FEATURES High efficiency: 96%@5.0Vin, 3.3V/10A out Small size and low profile: (SMD) 33.0x 13.5x8.8mm (1.30” x 0.53” x 0.35”) Surface mount packaging Standard footprint Voltage and resistor-based trim Pre-bias startup Output voltage tracking No minimum load required Output voltage programmable from 0.75Vdc to 3.3Vdc via external resistor Fixed frequency operation Input UVLO, output OTP, OCP Remote ON/OFF Remote sense ISO 9001, TL 9000, ISO 14001, QS9000, OHSAS18001 certified manufacturing facility UL/cUL 60950-1 (US & Canada) Recognized, and TUV (EN60950-1) Certified Delphi DNM, Non-Isolated Point of Load CE mark meets 73/23/EEC and 93/68/EEC directives DC/DC Power Modules: 2.8-5.5Vin, 0.75-3.3V/10Aout The Delphi Series DNM, 2.8-5.5V input, single output, non-isolated Point of Load DC/DC converters are the latest offering from a world leader in power system and technology and manufacturing ― Delta Electronics, Inc. The DNM04 series provides a programmable output voltage from 0.75V to 3.3V using an external resistor. The DNM series has flexible and programmable tracking and sequencing features to enable a variety of startup voltages as well as sequencing and tracking between power modules. This product family is available in surface mount or SIP packages and provides up to 10A of output current in an industry standard footprint. With creative design technology and optimization of component placement, these converters possess outstanding electrical and thermal performance, as well as extremely high reliability under highly stressful operating conditions. DATASHEET DS_DNM04SMD10_03062009 OPTIONS Negative On/Off logic Tracking feature SIP package APPLICATIONS Telecom / DataCom Distributed power architectures Servers and workstations LAN / WAN applications Data processing applications TECHNICAL SPECIFICATIONS (TA = 25°C, airflow rate = 300 LFM, Vin = 2.8Vdc and 5.5Vdc, nominal Vout unless otherwise noted.) PARAMETER NOTES and CONDITIONS DNM04S0A0S10PFD Min. ABSOLUTE MAXIMUM RATINGS Input Voltage (Continuous) Tracking Voltage Operating Temperature Storage Temperature INPUT CHARACTERISTICS Operating Input Voltage Input Under-Voltage Lockout Turn-On Voltage Threshold Turn-Off Voltage Threshold Maximum Input Current No-Load Input Current Off Converter Input Current Inrush Transient Recommended Inout Fuse OUTPUT CHARACTERISTICS Output Voltage Set Point Output Voltage Adjustable Range Output Voltage Regulation Over Line Over Load Over Temperature Total Output Voltage Range Output Voltage Ripple and Noise Peak-to-Peak RMS Output Current Range Output Voltage Over-shoot at Start-up Output DC Current-Limit Inception Output Short-Circuit Current (Hiccup Mode) DYNAMIC CHARACTERISTICS Dynamic Load Response Positive Step Change in Output Current Negative Step Change in Output Current Setting Time to 10% of Peak Deviation Turn-On Transient Start-Up Time, From On/Off Control Start-Up Time, From Input Output Voltage Rise Time Output Capacitive Load EFFICIENCY Vo=3.3V Vo=2.5V Vo=1.8V Vo=1.5V Vo=1.2V Vo=0.75V FEATURE CHARACTERISTICS Switching Frequency ON/OFF Control, (Negative logic) Logic Low Voltage Logic High Voltage Logic Low Current Logic High Current ON/OFF Control, (Positive Logic) Logic High Voltage Logic Low Voltage Logic Low Current Logic High Current Tracking Slew Rate Capability Tracking Delay Time Tracking Accuracy Remote