CY28411-1 Clock Generator for Intel Alviso Chipset Features • 33-MHz PCI clock • Low-voltage frequency select input • Compliant to Intel CK410M • I2C support with readback capabilities • Supports Intel Pentium-M CPU • Ideal Lexmark Spread Spectrum profile for maximum electromagnetic interference (EMI) reduction • Selectable CPU frequencies • Differential CPU clock pairs • 3.3V power supply • 100-MHz differential SRC clocks • 56-pin SSOP and TSSOP packages • 96-MHz differential dot clock • 48-MHz USB clocks CPU SRC PCI REF DOT96 USB_48 x2 / x3 x7 / x8 x6 x1 x1 x1 Block Diagram XIN XOUT CPU_STP# PCI_STP# XTAL OSC PLL1 Pin Configuration VDD_REF REF PLL Ref Freq Divider Network FS_[C:A] VTT_PWRGD# IREF PD PLL2 SDATA SCLK I2C Logic 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 CY28411-1 VDD_PCI VSS_PCI PCI3 VDD_CPU PCI4 CPUT[0:1], CPUC[0:1], CPU(T/C)2_ITP] PCI5 VDD_SRC VSS_PCI SRCT[0:6], SRCC[0:6] VDD_PCI PCIF0/ITP_EN PCIF1 VTT_PWRGD#/PD VDD_PCI VDD_48 PCI[2:5] USB_48/FS_A VDD_PCIF VSS_48 PCIF[0:1] DOT96T DOT96C VDD_48 MHz FS_B/TEST_MODE DOT96T SRCT0 DOT96C SRCC0 USB_48 SRCT1 SRCC1 VDD_SRC SRCT2 SRCC2 SRCT3 SRCC3 SRC4_SATAT SRC4_SATAC VDD_SRC 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 PCI2 PCI_STP# CPU_STP# FS_C/TEST_SEL REF VSS_REF XIN XOUT VDD_REF SDATA SCLK VSS_CPU CPUT0 CPUC0 VDD_CPU CPUT1 CPUC1 IREF VSSA VDDA CPUT2_ITP/SRCT7 CPUC2_ITP/SRCC7 VDD_SRC SRCT6 SRCC6 SRCT5 SRCC5 VSS_SRC 56 SSOP/TSSOP Cypress Semiconductor Corporation Document #: 38-07694 Rev. *B • 3901 North First Street • San Jose, CA 95134 • 408-943-2600 Revised March 10, 2005 CY28411-1 Pin Definitions Pin No. Name Type Description I, PU 3.3V LVTTL input for CPU_STP# active low. 54 CPU_STP# 44,43,41,40 CPUT/C O, DIF Differential CPU clock outputs. 36,35 CPUT2_ITP/SRCT7, CPUC2_ITP/SRCC7 O, DIF Selectable differential CPU or SRC clock output. ITP_EN = 0 @ VTT_PWRGD# assertion = SRC7 ITP_EN = 1 @ VTT_PWRGD# assertion = CPU2 14,15 DOT96T, DOT96C O, DIF Fixed 96-MHz clock output. 12 FS_A/USB_48 I/O, SE 3.3V-tolerant input for CPU frequency selection/fixed 48-MHz clock output. Refer to DC Electrical Specifications table for Vil_FS and Vih_FS specifications. 16 FS_B/TEST_MODE I 3.3V-tolerant input for CPU frequency selection. Selects Ref/N or Hi-Z when in test mode 0 = Hi-Z, 1 = Ref/N Refer to DC Electrical Specifications table for Vil_FS and Vih_FS specifications. 53 FS_C/TEST_SEL I 3.3V-tolerant input for CPU frequency selection. Selects test mode if pulled to VIMFS_C when VTT_PWRGD# is asserted low. Refer to DC Electrical Specifications table for VILFS_C,VIMFS_C,VIHFS_C specifications. 39 IREF I A precision resistor is attached to this pin, which is connected to the internal current reference. 56,3,4,5 PCI O, SE 33-MHz clocks. 55 PCI_STP# I, PU 8 PCIF0/ITP_EN I/O, SE 33-MHz clock/CPU2 select (sampled on the VTT_PWRGD# assertion). 1 = CPU2_ITP, 0 = SRC7 9 PCIF1 O, SE 33-MHz clocks. 52 REF O, SE Reference clock. 3.3V 14.318-MHz clock output. 46 SCLK I 47 SDATA I/O 26,27 SRC4_SATAT, SRC4_SATAC 24,25,22,23, SRCT/C 19,20,17,18, 33,32,31,30 11 3.3V LVTTL input for PCI_STP# active low. SMBus-compatible SCLOCK. SMBus-compatible SDATA. O, DIF Differential serial reference clock. Recommended output for SATA. O, DIF Differential serial reference clocks. VDD_48 PWR 3.3V power supply for outputs. 42 VDD_CPU PWR 3.3V power supply for outputs. 1,7 VDD_PCI PWR 3.3V power supply for outputs. 48 VDD_REF PWR 3.3V power supply for outputs. 21,28,34 VDD_SRC PWR 3.3V power supply for outputs. 37 VDDA PWR 3.3V power supply for PLL. 13 VSS_48 GND Ground for outputs. 45 VSS_CPU GND Ground for outputs. 2,6 VSS_PCI GND Ground for outputs. 51 VSS_REF GND Ground for outputs. 29 VSS_SRC GND Ground for outputs. 38 VSSA GND Ground for PLL. 10 VTT_PWRGD#/PD I, PU 3.3V LVTTL input is a level sensitive strobe used to latch the USB_48/FS_A, FS_B, FS_C/TEST_SEL and PCIF0/ITP_EN inputs. After VTT_PWRGD# (active low) assertion, this pin becomes a real-time input for asserting power down (active high). 