Murata CSTCW X11 Ceramic resonators (ceralock) Datasheet

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Ceramic Resonators
(CERALOCKr)
Cat.No.P16E-22
P16E.pdf
Nov.22,2012
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
EU RoHS Compliant
s
s
s
All the products in this catalog comply with EU RoHS.
EU RoHS is "the European Directive 2011/65/EU on the Restriction of the Use
of Certain Hazardous Substances in Electrical and Electronic Equipment."
For more details, please refer to our website 'Murata's Approach for EU RoHS'
(http://www.murata.com/info/rohs.html).
P16E.pdf
Nov.22,2012
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
CONTENTS
Nov.22,2012
1
CERALOCKr, CERALOCK(R) and "CERALOCK" in this catalog are
the trademarks of Murata Manufacturing Co., Ltd.
Selection Guide
2
2
Part Numbering
1
MHz Chip Type -Tight Frequency Tolerance for AutomotiveApplication Circuits Utilization
3
4
6
3
2
MHz Chip Type -Standard Frequency Tolerance for AutomotiveApplication Circuits Utilization
7
11
Notice for Automotive
12
Packaging for Automotive
17
4
3
MHz Chip Type -Tight Frequency Tolerance for General UsageApplication Circuits Utilization
4
MHz Chip Type -Standard Frequency Tolerance for General UsageApplication Circuits Utilization
5
MHz Lead Type -Standard Frequency Tolerance for General UsageApplication Circuits Utilization
19
22
5
23
27
29
31
Notice for General Usage
MHz Chip Type
32
MHz Lead Type
37
Packaging for General Usage
MHz Chip Type
38
MHz Lead Type
41
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Selection Guide
Applications
Automotive
Consumer
Tight Tolerance
Standard Tolerance
SMD
SMD
CSTCR_G15C
CSTCC_G_A
4.00–7.99MHz
2.00–3.99MHz
CSTCE_G15C
CSTCR_G_B
8.00–13.99MHz
4.00–7.99MHz
CSTCE_V13C
CSTCE_G_A
14.00–20.00MHz
Tight Tolerance
Standard Tolerance
SMD
SMD
CSTCR_G15L
CSTCR_GH5L
4.00–7.99MHz
CSTCE_G15L
CSTCE_GH5L
8.00–13.99MHz
CSTCC_G
2.00–3.99MHz
CSTCR_G
4.00–7.99MHz
8.00–13.99MHz
CSTCE_V13L
CSTCE_VH3L
CSTCE_V_C
CSTCW_X11
CSTCE_V
14.00–20.00MHz
20.01–48.00MHz
14.00–20.00MHz
CSTCV_X_Q
20.01–70.00MHz
14.00–20.00MHz
CSTCE_G
8.00–13.99MHz
CSTCW_X
20.01–70.00MHz
CSACV_X_Q
CSACW_X
20.01–70.00MHz
(Two Terminals)
20.01–70.00MHz
(Two Terminals)
CSTCG_V
20.00–33.86MHz
Super Small!
Leaded
CSTLS_G
3.40–10.00MHz
CSTLS_X
16.00–70.00MHz
Notice: "CERALOCKr for consumer" and "CERALOCKr for automotive" is different in the specification of Operating Temperature Range, Environmental Characteristics,
Physical Characteristics and so on. Please choose either "for consumer" or "for automotive" according to the required specification.
2
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
o Part Numbering
CERALOCKr (MHz)
(Part Number)
CS
T
CE
16M0
q
w
e
r
3
***
-R0
t y u
i
o
V
5
qProduct ID
yInitial Frequency Tolerance
Product ID
CS
Ceramic Resonators
wFrequency/Capacitance
Code
Initial Frequency Tolerance
5
±0.5%
3
±0.3%
2
±0.2%
Code
Frequency/Capacitance
1
±0.1%
A
MHz with No Capacitance Built-in
H
±0.07%
T
MHz with Built-in Capacitance
uLoad Capacity
eStructure/Size
Code
Load Capacity
Code
Structure/Size
1
5/6pF
LS
Round Lead Type
2
10pF
CC
Cap Chip Type
3
15pF
CR/CE/CG
Small-cap Chip Type
4
22pF
CV
Monolithic Chip Type
5
30/33/39pF
CW
Small Monolithic Chip Type
6
47pF
rNominal Center Frequency
iIndividual Specification
Expressed by four-digit alphanumerics. The unit is in hertz (Hz).
Decimal point is expressed by capital letter "M."
tDesign
Code
Design
Gpp
Thickness Shear mode
T/Vpp
Thickness Expander mode
Xpp
Thickness Expander mode (3rd overtone)
pp indicates initial frequency tolerance and load capacity.
Code
Individual Specification
***
Three-digit alphanumerics express
"Individual Specification."
With standard products, "iIndividual Specification" and "oPackaging"
is omitted.
oPackaging
Code
Packaging
-B0
Bulk
-A0
Radial Taping H0=18mm
-R0
Plastic Taping ø=180mm
-R1
Plastic Taping ø=330mm
Radial taping is applied to lead type and plastic taping to chip type.
3
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Ceramic Resonators (CERALOCKr)
1
MHz Chip Type -Tight Frequency Tolerance for Automotive-
∗
0.2±0.2
0.6±0.05
1.1±0.1
4.1 max.
0.4 (ref.)
0.4 (ref.)
0.4 (ref.)
(3)
(2)
0.4±0.1
(1)
0.4±0.1
0.4±0.1
∗: EIAJ Monthly
CSTCR_G15C
4.00-7.99MHz
Code
0.75±0.1
c Features
1. The series are high accuracy resonators whose total
tolerance is available for less than ±3,000ppm.
2. The series has high reliability and is available
for a wide temperature range.
3. Oscillation circuits do not require external load
capacitors.
4. The series is available for a wide frequency range.
5. The resonators are extremely small and have a low
profile.
6. No adjustment is necessary for oscillation circuits.
1.5±0.1
1.5±0.1
(in mm)
∗
1.1 max.
1.3±0.15
0.10±0.10
3.2±0.15
0.4±0.1
0.1±0.1
0.70±0.10
3.0 max.
0.50 (ref.)
0.50 (ref.)
0.50 (ref.)
(3)
(2)
(1)
0.4±0.1 0.4±0.1 0.4±0.1
∗: EIAJ Monthly
CSTCE_G15C
8.00-13.99MHz
c Applications
Code
(in mm)
0.4±0.1
1. Cluster panel and Control panel
2. Safety control
(Anti-lock Brake System, Electronic Stability
Control, Airbag, etc.)
3. Engine ECU, Electronic Power Steering, Immobilizer,
etc.
4. Car Air conditioner, Power Window, Remote Keyless
Entry system, etc.
5. Intelligent Transportation System
(Lane Keeping System, Millimeter wave radar, etc.)
6. Battery control for hybrid cars
1.2±0.1 1.2±0.1
∗
1.1 max.
1.3±0.15
0.10±0.10
3.2±0.15
0.4±0.1
0.1±0.1
0.9±0.1
3.0 max.
0.5 (ref.)
0.5 (ref.)
0.5 (ref.)
(3)
(2)
(1)
0.4±0.1 0.4±0.1 0.4±0.1
∗: EIAJ Monthly
CSTCE_V13C
14.00-20.00MHz
Code
0.4±0.1
1.2±0.1 1.2±0.1
(in mm)
Oscillating
Frequency
(MHz)
Initial
Tolerance
Temperature Stability
(%)
Temperature
Range
(°C)
CSTCR_G15C
4.00 to 7.99
±0.1%
±0.13
-40 to 125
CSTCE_G15C
8.00 to 13.99
±0.1%
±0.13
-40 to 125
CSTCE_V13C
14.00 to 20.00
±0.1%
±0.13
-40 to 125
Part Number
Irregular or stopped oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.
4
1.4 max.
Chip type CERALOCK(R) with built-in load capacitors
provides high accuracy in an extremely small package.
MURATA's frequency adjustment and package technology
expertise has enabled the development of the chip
CERALOCK(R) with built-in load capacitors.
This diverse series owes its development to MURATA's
original mass production techniques and high reliability,
and has achieved importance in the worldwide automotive
market.
2.0±0.1
0.30±0.20
4.5±0.1
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
c Oscillation Frequency Measuring Circuit
1
VDD
5pF
To Frequency Counter
Rf
1MΩ
Rd
(1)
(3)
C1
C2
(2)
c Standard Land Pattern Dimensions
CSTCE_G15C
CSTCR_G15C
(* This Land Pattern is not common to CSTCR_G.)
0.4
0.4
1.1
1.1
0.4
0.8
0.4
0.8
0.4
2.6
1.90 ~ 2.10
0.4
1.2
1.5
1.5
1.2
Land Pattern
Land Pattern
(in mm)
(in mm)
c Oscillation Frequency Temperature Stability
CSTCE_V13C
(* This Land Pattern is not common to CSTCE_V.)
CSTCR_G15C
+0.2
0.4
0.8
0.4
Oscillating Frequency Shift (%)
0.8
1.90 ~ 2.10
0.4
1.2
1.2
+0.1
0
-0.1
Land Pattern
-0.2
-60
-40
-20
0
CSTCE_G15C
+60
+80
+100
+120
+140
+80
+100
+120
+140
+0.2
Oscillating Frequency Shift (%)
Oscillating Frequency Shift (%)
+40
CSTCE_V13C
+0.2
+0.1
0
-0.1
-0.2
-60
+20
Temperature (°C)
(in mm)
-40
-20
0
+20
+40
+60
Temperature (°C)
+80
+100
+120
+140
+0.1
0
-0.1
-0.2
-60
-40
-20
0
+20
+40
+60
Temperature (°C)
5
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Application Circuits Utilization
1
c TMP92CD54IF (Toshiba)
c MB90F387 (Fujitsu)
16-bit Microcomputer
Vcc3=3.3V
16-bit Microcomputer
Vcc5=5.0V
Vcc=5.0V
H2
H
0.1μF
H1
IC : TMP92CD54IF
74
72
IC : MB90F387
L
27
H1: 36, 68, 86
H2: 2, 4, 15, 40, 50, 61, 75
L: 1, 3, 13, 38, 51, 63, 73, 88
CERALOCKr
V1
V1
C2
H: 1, 2, 21, 22, 24
L: 20, 23, 25, 48
C2
CERALOCKr: CSTCE8M00G15Cpp-R0
C1=33pF (Typ.)
C2=33pF (Typ.)
c ST72F561 (HS) (ST Microelectronics)
8-bit Microcomputer
Vdd=5.0V
L
V2
C1
CERALOCKr: CSTCE10M0G15Cpp-R0
C1=33pF (Typ.)
