EM640FP16 Series Low Power, 256Kx16 SRAM Document Title 256K x16 bit Low Power and Low Voltage Full CMOS Static RAM Revision History Revision No. History Draft Date 0.0 Initial Draft October 24 , 2002 0.1 2’nd Draft Changed Icc, Icc1 value November 11 , 2002 0.2 3’rd Draft Changed ISB1 test conditions, December 23 , 2002 Remark Preliminary Changed VDR & IDR measurement condition 0.3 4’th Draft 0.4 5’th Draft Add Pb-free part number EM640FP16: February 13 , 2004 April 11 , 2006 Changed Icc2 value Changed Package Dimension Emerging Memory & Logic Solutions Inc. IT Venture Tower Eastside 11F, 78, Karac-Dong, Songpa-Ku, Seoul, Rep.of Korea Zip Code : 138-160 Tel : +82-2-2142-1759~1766 Fax : +82-2-2142-1769 / Homepage : www.emlsi.com The attached datasheets are provided by EMLSI reserve the right to change the specifications and products. EMLSI will answer to your questions about device. If you have any questions, please contact the EMLSI office. 1 EM640FP16 Series Low Power, 256Kx16 SRAM FEATURES GENERAL DESCRIPTION • • • • • • The EM640FP16 families are fabricated by EMLSI’s advanced full CMOS process technology. The families support industrial temperature range and Chip Scale Package for user flexibility of system design. The families also supports low data retention voltage for battery back-up operation with low data retention current. Process Technology : 0.18µm Full CMOS Organization : 256K x 16 bit Power Supply Voltage : 1.65V ~ 2.2V Low Data Retention Voltage : 1.0V(Min.) Three state outputs Package Type : 48-FPBGA 6.0x7.0 PRODUCT FAMILY Power Dissipation Product Family Operating Temperature Vcc Range Industrial (-40 ~ 85oC) EM640FP16 Speed Standby (ISB1, Typ.) 1 µA 70ns1) 1.65~2.2V PKG Type Operating (ICC1.Max) 48-FPBGA (6.0x7.0) 2 mA 1. The parameter is measured with 30pF test load. PIN DESCRIPTION FUNCTIONAL BLOCK DIAGRAM 1 2 3 4 5 6 A LB OE A0 A1 A2 CS2 B I/O9 UB A3 A4 CS1 I/O1 Pre-charge Circuit I/O10 I/O 11 A5 A6 I/O2 I/O3 D VSS I/O 12 A17 A7 I/O4 VCC E V CC I/O 13 DNU A16 I/O5 VSS VCC Row Select C A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 I/O15 I/O 14 A14 A15 I/O6 I/O7 G I/O16 DNU A12 A13 WE I/O8 H DNU A9 A10 A11 DNU A8 UB LB Name Function CS1 CS2 CS1,CS2 Chip select inputs Vcc Power Supply OE Output Enable input Vss Ground WE Write Enable input UB Upper Byte (I/O9~16) Address Inputs LB Lower Byte (I/O1~8) A 0~A17 I/O 1~I/O16 Data Inputs/outputs DNU I/O Circuit Column Select A11 A12 A13 A14 A15 A16 A17 WE OE Function Data Cont Data Cont 48-FPBGA : Top view (ball down) Name 2048 x 2048 A10 I/O1 ~ I/O8 I/O9 ~ I/O16 F VSS Memory Array Do Not Use 2 Control Logic EM640FP16 Series Low Power, 256Kx16 SRAM ABSOLUTE MAXIMUM RATINGS * Parameter Symbol Voltage on Any Pin Relative to Vss Minimum Unit VIN, VOUT -0.5 to 2.5V V Voltage on Vcc supply relative to Vss VCC -0.3 to 2.5V V Power Dissipation PD 1.0 W Operating Temperature TA -40 to 85 oC * Stresses greater than those listed above “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability. FUNCTIONAL DESCRIPTION CS1 CS2 OE WE LB UB I/O1-8 I/O9-16 Mode Power H X X X X X High-Z High-Z Deselected Stand by X L X X X X High-Z High-Z Deselected Stand by X X X X H H High-Z High-Z Deselected Stand by L H H H L X High-Z High-Z Output Disabled Active L H H H X L High-Z High-Z Output Disabled Active L H L H L H Data Out High-Z Lower Byte Read Active L H L H H L High-Z Data Out Upper Byte Read Active L H L H L L Data Out Data Out Word Read Active L H X L L H Data In High-Z Lower Byte Write Active L H X L H L High-Z Data In Upper Byte Write Active L H X L L L Data In Data In Word Write Active Note: X means don’t care. (Must be low or high state) 3 EM640FP16 Series Low Power, 256Kx16 SRAM RECOMMENDED DC OPERATING CONDITIONS 1) Parameter 1. 2. 3. 