G926 Global Mixed-mode Technology Inc. Dual 500mA LDO Regulator General Description Features The G926A is a dual low dropout regulator with VOUT1 2.5V/500mA and VOUT2 3.3V/500mA, G926B is with VOUT1 1.8V/500mA and VOUT2 3.3V/500mA, G926C is with VOUT1 3.3V/500mA and VOUT2 2.5V/ 500mA and G926D is with VOUT1 3.3V/500mA and VOUT2 1.8V/500mA. The dropout voltage is typically 1V with 500mA load. A low quiescent current is typical 200µA. Wide Input Voltage Range: 4.3V~6.5V IO = 500mA, VOUT1 and VOUT2 Dropout Voltage Typically 1V Output Current in Excess of 500mA Output Voltage Accuracy ±2% Quiescent Current, Typically 200µA Internal Short Circuit Current Limit Internal Over Temperature Protection Familiar regulator features such as over temperature and current limit protection circuits are provided to prevent it from being damaged by abnormal operating conditions. Applications The G926 comes in a SOP-8 and SOP-8 (FD) with power-pad package. CD/DVD-ROM, CD/RW Wireless LAN Card/Keyboard/Mouse Battery-Powered Equipment XDSL Router Ordering Information ORDER NUMBER MARKING VOUT1 VOUT2 TEMP. RANGE PACKAGE (Pb free) G926AP1U G926BP1U G926A G926B 2.5V 1.8V 3.3V 3.3V -40°C~ +85°C -40°C~ +85°C SOP-8 SOP-8 G926CP1U G926C 3.3V 2.5V -40°C~ +85°C SOP-8 G926DP1U G926AF1U G926D G926A 3.3V 2.5V 1.8V 3.3V -40°C~ +85°C -40°C~ +85°C SOP-8 SOP-8 (FD) G926BF1U G926CF1U G926DF1U G926B G926C G926D 1.8V 3.3V 3.3V 3.3V 2.5V 1.8V -40°C~ +85°C -40°C~ +85°C -40°C~ +85°C SOP-8 (FD) SOP-8 (FD) SOP-8 (FD) Note: P1: SOP-8 F1: SOP-8 (FD) U: Tape & Reel Pin Configuration Typical Application Circuit G926 G926 8 VOUT1 1 GND 8 VOUT1 1 NC VIN VIN VOUT1 VIN 2 7 GND VIN 2 7 GND VIN 3 6 GND VIN 3 6 NC VOUT2 4 5 SOP-8 G926 VOUT2 GND GND VOUT2 4 5 VOUT1 10µF 10µF VOUT2 10µF NC SOP-8 (FD) TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 0.3 Preliminary Oct 19, 2006 1 G926 Global Mixed-mode Technology Inc. Absolute Maximum Ratings (Note 1) Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Power Dissipation Internally Limited (Note2) Maximum Junction Temperature . . . . . . . . . . . .150°C Storage Temperature Range . . . .-65°C ≤ TJ ≤+150°C Reflow Temperature (soldering, 10sec) . . . . . . 260°C Thermal Resistance Junction to Ambient SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .162°C/W SOP-8(FD) . . . . . . . . . . . . . . . . . . . . . . . . . . .75°C/W Thermal Resistance Junction to Case SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31°C/W SOP-8(FD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .5°C/W Operating Conditions (Note 1) Input Voltage. . . . . . . . . . . . . . . . . . . . . . . .4.3V ~ 6.5V Temperature Range. . . . . . . . . . . . . .