EM773
Energy metering IC; up to 32 kB flash and 8 kB SRAM
Rev. 2 — 3 January 2012
Product data sheet
1. General description
The EM773 is an ARM Cortex-M0 based, low-cost 32-bit energy metering IC, designed for
8/16-bit smart metering applications. The EM773 offers programmability and on-chip
metrology functionality combined with a low power, simple instruction set and memory
addressing with reduced code size compared to existing 8/16-bit architectures.
The EM773 operates at CPU frequencies of up to 48 MHz.
The peripheral complement of the EM773 includes up to 32 kB of flash memory, up to
8 kB of data memory, one Fast-mode Plus I2C-bus interface, one RS-485/EIA-485 UART,
one SPI interface with SSP features, three general purpose counter/timers, up to 25
general purpose I/O pins, and a metrology engine for energy measurement.
2. Features and benefits
System:
ARM Cortex-M0 processor, running at frequencies of up to 48 MHz.
ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).
Serial Wire Debug.
System tick timer.
Memory:
32 kB on-chip flash programming memory.
8 kB SRAM.
In-System Programming (ISP) and In-Application Programming (IAP) via on-chip
bootloader software.
Digital peripherals:
Up to 25 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down
resistors, and a configurable open-drain mode.
GPIO pins can be used as edge and level sensitive interrupt sources.
High-current output driver (20 mA) on one pin.
High-current sink drivers (20 mA) on two I2C-bus pins in Fast-mode Plus.
Three general purpose counter/timers with a total of two capture inputs and 10
match outputs.
Programmable Windowed WatchDog Timer (WWDT).
Analog peripherals:
Metrology Engine for Smart Metering with two current inputs and a voltage input.
EM773
NXP Semiconductors
Energy metering IC
Serial interfaces:
UART with fractional baud rate generation, internal FIFO, and RS-485 support.
One SPI controller with SSP features and with FIFO and multi-protocol capabilities.
I2C-bus interface supporting full I2C-bus specification and Fast-mode Plus with a
data rate of 1 Mbit/s with multiple address recognition and monitor mode.
Clock generation:
12 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used
as a system clock.
Crystal oscillator with an operating range of 1 MHz to 25 MHz.
Programmable watchdog oscillator with a frequency range of 7.8 kHz to 1.8 MHz.
PLL allows CPU operation up to the maximum CPU rate without the need for a
high-frequency crystal. May be run from the system oscillator or the internal RC
oscillator.
Clock output function with divider that can reflect the system oscillator clock, IRC
clock, CPU clock, and the Watchdog clock.
Power control:
Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, and Deep power-down modes.
Three reduced power modes: Sleep, Deep-sleep, and Deep power-down.
Processor wake-up from Deep-sleep mode via a dedicated start logic using up to
13 of the functional pins.
Power-On Reset (POR).
Brownout detect with four separate thresholds for interrupt and forced reset.
Unique device serial number for identification.
Single 3.3 V power supply (1.8 V to 3.6 V).
Available as 33-pin HVQFN33 package.
3. Applications
Smart Metering
EM773
Product data sheet
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Rev. 2 — 3 January 2012
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EM773
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Energy metering IC
4. Ordering information
Table 1.
Ordering information
Type number
EM773FHN33
EM773
Product data sheet
Package
Name
Description
Version
HVQFN33
HVQFN: plastic thermal enhanced very thin quad flat package; no
leads; 33 terminals; body 7 7 0.85 mm
n/a
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Energy metering IC
5. Block diagram
XTALIN
XTALOUT
RESET
SWD
EM773
IRC
TEST/DEBUG
INTERFACE
CLOCK
GENERATION,
POWER CONTROL,
SYSTEM
FUNCTIONS
POR
ARM
CORTEX-M0
system bus
clocks and
controls
FLASH
32 kB
slave
GPIO ports
PIO0/1/2/3
HIGH-SPEED
GPIO
CLKOUT
SRAM
8 kB
slave
ROM
slave
slave
AHB-LITE BUS
slave
AHB TO APB
BRIDGE
RXD
TXD
DTR, CTS, RTS
CT32B0_MAT[2:0]
CT32B0_CAP0
CT32B1_MAT[3:0]
CT16B0_MAT[2:0]
CT16B0_CAP0
UART
METROLOGY ENGINE
I_LOWGAIN
I_HIGHGAIN
VOLTAGE
SCK0, SSEL0
MISO0, MOSI0
SPI0
32-bit COUNTER/TIMER 0
SCL
SDA
I2C-BUS
32-bit COUNTER/TIMER 1
16-bit COUNTER/TIMER 0
WDT
IOCONFIG
SYSTEM CONTROL
PMU
002aag726
Fig 1.
EM773 block diagram
EM773
Product data sheet
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EM773
NXP Semiconductors
Energy metering IC
6. Pinning information
VDD
PIO3_2
PIO1_11
PIO1_4/CT32B1_MAT3/WAKEUP
SWDIO/PIO1_3/CT32B1_MAT2
27
26
25
PIO1_5/RTS/CT32B0_CAP0
28
PIO1_6/RXD/CT32B0_MAT0
30
29
PIO1_7/TXD/CT32B0_MAT1
31
terminal 1
index area
32
6.1 Pinning
PIO2_0/DTR
1
24
R/PIO1_2/CT32B1_MAT1
RESET/PIO0_0
2
23
R/PIO1_1/CT32B1_MAT0
PIO0_1/CLKOUT/CT32B0_MAT2
3
22
VOLTAGE
XTALIN
4
21
I_HIGHGAIN
XTALOUT
5
20
I_LOWGAIN
VDD
6
19
SWCLK/PIO0_10/SCK0/CT16B0_MAT2
PIO1_8
7
18
PIO0_9/MOSI0/CT16B0_MAT1
PIO0_2/SSEL0/CT16B0_CAP0
8
17
PIO0_8/MISO0/CT16B0_MAT0
15
16
PIO0_7/CTS
13
PIO3_4
14
12
PIO1_9
PIO3_5
11
PIO0_5/SDA
PIO0_6/SCK0
9
10
PIO0_3
PIO0_4/SCL
33 VSS
002aag727
Transparent top view
Fig 2.
Pin configuration HVQFN 33 package
EM773
Product data sheet
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Rev. 2 — 3 January 2012
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Energy metering IC
6.2 Pin description
Table 2.
EM773 pin description table
Symbol
Pin
Start
logic
input
PIO0_0 to PIO0_10
2[2]
PIO0_1/CLKOUT/
CT32B0_MAT2
3[3]
PIO0_2/SSEL0/
CT16B0_CAP0
8[3]
PIO0_3
9[3]
PIO0_4/SCL
10[4]
11[4]
PIO0_6/SCK0
15[3]
PIO0_7/CTS
16[3]
PIO0_8/MISO0/
CT16B0_MAT0
17[3]
PIO0_9/MOSI0/
CT16B0_MAT1
EM773
Product data sheet
Reset
state
18[3]
yes
yes
yes
Description
[1]
I/O
RESET/PIO0_0
PIO0_5/SDA
Type
Port 0 — Port 0 is a 12-bit I/O port with individual
direction and function controls for each bit. The
operation of port 0 pins depends on the function
selected through the IOCONFIG register block. Pin
PIO0_11 is not available.
I
I;PU
RESET — External reset input with 20 ns glitch filter. A
LOW-going pulse as short as 50 ns on this pin resets
the device, causing I/O ports and peripherals to take on
their default states, and processor execution to begin at
address 0.
I/O
-
PIO0_0 — General purpose digital input/output pin.
I/O
I;PU
PIO0_1 — General purpose digital input/output pin. A
LOW level on this pin during reset starts the ISP
command handler.
O
-
CLKOUT — Clock out pin.
O
-
CT32B0_MAT2 — Match output 2 for 32-bit timer 0.
I/O
I;PU
PIO0_2 — General purpose digital input/output pin.
I/O
-
SSEL0 — Slave select for SPI0.
I
-
CT16B0_CAP0 — Capture input 0 for 16-bit timer 0.
yes
I/O
I;PU
PIO0_3 — General purpose digital input/output pin.
yes
I/O
IA
PIO0_4 — General purpose digital input/output pin
(open-drain).
I/O
-
SCL — I2C-bus, open-drain clock input/output.
High-current sink only if I2C Fast-mode Plus is selected
in the I/O configuration register.
I/O
IA
PIO0_5 — General purpose digital input/output pin
(open-drain).
I/O
-
SDA — I2C-bus, open-drain data input/output.
High-current sink only if I2C Fast-mode Plus is selected
in the I/O configuration register.
I/O
I;PU
PIO0_6 — General purpose digital input/output pin.
I/O
-
SCK0 — Serial clock for SPI0.
I/O
I;PU
PIO0_7 — General purpose digital input/output pin
(high-current output driver).
I
-
CTS — Clear To Send input for UART.
I/O
I;PU
PIO0_8 — General purpose digital input/output pin.
I/O
-
MISO0 — Master In Slave Out for SPI0.
O
-
CT16B0_MAT0 — Match output 0 for 16-bit timer 0.
I/O
I;PU
PIO0_9 — General purpose digital input/output pin.
