TI1 DAC5311IDCKT 1.8v to 5.5v, 80î¼a, 8-, 10-, and 12-bit, low-power, single-channel, digital-to-analog converters in sc70 package Datasheet

DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
1.8V to 5.5V, 80μA, 8-, 10-, and 12-Bit, Low-Power, Single-Channel,
DIGITAL-TO-ANALOG CONVERTERS in SC70 Package
Check for Samples: DAC5311, DAC6311, DAC7311
FEATURES
DESCRIPTION
• Relative Accuracy:
– 0.25 LSB INL (DAC5311: 8-bit)
– 0.5 LSB INL (DAC6311: 10-bit)
– 1 LSB INL (DAC7311: 12-bit)
• microPower Operation: 80μA at 1.8V
• Power-Down: 0.5μA at 5V, 0.1μA at 1.8V
• Wide Power Supply: +1.8V to +5.5V
• Power-On Reset to Zero Scale
• Straight Binary Data Format
• Low Power Serial Interface with
Schmitt-Triggered Inputs: Up to 50MHz
• On-Chip Output Buffer Amplifier, Rail-to-Rail
Operation
• SYNC Interrupt Facility
• Extended Temperature Range –40°C to +125°C
• Pin-Compatible Family in a Tiny, 6-Pin SC70
Package
The DAC5311 (8-bit), DAC6311 (10-bit), and
DAC7311 (12-bit) are low-power, single-channel,
voltage output digital-to-analog converters (DAC).
They are monotonic by design and provide excellent
linearity and minimize undesired code-to-code
transient voltages while offering an easy upgrade
path within a pin-compatible family. All devices use a
versatile, 3-wire serial interface that operates at clock
rates of up to 50MHz and is compatible with standard
SPI™, QSPI™, MICROWIRE™, and digital signal
processor (DSP) interfaces.
1
234
APPLICATIONS
•
•
•
•
Portable, Battery-Powered instruments
Process Control
Digital Gain and Offset Adjustment
Programmable Voltage and Current Sources
RELATED
DEVICES
Pin and
Function
Compatible
16-BIT
14-BIT
12-BIT
10-BIT
8-BIT
DAC8411
DAC8311
DAC7311
DAC6311
DAC5311
All devices use an external power supply as a
reference voltage to set the output range. The
devices incorporate a power-on reset (POR) circuit
that ensures the DAC output powers up at 0V and
remains there until a valid write to the device occurs.
The DAC5311, DAC6311, and DAC7311 contain a
power-down feature, accessed over the serial
interface, that reduces current consumption of the
device to 0.1μA at 1.8V in power down mode. The
low power consumption of this part in normal
operation makes it ideally suited for portable,
battery-operated equipment. The power consumption
is 0.55mW at 5V, reducing to 2.5μW in power-down
mode.
These devices are pin-compatible with the DAC8311
and DAC8411, offering an easy upgrade path from
8-, 10-, and 12-bit resolution to 14- and 16-bit. All
devices are available in a small, 6-pin, SC70
package.
This
package
offers
a
flexible,
pin-compatible, and functionally-compatible drop-in
solution within the family over an extended
temperature range of –40°C to +125°C.
AVDD
GND
Power-On
Reset
REF(+)
DAC
Register
8-/10-/12-Bit
DAC
Input Control
Logic
SYNC SCLK
Output
Buffer
Power-Down
Control Logic
VOUT
Resistor
Network
DIN
1
2
3
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI, QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corporation.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION (1)
PRODUCT
MAXIMUM
RELATIVE
ACCURACY
(LSB)
MAXIMUM
DIFFERENTIAL
NONLINEARITY
(LSB)
PACKAGELEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
DAC5311
±0.25
±0.25
SC70-6
DCK
–40°C to 125°C
D53
DAC6311
±0.5
±0.5
SC70-6
DCK
–40°C to 125°C
D63
DAC7311
±1
±1
SC70-6
DCK
–40°C to 125°C
D73
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
PARAMETER
VALUE
UNIT
AVDD to GND
–0.3 to +6
V
Digital input voltage to GND
–0.3 to +AVDD +0.3
V
AVOUT to GND
–0.3 to +AVDD +0.3
V
Operating temperature range
–40 to +125
°C
Storage temperature range
–65 to +150
°C
+150
°C
Junction temperature (TJ max)
Power dissipation
θJA thermal impedance
(1)
2
(TJ max – TA)/θJA
W
250
°C/W
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
At AVDD = +1.8V to +5.5V, RL = 2kΩ to GND, and CL = 200 pF to GND, unless otherwise noted.
DAC5311, DAC6311,
DAC7311
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
STATIC PERFORMANCE (1)
Resolution
DAC5311
Relative accuracy
8
Measured by the line passing through codes 3 and 252
Differential
nonlinearity
Resolution
DAC6311
Relative accuracy
Resolution
DAC7311
Measured by the line passing through two codes (2)
Offset error drift
LSB
±0.01
±0.25
LSB
±0.06
±0.5
LSB
±0.03
±0.5
LSB
±0.3
±1
LSB
±0.2
±1
LSB
±0.05
±4
Bits
Bits
All zeros loaded to the DAC register
Full-scale error
All ones loaded to DAC register
0.2
Gain error
mV
μV/°C
3
Zero code error
Gain temperature coefficient
±0.25
12
Measured by the line passing through codes 30 and 4050
Differential
nonlinearity
Offset error
±0.01
10
Measured by the line passing through codes 12 and 1012
Differential
nonlinearity
Relative accuracy
Bits
mV
0.04
0.2
% of FSR
0.05
±0.15
% of FSR
AVDD = +5V
±0.5
AVDD = +1.8V
±1.5
ppm of
FSR/°C
OUTPUT CHARACTERISTICS (3)
Output voltage range
Output voltage settling time
0
RL = 2kΩ, CL = 200 pF, AVDD = 5V, 1/4 scale to 3/4 scale
RL = 2MΩ, CL = 470pF
Slew rate
Capacitive load stability
Code change glitch impulse
RL = ∞
RL = 2kΩ
1LSB change around major carry
Digital feedthrough
Power-on glitch impulse
RL = 2kΩ, CL = 200pF, AVDD = 5V
Power-up time
V
10
μs
12
μs
0.7
V/μs
470
pF
1000
pF
0.5
nV-s
0.5
nV-s
17
mV
0.5
Ω
AVDD = +5V
50
mA
AVDD = +3V
20
mA
Coming out of power-down mode
50
μs
81
dB
–65
dB
65
dB
65
dB
TA= +25°C, at zero-scale input, fOUT = 1kHz, AVDD = 5V
17
nV/√Hz
TA= +25°C, at mid-code input, fOUT = 1kHz, AVDD = 5V
110
nV/√Hz
DC output impedance
Short-circuit current
6
AVDD
AC PERFORMANCE
SNR
THD
SFDR
TA= +25°C, BW = 20kHz, 12-bit level, AVDD = 5V,
fOUT = 1kHz, 1st 19 harmonics removed for SNR
calculation
SINAD
DAC output noise density (4)
DAC output noise (5)
(1)
(2)
(3)
(4)
(5)
TA= +25°C, at mid-code input, 0.1Hz to 10Hz, AVDD = 5V
3
μVPP
Linearity calculated using a reduced code range of 3 to 252 for 8-bit, 12 to 1012 for 10bit, and 30 to 4050 for 12-bit, output unloaded.
Straight line passing through codes 3 and 252 for 8-bit, 12 and 1012 for 10bit, and 30 and 4050 for 12-bit, output unloaded.
Specified by design and characterization, not production tested.
For more details, see Figure 22.
For more details, see Figure 23.
Copyright © 2008–2011, Texas Instruments Incorporated
3
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
At AVDD = +1.8V to +5.5V, RL = 2kΩ to GND, and CL = 200 pF to GND, unless otherwise noted.
DAC5311, DAC6311,
DAC7311
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
LOGIC INPUTS (6)
±1
μA
AVDD = 2.7V to 5.5V
0.3AVDD
V
AVDD = 1.8V to 2.7V
0.1AVDD
V
Input current
VINL, input low voltage
VINH, input high voltage
AVDD = 2.7V to 5.5V
0.7AVDD
AVDD = 1.8V to 2.7V
0.9AVDD
Pin capacitance
V
V
1.5
3
pF
5.5
V
POWER REQUIREMENTS
AVDD
1.8
Normal mode
VINH = AVDD and VINL =
GND, at midscale code (7)
IDD
All power-down mode
Normal mode
VINH = AVDD and VINL =
GND, at midscale code
VINH = AVDD and VINL =
GND, at midscale code
Power
dissipation
VINH = AVDD and VINL =
All power-down mode
GND, at midscale code
AVDD = 3.6V to 5.5V
110
160
AVDD = 2.7V to 3.6V
95
150
AVDD = 1.8V to 2.7V
80
140
AVDD = 3.6V to 5.5V
0.5
3.5
AVDD = 2.7V to 3.6V
0.4
3.0
AVDD = 1.8V to 2.7V
0.1
2.0
AVDD = 3.6V to 5.5V
0.55
0.88
AVDD = 2.7V to 3.6V
0.25
0.54
AVDD = 1.8V to 2.7V
0.14
0.38
AVDD = 3.6V to 5.5V
2.50
19.2
AVDD = 2.7V to 3.6V
1.08
10.8
AVDD = 1.8V to 2.7V
0.72
8.1
μA
μA
mW
μW
TEMPERATURE RANGE
Specified performance range
(6)
(7)
4
–40
+125
°C
Specified by design and characterization, not production tested.