50 XIN 49 XOUT Document #: 38-07694 Rev. *B I 14.318-MHz crystal input. O, SE 14.318-MHz crystal output. Page 2 of 19 CY28411-1 Frequency Select Pins (FS_A, FS_B and FS_C) Host clock frequency selection is achieved by applying the appropriate logic levels to FS_A, FS_B, FS_C inputs prior to VTT_PWRGD# assertion (as seen by the clock synthesizer). Upon VTT_PWRGD# being sampled low by the clock chip (indicating processor VTT voltage is stable), the clock chip samples the FS_A, FS_B and FS_C input values. For all logic levels of FS_A, FS_B and FS_C, VTT_PWRGD# employs a one-shot functionality in that once a valid low on VTT_PWRGD# has been sampled, all further VTT_PWRGD#, FS_A, FS_B and FS_C transitions will be ignored, except in test mode. Table 1. Frequency Select Table FS_A, FS_B and FS_C FS_C FS_B FS_A CPU SRC PCIF/PCI REF0 DOT96 USB MID 0 1 100 MHz 100 MHz 33 MHz 14.318 MHz 96 MHz 48 MHz 133 MHz 100 MHz 33 MHz 14.318 MHz 96 MHz 48 MHz 0 0 1 0 1 1 0 1 0 200 MHz 100 MHz 33 MHz 14.318 MHz 96 MHz 48 MHz 0 0 0 266 MHz 100 MHz 33 MHz 14.318 MHz 96 MHz 48 MHz RESERVED MID 0 0 MID 1 0 RESERVED MID 1 1 1 0 x Hi-Z 1 1 0 1 1 1 Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z REF/2 REF/8 REF/24 REF REF REF REF/2 REF/8 REF/24 REF REF REF Serial Data Interface Data Protocol To enhance the flexibility and function of the clock synthesizer, a two-signal serial interface is provided. Through the Serial Data Interface, various device functions, such as individual clock output buffers, can be individually enabled or disabled. The registers associated with the Serial Data Interface initializes to their default setting upon power-up, and therefore use of this interface is optional. Clock device register changes are normally made upon system initialization, if any are required. The interface cannot be used during system operation for power management functions. The clock driver serial protocol accepts byte write, byte read, block write, and block read operations from the controller. For block write/read operation, the bytes must be accessed in sequential order from lowest to highest byte (most significant bit first) with the ability to stop after any complete byte has been transferred. For byte write and byte read operations, the system controller can access individually indexed bytes. The offset of the indexed byte is encoded in the command code, as described in Table 2. The block write and block read protocol is outlined in Table 3 while Table 4 outlines the corresponding byte write and byte read protocol. The slave receiver address is 11010010 (D2h). Table 2. Command Code Definition Bit 7 (6:0) Description 0 = Block read or block write operation, 1 = Byte read or byte write operation Byte offset for byte read or byte write operation. For block read or block write operations, these bits should be '0000000' Table 3. Block Read and Block Write Protocol Block Write Protocol Bit 1 8:2 Description Start Slave address – 7 bits 9 Write 10 18:11 19 27:20 Block Read Protocol Bit 1 8:2 Description Start Slave address – 7 bits 9 Write Acknowledge from slave 10 Acknowledge from slave Command Code – 8 bits 18:11 Command Code – 8 bits Acknowledge from slave 19 Acknowledge from slave Byte Count – 8 bits (Skip this step if I2C_EN bit set) 20 Repeat start Document #: 38-07694 Rev. *B Page 3 of 19 CY28411-1 Table 3. Block Read and Block Write Protocol (continued) Block Write Protocol Bit 28 36:29 37 45:38 Description Acknowledge from slave Block Read Protocol Bit 27:21 Description Slave address – 7 bits Data byte 1 – 8 bits 28 Read = 1 Acknowledge from slave 29 Acknowledge from slave Data byte 2 – 8 bits 37:30 46 Acknowledge from slave .... Data Byte /Slave Acknowledges .... Data Byte N –8 bits 38 46:39 47 .... Acknowledge from slave .... Stop 55:48 Byte Count from slave – 8 bits Acknowledge Data byte 1 from slave – 8 bits Acknowledge Data byte 2 from slave – 8 bits 56 Acknowledge .... Data bytes from slave / Acknowledge .... Data Byte N from slave – 8 bits .... NOT Acknowledge .... Stop Table 4. Byte Read and Byte Write Protocol Byte Write Protocol Bit 1 8:2 Description Start Byte Read Protocol Bit 1 Slave address – 7 bits 8:2 Slave address – 7 bits 9 Write 10 Acknowledge from slave 10 Acknowledge from slave 18:11 Command Code – 8 bits 18:11 Command Code – 8 bits Acknowledge from slave 19 Acknowledge from slave Data byte – 8 bits 20 Repeated start 19 27:20 9 Description Start 28 Acknowledge from slave 29 Stop 27:21 Write Slave address – 7 bits 28 Read 29 Acknowledge from slave 37:30 Data from slave – 8 bits 38 NOT Acknowledge 39 Stop Control Registers Byte 0:Control Register 0 Bit @Pup Name 7 1 CPUT2_ITP/SRCT7 CPUC2_ITP/SRCC7 6 1 SRC[T/C]6 SRC[T/C]6 Output Enable 0 = Disable (Hi-Z), 1 = Enable 5 1 SRC[T/C]5 SRC[T/C]5 Output Enable 0 = Disable (Hi-Z), 1 = Enable 4 1 SRC[T/C]4 SRC[T/C]4 Output Enable 