I/O
-
MOSI0 — Master Out Slave In for SPI0.
O
-
CT16B0_MAT1 — Match output 1 for 16-bit timer 0.
yes
yes
yes
yes
yes
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EM773
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Energy metering IC
Table 2.
EM773 pin description table …continued
Symbol
SWCLK/PIO0_10/SCK0/
CT16B0_MAT2
I_HIGHGAIN
Pin
19[3]
21[5]
Start
logic
input
Type
yes
I
I;PU
I/O
-
PIO0_10 — General purpose digital input/output pin.
I/O
-
SCK0 — Serial clock for SPI0.
O
-
CT16B0_MAT2 — Match output 2 for 16-bit timer 0.
I
I;PU
I_HIGHGAIN — High gain current input for metrology
engine.
no
PIO1_1 to PIO1_9;
PIO1_11
Reset
state
Description
[1]
I/O
SWCLK — Serial wire clock.
Port 1 — Port 1 is a 12-bit I/O port with individual
direction and function controls for each bit. The
operation of port 1 pins depends on the function
selected through the IOCONFIG register block. Pins
PIO1_0 and PIO1_10 are not available.
VOLTAGE
22[5]
no
I
I;PU
VOLTAGE — Voltage input for the metrology engine.
R/PIO1_1/
CT32B1_MAT0
23[5]
no
O
I;PU
R — Reserved. Configure for an alternate function in
the IOCONFIG block.
I/O
-
PIO1_1 — General purpose digital input/output pin.
O
-
CT32B1_MAT0 — Match output 0 for 32-bit timer 1.
I
I;PU
R — Reserved. Configure for an alternate function in
the IOCONFIG block.
I/O
-
PIO1_2 — General purpose digital input/output pin.
O
-
CT32B1_MAT1 — Match output 1 for 32-bit timer 1.
I/O
I;PU
SWDIO — Serial wire debug input/output.
I/O
-
PIO1_3 — General purpose digital input/output pin.
O
-
CT32B1_MAT2 — Match output 2 for 32-bit timer 1.
I/O
I;PU
PIO1_4 — General purpose digital input/output pin.
O
-
CT32B1_MAT3 — Match output 3 for 32-bit timer 1.
I
-
WAKEUP — Deep power-down mode wake-up pin with
20 ns glitch filter. This pin must be pulled HIGH
externally to enter Deep power-down mode and pulled
LOW to exit Deep power-down mode. A LOW-going
pulse as short as 50 ns wakes up the part.
I/O
I;PU
PIO1_5 — General purpose digital input/output pin.
O
-
RTS — Request To Send output for UART.
I
-
CT32B0_CAP0 — Capture input 0 for 32-bit timer 0.
I/O
I;PU
PIO1_6 — General purpose digital input/output pin.
I
-
RXD — Receiver input for UART.
O
-
CT32B0_MAT0 — Match output 0 for 32-bit timer 0.
I/O
I;PU
PIO1_7 — General purpose digital input/output pin.
O
-
TXD — Transmitter output for UART.
O
-
CT32B0_MAT1 — Match output 1 for 32-bit timer 0.
R/PIO1_2/
CT32B1_MAT1
SWDIO/PIO1_3/
CT32B1_MAT2
PIO1_4/
CT32B1_MAT3/WAKEUP
24[5]
25[5]
26
PIO1_5/RTS/
CT32B0_CAP0
30[3]
PIO1_6/RXD/
CT32B0_MAT0
31[3]
PIO1_7/TXD/
CT32B0_MAT1
32[3]
no
no
no
no
no
no
PIO1_8
7[3]
no
I/O
I;PU
PIO1_8 — General purpose digital input/output pin.
PIO1_9
12[3]
no
I/O
I;PU
PIO1_9 — General purpose digital input/output pin.
I_LOWGAIN
20
no
I
I;PU
I_LOWGAIN — Low gain current input for metrology
engine.
EM773
Product data sheet
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Energy metering IC
Table 2.
EM773 pin description table …continued
Symbol
PIO1_11
Pin
27
Start
logic
input
Type
no
I/O
PIO2_0
PIO2_0/DTR
Reset
state
[1]
I;PU
I/O
1[3]
PIO3_0 to PIO3_5
no
Description
PIO1_11 — General purpose digital input/output pin.
Port 2 — Port 2 is a 12-bit I/O port with individual
direction and function controls for each bit. The
operation of port 2 pins depends on the function
selected through the IOCONFIG register block. Pins
PIO2_1 to PIO2_11 are not available.
I/O
I;PU
PIO2_0 — General purpose digital input/output pin.
O
-
DTR — Data Terminal Ready output for UART.
no
I/O
Port 3 — Port 3 is a 12-bit I/O port with individual
direction and function controls for each bit. The
operation of port 3 pins depends on the function
selected through the IOCONFIG register block. Pins
PIO3_0, PIO3_1, PIO3_3 and PIO3_6 to PIO3_11 are
not available.
PIO3_2
28[3]
no
I/O
I;PU
PIO3_2 — General purpose digital input/output pin.
PIO3_4
13[3]
no
I/O
I;PU
PIO3_4 — General purpose digital input/output pin.
PIO3_5
14[3]
no
I/O
I;PU
PIO3_5 — General purpose digital input/output pin.
VDD
6; 29
-
I
-
3.3 V supply voltage to the internal regulator, the
external rail, and the metrology engine.
XTALIN
4[6]
-
I
-
Input to the oscillator circuit and internal clock generator
circuits. Input voltage must not exceed 1.8 V.
XTALOUT
5[6]
-
O
-
Output from the oscillator amplifier.
VSS
33
-
-
-
Thermal pad. Connect to ground.
[1]
Pin state at reset for default function: I = Input; O = Output; PU = internal pull-up enabled; (pins pulled up to full VDD level ); IA = inactive,
no pull-up/down enabled.
[2]
See Figure 25 for the reset pad configuration. RESET functionality is not available in Deep power-down mode. Use the WAKEUP pin to
reset the chip and wake up from Deep power-down mode. An external pull-up resistor is required on this pin for the Deep power-down
mode. Pin is 5 V tolerant.
[3]
5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors and configurable hysteresis (see Figure 24).
[4]
I2C-bus pads compliant with the I2C-bus specification for I2C standard mode and I2C Fast-mode Plus.
[5]
5 V tolerant pad providing digital I/O functions with configurable pull-up/pull-down resistors, configurable hysteresis, and analog input.
When configured as a analog input, digital section of the pad is disabled and the pin is not 5 V tolerant (see Figure 24).
[6]
When the system oscillator is not used, connect XTALIN and XTALOUT as follows: XTALIN can be left floating or can be grounded
(grounding is preferred to reduce susceptibility to noise). XTALOUT should be left floating.
EM773
Product data sheet
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Energy metering IC
7. Functional description
7.1 ARM Cortex-M0 processor
The ARM Cortex-M0 is a general purpose, 32-bit microprocessor, which offers high
performance and very low power consumption.
7.2 On-chip flash program memory
The EM773 contains 32 kB of on-chip flash memory.
7.3 On-chip SRAM
The EM773 contains a total of 8 kB on-chip static RAM memory.
7.4 Memory map
The EM773 incorporates several distinct memory regions, shown in the following figure.
Figure 3 shows the overall map of the entire address space from the user program
viewpoint following reset. The interrupt vector area supports address remapping.
The AHB peripheral area is 2 megabyte in size, and is divided to allow for up to 128
peripherals. The APB peripheral area is 512 kB in size and is divided to allow for up to 32
peripherals. Each peripheral of either type is allocated 16 kilobytes of space. This allows
simplifying the address decoding for each peripheral.
EM773
Product data sheet
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Energy metering IC
AHB peripherals
EM773
4 GB
0x5020 0000
0xFFFF FFFF
16-127 reserved
reserved
0x5004 0000
0x5020 0000
AHB peripherals
0x5000 0000
12-15
GPIO PIO3
8-11
GPIO PIO2
4-7
GPIO PIO1
0-3
GPIO PIO0
reserved
APB peripherals
0x4008 0000
APB peripherals
1 GB
0x5003 0000
0x5002 0000
0x5001 0000
0x5000 0000
0x4008 0000
31 - 19 reserved
0x4000 0000
0x4004 C000
reserved
0x2000 0000
0.5 GB
18
system control
17
IOCONFIG
16
15
SPI0
flash controller
14
PMU
0x4004 8000
0x4004 4000
0x4004 0000
0x4003 C000
0x4003 8000
reserved
0x1FFF 4000
16 kB boot ROM
13 - 7 reserved
0x1FFF 0000
reserved
0x4001 C000
0x1000 2000
8 kB SRAM
0x1000 0000
reserved
0x0000 8000
6
32-bit counter/timer 1
0x4001 8000
5
32-bit counter/timer 0
0x4001 4000
4
reserved
0x4001 0000
3
16-bit counter/timer 0
0x4000 C000
2
UART
0x4000 8000
1
0
WDT
0x4000 4000
I2C-bus
0x4000 0000
32 kB on-chip flash
0x0000 00C0
active interrupt vectors
0x0000 0000
0x0000 0000
0 GB
002aag728
Fig 3.