For more details, see Figure 15, Figure 58, and Figure 91.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
PIN CONFIGURATION
DCK PACKAGE
SC70-6
(TOP VIEW)
SYNC
1
6
VOUT
SCLK
2
5
GND
DIN
3
4
AVDD/VREF
Table 1. PIN DESCRIPTION
PIN
NAME
DESCRIPTION
1
SYNC
Level-triggered control input (active low). This is the frame sychronization signal for the input data. When
SYNC goes low, it enables the input shift register and data are transferred in on the falling edges of the
following clocks. The DAC is updated following 16th clock cycle, unless SYNC is taken high before this
edge, in which case the rising edge of SYNC acts as an interrupt and the write sequence is ignored by
the DACx311. Refer to the SYNC Interrupt section for more details.
2
SCLK
Serial Clock Input. Data can be transferred at rates up to 50MHz.
3
DIN
4
AVDD/VREF
5
GND
Ground reference point for all circuitry on the part.
6
VOUT
Analog output voltage from DAC. The output amplifier has rail-to-rail operation.
Serial Data Input. Data is clocked into the 16-bit input shift register on the falling edge of the serial clock
input.
Power Supply Input, +1.8V to 5.5V.
Copyright © 2008–2011, Texas Instruments Incorporated
5
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
SERIAL WRITE OPERATION
t9
t1
SCLK
1
16
t8
t3
t4
t2
t7
SYNC
t6
t10
t5
DIN
DB15
DB0
DB15
TIMING REQUIREMENTS (1)
All specifications at –40°C to +125°C, and AVDD = +1.8V to +5.5V, unless otherwise noted.
PARAMETER
t1
(2)
SCLK cycle time
t2
SCLK high time
t3
SCLK low time
t4
SYNC to SCLK rising edge setup time
t5
Data setup time
t6
Data hold time
t7
SCLK falling edge to SYNC rising edge
t8
Minimum SYNC high time
t9
16th SCLK falling edge to SYNC falling edge
t10
SYNC rising edge to 16th SCLK falling edge
(for successful SYNC interrupt)
(1)
(2)
6
TEST CONDITIONS
MIN
AVDD = 1.8V to 3.6V
50
AVDD = 3.6V to 5.5V
20
AVDD = 1.8V to 3.6V
25
AVDD = 3.6V to 5.5V
10
AVDD = 1.8V to 3.6V
25
AVDD = 3.6V to 5.5V
10
AVDD = 1.8V to 3.6V
0
AVDD = 3.6V to 5.5V
0
AVDD = 1.8V to 3.6V
5
AVDD = 3.6V to 5.5V
5
AVDD = 1.8V to 3.6V
4.5
AVDD = 3.6V to 5.5V
4.5
AVDD = 1.8V to 3.6V
0
AVDD = 3.6V to 5.5V
0
AVDD = 1.8V to 3.6V
50
AVDD = 3.6V to 5.5V
20
AVDD = 1.8V to 3.6V
100
AVDD = 3.6V to 5.5V
100
AVDD = 1.8V to 3.6V
15
AVDD = 3.6V to 5.5V
15
TYP
MAX
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
All input signals are specified with tR = tF = 3ns (10% to 90% of AVDD) and timed from a voltage level of (VIL + VIH)/2.
Maximum SCLK frequency is 50MHz at AVDD = 3.6V to 5.5V and 20MHz at AVDD = 1.8V to 3.6V.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +5V
At TA = +25°C, AVDD = +5V, and DAC loaded with midscale code, unless otherwise noted.
DAC7311 12-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (–40°C)
0.10
AVDD = 5V
LE (LSB)
0.25
0
0
-0.05
-0.50
-0.10
0.2
0.06
0.1
0
-0.1
-0.2
AVDD = 5V
0.05
-0.25
DLE (LSB)
DLE (LSB)
LE (LSB)
0.50
DAC6311 10-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (–40°C)
0.03
0
-0.03
-0.06
0
512
1024
1536
2048
2560
3072
3584
4096
0
128
256
Digital Input Code
768
896
1024
DAC7311 12-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+25°C)
DAC6311 10-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+25°C)
0.10
AVDD = 5V
LE (LSB)
0.25
0
0
-0.05
-0.50
-0.10
0.2
0.06
0.1
0
-0.1
AVDD = 5V
0.05
-0.25
DLE (LSB)
LE (LSB)
DLE (LSB)
640
Figure 2.
-0.2
0.03
0
-0.03
-0.06
0
512
1024
1536
2048
2560
3072
3584
4096
0
128
256
Digital Input Code
384
512
640
768
896
1024
Digital Input Code
Figure 3.
Figure 4.
DAC7311 12-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+125°C)
DAC6311 10-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+125°C)
0.50
0.10
AVDD = 5V
LE (LSB)
0.25
0
0
-0.05
-0.50
-0.10
0.2
0.06
0.1
0
-0.1
-0.2
AVDD = 5V
0.05
-0.25
DLE (LSB)
LE (LSB)
512
Digital Input Code
Figure 1.
0.50
DLE (LSB)
384
0.03
0
-0.03
-0.06
0
512
1024
1536
2048
2560
3072
Digital Input Code
Figure 5.
Copyright © 2008–2011, Texas Instruments Incorporated
3584
4096
0
128
256
384
512
640
768
896
1024
Digital Input Code
Figure 6.
7
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +5V (continued)
At TA = +25°C, AVDD = +5V, and DAC loaded with midscale code, unless otherwise noted.
DAC5311 8-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (–40°C)
0.4
AVDD = 5V
0.01
AVDD = 5V
0
Zero-Code Error (mV)
LE (LSB)
0.02
-0.01
-0.02
0.02
DLE (LSB)
ZERO-CODE ERROR
vs TEMPERATURE
0.01
0
0.3
0.2
0.1
-0.01
0
-40 -25 -10
-0.02
0
32
64
96
128
160
192
224
256
5
Digital Input Code
OFFSET ERROR
vs TEMPERATURE
95
110 125
80
95
110 125
95
110 125
AVDD = 5V
0.4
0
Offset Error (mV)
LE (LSB)
80
0.6
AVDD = 5V
0.01
0.02
DLE (LSB)
65
DAC5311 8-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+25°C)
-0.02
0.01
0.2
0
-0.2
0
-0.4
-0.01
-0.6
-40 -25 -10
-0.02
0
32
64
96
128
160
192
224
256
5
Digital Input Code
20
35
50
65
Temperature (°C)
Figure 9.
Figure 10.
DAC5311 8-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+125°C)
FULL-SCALE ERROR
vs TEMPERATURE
0.02
0.06
AVDD = 5V
0.01
AVDD = 5V
0.04
0
Full-Scale Error (mV)
LE (LSB)
50
Figure 8.
-0.01
-0.01
-0.02
0.02
DLE (LSB)
35
Temperature (°C)
Figure 7.
0.02
0.01
0
0.02
0
-0.02
-0.04
-0.01
-0.02
0
32
64
96
128
160
Digital Input Code
Figure 11.
8
20
192
224
256
-0.06
-40 -25 -10
5
20
35
50
65
80
Temperature (°C)
Figure 12.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +5V (continued)
At TA = +25°C, AVDD = +5V, and DAC loaded with midscale code, unless otherwise noted.
SOURCE CURRENT
AT POSITIVE RAIL
SINK CURRENT
AT NEGATIVE RAIL
0.6
AVDD = 5V
DAC Loaded with 000h
5.0
Analog Output Voltage (V)
Analog Output Voltage (V)
5.5
4.5
4.0
3.5
3.0
AVDD = 5V
DAC Loaded with FFFh
2.5
0
2
0.4
0.2
0
4
6
8
10
0
2
4
ISOURCE (mA)
Figure 14.
POWER-SUPPLY CURRENT
vs DIGITAL INPUT CODE
POWER-SUPPLY CURRENT
vs LOGIC INPUT VOLTAGE
10
2000
SYNC Input (all other digital inputs = GND)
Power-Supply Current (mA)
AVDD = 5.5V
Power-Supply Current (mA)
8
Figure 13.
120
100
80
60
1500
Sweep from
0V to 5.5V
1000
Sweep from
5.5V to 0V
500
0
0
512
1024
1536
2048
2560
3072
3584
4096
0
0.5
1.0
1.5
2.0
Digital Input Code
2.5
3.0
3.5
4.0
4.5
5.0
95
110 125
VLOGIC (V)
Figure 15.
Figure 16.
