TI BQ27741-G1 Single cell li-ion battery fuel gauge with integrated protection Datasheet

bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
Single Cell Li-Ion Battery Fuel Gauge with Integrated Protection
Check for Samples: bq27741-G1
FEATURES
1
•
23
•
•
•
•
Battery Fuel Gauge and Protector for 1-Series
Li-Ion Applications
Microcontroller Peripheral Provides:
– Accurate Battery Fuel Gauging Supports up
to 32 Ahr
– External and Internal Temperature Sensors
for Battery Temperature Reporting
– Precision 16-bit High-Side Coulomb
Counter with High-Side Low-Value Sense
Resistor (5 mΩ to 20 mΩ)
– Lifetime and Current Data Logging
– 64 Bytes of Non-Volatile Scratch Pad Flash
– SHA-1/HMAC Authentication
Battery Fuel Gauging Based on Patented
Impedance Track™ Technology
– Models Battery Discharge Curve for
Accurate Time-To-Empty Predictions
– Automatically Adjusts for Aging, SelfDischarge, and Temperature- and RateInduced Effects on Battery
Advanced Fuel Gauging Features
– Internal Short Detection
– Tab Disconnection Detection
Safety and Protection:
– Over- and Undervoltage Protection with
Brown-out Low-Power Mode
– Overcharging and Discharging Current
Protection
– Overtemperature Protection
– Short-Circuit Protection
– Low-Voltage Notification
•
•
– Voltage Doubler to Support High-side NFET
Protection
HDQ and I2C™ Interface Formats for
Communication With Host System
Small 15-ball NanoFree™ (CSP) Packaging
APPLICATIONS
•
•
•
•
•
Smartphones
PDAs
Digital Still and Video Cameras
Handheld Terminals
MP3 or Multimedia Players
DESCRIPTION
The Texas Instruments bq27741-G1 Li-Ion battery
fuel gauge is a microcontroller peripheral that
provides fuel gauging for single-cell Li-Ion battery
packs.
The
device
requires
little
system
microcontroller firmware development for accurate
battery fuel gauging. The fuel gauge resides within
the battery pack or on the system’s main board with
an embedded battery (non-removable). The fuel
gauge
provides
hardware-based
overand
undervoltage, overcurrent in charge or discharge, and
short-circuit protections.
The fuel gauge uses the patented Impedance
Track™ algorithm for fuel gauging, and provides
information such as remaining battery capacity
(mAh), state-of-charge (%), run-time to empty
(minimum), battery voltage (mV), and temperature
(°C), as well as recording vital parameters throughout
the lifetime of the battery.
The CSP is a 15-ball package (2.776 mm x 1.96 mm)
that is ideal for space-constrained applications.
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Impedance Track, NanoFree are trademarks of Texas Instruments.
I2C is a trademark of NXP B.V. Corp Netherlands.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
DEVICE INFORMATION
bq27741 PIN DIAGRAM
(TOP VIEW)
CSP-15
(BOTTOM VIEW)
CSP-15
(TOP VIEW)
A3
B3
C3
D3
E3
E3
D3
C3
B3
A3
A2
B2
C2
D2
E2
E2
D2
C2
B2
A2
A1
B1
C1
D1
E1
E1
D1
C1
B1
A1
BOTTOM VIEW
SCL
RC2
SDA
PACKP
DSG
3
TS
HDQ
BAT
RA0
CHG
2
REG25
VSS
VPWR
SRN
SRP
1
E
D
C
B
A
Table 1. Terminal Functions
TERMINAL
(1)
2
TYPE (1)
DESCRIPTION
PIN
NAME
A1
SRP
IA
Analog input pin connected to the internal coulomb counter where SRP is nearest the PACK+
connection. Connect to sense resistor.
A2
CHG
O
External high side N-channel charge FET driver.
A3
DSG
O
External high side N-channel discharge FET driver.
B1
SRN
IA
Analog input pin connected to the internal coulomb counter where SRN is nearest the CELL+
connection. Connect to sense resistor.
B2
RA0
IO
General Purpose IO. Open-drain I/O.
B3
PACKP
IA
Pack voltage measurement input for protector operation.
C1
VPWR
P
Power input. Decouple with 0.1-µF ceramic capacitor to VSS.
C2
BAT
IA
Cell-voltage measurement input. ADC input.
C3
SDA
IO
Slave I2C serial communications data line for communication with system. Open-drain I/O. Use with
10-kΩ pullup resistor (typical).
D1
VSS
P
Device ground.
D2
HDQ
IO
HDQ serial communications line. Open-drain.
D3
RC2
IO
General purpose IO. Push-pull output.
E1
REG25
P
Regulator output and bq27741-G1 processor power. Decouple with 1.0-µF ceramic capacitor to VSS.
E2
TS
IA
Pack thermistor voltage sense (use 103AT-type thermistor). ADC input.
E3
SCL
IO
Slave I2C serial communications clock input line for communication with system. Use with 10-kΩ
pullup resistor (typical).
IO = Digital input-output, IA = Analog input, P = Power connection, O = Output
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
Table 2. Default Configuration
OVERVOLTAGE
PROTECTION (VOVP)
UNDERVOLTAGE
PROTECTION (VUVP)
OVERCURRENT IN
DISCHARGE (VOCD)
OVERCURRENT IN
CHARGE (VOCC)
SHORT CIRCUIT IN
DISCHARGE (Vscd)
4.390 V
2.407 V
34.4 mV
20 mV
74.6 mV
OVERVOLTAGE
PROTECTION DELAY
(tOVP)
UNDERVOLTAGE
PROTECTION DELAY
(tUVP)
OVERCURRENT IN
DISCHARGE DELAY
(tOCD)
OVERCURRENT IN
CHARGE DELAY (tOCC)
SHORT CIRCUIT IN
DISCHARGE DELAY
(tscd)
1s
31.25 ms
31.25 ms
7.8125 ms
312.5 µs
THERMAL INFORMATION
THERMAL METRIC (1)
bq27741-G1
YZF (15 PINS)
θJA
Junction-to-ambient thermal resistance
70
θJCtop
Junction-to-case (top) thermal resistance
17
θJB
Junction-to-board thermal resistance
20
ψJT
Junction-to-top characterization parameter
1
ψJB
Junction-to-board characterization parameter
18
θJCbot
Junction-to-case (bottom) thermal resistance
NA
(1)
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
3
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
VVPWR
Power input range
PARAMETER
–0.3
5.5
V
VREG25
Supply voltage range
–0.3
2.75
V
VPACKP
PACKP input pin
–0.3
5.5
V
PACK+ input when external 2-kΩ resistor is in series with PACKP input pin (see
Reference Schematics)
–0.3
28
V
VOUT
Voltage output pins (DSG, CHG)
–0.3
10
V
VIOD1
Push-pull IO pins (RC2)
–0.3
2.75
V
VIOD2
Open-drain IO pins (SDA, SCL, HDQ, RA0)
–0.3
5.5
V
VBAT
BAT input pin
–0.3
5.5
V
VI
Input voltage range to all other pins (SRP, SRN)
–0.3
5.5
V
VTS
Input voltage range for TS
–0.3
2.75
V
ESD
Human Body Model (HBM), all pins
TA
Operating free-air temperature range
–40
85
°C
TF
Functional temperature range
–40
100
°C
TSTG
Storage temperature range
–65
150
°C
(1)
4
2
UNIT
kV
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
Recommended Operating Conditions
TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted)
PARAMETER
VVPWR
Supply voltage
TEST CONDITION
No operating restrictions
No FLASH writes
CVPWR
External input capacitor for internal
LDO between VPWR and VSS
CREG25
External output capacitor for
internal LDO between REG25 and
VSS
ICC
Normal operating mode
current (1) (2) (VPWR)
ISLP
NOM
MAX
2.8
5.0
2.45
2.8
UNIT
V
0.1
µF
1.0
µF
Fuel gauge in NORMAL mode.
ILOAD > Sleep Current with charge
pumps on (FETs on)
167
µA
SLEEP mode current (1) (2) (VPWR)
Fuel gauge in SLEEP+ mode.
ILOAD < Sleep Current with charge
pumps on (FETs on)
88
µA
IFULLSLP
FULLSLEEP mode current (1) (2)
(VPWR)
Fuel gauge in SLEEP mode.
ILOAD < Sleep Current with charge
pumps on (FETs on)
40
µA
ISHUTDOWN
Shutdown mode current (1) (2)
(VPWR)
Fuel gauge in SHUTDOWN mode.
UVP tripped with fuel gauge and
protector turned off (FETs off)
VVPWR = 2.5 V
TA = 25°C
0.1
VOL
Output voltage low (SCL, SDA,
HDQ, RA0, RC2)
VOH(OD)
Output voltage high (SDA, SCL,
HDQ, RA0, RC2)
External pullup resistor connected
to VREG25
VIL
Input voltage low (SDA, SCL,
HDQ, RA0)
–0.3
0.6
V
VIH(OD)
Input voltage high (SDA, SCL,
HDQ, RA0)
1.2
5.5
V
VA1
Input voltage range (TS)
VSS – 0.125
2
V
VA2
Input voltage range (BAT)
VSS – 0.125
5
V
VA3
Input voltage range (SRP, SRN)
VVPWR –
0.125
VVPWR +
0.125
V
Ilkg
Input leakage current (I/O pins)
tPUCD
Power-up communication delay
(1)
(2)
Nominal capacitor values specified.