0 = Disable (Hi-Z), 1 = Enable 3 1 SRC[T/C]3 SRC[T/C]3 Output Enable 0 = Disable (Hi-Z), 1 = Enable Document #: 38-07694 Rev. *B Description CPU[T/C]2_ITP/SRC[T/C]7 Output Enable 0 = Disable (Hi-Z), 1 = Enable Page 4 of 19 CY28411-1 Byte 0:Control Register 0 (continued) Bit @Pup Name Description 2 1 SRC[T/C]2 SRC[T/C]2 Output Enable 0 = Disable (Hi-Z), 1 = Enable 1 1 SRC[T/C]1 SRC[T/C]1 Output Enable 0 = Disable (Hi-Z), 1 = Enable 0 1 SRC[T/C]0 SRC[T/C]0 Output Enable 0 = Disable (Hi-Z), 1 = Enable Byte 1: Control Register 1 Bit @Pup Name Description 7 1 PCIF0 6 1 DOT_96T/C 5 1 USB_48 4 1 REF 3 0 Reserved Reserved 2 1 CPU[T/C]1 CPU[T/C]1 Output Enable 0 = Disable (Hi-Z), 1 = Enabled 1 1 CPU[T/C]0 CPU[T/C]0 Output Enable 0 = Disable (Hi-Z), 1 = Enabled 0 0 CPUT/C SRCT/C PCIF PCI PCIF0 Output Enable 0 = Disabled, 1 = Enabled DOT_96 MHz Output Enable 0 = Disable (Hi-Z), 1 = Enabled USB_48 MHz Output Enable 0 = Disabled, 1 = Enabled REF Output Enable 0 = Disabled, 1 = Enabled Spread Spectrum Enable 0 = Spread off, 1 = Spread on Byte 2: Control Register 2 Bit @Pup Name Description 7 1 PCI5 PCI5 Output Enable 0 = Disabled, 1 = Enabled 6 1 PCI4 PCI4 Output Enable 0 = Disabled, 1 = Enabled 5 1 PCI3 PCI3 Output Enable 0 = Disabled, 1 = Enabled 4 1 PCI2 PCI2 Output Enable 0 = Disabled, 1 = Enabled 3 1 Reserved Reserved, Set = 1 2 1 Reserved Reserved, Set = 1 1 1 Reserved 0 1 PCIF1 Reserved, Set = 1 PCIF1 Output Enable 0 = Disabled, 1 = Enabled Byte 3: Control Register 3 Bit @Pup Name Description 7 0 SRC7 Allow control of SRC[T/C]7 with assertion of PCI_STP# or SW PCI_STP# 0 = Free running, 1 = Stopped with PCI_STP# 6 0 SRC6 Allow control of SRC[T/C]6 with assertion of PCI_STP# or SW PCI_STP# 0 = Free running, 1 = Stopped with PCI_STP# 5 0 SRC5 Allow control of SRC[T/C]5 with assertion of PCI_STP# or SW PCI_STP# 0 = Free running, 1 = Stopped with PCI_STP# Document #: 38-07694 Rev. *B Page 5 of 19 CY28411-1 Byte 3: Control Register 3 (continued) Bit @Pup Name Description 4 0 SRC4 Allow control of SRC[T/C]4 with assertion of PCI_STP# or SW PCI_STP# 0 = Free running, 1 = Stopped with PCI_STP# 3 0 SRC3 Allow control of SRC[T/C]3 with assertion of PCI_STP# or SW PCI_STP# 0 = Free running, 1 = Stopped with PCI_STP# 2 0 SRC2 Allow control of SRC[T/C]2 with assertion of PCI_STP# or SW PCI_STP# 0 = Free running, 1 = Stopped with PCI_STP# 1 0 SRC1 Allow control of SRC[T/C]1 with assertion of PCI_STP# or SW PCI_STP# 0 = Free running, 1 = Stopped with PCI_STP# 0 0 SRC0 Allow control of SRC[T/C]0 with assertion of PCI_STP# 0 = Free running, 1 = Stopped with PCI_STP# Byte 4: Control Register 4 Bit @Pup Name Description 7 0 Reserved Reserved, Set = 0 6 0 DOT96T/C DOT_PWRDWN Drive Mode 0 = Driven in PWRDWN, 1 = Hi-Z 5 0 Reserved Reserved, Set = 0 4 0 PCIF1 Allow control of PCIF1 with assertion of PCI_STP# or SW PCI_STP# 0 = Free running, 1 = Stopped with PCI_STP# 3 0 PCIF0 Allow control of PCIF0 with assertion of PCI_STP# or SW PCI_STP# 0 = Free running, 1 = Stopped with PCI_STP# 2 1 CPU[T/C]2 Allow control of CPU[T/C]2 with assertion of CPU_STP# 0 = Free running, 1 = Stopped with CPU_STP# 1 1 CPU[T/C]1 Allow control of CPU[T/C]1 with assertion of CPU_STP# 0 = Free running, 1 = Stopped with CPU_STP# 0 1 CPU[T/C]0 Allow control of CPU[T/C]0 with assertion of CPU_STP# 0 = Free running, 1 = Stopped with CPU_STP# Byte 5: Control Register 5 Bit @Pup Name Description 7 0 SRC[T/C][7:0] SRC[T/C] Stop Drive Mode 0 = Driven when PCI_STP# asserted,1 = Hi-Z when PCI_STP# asserted 6 0 CPU[T/C]2 CPU[T/C]2 Stop Drive Mode 0 = Driven when CPU_STP# asserted,1 = Hi-Z when CPU_STP# asserted 5 0 CPU[T/C]1 CPU[T/C]1 Stop Drive Mode 0 = Driven when CPU_STP# asserted,1 = Hi-Z when CPU_STP# asserted 4 0 CPU[T/C]0 CPU[T/C]0 Stop Drive Mode 0 = Driven when CPU_STP# asserted,1 = Hi-Z when CPU_STP# asserted 3 0 SRC[T/C][7:0] SRC[T/C] PWRDWN Drive Mode 0 = Driven when PD asserted,1 = Hi-Z when PD asserted 2 0 CPU[T/C]2 CPU[T/C]2 PWRDWN Drive Mode 0 = Driven when PD asserted,1 = Hi-Z when PD asserted 1 0 CPU[T/C]1 CPU[T/C]1 PWRDWN Drive Mode 0 = Driven when PD asserted,1 = Hi-Z when PD asserted 0 0 CPU[T/C]0 CPU[T/C]0 PWRDWN Drive Mode 0 = Driven when PD asserted,1 = Hi-Z when PD asserted Document #: 38-07694 Rev. *B Page 6 of 19 CY28411-1 Byte 6: Control Register 6 Bit @Pup Name Description 7 0 REF/N or Hi-Z Select 0 = Hi-Z, 1 = REF/N Clock 6 0 Test Clock Mode Entry Control 0 = Normal operation, 1 = REF/N or