POWER-SUPPLY CURRENT
vs TEMPERATURE
POWER-DOWN CURRENT
vs TEMPERATURE
140
1.6
AVDD = 5V
AVDD = 5V
Quiescent Current (mA)
Power-Supply Current (mA)
6
ISINK (mA)
130
120
110
100
-40 -25 -10
5
20
35
50
65
80
Temperature (°C)
Figure 17.
Copyright © 2008–2011, Texas Instruments Incorporated
95
110 125
1.2
0.8
0.4
0
-40 -25 -10
5
20
35
50
65
80
Temperature (°C)
Figure 18.
9
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +5V (continued)
At TA = +25°C, AVDD = +5V, and DAC loaded with midscale code, unless otherwise noted.
TOTAL HARMONIC DISTORTION
vs OUTPUT FREQUENCY
102
-20
AVDD = 5V, fS = 225kSPS,
-1dB FSR Digital Input,
Measurement Bandwidth = 20kHz
-40
AVDD = 5V, fS = 225kSPS,
-1dB FSR Digital Input,
Measurement Bandwidth = 20kHz
94
THD
SNR (dB)
THD (dB)
SIGNAL-TO-NOISE RATIO
vs OUTPUT FREQUENCY
-60
86
2nd Harmonic
78
-80
3rd Harmonic
70
-100
0
1
2
3
4
5
0
1
2
fOUT (kHz)
4
Figure 19.
Figure 20.
POWER SPECTRAL DENSITY
DAC OUTPUT NOISE DENSITY
vs FREQUENCY
0
5
300
AVDD = 5V,
fOUT = 1kHz, fS = 225kSPS,
Measurement Bandwidth = 20kHz
20
AVDD = 5V
250
Noise (nV/ÖHz)
-40
Gain (dB)
3
fOUT (kHz)
-60
-80
200
150
Midscale
100
-100
Zero Scale
Full Scale
50
-120
0
-140
0
5
10
15
20
10
100
1k
Frequency (kHz)
Frequency (Hz)
Figure 21.
Figure 22.
10k
100k
DAC OUTPUT NOISE
0.1Hz TO 10Hz BANDWIDTH
VNOISE (1mV/div)
AVDD = 5V,
DAC = Midscale, No Load
3mVPP
Time (2s/div)
Figure 23.
10
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +5V (continued)
At TA = +25°C, AVDD = +5V, and DAC loaded with midscale code, unless otherwise noted.
VOUT (500mV/div)
CLOCK FEEDTHROUGH
5V, 2MHz, MIDSCALE
AVDD = 5V
Clock Feedthrough Impulse ~0.5nV-s
Time (500ns/div)
Figure 24.
GLITCH ENERGY
5V, 12-BIT, 1LSB STEP, RISING EDGE
GLITCH ENERGY
5V, 12-BIT, 1LSB STEP, FALLING EDGE
Glitch Impulse
< 0.5nV-s
Clock
Feedthrough
~0.5nV-s
VOUT (500mV/div)
VOUT (500mV/div)
AVDD = 5V
From Code: 800h
To Code: 801h
AVDD = 5V
From Code: 801h
To Code: 800h
Clock
Feedthrough
~0.5nV-s
Glitch Impulse
< 0.5nV-s
Time (5ms/div)
Time (5ms/div)
Figure 25.
Figure 26.
GLITCH ENERGY
5V, 8-BIT, 1LSB STEP, RISING EDGE
GLITCH ENERGY
5V, 8-BIT, 1LSB STEP, FALLING EDGE
VOUT (5mV/div)
VOUT (5mV/div)
Glitch Impulse
~1nV-s
AVDD = 5V
From Code: 80h
To Code: 81h
Clock
Feedthrough
~0.5nV-s
AVDD = 5V
From Code: 81h
To Code: 80h
Glitch Impulse
~1nV-s
Clock
Feedthrough
~0.5nV-s
Time (5ms/div)
Time (5ms/div)
Figure 27.
Figure 28.
Copyright © 2008–2011, Texas Instruments Incorporated
11
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +5V (continued)
At TA = +25°C, AVDD = +5V, and DAC loaded with midscale code, unless otherwise noted.
FULL-SCALE SETTLING TIME
5V RISING EDGE
FULL-SCALE SETTLING TIME
5V FALLING EDGE
AVDD = 5V
From Code: 000h
To Code: FFFh
AVDD = 5V
From Code: FFFh
To Code: 000h
Rising Edge
1V/div
Zoomed Rising Edge
100mV/div
Falling Edge
1V/div
Zoomed Falling Edge
100mV/div
Trigger Pulse 5V/div
Trigger Pulse 5V/div
Time (2ms/div)
Time (2ms/div)
Figure 29.
Figure 30.
HALF-SCALE SETTLING TIME
5V RISING EDGE
HALF-SCALE SETTLING TIME
5V FALLING EDGE
AVDD = 5V
From Code: C00h
To Code: 400h
Falling
Edge
1V/div
Rising
Edge
1V/div
Zoomed Falling Edge
100mV/div
Zoomed Rising Edge
100mV/div
AVDD = 5V
From Code: 400h
To Code: C00h
Trigger
Pulse
5V/div
Trigger
Pulse
5V/div
Time (2ms/div)
Figure 31.
Figure 32.
POWER-ON RESET TO 0V
POWER-ON GLITCH
POWER-OFF GLITCH
17mV
AVDD (2V/div)
AVDD = 5V
DAC = Zero Scale
Load = 200pF || 10kW
AVDD = 5V
DAC = Zero Scale
Load = 200pF || 10kW
VOUT (20mV/div)
AVDD (2V/div)
VOUT (20mV/div)
12
Time (2ms/div)
Time (5ms/div)
Time (10ms/div)
Figure 33.
Figure 34.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +5V (continued)
At TA = +25°C, AVDD = +5V, and DAC loaded with midscale code, unless otherwise noted.
POWER-SUPPLY CURRENT
vs POWER-SUPPLY VOLTAGE
POWER-DOWN CURRENT
vs POWER-SUPPLY VOLTAGE
120
0.4
AVDD = 1.8V to 5.5V
110
Quiescent Current (mA)
Power-Supply Current (mA)
AVDD = 1.8V to 5.5V
100
90
80
70
1.800
2.725
3.650
4.575
0.3
0.2
0.1
0
1.800
5.500
2.725
3.650
AVDD (V)
AVDD (V)
Figure 35.
Figure 36.
4.575
5.500
POWER-SUPPLY CURRENT
HISTOGRAM
50
45
AVDD = 5.5V
40
Occurrences
35
30
25
20
15
10
5
136
140
128
132
120
124
112
116
104
108
96
100
88
92
80
84
0
IDD (mA)
Figure 37.
Copyright © 2008–2011, Texas Instruments Incorporated
13
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +3.6V
At TA = 25°C, AVDD = +3.6V, and DAC loaded with midscale code, unless otherwise noted.
POWER-SUPPLY CURRENT
vs TEMPERATURE
POWER-DOWN CURRENT
vs TEMPERATURE
140
1.2
AVDD = 3.6V
130
Quiescent Current (mA)
120
110
100
0.8
0.4
90
80
-40 -25 -10
5
20
35
50
65
80
95
0
-40 -25 -10
110 125
5
20
Temperature (°C)
80
95
POWER-SUPPLY CURRENT
vs LOGIC INPUT VOLTAGE
POWER-SUPPLY CURRENT
HISTOGRAM
50
110 125
AVDD = 3.6V
45
40
900
35
Occurrences
Sweep from
0V to 3.6V
600
30
25
20
15
300
10
Sweep from
3.6V to 0V
5
VLOGIC (V)
126
130
118
122
110
114
4.0
102
3.5
106
3.0
94
2.5
98
2.0
86
1.5
78
1.0
82
0.5
70
0
74
0
0
IDD (mA)
Figure 40.
Figure 41.
SOURCE CURRENT
AT POSITIVE RAIL
SINK CURRENT
AT NEGATIVE RAIL
3.7
0.6
AVDD = 3.6V
DAC Loaded with 0000h
3.5
Analog Output Voltage (V)
Analog Output Voltage (V)
65
Figure 39.
SYNC Input (all other digital inputs = GND)
3.3
3.1
2.9
2.7
AVDD = 3.6V
DAC Loaded with FFFFh
2.5
0
2
4
Figure 42.
0.4
0.2
0
6
ISOURCE (mA)
14
50
Figure 38.
1200
Power-Supply Current (mA)
35
Temperature (°C)
90
Power-Supply Current (mA)
AVDD = 3.6V
8
10
0
2
4
6
8
10
ISINK (mA)
Figure 43.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +2.7V
At TA = 25°C, AVDD = +2.7V, and DAC loaded with midscale code, unless otherwise noted.
DAC7311 12-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (–40°C)
0.10
AVDD = 2.7V
LE (LSB)
0.25
0
0
-0.05
-0.50
-0.10
0.2
0.06
0.1
0
-0.1
-0.2
AVDD = 2.7V
0.05
-0.25
DLE (LSB)
DLE (LSB)
LE (LSB)
0.50
DAC6311 10-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (–40°C)
0.03
0
-0.03
-0.06
0
512
1024
1536
2048
2560
3072
3584
4096
0
128
256
Digital Input Code
768
896
1024
DAC7311 12-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+25°C)
DAC6311 10-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+25°C)
0.10
AVDD = 2.7V
LE (LSB)
0.25
0
0
-0.05
-0.50
-0.10
0.2
0.06
0.1
0
-0.1
AVDD = 2.7V
0.05
-0.25
DLE (LSB)
LE (LSB)
DLE (LSB)
640
Figure 45.
