BSI Ultra Low Power/Voltage CMOS SRAM 1M X 16 bit BS616UV1610 FEATURES DESCRIPTION • Ultra low operation voltage : 1.8 ~ 2.3V • Ultra low power consumption : Vcc = 2.0V C-grade: 25mA (Max.) operating current I-grade : 30mA (Max.) operating current 1.2uA (Typ.) CMOS standby current • High speed access time : -70 70ns (Max.) at Vcc=2V -10 100ns (Max.) at Vcc=2V • Automatic power down when chip is deselected • Three state outputs and TTL compatible • Fully static operation • Data retention supply voltage as low as 1.5V • Easy expansion with CE2,CE1 and OE options • I/O Configuration x8/x16 selectable by LB and UB pin The BS616UV1610 is a high performance, ultra low power CMOS Static Random Access Memory organized as 1,048,576 words by 16 bits and operates from a wide range of 1.8V to 2.3V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with a typical CMOS standby current of 1.2uA and maximum access time of 70/100ns in 2V operation. Easy memory expansion is provided by an active LOW chip enable(CE1), active HIGH chip enable (CE2), active LOW output enable(OE) and three-state output drivers. The BS616UV1610 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BS616UV1610 is available in 48-pin BGA package. PRODUCT FAMILY SPEED PRODUCT FAMILY OPERATING TEMPERATURE Vcc RANGE BS616UV1610BC O O +0 C to +70 C 1.8 ~ 2.3V BS616UV1610FC BS616UV1610BI O O - 40 C to +85 C 1.8 ~ 2.3V BS616UV1610FI PIN CONFIGURATIONS A (ns) POWER DISSIPATION STANDBY Operating (I CCSB1 , Max) (I CC , Max) Vcc=2V Vcc=2V Vcc=2V 70 / 100 30uA 25mA 70 / 100 40uA 30mA 2 3 4 5 6 A4 A3 A2 LB OE A0 A1 A2 CE2 A1 Address A0 A17 Input B D8 UB A3 A4 CE1 D0 C D9 D10 A5 A6 D1 D2 D VSS D11 A17 A7 D3 VCC E VCC D12 VSS A16 D4 VSS A16 A15 A14 A13 A12 Buffer D6 A13 WE D7 A10 A11 A19 . D13 A14 A15 G D15 NC . A12 H A18 A8 A9 48 - 0810 48 - 0912 48 - 0810 48 - 0912 22 2048 Row Memory Array Decoder 2048 x 8192 8192 16 D0 . . . . . . . . Data Input Buffer 16 Column I/O Write Driver Sense Amp 16 Data Output Buffer D15 D5 D14 BGA BGA BGA BGA - BLOCK DIAGRAM 1 F PKG TYPE 512 16 Column Decoder CE2 CE1 WE OE UB LB 18 Control Address Input Buffer A11A10 A9 A8 A7 A6 A5 A18 A19 Vcc Gnd 48-Ball CSP top View Brilliance Semiconductor Inc. reserves the right to modify document contents without notice. R0201-BS616UV1610 1 Revision 2.2 April 2001 BSI BS616UV1610 PIN DESCRIPTIONS Name Function A0-A19 Address Input These 20 address inputs select one of the 1,048,576 x 16-bit words in the RAM. CE1 Chip Enable 1 Input CE2 Chip Enable 2 Input CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active when data read from or write to the device. If either chip enable is not active, the device is deselected and is in a standby power mode. The DQ pins will be in the high impedance state when the device is deselected. WE Write Enable Input The write enable input is active LOW and controls read and write operations. With the chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location. OE