GSI GS832472C-133

Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
2M x 18, 1M x 36, 512K x 72
36Mb S/DCD Sync Burst SRAMs
119- and 209-Pin BGA
Commercial Temp
Industrial Temp
Features
• FT pin for user-configurable flow through or pipeline operation
• Single/Dual Cycle Deselect selectable (x36 and x72)
• Dual Cycle Deselect only (x18)
• IEEE 1149.1 JTAG-compatible Boundary Scan
• ZQ mode pin for user-selectable high/low output drive
• 2.5 V or 3.3 V +10%/–5% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to SCD x36/x72 Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 119- and 209-bump BGA package
Pipeline
3-1-1-1
3.3 V
2.5 V
Flow
Through
2-1-1-1
3.3 V
2.5 V
tKQ
tCycle
Curr (x18)
Curr (x36)
Curr (x72)
Curr (x18)
Curr (x36)
Curr (x72)
-250 -225 -200 -166 -150 -133 Unit
2.3 2.5 3.0 3.5 3.8 4.0 ns
4.0 4.4 5.0 6.0 6.6 7.5 ns
365
560
660
360
550
640
335
510
600
330
500
590
305
460
540
305
460
530
265
400
460
260
390
450
245
370
430
240
360
420
215
330
380
215
330
370
mA
mA
mA
mA
mA
mA
tKQ
tCycle
6.0
7.0
6.5
7.5
7.5
8.5
8.5
10
10
10
11
15
ns
ns
Curr (x18)
Curr (x36)
Curr (x72)
Curr (x18)
Curr (x36)
Curr (x72)
235
300
350
235
300
340
230
300
350
230
300
340
210
270
300
210
270
300
200
270
300
200
270
300
195
270
300
195
270
300
150
200
220
145
190
220
mA
mA
mA
mA
mA
mA
Functional Description
Applications
The GS832418/36/72 is a 37,748,736-bit high performance 2-die
synchronous SRAM module with a 2-bit burst address counter.
Although of a type originally developed for Level 2 Cache
applications supporting high performance CPUs, the device now
finds application in synchronous SRAM applications, ranging
from DSP main store to networking chip set support.
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV), and write control inputs (Bx, BW,
GW) are synchronous and are controlled by a positive-edgetriggered clock input (CK). Output enable (G) and power down
control (ZZ) are asynchronous inputs. Burst cycles can be initiated
Rev: 1.00 10/2001
250 MHz–133MHz
2.5 V or 3.3 V VDD
2.5 V or 3.3 V I/O
with either ADSP or ADSC inputs. In Burst mode, subsequent
burst addresses are generated internally and are controlled by
ADV. The burst address counter may be configured to count in
either linear or interleave order with the Linear Burst Order (LBO)
input. The Burst function need not be used. New addresses can be
loaded on every cycle with no degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by the
user via the FT mode . Holding the FT mode pin low places the
RAM in Flow Through mode, causing output data to bypass the
Data Output Register. Holding FT high places the RAM in
Pipeline mode, activating the rising-edge-triggered Data Output
Register.
SCD and DCD Pipelined Reads
The GS832436(B/C) and the GS832472(C) are SCD (Single
Cycle Deselect) and DCD (Dual Cycle Deselect) pipelined
synchronous SRAMs. The GS832418(B/C) is a DCD-only
SRAM. DCD SRAMs pipeline disable commands to the same
degree as read commands. SCD SRAMs pipeline deselect
commands one stage less than read commands. SCD RAMs begin
turning off their outputs immediately after the deselect command
has been captured in the input registers. DCD RAMs hold the
deselect command for one full cycle and then begin turning off
their outputs just after the second rising edge of clock. The user
may configure the x36 or x72 versions of this SRAM for either
mode of operation using the SCD mode input.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write control
inputs.
FLXDrive™
The ZQ pin allows selection between high drive strength (ZQ low)
for multi-drop bus applications and normal drive strength (ZQ
floating or high) point-to-point applications. See the Output Driver
Characteristics chart for details.
Sleep Mode
Low power (Sleep mode) is attained through the assertion (High)
of the ZZ signal, or by stopping the clock (CK). Memory data is
retained during Sleep mode.
Core and Interface Voltages
The GS832418/36/72 operates on a 2.5 V or 3.3 V power supply.
All input are 3.3 V and 2.5 V compatible. Separate output power
(VDDQ) pins are used to decouple output noise from the internal
circuits and are 3.3 V and 2.5 V compatible.
1/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ByteSafe is a Trademark of Giga Semiconductor, Inc. (GSI Technology).
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
GS832472B Pad Out
209-Bump BGA—Top View
1
2
3
4
5
6
7
8
9
10
11
A
DQG5
DQG1
A15
E2
ADSP
ADSC
ADV
E3
A17
DQB1
DQB5
A
B
DQG6
DQG2
BC
BG
NC
BW
A16
BB
BF
DQB2
DQB6
B
C
DQG7
DQG3
BH
BD
NC
E1
NC
BE
BA
DQB3
DQB7
C
D
DQG8
DQG4
VSS
NC
NC
G
GW
NC
VSS
DQB4
DQB8
D
E
DQPG9
DQPC9
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQPF9
DQPB9
E
F
DQC4
DQC8
VSS
VSS
VSS
ZQ
VSS
VSS
VSS
DQF8
DQF4
F
G
DQC3
DQC7
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
DQF7
DQF3
G
H
DQC2
DQC6
VSS
VSS
VSS
MCL
VSS
VSS
VSS
DQF6
DQF2
H
J
DQC1
DQC5
VDDQ
VDDQ
VDD
MCL
VDD
VDDQ
VDDQ
DQF5
DQF1
J
K
NC
NC
CK
NC
VSS
MCL
VSS
NC
NC
NC
NC
K
L
DQH1
DQH5
VDDQ
VDDQ
VDD
FT
VDD
VDDQ
VDDQ
DQA5
DQA1
L
M
DQH2
DQH6
VSS
VSS
VSS
MCL
VSS
VSS
VSS
DQA6
DQA2
M
N
DQH3
DQH7
VDDQ
VDDQ
VDD
SCD
VDD
VDDQ
VDDQ
DQA7
DQA3
N
P
DQH4
DQH8
VSS
VSS
VSS
