CSPST CALIFORNIA MICRO DEVICES Chip Scale Series Termination Array Features Applications • 8 or 16 integrated high frequency series terminations • Series resistive bus termination • Isolated resistor array • Ultra small footprint Chip Scale Package • Ceramic substrate • 0.35mm Eutectic Solder Bumps, 0.65mm pitch Product Description The CSPST is a high performance Integrated Passive Device (IPD) which provides series terminations suitable for use in high speed bus applications. Eight (8) or sixteen (16) series termination versions are provided. These resistors provide excellent high frequency performance in excess of 3GHz and are manufactured to an absolute tolerance as low as ±1%. The Chip Scale Package provides an ultra small footprint for this IPD and provides minimal parasitics compared to conventional packaging. Typical bump inductance is less than 25pH. The large solder bumps and ceramic substrate allow for standard attachment to laminate printed circuit boards without the use of underfill. SCHEMATIC DIAGRAMS D D R1 R1 R1 R1 R1 C C B B R1 R1 R1 R1 R1 R1 A R1 R1 R1 R1 R1 R1 R1 R1 R1 R1 R1 R1 R1 A 1 2 3 4 1 2 3 4 5 6 7 8 CSPST16 CSPST08 S TA N D A R D VA L U E S Re s i s t o r Va l u e R1 = 22Ω, 33Ω, 39Ω, 4 7 Ω, 51Ω, 56Ω, Ab s o l u t e To l e r a n c e R ± 1 %, ± 5 % TCR of Resi st or s ±100ppm Powe r Ra t i n g / Re s i s t o r 1 0 0 mW Op e r a t i n g Te mp e r a t u r e Ra n g e –40°C to 85°C C1300700 © 2000 California Micro Devices Corp. All rights reserved. 11/10/2000 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 1 CSPST CALIFORNIA MICRO DEVICES Package Diagram (Bumps Up View) 2.3968mmmm 0.65 mm 0.2234mm D 0.65 mm C 2.3968mm B A 0.35mm Dia. Bumps 1 2 3 4 0.381mm 0.643mm CSPST08 4.9968mm 0.65 mm 0.2234mm D 0.65 mm C 2.3968mm B A 0.35mm Dia. Bumps 1 2 3 4 5 6 7 8 0.381mm 0.643mm CSPST16 P R I N T E D C I R C U I T B OA R D R E C O M M E N D AT I O N S Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening Solder Flux Ratio Solder Paste Bond Trace Finish 0.300mm Round Non Solder Mask Defined Pads (NSMD) 0.350mm 0.152mm 0.360mm (sq.) 50/50 No Clean OSP (Entek Cu Plus 106A) ©2000 California Micro Devices Corp. All rights reserved. 2 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 11/10/2000 CSPST CALIFORNIA MICRO DEVICES Typical PCB Routing Diagram (Bumps Down View) 1 8 A B C D Typical Solder Reflow Thermal Profile (No Clean Flux) 250 EXH 225 PH Z2 Z3 48 97 145 Z4 Z5 RF EXH CD Temperature (oC) 200 175 150 125 100 75 50 25 0 194 242 290 339 387 435 Time (s) © 2000 California Micro Devices Corp. All rights reserved. 11/10/2000 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 3 CSPST CALIFORNIA MICRO DEVICES S TA N D A R D PA R T O R D E R I N G I N F O R M AT I O N Package Style Ordering Part Number Terminations Tape & Reel Part Marking Chip Scale 8 CSPST08-220F None Chip Scale 8 CSPST08-220J None None Chip Scale 8 CSPST08-330F Chip Scale 8 CSPST08-330J None Chip Scale 8 CSPST08-390F None Chip Scale 8 CSPST08-390J None Chip Scale 8 CSPST08-470F None Chip Scale 8 CSPST08-470J None Chip Scale 8 CSPST08-510F None None Chip Scale 8 CSPST08-510J Chip Scale 8 CSPST08-560F None Chip Scale 8 CSPST08-560J None Chip Scale 16 CSPST16-220F None Chip Scale 16 CSPST16-220J None Chip Scale 16 CSPST16-330F None Chip Scale 16 CSPST16-330J None None Chip Scale 16 CSPST16-390F Chip Scale 16 CSPST16-390J None Chip Scale 16 CSPST16-470F None Chip Scale 16 CSPST16-470J None Chip Scale 16 CSPST16-510F None Chip Scale 16 CSPST16-510J None Chip Scale 16 CSPST16-560F None Chip Scale 16 CSPST16-560J None Part Series Terminations Value Code: R1 (XXX) Tolerance Example (CSPST) (8) (J) CSPST 8 CSPST 16 (201) First 2 digits are significant value. Third digit represents number of zeros to follow PA C K AG E N O N - S TA N D A R D PA R T O R D E R I N G I N F O R M AT I O N F = ±1% J = ±5% PART NUMBER KEY CSP ST YY XXX T PACKAGE TYPE APPLICATION Number of Terminations Resistor Value Code CSP = Chip Scale Package Series Termination 08 = 8 16 = 16 R1 Value First 2 digits are significant value. 3rd digit represents number of zeros Tolerance F = ±1% J = ±5% ©2000 California Micro Devices Corp. All rights reserved. 4 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com 11/10/2000