Sense Range GENERAL SPECIFICATIONS MTBF Weight Over-Temperature Shutdown DS_DNM04SMD10_03062009 Typ. Max. 0 Refer to Figure 44 for measuring point -40 -55 5.8 Vin,max +125 +125 Vout ≦ Vin –0.5 2.8 5.5 2.2 2.0 Vin=2.8V to 5.5V, Io=Io,max Vin=5V, Io= Io, max Vi=Vi,min to Vi,max Io=Io,min to Io,max Tc=-40℃ to 100℃ Over sample load, line and temperature 5Hz to 20MHz bandwidth Full Load, 1µF ceramic, 10µF tantalum Full Load, 1µF ceramic, 10µF tantalum Vo,set +2.0 3.63 % Vo,set V +3.0 % Vo,set % Vo,set % Vo,set % Vo,set 0.3 0.4 0.8 -3.0 25 8 220 3.5 mV mV A % Vo,set % Io Adc 200 200 25 mV mV µs 4 4 4 ms ms ms µF µF 0 Vout= 3.3V Io,s/c 10µF Tan & 1µF Ceramic load cap, 2.5A/µs 50% Io, max to 100% Io, max 100% Io, max to 50% Io, max Io=Io.max Vin=Vin,min, Vo=10% of Vo,set Vo=10% of Vo,set Time for Vo to rise from 10% to 90% of Vo,set Full load; ESR ≧1mΩ Full load; ESR ≧10mΩ Vin=5V, 100% Load Vin=5V, 100% Load Vin=5V, 100% Load Vin=5V, 100% Load Vin=5V, 100% Load Vin=5V, 100% Load Module On, Von/off Module Off, Von/off Module On, Ion/off Module Off, Ion/off Module On, Von/off Module Off, Von/off Module On, Ion/off Module Off, Ion/off Delay from Vin.min to application of tracking voltage Power-up 2V/mS Power-down 1V/mS Io=80% of Io, max; Ta=25°C Refer to Figure 44 for measuring point V 0.1 15 10 -2.0 0.7525 Vdc Vdc °C °C V V A mA mA A 2S A 70 5 Vin=2.8V to 5.5V, Io=Io,min to Io,max Units 50 15 10 1 8 1000 5000 96.0 94.3 92.7 91.7 90.2 86.4 % % % % % % 300 kHz -0.2 1.5 0.2 -0.2 0.2 0.1 10 100 200 22.9 9 130 0.3 Vin,max 10 1 V V µA mA Vin,max 0.3 1 10 2 V V mA µA V/msec ms mV mV V 200 400 0.1 M hours grams °C 2 100 100 95 95 90 EFFICIENCY(%) EFFICIENCY(%) ELECTRICAL CHARACTERISTICS CURVES Vin=4.5V Vin=5.0V 85 Vin=5.5V 80 90 Vin=3.0V 85 Vin=5.0 Vin=5.5V 80 75 1 2 3 4 5 6 7 8 9 75 10 1 2 3 OUTPUR CURRENT(A) 95 95 EFFICIENCY(%) EFFICIENCY(%) 100 Vin=2.8V Vin=5.0V Vin=5.5V 80 7 90 8 9 10 Vin=2.8V Vin=5.0V 85 Vin=5.5V 80 75 75 1 2 3 4 5 6 7 8 9 10 1 2 3 OUTPUR CURRENT(A) 5 6 7 8 9 10 Figure 4: Converter Efficiency vs. Output Current (1.5V out) 95 90 90 EFFICIENCY(%) 95 85 80 4 OUTPUR CURRENT(A) Figure 3: Converter Efficiency vs. Output Current (1.8V out) EFFICIENCY(%) 6 Figure 2: Converter Efficiency vs. Output Current (2.5V out) 100 85 5 OUTPUR CURRENT(A) Figure 1: Converter Efficiency vs. Output Current (3.3V out) 90 4 Vin=2.8V 75 Vin=5.0 70 Vin=5.5V 85 80 Vin=2.8V 75 Vin=5.0 70 Vin=5.5V 65 65 60 1 2 3 4 5 6 7 8 9 OUTPUR CURRENT(A) Figure 5: Converter Efficiency vs. Output Current (1.2V out) DS_DNM04SMD10_03062009 10 1 2 3 4 5 6 7 8 9 10 OUTPUR CURRENT(A) Figure 6: Converter Efficiency vs. Output Current (0.75V out) 3 ELECTRICAL CHARACTERISTICS CURVES Figure 7: Output ripple & noise at 3.3Vin, 2.5V/10A out Figure 8: Output ripple & noise at 3.3Vin, 1.8V/10A out Figure 9: Output ripple & noise at 5Vin, 3.3V/10A out Figure 10: Output ripple & noise at 5Vin, 1.8V/10A out Figure 11: Turn on delay time at 3.3Vin, 2.5V/10A out Figure 12: Turn on delay time at 3.3Vin, 1.8V/10A out DS_DNM04SMD10_03062009 4 ELECTRICAL CHARACTERISTICS CURVES Figure 13: Turn on delay time at 5Vin, 3.3V/10A out Figure 14: Turn on delay time at 5Vin, 1.8V/10A out Figure 15: Turn on delay time at remote turn on 5Vin, 3.3V/16A out Figure 16: Turn on delay time at remote turn on 3.3Vin, 2.5V/16A out Figure 17: Turn on delay time at remote turn on with external