[ /Title (CD74 HC240 , CD74 HCT24 0, CD74 HC241 , CD74 HCT24 1, CD74 HC244 , CD74 Data sheet acquired from Harris Semiconductor SCHS167E CD54/74HC240, CD54/74HCT240, CD74HC241, CD54/74HCT241, CD54/74HC244, CD54/74HCT244 High-Speed CMOS Logic Octal Buffer/Line Drivers, Three-State November 1997 - Revised October 2004 Features Ordering Information • HC/HCT240 Inverting PART NUMBER • HC/HCT241 Non-Inverting TEMP. RANGE (oC) PACKAGE • HC/HCT244 Non-Inverting CD54HC240F3A -55 to 125 20 Ld CERDIP • Typical Propagation Delay = 8ns at VCC = 5V, CL = 15pF, TA = 25oC for HC240 CD54HC244F3A -55 to 125 20 Ld CERDIP • Three-State Outputs CD54HCT240F3A -55 to 125 20 Ld CERDIP • Buffered Inputs CD54HCT241F3A -55 to 125 20 Ld CERDIP • High-Current Bus Driver Outputs CD54HCT244F3A -55 to 125 20 Ld CERDIP CD74HC240E -55 to 125 20 Ld PDIP CD74HC240M -55 to 125 20 Ld SOIC • Wide Operating Temperature Range . . . -55oC to 125oC CD74HC240M96 -55 to 125 20 Ld SOIC • Balanced Propagation Delay and Transition Times CD74HC241E -55 to 125 20 Ld PDIP • Significant Power Reduction Compared to LSTTL Logic ICs CD74HC241M -55 to 125 20 Ld SOIC • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V CD74HC241M96 -55 to 125 20 Ld SOIC CD74HC244E -55 to 125 20 Ld PDIP CD74HC244M -55 to 125 20 Ld SOIC • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH CD74HC244M96 -55 to 125 20 Ld SOIC CD74HCT240E -55 to 125 20 Ld PDIP CD74HCT240M -55 to 125 20 Ld SOIC CD74HCT240M96 -55 to 125 20 Ld SOIC Description CD74HCT240PW -55 to 125 20 Ld TSSOP The ’HC240 and ’HCT240 are inverting three-state buffers having two active-low output enables. The CD74HC241, ’HCT241, ’HC244 and ’HCT244 are non-inverting threestate buffers that differ only in that the 241 has one activehigh and one active-low output enable, and the 244 has two active-low output enables. All three types have identical pinouts. CD74HCT240PWR -55 to 125 20 Ld TSSOP CD74HCT240PWT -55 to 125 20 Ld TSSOP CD74HCT241E -55 to 125 20 Ld PDIP CD74HCT241M -55 to 125 20 Ld SOIC CD74HCT241M96 -55 to 125 20 Ld SOIC CD74HCT244E -55 to 125 20 Ld PDIP CD74HCT244M -55 to 125 20 Ld SOIC CD74HCT244M96 -55 to 125 20 Ld SOIC • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2004, Texas Instruments Incorporated 1 CD54/74HC240, CD54/74HCT240, CD74HC241, CD54/74HCT241, CD54/74HC244, CD54/74HCT244 Pinout CD54HC240, CD54HCT240, CD54HCT241, CD54HC244, CD54HCT244 (CERDIP) CD74HC240, CD74HC241, CD74HCT241, CD74HC244, CD74HCT244 (PDIP, SOIC) CD74HCT240, (PDIP, SOIC, TSSOP) TOP VIEW 240 241 244 1OE 1OE 1 1A0 1A0 2 19 2OE (241) 2OE (240, 244) 2Y3 2Y3 3 18 1Y0 1Y0 1A1 1A1 4 17 2A3 2A3 2Y2 2Y2 5 16 1Y1 1Y1 1A2 1A2 6 15 2A2 2A2 2Y1 2Y1 7 14 1Y2 1Y2 1A3 1A3 8 13 2A1 2A1 2Y0 2Y0 9 12 1Y3 1Y3 GND 10 11 2A0 2A0 GND 241 244 20 VCC 240 VCC Functional Diagram 241 AND 244 240 2 18 4 16 6 14 8 12 11 9 13 7 15 5 240 17 AND 2A3 244 241 3 1A0 1A1 1A2 1A3 2A0 2A1 2A2 1 1OE 1OE 2OE 2OE 19 2 1Y0 1Y0 1Y1 1Y1 1Y2 1Y2 1Y3 1Y3 2Y0 2Y0 2Y1 2Y1 2Y2 2Y2 2Y3 2Y3 VCC = 20 GND = 10 CD54/74HC240, CD54/74HCT240, CD74HC241, CD54/74HCT241, CD54/74HC244, CD54/74HCT244 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Drain Current, per Output, IO For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . . ±35mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±70mA Thermal Resistance (Typical, Note 1) θJA E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 69oC/W M (SOIC) Package . . . . . . . . . . . . . . . . . . . . . . . . . 58oC/W PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . 83oC/W Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance wIth JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER SYMBOL VI (V) VIH - 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current - - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V -6 4.5 3.98 - - 3.84 - 3.7 - V -7.8 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V 6 4.5 - - 0.26 - 0.33 - 0.4 V 7.8 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 8 - 80 - 160 µA 3 CD54/74HC240, CD54/74HCT240, CD74HC241, CD54/74HCT241, CD54/74HC244, CD54/74HCT244 DC Electrical Specifications (Continued) TEST CONDITIONS 25oC -55oC TO 125oC SYMBOL VI (V) MIN TYP MAX MIN MAX MIN MAX UNITS IOZ VIL or VIH - 6 - - ±0.5 - ±0.5 - ±10 µA High Level Input Voltage VIH - - 4.5 to 5.5 2 - - 2 - 2 - V Low Level Input Voltage VIL - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V High Level Output Voltage CMOS Loads VOH VIH or VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V -6 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 6 4.5 - - 0.26 - 0.33 - 0.4 V PARAMETER Three-State Leakage Current IO (mA) VCC (V) -40oC TO 85oC HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads II VCC to GND 0 5.5 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA Additional Quiescent Device Current Per Input Pin: 1 Unit Load ∆ICC (Note 2) VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA Three-State Leakage Current IOZ VIL or VIH - 5.5 - - ±0.5 - ±5 - ±10 µA Input Leakage Current Quiescent Device Current NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS nA0-A3 1.5 1OE 0.7 2OE 0.7 nA0-A3 0.7 1OE 0.7 2OE 1.5 nA0-A3 0.7 1OE 0.7 2OE 0.7 HCT240 HCT241 HCT244 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications table, e.g., 360µA max at 25oC. 4 CD54/74HC240, CD54/74HCT240, CD74HC241, CD54/74HCT241, CD54/74HC244, CD54/74HCT244 Switching Specifications PARAMETER CL = 50pF, Input tr, tf = 6ns SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN TYP MAX MIN TYP 2 - - 100 - - 125 - - 150 ns 4.5 - - 20 - - 25 - - 30 ns CL = 15pF 5 - 8 - - - - - - - ns CL = 50pF 6 - - 17 - - 21 - - 26 ns CL = 50pF 2 - - 110 - - 140 - - 165 ns 4.5 - - 22 - - 28 - - 33 ns CL = 15pF 5 - 9 - - - - - - - ns CL = 50pF 6 - - 19 - - 24 - - 28 ns CL = 50pF 2 - - 110 - - 140 - - 165 ns 4.5 - - 22 - - 28 - - 33 ns CL = 15pF 5 - 9 - - - - - - - ns CL = 50pF 6 - - 19 - - 24 - - 28 ns CL = 50pF 2 - - 150 - - 190 - - 225 ns 4.5 - - 30 - - 38 - - 45 ns 5 - 12 - - - - - - - ns 6 - - 26 - - 33 - - 38 ns 2 - - 60 - - 75 - - 90 ns 4.5 - - 12 - - 15 - - 18 ns 6 - - 10 - - 13 - - 15 ns MAX UNITS HC TYPES Propagation Delay Data to Outputs HC240 Data to Outputs HC241 Data to Outputs HC244 Output Enable and Disable Time Output Transition Time tPLH, tPHL tPLH, tPHL tTHL, tTLH tTLH, tTHL CL = 50pF Input Capacitance CI CL = 50pF - 10 - 10 - - 10 - - 10 pF Three-State Output Capacitance CO CL = 50pF - - - 20 - - 20 - - 20 pF Power Dissipation Capacitance (Notes 3, 4) CPD CL = 15pF HC240 5 - 38 - - - - - - - pF HC241 5 - 34 - - - - - - - pF HC244 5 - 46 - - - - - - - pF CL = 50pF 4.5 - - 22 - - 28 - - 33 ns CL = 15pF 5 - 9 - - - - - - - ns CL = 50pF 4.5 - - 25 - - 31 - - 38 ns CL = 15pF 5 - 10 - - - - - - - ns CL = 50pF 4.5 - - 25 - - 31 - - 38 ns CL = 15pF 5 - 10 - - - - - - - ns HCT TYPES Propagation Delay Data to Outputs HCT240 tPHL, tPLH Data to Outputs HCT241 tPHL, tPLH Data to Outputs HCT244 tPHL, tPLH 5 CD54/74HC240, CD54/74HCT240, CD74HC241, CD54/74HCT241, CD54/74HC244, CD54/74HCT244 Switching Specifications CL = 50pF, Input tr, tf = 6ns (Continued) 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN TYP MAX MIN TYP Output Enable and Disable Times tTLH, tTHL CL = 50pF 4.5 - - 30 - - 38 - - 45 ns Output Transition Time tTHL, tTLH CL = 50pF 4.5 - - 12 - - 15 - - 18 ns CI CL = 50pF - 10 - 10 - - 10 - - 10 pF HCT240 - 5 - 40 - - - - - - - pF HCT241 - 5 - 38 - - - - - - - pF HCT244 - 5 - 40 - - - - - - - pF PARAMETER Input Capacitance Power Dissipation Capacitance (Notes 3, 4) MAX UNITS CPD NOTES: 3. CPD is used to determine the dynamic power consumption, per channel. 4. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, fO = Output Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Test Circuits and Waveforms tr = 6ns tf = 6ns VCC 90% 50% 10% INPUT GND tTLH 90% INVERTING OUTPUT tPHL FIGURE 1. HC TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 6ns tr VCC 10% OUTPUT LOW TO OFF OUTPUT LOW TO OFF OUTPUTS ENABLED OUTPUTS DISABLED OUTPUTS ENABLED OUTPUTS ENABLED FIGURE 3. HC THREE-STATE PROPAGATION DELAY WAVEFORM 0.3 GND 1.3V 10% OUTPUT HIGH TO OFF 50% 3V tPZL tPHZ tPZH 90% 6ns 2.7 1.3 tPLZ 10% tPHZ tf GND 50% OUTPUT HIGH TO OFF 6ns OUTPUT DISABLE tPZL tPLZ tPLH FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 6ns 90% 50% tTLH 1.3V 10% tPLH tPHL GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL OUTPUT DISABLE tf = 6ns tr = 6ns 90% tPZH 1.3V OUTPUTS DISABLED OUTPUTS ENABLED FIGURE 4. HCT THREE-STATE PROPAGATION DELAY WAVEFORM 6 CD54/74HC240, CD54/74HCT240, CD74HC241, CD54/74HCT241, CD54/74HC244, CD54/74HCT244 Test Circuits and Waveforms OTHER INPUTS TIED HIGH OR LOW OUTPUT DISABLE (Continued) IC WITH THREESTATE OUTPUT OUTPUT RL = 1kΩ CL 50pF VCC FOR tPLZ AND tPZL GND FOR tPHZ AND tPZH NOTE: Open drain waveforms tPLZ and tPZL are the same as those for three-state shown on the left. The test circuit is Output RL = 1kΩ to VCC, CL = 50pF. FIGURE 5. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT 7 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD54HC240F3A ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CD54HC244F ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) CD54HC244F3A ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CD54HCT240F3A ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CD54HCT241F3A ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CD54HCT244F ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CD54HCT244F3A ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type CD74HC240E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC240EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC240M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC240M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC240M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC240M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC240ME4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC240MG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC241E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC241EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC241M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC241M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC241M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC241M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC241ME4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC241MG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC244E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC244EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC244M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC244M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC244M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD74HC244M96G4 ACTIVE SOIC DW 20 CD74HC244ME4 ACTIVE SOIC DW 20 25 CD74HC244MG4 ACTIVE SOIC DW 20 CD74HCT240E ACTIVE PDIP N CD74HCT240EE4 ACTIVE PDIP CD74HCT240M ACTIVE CD74HCT240M96 Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT240M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT240M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT240ME4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT240MG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT240PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT240PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT240PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT240PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT240PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT240PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT240PWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT240PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT240PWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT241E ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT241EE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT241M ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT241M96 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT241M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD74HCT241M96G4 ACTIVE SOIC DW 20 CD74HCT241ME4 ACTIVE SOIC DW 20 25 CD74HCT241MG4 ACTIVE SOIC DW 20 CD74HCT244E ACTIVE PDIP N CD74HCT244EE4 ACTIVE PDIP CD74HCT244M ACTIVE CD74HCT244M96 2000 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT244M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT244M96G4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT244ME4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT244MG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74HC240M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CD74HC241M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CD74HC244M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CD74HCT240M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CD74HCT240PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 CD74HCT241M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CD74HCT244M96 SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC240M96 SOIC DW 20 2000 346.0 346.0 41.0 CD74HC241M96 SOIC DW 20 2000 346.0 346.0 41.0 CD74HC244M96 SOIC DW 20 2000 346.0 346.0 41.0 CD74HCT240M96 SOIC DW 20 2000 346.0 346.0 41.0 CD74HCT240PWR TSSOP PW 20 2000 346.0 346.0 33.0 CD74HCT241M96 SOIC DW 20 2000 346.0 346.0 41.0 CD74HCT244M96 SOIC DW 20 2000 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. 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