Recommend a 5% ceramic X5R
type capacitor located close to the
device.
MIN
0.47
0.2
µA
TA = –40°C to 85°C
0.5
µA
IOL = 1 mA
0.4
V
VREG25 – 0.5
V
0.3
250
µA
ms
All currents are specified as charge pump on (FETs on).
All currents are continuous average over 5-second period.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
5
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
Power-On Reset
TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIT+
Increasing battery voltage input at VREG25
VHYS
Power-on reset hysteresis
MIN
TYP
MAX
UNIT
2.09
2.20
2.31
V
45
115
185
mV
MIN
TYP
MAX
2.3
2.5
2.6
2.5-V LDO Regulator (1)
TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
2.8 V ≤ VVPWR ≤ 4.5 V,
IOUT (1) ≤ 16 mA
VREG25
ISHORT
(1)
(2)
Regulator output voltage
(2)
Short-circuit current limit
2.45 V ≤ VVPWR < 2.8 V (low
battery),
IOUT (1) ≤ 3 mA
TA = –40°C to
85°C
2.3
V
V
TA = –40°C to
85°C
VREG25 = 0 V
UNIT
250
mA
TYP
MAX
UNIT
2.7
3.0
LDO output current, IOUT, is the sum of internal and external load currents.
Assured by characterization. Not production tested.
Charger Attachment and Removal Detection
TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted)
PARAMETER
VCHGATT
TEST CONDITIONS
MIN
Voltage threshold for charger attachment
detection
VCHGREM Voltage threshold for charger removal
detection
0.5
1.0
V
V
Voltage Doubler
TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
2 × VVPWR – 0.4
2 × VVPWR – 0.2
2 × VVPWR
UNIT
VFETON
CHG and DSG FETs on
IL = 1 µA
TA = –40°C to 85°C
VFETOFF
CHG and DSG FETs off
TA = –40°C to 85°C
0.2
V
VFETRIPPLE (1)
CHG and DSG FETs on
IL = 1 µA
TA = –40°C to 85°C
0.1
VPP
tFETON
FET gate rise time
(10% to 90%)
CL = 4 nF
TA = –40°C to 85°C
No series resistance
67
140
218
μs
tFETOFF
FET gate fall time
(90% to 10%)
CL = 4 nF
TA = –40°C to 85°C
No series resistance
10
30
60
μs
(1)
6
V
Assured by characterization. Not production tested.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
Overvoltage Protection (OVP)
TA = 25°C and CREG25 = 1.0 µF (unless otherwise noted)
PARAMETER
VOVP
VOVPREL
tOVP
OVP detection voltage
threshold
OVP release voltage
OVP delay time
TEST CONDITIONS
MIN
TYP
MAX
TA = 25°C
VOVP – 0.006
VOVP
VOVP + 0.006
TA = 0°C to 25°C
VOVP – 0.023
VOVP
VOVP + 0.020
TA = 25°C to 50°C
VOVP – 0.018
VOVP
VOVP + 0.014
TA = –40°C to 85°C
VOVP – 0.053
VOVP
VOVP + 0.035
TA = 25°C
VOVPREL – 0.012
VOVP – 0.215
VOVPREL + 0.012
TA = 0°C to 25°C
VOVPREL – 0.023
VOVP – 0.215
VOVPREL + 0.020
TA = 25°C to 50°C
VOVPREL – 0.018
VOVP – 0.215
VOVPREL + 0.014
TA = –40°C to 85°C
VOVPREL – 0.053
VOVP – 0.215
VOVPREL + 0.035
TA = –40°C to 85°C
tOVP – 5%
tOVP
tOVP + 5%
UNIT
V
V
s
Undervoltage Protection (UVP)
TA = 25°C and CREG25 = 1.0 µF (unless otherwise noted)
PARAMETER
VUVP
VUVPREL
tUVP
UVP detection voltage
threshold
UVP release voltage
UVP delay time
MIN
TYP
MAX
TA = 25°C
TEST CONDITIONS
VUVP – 0.012
VUVP
VUVP + 0.012
TA = –5°C to 50°C
VUVP – 0.020
VUVP
VUVP + 0.020
TA = –40°C to 85°C
VUVP – 0.040
VUVP
VUVP + 0.040
TA = 25°C
VUVPREL – 0.012
VUVP + 0.105
VUVPREL + 0.012
TA = –5°C to 50°C
VUVPREL – 0.020
VUVP + 0.105
VUVPREL + 0.020
TA = –40°C to 85°C
VUVPREL – 0.040
VUVP + 0.105
VUVPREL + 0.040
TA = –40°C to 85°C
tUVP – 5%
tUVP
tUVP + 5%
MIN
TYP
MAX
VOCD – 3
VOCD
VOCD + 3
TA = –20°C to 60°C
VSRN – VSRP
VOCD – 3.785
VOCD
VOCD + 3.785
TA = –40°C to 85°C
VSRN – VSRP
VOCD – 4.16
VOCD
VOCD + 4.16
TA = –40°C to 85°C
tOCD – 5%
tOCD
tOCD + 5%
UNIT
V
V
ms
Overcurrent in Discharge (OCD)
TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted)
PARAMETER
VOCD
tOCD
OCD detection voltage
threshold
OCD delay time
TEST CONDITIONS
TA = 25°C
VSRN – VSRP
UNIT
mV
ms
Overcurrent in Charge (OCC)
TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted)
PARAMETER
VOCC
tOCC
OCC detection voltage
threshold
OCC delay time
TEST CONDITIONS
MIN
TYP
MAX
VOCC – 3
VOCC
VOCC + 3
TA = –20°C to 60°C
VSRP – VSRN
VOCC – 3.49
VOCC
VOCC + 3.49
TA = –40°C to 85°C
VSRP – VSRN
VOCC – 3.86
VOCC
VOCC + 3.86
TA = –40°C to 85°C
tOCC – 5%
tOCC
tOCC + 5%
TA = 25°C
VSRP – VSRN
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
UNIT
mV
ms
7
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
Short-Circuit in Discharge (SCD)
TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted)
PARAMETER
VSCD
tSCD
SCD detection voltage
threshold
SCD delay time
TEST CONDITIONS
MIN
TYP
MAX
VSCD – 3
VSCD
VSCD + 3
TA = –20°C to 60°C
VSRN – VSRP
VSCD – 4.5
VSCD
VSCD + 4.5
TA = –40°C to 85°C
VSRN – VSRP
VSCD – 4.9
VSCD
VSCD + 4.9
TA = –40°C to 85°C
tSCD – 10%
tSCD
tSCD + 10%
TA = 25°C
VSRN – VSRP
UNIT
mV
µs
Low Voltage Charging
TA = 25°C, CREG25 = 1.0 µF, and VVPWR = 3.6 V (unless otherwise noted)
PARAMETER
VLVDET
TEST CONDITIONS
Voltage threshold for low-voltage charging
detection
TA = –40°C to 85°C
MIN
TYP
MAX
1.4
1.55
1.7
MIN
TYP
MAX
UNIT
V
Internal Temperature Sensor Characteristics
TA = –40°C to 85°C, 2.4 V < VREG25 < 2.6 V
PARAMETER
G(TEMP)
TEST CONDITIONS
Temperature sensor voltage gain
–2
UNIT
mV/°C
High-Frequency Oscillator
2.4 V < VREG25 < 2.6 V; typical values at TA = 25°C and VREG25 = 2.5 V (unless otherwise noted)
PARAMETER
fOSC
Frequency error (1)
fEIO
(1)
(2)
(3)
(2)
Start-up time (3)
tSXO
TEST CONDITIONS
MIN
Operating frequency
TYP
MAX
8.389
MHz
TA = 0°C to 60°C
–2.0%
0.38%
2.0%
TA = –20°C to 70°C
–3.0%
0.38%
3.0%
TA = –40°C to 85°C
-4.5%
0.38%
4.5%
2.5
5
TA = –40°C to 85°C
UNIT
ms
The frequency error is measured from 2.097 MHz.
The frequency drift is included and measured from the trimmed frequency at VREG25 = 2.5 V, TA = 25°C.
The startup time is defined as the time it takes for the oscillator output frequency to be ±3% of the typical oscillator frequency.
Low-Frequency Oscillator
2.4 V < VREG25 < 2.6 V; typical values at TA = 25°C and VREG25 = 2.5 V (unless otherwise noted)
PARAMETER
f(LOSC)
f(LEIO)
t(LSXO)
(1)
(2)
(3)
8
TEST CONDITIONS
MIN
Operating frequency
Frequency error (1)
(2)
Start-up time (3)
TYP
MAX
32.768
kHz
TA = 0°C to 60°C
–1.5%
0.25%
1.5%
TA = –20°C to 70°C
–2.5%
0.25%
2.5%
TA = –40°C to 85°C
-4.0%
0.25%
4.0%
TA = –40°C to 85°C
UNIT
500
μs
The frequency drift is included and measured from the trimmed frequency at VREG25 = 2.5 V, TA = 25°C.
The frequency error is measured from 32.768 kHz.