capacitors (Co= 5000 µF) 5Vin, 3.3V/16A out DS_DNM04SMD10_03062009 Figure 18: Turn on delay time at remote turn on with external capacitors (Co= 5000 µF) 3.3Vin, 2.5V/16A out 5 ELECTRICAL CHARACTERISTICS CURVES Figure 19: Typical Transient Response to Step Load Change at 2.5A/μS from 100% to 50% of Io, max at 5Vin, 3.3Vout (Cout = 1uF ceramic, 10μF Tantalum) Figure 20: Typical Transient Response to Step Load Change at 2.5A/μS from 50% to 100% of Io, max at 5Vin, 3.3Vout (Cout =1uF ceramic, 10μF Tantalum) Figure 21: Typical Transient Response to Step Load Change at 2.5A/μS from 100% to 50% of Io, max at 5Vin, 1.8Vout (Cout =1uF ceramic, 10μF Tantalum) Figure 22: Typical Transient Response to Step Load Change at 2.5A/μS from 50% to 100% of Io, max at 5Vin, 1.8Vout (Cout = 1uF ceramic, 10μF Tantalum) Figure 23: Typical Transient Response to Step Load Change at 2.5A/μS from 100% to 50% of Io, max at 3.3Vin, 2.5Vout (Cout =1uF ceramic, 10μF Tantalum) Figure 24: Typical Transient Response to Step Load Change at 2.5A/μS from 50% to 100% of Io, max at 3.3Vin, 2.5Vout (Cout =1uF ceramic, 10μF Tantalum) DS_DNM04SMD10_03062009 6 ELECTRICAL CHARACTERISTICS CURVES Figure 25: Typical Transient Response to Step Load Change at 2.5A/μS from 100% to 50% of Io, max at 3.3Vin,1.8Vout (Cout=1uF ceramic, 10μF Tantalum) Figure 26: Typical Transient Response to Step Load Change at 2.5A/μS from 50% to 100% of Io, max at 3.3Vin,1.8Vout (Cout = 1uF ceramic, 10μF Tantalum) Figure 27: Output short circuit current 5Vin, 0.75Vout Figure 28:Turn on with Prebias 5Vin, 3.3V/0A out, Vbias =1.0Vdc DS_DNM04SMD10_03062009 7 TEST CONFIGURATIONS DESIGN CONSIDERATIONS TO OSCILLOSCOPE L VI(+) 2 100uF Tantalum BATTERY VI(-) To maintain low noise and ripple at the input voltage, it is critical to use low ESR capacitors at the input to the module. Figure 32 shows the input ripple voltage (mVp-p) for various output models using 200 µF(2 x100uF) low ESR tantalum capacitor (KEMET p/n: T491D107M016AS, AVX p/n: TAJD107M106R, or equivalent) in parallel with 47 µF ceramic capacitor (TDK p/n:C5750X7R1C476M or equivalent). Figure 33 shows much lower input voltage ripple when input capacitance is increased to 400 µF (4 x 100 µF) tantalum capacitors in parallel with 94 µF (2 x 47 µF) ceramic capacitor. Note: Input reflected-ripple current is measured with a simulated source inductance. Current is measured at the input of the module. The input capacitance should be able to handle an AC ripple current of at least: Figure 29: Input reflected-ripple test setup Irms = Iout Vo 1uF 10uF SCOPE tantalum ceramic Resistive Load GND Input Ripple Voltage (mVp-p) COPPER STRIP 150 100 50 VI Vo II SUPPLY Io Vo Vin LOAD GND CONTACT RESISTANCE Figure 31: Output voltage and efficiency measurement test setup Note: All measurements are taken at the module terminals. When the module is not soldered (via socket), place Kelvin connections at module terminals to avoid measurement errors due to contact resistance. η =( 5.0Vin 3.3Vin 0 0 1 2 3 4 Output Voltage (Vdc) Figure 32: Input voltage ripple for various output models, IO = 10 A (CIN = 2×100 µF tantalum // 47 µF ceramic) Input Ripple Voltage (mVp-p) CONTACT AND DISTRIBUTION LOSSES Arms 200 Note: Use a 10μF tantalum and 1μF capacitor. Scope measurement should be made using a BNC cable. Figure 30: Peak-peak output noise and startup transient