ETC5064/64-X ETC5067/67-X ® SERIAL INTERFACE CODEC/FILTER WITH RECEIVE POWER AMPLIFIER . .. . .. . .. . .. COMPLETE CODEC AND FILTERING SYSTEM INCLUDING : - Transmit high-pass and low-pass filtering. - Receive low-pass filter with sin x/x correction. - Active RC noise filter. - µ-law or A-law compatible CODER and DECODER. - Internal precision voltage reference. I/O interface. - Serial Internal auto-zero circuitry. Receive push-pull power amplifiers. µ-LAW ETC5064 A-LAW ETC5067 MEETS OR EXCEEDS ALL D3/D4 AND CCITT SPECIFICATIONS. ± 5 V OPERATION. LOW OPERATING POWER-TYPICALLY 70 mW POWER-DOWN STANDBY MODE-TYPICALLY 3 mW AUTOMATIC POWER DOWN TTL OR CMOS COMPATIBLE DIGITAL INTERFACES MAXIMIZES LINE INTERFACE CARD CIRCUIT DENSITY 0°C TO 70°C OPERATION: ETC5064/67 –40°C TO 85°C OPERATION: ETC5064-X/67-X ) s ( ct r P e ORDERING NUMBERS: ETC5064N ETC5064N-X ETC5067N ETC5067N-X c u d e t le o s b O - u d o DESCRIPTION DIP20 (Plastic) N ) s t( o r P PLCC20 FN ORDERING NUMBERS: ETC5064FN ETC5064FN-X ETC5067FN ETC5067FN-X t e l o The ETC5064 (µ-law), ETC5067 (A-law) are monolithic PCM CODEC/FILTERS utilizing the A/D and D/A conversion architecture shown in the Block Diagrams and a serial PCM interface. The devices are fabricated using double-poly CMOS process. Similar to the ETC505X family, these devices feature an additional Receive Power Amplifier to provide push-pull balanced output drive capability. The receive gain can be adjusted by means of two external resistors for an output level of up to ± 6.6 V across a balanced 600Ω load. Also included is an Analog Loopback switch and TSX output. s b O September 2003 SO20 D ORDERING NUMBERS: ETC5064D ETC5064D-X ETC5067D ETC5067D-X 1/18 ETC5064 - ETC5064-X - ETC5067 - ETC5067-X PIN CONNECTIONS (Top views) DIP20 & SO20 PLCC20 o r P BLOCK DIAGRAM (ETC5064 - ETC5064-X - ETC5067 - ETC5067-X) e t le ) s ( ct u d o r P e t e l o s b O 2/18 o s b O - c u d ) s t( ETC5064 - ETC5064-X - ETC5067 - ETC5067-X PIN DESCRIPTION Pin Type (*) Name + N Description O 1 The Non-inverting Output of the Receive Power Amplifier GND 2 Analog Ground. All signals are referenced to this pin. VPOVPI O 3 The Inverting Output of the Receive Power Amplifier I 4 Inverting Input to the Receive Power Amplifier. Also powers down both amplifiers when connected to VBB. VFRO O 5 Analog Output of the Receive Filter. VCC S 6 Positive Power Supply Pin. VCC = +5V ±5% FSR I 7 Receive Frame Sync Pulse which enable BCLKR to shift PCM data into DR. FSR is an 8KHz pulse train. See figures 1 and 2 for timing details. DR I 8 Receive Data Input. PCM data is shifted into DR following the FSR leading edge BCLKR/CLKSEL I 9 The bit Clock which shifts data into DR after the FSR leading edge. May vary from 64KHz to 2.048MHz. Alternatively, may be a logic input which selects either 1.536MHz/1.544MHz or 2.048MHz for master clock in synchronous mode and BCLK X is used for both transmit and receive directions (see table 1). This input has an internal pull-up. VPO GNDA c u d ) s t( MCKLR/PDN I 10 Receive Master Clock. Must be 1.536MHz, 1.544MHz or 2.048MHz. May be asynchronous with MCLKX, but should be synchronous with MCLKX for best performance. When MCLKR is connected continuously low, MCLKX is selected for all internal timing. When MCLKR is connected continuously high, the device is powered down. MCLKX I 11 Transmit Master Clock. Must be 1.536MHz, 1.544MHz or 2.048MHz. May be asynchronous with MCLKR. BCLKX