The startup time is defined as the time it takes for the oscillator output frequency to be ±3% of the typical oscillator frequency.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
Integrating ADC (Coulomb Counter) Characteristics
TA = –40°C to 85°C, 2.4 V < VREG25 < 2.6 V; typical values at TA = 25°C and VREG25 = 2.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VSR_IN
Input voltage range, VSRN and VSRP VSR = VSRN – VSRP
tSR_CONV
Conversion time
MIN
VVPWR – 0.125
MAX
Input offset
INL
Integral nonlinearity error
ZSR_IN
Effective input resistance (1)
ISR_LKG
Input leakage current (1)
V
1
s
14
VSR_OS
UNIT
VVPWR + 0.125
Single conversion
Resolution
(1)
TYP
15
bits
μV
10
±0.007
±0.034
%FSR
7
MΩ
μA
0.3
Assured by design. Not production tested.
ADC (Temperature and Cell Voltage) Characteristics
TA = –40°C to 85°C, 2.4 V < VREG25 < 2.6 V; typical values at TA = 25°C and VREG25 = 2.5 V (unless otherwise noted)
PARAMETER
VADC_IN
tADC_CONV
TEST CONDITIONS
VSS – 0.125
Input voltage range (other channels)
VSS – 0.125
TYP
Input offset
ZADC1
Effective input resistance (TS)
ZADC2
Effective input resistance (BAT) (1)
IADC_LKG
Input leakage current (1)
UNIT
V
1
14
VADC_OS
MAX
5
Conversion time
Resolution
(1)
MIN
Input voltage range (VBAT channel)
V
125
ms
15
bits
1
(1)
Not measuring cell voltage
mV
55
MΩ
55
MΩ
Measuring cell voltage
100
kΩ
μA
0.3
Assured by design. Not production tested.
Data Flash Memory Characteristics
TA = –40°C to 85°C, 2.4 V < VREG25 < 2.6 V; typical values at TA = 25°C and VREG25 = 2.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Data retention (1)
tDR
Flash programming write-cycles
TYP
Word programming time
ICCPROG
Flash-write supply current (1)
MAX
UNIT
10
years
20,000
cycles
(1)
tWORDPROG
(1)
(1)
MIN
5
2
ms
10
mA
Assured by design. Not production tested.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
9
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
I2C-Compatible Interface Timing Characteristics
TA = –40°C to 85°C, 2.4 V < VREG25 < 2.6 V; typical values at TA = 25°C and VREG25 = 2.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tR
SCL or SDA rise time
300
ns
tF
SCL or SDA fall time
300
ns
tw(H)
SCL pulse width (high)
600
ns
tw(L)
SCL pulse width (low)
1.3
μs
tsu(STA)
Setup for repeated start
600
ns
td(STA)
Start to first falling edge of SCL
600
ns
tsu(DAT)
Data setup time
100
ns
th(DAT)
Data hold time
0
ns
tsu(STOP)
Setup time for stop
tBUF
Bus free time between stop and start
fSCL
Clock frequency
600
ns
66
μs
400
tSU(STA)
tw(H)
tf
tw(L)
tr
kHz
t(BUF)
SCL
SDA
td(STA)
tsu(STOP)
tf
tr
th(DAT)
tsu(DAT)
REPEATED
START
STOP
START
Figure 1. I2C-Compatible Interface Timing Diagrams
10
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
HDQ Communication Timing Characteristics
TA = –40°C to 85°C, 2.4 V < VREG25 < 2.6 V; typical values at TA = 25°C and VREG25 = 2.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
205
250
μs
μs
t(CYCH)
Cycle time, host to fuel gauge
190
t(CYCD)
Cycle time, fuel gauge to host
190
t(HW1)
Host sends 1 to fuel gauge
0.5
50
μs
t(DW1)
Fuel gauge sends 1 to host
32
50
μs
t(HW0)
Host sends 0 to fuel gauge
86
145
μs
t(DW0)
Fuel gauge sends 0 to host
80
145
μs
t(RSPS)
Response time, fuel gauge to host
190
950
μs
t(B)
Break time
190
t(BR)
Break recovery time
40
t(RST)
HDQ reset
1.8
t(RISE)
HDQ line rise time to logic 1 (1.2 V)
μs
μs
2.2
s
950
ns
1.2V
t(RISE)
t(BR)
t(B)
(b) HDQ line rise time
(a) Break and Break Recovery
t(DW1)
t(HW1)
t(DW0)
t(CYCD)
t(HW0)
t(CYCH)
(d) Gauge Transmitted Bit
(c) Host Transmitted Bit
Break
7-bit address
1-bit
8-bit data
R/W
t(RSPS)
(e) Gauge to Host Response
t(RST)
(f) HDQ Reset
Figure 2. Timing Diagrams
(a)
(b)
(c)
(d)
(e)
(f)
HDQ Breaking
Rise time of HDQ line
HDQ Host to fuel gauge communication
Fuel gauge to Host communication
Fuel gauge to Host response format
HDQ Host to fuel gauge reset
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
11
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
FEATURE SET
The bq27741-G1 fuel gauge accurately predicts the battery capacity and other operational characteristics of a
single Li-based rechargeable cell. It can be interrogated by a system processor to provide cell information, such
as state-of-charge (SOC), time-to-empty (TTE), and time-to-full (TTF).
Configuration
Cell information is stored in the fuel gauge in non-volatile flash memory. Many of these data flash locations are
accessible during application development. They cannot, generally, be accessed directly during end-equipment
operation. Access to these locations is achieved by either use of the companion evaluation software, through
individual commands, or through a sequence of data-flash-access commands. To access a desired data flash
location, the correct data flash subclass and offset must be known.
The fuel gauge provides 96 bytes of user-programmable data flash memory, partitioned into three 32-byte
blocks: Manufacturer Info Block A and Manufacturer Info Block B. This data space is accessed through a
data flash interface.
Fuel Gauging
The key to the high-accuracy gas gauging prediction is Texas Instruments proprietary Impedance Track™
algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-of-charge
predictions that can achieve less than 1% error across a wide variety of operating conditions and over the
lifetime of the battery.
See application note SLUA364B, Theory and Implementation of Impedance Track Battery Fuel-Gauging
Algorithm, for further details.
Power Modes
To minimize power consumption, the fuel gauge has different power modes: NORMAL, SLEEP, and
FULLSLEEP. The fuel gauge passes automatically between these modes, depending upon the occurrence of
specific events, though a system processor can initiate some of these modes directly.
NORMAL Mode
The fuel gauge is in NORMAL mode when not in any other power mode. During this mode, AverageCurrent( ),
Voltage( ), and Temperature( ) measurements are taken, and the interface data set is updated. Decisions to
change states are also made. This mode is exited by activating a different power mode.
Because the fuel gauge consumes the most power in NORMAL mode, the Impedance Track™ algorithm
minimizes the time the fuel gauge remains in this mode.
SLEEP Mode
SLEEP mode performs AverageCurrent(), Voltage(), and Temperature() less frequently which results in reduced
power consumption. SLEEP mode is entered automatically if the feature is enabled (Pack Configuration
[SLEEP] = 1) and AverageCurrent( ) is below the programmable level Sleep Current. Once entry into SLEEP
mode has been qualified, but prior to entering it, the fuel gauge performs an ADC autocalibration to minimize
offset.
During the SLEEP mode, the fuel gauge periodically takes data measurements and updates its data set.
However, a majority of its time is spent in an idle condition.
The fuel gauge exits SLEEP if any entry condition is broken, specifically when either:
• AverageCurrent( ) rises above Sleep Current, or
• A current in excess of IWAKE through RSENSE is detected.
12
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
FULLSLEEP Mode
FULLSLEEP mode turns off the high-frequency oscillator and performs AverageCurrent(), Voltage(), and
Temperature() less frequently which results in power consumption that is lower than that of the SLEEP mode.
FULLSLEEP mode can be enabled by two methods:
• Setting the [FULLSLEEP] bit in the Control Status register using the FULL_SLEEP subcommand and Full
Sleep Wait Time (FS Wait) in data flash is set as 0.
• Setting the Full Sleep Wait Time (FS Wait) in data flash to a number larger than 0. This method is disabled
when the FS Wait is set as 0.
FULLSLEEP mode is entered automatically when it is enabled by one of the methods above. When the first
method is used, the gauge enters the FULLSLEEP mode when the fuel gauge is in SLEEP mode. When the
second method is used, the FULLSLEEP mode is entered when the fuel gauge is in SLEEP mode and the timer
counts down to 0.
The fuel gauge exits the FULLSLEEP mode when there is any communication activity. Therefore, the execution
of SET_FULLSLEEP sets the [FULLSLEEP] bit. The FULLSLEEP mode can be verified by measuring the
current consumption of the gauge.
During FULLSLEEP mode, the fuel gauge periodically takes data measurements and updates its data set.
However, a majority of its time is spent in an idle condition.
The fuel gauge exits SLEEP if any entry condition is broken, specifically when either:
• AverageCurrent( ) rises above Sleep Current, or
• A current in excess of IWAKE through RSENSE is detected.
While in FULLSLEEP mode, the fuel gauge can suspend serial communications by as much as 4 ms by holding
the comm line(s) low. This delay is necessary to correctly process host communication, because the fuel gauge
processor is mostly halted in SLEEP mode.
Battery Protector Description
The battery protector controls two external high-side N-channel FETs in a back-to-back configuration for battery
protection. The protector uses two voltage doublers to drive the CHG and DSG FETs on.
