL DESCRIPTION
The Pm25LV512/010 are 512 Kbit/1 Mbits 3.0 Volt-only serial Flash memories. These devices are designed to use
a single low voltage, range from 2.7 Volt to 3.6 Volt, power supply to perform read, erase and program operations.
The devices can be programmed in standard EPROM programmers as well.
The device is optimized for use in many commercial applications where low-power and low-voltage operation are
essential. The Pm25LV512/010 is enabled through the Chip Enable pin (CE#) and accessed via a 3-wire interface
consisting of Serial Data Input (Sl), Serial Data Output (SO), and Serial Clock (SCK). All write cycles are completely self-timed.
Block Write protection for top 1/4, top 1/2 or the entire memory array (1M) or entire memory array (512K) is enabled
by programming the status register. Separate write enable and write disable instructions are provided for additional
data protection. Hardware data protection is provided via the WP pin to protect against inadvertent write attempts
to the status register. The HOLD pin may be used to suspend any serial communication without resetting the serial
sequence.
The Pm25LV512/010 are manufactured on PMC’s advanced nonvolatile CMOS technology, P-FLASH™. The devices are offered in 8-pin JEDEC SOIC and 8-contact WSON packages with operation frequency up to 25 MHz.
Programmable Microelectronics Corp.
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Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
CONNECTION DIAGRAMS
CE#
1
8
Vcc
SO
2
7
HOLD#
CE#
1
SO
2
Top View
8
Vcc
7
HOLD#
WP#
3
6
SCK
WP#
3
6
SCK
GND
4
5
SI
GND
4
5
SI
8-Pin SOIC
8-Contact WSON
PIN DESCRIPTIONS
SYMB OL
TYPE
D ESC R IPTION
C E#
INPUT
C hi p Enable: C E# goes low acti vates the devi ce's i nternal ci rcui tri es for
devi ce operati on. C E# goes hi gh deselects the devi ce and swi tches i nto
standby mode to reduce the power consumpti on. When the devi ce i s not
selected, data wi ll not be accepted vi a the seri al i nput pi n (Sl), and the
seri al output pi n (SO) wi ll remai n i n a hi gh i mpedance state.
SC K
INPUT
Seri al D ata C lock
SI
INPUT
Seri al D ata Input
SO
OUTPUT
Seri al D ata Output
GND
Ground
V cc
D evi ce Power Supply
WP#
INPUT
Wri te Protect: When the WP# pi n brought to low and WPEN bi t i s "1", all
wri te operati ons to the status regi ster are i nhi bi ted.
HOLD #
INPUT
Hold: Pause seri al communi cati on wi th the master devi ce wi thout
resetti ng the seri al sequence.
Programmable Microelectronics Corp.
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Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
PRODUCT ORDERING INFORMATION
Pm25LVxxx
-25
S
C
E
Environmental Attribute
E = Lead-free (Pb-free) Package
Blank = Standard Package
Temperature Range
C = Commercial (0°C to +70°C)
Package Type
S = 8-pin SOIC (8S)
Q = 8-contact WSON (8Q)
Operating Speed
25 MHz
PMC Device Number
Pm25LV512 (512 Kbit)
Pm25LV010 (1 Mbit)
Part Number
Operating Frequency (MHz )
P ackag e
Temperature Range
Pm25LV512-25SCE
8S
Pm25LV512-25SC
25
Pm25LV512-25QCE
8Q
Pm25LV512-25QC
Commercial
(0°C to + 70°C)
Pm25LV010-25SCE
8S
Pm25LV010-25SC
25
Pm25LV010-25QCE
8Q
Pm25LV010-25QC
Programmable Microelectronics Corp.
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Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
BLOCK DIAGRAM
SPI Chip Block Diagram
High Voltage
Generator
Control Logic
Instruction Decoder
Serial /Parallel convert Logic
Y-DECODER
Address Latch
& Counter
2KBit Page Buffer
Status
Register
Memory Array
X-DECODER
Programmable Microelectronics Corp.
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Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
SERIAL INTERFACE DESCRIPTION
Pm25LV512/010 can be driven by a microcontroller on the SPI bus as shown in Figure 1. The serial communication
term definitions are in the following section.
MASTER: The device that generates the serial clock.
SLAVE: Because the Serial Clock pin (SCK) is always an input, the Pm25LV512/010 always operates as a slave.