-0.2
0.03
0
-0.03
-0.06
0
512
1024
1536
2048
2560
3072
3584
4096
0
128
256
Digital Input Code
384
512
640
768
896
1024
Digital Input Code
Figure 46.
Figure 47.
DAC7311 12-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+125°C)
DAC6311 10-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+125°C)
0.50
0.10
AVDD = 2.7V
LE (LSB)
0.25
0
0
-0.05
-0.50
-0.10
0.2
0.06
0.1
0
-0.1
-0.2
AVDD = 2.7V
0.05
-0.25
DLE (LSB)
LE (LSB)
512
Digital Input Code
Figure 44.
0.50
DLE (LSB)
384
0.03
0
-0.03
-0.06
0
512
1024
1536
2048
2560
3072
Digital Input Code
Figure 48.
Copyright © 2008–2011, Texas Instruments Incorporated
3584
4096
0
128
256
384
512
640
768
896
1024
Digital Input Code
Figure 49.
15
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +2.7V (continued)
At TA = 25°C, AVDD = +2.7V, and DAC loaded with midscale code, unless otherwise noted.
DAC5311 8-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (–40°C)
0.4
AVDD = 2.7V
0.01
AVDD = 2.7V
0
Zero-Code Error (mV)
LE (LSB)
0.02
-0.01
-0.02
0.02
DLE (LSB)
ZERO-CODE ERROR
vs TEMPERATURE
0.01
0
0.3
0.2
0.1
-0.01
0
-40 -25 -10
-0.02
0
32
64
96
128
160
192
224
256
5
Digital Input Code
OFFSET ERROR
vs TEMPERATURE
95
110 125
80
95
110 125
95
110 125
AVDD = 2.7V
0.4
0
Offset Error (mV)
LE (LSB)
80
0.6
AVDD = 2.7V
0.01
0.02
DLE (LSB)
65
DAC5311 8-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+25°C)
-0.02
0.01
0.2
0
-0.2
0
-0.4
-0.01
-0.6
-40 -25 -10
-0.02
0
32
64
96
128
160
192
224
256
5
Digital Input Code
20
35
50
65
Temperature (°C)
Figure 52.
Figure 53.
DAC5311 8-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+125°C)
FULL-SCALE ERROR
vs TEMPERATURE
0.02
0.06
AVDD = 2.7V
0.01
AVDD = 2.7V
0.04
0
Full-Scale Error (mV)
LE (LSB)
50
Figure 51.
-0.01
-0.01
-0.02
0.02
DLE (LSB)
35
Temperature (°C)
Figure 50.
0.02
0.01
0
0.02
0
-0.02
-0.04
-0.01
-0.02
0
32
64
96
128
160
Digital Input Code
Figure 54.
16
20
192
224
256
-0.06
-40 -25 -10
5
20
35
50
65
80
Temperature (°C)
Figure 55.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +2.7V (continued)
At TA = 25°C, AVDD = +2.7V, and DAC loaded with midscale code, unless otherwise noted.
SOURCE CURRENT
AT POSITIVE RAIL
SINK CURRENT
AT NEGATIVE RAIL
2.8
0.6
Analog Output Voltage (V)
Analog Output Voltage (V)
AVDD = 2.7V
DAC Loaded with 000h
2.6
2.4
2.2
AVDD = 2.7V
DAC Loaded with FFFh
2.0
0
2
0.4
0.2
0
4
6
8
10
0
2
4
ISOURCE (mA)
Figure 57.
POWER-SUPPLY CURRENT
vs DIGITAL INPUT CODE
POWER-SUPPLY CURRENT
vs LOGIC INPUT VOLTAGE
10
800
AVDD = 2.7V
SYNC Input (all other digital inputs = GND)
Power-Supply Current (mA)
Power-Supply Current (mA)
8
Figure 56.
100
90
80
70
60
50
600
Sweep from
0V to 2.7V
400
Sweep from
2.7V to 0V
200
0
0
512
1024
1536
2048
2560
3072
3584
4096
0
0.5
1.0
1.5
Digital Input Code
2.0
2.5
3.0
VLOGIC (V)
Figure 58.
Figure 59.
POWER-SUPPLY CURRENT
vs TEMPERATURE
POWER-DOWN CURRENT
vs TEMPERATURE
120
1.0
AVDD = 2.7V
AVDD = 2.7V
110
Quiescent Current (mA)
Power-Supply Current (mA)
6
ISINK (mA)
100
90
80
70
-40 -25 -10
5
20
35
50
65
80
Temperature (°C)
Figure 60.
Copyright © 2008–2011, Texas Instruments Incorporated
95
110 125
0.8
0.6
0.4
0.2
0
-40 -25 -10
5
20
35
50
65
80
95
110 125
Temperature (°C)
Figure 61.
17
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +2.7V (continued)
At TA = 25°C, AVDD = +2.7V, and DAC loaded with midscale code, unless otherwise noted.
TOTAL HARMONIC DISTORTION
vs
OUTPUT FREQUENCY
SIGNAL-TO-NOISE RATIO
vs
OUTPUT FREQUENCY
94
-20
AVDD = 2.7V, fS = 225kSPS,
-1dB FSR Digital Input,
Measurement Bandwidth = 20kHz
AVDD = 2.7V, fS = 225kSPS,
-1dB FSR Digital Input,
Measurement Bandwidth = 20kHz
90
THD
-40
SNR (dB)
THD (dB)
86
-60
82
78
2nd Harmonic
-80
74
3rd Harmonic
70
-100
0
1
2
3
4
5
0
1
2
fOUT (kHz)
4
Figure 62.
Figure 63.
POWER SPECTRAL DENSITY
POWER-SUPPLY CURRENT
HISTOGRAM
0
50
AVDD
DD = 2.7V,
fOUT
OUT = 1kHz, fS
S = 225kSPS,
Measurement Bandwidth = 20kHz
20
45
5
AVDD = 2.7V
40
35
Occurrences
-40
Gain (dB)
3
fOUT (kHz)
-60
-80
30
25
20
15
-100
10
-120
5
Frequency (kHz)
Figure 64.
18
100
104
96
92
88
80
84
20
76
15
72
10
68
5
60
0
64
0
-140
IDD (mA)
Figure 65.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +2.7V (continued)
At TA = 25°C, AVDD = +2.7V, and DAC loaded with midscale code, unless otherwise noted.
VOUT (500mV/div)
CLOCK FEEDTHROUGH
2.7V, 20MHz, MIDSCALE
AVDD = 2.7V
Clock Feedthrough Impulse ~0.4nV-s
Time (5ms/div)
Figure 66.
Glitch Impulse
< 0.3nV-s
AVDD = 2.7V
From Code: 800h
To Code: 801h
Clock
Feedthrough
~0.4nV-s
AVDD = 2.7V
From Code: 801h
To Code: 800h
Clock
Feedthrough
~0.4nV-s
Glitch Impulse
< 0.3nV-s
Time (5ms/div)
Time (5ms/div)
Figure 67.
Figure 68.
GLITCH ENERGY
2.7V, 8-BIT, 1LSB STEP, RISING EDGE
GLITCH ENERGY
2.7V, 8-BIT, 1LSB STEP, FALLING EDGE
Glitch Impulse
~1nV-s
Clock
Feedthrough
~0.4nV-s
AVDD = 2.7V
From Code: 80h
To Code: 81h
VOUT (2mV/div)
VOUT (2mV/div)
GLITCH ENERGY
2.7V, 12-BIT, 1LSB STEP, FALLING EDGE
VOUT (200mV/div)
VOUT (200mV/div)
GLITCH ENERGY
2.7V, 12-BIT, 1LSB STEP, RISING EDGE
AVDD = 2.7V
From Code: 81h
To Code: 80h
Clock
Feedthrough
~0.4nV-s
Glitch Impulse
~1nV-s
Time (5ms/div)
Time (5ms/div)
Figure 69.
Figure 70.
Copyright © 2008–2011, Texas Instruments Incorporated
19
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +2.7V (continued)
At TA = 25°C, AVDD = +2.7V, and DAC loaded with midscale code, unless otherwise noted.
FULL-SCALE SETTLING TIME
2.7V RISING EDGE
FULL-SCALE SETTLING TIME
2.7V FALLING EDGE
AVDD = 2.7V
From Code: 000h
To Code: FFFh
AVDD = 2.7V
From Code: FFFh
To Code: 000h
Falling Edge
1V/div
Rising Edge
1V/div
Zoomed Rising Edge
100mV/div
Zoomed Falling Edge
100mV/div
Trigger
Pulse
2.7V/div
Trigger Pulse 2.7V/div
Time (2ms/div)
Time (2ms/div)
Figure 71.
