IRC TT DIP-4769HT-03-1001FF Tanfilmâ® high temperature dip and sip network Datasheet

TaNFilm® High Temperature
DIP and SIP Networks
IRC Advanced Film Division
1900HT / 4700HT SERIES
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Ceramic sandwich construction with
high temperature epoxy encapsulent
Sputtered tantalum
nitride with passivation
oxide layer
Inherent reliability
Custom configurations available
Bonded leads not susceptible to solder reflow problems
Absolute tolerence to ±0.1% - ratio accuracy to ±0.05%
Absolute TCR to ±25 ppm/°C - ratio tracking to ±5ppm/°C
Thermo-compression
bonded leads provide
exceptional reliability
The IRC 1900HT and 4700HT Series is the ultimate combination of precision performance, reliability, and long term stability in a low
profile, TaNFilm® DIP and SIP packages. The rugged welded lead construction combined with the inherent passivation characteristics
of tantalum nitride film insure superior continuous performance in high temperature applications over the installed life of the part.
Electrical Data
Package
Type
Size
14
DIP
16
6
SIP
8
Schematic
Ohmic
Range
Isolated
Schematic A
100Ω to 100KΩ
Bussed
Schematic B
1.00KΩ to 50KΩ
Isolated
Schematic A
100Ω to 100KΩ
Bussed
Schematic B
1.00KΩ to 50KΩ
Package
Power
Element
Power
Rated Voltage
(not to exceed
rated power)
0.08W
100V
Temperature
Range
1.12W
1.28W
-55°C to +200°C
Isolated
Schematic G
50Ω to 50KΩ
Bussed
Schematic C
2.00KΩ to 25KΩ
Isolated
Schematic G
50Ω to 50KΩ
Bussed
Schematic C
2.00KΩ to 25KΩ
0.24W
0.08W
50V
0.32W
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
HT Series Issue November 2008 Sheet 1 of 3
TaNFilm® High Temperature
DIP and SIP Networks
IRC Advanced Film Division
Physical Data
1900HT DIP Series
A
0.250″
# OF
LEADS
DIM A
14
0.700" ± 0.020
16
0.800" ± 0.020
LEAD MATERIAL:
CDA 110 COPPER ½ HARD (EIP)
PLATED 30-50 µIN. NICKEL
25µIN MINIMUM GOLD
0.105″ ± 0.020
0.020″ Max
meniscus
0.080″ Max
0.010″
0.205″
0.025″
± 0.005
0.135″ + 0.015
- 0.010
0.300″
+0.015/-0.010
0.050″ ± 0.015
0.100″ ± 0.005
Typ. Non-Cumulative
0.050″ ± 0.003
0.020″ ± 0.001 Typ
Schematic A
Schematic A
N-1
N
0.010″ ± 0.001
Schematic B
N
N-1
Schematic C
Schematic G
Schematic B
N-2 . . .
N-2 . . .
RN-1
R2
R1
...
...
R3
1
1
2
3 ...
...
R2
R1
RN-1
R2
R1
R2
R1
1
2
2
3
4
N-1
N
1
2
3
3...
N = Number of pins
© IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
HT Series Issue November 2008 Sheet 2 of 3
N
TaNFilm® High Temperature
DIP and SIP Networks
IRC Advanced Film Division
Physical Data (continued)
4700HT SIP Series
0.070″ ± 0.010
A
Pin 1 Indicator
0.130″ + 0.008/-0.010
0.187″ ± 0.010
# OF
LEADS
DIM A
6
0.580" ± 0.015
8
0.780" ± 0.015
0.322″ Ref
0.015″ Min
Clean Lead
Above Seating Plane
0.135″+ 0.015/-0.010
0.050″ ± 0.003
ematic A
N-1
N
N-1
0.020″ ± 0.003
Schematic C
Schematic G
Schematic B
N-2 . . .
0.100″ ± 0.005
Schematic C
Schematic G
N-2 . . .
LEAD MATERIAL:
CDA 110 COPPER ½ HARD (EIP)
PLATED 30-50 µIN. NICKEL
25µIN MINIMUM GOLD
0.026″ ± 0.003
0.010″ ± 0.001
0.045″ ± 0.015
RN-1
R3
...
...
1
3 ...
RN-1
R2
R1
R2
R1
2
...
R2
R1
1
2
2
3
N-1
4
N
1
2
N
3
3...
N = Number of pins
Environmental Data
Power Derating Curve
Performance
Environmental Test
MIL-PRF-55342
Typical
Maximum
Thermal Shock
±0.02%
±0.10%
Short Time Overload
±0.02%
±0.05%
High Temperature Exposure
±0.03%
±0.10%
Effects of Solder
±0.01%
±0.10%
Moisture Resistance
±0.03%
±0.10%
Life
(1000 hours, 200°C, no load)
±0.08%
±1.0%
Life
(1000 hours, 150°C, rated power)
±0.02%
100
% Of Rated Power
R2
50
10
50
100
150
200
Temperature in °C
±0.05%
Ordering Data
Package Prefix
SIP - 4789HT - 03 - 1001 F
DIP = 1900HT Series; SIP = 4700HT SIP Series
B
Optional Ratio Tolerance to R1
Model
F=±1.0%; D=±0.5%; C=±0.25%;
1987HT = 14-pin DIP bussed schematic B
1989HT = 14-pin DIP isolated schematic A
1998HT = 16-pin DIP bussed schematic B
1999HT = 16-pin DIP isolated schematic A
B = ±0.1%; A = ±0.05%
4761HT = 6-pin SIP bussed schematic C
4769HT = 6-pin SIP isolated schematic G
4781HT = 8-pin SIP bussed schematic C
4789HT = 8-pin SIP isolated schematic G
Absolute Tolerance
Standard MIL tolerance code
J = ±5%; G = ±2%; F=±1.0%; D=±0.5%; C = ±0.25%; B = ±0.1%
Resistance
Standard MIL resistance code.
Example: 1001 = 1000 Ω; 50R0 = 50Ω
Absolute TCR
01 = ±100ppm/°C; 02 = ±50ppm/°C; 03 = ±25ppm/°C
© IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
HT Series Issue November 2008 Sheet 3 of 3
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