C2=33pF (Typ.)
c MC68HC908AZ60AVFU (Freescale)
26
0.1μF
V2
C1
28
CERALOCKr
8-bit Microcomputer
Vdd=5.0V
H
60
EVALUATION BOARD
IC : MC68HC908AZ60AVFU
59
58
IC : ST72F561 (HS)
GND
1
1MΩ
CERALOCKr
V1
V2
C1
2
L
CERALOCKr
H: 9, 25, 41, 57, 58
L: 8, 24, 40, 55, 56
V1
V2
C1
CERALOCKr: CSTCE16M0V13Cpp-R0
C1=15pF (Typ.)
C2=15pF (Typ.)
C2
c µPD70F3283YGC (Renesas)
C2
CERALOCKr: CSTCE8M00G15App-R0
C1=33pF (Typ.)
C2=33pF (Typ.)
c M30842MCT-XXXGP (Renesas)
32-bit Microcomputer
Vdd=3.3V
16-bit Microcomputer
Vcc=5.0V
10kΩ
H
14
H
19
IC : μPD70F3283YGC
12
13
10
4.7μF
IC : M30842MCT-XXXGP (High*)
L
22
CERALOCKr
V1
6
C2
L
CERALOCKr
V2
C1
20
H: 1, 5, 9, 34, 70
L: 2, 8, 11, 15, 33, 69
CERALOCKr: CSTCE10M0G15Cpp-R0
C1=33pF (Typ.)
C2=33pF (Typ.)
H: 23, 24, 37, 39, 59, 74, 91, 118, 122,
132, 142, 143
L: 15, 16, 21, 36, 41, 57, 76, 93,
110~113, 120, 121, 130, 140
*High: XIN-XOUT Drive Capacity Select Bit
V1
V2
C1
C2
CERALOCKr: CSTCE8M00G15Cpp-R0
C1=33pF (Typ.)
C2=33pF (Typ.)
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Ceramic Resonators (CERALOCKr)
MHz Chip Type -Standard Frequency Tolerance for Automotive2
2.1 max.
3.0±0.2
∗
0.5±0.05
0.3±0.3
6.6 max.
0.45
(Ref.)
0.45
(Ref.)
0.45
(Ref.)
t
(3)
(2)
(1)
1.2±0.2
1.4±0.2
1.2±0.2
t : 1.75±0.05
(2.00—2.99MHz)
t : 1.55±0.05
(3.00MHz—)
CSTCC_G_A
2.00-3.99MHz
c Features
∗: EIAJ code
1.1±0.1 2.5±0.1
1. The series has high reliability and is available
for a wide temperature range.
2. Oscillation circuits do not require external load
capacitors.
3. The series is available in a wide frequency range.
4. The resonators are extremely small and have a low
profile.
5. No adjustment is necessary for oscillation circuits.
(in mm)
2.5±0.1
∗
(3)
0.2±0.2
(2)
0.4±0.05
(1)
4.1 max.
0.4 (ref.)
0.4 (ref.)
0.8±0.1
0.4 (ref.)
0.8±0.1
1.4 max.
2.0±0.1
0.3±0.2
4.5±0.1
1.15±0.05
Chip type CERALOCK(R) with built-in load capacitors
provides high accuracy in an extremely small package.
MURATA's frequency adjustment and package technology
expertise has enabled the development of the chip
CERALOCK(R) with built-in load capacitors.
This diverse series owes its development to MURATA's
original mass production techniques and high reliability,
and has achieved importance in the worldwide automotive
market.
0.45±0.3
7.2±0.2
∗ : EIAJ Monthly
Code
0.8±0.1
c Applications
CSTCR_G_B
4.00-7.99MHz
0.4±0.1
0.4±0.1
0.75±0.1 1.5±0.1
1.5±0.1
0.4±0.1
(in mm)
∗
1.1 max.
1.3±0.15
0.10±0.10
3.2±0.15
0.4±0.1
0.1±0.1
0.70±0.10
3.0 max.
0.50 (ref.)
0.50 (ref.)
0.50 (ref.)
(3)
(2)
(1)
0.4±0.1 0.4±0.1 0.4±0.1
CSTCE_G_A
8.00-13.99MHz
(in mm)
0.4±0.1
1.2±0.1 1.2±0.1
∗
1.1 max.
1.3±0.15
3.2±0.15
0.10±0.10
0.4±0.1
0.1±0.1
3.0 max.
0.9±0.1
1. Cluster panel and Control panel
2. Safety control
(Anti-lock Brake System, Electronic Stability
Control, Airbag, etc.)
3. Engine ECU, Electronic Power Steering, Immobilizer,
etc.
4. Car Air conditioner, Power Window, Remote Keyless
Entry system, etc.
5. Electronic Toll Collection system, Car Navigation,
etc.
0.5 (ref.)
0.5 (ref.)
0.5 (ref.)
(3)
(2)
(1)
0.4±0.1 0.4±0.1 0.4±0.1
∗: EIAJ Monthly
CSTCE_V_C
14.00-20.00MHz
Code
0.4±0.1
1.2±0.1 1.2±0.1
(in mm)
Continued on the following page.
7
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Continued from the preceding page.
(0.5)
(2)
3.7±0.2
(0.7)
(3)
Terminals (1) and (3) are
interchangeable.
Terminal (2) should be soldered
only to fix the resonator onto PCB
Terminal (2) should be electrically
0.4±0.2 0.5±0.2 0.4±0.2 floating so it cannot be connected
0.5±0.3 0.5±0.3 0.5±0.3
anywhere.
2
Thickness varies
with frequency.
∗: EIAJ Monthly Code
CSACV_X_Q
20.01-70.00MHz
∗
M
(0.5)
(1)
1.6±0.2 1.6±0.2
1.85±0.3
1.3±0.1
3.1±0.2
∗
M
(0.5)
(3)
1.3±0.1
3.1±0.2
3.7±0.2
(0.9)
(2)
(0.7)
(1)
0.4±0.2 0.5±0.2 0.4±0.2
0.5±0.3 0.5±0.3 0.5±0.3
Thickness varies
with frequency and
built-in capacitance.
∗: EIAJ code
CSTCV_X_Q
20.01-70.00MHz
1.6±0.2 1.6±0.2
1.85±0.3
(in mm)
(in mm)
Temperature
Range
(°C)
Oscillating
Frequency
(MHz)
Initial
Tolerance
Temperature Stability
(%)
CSTCC_G_A
2.00 to 3.99
±0.5%
±0.4 [-0.6% to +0.3%:Built-in Capacitance 47pF type within Freq.2.00 to 3.49MHz]
-40 to 125
CSTCR_G_B
4.00 to 7.99
±0.5%
±0.15
-40 to 125
-40 to 125
Part Number
CSTCE_G_A
8.00 to 13.99
±0.5%
±0.2
CSTCE_V_C
14.00 to 20.00
±0.5%
±0.15
-40 to 125
CSACV_X_Q
20.01 to 70.00
±0.5%
±0.3
-40 to 125
CSTCV_X_Q
20.01 to 70.00
±0.5%
±0.3
-40 to 125
Irregular or stopped oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.
c Oscillation Frequency Measuring Circuit
CSTCC_G_A
CSTCE_G_A/CSTCE_V_C/CSTCR_G_B/CSTCV_X_Q
VDD
VDD
5pF
To Frequency Counter
Rf
To Frequency Counter
Rf
1MΩ
Rd
Rd
(1)
(3)
C1
(1)
C1
C2
(2)
VDD
0.01μF
To Frequency Counter
Rf
CL1
8
C2
(2)
CSACV_X_Q
22μF
+
(3)
CL2
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
c Standard Land Pattern Dimensions
CSTCC_G_A
CSTCR_G_B
0.8
1.4
1.2
0.8
0.7
0.8
1.2
1.6
1.2
2
3.8~4.4
2.6
1.2
0.7
0.4
0.4
1.5
2.5
0.4
1.5
2.5
Land Pattern
Land Pattern
(in mm)
(in mm)
CSTCE_G_A
0.4
0.8
0.4
0.4
0.8
0.4
0.8
0.4
1.90 ~ 2.10
0.8
1.90 ~ 2.10
0.4
CSTCE_V_C
(* This Land Pattern is not common to CSTCE_V.)
1.2
1.2
1.2
Land Pattern
1.2
Land Pattern
(in mm)
(in mm)
CSTCV_X_Q
0.5
1.1
0.5
0.5
1.1
0.5
1.1
0.5
1.0
0.5
1.0
0.5
3.1±0.2
3.1±0.2
1.0
0.5
1.1
1.0
0.5
0.5
CSACV_X_Q
1.6
1.6
1.6
Land Pattern
(in mm)
1.6
Land Pattern
(in mm)
9
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
c Oscillation Frequency Temperature Stability
CSTCC_G_A
CSTCR_G_B
+0.2
Oscillating Frequency Shift (%)
+0.1
0
-0.1
-0.2
-60
-40
-20
0
+20
+40
+60
+80
+100
+120
+0.1
0
-0.1
-0.2
-60
+140
-40
-20
0
Temperature (°C)
Oscillating Frequency Shift (%)
Oscillating Frequency Shift (%)
+80
+100
+120
+140
0
-0.1
-40
-20
0
+20
+40
+60
+80
+100
+120
+80
+100
+120
+140
+80
+100
+120
+140
+0.1
0
-0.1
-0.2
-60
+140
-40
-20
0
Temperature (°C)
+20
+40
+60
Temperature (°C)
CSTCV_X_Q
CSACV_X_Q
+0.2
Oscillating Frequency Shift (%)
+0.2
+0.1
0
-0.1
-40
-20
0
+20
+40
+60
Temperature (°C)
10
+60
+0.2
+0.1
-0.2
-60
+40
CSTCE_V_C
+0.2
-0.2
-60
+20
Temperature (°C)
CSTCE_G_A
Oscillating Frequency Shift (%)
2
Oscillating Frequency Shift (%)
+0.2
+80
+100
+120
+140
+0.1
0
-0.1
-0.2
-60
-40
-20
0
+20
+40
+60
Temperature (°C)
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Application Circuits Utilization
c µPD78F9222MC-5A4 (Renesas)
c M30260F8AGP (Renesas)
8-bit Microcomputer
Vdd=5.0V
V'dd=7.0V
16-bit Microcomputer
Vcc=5.0V
2
10kΩ
H
6
H
7
IC : μPD78F9222MC-5A4
2
3
8
IC : M30260F8AGP (High*)
L
23
CERALOCKr
V1
H: 5, 20
L: 1
V2
C1
24
L
H: 11, 46, 47, 48
L: 4, 9, 44
CERALOCKr
C2
*High: XIN-XOUT Drive Capacity Select Bit
V1
V2
C1
CERALOCKr: CSTCR6M00G55B-R0
C1=39pF (Typ.)