ZZ
VSS
VSS
VSS
DQA8
DQA4
P
R
DQPD9
DQPH9
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQPA9
DQPE9
R
T
DQD8
DQD4
VSS
NC
NC
LBO
NC
NC
VSS
DQE4
DQE8
T
U
DQD7
DQD3
NC
A14
A13
A12
A11
A10
A18
DQE3
DQE7
U
V
DQD6
DQD2
A9
A8
A7
A1
A6
A5
A4
DQE2
DQE6
V
W
DQD5
DQD1
TMS
TDI
A3
A0
A2
TDO
TCK
DQE1
DQE5
W
11 x 19 Bump BGA—14 x 22 mm2 Body—1 mm Bump Pitch
Rev: 1.00 10/2001
2/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
GS832436C Pad Out
209-Bump BGA—Top View
1
2
3
4
5
6
7
8
9
10
11
A
NC
NC
A15
E2
ADSP
ADSC
ADV
E3
A17
DQB1
DQB5
A
B
NC
NC
BC
NC
A19
BW
A16
BB
NC
DQB2
DQB6
B
C
NC
NC
NC
BD
NC
E1
NC
NC
BA
DQB3
DQB7
C
D
NC
NC
VSS
NC
NC
G
GW
NC
VSS
DQB4
DQB8
D
E
NC
DQPC9
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
NC
DQPB9
E
F
DQC4
DQC8
VSS
VSS
VSS
ZQ
VSS
VSS
VSS
NC
NC
F
G
DQC3
DQC7
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
NC
NC
G
H
DQC2
DQC6
VSS
VSS
VSS
MCL
VSS
VSS
VSS
NC
NC
H
J
DQC1
DQC5
VDDQ
VDDQ
VDD
MCL
VDD
VDDQ
VDDQ
NC
NC
J
K
NC
NC
CK
NC
VSS
MCL
VSS
NC
NC
NC
NC
K
L
NC
NC
VDDQ
VDDQ
VDD
FT
VDD
VDDQ
VDDQ
DQA5
DQA1
L
M
NC
NC
VSS
VSS
VSS
MCL
VSS
VSS
VSS
DQA6
DQA2
M
N
NC
NC
VDDQ
VDDQ
VDD
SCD
VDD
VDDQ
VDDQ
DQA7
DQA3
N
P
NC
NC
VSS
VSS
VSS
ZZ
VSS
VSS
VSS
DQA8
DQA4
P
R
DQPD9
NC
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQPA9
NC
R
T
DQD8
DQD4
VSS
NC
NC
LBO
NC
NC
VSS
NC
NC
T
U
DQD7
DQD3
NC
A14
A13
A12
A11
A10
A18
NC
NC
U
V
DQD6
DQD2
A9
A8
A7
A1
A6
A5
A4
NC
NC
V
W
DQD5
DQD1
TMS
TDI
A3
A0
A2
TDO
TCK
NC
NC
W
11 x 19 Bump BGA—14 x 22 mm2 Body—1 mm Bump Pitch
Rev: 1.00 10/2001
3/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
GS832418C Pad Out
209-Bump BGA—Top View
1
2
3
4
5
6
7
8
9
10
11
A
NC
NC
A15
MCH
ADSP
ADSC
ADV
MCL
A17
NC
NC
A
B
NC
NC
BB
NC
A19
BW
A16
NC
NC
NC
NC
B
C
NC
NC
NC
NC
NC
E1
A20
NC
BA
NC
NC
C
D
NC
NC
VSS
NC
NC
G
GW
NC
VSS
NC
NC
D
E
NC
DQPB9
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
NC
NC
E
F
DQB4
DQB8
VSS
VSS
VSS
ZQ
VSS
VSS
VSS
NC
NC
F
G
DQB3
DQB7
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
NC
NC
G
H
DQB2
DQB6
VSS
VSS
VSS
MCL
VSS
VSS
VSS
NC
NC
H
J
DQB1
DQB5
VDDQ
VDDQ
VDD
MCL
VDD
VDDQ
VDDQ
NC
NC
J
K
NC
NC
CK
NC
VSS
MCL
VSS
NC
NC
NC
NC
K
L
NC
NC
VDDQ
VDDQ
VDD
FT
VDD
VDDQ
VDDQ
DQA5
DQA1
L
M
NC
NC
VSS
VSS
VSS
MCL
VSS
VSS
VSS
DQA6
DQA2
M
N
NC
NC
VDDQ
VDDQ
VDD
MCL
VDD
VDDQ
VDDQ
DQA7
DQA3
N
P
NC
NC
VSS
VSS
VSS
ZZ
VSS
VSS
VSS
DQA8
DQA4
P
R
NC
NC
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQPA9
NC
R
T
NC
NC
VSS
NC
NC
LBO
NC
NC
VSS
NC
NC
T
U
NC
NC
NC
A14
A13
A12
A11
A10
A18
NC
NC
U
V
NC
NC
A9
A8
A7
A1
A6
A5
A4
NC
NC
V
W
NC
NC
TMS
TDI
A3
A0
A2
TDO
TCK
NC
NC
W
11 x 19 Bump BGA—14 x 22 mm2 Body—1 mm Bump Pitch
Rev: 1.00 10/2001
4/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
GS832418/36/72 209-Bump BGA Pin Description
Pin Location
Symbol
Type
Description
W6, V6
A0, A1
I
Address field LSBs and Address Counter Preset Inputs.
W7, W5, V9, V8, V7, V5, V4, V3, U8, U7, U6,
U5, U4, A3, B7, A9, U9
An
I
Address Inputs
B5
A19
I
Address Inputs (x36/x18 Versions)
C7
A20
I
Address Inputs (x18 Version)
L11, M11, N11, P11, L10, M10, N10, P10, R10
A10, B10, C10, D10, A11, B11, C11, D11, E11
J1, H1, G1, F1, J2, H2, G2, F2, E2
W2, V2, U2, T2, W1, V1, U1, T1, R1
W10, V10, U10, T10, W11, V11, U11, T11, R11
J11, H11, G11, F11, J10, H10, G10, F10, E10
A2, B2, C2, D2, A1, B1, C1, D1, E1
L1, M1, N1, P1, L2, M2, N2, P2, R2
DQA1–DQA9
DQB1–DQB9
DQC1–DQC9
DQD1–DQD9
DQE1–DQE9
DQF1–DQF9
DQG1–DQG9
DQH1–DQH9
I/O
Data Input and Output pins (x72 Version)
L11, M11, N11, P11, L10, M10, N10, P10, R10
A10, B10, C10, D10, A11, B11, C11, D11, E11
J1, H1, G1, F1, J2, H2, G2, F2, E2
W2, V2, U2, T2, W1, V1, U1, T1, R1
DQA1–DQA9
DQB1–DQB9
DQC1–DQC9
DQD1–DQD9
I/O
Data Input and Output pins (x36 Version)
L11, M11, N11, P11, L10, M10, N10, P10, R10
J1, H1, G1, F1, J2, H2, G2, F2, E2
DQA1–DQA9
DQB1–DQB9
I/O
Data Input and Output pins (x18 Version)
C9, B8
BA, BB
I
Byte Write Enable for DQA, DQB I/Os; active low
B3, C4
BC,BD
I
Byte Write Enable for DQC, DQD I/Os; active low
(x72/x36 Versions)
C8, B9, B4, C3
BE, BF, BG,BH
I
Byte Write Enable for DQE, DQF, DQG, DQH I/Os; active low
(x72 Version)
B5
NC
—
No Connect (x72 Version)
C7
NC
—
No Connect (x72/x36 Versions)
W10, V10, U10, T10, W11, V11, U11, T11, R11
J11, H11, G11, F11, J10, H10, G10, F10, E10
A2, B2, C2, D2, A1, B1, C1, D1, E1
L1, M1, N1, P1, L2, M2, N2, P2, R2, C8, B9,
B4, C3
NC
—
No Connect (x36/x18 Versions)
B3, C4
NC
—
No Connect (x18 Version)
C5, D4, D5, D8, K1, K2, K4, K8, K9, K10, K11,
T4, T5, T7, T8, U3
NC
—
No Connect
K3
CK
I
Clock Input Signal; active high
D7
GW
I
Global Write Enable—Writes all bytes; active low
C6
E1
I
Chip Enable; active low
A8
E3
I
Chip Enable; active low (x72/x36 Versions)
A4
E2
I
Chip Enable; active high (x72/x36 Versions)
Rev: 1.00 10/2001
5/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
GS832418/36/72 209-Bump BGA Pin Description
Pin Location
Symbol
Type
Description
D6
G
I
Output Enable; active low
A7
ADV
I
Burst address counter advance enable; active low
A5, A6
ADSP, ADSC
I
Address Strobe (Processor, Cache Controller); active low
P6
ZZ
I
Sleep Mode control; active high
L6
FT
I
Flow Through or Pipeline mode; active low
T6
LBO