I 12 The bit clock which shifts out the PCM data on DX. May vary from 64KHz to 2.048MHz, but must be synchronous with MCLKX. DX O 13 FSX I 14 The TRI-STATEPCM data output which is enabled by FSX. Transmit frame sync pulse input which enables BCLKX to shift out the PCM data on DX. FSX is an 8KHz pulse train. See figures 1 and 2 for timing details. TSX O 15 ANLB I s b O VFXI+ VBB ) s ( ct u d o r P e t e l o GSX VFXI- e t le 16 o r P o s b O - Open drain output which pulses low during the encoder time slot. Must to be grounded if not used. Analog Loopback Control Input. Must be set to logic ’0’ for normal operation. When pulled to logic ’1’, the transmit filter input is disconnected from the output of the transmit preamplifier and connected to the VPO + output of the receive power amplifier. O I 17 18 Analog output of the transmit input amplifier. Used to set gain externally. Inverting input of the transmit input amplifier. I S 19 20 Negative Power Supply Pin. VBB = -5V ±5% Non-inverting input of the transmit input amplifier. (*) I: Input, O: Output, S: Power Supply. TRI-STATE is a trademark of National Semiconductor Corp. 3/18 ETC5064 - ETC5064-X - ETC5067 - ETC5067-X FUNCTIONAL DESCRIPTION POWER-UP When power is first applied, power-on reset circuitry initializes the device and places it into the powerdown mode. All non-essential circuits are deactivated and the DX and VFRO outputs are put in high impedance states. To power-up the device, a logical low level or clock must be applied to the MCLKR/PDN pin and FSX and/or FSR pulses must be present. Thus 2 power-down control modes are available. The first is to pull the MCLKR/PDN pin high; the alternative is to hold both FSX and FSR inputs continuously low. The device will power-down approximately 2 ms after the last FSX pulse. The TRI-STATE PCM data output, DX, will remain in the high impedance state until the second FSX pulse. SYNCHRONOUS OPERATION For synchronous operation, the same master clock and bit clock should be used for both the transmit and receive directions. In this mode, a clock must be applied to MCLKX and the MCLKR/PDN pin can be used as a power-down control. A low level on MCLKR/PDN powers up the device and a high level powers down the device. In either case, MCLKX will be selected as the master clock for both the transmit and receive circuits. A bit clock must also be applied to BCLKX and the BCLR/CLKSEL can be used to select the proper internal divider for a master clock of 1.536 MHz, 1.544 MHz or 2.048 MHz. For 1.544 MHz operation, the device automatically compensates for the 193 rd clock pulse each frame. With a fixed level on the BCLKR/CKSEL pin, BCLKX will be selected as the bit clock for both the transmit and receive directions. Table 1 indicates the frequencies of operation which can be selected, depending on the state of BCLKR/CLKSEL. In this synchronous mode, the bit clock, BCLKX, may be from 64 kHz to 2.048 MHz, but must be synchronous with MCLKX. ) s ( ct r P e Table 1: Selection of Master Clock Frequencies. s b O BCLKR/CLKSEL Clocked 0 1 (or open circuit) 4/18 ASYNCHRONOUS OPERATION For asynchronous operation, separate transmit and receive clocks may be applied. MCLKX and MCLKR must be 2.048 MHz for the ETC5067 or 1.536 MHz, 1.544 MHz for the ETC5064, and need not be synchronous. For best transmission performance, however, MCLKR should be synchronous with MCLKX, which is easily achieved by applying