Hi-Z mode, 5 0 Reserved 4 1 REF 3 1 PCIF, SRC, PCI 2 Externally selected CPUT/C FS_C Reflects the value of the FS_C pin sampled on power up 0 = FS_C was low during VTT_PWRGD# assertion 1 Externally selected CPUT/C FS_B Reflects the value of the FS_B pin sampled on power up 0 = FS_B was low during VTT_PWRGD# assertion 0 Externally selected CPUT/C FS_A Reflects the value of the FS_A pin sampled on power up 0 = FS_A was low during VTT_PWRGD# assertion Reserved, Set = 0 REF Output Drive Strength 0 = Low, 1 = High SW PCI_STP Function 0=SW PCI_STP assert, 1= SW PCI_STP deassert When this bit is set to 0, all STOPPABLE PCI, PCIF and SRC outputs will be stopped in a synchronous manner with no short pulses. When this bit is set to 1, all STOPPED PCI, PCIF and SRC outputs will resume in a synchronous manner with no short pulses. Byte 7: Vendor ID Bit @Pup Name Description 7 0 Revision Code Bit 3 Revision Code Bit 3 6 0 Revision Code Bit 2 Revision Code Bit 2 5 1 Revision Code Bit 1 Revision Code Bit 1 4 0 Revision Code Bit 0 Revision Code Bit 0 3 1 Vendor ID Bit 3 Vendor ID Bit 3 2 0 Vendor ID Bit 2 Vendor ID Bit 2 1 0 Vendor ID Bit 1 Vendor ID Bit 1 0 0 Vendor ID Bit 0 Vendor ID Bit 0 Crystal Recommendations Crystal Loading The CY28411-1 requires a Parallel Resonance Crystal. Substituting a series resonance crystal will cause the CY28411-1 to operate at the wrong frequency and violate the ppm specification. For most applications there is a 300-ppm frequency shift between series and parallel crystals due to incorrect loading. Crystal loading plays a critical role in achieving low ppm performance. To realize low ppm performance, the total capacitance the crystal will see must be considered to calculate the appropriate capacitive loading (CL). The following diagram shows a typical crystal configuration using the two trim capacitors. An important clarification for the following discussion is that the trim capacitors are in series with the crystal not parallel. It’s a common misconception that load capacitors are in parallel with the crystal and should be approximately equal to the load capacitance of the crystal. This is not true. Table 5. Crystal Recommendations Frequency (Fund) Cut Loading Load Cap Drive (max.) Shunt Cap (max.) Motional (max.) Tolerance (max.) Stability (max.) Aging (max.) 14.31818 MHz AT Parallel 0.1 mW 5 pF 0.016 pF 35 ppm 30 ppm 5 ppm Document #: 38-07694 Rev. *B 20 pF Page 7 of 19 CY28411-1 Figure 1. Crystal Capacitive Clarification Calculating Load Capacitors In addition to the standard external trim capacitors, trace capacitance and pin capacitance must also be considered to correctly calculate crystal loading. As mentioned previously, the capacitance on each side of the crystal is in series with the crystal. This means the total capacitance on each side of the crystal must be twice the specified crystal load capacitance (CL). While the capacitance on each side of the crystal is in series with the crystal, trim capacitors (Ce1,Ce2) should be calculated to provide equal capacitive loading on both sides. Clock Chip Ci2 Ci1 Pin 3 to 6p X2 X1 Cs1 Cs2 Trace 2.8pF XTAL Ce1 Ce2 Trim 33pF Figure 2. Crystal Loading Example As mentioned previously, the capacitance on each side of the crystal is in series with the crystal. This mean the total capacitance on each side of the crystal must be twice the specified load capacitance (CL). While the capacitance on each side of the crystal is in series with the crystal, trim capacitors (Ce1,Ce2) should be calculated to provide equal capacitance loading on both sides. Use the following formulas to calculate the trim capacitor values for Ce1 and Ce2. Ce = 2 * CL – (Cs + Ci) = 1 ( Ce1 + Cs1 + Ci1 + Document #: 38-07694 Rev. *B 1 Ce2 + Cs2 + Ci2 Ce ..................................................... External trim capacitors Cs ..............................................Stray capacitance (terraced) Ci .......................................................... Internal capacitance (lead frame, bond wires etc.) CL ....................................................Crystal load capacitance Ce ..................................................... External trim capacitors Total Capacitance (as seen by the crystal) CLe CLe ......................................... Actual loading seen by crystal using standard value trim capacitors CLe ......................................... Actual loading seen by crystal using