EM773 memory map
7.5 Nested Vectored Interrupt Controller (NVIC)
The Nested Vectored Interrupt Controller (NVIC) is an integral part of the Cortex-M0. The
tight coupling to the CPU allows for low interrupt latency and efficient processing of late
arriving interrupts.
7.5.1 Features
• Controls system exceptions and peripheral interrupts.
• In the EM773, the NVIC supports 32 vectored interrupts including up to 13 inputs to
the start logic from individual GPIO pins.
EM773
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Energy metering IC
• Four programmable interrupt priority levels with hardware priority level masking.
• Software interrupt generation.
7.5.2 Interrupt sources
Each peripheral device has one interrupt line connected to the NVIC but may have several
interrupt flags. Individual interrupt flags may also represent more than one interrupt
source.
Any GPIO pin (total of up to 25 pins) regardless of the selected function, can be
programmed to generate an interrupt on a level, or rising edge or falling edge, or both.
7.6 IOCONFIG block
The IOCONFIG block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on-chip peripherals.
Peripherals should be connected to the appropriate pins prior to being activated and prior
to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is
not mapped to a related pin should be considered undefined.
7.7 Fast general purpose parallel I/O
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Multiple outputs
can be set or cleared in one write operation.
The EM773 uses accelerated GPIO functions:
• GPIO registers are a dedicated AHB peripheral so that the fastest possible I/O timing
can be achieved.
• Entire port value can be written in one instruction.
Additionally, any GPIO pin (total of up to 25 pins) providing a digital function can be
programmed to generate an interrupt on a level, a rising or falling edge, or both.
7.7.1 Features
• Bit level port registers allow a single instruction to set or clear any number of bits in
one write operation.
• Direction control of individual bits.
• All I/O default to inputs with pull-ups enabled after reset with the exception of the
I2C-bus pins PIO0_4 and PIO0_5.
• Pull-up/pull-down resistor configuration can be programmed through the IOCONFIG
block for each GPIO pin (except for pins PIO0_4 and PIO0_5).
• All GPIO pins (except PIO0_4 and PIO0_5) are pulled up to 3.3 V (VDD = 3.3 V) if their
pull-up resistor is enabled in the IOCONFIG block.
• Programmable open-drain mode.
EM773
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7.8 UART
The EM773 contains one UART.
Support for RS-485/9-bit mode allows both software address detection and automatic
address detection using 9-bit mode.
The UART includes a fractional baud rate generator. Standard baud rates such as
115200 Bd can be achieved with any crystal frequency above 2 MHz.
7.8.1 Features
•
•
•
•
•
Maximum UART data bit rate of 3.125 MBit/s.
16 Byte Receive and Transmit FIFOs.
Register locations conform to 16C550 industry standard.
Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• FIFO control mechanism that enables software flow control implementation.
• Support for RS-485/9-bit mode.
• Support for modem control.
7.9 SPI serial I/O controller
The SPI controller is capable of operation on a SSP, 4-wire SSI, or Microwire bus. It can
interact with multiple masters and slaves on the bus. Only a single master and a single
slave can communicate on the bus during a given data transfer. The SPI supports full
duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the
slave and from the slave to the master. In practice, often only one of these data flows
carries meaningful data.
7.9.1 Features
• Maximum SPI speed of 25 Mbit/s (master) or 4.17 Mbit/s (slave) (in SSP mode)
• Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National
Semiconductor Microwire buses
•
•
•
•
Synchronous serial communication
Master or slave operation
8-frame FIFOs for both transmit and receive
4-bit to 16-bit frame
7.10 I2C-bus serial I/O controller
The EM773 contains one I2C-bus controller.
The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial Clock Line
(SCL) and a Serial DAta line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the
capability to both receive and send information (such as memory). Transmitters and/or
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receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be
controlled by more than one bus master connected to it.
7.10.1 Features
• The I2C-interface is a standard I2C-bus compliant interface with open-drain pins. The
I2C-bus interface also supports Fast-mode Plus with bit rates up to 1 Mbit/s.
•
•
•
•
•
Easy to configure as master, slave, or master/slave.
Programmable clocks allow versatile rate control.
Bidirectional data transfer between masters and slaves.
Multi-master bus (no central master).
Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
• The I2C-bus controller supports multiple address recognition and a bus monitor mode.
7.11 Metrology engine
The EM773 contains a metrology engine designed to collect voltage and current inputs to
calculate the active power, reactive power, apparent power and power factor of a load.
The purpose of the metrology engine is for non-billing applications such as plug meters,
smart appliances, industrial and consumer sub-meters, etc.
7.11.1 Features
• 1 % accurate for scalable input sources up to 230 V/50 Hz/16 A and
110 V/60 Hz/20 A while maintaining this accuracy with a factor of 1 to 400 down from
this maximum current.
• Automatically calculates active power in W, reactive power in VAr, apparent power in
VA, power factor ratio, Vrms and Irms without ARM CPU intervention.
• Standard API for initializing, starting, stopping and reading data from the metrology
engine using the ARM Cortex M0.
7.12 General purpose external event counter/timers
The EM773 includes two 32-bit counter/timers and one 16-bit counter/timer. The
counter/timer is designed to count cycles of the system derived clock. It can optionally
generate interrupts or perform other actions at specified timer values, based on four
match registers. Each counter/timer also includes one capture input to trap the timer value
when an input signal transitions, optionally generating an interrupt.
7.12.1 Features
• A 32-bit/16-bit timer/counter with a programmable 32-bit/16-bit prescaler.
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• Counter or timer operation.
• One capture channel per timer, that can take a snapshot of the timer value when an
input signal transitions. A capture event may also generate an interrupt.
• Four match registers per timer that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Up to four external outputs corresponding to match registers, with the following
capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
7.13 System tick timer
The ARM Cortex-M0 includes a system tick timer (SYSTICK) that is intended to generate
a dedicated SYSTICK exception at a fixed time interval (typically 10 ms).
7.14 Windowed WatchDog Timer
The purpose of the watchdog is to reset the controller if software fails to periodically
service it within a programmable time window.
7.14.1 Features
• Internally resets chip if not periodically reloaded during the programmable time-out
period.
• Optional windowed operation requires reload to occur between a minimum and
maximum time period, both programmable.
• Optional warning interrupt can be generated at a programmable time prior to
watchdog time-out.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
•
•
•
•
Incorrect feed sequence causes reset or interrupt if enabled.
Flag to indicate watchdog reset.
Programmable 24-bit timer with internal prescaler.
Selectable time period from (Tcy(WDCLK) 256 4) to (Tcy(WDCLK) 224 4) in
multiples of Tcy(WDCLK) 4.
• The Watchdog Clock (WDCLK) source can be selected from the IRC or the dedicated
watchdog oscillator (WDO). This gives a wide range of potential timing choices of
watchdog operation under different power conditions.
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7.15 Clocking and power control
7.15.1 Crystal oscillators
The EM773 includes three independent oscillators. These are the system oscillator, the
Internal RC oscillator (IRC), and the Watchdog oscillator. Each oscillator can be used for
more than one purpose as required in a particular application.
Following reset, the EM773 will operate from the Internal RC oscillator until switched by
software. This allows systems to operate without any external crystal and the bootloader
code to operate at a known frequency.
See Figure 4 for an overview of the EM773 clock generation.
SYSTEM CLOCK
DIVIDER
AHB clock 0
(system)
system clock
18
AHB clocks 1 to 18
(memories
and peripherals)
SYSAHBCLKCTRL[1:18]
(AHB clock enable)
IRC oscillator
SPI0 PERIPHERAL
CLOCK DIVIDER
SPI0
UART PERIPHERAL
CLOCK DIVIDER
UART
WDT CLOCK
DIVIDER
WDT
main clock
watchdog oscillator
IRC oscillator
MAINCLKSEL
(main clock select)
watchdog oscillator
WDTUEN
(WDT clock update enable)
IRC oscillator
SYSTEM PLL
system oscillator
IRC oscillator
system oscillator
watchdog oscillator
SYSPLLCLKSEL
(system PLL clock select)
CLKOUTUEN
(CLKOUT update enable)
Fig 4.
CLKOUT PIN CLOCK
DIVIDER
CLKOUT pin
002aag729
EM773 clock generation block diagram
7.15.1.1
Internal RC oscillator
The IRC may be used as the clock source for the WDT, and/or as the clock that drives the
PLL and subsequently the CPU. The nominal IRC frequency is 12 MHz. The IRC is
trimmed to 1 % accuracy over the entire voltage and temperature range.
Upon power-up or any chip reset, the EM773 uses the IRC as the clock source. Software
may later switch to one of the other available clock sources.
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7.15.1.2
System oscillator
The system oscillator can be used as the clock source for the CPU, with or without using
the PLL.
The system oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be
boosted to a higher frequency, up to the maximum CPU operating frequency, by the
system PLL.
7.15.1.3
Watchdog oscillator
The watchdog oscillator can be used as a clock source that directly drives the CPU, the
watchdog timer, or the CLKOUT pin. The watchdog oscillator nominal frequency is
programmable between 7.8 kHz and 1.7 MHz. The frequency spread over processing and
temperature is 40 %.