C2=39pF (Typ.)
c MB90F347D (Fujitsu)
C2
CERALOCKr: CSTCE10M0G55A-R0
C1=33pF (Typ.)
C2=33pF (Typ.)
c MC68HC908AZ60AVFU (Freescale)
16-bit Microcomputer
Vcc=5.0V
8-bit Microcomputer
Vdd=5.0V
H
EVALUATION BOARD
IC : MC68HC908AZ60AVFU
IC : MB90F347D
93
92
L
59
H: 15, 32, 65, 90
L: 16, 35, 44, 66, 91
V1
V2
C1
58
V1
C2
V2
CERALOCKr: CSTCE8M00G55A-R0
C1=33pF (Typ.)
C2=33pF (Typ.)
c ST72F324J6T3 (MS) (ST Microelectronics)
C1
c PIC12F675-I/P (HS) (Microchip)
8-bit Microcomputer
Vdd=5.0V
Vdd=5.0V
H
H
IC : PIC12F675-I/P(HS)
IC : ST72F324J6T3 (MS)
41
2
L
H: 13, 21, 32, 43
L: 14, 22, 33, 39, 40
V2
C1
C2
3
V1
CERALOCKr: CSTCR4M00G55B-R0
C1=39pF (Typ.)
C2=39pF (Typ.)
L
1MΩ
CERALOCKr
CERALOCKr
V1
CERALOCKr: CSTCE16M0V53C-R0
C1=15pF (Typ.)
C2=15pF (Typ.)
C2
8-bit Microcomputer
42
GND
1MΩ
CERALOCKr
CERALOCKr
H: 1
L: 4, 8
V2
C1
C2
CERALOCKr: CSTCE8M00G52A-R0
C1=10pF (Typ.)
C2=10pF (Typ.)
11
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Notice for Automotive
c Soldering and Mounting (CSTCC/CSTCR/CSTCE_V/CSTCE_G Series)
1. Soldering
(1) Reflow soldering
Please mount component on a circuit board by reflow
soldering. Flow soldering is not acceptable.
Flux
Please use rosin based flux,
not water soluble flux.
Solder
Please use solder (Sn-3.0Ag-0.5Cu) under
the following conditions: Standard thickness
of soldering paste: 0.10 to 0.15mm.
Recommendable Soldering Profile
150 to 180°C
60 to 120s
220°C min.
30 to 60s
upper limit: 260°C
1s max.
lower limit: 245°C
5s max.
Pre-heating
Heating
Peak Temperature
Temperature (°C)
Recommendable Flux and Solder
Peak
260
245
220
Heating
(220°C min.)
180
150
Pre-heating
(150 to 180°C)
60 to 120s
Gradual
Cooling
30 to 60s
Temperature shall be measured on the surface of component.
(2) Soldering with Iron
If compelled to mount the component by using soldering
iron, please do not directly touch the component with the
soldering iron. The component terminals or electrical
characteristics may be damaged if excessive thermal
stress is applied.
Recommendable Soldering with Iron
Heating of the soldering iron
Watt
Shape of the soldering iron
Soldering Time
Solder
350°C max.
30W max.
ø3mm max.
5s max. at one terminal
Sn-3.0Ag-0.5Cu
(3) Solder Volume
Please make the solder volume less than the height of
the substrate to avoid damage to the seal between the
metal cap and the substrate.
(4) Other
Do not reuse components removed from a circuit board
after soldering.
(5) Conditions for Placement Machines
The component is recommended with placement
machines that employ optical placement capabilities. The
component may be damaged by excessive mechanical
force. Please make sure that you have evaluated by
using placement machines before going into mass
production. Do not use placement machines that utilize
mechanical positioning. Please contact Murata for details
beforehand.
Continued on the following page.
12
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
P16E.pdf
Nov.22,2012
Notice for Automotive
Continued from the preceding page.
2. Wash
(1) Cleaning Solvents
HCFC, Isopropanol, Tap water, Demineralized water,
Cleanthrough750H, Pine alpha 100S, Techno care FRW
(2) Temperature Difference : dT *1
dTV60°C (dT=Component-solvent)
*1 ex. If the component is immersed at +90°C into
cleaning solvent at +60°C, then dT=30°C.
(3) Conditions
(a) Ultrasonic Wash
1 minute max. in above solvent at +60°C max.
(Frequency: 28kHz, Output: 20W/l)
(b) Immersion Wash
5 minutes max. in above solvent at +60°C max.
(c) Shower or Rinse Wash
5 minutes max. in above solvent at +60°C max.
(4) Drying
5 minutes max. by air blow at +80°C max.
(5) Other
(a) Total washing time should be within 10 minutes.
(b) The component may be damaged if it is washed with
chlorine, petroleum, or alkali cleaning solvent.
3. Coating
Conformal coating of the component is acceptable.
However, the resin material, curing temperature, and
other process conditions should be evaluated to confirm
stable electrical characteristics are maintained.
13
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Notice for Automotive
c Soldering and Mounting (CSTCV/CSACV Series)
1. Soldering
(1) Reflow soldering
Please mount component on a circuit board by reflow
soldering. Flow soldering is not acceptable.
Flux
Please use rosin based flux,
not water soluble flux.
Solder
Please use solder (Sn-3.0Ag-0.5Cu) under
the following conditions: Standard thickness
of soldering paste: 0.10 to 0.15mm.
Recommendable Soldering Profile
150 to 180°C
60 to 120s
220°C min.
30 to 60s
upper limit: 260°C
1s max.
lower limit: 245°C
5s max.
Pre-heating
Heating
Peak Temperature
Temperature (°C)
Recommendable Flux and Solder
Peak
260
245
220
Heating
(220°C min.)
180
150
Pre-heating
(150 to 180°C)
60 to 120s
Gradual
Cooling
30 to 60s
Temperature shall be measured on the surface of component.
(2) Soldering with Iron
If compelled to mount the component by using soldering
iron, please do not directly touch the component with the
soldering iron. The component terminals or electrical
characteristics may be damaged if excessive thermal
stress is applied.
Recommendable Soldering with Iron
Heating of the soldering iron
Watt
Shape of the soldering iron
Soldering Time
Solder
350°C max.
30W max.
ø3mm max.
5s max. at one terminal
Sn-3.0Ag-0.5Cu
(3) Other
Do not reuse components removed from a circuit board
after soldering.
(4) Conditions for Placement Machines
The component is recommended with placement
machines that employ optical placement capabilities. The
component may be damaged by excessive mechanical
force. Please make sure that you have evaluated by
using placement machines before going into mass
production. Do not use placement machines that utilize
mechanical positioning. Please contact Murata for details
beforehand.
2. Wash
(1) Cleaning Solvents
HCFC, Isopropanol, Tap water, Demineralized water,
Cleanthrough750H, Pine alpha 100S, Techno care FRW
(2) Temperature Difference : dT *1
dTV60°C (dT=Component-solvent)
*1 ex. If the component is immersed at +90°C into
cleaning solvent at +60°C, then dT=30°C.
Continued on the following page.
14
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
P16E.pdf
Nov.22,2012
Notice for Automotive
Continued from the preceding page.
(3) Conditions
(a) Ultrasonic Wash
1 minute max. in above solvent at +60°C max.
(Frequency: 28kHz, Output: 20W/l)
(b) Immersion Wash
5 minutes max. in above solvent at +60°C max.
(c) Shower or Rinse Wash
5 minutes max. in above solvent at +60°C max.
(4) Drying
5 minutes max. by air blow at +80°C max.
(5) Other
(a) Total washing time should be within 10 minutes.
(b) The component may be damaged if it is washed with
chlorine, petroleum, or alkali cleaning solvent.
3. Coating
Conformal coating of the component is acceptable.
However, the resin material, curing temperature, and
other process conditions should be evaluated to confirm
stable electrical characteristics are maintained.
15
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Notice for Automotive
c Storage and Operating Conditions
1. Product Storage Conditions
Please store the products in a room where the
temperature/humidity is stable, and avoid such
places where there are large temperature changes.
Please store the products under the following
conditions:
Temperature: -10 to +40°C
Humidity: 15 to 85% R.H.
2. Expiration Date on Storage
Expiration date (Shelf life) of the products is six
months after delivery under the conditions of a
sealed and unopened package. Please use the products
within six months after delivery. If you store the
products for a long time (more than six months),
use carefully because the products may be degraded
in solderability and/or rusty.
Please confirm solderability and characteristics
for the products regularly.
3. Notice on Product Storage
(1) Please do not store the products in a chemical
atmosphere (Acids, Alkali, Bases, Organic gas,
Sulfides and so on), because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to the storage in a
chemical atmosphere.
c Rating
The component may be damaged if excessive mechanical
stress is applied.
c Handling
"CERALOCK" may stop oscillating or oscillate
irregularly under improper circuit conditions.
16
(2) Please do not put the products directly on the
floor without anything under them to avoid damp
and/or dusty places.
(3) Please do not store the products in places
such as: in a damp heated place, in a place where
direct sunlight comes in, in a place applying
vibrations.
(4) Please use the products immediately after the
package is opened, because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to storage under the poor
conditions.
(5) Please do not drop the products to avoid cracking
of ceramic elements.
4. Other
Conformal coating of the component is acceptable.
However, the resin material, curing temperature, and
other process conditions should be evaluated to
confirm that stable electrical characteristics are
maintained.
Please be sure to consult with our sales representatives
or engineers whenever and prior to using the products.
P16E.pdf
Nov.22,2012
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Packaging for Automotive
c Minimum Quantity
Bulk
Dimensions
CSTCC_G_A
Part Number
Plastic Tape ø180mm
2,000
Plastic Tape ø330mm
6,000
500
a
CSTCR_G_B
3,000
9,000
500
a
CSTCR_G15C
3,000
9,000
500
a
CSTCE_G_A
3,000
9,000
500
b
CSTCE_G15C
3,000
9,000
500
b
CSTCE_V_C
3,000
9,000
500
b
CSTCE_V13C
3,000
9,000
500
b
CSTCV_X_Q
2,000
6,000
500
a
CSACV_X_Q
2,000
6,000
500
a
(pcs.)
The order quantity should be an integral multiple of the "Minimum Quantity" shown above.
c Dimensions of Reel
a
b
Trailer
160-190
Leader
13.0
Empty Components
Empty
160 min.
400-560
(ø180 0–1.5 )
(ø180 0–1.5 )
Empty Components
Leader
Cover Film
Trailer
160-190
Cover Film
ø13.0±0.2
2.0±0.5
+1.0
0
9.0
17.0±1.0
Empty
160 min.
