Fairchild FAN1539MPX 1a/1.3a, ldo with low quiescent current Datasheet

FAN1539/FAN1540
1A/1.3A, LDO with Low Quiescent Current
Features
Description
■ Very Low Ground Current (IGND = 1mA)
■ Excellent Line Regulation
The FAN1539/FAN1540 series of high current LDOs
(1.0A and 1.3A) has been developed for portable applications where low quiescent current is an important
requirement. The device features excellent line and load
transient response which does not exceed 10% of nominal output value for full operating temperature range
even during power ON cycle and short circuit removal.
Internally trimmed, temperature compensated bandgap
reference guarantees 2.5% accuracy for full range of
input voltage, output current and temperature. Included
on the chip are accurate current limit and thermal shutdown protection. Device stability is achieved with only
two external low ESR ceramic capacitors.
■ Excellent Load Regulation
■ Very Low Transient Overshoot
■ Stable with low ESR Output Capacitor (ESR = 0mΩ)
■ Thermal Shutdown
■ Current Limit
■ Output Options: 3.3V and 1.8V
Applications
■ Disk Drive Circuits
The FAN1539/FAN1540 is available in thermally
enhanced 3x3mm 6-lead MLP, 5x6mm 8-lead MLP and
3-lead TO-252 packages. The 5x6mm MLP package version features a separate Kelvin sense pin for high precision applications.
■ Desktop Computers
■ Laptop, Notebook Computers
■ General Purpose Three Terminal Regulator
Ordering Information
Product Number
Output Voltage
Package
FAN1540MMPX
3.3V
5x6mm 8-Lead MLP in T&R
FAN1539MPX
3.3V
3x3mm 6-Lead MLP in T&R
FAN1540MPX
3.3V
3x3mm 6-Lead MLP in T&R
FAN1540DX
3.3V
3-Lead TO-252 in T&R
FAN1540D18X
1.8V
3-Lead TO-252 in T&R
Tape and Reel Information
Quantity
Reel Size
Width
3000
7"
8mm
©2005 Fairchild Semiconductor Corporation
FAN1539/FAN1540 Rev. 1.1.1
1
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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
November 2005
VOUT
VIN
X
BANDGAP
REFERENCE
(Note 1)
VSENSE
(Note 2)
CURRRENT
LIMIT
START-UP
CIRCUIT
ERROR
AMPLIFIER
THERMAL
SHUTDOWN
GND
Notes:
1. No connection for FAN1540MMPX.
2. VSEN available for FAN1540MMPX.
Pin Assignments
TOP VIEW
GND
1
8
VOUT
2
7
GND
NC
GND
VOUT
VIN
FAN1540
VSEN
3
6
GND
VIN
4
5
GND
1
6
GND
2
5
NC
3
4
NC
FAN1539/FAN1540
3x3mm 6-Lead MLP
5x6mm 8-Lead MLP
FAN1540
VIN
VOUT
GND
3-Lead TO-252 PACKAGE
Pin Description
Symbol
VIN
Name and Function
Input pin
GND
Ground Pin (Tab)
VOUT
Output pin: Fixed Output Voltage
VSEN
Output sense pin. Connect to VOUT if Kelvin sensing is not required
NC
No Connection
2
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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Block Diagram
Parameter
Symbol
Value
Units
Operating Input Voltage
VIN
10
V
Power Dissipation
PD
Internally
Limited
W
IOSH
Internally
Limited
A
Operating Junction Temperature Range
TJ
0 to 150
°C
Thermal Resistance–Junction to Tab, TO-252
θJC
3
°C/W
Thermal Resistance–Junction to Tab, 3mmx3mm 6-lead MLP (Note 3)
θJC
8
°C/W
Thermal Resistance–Junction to Tab, 5mmx6mm 8-lead MLP (Note 3)
θJC
4
°C/W
Storage Temperature Range (Note 3)
TSTG
-65 to 150
°C
Lead Temperature (I.R. Reflow) 30 Sec. (Note 4)
TLEAD
240
°C
Lead Temperature (Soldering) 10 Sec. (Note 4)
TLEAD
260
°C
ESD
4
kV
Short Circuit Output Current
Electrostatic Discharge Protection (Note 5)
HBM
CDM
2
Notes:
3. Junction to ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and
number of copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink
characteristics.Thermal resistance (θJA), VIN, IOUT must be chosen not to exceed TJ = 150°C.