High-Side NFET Charge and Discharge FET Drive
The CHG or DSG FET is turned on by pulling the FET gate input up to VFETON. The FETs are turned off by
pulling the FET gate input down to VSS. These FETs are automatically turned off by the protector based on the
detected protection faults, or when commanded to turn off via the FETTest(0x74/0x75) extended command.
Once the protection fault(s) is cleared, the FETs may be turned on again.
Operating Modes
The battery protector has several operating modes:
• Virtual shutdown mode
– Analog shutdown
– Low voltage charging
• UVP fault (POR state)
• Normal mode
• Shutdown wait
• OCD or SCD fault mode
• OCC fault mode
• OVP fault mode
The relationships among these modes are shown in Figure 3.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
13
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
UVP Fault
(POR State)
CHG FET on
DSG FET off
Fuel Gauge on
LDO is on
EL
PR
Normal
W
V VP
OCC Fault
CHG FET off
DSG FET on
Fuel Gauge on
LDO on
Fuel Gauge in
Normal, SLEEP,
FULLSLEEP Modes
CHG FET on
DSG FET on
Fuel Gauge on
LDO is on
(VSRP – VSRN) > VOCC
Fault recovery:
Charger removed
R
UV
>V
R
<V
P
UV
FW(ROM) turns
FETs off briefly
PW
VV
POR
(Force UVP set)
Low Voltage Charging
(VSRN – VSRP) > VOCD
OR
(VSRN – VSRP) > VSCD
Charger removed
VVPWR > VOVP
Fault recovery:
load removed
Shutdown bit
cleared
Charger removed
Shutdown Bit
set
VVPWR < VOVPREL
AND
Fault recovery:
Charger removed
OCD/SCD Fault
CHG FET on
DSG FET off
Fuel Gauge on
LDO on
CHG FET control shorted to
PACKP pin
DSG FET off
Protection off
Fuel Gauge off
LDO is off
Charger attached
AND
VVPWR>VLVDET
Analog Shutdown
Shutdown Wait
OVP Fault
CHG FET off
DSG FET on
Fuel Gauge on
LDO on
CHG FET off
DSG FET off
Fuel Gauge on Charger removed
LDO is on
CHG FET off
DSG FET off
Fuel Gauge off
LDO is off
Virtual Shutdown
Figure 3. Operating Modes
Virtual Shutdown Mode
In this mode, the fuel gauge is not functional and only certain portions of analog circuitry are running to allow
device wakeup from shutdown and low voltage charging.
Analog Shutdown Mode
In this mode, the fuel gauge is not functional. Once the charger is connected, the fuel gauge determines if low
voltage charging is allowed and then transitions to low voltage charging.
Low Voltage Charging Mode
In this mode, the fuel gauge closes CHG FET by shorting the gate to PACKP pin. Low voltage charging
continues until the cell voltage (VVPWR) rises above the POR threshold.
Undervoltage Fault Mode
In this mode, the voltage on VPWR pin is below VUVP and the charger is connected. As soon as the charger
disconnects, the fuel gauge transitions into Analog Shutdown Mode to save power.
The fuel gauge can enter this mode from Low Voltage Charging Mode when the battery pack is being charged
from a deeply discharged state or from Normal Mode when the battery pack is being discharged below the
allowed voltage.
14
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
When the battery pack is charged above VUVPREL, the fuel gauge transitions to Normal Mode.
Normal Mode
In this mode, the protector is fully powered and operational. Both CHG and DSG FETs are closed, while further
operation is determined by the firmware. Protector is continuously checking for all faults.
The CHG or DSG FET may be commanded to be opened via the protector register by the firmware, but it does
not affect protector operation nor changes the mode of operation.
Firmware can also command the fuel gauge to go into shutdown mode based on the command from the host. In
this case, firmware sets the Shutdown bit to indicate intent to go into shutdown mode. The fuel gauge then
transitions to Shutdown Wait Mode.
Shutdown Wait Mode
In this mode, the shutdown bit was set by the firmware and the fuel gauge initiated the shutdown sequence.
The shutdown sequence:
1. Open both CHG and DSG FETs
2. Determine if any faults are set. If any faults are set, then go back to Normal Mode.
3. Wait for charger removal. Once the charger is removed, turn off the LDO, which puts the fuel gauge into
Analog Shutdown Mode.
Overcurrent Discharge (OCD) and Short-Circuit Discharge (SCD) Fault Mode
In this mode, a short-circuit discharge (SCD) or overcurrent discharge (OCD) protection fault is detected when
the voltage across the sense resistor continuously exceeds the configured VOCD or VSCD thresholds for longer
than the configured delay.
The fuel gauge enables the fault removal detection circuitry, which monitors load removal. A special high
resistance load is switched in to monitor load presence. The OCD/SCD fault is cleared when the load is
removed, which causes the fuel gauge to transition into Normal Mode.
Overcurrent Charge (OCC) Fault Mode
In this mode, an overcurrent charge (OCC) protection fault is detected when the voltage across the sense
resistor continuously exceeds the configured VOCC for longer than the configured delay.
The fuel gauge enables the fault removal detection circuitry, which monitors the charger removal. The OCC fault
is cleared once the charger voltage drops below the cell voltage by more than 300 mV, which causes the fuel
gauge to transition to Normal Mode.
Overvoltage Protection (OVP) Fault Mode
In this mode, an overvoltage protection (OVP) fault mode is entered when the voltage on VPWR pin continuously
exceeds the configured VOVP threshold for longer than the configured delay.
The fuel gauge enables the fault removal detection circuitry, which monitors the charger removal. The OVP fault
is cleared once the charger voltage drops below the cell voltage by more than 300 mV and the cell voltage drops
below VOVPREL, which causes the fuel gauge to transition to Normal Mode.
Firmware Control of Protector
The firmware has control to open the CHG FET or DSG FET independently by overriding hardware control.
However, it has no control to close the CHG FET or DSG FET and can only disable the FET override.
Overtemperature Fault Mode
Overtemperature protection is implemented in firmware. Gauging firmware monitors temperature every second
and will open both CHG and DSG FETs if Temperature() > OT Prot Threshold for OT Prot Delay. CHG and DSG
FETs override will be released when Temperature() < OT Prot Recover.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
15
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
Wake-Up Comparator
The wake-up comparator indicates a change in cell current while the fuel gauge is in SLEEP mode. Wake
comparator threshold can be configured in firmware and set to the thresholds in Table 3. An internal event is
generated when the threshold is breached in either charge or discharge directions.
Table 3. IWAKE Threshold Settings(1)
RSNS1
RSNS0
IWAKE
Vth(SRP-SRN)
0
0
0
Disabled
0
0
1
Disabled
0
1
0
1.0 mV or –1.0 mV
0
1
1
2.2 mV or –2.2 mV
1
0
0
2.2 mV or –2.2 mV
1
0
1
4.6 mV or –4.6 mV
1
1
0
4.6 mV or –4.6 mV
1
1
1
9.8 mV or –9.8 mV
(1) The actual resistance value versus the setting of the sense resistor is not important just the actual voltage threshold when calculating
the configuration. The voltage thresholds are typical values under room temperature.
Battery Parameter Measurements
Charge and Discharge Counting
The integrating delta-sigma ADC measures the charge or discharge flow of the battery by measuring the voltage
drop across a small-value sense resistor between the SRP and SRN pins. The integrating ADC measures bipolar
signals and detects charge activity when VSR = VSRP – VSRN is positive and discharge activity when VSR = VSRP –
VSRN is negative. The fuel gauge continuously integrates the signal over time using an internal counter.
Voltage
The fuel gauge updates cell voltages at 1-second intervals when in NORMAL mode. The internal ADC of the fuel
gauge measures the voltage, and scales and calibrates it appropriately. Voltage measurement is automatically
compensated based on temperature. This data is also used to calculate the impedance of the cell for Impedance
Track™ fuel gauging.
Current
The fuel gauge uses the SRP and SRN inputs to measure and calculate the battery charge and discharge
current using a 5-mΩ to 20-mΩ typical sense resistor.
Auto-Calibration
The fuel gauge provides an auto-calibration feature to cancel the voltage offset error across SRN and SRP for
maximum charge measurement accuracy. The fuel gauge performs auto-calibration before entering the SLEEP
mode.
Temperature
The fuel gauge external temperature sensing is optimized with the use of a high-accuracy negative temperature
coefficient (NTC) thermistor with R25 = 10 kΩ ± 1% and B25/85 = 3435 kΩ ± 1% (such as Semitec 103AT for
measurement). The fuel gauge can also be configured to use its internal temperature sensor. The fuel gauge
uses temperature to monitor the battery-pack environment, which is used for fuel gauging and cell protection
functionality.
16
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
NOTE
Formatting Conventions in This Document:
Commands: italics with parentheses and no breaking spaces, for example,
RemainingCapacity( ).
Data Flash: italics, bold, and breaking spaces, for example, Design Capacity.
Register Bits and Flags: brackets only, for example, [TDA]
Data Flash Bits: italic and bold, for example, [XYZ1]
Modes and states: ALL CAPITALS, for example, UNSEALED mode.
Communications
HDQ Single-Pin Serial Interface
The HDQ interface is an asynchronous return-to-one protocol where a processor sends the command code to
the fuel gauge. With HDQ, the least significant bit (LSB) of a data byte (command) or word (data) is transmitted
first. The DATA signal on pin 12 is open-drain and requires an external pullup resistor. The 8-bit command code
consists of two fields: the 7-bit HDQ command code (bits 0 through 6) and the 1-bit RW field (MSB bit 7). The
RW field directs the fuel gauge either to:
• Store the next 8 bits of data to a specified register, or
• Output 8 bits of data from the specified register
The HDQ peripheral can transmit and receive data as either an HDQ master or slave.
