C Series High Voltage Application Type: C4520 [EIA CC1808] C4532 [EIA CC1812] Issue date: January 2011 TDK MLCC US Catalog Version A11 REMINDERS Please read before using this product SAFETY REMINDERS REMINDERS 1. 2. 3. 4. 5. 6. 7. If you intend to use a product listed in this catalog for a purpose that may cause loss of life or other damage, you must contact our company’s sales window. We may modify products or discontinue production of a product listed in this catalog without prior notification. We provide “Delivery Specification” that explain precautions for the specifications and safety of each product listed in this catalog. We strongly recommend that you exchange these delivery specifications with customers that use one of these products. If you plan to export a product listed in this catalog, keep in mind that it may be a restricted item according to the “Foreign Exchange and Foreign Trade Control Law”. In such cases, it is necessary to acquire export permission in harmony with this law. Any reproduction or transferring of the contents of this catalog is prohibited without prior permission from our company. We are not responsible for problems that occur related to the intellectual property rights or other rights of our company or a third party when you use a product listed in this catalog. We do not grant license of these rights. This catalog only applies to products purchased through our company or one of our company’s official agencies. This catalog does not apply to products that are purchased through other third parties. C Series High Voltage Application Type: C4520, C4532 Features • Advanced design provides improved withstand voltage characteristics. • TDK’s proprietary internal electrode structure and the use of low-dielectric-strength material result in highly reliable performance in high-voltage applications. • Complies with ISO8802-3 for LAN applications. • Designed exclusively for reflow soldering. Applications Cautions • This product intended solely for reflow soldering. • A slit of about 1mm on the circuit board is recommended to improve removal of the flux after soldering. • Ensure that this product is completely dried following washing. • Because this product will be subjected to high voltages, use only low-activity rosin flux (with 0.2% max. of chlorine). • Using this product with aluminum circuit boards must be considered a special implementation because the high heat stress levels are involved. In case of using aluminum circuit boards, please contact TDK. Shape & Dimensions • • • • • • Inverter circuits with a liquid crystal backlight LAN card General high voltage circuits. Noise bypass for power supply Transceiver for LAN Hub, etc. L W T B Body Length Body Width Body Height Terminal Width Dimensions in mm Part Number Construction C 4532 X7R 3D 222 K T XXXX Series Name Internal Codes Dimensions L x W (mm) Packaging Style Case Code Length Width Packaging Code Style C4520 C4532 4.50 ± 0.40 4.50 ± 0.40 2.00 ± 0.30 3.20 ± 0.40 T Tape and Reel Temperature Characteristic Temperature Characteristics Capacitance Change Temperature Range C0G X7R 0±30 ppm/ºC ±15% -55 to +125ºC -55 to +125ºC Rated Voltage (DC) Voltage Code Voltage(DC) 3A 3D 3F 1,000V 2,000V 3,000V Capacitance Tolerance Tolerance Code Tolerance F K ± 1pF ± 10% Nominal Capacitance (pF) The capacitance is expressed in three digit codes and in units of pico Farads (pF). The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier. R designates a decimal point. Capacitance Code 0R5 010 102 105 Capacitance 0.5pF 1pF 1,000pF (1nF) 1,000,000pF (1μF) • All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 Capacitance Range Chart C4520 [EIA CC1808] Capacitance Range Chart Temperature Characteristics: C0G (0 ± 30ppm/ºC), X7R (± 15%) Rated Voltage: 3,000 (3F), 2,000V (3D), 1,000V (3A) Capacitance (pF) 10 12 15 18 22 27 33 39 47 56 68 82 100 470 1,000 Cap Code 100 120 150 180 220 270 330 390 470 560 680 820 101 471 102 Tolerance C0G 3F (3,000V) X7R 3D 3A (2,000V) (1,000V) F: ± 1pF K: ± 10% Standard Thickness 0.85 ± 0.15 mm 1.10 ± 0.20 mm 1.30 ± 0.20 mm 1.60 ± 0.20 mm 2.00 ± 0.20 mm Capacitance Range Table Class 1 (Temperature Compensating) Temperature Characteristics: C0G (0 ± 30 ppm/ºC) TDK Part Number Temperature Rated (Ordering Code) Characteristics Voltage C4520C0G3F100F C4520C0G3F120K C4520C0G3F150K C4520C0G3F180K C4520C0G3F220K C4520C0G3F270K C4520C0G3F330K C4520C0G3F390K C4520C0G3F470K C4520C0G3F560K C4520C0G3F680K C4520C0G3F820K C4520C0G3F101K C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G C0G Class 2 (Temperature Stable) Temperature Characteristics: X7R (± 15%) TDK Part Number Temperature (Ordering Code) Characteristics C4520X7R3A471K C4520X7R3A102K C4520X7R3D471K C4520X7R3D102K X7R X7R X7R X7R 3000V 3000V 3000V 3000V 3000V 3000V 3000V 3000V 3000V 3000V 3000V 3000V 3000V Rated Voltage 1000V 1000V 2000V 2000V Capacitance (pF) 10 12 15 18 22 27 33 39 47 56 68 82 100 Capacitance (pF) 470 1,000 470 1,000 • All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // High Voltage C4520 Series // Version A11 Capacitance Tolerance Thickness (mm) ± 1pF ± 10% ± 10% ± 10% ± 10% ± 10% ± 10% ± 10% ± 10% ± 10% ± 10% ± 10% ± 10% 0.85 ± 0.15 0.85 ± 0.15 1.10 ± 0.20 1.10 ± 0.20 1.10 ± 0.20 1.60 ± 0.20 1.60 ± 0.20 1.60 ± 0.20 1.60 ± 0.20 2.00 ± 0.20 2.00 ± 0.20 2.00 ± 0.20 2.00 ± 0.20 Capacitance Tolerance Thickness (mm) ± 10% ± 10% ± 10% ± 10% 1.30 ± 0.20 1.30 ± 0.20 1.30 ± 0.20 1.30 ± 0.20 Capacitance Range Chart C4532 [EIA CC1812] Capacitance Range Chart Temperature Characteristics: C0G (0 ± 30ppm/ºC), X7R (± 15%) Rated Voltage: 3,000 (3F), 2,000V (3D), 1,000V (3A) Capacitance (pF) 100 120 150 180 220 270 330 2,200 4,700 10,000 Cap Code 101 121 151 181 221 271 331 222 472 103 C0G 3F (3,000V) Tolerance X7R 3D 3A (2,000V) (1,000V) K: ± 10% Standard Thickness 1.30 ± 0.20 mm 1.60 ± 0.20 mm 2.00 ± 0.20 mm 2.30 ± 0.20 mm 2.50 ± 0.30 mm Capacitance Range Table Class 1 (Temperature Compensating) Temperature Characteristics: C0G (0 ± 30 ppm/ºC) TDK Part Number Temperature Rated (Ordering Code) Characteristics Voltage C4532C0G3F101K C4532C0G3F121K C4532C0G3F151K C4532C0G3F181K C4532C0G3F221K C4532C0G3F271K C4532C0G3F331K C0G C0G C0G C0G C0G C0G C0G Class 2 (Temperature Stable) Temperature Characteristics: X7R (± 15%) TDK Part Number Temperature (Ordering Code) Characteristics C4532X7R3A472K C4532X7R3A103K C4532X7R3D222K X7R X7R X7R 3000V 3000V 3000V 3000V 3000V 3000V 3000V Capacitance (pF) 100 120 150 180 220 270 330 Capacitance Tolerance Thickness (mm) ± 10% ± 10% ± 10% ± 10% ± 10% ± 10% ± 10% 1.60 ± 0.20 1.60 ± 0.20 1.60 ± 0.20 1.60 ± 0.20 2.00 ± 0.20 2.30 ± 0.20 2.50 ± 0.30 Rated Voltage Capacitance (pF) Capacitance Tolerance Thickness (mm) 1000V 1000V 2000V 4,700 10,000 2,200 ± 10% ± 10% ± 10% 1.60 ± 0.20 2.00 ± 0.20 1.30 ± 0.20 • All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // High Voltage C4532 Series // Version A11 General Specifications C Series — High Voltage Application No. Item Performance Test or Inspection Method 1 External Appearance No defects which may affect performance. Inspect with magnifying glass (3×). 2 Insulation Resistance 10,000MΩ min. Apply 500V DC for 60s. 3 Voltage Proof Withstand test voltage without insulation breakdown or other damage. 