CRY62~CRZ47 TOSHIBA Zener Diode Silicon Epitaxial Type CRY62~CRZ47 Applications: Communication, Control and Unit: mm 削除: Automation Measurement Equipment Constant Voltage Regulation Transient Suppressors z Average power dissipation: P = 0.7 W z Zener voltage: VZ = 6.2~47 V z Suitable for compact assembly due to small surface-mount package “S−FLATTM” (Toshiba package name) Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Power dissipation P 700 mW Junction temperature Tj −40 ~ 150 °C Tstg −40 ~ 150 °C Storage temperature range 削除: Use in JEDEC ― JEITA ― Note: Using continuously under heavy loads (e.g. the application of high TOSHIBA 3-2A1A temperature/current/voltage and the significant change in Weight: 0.013 g (typ.) temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Standard Soldering Pad Unit: mm 1.2 1.2 2.8 1 2006-11-09 CRY62~CRZ47 Electrical Characteristics (Ta = 25°C) Zener Impedance Zener Voltage Product No. VZ (V) Measurement Current IZ (mA) rd (Ω) Min Typ. Max CRY62 5.6 6.2 6.8 10 60 CRY68 6.2 6.8 7.4 10 60 CRY75 6.8 7.5 8.3 10 CRY82 7.4 8.2 9.0 CRY91 8.2 9.1 10.0 CRZ10 9.0 10.0 11.0 Max Measurement Current IZ (mA) Temperature Coefficient of Zener Voltage αT (mV / °C) Forward Voltage VF (V) Measure -ment Current IF (A) Reverse Current IR (μA) Max Measurement Voltage VR (V) Typ. Max Max 10 2 3 1.0 0.2 10 3.0 10 3 4 1.0 0.2 10 3.0 30 10 4 5 1.0 0.2 10 4.5 10 30 10 4 6 1.0 0.2 10 4.9 10 30 10 5 8 1.0 0.2 10 5.5 10 30 10 6 9 1.0 0.2 10 6.0 CRZ11 9.9 11.0 12.1 10 30 10 7 11 1.0 0.2 10 7.0 CRZ12 10.8 12.0 13.2 10 30 10 8 13 1.0 0.2 10 8.0 CRZ13 11.7 13.0 14.3 10 30 10 9 14 1.0 0.2 10 9.0 CRZ15 13.5 15.0 16.5 10 30 10 11 17 1.0 0.2 10 10.0 CRZ16 14.4 16.0 17.6 10 30 10 12 19 1.0 0.2 10 11.0 CRZ18 16.2 18.0 19.8 10 30 10 14 23 1.0 0.2 10 13.0 CRZ20 18.0 20.0 22.0 10 30 10 16 26 1.0 0.2 10 14.0 CRZ22 19.8 22.0 24.2 10 30 10 18 28 1.0 0.2 10 16.0 CRZ24 21.6 24.0 26.4 10 30 10 20 32 1.0 0.2 10 17.0 CRZ27 24.3 27.0 29.7 10 30 10 23 36 1.0 0.2 10 19.0 CRZ30 27.0 30.0 33.0 10 30 10 25 40 1.0 0.2 10 21.0 CRZ33 29.7 33.0 36.3 10 30 10 26 41 1.0 0.2 10 26.4 CRZ36 32.4 36.0 39.6 9 30 9 28 45 1.0 0.2 10 28.8 CRZ39 35.1 39.0 42.9 8 35 8 30 48 1.0 0.2 10 31.2 CRZ43 38.7 43.0 47.3 7 40 7 33 53 1.0 0.2 10 34.4 CRZ47 42.3 47.0 51.7 6 65 6 38 60 1.0 0.2 10 37.6 2 2006-11-09 CRY62~CRZ47 Marking Abbreviation Code Part No. 6□2 CRY62 6□8 CRY68 7□5 CRY75 8□2 CRY82 9□1 CRY91 □10 CRZ10 □11 CRZ11 □12 CRZ12 □13 CRZ13 □15 CRZ15 □16 CRZ16 □18 CRZ18 □20 CRZ20 □22 CRZ22 □24 CRZ24 □27 CRZ27 □30 CRZ30 □33 CRZ33 □36 CRZ36 □39 CRZ39 □43 CRZ43 □47 CRZ47 Handling Precaution The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend when you design a circuit with a device. P: We recommend that the worst case power dissipation be no greater than 50% of the absolute maximum rating of power dissipation. Carry out adequate heat design. PRSM: We recommend that a device be used within the recommended area in the figure, PRSM-tw. Tj: Derate this rating when using a device in order to ensure high reliability. We recommend that the device be used at a Tj of below 120°C. Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. 3 2006-11-09 CRY62~CRZ47 Ta max – P 140 Maximum allowable ambient temperature Ta max (°C) PRSM – tW Device mounted on a glass-epoxy board Soldering land: 6 mm × 6 mm 120 100 80 60 40 20 1000 Non-repetitive peak reverse power dissipation PRSM (W) 160 300 tW Rectangular pulse Ta = 25°C 100 Recommended 50 30 10 5 3 0.01 0 0 0.2 0.4 0.6 Power dissipation 0.8 P 0.03 1.0 0.1 0.3 Pulse width (W) αT – VZ 1 tW 3 10 (ms) αT – VZ (typ.) (typ.) 40 25 CRY62~CRZ27 CRZ30~CRZ47 Temperature coefficient of zenner voltage αT (mV/°C) Temperature coefficient of zenner voltage αT (mV/°C) PRSM 500 20 15 10 5 0 0 4 8 12 16 Zenner voltage 20 VZ 24 35 30 25 26 28 (V) 30 34 38 Zenner voltage 42 VZ 46 50 (V) rth (j-a) – t Transient thermal impedance rth (j-a) (°C/W) 10000 (1) Device mounted on a ceramic board Soldering land: 2 mm × 2 mm 1000 (2) Device mounted on a glass-epoxy board Soldering land: 6 mm × 6 mm 削除: n 100 (2) (1) 10 1 0.001 0.01 0.1 Time 1 t 10 100 (s) 4 2006-11-09 CRY62~CRZ47 RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 2006-11-09