HDQ serial communication is normally initiated by the host processor sending a break command to the fuel
gauge. A break is detected when the DATA pin is driven to a logic low state for a time t(B) or greater. The DATA
pin then is returned to its normal ready logic high state for a time t(BR). The fuel gauge is now ready to receive
information from the host processor.
The fuel gauge is shipped in the I2C mode. TI provides tools to enable the HDQ peripheral.
HDQ Host Interruption
The default fuel gauge behaves as an HDQ slave-only device. If the HDQ interrupt function is enabled, the fuel
gauge is capable of mastering and also communicating to a HDQ device. There is no mechanism for negotiating
which is to function as the HDQ master and care must be taken to avoid message collisions. The interrupt is
signaled to the host processor with the fuel gauge mastering an HDQ message. This message is a fixed
message that signals the interrupt condition. The message itself is 0x80 (slave write to register 0x00) with no
data byte being sent as the command is not intended to convey any status of the interrupt condition. The HDQ
interrupt function is not public and needs to be enabled by command.
When the SET_HDQINTEN subcommand is received, the fuel gauge detects any of the interrupt conditions and
asserts the interrupt at one-second intervals until either:
• The CLEAR_HDQINTEN subcommand is received, or
• The number of tries for interrupting the host has exceeded a predetermined limit. After the interrupt event,
interrupts are automatically disabled. To re-enable interrupts, SET_HDQINTEN needs to be sent.
Low Battery Capacity
This feature works identically to SOC1. It uses the same data flash entries as SOC1 and triggers interrupts as
long as SOC1 = 1 and HDQIntEN = 1.
Temperature
This feature triggers an interrupt based on the OTC (Overtemperature in Charge) or OTD (Overtemperature in
Discharge) condition being met. It uses the same data flash entries as OTC or OTD and triggers interrupts as
long as either the OTD or OTC condition is met and HDQIntEN = 1. (See detail in HDQ Host Interruption.)
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
17
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
I2C Interface
The fuel gauge supports the standard I2C read, incremental read, one-byte write quick read, and functions. The
7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as 1010101. The 8-bit
device address is therefore 0xAA or 0xAB for write or read, respectively.
GG Generated
Host Generated
S
0 A
ADDR[6:0]
CMD[7:0]
P
A P
DATA[7:0]
A
S
ADDR[6:0]
1 A
(a)
S
ADDR[6:0]
DATA[7:0]
N P
(b)
0 A
CMD[7:0]
A Sr
ADDR[6:0]
1 A
DATA[7:0]
N P
( c)
S
ADDR[6:0]
0 A
CMD[7:0]
A Sr
ADDR[6:0]
1 A
DATA[7:0]
A ...
DATA[7:0]
N P
(d)
Figure 4. Supported I2C Formats
(a)
(b)
(c)
(d)
1-byte write
Quick read
1-byte read
Incremental read (S = Start, Sr = Repeated Start, A = Acknowledge, N = No Acknowledge, and P = Stop).
The quick read returns data at the address indicated by the address pointer. The address pointer, a register
internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the
I2C master. Quick writes function in the same manner and are a convenient means of sending multiple bytes to
consecutive command locations (such as two-byte commands that require two bytes of data).
Attempt to write a read-only address (NACK after data sent by master):
S
ADDR[6:0]
0 A
CMD[7:0]
A
DATA[7:0]
P
P
N P
Attempt to read an address above 0x7F (NACK command):
S
0 A
ADDR[6:0]
P
P
N P
CMD[7:0]
Attempt at incremental writes (NACK all extra data bytes sent):
S
ADDR[6:0]
0 A
CMD[7:0]
A
DATA[7:0]
A
DATA[7:0]
N
... N P
Incremental read at the maximum allowed read address:
S
ADDR[6:0]
0 A
CMD[7:0]
A Sr
ADDR[6:0]
1 A
DATA[7:0]
Address
0x7F
A
DATA[7:0]
Data from
addr 0x74
N P
Data from
addr 0x00
The I2C engine releases both SDA and SCL if the I2C bus is held low for t(BUSERR). If the fuel gauge was holding
the lines, releasing them frees the master to drive the lines. If an external condition is holding either of the lines
low, the I2C engine enters the low-power sleep mode.
18
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
I2C Time Out
The I2C engine releases both SDA and SCL lines if the I2C bus is held low for about 2 seconds. If the fuel gauge
was holding the lines, releasing them frees the master to drive the lines.
I2C Command Waiting Time
To ensure the correct results of a command with the 400-kHz I2C operation, a proper waiting time must be added
between issuing a command and reading the results. For subcommands, the following diagram shows the
waiting time required between issuing the control command and reading the status with the exception of the
checksum command. A 100-ms waiting time is required between the checksum command and reading the result.
For read-write standard commands, a minimum of 2 seconds is required to get the result updated. For read-only
standard commands, there is no waiting time required, but the host must not issue any standard command more
than two times per second. Otherwise, the gauge could result in a reset issue due to the expiration of the
watchdog timer.
xx
xxxxxxxx
xx
xxxxxxxxx
xxxxxxxxx
xxxxxxxxx
xx
S ADDR[6:0] 0 A
CMD[7:0]
A
DATA[7:0]
A
DATA[7:0]
A P
66Ps
xx
xxxxxxxx
xx
xxxxxxxxx
xxxxxxxxx
xxxxxxxxx
xx
xxx
xxxxxxxx
xx
xxx
xx
xxxxxxxx
xx
xxxxxxxxx
xxxxxxxxx
xxxxxxxxx
xx
S ADDR[6:0] 0 A
CMD[7:0]
A Sr ADDR[6:0] 1 A
DATA[7:0]
A
DATA[7:0] xxx
N xx
P
xx
xxxxxxxx
xx
xxxxxxxxx
xxx
xxxxxxxx
xx
xxx
xxx
xx
xx
xxxxxxxx
xx xxxxxxxxx
xxx
xxxxxxxx
xx
xxx
xxx
xx
Waiting time between control subcommand and reading results
xx
xxxxxxxx
xx
xxxxxxxxx
xxx
xxxxxxx
xxx
Sxxxxxxxx
ADDR[6:0] xx
0 A xxxxxxxxx
CMD[7:0]
Axxx
Sr xxxxxxx
ADDR[6:0]xxx
1 A
xx
xx
xxxxxxxx
xxxxxxxxx
xxx
xxxxxxx
xxx
xx
xxx
xx
DATA[7:0] xx
A
DATA[7:0] xxx
Nxx
P
66Ps
xx
xxx
xx
DATA[7:0]
xxx
A
xxx
xxx
DATA[7:0]
66Ps
xx
A
xx
xx
Waiting time between continuous reading results
The I2C clock stretch could happen in a typical application. A maximum 80-ms clock stretch could be observed
during the flash updates. There is up to a 270-ms clock stretch after the OCV command is issued.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
19
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
DATA COMMANDS
Standard Data Commands
The fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of battery
information. Each standard command has an associated command-code pair, as indicated in Table 4. Each
protocol has specific means to access the data at each Command Code. Data RAM is updated and read by the
gauge only once per second. Standard commands are accessible in NORMAL operation mode.
Table 4. Standard Commands
COMMAND CODE
UNIT
SEALED
ACCESS
CNTL
0x00 and 0x01
NA
RW
NAME
Control( )
AtRate( )
AR
0x02 and 0x03
mA
RW
UnfilteredSOC()
UFSOC
0x04 and 0x05
%
R
Temperature( )
TEMP
0x06 and 0x07
0.1°K
R
Voltage( )
VOLT
0x08 and 0x09
mV
R
Flags( )
FLAGS
0x0A and 0x0B
NA
R
NomAvailableCapacity( )
NAC
0x0C and 0x0D
mAh
R
FullAvailableCapacity( )
FAC
0x0E and 0x0F
mAh
R
RemainingCapacity( )
RM
0x10 and 0x11
mAh
R
FullChargeCapacity( )
FCC
0x12 and 0x13
mAh
R
AI
0x14 and 0x15
mA
R
AverageCurrent( )
TimeToEmpty( )
FilteredFCC()
StandbyCurrent( )
UnfilteredFCC()
MaxLoadCurrent( )
UnfilteredRM()
FilteredRM()
AveragePower( )
TTE
0x16 and 0x17
minutes
R
FFCC
0x18 and 0x19
mAh
R
SI
0x1A and 0x1B
mA
R
UFFCC
0x1C and 0x1D
mAh
R
MLI
0x1E and 0x1F
mA
R
UFRM
0x20 and 0x21
mAh
R
FRM
0x22 and 0x23
mAh
R
AP
0x24 and 0x25
mW or cW
R
INTTEMP
0x28 and 0x29
0.1°K
R
CC
0x2A and 0x2B
Counts
R
StateOfCharge( )
SOC
0x2C and 0x2D
%
R
StateOfHealth( )
SOH
0x2E and 0x2F
% / num
R
PassedCharge( )
PCHG
0x34 and 0x35
mAh
R
DOD0( )
DOD0
0x36 and 0x37
hex#
R
SelfDischargeCurrent()
SDSG
0x38 and 0x39
mA
R
InternalTemperature( )
CycleCount( )
20
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
Control( ): 0x00 and 0x01
Issuing a Control( ) command requires a subsequent 2-byte subcommand. These additional bytes specify the
particular control function desired. The Control( ) command allows the system to control specific features of the
fuel gauge during normal operation and additional features when the fuel gauge is in different access modes, as
described in Table 5.