Output Enable Input The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impedance state when OE is inactive. LB and UB Data Byte Control Input Lower byte and upper byte data input/output control pins. D0 - D15 Data Input/Output Ports These 16 bi-directional ports are used to read data from or write data into the RAM. Vcc Power Supply Gnd Ground TRUTH TABLE MODE Not selected (Power Down) Output Disabled Read CE1 H CE2 WE OE LB UB D0~D7 D8~D15 X X X X X High Z High Z ICCSB , I CCSB1 X L X X X X High Z High Z ICCSB , I CCSB1 L H H H X X High Z High Z ICC L L Dout Dout ICC H L High Z Dout ICC L H Dout High Z ICC L Write L H H H L L X L L Din Din ICC H L X Din ICC L H Din X ICC OPERATING RANGE ABSOLUTE MAXIMUM RATINGS(1) SYMBOL PARAMETER with Vcc CURRENT RATING UNITS -0.5 to Vcc+0.5 V VTERM Terminal Voltage Respect to GND TBIAS Temperature Under Bias -40 to +125 O TSTG Storage Temperature -60 to +150 O PT Power Dissipation 1.0 W IOUT DC Output Current 20 mA C RANGE AMBIENT TEMPERATURE Vcc Commercial 0 O C to +70O C 1.8V ~ 2.3V Industrial O O -40 C to +85 C 1.8V ~ 2.3V C CAPACITANCE (1) (TA = 25oC, f = 1.0 MHz) SYMBOL PARAMETER CONDITIONS MAX. Input CIN VIN=0V 10 1. Stresses greater than those listed under ABSOLUTE MAXIMUM Capacitance RATINGS may cause permanent damage to the device. This is a Input/Output CDQ VI/O=0V 12 stress rating only and functional operation of the device at these Capacitance or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute 1. This parameter is guaranteed and not tested. maximum rating conditions for extended periods may affect reliability. R0201-BS616UV1610 2 UNIT pF pF Revision 2.2 April 2001 BSI BS616UV1610 DC ELECTRICAL CHARACTERISTICS ( TA = 0 to + 70oC ) PARAMETER NAME PARAMETER TEST CONDITIONS Guaranteed Input Low Voltage(2) Guaranteed Input High Voltage(2) VIL VIH MIN. TYP. (1) MAX. UNITS Vcc=2V -0.5 -- 0.6 V Vcc=2V 1.4 -- Vcc+0.2 V IIL Input Leakage Current Vcc = Max, VIN = 0V to Vcc -- -- 1 uA IOL Output Leakage Current Vcc = Max, CE1 = VIH , or CE2 = ViL, or OE = VIH, VI/O = 0V to Vcc -- -- 1 uA VOL Output Low Voltage Vcc = Max, IOL = 1mA Vcc=2V -- -- 0.4 V VOH Output High Voltage Vcc = Min, IOH = -0.5mA Vcc=2V 1.6 -- -- V ICC Operating Power Supply Current Vcc= max, CE1 = VIL and CE2 = VIH, IDQ = 0mA, F = Fmax(3) Vcc=2V -- -- 25 mA ICCSB Standby Current-TTL Vcc= max, CE1 = VIH or CE2 = VIL, IDQ = 0mA Vcc=2V -- -- 0.8 mA ICCSB1 Standby Current-CMOS Vcc= max,CE1 Њ Vcc-0.2V, or CE2 Љ 0.2V, V IN Њ Vcc - 0.2V or VIN Љ 0.2V Vcc=2V -- 1.2 30 uA 1. Typical characteristics are at TA = 25oC. 2. These are absolute values with respect to device ground and all overshoots due to system or tester notice are included. 