400-560
ø13.0±0.2
2.0±0.5
+1.0
0
13.0±1.0
(in mm)
c Dimensions of Taping
4.0±0.1
+0.10
Direction of Feed
0.90±0.10
10°
(1.30 max.)
(3˚)
0.25±0.05
1.50 -0.05
Cover Film
(in mm)
8.0±0.2
3.5±0.05
+0.2
ø1.0 -0.0
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
(1.85 max.)
0.3±0.05
(3°)
1.25±0.05
2.2±0.1
Direction of Feed
3.40 -0.05
(3)(2)(1)
(5.2)
+0.1
ø1.5 -0
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
Cover Film
10°
+0.10
2.0±0.05
12.0±0.2
4.7±0.1
(3)(2)(1)
(9.5)
4.0±0.1
ø1.5 +0.1
-0.0
4.0±0.1
5.5±0.05
+0.1
ø1.5 -0
2.0±0.05
1.75±0.1
CSTCE_G15C
1.75±0.1
CSTCR_G15C
4.0±0.1
(in mm)
Continued on the following page.
17
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Packaging for Automotive
Continued from the preceding page.
c Dimensions of Taping
Direction of Feed
(1.40 max.)
0.25±0.05
(3°)
1.10±0.05
(in mm)
Direction of Feed
Direction of Feed
(in mm)
t2 ∗2
(3°)
10°
t1 ∗1
+0.2
ø1.5 –0.0
0.3±0.1
+0.1
3.35 –0.05
12.0±0.2
1.75±0.1
5.5±0.1
4.1±0.1
(9.5)
(3)(2)(1)
4.0±0.1
Direction of Feed
∗1, ∗2: Dimensions vary with product thickness of CERALOCKr.
1.30–1.20
1.45±0.1
1.8 max.
1.10–1.00
1.2±0.1
1.5 max.
12.0±0.2
1.75±0.1
8.0±0.2
(1.30 max.)
0.90±0.10
0.25±0.05
5.5±0.1
1.75±0.1
t2 ∗2
t1 ∗1
(3°)
Direction of Feed
∗1, ∗2: Dimensions vary with product thickness of CERALOCKr.
Thickness of CERALOCKr
t1
∗1
t2
∗2
CSACV_X_Q
+0.1
ø1.5 –0.0
+0.2
ø1.5 –0.0
10°
(1.40 max.)
0.25±0.05
(3°)
1.10±0.05
Cover Film
1.50 -0.05
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
Cover Film
10°
2.0±0.1
+0.1
3.35 –0.05
0.3±0.1
+0.10
4.0±0.1
12.0±0.2
(9.5)
(3)(2)(1)
3.5±0.05
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
4.0±0.1
+0.1
ø1.5 –0.0
2.0±0.1
8.0±0.2
3.45±0.1
(3)(2)(1)
4.0±0.1
+0.1
-0.0
1.50–1.40
1.65±0.1
2.0 max.
(in mm)
Direction of Feed
1.75±0.1
+0.1
ø1.5 -0.0
Cover Film
+0.10
10°
CSTCV_X_Q
4.0±0.1
(5.2)
(3˚)
Cover Film
CSTCE_V_C
18
+0.10
(in mm)
Dimensions of Carrier Tape
Thickness of CERALOCKr
t1
∗1
t2
∗2
+0.2
ø1.0 -0.0
1.50 -0.05
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
(1.85 max.)
0.3±0.05
(3°)
1.25±0.05
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
Cover Film
10°
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
3.40 -0.05
(3)(2)(1)
(5.2)
12.0±0.2
4.0±0.1
3.5±0.05
1.75±0.1
5.5±0.05
4.7±0.1
(3)(2)(1)
(9.5)
2.0±0.05
2.2±0.1
ø1.0
ø1.5 +0.1
-0.0
4.0±0.1
+0.1
ø1.5 -0
4.0±0.1
(in mm)
CSTCE_G_A
+0.1
ø1.5 -0
2.0±0.05
5.5±0.05
Direction of Feed
∗1, ∗2: Dimensions vary with frequency range of CERALOCKr.
2.00–2.99MHz
3.00–3.99MHz
Frequency Range
1.85±0.05
1.65±0.05
t1
∗1
2.45
max.
2.25 max.
t2
∗2
CSTCR_G_B
4.0±0.1
(3°)
t2 ∗2
+0.10
1.50 -0.05
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
Cover Film
10°
2.0±0.05
7.6±0.1
(9.5)
(3) (2) (1)
3.5±0.05
4.0±0.1
ø1.5 +0.3
-0.0
The cover film peel strength force 0.1 to 0.7N
3.3±0.1
The cover film peel speed 300mm/min.
Cover Film
10°
+0.1
-0.0
4.0±0.1
ø1.55±0.05
4.1±0.1
ø1.0
8.0±0.2
3.45±0.1
(3)(2)(1)
(5.2)
4.0±0.1
2.0±0.05
0.3±0.05
1.75±0.1
+0.1
ø1.5 -0.0
2.0±0.05
1.75±0.1
CSTCC_G_A
4.0±0.1
t1 ∗1
CSTCE_V13C
Dimensions of Carrier Tape
4.0±0.1
(in mm)
1.50–1.40
1.65±0.1
2.0 max.
1.30–1.20
1.45±0.1
1.8 max.
1.10–1.00
1.2±0.1
1.5 max.
(in mm)
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Ceramic Resonators (CERALOCKr)
MHz Chip Type -Tight Frequency Tolerance for General Usage1.4 max.
Chip type CERALOCK(R) with built-in load capacitors
provides high accuracy in an extremely small package.
MURATA's frequency adjustment and packaging technology
expertise has enabled the development of the chip
CERALOCK(R) with built-in load capacitors.
High-density mounting is made possible by the small
package and the elimination of the need for an external
load capacitor.
2.0±0.1
0.30±0.20
4.5±0.1
∗
0.2±0.2
0.6±0.05
1.1±0.1
4.1 max.
0.4 (ref.)
0.4 (ref.)
0.4 (ref.)
(3)
(2)
0.4±0.1
(1)
0.4±0.1
3
0.4±0.1
∗: EIAJ Monthly
CSTCR_G15L/CSTCR_GH5L
4.00-7.99MHz
c Features
Code
0.75±0.1
1. Oscillation circuits do not require external load
capacitors.
2. Available in a wide frequency range.
3. Extremely small and have a low profile.
4. No adjustment is necessary for oscillation circuits.
1.5±0.1
1.5±0.1
(in mm)
∗
1.1 max.
1.3±0.15
0.10±0.10
3.2±0.15
0.4±0.1
0.1±0.1
3.0 max.
1. Clock oscillators for USB (Full-speed)
controller ICs
2. Audio equipment and musical instruments, etc.
3. Other applications for replacement of Crystal
Oscillators
0.70±0.10
c Applications
0.50 (ref.)
0.50 (ref.)
0.50 (ref.)
(3)
(2)
(1)
0.4±0.1 0.4±0.1 0.4±0.1
∗: EIAJ Monthly
CSTCE_G15L/CSTCE_GH5L
8.00-13.99MHz
Code
(in mm)
0.4±0.1
1.2±0.1 1.2±0.1
∗
0.4±0.1
0.1±0.1
3.0 max.
0.05 +0.10
- 0.05
0.9±0.1
0.5 (ref.)
1.4 max.
2.0±0.2
∗
1.1 max.
2.5±0.2
1.3±0.15
0.10±0.10
3.2±0.15
0.5 (ref.)
0.5 (ref.)
(0.5)
(3)
(0.5)
(2)
(0.5)
(1)
+0.3
+0.3
0.4 +0.3
- 0.2 0.4 - 0.2 0.4 - 0.2
0.5±0.2 0.5±0.2 0.5±0.2
(3)
(2)
(1)
0.4±0.1 0.4±0.1 0.4±0.1
∗: EIAJ Monthly
CSTCE_V13L/CSTCE_VH3L
14.00-20.00MHz
0.05 +0.10
- 0.05
Thickness varies
with frequency and
built-in capacitance.
∗ : EIAJ code
CSTCW_X11
20.01-48.00MHz
Code
1.0±0.2 1.0±0.2
0.4±0.1
Part Number
1.2±0.1 1.2±0.1
Oscillating
Frequency
(MHz)
(in mm)
(in mm)
1.25±0.2
Initial
Tolerance
Temperature Stability
(%)
Temperature
Range
(°C)
0 to 70
CSTCR_G15L
4.00 to 7.99
±0.1%
±0.08
CSTCR_GH5L
4.00 to 7.99
±0.07%
±0.08
0 to 70
CSTCE_G15L
8.00 to 13.99
±0.1%
±0.08
0 to 70
CSTCE_GH5L
8.00 to 13.99
±0.07%
±0.08
0 to 70
CSTCE_V13L
14.00 to 20.00
±0.1%
±0.08
0 to 70
CSTCE_VH3L
14.00 to 20.00
±0.07%
±0.08
0 to 70
CSTCW_X11
20.01 to 48.00
±0.1%
±0.1
0 to 70
Irregular or stopped oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.
19
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
c Oscillation Frequency Measuring Circuit
CSTCW_X11
CSTCR_G15L/CSTCR_GH5L/CSTCE_G15L/
CSTCE_GH5L/CSTCE_V13L/CSTCE_VH3L
VDD
VDD
5pF
To Frequency Counter
To Frequency Counter
Rf
Rf
1MΩ
Rd
(1)
Rd
(1)
(3)
C1
(3)
C2
C1
C2
(2)
(2)
3
c Standard Land Pattern Dimensions
CSTCR_G15L/CSTCR_GH5L
(* This Land Pattern is not common to CSTCR_G.)
0.4
1.1
0.4
1.1
CSTCE_G15L/CSTCE_GH5L
0.4
0.8
0.4
0.8
0.4
2.6
1.90 ~ 2.10
0.4
1.2
1.2
1.5
1.5
Land Pattern
Land Pattern
(in mm)
(in mm)
CSTCE_V13L/CSTCE_VH3L
(* This Land Pattern is not common to CSTCE_V.)