Table 5. Control( ) Subcommands
CNTL DATA
SEALED
ACCESS
CONTROL_STATUS
0x0000
Yes
Reports the status of DF Checksum, Impedance Track™, etc.
DEVICE_TYPE
0x0001
Yes
Reports the device type of 0x0741 (indicating bq27741-G1)
FW_VERSION
0x0002
Yes
Reports the firmware version on the device type
HW_VERSION
0x0003
Yes
Reports the hardware version of the device type
PROTECTOR_VERSION
0x0004
Yes
Reports the hardware version of the protector portion of the device
RESET_DATA
0x0005
Yes
Returns reset data
Reserved
0x0006
No
Not to be used
PREV_MACWRITE
0x0007
Yes
Returns previous Control( ) subcommand code
CHEM_ID
0x0008
Yes
Reports the chemical identifier of the Impedance Track™ configuration
BOARD_OFFSET
0x0009
No
Forces the device to measure and store the board offset
CC_OFFSET
0x000A
No
Forces the device to measure internal CC offset
CNTL FUNCTION
DESCRIPTION
CC_OFFSET_SAVE
0x000B
No
Forces the device to store the internal CC offset
DF_VERSION
0x000C
Yes
Reports the data flash version on the device
SET_FULLSLEEP
0x0010
Yes
Sets the CONTROL_STATUS [FULLSLEEP] bit to 1
SET_SHUTDOWN
0x0013
Yes
Sets the CONTROL_STATUS [SHUTDN_EN] bit to 1
CLEAR_SHUTDOWN
0x0014
Yes
Clears the CONTROL_STATUS [SHUTDN_EN] bit to 0
SET_HDQINTEN
0x0015
Yes
Forces the CONTROL_STATUS [HDQIntEn] bit to 1
CLEAR_HDQINTEN
0x0016
Yes
Forces the CONTROL_STATUS [HDQIntEn] bit to 0
STATIC_CHEM_CHKSUM
0x0017
Yes
Calculates chemistry checksum
ALL_DF_CHKSUM
0x0018
Yes
Reports checksum for all data flash excluding device specific variables
STATIC_DF_CHKSUM
0x0019
Yes
Reports checksum for static data flash excluding device specific variables
SEALED
0x0020
No
Places the fuel gauge in SEALED access mode
IT_ENABLE
0x0021
No
Enables the Impedance Track™ algorithm
START_FET_TEST
0x0024
No
Starts FET Test based on data entered in FET Test register. Sets and clears
the [FETTST] bit in CONTROL_STATUS register
CAL_ENABLE
0x002D
No
Toggle calibration mode
RESET
0x0041
No
Forces a full reset of the fuel gauge
EXIT_CAL
0x0080
No
Exit calibration mode
ENTER_CAL
0x0081
No
Enter calibration mode
OFFSET_CAL
0x0082
No
Reports internal CC offset in calibration mode
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
21
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
Extended Data Commands
Extended commands offer additional functionality beyond the standard set of commands.
same manner; however unlike standard commands, extended commands are not limited
number of command bytes for a given extended command ranges in size from single
specified in Table 6. For details on the SEALED and UNSEALED states, see the Access
TRM, SLUUAA3.
They are used in the
to 2-byte words. The
to multiple bytes, as
Modes section in the
Table 6. Extended Commands
NAME
PackConfig( )
DesignCapacity( )
COMMAND CODE
UNIT
SEALED
ACCESS (1) (2)
UNSEALED
ACCESS (1) (2)
R
PCR
0x3A and 0x3B
hex#
R
DCAP
0x3C and 0x3D
mAh
R
R
0x3E
NA
NA
RW
DataFlashClass( )
(2)
DFCLS
DataFlashBlock( )
(2)
DFBLK
0x3F
NA
RW
RW
A/DF
0x40 to 0x53
NA
RW
RW
ACKS/DFD
0x54
NA
RW
RW
BlockData( ) / Authenticate( ) (3)
BlockData( ) / AuthenticateCheckSum( )
BlockData( )
(3)
DFD
0x55 to 0x5F
NA
R
RW
BlockDataCheckSum( )
DFDCKS
0x60
NA
RW
RW
BlockDataControl( )
DFDCNTL
0x61
NA
NA
RW
DNAMELEN
0x62
NA
R
R
DeviceName( )
DNAME
0x63 to 0x6C
NA
R
R
Protector Status
AFESTAT1
0x6D
hex
R
R
RSVD
0x6E and 0x6F
NA
R
R
0x70 and 0x71
NA
R
R
0x72 and 0x73
NA
R
R
0x74 and 0x75
NA
NA
RW
DeviceNameLength( )
Reserved
Simultaneous Current
Reserved
RSVD
FETTest( )
Reserved
Protector State
Reserved (4)
DODatEOC( ) (4)
QStart( )
(4)
FastQmax( ) (4)
RSVD
0x76 and 0x77
NA
R
R
AFESTATE
0x78
hex
R
R
RSVD
0x79
NA
R
R
0x7A and 0x7B
NA
R
R
0x7C and 0x7D
mA
R
R
0x7E and 0x7F
mAh
R
R
AN_COUNTER (5)
0x79
AN_CURRENT_LSB (5)
0x7A
AN_CURRENT_MSB (5)
0x7B
AN_VCELL_LSB (5)
0x7C
AN_VCELL_MSB (5)
0x7D
AN_TEMP_LSB (5)
0x7E
AN_TEMP_MSB
(1)
(2)
(3)
(4)
(5)
22
(5)
0x7F
SEALED and UNSEALED states are entered via commands to Control( ) 0x00 and 0x01
In SEALED mode, data flash cannot be accessed through commands 0x3E and 0x3F.
The BlockData( ) command area shares functionality for accessing general data flash and for using Authentication. See Authentication
in the bq27741-G1 TRM (SLUUAA3) for more details.
If CONTROL_STATUS [CALMODE] bit = 0, then this address or command is valid.
If CONTROL_STATUS [CALMODE] bit = 1, then this address or command is valid.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
DATA FLASH SUMMARY
Table 7 through Table 13 summarize the data flash locations available to the user, including their default,
minimum, and maximum values.
Table 7. Data Flash Summary—Configuration Class
SUBCLASS
ID
SUBCLASS
2
Safety
34
Charge
36
Charge
Termination
48
Data
NAME
OFFSET
DATA
TYPE
VALUE
UNIT
MIN
MAX
DEFAULT
OT Chg
0
I2
0
1200
550
OT Chg Time
2
U1
0
60
5
0.1°C
s
OT Chg Recovery
3
I2
0
1200
500
0.1°C
OT Dsg
5
I2
0
1200
600
0.1°C
OT Dsg Time
7
U1
0
60
5
s
OT Dsg Recovery
8
I2
0
1200
550
0.1°C
OT Prot Threshold
10
I2
0
1200
600
0.1°C
OT Prot Delay
12
U1
0
60
3
s
OT Prot Recovery
13
I2
0
1200
550
0.1°C
Charge Voltage
0
I2
0
4600
4200
mV
Taper Current
0
I2
0
1000
100
mA
Min Taper Capacity
2
I2
0
1000
25
mAh
Taper Voltage
4
I2
0
1000
100
mV
Current Taper Window
6
U1
0
60
40
s
TCA Set %
7
I1
–1%
100%
99%
TCA Clear %
8
I1
–1%
100%
95%
FC Set %
9
I1
–1%
100%
–1%
FC Clear %
10
I1
–1%
100%
98%
DODatEOC Delta T
11
I2
0
1000
50
0.1°C
Initial Standby
8
I1
–256
0
–10
mA
Initial MaxLoad
9
I2
–32767
0
–500
mA
Cycle Count
17
U2
0
65535
0
Count
CC Threshold
19
I2
100
32767
900
mAh
Design Capacity
23
I2
0
32767
1000
mAh
Design Energy
25
I2
0
32767
5400
mWh
SOH Load I
27
I2
–32767
0
-400
mA
TDD SOH Percent
29
I1
0%
100%
80%
ISD Current
40
I2
0
32767
10
Hour Rate
ISD I Filter
42
U1
0
255
127
Count
Min ISD Time
43
U1
0
255
7
Hour
Design Energy Scale
44
U1
1
10
1
number
Device Name
45
S11
x
x
bq27741G1
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
23
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
Table 7. Data Flash Summary—Configuration Class (continued)
SUBCLASS
ID
SUBCLASS
49
Discharge
56
57
59
60
64
66
68
24
NAME
OFFSET
DATA
TYPE
VALUE
UNIT
MIN
MAX
DEFAULT
SOC1 Set Threshold
0
U2
0
65535
150
mAh
SOC1 Clear Threshold
2
U2
0
65535
175
mAh
SOCF Set Threshold
4
U2
0
65535
75
mAh
SOCF Clear Threshold
6
U2
0
65535
100
mAh
BL Set Volt Threshold
9
I2
0
16800
2500
mV