Figure 72.
HALF-SCALE SETTLING TIME
2.7V RISING EDGE
HALF-SCALE SETTLING TIME
2.7V FALLING EDGE
AVDD = 2.7V
From Code: 400h
To Code: C00h
AVDD = 2.7V
From Code: C00h
To Code: 400h
Falling
Edge
1V/div
Rising
Edge
1V/div
Zoomed Rising Edge
100mV/div
Trigger
Pulse
2.7V/div
Trigger
Pulse
2.7V/div
Time (2ms/div)
Time (2ms/div)
Figure 73.
Figure 74.
POWER-ON RESET TO 0V
POWER-ON GLITCH
POWER-OFF GLITCH
17mV
AVDD (1V/div)
AVDD = 2.7V
DAC = Zero Scale
Load = 200pF || 10kW
AVDD = 2.7V
DAC = Zero Scale
Load = 200pF || 10kW
VOUT (20mV/div)
AVDD (1V/div)
VOUT (20mV/div)
20
Zoomed Falling Edge
100mV/div
Time (5ms/div)
Time (10ms/div)
Figure 75.
Figure 76.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +1.8V
At TA = 25°C, AVDD = +1.8V, and DAC loaded with midscale code, unless otherwise noted.
DAC7311 12-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (–40°C)
0.10
AVDD = 1.8V
LE (LSB)
0.25
0
0
-0.05
-0.50
-0.10
0.2
0.06
0.1
0
-0.1
-0.2
AVDD = 1.8V
0.05
-0.25
DLE (LSB)
DLE (LSB)
LE (LSB)
0.50
DAC6311 10-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (–40°C)
0.03
0
-0.03
-0.06
0
512
1024
1536
2048
2560
3072
3584
4096
0
128
256
Digital Input Code
768
896
1024
DAC7311 12-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+25°C)
DAC6311 10-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+25°C)
0.10
AVDD = 1.8V
LE (LSB)
0.25
0
0
-0.05
-0.50
-0.10
0.2
0.06
0.1
0
-0.1
AVDD = 1.8V
0.05
-0.25
DLE (LSB)
LE (LSB)
DLE (LSB)
640
Figure 78.
-0.2
0.03
0
-0.03
-0.06
0
512
1024
1536
2048
2560
3072
3584
4096
0
128
256
Digital Input Code
384
512
640
768
896
1024
Digital Input Code
Figure 79.
Figure 80.
DAC7311 12-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+125°C)
DAC6311 10-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+125°C)
0.50
0.10
0.25
0.05
LE (LSB)
LE (LSB)
512
Digital Input Code
Figure 77.
0.50
0
-0.25
0
-0.05
AVDD = 1.8V
-0.50
-0.10
0.2
0.06
DLE (LSB)
DLE (LSB)
384
0.1
0
-0.1
-0.2
AVDD = 1.8V
0.03
0
-0.03
-0.06
0
512
1024
1536
2048
2560
3072
Digital Input Code
Figure 81.
Copyright © 2008–2011, Texas Instruments Incorporated
3584
4096
0
128
256
384
512
640
768
896
1024
Digital Input Code
Figure 82.
21
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +1.8V (continued)
At TA = 25°C, AVDD = +1.8V, and DAC loaded with midscale code, unless otherwise noted.
DAC5311 8-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (–40°C)
AVDD = 1.8V
0.01
AVDD = 1.8V
1.0
0
-0.01
-0.02
0.02
DLE (LSB)
ZERO-CODE ERROR vs TEMPERATURE
1.2
Zero-Code Error (mV)
LE (LSB)
0.02
0.01
0
0.8
0.6
0.4
0.2
-0.01
0
-40 -25 -10
-0.02
0
32
64
96
128
160
192
224
256
5
Digital Input Code
OFFSET ERROR
vs TEMPERATURE
95
110 125
80
95
110 125
95
110 125
AVDD = 1.8V
0.4
0
Offset Error (mV)
LE (LSB)
80
0.6
AVDD = 1.8V
0.01
0.02
DLE (LSB)
65
DAC5311 8-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+25°C)
-0.02
0.01
0.2
0
-0.2
0
-0.4
-0.01
-0.6
-40 -25 -10
-0.02
0
32
64
96
128
160
192
224
256
5
Digital Input Code
20
35
50
65
Temperature (°C)
Figure 85.
Figure 86.
DAC5311 8-BIT LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE (+125°C)
FULL-SCALE ERROR
vs TEMPERATURE
0.2
0.06
AVDD = 1.8V
0.1
AVDD = 1.8V
0.04
0
Full-Scale Error (mV)
LE (LSB)
50
Figure 84.
-0.01
-0.1
-0.2
0.02
DLE (LSB)
35
Temperature (°C)
Figure 83.
0.02
0.01
0
0.02
0
-0.02
-0.04
-0.01
-0.02
0
32
64
96
128
160
Digital Input Code
Figure 87.
22
20
192
224
256
-0.06
-40 -25 -10
5
20
35
50
65
80
Temperature (°C)
Figure 88.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +1.8V (continued)
At TA = 25°C, AVDD = +1.8V, and DAC loaded with midscale code, unless otherwise noted.
SOURCE CURRENT
AT POSITIVE RAIL
SINK CURRENT
AT NEGATIVE RAIL
2.0
0.6
AVDD = 1.8V
DAC Loaded with 000h
Analog Output Voltage (V)
Analog Output Voltage (V)
1.8
1.6
1.4
1.2
1.0
0.8
AVDD = 1.8V
DAC Loaded with FFFh
0.6
0
0.4
0.2
0
2
4
6
8
0
2
4
ISOURCE (mA)
Figure 89.
Figure 90.
POWER-SUPPLY CURRENT
vs DIGITAL INPUT CODE
POWER-SUPPLY CURRENT
vs LOGIC INPUT VOLTAGE
100
SYNC Input (all other digital inputs = GND)
Power-Supply Current (mA)
Power-Supply Current (mA)
8
200
AVDD = 1.8V
90
80
70
60
50
150
Sweep from
0V to 1.8V
100
50
Sweep from
1.8V to 0V
0
0
512
1024
1536
2048
2560
3072
3584
4096
0
0.5
1.0
Digital Input Code
1.5
2.0
VLOGIC (V)
Figure 91.
Figure 92.
POWER-SUPPLY CURRENT
vs TEMPERATURE
POWER-DOWN CURRENT
vs TEMPERATURE
110
0.8
AVDD = 1.8V
AVDD = 1.8V
100
Quiescent Current (mA)
Power-Supply Current (mA)
6
ISINK (mA)
90
80
70
60
-40 -25 -10
5
20
35
50
65
80
Temperature (°C)
Figure 93.
Copyright © 2008–2011, Texas Instruments Incorporated
95
110 125
0.6
0.4
0.2
0
-40 -25 -10
5
20
35
50
65
80
95
110 125
Temperature (°C)
Figure 94.
23
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +1.8V (continued)
At TA = 25°C, AVDD = +1.8V, and DAC loaded with midscale code, unless otherwise noted.
TOTAL HARMONIC DISTORTION
vs OUTPUT FREQUENCY
90
-20
AVDD = 1.8V, fS = 225kSPS,
-1dB FSR Digital Input,
Measurement Bandwidth = 20kHz
THD
AVDD = 1.8V, fS = 225kSPS,
-1dB FSR Digital Input,
Measurement Bandwidth = 20kHz
86
SNR (dB)
-40
THD (dB)
SIGNAL-TO-NOISE RATIO
vs OUTPUT FREQUENCY
-60
-80
82
78
2nd Harmonic
74
-100
3rd Harmonic
70
-110
0
1
2
3
4
5
0
1
2
fOUT (kHz)
4
Figure 95.
Figure 96.
POWER SPECTRAL DENSITY
POWER-SUPPLY CURRENT
HISTOGRAM
0
50
AVDD = 1.8V,
fOUT = 1kHz, fS = 225kSPS,
Measurement Bandwidth = 20kHz
20
45
5
AVDD = 1.8V
40
35
Occurrences
-40
Gain (dB)
3
fOUT (kHz)
-60
-80
30
25
20
15
-100
10
-120
5
Frequency (kHz)
Figure 97.
24
116
120
108
112
100
104
92
96
84
88
76
20
80
15
68
10
72
5
60
0
64
0
-140
IDD (mA)
Figure 98.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +1.8V (continued)
At TA = 25°C, AVDD = +1.8V, and DAC loaded with midscale code, unless otherwise noted.
VOUT (500mV/div)
CLOCK FEEDTHROUGH
1.8V, 20MHz, MIDSCALE
AVDD = 1.8V
Clock Feedthrough Impulse ~0.34nV-s
Time (5ms/div)
Figure 99.
Glitch Impulse
< 0.2nV-s
Clock
Feedthrough
~0.3nV-s
GLITCH ENERGY
1.8V, 12-BIT, 1LSB STEP, FALLING EDGE
VOUT (100mV/div)
VOUT (100mV/div)
GLITCH ENERGY
1.8V, 12-BIT, 1LSB STEP, RISING EDGE
AVDD = 1.8V
From Code: 800h
To Code: 801h
AVDD = 1.8V
From Code: 801h
To Code: 800h
Glitch Impulse
< 0.2nV-s
Clock
Feedthrough
~0.3nV-s
Time (5ms/div)
Time (5ms/div)
Figure 101.