0.8
0.4
0.8
0.4
0.5 0.5 0.5 0.5 0.5
1.2
1.2
0.8
0.3
2.0
1.90 ~ 2.10
0.8
0.3
0.4
CSTCW_X11
Land Pattern
1.0
1.0
Land Pattern
(in mm)
(in mm)
20
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
c Oscillation Frequency Temperature Stability
CSTCR_G15L/CSTCR_GH5L
CSTCE_G15L/CSTCE_GH5L
+0.2
Oscillating Frequency Shift (%)
Oscillating Frequency Shift (%)
+0.2
+0.1
0
-0.1
-0.2
-60
-40
-20
0
+20
+40
+60
+80
+100
+120
+0.1
0
-0.1
-0.2
-60
+140
-40
-20
0
Temperature (°C)
+20
+40
+60
+80
+100
+120
+140
Temperature (°C)
3
CSTCE_V13L/CSTCE_VH3L
CSTCW_X11
+0.2
Oscillating Frequency Shift (%)
Oscillating Frequency Shift (%)
+0.2
+0.1
0
-0.1
-0.2
-60
-40
-20
0
+20
+40
+60
Temperature (°C)
+80
+100
+120
+140
+0.1
0
-0.1
-0.2
-40
-20
0
+20
+40
+60
+80
+100
Temperature (°C)
21
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Application Circuits Utilization
c M66291GP (Renesas)
c MN102HF74GHL (Panasonic)
USB Transceiver
Vset=3.3V
16-bit Microcontroller
Vdd=3.3V
Fout
H
82
EVALUATION BOARD
IC : M66291GP
14
3
IC : MN102HF74GHL
13
1MΩ
CERALOCKr
GND
23
V2
C1
24
L
CERALOCKr
220Ω
V1
18
V1
C1
CERALOCKr: CSTCR6M00G15ppp-R0
C1=39pF (Typ.)
C2=39pF (Typ.)
C2
c LC87F1964A (Sanyo)
H: 1~17, 22, 25, 26~42, 54, 58~60, 66~81, 83~91
L: 19, 20, 43~53, 55~57, 61~65, 82, 92~100
V2
C2
CERALOCKr: CSTCE12M0G15Lpp-R0
C1=33pF (Typ.)
C2=33pF (Typ.)
c TUSB2046B (Texas Instruments)
8-bit Microcontroller
Vdd=5.0V
USB 4-port HUB
Vcc=3.3V
10kΩ
H
H
H1
IC : TUSB2046B
IC : LC87F1964A
6
7
L1
L
CERALOCKr
V1
V2
C1
CERALOCKr: CSTCE12M0G15Lpp-R0
C1=33pF (Typ.)
C2=33pF (Typ.)
c ISP1181BDGG (Philips)
USB Controller
Vset=3.3V
H
EVALUATION BOARD
IC : ISP1181BDGG
47
GND
CERALOCKr
V1
V2
C1
22
C2
29
CERALOCKr: CSTCR6M00G15ppp-R0
C1=39pF (Typ.)
C2=39pF (Typ.)
GND
1MΩ
CERALOCKr
V1
C2
48
30
H: 8, 19, 39
L: 5, 20, 40
H1: 31, 33
L1: 29, 30, 32, 34~36
10kΩ
470Ω
V2
C1
C2
H: 3, 25
L: 7, 28
CERALOCKr: CSTCR6M00G15ppp-R0
C1=39pF (Typ.)
C2=39pF (Typ.)
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Ceramic Resonators (CERALOCKr)
MHz Chip Type -Standard Frequency Tolerance for General Usage-
3.0±0.2
0.45±0.3
Chip type CERALOCK(R) with built-in load capacitors
provides an extremely small package.
MURATA's package technology expertise has enabled the
development of the Chip CERALOCK(R) with built-in
load capacitors.
High-density mounting can be realized because of the
small package and the elimination of the need for an
external load capacitor.
2.1 max.
7.2±0.2
∗
0.5±0.05
0.3±0.3
6.6 max.
0.45
(Ref.)
0.45
(Ref.)
t
0.45
(Ref.)
(3)
(2)
(1)
1.2±0.2
1.4±0.2
1.2±0.2
t : 1.75±0.05
(2.00—2.99MHz)
t : 1.55±0.05
(3.00MHz—)
CSTCC_G
2.00-3.99MHz
c Features
∗: EIAJ code
1.1±0.1 2.5±0.1
1. Oscillation circuits do not require external load
capacitors.
2. Available in a wide frequency range.
3. Extremely small and have a low profile.
4. No adjustment is necessary for oscillation circuits.
(in mm)
2.5±0.1
∗
(3)
0.2±0.2
c Applications
(2)
0.4±0.05
(1)
0.4 (ref.)
0.4 (ref.)
0.8±0.1
CSTCR_G
4.00-7.99MHz
1.15±0.05
4.1 max.
0.4 (ref.)
0.8±0.1
∗ : EIAJ Monthly
Code
0.8±0.1
0.4±0.1
0.4±0.1
0.75±0.1 1.5±0.1
1.5±0.1
0.4±0.1
(in mm)
∗
1.1 max.
1.3±0.15
3.2±0.15
0.10±0.10
0.4±0.1
0.1±0.1
3.0 max.
0.70±0.10
1. Clock oscillators for microprocessors
2. Small electronic equipment such as handheld phone,
digital video camcorder (DVC), digital still camera
(DSC), portable audio player, etc.
3. Storage media and memory
(HDD, Optical storage device, FDD, Flash memory
card, etc.)
4. Office automation equipment
(Mobile PC, Mouse, Keyboard, etc.)
5. Audio-visual applications
(TV, DVD-HDD recorder, Audio equipment, Remote
control, etc.)
6. Home appliances
(Air conditioner, Microwave oven, Refrigerator,
Washing machine, etc.)
4
1.4 max.
2.0±0.1
0.3±0.2
4.5±0.1
0.50 (ref.)
0.50 (ref.)
0.50 (ref.)
(3)
(2)
(1)
0.4±0.1 0.4±0.1 0.4±0.1
CSTCE_G/CSTCE_G_Z
8.00-13.99MHz
(in mm)
0.4±0.1
3.2±0.15
1.2±0.1 1.2±0.1
0.4±0.1
0.1±0.1
1.85 max.
0.62 (ref.)
0.45 (ref.)
(3)
(2)
0.85±0.1
0.9±0.1
0.62 (ref.)
0.4±0.1
0.075±0.075
3.0 max.
1.1 max.
1.3±0.15
0.10±0.10
1.1 max.
0.10±0.10
1.3±0.15
2.0±0.15
0.52 (ref.)
(1)
(3)
0.6±0.10.4±0.1 0.6±0.1
0.5±0.1
CSTCE_V
14.00-20.00MHz
0.41 (ref.)
0.52 (ref.)
(2) (1)
0.3±0.1
0.5±0.1
CSTCG_V
20.00-33.86MHz
(Ultra Small)
0.65±0.1 0.95±0.1 0.95±0.1
(in mm)
0.3±0.1
0.7±0.1
0.7±0.1
(in mm)
Continued on the following page.
23
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Continued from the preceding page.
1.2 max.
(0.5)
(0.5)
0.05 - 0.05
∗
+0.10
0.05 +0.10
- 0.05
0.05 - 0.05
0.4
+0.3
- 0.2
0.5±0.2
0.4
+0.3
- 0.2
Thickness varies
with frequency.
∗ : EIAJ code
(0.5)
(1)
0.05 +0.10
- 0.05
Thickness varies
with frequency and
built-in capacitance.
∗ : EIAJ code
CSTCW_X
20.01-70.00MHz
1.0±0.2 1.0±0.2
1.0±0.2 1.0±0.2
1.25±0.2
(in mm)
(in mm)
1.25±0.2
Temperature
Range
(°C)
Oscillating
Frequency
(MHz)
Initial
Tolerance
Temperature Stability
(%)
CSTCC_G
2.00 to 3.99
±0.5%
±0.3 [±0.4%:Built-in Capacitance 47pF type within Freq.2.00 to 3.49MHz]
-20 to 80
CSTCR_G
4.00 to 7.99
±0.5%
±0.2
-20 to 80
CSTCE_G
8.00 to 13.99
±0.5%
±0.2
-20 to 80
CSTCE_G_Z
8.00 to 13.99
±0.5%
±0.2
-40 to 125
CSTCE_V
14.00 to 20.00
±0.5%
±0.3
-20 to 80
Part Number
4
(0.5)
(2)
(0.5)
(3)
+0.3
+0.3
0.4 +0.3
- 0.2 0.4 - 0.2 0.4 - 0.2
0.5±0.2 0.5±0.2 0.5±0.2
0.5±0.2
CSACW_X
20.01-70.00MHz
1.4 max.
2.0±0.2
∗
+0.10
2.5±0.2
2.0±0.2
2.5±0.2
CSTCG_V
20.00 to 33.86
±0.5%
±0.3
-20 to 80
CSACW_X
20.01 to 70.00
±0.5%
±0.2
-20 to 80
CSTCW_X
20.01 to 70.00
±0.5%
±0.2
-20 to 80
Irregular or stopped oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.
c Oscillation Frequency Measuring Circuit
CSTCR_G/CSTCE_G/CSTCE_G_Z/CSTCE_V/CSTCG_V
CSTCC_G/CSTCW_X
VDD
VDD
5pF
To Frequency Counter
To Frequency Counter
Rf
Rf
1MΩ
Rd
(1)
Rd
(1)
(3)
C1
C2
C1
CSACW_X
VDD
To Frequency counter
Rf
Rd
24
C2
(2)
(2)
CL1
(3)
CL2
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
c Standard Land Pattern Dimensions
CSTCC_G
CSTCR_G
(* This Land Pattern is not common to
CSTCR_G15C, CSTCR_G15L, CSTCR_GH5L.)
0.8
1.2
1.4
0.8
0.7
0.8
1.2
3.8~4.4
1.6
1.2
2.6
1.2
0.7
0.4
0.4
1.5
2.5
0.4
1.5
2.5
Land Pattern
Land Pattern
(in mm)
(in mm)
CSTCE_V
(* This Land Pattern is not common to
CSTCE_V13C, CSTCE_V_C, CSTCE_V13L, CSTCE_VH3L.)