measurement test setup. Vout ⎛ Vout ⎞ ⎜1 − ⎟ Vin ⎝ Vin ⎠ 200 150 100 5.0Vin 50 3.3Vin 0 0 1 2 3 4 Output Voltage (Vdc) Figure 33: Input voltage ripple for various output models, IO = 10 A (CIN = 4×100 µF tantalum // 2×47 µF ceramic) Vo × Io ) × 100 % Vi × Ii DS_DNM04SMD10_03062009 8 DESIGN CONSIDERATIONS (CON.) FEATURES DESCRIPTIONS The power module should be connected to a low ac-impedance input source. Highly inductive source impedances can affect the stability of the module. An input capacitance must be placed close to the modules input pins to filter ripple current and ensure module stability in the presence of inductive traces that supply the input voltage to the module. Remote On/Off Safety Considerations For safety-agency approval the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standards. For the converter output to be considered meeting the requirements of safety extra-low voltage (SELV), the input must meet SELV requirements. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a maximum 15A time-delay fuse in the ungrounded lead. The DNM/DNL series power modules have an On/Off pin for remote On/Off operation. Both positive and negative On/Off logic options are available in the DNM/DNL series power modules. For positive logic module, connect an open collector (NPN) transistor or open drain (N channel) MOSFET between the On/Off pin and the GND pin (see figure 34). Positive logic On/Off signal turns the module ON during the logic high and turns the module OFF during the logic low. When the positive On/Off function is not used, leave the pin floating or tie to Vin (module will be On). For negative logic module, the On/Off pin is pulled high with an external pull-up 5kΩ resistor (see figure 35). Negative logic On/Off signal turns the module OFF during logic high and turns the module ON during logic low. If the negative On/Off function is not used, leave the pin floating or tie to GND. (module will be On) Vo Vin ION/OFF RL On/Off GND Figure 34: Positive remote On/Off implementation Vo Vin Rpull-up ION/OFF On/Off RL GND Figure 35: Negative remote On/Off implementation Over-Current Protection To provide protection in an output over load fault condition, the unit is equipped with internal over-current protection. When the over-current protection is triggered, the unit enters hiccup mode. The units operate normally once the fault condition is removed. DS_DNM04SMD10_03062009 9 FEATURES DESCRIPTIONS (CON.) Over-Temperature Protection The over-temperature protection consists of circuitry that provides protection from thermal damage. If the temperature exceeds the over-temperature threshold the module will shut down. The module will try to restart after shutdown. If the over-temperature condition still exists during restart, the module will shut down again. This restart trial will continue until the temperature is within specification Vtrim = 0.7 − 0.1698 × (Vo − 0.7525) For example, to program the output voltage of a DNL module to 3.3 Vdc, Vtrim is calculated as follows Vtrim = 0.7 − 0.1698 × (3.3 − 0.7525) = 0.267V Vo RLoad TRIM Rtrim Remote Sense GND The DNM/DNL provide Vo remote sensing to achieve proper regulation at the load points and reduce effects of distribution losses on output line. In the event of an open remote sense line, the module shall maintain local sense regulation through an internal