GLITCH ENERGY
1.8V, 8-BIT, 1LSB STEP, RISING EDGE
GLITCH ENERGY
1.8V, 8-BIT, 1LSB STEP, FALLING EDGE
VOUT (2mV/div)
Glitch Impulse
~1nV-s
Clock
Feedthrough
~0.3nV-s
AVDD = 1.8V
From Code: 80h
To Code: 81h
Time (5ms/div)
Figure 102.
Copyright © 2008–2011, Texas Instruments Incorporated
VOUT (2mV/div)
Figure 100.
AVDD = 1.8V
From Code: 81h
To Code: 80h
Clock
Feedthrough
~0.3nV-s
Glitch Impulse
~1nV-s
Time (5ms/div)
Figure 103.
25
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
TYPICAL CHARACTERISTICS: AVDD = +1.8V (continued)
At TA = 25°C, AVDD = +1.8V, and DAC loaded with midscale code, unless otherwise noted.
FULL-SCALE SETTLING TIME
1.8V RISING EDGE
FULL-SCALE SETTLING TIME
1.8V FALLING EDGE
AVDD = 1.8V
From Code: 000h
To Code: FFFh
AVDD = 1.8V
From Code: FFFh
To Code: 000h
Falling Edge
1V/div
Zoomed Rising Edge
100mV/div
Rising Edge
1V/div
Zoomed Falling Edge
100mV/div
Trigger
Pulse
1.8V/div
Trigger Pulse 1.8V/div
Time (2ms/div)
Time (2ms/div)
Figure 104.
Figure 105.
HALF-SCALE SETTLING TIME
1.8V RISING EDGE
HALF-SCALE SETTLING TIME
1.8V FALLING EDGE
AVDD = 1.8V
From Code: 400h
To Code: C00h
AVDD = 1.8V
From Code: C00h
To Code: 400h
Falling
Edge
1V/div
Rising
Edge
1V/div
Zoomed Rising Edge
100mV/div
Zoomed Falling Edge
100mV/div
Trigger
Pulse
1.8V/div
Trigger Pulse 1.8V/div
Time (2ms/div)
Figure 107.
POWER-ON RESET TO 0V
POWER-ON GLITCH
POWER-OFF GLITCH
4mV
AVDD = 1.8V
DAC = Zero Scale
Load = 200pF || 10kW
VOUT (20mV/div)
AVDD = 1.8V
DAC = Zero Scale
Load = 200pF || 10kW
AVDD (1V/div)
Figure 106.
AVDD (1V/div)
VOUT (20mV/div)
26
Time (2ms/div)
Time (5ms/div)
Time (10ms/div)
Figure 108.
Figure 109.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
THEORY OF OPERATION
DAC SECTION
VREF
The DAC5311, DAC6311, and DAC7311 are
fabricated using TI's proprietary HPA07 process
technology. The architecture consists of a string DAC
followed by an output buffer amplifier. Because there
is no reference input pin, the power supply (AVDD)
acts as the reference. Figure 110 shows a block
diagram of the DAC architecture.
RDIVIDER
VREF
2
R
AVDD
R
To Output
Amplifier
REF (+)
DAC Register
Resistor String
VOUT
Output
Amplifier
GND
Figure 110. DACx311 Architecture
R
The input coding to the DACx311 is straight binary,
so the ideal output voltage is given by:
D
V OUT + AVDD
2n
Where:
n = resolution in bits; either 8 (DAC5311), 10
(DAC6311), or 12 (DAC7311).
D = decimal equivalent of the binary code that is
loaded to the DAC register. It ranges from 0 to
255 for 8-bit DAC5311; from 0 to 1023 for the
10-bit DAC6311; and 0 to 4095 for the 12-bit
DAC7311.
RESISTOR STRING
The resistor string section is shown in Figure 111. It
is simply a string of resistors, each of value R. The
code loaded into the DAC register determines at
which node on the string the voltage is tapped off to
be fed into the output amplifier by closing one of the
switches connecting the string to the amplifier. It is
tested monotonic because it is a string of resistors.
Copyright © 2008–2011, Texas Instruments Incorporated
R
Figure 111. Resistor String
OUTPUT AMPLIFIER
The output buffer amplifier is capable of generating
rail-to-rail voltages on its output which gives an output
range of 0V to AVDD. It is capable of driving a load of
2kΩ in parallel with 1000pF to GND. The source and
sink capabilities of the output amplifier can be seen in
the Typical Characteristics section for the given
voltage input. The slew rate is 0.7V/μs with a
half-scale settling time of typically 6μs with the output
unloaded.
27
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
SERIAL INTERFACE
the DACx311 compatible with high-speed DSPs. On
the 16th falling edge of the serial clock, the last data
bit is clocked in and the programmed function is
executed.
The DACx311 has a 3-wire serial interface (SYNC,
SCLK, and DIN) compatible with SPI, QSPI, and
Microwire interface standards, as well as most DSPs.
See the Serial Write Operation timing diagram for an
example of a typical write sequence.
At this point, the SYNC line may be kept low or
brought high. In either case, it must be brought high
for a minimum of 20ns before the next write
sequence so that a falling edge of SYNC can initiate
the next write sequence. As previously mentioned, it
must be brought high again before the next write
sequence.
DACx311 Input Shift Register
The input shift register is 16 bits wide, as shown in
Table 2. The first two bits (PD0 and PD1) are
reserved control bits that set the desired mode of
operation (normal mode or any one of three
power-down modes) as indicated in Table 5.
DACx311 SYNC Interrupt
In a normal write sequence, the SYNC line is kept
low for at least 16 falling edges of SCLK and the DAC
is updated on the 16th falling edge. However,
bringing SYNC high before the 16th falling edge acts
as an interrupt to the write sequence. The shift
register is reset and the write sequence is seen as
invalid. Neither an update of the DAC register
contents nor a change in the operating mode occurs,
as shown in Figure 112.
The remaining data bits are either 12 (DAC7311), 10
(DAC6311), or 8 (DAC5311) data bits, followed by
don't care bits, as shown in Table 2, Table 3, and
Table 4, respectively.
The write sequence begins by bringing the SYNC line
low. Data from the DIN line are clocked into the 16-bit
shift register on each falling edge of SCLK. The serial
clock frequency can be as high as 50MHz, making
Table 2. DAC5311 8-Bit Data Input Register
DB15
DB14
PD1
PD0
DB15
DB14
PD1
PD0
DB15
DB14
PD1
PD0
D7
D6
D5
D4
D3
D2
D1
DB6
DB5
D0
X
DB0
X
X
X
X
X
X
X
X
DB2
DB1
DB0
D0
X
X
Table 3. DAC6311 10-Bit Data Input Register
D9
D8
D7
D6
D5
D4
D3
D2
D1
DB4
DB3
D0
X
DB0
Table 4. DAC7311 12-Bit Data Input Register
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
CLK
SYNC
DIN
DB15
DB0
Invalid Write Sequence:
SYNC HIGH before 16th Falling Edge
DB15
DB0
Valid Write Sequence:
Output Updates on 16th Falling Edge
Figure 112. DACx311 SYNC Interrupt Facility
28
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
POWER-ON RESET TO ZERO-SCALE
The DACx311 contains a power-on reset circuit that
controls the output voltage during power-up. On
power-up, the DAC register is filled with zeros and
the output voltage is 0V. The DAC register remains
that way until a valid write sequence is made to the
DAC. This design is useful in applications where it is
important to know the state of the output of the DAC
while it is in the process of powering up.
The occurring power-on glitch impulse is only a few
millivolts (typically, 17mV; see Figure 33).
is also internally switched from the output of the
amplifier to a resistor network of known values. The
advantage of this architecture is that the output
impedance of the part is known while the part is in
power-down mode. There are three different options.
The output is connected internally to GND either
through a 1kΩ resistor or a 100kΩ resistor, or is left
open-circuited (High-Z). Figure 113 illustrates the
output stage.
Amplifier
Resistor
String DAC
VOUT
POWER-DOWN MODES
The DACx311 contains four separate modes of
operation. These modes are programmable by setting
two bits (PD1 and PD0) in the control register.
Table 5 shows how the state of the bits corresponds
to the mode of operation of the device.
Table 5. Modes of Operation for the DACx311
PD1
PD0
0
Resistor
Network
Figure 113. Output Stage During Power-Down
OPERATING MODE
Normal Mode
0
Power-down
Circuitry
Normal Operation
Power-Down Modes
0
1
Output 1kΩ to GND
1
0
Output 100kΩ to GND
1
1
High-Z
When both bits are set to '0', the device works
normally with a standard power consumption of
typically 80μA at 1.8V. However, for the three
power-down modes, the typical supply current falls to
0.5μA at 5V, 0.4μA at 3V, and 0.1μA at 1.8V. Not
only does the supply current fall, but the output stage
Copyright © 2008–2011, Texas Instruments Incorporated
All linear circuitry is shut down when the power-down
mode is activated. However, the contents of the DAC
register are unaffected when in power-down. The
time to exit power-down is typically 50μs for AVDD =
5V and AVDD = 3V.