CSTCE_G/CSTCE_G_Z
0.3
0.4
0.8
0.4
0.8
0.65
0.3
0.65
0.3
0.4
1.6
1.90 ~ 2.10
4
1.2
0.95
1.2
0.95
Land Pattern
Land Pattern
(in mm)
(in mm)
CSTCG_V
0.3
0.5
0.3
0.5
CSACW_X
0.3
0.3
0.5
0.8
0.8
0.8
Land Pattern
0.3
2.0
1.6
0.8
0.5
2.0
Land Pattern
(in mm)
(in mm)
CSTCW_X
0.8
0.3
2.0
0.8
0.3
0.5 0.5 0.5 0.5 0.5
1.0
1.0
Land Pattern
(in mm)
25
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
c Oscillation Frequency Temperature Stability
CSTCC_G
CSTCR_G
+0.2
Oscillating Frequency Shift (%)
Oscillating Frequency Shift (%)
+0.2
+0.1
0
-0.1
-0.2
-40
-20
0
+20
+40
+60
+80
+0.1
0
-0.1
-0.2
-60
+100
-40
-20
0
Temperature (°C)
Oscillating Frequency Shift (%)
Oscillating Frequency Shift (%)
0
-0.1
-40
-20
0
+20
+40
+60
+80
+100
+120
-40
-20
0
+20
+40
+60
+80
+100
+120
+140
Temperature (°C)
CSACW_X
+0.2
Oscillating Frequency Shift (%)
Oscillating Frequency Shift (%)
+140
-0.1
-0.2
-60
+140
+0.2
+0.1
0
-0.1
-40
-20
0
+20
+40
+60
+80
+100
+120
+140
Temperature (°C)
+0.2
+0.1
0
-0.1
-20
0
+20
+40
Temperature (°C)
+0.1
0
-0.1
-0.2
-40
-20
0
+20
+40
Temperature (°C)
CSTCW_X
Oscillating Frequency Shift (%)
+120
0
CSTCG_V
26
+100
+0.1
Temperature (°C)
-0.2
-40
+80
+0.2
+0.1
-0.2
-60
+60
CSTCE_V
+0.2
-0.2
-60
+40
Temperature (°C)
CSTCE_G/CSTCE_G_Z
4
+20
+60
+80
+100
+60
+80
+100
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Application Circuits Utilization
c µPD78F0533GB (Renesas)
c TMP19A43FDXBG (Toshiba)
8-bit Microcomputer
Vdd=5.0V
32-bit Microcomputer
Vcc=1.5V
Vcc'=2.5V
Vcc''=3.3V
10kΩ
H
6
EVALUATION BOARD
IC : TMP19A43FDXBG
IC : μPD78F0533GB
11
10
12
0.1μF
A14
L
CERALOCKr
V1
H: 15, 16, 47
L: 9, 13, 14, 48
V2
C1
A15
C2
V1
C1
C2
8-bit Microcomputer
Vdd=5.0V
Vcc=5.0V
H
H
IC : MN103SFC2D
13
Vdd2
10μF
L
56
C2
V1
C1
H: 3, 28, 51, 79
L: 4, 29, 54, 57
C2
CERALOCKr: CSTCE8M00G52-R0
C1=10pF (Typ.)
C2=10pF (Typ.)
c HD64F36077GH (Renesas)
8-bit Microcomputer
16-bit Microcomputer
Vdd=5.0V
Vcc=5.0V
H
H
EVALUATION BOARD
IC : PIC16F716-I/SO(HS)
15
L
V2
CERALOCKr: CSTCR5M00G55Z-R0
C1=39pF (Typ.)
C2=39pF (Typ.)
c PIC16F716-I/SO (Microchip)
55
CERALOCKr
H: 9, 17, 34
L: 7, 15, 36
Vdd2: 16, 38
V2
16
4
IC : MB95F128H
CERALOCKr
V1
CERALOCKr: CSTCE10M0G52-R0
C1=10pF (Typ.)
C2=10pF (Typ.)
c MB95F128H (Fujitsu)
32-bit Microcomputer
14
Xin: A14
Xout: A15
V2
CERALOCKr: CSTCR4M00G55-R0
C1=39pF (Typ.)
C2=39pF (Typ.)
c MN103SFC2D (Panasonic)
C1
GND
CERALOCKr
IC : HD64F36077GH
GND
11
10
6
L
0.1μF
1MΩ
CERALOCKr
V1
CERALOCKr
V2
C1
C2
V1
CERALOCKr: CSTCE12M0G52-R0
C1=10pF (Typ.)
C2=10pF (Typ.)
V2
C1
C2
H: 3, 7, 12
L: 8, 9
CERALOCKr: CSTCE8M00G52-R0
C1=10pF (Typ.)
C2=10pF (Typ.)
Continued on the following page.
27
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Application Circuits Utilization
Continued from the preceding page.
c µPD70F3215HYGC (Renesas)
c ATmega128 (Atmel)
32-bit Microcomputer
Vdd=5.0V
H
8-bit Microcomputer
Vcc=5.0V
14
H
IC : μPD70F3215HYGC
12
13
10
10μF
IC : ATmega128
L
24
CERALOCKr
V1
H: 1, 5, 9, 34, 70
L: 2, 8, 11, 33, 69
V2
C1
23
C2
V1
C1
C2
H
18
32-bit Microcomputer
Vdd1=1.8V
Vdd2=3.3V
H1
H2
IC : ST7FLITE29F2B6
15
14
IC : TMS320F2810PBKA
L
58
57
V2
C1
28
C2
L
100Ω
CERALOCKr
V1
CERALOCKr: CSTCE8M00G52-R0
C1=10pF (Typ.)
C2=10pF (Typ.)
c TMS320F2810PBKA (Texas Instruments)
8-bit Microcomputer
Vdd=5.0V
H: 21, 52, 64
L: 22, 53, 63
V2
CERALOCKr: CSTCR5M00G55-R0
C1=39pF (Typ.)
C2=39pF (Typ.)
c ST7FLITE29F2B6 (ST Microelectronics)
4
L
CERALOCKr
H: 17
L: 16
CERALOCKr: CSTCE16M0V53-R0
C1=15pF (Typ.)
C2=15pF (Typ.)
CERALOCKr
V1
V2
C1
C2
H1: 20, 29, 42, 56, 63, 74, 82, 94, 99,
100, 102, 110, 114
H2: 1, 13, 14, 25, 49, 52, 83, 104, 118
L: 12, 15, 17, 26, 30, 39, 53, 59, 62, 73,
88, 95, 103, 109, 115, 117, 128
CERALOCKr: CSTCE15M0V53-R0
C1=15pF (Typ.)
C2=15pF (Typ.)
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Ceramic Resonators (CERALOCKr)
MHz Lead Type -Standard Frequency Tolerance for General Usage-
0.7 (Ref.)
MURATA's ceramic resonator, CERALOCK(R) with built-in
load capacitors, has been widely applied as the most
suitable component for clock oscillators in a broad
range of microprocessors.
The CSTLS series can be used in the design of
oscillation circuits not requiring external load
capacitors, enabling both high-density mounting and
cost reduction.
3.0±1.0
3.5±0.3
∗∗∗
5.5±0.5
8.0±1.0
(3)
(2)
ø0.48±0.05
0.7 (Ref.)
7.0
(1)
CSTLS_G
3.40-10.00MHz
c Features
Oscillating
Frequency
(MHz)
Part Number
6.5±0.5
3.5±0.3
∗
(3)
(2)
(1)
5
T ∗1 : 3.5±1.0 (16.00—32.99MHz)
3.0±1.0 (33.00—70.00MHz)
CSTLS_X
16.00-70.00MHz
1. DTMF generators
2. Clock oscillators for microcomputers
3. Remote control units
4. Automated office equipment
T ∗1
5.5±1.0
2.5±0.2 2.5±0.2
Initial
Tolerance
Temperature Stability
(%)
ø0.48±0.05
c Applications
∗∗∗ : Weekly Date Code
(in mm)
2.5±0.2
2.5±0.2
1. Oscillation circuits do not require external load
capacitors.
There is some variation in built-in capacitance
values applicable to various ICs.
2. Stable over a wide temperature range.
3. Compact, lightweight and exhibit
superior shock resistance performance.
4. Enable the design of oscillator circuits
requiring no adjustment.
5. Cost-effective and reliable availability
∗
: EIAJ Monthly Code
(in mm)
Temperature
Range
(°C)
CSTLS_G
3.40 to 10.00
±0.5%
±0.2 [-0.4% to +0.2%:Built-in Capacitance 47pF type]
-20 to 80
CSTLS_X
16.00 to 70.00
±0.5%
±0.2
-20 to 80
Irregular or stopped oscillation may occur under unmatched circuit conditions. Please check the actual conditions prior to use.
The order quantity should be an integral multiple of the "Minimum Quantity" shown in the packaging page.
c Oscillation Frequency Measuring Circuit
CSTLS_G/CSTLS_X
VDD
To Frequency Counter
Rf
Rd
(1)
(3)
C1
C2
(2)
29
P16E.pdf
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• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
c Oscillation Frequency Temperature Stability
CSTLS_G
CSTLS_X
+0.50
0.3
0
–40
0
40
80
120
Temperature (°C)
–0.25
Oscillating Frequency Shift (%)
Oscillating Frequency Shift (%)
0.2
+0.25
0.1
0.0
–50
–0.2
–0.3
–0.50
5
30
–30
–10
10
30
50
70
90
110
130
Temperature (°C)
–0.1
P16E.pdf
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• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Application Circuits Utilization
c M38235G6HP (Renesas)
c LC87F5G32A (Sanyo)
8-bit Microcomputer
8-bit Microcomputer
Vcc=5.0V
Vdd=5.0V
510Ω
47000pF
10kΩ
H
25
26
H'
M38235G6HP
28
29
L
6
7
C2
L'
2.2kF
V2
C1
100pF
2
IC : LC87F5G32A
CERALOCKr
V1
10kΩ
H
H: 71
L: 30, 73
CERALOCKr: CSTLS8M00G53-B0
C1=15pF (Typ.)
C2=15pF (Typ.)
10kF
CERALOCKr
V1
V2
C1
C2
L
H: 8, 19, 39
L: 5, 20, 40
H': 29, 31, 35
L': 30, 32~34, 36
CERALOCKr: CSTLS5M00G53-B0
C1=15pF (Typ.)
C2=15pF (Typ.)
5
31
P16E.pdf
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• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Notice for General Usage -MHz Chip Typec Soldering and Mounting (CSTCC Series)
1. Soldering
(1) Reflow soldering
Please mount component on a circuit board by reflow
soldering. Flow soldering is not acceptable.
Flux
Please use rosin based flux,
not water soluble flux.
Solder
Please use solder (Sn-3.0Ag-0.5Cu) under
the following conditions: Standard thickness
of soldering paste: 0.10 to 0.15mm.
Recommendable Soldering Profile
150 to 180°C
60 to 120s
220°C min.
30 to 60s
upper limit: 260°C
1s max.
lower limit: 245°C
5s max.
Pre-heating
Heating
Peak Temperature
Temperature (°C)
Recommendable Flux and Solder
Peak
260
245
220
Heating
(220°C min.)
180
150
Pre-heating
(150 to 180°C)
60 to 120s
Gradual
Cooling
30 to 60s
Temperature shall be measured on the surface of component.
(2) Soldering with Iron
If compelled to mount the component by using soldering
iron, please do not directly touch the component with the
soldering iron. The component terminals or electrical
characteristics may be damaged if excessive thermal
stress is applied.
