CYStech Electronics Corp. Spec. No. : C820FP Issued Date : 2005.03.29 Revised Date :2005.07.26 Page No. : 1/ 4 Low Vcesat NPN Epitaxial Planar Transistor BTD1805FP Description The device is manufactured in NPN planar technology by using a “Base Island” layout. The resulting transistor shows exceptional high gain performance coupled with very low saturation voltage. Features • Very low collector-to-emitter saturation voltage • Fast switching speed • High current gain characteristic • Large current capability • Pb-free package Applications • CCFL drivers • Voltage regulators • Relay drivers • High efficiency low voltage switching applications Symbol Outline BTD1805FP B：Base C：Collector E：Emitter BTD1805FP TO-220FP B C E CYStek Product Specification CYStech Electronics Corp. Spec. No. : C820FP Issued Date : 2005.03.29 Revised Date :2005.07.26 Page No. : 2/ 4 Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage (IE=0) Collector-Emitter Voltage (IB=0) Emitter-Base Voltage (IC=0) Collector Current (DC) Collector Current (Pulse) Base Current Power Dissipation @ TA=25℃ Power Dissipation @ TC=25℃ Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Case Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC ICP IB PD PD RθJA RθJC Tj Tstg Limits 150 60 7 5 10 (Note 1) 2 2 40 62.5 3.125 150 -55~+150 Unit V V V A A W °C/W °C/W °C °C Note : 1. Single Pulse , Pw≦380µs,Duty≦2%. Characteristics (Ta=25°C) Symbol BVCBO *BVCEO BVEBO ICBO IEBO *VCE(sat) 1 *VCE(sat) 2 *VCE(sat) 3 *VCE(sat) 4 *VBE(sat) *hFE 1 *hFE 2 *hFE 3 fT Cob ton tstg tf Min. 150 60 7 200 85 20 - Typ. 200 240 0.9 150 50 50 1.35 120 Max. 0.1 0.1 50 300 400 600 1.2 400 - Unit V V V µA µA mV mV mV mV V MHz pF ns µs ns Test Conditions IC=100µA, IE=0 IC=1mA, IB=0 IC=100µA, IC=0 VCB=80V, IE=0 VEB=4V, IC=0 IC=100mA, IB=5mA IC=2A, IB=50mA IC=3A, IB=150mA IC=5A, IB=200mA IC=2A, IB=100mA VCE=2V, IC=100mA VCE=2V, IC=5A VCE=2V, IC=10A VCE=10V, IC=50mA VCB=10V, f=1MHz VCC=30V, IC=10IB1=-10IB2=1A, RL=30Ω *Pulse Test : Pulse Width ≤380µs, Duty Cycle≤2% BTD1805FP CYStek Product Specification Spec. No. : C820FP Issued Date : 2005.03.29 Revised Date :2005.07.26 Page No. : 3/ 4 CYStech Electronics Corp. Characteristic Curves Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 Saturation Voltage---(mV) Current Gain---HFE 1000 VCE=2V VCE=1V VCESAT@IC=40IB 100 VCESAT@IC=20IB 100 10 1 10 100 1000 10000 1 10 1000 Collector Current---IC(mA) Collector Current---IC(mA) Saturation Voltage vs Collector Current On Voltage vs Collector Current 10000 1000 On Voltage---(mV) Saturation Voltage---(mV) 1000 VBESAT@IC=20IB VBEON@VCE=1V 100 100 1 10 100 1000 10000 1 Collector Current---IC(mA) 10 100 1000 10000 Collector Current---IC(mA) Power Derating Curve Power Derating Curve 45 Power Dissipation---PD(W) 2.5 Power Dissipation---PD(W) 100 2 1.5 1 0.5 40 35 30 25 20 15 10 5 0 0 0 50 100 150 Ambient Temperature---TA(℃) BTD1805FP 200 0 50 100 150 200 Case Temeprature---TC(℃) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C820FP Issued Date : 2005.03.29 Revised Date :2005.07.26 Page No. : 4/ 4 TO-220FP Dimension Marking: D1805 Style: Pin 1.Base 2.Collector 3.Emitter 4.Collector 3-Lead TO-220FP Plastic Package CYStek Package Code: FP *: Typical Inches Min. Max. 0.169 0.185 0.051 REF 0.110 0.126 0.098 0.114 0.020 0.030 0.043 0.053 0.069 0.059 0.020 0.030 DIM A A1 A2 A3 b b1 b2 c Millimeters Min. Max. 4.300 4.700 1.300 REF 2.800 3.200 2.500 2.900 0.500 0.750 1.100 1.350 1.750 1.500 0.500 0.750 DIM D E e F Φ L L1 L2 Inches Min. Max. 0.408 0.392 0.583 0.598 0.100 TYP 0.106 REF 0.138 REF 1.102 1.118 0.067 0.075 0.075 0.083 Millimeters Min. Max. 10.360 9.960 14.800 15.200 2.540 TYP 2.700 REF 3.500 REF 28.000 28.400 1.700 1.900 1.900 2.100 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTD1805FP CYStek Product Specification