I
Linear Burst Order mode; active low
N6
SCD
I
Single Cycle Deselect/Dual Cycle Deselect Mode Control (
x72/x36 Versions)
G6
MCH
I
Must Connect High
A4
MCH
I
Must Connect High (x18 version)
H6, J6, K6, M6
MCL
Must Connect Low
A8, N6
MCL
Must Connect Low (x18 version)
B6
BW
I
Byte Enable; active low
F6
ZQ
I
FLXDrive Output Impedance Control
(Low = Low Impedance [High Drive], High = High Impedance [Low
Drive])
W3
TMS
I
Scan Test Mode Select
W4
TDI
I
Scan Test Data In
W8
TDO
O
Scan Test Data Out
W9
TCK
I
Scan Test Clock
E5, E6, E7, G5, G7, J5, J7, L5, L7, N5, N7, R5,
R6, R7
VDD
I
Core power supply
D3, D9, F3, F4, F5, F7, F8, F9, H3, H4, H5, H7,
H8, H9, K5, K7, M3, M4, M5, M7, M8, M9, P3,
P4, P5, P7, P8, P9, T3, T9
VSS
I
I/O and Core Ground
E3, E4, E8, E9, G3, G4, G8, G9, J3, J4, J8, J9,
L3, L4, L8, L9, N3, N4, N8, N9, R3, R4, R8, R9
VDDQ
I
Output driver power supply
Rev: 1.00 10/2001
6/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
GS832436B Pad Out
119-Bump BGA—Top View
1
2
3
4
5
6
7
A
VDDQ
A6
A7
ADSP
A8
A9
VDDQ
A
B
NC
A18
A4
ADSC
A15
A17
NC
B
C
NC
A5
A3
VDD
A14
A16
NC
C
D
DQC4
DQPC9
VSS
ZQ
VSS
DQPB9
DQB4
D
E
DQC3
DQC8
VSS
E1
VSS
DQB8
DQB3
E
F
VDDQ
DQC7
VSS
G
VSS
DQB7
VDDQ
F
G
DQC2
DQC6
BC
ADV
BB
DQB6
DQB2
G
H
DQC1
DQC5
VSS
GW
VSS
DQB5
DQB1
H
J
VDDQ
VDD
NC
VDD
NC
VDD
VDDQ
J
K
DQD1
DQD5
VSS
CK
VSS
DQA5
DQA4
K
L
DQD2
DQD6
BD
SCD
BA
DQA6
DQA3
L
M
VDDQ
DQD7
VSS
BW
VSS
DQA7
VDDQ
M
N
DQD3
DQD8
VSS
A1
VSS
DQA8
DQA2
N
P
DQD4
DQPD9
VSS
A0
VSS
DQPA9
DQA1
P
R
NC
A2
LBO
VDD
FT
A13
NC
R
T
NC
NC
A10
A11
A12
A19
ZZ
T
U
VDDQ
TMS
TDI
TCK
TDO
NC
VDDQ
U
7 x 17 Bump BGA—14 x 22 mm2 Body—1.27 mm Bump Pitch
Rev: 1.00 10/2001
7/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
GS832418B Pad Out
119-Bump BGA—Top View
1
2
3
4
5
6
7
A
VDDQ
A6
A7
ADSP
A8
A9
VDDQ
A
B
NC
A18
A4
ADSC
A15
A17
NC
B
C
NC
A5
A3
VDD
A14
A16
NC
C
D
DQB1
NC
VSS
ZQ
VSS
DQPA9
NC
D
E
NC
DQB2
VSS
E1
VSS
NC
DQA8
E
F
VDDQ
NC
VSS
G
VSS
DQA7
VDDQ
F
G
NC
DQB3
BB
ADV
NC
NC
DQA6
G
H
DQB4
NC
VSS
GW
VSS
DQA5
NC
H
J
VDDQ
VDD
NC
VDD
NC
VDD
VDDQ
J
K
NC
DQB5
VSS
CK
VSS
NC
DQA4
K
L
DQB6
NC
NC
VSS
BA
DQA3
NC
L
M
VDDQ
DQB7
VSS
BW
VSS
NC
VDDQ
M
N
DQB8
NC
VSS
A1
VSS
DQA2
NC
N
P
NC
DQPB9
VSS
A0
VSS
NC
DQA1
P
R
NC
A2
LBO
VDD
FT
A13
NC
R
T
NC
A10
A11
A20
A12
A19
ZZ
T
U
VDDQ
TMS
TDI
TCK
TDO
NC
VDDQ
U
7 x 17 Bump BGA—14 x 22 mm2 Body—1.27 mm Bump Pitch
Rev: 1.00 10/2001
8/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
GS832418/36 119-Bump BGA Pin Description
Pin Location
Symbol
Type
Description
P4, N4
A0, A1
I
Address field LSBs and Address Counter Preset Inputs
R2, C3, B3, C2, A2, A3, A5, A6, T3,
T5, R6, C5, B5, C6, B6, B2
An
I
Address Inputs
T4, T6
An
T2
NC
—
No Connect (x36 Version)
T2, T6, T4
An
I
Address Input (x18 Version)
K7, L7, N7, P7, K6, L6, M6, N6
H7, G7, E7, D7, H6, G6, F6, E6
H1, G1, E1, D1, H2, G2, F2, E2
K1, L1, N1, P1, K2, L2, M2, N2
DQA1–DQA8
DQB1–DQB8
DQC1–DQC8
DQD1–DQD8
I/O
Data Input and Output pins. (x36 Version)
P6, D6, D2, P2
DQA9, DQB9,
DQC9, DQD9
I/O
Data Input and Output pins. (x36 Version)
L5, G5, G3, L3
BA, BB, BC, BD
I
Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low (x36 Version)
P7, N6, L6, K7, H6, G7, F6, E7, D6
D1, E2, G2, H1, K2, L1, M2, N1, P2
DQA1–DQA9
DQB1–DQB9
I/O
Data Input and Output pins (x18 Version)
L5, G3
BA, BB
I
Byte Write Enable for DQA, DQB I/Os; active low (x18 Version)
B1, C1, R1, T1, U6, B7, C7, J3, J5,
R7
NC
—
No Connect
P6, N7, M6, L7, K6, H7, G6, E6, D7,
D2, E1, F2, G1, H2, K1, L2, N2, P1,
G5, L3
NC
—
No Connect (x18 Version)
K4
CK
I
Clock Input Signal; active high
M4
BW
I
Byte Write—Writes all enabled bytes; active low
H4
GW
I
Global Write Enable—Writes all bytes; active low
E4
E1
I
Chip Enable; active low
F4
G
I
Output Enable; active low
G4
ADV
I
Burst address counter advance enable; active low
A4, B4
ADSP, ADSC
I
Address Strobe (Processor, Cache Controller); active low
T7
ZZ
I
Sleep mode control; active high
R5
FT
I
Flow Through or Pipeline mode; active low
R3
LBO
I
Linear Burst Order mode; active low
D4
ZQ
I
FLXDrive Output Impedance Control (Low = Low Impedance [High Drive],
High = High Impedance [Low Drive])
L4
SCD
I
Single Cycle Deselect/Dual Cyle Deselect Mode Control (x36 version)
U2
TMS
I
Scan Test Mode Select
Rev: 1.00 10/2001
Address Input (x36 Version)
9/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
GS832418/36 119-Bump BGA Pin Description
Pin Location
Symbol
Type
Description
U3
TDI
I
Scan Test Data In
U5
TDO
O
Scan Test Data Out
U4
TCK
I
Scan Test Clock
J2, C4, J4, R4, J6
VDD
I
Core power supply
D3, E3, F3, H3, K3, M3, N3, P3, D5,
E5, F5, H5, K5, M5, N5, P5
VSS
I
I/O and Core Ground
L4
VSS
I
I/O and Core Ground
A1, F1, J1, M1, U1, A7, F7, J7, M7,
U7
VDDQ
I
Output driver power supply
Rev: 1.00 10/2001
10/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
GS832418/36/72 Block Diagram
Register
A0–An
D
Q
A0
A0
D0
Q0
A1
A1
D1
Q1
Counter
Load
A
LBO
ADV
Memory
Array
CK
ADSC
ADSP
Q
D
Register
GW
BW
BA
D
Q
36
36
Register
D
Q
BB
4
Register
D
Q
D
Q
D
Q
Register
Register
D
Q
Register
BC
BD
Register
D
36
Q
36
Register
E1
D
Q
36
Register
D
Q
FT
G
ZZ
36
Power Down
SCD
DQx0–DQx9
Control
Note: Only x36 version shown for simplicity.
