SAMSUNG CIH05T47NS

Ver 201207
Multilayer High Frequency inductor
CIH05T Series (1005/ EIA 0402)
APPLICATION
Mobile communication systems, noise suppression
at high frequency and Impedance matching.
FEATURES
RECOMMENDED LAND PATTERN
 Lowest value of specific resistivity, good property of Q
and high SRF.
 Possible to use at range above 100MHz
 Monolithic structure for high reliability.
 Do not contain lead and support lead-free soldering.
 RoHS compliant
0.45~
0.45~0.55mm
0.55mm
1.25~1.55mm
DIMENSION
Type
05
Dimension [mm]
L
W
t
d
1.0±0.05 0.5±0.05 0.5±0.05. 0.25±0.1
DESCRIPTION
Inductance
Part No.
Q (typical.)
Q
(nH)
(min)
500
800
@100MHz
100MHz
MHz
MHz
CIH05T1N0□
1.0±0.2nH,0.3nH
8
23
29
CIH05T1N2□
1.2±0.2nH,0.3nH
8
23
29
48
CIH05T1N5□
1.5±0.2nH,0.3nH
8
23
29
47
CIH05T1N8□
1.8±0.2nH,0.3nH
8
20
26
41
CIH05T2N0□
2.0±0.2nH,0.3nH
8
22
27
CIH05T2N2□
2.2±0.2nH,0.3nH
8
22
SRF
(MHz)
DC resistance
(Ω) Max.
Rated
current
1.8GHz
2.0GHz
2.4GHz
48
50
56
10000
0.12
300
50
56
10000
0.12
300
50
56
6000
0.13
300
43
49
6000
0.14
300
44
47
52
6000
0.16
300
27
44
47
52
6000
0.16
300
Min
(mA) Max.
CIH05T2N4□
2.4±0.2nH,0.3nH
8
22
27
44
47
52
6000
0.16
300
CIH05T2N7□
2.7±0.2nH,0.3nH
8
22
27
43
45
50
6000
0.17
300
CIH05T3N0□
3.0± 0.2nH,0.3nH
8
24
30
46
48
53
6000
0.19
300
CIH05T3N3□
3.3±0.2nH,0.3nH
8
24
30
46
48
53
6000
0.19
300
CIH05T3N6□
3.6±0.2nH,0.3nH
8
24
30
46
48
53
6000
0.19
300
CIH05T3N9□
3.9±0.2nH,0.3nH
8
22
28
43
45
50
4000
0.22
300
CIH05T4N3□
4.3±0.2nH,0.3nH
8
22
28
43
45
50
4000
0.24
300
CIH05T4N7□
4.7±0.2nH,0.3nH
8
23
30
45
47
50
4000
0.24
300
CIH05T5N1□
5.1±0.2nH,0.3nH
8
22
28
42
43
45
4000
0.27
300
CIH05T5N6□
5.6±0.2nH,0.3nH
8
22
28
42
43
45
4000
0.27
300
CIH05T6N2□
6.2±0.2nH,0.3nH
8
22
28
40
41
41
3900
0.32
300
CIH05T6N8□
6.8±5%, 10%
8
22
28
40
41
41
3900
0.32
300
CIH05T7N5□
7.5±5%, 10%
8
22
28
38
38
36
3600
0.37
300
CIH05T8N2□
8.2±5%, 10%
8
22
28
38
38
36
3600
0.37
300
CIH05T9N1□
9.1±5%, 10%
8
22
28
37
36
31
3200
0.42
300
CIH05T10N□
10.0±5%, 10%
8
22
28
37
36
31
3200
0.42
300
Ver 201207
Q (typical.)
Inductance
Q
(nH)
(min)
500
800
@100MHz
100MHz
MHz
MHz
CIH05T12N□
12.0±5%, 10%
8
22
28
33
31
23
2700
0.50
300
CIH05T15N□
15.0±5%, 10%
8
22
28
29
26
17
2300
0.55
300
CIH05T18N□
18.0±5%, 10%
8
23
28
26
22
11
2100
0.65
250
CIH05T22N□
22.0±5%, 10%
8
22
27
21
14
2
1900
0.80
250
CIH05T27N□
27.0±5%, 10%
8
20
23
10
3
-
1600
0.90
250
CIH05T33N□
33.0±5%, 10%
8
20
23
3
-
-
1300
1.00
250
CIH05T39N□
39.0±5%, 10%
8
20
21
-
-
-
1200
1.20
200
CIH05T47N□
47.0±5%, 10%
8
19
20
-
-
-
1000
1.30
200
CIH05T56N□
56.0±5%, 10%
8
19
18
-
-
-
750
1.40
180
CIH05T68N□
68.0±5%, 10%
8
17
15
-
-
-
750
1.40
180
CIH05T82N□
82.0±5%, 10%
8
16
11
-
-
-
600
1.60
150
CIH05TR10□
100.0±5%, 10%
8
15
9
-
-
-
600
1.60
130
Part No.
SRF
1.8GHz 2.0GHz 2.4GHz
(MHz)
Min
DC resistance
(Ω) Max.
Rated
current
(mA) Max.
*Operating temperature range –55 to +125°C
※Tolerance (C :±0.2nH, S :±0.3nH, J :±5%, K :±10%)
※Measurement equipment & Jig: Agilent E4991A+16192A or Equivalent
※ The Rated Current is either the DC value at witch the internal Ls value is decreased within 5%
with the application
of DC_Current, or the value of current at which the temperature of the element is increased within 20℃
(Reference ambient temperature:20℃)
PRODUCT IDENTIFICATION
CI H
(1) (2)
(1)
(3)
(5)
(7)
(8)
05
(3)
T
(4)
10N
(5)
J N C
(6) (7) (8)
Chip Inductor
(2) H:High frequency type
Dimension
(4) Material code(T:Dielectric material)
Inductance(4N7:4.7nH, 10N:10nH, R10:100nH)
(6) Tolerance(C:±0.2nH, S:±0.3nH, J:±5%, K:±10%)
Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
Packaging(C:paper tape, E:embossed tape)
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
FLOW SOLDERING
Ver 201207
PACKAGING
Packaging Style
Quantity(pcs/reel)
Card Board Taping
10,000
■ NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.