[ /Title (CD74 HC451 8, CD74 HC452 0, CD74 HCT45 20) /Subject CD74HC4518, CD54HC4520, CD74HC4520, CD74HCT4520 Data sheet acquired from Harris Semiconductor SCHS216D High-Speed CMOS Logic Dual Synchronous Counters November 1997 - Revised October 2003 Features having interchangeable CLOCK and ENABLE lines for incrementing on either the positive-going or the negativegoing transition of CLOCK. The counters are cleared by high levels on the MASTER RESET lines. The counter can be cascaded in the ripple mode by connecting Q3 to the ENABLE input of the subsequent counter while the CLOCK input of the latter is held low. • Positive or Negative Edge Triggering • Synchronous Internal Carry Propagation • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads Ordering Information • Wide Operating Temperature Range . . . -55oC to 125oC TEMP. RANGE (oC) PACKAGE CD54HC4520F3A -55 to 125 16 Ld CERDIP • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V CD74HC4518E -55 to 125 16 Ld PDIP CD74HC4520E -55 to 125 16 Ld PDIP CD74HC4520M -55 to 125 16 Ld SOIC • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH CD74HC4520MT -55 to 125 16 Ld SOIC CD74HC4520M96 -55 to 125 16 Ld SOIC CD74HCT4520E -55 to 125 16 Ld PDIP CD74HCT4520M -55 to 125 16 Ld SOIC Description CD74HCT4520MT -55 to 125 16 Ld SOIC CD74HCT4520M96 -55 to 125 16 Ld SOIC • Balanced Propagation Delay and Transition Times PART NUMBER • Significant Power Reduction Compared to LSTTL Logic ICs The CD74HC4518 is a dual BCD up-counter. The ’HC4520 and CD74HCT4520 are dual binary up-counters. Each device consists of two independent internally synchronous 4-stage counters. The counter stages are D-type flip-flops NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. The suffix T denotes a small-quantity reel of 250. Pinout CD54HC4520 (CERDIP) CD74HC4518 (PDIP) CD74HC4520, CD74HCT4520, (PDIP, SOIC) TOP VIEW 1CP 1 16 VCC 1E 2 15 2MR 1Q0 3 14 2Q3 1Q1 4 13 2Q2 1Q2 5 12 2Q1 1Q3 6 11 2Q0 1MR 7 10 2E 9 2CP GND 8 CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated 1 CD74HC4518, CD54HC4520, CD74HC4520, CD74HCT4520 Functional Diagram 1CP 1E ÷10/÷16 1 2CP 2E 1Q1 2 CL 5 1Q2 6 1Q3 7 ÷10/÷16 9 11 2Q0 12 2Q1 10 CL 13 2Q2 R 2MR 1Q0 4 R 1MR 3 14 2Q3 GND = 8 VCC = 16 15 TRUTH TABLE CP E MR OUTPUT STATE ↑ H L Increment Counter L ↓ L Increment Counter ↓ X L No Change X ↑ L No Change ↑ L L No Change H ↓ L No Change X X H Q0 thru Q3 = L H = High State. L = Low State. ↑ = High-to-Low Transition. ↓ = Low-to-High Transition. X = Don’t Care. 2 CD74HC4518, CD54HC4520, CD74HC4520, CD74HCT4520 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 1) θJA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS VIH - - 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 8 - 80 - 160 µA 3 CD74HC4518, CD54HC4520, CD74HC4520, CD74HCT4520 DC Electrical Specifications (Continued) TEST CONDITIONS 25oC -55oC TO 125oC -40oC TO 85oC SYMBOL VI (V) IO (mA) VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS High Level Input Voltage VIH - - 4.5 to 5.5 2 - - 2 - 2 - V Low Level Input Voltage VIL - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V High Level Output Voltage CMOS Loads VOH VIH or VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V PARAMETER HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load II VCC and GND 0 5.5 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA ∆ICC (Note 2) VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS MR 1.2 CP 0.25 ENABLE 0.5 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g., 360µA max at 25oC. Prerequisite for Switching Specifications 25oC PARAMETER -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS fMAX 2 6 - - 5 - 4 - MHz 4.5 30 - - 24 - 20 - MHz 6 35 - - 28 - 24 - MHz 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns HC TYPES Maximum Clock Frequency CP Pulse Width MR Pulse Width tW tW 6 14 - - 17 - 20 - ns 2 100 - - 125 - 150 - ns 4.5 20 - - 25 - 30 - ns 6 17 - - 21 - 26 - ns 4 CD74HC4518, CD54HC4520, CD74HC4520, CD74HCT4520 Prerequisite for Switching Specifications (Continued) 25oC PARAMETER Set-up Time, Enable to CP Removal Time, MR to CP Set-up Time, CP to Enable Removal Time, MR to Enable -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tSU 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns 2 0 - - 0 - 0 - ns 4.5 0 - - 0 - 0 - ns tREM tSU tREM 6 0 - - 0 - 0 - ns 2 80 - - 100 - 120 - ns 4.5 16 - - 20 - 24 - ns 6 14 - - 17 - 20 - ns 2 0 - - 0 - 0 - ns 4.5 0 - - 0 - 0 - ns 6 0 - - 0 - 0 - ns fMAX 4.5 25 - - 20 - 17 - MHz Clock Pulse Width tW 4.5 20 - - 25 - 30 - ns MR Pulse Width tW 4.5 20 - - 25 - 30 - ns Set-up Time, Enable to CP tSU 4.5 16 - - 20 - 24 - ns tREM 4.5 0 - - 0 - 0 - ns HCT TYPES Maximum Clock Frequency Removal Time, MR tp Enable Switching Specifications Input tr, tf = 6ns PARAMETER HC TYPES Propagation Delay CP to Qn Enable to Qn MR to Qn Output Transition Time TEST SYMBOL CONDITIONS tPLH, tPHL tPLH, tPHL tPLH, tPHL tTHL, tTLH VCC (V) MIN TYP MAX MIN MAX -55oC TO 125oC MIN MAX UNITS CL = 50pF 2 - - 240 - 300 - 360 ns