Rev: 1.00 10/2001
11/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
GS832418 Die Layout
TDI
Inputs
Die A
x18
16Mb
TDO
TDI
Die B
x18
16Mb
TDO
18 I/Os
GS832436 Die Layout
TDI
Inputs
Die A
x18
16Mb
TDO
TDI
18 I/Os
Inputs
Die A
x36
32Mb
TDO
TDI
36 I/Os
Rev: 1.00 10/2001
TDO
18 I/Os
GS832472 Die Layout
TDI
Die B
x18
16Mb
Die B
x36
32Mb
TDO
36 I/Os
12/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Mode Pin Functions
Mode Name
Pin
Name
Burst Order Control
LBO
Output Register Control
FT
Power Down Control
ZZ
Single/Dual Cycle Deselect Control
SCD
FLXDrive Output Impedance Control
ZQ
State
Function
L
Linear Burst
H
Interleaved Burst
L
Flow Through
H or NC
Pipeline
L or NC
Active
H
Standby, IDD = ISB
L
Dual Cycle Deselect
H or NC
Single Cycle Deselect
L
High Drive (Low Impedance)
H or NC
Low Drive (High Impedance)
Note:
There are pull-up devices on the ZQ, SCD and FT pins and a pull-down device on the ZZ pin, so those input pins can be unconnected and the
chip will operate in the default states as specified in the above tables.
Enable / Disable Parity I/O Pins
This SRAM allows the user to configure the device to operate in Parity I/O active (x18, x36, or x72) or in Parity I/O inactive (x16,
x32, or x64) mode. Holding the PE bump low or letting it float will activate the 9th I/O on each byte of the RAM. Grounding PE
deactivates the 9th I/O of each byte, although the bit in each byte of the memory array remains active to store and recall parity bits
generated and read into the ByteSafe parity circuits.
Burst Counter Sequences
Interleaved Burst Sequence
Linear Burst Sequence
A[1:0] A[1:0] A[1:0] A[1:0]
A[1:0] A[1:0] A[1:0] A[1:0]
1st address
00
01
10
11
1st address
00
01
10
11
2nd address
01
10
11
00
2nd address
01
00
11
10
3rd address
10
11
00
01
3rd address
10
11
00
01
4th address
11
00
01
10
4th address
11
10
01
00
Note: The burst counter wraps to initial state on the 5th clock.
Note: The burst counter wraps to initial state on the 5th clock.
BPR 1999.05.18
Rev: 1.00 10/2001
13/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Byte Write Truth Table
Function
GW
BW
BA
BB
BC
BD
Notes
Read
H
H
X
X
X
X
1
Read
H
L
H
H
H
H
1
Write byte a
H
L
L
H
H
H
2, 3
Write byte b
H
L
H
L
H
H
2, 3
Write byte c
H
L
H
H
L
H
2, 3, 4
Write byte d
H
L
H
H
H
L
2, 3, 4
Write all bytes
H
L
L
L
L
L
2, 3, 4
Write all bytes
L
X
X
X
X
X
Notes:
1. All byte outputs are active in read cycles regardless of the state of Byte Write Enable inputs.
2. Byte Write Enable inputs BA, BB, BC, and/or BD may be used in any combination with BW to write single or multiple bytes.
3. All byte I/Os remain High-Z during all write operations regardless of the state of Byte Write Enable inputs.
4. Bytes “C” and “D” are only available on the x36 version.
Rev: 1.00 10/2001
14/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Synchronous Truth Table (x72 and x36 209-Bump BGA)
Operation
State
Address Used Diagram
Key5
E1
E2
ADSP
ADSC
ADV
W3
DQ4
Deselect Cycle, Power Down
None
X
H
X
X
L
X
X
High-Z
Deselect Cycle, Power Down
None
X
L
F
L
X
X
X
High-Z
Deselect Cycle, Power Down
None
X
L
F
H
L
X
X
High-Z
Read Cycle, Begin Burst
External
R
L
T
L
X
X
X
Q
Read Cycle, Begin Burst
External
R
L
T
H
L
X
F
Q
Write Cycle, Begin Burst
External
W
L
T
H
L
X
T
D
Read Cycle, Continue Burst
Next
CR
X
X
H
H
L
F
Q
Read Cycle, Continue Burst
Next
CR
H
X
X
H
L
F
Q
Write Cycle, Continue Burst
Next
CW
X
X
H
H
L
T
D
Write Cycle, Continue Burst
Next
CW
H
X
X
H
L
T
D
Read Cycle, Suspend Burst
Current
X
X
H
H
H
F
Q
Read Cycle, Suspend Burst
Current
H
X
X
H
H
F
Q
Write Cycle, Suspend Burst
Current
X
X
H
H
H
T
D
Write Cycle, Suspend Burst
Current
H
X
X
H
H
T
D
Note:
1. X = Don’t Care, H = High, L = Low.
2. E = T (True) if E2 = 1 and E3 = 0; E = F (False) if E2 = 0 or E3 = 1.
3. W = T (True) and F (False) is defined in the Byte Write Truth Table preceding.
4. G is an asynchronous input. G can be driven high at any time to disable active output drivers. G low can only enable active drivers (shown
as “Q” in the Truth Table above).
5.
6.
7.
All input combinations shown above are tested and supported. Input combinations shown in gray boxes need not be used to accomplish
basic synchronous or synchronous burst operations and may be avoided for simplicity.
Tying ADSP high and ADSC low allows simple non-burst synchronous operations. See BOLD items above.
Tying ADSP high and ADV low while using ADSC to load new addresses allows simple burst operations. See ITALIC items above.
Rev: 1.00 10/2001
15/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Synchronous Truth Table (x18 209-Bump BGA and x36/x18 119-Bump BGA)
State
Operation
Address Used Diagram
E1
ADSP ADSC
5
Key
ADV
W3
DQ4
Deselect Cycle, Power Down
None
X
H
X
L
X
X
High-Z
Read Cycle, Begin Burst
External
R
L
L
X
X
X
Q
Read Cycle, Begin Burst
External
R
L
H
L
X
F
Q
Write Cycle, Begin Burst
External
W
L
H
L
X
T
D
Read Cycle, Continue Burst
Next
CR
X
H
H
L
F
Q
Read Cycle, Continue Burst
Next
CR
H
X
H
L
F
Q
Write Cycle, Continue Burst
Next
CW
X
H
H
L
T
D
Write Cycle, Continue Burst
Next
CW
H
X
H
L
T
D
Read Cycle, Suspend Burst
Current
X
H
H
H
F
Q
Read Cycle, Suspend Burst
Current
H
X
H
H
F
Q
Write Cycle, Suspend Burst
Current
X
H
H
H
T
D
Write Cycle, Suspend Burst
Current
H
X
H
H
T
D
Notes:
1. X = Don’t Care, H = High, L = Low
2. W = T (True) and F (False) is defined in the Byte Write Truth Table preceding
3. G is an asynchronous input. G can be driven high at any time to disable active output drivers. G low can only enable active drivers (shown
as “Q” in the Truth Table above).
4. All input combinations shown above are tested and supported. Input combinations shown in gray boxes need not be used to accomplish
basic synchronous or synchronous burst operations and may be avoided for simplicity.
5. Tying ADSP high and ADSC low allows simple non-burst synchronous operations. See BOLD items above.
6. Tying ADSP high and ADV low while using ADSC to load new addresses allows simple burst operations. See ITALIC items above.
Rev: 1.00 10/2001
16/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Simplified State Diagram
X
Deselect
W
R
Simple Burst Synchronous Operation
Simple Synchronous Operation
W
X
R
R
First Write
CW
First Read
CR
W
X
CR
R
R
X
Burst Write
Burst Read
X
CR
CW
CR
Notes:
1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low.
2. The upper portion of the diagram assumes active use of only the Enable (E1) and Write (BA, BB, BC, BD, BW, and GW) control inputs, and
that ADSP is tied high and ADSC is tied low.
3. The upper and lower portions of the diagram together assume active use of only the Enable, Write, and ADSC control inputs and
assumes ADSP is tied high and ADV is tied low.
Rev: 1.00 10/2001
17/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Simplified State Diagram with G
X
Deselect
W
R
W
X
R
R
First Write
CR
CW
W
CW
W
X
First Read
X
CR
R
Burst Write
R
CR
CW
W
Burst Read
X
CW
CR
Notes:
1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use of G.
2. Use of “Dummy Reads” (Read Cycles with G High) may be used to make the transition from read cycles to write cycles without passing
through a Deselect cycle. Dummy Read cycles increment the address counter just like normal read cycles.