only static logic levels to the MCLKR/PDN pin. This will automatically connect MCLKX to all internal MCLKR functions (see pin description). For 1.544 MHz operation, the device automatically compensates for the 193rd clock pulse each frame. FSX starts each encoding cycle and must be synchronous with MCLKX and BCLKX. FSR starts each decoding cycle and must be synchronous with BCLKR. BCLKR must be a clock, the logic levels shown in Table 1 are not valid in asynchronous mode. BCLKX and BCLKR may operate from 64kHz to 2.048 MHz. c u d e t le ) s t( o r P o s b O - u d o t e l o Each FSX pulse begins the encoding cycle and the PCM data from the previous encode cycle is shift out of the enabled DX output on the positive edge of BCLKX. After 8 bit clock periods, the TRISTATE DX output is returned to a high impedance state. With an FSR pulse, PCM data is latched via the DR input on the negative edge of BCLKX (or on BCKLR if running). FSX and FSR must be synchronous with MCLKX/R. Master Clock Frequency Selected ETC5067 ETC5067-X ETC5064 ETC5064-X 2.048MHz 1.536MHz or 1.544MHz 1.536MHz or 1.544MHz 2.048MHz 2.048MHz 1.536MHz or 1.544MHz SHORT FRAME SYNC OPERATION The device can utilize either a short frame sync pulse or a long frame sync pulse. Upon power initialization, the device assumes a short frame mode. In this mode, both frame sync pulses. FSX and FSR, must be one bit clock period long, with timing relationships specified in figure 2. With FSX high during a falling edge of BCLKR, the next rising edge of BCLKX enables the DX TRI-STATE output buffer, which will output the sign bit. The following seven rising edges clock out the remaining seven bits, and the next falling edge disables the DX output. With FSR high during a falling edge of BCLKR (BCLKX in synchronous mode), the next falling edge of BCLKR latches in the sign bit. The following seven falling edges latch in the seven remaining bits. Both devices may utilize the short frame sync pulse in synchronous or asynchronous operating mode. LONG FRAME SYNC OPERATION To use the long frame mode, both the frame sync pulses, FSX and FSR, must be three or more bit clock periods long, with timing relationships specified in figure 3. Based on the transmit frame sync FSX, the device will sense whether short or long frame sync ETC5064 - ETC5064-X - ETC5067 - ETC5067-X pulses are being used. For 64 kHz operation, the frame sync pulses must be kept low for a minimum of 160 ns (see Fig 1). The DX TRI-STATE output buffer is enabled with the rising edge of FSX or the rising edge of BCLKX, whichever comes later, and the first bit clocked out is the sign bit. The following seven BCLKX rising edges clock out the remaining seven bits. The DX output is disabled by the falling BCLKX edge following the eighth rising edge, or by FSX going low, whichever comes later. A rising edge on the receive frame sync pulse, FSR, will cause the PCM data at DR to be latched in on the next eight falling edges of BCLKR (BCLKx in synchronous mode). Both devices may utilize the long frame sync pulse in synchronous or asynchronous mode. TRANSMIT SECTION The transmit section input is an operational amplifier with provision for gain adjustment using two external resistors, see figure 4. The low noise and wide bandwidth allow gains in excess of 20 dB across the audio passband to be realized. The op amp drives a unity gain filter consisting of RC active pre-filter, followed by an