CL = 50pF 4.5 - - 48 - 60 - 72 ns CL = 15pF 5 - 20 - - - - - ns CL = 50pF 6 - - 41 - 51 - 61 ns CL = 50pF 2 - - 240 - 300 - 360 ns CL = 50pF 4.5 - - 48 - 60 - 72 ns CL = 15pF 5 - 20 - - - - - ns CL = 50pF 6 - - 41 - 51 - 61 ns CL = 50pF 2 - - 150 - 190 - 225 ns CL = 50pF 4.5 - - 30 - 38 - 45 ns CL = 15pF 5 - 12 - - - - - ns CL = 50pF 6 - - 26 - 33 - 38 ns CL = 50pF 2 - - 75 - 95 - 110 ns CL = 50pF 4.5 - - 15 - 19 - 22 ns 19 ns - - 10 - 10 - 10 pF - 33 - - - - - CL = 50pF 6 CIN CL = 50pF - Maximum Clock Frequency fMAX CL = 15pF 5 Power Dissipation Capacitance (Note 3, 4) CPD CL = 15pF 5 Input Capacitance -40oC TO 85oC 25oC 13 16 60 5 MHz pF CD74HC4518, CD54HC4520, CD74HC4520, CD74HCT4520 Switching Specifications Input tr, tf = 6ns (Continued) TEST SYMBOL CONDITIONS PARAMETER -40oC TO 85oC 25oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 4.5 - - 53 - 66 - 80 ns HCT TYPES Propagation Delay CP to Qn tPLH, tPHL CL = 50pF CL = 15pF 5 - 22 - - - - - ns CL = 50pF 4.5 - - 55 - 69 - 83 ns Enable to Qn tPLH, tPHL MR to Qn tPLH, tPHL CL = 15pF tTHL, tTLH CL = 50pF Output Transition Time Input Capacitance CL = 15pF 5 - 23 - - - - - ns CL = 50pF 4.5 - - 35 - 44 - 53 ns 5 - 14 - - - - - ns 4.5 - - 15 - 19 - 22 ns CIN CL = 50pF - - - 10 - 10 - 10 pF Maximum Clock Frequency fMAX CL = 15pF 5 - 50 - - - - - MHz Power Dissipation Capacitance (Note 3,4) CPD - 5 - 33 - - - - - pF NOTES: 3. CPD is used to determine the dynamic power consumption, per counter. 4. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Timing Diagram 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 CLOCK ENABLE MASTER RESET 0 1 2 3 4 5 6 7 8 9 0 0 1 2 3 4 Q1 Q2 HC4518 Q3 Q4 Q1 Q2 ’HC/HCT4520 Q3 Q4 FIGURE 1. 6 CD74HC4518, CD54HC4520, CD74HC4520, CD74HCT4520 Waveforms tWL + tWH = tfCL trCL 50% 10% 10% tf = 6ns tr = 6ns tTLH 90% INVERTING OUTPUT tPHL FIGURE 4. HC TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 5. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC trCL tfCL VCC tfCL GND 1.3V 0.3V GND tH(H) tH(L) VCC DATA INPUT 3V 2.7V CLOCK INPUT 50% tH(H) tTLH 1.3V 10% tPLH 10% GND tTHL 90% 50% 10% 90% 3V 2.7V 1.3V 0.3V GND tTHL trCL tWH FIGURE 3. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH INPUT INVERTING OUTPUT GND NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. VCC 90% 50% 10% 1.3V 1.3V tWL tf = 6ns tPHL 1.3V 0.3V tWH FIGURE 2. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH INPUT 2.7V 0.3V GND tr = 6ns DATA INPUT 50% tH(L) 3V 1.3V 1.3V 1.3V GND tSU(H) tSU(H) tSU(L) tTLH 90% OUTPUT tTHL 90% 50% 10% tTLH 90% 1.3V OUTPUT tREM 3V SET, RESET OR PRESET GND tTHL 1.3V 10% FIGURE 6. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS tPHL 1.3V GND IC CL 50pF GND 90% tPLH 50% IC tSU(L) tPHL tPLH I fCL 3V NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. tREM VCC SET, RESET OR PRESET tfCL = 6ns CLOCK 50% 50% tWL CLOCK INPUT tWL + tWH = trCL = 6ns VCC 90% CLOCK I fCL CL 50pF FIGURE 7. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS 7 PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-8995401EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8995401EA CD54HC4520F3A CD54HC4520F ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 CD54HC4520F CD54HC4520F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8995401EA CD54HC4520F3A CD74HC4518E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC4518E CD74HC4520E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC4520E CD74HC4520M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC4520M CD74HC4520M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC4520M CD74HC4520M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC4520M CD74HC4520ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC4520M CD74HC4520MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC4520M CD74HC4520MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC4520M CD74HCT4520E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT4520E CD74HCT4520EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT4520E CD74HCT4520M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT4520M CD74HCT4520M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT4520M CD74HCT4520MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT4520M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2014 LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. 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Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. 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OTHER QUALIFIED VERSIONS OF CD54HC4520, CD74HC4520 : • Catalog: CD74HC4520 • Military: CD54HC4520 NOTE: Qualified Version Definitions: Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2014 • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74HC4520M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74HCT4520M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC4520M96 SOIC D 16 2500 333.2 345.9 28.6 CD74HCT4520M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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