This product complies with the RoHS Directive (EU 2002/95/EC). DSC7003 Silicon NPN epitaxial planar type For low frequency output amplification Complementary to DSA7003 DSC8003 in MiniP3 type package Features Package Low collector-emitter saturation voltage VCE(sat) Contributes to miniaturization of sets, reduction of component count. Eco-friendly Halogen-free package Code MiniP3-F2-B Package dimension clicks here.→ Click! Packaging DSC7003×0L Embossed type (Thermo-compression sealing): 1000 pcs / reel (standard) Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Unit Collector-base voltage (Emitter open) VCBO 60 V Collector-emitter voltage (Base open) VCEO 50 V Emitter-base voltage (Collector open) VEBO 5 V Collector current IC 1 A Peak collector current ICP 1.5 A Collector power dissipation PC 1 W Junction temperature Tj 150 °C Tstg –55 to +150 °C Storage temperature Pin Name 1. Base 2. Collector 3. Emitter Marking Symbol: 5A cm2 Note) Printed circuit board: Copper foil area of 1 or more, and the board thickness of 1.7 mm for the collector portion Absolute maximum rating without heat sink for PC is 0.5 W Electrical Characteristics Ta = 25°C±3°C Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) VCBO IC = 10 mA, IE = 0 60 V Collector-emitter voltage (Base open) VCEO IC = 2 mA, IB = 0 50 V Emitter-base voltage (Collector open) VEBO IE = 10 mA, IC = 0 5 V Collector-base cutoff current (Emitter open) ICBO VCB = 20 V, IE = 0 hFE1 Forward current transfer ratio *1 *2 hFE2 0.1 VCE = 10 V, IC = 500 mA 120 VCE = 5 V, IC = 1 A 50 340 mA Collector-emitter saturation voltage *1 VCE(sat) IC = 500 mA, IB = 50 mA 0.15 0.4 V Base-emitter saturation voltage *1 VBE(sat) IC = 500 mA, IB = 50 mA 0.9 1.2 V fT VCE = 10 V, IC = 50 mA 170 VCB = 10 V, IE = 0, f = 1 MHz 10 Transition frequency Collector output capacitance (Common base, input open circuited) Cob MHz 20 pF Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *1: Pulse measurement *2: Rank classification Code R S 0 Rank R S No-rank hFE1 120 to 240 170 to 340 120 to 340 Marking Symbol 5AR 5AS 5A Product of no-rank is not classified and have no marking symbol for rank. Publication date: May 2012 Ver. DED 1 This product complies with the RoHS Directive (EU 2002/95/EC). DSC7003 DSC7003_PC-Ta DSC7003_IC-VCE PC Ta IB = 8 mA 1 000 Collector current IC (mA) 1 000 750 500 250 6 mA 800 5 mA 4 mA 600 3 mA 400 2 mA 200 0 40 80 120 160 0 200 Ambient temperature Ta (°C) 1 mA 0 2 4 VCE = 10 V Collector current IC (mA) Collector-emitter saturation voltage VCE(sat) (V) 1 0.1 25°C 25°C Ta = 85°C −30°C 800 600 400 10 100 0 0 0.2 0.4 0.6 fT IC Transition frequency fT (MHz) 250 VCE = 10 V Ta = 25°C 150 100 50 10 102 0.8 1.0 Base-emitter voltage VBE (V) DSC7003_fT-IC 1 100 50 0 1 103 Collector current IC (mA) Ver. DED 10 102 103 Collector current IC (mA) Cob VCB 200 Collector current IC (mA) 200 −30°C DSC7003_Cob-VCB −30°C 1 150 12 1 200 1 000 0.01 0.1 10 25°C IC VBE IC / IB = 10 Ta = 85°C 8 200 DSC7003_IC-VBE VCE(sat) IC 10 6 Ta = 85°C 250 Collector-emitter voltage VCE (V) DSC7003_VCEsat-IC 2 7 mA Forward current transfer ratio hFE 300 Ta = 25°C 0 hFE IC 1 200 1.2 Collector output capacitance (Common base, input open circuited) Cob (pF) Collector power dissipation PC (mW) 1 250 0 DSC7003_hFE-IC IC VCE IE = 0 f = 1 MHz Ta = 25°C 20 15 10 5 0 1 10 100 Collector-base voltage VCB (V) Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202