standard value trim capacitors Load Capacitance (each side) 1 CL ....................................................Crystal load capacitance ) Cs ..............................................Stray capacitance (terraced) Ci .......................................................... Internal capacitance (lead frame, bond wires etc.) Page 8 of 19 CY28411-1 PD (Power-down) Clarification The VTT_PWRGD# /PD pin is a dual function pin. During initial power-up, the pin functions as VTT_PWRGD#. Once VTT_PWRGD# has been sampled low by the clock chip, the pin assumes PD functionality. The PD pin is an asynchronous active high input used to shut off all clocks cleanly prior to shutting off power to the device. This signal is synchronized internal to the device prior to powering down the clock synthesizer. PD is also an asynchronous input for powering up the system. When PD is asserted high, all clocks need to be driven to a low value and held prior to turning off the VCOs and the crystal oscillator. PD (Power-down) – Assertion When PD is sampled high by two consecutive rising edges of CPUC, all single-ended outputs will be held low on their next high to low transition and differential clocks must held high or Hi-Zd (depending on the state of the control register drive mode bit) on the next diff clock# high to low transition within four clock periods. When the SMBus PD drive mode bit corresponding to the differential (CPU, SRC, and DOT) clock output of interest is programmed to ‘0’, the clock output are held with “Diff clock” pin driven high at 2 x Iref, and “Diff clock#” tri-state. If the control register PD drive mode bit corresponding to the output of interest is programmed to “1”, then both the “Diff clock” and the “Diff clock#” are tristate. Note the example below shows CPUT = 133 MHz and PD drive mode = ‘1’ for all differential outputs. This diagram and description is applicable to valid CPU frequencies 100,133,166,200,266,333 and 400MHz. In the event that PD mode is desired as the initial power-on state, PD must be asserted high in less than 10 uS after asserting Vtt_PwrGd#. PD CPUT, 133MHz CPUC, 133MHz SRCT 100MHz SRCC 100MHz USB, 48MHz DOT96T DOT96C PCI, 33 MHz REF Figure 3. Power-down Assertion Timing Waveform PD Deassertion The power-up latency is less than 1.8 ms. This is the time from the deassertion of the PD pin or the ramping of the power supply until the time that stable clocks are output from the clock chip. All differential outputs stopped in a three-state condition resulting from power down will be driven high in less than 300 µs of PD deassertion to a voltage greater than 200 mV. After the clock chip’s internal PLL is powered up and locked, all outputs will be enabled within a few clock cycles of each other. Below is an example showing the relationship of clocks coming up. Tstable <1.8nS PD CPUT, 133MHz CPUC, 133MHz SRCT 100MHz SRCC 100MHz USB, 48MHz DOT96T DOT96C PCI, 33MHz REF Tdrive_PWRDN# <300µS, >200mV Figure 4. Power-down Deassertion Timing Waveform Document #: 38-07694 Rev. *B Page 9 of 19 CY28411-1 CPU_STP# Assertion The CPU_STP# signal is an active low input used for synchronous stopping and starting the CPU output clocks while the rest of the clock generator continues to function. When the CPU_STP# pin is asserted, all CPU outputs that are set with the SMBus configuration to be stoppable via assertion of CPU_STP# will be stopped within two–six CPU clock periods after being sampled by two rising edges of the internal CPUC clock. The final states of the stopped CPU signals are CPUT = HIGH and CPUC = LOW. There is no change to the output drive current values during the stopped state. The CPUT is driven HIGH with a current value equal to 6 x (Iref), and the CPUC signal will be Hi-Z. CPU_STP# CPUT CPUC Figure 5. CPU_STP# Assertion Waveform CPU_STP# Deassertion The deassertion of the CPU_STP# signal will cause all CPU outputs that were stopped to resume normal operation in a synchronous manner. Synchronous manner meaning that no short or stretched clock pulses will be produce when the clock resumes. The maximum latency from the deassertion to active outputs is no more than two CPU clock cycles. CPU_STP# CPUT CPUC CPUT Internal CPUC Internal Tdrive_CPU_STP#,10nS>200mV Figure 6. CPU_STP# Deassertion Waveform 1.8mS CPU_STOP# PD CPUT(Free Running CPUC(Free Running CPUT(Stoppable) CPUC(Stoppable) DOT96T DOT96C Figure 7. CPU_STP#= Driven, CPU_PD = Driven, DOT_PD = Driven Document #: 38-07694 Rev. *B Page 10 of 19 CY28411-1 1.8mS CPU_STOP# PD CPUT(Free Running) CPUC(Free Running) CPUT(Stoppable) CPUC(Stoppable) DOT96T DOT96C Figure 8. CPU_STP# = Hi-Z, CPU_PD = Hi-Z, DOT_PD = tHi-Z PCI_STP# Assertion[1] The PCI_STP# signal is an active LOW input used for synchronous stopping and starting the PCI outputs while the rest of the clock generator continues to function. The set-up PCI_STP# time for capturing PCI_STP# going LOW is 10 ns (tSU). (See Figure 9.) The PCIF clocks will not be affected by this pin if their corresponding control bit in the SMBus register is set to allow them to be free running. Tsu PCI_F PCI SRC 100MHz Figure 9. PCI_STP# Assertion Waveform PCI_STP# Deassertion The deassertion of the PCI_STP# signal will cause all PCI and stoppable PCIF clocks to resume running in a synchronous manner within two PCI clock periods after PCI_STP# transitions to a high level. Tsu Tdrive_SRC PCI_STP# PCI_F PCI SRC 100MHz Figure 10. PCI_STP# Deassertion Waveform Note: 1. The PCI STOP function is controlled by two inputs. One is the device PCI_STP# pin number 34 and the other is SMBus byte 0 bit 3. These two inputs are logically OR’ed. If either the external pin or the internal SMBus register bit is set low then the stoppable PCI clocks will be stopped in a logic low state. Reading SMBus Byte 0 Bit 3 will return a 0 value if either of these control bits are set LOW thereby indicating the device’s stoppable PCI clocks are not running. Document #: 38-07694 Rev. *B Page 11 of 19 CY28411-1 FS_A, FS_B,FS_C VTT_PW RGD# PW RGD_VRM 0.2-0.3mS Delay VDD Clock Gen State 0 Clock State W ait for VTT_PW RGD# State 1 State 2 Off Clock Outputs State 3 On On Off Clock VCO Device is not affected, VTT_PW RGD# is ignored Sample Sels Figure 11. VTT_PWRGD# Timing Diagram S2 S1 Delay >0.25mS VTT_PWRGD# = Low Sample Inputs straps VDD_A = 2.0V Wait for <1.8ms S0 Power Off S3 VDD_A = off Normal Operation Enable Outputs VTT_PWRGD# = toggle Figure 12. Clock Generator Power-up/Run State Diagram Document #: 38-07694 Rev. *B Page 12 of 19 CY28411-1 Absolute Maximum Conditions Parameter Description Condition Min. Max. Unit VDD Core Supply Voltage –0.5 4.6 V VDD_A Analog Supply Voltage –0.5 4.6 V VIN Input Voltage Relative to VSS –0.5 VDD + 0.5 VDC TS Temperature, Storage Non-functional –65 150 °C TA Temperature, Operating Ambient Functional 0 85 °C TJ Temperature, Junction Functional – 150 °C ØJC Dissipation, Junction to Case (Mil-Spec 883E Method 1012.1) SSOP 39.56 TSSOP 20.62 Dissipation, Junction to Ambient JEDEC (JESD 51) SSOP 45.29 TSSOP 62.26 ESDHBM ESD Protection (Human Body Model) MIL-STD-883, Method 3015 UL-94 Flammability Rating At 1/8 in. MSL Moisture Sensitivity Level ØJA 2000 °C/W °C/W – V V–0 1 Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required. DC Electrical Specifications Parameter Description 3.3V Operating Voltage VDD_A, VDD_REF, VDD_PCI, VDD_3V66, VDD_48, VDD_CPU Condition 3.3 ± 5% Min. Max. Unit 3.135 3.465 V VILI2C Input Low Voltage SDATA, SCLK – 1.0 V VIHI2C Input High Voltage SDATA, SCLK 2.2 – V VIL_FS FS_A/FS_B Input Low Voltage VSS – 0.3 0.35 V VIH_FS FS_A/FS_B Input High Voltage 0.7 VDD + 0.5 V VILFS_C FS_C Low Range 0 0.35 V VIMFS_C FS_C Mid Range 0.7 1.7 V VIH FS_C FS_C High Range VIL 3.3V Input Low Voltage 2.1 VDD V VSS – 0.5 0.8 V VIH 3.3V Input High Voltage 2.0 VDD + 0.5 V IIL Input Low Leakage Current except internal pull-up resistors, 0 < VIN < VDD –5 – µA IIH Input High Leakage Current except internal pull-down resistors, 0 < VIN < VDD – 5 µA VOL 3.3V Output Low Voltage IOL = 1 mA – 0.4 V VOH 3.3V Output High Voltage IOH = –1 mA IOZ High-impedance Output Current 2.4 – V –10 10 µA CIN Input Pin Capacitance 2 5 pF COUT Output Pin Capacitance 3 6 pF LIN Pin Inductance VXIH Xin High Voltage VXIL Xin Low Voltage IDD3.3V Dynamic Supply Current At max. load and freq. per Figure 14 IPD3.3V Power-down Supply Current IPD3.3V Power-down Supply Current Document #: 38-07694 Rev. *B – 7 nH 0.7VDD VDD V 0 0.3VDD V – 550 mA PD asserted, Outputs driven – 70 mA PD asserted, Outputs Hi-Z – 2 mA Page 13 of 19 CY28411-1 AC Electrical Specifications Parameter Condition Min. Max. Unit XIN Duty Cycle The device will operate reliably with input duty cycles up to 30/70 but the REF clock duty cycle will not be within specification 47.5 52.5 % TPERIOD XIN Period When XIN is driven from an external clock source 69.841 71.0 