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2002 California Micro Devices Corp. All rights reserved.
12/13/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
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2002 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
12/13/02
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2002 California Micro Devices Corp. All rights reserved.
12/13/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
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2002 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
12/13/02
%'%
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41
Power Supply Ripple Rejection
Power Supply Ripple Rejection
80
100uA
60
1mA
40
10mA
VIN = 3.8V, VOUT = 2.8V
COUT = 10uF Cer.
CBYP = 0.01uF
20
150mA
RIPPLE REJECTION [dB]
RIPPLE REJECTION [dB]
80
100uA
60
150mA
40
1mA
0
100000
10000
FREQUENCY [Hz]
Power Supply Ripple Rejection
Power Supply Ripple Rejection
Vs. Voltage Drop (1kHz)
80
60
100uA
150mA
40
1mA
VIN = 3.8V, VOUT = 2.8V
COUT = 1uF Cer.
NO BYP CAP
10mA
RIPPLE REJECTION [dB]
80
20
1000
100
100000
10000
1000
100
10
FREQUENCY [Hz]
10
0
RIPPLE REJECTION [dB]
10mA
VIN = 3.8V, VOUT = 2.8V
COUT = 1uF Cer.
CBYP = 0.01uF
20
0
100000
10000
1000
100
10
FREQUENCY [Hz]
1mA 100uA
60
40
10mA
100mA
20
150mA
0
0.00
0.25
0.50
0.75
1.00
1.25
1.50
DROPOUT VOLTAGE [V]
Noise Performance
Noise Performance
2002 California Micro Devices Corp. All rights reserved.
12/13/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
5
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9
41
Ground Current vs. Input (5mA Load)
Ground Current vs. Load (VIN = 3.8V)
100
GROUND CURRENT [uA]
GROUND CURRENT [uA]
80
70
60
50
40
30
20
10
75
50
25
0
0
0
1
2
3
4
5
0
6
INPUT VOLTAGE [V]
Load Regulation (VIN = 3.8V)
250
DROPOUT VOLTAGE [mV]
2.81
VOUT[V]
200
Dropout Voltage vs. Load Current (VOUT = 2.7V)
2.82
2.80
2.79
200
150
100
50
0
2.78
0
50
100
150
LOAD CURRENT [mA]
0
200
50
100
150
200
LOAD CURRENT [mA]
Line Regulation (5mA Load)
Foldback Current Limiting (VIN = 3.8V)
2.9
4.0
OUTPUT VOLTAGE [V]
OUTPUT VOLTAGE [V]
50
100
150
LOAD CURRENT [mA]
2.8
2.7
2.6
3.0
2.0
1.0
0.0
2.5
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
INPUT VOLTAGE [V]
0
100
200
300
400
500
LOAD CURRENT [mA]
2002 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
12/13/02
%'%
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41
Load transient (10% to 100%) Step Response
Enable Response (CBYP = 10nF)
Line Transient (1Vpp) Step Response
Disable Response (CBYP = 10nF)
2002 California Micro Devices Corp. All rights reserved.
12/13/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
7
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&&
TJUNC = TAMB + PD ∗ (θJC) + PD ∗ (θCA)
= TAMB + PD ∗ (θJA)
Output Voltage Change vs. Temperature (1mA Load)
50
40
OUTPUT CHANGE [mV]
The overall junction to ambient thermal resistance
(θJA) for device power dissipation (PD) consists primarily of two paths in series. The first path is the junction
to the case (θJC) which is defined by the package style,
and the second path is case to ambient (θCA) thermal
resistance which is dependent on board layout. The
final operating junction temperature for any set of conditions can be estimated by the following thermal equation:
30
20
10
0
-10
-20
-30
-40
-50
The CM3014 uses a SOT23-5 package. When this
package is mounted on a double-sided printed circuit
board with two square inches of copper allocated for
"heat spreading", the resulting θJA is 175°C/W.
-50
0
25
50
75
100 125
TEMPERATURE [oC]
Based on a maximum power dissipation of 320mW
(Load x Vin-Vout = 150mA x 2.2V) with an ambient of
70°C the resulting junction temperature will be:
Ground Current vs. Temperature
100
GROUND CURRENT [uA]
TJUNC = TAMB + PD ∗ (θJA)
= 70°C + 315mW ∗ (175°C/W)
= 70°C + 57.75°C = 127.75°C
()
) '
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Measurements showing performance up to a junction
temperature of 125°C were performed under light load
conditions (1mA). This allows the ambient temperature
to be representative of the internal junction temperature.
Note: The use of multi-layer board construction with
separate ground and power planes will further enhance
the overall thermal performance. In the event of no
copper area being dedicated for heat spreading, a
multi-layer board construction using only the minimum
size pad layout will typically provide the CM3014 with
an overall θJA of 175°C/W, which allows up to 450mW
to be dissipated safely.
-25
80
60
40
20
0
0
25
50
75
100
125
o
JUNCTION TEMPERATURE [ C]
7
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9 2002 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
12/13/02
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2002 California Micro Devices Corp. All rights reserved.
12/13/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲ Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
9
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2002 California Micro Devices Corp. All rights reserved.
10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846
▲
www.calmicro.com
12/13/02