eighth order switched-capacitor bandpass filter directly drives the encoder sampleand-hold circuit. The A/D is of companding type according to A-law (ETC5067 and ETC5067-X) or µlaw (ETC5064 and ETC5064-X) coding conventions. A precision voltage reference is trimmed in manufacturing to provide an input over load (tMAX) of nominally 2.5V peak (see table of Transmission Characteristics). The FSX frame sync pulse controls the sampling of the filer output, and then the successive-approximation encoding cycle begins. The 8-bit code is then loaded into a buffer and shifted out through DX at the next FSX pulse. the total encoding delay will be approximately 165 µs (due to the transmit filter) plus 125µs (due to encoding delay), which totals 290µs. Any offset voltage due to the filters or comparator is cancelled by sign bit integration. ) s ( ct c u d ) s t( RECEIVE POWER AMPLIFIERS Two inverting mode power amplifiers are provided for directly driving a matched line interface transformer. The gain of the first power amplifier can be adjusted to boost the ± 2.5V peak output signal from the receive filter up ± 3.3V peak into an unbalanced 300Ω load, or ±4.0V into an unbalanced 15kΩ load. The second power amplifier is internally connected in unity-gain inverting mode to give 6dB of signal gain for balanced loads. Maximum power transfer to a 600Ω subscriber line termination is obtained by differientially driving a balanced transformer with a 2 : 1 turns ratio, as shown in figure 4. A total peak √ power of 15.6dBm can be delivered to the load plus termination. Both power amplifier can be powered down independently from the PDN input by connecting the VPI input to VBB saving approximately 12 mW of power. e t le o r P o s b O - u d o r P e t e l o RECEIVE SECTION The receive section consist of an expanding DAC which drives a fifth order switched-capacitor low pass filter clocked at 256kHz. The decoder is A-law (ETC5067 and ETC5067-X) or µ–law (ETC5064 and ETC5064-X) and the 5 th order low pass filter corrects for the sin x/x attenuation due to the 8kHz sample and hold. The filter is then followed by a 2 nd order RC active post-filter and power amplifier capable of driving a 600Ω load to a level of 7.2dBm. The receive section is unity-gain. Upon the occurence of FSR, the data at the DR input is clocked in on the falling edge of the next eight BCLKR (BCKLX) periods. At the end of the decoder time slot, the decoding cycle begins, and 10µs later the decoder DAC output is updated. The total decoder delay is about10µs (decoder up-date) plus 110µs (filter delay) plus 62.5µs (1/2 frame), which gives approximately 180µs. ABSOLUTE MAXIMUM RATINGS bs Symbol O VCC VBB VIN, VOUT Parameter VCC to GNDA VBB to GNDA Voltage at any Analog Input or Output Toper Voltage at any Digital Input or Output Operating Temperature Range: ETC5064/67 ETC5064-X/67-X Tstg Storage Temperature Range Lead Temperature (soldering, 10 seconds) Value Unit 7 V -7 VCC +0.3 to VBB -0.3 V V VCC +0.3 to GNDA -0.3 -25 to +125 -40 to +125 V °C °C -65 to +150 °C 300 °C 5/18 ETC5064 - ETC5064-X - ETC5067 - ETC5067-X ELECTRICAL OPERATING CHARACTERISTICS VCC = 5.0V ±5%, VBB = -5V ±5%, GNDA = 0V, TA = 0°C to 70°C (ETC5064-X/67-X: TA = –40°C to 85°), unless otherwise noted; typical characteristics specified at VCC = 5.0V, VBB =-5.0V, TA = 25°C; all signals are referenced to GNDA. DIGITAL INTERFACE (All devices) Symbol Parameter Min. VIL VIH Input Low