7.15.2 System PLL
The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input
frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO).
The multiplier can be an integer value from 1 to 32. The CCO operates in the range of
156 MHz to 320 MHz, so there is an additional divider in the loop to keep the CCO within
its frequency range while the PLL is providing the desired output frequency. The PLL
output frequency must be lower than 100 MHz. The output divider may be set to divide by
2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2, it is
insured that the PLL output has a 50 % duty cycle. The PLL is turned off and bypassed
following a chip reset and may be enabled by software. The program must configure and
activate the PLL, wait for the PLL to lock, and then connect to the PLL as a clock source.
The PLL settling time is 100 s.
7.15.3 Clock output
The EM773 features a clock output function that routes the IRC oscillator, the system
oscillator, the watchdog oscillator, or the main clock to an output pin.
7.15.4 Wake-up process
The EM773 begin operation at power-up and when awakened from Deep power-down
mode by using the 12 MHz IRC oscillator as the clock source. This allows chip operation
to resume quickly. If the system oscillator or the PLL is needed by the application,
software will need to enable these features and wait for them to stabilize before they are
used as a clock source.
7.15.5 Power control
The EM773 support a variety of power control features. There are three special modes of
processor power reduction: Sleep mode, Deep-sleep mode, and Deep power-down mode.
The CPU clock rate may also be controlled as needed by changing clock sources,
reconfiguring PLL values, and/or altering the CPU clock divider value. This allows a
trade-off of power versus processing speed based on application requirements. In
addition, a register is provided for shutting down the clocks to individual on-chip
peripherals, allowing fine tuning of power consumption by eliminating all dynamic power
use in any peripherals that are not required for the application. Selected peripherals have
their own clock divider which provides even better power control.
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7.15.5.1
Power profiles
The power consumption in Active and Sleep modes can be optimized for the application
through simple calls to the power profile. The power configuration routine configures the
EM773 for one of the following power modes:
• Default mode corresponding to power configuration after reset.
• CPU performance mode corresponding to optimized processing capability.
• Efficiency mode corresponding to optimized balance of current consumption and CPU
performance.
• Low-current mode corresponding to lowest power consumption.
In addition, the power profile includes routines to select the optimal PLL settings for a
given system clock and PLL input clock.
7.15.5.2
Sleep mode
When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep
mode does not need any special sequence but re-enabling the clock to the ARM core.
In Sleep mode, execution of instructions is suspended until either a reset or interrupt
occurs. Peripheral functions continue operation during Sleep mode and may generate
interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic
power used by the processor itself, memory systems and related controllers, and internal
buses.
7.15.5.3
Deep-sleep mode
In Deep-sleep mode, the chip is in Sleep mode, and in addition all analog blocks are shut
down. As an exception, the user has the option to keep the watchdog oscillator and the
BOD circuit running for self-timed wake-up and BOD protection. Deep-sleep mode allows
for additional power savings.
Up to 13 pins total serve as external wake-up pins to the start logic to wake up the chip
from Deep-sleep mode.
Unless the watchdog oscillator is selected to run in Deep-sleep mode, the clock source
should be switched to IRC before entering Deep-sleep mode, because the IRC can be
switched on and off glitch-free.
7.15.5.4
Deep power-down mode
In Deep power-down mode, power is shut off to the entire chip with the exception of the
WAKEUP pin. The EM773 can wake up from Deep power-down mode via the WAKEUP
pin.
A LOW-going pulse as short as 50 ns wakes up the part from Deep power-down mode.
When entering Deep power-down mode, an external pull-up resistor is required on the
WAKEUP pin to hold it HIGH. The RESET pin must also be held HIGH to prevent it from
floating while in Deep power-down mode.
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7.16 System control
7.16.1 Start logic
The start logic connects external pins to corresponding interrupts in the NVIC. Each pin
shown in Table 2 as input to the start logic has an individual interrupt in the NVIC interrupt
vector table. The start logic pins can serve as external interrupt pins when the chip is
running. In addition, an input signal on the start logic pins can wake up the chip from
Deep-sleep mode when all clocks are shut down.
The start logic must be configured in the system configuration block and in the NVIC
before being used.
7.16.2 Reset
Reset has four sources on the EM773: the RESET pin, the Watchdog reset, Power-On
Reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt
trigger input pin. Assertion of chip reset by any source, once the operating voltage attains
a usable level, starts the IRC and initializes the flash controller.
A LOW-going pulse as short as 50 ns resets the part.
When the internal Reset is removed, the processor begins executing at address 0, which
is initially the Reset vector mapped from the boot block. At that point, all of the processor
and peripheral registers have been initialized to predetermined values.
An external pull-up resistor is required on the RESET pin if Deep power-down mode is
used.
7.16.3 Brownout detection
The EM773 includes four levels for monitoring the voltage on the VDD pin. If this voltage
falls below one of the four selected levels, the BOD asserts an interrupt signal to the
NVIC. This signal can be enabled for interrupt in the Interrupt Enable Register in the NVIC
in order to cause a CPU interrupt; if not, software can monitor the signal by reading a
dedicated status register. Four additional threshold levels can be selected to cause a
forced reset of the chip.
7.16.4 Code security (Code Read Protection - CRP)
This feature of the EM773 allows user to enable different levels of security in the system
so that access to the on-chip flash and use of the Serial Wire Debugger (SWD) and
In-System Programming (ISP) can be restricted. When needed, CRP is invoked by
programming a specific pattern into a dedicated flash location. IAP commands are not
affected by the CRP.
In addition, ISP entry via the PIO0_1 pin can be disabled without enabling CRP. For
details see the EM773 user manual.
There are three levels of Code Read Protection:
1. CRP1 disables access to the chip via the SWD and allows partial flash update
(excluding flash sector 0) using a limited set of the ISP commands. This mode is
useful when CRP is required and flash field updates are needed but all sectors can
not be erased.
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2. CRP2 disables access to the chip via the SWD and only allows full flash erase and
update using a reduced set of the ISP commands.
3. Running an application with level CRP3 selected fully disables any access to the chip
via the SWD pins and the ISP. This mode effectively disables ISP override using
PIO0_1 pin, too. It is up to the user’s application to provide (if needed) flash update
mechanism using IAP calls or call reinvoke ISP command to enable flash update via
the UART.
CAUTION
If level three Code Read Protection (CRP3) is selected, no future factory testing can be
performed on the device.
In addition to the three CRP levels, sampling of pin PIO0_1 for valid user code can be
disabled. For details see the EM773 user manual.
7.16.5 APB interface
The APB peripherals are located on one APB bus.
7.16.6 AHBLite
The AHBLite connects the CPU bus of the ARM Cortex-M0 to the flash memory, the main
static RAM, and the Boot ROM.
7.16.7 External interrupt inputs
All GPIO pins can be level or edge sensitive interrupt inputs. In addition, start logic inputs
serve as external interrupts (see Section 7.16.1).
7.17 Emulation and debugging
Debug functions are integrated into the ARM Cortex-M0. Serial wire debug with four
breakpoints and two watchpoints is supported.
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8. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
VDD
supply voltage (core and external rail)
Min
Max
Unit
1.8
3.6
V
0.5
+5.5
V
VI
input voltage
5 V tolerant I/O
pins; only valid
when the VDD
supply voltage is
present
[2]
IDD
supply current
per supply pin
[3]
-
100
mA
[3]
-
100
mA
-
100
mA
65
+150
C
-
150
C
-
1.5
W
6500
+6500
V
ISS
ground current
per ground pin
Ilatch
I/O latch-up current
(0.5VDD) < VI <
(1.5VDD);
Tj < 125 C
Tstg
storage temperature
non-operating
Tj(max)
maximum junction temperature
Ptot(pack)
total power dissipation (per package)
based on package
heat transfer, not
device power
consumption
VESD
electrostatic discharge voltage
human body
model; all pins
[1]
[4]
[5]
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Including voltage on outputs in 3-state mode.
[3]
The peak current is limited to 25 times the corresponding maximum current.
[4]
The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined
based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details.
[5]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
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9. Static characteristics
Table 4.
Static characteristics
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
VDD
supply voltage (core
and external rail)
Min
Typ[1]
Max
Unit
1.8
3.3
3.6
V
-
2
-
mA
-
7
-
mA
-
1
-
mA
[2][3][8]
-
2
-
A
[2][9]
-
220
-
nA
Conditions
Power consumption in low-current mode[10]
IDD
supply current
Active mode; code
while(1){}
executed from flash
system clock = 12 MHz
[2][3][4]
[5][6]
VDD = 3.3 V
system clock = 50 MHz
[2][3][5]
[6][7]
VDD = 3.3 V
Sleep mode;
[2][3][4]
[5][6]
system clock = 12 MHz
VDD = 3.3 V
Deep-sleep mode;
VDD = 3.3 V
Deep power-down mode;
VDD = 3.3 V
Standard port pins, RESET
IIL
LOW-level input current VI = 0 V; on-chip pull-up
resistor disabled
-
0.5
10
nA
IIH
HIGH-level input
current
VI = VDD; on-chip
pull-down resistor
disabled
-
0.5
10
nA
IOZ
OFF-state output
current
VO = 0 V; VO = VDD;
on-chip pull-up/down
resistors disabled
-
0.5
10
nA
VI
input voltage
pin configured to provide
a digital function
0
-
5.0
V
[11][12]
VO
output voltage
0
-
VDD
V
VIH
HIGH-level input
voltage
0.7VDD
-
-
V
VIL
LOW-level input voltage
-
-
0.3VDD
V
Vhys
hysteresis voltage
VOH
HIGH-level output
voltage
VOL
EM773
Product data sheet
LOW-level output
voltage
output active
[13]
-
0.4
-
V
2.0 V VDD 3.6 V;
IOH = 4 mA
VDD 0.4
-
-
V
1.8 V VDD < 2.0 V;
IOH = 3 mA
VDD 0.4
-
-
V
2.0 V VDD 3.6 V;
IOL = 4 mA
-
-
0.4
V
1.8 V VDD < 2.0 V;
IOL = 3 mA
-
-
0.4
V
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Table 4.
Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
IOH
HIGH-level output
current
VOH = VDD 0.4 V;
4
-
-
mA
3
-
-
mA
4
-
-
mA
2.0 V VDD 3.6 V
1.8 V VDD < 2.0 V
IOL
LOW-level output
current
VOL = 0.4 V
2.0 V VDD 3.6 V
1.8 V VDD < 2.0 V
3
-
-
mA
-
-
45
mA
-
-
50
mA
IOHS
HIGH-level short-circuit VOH = 0 V
output current
[14]
IOLS
LOW-level short-circuit
output current
VOL = VDD
[14]
Ipd
pull-down current
VI = 5 V
10
50
150
A
Ipu
pull-up current
VI = 0 V;
15
50
85
A
10
50
85
A
0
0
0
A
2.0 V VDD 3.6 V
1.8 V VDD < 2.0 V
VDD < VI < 5 V
High-drive output pin (PIO0_7)
IIL
LOW-level input current VI = 0 V; on-chip pull-up
resistor disabled
-
0.5
10
nA
IIH
HIGH-level input
current
VI = VDD; on-chip
pull-down resistor
disabled
-
0.5
10
nA
IOZ
OFF-state output
current
VO = 0 V; VO = VDD;
on-chip pull-up/down
resistors disabled
-
0.5
10
nA
VI
input voltage
pin configured to provide
a digital function
0
-
5.0
V
0
-
VDD
V
[11][12]
[13]
VO
output voltage
VIH
HIGH-level input
voltage
0.7VDD
-
-
V
VIL
LOW-level input voltage
-
-
0.3VDD
V
Vhys
hysteresis voltage
0.4
-
-
V
VOH
HIGH-level output
voltage
2.5 V VDD 3.6 V;
IOH = 20 mA
VDD 0.4
-
-
V
1.8 V VDD < 2.5 V;
IOH = 12 mA
VDD 0.4
-
-
V
2.0 V VDD 3.6 V;
IOL = 4 mA
-
-
0.4
V
1.8 V VDD < 2.0 V;
IOL = 3 mA
-
-
0.4
V
VOH = VDD 0.4 V;
2.5 V VDD 3.6 V
20
-
-
mA
1.8 V VDD < 2.5 V
12
-
-
mA
VOL
IOH
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HIGH-level output
current
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Table 4.
Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
IOL
LOW-level output
current
VOL = 0.4 V
4
-
-
mA
3
-
-
mA
-
-
50
mA
2.0 V VDD 3.6 V
1.8 V VDD < 2.0 V
[14]
IOLS
LOW-level short-circuit
output current
VOL = VDD
Ipd
pull-down current
VI = 5 V
10
50
150
A
Ipu
pull-up current
VI = 0 V
15
50
85
A
2.0 V VDD 3.6 V
1.8 V VDD < 2.0 V
VDD < VI < 5 V
I2C-bus
10
50
85
A
0
0
0
A
pins (PIO0_4 and PIO0_5)
VIH
HIGH-level input
voltage
0.7VDD
-
-
V
VIL
LOW-level input voltage
-
-
0.3VDD
V
Vhys
hysteresis voltage
-
0.05VDD
-
V
3.5
-
-
mA
1.8 V VDD < 2.0 V
3
-
-
VOL = 0.4 V; I2C-bus pins
configured as Fast-mode
Plus pins
20
-
-
16
-
-
-
2
4
A
-
10
22
A
IOL
LOW-level output
current
I2C-bus
VOL = 0.4 V;
pins
configured as standard
mode pins
2.0 V VDD 3.6 V
IOL
LOW-level output
current
mA
2.0 V VDD 3.6 V
1.8 V VDD < 2.0 V
ILI
input leakage current
VI = VDD
VI = 5 V
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Table 4.
Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
Oscillator pins
Vi(xtal)
crystal input voltage
0.5
1.8
1.95
V
Vo(xtal)
crystal output voltage
0.5
1.8
1.95
V
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[2]
Tamb = 25 C.
[3]
IDD measurements were performed with all pins configured as GPIO outputs driven LOW and pull-up resistors disabled.
[4]
IRC enabled; system oscillator disabled; system PLL disabled.
[5]
BOD disabled.
[6]
All peripherals disabled in the SYSAHBCLKCTRL register. Peripheral clocks to UART and SPI0 disabled in system configuration block.
[7]
IRC disabled; system oscillator enabled; system PLL enabled.
[8]
All oscillators and analog blocks turned off in the PDSLEEPCFG register; PDSLEEPCFG = 0x0000 18FF.
[9]
WAKEUP pin pulled HIGH externally.
[10] Low-current mode PWR_LOW_CURRENT selected when running the set_power routine in the power profiles.
[11] Including voltage on outputs in 3-state mode.
[12] VDD supply voltage must be present.
[13] 3-state outputs go into 3-state mode in Deep power-down mode.
[14] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[15] To VSS.
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9.1 BOD static characteristics
Table 5.
BOD static characteristics[1]
Tamb = 25 C.
Symbol
Parameter
Conditions
Vth
threshold voltage
interrupt level 0
Min
Typ
Max
Unit
assertion
-
1.65
-
V
de-assertion
-
1.80
-
V
assertion
-
2.22
-
V
de-assertion
-
2.35
-
V
assertion
-
2.52
-
V
de-assertion
-
2.66
-
V
assertion
-
2.80
-
V
de-assertion
-
2.90
-
V
interrupt level 1
interrupt level 2
interrupt level 3
reset level 0
assertion
-
1.46
-
V
de-assertion
-
1.63
-
V
assertion
-
2.06
-
V
de-assertion
-
2.15
-
V
assertion
-
2.35
-
V
de-assertion
-
2.43
-
V
assertion
-
2.63
-
V
de-assertion
-
2.71
-
V
reset level 1
reset level 2
reset level 3
[1]
Interrupt levels are selected by writing the level value to the BOD control register BODCTRL, see EM773
user manual.
9.2 Power consumption
Power measurements in Active, Sleep, and Deep-sleep modes were performed under the
following conditions (see EM773 user manual):
• Configure all pins as GPIO with pull-up resistor disabled in the IOCONFIG block.
• Configure GPIO pins as outputs using the GPIOnDIR registers.
• Write 0 to all GPIOnDATA registers to drive the outputs LOW.
EM773
Product data sheet
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EM773
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Energy metering IC
002aaf980
10
IDD
(mA)
8
48 MHz(2)
6
36 MHz(2)
4
24 MHz(2)
12 MHz(1)
2
0
1.8
2.4
3.0
3.6
VDD (V)
Conditions: Tamb = 25 C; active mode entered executing code while(1){} from flash; all peripherals
disabled in the SYSAHBCLKCTRL register (SYSAHBCLKCTRL = 0x1F); all peripheral clocks
disabled; internal pull-up resistors disabled; BOD disabled; low-current mode.
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
Fig 5.
Active mode: Typical supply current IDD versus supply voltage VDD for different
system clock frequencies
002aaf981
10
IDD
(mA)
8
48 MHz(2)
6
36 MHz(2)
4
24 MHz(2)
12 MHz(1)
2
0
−40
−15
10
35
60
85
temperature (°C)
Conditions: VDD = 3.3 V; active mode entered executing code while(1){} from flash; all peripherals
disabled in the SYSAHBCLKCTRL register (SYSAHBCLKCTRL = 0x1F); all peripheral clocks
disabled; internal pull-up resistors disabled; BOD disabled; low-current mode.
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
Fig 6.
EM773
Product data sheet
Active mode: Typical supply current IDD versus temperature for different system
clock frequencies
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EM773
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Energy metering IC
002aaf982
6
IDD
(mA)
48 MHz(2)
4
36 MHz(2)
24 MHz(2)
2
12 MHz(1)
0
−40
−15
10
35
60
85
temperature (°C)
Conditions: VDD = 3.3 V; sleep mode entered from flash; all peripherals disabled in the
SYSAHBCLKCTRL register (SYSAHBCLKCTRL = 0x1F); all peripheral clocks disabled; internal
pull-up resistors disabled; BOD disabled; low-current mode.
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
Fig 7.