ns TR / TF XIN Rise and Fall Times Measured between 0.3VDD and 0.7VDD – 10.0 ns TCCJ XIN Cycle to Cycle Jitter As an average over 1-µs duration – 500 ps LACC Long-term Accuracy Over 150 ms – 300 ppm CPU at 0.7V TDC CPUT and CPUC Duty Cycle Measured at crossing point VOX 45 55 % Crystal TDC Description TPERIOD 100-MHz CPUT and CPUC Period Measured at crossing point VOX 9.997001 10.00300 ns TPERIOD 133-MHz CPUT and CPUC Period Measured at crossing point VOX 7.497751 7.502251 ns TPERIODSS 100-MHz CPUT and CPUC Period, SSC Measured at crossing point VOX 9.997001 10.05327 ns TPERIODSS 133-MHz CPUT and CPUC Period, SSC Measured at crossing point VOX 7.497751 7.539950 ns TPERIODAbs 100-MHz CPUT and CPUC Absolute period Measured at crossing point VOX 9.912001 10.08800 ns TPERIODAbs 133-MHz CPUT and CPUC Absolute period Measured at crossing point VOX 7.412751 7.587251 ns TPERIODSSAbs 100-MHz CPUT and CPUC Absolute period, SSC Measured at crossing point VOX 9.912001 10.13827 ns TPERIODSSAbs 133-MHz CPUT and CPUC Absolute period, SSC Measured at crossing point VOX 7.412751 7.624950 ns TCCJ CPUT/C Cycle to Cycle Jitter Measured at crossing point VOX – 85 ps TCCJ2 CPU2_ITP Cycle to Cycle Jitter Measured at crossing point VOX – 125 ps TSKEW2 CPU2_ITP to CPU0 Clock Skew Measured at crossing point VOX – 150 ps TR / TF CPUT and CPUC Rise and Fall Times Measured from VOL = 0.175 to VOH = 0.525V 175 700 ps TRFM Rise/Fall Matching Determined as a fraction of 2 * (TR – TF)/(TR + TF) – 20 % ∆TR Rise Time Variation – 125 ps ∆TF Fall Time Variation – 125 ps VHIGH Voltage High Math averages Figure 14 660 850 mV VLOW Voltage Low Math averages Figure 14 –150 – mV VOX Crossing Point Voltage at 0.7V Swing 250 550 mV VOVS Maximum Overshoot Voltage – VHIGH + 0.3 V VUDS Minimum Undershoot Voltage –0.3 – V VRB Ring Back Voltage See Figure 14. Measure SE – 0.2 V SRC TDC SRCT and SRCC Duty Cycle Measured at crossing point VOX 45 55 % TPERIOD 100-MHz SRCT and SRCC Period Measured at crossing point VOX 9.997001 10.00300 ns TPERIODSS 100-MHz SRCT and SRCC Period, SSC Measured at crossing point VOX 9.997001 10.05327 ns TPERIODAbs 100-MHz SRCT and SRCC Absolute Period Measured at crossing point VOX 10.12800 9.872001 ns TPERIODSSAbs 100-MHz SRCT and SRCC Absolute Period, SSC Measured at crossing point VOX 9.872001 10.17827 ns TSKEW Measured at crossing point VOX – 250 ps Any SRCT/C to SRCT/C Clock Skew Document #: 38-07694 Rev. *B Page 14 of 19 CY28411-1 AC Electrical Specifications (continued) Parameter Description Min. Max. Unit Measured at crossing point VOX – 125 ps SRCT/C Long Term Accuracy Measured at crossing point VOX – 300 ppm SRCT and SRCC Rise and Fall Times Measured from VOL = 0.175 to VOH = 0.525V 175 700 ps TRFM Rise/Fall Matching Determined as a fraction of 2 * (TR – TF)/(TR + TF) – 20 % ∆TR Rise TimeVariation – 125 ps ∆TF Fall Time Variation – 125 ps VHIGH Voltage High Math averages Figure 14 660 850 mV VLOW Voltage Low Math averages Figure 14 –150 – mV VOX Crossing Point Voltage at 0.7V Swing 250 550 mV VOVS Maximum Overshoot Voltage – VHIGH + 0.3 V VUDS Minimum Undershoot Voltage –0.3 – V VRB Ring Back Voltage See Figure 14. Measure SE – 0.2 V PCI/PCIF TDC PCI Duty Cycle Measurement at 1.5V 45 55 % TPERIOD Spread Disabled PCIF/PCI Period Measurement at 1.5V 29.99100 30.00900 ns TPERIODSS Spread Enabled PCIF/PCI Period, SSC Measurement at 1.5V 29.9910 30.15980 ns TPERIODAbs Spread Disabled PCIF/PCI Period Measurement at 1.5V 29.49100 30.50900 ns TPERIODSSAbs Spread Enabled PCIF/PCI Period, SSC Measurement at 1.5V TCCJ SRCT/C Cycle to Cycle Jitter LACC TR / TF Condition 29.49100 30.65980 ns Measurement at 2.4V 12.0 – ns PCIF and PCI low time Measurement at 0.4V 12.0 – ns PCIF and PCI rise and fall times Measured between 0.8V and 2.0V 1.0 4.0 V/ns TSKEW Any PCI clock to Any PCI clock Skew Measurement at 1.5V – 500 ps TCCJ PCIF and PCI Cycle to Cycle Jitter Measurement at 1.5V – 500 ps DOT TDC DOT96T and DOT96C Duty Cycle Measured at crossing point VOX 45 55 % TPERIOD DOT96T and DOT96C Period Measured at crossing point VOX 10.41354 10.41979 ns TPERIODAbs DOT96T and DOT96C Absolute Period Measured at crossing point VOX TCCJ DOT96T/C Cycle to Cycle Jitter LACC TR / TF THIGH PCIF and PCI high time TLOW TR / TF 10.16354 10.66979 ns Measured at crossing point VOX – 250 ps DOT96T/C Long Term Accuracy Measured at crossing point VOX – 100 ppm DOT96T and DOT96C Rise and Fall Times Measured