SAMWHA CB3216PA151

DPS-081104
CHIP BEADS
Power Line Series
v Features
v Dimensions
(unit : mm)
B
• High impedance characteristics
• Low Rdc, High Current characteristics
T
• Good reliability (Monolithic structure)
L
• Magnetically shielded
W
• Fast mounting speed
• RoHS compliant
v Applications
• PDP/LCD Monitor, Digital TV/VCR etc.
v General Code
1
2
3
4
5
6
CB
2012
P
J
601
T
1
2
3
4
5
6
Series Code
CB : Chip Ferrite Beads
Dimension Code
The first two digits : length(mm)
The last two digits : width(mm)
Application Code
G : Signal Line
P : High Current Line
U : Ultra High Current Line
Material Code
A: General Frequency
K,J: Medium Frequency
M: High Frequency
V: Very High Frequency
Impedance Value Code
The first two digits represents significant
The last digit is the number of zeros following
ex) 601 = 600 (Ω)
Packaging Code
T : Reel paper packaging
E : Reel embossed tape packaging
Size
L
W
T
B
1005
1.0±0.10
0.5±0.10
0.5±0.10
0.25±0.1
1608
1.6±0.15
0.8±0.15
0.8±0.15
0.3±0.2
2012
2.0±0.20
1.25±0.2
0.85±0.2
0.5±0.3
3216
3.2±0.20
1.6±0.20
1.1±0.20
0.5±0.3
4516
4.5±0.25
1.6±0.20
1.3±0.20
0.5±0.3
4532
4.5±0.25
3.2±0.25
1.5±0.25
0.5±0.3
v Temperature Range
• Operating Temp. -55 ~ +125℃
• Storage Temp. -10 ~ +40 ℃
v Typical Material Characteristics
High μ
Low μ
(Low RXCP)
(High RXCP)
V
M
J,K
A
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS, For Power Line
v 1608 SIZE
Impedance
(Ω) ±25%
DC Resistance
(Ω) max.
Rated Current
(mA) max.
CB1608PA100
10
0.05
2000
CB1608PA300
30
0.05
2000
CB1608PA600
60
0.08
1000
CB1608PA121
120
0.10
800
CB1608PA181
180
0.12
800
CB1608PK100
10
0.05
2000
CB1608PK300
30
0.05
2000
CB1608PK600
60
0.08
1000
CB1608PK121
120
0.10
800
CB1608PK181
180
0.12
800
CB1608PJ300
30
0.05
2000
CB1608PJ600
60
0.10
1000
CB1608PJ121
120
0.12
1000
CB1608PM300
30
0.06
1500
CB1608PM600
60
0.08
1000
CB1608PM121
120
0.12
800
Test Frequency
(MHz)
100
※ Measuring Equipment
CHIP BEAD, Power Line Series
Samwha P/N
-. Z : HP4291B / E4991A
-. Rdc : HP4338B
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS, For Power Line
v 1608 SIZE
CB 1608 PA 100
16
CB 1608 PA 300
40
CB 1608 PA 600
100
Z
R
8
X
4
1
10
100
20
X
10
0
1000
R
1
Frequency [MHz]
CB 1608 PA 121
Impedance [W]
R
80
X
40
0
1
10
1
10
100
Z
R
40
X
1
10
100
180
120
R
60
0
1000
Z
X
1
10
Frequency [MHz]
CB 1608 PJ 300
100
1000
Frequency [MHz]
CB 1608 PJ 600
120
1000
CB 1608 PK 121
240
80
0
1000
100
Frequency [MHz]
120
Frequency [MHz]
100
X
25
0
1000
CB 1608 PK 600
160
Z
120
100
R
50
CB 1608 PM 300
120
Z
50
R
25
0
X
1
10
100
90
R
60
X
30
0
1000
1
Impedance [W]
Impedance [W]
Z
100
R
X
1
10
100
R
30
10
100
1000
0
1
10
1000
Frequency [MHz]
100
1000
Frequency [MHz]
CB 1608 PM 121
400
150
0
Z
60
Frequency [MHz]
CB 1608 PM 600
50
90
X
Frequency [MHz]
200
Impedance [W]
Impedance [W]
Impedance [W]
Z
75
CHIP BEAD, Power Line Series
Impedance [W]
160
10
Z
75
Frequency [MHz]
Impedance [W]
0
30
Impedance [W]
Impedance [W]
Impedance [W]
Z
12
300
Z
200
R
100
0
X
1
10
100
1000
Frequency [MHz]
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS, For Power Line
v 2012 SIZE
Impedance
(Ω) ±25%
DC Resistance
(Ω) max.