EM773
Product data sheet
Sleep mode: Typical supply current IDD versus temperature for different system
clock frequencies
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EM773
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Energy metering IC
002aaf977
5.5
IDD
(μA)
4.5
3.5
VDD = 3.3 V, 3.6 V
1.8 V
2.5
1.5
−40
−15
10
35
60
85
temperature (°C)
Conditions: BOD disabled; all oscillators and analog blocks disabled in the PDSLEEPCFG register
(PDSLEEPCFG = 0x0000 18FF).
Fig 8.
Deep-sleep mode: Typical supply current IDD versus temperature for different
supply voltages VDD
002aaf978
0.8
IDD
(μA)
VDD = 3.6 V
3.3 V
1.8 V
0.6
0.4
0.2
0
−40
Fig 9.
EM773
Product data sheet
−15
10
35
60
85
temperature (°C)
Deep power-down mode: Typical supply current IDD versus temperature for
different supply voltages VDD
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Energy metering IC
9.3 Peripheral power consumption
The supply current per peripheral is measured as the difference in supply current between
the peripheral block enabled and the peripheral block disabled in the SYSAHBCLKCFG
and PDRUNCFG (for analog blocks) registers. All other blocks are disabled in both
registers and no code is executed. Measured on a typical sample at Tamb = 25 C. Unless
noted otherwise, the system oscillator and PLL are running in both measurements.
The supply currents are shown for system clock frequencies of 12 MHz and 48 MHz.
Table 6.
Power consumption for individual analog and digital blocks
Peripheral
EM773
Product data sheet
Typical supply current in
mA
Notes
n/a
12 MHz
48 MHz
IRC
0.27
-
-
System oscillator running; PLL off; independent
of main clock frequency.
System oscillator
at 12 MHz
0.22
-
-
IRC running; PLL off; independent of main clock
frequency.
Watchdog
oscillator at
500 kHz/2
0.004
-
-
System oscillator running; PLL off; independent
of main clock frequency.
BOD
0.051
-
-
Independent of main clock frequency.
Main PLL
-
0.21
-
CLKOUT
-
0.12
0.47
CT16B0
-
0.02
0.06
CT16B1
-
0.02
0.06
CT32B0
-
0.02
0.07
CT32B1
-
0.02
0.06
GPIO
-
0.23
0.88
IOCONFIG
-
0.03
0.10
I2C
-
0.04
0.13
ROM
-
0.04
0.15
SPI0
-
0.12
0.45
UART
-
0.22
0.82
WDT
-
0.02
0.06
Main clock divided by 4 in the CLKOUTDIV
register.
GPIO pins configured as outputs and set to
LOW. Direction and pin state are maintained if
the GPIO is disabled in the SYSAHBCLKCFG
register.
Main clock selected as clock source for the
WDT.
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Energy metering IC
9.4 Electrical pin characteristics
002aae990
3.6
VOH
(V)
T = 85 °C
25 °C
−40 °C
3.2
2.8
2.4
2
0
10
20
30
40
50
60
IOH (mA)
Conditions: VDD = 3.3 V; on pin PIO0_7.
Fig 10. High-drive output: Typical HIGH-level output voltage VOH versus HIGH-level
output current IOH.
002aaf019
60
T = 85 °C
25 °C
−40 °C
IOL
(mA)
40
20
0
0
0.2
0.4
0.6
VOL (V)
Conditions: VDD = 3.3 V; on pins PIO0_4 and PIO0_5.
Fig 11. I2C-bus pins (high current sink): Typical LOW-level output current IOL versus
LOW-level output voltage VOL
EM773
Product data sheet
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Energy metering IC
002aae991
15
IOL
(mA)
T = 85 °C
25 °C
−40 °C
10
5
0
0
0.2
0.4
0.6
VOL (V)
Conditions: VDD = 3.3 V; standard port pins and PIO0_7.
Fig 12. Typical LOW-level output current IOL versus LOW-level output voltage VOL
002aae992
3.6
VOH
(V)
T = 85 °C
25 °C
−40 °C
3.2
2.8
2.4
2
0
8
16
24
IOH (mA)
Conditions: VDD = 3.3 V; standard port pins.
Fig 13. Typical HIGH-level output voltage VOH versus HIGH-level output source current
IOH
EM773
Product data sheet
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Energy metering IC
002aae988
10
Ipu
(μA)
−10
−30
T = 85 °C
25 °C
−40 °C
−50
−70
0
1
2
3
4
5
VI (V)
Conditions: VDD = 3.3 V; standard port pins.
Fig 14. Typical pull-up current Ipu versus input voltage VI
002aae989
80
T = 85 °C
25 °C
−40 °C
Ipd
(μA)
60
40
20
0
0
1
2
3
4
5
VI (V)
Conditions: VDD = 3.3 V; standard port pins.
Fig 15. Typical pull-down current Ipd versus input voltage VI
EM773
Product data sheet
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32 of 51
EM773
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Energy metering IC
10. Dynamic characteristics
10.1 Power-up ramp conditions
Table 7.
Power-up characteristics
Tamb = 40 C to +85 C.
Symbol Parameter
tr
rise time
twait
wait time
VI
input voltage
Conditions
at t = t1: 0 < VI 400 mV
[1]
[1][2]
at t = t1 on pin VDD
Min
Typ
Max
Unit
0
-
500
ms
12
-
-
s
0
-
400
mV
[1]
See Figure 16.
[2]
The wait time specifies the time the power supply must be at levels below 400 mV before ramping up.
tr
VDD
400 mV
0
twait
t = t1
002aag001
Condition: 0 < VI 400 mV at start of power-up (t = t1)
Fig 16. Power-up ramp
10.2 Flash memory
Table 8.
Flash characteristics
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
EM773
Product data sheet
Parameter
Conditions
Min
[1]
Nendu
endurance
tret
retention time
ter
erase time
tprog
programming
time
Typ
Max
Unit
10000
100000
-
cycles
powered
10
-
-
years
unpowered
20
-
-
years
sector or multiple
consecutive
sectors
95
100
105
ms
0.95
1
1.05
ms
[2]
[1]
Number of program/erase cycles.
[2]
Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash
in blocks of 256 bytes.
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Energy metering IC
10.3 External clock
Table 9.
Dynamic characteristic: external clock
Tamb = 40 C to +85 C; VDD over specified ranges.[1]
Min
Typ[2]
Max
Unit
oscillator frequency
1
-
25
MHz
Tcy(clk)
clock cycle time
40
-
1000
ns
tCHCX
clock HIGH time
Tcy(clk) 0.4
-
-
ns
tCLCX
clock LOW time
Tcy(clk) 0.4
-
-
ns
tCLCH
clock rise time
-
-
5
ns
tCHCL
clock fall time
-
-
5
ns
Symbol
Parameter
fosc
Conditions
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
tCHCL
tCHCX
tCLCH
tCLCX
Tcy(clk)
002aaa907
Fig 17. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
EM773
Product data sheet
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Energy metering IC
10.4 Internal oscillators
Table 10. Dynamic characteristic: internal oscillators
Tamb = 40 C to +85 C; 2.7 V VDD 3.6 V.[1]
Symbol
Parameter
Conditions
fosc(RC)
internal RC oscillator frequency -
Min
Typ[2]
Max
Unit
11.88
12
12.12
MHz
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
002aaf403
12.15
f
(MHz)
VDD = 3.6 V
3.3 V
3.0 V
2.7 V
2.4 V
2.0 V
12.05
11.95
11.85
−40
−15
10
35
60
85
temperature (°C)
Conditions: Frequency values are typical values. 12 MHz 1 % accuracy is guaranteed for
2.7 V VDD 3.6 V and Tamb = 40 C to +85 C. Variations between parts may cause the IRC to
fall outside the 12 MHz 1 % accuracy specification for voltages below 2.7 V.
Fig 18. Internal RC oscillator frequency versus temperature
Table 11.
Dynamic characteristics: Watchdog oscillator
Min
Typ[1]
Max
Unit
internal oscillator DIVSEL = 0x1F, FREQSEL = 0x1
frequency
in the WDTOSCCTRL register;
[2][3]
-
7.8
-
kHz
DIVSEL = 0x00, FREQSEL = 0xF
in the WDTOSCCTRL register
[2][3]
-
1700
-
kHz
Symbol Parameter
fosc(int)
EM773
Product data sheet
Conditions
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
[2]
The typical frequency spread over processing and temperature (Tamb = 40 C to +85 C) is 40 %.
[3]
See the EM773 user manual.
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EM773
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Energy metering IC
10.5 I/O pins
Table 12. Dynamic characteristic: I/O pins[1]
Tamb = 40 C to +85 C; 3.0 V VDD 3.6 V.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tr
rise time
pin
configured as
output
3.0
-
5.0
ns
tf
fall time
pin
configured as
output
2.5
-
5.0
ns
[1]
Applies to standard port pins and RESET pin.
