MATERIAL DECLARATION SHEET Material Number CRL0805 Product Line Chip Resistor Compliance Date 04-01-2003 RoHS Compliant YES No. 1 2 Construction Element(subpart) Ceramic Substrate Conductor Layer MSL Homogeneous Material Alumina 1 Material weight [mg] 3.81944 Glass 0.08224 Homogeneous Material\ Substances Aluminum oxide Silicon dioxide Silver Bismuth trioxide Barium oxide Silicon dioxide Boron oxide Resistive Element Glass 0.04328 4 5 Over Coating Marking Epoxy Epoxy 0.0665 0.00361 6 End Terminal NI-CR 0.00337 7 8 Nickel underplate Matte tin plating Nickel Tin Total weight 0.14111 0.12589 4.28544 This Document was updated on: if applicable Materials Mass % 1344-28-1 14808-60-7 7440-22-4 1304-76-3 1304-28-5 7631-86-9 1303-86-2 Silver Palladium 12036-10-1 7440-22-4 7440-05-3 Lead oxide (Glass) 1317-36-8 Epoxy Epoxy Nickel Chromium III Nickel Tin 29690-82-2 25068-38-6 7440-02-0 7440-47-3 7440-02-0 7440-31-5 Ruthenium dioxide 3 CASRN 96% 4% 96% 1% 1% 1% 1% 25% 40% 15% 20% 100% 100% 80% 20% 100% 100% Material Mass % of total unit wt. 85.56% 3.57% 1.82% 0.025% 0.025% 0.025% 0.025% 0.25% 0.40% 0.15% 0.20% 1.55% 0.08% 0.06% 0.02% 3.29% 2.94% Subpart mass of total wt. (%) 85.93% 2.31% 1.32% 1.57% 0.16% 0.13% 4.54% 4.04% 10.26.2010 Important remarks: 1. 2. It is the responsibility of the user to verify they are accessing the latest version. RoHS exemption: 7(c)-I Electrical and electronic components containing lead in a glass or ceramic... Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1