4. Soldering temperature should be 260°C for 10 second after 240°C for 30 second in I.R. reflow using 60/40 solder.
Maximum rate of temperature rise is 3°C/SEC to within 100°C of the final temperature.
5. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
3
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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Absolute Maximum Ratings
Unless otherwise specified, VIN = 4.50V to 7V, Tj = 25°C, IMAX (FAN1539) = 1.0A, IMAX (FAN1540) = 1.3A.
Boldface limits apply over operating junction temperature range of 0°C ≤ TJ ≤ 125°C.
Test Conditions
Parameter
Output Voltage
FAN1540
Test Limits
Symbol
VIN
IOUT
Min.
Typ.
Max.
Units
VOUT
4.75V ≤ VIN ≤ 5.25V
5mA ≤ IOUT ≤ IMAX
3.234
3.300
3.366
V
3.217
3.383
Line Regulation
REG(LINE) 3.0V ≤ VIN ≤ 5.25V
Load Regulation
REG(LOAD)
Dropout Voltage
(Note 6)
VD
Current Limit
IS
Min. Output
Current for
regulation
(∆VOUT ≤ 3%)
IOMIN
Temperature
Stability
TS
IOUT = 5mA
0.3
%
RMS Output
Noise
(Note 7)
VN
IOUT = IMAX
0.003
%VOUT
Ripple Rejection
Ratio (Note 8)
RA
dB
4.75V
5mA ≤ IOUT ≤ IMAX
2
15
mV
5mA ≤ IOUT FAN1539
≤ IMAX
FAN1540
25
35
mV
30
40
IOUT = IMAX
0.9
1.2
5.5V
V
3.3
A
0
5V
IOUT = 10mA
65
75
IOUT = 100mA
63
73
IOUT = IMAX
45
57
Transient
Response
Change of VOUT
with step load
change (Note 9)
∆V OUT
-----------------∆I OUT
5V
Transient
Response
Change of VOUT
with application
of VIN
(Note 9)
∆V OUT
-----------------∆V IN
0 to 5V Step Input
tr ≥ 1µS
10% to 90%
1mA ≤ IOUT ≤ IMAX
5.0
10
(undershoot or
overshoot
of VOUT)
%
5V
IOUT = short
to
IOUT = 10mA
5.0
10 (overshoot or
undershoot of
VO)
%
VIN ≤ 7V
IOUT = 0mA
1.0
2.0
mA
Transient
Response
Short circuit
Removal
Response
(Note 9)
Quiescent
Current
∆V OUT
-----------------∆V IN
1mA to IMAX
tr ≥ 1µS
mA
2.0
IMAX to 1mA
tf ≥ 1µS
@IOUT =
short
IGND
4
FAN1539/FAN1540 Rev. 1.1.1
10
(undershoot or
overshoot
of VOUT)
%
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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Electrical Characteristics—FAN1539MPX, FAN1540MPX, FAN1540MMPX,
FAN1540DX
Unless otherwise specified, VIN = 4.50V to 7V, Tj = 25˚C, IMAX (FAN1539) = 1.0A, IMAX (FAN1540) = 1.3A.
Boldface limits apply over operating junction temperature range of 0°C ≤ TJ ≤ 125°C.
Test Conditions
Parameter
Test Limits
Symbol
VIN
IOUT
Min.
Typ.
Max.
Units
Quiescent
Current
IGND
VIN ≤ 7V
2mA ≤ IOUT ≤ IMAX
1.0
2.0
mA
Quiescent
Current
IGND
VIN = 5V
0mA ≤ IOUT ≤ 50mA
1.0
2.0
mA
Thermal
Shutdown
TjSD
3.0V ≤ VIN ≤ 5.25V
160
°C
Thermal
Hysteresis
THYST
3.0V ≤ VIN ≤ 5.25V
15
°C
Notes:
6. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the
nominal value measured at VIN = 5V.
7. Measured within 10Hz to 10kHz bandwidth.
8. Measured at DC, specified at 120 Hz.
9. CIN = 22µF, COUT = 10µF. Both capacitors are low ESR X7R type.
Test Circuit
VOUT
VIN
IN
CIN
DUT
OUT
10µF
22µF
COUT
GND
Notes: 1. Use low ESR capacitors.