Rated Current
(mA) max.
CB2012PA110
11
0.007
3000
CB2012PA300
30
0.015
3000
CB2012PA600
60
0.025
3000
CB2012PA121
120
0.050
2500
CB2012PA221
220
0.050
2000
CB2012PA301
300
0.100
2000
CB2012PA601
600
0.130
1500
CB2012PK150
15
0.080
2000
CB2012PK300
30
0.015
3000
CB2012PK600
60
0.025
3000
CB2012PK121
120
0.050
2500
CB2012PK181
180
0.050
2000
CB2012PK221
220
0.050
2000
CB2012PK301
300
0.070
2000
CB2012PK601
600
0.130
1500
CB2012PK102
1000
0.250
1000
CB2012PK202
2000
0.300
500
CB2012PJ601
600
0.100
1500
CB2012PJ801
800
0.150
1500
CB2012PM600
60
0.020
3000
CB2012PM121
120
0.050
2500
CB2012PM221
220
0.050
2000
CB2012PM301
300
0.070
2000
CB2012PM601
600
0.130
1500
Test Frequency
(MHz)
100
70
CHIP BEAD, Power Line Series
Samwha P/N
100
※ Measuring Equipment
-. Z : HP4291B / E4991A
-. Rdc : HP4338B
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS, For Power Line
v 2012 SIZE
CB 2012 PA 110
20
CB 2012 PA 600
120
CB 2012 PA 121
160
R
10
X
0
1
10
100
R
30
X
0
1000
Z
60
1
Frequency [MHz]
CB 2012 PA 221
Z
R
200
100
0
X
1
10
100
600
Z
400
R
1
10
0
1000
1
10
100
Z
120
R
80
X
40
0
1000
1
10
200
X
100
1
10
100
600
X
200
0
1000
R
400
1
Frequency [MHz]
Z
CB 2012 PK 202
2500
1500
X
500
1
10
X
300
1
10
100
1000
Z
Frequency [MHz]
R
500
0
X
1
10
100
1000
CB 2012 PJ 801
1000
750
250
100
Frequency [MHz]
Z
R
1000
R
600
0
1000
CB 2012 PJ 601
1000
Impedance [W]
Impedance [W]
100
Z
2000
0
10
900
Frequency [MHz]
Impedance [W]
0
Z
Impedance [W]
Impedance [W]
Impedance [W]
R
1000
CB 2012 PK 102
1200
Z
300
100
Frequency [MHz]
CB 2012 PK 601
800
1000
CB 2012 PK 121
160
Frequency [MHz]
CB 2012 PK 301
100
Frequency [MHz]
X
200
Frequency [MHz]
400
X
40
0
1000
CB 2012 PA 601
800
Impedance [W]
300
100
R
80
CHIP BEAD, Power Line Series
Impedance [W]
400
10
120
Frequency [MHz]
Impedance [W]
5
90
Impedance [W]
Impedance [W]
Impedance [W]
Z
Z
15
1000
750
R
500
X
250
0
1
10
Frequency [MHz]
100
1000
Frequency [MHz]
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS, For Power Line
v 2012 SIZE
CB 2012 PM 600
X
300
Impedance [W]
R
60
30
CB 2012 PM 601
1200
Z
Z
90
CB 2012 PM 121
400
Impedance [W]
Impedance [W]
120
Z
200
R
100
900
R
600
X
300
X
0
1
10
100
1000
Frequency [MHz]
0
1
10
100
1000
0
1
10
Frequency [MHz]
100
1000
Frequency [MHz]
CHIP BEAD, Power Line Series
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS, For Power Line
v 3216 SIZE
Impedance
(Ω) ±25%
DC Resistance
(Ω) max.