resistor. The module shall correct for a total of 0.5V of loss. The remote sense line impedance shall be < 10Ω. Distribution Losses Vo Vin using an external resistor Vo Vtrim RL GND Distribution L Figure 36: Effective circuit configuration for remote sense operation Output Voltage Programming The output voltage of the DNM/DNL can be programmed to any voltage between 0.75Vdc and 3.3Vdc by connecting one resistor (shown as Rtrim in Figure 37) between the TRIM and GND pins of the module. Without this external resistor, the output voltage of the module is 0.7525 Vdc. To calculate the value of the resistor Rtrim for a particular output voltage Vo, please use the following equation: ⎡ 21070 ⎤ Rtrim = ⎢ − 5110⎥ Ω ⎣Vo − 0.7525 ⎦ For example, to program the output voltage of the DNL module to 1.8Vdc, Rtrim is calculated as follows: ⎡ 21070 ⎤ Rtrim = ⎢ − 5110⎥ Ω = 15KΩ ⎣1.8 − 0.7525 ⎦ DNL can also be programmed by apply a voltage between the TRIM and GND pins (Figure 38). The following equation can be used to determine the value of Vtrim needed for a desired output voltage Vo: DS_DNM04SMD10_03062009 RLoad TRIM GND Distribution Losses Sense Distribution Figure 37: Circuit configuration for programming output voltage + _ Figure 38: Circuit Configuration for programming output voltage using external voltage source Table 1 provides Rtrim values required for some common output voltages, while Table 2 provides value of external voltage source, Vtrim, for the same common output voltages. By using a 1% tolerance trim resistor, set point tolerance of ±2% can be achieved as specified in the electrical specification. Table 1 Vo(V) Rtrim(KΩ) 0.7525 Open 1.2 41.97 1.5 23.08 1.8 15.00 2.5 6.95 3.3 3.16 Table 2 Vo(V) Vtrim(V) 0.7525 Open 1.2 0.624 1.5 0.573 1.8 0.522 2.5 0.403 3.3 0.267 10 FEATURE DESCRIPTIONS (CON.) The amount of power delivered by the module is the voltage at the output terminals multiplied by the output current. When using the trim feature, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module must not exceed the maximum rated power (Vo.set x Io.max ≤ P max). Voltage Margining The output voltage tracking feature (Figure 40 to Figure 42) is achieved according to the different external connections. If the tracking feature is not used, the TRACK pin of the module can be left unconnected or tied to Vin. For proper voltage tracking, input voltage of the tracking power module must be applied in advance, and the remote on/off pin has to be in turn-on status. (Negative logic: Tied to GND or unconnected. Positive logic: Tied to Vin or unconnected) Output voltage margining can be implemented in the DNL modules by connecting a resistor, R margin-up, from the Trim pin to the ground pin for margining-up the output voltage and by connecting a resistor, Rmargin-down, from the Trim pin to the output pin for margining-down. Figure 39 shows the circuit configuration for output voltage margining. If unused, leave the trim pin unconnected. A calculation tool is available from the evaluation procedure which computes the values of R margin-up and Rmargin-down for a specific output voltage and margin percentage. Vin Vo Rmargin-down PS1 PS1 PS2 PS2 Figure 40: Sequential Q1 On/Off Trim Rmargin-up Rtrim Q2 PS1 PS1 PS2 PS2 GND Figure 39: Circuit configuration for output voltage margining Voltage Tracking Figure 41: Simultaneous The DNM family