BL Set Volt Time
11
U1
0
60
2
s
BL Clear Volt Threshold
12
I2
0
16800
2600
mV
BH Set Volt Threshold
14
I2
0
16800
4500
mV
BH Volt Time
16
U1
0
60
2
s
BH Clear Volt Threshold
17
I2
0
16800
4400
mV
0
H2
0x0000
0xFFFF
0x0000
hex
2
H2
0x0000
0xFFFF
0x0000
hex
Firmware Version
4
H2
0x0000
0xFFFF
0x0000
hex
Hardware Revision
6
H2
0x0000
0xFFFF
0x0000
hex
Cell Revision
8
H2
0x0000
0xFFFF
0x0000
hex
DFl Config Version
10
H2
0x0000
0xFFFF
0x0000
hex
Manufacturer Pack Lot Code
Data
PCB Lot Code
Integrity Data All DF Checksum
6
H2
0x0000
0x7FFF
0x0000
hex
Static Chem DF Checksum
8
H2
0x0000
0x7FFF
0x0000
hex
Static DF Checksum
10
H2
0x0000
0x7FFF
0x0000
hex
Lifetime Data Lifetime Max Temp
0
I2
0
1400
0
0.1°C
Lifetime Min Temp
2
I2
–600
1400
500
0.1°C
Lifetime Max Pack Voltage
4
I2
0
32767
2800
mV
Lifetime Min Pack Voltage
6
I2
0
32767
4200
mV
Lifetime Max Chg Current
8
I2
–32767
32767
0
mA
Lifetime Max Dsg Current
10
I2
–32767
32767
0
mA
Lifetime
Temp
Samples
LT Flash Cnt
0
I2
0
32767
0
Count
LT AFE Status
2
H1
0x00
0xFF
0x00
hex
Registers
Pack Configuration
0
H2
0x0000
0xFFFF
0x1171
flags
Pack Configuration B
2
H1
0x00
0xFF
0xA7
flags
Pack Configuration C
3
H1
0x00
0xFF
0x1C
flags
LT Temp Res
0
U1
0
255
10
°C
LT V Res
1
U1
0
255
25
mV
LT Cur Res
2
U1
0
255
100
mA
LT Update Time
3
U2
0
65535
60
s
Flash Update OK Voltage
0
I2
0
4200
2800
mV
Sleep Current
2
I2
0
100
10
mA
Shutdown V
11
I2
0
2600
0
mV
FS Wait
13
U1
0
255
0
s
Lifetime
Resolution
Power
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
Table 8. Data Flash Summary—System Data Class
SUBCLASS
ID
58
SUBCLASS
NAME
OFFSET
DATA
TYPE
VALUE
UNIT
MIN
MAX
DEFAULT
Manufacturer Block A [0 through 31]
Info
0 through
31
H1
0x00
0xFF
0x00
hex
Block B [0 through 31]
32 through
63
H1
0x00
0xFF
0x00
hex
Table 9. Data Flash Summary—Gas Gauging Class
SUBCLASS SUBCLASS
ID
80
81
IT Cfg
Current
Thresholds
NAME
OFFSET
Load Select
DATA
TYPE
VALUE
UNIT
MIN
MAX
DEFAULT
1
number
0
U1
0
255
Load Mode
1
U1
0
255
0
number
Max Res Factor
21
U1
0
255
15
number
Min Res Factor
22
U1
0
255
5
number
Ra Filter
25
U2
0
1000
800
number
Fast Qmax Start DOD %
42
U1
0%
255%
92%
Fast Qmax End DOD %
43
U1
0%
255%
96%
Fast Qmax Start Volt Delta
44
I2
0
4200
200
Fast Qmax Current Threshold
46
I2
0
1000
4
C/rate
Qmax Capacity Err
64
U1
0
100
15
0.10%
Max Qmax Change
65
U1
0%
255%
30%
Terminate Voltage
67
I2
2800
3700
3000
mV
Term V Delta
69
I2
0
4200
200
mV
ResRelax Time
72
U2
0
65534
500
s
User Rate-Pwr
78
I2
3000
14000
0
cW
Reserve Cap-mAh
80
I2
0
9000
0
mAh
Reserve Energy
82
I2
0
14000
0
cWh
Max DeltaV
87
U2
0
65535
200
mV
Min DeltaV
89
U2
0
65535
0
mV
Max Sim Rate
91
U1
0
255
1
C/rate
Min Sim Rate
92
U1
0
255
20
C/rate
Ra Max Delta
93
U2
0
65535
43
mΩ
Qmax Max Delta %
95
U1
0%
100%
5%
Qmax Bound %
96
U1
0%
255%
130%
DeltaV Max Delta
97
U2
0
65535
10
mV
Max Res Scale
99
U2
0
32767
5000
number
Min Res Scale
101
U2
0
32767
200
number
Fast Scale Start SOC
103
U1
0%
100%
10%
Charge Hys V Shift
104
I2
0
2000
40
mV
Dsg Detection Threshold
0
I2
0
2000
60
mA
Chg Detection Threshold
2
I2
0
2000
75
mA
Quit Current
4
I2
0
1000
40
mA
Dsg Relax Time
6
U2
0
8191
60
s
Chg Relax Time
8
U1
0
255
60
s
Quit Relax Time
9
U1
0
63
1
s
Max IR Correct
10
U2
0
1000
400
mV
mV
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
25
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
Table 9. Data Flash Summary—Gas Gauging Class (continued)
SUBCLASS SUBCLASS
ID
82
State
NAME
OFFSET
DATA
TYPE
VALUE
UNIT
MIN
MAX
DEFAULT
Qmax Cell 0
0
I2
0
32767
1000
mAh
Update Status
2
H1
0x0
0x6
0x0
hex
V at Chg Term
3
I2
0
5000
4200
mV
Avg I Last Run
5
I2
–32768
32767
–299
mA
Avg P Last Run
7
I2
–32768
32767
–1131
Power
(mA)
Delta Voltage
9
I2
–32768
32767
2
mV
T Rise
13
I2
0
32767
20
number
T Time Constant
15
I2
0
32767
1000
number
Table 10. Data Flash Summary—OCV Table Class
SUBCLASS SUBCLASS
ID
83
NAME
OCVa Table Chem ID
OFFSET
DATA
TYPE
0
H2
VALUE
UNIT
MIN
MAX
DEFAULT
0x0000
0xFFFF
0x128
flags
Table 11. Data Flash Summary—Ra Table Class
SUBCLASS SUBCLASS
ID
88
26
R_a0
NAME
OFFSET
DATA
TYPE
MIN
MAX
DEFAULT
Cell0 R_a flag
0
H2
0x0000
0x0000
0xFF55
hex
Cell0 R_a 0
2
I2
183
183
407
2–10 Ω
Cell0 R_a 1
4
I2
181
181
407
2–10 Ω
Cell0 R_a 2
6
I2
198
198
396
2–10 Ω
Cell0 R_a 3
8
I2
244
244
429
2–10 Ω
Cell0 R_a 4
10
I2
254
254
287
2–10 Ω
Cell0 R_a 5
12
I2
261
261
236
2–10 Ω
Cell0 R_a 6
14
I2
333
333
249
2–10 Ω
Cell0 R_a 7
16
I2
338
338
252
2–10 Ω
Cell0 R_a 8
18
I2
345
345
211
2–10 Ω
Cell0 R_a 9
20
I2
350
350
189
2–10 Ω
Cell0 R_a 10
22
I2
382
382
238
2–10 Ω
Cell0 R_a 11
24
I2
429
429
281
2–10 Ω
Cell0 R_a 12
26
I2
502
502
560
2–10 Ω
Cell0 R_a 13
28
I2
545
545
1475
2–10 Ω
Cell0 R_a 14
30
I2
366
366
2350
2–10 Ω
Submit Documentation Feedback
VALUE
UNIT
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
Table 11. Data Flash Summary—Ra Table Class (continued)
SUBCLASS SUBCLASS
ID
89
R_a0x
NAME
OFFSET
DATA
TYPE
VALUE
UNIT
MIN
MAX
DEFAULT
xCell0 R_a flag
0
H2
0xFFFF
0xFFFF
0xFFFF
hex
xCell0 R_a 0
2
I2
183
183
407
2–10 Ω
xCell0 R_a 1
4
I2
181
181
407
2–10 Ω
xCell0 R_a 2
6
I2
198
198
396
2–10 Ω
xCell0 R_a 3
8
I2
244
244
429
2–10 Ω
xCell0 R_a 4
10
I2
254
254
287
2–10 Ω
xCell0 R_a 5
12
I2
261
261
236
2–10 Ω
xCell0 R_a 6
14
I2
333
333
249
2–10 Ω
xCell0 R_a 7
16
I2
338
338
252
2–10 Ω
xCell0 R_a 8
18
I2
345
345
211
2–10 Ω
xCell0 R_a 9
20
I2
350
350
189
2–10 Ω
xCell0 R_a 10
22
I2
382
382
238
2–10 Ω
xCell0 R_a 11
24
I2
429
429
281
2–10 Ω
xCell0 R_a 12
26
I2
502
502
560
2–10 Ω
xCell0 R_a 13
28
I2
545
545
1475
2–10 Ω
xCell0 R_a 14
30
I2
366
366
2350
2–10 Ω
Table 12. Data Flash Summary—Calibration
SUBCLASS SUBCLASS
ID
104
107
Data
Current
NAME
OFFSET
DATA
TYPE
VALUE
MIN
MAX
UNIT
DEFAULT
CC Gain
0
F4
0.100
40.00
0.9536
mΩ
CC Delta
4
F4
29800
1190000
1119000
mΩ
CC Offset
8
I2
–32768
32767
–1500
mA
Board Offset
10
I1
–128
127
0
µA
Int Temp Offset
11
I1
–128
127
0
°C
Ext Temp Offset
12
I1
–128
127
0
°C
Pack V Offset
13
I1
–128
127
0
mV
ADC I Offset
14
I1
–128
127
0
mA
Filter
0
U1
0
255
239
number
Deadband
1
U1
0
255
5
mA
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
27
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
Table 13. Data Flash Summary—Security
SUBCLASS SUBCLASS
ID
112
Codes
NAME
OFFSET
DATA
TYPE
VALUE
MIN
MAX
UNIT
DEFAULT
Sealed to Unsealed
0
H4
0x0000 0000
0xFFFF FFFF
0x3672 0414
hex
Unsealed to Full
4
H4
0x0000 0000
0xFFFF FFFF
0xFFFF FFFF
hex