2. CIN should be placed as close to VIN as possible.
5
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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Electrical Characteristics—FAN1539MPX, FAN1540MPX, FAN1540MMPX,
FAN1540DX (Continued)
Unless otherwise specified, VIN = 3.135V to 3.465V, Tj = 25°C, IMAX = 1.3A. Boldface limits apply over operating
junction temperature range of 0°C ≤ TJ ≤ 125°C.
Test Conditions
Parameter
Symbol
VIN
Output Voltage
VOUT
Line Regulation
Test Limits
Typ.
Max.
Units
3.15V ≤ VIN ≤ 3.465V
5mA ≤ IOUT ≤ IMAX 1.755 1.800
1.845
V
REG(LINE)
3.135V ≤ VIN ≤ 3.465V
5mA ≤ IOUT ≤ IMAX
3
10
mV
Load Regulation
REG(LOAD)
3.3V
5mA ≤ IOUT ≤ IMAX
20
40
mV
Dropout Voltage
(Note 6)
VD
IOUT = IMAX
0.9
1.2
V
Current Limit
IS
Min. Output
Current for
regulation
(∆VOUT ≤ 3%)
IOMIN
Temperature
Stability
TS
IOUT = 5mA
0.3
%
RMS Output
Noise (Note 7)
VN
IOUT = IMAX
0.003
%VOUT
Ripple Rejection
Ratio (Note 8)
RA
3.3V
IOUT = 500mA
Transient
Response
Change of VOUT
with step load
change (Note 9)
∆V OUT
-----------------∆I OUT
3.3V
1mA to IMAX
tr ≥ 1µS
Transient
Response
Change of VOUT
with application of
VIN (Note 9)
∆V OUT
-----------------∆V IN
0 to 1.8V Step Input
tr ≥ 1µS
10% to 90%
1mA ≤ IOUT ≤ IMAX
3.0
10
(undershoot
or overshoot
of VOUT)
%
3.3V
IOUT = short
to
IOUT = 10mA
3.0
10
(overshoot
or undershoot of VO)
%
Transient
Response
Short circuit
Removal
Response
(Note 9)
∆V OUT
-----------------∆V IN
IOUT
Min.
3.3V
2.5
A
0
mA
40
dB
2.0
IMAX to 1mA
tf ≥ 1µS
10
(undershoot
or overshoot
of VOUT)
%
@IOUT =
short
Quiescent Current
IGND
3.3V
IOUT = 0mA
1.0
2.0
mA
Quiescent Current
IGND
3.3V
2mA ≤ IOUT ≤ IMAX
1.0
2.0
mA
Thermal Shutdown
TjSD
160
°C
Thermal Hysteresis
THYST
10
°C
Notes:
6 Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the
nominal value measured at VIN = 3.3V.
7. Measured within 10Hz to 10kHz bandwidth.
8. Measured at DC, specified at 120 Hz.
9. CIN = 22µF, COUT = 10µF. Both capacitors are low ESR X7R type.
6
FAN1539/FAN1540 Rev. 1.1.1
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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Electrical Characteristics—FAN1540D18X
FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Test Circuit
VOUT
VIN
IN
CIN
DUT
OUT
10µF
22µF
COUT
GND
Notes: 1. Use low ESR capacitors.
2. CIN should be placed as close to VIN as possible.
7
FAN1539/FAN1540 Rev. 1.1.1
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Ground Pin Current vs. Temperature
1.3
3.305
1.2
Quiescent Current (mA)
Output Voltage (V)
Output Voltage vs. Temperature
3.310
3.300
3.295
3.290
V IN = 5V
3.285
VI IN
= 5V= 10mA
OUT
IOUT = 5m A
Typical
3.3V Device
Typical 3.3V Device
3.280
V IN = 5V
I OUT = 10mA
1.1
1.0
0.9
0.8
0.7
3.275
-50
0
50
100
0
150
Ambient Temperature (°C)
Ground Pin Current vs. Input Voltage
1.20
1.15
1.06
1.10
1.05
1.00
0.95
I OUT = 10 mA
0.90
150
1.05
1.04
1.03
1.02
V IN = 5V
1.01
1.00
0.85
4
5
6
7
8
9
0
10
200
400
Input Voltage (V)
1.1
3.0
Output Voltage (V)
3.5
1.0
I OUT = 1.3 A
0.9
IO U
IO
UT
T
= 1A
= 0.