-40°C ≤ TA ≤85°C Electrical Characteristics VIN =5V, IO = 500mA, CIN=1µF, COUT =1µF. All specifications apply for TA = TJ = 25°C. [Note 3] PARAMETER Input Voltage SYMBOL CONDITION VIN G926A Output Voltage1 VOUT1 G926B G926C G926D G926A Output Voltage 2 Line Regulation Load Regulation Quiescent Current VOUT2 Vline Vload IQ Ripple Rejection PSRR Dropout Voltage VD Short Circuit Current Ishort G926B G926C IO = 50mA 10mA < IO < 500mA 10mA < IO < 500mA IO = 50mA G926D 4V < VIN < 6.5V, IO = 10mA 10mA < IO < 500mA MIN TYP MAX UNIT 4.3 2.450 --2.5 6.5 2.550 V 1.764 3.234 1.8 3.3 1.836 3.366 3.234 3.234 3.3 3.3 3.366 3.366 3.234 2.450 3.3 2.5 3.366 2.550 1.764 ----- 1.8 0.3 0.5 1.836 1 1 % % V V VIN = 5V --- 200 500 µA fi=120Hz, VP-P = 1V, VO = 3.3V fi=120Hz, VP-P = 1V, VO = 2.5V ----- 53 53 ----- dB fi=120Hz, VP-P = 1V, VO = 1.8V IO=500mA VOUT1 ------- 53 1 650 --1.2 --- VOUT2 VOUT1 --550 650 800 ----- VOUT2 800 150 ----- 25 --- Current Limit Ilim Over Temperature Threshold TOT 550 --- Over Temperature Hysterisis Thys --- V mA mA °C °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the G926 in SOP-8 package, θJA is 162°C/W. For in SOP-8 (FD) with power-pad package, θJA is 75°C/W. Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum, aluminum or ceramic. TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 0.3 Preliminary Oct 19, 2006 2 G926 Global Mixed-mode Technology Inc. Pin Description PIN NAME SOP-8 SOP-8(FD) 1 1 VOUT1 2,3 2,3 VIN 4 4 VOUT2 5,6,7,8 5,6,8 7 NC GND I/O FUNCTION O VOUT1 output voltage 2.5V in G926A, 1.8V in G926B or 3.3V in G926C and G926D, and source up to 500mA. Input voltage I O VOUT2 output voltage 3.3V in G926A and G926B, 2.5V in G926C or 1.8V in G926D, and source up to 500mA. I I No Connection Ground also function as heat-sink. Definitions Dropout Voltage The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 0.3 Preliminary Oct 19, 2006 3 G926 Global Mixed-mode Technology Inc. Typical Performance Characteristics (VIN=5V, CIN=1µF, COUT =1µF, TA=25°C, unless otherwise noted.) Line Transient Response Line Transient Response Load Transient Response Load Transient Response Short Circuit Current Ripple Rejection 60 IL=10mA IL=100mA Ripply Rejection(dB) 50 40 IL=500mA 30 20 CIN=10µF; COUT =10µF 10 0 10 100 1000 10000 100000 Frequency (Hz) TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 0.3 Preliminary Oct 19, 2006 4 G926 Global Mixed-mode Technology Inc. Typical Performance Characteristics (continued) Overcurrent Protection Characteristics Overcurrent Protection Characteristics Start-up Start-up Output Voltage vs. VIN Output Voltage vs. IL 1.809 TA =25°C ; IL=10mA 1.807 3.312 1.802 3.31 1.801 1.800 Output Voltage (V) Outpur Voltage (V) 3.308 1.805 3.306 V O1 1.803 3.304 3.302 1.801 3.3 1.799 V O2 1.797 1.795 2.5 3 3.5 4 4.5 V IN (V) 5 5.5 3.31 V IN=4.0V;V O1 3.30 V IN=5.0V;V O2 1.799 1.798 3.30 1.797 V IN=4.0V;V O2 1.796 1.795 3.298 1.794 3.296 1.793 3.294 1.792 V IN=3.3V;V O1 3.29 0 6 3.29 100 200 300 IL (mA) 400 3.28 500 TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 0.3 Preliminary Oct 19, 2006 5 G926 Global Mixed-mode Technology Inc. Typical Performance Characteristics (continued) Quiescent