from VOL = 0.175 to VOH = 0.525V 175 700 ps TRFM Rise/Fall Matching Determined as a fraction of 2 * (TR – TF)/(TR + TF) – 20 % ∆TR Rise Time Variation – 125 ps ∆TF Fall Time Variation – 125 ps VHIGH Voltage High Math averages Figure 14 660 850 mV VLOW Voltage Low Math averages Figure 14 –150 – mV VOX Crossing Point Voltage at 0.7V Swing 250 550 mV VOVS Maximum Overshoot Voltage – VHIGH + 0.3 V VUDS Minimum Undershoot Voltage –0.3 – V VRB Ring Back Voltage See Figure 14. Measure SE – 0.2 V USB TDC Duty Cycle Measurement at 1.5V 45 55 % Document #: 38-07694 Rev. *B Page 15 of 19 CY28411-1 AC Electrical Specifications (continued) Parameter Description Condition Min. Max. Unit 20.83125 20.83542 ns TPERIOD Period TPERIODAbs Absolute Period Measurement at 1.5V 21.18542 ns THIGH USB high time Measurement at 2.4V 8.094 10.036 ns TLOW USB low time Measurement at 0.4V 7.694 9.836 ns TR / TF Rise and Fall Times Measured between 0.8V and 2.0V 1.0 2.0 V/ns TCCJ Cycle to Cycle Jitter Measurement at 1.5V – 350 ps REF TDC REF Duty Cycle Measurement at 1.5V 45 55 % TPERIOD REF Period Measurement at 1.5V 69.8203 69.8622 ns TPERIODAbs REF Absolute Period Measurement at 1.5V 68.82033 70.86224 ns TR / TF REF Rise and Fall Times Measured between 0.8V and 2.0V 1.0 4.0 V/ns TCCJ REF Cycle to Cycle Jitter Measurement at 1.5V – 1000 ps Measurement at 1.5V 20.48125 ENABLE/DISABLE and SET-UP TSTABLE Clock Stabilization from Power-up TSS Stopclock Set-up Time TSH Stopclock Hold Time – 1.8 ms 10.0 – ns 0 – ns Test and Measurement Set-up For PCI Single-ended Signals and Reference The following diagram shows the test load configurations for the single-ended PCI, USB, and REF output signals. PCI/ USB 12Ω 60Ω Measurement Point 4pF 12Ω 60Ω Measurement Point 4pF 12Ω 60Ω 12Ω 60Ω Measurement Point 4pF REF Measurement Point 4pF 12Ω 60Ω Measurement Point 4pF Figure 13. Single-ended Load Configuration Document #: 38-07694 Rev. *B Page 16 of 19 CY28411-1 For Differential CPU, SRC and DOT96 Output Signals The following diagram shows the test load configuration for the differential CPU and SRC outputs. CPUT SRCT D O T96T M e a s u re m e n t P o in t 33Ω 4 9 .9 Ω CPUC SRCC D O T96C IR E F 2pF 1 0 0 Ω D iff e r e n tia l M e a s u re m e n t P o in t 33Ω 2pF 4 9 .9 Ω 475Ω Figure 14. 0.7V Single-ended Load Configuration O u tp u t u n d e r T e s t tD C P ro b e 3 .3 V 2 .4 V Loas C ap 1 .5 V 0 .4 V 0V Tr Tf Figure 15. Single-ended Output Signals (for AC Parameters Measurement) Ordering Information Part Number Package Type Product Flow Lead-free CY28411OXC-1 56-pin SSOP Commercial, 0° to 85°C CY28411OXCT-1 56-pin SSOP – Tape and Reel Commercial, 0° to 85°C CY28411ZXC-1 56-pin TSSOP Commercial, 0° to 85°C CY28411ZXCT-1 56-pin TSSOP – Tape and Reel Commercial, 0° to 85°C Document #: 38-07694 Rev. *B Page 17 of 19 CY28411-1 Package Drawing and Dimensions 56-Lead Thin Shrunk Small Outline Package, Type II (6 mm x 12 mm) Z56 0.249[0.009] 28 1 DIMENSIONS IN MM[INCHES] MIN. MAX. REFERENCE JEDEC MO-153 7.950[0.313] 8.255[0.325] PACKAGE WEIGHT 0.42gms 5.994[0.236] 6.198[0.244] PART # Z5624 STANDARD PKG. ZZ5624 LEAD FREE PKG. 29 56 13.894[0.547] 14.097[0.555] 1.100[0.043] MAX. GAUGE PLANE 0.25[0.010] 0.20[0.008] 0.851[0.033] 0.950[0.037] 0.500[0.020] BSC 0.051[0.002] 0.152[0.006] 0.170[0.006] 0.279[0.011] 0.508[0.020] 0.762[0.030] 0°-8° 0.100[0.003] 0.200[0.008] SEATING PLANE 51-85060-*C 56-Lead Shrunk Small Outline Package O56 .020 1 28 0.395 0.420 0.292 0.299 29 DIMENSIONS IN INCHES MIN. MAX. 56 0.720 0.730 SEATING PLANE 0.088 0.092 0.095 0.110 0.005 0.010 .010 GAUGE PLANE 0.025 BSC 0.110 0.008 0.0135 0.008 0.016 0°-8° 0.024 0.040 51-85062-*C Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. Intel and Pentium are registered trademarks of Intel Corporation. All product and company names mentioned in this document are the trademarks of their respective holders. Document #: 38-07694 Rev. *B Page 18 of 19 © Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY28411-1 Document History Page Document Title: CY28411-1 Clock Generator for Intel Alviso Chipset Document Number: 38-07694 REV. ECN NO. Issue Date Orig. of Change Description of Change ** 246811 See ECN RGL New data sheet *A 299753 See ECN RGL Corrected the Operating Ambient Temp from 0 to 85°C to 0 to 70°C *B 331934 See ECN RGL Minor Change: Pls. ignore the changes in Rev *A - Ambient Temp. remained 0 to 85°C Document #: 38-07694 Rev. *B Page 19 of 19