CY54FCT541T, CY74FCT541T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS072 – OCTOBER 2001 D D D D D D D OEA D0 D1 D2 D3 D4 D5 D6 D7 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC OEB O0 O1 O2 O3 O4 O5 O6 O7 CY54FCT541T . . . L PACKAGE (TOP VIEW) D2 D3 D4 D5 D6 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 O0 O1 O2 O3 O4 D7 GND O7 O6 O5 description OEB D CY54FCT541T . . . D PACKAGE CY74FCT541T . . . P, Q, OR SO PACKAGE (TOP VIEW) OEA VCC D Function, Pinout, and Drive Compatible With FCT and F Logic Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics Ioff Supports Partial-Power-Down Mode Operation ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) Matched Rise and Fall Times Fully Compatible With TTL Input and Output Logic Levels CY54FCT541T – 48-mA Output Sink Current – 12-mA Output Source Current CY74FCT541T – 64-mA Output Sink Current – 32-mA Output Source Current 3-State Outputs D1 D0 D The ’FCT541T noninverting buffers/line drivers can be employed as memory address drivers, clock drivers, and bus-oriented transmitters/receivers. These devices provide speed and drive capabilities equivalent to their fastest bipolar-logic counterparts, while reducing power dissipation. The input and output voltage levels allow direct interface with TTL, NMOS, and CMOS devices without external components. These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CY54FCT541T, CY74FCT541T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS072 – OCTOBER 2001 ORDERING INFORMATION QSOP – Q TOP-SIDE MARKING 4.1 CY74FCT541CTQCT Tube 4.1 CY74FCT541CTSOC Tape and reel 4.1 CY74FCT541CTSOCT DIP – P Tube 4.8 CY74FCT541ATPC CY74FCT541ATPC QSOP – Q Tape and reel 4.8 CY74FCT541ATQCT FCT541A Tube 4.8 CY74FCT541ATSOC Tape and reel 4.8 CY74FCT541ATSOCT SOIC – SO SOIC – SO –55°C to 125°C ORDERABLE PART NUMBER Tape and reel SOIC – SO –40°C to 85°C SPEED (ns) PACKAGE† TA Tube 8 CY74FCT541TSOC Tape and reel 8 CY74FCT541TSOCT CY54FCT541CTDMB CDIP – D Tube 4.6 CDIP – D Tube 8 LCC – L Tube 8 FCT541C FCT541C FCT541A FCT541 CY54FCT541TDMB CY54FCT541TLMB † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS D OUTPUT O OEA OEB L L L L L L H H H H X Z H = High logic level, L = Low logic level, X = Don’t care, Z = High-impedance state logic diagram (positive logic) OEA OEB D0 1 19 2 18 To Seven Other Channels 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 O0 CY54FCT541T, CY74FCT541T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS072 – OCTOBER 2001 absolute maximum rating over operating free-air temperature range (unless otherwise noted)† Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA Package thermal impedance, θJA (see Note 1): P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 2) CY54FCT541T CY74FCT541T MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.75 5 5.25 UNIT VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 0.8 V High-level output current –12 –32 mA IOL TA Low-level output current 48 64 mA 85 °C High-level input voltage 2 Operating free-air temperature –55 2 125 –40 V V NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CY54FCT541T, CY74FCT541T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS072 – OCTOBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH CY54FCT541T TYP† MAX TEST CONDITIONS VCC = 4.5, V VCC = 4.75 V, IIN = –18 mA IIN = –18 mA VCC =4.5 V, IOH = –12 mA IOH = –32 mA VCC = 4 4.75 75 V MIN –0.7 –1.2 –0.7 2.4 2.4 Vhys All inputs II VCC = 5.5 V, VCC = 5.25 V, VIN = VCC VIN = VCC 5 IIH VCC = 5.5 V, VCC = 5.25 V, VIN = 2.7 V VIN = 2.7 V ±1 IIL VCC = 5.5 V, VCC = 5.25 V, VIN = 0.5 V VIN = 0.5 V ±1 IOZH VCC = 5.5 V, VCC = 5.25 V, VOUT = 2.7 V VOUT = 2.7 V 10 IOZL VCC = 5.5 V, VCC = 5.25 V, VOUT = 0.5 V VOUT = 0.5 V –10 IOS‡ VCC = 5.5 V, VCC = 5.25 V, VOUT = 0 V VOUT = 0 V VCC = 0 V, VCC = 5.5 V, VOUT = 4.5 V VIN ≤ 0.2 V, ∆ICC 0.3 0.3 0.2 0.55 0.2 ±1 ±1 10 –10 –120 –225 –60 –120 ±1 VIN ≥ VCC – 0.2 V VIN ≥ VCC – 0.2 V 0.1 0.5 V V 5 VIN ≤ 0.2 V, VCC = 5.5 V, VIN = 3.4 V§, f1 = 0, Outputs open VCC = 5.25 V, 3.3 0.55 IOL = 64 mA –60 V V 2 IOH = –15 mA IOL = 48 mA VCC = 4.5 V, VCC = 4.75 V, ICC –1.2 UNIT 3.3 VOL Ioff CY74FCT541T TYP† MAX MIN –225 ±1 0.2 0.1 0.2 0.5 2 µA µA µA µA µA mA µA mA 2 mA VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open VCC = 5.5 V, 50% duty cycle, Outputs open, One bit switching at f1 = 10 MHz, 0.06 0.12 OEA = OEB = GND or OEA = GND and OEB = VCC, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V mA/ ICCD¶ MHz VCC = 5.25 V, 50% duty cycle, Outputs open, One bit switching at f1 = 10 MHz, 0.06 0.12 OEA = OEB = GND or OEA = GND and OEB = VCC, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V † Typical values are at VCC = 5 V, TA = 25°C. ‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. § Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND ¶ This parameter is derived for use in total power-supply calculations. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY54FCT541T, CY74FCT541T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS072 – OCTOBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) (continued) PARAMETER CY54FCT541T TYP† MAX TEST CONDITIONS VCC = 5.5 V, Outputs Out uts o open en, OEA = OEB = GND or OEA = GND and OEB = VCC One bit switching at f1 = 10 MHz at 50% duty cycle VCC = 5.25 V, Out uts o en, Outputs open OEA = OEB = GND or OEA = GND and OEB = VCC One bit switching at f1 = 10 MHz at 50% duty cycle IC# Eight bits switching at f1 = 2.5 MHz at 50% duty cycle MIN VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V VIN = 3.4 V or GND VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V VIN = 3.4 V or GND VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 0.7 1.4 1 2.4 1.3 2.6|| 3.3 10.6|| CY74FCT541T TYP† MAX MIN UNIT mA 0.7 1.4 1 2.4 1.3 2.6|| 3.3 10.6|| Ci 5 10 pF Co 9 12 pF Eight bits switching at f1 = 2.5 MHz at 50% duty cycle VIN = 3.4 V or GND VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V VIN = 3.4 V or GND † Typical values are at VCC = 5 V, TA = 25°C. # IC = ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1) Where: IC = Total supply current ICC = Power-supply current with CMOS input levels ∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V) DH = Duty cycle for TTL inputs high NT = Number of TTL inputs at DH ICCD = Dynamic current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N1 = Number of inputs changing at f1 All currents are in milliamperes and all frequencies are in megahertz. || Values for these conditions are examples of the ICC formula. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 CY54FCT541T, CY74FCT541T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS072 – OCTOBER 2001 switching characteristics over operating free-air temperature range (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL D O tPZH tPZL OE O tPHZ tPLZ OE O CY54FCT541T CY54FCT541CT MIN MAX MIN MAX 1.5 8 1.5 4.6 1.5 8 1.5 4.6 1.5 10.5 1.5 6.5 1.5 10.5 1.5 6.5 1.5 10 1.5 5.7 1.5 10 1.5 5.7 UNIT ns ns ns switching characteristics over operating free-air temperature range (see Figure 1) 6 PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL D O tPZH tPZL OE O tPHZ tPLZ OE O POST OFFICE BOX 655303 CY74FCT541T CY74FCT541AT CY74FCT541CT MIN MAX MIN MAX MIN MAX 1.5 8 1.5 4.8 1.5 4.1 1.5 8 1.5 4.8 1.5 4.1 1.5 10 1.5 6.2 1.5 5.8 1.5 10 1.5 6.2 1.5 5.8 1.5 9.5 1.5 5.6 1.5 5.2 1.5 9.5 1.5 5.6 1.5 5.2 • DALLAS, TEXAS 75265 UNIT ns ns ns CY54FCT541T, CY74FCT541T 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS SCCS072 – OCTOBER 2001 PARAMETER MEASUREMENT INFORMATION 7V From Output Under Test From Output Under Test Test Point CL = 50 pF (see Note A) Open TEST GND CL = 50 pF (see Note A) 500 Ω S1 500 Ω S1 Open 7V Open tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 500 Ω LOAD CIRCUIT FOR 3-STATE OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw tsu 3V 1.5 V Input 1.5 V th 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output tPLZ ≈3.5 V 1.5 V tPZH VOH 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V Output Waveform 1 (see Note B) tPLH 1.5 V 1.5 V tPZL VOH In-Phase Output 3V Output Control Output Waveform 2 (see Note B) VOL + 0.3 V VOL tPHZ 1.5 V VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 PACKAGE OPTION ADDENDUM www.ti.com 25-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) (Requires Login) 5962-9223701M2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-9223701MRA ACTIVE CDIP J 20 1 TBD Call TI Call TI 5962-9223705MRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type CY54FCT541TDMB ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type CY54FCT541TLMB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type CY74FCT541ATPC ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CY74FCT541ATPCE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CY74FCT541ATQCT ACTIVE SSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT541ATQCTE4 ACTIVE SSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT541ATQCTG4 ACTIVE SSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT541ATSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT541ATSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT541ATSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT541ATSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT541ATSOCTE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT541ATSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT541CTQCT ACTIVE SSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT541CTQCTE4 ACTIVE SSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT541CTQCTG4 ACTIVE SSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT541CTSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 25-Aug-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CY74FCT541CTSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT541CTSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT541CTSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT541CTSOCTE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT541CTSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT541TQCT ACTIVE SSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT541TQCTE4 ACTIVE SSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT541TQCTG4 ACTIVE SSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT541TSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT541TSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT541TSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT541TSOCT OBSOLETE SOIC DW 20 TBD Call TI Call TI CY74FCT541TSOCTE4 OBSOLETE SOIC DW 20 TBD Call TI Call TI CY74FCT541TSOCTG4 OBSOLETE SOIC DW 20 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 25-Aug-2012 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device CY74FCT541ATQCT Package Package Pins Type Drawing SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT541ATSOCT SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CY74FCT541CTQCT SSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT541CTSOCT SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CY74FCT541TQCT SSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CY74FCT541ATQCT SSOP DBQ 20 2500 367.0 367.0 38.0 CY74FCT541ATSOCT SOIC DW 20 2000 367.0 367.0 45.0 CY74FCT541CTQCT SSOP DBQ 20 2500 367.0 367.0 38.0 CY74FCT541CTSOCT SOIC DW 20 2000 367.0 367.0 45.0 CY74FCT541TQCT SSOP DBQ 20 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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