TRANSMITTER/RECEIVER: The Pm25LV512/010 has separate pins designated for data transmission (SO) and
reception (Sl).
MSB: The Most Significant Bit (MSB) is the first bit transmitted and received.
SERIAL OP-CODE: After the device is selected with CE# going low, the first byte will be received. This byte
contains the op-code that defines the operations to be performed.
INVALID OP-CODE: If an invalid op-code is received, no data will be shifted into the Pm25LV512/010, and the serial
output pin (SO) will remain in a high impedance state until the falling edge of CE# is detected again. This will
reinitialize the serial communication.
Figure 1. Bus Master and SPI Memory Devices
SDO
SPI Interface with
(0, 0) or (1, 1)
SDI
SCK
SCK
SO
SI
SCK SO
SI
SCK
SO
SI
Bus Master
SPI Memory
Device
CS3
SPI Memory
Device
SPI Memory
Device
CS2 CS1
CE#
WP# HOLD# CE#
WP# HOLD# CE#
WP# HOLD#
Note: 1. The Write Protect (WP#) and Hold (HOLD#) signals should be driven, High or Low as appropriate.
Programmable Microelectronics Corp.
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Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
SERIAL INTERFACE DESCRIPTION (CONTINUED)
SPI MODES
These devices can be driven by microcontroller with its
SPI peripheral running in either of the two following modes:
Mode 0 = (0, 0)
Mode 3 = (1, 1)
For these two modes, input data is latched in on the
rising edge of Serial Clock (SCK), and output data is
available from the falling edge of Serial Clock (SCK).
The difference between the two modes, as shown in
Figure 2, is the clock polarity when the bus master is in
Stand-by mode and not transfering data:
- Clock remains at 0 (SCK = 0) for Mode 0 (0, 0)
- Clock remains at 1 (SCK = 1) for Mode 3 (1, 1)
Figure 2. SPI Modes
Mode 0 (0
0) S C K
Mode 3 (1
1) S C K
SI
SO
Programmable Microelectronics Corp.
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Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
DEVICE OPERATION
The Pm25LV512/010 is designed to interface directly with the synchronous serial peripheral interface (SPI) of the
6800 type series of microcontrollers.
The Pm25LV512/010 utilizes an 8-bit instruction register. The list of instructions and their operation codes are
contained in Table 1. All instructions, addresses, and data are transferred with the MSB first and start with a highto-low transition.
Write is defined as program and/or erase in this specification. The following commands, PAGE PROGRAM,
SECTOR ERASE, BLOCK ERASE, CHIP ERASE, and WRSR are write instructions for Pm25LV512/010.
Table 1. Instruction Set for the Pm25LV512/010
Instruction N ame
Instruction Format
H ex C o d e
Operation
WREN
0000 0110
06h
Set Wri te Enable Latch
WRD I
0000 0100
04h
Reset Wri te Enable Latch
RD SR
0000 0101
05h
Read Status regi ster
WRSR
0000 0001
01h
Wri te Status Regi ster
READ
0000 0011
03h
Read D ata from Memory Arrary
FAST_READ
0000 1011
0B h
Read D ata from Memory at Hi gher Speed
PG_ PROG
0000 0010
02h
Program D ata Into Memory Array
SEC TOR_ERASE
1101 0111
D 7h
Erase One Sector i n Memory Array
BLOC K_ERASE
1101 1000
D 8h
Erase One Block i n Memory Array
C HIP_ERASE
1100 0111
C 7h
Erase Enti re Memory Array
RD ID
1010 1011
ABh
Read Manufacturer and Product ID
READ PRODUCT ID (RDID): The RDID instruction allows the user to read the manufacturer and product ID of the
device. The instruction code is followed by three dummy bytes, each bit being latched-in on Serial Data Input (SI)
during the rising edge of Serial Clock (SCK). Then the first manufacturer ID (9Dh) is shifted out on Serial Data
Output (SO), followed by the device ID (7Bh = Pm25LV512; 7Ch = Pm25LV010) and the second manufacturer ID
(7Fh), each bit been shifted out during the falling edge of Serial Clock (SCK).
Table 2. Product Identification
Product Identification
Data
Manufacturer ID
9D h
Device ID:
Pm25LV512
7B h
Pm25LV010
7C h
Programmable Microelectronics Corp.