was designed for applications that have output voltage tracking requirements during power-up and power-down. The devices have a TRACK pin to implement three types of tracking method: sequential start-up, simultaneous and ratio-metric. TRACK simplifies the task of supply voltage tracking in a power system by enabling modules to track each other, or any external voltage, during power-up and power-down. By connecting multiple modules together, customers can get multiple modules to track their output voltages to the voltage applied on the TRACK pin. DS_DNM04SMD10_03062009 +△V PS1 PS1 PS2 PS2 Figure 42: Ratio-metric 11 FEATURE DESCRIPTIONS (CON.) Sequential Start-up Sequential start-up (Figure 40) is implemented by placing an On/Off control circuit between VoPS1 and the On/Off pin of PS2. PS1 PS2 Vin Vin VoPS1 VoPS2 R3 On/Off R1 Q1 On/Off R2 C1 Simultaneous Simultaneous tracking (Figure 41) is implemented by using the TRACK pin. The objective is to minimize the voltage difference between the power supply outputs during power up and down. The simultaneous tracking can be accomplished by connecting VoPS1 to the TRACK pin of PS2. Please note the voltage apply to TRACK pin needs to always higher than the VoPS2 set point voltage. PS2 PS1 Vin Vin VoPS1 VoPS2 TRACK On/Off On/Off DS_DNM04SMD10_03062009 12 THERMAL CONSIDERATIONS Thermal management is an important part of the system design. To ensure proper, reliable operation, sufficient cooling of the power module is needed over the entire temperature range of the module. Convection cooling is usually the dominant mode of heat transfer. Hence, the choice of equipment to characterize the thermal performance of the power module is a wind tunnel. Thermal Testing Setup Delta’s DC/DC power modules are characterized in heated vertical wind tunnels that simulate the thermal environments encountered in most electronics equipment. This type of equipment commonly uses vertically mounted circuit cards in cabinet racks in which the power modules are mounted. The following figure shows the wind tunnel characterization setup. The power module is mounted on a test PWB and is vertically positioned within the wind tunnel. The height of this fan duct is constantly kept at 25.4mm (1’’). Thermal Derating Heat can be removed by increasing airflow over the module. The module’s maximum hot spot temperature is 125°C. To enhance system reliability, the power module should always be operated below the maximum operating temperature. If the temperature exceeds the maximum module temperature, reliability of the unit may be affected. PWB FACING PWB MODULE AIR VELOCITY AND AMBIENT TEMPERATURE MEASURED BELOW THE MODULE 50.8 (2.0”) AIR FLOW 12.7 (0.5”) 25.4 (1.0”) Note: Wind Tunnel Test Setup Figure Dimensions are in millimeters and (Inches) Figure 43: Wind tunnel test setup DS_DNM04SMD10_03062009 13 THERMAL CURVES 12 DNM04S0A0S10(Standard) Output Current vs. Ambient Temperature and Air Velocity @ Vin = 3.3V, Vo = 2.5V (Either Orientation) Output Current(A) 10 8 6 Natural Convection 4 2 0 60 Figure 44: Temperature measurement location * The allowed maximum hot spot temperature is defined at 125℃ 12 65 70 75 80 85 Ambient Temperature (℃) Figure 47: DNM04S0A0S10(Standard) Output Current vs. Ambient Temperature and Air Velocity@Vin=3.3V, Vo=2.5V(Either Orientation) DNM04S0A0S10(Standard) Output Current