Voltage VOL Output Low Voltage IL = 3.2 mA IL = 3.2 mA, Open Drain DX TSX Output High Voltage IH = 3.2 mA DX VOH Input High Voltage Typ. Max. 0.6 2.2 Unit V V 0.4 0.4 V V 2.4 V IIL Input Low Current (GNDA ≤ VIN ≤ VIL )all digital inputs Except BCLKR – 10 10 µA IIH Input High Current (VIH ≤ VIN ≤ VCC) Except ANLB – 10 10 µA c u d ANALOG INTERFACE WITH TRANSMIT INPUT AMPLIFIER (all devices) Symbol IIXA RIXA Parameter VFxI + or VFxI – Input Leakage Current (– 2.5 V ≤ V ≤ + 2.5 V) ROXA Input Resistance (– 2.5 V ≤ V ≤ + 2.5 V) Output Resistance (closed loop, unity gain) RLXA Load Resistance CLXA Load Capacitance VOXA AVXA Output Dynamic Range (RL ≥ 10 kΩ) Voltage Gain (VFXI + to GSX) FUXA Unity Gain Bandwidth VOSXA VCMXA CMRRXA PSRRXA Offset Voltage Common-mode Voltage ) s ( ct VFXI + or VFXI – so e t le b O - GSX Typ. o r P GSX Max. 200 10 1 3 5000 pF V V/V 2 – 20 – 2.5 u d o Ω kΩ 50 +2.8 – 2.8 1 Unit nA MΩ 10 GSX Common-mode Rejection Ratio Power Supply Rejection Ratio r P e Min. – 200 ) s t( MHz 20 2.5 60 60 mV V dB dB ANALOG INTERFACE WITH RECEIVE FILTER (all devices) t e l o Symbol RORF s b O Parameter Output Resistance RLRF Load Resistance (VFRO = ± 2.5 V) CLRF Load Capacitance VOSRO 6/18 Output DC Offset Voltage Min. VF RO Typ. 1 Max. 3 10 – 200 Unit Ω 25 kΩ pF 200 mV ETC5064 - ETC5064-X - ETC5067 - ETC5067-X ELECTRICAL OPERATING CHARACTERISTICS (Continued) ANALOG INTERFACE WITH POWER AMPLIFIERS (all devices) Symbol IPI Parameter Min. Input Leakage Current (– 1.0 V ≤ VPI ≤ 1.0 V) RIPI Input Resistance (– 1.0 ≤ VPI ≤ 1.0 V) VIOS ROP Input Offset Voltage Output Resistance (inverting unity–gain at VPO + or VPO –) FC CL P Unity–gain Bandwidth, Open Loop (VPO –) GAp + PSRRp Typ. – 100 Unit 100 nA 10 MΩ – 25 25 mV Ω kHz pF 1 400 Load Capacitance (VPO + or VPO – to GNDA) RL ≥ 1500 Ω RL = 600 Ω RL = 300 Ω 100 500 1000 Gain VPO – to VPO + to GNDA, Level at VPO – = 1. 77 Vrms (+ 3 dBmO) –1 V/V dB Power Supply Rejection of VCC or VBB (VPO– connected to VPI) 0 kHz – 4 kHz 0 kHz – 50 kHz 60 36 c u d POWER DISSIPATION (all devices) Symbol ICC0 Parameter Power-down Current at ETC6064/67 ETC5064-X/67-X IBB0 Power-down Current at ETC6064/67 ETC5064-X/67-X ICC1 Active Current at ETC6064/67 ETC5064-X/67-X IBB1 Active Current at ETC6064/67 ETC5064-X/67-X ) s ( ct Max. ro Min. o s b O - P e let ) s t( Typ. 0.5 0.5 Max. 1.5 Unit mA mA 0.05 0.05 7.0 7.0 0.3 0.4 10.0 12.0 mA mA mA mA 7.0 7.0 10.0 12.0 mA mA u d o r P e t e l o s b O 7/18 ETC5064 - ETC5064-X - ETC5067 - ETC5067-X All TIMING SPECIFICATIONS Symbol 1/tPM tWMH tWML tRM tFM tPB tWBH tWBL tRB tFB Parameter Frequency of master clocks MCLKX and MCLKR Depends on the device used and the BCLKR/CLKSEL Pin Width of Master Clock High Min. MCLKX and MCLKR 160 Width of Master Clock Low Rise Time of Master Clock MCLKX and MCLKR MCLKX and MCLKR 160 Fall Time of Master Clock MCLKX and MCLKR Period of Bit Clock 485 Width of Bit Clock High (VIH = 2.2 V) Width of Bit Clock Low (VIL = 0.6 V) 160 160 ns 488 Holding Time from Bit Clock Low to the Frame Sync (long frame only) 0 tSFB Set-up Time from Frame Sync to Bit Clock (long frame only) Hold Time from 3rd Period of Bit Clock FSX or FSR Low to Frame Sync (long frame only) Delay Time to valid data from FSX or BCLKX, whichever comes later and delay time from FSX to data output disabled (CL = 0 pF to 150 pF) Delay Time from BCLKX high to data valid (load = 150 pF plus 2 LSTTL loads) 80 ns ns e t le o s b O - ns