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Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
WRITE ENABLE (WREN): The device will power up in the write disable state when Vcc is applied. All write
instructions must therefore be preceded by the WREN instruction.
WRITE DISABLE (WRDI): To protect the device against inadvertent writes, the WRDI instruction disables all write
commands. The WRDI instruction is independent of the status of the WP# pin.
READ STATUS REGISTER (RDSR): The RDSR instruction provides access to the status register. The READY/
BUSY and write enable status of the device can be determined by the RDSR instruction. Similarly, the Block Write
Protection bits indicate the extent of protection employed. These bits are set by using the WRSR instruction.
During internal write cycles, all other commands will be ignored except the RDSR instruction.
Table 3. Status Register Format
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
WPEN
X
X
X
BP1
BP0
WEN
RDY
Table 4. Read Status Register Bit Definition
Bit
Definition
Bit 0 (RDY)
Bit 0 = 0 indicates the device is READY.
Bit 0 = 1 indicates the write cycle is in progress and the device is
BUSY.
Bit 1 (WEN)
Bit 1 = 0 indicates the device is not WRITE ENABLED.
Bit 1 = 1 indicates the device is WRITE ENABLED.
Bit 2 (BP0)
See Table 5.
Bit 3 (BP1)
See Table 5.
Bits 4-6 are 0s when device is not in an internal write cycle.
Bit 7 (WPEN)
WPEN = 0 blocks the function of Write Protect pin (WP#).
WPEN = 1 activates the Write Protect pin (WP#).
See Table 6 for details.
Bits 0-7 are 1s during an internal write cycle.
WRITE STATUS REGISTER (WRSR): The WRSR instruction allows the user to select one of four levels of protection for the Pm25LV010. The Pm25LV010 is divided into four blocks where the top quarter (1/4), top half (1/2), or all
of the memory blocks can be protected (locked out) from write. The Pm25LV512 is divided into 2 blocks where all
of the memory blocks can be protected (locked out) from write. Any of the locked-out blocks will therefore be READ
only. The locked-out block and the corresponding status register control bits are shown in Table 5.
The three bits, BP0, BP1, and WPEN, are nonvolatile cells that have the same properties and functions as the
regular memory cells (e.g., WREN, RDSR).
Programmable Microelectronics Corp.
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Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
Table 5. Block Write Protect Bits
Status Register Bits
L evel
B P1
B P0
0
0
0
1(1/4)
0
1
2(1/2)
1
0
3(All)
1
1
Pm25LV512
Array Addresses
Locked Out
Pm25LV010
Locked-out
Block(s)
None
None
All Blocks
(1 - 2)
000000-00FFFF
Array Addresses
Locked Out
Locked-out
Block(s)
None
None
018000 - 01F F F F
Block 4
010000 - 01F F F F
Block 3, 4
000000 - 01F F F F
All Blocks
(1 - 4)
The WRSR instruction also allows the user to enable or disable the Write Protect (WP#) pin through the use of the
Write Protect Enable (WPEN) bit. Hardware write protection is enabled when the WP# pin is low and the WPEN bit
is "1". Hardware write protection is disabled when either the WP# pin is high or the WPEN bit is "0." When the
device is hardware write protected, writes to the Status Register, including the Block Protect bits and the WPEN
bit, and the locked-out blocks in the memory array are disabled. Write is only allowed to blocks of the memory
which are not locked out. The WRSR instruction is self-timed to automatically erase and program BP0, BP1, and
WPEN bits. In order to write the status register, the device must first be write enabled via the WREN instruction.
Then, the instruction and data for the three bits are entered. During the internal write cycle, all instructions will be
ignored except RDSR instructions. The Pm25LV512/010 will automatically return to write disable state at the
completion of the WRSR cycle.
Note: When the WPEN bit is hardware write protected, it cannot be changed back to "0", as long as the WP# pin
is held low.
Table 6. WPEN Operation
WPEN
WP
WEN
ProtectedBlocks
UnprotectedBlocks
Status Register
0
X
0
Protected
Protected
Protected
0
X
1
Protected
Writable
Writable
1
Low
0
Protected
Protected
Protected
1
Low
1
Protected
Writable
Protected
X
High
0
Protected
Protected
Protected
X
High
1
Protected
Writable
Writable
Programmable Microelectronics Corp.