vs. Ambient Temperature and Air Velocity @ Vin = 5V, Vo = 3.3V (Either Orientation) Output Current(A) 12 DNM04S0A0S10(Standard) Output Current vs. Ambient Temperature and Air Velocity @ Vin = 3.3V, Vo = 0.75V (Either Orientation) Output Current(A) 10 10 8 8 6 6 Natural Convection Natural Convection 4 4 2 2 0 60 65 70 75 80 85 Ambient Temperature (℃) Figure 45: DNM04S0A0S10(Standard) Output Current vs. Ambient Temperature and Air Velocity@Vin=5V, Vo=3.3V(Either Orientation) 12 DNM04S0A0S10(Standard) Output Current vs. Ambient Temperature and Air Velocity @ Vin = 5.0V, Vo = 0.75V (Either Orientation) 0 60 65 70 75 80 85 Ambient Temperature (℃) Figure 48: DNM04S0A0S10(Standard) Output Current vs. Ambient Temperature and Air Velocity@Vin=3.3V, Vo=0.75V(Either Orientation) Output Current(A) 10 8 6 Natural Convection 4 2 0 60 65 70 75 80 85 Ambient Temperature (℃) Figure 46: DNM04S0A0S10(Standard) Output Current vs. Ambient Temperature and Air Velocity@Vin=5V, DS_DNM04SMD10_03062009 Vo=0.75V(Either Orientation) 14 PICK AND PLACE LOCATION SURFACE-MOUNT TAPE & REEL LEAD (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE Temperature (°C ) 250 200 150 Ramp-up temp. 0.5~3.0°C /sec. Peak temp. 2nd Ramp-up temp. 210~230°C 5sec. 1.0~3.0°C /sec. Pre-heat temp. 140~180°C 60~120 sec. Cooling down rate <3°C /sec. 100 Over 200°C 40~50sec. 50 0 60 120 Time ( sec. ) 180 240 300 LEAD FREE (SAC) PROCESS RECOMMEND TEMP. PROFILE Temp. Peak Temp. 240 ~ 245 ℃ 220℃ Ramp down max. 4℃ /sec. 200℃ 150℃ Preheat time 90~120 sec. Ramp up max. 3℃ /sec. Time Limited 75 sec. above 220℃ 25℃ Time Note: All temperature refers to assembly application board, measured on the land of assembly application board. DS_DNM04SMD10_03062009 15 MECHANICAL DRAWING SMD PACKAGE DS_DNM04SMD10_03062009 SIP PACKAGE (OPTIONAL) 16 PART NUMBERING SYSTEM DNM 04 S 0A0 S 10 P Product Series Input Voltage Numbers of Outputs Output Voltage Package Type Output Current On/Off logic DNL - 16A 04 - 2.8~5.5V S - Single 0A0 - R - SIP 16 -16A N- negative DNM - 10A 10 – 8.3~14V Programmable S - SMD 10 -10A (Default) DNS - 6A F D Option Code F- RoHS 6/6 D - Standard Function (Lead Free) P- positive MODEL LIST Output Voltage Output Current Efficiency 5.0Vin, 3.3Vdc @ 100% Load Model Name Packaging Input Voltage DNM04S0A0S10PFD SMD 2.8 ~ 5.5Vdc 0.75 V~ 3.3Vdc 10A 96.0% DNM04S0A0S10NFD SMD 2.8 ~ 5.5Vdc 0.75 V~ 3.3Vdc 10A 96.0% DNM04S0A0R10PFD SIP 2.8 ~ 5.5Vdc 0.75 V~ 3.3Vdc 10A 96.0% DNM04S0A0R10NFD SIP 2.8 ~ 5.5Vdc 0.75 V~ 3.3Vdc 10A 96.0% CONTACT: www.delta.com.tw/dcdc USA: Telephone: East Coast: (888) 335 8201 West Coast: (888) 335 8208 Fax: (978) 656 3964 Email: [email protected] Europe: Phone: +41 31 998 53 11 Fax: +41 31 998 53 53 Email: [email protected] Asia & the rest of world: Telephone: +886 3 4526107 ext 6220~6224 Fax: +886 3 4513485 Email: [email protected] WARRANTY Delta offers a two (2) year limited warranty. Complete warranty information is listed on our web site or is available upon request from Delta. Information furnished by Delta is believed to be accurate and reliable. However, no responsibility is assumed by Delta for its use, nor for any infringements of patents or other rights of third parties, which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Delta. Delta reserves the right to revise these specifications at any time, without notice. DS_DNM04SMD10_03062009 17