Authen Key3
8
H4
0x0000 0000
0xFFFF FFFF
0x0123 4567
hex
Authen Key2
12
H4
0x0000 0000
0xFFFF FFFF
0x89AB CDEF
hex
Authen Key1
16
H4
0x0000 0000
0xFFFF FFFF
0xFEDC BA98
hex
Authen Key0
20
H4
0x0000 0000
0xFFFF FFFF
0x7654 3210
hex
Table 14. Data Flash to EVSW Conversion
Class
SubClass
ID
SubClass
Offset
Gas Gauging
80
IT Cfg
Calibration
104
Data
EVSW
Unit
Data Flash
to EVSW
Conversion
0
mW/cW
DF × 10
0
mWh/cW
DF × 10
number
10.124
mΩ
4.768/DF
number
10.147
mΩ
5677445/DF
–1200
number
–0.576
mV
DF × 0.0048
0
number
0
µV
DF × 0.0075
Name
Data
Type
Data Flash
Default
Data Flash
Unit
EVSW
Default
78
User Rate-Pwr
I2
82
Reserve Energy
I2
0
cW/10W
0
cWh/10cWh
0
CC Gain
4
CC Delta
F4
0.47095
F4
5.595e5
8
10
CC Offset
I2
Board Offset
I1
Table 15. ORDERING INFORMATION
PRODUCTION
PART NO. (1)
bq27741YZFR-G1
bq27741YZFT-G1
(1)
(2)
28
FIRMWARE
VERSION
PACKAGE (2)
TA
COMMUNICATION
FORMAT
1.08
CSP-15
–40°C to 85°C
I2C, HDQ (1)
TAPE and REEL
QUANTITY
3000
250
bq27741-G1 is shipped in the I2C mode.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
APPLICATION INFORMATION
Reference Schematics
0.1 µF
0.1 µF
C10
1
G1
3
S1
6
S2A
S1A 5
G2
4
S2
200
200
R12
2
Q1
UPA2375T1P
R2 5 mΩ
R11
C9
C5
C7
R16
0.1 µF
10
0.1 µF
C6
C1
R1
10
0.1 µF
C1 VPWR
C2
E1
E2
C3
Ext Therm
TB1
CELL+
1
2
CELL–
R5
1k
U1
bq27741–G1
C2
1 µF
R3
1k
0.1 µF
0.1 µF
C4
RT1
.47 µF
10 k
B2
D3
D1
BAT[RC3]
REG25
TS
RA0
RC2
VSS
SRN
R13
B1
2k
A1
C8
PACKP B3
A2
CHG
A3
DSG
C3
SDA
0.1 µF
SRP
SCL
E3
HDQ D2
3
C11
R4
R8
100
100
0.1 µF
4
PACK+
3
I2C_SDA
2
R7
R10
100
100
I2C_CLK
1
PACK–
TB2
D2
C12
0.1 µF
Figure 5. I2C Mode
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
29
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
0.1 µF
0.1 µF
C10
1
S1
S2A
S1A 5
6
S2
200
200
R12
2
Q1
UPA2375T1P
R2 5 mΩ
R11
C9
C5
C7
10
U1
bq27741–G1
C2
0.1 µF
C3
Ext Therm
1 µF
TB1
CELL+
1
2
CELL–
R5
1k
R3
1k
0.1 µF
0.1 µF
G1
C1
R1
3
0.1 µF
C6
G2
0.1 µF
10
4
R16
C4
RT1
.47 µF
10 k
3
C1 VPWR
C2
BAT[RC3]
E1
REG25
E2
TS
B2
RA0
D3
RC2
D1
VSS
SRN
R13
B1
2k
A1
C8
PACKP B3
A2
CHG
A3
DSG
C3
SDA
0.1 µF
SRP
SCL
E3
C11
0.1 µF
PACK+/Load+
2
R7
C12
100
4.7 k
100
HDQ
1
R10
HDQ D2
R17
3
PACK–/Load–
TB3
0.1 µF
D1
1.8 V pullup. HDQ requires pack-side pullup.
Figure 6. HDQ Mode
SPACER
30
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
MECHANICAL DATA
SPACER
Package Information
YZF (R–XBGA–N15)
DIE–SIZE BALL GRID ARRAY
1,00
1.99
1.93
A
B
0,50
E
D
2.81
2.75
2,00
C
B
A
0,50
PIN A1
INDEX AREA
E
15X Ø
0,35
0,25
Ø 0,015
M
C A B
0,35
0,15
C
0,625 MAX
SEATING PLANE
Ç
0,05 C
NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M–1994.
B. This drawing is subject to change without notice.
TM
C. NanoFree package
configuration.
Figure 7. Mechanical Package
Package Dimensions
The dimensions for the YZF package are shown in Table 16.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
31
bq27741-G1
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
Table 16. YZF Package Dimension
PACKAGED DEVICES
D
E
BQ27741YZFR-G1
2.776 ± 0.030 mm
1.956 ± 0.030 mm
Related Documentation from Texas Instruments
To obtain a copy of any of the following TI documents, call the Texas Instruments Literature Response Center at
(800) 477-8924 or the Product Information Center (PIC) at (972) 644-5580. When ordering, identify this
document by its title and literature number. Updated documents also can be obtained through the TI Web site at
www.ti.com.
1. bq27741-G1, Pack-Side Impedance Track™ Battery Fuel Gauge With Integrated Protector and LDO User's
Guide (SLUUAA3)
2. bq27741EVM Single Cell Impedance Track™ Technology Evaluation Module User's Guide (SLUUAH1)
Spacer
REVISION HISTORY
Changes from Original (July 2013) to Revision A
•
32
Page
Changed the FIRMWARE VERSION From 1.07 To 1.08 in Table 15 ............................................................................... 28
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
bq27741-G1
www.ti.com
SLUSBF2A – JULY 2013 – REVISED SEPTEMBER 2013
GLOSSARY
ACK
Acknowledge character
ADC
Analog-to-digital converter
BCA
Board calibration
CC
Coulomb counter
CCA
Coulomb counter calibration
CE
Chip enable
cWh
Centiwatt-hour
DF
Data flash
DOD
Depth of discharge in percent as related to Qmax. 100% corresponds to empty battery.
DOD0
Depth of discharge that was looked up in the DOD (OCV) table based on OCV measurement in relaxed state.
EOC
End of charge
FC
Fully charged
FCC
Full charge capacity. Total capacity of the battery compensated for present load current, temperature, and aging effects
(reduction in chemical capacity and increase in internal impedance).
FIFO
First in, first out
FVCA
Fast voltage and current acquisition
GPIO
General-purpose input output
HDQ
High-speed data queue
IC
Integrated circuit
ID
Identification
IO
Input or output
IT
Impedance Track™
I2C
Inter-integrated circuit
LDO
Low dropout
LSB
Least significant bit
LT
Lifetime
MAC
Manufacturer access command or control command
mAh
Milliamp-hour
MSB
Most significant bit
mWh
Milliwatt-hour
NACK
Negative acknowledge character
NTC
Negative temperature coefficient
OCV
Open-circuit voltage. Voltage measured on fully-relaxed battery with no load applied.
OTC
Overtemperature in charge
OTD
Overtemperature in discharge
Qmax
Maximum chemical capacity
RM
Remaining capacity
RW
Read or write
SCL
Serial clock: programmable serial clock used in the I2C interface
SDA
Serial data: serial data bus in the I2C interface
SE
Shutdown enable
SOC
State-of-charge in percent related to FCC
SOC1
State-of-charge initial
SOCF
State-of-charge final
TCA
TS
Terminate charge alarm
Temperature status
TTE
Time-to-empty
TTF
Time-to-full
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: bq27741-G1
33
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
BQ27741YZFR-G1
ACTIVE
DSBGA
YZF
15
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27741-G1
BQ27741YZFT-G1
ACTIVE
DSBGA
YZF
15
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27741-G1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
BQ27741YZFR-G1
Package Package Pins
Type Drawing
SPQ
DSBGA
3000
YZF
15
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
180.0
8.4
Pack Materials-Page 1
2.06
B0
(mm)
K0
(mm)
P1
(mm)
2.88
0.69
4.0
W
Pin1
(mm) Quadrant
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ27741YZFR-G1
DSBGA
YZF
15
3000
182.0
182.0
17.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated