CRY62~CRZ47 TOSHIBA Zener Diode Silicon Epitaxial Type CRY62~CRZ47 Use in Communication, Automation and Measurement Equipment Constant Voltage Regulation Transient Suppressors Unit: mm l Average power dissipation: P = 0.7 W l Zener voltage: VZ = 6.2~47 V l Suitable for compact assembly due to small surface-mount package “S−FLATTM” (Toshiba package name) Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Power dissipation P 700 mW Junction temperature Tj −40 ~ 150 °C Tstg −40 ~ 150 °C Storage temperature range Standard Soldering Pad JEDEC ― JEITA ― TOSHIBA Unit: mm 3-2A1A Weight: 0.013 g (typ.) 1.2 1.2 2.8 1 2002-08-29 CRY62~CRZ47 Marking Following Indicates the Date of Manufacture CRY62~CRY91 Lot No. 6 2 Month of manufacture January to December are denoted by letter A to L respectively. Year of manufacture Last decimal digit of the year of manufacture 0 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 7 8 9 Type Code (e.g., CRY62) Cathode mark CRZ10~CRZ47 Lot No. 10 Month of manufacture January to December are denoted by letter A to L respectively. Year of manufacture Last decimal digit of the year of manufacture Type Code (e.g., CRZ10) Cathode mark 2 2002-08-29 CRY62~CRZ47 Electrical Characteristics (Ta = 25°C) Zener Impedance Zener Voltage Product No. VZ (V) Measurement Current IZ (mA) rd (Ω) Max Measurement Current IZ (mA) Temperature Coefficient of Zener Voltage αT (mV / °C) Forward Voltage VF (V) Measure -ment Current IF (A) Reverse Current IR (µA) Typ. Max Max 10 2 3 1.0 0.2 10 3.0 60 10 3 4 1.0 0.2 10 3.0 10 30 10 4 5 1.0 0.2 10 4.5 9.0 10 30 10 4 6 1.0 0.2 10 4.9 9.1 10.0 10 30 10 5 8 1.0 0.2 10 5.5 9.0 10.0 11.0 10 30 10 6 9 1.0 0.2 10 6.0 CRZ11 9.9 11.0 12.1 10 30 10 7 11 1.0 0.2 10 7.0 CRZ12 10.8 12.0 13.2 10 30 10 8 13 1.0 0.2 10 8.0 CRZ13 11.7 13.0 14.3 10 30 10 9 14 1.0 0.2 10 9.0 CRZ15 13.5 15.0 16.5 10 30 10 11 17 1.0 0.2 10 10.0 CRZ16 14.4 16.0 17.6 10 30 10 12 19 1.0 0.2 10 11.0 CRZ18 16.2 18.0 19.8 10 30 10 14 23 1.0 0.2 10 13.0 CRZ20 18.0 20.0 22.0 10 30 10 16 26 1.0 0.2 10 14.0 CRZ22 19.8 22.0 24.2 10 30 10 18 28 1.0 0.2 10 16.0 CRZ24 21.6 24.0 26.4 10 30 10 20 32 1.0 0.2 10 17.0 CRZ27 24.3 27.0 29.7 10 30 10 23 36 1.0 0.2 10 19.0 CRZ30 27.0 30.0 33.0 10 30 10 25 40 1.0 0.2 10 21.0 CRZ33 29.7 33.0 36.3 10 30 10 26 41 1.0 0.2 10 26.4 CRZ36 32.4 36.0 39.6 9 30 9 28 45 1.0 0.2 10 28.8 CRZ39 35.1 39.0 42.9 8 35 8 30 48 1.0 0.2 10 31.2 CRZ43 38.7 43.0 47.3 7 40 7 33 53 1.0 0.2 10 34.4 CRZ47 42.3 47.0 51.7 6 65 6 38 60 1.0 0.2 10 37.6 Min Typ. Max CRY62 5.6 6.2 6.8 10 60 CRY68 6.2 6.8 7.4 10 CRY75 6.8 7.5 8.3 CRY82 7.4 8.2 CRY91 8.2 CRZ10 3 Max Measurement Voltage VR (V) 2002-08-29 CRY62~CRZ47 PRSM – tW Ta max – P Device mounted on a glass-epoxy board Soldering land: 6 mm ´ 6 mm Maximum allowable ambient temperature Ta max (°C) 140 120 100 80 60 40 20 1000 Non-repetitive peak reverse power dissipation PRSM (W) 160 300 tW Rectangular pulse Ta = 25°C 100 Recommended 50 30 10 5 3 0.01 0 0 0.2 0.4 0.6 0.8 Power dissipation P 0.03 1.0 =T – VZ 0.1 0.3 Pulse width tW (W) 1 3 10 (ms) =T – VZ (typ.) 25 (typ.) 40 CRY62~CRZ27 CRZ30~CRZ47 Temperature coefficient of zenner voltage =T (mV/°C) Temperature coefficient of zenner voltage =T (mV/°C) PRSM 500 20 15 10 5 0 0 4 8 12 16 20 24 35 30 25 26 28 Zenner voltage VZ (V) 30 34 38 42 46 50 Zenner voltage VZ (V) rth (j-a) – t Transient thermal impendance rth (j-a) (°C/W) 10000 (1) Device mounted on a ceramic board Soldering land: 2 mm ´ 2 mm 1000 (2) Device mounted on a glass-epoxy board Soldering land: 6 mm ´ 6 mm 100 (2) (1) 10 1 0.001 0.01 0.1 Time t 1 10 100 (s) 4 2002-08-29 CRY62~CRZ47 RESTRICTIONS ON PRODUCT USE 000707EAA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 5 2002-08-29