RSG CX2O.T.SM4 9.6 mhz to 250 mhz low profile, miniature surface mount at quartz crystal Datasheet

CX2SM AT CRYSTAL
9.6 MHz to 250 MHz
™
Low Profile, Miniature Surface Mount AT Quartz Crystal
Fundamental Mode:
9.6 MHz - 250 MHz
Third Overtone:
48 MHz - 160 MHz
actual size
DESCRIPTION
STATEK’s miniature CX2SM AT crystals in leadless
ceramic packages are designed for surface mounting on
printed circuit boards or hybrid substrates. These crystals
are low profile and have a small footprint. The CX2SM
crystal is manufactured using the STATEK-developed
photolithographic process, and was designed utilizing the
experience acquired by producing millions of crystals for
industrial, commercial, military and medical applications.
XX
SXX
glass lid
side view
ceramic lid
PACKAGE DIMENSIONS
B
1
FEATURES
2
A
I
Designed for surface mount applications using infrared,
vapor phase, or epoxy mount techniques.
H
G
Hermetically sealed ceramic package
3
F
Excellent aging characteristics
D
Available with glass or ceramic lid
High shock and vibration resistance
E
C
Custom designs available
Full military testing available
Designed and manufactured in the USA
APPLICATIONS
Medical
Infusion Pumps
Industrial, Computer & Communications
TYPICAL
MAXIMUM
DIM
inches
mm
inches
mm
A
0.260
6.60
0.275
6.99
B
0.094
2.39
0.108
2.74
C
-
-
D
0.035
0.89
0.045
1.14
E
0.059
1.50
0.069
1.75
see below
F
0.050
1.27
0.060
1.52
Engine Control
G
0.105
2.67
0.115
2.92
Down-hole Data Recorder
H
0.155
3.94
0.165
4.19
I
0.210
5.33
0.220
5.59
Military & Aerospace
Communications
Smart Munitions
Timing Devices (Fuzes)
THICKNESS (DIM C) MAXIMUM
GLASS LID
Surveillance Devices
CERAMIC LID
inches
mm
inches
mm
SM1
0.065
1.65
0.075
1.91
SM2/SM4
0.067
1.70
0.077
1.96
SM3/SM5
0.070
1.78
0.080
2.03
Note: Terminal 1 is electrically connected internally to terminal 3
IS O
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
YS
90
01
ERT
T E M C IFIC T
A
N
IO
S
10136 - Rev B
Pb
TERMINATIONS
SPECIFICATIONS
O
Specifications are typical at 25 C unless otherwise noted.
Specifications are subject to change without notice.
Fundamental Frequency
10 MHz
Motional Resistance (R1)
60
25
10
Motional Capacitance C1 (fF)
2.8
6.2
4.0
Quality Factor Q (k)
95
30
30
Shunt Capacitance C0 (pF)
1.4
2.3
2.3
Calibration Tolerance1
2
Load Capacitance
Drive Level
Frequency-Temperature
Stability1,3
+
_
Designation
SM1
SM2
SM3
SM4
SM5
32 MHz 155.52 MHz
Termination
Gold Plated (Lead Free)
Solder Plated
Solder Dipped
Solder Plated (Lead Free)
Solder Dipped (Lead Free)
Max Process Temperature 260OC for 20 sec.
100 ppm, or tighter as required
20 pF for f ≤ 50 MHz
PACKAGING OPTIONS
10 pF for f > 50 MHz
• Tray Pack
500 µW MAX for f ≤ 50 MHz
200 µW MAX for f > 50 MHz
• 16mm tape, 7” or 13” reels
Per EIA 481 (see Tape and Reel data sheet 10109)
+
_
50 ppm to
+
_
10 ppm (Commercial)
+
_
100 ppm to
+
_
20 ppm (Industrial)
SUGGESTED LAND PATTERN
0.070 (1.78)
+
_
100 ppm to +_ 30 ppm (Military)
5 ppm MAX (better than 1 ppm available)
Aging, first year4
3,000 g, 0.3 ms, 1/2 sine
Shock, survival5
6
Vibration, survival
20 g, 10-2,000 Hz swept sine
O
Operating Temp. Range
-10 C to +70 C (Commercial)
-40OC to +85OC (Industrial)
-55OC to +125OC (Military)
Storage Temp. Range
-55OC to +125OC
Max Process Temperature
0.114
(2.90)
O
0.105 (2.67)
O
260 C for 20 sec.
EQUIVALENT CIRCUIT
1. Other tolerances available. Contact factory.
2. Unless specified otherwise.
3. Does not include calibration tolerance. The characteristics of the frequency stability over
temperature follow that of the AT thickness-shear mode.
4. 5 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies
contact factory.
5. Higher shock version available.
6. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available.
C0
1
L1
C1
R1
2
R1 Motional Resistance L1 Motional Inductance
C1 Motional Capacitance C0 Shunt Capacitance
HOW TO ORDER CX2SM AT CRYSTALS
CX2
S
“S” if special or
custom design.
Blank if Std.
O.T. = 3RD O.T. Mode
Blank = Fundamental
Mode
C
C = Ceramic Lid
Blank = Glass Lid
SM1
–
32.0M
Frequency
M = MHz
SM1 = Gold Plated (Lead Free)
SM2 = Solder Plated
SM3 = Solder Dipped
SM4 = Solder Plated (Lead Free)
SM5 = Solder Dipped (Lead Free)
,
100
/
Calibration
Tolerance
@ 25OC
(in ppm)
100
/
—
I
/
Operating Temp. Range:
C = -10OC to +70OC
I = -40OC to +85OC
M = -55OC to +125OC
S = Customer Specified
Frequency
Stability over
Temp. Range
(in ppm)
OR
—
/
—
/
200
Total
Frequency
Tolerance
(in ppm)
/
I
Operating Temp. Range:
C = -10OC to +70OC
I = -40OC to +85OC
M = -55OC to +125OC
S = Customer Specified
IS O
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
YS
90
01
ERT
T E M C IFIC T
A
N
IO
S
10136 - Rev B
Pb
Similar pages