5A
0.7
0.6
-50
800
1000
1200
1400
Output Voltage vs. Output Current
1.2
0.8
600
Output Current (mA)
Dropout Voltage vs. Temperature
Dropout Voltage (V)
100
Ground Pin Current vs. Output Current
1.07
Quiescent Current (mA)
Quiescent Current (mA)
50
Ambient Temperature (°C)
2.5
2.0
VIN = 5V
1.5
T j = 25°C
1.0
0.5
0
50
0.0
0. 0
100
Ambient Temperature (°C)
1. 0
1. 5
2. 0
2.5
3. 0
3. 5
Output Current (A)
8
FAN1539/FAN1540 Rev. 1.1.1
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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Typical Performance Characteristics—FAN1539MPX, FAN1540MPX,
FAN1540MMPX, FAN1540DX
Load Transient Response
Output Voltage
(20mV/div)
Output Voltage
(50mV/div)
Line Transient Response
I OUT = I MAX
3.300V
C IN = 22µF
C OUT = 10µF
VIN = 5V
3.300V
CIN = 22µF
C OUT = 10µF
(Ceramic Low ESR Capacitors)
Output Current
(0.5A/div)
Output Voltage
(2.5V/div)
(Ceramic Low ESR Capacitors)
t r = 1µs
Tj = 25°C
t r = 1µs
t f = 1µs
T j = 25°C
Time (20µs/div)
Time (20µs/div)
Short Circuit Removal Response
100
VIN = 5V
3.300V
90
Ripple Rejection (dB)
Output Voltage
(50mV/div)
Output Current
(2.5A/div)
Ripple Rejection vs. Frequency
CIN = 22µF
C OUT = 10µF
(Ceramic Low ESR Capacitors)
~3.3A
t f = 1µs
70
60
50
40
30
VIN = 5V
I OUT = 10mA
20
COUT = 10µF (Low ESR)
10
T j = 25°C
10 mA
80
0
10 1
10 2
10 3
10 4
10 5
10 6
Frequency (Hz)
Time (40µs/div)
Typical Region of Stability
ESR vs. Output Current*
Output Spectral Noise Density
vs. Frequency
1000
ESR (mΩ)
(Equivalent Series Resistance)
Output Spectral Noise Density
(µVrms/rtHz)
2.0
1.8
VIN = 5V
IOUT = IMAX
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
10
CIN = 22µF
COUT = 10µF
Ceramic Low ESR
Region of Instability
100
Region of Stability
10
VIN = 5V
CIN = 22µF
COUT = 10µF
Tj = 25°C
1
0.1
0
100
1K
10K
100K
200
400
600
800
1000
1200
1400
Output Current (mA)
*Note: ESR Values measured at f = 10kHz
Fr eq ue ncy (H z)
Note:
Transient response tests require short lead lengths and low resistance connections at source and load.
9
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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Typical Performance Characteristics—FAN1539MPX, FAN1540MPX,
FAN1540MMPX, FAN1540DX (Continued)
Ground Pin Current vs. Temperature
1.810
1.3
1.805
1.2
Quiescent Current (mA)
Output Voltage (V)
Output Voltage vs. Temperature
1.800
1.795
1.790
VIN = 3.3V
I OUT = 10mA
Typical 1.8V Device
1.785
1.780
1.775
VIN = 3.3V
I OUT = 10mA
1.1
1.0
0.9
0.8
0.7
0
50
100
150
0
Ambient Temperature (°C)
1.15
1.06
1.10
1.05
1.00
I OUT = 10mA
0.90
1.05
1.04
1.03
V IN = 3.3V
1.02
1.01
0.85
1.00
3
4
5
6
7
8
9
10
0
200
Input Voltage (V)
600
800
1000
1200
1400
Output Voltage vs. Output Current
Dropout Voltage vs. Temperature
1.9
1.1
Output Voltage (V)
1.8
1.0
I OUT = 1.3A
0.9
IO U
0.8
IO
UT
T
= 1A
= 0.
