COMCHIP CPDZ3V3U-HF

SMD ESD Protection Diode
CPDZ3V3U-HF
RoHS Device
Halogen Free
Features
0201/DFN0603
- Uni-directional ESD protection.
0.026(0.670)
0.022(0.570)
- Surface mount package.
- Ultra small SMD package:0201
- High component density.
0.015(0.370)
0.011(0.270)
- Low clamping voltage.
- Low leakage.
Mechanical data
0.013(0.335)
0.010(0.265)
- Case: 0201/DFN0603 package,
molded plastic.
0.007(0.175)
0.004(0.105)
0.012(0.285)
0.008(0.215)
- Terminals: Gold plated, solderable per
MIL-STD-750, method 2026.
- Polarity: Color band denotes cathode end.
0.011(0.285)
0.008(0.215)
- Mounting position: Any
Dimensions in inches and (millimeter)
Circuit diagram
Maximum Rating AND Electrical Characteristics
(at TA=25°C unless otherwise noted)
Parameter
Conditions
Symbol Min Typ Max Unit
Reverse stand-off voltage
VRWM
3.3
V
6.7
V
Breakdown voltage
IR = 1mA
VBR
Forward voltage
I F = 10 mA
VF
1.2
V
Leakage current
VR = 3.3V
IL
0.1
uA
Junction capacitance
VR = 0V, f=1MHZ
CT
5.7
6.2
IEC 61000-4-2(air)
ESD capability
IEC 61000-4-2(contact)
Clamping voltage
Peak pulse power
ESD
IPP = 1A,TP=8/20us
IPP = 6.5A,TP=8/20us
TP=8/20us
pF
35
VC
PPP
30
kV
30
kV
7.5
V
10.6
V
70
W
Operation temperature
TOP
-40
125
°C
Storage temperature
TSTG
-55
150
°C
Company reserves the right to improve product design , functions and reliability without notice.
REV: B
Page 1
QW-JP027
Comchip Technology CO., LTD.
SMD ESD Protection Diode
RATING AND CHARACTERISTIC CURVES (CPDZ3V3U-HF)
Fig.1 - 8/20us Peak Pulse Current
Waveform Acc. IEC 6100-4-5
120%
Percentage of Ipp
100%
Peak Valur Ipp
e-t
80%
60%
40%
120
Test Waveform
parameters
tf=8us
td=20us
Mounting on glass epoxy PCBs
100
Power Rating, (%)
Ta=25°C
Fig.2 - Power Rating Derating Curve
td= t Ipp/2
80
60
40
20
20%
0
0%
0
5
10
15
20
25
30
0
25
50
Time, (us)
100
125
150
Ambient Temperature, ( °C )
Fig.3 - Clamping Voltage Vs.
Peak Pulse Current
Fig.4 - Reverse Characteristics
1.00
11.0
8/20us waveform
Reverse Current, (uA)
Clamping Voltage,VC (V)
75
10.0
9.0
8.0
7.0
1.0
0.10
50°C
75°C
100°C
125°C
150°C
0.01
25°C
0.001
3.0
2.0
4.0
5.0
6.0
7.0
0
Peak Pulse Current, IPP (A)
1
2
3
4
5
Reverse Voltage, (V)
Fig.5 - Capacitance Between
Terminals Characteristics
Capacitance Between Terminals, (PF)
35.0
f=1MHz
TA=25°C
30.0
25.0
20.0
0
1
2
3
4
Reverse Voltage, (V)
Company reserves the right to improve product design , functions and reliability without notice.
REV: B
Page 2
QW-JP027
Comchip Technology CO., LTD.
SMD ESD Protection Diode
Reel Taping Specification
d
P0
P1
T
E
F
W
B
A
C
P
12
o
0
D2
D1 D
W1
Trailer
Device
.......
.......
End
.......
.......
Leader
.......
.......
.......
.......
10 pitches (min)
Start
10 pitches (min)
Direction of Feed
0201
(DFN0603)
0201
(DFN0603)
SYMBOL
A
B
C
d
D
D1
D2
(mm)
0.39 +0.03/-0.02
0.72 ± 0.03
0.36 ± 0.03
1.50 + 0.10
178 ± 1.00
54.4 ± 0.40
13.0 ± 0.20
(inch)
0.015 +0.001/0.001
0.028 ± 0.001
0.014 ± 0.001
0.059 + 0.004
7.008 ± 0.039
2.142 ± 0.016
0.512 ± 0.008
SYMBOL
E
F
P
P0
P1
T
W
W1
(mm)
1.75 ± 0.10
3.50 ± 0.05
2.00 ± 0.05
4.00 ± 0.05
2.00 ± 0.05
0.23 ± 0.05
8.00 ± 0.10
12.30 ± 0.10
(inch)
0.069 ± 0.004 0.138 ± 0.002 0.079 ± 0.004 0.157 ± 0.004 0.079 ± 0.004 0.009 ± 0.002 0.315 ± 0.008 0.484 ± 0.004
Company reserves the right to improve product design , functions and reliability without notice.
REV: B
Page 3
QW-JP027
Comchip Technology CO., LTD.
Comchip
SMD ESD Protection Diode
SMD Diode Specialist
Marking Code
Part Number
Marking Code
CPDZ3V3U-HF
C
C
Suggested PAD Layout
0201(DFN0603)
E
SIZE
(mm)
(inch)
A
0.310
0.122
B
0.200
0.079
C
0.350
0.014
D
C
B
D
0.150
0.006
E
0.365
0.014
A
Standard Packaging
Case Type
0201(DFN0603)
Qty Per Reel
Reel Size
(Pcs)
(inch)
8,000
7
Company reserves the right to improve product design , functions and reliability without notice.
QW-JP027
REV: B
Page 4