c u d o r P 100 ns ns ) s t( ns ns ns 20 165 ns 0 150 ns 165 ns tDZC Delay Time from BCLKX low to data output disabled 50 tSDB Set-up Time from DR valid to BCLKR/X low Hold Time from BCLKR/X low to DR invalid 50 50 ns ns Holding Time from Bit Clock High to Frame Sync (short frame only) Set-up Time from FSX/R to BCLKX/R Low (short frame sync pulse) - Note 1 0 80 ns ns tHF Hold Time from BCLKX/R Low to FSX/R Low (short frame sync pulse) - Note 1 100 ns tXDP Delay Time to TSX low (load = 150 pF plus 2 LSTTI loads) Minimum Width of the Frame Sync Pulse (low level) (64 bit/s operating mode) tHBD tHOLD tSF tWFL (s) t c u t e l o d o r P e 140 160 Note : 1.For short frame sync timing. FSX and FS R must go high while their respective bit clocks are high. s b O Figure 1 : 64 k bits/s TIMING DIAGRAM. (see next page for complete timing) 8/18 50 15.725 50 50 tHBF ns ns ns ns Rise Time of Bit Clock (tPB = 488 ns) Fall Time of Bit Clock (tPB = 488 ns) 100 tDBD Unit MHz 50 Set-up time from BCLKX high to MCLKX falling edge. (first bit clock after the leading edge of FSX) tDZF Max. 1.544 tSBFM tHBFI Typ. 1.536 2.048 ns ns ETC5064 - ETC5064-X - ETC5067 - ETC5067-X Figure 2 : Short Frame Sync Timing. c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O 9/18 ETC5064 - ETC5064-X - ETC5067 - ETC5067-X Figure 3 : Long Frame Sync Timing. c u d e t le ) s ( ct u d o r P e t e l o s b O 10/18 o s b O - o r P ) s t( ETC5064 - ETC5064-X - ETC5067 - ETC5067-X TRANSMISSION CHARACTERISTICS (all devices) TA = 0°C to 70°C (ETC5064-X/67-X: TA = –40°C to 85°), VCC = 5V ± 5%, VBB = – 5V ± 5%, GNDA = 0V, f = 1.02kHz, VIN = 0dBm0 transmit input amplifier connected for unity–gain non–inverting. (unless otherwise specified). AMPLITUDE RESPONSE Symbol Parameter Min. Absolute Levels - Nominal 0 dBm0 is 4 dBm (600Ω). 0 dBm0 Typ. tMAX Max Overload Level 3.14 dBm0 3.17 dBm0 ETC5067 ETC5064 GXA Transmit Gain, Absolute (TA = 25°C, VCC = 5V, VBB = -5V) Input at GSX = 0dBm0 at 1020Hz GXR Transmit Gain, Relative to GXA f = 16Hz f = 50Hz f = 60Hz f = 180Hz f = 200Hz f = 300Hz -3000Hz f = 3200Hz (ETC5064-X/67-X) f = 3300Hz f = 3400Hz f = 4000Hz f = 4600Hz and up, measure response from oHz to 4000Hz GXAT Absolute Transmit Gain Variation with Temperature TA = 0°C to +70°C TA = –40°C to +85°C (ETC5064-X/67-X) VPK 0.15 dB -2.8 -1.8 -0.15 -0.35 -0.35 -0.7 -40 -30 -26 -0.2 -0.1 0.15 0.20 0.05 0 -14 -32 dB d o r uc ) s t( dB 0.05 dB -0.2 -0.4 -1.2 0.2 0.4 1.2 dB -0.15 0.15 dB -0.15 -0.35 -0.35 -0.7 0.15 0.20 0.05 0 -14 -0.1 -0.15 0.1 0.15 dB -0.05 0.05 dB Receive Gain Variation with Level Sinusoidal Test Method; Reference Input PCM code corresponds to an ideally encoded -10dBm0 signal PCM level = -40dBm0 to +3dBm0 PCM level = -50dBm0 to -40dBm0 PCM level = -55dBm0 to -50dBm0 -0.2 -0.4 -1.2 0.2 0.4 1.2 dB Receive Filter Output at VFRO RL = 10KΩ -2.5 2.5 V c u d (t s) GRA Receive Gain, Absolute (TA = 25°C, VCC = 5V, VBB = -5V) Input = Digital Code Sequence for 0dBm0 Signal at 1020Hz GRR Receive Gain, Relative to GRA f = 0Hz to 3000Hz f = 3200Hz (ETC5064-X/67-X) f = 3300Hz f = 3400Hz f = 4000Hz o r P e t e l o VRO 2.492 2.501 -0.05 Transmit Gain Variation with Level Sinusolidal Test Method Reference Level = -10dBm0 VFXI+ = -40dBm0 to +3dBm0 VFXI+ = -50dBm0 to -40dBm0 VFXI+ = -55dBm0 to -50dBm0 GRRL Vrms -0.15 P e let o s b O - GXRL GRAV 1.2276 0.1 0.15 Absolute Transmit Gain Variation with Supply Voltage (VCC = 5V ±5%, VBB = -5V ±5%) GRAT