DS7837/DS8837 Hex Unified Bus Receiver General Description Features The DS7837/DS8837 are high speed receivers designed for use in bus organized data transmission systems interconnected by terminated 120X impedance lines. The external termination is intended to be 180X resistor from the bus to the a 5V logic supply together with a 390X resistor from the bus to ground. The receiver design employs a built-in input hysteresis providing substantial noise immunity. Low input current allows up to 27 driver/receiver pairs to utilize a common bus. Disable inputs provide time discrimination. Disable inputs and receiver outputs are TTL compatible. Performance is optimized for systems with bus rise and fall times s 1.0 ms/V. Y Y Y Y Y Y Y Y Low receiver input current for normal VCC or VCC e 0V (15 mA typ) Six separate receivers per package Built-in receiver input hysteresis (1V typ) High receiver noise immunity (2V typ) Temperature insensitive receiver input thresholds track bus logic levels TTL compatible disable and output Molded or cavity dual-in-line or flat package High speed Typical Application TL/F/5811 – 1 Connection Diagram Dual-In-Line Package TL/F/5811 – 2 Top View Order Number DS7837J, DS8837M or DS8837N See NS Package Number J16A, M16A or N16A C1996 National Semiconductor Corporation TL/F/5811 RRD-B30M36/Printed in U. S. A. http://www.national.com DS7837/DS8837 Hex Unified Bus Receiver February 1996 Absolute Maximum Ratings (Note 1) Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage Input Voltage Operating Temperature Range DS7837 DS8837 Supply Voltage, (VCC) DS7837 DS8837 Temperature (TA) DS7837 DS8837 7V 5.5V b 55§ C to a 125§ C 0§ C to a 70§ C Min Max Units 4.5 4.75 5.5 5.25 V V b 55 a 125 a 70 §C §C 0 b 65§ C to a 150§ C Storage Temperature Range Maximum Power Dissipation* at 25§ C Cavity Package 1433 mW Molded DIP Package 1362 mW SO Package 1002 mW Lead Temperature (Soldering, 4 seconds) 260§ C *Derate cavity package 9.6 mW/§ C above 25§ C; derate molded DIP package 10.9 mW/§ C above 25§ C; derate SO package 8.01 mW/§ C above 25§ C. Electrical Characteristics The following apply for VMIN s VCC s VMAX, TMIN s TA s TMAX, unless otherwise specified (Notes 2 and 3) Symbol VTH VTL IIH Parameter High Level Receiver Threshold Conditions VCC e Max Low Level Receiver Threshold VCC e Min Maximum Receiver Input Current VIN e 4V Min Typ Max Units DS7837 1.65 2.25 2.65 V DS8837 1.80 2.25 2.50 V DS7837 0.97 1.30 1.63 V DS8837 1.05 1.30 1.55 V VCC e VMAX 15.0 50.0 mA VCC e 0V 1.0 50.0 mA 1.0 50.0 mA IIL Logical ‘‘0’’ Receiver Input Current VIN e 0.4V, VCC e VMAX VIH Logical ‘‘1’’ Input Voltage VIL Logical ‘‘0’’ Input Voltage IIH Logical ‘‘1’’ Input Current Disable Input IIL Logical ‘‘0’’ Input Current VIN e 4V, VIND e 0.4V, Disable Input VOH Logical ‘‘1’’ Output Voltage VIN e 0.5V, VIND e 0.8V, IOH e b400 mA VOL Logical ‘‘0’’ Output Voltage VIN e 4V, VIND e 0.8V, IOH e 16 mA IOS Output Short Circuit Current VIN e 0.5V, VIND e 0V, VOS e 0V, VCC e VMAX, (Note 4) ICC Power Supply Current VIN e 4V, VIND e 0V, (Per Package) VCL Input Clamp Diode VIN e b12 mA, VIND e b12 mA, TA e 25§ C Disable 2.0 V Disable 0.8 V VIND e 2.4V 80.0 mA 2.0 mA b 3.2 mA VIND e 5.5V http://www.national.com 2 2.4 V 0.25 0.4 V b 55.0 mA 45.0 60.0 mA b 1.0 b 1.5 V b 18.0 Switching Characteristics TA e 25§ C, nominal power supplies unless otherwise noted Symbol tpd Parameter Propagation Delays Typ Max Units VIND e 0V, Receiver Input to Logical ‘‘1’’ Output, (Note 5) Conditions Min 20 30 ns Input to Logical ‘‘0’’ Output, (Note 6) 18 30 ns Input e 0V, Disable, (Note 7) Input to Logical ‘‘1’’ Output 9 15 ns Input to Logical ‘‘0’’ Output 4 10 ns Note 1: ‘‘Absolute Maximum Ratings’’ are those values beyond which the safety of the device cannot be guaranteed. Except for ‘‘Operating Temperature Range’’ they are not meant to imply that the devices should be operated at these limits. The table of ‘‘Electrical Characteristics’’ provides conditions for actual device operation. Note 2: Unless otherwise specified min/max limits apply across the b 55§ C to a 125§ C temperature range for the DS7837 and across the 0§ C to a 70§ C range for the DS8837. All typical values are for TA e 25§ C and VCC e 5V. Note 3: All currents into device pins shown as positive, out of device pins as negative, all voltages referenced to ground unless otherwise noted. All values shown as max or min on absolute value basis. Note 4: Only one output at a time should be shorted. Note 5: Fan-out of 10 load, CLOAD e 15 pF total. Measured from VIN e 1.3V to VOUT e 1.5V, VIN e 0V to 3V pulse. Note 6: Fan-out of 10 load, CLOAD e 15 pF total. Measured from VIN e 2.3V to VOUT e 1.5V, VIN e 0V to 3V pulse. Note 7: Fan-out of 10 load, CLOAD e 15 pF total. Measured from VIN e 1.5V to VOUT e 1.5V, VIN e 0V to 3V pulse. Physical Dimensions inches (millimeters) Ceramic Dual-In-Line Package (J) Order Number DS7837J NS Package Number J16A 3 http://www.national.com DS7837/DS8837 Hex Unified Bus Receiver Physical Dimensions inches (millimeters) (Continued) SO Package (M) Order Number DS8837M NS Package Number M16A Molded Dual-In-Line Package (N) Order Number DS8837N NS Package Number N16A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. 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