Rated Current
(mA) max.
CB3216PA310
31
0.03
3000
CB3216PA350
35
0.03
3000
CB3216PA500
50
0.03
3000
CB3216PA600
60
0.03
3000
CB3216PA700
70
0.03
3000
CB3216PA900
90
0.03
3000
CB3216PA101
100
0.03
3000
CB3216PA121
120
0.03
3000
CB3216PA151
150
0.03
3000
CB3216PA301
300
0.06
3000
CB3216PA501
500
0.06
3000
CB3216PA601
600
0.06
3000
CB3216PK501
500
0.06
3000
CB3216PK601
600
0.06
3000
CB3216PJ601
600
0.06
3000
CB3216PM121
120
0.03
3000
CB3216PM601
600
0.06
3000
Test Frequency
(MHz)
100
CHIP BEAD, Power Line Series
Samwha P/N
※ Measuring Equipment
-. Z : HP4291B / E4991A
-. Rdc : HP4338B
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS, For Power Line
v 3216 SIZE
Impedance [W]
Z
R
20
60
Z
40
R
20
10
100
0
1000
1
Frequency [MHz]
Impedance [W]
Impedance [W]
X
30
1
10
100
1
10
100
R
300
X
150
1
10
R
300
X
150
100
1000
Z
Frequency [MHz]
R
160
0
X
1
10
100
1000
CB 3216 PM 601
1200
240
80
100
Frequency [MHz]
Z
Impedance [W]
Impedance [W]
450
0
1000
CB 3216 PM 121
320
1000
Z
X
40
100
CB 3216 PA 501
600
R
Z
10
10
Frequency [MHz]
CB 3216 PK 501
1
1
Frequency [MHz]
80
0
1000
450
0
0
1000
Z
120
Frequency [MHz]
600
X
20
1000
900
R
600
X
300
0
1
10
Frequency [MHz]
100
CHIP BEAD, Power Line Series
R
60
0
100
CB 3216 PA 121
160
Z
90
R
40
Frequency [MHz]
CB 3216 PA 101
120
10
Impedance [W]
1
Z
60
X
X
0
CB 3216 PA 500
80
Impedance [W]
Impedance [W]
60
40
CB 3216 PA 350
80
Impedance [W]
CB 3216 PA 310
80
1000
Frequency [MHz]
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Reliability & Test Condition
Item
Requirements
Test Conditions
Operating
temperature range
- 55 ℃ ~ + 125 ℃
-
Storage
temperature range
40 ℃ max., 70% RH max.
at packing condition
More than 90% of the terminal electrode shall be
covered with new solder
Resistance to
soldering heat
1. No damage such as cracks should be
caused in chip element
2. More than 75% of the terminal electrode
shall be covered with new solder
3. Impedance shall not change
more than ±30 %
Preheat temperature : 100 ~ 150 ℃
Preheat time : 60 sec.
Solder temperature : 270 ± 10 ℃
Soldering time : 10 ± 0.5 sec.
More than 50% of the terminal electrode
shall be covered with new solder
ST ≥
Reflow soldering
ST
1
CT
2
CT
Preheat temperature : 150 ℃
Preheat time : 60 sec.
Solder temperature : 245 ± 5 ℃
Soldering time : 10 sec. max.