Recommendable Soldering with Iron
Heating of the soldering iron
Watt
Shape of the soldering iron
Soldering Time
Solder
350°C max.
30W max.
ø3mm max.
5s max. at one terminal
Sn-3.0Ag-0.5Cu
(3) Solder Volume
Please make the solder volume less than the height of
the substrate to avoid damage to the seal between the
metal cap and the substrate.
(4) Other
Do not reuse components removed from a circuit board
after soldering.
(5) Conditions for Placement Machines
The component is recommended with placement
machines that employ optical placement capabilities. The
component may be damaged by excessive mechanical
force. Please make sure that you have evaluated by
using placement machines before going into mass
production. Do not use placement machines that utilize
mechanical positioning. Please contact Murata for details
beforehand.
Continued on the following page.
32
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Notice for General Usage -MHz Chip TypeContinued from the preceding page.
2. Wash
Some series do not withstand washing.
Please check the list at right before use.
Series
Wash
CSTCC (2.00 to 3.49MHz)
Not Available
CSTCC (3.50 to 3.99MHz)
Available
(1) Cleaning Solvents
HCFC, Isopropanol, Tap water, Demineralized water,
Cleanthrough750H, Pine alpha 100S, Techno care FRW
(2) Temperature Difference : dT *1
dTV60°C (dT=Component-solvent)
*1 ex. If the component is immersed at +90°C into
cleaning solvent at +60°C, then dT=30°C.
(3) Conditions
(a) Ultrasonic Wash
1 minute max. in above solvent at +60°C max.
(Frequency: 28kHz, Output: 20W/l)
(b) Immersion Wash
5 minutes max. in above solvent at +60°C max.
(c) Shower or Rinse Wash
5 minutes max. in above solvent at +60°C max.
(4) Drying
5 minutes max. by air blowing at +80°C max.
(5) Other
(a) Total washing time should be within 10 minutes.
(b) The component may be damaged if it is washed with
chlorine, petroleum, or alkali cleaning solvent.
3. Coating
Conformal coating of the component is acceptable.
However, the resin material, curing temperature, and
other process conditions should be evaluated to confirm
stable electrical characteristics are maintained.
33
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Notice for General Usage -MHz Chip Typec Soldering and Mounting (CSTCR/CSTCE_V/CSTCG/CSTCE_G Series)
1. Soldering
(1) Reflow soldering
Please mount component on a circuit board by reflow
soldering. Flow soldering is not acceptable.
Flux
Please use rosin based flux,
not water soluble flux.
Solder
Please use solder (Sn-3.0Ag-0.5Cu) under
the following conditions: Standard thickness
of soldering paste: 0.10 to 0.15mm.
Recommendable Soldering Profile
150 to 180°C
60 to 120s
220°C min.
30 to 60s
upper limit: 260°C
1s max.
lower limit: 245°C
5s max.
Pre-heating
Heating
Peak Temperature
Temperature (°C)
Recommendable Flux and Solder
Peak
260
245
220
Heating
(220°C min.)
180
150
Pre-heating
(150 to 180°C)
60 to 120s
Gradual
Cooling
30 to 60s
Temperature shall be measured on the surface of component.
(2) Soldering with Iron
If compelled to mount the component by using soldering
iron, please do not directly touch the component with the
soldering iron. The component terminals or electrical
characteristics may be damaged if excessive thermal
stress is applied.
Recommendable Soldering with Iron
Heating of the soldering iron
Watt
Shape of the soldering iron
Soldering Time
Solder
350°C max.
30W max.
ø3mm max.
5s max. at one terminal
Sn-3.0Ag-0.5Cu
(3) Solder Volume
Please make the solder volume less than the height of
the substrate to avoid damage to the seal between the
metal cap and the substrate.
(4) Other
Do not reuse components removed from a circuit board
after soldering.
(5) Conditions for Placement Machines
The component is recommended with placement machines
that employ optical placement capabilities. The component
may be damaged by excessive mechanical force. Please
make sure that you have evaluated by using placement
machines before going into mass production. Do not use
placement machines that utilize mechanical positioning.
Please contact Murata for details beforehand.
2. Washing / Coating
Conformal coating or washing of the component is not
acceptable, because it is not hermetically sealed.
Please contact us if you need a washable component.
Continued on the following page.
34
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Notice for General Usage -MHz Chip TypeContinued from the preceding page.
c Soldering and Mounting (CSACW/CSTCW Series)
1. Soldering
(1) Reflow soldering
Please mount component on a circuit board by reflow
soldering. Flow soldering is not acceptable.
Flux
Please use rosin based flux,
not water soluble flux.
Solder
Please use solder (Sn-3.0Ag-0.5Cu) under
the following conditions: Standard thickness
of soldering paste: 0.10 to 0.15mm.
Recommendable Soldering Profile
150 to 180°C
60 to 120s
220°C min.
30 to 60s
upper limit: 260°C
1s max.
lower limit: 245°C
5s max.
Pre-heating
Heating
Peak Temperature
Temperature (°C)
Recommendable Flux and Solder
Peak
260
245
220
Heating
(220°C min.)
180
150
Pre-heating
(150 to 180°C)
60 to 120s
Gradual
Cooling
30 to 60s
Temperature shall be measured on the surface of component.
(2) Soldering with Iron
If compelled to mount the component by using soldering
iron, please do not directly touch the component with the
soldering iron. The component terminals or electrical
characteristics may be damaged if excessive thermal
stress is applied.
Recommendable Soldering with Iron
Heating of the soldering iron
Watt
Shape of the soldering iron
Soldering Time
Solder
350°C max.
30W max.
ø3mm max.
5s max. at one terminal
Sn-3.0Ag-0.5Cu
(3) Other
Do not reuse components removed from a circuit board
after soldering.
(4) Conditions for Placement Machines
The component is recommended with placement
machines that employ optical placement capabilities. The
component may be damaged by excessive mechanical
force. Please make sure that you have evaluated by
using placement machines before going into mass
production. Do not use placement machines that utilize
mechanical positioning. Please contact Murata for details
beforehand.
2. Washing / Coating
Conformal coating or washing of the component is not
acceptable, because it is not hermetically sealed.
Please contact us if you need a washable component.
35
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Notice for General Usage -MHz Chip Typec Storage and Operating Conditions
1. Product Storage Conditions
Please store the products in a room where the
temperature/humidity is stable, and avoid
such places where there are large temperature
changes. Please store the products under the
following conditions:
Temperature: -10 to +40°C
Humidity: 15 to 85% R.H.
2. Expiration Date on Storage
Expiration date (Shelf life) of the products is six
months after delivery under the conditions of a
sealed and unopened package. Please use the
products within six months after delivery. If you
store the products for a long time (more than six
months), use carefully because the products may
be degraded in solderability and/or rusty.
Please confirm solderability and characteristics
for the products regularly.
3. Notice on Product Storage
(1) Please do not store the products in a chemical
atmosphere (Acids, Alkali, Bases, Organic gas,
Sulfides and so on), because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to the storage in a
chemical atmosphere.
c Rating
The component may be damaged if excessive mechanical
stress is applied.
c Handling
"CERALOCK" may stop oscillating or oscillate
irregularly under improper circuit conditions.
36
(2) Please do not put the products directly on the
floor without anything under them to avoid damp
and/or dusty places.
(3) Please do not store the products in places
such as: in a damp heated place, in a place where
direct sunlight comes in, in a place applying
vibrations.
(4) Please use the products immediately after the
package is opened, because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to storage under the poor
conditions.
(5) Please do not drop the products to avoid cracking
of ceramic elements.
4. Other
Conformal coating or washing of the component is not
acceptable because it is not hermetically sealed.
Please be sure to consult with our sales representatives
or engineers whenever and prior to using the products.
P16E.pdf
Nov.22,2012
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
P16E.pdf
Nov.22,2012
Notice for General Usage -MHz Lead Typec Soldering and Mounting
The component cannot withstand washing.
Please do not apply excessive mechanical stress to the
component and lead terminals during soldering.
c Storage and Operating Conditions
1. Product Storage Conditions
Please store the products in a room where the
temperature/humidity is stable, and avoid
such places where there are large temperature
changes. Please store the products under the
following conditions:
Temperature: -10 to +40°C
Humidity: 15 to 85% R.H.
2. Expiration Date on Storage
Expiration date (Shelf life) of the products is six
months after delivery under the conditions of a
sealed and unopened package. Please use the
products within six months after delivery. If you
store the products for a long time (more than six
months), use carefully because the products may
be degraded in solderability and/or rusty.
Please confirm solderability and characteristics
for the products regularly.
3. Notice on Product Storage
(1) Please do not store the products in a chemical
atmosphere (Acids, Alkali, Bases, Organic gas,
Sulfides and so on), because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to the storage in a
chemical atmosphere.
(2) Please do not put the products directly on the
floor without anything under them to avoid damp
and/or dusty places.
(3) Please do not store the products in places
such as: in a damp heated place, in a place where
direct sunlight comes in, in a place applying
vibrations.
(4) Please use the products immediately after the
package is opened, because the characteristics
may be reduced in quality, and/or be degraded in
the solderability due to storage under the poor
conditions.
(5) Please do not drop the products to avoid cracking
of ceramic elements.
4. Other
Conformal coating or washing of the component is not
acceptable because it is not hermetically sealed.
Please be sure to consult with our sales representatives
or engineers whenever and prior to using the products.
c Rating
The component may be damaged if excessive mechanical
stress is applied.
c Handling
"CERALOCK" may stop oscillating or oscillate
irregularly under improper circuit conditions.
37
P16E.pdf
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• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Packaging for General Usage -MHz Chip Typec Minimum Quantity
Bulk
Dimensions
CSTCC_G
Part Number
Plastic Tape ø180mm
2,000
Plastic Tape ø330mm
6,000
500
a
CSTCR_G
3,000
9,000
500
a
CSTCR_G15L
3,000
9,000
500
a
CSTCR_GH5L
3,000
9,000
500
b
CSTCE_G
3,000
9,000
500
b
CSTCE_G15L
3,000
9,000
500
b
CSTCE_GH5L
3,000
9,000
500
b
CSTCE_V
3,000
9,000
500
b
CSTCE_V13L
3,000
9,000
500
b
CSTCE_VH3L
3,000
9,000
500
b
CSTCG_V
3,000
9,000
500
b
CSTCW_X
3,000
9,000
500
b
CSTCW_X11
3,000
9,000
500
b
CSACW_X
3,000
9,000
500
b
(pcs.)
The order quantity should be an integral multiple of the "Minimum Quantity" shown above.
Dimensions of Reel
a
b
Trailer
160-190
Leader
Components
Empty
160 min.