DAC NOISE PERFORMANCE
Typical noise performance for the DACx311 is shown
in Figure 34 and 35. Output noise spectral density at
the VOUT pin versus frequency is depicted in Figure
34 for full-scale, midscale, and zero-scale input
codes. The typical noise density for midscale code is
110nV/√Hz at 1kHz and at 1MHz.
29
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
APPLICATION INFORMATION
USING THE REF5050 AS A POWER SUPPLY
FOR THE DACx311
As a result of the extremely low supply current
required by the DACx311, an alternative option is to
use a REF5050 +5V precision voltage reference to
supply the required voltage to the part, as shown in
Figure 114. This option is especially useful if the
power supply is too noisy or if the system supply
voltages are at some value other than 5V. The
REF5050 outputs a steady supply voltage for the
DACx311. If the REF5050 is used, the current
needed to supply DACx311 is typically 110μA at 5V,
with no load on the output of the DAC. When the
DAC output is loaded, the REF5050 also needs to
supply the current to the load. The total current
required (with a 5kΩ load on the DAC output) is:
110μA + (5V/5kΩ) = 1.11mA
The load regulation of the REF5050 is typically
0.002%/mA, which results in an error of 90μV for the
1.1mA current drawn from it. This value corresponds
to a 0.07LSB error at 12 bits (DAC7311).
+5.5V
+5V
1mF
The output voltage for any input code can be
calculated as follows:
VO +
ƪ
ǒ
R1 ) R 2
ǒ2DnǓ
AVDD
R1
Ǔ
* AV DD
ǒ Ǔƫ
R2
R1
(1)
Where:
n = resolution in bits; either 8 (DAC5311), 10
(DAC6311), or 12 (DAC7311).
D = decimal equivalent of the binary code that is
loaded to the DAC register. It ranges from 0 to
255 for 8-bit DAC5311; from 0 to 1023 for the
10-bit DAC6311; and 0 to 4095 for the 12-bit
DAC7311.
Ǔ
ǒ
V O + 10 n D *5V
2
110mA
SYNC
SCLK
The DACx311 has been designed for single-supply
operation but a bipolar output range is also possible
using the circuit in Figure 115. The circuit shown
gives an output voltage range of ±5V. Rail-to-rail
operation at the amplifier output is achievable using
an OPA211, OPA340, or OPA703 as the output
amplifier. For a full list of available operational
amplifiers from TI, see the TI web site at www.ti.com
With AVDD = 5V, R1 = R2 = 10kΩ:
REF5050
Three-Wire
Serial
Interface
BIPOLAR OPERATION USING THE DACx311
VOUT = 0V to 5V
DACx311
DIN
(2)
This is an output voltage range of ±5V with 000h
(12-bit level) corresponding to a –5V output and FFFh
(12-bit level) corresponding to a +5V output.
R2
10kW
+5V
+5.5V
R1
10kW
Figure 114. REF5050 as Power Supply to
DACx311
OPA211
VOUT
For other power-supply voltages, alternative
references such as the REF3030 (3V), REF3033
(3.3V), or REF3220 (2.048V) are recommended. For
a full list of available voltage references from TI, see
the TI web site at www.ti.com.
AVDD
10mF
±5V
DACx311
- 5.5V
0.1mF
Three-Wire
Serial
Interface
Figure 115. Bipolar Operation with the DACx311
30
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
MICROPROCESSOR INTERFACING
Microwire
DACx311(1)
DACx311 to 8051 Interface
CS
SYNC
Figure 116 shows a serial interface between the
DACx311 and a typical 8051-type microcontroller.
The setup for the interface is as follows: TXD of the
8051 drives SCLK of the DACx311, while RXD drives
the serial data line of the part. The SYNC signal is
derived from a bit programmable pin on the port. In
this case, port line P3.3 is used. When data are to be
transmitted to the DACx311, P3.3 is taken low. The
8051 transmits data only in 8-bit bytes; thus, only
eight falling clock edges occur in the transmit cycle.
To load data to the DAC, P3.3 remains low after the
first eight bits are transmitted, and a second write
cycle is initiated to transmit the second byte of data.
P3.3 is taken high following the completion of this
cycle. The 8051 outputs the serial data in a format
which has the LSB first. The DACx311 requires its
data with the MSB as the first bit received. Therefore,
the 8051 transmit routine must take this requirement
into account, and mirror the data as needed.
SK
SCLK
SO
DIN
80C51/80L51(1)
DACx311(1)
P3.3
SYNC
TXD
SCLK
RXD
DIN
NOTE: (1) Additional pins omitted for clarity.
Figure 117. DACx311 to Microwire Interface
DACx311 to 68HC11 Interface
Figure 118 shows a serial interface between the
DACx311 and the 68HC11 microcontroller. SCK of
the 68HC11 drives the SCLK of the DACx311, while
the MOSI output drives the serial data line of the
DAC. The SYNC signal is derived from a port line
(PC7), similar to what was done for the 8051.
68HC11(1)
DACx311(1)
PC7
SYNC
SCK
SCLK
MOSI
DIN
NOTE: (1) Additional pins omitted for clarity.
Figure 118. DACx311 to 68HC11 Interface
NOTE: (1) Additional pins omitted for clarity.
Figure 116. DACx311 to 80C51/80L51 Interfaces
DACx311 to Microwire Interface
Figure 117 shows an interface between the DACx311
and any Microwire-compatible device. Serial data are
shifted out on the falling edge of the serial clock and
are clocked into the DACx311 on the rising edge of
the SK signal.
Copyright © 2008–2011, Texas Instruments Incorporated
The 68HC11 should be configured so that its CPOL
bit is a '0' and its CPHA bit is a '1'. This configuration
causes data appearing on the MOSI output to be
valid on the falling edge of SCK. When data are
being transmitted to the DAC, the SYNC line is taken
low (PC7). Serial data from the 68HC11 are
transmitted in 8-bit bytes with only eight falling clock
edges occurring in the transmit cycle. Data are
transmitted MSB first. In order to load data to the
DACx311, PC7 is held low after the first eight bits are
transferred, and a second serial write operation is
performed to the DAC; PC7 is taken high at the end
of this procedure.
31
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
LAYOUT
A precision analog component requires careful layout,
adequate bypassing, and clean, well-regulated power
supplies.
The DACx311 offers single-supply operation; it is
often used in close proximity with digital logic,
microcontrollers, microprocessors, and digital signal
processors. The more digital logic present in the
design and the higher the switching speed, the more
difficult it is to achieve good performance from the
converter.
Because of the single ground pin of the DACx311, all
return currents, including digital and analog return
currents, must flow through the GND pin. Ideally,
GND is connected directly to an analog ground plane.
This plane should be separate from the ground
connection for the digital components until they are
connected at the power entry point of the system.
32
The power applied to AVDD should be well-regulated
and low-noise. Switching power supplies and dc/dc
converters often have high-frequency glitches or
spikes riding on the output voltage. In addition, digital
components can create similar high-frequency spikes
as the internal logic switches state. This noise can
easily couple into the DAC output voltage through
various paths between the power connections and
analog output. This condition is particularly true for
the DACx311, as the power supply is also the
reference voltage for the DAC.
As with the GND connection, AVDD should be
connected to a +5V power supply plane or trace that
is separate from the connection for digital logic until
they are connected at the power entry point. In
addition, the 1μF to 10μF and 0.1μF bypass
capacitors are strongly recommended. In some
situations, additional bypassing may be required,
such as a 100μF electrolytic capacitor or even a Pi
filter made up of inductors and capacitors—all
designed to essentially low-pass filter the +5V supply,
removing the high-frequency noise.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
PARAMETER DEFINITIONS
With the increased complexity of many different
specifications listed in product data sheets, this
section summarizes selected specifications related to
digital-to-analog converters.
STATIC PERFORMANCE
Static performance parameters are specifications
such as differential nonlinearity (DNL) or integral
nonlinearity (INL). These are dc specifications and
provide information on the accuracy of the DAC. They
are most important in applications where the signal
changes slowly and accuracy is required.
Resolution
Generally, the DAC resolution can be expressed in
different forms. Specifications such as IEC 60748-4
recognize the numerical, analog, and relative
resolution. The numerical resolution is defined as the
number of digits in the chosen numbering system
necessary to express the total number of steps of the
transfer characteristic, where a step represents both
a digital input code and the corresponding discrete
analogue output value. The most commonly-used
definition of resolution provided in data sheets is the
numerical resolution expressed in bits.
Least Significant Bit (LSB)
The least significant bit (LSB) is defined as the
smallest value in a binary coded system. The value of
the LSB can be calculated by dividing the full-scale
output voltage by 2n, where n is the resolution of the
converter.
Most Significant Bit (MSB)
The most significant bit (MSB) is defined as the
largest value in a binary coded system. The value of
the MSB can be calculated by dividing the full-scale
output voltage by 2. Its value is one-half of full-scale.