(Reflow soldering profile)
High temperature
resistance
Temperature : 125 ± 3 ℃
Time : 500 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
High temperature
load resistance
Temperature : 125 ± 3 ℃
Applied current : rated current
Time : 1000 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
1. No mechanical damage
2. Impedance shall not change more than ±30 %
CHIP BEAD, Reliability & Test Condition
Solderability
Preheat temperature : 100 ~ 150 ℃
Preheat time : 60 sec.
Solder temperature : 245 ± 5 ℃
Soldering time : 10 ± 1 sec.
Temperature : 40 ± 2 ℃
Humidity : 90 ± 2 % RH
Time : 500 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
Humidity
resistance
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Reliability & Test Condition
Item
Requirements
Test Conditions
Temperature : 40 ± 2 ℃
Humidity : 90 ± 2 % RH
Applied current : rated current
Time : 500 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
Humidity load
resistance
1. No mechanical damage
2. Impedance shall not change more than ±30 %
Temperature : -55 ± 3 ℃
Time : 1000 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
Thermal shock
1. -55 ± 3℃ for 30 minutes
2.125 ± 3 ℃ for 30 minutes
3. repeat 100 cycle
Vibration
Frequency : 10 ~ 55 Hz
Amplitude : 1.5 mm
Direction : X, Y, Z
Sweep time : 2 hours for each axis
Drop
Drop 10 times on a concrete floor
from a height of 100 cm
W
No mechanical damage
Flexure strength
ITEM
1005
1608
2012
3216
4516
4532
A
(mm)
0.7
1.0
1.0
1.3
1.5
1.5
B
(mm)
0.5
0.8
1.0
1.5
3.6
3.6
C
(mm)
0.7
1.3
1.3
3.0
3.0
3.8
W
(kgf)
0.7
2.0
4.0
5.0
5.0
5.0
R0.5
C
A
50
B
CHIP BEAD, Reliability & Test Condition
Low temperature
resistance
A
20
W
Bending strength
R340
The terminal electrode shall be neither break off
nor the chip damage
2 mm
Resistance meter
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Packaging
v Standard Quantity
Size
Q’TY(PCS)
1005
10,000
1608
4,000
2012
4,000
3216
3,000
4516
2,000
4532
1,000
Remarks
0.85 T size
(Unit:mm)
A
B
C
Φ178±2
Φ50 min.
Φ13±0.5
D
E
W
4±0.8
2±0.2
9±1.5
CHIP BEAD, Packaging
v Reel Dimension
v Leader & Blank Portion
(Unit:mm)
Blank
Chips
350±50 mm
Blank
Leader
350±50 mm
150 min
60 Pitch
60 Pitch
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Packaging
v Taping Dimensions (Paper tape)
T
A
B
S
P
(Unit:mm)
A
±0.1
B
±0.1
P
±0.1
S
±0.1
T
(Max.)
1005
1.15
0.65
2.0
1.0
0.8
1608
1.80
1.00
4.0
2.0
1.1
2012
2.30
1.55
4.0
2.0
1.1
v Taping Dimensions (Emboss tape)
CHIP BEAD, Packaging
Type
(Unit:mm)
Type
A
±0.1
B
±0.1
C
±0.1
D
±0.1
2012
2.25
1.45
1.50
0.23
3216
3.50
1.85
1.25
0.23
4516
4.90
1.90
1.35
0.30
4532
4.85
3.60
1.40
0.30
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS
Soldering Profile
v Reflow Soldering
Pre - heating
Soldering
Cooling
245±5℃
230
180
150
10 sec. max.
30~60 sec.
60 sec. min.
v Flow Soldering
Pre - heating
Soldering
Cooling
250±5℃
250
180
150
60 sec. min.
10 sec. max.
CHIP BEAD, Soldering Profile
60~120 sec.
60 sec. min.
v Manual Soldering
300
Soldering Iron : 30W max.
Diameter of soldering iron : 1.2 mm max.
Tc
2 sec. max.
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD