[ /Title (CD74H C109, CD74H CT109) /Subject (Dual JK FlipFlop with Set and Reset CD54HC109, CD74HC109, CD54HCT109, CD74HCT109 Data sheet acquired from Harris Semiconductor SCHS140E Dual J-K Flip-Flop with Set and Reset Positive-Edge Trigger March 1998 - Revised October 2003 Features Description • Asynchronous Set and Reset The ’HC109 and ’HCT109 are dual J-K flip-flops with set and reset. The flip-flop changes state with the positive transition of Clock (1CP and 2CP). • Schmitt Trigger Clock Inputs • Typical fMAX = 54MHz at VCC = 5V, CL = 15pF, TA = 25oC The flip-flop is set and reset by active-low S and R, respectively. A low on both the set and reset inputs simultaneously will force both Q and Q outputs high. However, both set and reset going high simultaneously results in an unpredictable output condition. • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads Ordering Information • Wide Operating Temperature Range . . . -55oC to 125oC • Balanced Propagation Delay and Transition Times PART NUMBER • Significant Power Reduction Compared to LSTTL Logic ICs • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH Pinout 16 VCC 1J 2 15 2R 1K 3 14 2J 1CP 4 13 2K 1S 5 12 2CP 1Q 6 11 2S 1Q 7 10 2Q GND 8 9 2Q CD54HC109F3A -55 to 125 16 Ld CERDIP CD54HCT109F3A -55 to 125 16 Ld CERDIP CD74HC109E -55 to 125 16 Ld PDIP CD74HC109M -55 to 125 16 Ld SOIC CD74HC109MT -55 to 125 16 Ld SOIC CD74HC109M96 -55 to 125 16 Ld SOIC CD74HCT109E -55 to 125 16 Ld PDIP CD74HCT109M -55 to 125 16 Ld SOIC CD74HCT109MT -55 to 125 16 Ld SOIC CD74HCT109M96 -55 to 125 16 Ld SOIC CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated PACKAGE NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. The suffix T denotes a small-quantity reel of 250. CD54HC109, CD54HCT109 (CERDIP) CD74HC109, CD74HCT109 (PDIP, SOIC) TOP VIEW 1R 1 TEMP. RANGE (oC) 1 CD54HC109, CD74HC109, CD54HCT109, CD74HCT109 Functional Diagram 1S 1J 1K 1CP 1R 2S 2J 2K 2CP 2R 5 2 6 1Q 3 F/F 1 7 1Q 4 1 11 14 10 2Q 13 F/F 2 9 2Q 12 GND = 8 VCC = 16 15 TRUTH TABLE INPUTS OUTPUTS S R CP J K Q Q L H X X X H L H L X X X L H L L X X X H (Note 1) H (Note 1) H H ↑ L L L H H ↑ H L Toggle H H ↑ L H No Change H H ↑ H H H H L X X H H L No Change H= High Level (Steady State) L= Low Level (Steady State) X= Don’t Care ↑= Low-to-High Transition NOTE: 1. Unpredictable and unstable condition if both S and R go high simultaneously Logic Diagram 5(11) S 2(14) J J S 3(13) K K FF 4(12) CP 1(15) R 16 VCC Q 8 GND 2 CL CL R Q 6(10) Q 7(9) Q CD54HC109, CD74HC109, CD54HCT109, CD74HCT109 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Drain Current, per Output, IO For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 2) θJA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 67 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . 73 Maximum Junction Temperature (Hermetic Package or Die) . . . 175oC Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC CP Input Rise and Fall Time, tr, tf 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0ms (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0ms (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0ms (Max) Input Rise and Fall Time (All Inputs Except CP), tr, tf 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 2. The package thermal impedance is calculated in accordance with JESD 51-7 DC Electrical Specifications TEST CONDITIONS PARAMETER SYMBOL VI (V) VIH - 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads High Level Output Voltage TTL Loads VIL VOH - VIH or VIL - - -0.02 2 1.9 - - 1.9 - 1.9 - V 4.5 4.4 - - 4.4 - 4.4 - V 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -4 4.5 3.96 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 3 CD54HC109, CD74HC109, CD54HCT109, CD74HCT109 DC Electrical Specifications (Continued) TEST CONDITIONS PARAMETER Low Level Output Voltage CMOS Loads SYMBOL VI (V) VOL VIH or VIL Low Level Output Voltage TTL Loads 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 0.1 - 0.1 - 0.1 V 4.5 - - 0.1 - 0.1 - 0.1 V 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V 0.02 II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 4 - 40 - 80 µA High Level Input Voltage VIH - - 4.5 to 5.5 2 - - 2 - 2 - V Low Level Input Voltage VIL - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V High Level Output Voltage CMOS Loads VOH VIH or VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V ±0.1 - ±1 - ±1 µA Input Leakage Current Quiescent Device Current HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load II VCC and GND - 5.5 - ICC VCC or GND 0 5.5 - - 4 - 40 - 80 µA ∆ICC (Note 3) VCC - 2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA NOTE: 3. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS All 0.3 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications table, e.g., 360µA max at 25oC. 4 CD54HC109, CD74HC109, CD54HCT109, CD74HCT109 Prerequisite For Switching Specifications PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tSU - 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns 2 5 - - 5 - 5 - ns 4.5 5 - - 5 - 5 - ns 6 5 - - 5 - 5 - ns 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns 2 80 - - 100 - 120 - ns HC TYPES Setup Time J, K, to CP Hold Time J, K, to CP Removal Time R, S, to CP Pulse Width CP, R, S CP Frequency tH - tREM - tW - fMAX - 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns 2 6 - - 5 - 4 - MHz 4.5 30 - - 25 - 20 - MHz 6 35 - - 29 - 23 - MHz HCT TYPES Setup Time J, K to CP tSU - 4.5 18 - - 23 - 27 - ns Hold Time J, K to CP tH - 4.5 3 - - 3 - 3 - ns tREM - 4.5 18 - - 23 - 27 - ns tW - 4.5 18 - - 23 - 27 - ns fMAX - 4.5 27 - - 22 - 18 - MHz SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tPLH, tPHL CL = 50pF 2 - - 175 - 220 - 265 ns CL = 50pF 4.5 - - 35 - 44 - 53 ns CL = 15pF 5 - 14 - - - - - ns CL = 50pF 6 - - 30 - 37 - 45 ns CL = 50pF 2 - - 120 - 150 - 180 ns CL = 50pF 4.5 - - 24 - 30 - 36 ns CL = 15pF 5 - 9 - - - - - ns CL = 50pF 6 - - 20 - 26 - 31 ns CL = 50pF 2 - - 155 - 195 - 235 ns CL = 50pF 4.5 - - 31 - 39 - 47 ns CL = 15pF 5 - 13 - - - - - ns CL = 50pF 6 - - 26 - 33 - 40 ns Removal Time R, S, to CP Pulse Width CP, R, S CP Frequency Switching Specifications Input tr, tf = 6ns PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC HC TYPES Propagation Delay, CP → Q, Q Propagation Delay, S→Q Propagation Delay, S→Q tPLH, tPHL tPLH, tPHL 5 CD54HC109, CD74HC109, CD54HCT109, CD74HCT109 Switching Specifications Input tr, tf = 6ns PARAMETER Propagation Delay, R→Q Propagation Delay, R→Q Transition Time Input Capacitance (Continued) 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF 2 - - 185 - 230 - 280 ns CL = 50pF 4.5 - - 37 - 46 - 56 ns CL = 15pF 5 - 15 - - - - - ns CL = 50pF 6 - - 31 - 39 - 48 ns CL = 50pF 2 - - 170 - 215 - 255 ns CL = 50pF 4.5 - - 34 - 43 - 51 ns CL = 15pF 5 - 14 - - - - - ns CL = 50pF 6 - - 29 - 37 - 43 ns CL = 50pF 2 - - 75 - 95 - 110 ns CL = 50pF 4.5 - - 15 - 19 - 22 ns CL = 50pF 6 - - 13 - 16 - 19 ns - - - 10 - 10 - 10 pF 5 - 60 - - - - - MHz 5 - 30 - - - - - pF CL = 50pF 4.5 - - 40 - 50 - 60 ns CL = 15pF 5 - 17 - - - - - ns CL = 50pF 4.5 - - 30 - 38 - 45 ns CL = 15pF 5 - 12 - - - - - ns CL = 50pF 4.5 - - 45 - 56 - 68 ns CL = 15pF 5 - 19 - - - - - ns CL = 50pF 4.5 - - 45 - 56 - 68 ns CL = 15pF 5 - 19 - - - - - ns CL = 50pF 4.5 - - 37 - 46 - 56 ns CL = 15pF 5 - 15 - - - - - ns CL = 50pF 4.5 - - 15 - 19 - 22 ns tPLH, tPHL tTLH, tTHL CI CP Frequency fMAX Power Dissipation Capacitance (Notes 4, 5) CPD CL = 15pF - VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS HCT TYPES Propagation Delay, CP → Q, Q tPLH, tPHL Propagation Delay, S→Q tPLH, tPHL Propagation Delay, S→Q tPLH, tPHL Propagation Delay, R→Q tPLH, tPHL Propagation Delay, R→Q tPLH, tPHL Transition Time (Figure 5) tTLH, tTHL Input Capacitance CI - - - - 10 - 10 - 10 pF CP Frequency fMAX CL = 15pF 5 - 54 - - - - - MHz Power Dissipation Capacitance (Notes 4, 5) CPD - 5 - 33 - - - - - pF NOTES: 4. CPD is used to determine the dynamic power consumption, per flip-flop. 5. PD = CPD VCC2 fi + Σ CL fo where fi = input frequency, fo = output frequency, CL = output load capacitance, VCC = supply voltage. 6 CD54HC109, CD74HC109, CD54HCT109, CD74HCT109 Test Circuits and Waveforms tWL + tWH = tfCL trCL 50% 10% 10% tf = 6ns tr = 6ns GND tTLH 90% INVERTING OUTPUT tPHL FIGURE 9. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC trCL VCC tfCL GND 1.3V 0.3V GND tH(H) tH(L) VCC DATA INPUT 3V 2.7V CLOCK INPUT 50% tH(H) tPLH FIGURE 10. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tfCL 10% tTLH 1.3V 10% tPLH 90% GND tTHL 90% 50% 10% trCL 3V 2.7V 1.3V 0.3V INPUT tTHL tPHL tWH FIGURE 8. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH VCC INVERTING OUTPUT GND NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. tf = 6ns 90% 50% 10% 1.3V 1.3V tWL tWH FIGURE 7. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH INPUT 1.3V 0.3V 0.3V GND tr = 6ns DATA INPUT 50% tH(L) 3V 1.3V 1.3V 1.3V GND tSU(H) tSU(H) tSU(L) tTLH 90% OUTPUT tTHL 90% 50% 10% tTLH 90% 1.3V OUTPUT tREM 3V SET, RESET OR PRESET GND tTHL 1.3V 10% FIGURE 11. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS tPHL 1.3V GND IC CL 50pF GND 90% tPLH 50% IC tSU(L) tPHL tPLH I fCL 3V 2.7V CLOCK NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. tREM VCC SET, RESET OR PRESET tfCL = 6ns fCL 50% 50% tWL CLOCK INPUT tWL + tWH = trCL = 6ns VCC 90% CLOCK I CL 50pF FIGURE 12. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS 7 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION (1) Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9070101MEA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type CD54HC109F3A ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type CD54HCT109F3A ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type CD74HC109E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC109EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC109M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC109M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC109M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC109M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC109ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC109MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC109MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC109MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC109MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT109E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT109EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT109M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT109M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT109M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT109M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT109ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT109MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT109MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT109MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT109MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM The marketing status values are defined as follows: Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74HC109M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74HCT109M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC109M96 SOIC D 16 2500 333.2 345.9 28.6 CD74HCT109M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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