4. Symbol Min Typ Max Unit Supply voltage VCC 1.65 1.8 2.2 V Ground VSS 0 0 0 V Input high voltage VIH 1.4 - VCC + 0.32) V Input low voltage VIL -0.33) - 0.4 V TA= -40 to 85oC, otherwise specified Overshoot: VCC +1.0 V in case of pulse width < 20ns Undershoot: -1.0 V in case of pulse width < 20ns Overshoot and undershoot are sampled, not 100% tested. CAPACITANCE1) (f =1MHz, TA=25oC) Item Symbol Test Condition Min Max Unit Input capacitance CIN VIN=0V - 8 pF Input/Ouput capacitance CIO VIO=0V - 10 pF 1. Capacitance is sampled, not 100% tested DC AND OPERATING CHARACTERISTICS Parameter Symbol Test Conditions Min Typ Max Unit Input leakage current ILI VIN =VSS to VCC -1 - 1 uA Output leakage current ILO CS1=V IH, CS2=VIL or OE=V IH or WE=VIL or LB=UB=VIH VIO=V SS to VCC -1 - 1 uA Operating power supply ICC IIO=0mA, CS1=VIL, CS2=WE=VIH , VIN=V IH or VIL - - 2 mA ICC1 Cycle time=1µs, 100% duty, ILO=0mA, CS1<0.2V, LB<0.2V or/and UB<0.2V, CS2>VCC-0.2V VIN<0.2V or V IN>VCC -0.2V - - 2 mA ICC2 Cycle time = Min, IIO=0mA, 100% duty, CS1=VIL, CS2=V IH , LB=V IL or/and UB=VIL VIN =V IL or VIH - - 15 mA Output low voltage VOL IOL = 0.1mA - - 0.2 V Output high voltage VOH IOH = -0.1mA 1.4 - - V ISB1 CS1>V CC-0.2V, CS2>VCC-0.2V (CS 1 controlled) or 0V<CS2<0.2V (CS2 controlled), Other inputs = 0 ~ VCC - 1 5 uA Average operating current Standby Current (CMOS) (Typ. condition : VCC =1.8V @ 25oC) (Max. condition : V CC=2.2V @ 85oC) 4 LL LF EM640FP16 Series Low Power, 256Kx16 SRAM VTM3) AC OPERATING CONDITIONS Test Conditions (Test Load and Test Input/Output Reference) R12) Input Pulse Level : 0.2 to VCC-0.2V Input Rise and Fall Time : 5ns Input and Output reference Voltage : 0.9V Output Load (See right) : CL = 100pF+ 1 TTL CL1) = 30pF + 1 TTL 1. Including scope and Jig capacitance R2=3150 ohm 2. R 1=3070 ohm, 3. VTM =1.8V R22) CL1) READ CYCLE (Vcc =1.65 to 2.2V, Gnd = 0V, TA = -40oC to +85oC) Parameter Symbol 70ns Min Max Unit Read Cycle Time tRC 70 - ns Address Access Time tAA - 70 ns Chip Select to output tco1, tco2 - 70 ns Output Enable to valid output tOE - 35 ns UB, LB Acess time tBA 70 ns tLZ1, tLZ2 10 - ns UB, LB enable to low-Z output tBLZ 10 - ns Output Enable to Low-Z output tOLZ 5 - ns tHZ1, tHZ2 0 25 ns UB, LB disable to high-Z output tBHZ 0 25 ns Output disable to high-Z output tOHZ 0 25 ns Output hold from address change tOH 10 - ns Chip select to low-Z output Chip disable to high-Z output WRITE CYCLE (Vcc =1.65 to 2.2V, Gnd = 0V, TA = -40oC to +85oC) Parameter Symbol 70ns Unit Min Max tWC 70 - ns tCW1, tCW2 60 - ns Address Setup time tAs 0 - ns Address valid to end of write tAW 60 - ns UB, LB valid to end of write tBW 60 - ns Write pulse width tWP 55 - ns Write recovery time tWR 0 - ns Write to ouput high-Z tWHZ 0 25 ns Data to write time overlap tDW 30 Data hold from write time tDH 0 - ns End write to output low-Z tOW 5 - ns Write Cycle Time Chip Select to end of write 5 ns EM640FP16 Series Low Power, 256Kx16 SRAM TIMING DIAGRAMS TIMING WAVEFORM OF READ CYCLE(1). (Address Controlled, CS1=OE=VIL, CS2=WE=VIH, UB or/and LB=VIL) tRC Address tAA tOH Data Out Previous Data Valid Data Valid TIMING WAVEFORM OF READ CYCLE(2) (WE = VIH) tRC Address tAA tOH tCO CS1 CS2 tHZ tBA UB,LB tBHZ tOE OE tOHZ tOLZ Data Out High-Z Data Valid tBLZ tWHZ tLZ NOTES (READ CYCLE) 1. tHZ and tOHZ are defined as the outputs achieve the open circuit conditions and are not referanced to output voltage levels. 2. At any given temperature and voltage condition, tHZ(Max.) is less than tLZ(Min.) both for a given device and from device to device interconnection. 6 EM640FP16 Series Low Power, 256Kx16 SRAM TIMING WAVEFORM OF WRITE CYCLE(1) (WE CONTROLLED) tWC Address tCW(2) tWR(4) CS1 CS2 tAW tBW UB,LB tWP(1) WE tAS(3) Data in tDH tDW High-Z High-Z Data Valid tWHZ Data out tOW Data Undefined TIMING WAVEFORM OF WRITE CYCLE(2) (CS1 CONTROLLED) tWC Address tAS(3) tCW(2) tWR(4) CS1 CS2 tAW tBW UB,LB tWP(1) WE tDW Data in Data out Data Valid High-Z High-Z 7 tDH EM640FP16 Series Low Power, 256Kx16 SRAM TIMING WAVEFORM OF WRITE CYCLE(3) (UB, LB CONTROLLED) tWC Address tCW(2) tWR(4) CS1 CS2 tAW tBW UB,LB tWP(1) tAS(3) WE tDW Data in Data out tDH Data Valid High-Z High-Z NOTES (WRITE CYCLE) 1. A write occurs during the overlap(tWP) of low CS1 and low WE. A write begins when CS1 goes low and WE goes low with asserting UB or LB for single byte operation or simultaneously asserting UB and LB for double byte operation. A write ends at the earliest transition when CS1 goes high and WE goes high. The tWP is measured from the beginning of write to the end of write. 2. tCW is measured from the CS1 going low to end of write. 3. tAS is measured from the address valid to the beginning of write. 4. tWR is measured from the end or write to the address change. tWR applied in case a write ends as CS1 or WE going high. 8 EM640FP16 Series Low Power, 256Kx16 SRAM DATA RETENTION CHARACTERISTICS Parameter Symbol VCC for Data Retention V DR Data Retention Current IDR Chip Deselect to Data Retention Time tSDR Test Condition ISB1 Test Condition (Chip Disabled) 1) VCC=1.2V, ISB1 Test Condition (Chip Disabled) 1) Min Typ Max Unit 1.0 - 2.2 V - 0.5 2 uA 0 - - tRC - - See data retention wave form Operation Recovery Time tRDR ns NOTES 1. See the ISB1 measurement condition of datasheet page 4. DATA RETENTION WAVE FORM tSDR Data Retention Mode tRDR Vcc 1.65V 1.4V VDR CS1 > Vcc-0.2V CS1 GND Data Retention Mode Vcc 1.65V CS2 tRDR tSDR VDR 0.4V CS 2 < 0.2V GND 9 EM640FP16 Series Low Power, 256Kx16 SRAM Unit: millimeters PACKAGE DIMENSION 48 Ball Fine Pitch BGA (0.75mm ball pitch) Bottom View Top View A1 index Mark B B1 6 5 4 3 0.4 2 0.4 B 1 A B #A1 C C1 C C D C1/2 E F G H B/2 Detail A D E2 0.26 Side View 0.27Typ. E E1 A Min Typ Max A - 0.75 - B 5.95 6.00 6.05 B1 - 3.75 - C 6.95 7.00 7.05 C1 - 5.25 - D 0.30 0.35 0.40 E - 0.85 0.90 E1 - 0.58 - E2 - 0.27 - Y - - 0.08 Y 0.58Typ. C NOTES. 1. Bump counts : 48(8row x 6column) 2. Bump pitch : (x,y)=(0.75x0.75) (typ.) 3. All tolerence are +/-0.050 unless otherwise specified. 4. Typ : Typical 5. Y is coplanarity : 0.08(Max) 10 EM640FP16 Series Low Power, 256Kx16 SRAM MEMORY FUNCTION GUIDE EM X XX X X X XX X X - XX XX 1. EMLSI Memory 11. Power 2. Device Type 10. Speed 3. Density 4. Option 9. Packages 5. Technology 8. Version 6. Operating Voltage 7. Orgainzation 8. Version Blank ----------------- Mother die A ----------------------- First version B ----------------------- Second version C ----------------------- Third version D ----------------------- Fourth version E ----------------------- Fifth version 1. Memory Component 2. Device Type 6 ------------------------ Low Power SRAM 7 ------------------------ Pseudo SRAM 3. Density 1 ------------------------- 1M 2 ------------------------- 2M 4 ------------------------- 4M 8 ------------------------- 8M 16 ----------------------- 16M 32 ----------------------- 32M 64 ----------------------- 64M 9. Package Blank ---------------------- Package W --------------------- Wafer 10. Speed 45 ---------------------- 45ns 55 ---------------------- 55ns 70 ---------------------- 70ns 85 ---------------------- 85ns 10 --------------------- 100ns 12 --------------------- 120ns 4. Option 0 ----------------------- Dual CS 1 ----------------------- Single CS 5. Technology Blank ------------------ CMOS F ------------------------ Full CMOS 11. Power LL ------------ Low Low Power LF ------------ Low Low Power(Pb-Free & Green) L ------------- Low Power S ------------- Standard Power 6. Operating Voltage Blank ------------------- 5V V ------------------------- 3.3V U ------------------------- 3.0V S ------------------------- 2.5V R ------------------------- 2.0V P ------------------------- 1.8V 7. Orginzation 8 ---------------------- x8 bit 16 ---------------------- x16 bit 32 ---------------------- x32 bit 11