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Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
READ: Reading the Pm25LV512/010 via the SO (Serial Output) pin requires the following sequence. After the CE#
line is pulled low to select a device, the READ instruction is transmitted via the Sl line followed by the byte address
to be read (Refer to Table 7). Upon completion, any data on the Sl line will be ignored. The data (D7-D0) at
the specified address is then shifted out onto the SO line. If only one byte is to be read, the CE# line should be
driven high after the data comes out. The READ instruction can be continued since the byte address is automatically incremented and data will continue to be shifted out. For the Pm25LV512/010, when the highest address is
reached, the address counter will roll over to the lowest address allowing the entire memory to be read in one
continuous READ instruction.
FAST_READ: The device is first selected by driving CE# low. The FAST READ instruction is followed by a 3-byte
address (A23-A0) and a dummy byte, each bit being latched-in during the rising edge of SCK (Serial Clock). Then
the memory contents, at that address, is shifted out on SO (Serial Output), each bit being shifted out, at a
maximum frequency fFR, during the falling edge of SCK (Serial Clock).
The first byte addressed can be at any location. The address is automatically incremented to the next higher
address after each byte of data is shifted out. When the highest address is reached, the address counter will roll
over to the lowest address allowing the entire memory to be read with a single FAST READ instruction. The FAST
READ instruction is terminated by driving CE# high.
PAGE PROGRAM (PG_PROG): In order to program the Pm25LV512/010, two separate instructions must be
executed. First, the device must be write enabled via the WREN instruction. Then the PAGE PROGRAM instruction can be executed. Also, the address of the memory location(s) to be programmed must be outside the protected address field location selected by the Block Write Protection Level. During an internal self-timed programming cycle, all commands will be ignored except the RDSR instruction.
The PAGE PROGRAM instruction requires the following sequence. After the CE# line is pulled low to select the
device, the PAGE PROGRAM instruction is transmitted via the Sl line followed by the address and the data (D7-D0)
to be programmed (Refer to Table 7). Programming will start after the CE# pin is brought high. The low-to-high
transition of the CE# pin must occur during the SCK low time immediately after clocking in the D0 (LSB) data bit.
The READY/BUSY status of the device can be determined by initiating a RDSR instruction. If Bit 0 = 1, the program
cycle is still in progress. If Bit 0=0, the program cycle has ended. Only the RDSR instruction is enabled during the
program cycle. A single PROGRAM instruction programs 1 to 256 consecutive bytes within a page if it is not write
protected. The starting byte could be anywhere within the page. When the end of the page is reached, the address
will wrap around to the beginning of the same page. If the data to be programmed are less than a full page, the data
of all other bytes on the same page will remain unchanged. If more than 256 bytes of data are provided, the address
counter will roll over on the same page and the previous data provided will be replaced. The same byte cannot be
reprogrammed without erasing the whole sector/block first. The Pm25LV512/010 will automatically return to the
write disable state at the completion of the PROGRAM cycle.
Note:
If the device is not write enabled (WREN) the device will ignore the Write instruction and will return to the
standby state, when CE# is brought high. A new CE# falling edge is required to re-initiate the serial
communication.
Table 7. Address Key
Address
Pm25LV512
Pm25LV010
AN
A 15 - A 0
A 16 - A 0
Don't Care Bits
A 23 - A 16
A 23 - A 17
Programmable Microelectronics Corp.
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Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
SECTOR_ERASE, BLOCK_ERASE: Before a byte can be reprogrammed, the sector/block which contains the
byte must be erased. In order to erase the Pm25LV512/010, two separate instructions must be executed. First, the
device must be write enabled via the WREN instruction. Then the SECTOR ERASE or BLOCK ERASE instruction
can be executed.
Table 8. Block Addresses
Block Address
Pm25LV512 Block
Pm25LV010 Block
000000 to 007FFF
Block 1
Block 1
008000 to 00FFFF
Block 2
Block 2
010000 to 017FFF
N/A
Block 3
018000 to 01FFFF
N/A
Block 4
The BLOCK ERASE instruction erases every byte in the selected block if the block is not locked out. Block
address is automatically determined if any address within the block is selected. The BLOCK ERASE instruction
is internally controlled; it will automatically be timed to completion. During this time, all commands will be ignored,
except RDSR instruction. The Pm25LV512/010 will automatically return to the write disable state at the completion
of the BLOCK ERASE cycle.
CHIP_ERASE: As an alternative to the SECTOR and BLOCK ERASE, the CHIP ERASE instruction will erase
every byte in all blocks that are not locked out. First, the device must be write enabled via the WREN instruction.
Then the CHIP ERASE instruction can be executed. The CHIP ERASE instruction is internally controlled; it will
automatically be timed to completion. The CHIP ERASE cycle time maximum is 100 miliseconds. During the
internal erase cycle, all instructions will be ignored except RDSR. The Pm25LV512/010 will automatically return to
the write disable state at the completion of the CHIP ERASE.
HOLD: The HOLD# pin is used in conjunction with the CE# pin to select the Pm25LV512/010. When the device is
selected and a serial sequence is underway, HOLD# pin can be used to pause the serial communication with the
master device without resetting the serial sequence. To pause, the HOLD# pin must be brought low while the SCK
pin is low. To resume serial communication, the HOLD# pin is brought high while the SCK pin is low (SCK may still
toggle during HOLD). Inputs to the Sl pin will be ignored while the SO pin is in the high impedance state.
HARDWARE WRITE PROTECT: The Pm25LV512/010 has a write lockout feature that can be activated by asserting the write protect pin (WP#). When the lockout feature is activated, locked-out sectors will be READ only. The
write protect pin will allow normal read/write operations when held high. When the WP# is brought low and WPEN
bit is "1", all write operations to the status register are inhibited. WP# going low while CE# is still low will interrupt
a write to the status register. If the internal status register write cycle has already been initiated, WP# going low will
have no effect on any write operation to the status register. The WP# pin function is blocked when the WPEN bit in
the status register is "0". This will allow the user to install the Pm25LV512/010 in a system with the WP# pin tied
to ground and still be able to write to the status register. All WP# pin functions are enabled when the WPEN bit is
set to "1".
Programmable Microelectronics Corp.
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Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
ABSOLUTE MAXIMUM RATINGS (1)
Temperature Under Bias
-65°C to +125°C
Storage Temperature
-65°C to +125°C
Standard Package
240°C 3 Seconds
Lead-free Package
260°C 3 Seconds
(2)
-0.5 V to VCC + 0.5 V
Surface Mount Lead Soldering Temperature
Input Voltage with Respect to Ground on All Pins
All Output Voltage with Respect to Ground
-0.5 V to VCC + 0.5 V
VCC (2)
-0.5 V to +6.0 V
Notes:
1. Stresses under those listed in “Absolute Maximum Ratings” may cause permanent damage
to the device. This is a stress rating only. The functional operation of the device or any other
conditions under those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating condition for extended periods may affected
device reliability.
2. Maximum DC voltage on input or I/O pins are VCC + 0.5 V. During voltage transitioning
period, input or I/O pins may overshoot to VCC + 2.0 V for a period of time up to 20 ns.
Minimum DC voltage on input or I/O pins are -0.5 V. During voltage transitioning period,
input or I/O pins may undershoot GND to -2.0 V for a period of time up to 20 ns.
DC AND AC OPERATING RANGE
Part Number
Pm25LV512/010
Operating Temperature
0°C to 70°C
Vcc Power Supply
2.7 V - 3.6 V
Programmable Microelectronics Corp.
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Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
DC CHARACTERISTICS
Applicable over recommended operating range from:
TAC = 0°C to +70°C, VCC = +2.7 V to +3.6 V (unless otherwise noted).
Symbol Parameter
Condition
ICC1
Vcc Active Read Current
ICC2
Typ
Max
Units
VCC = 3.6V at 25 MHz, SO = Open
10
15
mA
Vcc Program/Erase Current
VCC = 3.6V at 25 MHz, SO = OPen
15
30
mA
ISB1
Vcc Standby Current CMOS
VCC = 3.6V, CE# = VCC
0.1
5
µA
ISB2
Vcc Standby Current TTL
VCC = 3.6V, CE# = VIH to VCC
0.05
3
mA
ILI
Input Leakage Current
VIN = 0V to VCC
1
µA
ILO
Output Leakage Current
VIN = 0V to VCC, TAC = 0°C to 70°C
1
µA
VIL
Input Low Voltage
-0.5
0.8
V
VIH
Input HIgh Voltage
0.7VCC
VCC + 0.3
V
VOL
Output Low Voltage
0.45
V
VOH
Output High Voltage
Programmable Microelectronics Corp.
Min
2.7V < VCC < 3.6V
13
IOL = 2.1 mA
IOH = -100 µA VCC - 0.2
V
Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
AC CHARACTERISTICS
Applicable over recommended operating range from TA = 0°C to +70°C, VCC = +2.7 V to +3.6 V
CL = 1TTL Gate and 30 pF (unless otherwise noted).
Symbol
Parameter
fFR
Clock Frequency for
FAST_READ
fR
Clock Frequency for READ instructions
tRI
Max
Units
0
25
MHz
0
20
MHz
Input Rise Time
20
ns
tFI
Input Fall Time
20
ns
tCKH
SCK High Time
20
ns
tCKL
SCK Low Time
20
ns
tCEH
CE High Time
25
ns
tCS
CE Setup Time
25
ns
tCH
CE Hold Time
25
ns
tDS
Data In Setup Time
5
ns
tDH
Data in Hold Time
5
ns
tHS
Hold Setup Time
15
ns
tHD
Hold Time
15
ns
tV
Output Valid
tOH
Output Hold Time
tLZ
Hold to Output Low Z
200
ns
tHZ
Hold to Output High Z
200
ns
tDIS
Output Disable Time
100
ns
tEC
Secter/Block/Chip Erase Time
40
100
ms
tpp
Page Program Time
2
5
ms
tw
Write Status Register time
40
100
ms
Programmable Microelectronics Corp.
Min
Typ
15
0
14
ns
ns
Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
AC CHARACTERISTICS (CONTINUED)
AC WAVEFORMS(1)
tC E H
V IH
CE#
V IL
tC S
tC H
V IH
SCK
tC K H
V IL
tD S
tC K L
tD H
V IH
SI
VALID IN
V IL
tV
V OH
SO
tO H
tD I S
HI-Z
HI-Z
V OL
Note: 1. For SPI Mode 0 (0,0)
OUTPUT TEST LOAD
INPUT TEST WAVEFORMS
AND MEASUREMENT LEVEL
3.3 V
3.0 V
1.8 K
Input
OUTPUT PIN
1.5 V
AC
Measurement
Level
0.0 V
1.3 K
Programmable Microelectronics Corp.
30 pF
15
Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
AC CHARACTERISTICS (CONTINUED)
HOLD Timing
CE#
tH D
tH D
SCK
tH S
tH S
HOLD#
tH Z
SO
tL Z
PIN CAPACITANCE ( f = 1 MHz, T = 25°C )
Typ
Max
Units
Conditions
CIN
4
6
pF
VIN = 0 V
COUT
8
12
pF
VOUT = 0 V
Note: These parameters are characterized but not 100% tested.
Programmable Microelectronics Corp.
16
Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
TIMING DIAGRAMS
RDID Timing
CE#
0
1
7
8
9
38
31
46
39
47
54
SCK
INSTRUCTION
SI
3 Dummy Bytes
1010 1011b
HIGH IMPEDANCE
SO
Manufacture ID1
Device ID
Manufacture ID2
WREN Timing
CE#
SCK
SI
INSTRUCTION = 0000 0110b
HI-Z
SO
WRDI Timing
CE#
SCK
SI
INSTRUCTION = 0000 0100b
HI-Z
SO
nnnnnnN
Programmable Microelectronics Corp.
17
Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
RDSR Timing
CE#
1
0
2
3
5
4
7
6
9
8
10
11
12
13
14
3
2
1
13
14
15
2
1
0
SCK
SI
INSTRUCTION = 0000 0101b
DATA OUT
HIGH IMPEDANCE
SO
7
6
5
4
0
MSB
WRSR Timing
CE#
0
SCK
1
2
3
4
5
6
7
8
9
10
11
12
DATA IN
SI
INSTRUCTION = 0000 0001b
7
6
5
3
4
HIGH IMPEDANCE
SO
READ Timing
CE#
0
1
2
3
4
5
6
7
8
9
10 11
28 29
30
31 32 33 34
1
0
35 36 37 38
SCK
3-BYTE ADDRESS
SI
SO
INSTRUCTION = 0000 0011b
23 22 21
...
HIGH IMPEDANCE
Programmable Microelectronics Corp.
3
2
7
18
6
5
4
3
2
1
0
Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
FAST READ Timing
CE#
0
1
2
3
4
5
6
7
8
9
10 11
28 29
30
31
1
0
SCK
3-BYTE ADDRESS
SI
23 22 21
INSTRUCTION = 0000 1011b
...
3
2
HIGH IMPEDANCE
SO
CE#
32
33
34 35 36
37 38
39 40
41 42 43
44 45
46
47
SCK
DUMMY BYTE
7
SI
6
5
4
3
2
1
0
DATA OUT 1
HIGH IMPEDANCE
SO
7
6
5
4
3
DATA OUT 2
2
1
0
7
6
5
4
3
2
1
0
PAGE PROGRAM Timing
4
5
6
7
8
9
10 11 28 29 30 31 32 33 34
2079
3
2078
2
2077
1
2076
0
2075
CE#
SCK
256th BYTE DATA-IN
1st BYTE DATA-IN
3-BYTE ADDRESS
SI
INSTRUCTION = 0000 0010b
23 22 21
3
2
1
0
7
6
5
4
3
2
1
0
HIGH IMPEDANCE
SO
Programmable Microelectronics Corp.
19
Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
SECTOR ERASE Timing
CE#
0
1
2
3
4
5
6
7
8
9
10
11
28
29
30
31
SCK
3-BYTE ADDRESS
SI
SO
INSTRUCTION = 1101 0111b
23
22
8
9
21
...
3
2
1
0
28
29
30
31
1
0
HIGH IMPEDANCE
BLOCK ERASE Timing
CE#
0
1
2
3
4
5
6
7
10
11
SCK
3-BYTE ADDRESS
SI
SO
INSTRUCTION = 1101 1000b
23
22
21
...
3
2
HIGH IMPEDANCE
CHIP ERASE Timing
CE#
0
1
2
3
4
5
6
7
SCK
SI
SO
Programmable Microelectronics Corp.
INSTRUCTION = 1100 0111b
HIGH IMPEDANCE
20
Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
PROGRAM/ERASE PERFORMANCE
Parameter
Unit
Typ
Max
Remarks
Sector Erase Time
ms
40
100
From writing erase command to erase completion
Block Erase Time
ms
40
100
From writing erase command to erase completion
Chip Erase Time
ms
40
100
From writing erase command to erase completion
Page Programming Time
ms
2
5
From writing program command to program
completion
Note: These parameters are characterized and are not 100% tested.
RELIABILITY CHARACTERISTICS (1)
Parameter
Endurance
Data Retention
ESD - Human Body Model
ESD - Machine Model
Latch-Up
Note:
Min
100,000
Typ
(2)
Unit
Test Method
Cycles
JEDEC Standard A117
20
Years
JEDEC Standard A103
2,000
Volts
JEDEC Standard A114
200
Volts
JEDEC Standard A115
100 + ICC1
mA
JEDEC Standard 78
1. These parameters are characterized and are not 100% tested.
2. Preliminary specification only and will be formalized after cycling qualification test.
Programmable Microelectronics Corp.
21
Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
PACKAGE TYPE INFORMATION
8S
8-Pin JEDEC Small Outline Integrated Circuit (SOIC) Package (measure in millimeters)
Top View
Side View
0.51
0.33
5.00
4.80
1.27 BSC
4.00
3.80
0.25
0.10
6.20
5.80
1.75
1.35
End View
45º
0.25
0.19
1.27
0.40
`
Programmable Microelectronics Corp.
22
Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
PACKAGE TYPE INFORMATION (CONTINUED)
8Q
8-Contact Ulta-Thin Small Outline No-Lead (WSON) Package (measure in millimeters)
Top View
Side View
5.00
BSC
6.00
BSC
Bottom View
0.25
0.19
Pin 1
0.80
0.70
1.27
BSC
3.40
4.00
0.48
0.35
0.75
0.50
Programmable Microelectronics Corp.
23
Issue Date: December, 2003, Rev: 1.3
PMC
Pm25LV512/010
REVISION HISTORY
Date
Revision No. Description of Changes
P ag e N o .
October, 2002
1.0
New publication, Preliminary Spec
All
December, 2002
1.1
Formal Release
All
Jun, 2003
1.2
Added WSON package option
1, 2, 3, 23
Added Lead-free package options
December, 2003
1.3
1, 3, 12
Upgraded guranteed program/erase cycles from 50,000
to 100,000 (preliminary)
Updated and redrawed package dimension
Programmable Microelectronics Corp.
24
1, 21
22, 23
Issue Date: December, 2003, Rev: 1.3