3. Fmax = 1/tRC . DATA RETENTION CHARACTERISTICS ( TA = 0 to + 70oC ) SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. (1) MAX. UNITS VDR Vcc for Data Retention CE1 Њ Vcc - 0.2V or CE2Љ0.2V VIN Њ Vcc - 0.2V or VIN Љ 0.2V 1.5 -- -- V ICCDR Data Retention Current CE1 Њ Vcc - 0.2V or CE2Љ0.2V VIN Њ Vcc - 0.2V or VIN Љ 0.2V -- 0.8 15 uA tCDR Chip Deselect to Data Retention Time 0 -- -- ns TRC (2) -- -- ns tR See Retention Waveform Operation Recovery Time 1. Vcc = 1.5V, TA = + 25 C 2. tRC = Read Cycle Time O LOW VCC DATA RETENTION WAVEFORM (1) ( CE1 Controlled ) Data Retention Mode Vcc VDR ≥ 1.5V Vcc CE1 Vcc tR t CDR CE1≥ Vcc - 0.2V VIH VIH LOW VCC DATA RETENTION WAVEFORM (2) ( CE2 Controlled ) Data Retention Mode Vcc VDR Њ 1.5V Vcc CE2 R0201-BS616UV1610 VIL Vcc tR t CDR CE2 Љ 0.2V 3 VIL Revision 2.2 April 2001 BSI BS616UV1610 KEY TO SWITCHING WAVEFORMS AC TEST CONDITIONS Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Vcc/0V 5ns WAVEFORM 0.5Vcc AC TEST LOADS AND WAVEFORMS 1333 Ω 2V 1333 Ω 2V OUTPUT OUTPUT 5PF INCLUDING JIG AND SCOPE 2000 Ω 2000 Ω FIGURE 1A FIGURE 1B THEVENIN EQUIVALENT 800 Ω OUTPUT OUTPUTS MUST BE STEADY MUST BE STEADY MAY CHANGE FROM H TO L WILL BE CHANGE FROM H TO L MAY CHANGE FROM L TO H WILL BE CHANGE FROM L TO H , 100PF INCLUDING JIG AND SCOPE INPUTS DON T CARE: ANY CHANGE PERMITTED CHANGE : STATE UNKNOWN DOES NOT APPLY CENTER LINE IS HIGH IMPEDANCE ”OFF ”STATE 1.2V ALL INPUT PULSES Vcc GND 90% 90% 10% → ← → 10% ← 5ns FIGURE 2 AC ELECTRICAL CHARACTERISTICS ( TA = 0 to + 70oC, Vcc=2V) READ CYCLE JEDEC PARAMETER NAME PARAMETER NAME DESCRIPTION BS616UV1610-70 MIN. TYP. MAX. BS616UV1610-100 MIN. TYP. MAX. UNIT tAVAX tRC Read Cycle Time 70 -- -- 100 -- -- ns tAVQV tAA Address Access Time -- -- 70 -- -- 100 ns tELQV tACS1 Chip Select Access Time (CE1) -- -- 70 -- -- 100 ns tELQV tACS2 Chip Select Access Time (CE2) -- -- 70 -- -- 100 ns tBA tBA Data Byte Control Access Time (LB,UB) -- -- 50 -- -- 60 ns tGLQV tOE Output Enable to Output Valid -- -- 50 -- -- 60 ns tELQX tCLZ Chip Select to Output Low Z (CE2,CE1) 10 -- -- 15 -- -- ns tBE tBE Data Byte Control to Output Low Z (LB,UB) 10 -- -- 15 -- -- ns tGLQX tOLZ Output Enable to Output in Low Z 10 -- -- 15 -- -- ns tEHQZ tCHZ Chip Deselect to Output in High Z (CE2,CE1) 0 -- 35 0 -- 40 ns tBDO tBDO Data Byte Control to Output High Z (LB,UB) 0 -- 30 0 -- 35 ns tGHQZ tOHZ Output Disable to Output in High Z 0 -- 30 0 -- 35 ns tAXOX tOH Output Disable to Address Change 10 -- -- 15 -- -- ns R0201-BS616UV1610 4 Revision 2.2 April 2001 BSI BS616UV1610 SWITCHING WAVEFORMS (READ CYCLE) READ CYCLE1 (1,2,4) t RC ADDRESS t t t OH AA OH D OUT READ CYCLE2 (1,3,4) CE2 t ACS2 t ACS1 CE1 t t CHZ(5) (5) CLZ D OUT READ CYCLE3 (1,4) t RC ADDRESS t AA OE t CE2 t t CE1 t t t OE OH ACS2 OLZ t ACS1 (5) CLZ OHZ (5) (1,5) t CHZ t BDO LB,UB t BE t BA D OUT NOTES: 1. WE is high in read Cycle. 2. Device is continuously selected when CE1 = VIL and CE2 = VIH. 3. Address valid prior to or coincident with CE transition low. 4. OE = VIL . 