5A
1.7
1.6
1.5
0.7
0.6
-50
400
Output Current (mA)
1.2
Dropout Voltage (V)
150
100
Ground Pin Current vs. Output Current
1.07
Quiescent Current (mA)
Quiescent Current (mA)
Ground Pin Current vs. Input Voltage
1.20
0.95
50
Ambient Temperature (°C)
VIN = 3.3V
T j = 25°C
0
50
1.4
0.0
100
1.0
1.5
2.0
2.5
3.0
Output Current (A)
Ambient Temperature (°C)
10
FAN1539/FAN1540 Rev. 1.1.1
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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Typical Performance Characteristics—FAN1540D18X
General Circuit Description
The ground pin current, IGND can be found in the charts
provided in the “Electrical Characteristics” section.
The FAN1539/FAN1540 is an advanced low dropout voltage regulator, specially designed for applications in portable computers, where high performance and low
quiescent current are required. The device has an internal trimmed bandgap voltage reference and an internal
output voltage sense divider. These two signals form the
input to the error amplifier which regulates the output
voltage.
The relationship describing the thermal behavior of the
package is:
 T J ( max ) – T A 
P D ( max ) =  -------------------------------- 
θ JA


where TJ(max) is the maximum allowable junction temperature of the die, which is 150°C, and TA is the ambient
operating temperature. θJA is dependent on the surrounding PC board layout and can be empirically
obtained. While the θJC (junction-to-case) of the 6-lead
MLP package is specified at 8°C /W, the θJA for a minimum PWB footprint will be in substantially higher. This
can be improved upon by providing a heat sink of surrounding copper ground on the PWB. Depending on the
size of the copper area, and the thickness of the copper
layer, the resulting θJA can vary over a wide range. The
addition of backside copper with through-holes, stiffeners, and other enhancements can also aid in reducing
thermal resistance. Thermal simulations performed on
a thermally optimized board layout indicate that θJA
as low as 20°C /W can be achieved. For example, the
heat contributed by the dissipation of other devices
located nearby must be included in the design considerations.
The FAN1539/FAN1540 has a complete set of internal
protection circuitry including thermal shutdown, short circuit current limit and electrostatic discharge protection.
Low ESR ceramic capacitors are needed for input as
well as output pins to maintain the circuit stability.
Short Circuit Current Limit
The device has internal over-current limit and short circuit protection. Under over-current conditions the device
current is determined by the current limit threshold. Once
the device is released from short circuit conditions, the
normal level of current limit is gradually re-established as
the device output voltage reaches normal levels. Special
circuitry has been added to ensure that recovery from
short circuit current conditions does not lead to excessive overshoot of the output voltage — a phenomenon
often encountered in conventional regulators.
Thermal Protection
Overload conditions also need to be considered. It is
possible for the device to enter a thermal cycling loop, in
which the circuit enters a shutdown condition, cools, reenables, and then again overheats and shuts down
repeatedly due to a persistent fault condition.
The FAN1539/FAN1540 is designed to supply at least
1A/1.3A output currents. Excessive output load at high
input-output voltage difference will cause the device temperature to increase and exceed maximum ratings due
to power dissipation. During output overload conditions,
when the die temperature exceeds the shutdown limit
temperature of 160°C, an onboard thermal protection will
disable the output until the temperature drops approximately 15°C below the limit, at which point the output is
re-enabled.
Capacitor ESR and Printed Circuit Board
Layout
The FAN1539/FAN1540 has been optimized to accommodate low ESR bypass capacitors down to 0 mΩ.
For best results it is important to place both input and
output bypass capacitors as near to the input and
output pins as possible. Use of X7R types such as
Murata’s
GRM31CR70J106KA01B
(10µF)
and
GRM43ER71A226KE01B (22µF) or similar component from TDK. The capacitors should connect directly
to the ground plane. Use of ground plane on the top and
the bottom side of the PCB is recommended. As many
vias as possible should be used to minimize ground
plane resistance.
Thermal Characteristics
The FAN1539/FAN1540 is designed to supply at least
1A/1.3A at the specified output voltage with an operating
die (junction) temperature of up to 125°C. Once the
power dissipation and thermal resistance is known, the
maximum junction temperature of the device can be calculated. While the power dissipation is calculated from
known electrical parameters, the actual thermal resistance depends on the thermal characteristics of the chosen package and the surrounding PC board copper to
which it is mounted.
The power dissipation is equal to the product of the
input-to-output voltage differential and the output current
plus the ground current multiplied by the input voltage,
or:
P D = ( V IN – V OUT )I OUT + V IN I GND
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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Applications Information
5x6mm 8-Lead MLP
5.0
A
4.50
B
6.25
3.50
6.0
4.25
0.25
(1.00)
C
2X
0.25
TOP VIEW
C
0.65 TYP
1.27 TYP
2X
LAND PATTERN RECOMMENDATION
0.10
C
(0.25)
1.0 MAX
0.08
C
SIDE VIEW
0.05
0.00
C
SEATING
PLANE
4.25 A
1.75
1
2
3
4
0.75 A
0.35
PIN #1 IDENT.
(OPTIONAL)
3.25 A
1.25
8
7
6
1.27
5
NOTES:
A)
DOES NOT FULLY CONFORM TO JEDEC
REGISTRATION MO-229, DATED 11/2001.
B)
DIMENSIONS ARE IN MILLIMETERS.
C)
DIMENSIONING AND TOLERANCES PER
ASME Y14.5–1994.
0.28–0.40 A
0.10 M C A B
3.81
A
0.05 M C
BOTTOM VIEW
12
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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Mechanical Dimensions
3x3mm 6-Lead MLP
3.0
0.15 C
A
2X
2.45
B
0.10 C
2X
2.6
1.85
3.0
2.15
3.45
(0.65)
0.15 C
2.6
0.10 C
2X
0.95 TYP
2X
TOP VIEW
0.65 TYP
RECOMMENDED LAND PATTERN
1.0 MAX
0°~12°
0.10 C
1.00
0.65
0.08 C 0.05
(0.20)
0.00
SEATING
PLANE
C
SIDE VIEW
2.25
1
0.95
3
0.45
0.20
1.65
0.2 MIN
4
6
1.90
0.30~0.45
Ø0.10 M C A B
Ø0.05 M C
BOTTOM VIEW
NOTES:
A. CONFORMS TO JEDEC REGISTRATION MO-229,
VARIATION VEEA, DATED 11/2001
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994
13
FAN1539/FAN1540 Rev. 1.1.1
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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Mechanical Dimensions
3-Lead TO-252
A
6.73
6.35
5.46
5.21
6.00 MIN
L3
4
6.50 MIN
D
6.25
1.02
0.64
C
1
3.00 MIN
2
3
1
1.14
0.76
(0.59)
0.89
0.64
2.30
1.40 MIN
4.60
2.29
4.57
0.25 M A M C
3
LAND PATTERN RECOMMENDATION
B
2.39
2.18
SEE
NOTE D
E1
0.58
0.46
4
D1
10.41
9.40
SEE
DETAIL A
2
3
1
0.10 B
NOTES: UNLESS OTHERWISE SPECIFIED
A) ALL DIMENSIONS ARE IN MILLIMETERS.
B) THIS PACKAGE CONFORMS TO JEDEC, TO-252,
ISSUE C. VARIATION AA & AB, DATED NOV. 1999.
0.51
GAGE PLANE
0.61
0.46
(1.54)
10°
0°
1.78
1.40
0.127 MAX
(2.90)
SEATING PLANE
DETAIL A
(ROTATED –90°)
SCALE 12X
14
FAN1539/FAN1540 Rev. 1.1.1
C)
DIMENSIONING AND TOLERANCING PER
ASME Y14.5–1994.
D)
HEAT SINK TOP EDGE COULD BE IN CHAMFERED
CORNERS OR EDGE PROTRUSION.
E)
DIMENSIONS L3, D, E1 & D1 TABLE:
OPTION AA OPTION AB
L3 0.89 – 1.27 1.52 – 2.03
D
5.97 – 6.22 5.33 – 5.59
E1 4.32 MIN
3.81 MIN
D1 5.21 MIN
4.57 MIN
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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
Mechanical Dimensions
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Definition of Terms
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Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
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any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I17
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FAN1539/FAN1540 Rev. 1.1.1
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FAN1539/FAN1540 1A/1.3A, LDO with Low Quiescent Current
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