Current vs. VIN Dropout Voltage vs. IL 250 1.0 TA=25°C 0.8 Dropout Voltage (V) Quiescent Current (µA) 0.9 200 150 100 50 0.7 VO1 0.6 0.5 0.4 0.3 0.2 TA=25°C V O2 0.1 0 0.0 2.5 3 3.5 4 4.5 VIN (V) 5 5.5 6 0 3.324 400 500 2.5 Max. Dissipation Power (W) 3.314 1.807 Output Voltage (V) 200 300 IL (mA) G926 Max. Power Dissipation vs. PCB Top Copper Area Output Voltage vs. Temperature 1.809 100 3.304 VIN=5V;VO2 1.805 3.294 3.284 1.803 VIN=4V;VO1 3.274 1.801 3.264 1.799 3.254 1.797 IL=10mA 5 1 0.5 0 3.234 -5 1.5 3.244 1.795 -25 -15 2 15 25 35 45 55 65 75 85 0 1 2 3 4 5 2 PCB Top Copper Area (in ) Temperature (°C) G926 Max. Power Dissipation vs. TAMB (still air) Recommended Minimum Footprint Unit:in2 2.5 SOP-8/SOP-8 (FD) A=0.1 Max. Dissipation Power (W) SOP-8 Package A=0.2 2 A=0.3 A=0.4 A=0.5 1.5 A=1.0 A=1.5 A=2.0 1 A=2.5 A=3.0 A=3.5 0.5 A=4.0 A=4.5 A=5.0 0 25 35 45 55 65 TAMB (°C) 75 85 TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 0.3 Preliminary Oct 19, 2006 6 G926 Global Mixed-mode Technology Inc. Package Information C E H L D θ 7 °(4X) A2 A A1 y e B SOP-8 Package Note: 1. Package body sizes exclude mold flash and gate burrs 2. Dimension L is measured in gage plane 3. Tolerance 0.10mm unless otherwise specified 4. Controlling dimension is millimeter converted inch dimensions are not necessarily exact. 5. Followed from JEDEC MS-012 MIN. DIMENSION IN MM NOM. MAX. MIN. DIMENSION IN INCH NOM. MAX. A A1 1.35 0.10 1.60 ----- 1.75 0.25 0.053 0.004 0.063 ----- 0.069 0.010 A2 B ----0.33 1.45 ----- ----0.51 ----0.013 0.057 ----- ----0.020 C 0.19 ----- 0.25 0.007 ----- 0.010 D E e 4.80 3.80 ----- --------1.27 5.00 4.00 ----- 0.189 0.150 ----- --------0.050 0.197 0.157 ----- H L y θ 5.80 0.40 ----- ------------- 6.20 1.27 0.10 0.228 0.016 ----- ------------- 0.244 0.050 0.004 0° ----- 8° 0° ----- 8° SYMBOL TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 0.3 Preliminary Oct 19, 2006 7 G926 Global Mixed-mode Technology Inc. D1 0.008TYP E1 E H L D θ 0.015x45º A2 A SEATING PLANE A1 0.004MAX. e B SOP-8 (FD) Package Note: 1. JEDEC Outline: MS-012 AA/E.P. Version: N/A 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs shall not exceed .15mm (.006in) per side. 3. Dimensions “E” does not include inter-lead flash, or protrusions inter-lead flash and protrusions shall not exceed .25mm (.010in) per side. SYMBOL DIMENSION IN MM MIN DIMENSION IN INCH MIN MAX MAX A 1.35 1.75 0.053 0.069 A1 A2 B D E 0.00 ----- 0.13 1.50 0.000 ----- 0.005 0.059 4.80 3.81 4.98 3.99 0.189 0.150 e H 5.80 6.20 0.228 0.244 0.41 1.27 0.016 0.050 0° --------- 8° 2.29 2.29 0° --------- 8° 0.090 0.090 L θ D1 E1 0.41TYP 0.016TYP 1.27TYP 0.196 0.157 0.05TYP Taping Specification PACKAGE Q’TY/REEL SOP-8 SOP-8 (FD) 2,500 ea 2,500 ea Feed Direction Typical SOP Package Orientation GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications. TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 0.3 Preliminary Oct 19, 2006 8