5. Transition is measured ± 500mV from steady state with CL = 5pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested. R0201-BS616UV1610 5 Revision 2.2 April 2001 BSI BS616UV1610 AC ELECTRICAL CHARACTERISTICS ( TA = 0 to + 70oC, Vcc=2V) WRITE CYCLE JEDEC PARAMETER PARAMETER NAME NAME BS616UV1610-70 MIN. TYP. MAX. DESCRIPTION tAVAX tWC Write Cycle Time 70 t E1LWH tCW Chip Select to End of Write tAVWL tAS Address Setup Time tAVWH tAW tWLWH BS616UV1610-10 MIN. TYP. MAX. -- -- 100 70 -- -- 100 -- -- ns 0 -- -- 0 -- -- ns Address Valid to End of Write 70 -- -- 100 -- -- ns tWP Write Pulse Width 50 -- -- 70 -- -- ns tWHAX t WR1 Write recovery Time 0 -- -- 0 -- -- ns tBW tBW Date Byte Control to End of Write (LB,UB) 60 -- -- 80 -- -- ns tWLQZ tWHZ Write to Output in High Z 0 -- 30 0 -- 40 ns tDVWH tDW Data to Write Time Overlap 30 -- -- 40 -- -- ns tWHDX tDH Data Hold from Write Time 0 -- -- 0 -- -- ns tGHQZ tOHZ Output Disable to Output in High Z 0 -- 30 0 -- 40 ns tWHOX tOW End of Write to Output Active 5 -- -- 10 -- -- ns (CE2,CE1,WE) -- -- UNIT ns SWITCHING WAVEFORMS (WRITE CYCLE) WRITE CYCLE1 (1) t WC ADDRESS (3) t WR OE CE2 (5) (11) t CW (5) CE1 t BW (5) LB,UB t AW WE (3) t WP t AS (2) (4,10) t OHZ D OUT t DH t DW D IN R0201-BS616UV1610 6 Revision 2.2 April 2001 BSI BS616UV1610 WRITE CYCLE2 (1,6) t WC ADDRESS CE2 (11) t (5) CE1 t BW (5) LB,UB t WE CW AW t WR t WP (3) (2) t t AS DH (4,10) t WHZ D OUT (7) (8) t DW t DH (8,9) D IN NOTES: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE2, CE1 and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. TWR is measured from the earlier of CE2 going low, or CE1 or WE going high at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE2 high transition or CE1 low transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL ). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE2 is high or CE1 is low during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. Transition is measured ± 500mV from steady state with CL = 5pF as shown in Figure 1B. The parameter is guaranteed but not 100% tested. 11. TCW is measured from the later of CE2 going high or CE1 going low to the end of write. R0201-BS616UV1610 7 Revision 2.2 April 2001 BSI BS616UV1610 ORDERING INFORMATION BS616UV1610 X X -- Y Y SPEED 70: 70ns 10: 100ns GRADE C: +0oC ~ +70oC I: -40oC ~ +85oC PACKAGE B :BGA - 48 PIN(8x10mm) F :BGA - 48 PIN(9x12mm) 1.4 Max. 0.25 ̈́ 0.05 PACKAGE DIMENSIONS NOTES: 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS. SIDE VIEW D 0.1 D1 N D E D1 E1 e 48 10.0 8.0 5.25 3.75 0.75 0.35̈́ 0.05 E1 E ̈́ 0.1 e SOLDER BALL VIEW A 48 mini-BGA (8 x 10mm) R0201-BS616UV1610 8 Revision 2.2 April 2001 BSI BS616UV1610 1.4 Max. 0.25̈́ 0.05 PACKAGE DIMENSIONS (continued) NOTES: 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS. SIDE VIEW D 0.1 3.375 D1 N D E D1 E1 e 48 12.0 9.0 5.25 3.75 0.75 E1 2.625 E ̈́ 0.1 e SOLDER BALL 0.35̈́0.05 VIEW A 48 mini-BGA (9 x 12mm) R0201-BS616UV1610 9 Revision 2.2 April 2001 BSI BS616UV1610 REVISION HISTORY Revision Description Date 2.2 2001 Data Sheet release Apr. 15, 2001 R0201-BS616UV1610 10 Note Revision 2.2 April 2001