10.6 I2C-bus
Table 13. Dynamic characteristic: I2C-bus pins[1]
Tamb = 40 C to +85 C.[2]
Symbol
Parameter
Conditions
Min
Max
Unit
fSCL
SCL clock
frequency
Standard-mode
0
100
kHz
Fast-mode
0
400
kHz
Fast-mode Plus
0
1
MHz
of both SDA and
SCL signals
-
300
ns
20 + 0.1 Cb
300
ns
[4][5][6][7]
fall time
tf
Standard-mode
Fast-mode
Fast-mode Plus
tLOW
tHIGH
tHD;DAT
tSU;DAT
[1]
EM773
Product data sheet
LOW period of
the SCL clock
HIGH period of
the SCL clock
data hold time
data set-up
time
[3][4][8]
[9][10]
-
120
ns
Standard-mode
4.7
-
s
Fast-mode
1.3
-
s
Fast-mode Plus
0.5
-
s
Standard-mode
4.0
-
s
Fast-mode
0.6
-
s
Fast-mode Plus
0.26
-
s
Standard-mode
0
-
s
Fast-mode
0
-
s
Fast-mode Plus
0
-
s
Standard-mode
250
-
ns
Fast-mode
100
-
ns
Fast-mode Plus
50
-
ns
See the I2C-bus specification UM10204 for details.
[2]
Parameters are valid over operating temperature range unless otherwise specified.
[3]
tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission
and the acknowledge.
[4]
A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the
VIH(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL.
[5]
Cb = total capacitance of one bus line in pF.
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EM773
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Energy metering IC
[6]
The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA
output stage tf is specified at 250 ns. This allows series protection resistors to be connected in between the
SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf.
[7]
In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors
are used, designers should allow for this when considering bus timing.
[8]
The maximum tHD;DAT could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than
the maximum of tVD;DAT or tVD;ACK by a transition time (see UM10204). This maximum must only be met if
the device does not stretch the LOW period (tLOW) of the SCL signal. If the clock stretches the SCL, the
data must be valid by the set-up time before it releases the clock.
[9]
tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in
transmission and the acknowledge.
[10] A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but the requirement
tSU;DAT = 250 ns must then be met. This will automatically be the case if the device does not stretch the
LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must
output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the
Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must
meet this set-up time.
tf
SDA
tSU;DAT
70 %
30 %
70 %
30 %
tHD;DAT
tf
70 %
30 %
SCL
tVD;DAT
tHIGH
70 %
30 %
70 %
30 %
70 %
30 %
tLOW
S
1 / fSCL
002aaf425
Fig 19. I2C-bus pins clock timing
10.7 SPI interface
Table 14.
Dynamic characteristics of SPI pins in SPI mode
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
-
ns
SPI master (in SPI mode)
Tcy(clk)
tDS
clock cycle time
data set-up time
full-duplex mode
[1]
50
when only transmitting
[1]
40
in SPI mode
[2]
15
2.0 V VDD < 2.4 V
[2]
20
1.8 V VDD < 2.0 V
[2]
24
-
-
ns
-
-
ns
2.4 V VDD 3.6 V
ns
ns
tDH
data hold time
in SPI mode
[2]
0
-
-
ns
tv(Q)
data output valid time in SPI mode
[2]
-
-
10
ns
th(Q)
data output hold time in SPI mode
[2]
0
-
-
ns
EM773
Product data sheet
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EM773
NXP Semiconductors
Energy metering IC
Table 14.
Dynamic characteristics of SPI pins in SPI mode
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
SPI slave (in SPI mode)
Tcy(PCLK)
tDS
PCLK cycle time
data set-up time
20
-
-
ns
in SPI mode
[3][4]
0
-
-
ns
tDH
data hold time
in SPI mode
[3][4]
3 Tcy(PCLK) + 4
-
-
ns
tv(Q)
data output valid time in SPI mode
[3][4]
-
-
3 Tcy(PCLK) + 11
ns
th(Q)
data output hold time in SPI mode
[3][4]
-
-
2 Tcy(PCLK) + 5
ns
[1]
Tcy(clk) = (SSPCLKDIV (1 + SCR) CPSDVSR) / fmain. The clock cycle time derived from the SPI bit rate Tcy(clk) is a function of the
main clock frequency fmain, the SPI peripheral clock divider (SSPCLKDIV), the SPI SCR parameter (specified in the SSP0CR0 register),
and the SPI CPSDVSR parameter (specified in the SPI clock prescale register).
[2]
Tamb = 40 C to 85 C.
[3]
Tcy(clk) = 12 Tcy(PCLK).
[4]
Tamb = 25 C; for normal voltage supply range: VDD = 3.3 V.
Tcy(clk)
tclk(H)
tclk(L)
SCK (CPOL = 0)
SCK (CPOL = 1)
tv(Q)
th(Q)
DATA VALID
MOSI
DATA VALID
tDS
DATA VALID
MISO
tDH
DATA VALID
tv(Q)
MOSI
DATA VALID
th(Q)
DATA VALID
tDH
tDS
MISO
DATA VALID
CPHA = 1
CPHA = 0
DATA VALID
002aae829
Fig 20. SPI master timing in SPI mode
EM773
Product data sheet
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EM773
NXP Semiconductors
Energy metering IC
Tcy(clk)
tclk(H)
tclk(L)
tDS
tDH
SCK (CPOL = 0)
SCK (CPOL = 1)
MOSI
DATA VALID
DATA VALID
tv(Q)
MISO
th(Q)
DATA VALID
tDS
MOSI
DATA VALID
tDH
DATA VALID
tv(Q)
MISO
DATA VALID
CPHA = 1
DATA VALID
th(Q)
CPHA = 0
DATA VALID
002aae830
Fig 21. SPI slave timing in SPI mode
EM773
Product data sheet
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39 of 51
EM773
NXP Semiconductors
Energy metering IC
11. Application information
11.1 XTAL input
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
Ci = 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave
mode, a minimum of 200 mV (RMS) is needed.
EM773
XTALIN
Ci
100 pF
Cg
002aag730
Fig 22. Slave mode operation of the on-chip oscillator
In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure 22), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTALOUT pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in Figure 23 and in
Table 15 and Table 16. Since the feedback resistance is integrated on chip, only a crystal
and the capacitances CX1 and CX2 need to be connected externally in case of
fundamental mode oscillation (the fundamental frequency is represented by L, CL and
RS). Capacitance CP in Figure 23 represents the parallel package capacitance and should
not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal
manufacturer (see Table 15).
EM773
Product data sheet
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40 of 51
EM773
NXP Semiconductors
Energy metering IC
EM773
L
XTALIN
XTALOUT
=
CL
CP
XTAL
RS
CX2
CX1
002aag731
Fig 23. Oscillator modes and models: oscillation mode of operation and external crystal
model used for CX1/CX2 evaluation
Table 15.
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) low frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1, CX2
1 MHz - 5 MHz
10 pF
< 300
18 pF, 18 pF
20 pF
< 300
39 pF, 39 pF
30 pF
< 300
57 pF, 57 pF
10 pF
< 300
18 pF, 18 pF
20 pF
< 200
39 pF, 39 pF
5 MHz - 10 MHz
10 MHz - 15 MHz
15 MHz - 20 MHz
Table 16.
30 pF
< 100
57 pF, 57 pF
10 pF
< 160
18 pF, 18 pF
20 pF
< 60
39 pF, 39 pF
10 pF
< 80
18 pF, 18 pF
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) high frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1, CX2
15 MHz - 20 MHz
10 pF
< 180
18 pF, 18 pF
20 pF
< 100
39 pF, 39 pF
10 pF
< 160
18 pF, 18 pF
20 pF
< 80
39 pF, 39 pF
20 MHz - 25 MHz
11.2 XTAL Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors CX1, CX2, and CX3 in case
of third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
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order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of CX1 and CX2 should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
11.3 Standard I/O pad configuration
Figure 24 shows the possible pin modes for standard I/O pins with analog input function:
•
•
•
•
•
Digital output driver
Digital input: Pull-up enabled/disabled
Digital input: Pull-down enabled/disabled
Digital input: Repeater mode enabled/disabled
Analog input
VDD
ESD
output enable
pin configured
as digital output
driver
output
PIN
ESD
VDD
VSS
weak
pull-up
pull-up enable
pin configured
as digital input
weak
pull-down
repeater mode
enable
pull-down enable
data input
select analog input
pin configured
as analog input
analog input
002aaf304
Fig 24. Standard I/O pad configuration
EM773
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11.4 Reset pad configuration
VDD
VDD
VDD
Rpu
ESD
20 ns RC
GLITCH FILTER
reset
PIN
ESD
VSS
002aaf274
Fig 25. Reset pad configuration
11.5 ElectroMagnetic Compatibility (EMC)
Radiated emission measurements according to the IEC61967-2 standard using the
TEM-cell method are shown in Table 17.
Table 17. ElectroMagnetic Compatibility (EMC) (TEM-cell method)
VDD = 3.3 V; Tamb = 25 C.
Parameter
Frequency band
System clock =
Unit
12 MHz
24 MHz
48 MHz
150 kHz - 30 MHz
7
5
7
dBV
30 MHz - 150 MHz
2
1
10
dBV
150 MHz - 1 GHz
4
8
16
dBV
-
O
N
M
-
7
7
dBV
Input clock: IRC (12 MHz)
maximum
peak level
IEC
level[1]
Input clock: crystal oscillator (12 MHz)
maximum
peak level
IEC level[1]
[1]
EM773
Product data sheet
150 kHz - 30 MHz
7
30 MHz - 150 MHz
2
1
8
dBV
150 MHz - 1 GHz
4
7
14
dBV
-
O
N
M
-
IEC levels refer to Appendix D in the IEC61967-2 Specification.
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12. Package outline
HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
D
B
A
terminal 1
index area
A
A1
E
c
detail X
C
e1
e
9
y1 C
C A B
C
v
w
1/2 e b
y
16
L
17
8
e
e2
Eh
1/2 e
24
1
terminal 1
index area
32
25
X
Dh
0
2.5
Dimensions (mm are the original dimensions)
Unit(1)
mm
A(1)
A1
b
max
0.05 0.30
nom 0.85
min
0.00 0.18
c
D(1)
Dh
E(1)
Eh
5.1
3.75
5.1
3.75
0.2
4.9
5 mm
scale
3.45
4.9
e
e1
e2
0.5
3.5
3.5
L
v
w
y
y1
0.5
0.1
0.05 0.05
0.1
0.3
3.45
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
hvqfn33f_po
European
projection
Issue date
11-10-11
11-10-17
MO-220
Fig 26. Package outline (HVQFN33 5x5)
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HVQFN33: plastic thermal enhanced very thin quad flat package; no leads;
33 terminals; body 7 x 7 x 0.85 mm
A
B
D
terminal 1
index area
E
A
A1
c
detail X
e1
e
9
16
C
C A B
C
v
w
b
y
y1 C
L
8
17
e
e2
Eh
33
1
terminal 1
index area
24
32
X
25
Dh
0
2.5
scale
Dimensions
Unit
mm
5 mm
A(1)
A1
b
max 1.00 0.05 0.35
nom 0.85 0.02 0.28
min 0.80 0.00 0.23
c
D(1)
Dh
E(1)
0.2
7.1
7.0
6.9
4.85
4.70
4.55
7.1
7.0
6.9
Eh
e
e1
e2
L
0.75
4.85
4.70 0.65 4.55 4.55 0.60
0.45
4.55
v
0.1
w
y
0.05 0.08
y1
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
---
hvqfn33_po
European
projection
Issue date
09-03-17
09-03-23
Fig 27. Package outline (HVQFN33 7x7)
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13. Soldering
Footprint information for reflow soldering of HVQFN33 package
OID = 8.20 OA
PID = 7.25 PA+OA
OwDtot = 5.10 OA
evia = 4.25
0.20 SR
chamfer (4×)
W = 0.30 CU
SPD = 1.00 SP
LaE = 7.95 CU
PIE = 7.25 PA+OA
LbE = 5.80 CU
evia = 4.25
evia = 1.05
0.45 DM
SPE = 1.00 SP
GapE = 0.70 SP
4.55 SR
SEhtot = 2.70 SP
EHS = 4.85 CU
OwEtot = 5.10 OA
OIE = 8.20 OA
e = 0.65
0.45 DM
GapD = 0.70 SP
evia = 2.40
B-side
SDhtot = 2.70 SP
4.55 SR
DHS = 4.85 CU
Solder resist
covered via
0.30 PH
LbD = 5.80 CU
0.60 SR cover
LaD = 7.95 CU
0.60 CU
(A-side fully covered)
number of vias: 20
solder land
solder land plus solder paste
solder paste deposit
solder resist
occupied area
Dimensions in mm
Remark:
Stencil thickness: 0.125 mm
001aao134
Fig 28. Reflow soldering of the HVQFN33 package
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14. Abbreviations
Table 18.
EM773
Product data sheet
Abbreviations
Acronym
Description
AHB
Advanced High-performance Bus
APB
Advanced Peripheral Bus
BOD
BrownOut Detection
GPIO
General Purpose Input/Output
PLL
Phase-Locked Loop
RC
Resistor-Capacitor
SPI
Serial Peripheral Interface
SSI
Serial Synchronous Interface
SSP
Synchronous Serial Port
TEM
Transverse ElectroMagnetic
UART
Universal Asynchronous Receiver/Transmitter
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15. Revision history
Table 19.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
EM773 v.2
20120103
Product data sheet
-
EM773 v.1
Modifications:
•
•
•
•
•
•
•
•
•
•
•
•
Updated Section 7.7.1 “Features”.
Updated Section 7.14 “Windowed WatchDog Timer”.
Updated Section 7.15.2 “System PLL”.
Added Section 7.15.5.1 “Power profiles”.
Updated Section 7.15.5.4 “Deep power-down mode”.
Updated Section 7.16.2 “Reset”.
Updated Section 7.16.7 “External interrupt inputs”.
Updated Section 9.2 “Power consumption”.
Added Section 9.3 “Peripheral power consumption”.
Updated Section 10 “Dynamic characteristics”.
Added Section 11.5 “ElectroMagnetic Compatibility (EMC)”.
Table 2 “EM773 pin description table”:
– Updated descriptions for WAKEUP and RESET.
– Updated Table note [1], Table note 2, and Table note 5.
•
Table 3 “Limiting values”:
– Added “non-operating” to Tstg conditions.
– Updated Table note [4].
•
Table 4 “Static characteristics”:
– Added/updated power consumption information.
– Updated I2C-bus Vhys typical to 0.05VDD.
– Updated Table note [6] and Table note [8].
– Added Table note [10].
EM773 v.1
EM773
Product data sheet
20100901
Product data sheet
-
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Rev. 2 — 3 January 2012
-
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16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
EM773
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 January 2012
© NXP B.V. 2012. All rights reserved.
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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18. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.5.1
7.5.2
7.6
7.7
7.7.1
7.8
7.8.1
7.9
7.9.1
7.10
7.10.1
7.11
7.11.1
7.12
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 9
ARM Cortex-M0 processor . . . . . . . . . . . . . . . . 9
On-chip flash program memory . . . . . . . . . . . . 9
On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . . 9
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Nested Vectored Interrupt Controller (NVIC) . 10
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 11
IOCONFIG block . . . . . . . . . . . . . . . . . . . . . . 11
Fast general purpose parallel I/O . . . . . . . . . . 11
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
SPI serial I/O controller. . . . . . . . . . . . . . . . . . 12
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
I2C-bus serial I/O controller . . . . . . . . . . . . . . 12
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Metrology engine . . . . . . . . . . . . . . . . . . . . . . 13
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
General purpose external event
counter/timers . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.12.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.13
System tick timer . . . . . . . . . . . . . . . . . . . . . . 14
7.14
Windowed WatchDog Timer . . . . . . . . . . . . . . 14
7.14.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.15
Clocking and power control . . . . . . . . . . . . . . 15
7.15.1
Crystal oscillators . . . . . . . . . . . . . . . . . . . . . . 15
7.15.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 15
7.15.1.2 System oscillator . . . . . . . . . . . . . . . . . . . . . . 16
7.15.1.3 Watchdog oscillator . . . . . . . . . . . . . . . . . . . . 16
7.15.2
System PLL . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.15.3
Clock output . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.15.4
Wake-up process . . . . . . . . . . . . . . . . . . . . . . 16
7.15.5
Power control . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.15.5.1 Power profiles . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.15.5.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.15.5.3 Deep-sleep mode . . . . . . . . . . . . . . . . . . . . . . 17
7.15.5.4 Deep power-down mode . . . . . . . . . . . . . . . . 17
7.16
System control . . . . . . . . . . . . . . . . . . . . . . . . 18
7.16.1
7.16.2
7.16.3
7.16.4
7.16.5
7.16.6
7.16.7
7.17
8
9
9.1
9.2
9.3
9.4
10
10.1
10.2
10.3
10.4
10.5
10.6
10.7
11
11.1
11.2
11.3
11.4
11.5
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
Start logic . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Brownout detection . . . . . . . . . . . . . . . . . . . .
Code security (Code Read Protection - CRP)
APB interface . . . . . . . . . . . . . . . . . . . . . . . . .
AHBLite . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External interrupt inputs . . . . . . . . . . . . . . . . .
Emulation and debugging . . . . . . . . . . . . . . .
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
Static characteristics . . . . . . . . . . . . . . . . . . .
BOD static characteristics . . . . . . . . . . . . . . .
Power consumption . . . . . . . . . . . . . . . . . . .
Peripheral power consumption . . . . . . . . . . .
Electrical pin characteristics. . . . . . . . . . . . . .
Dynamic characteristics. . . . . . . . . . . . . . . . .
Power-up ramp conditions . . . . . . . . . . . . . . .
Flash memory . . . . . . . . . . . . . . . . . . . . . . . .
External clock. . . . . . . . . . . . . . . . . . . . . . . . .
Internal oscillators . . . . . . . . . . . . . . . . . . . . .
I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI interface . . . . . . . . . . . . . . . . . . . . . . . . .
Application information . . . . . . . . . . . . . . . . .
XTAL input . . . . . . . . . . . . . . . . . . . . . . . . . . .
XTAL Printed Circuit Board (PCB) layout
guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Standard I/O pad configuration . . . . . . . . . . .
Reset pad configuration . . . . . . . . . . . . . . . . .
ElectroMagnetic Compatibility (EMC) . . . . . .
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 3 January 2012
Document identifier: EM773