1.2 × rated voltage (DC) shall be applied for 1 to 5s. 4 5 Capacitance Q (Class 1) Charge / discharge current shall not exceed 50mA. Within the specified tolerance. Rated Capacitance Q 30pF and over 1,000 min. Under 30pF 400+20×C min. Class Measuring Frequency Class 1 1MHz±10% 0.5 - 5 Vrms Class 2 1kHz±10% 1.0±0.2Vrms Measuring Voltage See No.4 in this table for measuring condition. C : Rated capacitance (pF) 6 7 8 9 Dissipation Factor (Class 2) T.C. D.F. X7R 0.03 max. Temperature Characteristics of Capacitance (Class 1) T.C. Temperature Coefficient C0G 0 ± 30 (ppm/ºC) Temperature Characteristics of Capacitance (Class 2) Robustness of Terminations See No.4 in this table for measuring condition. Temperature coefficient shall be calculated based on values at 25ºC and 85ºC temperature. Capacitance drift within ± 0.2% or ± 0.05pF, whichever larger. Measuring temperature below 20ºC shall be -10ºC and -25ºC. Capacitance Change (%) Capacitance shall be measured by the steps shown in the following table after thermal equilibrium is obtained for each step. ∆C be calculated ref. STEP3 reading No Voltage Applied X7R: ± 15% No sign of termination coming off, breakage of ceramic, or other abnormal signs. Step Temperature (ºC) 1 Reference temp. ± 2 2 Min. operating temp. ± 2 3 Reference temp. ± 2 4 Max. operating temp. ± 2 Reflow solder the capacitors on P.C. board (shown in Appendix 1) and apply a pushing force of 5N with 10±1s. Pushing force Capacitor • All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 P.C. board General Specifications C Series — High Voltage Application No. Item Performance Test or Inspection Method 10 Solderability New solder to cover over 75% of termination. Completely soak both terminations in solder at 235±5ºC for 2±0.5s. 25% may have pin holes or rough spots but not concentrated in one spot. Solder: H63A (JIS Z 3282) Ceramic surface of “A sections” shall not be exposed due to melting or shifting of termination material. Flux: Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. A section 11 Vibration External appearance Capacitance Q (Class 1) No mechanical damage. Characteristics Change from the value before test Class 1 C0G ±2.5 % Class 2 X7R ± 7.5 % Completely soak both terminations in solder at 260±5ºC for 5±1s. Preheating condition Temp.: 150±10ºC Time: 1 to 2min. Flux: Isopropyl alcohol (JIS K 8839) Rosin (JIS K 5902) 25% solid solution. Q Solder: H63A (JIS Z 3282) 30pF and over 1,000 min. Under 30pF 400+20×C min. Leave the capacitor in ambient conditions for 6 to 24h (Class 1) or 24±2h (Class 2) before measurement. Rated Capacitance C : Rated capacitance (pF) D.F. (Class 2) 12 Meet the initial spec. Temperature cycle External appearance Capacitance Q (Class 1) No mechanical damage. Characteristics Change from the value before test Class 1 C0G ±2.5 % Class 2 X7R ± 7.5 % Reflow solder the capacitor on P.C. board (shown in Appendix 1) before testing. Expose the capacitor in the conditions step1 through step 4 and repeat 5 times consecutively. Leave the capacitor in ambient conditions for 6 to 24h (Class 1) or 24±2h (Class 2) before measurement. Rated Capacitance Q Step Temperature (ºC) Time (min.) 30pF and over 1,000 min. 1 Min. operating temp. ±3 30 ± 3 Under 30pF 400+20×C min. 2 Reference Temp. 2—5 3 Max. operating temp. ± 2 30 ± 2 4 Reference Temp. 2-5 C : Rated capacitance (pF) D.F. (Class 2) Meet the initial spec. Insulation Resistance Meet the initial spec. Voltage Proof No insulation breakdown or other damage. • All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 