Unit -0.1 -0.15 GXAV s b O Max. Absolute Receive Gain Variation with Temeperature TA = 0°C to +70°C TA = –40°C to +85°C (ETC5064-X/67-X) Absolute Receive Gain Variation with Supply Voltage (VCC = 5V ±5%, VBB = -5V ±5%) dB 11/18 ETC5064 - ETC5064-X - ETC5067 - ETC5067-X TRANSMISSION CHARACTERISTICS (continued). ENVELOPE DELAY DISTORTION WITH FREQUENCY Symbol Typ. Max. Unit DXA Transmit Delay, Absolute (f = 1600 Hz) Parameter Min. 290 315 µs DXR Transmit Delay, Relative to DXA f = 500 Hz-600 Hz f = 600 Hz-800 Hz f = 800 Hz-1000 Hz f = 1000 Hz-1600 Hz f = 1600 Hz-2600Hz f = 2600 Hz-2800 Hz f = 2800 Hz-3000 Hz 195 120 50 20 55 80 130 220 145 75 40 75 105 155 DRA Receive Delay, Absolute (f = 1600 Hz) 180 200 DRR Receive Delay, Relative to DRA f = 500 Hz-1000 Hz f = 1000 Hz-1600 Hz f = 1600 Hz-2600 Hz f = 2600 Hz-2800 Hz f = 2800 Hz-3000 Hz – 25 – 20 70 100 145 90 125 175 – 40 – 30 c u d NOISE Symbol NXP NRP NXC NRC NRS PPSRX NPSRX PPSRR Parameter Transmit Noise, P Message (A-LAW, VFXI + = 0 V) Weighted 1) ETC5064 ETC5064-X Receive Noise, P Message Weighted (A-LAW, PCM Code Equals Positive Zero) Transmit Noise, C Message Weighted (µ-LAW, VFxI + = 0 V) e t le o s b O - ETC5064 ETC5064-X Receive Noise, C Message Weighted (µ-LAW, PCM Code Equals Alternating Positive and Negative Zero) Noise, Single Frequency f = 0 kHz to 100 kHz, Loop around Measurement, VFXI + = 0 V (s) t c u Positive Power Supply Rejection, Transmit (note 2) VCC = 5.0 VDC + 100 mVrms, f = 0 kHz-50 kHz Negative Power Supply Rejection, Transmit (note 2) VBB = 5.0 VDC + 100 mVrms, f = 0 kHz-50 kHz d o r P e Positive Power Supply Rejection, Receive (PCM code equals positive zero, VCC = 5.0 VDC + 100 mVrms) f = 0 Hz-4000Hz A LAW µ LAW f = 4 kHz-25 kHz f = 25 kHz-50 kHz t e l o s b O NPSRR SOS 12/18 o r P Min. Negative Power Supply Rejection, Receive (PCM code equals positive zero, VBB = – 5.0 VDC + 100 mVrms) f = 0 Hz-4000Hz A LAW µ LAW f = 4 kHz-25 kHz f = 25 kHz-50 kHz Spurious out-of-band Signals at the Channel Output 0 dBm0, 300 Hz-3400 Hz input PCM applied at DR 4600 Hz-7600 Hz 7600 Hz-8400 Hz 8400 Hz-100,000 Hz µs µs µs ) s t( Typ. Max. Unit – 74 – 74 – 82 – 69 – 67 – 79 dBm0p dBm0p dBm0p 12 12 15 16 dBrnC0 dBrnC0 11 dBrnC0 – 53 dBm0 8 40 dBp 40 dBp 40 40 40 36 dBp dBc dB dB 40 40 40 36 dBp dBc dB dB –32 –40 –32 dB dB dB ETC5064 - ETC5064-X - ETC5067 - ETC5067-X TRANSMISSION CHARACTERISTICS (continued). DISTORTION Symbol STDX or STDR Parameter Signal to Total Distortion (sinusoidal test method) Min. Transmit or Receive Half-channel Level = 3.0 dBm0 = 0 dBm0 to – 30 dBm0 = – 40 dBm0 XMT RCV XMT RCV = – 55 dBm0 SFDX SFDR IMD Typ. CTR-X dBc (µLAW) Single Frequency Distortion, Transmit (TA = 25°C) – 46 dB Single Frequency Distortion, Receive (TA = 25°C) – 46 dB Intermodulation Distortion Loop Around Measurement, VFXI + = – 4 dBm0 to – 21 dBm0, two Frequencies in the Range 300 Hz-3400 Hz – 41 dB Parameter Transmit to Receive Crosstalk, 0dBm0 Transmit f = 300 Hz-3400 Hz, DR = Steady PCM Code ETC5064/67 ETC5064-X/67-X e t le Receive to Transmit Crosstalk, 0dBm0 Receive Level (note 2) f = 300 Hz-3400 Hz, VFXI = 0 V ETC5064/67 ETC5064-X/67-X ) s ( ct POWER AMPLIFIERS Symbol VOL s b O Notes : Min. c u d Parameter Min. Maximum 0 dBm0 Level for Better than ± 0.1 dB Linearity Over the Range 10 dBm0 to + 3 dBm0 (balanced load, RL connected between VPO + and VPO –) RL = 600 Ω RL = 1200 Ω RL = 30 kΩ 33 3.5 4.0 Signal/Distortion RL = 600 Ω, 0 dBm0 50 u d o r P e ) s t( Typ. Max. Unit – 90 – 75 – 65 dB dB – 90 – 70 – 65 dB dB Typ. Max. Unit Vrms o r P o s b O - t e l o S/DP Unit dBp (ALAW) 33 36 29 30 14 15 CROSSTALK Symbol CTX-R Max. dB 1. Measured by extrapolation from the distortion test results. 2. PPSRX, NPSRX, CTR–X measured with a –50dBm0 activating signal applied at VFXI + ENCODING FORMAT AT DX OUTPUT VIN (at GSX) = + Full-scale VIN (at GSX) = 0 V VIN (at GSX) = – Full-scale µLaw A-Law (Including even bit inversion) 1 0 1 0 1 0 1 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 1 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 1 1 1 1 1 1 1 0 0 1 0 1 0 1 0 0 0 0 0 0 0 0 0 13/18 ETC5064 - ETC5064-X - ETC5067 - ETC5067-X APPLICATION INFORMATION Figure 4 : Typical Asynchronous Application. POWER SUPPLIES While the pins at the ETC506X family are well protected against electrical misure, it is recommended that the standard CMOS practice be followed, ensuring that ground is connected to the device before any other connections are made. In applications where the printed circuit board may be plugged into a "hot" socket with power and clocks already present, an extra long ground pin in the connector should be used. All ground connections to each device should meet at a common point as close as possible to the GNDA pin. This minimizes the interaction of ground return currents flowing through a common bus impedance. 0.1µF supply decoupling capacitors should be connected from this common ground point to VCC and VBB as close to the device as possible. For best performance, the ground point of each CODEC/FILTER on a card should be connected to a common card ground in star formation, rather than via a ground bus. This common ground point should be decoupled to VCC and VBB with 10µF capacitors. ) s ( ct u d o r P e t e l o s b O 14/18 c u d o s b O - e t le o r P ) s t( ETC5064 - ETC5064-X - ETC5067 - ETC5067-X mm inch OUTLINE AND MECHANICAL DATA DIM. MIN. TYP. MAX. MIN. TYP. MAX. A 2.35 2.65 0.093 0.104 A1 0.1 0.3 0.004 0.012 B 0.33 0.51 0.013 0.020 C 0.23 0.32 0.009 0.013 D 12.6 13 0.496 0.512 E 7.4 7.6 0.291 0.299 e 1.27 0.050 H 10 10.65 0.394 0.419 h 0.25 0.75 0.010 0.030 L 0.4 1.27 0.016 0.050 K c u d e t le 0˚ (min.)8˚ (max.) (s) t c u d o r P e B s b O t e l o o s b O - L ) s t( o r P SO20 h x 45˚ A e A1 K C H D 20 11 E 1 0 1 SO20MEC 15/18 ETC5064 - ETC5064-X - ETC5067 - ETC5067-X mm inch OUTLINE AND MECHANICAL DATA DIM. MIN. TYP. MAX. MIN. TYP. MAX. A 9.78 10.03 0.385 0.395 B 8.89 9.04 0.350 0.356 D 4.2 4.57 0.165 0.180 d1 2.54 0.100 d2 0.56 0.022 E 7.37 8.38 0.290 0.330 e 1.27 0.050 F 0.38 0.015 G 0.101 M 1.27 0.050 M1 1.14 0.045 e t le ) s ( ct M1 t e l o bs 4 o r P e M1 du 2 1 20 o s b O 18 M F 17 6 16 7 15 e 8 O M 19 5 9 o r P PLCC20 B 3 c u d 0.004 10 11 A 12 E 14 13 d2 d1 PLCC20ME 16/18 ) s t( G (Seating Plane Coplanarity) D ETC5064 - ETC5064-X - ETC5067 - ETC5067-X mm DIM. MIN. a1 0.254 B 1.39 TYP. inch MAX. MIN. TYP. MAX. OUTLINE AND MECHANICAL DATA 0.010 1.65 0.055 0.065 b 0.45 0.018 b1 0.25 0.010 D 25.4 1.000 E 8.5 0.335 e 2.54 0.100 e3 22.86 0.900 F 7.1 0.280 I 3.93 0.155 L 3.3 Z c u d 0.130 1.34 e t le 0.053 ) s ( ct ) s t( o r P DIP20 o s b O - u d o r P e t e l o s b O 17/18 ETC5064 - ETC5064-X - ETC5067 - ETC5067-X c u d e t le ) s ( ct ) s t( o r P o s b O - u d o r P e t e l o s b O Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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