400-560
ø13.0±0.2
Empty
160 min.
Empty Components
(ø180 0–1.5 )
(ø180 0–1.5 )
Empty
Leader
Cover Film
Trailer
160-190
Cover Film
2.0±0.5
+1.0
400-560
ø13.0±0.2
2.0±0.5
+1.0
13.0 0
9.0 –0
17.0±1.0
13.0±1.0
(in mm)
c Dimensions of Taping
1.75±0.1
+0.10
Direction of Feed
0.90±0.10
10°
(1.30 max.)
(3˚)
0.25±0.05
1.50 -0.05
Cover Film
(in mm)
8.0±0.2
+0.2
ø1.0 -0.0
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
(1.85 max.)
0.3±0.05
1.25±0.05
(3°)
3.5±0.05
+0.10
4.0±0.1
2.2±0.1
Direction of Feed
3.40 -0.05
(3)(2)(1)
(5.2)
12.0±0.2
4.7±0.1
(3)(2)(1)
(9.5)
2.0±0.05
+0.1
ø1.5 -0
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
Cover Film
10°
+0.1
ø1.5 -0.0
4.0±0.1
5.5±0.05
+0.1
ø1.5 -0
2.0±0.05
4.0±0.1
CSTCE_G15L/CSTCE_GH5L
1.75±0.1
CSTCR_G15L/CSTCR_GH5L
4.0±0.1
(in mm)
Continued on the following page.
38
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Packaging for General Usage -MHz Chip TypeContinued from the preceding page.
c Dimensions of Taping
(1.40 max.)
0.25±0.05
1.10±0.05
(3°)
Direction of Feed
Thickness of CERALOCKr
t1
∗1
t2
∗2
(in mm)
1.40–1.20
1.48±0.1
2.1 max.
t2 ∗2
t1 ∗1
1.75±0.1
12.0±0.2
(1.85 max.)
(in mm)
+0.1
4.0±0.1
ø1.0
8.0±0.2
3.45±0.1
(3)(2)(1)
(5.2)
8.0±0.2
+0.2
3.5±0.05
ø1.5 -0.0
2.0±0.05
+0.10
1.75±0.1
4.0±0.1
ø1.0 -0.0
+0.1
-0.0
(in mm)
Direction of Feed
Direction of Feed
(in mm)
(3°)
Direction of Feed
(1.30 max.)
0.25±0.05
(3°)
1.00±0.05
10°
(in mm)
t2 ∗2
2.3±0.1
t1 ∗1
+0.2
ø1.0 -0.0
4.0±0.1
0.2±0.1
8.0±0.2
2.8±0.1
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
Cover Film
+0.1
-0.0
1.50±0.1
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
Cover Film
10°
+0.1
ø1.5 -0.0
2.0±0.1
(5.5)
2.2±0.05
(3) (2) (1)
4.0±0.1
3.5±0.05
+0.1
ø1.5 -0.0
8.0±0.2
4.0±0.1
1.75±0.1
CSACW_X
1.75±0.1
CSTCG_V
(1.40 max.)
(3°)
1.10±0.05
(1.30 max.)
0.25±0.05
10°
0.90±0.10
(3˚)
1.50 -0.05
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
Cover Film
10°
0.25±0.05
+0.10
1.50 -0.05
Cover Film
(5.2)
5.5±0.05
Direction of Feed
(in mm)
Dimensions of Carrier Tape
3.5±0.05
+0.10
3.40 -0.05
(3)(2)(1)
(5.2)
(3°)
0.3±0.05
t2 ∗2
2.2±0.1
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
Cover Film
10°
1.75±0.1
ø1.5
ø1.0
4.7±0.1
(3)(2)(1)
(9.5)
12.0±0.2
5.5±0.05
t1 ∗1
+0.1
ø1.5 -0
4.0±0.1
CSTCE_V
+0.1
-0.0
2.0±0.05
4.0±0.1
(in mm)
1.25±0.05
1.75±0.1
(3°)
CSTCE_G
2.0±0.05
0.95–0.90
1.12±0.1
1.7 max.
+0.1
ø1.5 -0
2.0±0.05
Direction of Feed
∗1, ∗2: Dimensions vary with frequency range of CERALOCKr.
2.00–2.99MHz
3.00–3.99MHz
Frequency Range
1.85±0.05
1.65±0.05
t1
∗1
2.45 max.
2.25 max.
t2
∗2
4.0±0.1
1.15–1.00
1.30±0.1
1.9 max.
4.0±0.1
0.3±0.05
7.6±0.1
(3) (2) (1)
4.0±0.1
ø1.5 +0.3
-0.0
The cover film peel strength force 0.1 to 0.7N
3.3±0.1
The cover film peel speed 300mm/min.
Cover Film
10°
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
0.2±0.1
Direction of Feed
CSTCR_G
ø1.55±0.05
4.0±0.1
(3°)
∗1, ∗2: Dimensions vary with product thickness of CERALOCKr.
CSTCC_G
4.0±0.1
(9.5)
2.3±0.1
10°
1.50 -0.05
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
Cover Film
10°
2.0±0.05
2.8±0.1
(3)
(5.5)
(2) (1)
3.5±0.05
+0.10
ø1.0+0.2
-0.0
4.0±0.1
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
Cover Film
+0.1
-0.0
3.5±0.1
ø1.0
8.0±0.2
3.45±0.1
(3)(2)(1)
(5.2)
4.0±0.1
ø1.5 +0.1
-0.0
2.0±0.1
3.5±0.1
1.75±0.1
+0.1
ø1.5 -0.0
2.0±0.05
4.0±0.1
1.75±0.1
CSTCW_X11
Dimensions of Carrier Tape
8.0±0.2
CSTCE_V13L/CSTCE_VH3L
4.0±0.1
Direction of Feed
∗1, ∗2: Dimensions vary with product thickness of CERALOCKr.
Thickness of CERALOCKr
t1
∗1
t2
∗2
1.40–1.20
1.48±0.1
2.1 max.
1.15–1.00
1.30±0.1
1.9 max.
0.95–0.90
1.12±0.1
1.7 max.
(in mm)
Continued on the following page.
39
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Packaging for General Usage -MHz Chip TypeContinued from the preceding page.
c Dimensions of Taping
t2 ∗2
t1 ∗1
(3°)
10°
0.2±0.1
3.5±0.1
2.8±0.1
(2) (1)
ø1.0+0.2
-0.0
4.0±0.1
2.3±0.1
8.0±0.2
ø1.5 +0.1
-0.0
2.0±0.1
(3)
(5.5)
The cover film peel strength force 0.1 to 0.7N
The cover film peel speed 300mm/min.
Cover Film
1.75±0.1
CSTCW_X
4.0±0.1
Direction of Feed
∗1, ∗2: Dimensions vary with product thickness of CERALOCKr.
Thickness of CERALOCKr
t1
∗1
t2
∗2
40
1.40–1.20
1.48±0.1
2.1 max.
1.15–1.00
1.30±0.1
1.9 max.
0.95–0.90
1.12±0.1
1.7 max.
(in mm)
P16E.pdf
Nov.22,2012
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Packaging for General Usage -MHz Lead Typec Minimum Quantity
Ammo Pack
Bulk
CSTLS_G (3.40 to 10.0MHz)
Part Number
2,000
500
CSTLS_X (16.00 to 70.00MHz)
2,000
500
(pcs.)
The order quantity should be an integral multiple of the "Minimum Quantity" shown above.
c Tape Dimensions of CSTLS_G
P2
P
dh dh
dS
D
M∗∗∗
A
W2
d
W1
W0
W
L1
H0
H1
M∗∗∗
D0
P1 F1 F2
P0
Item
t
Direction of Feed
Code
Dimensions
Tolerance
±1.0
Width of diameter
D
8.0
Height of resonator
A
5.5
±0.5
Dimensions of terminal
d
ø0.48
±0.05
Lead length under the hold down tape
L1
5.0 min.
Pitch of component
P
12.7
±0.5
–
Pitch of sprocket hole
P0
12.7
±0.2
Length from sprocket hole center to lead
P1
3.85
±0.5
Length from sprocket hole center to
component center
P2
6.35
±0.5
Lead spacing (I)
F1
2.5
±0.2
Lead spacing (II)
F2
2.5
±0.2
Slant forward or backward
dh
0
±1.0
Width of carrier tape
W
18.0
±0.5
Width of hold down tape
W0
6.0 min.
Position of sprocket hole
W1
9.0
Gap of hold down tape and carrier tape
W2
0
±0.5
W0.5
Y0
Distance between the center of
sprocket hole and lead stopper
H0
18.0
±0.5
Total height of resonator
H1
23.5
±1.0
Diameter of sprocket hole
D0
ø4.0
±0.2
0.6
±0.2
0
±1.0
Total tape thickness
Body tilt
t
dS
Remarks
–
Tolerance for Pitches 10xP0=127±1
1mm max.
Hold down tape does not exceed the carrier tape.
(in mm)
Continued on the following page.
41
P16E.pdf
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Nov.22,2012
Packaging for General Usage -MHz Lead TypeContinued from the preceding page.
c Tape Dimensions of CSTLS_X
P
P2
dh dh
dS
H1
H0
W1
W
L1
d
W0
W2
A
D
D0
P1 F1 F2
Direction of Feed
P0
Item
Code
Dimensions
t
Tolerance
D
5.5
Height of resonator
A
6.5
±0.5
Dimensions of terminal
d
ø0.48
±0.05
Lead length under the hold down tape
L1
5.0 min.
Pitch of component
P
12.7
±0.5
Pitch of sprocket hole
P0
12.7
±0.2
Length from sprocket hole center to lead
P1
3.85
±0.5
Length from sprocket hole center to
component center
P2
6.35
±0.5
Lead spacing (I)
F1
2.5
±0.2
Lead spacing (II)
F2
2.5
±0.2
Slant forward or backward
dh
0
±1.0
Width of carrier tape
W
18.0
±0.5
Width of hold down tape
W0
6.0 min.
Position of sprocket hole
W1
9.0
±0.5
Gap of hold down tape and carrier tape
W2
0
W0.5
Y0.0
Distance between the center of
sprocket hole and lead stopper
H0
18.0
±0.5
Total height of resonator
H1
24.5
±1.0
Diameter of sprocket hole
D0
ø4.0
±0.2
0.6
±0.2
0
±1.0
Total tape thickness
Body tilt
t
dS
Remarks
±1.0
Width of diameter
–
–
Tolerance for Pitches 10xP0=127±1
1mm max.
Hold down tape does not exceed the carrier tape.
(in mm)
42
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
P16E.pdf
Nov.22,2012