General Specifications C Series — High Voltage Application No. Item 13 Moisture Resistance (Steady State) External appearance Capacitance Q (Class 1) Performance Test or Inspection Method No mechanical damage. Reflow solder the capacitors on P.C. board (shown in Appendix 1) before testing. Leave at temperature 40±2ºC, 90 to 95%RH for 500 +24,0h. Characteristics Change from the value before test Class 1 C0G ±5 % Class 2 X7R ±12.5 % Rated Capacitance Q 30pF and over 350 min. 10pF and over to under 30pF 275+5/2×C min. Leave the capacitors in ambient conditions for 6 to 24h (Class 1) or 24±2h (Class 2) before measurement. C : Rated capacitance (pF) 14 D.F. (Class 2) Characteristics X7R: 200% of initial spec. max. Insulation Resistance 1,000MΩ min. Life External appearance Capacitance Q (Class 1) No mechanical damage. Reflow solder the capacitors on P.C. board (shown in Appendix 1) before testing. Apply rated voltage at maximum operating temperature ±2ºC for 1,000 +48, 0h. Characteristics Change from the value before test Class 1 C0G ±3 % Class 2 X7R ±15 % Rated Capacitance Q 30pF and over 350 min. 10pF and over to under 30pF 275+5/2×C min. C : Rated capacitance (pF) D.F. (Class 2) Characteristics X7R: 200% of initial spec. max. Insulation Resistance 1,000MΩ min. Charge/discharge current shall not exceed 50mA. Leave the capacitor in ambient conditions for 6 to 24h (Class1) or 24±2h (Class2) before measurement. Voltage conditioning: Voltage treat the capacitors under testing temperature and voltage for 1 hour. Leave the capacitors in ambient conditions for 24±2h before measurement. Use this measurement for initial value. *As for the initial measurement of capacitors (Class 2) on number 8, 11, 12 and 13, leave capacitors at 150 —10, 0°C for 1 hour and measure the value after leaving capacitor for 24±2h in ambient condition. • All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 General Specifications C Series — High Voltage Application Appendix - 1 P.C. Board for reliability test 40 mm 100 mm a b c Slit Copper Solder Resist Material : Glass Epoxy (As per JIS C6484 GE4) P.C. Board thickness : 1.6mm Copper (thickness 0.035mm) Solder resist Case Code JIS EIA Dimensions (mm) a b c C4520 CC1808 3.5 7.0 2.5 C4532 CC1812 3.5 7.0 3.7 • All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 Soldering Information C Series — High Voltage Application • Recommended Soldering Land Pattern • Recommended Soldering Profile Reflow Soldering D Chip capacitor Solder land Slit Preheating 300 Temp (ºC) B ∆T 0 • This product intended solely for reflow soldering. • A slit of about 1mm on the circuit board is recommended to improve removal of the flux after soldering. • Ensure that this product is completely dried following washing. • Because this product will be subjected to high voltages, use only low-activity rosin flux (with 0.2% max. of chlorine). • Using this product with aluminum circuit boards must be considered a special implementation because the high heat stress levels are involved. In case of using aluminum circuit boards, please contact TDK. Reflow Soldering Unit: mm Symbol C4520 [CC1808] C4532 [CC1812] A 3.1 — 3.7 3.1 — 3.7 B 1.2 — 1.4 1.2 — 1.4 Type Insufficient solder Preheating 0 Over 60 sec. Peak Temp time 3sec. (As short as possible) Recommended soldering duration Temp./ Dura. Reflow Soldering Peak temp (°C) Duration (sec.) Sn-Pb Solder 230 max. 20 max. Lead-Free Solder 260 max. 10 max. Solder Recommended solder compositions Sn-37Pb (Sn-Pb solder) Sn-3.0Ag-0.5Cu (Lead Free Solder) Preheating Condition Soldering Temp. (ºC) C 1.5 — 2.0 2.4 — 3.2 Reflow soldering ∆T ≤ 130 D 1.0 — 1.3 1.0 — 1.3 Manual soldering ∆T ≤ 130 • Recommended Solder Amount Adequate solder ∆T Solder resist A Excessive solder Temp (ºC) Peak Temp C Manual soldering (Solder iron) Soldering Natural cooling Higher tensile force on the chip capacitor may cause cracking. Maximum amount Minimum amount Small solder fillet may cause contact failure or failure to hold the chip capacitor to the P.C. board. • All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 Packaging Information C Series — High Voltage Application • Carrier Tape Configuration Bulk Chips Bulk 160mm min 160mm min. Leader Drawing direction 400mm min • Peel Back Force (Top Tape) Direction & angle of pull Top cover tape 0.05 — 0.7 N Carrier tape 0~15° • Carrier tape shall be flexible enough to be wound around a minimum radius of 30mm with components in tape. • The missing of components shall be less than 0.1% • Components shall not stick to the cover tape. • The cover tape shall not protrude beyond the edges of the carrier tape not shall cover the sprocket holes. • Chip Quantity Per Reel and Structure of Reel Plastic Carrier Tape & Reel Top cover tape Pitch hole Plastic carrier tape Case Code JIS C4520 C4532 EIA CC1808 CC1812 Chip Thickness 0.85 mm 1.10 mm 1.30 mm 1.60 mm 2.00 mm 1.30 mm 1.60 mm 2.00 mm 2.30 mm 3.20 mm Taping Material Chip quantity (pcs.) φ178mm Φ330mm (7”) reel (13”) reel 5,000 Plastic 1,000 3,000 5,000 1,000 Plastic 3,000 500 • All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 Additional Information C Series — High Voltage Application • Shape & Dimensions • Inside Structure & Material System 3 4 Terminal electrode L B G 5 W B T 2 1 Internal electrode Ceramic dielectric Case Code C4520 C4532 CC1808 CC1812 4.50 4.50 Dimensions (mm) 0.85 mm 0.30 min 1.10 mm 2.00 1.30 mm 2.00 min 1.60 mm 0.30 min 2.00 mm 1.30 mm 0.30 min. 1.60 mm 3.20 2.00 mm 0.20 min 2.30 mm 3.20 mm 0.30 min. No. 2.00 min • Environmental Information TDK Corporation established internal product environmental assurance standards that include the six hazardous substances banned by the EU RoHS Directive1 enforced on July 1, 2006 along with additional substances independently banned by TDK and has successfully completed making general purpose electronic components conform to the RoHS Directive2. 1. Abbreviation for Restriction on Hazardous Substances, which refers to the regulation EU Directive 2002/95/EC on hazardous substances by the European Union (EU) effective from July 1, 2006. The Directive bans the use of six specific hazardous substances in electric and electronic devices and products handled within the EU. The six substances are lead, mercury, cadmium, hexavalent chromium, PBB (polybrominated biphenyls), and PBDE (polybrominated diphenyl ethers). 2. This means that, in conformity with the EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. For REACH (SVHC : 15 substances according to ECHA / October 2008) : All TDK MLCC do not contain these 15 substances. For European Directive 2000/53/CE and 2005/673/CE : Cadmium, Hexavalent Chromium, Mercury, Lead are not contained in all TDK MLCC. For European Directive 2003/11/CE : Pentabromodiphenyl-ether, Octabromodiphenyl-ether are not contained in all TDK MLCC. • All specifications are subject to change without notice. Please read the precautions before using the product. US Catalog // C Series — High Voltage Application // Version A11 (1) Ceramic Dielectric (2) Internal Electrode (3) (4) (5) 2.00 min NAME MATERIAL Class 1 Class 2 CaZrO3 BaTiO3 Nickel (Ni) Copper (Cu) Termination Nickel (Ni) Tin (Sn)