Relative Accuracy or Integral Nonlinearity (INL)
Relative accuracy or integral nonlinearity (INL) is
defined as the maximum deviation between the real
transfer function and a straight line passing through
the endpoints of the ideal DAC transfer function. INL
is measured in LSBs.
Differential Nonlinearity (DNL)
Differential nonlinearity (DNL) is defined as the
maximum deviation of the real LSB step from the
ideal 1LSB step. Ideally, any two adjacent digital
codes correspond to output analog voltages that are
exactly one LSB apart. If the DNL is within ±1LSB,
the DAC is said to be monotonic.
Copyright © 2008–2011, Texas Instruments Incorporated
Full-Scale Error
Full-scale error is defined as the deviation of the real
full-scale output voltage from the ideal output voltage
while the DAC register is loaded with the full-scale
code (0xFFFF). Ideally, the output should be VDD –
1LSB. The full-scale error is expressed in percent of
full-scale range (%FSR).
Offset Error
Offset error is defined as the difference between
actual output voltage and the ideal output voltage in
the linear region of the transfer function. This
difference is calculated by using a straight line
defined by two codes (for example, for 16-bit
resolution, codes 485 and 64714). Since the offset
error is defined by a straight line, it can have a
negative or positve value. Offset error is measured in
mV.
Zero-Code Error
Zero-code error is defined as the DAC output voltage,
when all '0's are loaded into the DAC register.
Zero-scale error is a measure of the difference
between actual output voltage and ideal output
voltage (0V). It is expressed in mV. It is primarily
caused by offsets in the output amplifier.
Gain Error
Gain error is defined as the deviation in the slope of
the real DAC transfer characteristic from the ideal
transfer function. Gain error is expressed as a
percentage of full-scale range (%FSR).
Full-Scale Error Drift
Full-scale error drift is defined as the change in
full-scale error with a change in temperature.
Full-scale error drift is expressed in units
of %FSR/°C.
Offset Error Drift
Offset error drift is defined as the change in offset
error with a change in temperature. Offset error drift
is expressed in μV/°C.
Zero-Code Error Drift
Zero-code error drift is defined as the change in
zero-code error with a change in temperature.
Zero-code error drift is expressed in μV/°C.
33
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
Gain Temperature Coefficient
Digital Feedthrough
The gain temperature coefficient is defined as the
change in gain error with changes in temperature.
The gain temperature coefficient is expressed in ppm
of FSR/°C.
Digital feedthrough is defined as impulse seen at the
output of the DAC from the digital inputs of the DAC.
It is measured when the DAC output is not updated. It
is specified in nV-s, and measured with a full-scale
code change on the data bus; that is, from all '0's to
all '1's and vice versa.
Power-Supply Rejection Ratio (PSRR)
Power-supply rejection ratio (PSRR) is defined as the
ratio of change in output voltage to a change in
supply voltage for a full-scale output of the DAC. The
PSRR of a device indicates how the output of the
DAC is affected by changes in the supply voltage.
PSRR is measured in decibels (dB).
Monotonicity
Monotonicity is defined as a slope whose sign does
not change. If a DAC is monotonic, the output
changes in the same direction or remains at least
constant for each step increase (or decrease) in the
input code.
Channel-to-Channel DC Crosstalk
Channel-to-channel dc crosstalk is defined as the dc
change in the output level of one DAC channel in
response to a change in the output of another DAC
channel. It is measured with a full-scale output
change on one DAC channel while monitoring
another DAC channel remains at midscale. It is
expressed in LSB.
Channel-to-Channel AC Crosstalk
Dynamic performance parameters are specifications
such as settling time or slew rate, which are important
in applications where the signal rapidly changes
and/or high frequency signals are present.
AC crosstalk in a multi-channel DAC is defined as the
amount of ac interference experienced on the output
of a channel at a frequency (f) (and its harmonics),
when the output of an adjacent channel changes its
value at the rate of frequency (f). It is measured with
one channel output oscillating with a sine wave of
1kHz frequency, while monitoring the amplitude of
1kHz harmonics on an adjacent DAC channel output
(kept at zero scale). It is expressed in dB.
Slew Rate
Signal-to-Noise Ratio (SNR)
The output slew rate (SR) of an amplifier or other
electronic circuit is defined as the maximum rate of
change of the output voltage for all possible input
signals.
Signal-to-noise ratio (SNR) is defined as the ratio of
the root mean-squared (RMS) value of the output
signal divided by the RMS values of the sum of all
other spectral components below one-half the output
frequency, not including harmonics or dc. SNR is
measured in dB.
DYNAMIC PERFORMANCE
SR = max
DVOUT(t)
Dt
(3)
Where ΔVOUT(t) is the output produced by the
amplifier as a function of time t.
Output Voltage Settling Time
Settling time is the total time (including slew time) for
the DAC output to settle within an error band around
its final value after a change in input. Settling times
are specified to within ±0.003% (or whatever value is
specified) of full-scale range (FSR).
Code Change/Digital-to-Analog Glitch Energy
Digital-to-analog glitch impulse is the impulse injected
into the analog output when the input code in the
DAC register changes state. It is normally specified
as the area of the glitch in nanovolts-second (nV-s),
and is measured when the digital input code is
changed by 1LSB at the major carry transition.
34
Total Harmonic Distortion (THD)
Total harmonic distortion + noise is defined as the
ratio of the RMS values of the harmonics and noise
to the value of the fundamental frequency. It is
expressed in a percentage of the fundamental
frequency amplitude at sampling rate fS.
Spurious-Free Dynamic Range (SFDR)
Spurious-free dynamic range (SFDR) is the usable
dynamic range of a DAC before spurious noise
interferes or distorts the fundamental signal. SFDR is
the measure of the difference in amplitude between
the fundamental and the largest harmonically or
non-harmonically related spur from dc to the full
Nyquist bandwidth (half the DAC sampling rate, or
fS/2). A spur is any frequency bin on a spectrum
analyzer, or from a Fourier transform, of the analog
output of the DAC. SFDR is specified in decibels
relative to the carrier (dBc).
Copyright © 2008–2011, Texas Instruments Incorporated
DAC5311
DAC6311
DAC7311
www.ti.com
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
Signal-to-Noise plus Distortion (SINAD)
DAC Output Noise
SINAD includes all the harmonic and outstanding
spurious components in the definition of output noise
power in addition to quantizing any internal random
noise power. SINAD is expressed in dB at a specified
input frequency and sampling rate, fS.
DAC output noise is defined as any voltage deviation
of DAC output from the desired value (within a
particular frequency band). It is measured with a DAC
channel kept at midscale while filtering the output
voltage within a band of 0.1Hz to 10Hz and
measuring its amplitude peaks. It is expressed in
terms of peak-to-peak voltage (Vpp).
DAC Output Noise Density
Output
noise
density
is
defined
as
internally-generated random noise. Random noise is
characterized as a spectral density (nV/√Hz). It is
measured by loading the DAC to midscale and
measuring noise at the output.
Copyright © 2008–2011, Texas Instruments Incorporated
Full-Scale Range (FSR)
Full-scale range (FSR) is the difference between the
maximum and minimum analog output values that the
DAC is specified to provide; typically, the maximum
and minimum values are also specified. For an n-bit
DAC, these values are usually given as the values
matching with code 0 and 2n – 1.
35
DAC5311
DAC6311
DAC7311
SBAS442A – AUGUST 2008 – REVISED AUGUST 2011
www.ti.com
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (August, 2008) to Revision A
Page
•
Changed specifications and test conditions for input low voltage parameter ....................................................................... 4
•
Changed specifications and test conditions for input high voltage parameter ..................................................................... 4
36
Copyright © 2008–2011, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jul-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
DAC5311IDCKR
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC5311IDCKRG4
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC5311IDCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC5311IDCKTG4
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC6311IDCKR
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC6311IDCKRG4
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC6311IDCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC6311IDCKTG4
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC7311IDCKR
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC7311IDCKRG4
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC7311IDCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC7311IDCKTG4
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(3)
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jul-2011
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF DAC5311 :
• Automotive: DAC5311-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
DAC5311IDCKR
SC70
DCK
6
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
DAC5311IDCKT
SC70
DCK
6
250
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
DAC6311IDCKR
SC70
DCK
6
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
DAC6311IDCKT
SC70
DCK
6
250
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
DAC7311IDCKR
SC70
DCK
6
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
DAC7311IDCKT
SC70
DCK
6
250
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC5311IDCKR
SC70
DCK
6
3000
180.0
180.0
18.0
DAC5311IDCKT
SC70
DCK
6
250
180.0
180.0
18.0
DAC6311IDCKR
SC70
DCK
6
3000
180.0
180.0
18.0
DAC6311IDCKT
SC70
DCK
6
250
180.0
180.0
18.0
DAC7311IDCKR
SC70
DCK
6
3000
180.0
180.0
18.0
DAC7311IDCKT
SC70
DCK
6
250
180.0
180.0
18.0
Pack Materials-Page 2
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