TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01844 1-800-446-1158 / (978) 794-1666 / Fax: (978) 689-0803 Website: http: //www.microsemi.com SCHOTTKY BARRIER DIODES – LOW REVERSE LEAKAGE CHARACTERISTICS – METALLURGICALLY BONDED Qualified per MIL-PRF-19500/444 DEVICES LEVELS 1N5711-1 1N5712-1 1N6857-1 1N6858-1 *DSB2810 *DSB5712 *1N5711 JAN JANTX JANTXV * These devices are only available as Commercial Level Product. MAXIMUM RATING AT 25°C Operating Temperature: -65°C to +150°C Storage Temperature: -65°C to +150°C Operating Current: 5711 types 2810, 5712 & 6858 types 6857 type Derating: all types: *COMMERCIAL :33mA dc @ TL = +130°C, L = 3/8” :75mA dc @ TL = +110°C, L = 3/8” :75mA dc @ TL = +70°C, L = 3/8” Derate to 0 (zero) mA @ +150°C ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified) TYPE NUMBER MINIMUM BEAKDOWN VOLTAAGE MAXIMUM FORWARD VOLTAGE MAXIMUM FORWARD VOLTAGE MAXIMUM REVERSE LEAKAGE CURRENT VBR @ 10μA VF @ 1mA VF @ IF IR @ VR MAXIMUM CAPACITANCE @ VR = 0 VOLTS f = 1.0MHz ESDS CLASS CT VOLTS VOLTS MILLIAMPS nA VOLTS PICO FARADS DSB2810 20 0.41 1.0 @ 35 100 15 2.0 1 1N5711, -1 70 0.41 1.0 @ 15 200 50 2.0 1 DSB5712 20 0.41 1.0 @ 35 150 16 2.0 1 1N5712-1 20 0.41 1.0 @ 35 150 16 2.0 1 1N6857-1 20 0.35 0.75 @ 35 150 16 4.5 2 1N6858-1 70 0.36 0.65 @ 15 200 50 4.5 2 LDS-0040 Rev. 2 (101097) DO-35 Page 1 of 3 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01844 1-800-446-1158 / (978) 794-1666 / Fax: (978) 689-0803 Website: http: //www.microsemi.com GRAPHS FIGURE 1 FIGURE 2 I – V Curve Showing Typical Forward Voltage Variation with Temperature for the DSB5712 and DSB2810 Schottky Diodes. FIGURE 3 I – V Curve Showing Typical Forward Voltage Variation with Temperature for Schottky Diode 1N5711. DSB5712 and DSB2810 Typical Variation of Reverse Current (IR) vs. Reverse Voltage (VR) at Various Temperatures FIGURE 4 1N5711 Typical; Variation of Reverse Current (IR); vs. ReverseVoltage (VR) at Various Temperatures. FIGURE 5 Typical Dynamic Resistance (RD) vs. Forward Current Current (IF) LDS-0040 Rev. 2 (101097) Page 2 of 3 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01844 1-800-446-1158 / (978) 794-1666 / Fax: (978) 689-0803 Website: http: //www.microsemi.com PACKAGE DIMENSIONS NOTE: 1. Dimensions are in inches. Millimeters are given for general information only. 2. Dimensions BL and LD include all components of the diode periphery except the sections of the leads over which the diameter is controlled. 3. Dimension BD shall be measured at the largest diameter. 4. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology. 5. Effective Minority Carrier Lifetime (τ) is 100 Pico Seconds Symbol BD BL LD LL Dimensions Inches Millimeters Min Max Min Max .068 .076 1.73 1.93 .125 .170 3.18 4.32 .014 .022 0.36 0.56 1.000 1.500 25.40 38.10 Notes 2, 3 2 FIGURE 1 Physical dimensions, (DO-35) 1N5711-1, 1N5712-1, 1N6857-1, and 1N6858-1 DESIGN DATA Case: Hermetically sealed glass case per MIL-PRF-19500/444 and /445 DO-35 outline. Lead Material: Copper clad steel. Lead Finish: Tin / Lead Thermal Resistance: (RθJEC): 250°C/W maximum at L = .375 inch Thermal Impedance (ZθJX): (ZθJX): 40°C/W maximum. Polarity: Cathode end is banded. Mounting Position: Any. LDS-0040 Rev. 2 (101097) Page 3 of 3