3. Transitions shown in grey tone assume G has been pulsed high long enough to turn the RAM’s drivers off and for incoming data to meet
Data Input Set Up Time.
Rev: 1.00 10/2001
18/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Absolute Maximum Ratings
(All voltages reference to VSS)
Symbol
Description
Value
Unit
VDD
Voltage on VDD Pins
–0.5 to 4.6
V
VDDQ
Voltage in VDDQ Pins
–0.5 to 4.6
V
VCK
Voltage on Clock Input Pin
–0.5 to 6
V
VI/O
Voltage on I/O Pins
–0.5 to VDDQ +0.5 (≤ 4.6 V max.)
V
VIN
Voltage on Other Input Pins
–0.5 to VDD +0.5 (≤ 4.6 V max.)
V
IIN
Input Current on Any Pin
+/–20
mA
IOUT
Output Current on Any I/O Pin
+/–20
mA
PD
Package Power Dissipation
1.5
W
TSTG
Storage Temperature
–55 to 125
o
TBIAS
Temperature Under Bias
–55 to 125
oC
C
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of
this component.
Rev: 1.00 10/2001
19/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Power Supply Voltage Ranges
Parameter
Symbol
Min.
Typ.
Max.
Unit
3.3 V Supply Voltage
VDD3
3.0
3.3
3.6
V
2.5 V Supply Voltage
VDD2
2.3
2.5
2.7
V
3.3 V VDDQ I/O Supply Voltage
VDDQ3
3.0
3.3
3.6
V
2.5 V VDDQ I/O Supply Voltage
VDDQ2
2.4
2.5
2.7
V
Notes
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are
evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
VDDQ3 Range Logic Levels
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
VDD Input High Voltage
VIH
1.7
—
VDD + 0.3
V
1
VDD Input Low Voltage
VIL
–0.3
—
0.8
V
1
VDDQ I/O Input High Voltage
VIHQ
1.7
—
VDDQ + 0.3
V
1,3
VDDQ I/O Input Low Voltage
VILQ
–0.3
—
0.8
V
1,3
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are
evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V.
VDDQ2 Range Logic Levels
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
VDD Input High Voltage
VIH
0.6*VDD
—
VDD + 0.3
V
1
VDD Input Low Voltage
VIL
–0.3
—
0.3*VDD
V
1
VDDQ I/O Input High Voltage
VIHQ
0.6*VDD
—
VDDQ + 0.3
V
1,3
VDDQ I/O Input Low Voltage
VILQ
–0.3
—
0.3*VDD
V
1,3
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are
evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V.
Rev: 1.00 10/2001
20/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Recommended Operating Temperatures
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
Ambient Temperature (Commercial Range Versions)
TA
0
25
70
°C
2
Ambient Temperature (Industrial Range Versions)
TA
–40
25
85
°C
2
Note:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are
evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
Undershoot Measurement and Timing
Overshoot Measurement and Timing
VIH
20% tKC
VDD + 2.0 V
VSS
50%
50%
VDD
VSS – 2.0 V
20% tKC
VIL
Capacitance
(TA = 25oC, f = 1 MHZ, VDD = 2.5 V)
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
Input Capacitance
CIN
VIN = 0 V
6.5
7.5
pF
Input/Output Capacitance (x36/x72)
CI/O
VOUT = 0 V
6
7
pF
Input/Output Capacitance (x18)
CI/O
VOUT = 0 V
8.5
9.5
pF
Note: These parameters are sample tested.
Package Thermal Characteristics
Rating
Layer Board
Symbol
Max
Unit
Notes
Junction to Ambient (at 200 lfm)
single
RΘJA
40
°C/W
1,2
Junction to Ambient (at 200 lfm)
four
RΘJA
24
°C/W
1,2
Junction to Case (TOP)
—
RΘJC
9
°C/W
3
Notes:
1. Junction temperature is a function of SRAM power dissipation, package thermal resistance, mounting board temperature, ambient. Temperature air flow, board density, and PCB thermal resistance.
2. SCMI G-38-87
3. Average thermal resistance between die and top surface, MIL SPEC-883, Method 1012.1
Rev: 1.00 10/2001
21/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
AC Test Conditions
Parameter
Conditions
Input high level
2.3 V
Input low level
0.2 V
Input slew rate
1 V/ns
Input reference level
1.25 V
Output reference level
1.25 V
Output load
Fig. 1& 2
Notes:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig.
1 unless otherwise noted.
3. Output Load 2 for tLZ, tHZ, tOLZ and tOHZ
4. Device is deselected as defined by the Truth Table.
Output Load 2
Output Load 1
DQ
2.5 V
50Ω
225Ω
DQ
30pF*
5pF*
VT = 1.25 V
225Ω
* Distributed Test Jig Capacitance
DC Electrical Characteristics
Parameter
Symbol
Test Conditions
Min
Max
Input Leakage Current
(except mode pins)
IIL
VIN = 0 to VDD
–2 uA
2 uA
ZZ and PE Input Current
IIN1
VDD ≥ VIN ≥ VIH
0 V ≤ VIN ≤ VIH
–1 uA
–1 uA
1 uA
100 uA
FT, SCD, ZQ, DP Input Current
IIN2
VDD ≥ VIN ≥ VIL
0 V ≤ VIN ≤ VIL
–100 uA
–1 uA
1 uA
1 uA
Output Leakage Current (x36/x72)
IOL
Output Disable, VOUT = 0 to VDD
–1 uA
1 uA
Output Leakage Current (x18)
IOL
Output Disable, VOUT = 0 to VDD
–2 uA
2 uA
Output High Voltage
VOH2
IOH = –8 mA, VDDQ = 2.375 V
1.7 V
—
Output High Voltage
VOH3
IOH = –8 mA, VDDQ = 3.135 V
2.4 V
—
Output Low Voltage
VOL
IOL = 8 mA
—
0.4 V
Rev: 1.00 10/2001
22/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Rev: 1.00 10/2001
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
23/46
—
Device Deselected;
All other inputs
≥ VIH or ≤ VIL
Deselect
Current
310
30
520
30
280
20
345
15
200
10
40
IDD
IDDQ
IDD
IDDQ
IDD
IDDQ
IDD
IDDQ
ISB
Pipeline
Flow
Through
Pipeline
Flow
Through
Pipeline
IDD
120
170
IDD
Pipeline
Flow
Through
40
ISB
Flow
Through
Flow
Through
IDD
IDDQ
200
10
345
20
280
20
580
60
IDD
IDDQ
IDD
IDDQ
IDD
IDDQ
IDD
IDDQ
IDD
520
40
310
40
IDD
IDDQ
580
80
0
to
70°C
IDD
IDDQ
Symbol
IDDQ
Pipeline
Flow
Through
Pipeline
Flow
Through
Pipeline
Flow
Through
Pipeline
Mode
130
180
60
60
215
10
360
15
300
20
540
30
330
30
600
60
215
10
360
20
300
20
540
40
330
40
560
80
–40
to
85°C
-250
120
160
40
40
200
10
315
15
280
20
470
30
310
30
530
60
200
10
315
20
280
20
470
40
340
40
530
70
130
170
60
60
215
10
330
15
300
20
490
30
330
30
550
60
215
10
330
20
300
20
490
40
330
40
550
70
–40
to
85°C
-225
0
to
70°C
Notes:
1. IDD and IDDQ apply to any combination of VDD3, VDD2, VDDQ3, and VDDQ2 operation.
2. All parameters listed are worst case scenario.
—
ZZ ≥ VDD – 0.2 V
(x18)
(x36)
(x72)
(x18)
(x36)
(x72)
Standby
Current
2.5 V
Operating
Current
Device Selected;
All other inputs
≥VIH or ≤ VIL
Output open
Device Selected;
All other inputs
≥VIH or ≤ VIL
Output open
Operating
Current
3.3 V
Test Conditions
Parameter
Operating Currents
100
150
40
40
175
10
290
15
250
20
430
30
270
30
480
50
175
10
290
15
250
20
430
30
270
30
480
60
0
to
70°C
110
160
60
60
190
10
305
15
270
20
450
30
290
30
500
50
190
10
305
15
270
20
450
30
290
30
500
60
–40
to
85°C
-200
100
130
40
40
175
10
250
10
250
20
370
20
270
30
410
40
175
10
250
15
350
20
370
30
270
30
410
50
0
to
70°C
110
140
60
60
190
10
265
10
270
20
390
20
290
30
430
40
190
10
265
15
270
20
390
30
290
30
430
50
–40
to
85°C
-166
100
120
40
40
175
10
230
10
250
20
340
20
270
30
380
40
175
10
230
15
250
20
340
30
270
30
380
50
0
to
70°C
110
130
60
60
190
10
245
10
270
20
360
20
290
30
400
40
190
10
245
15
270
20
360
30
290
30
400
50
–40
to
85°C
-150
90
100
40
40
135
5
205
10
180
10
310
20
200
20
340
30
135
10
205
10
180
20
310
20
200
20
340
40
0
to
70°C
100
110
60
60
150
5
220
10
200
10
330
20
220
20
360
30
150
10
220
10
200
20
330
20
220
20
360
40
–40
to
85°C
-133
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
Unit
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
AC Electrical Characteristics
Pipeline
Flow
Through
Parameter
Symbol
Clock Cycle Time
-250
-225
-200
-166
-150
-133
Unit
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
tKC
4.0
—
4.4
—
5.0
—
6.0
—
6.7
—
7.5
—
ns
Clock to Output Valid
tKQ
—
2.3
—
2.5
—
3.0
—
3.4
—
3.8
—
4.0
ns
Clock to Output Invalid
tKQX
1.5
—
1.5
—
1.5
—
1.5
—
1.5
—
1.5
—
ns
Clock to Output in Low-Z
tLZ
1
1.5
—
1.5
—
1.5
—
1.5
—
1.5
—
1.5
—
ns
Clock Cycle Time
tKC
7.0
—
7.5
—
8.5
—
10.0
—
10.0
—
15.0
—
ns
Clock to Output Valid
tKQ
—
6.0
—
6.0
—
7.5
—
8.5
—
10.0
—
10.0
ns
Clock to Output Invalid
tKQX
3.0
—
3.0
—
3.0
—
3.0
—
3.0
—
3.0
—
ns
Clock to Output in Low-Z
tLZ1
3.0
—
3.0
—
3.0
—
3.0
—
3.0
—
3.0
—
ns
Clock HIGH Time
tKH
1.3
—
1.3
—
1.3
—
1.3
—
1.5
—
1.7
—
ns
Clock LOW Time
tKL
1.5
—
1.5
—
1.5
—
1.5
—
1.7
—
2
—
ns
Clock to Output in
High-Z
tHZ1
1.5
2.3
1.5
2.5
1.5
3.0
1.5
3.5
1.5
3.8
1.5
4.0
ns
G to Output Valid
tOE
—
2.3
—
2.5
—
3.2
—
3.5
—
3.8
—
4.0
ns
G to output in Low-Z
tOLZ1
0
—
0
—
0
—
0
—
0
—
0
—
ns
G to output in High-Z
tOHZ1
—
2.3
—
2.5
—
3.0
—
3.5
—
3.8
—
4.0
ns
Setup time
tS
1.5
—
1.5
—
1.5
—
1.5
—
1.5
—
1.5
—
ns
Hold time
tH
0.5
—
0.5
—
0.5
—
0.5
—
0.5
—
0.5
—
ns
ZZ setup time
tZZS2
5
—
5
—
5
—
5
—
5
—
5
—
ns
ZZ hold time
tZZH2
1
—
1
—
1
—
1
—
1
—
1
—
ns
ZZ recovery
tZZR
100
—
100
—
100
—
100
—
100
—
100
—
ns
Notes:
1. These parameters are sampled and are not 100% tested.
2. ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold
times as specified above.
Rev: 1.00 10/2001
24/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Write Cycle Timing
Single Write
Burst Write
Deselected
Write
CK
tS tH
tKH tKL
tKC
ADSP is blocked by E inactive
ADSP
tS tH
ADSC initiated write
ADSC
tS tH
ADV
tS tH
A0–An
ADV must be inactive for ADSP Write
WR2
WR1
WR3
tS tH
GW
tS
tH
BW
tS tH
BA–BD
WR2
WR1
WR1
tS tH
WR3
WR3
E1 masks ADSP
E1
E1 only sampled with ADSP or ADSC
G
tS tH
DQA–DQD
Rev: 1.00 10/2001
Hi-Z
Write specified byte for 2A and all bytes for 2B, 2C& 2D
D1A
D2A
D2B
D2C
D2D
25/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
D3A
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Flow Through Read Cycle Timing
Single Read
Burst Read
tKL
CK
tKH
tS tH
tKC
ADSP is blocked by E inactive
ADSP
tS tH
ADSC initiated read
ADSC
tS tH
Suspend Burst
Suspend Burst
ADV
tS tH
A0–An
RD1
RD2
RD3
tS
tH
tS
tH
GW
BW
BA–BD
tS tH
E1 masks ADSP
E1
tOE
tOHZ
G
tKQX
tOLZ
DQA–DQD
Q1A
Hi-Z
Q2A
tKQX
Q2B
Q2c
Q2D
Q3A
tLZ
tHZ
tKQ
Rev: 1.00 10/2001
26/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Flow Through Read-Write Cycle Timing
Single Write
Single Read
Burst Read
CK
tS tH
tKH tKL
tKC
ADSP is blocked by E inactive
ADSP
tS tH
ADSC initiated read
ADSC
tS tH
ADV
tS tH
A0–An
WR1
RD1
tS
RD2
tH
GW
tH
tS
BW
tS tH
BA–BD
WR1
tS tH
E1 masks ADSP
E1
tOE
tOHZ
G
tS
tKQ
DQA–DQD
Hi-Z
Q1A
tH
D1A
Q2A
Q2B
Q2c
Q2D
Q2A
Burst wrap around to it’s initial state
Rev: 1.00 10/2001
27/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Pipelined SCD Read Cycle Timing
Single Read
Burst Read
CK
tKH
tS tH
tKL
tKC
ADSP
ADSP is blocked by E inactive
tS tH
ADSC initiated read
ADSC
tS tH
Suspend Burst
ADV
tS tH
A0–An
RD2
RD1
RD3
tS
tH
tS
tH
GW
BW
BWA–BWD
tS tH
E1 masks ADSP
E1
tOE
G
DQA–DQD
tOHZ
Hi-Z
tKQX
tKQX
tOLZ
Q1A
Q2A
Q2B
Q2c
Q2D
Q3A
tLZ
tHZ
tKQ
Rev: 1.00 10/2001
28/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Pipelined SCD Read-Write Cycle Timing
Single Write
Single Read
Burst Read
tKL
CK
tS tH
tKH
tKC
ADSP is blocked by E inactive
ADSP
tS tH
ADSC initiated read
ADSC
tS tH
ADV
tS tH
A0–An
WR1
RD1
RD2
tS tH
GW
tS
tH
BW
tS tH
BWA– BWD
WR1
tS tH
E1 masks ADSP
E1
tOE
tOHZ
G
DQA–DQD
Rev: 1.00 10/2001
Hi-Z
tS tH
tKQ
Q1A
D1A
Q2A
29/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Q2B
Q2c
Q2D
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Pipelined DCD Read Cycle Timing
Single Read
tKL
Burst Read
CK
tS tH
tKH
tKC
ADSP is blocked by E1 inactive
ADSP
tS tH
ADSC initiated read
ADSC
tS tH
Suspend Burst
ADV
tS tH
A0–An
RD1
RD3
RD2
tS
tH
tS
tH
GW
BW
BA–BD
tS
tH
E1 masks ADSP
E1
tOE
G
tOHZ
Hi-Z
tOLZ
Q1A
DQA–DQD
tKQX
Q2A
tKQX
Q2B
Q2c
Q2D
Q3A
tLZ
tHZ
tKQ
Rev: 1.00 10/2001
30/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Pipelined DCD Read-Write Cycle Timing
Single Write
Burst Read
Single Read
tKL
CK
tS tH
tKH
tKC
ADSP is blocked by E1 inactive
ADSP
tS tH
ADSC initiated read
ADSC
tS tH
ADV
tS tH
A0–An
RD1
WR1
RD2
tS tH
GW
tS
tH
BW
tS tH
BA–BD
WR1
tS tH
E1 masks ADSP
E1
tOE
tOHZ
G
DQA–DQD
Rev: 1.00 10/2001
Hi-Z
tS tH
tKQ
Q1A
D1A
Q2A
31/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Q2B
Q2c
Q2D
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Sleep Mode
During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high,
the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to
low, the SRAM operates normally after 2 cycles of wake up time.
Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of
Sleep mode is dictated by the length of time the ZZ is in a High state. After entering Sleep mode, all inputs except ZZ become
disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode.
When the ZZ pin is driven high, ISB2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending
operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated
until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a Deselect or Read commands
may be applied while the SRAM is recovering from Sleep mode.
CK
tS tH
tKC
tKH tKL
ADSP
ADSC
tZZS
ZZ
~ ~
~ ~
~ ~
~~
~ ~
~
Sleep Mode Timing Diagram
tZZH
tZZR
Snooze
Application Tips
Single and Dual Cycle Deselect
SCD devices (like this one) force the use of “dummy read cycles” (read cycles that are launched normally, but that are ended with
the output drivers inactive) in a fully synchronous environment. Dummy read cycles waste performance, but their use usually
assures there will be no bus contention in transitions from reads to writes or between banks of RAMs. DCD SRAMs do not waste
bandwidth on dummy cycles and are logically simpler to manage in a multiple bank application (wait states need not be inserted at
bank address boundary crossings), but greater care must be exercised to avoid excessive bus contention.
JTAG Port Operation
Due to the fact that this device is built from two die, the two JTAG parts are chained together internally. The following describes
the behavior of each die.
Overview
The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan
interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with VDD. The JTAG output
drivers are powered by VDDQ.
Rev: 1.00 10/2001
32/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless
clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG
Port unused, TCK, TDI, and TMS may be left floating or tied to either VDD or VSS. TDO should be left unconnected.
JTAG Pin Descriptions
Pin
Pin Name
I/O
Description
TCK
Test Clock
In
Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate
from the falling edge of TCK.
TMS
Test Mode Select
In
The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP
controller state machine. An undriven TMS input will produce the same result as a logic one input
level.
In
The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers
placed between TDI and TDO. The register placed between TDI and TDO is determined by the
state of the TAP Controller state machine and the instruction that is currently loaded in the TAP
Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce
the same result as a logic one input level.
TDI
Test Data In
TDO
Test Data Out
Output that is active depending on the state of the TAP state machine. Output changes in
Out response to the falling edge of TCK. This is the output side of the serial registers placed between
TDI and TDO.
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is
held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
JTAG Port Registers
Overview
The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s
and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the
rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the
TDI and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or
the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the
TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through
the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.
Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.
The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The
Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the
device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan
Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in
Rev: 1.00 10/2001
33/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,
SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
JTAG TAP Block Diagram
0
Bypass Register
2 1 0
Instruction Register
TDI
TDO
ID Code Register
31 30 29
·
· · ·
2 1 0
Boundary Scan Register
n
· · · · · ·
· · ·
2 1 0
TMS
Test Access Port (TAP) Controller
TCK
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
Die
Revision
Code
GSI Technology
JEDEC Vendor
ID Code
I/O
Configuration
Not Used
Presence Register
ID Register Contents
Bit #
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
0
x72
X
X
X
X
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
0
0 0 1 1 0 1 1 0 0 1
1
x36
X
X
X
X
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0 0 1 1 0 1 1 0 0 1
1
x32
X
X
X
X
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0 0 1 1 0 1 1 0 0 1
1
x18
X
X
X
X
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
0
0 0 1 1 0 1 1 0 0 1
1
x16
X
X
X
X
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0 0 1 1 0 1 1 0 0 1
1
Tap Controller Instruction Set
Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific
(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be
Rev: 1.00 10/2001
34/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load
address, data or control signals into the RAM or to preload the I/O buffers.
When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.
When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired
instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the
TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this
device is listed in the following table.
JTAG Tap Controller State Diagram
1
0
Test Logic Reset
0
Run Test Idle
1
Select DR
1
Select IR
0
0
1
1
Capture DR
Capture IR
0
0
Shift DR
1
1
1
Shift IR
0
1
1
Exit1 DR
0
Exit1 IR
0
0
Pause DR
1
Exit2 DR
1
0
Pause IR
1
Exit2 IR
0
1
Update DR
Update IR
1
1
0
0
0
0
Instruction Descriptions
BYPASS
When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This occurs when
the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facilitate testing of other devices
in the scan path.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and I/O buffers into the Boundary Scan
Register. Boundary Scan Register locations are not associated with an input or I/O pin, and are loaded with the default state identified in the
Rev: 1.00 10/2001
35/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Boundary Scan Chain table at the end of this section of the datasheet. Because the RAM clock is independent from the TAP Clock (TCK) it
is possible for the TAP to attempt to capture the I/O ring contents while the input buffers are in transition (i.e. in a metastable state). Although
allowing the TAP to sample metastable inputs will not harm the device, repeatable results cannot be expected. RAM input signals must be
stabilized for long enough to meet the TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be
paused for any other TAP operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to ShiftDR state then places the boundary scan register between the TDI and TDO pins.
EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with all logic 0s.
The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is still determined by its input
pins.
Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command. Then the EXTEST
command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output drivers on the falling edge of TCK
when the controller is in the Update-IR state.
Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruction is selected,
the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not associated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR state, the RAM’s output pins drive out the
value of the Boundary Scan Register location with which each output pin is associated.
IDCODE
The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and places the ID
register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction loaded in at power up and any
time the controller is placed in the Test-Logic-Reset state.
SAMPLE-Z
If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (high-Z) and the
Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR state.
RFU
These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction.
Rev: 1.00 10/2001
36/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
JTAG TAP Instruction Set Summary
Instruction
Code
Description
Notes
EXTEST
000
Places the Boundary Scan Register between TDI and TDO.
1
IDCODE
001
Preloads ID Register and places it between TDI and TDO.
1, 2
SAMPLE-Z
010
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
Forces all RAM output drivers to High-Z.
1
RFU
011
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
1
SAMPLE/
PRELOAD
100
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
1
GSI
101
GSI private instruction.
1
RFU
110
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
1
BYPASS
111
Places Bypass Register between TDI and TDO.
1
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in test-logic-reset state.
Rev: 1.00 10/2001
37/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
JTAG Port Recommended Operating Conditions and DC Characteristics
Parameter
Symbol
Min.
Max.
Unit Notes
3.3 V Test Port Input High Voltage
VIHJ3
2.0
VDD3 +0.3
V
1
3.3 V Test Port Input Low Voltage
VILJ3
–0.3
0.8
V
1
2.5 V Test Port Input High Voltage
VIHJ2
0.6 * VDD2
VDD2 +0.3
V
1
2.5 V Test Port Input Low Voltage
VILJ2
–0.3
0.3 * VDD2
V
1
TMS, TCK and TDI Input Leakage Current
IINHJ
–300
1
uA
2
TMS, TCK and TDI Input Leakage Current
IINLJ
–1
100
uA
3
TDO Output Leakage Current
IOLJ
–1
1
uA
4
Test Port Output High Voltage
VOHJ
1.7
—
V
5, 6
Test Port Output Low Voltage
VOLJ
—
0.4
V
5, 7
Test Port Output CMOS High
VOHJC
VDDQ – 100 mV
—
V
5, 8
Test Port Output CMOS Low
VOLJC
—
100 mV
V
5, 9
Notes:
1. Input Under/overshoot voltage must be –2 V > Vi < VDDn +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tTKC.
2. VILJ ≤ VIN ≤ VDDn
3. 0 V ≤ VIN ≤ VILJn
4. Output Disable, VOUT = 0 to VDDn
5. The TDO output driver is served by the VDDQ supply.
6. IOHJ = –4 mA
7. IOLJ = + 4 mA
8. IOHJC = –100 uA
9. IOHJC = +100 uA
JTAG Port AC Test Conditions
Parameter
Conditions
Input high level
2.3 V
Input low level
0.2 V
Input slew rate
1 V/ns
Input reference level
1.25 V
Output reference level
1.25 V
50Ω
30pF*
VT = 1.25 V
* Distributed Test Jig Capacitance
Notes:
1. Include scope and jig capacitance.
2. Test conditions as as shown unless otherwise noted.
Rev: 1.00 10/2001
JTAG Port AC Test Load
DQ
38/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
JTAG Port Timing Diagram
tTKH
tTKL
tTKC
TCK
tTS
tTH
TMS
TDI
TDO
tTKQ
JTAG Port AC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
TCK Cycle Time
tTKC
50
—
ns
TCK Low to TDO Valid
tTKQ
—
20
ns
TCK High Pulse Width
tTKH
20
—
ns
TCK Low Pulse Width
tTKL
20
—
ns
TDI & TMS Set Up Time
tTS
10
—
ns
TDI & TMS Hold Time
tTH
10
—
ns
Rev: 1.00 10/2001
39/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
GS832418/36/72 Boundary Scan Chain Order
Order
x72
x36
x18
Bump
x72
x36
x18
1(TBD)
Notes:
1. Depending on the package, some input pads of the scan chain may not be connected to any external pin. In such case: LBO = 1, ZQ = 1,
PE = 0, SD = 0, ZZ = 0, FT = 1, DP = 1, and SCD = 1.
2. Every DQ pad consists of two scan registers—D is for input capture, and Q is for output capture.
3. A single register (#194) for controlling tristate of all the DQ pins is at the end of the scan chain (i.e., the last bit shifted in this tristate control
is effective after JTAG EXTEST instruction is executed.
4. 1 = no connect, internally set to logic value 1
5. 0 = no connect, internally set to logic value 0
6. X = no connect, value is undefined
Rev: 1.00 10/2001
40/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
209 BGA Package Drawing
14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array
C A1
A
Side View
D
aaa
D1
∅b
Symbol
Min
Typ
A
Max
Units
1.70
mm
0.40
0.50
0.60
mm
∅b
0.50
0.60
0.70
mm
c
0.31
0.36
0.38
mm
D
21.9
22.0
22.1
mm
18.0 (BSC)
E
13.9
14.0
Bottom View
e
A1
D1
E
E1
e
mm
14.1
mm
E1
10.0 (BSC)
mm
e
1.00 (BSC)
mm
aaa
0.15
mm
Rev 1.0
Rev: 1.00 10/2001
41/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Package Dimensions—119-Pin PBGA
119-Bump BGA Package
A
Pin 1
Corner
7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
G
B
S
D
R
Bottom View
Top View
Symbol
Description
Min.
Nom.
Max
A
Width
13.9
14.0
14.1
B
Length
21.9
22.0
22.1
C
Package Height (including ball)
1.73
1.86
1.99
D
Ball Size
0.60
0.75
0.90
E
Ball Height
0.50
0.60
0.70
F
Package Height (excluding balls)
1.16
1.26
1.36
G
Width between Balls
K
Package Height above board
R
Width of package between balls
7.62
S
Length of package between balls
20.32
T
Variance of Ball Height
0.15
1.27
0.65
0.70
0.75
C
F
E
K
T
Package Dimensions—119-Pin PBGA
Unit: mm
Side View
Rev: 1.00 10/2001
42/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Ordering Information for GSI Synchronous Burst RAMs
Org
Part Number1
Type
Package
Speed2
(MHz/ns)
TA3
2M x 18
GS832418B-250
DCD Pipeline/Flow Through
119 BGA
250/6
C
2M x 18
GS832418B-225
DCD Pipeline/Flow Through
119 BGA
225/6.5
C
2M x 18
GS832418B-200
DCD Pipeline/Flow Through
119 BGA
200/7.5
C
2M x 18
GS832418B-166
DCD Pipeline/Flow Through
119 BGA
166/8.5
C
2M x 18
GS832418B-150
DCD Pipeline/Flow Through
119 BGA
150/10
C
2M x 18
GS832418B-133
DCD Pipeline/Flow Through
119 BGA
133/11
C
2M x 18
GS832418C-250
DCD Pipeline/Flow Through
209 BGA
250/6
C
2M x 18
GS832418C-225
DCD Pipeline/Flow Through
209 BGA
225/6.5
C
2M x 18
GS832418C-200
DCD Pipeline/Flow Through
209 BGA
200/7.5
C
2M x 18
GS832418C-166
DCD Pipeline/Flow Through
209 BGA
166/8.5
C
2M x 18
GS832418C-150
DCD Pipeline/Flow Through
209 BGA
150/10
C
2M x 18
GS832418C-133
DCD Pipeline/Flow Through
209 BGA
133/11
C
1M x 36
GS832436B-250
SCD/DCD Pipeline/Flow Through
119 BGA
250/6
C
1M x 36
GS832436B-225
SCD/DCD Pipeline/Flow Through
119 BGA
225/6.5
C
1M x 36
GS832436B-200
SCD/DCD Pipeline/Flow Through
119 BGA
200/7.5
C
1M x 36
GS832436B-166
SCD/DCD Pipeline/Flow Through
119 BGA
166/8.5
C
1M x 36
GS832436B-150
SCD/DCD Pipeline/Flow Through
119 BGA
150/10
C
1M x 36
GS832436B-133
SCD/DCD Pipeline/Flow Through
119 BGA
133/11
C
1M x 36
GS832436C-250
SCD/DCD Pipeline/Flow Through
209 BGA
250/6
C
1M x 36
GS832436C-225
SCD/DCD Pipeline/Flow Through
209 BGA
225/6.5
C
1M x 36
GS832436C-200
SCD/DCD Pipeline/Flow Through
209 BGA
200/7.5
C
1M x 36
GS832436C-166
SCD/DCD Pipeline/Flow Through
209 BGA
166/8.5
C
1M x 36
GS832436C-150
SCD/DCD Pipeline/Flow Through
209 BGA
150/10
C
1M x 36
GS832436C-133
SCD/DCD Pipeline/Flow Through
209 BGA
133/11
C
512K x 72
GS832472C-250
SCD/DCD Pipeline/Flow Through
209 BGA
250/6
C
512K x 72
GS832472C-225
SCD/DCD Pipeline/Flow Through
209 BGA
225/6.5
C
512K x 72
GS832472C-200
SCD/DCD Pipeline/Flow Through
209 BGA
200/7.5
C
512K x 72
GS832472C-166
SCD/DCD Pipeline/Flow Through
209 BGA
166/8.5
C
512K x 72
GS832472C-150
SCD/DCD Pipeline/Flow Through
209 BGA
150/10
C
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832418B-150IB.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which
are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.00 10/2001
43/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Ordering Information for GSI Synchronous Burst RAMs (Continued)
Org
Part Number1
Type
Package
Speed2
(MHz/ns)
TA3
512K x 72
GS832472C-133
SCD/DCD Pipeline/Flow Through
209 BGA
133/11
C
2M x 18
GS832418B-250I
DCD Pipeline/Flow Through
119 BGA
250/6
I
2M x 18
GS832418B-225I
DCD Pipeline/Flow Through
119 BGA
225/6.5
I
2M x 18
GS832418B-200I
DCD Pipeline/Flow Through
119 BGA
200/7.5
I
2M x 18
GS832418B-166I
DCD Pipeline/Flow Through
119 BGA
166/8.5
I
2M x 18
GS832418B-150I
DCD Pipeline/Flow Through
119 BGA
150/10
I
2M x 18
GS832418B-133I
DCD Pipeline/Flow Through
119 BGA
133/11
I
2M x 18
GS832418C-250I
DCD Pipeline/Flow Through
209 BGA
250/6
I
2M x 18
GS832418C-225I
DCD Pipeline/Flow Through
209 BGA
225/6.5
I
2M x 18
GS832418C-200I
DCD Pipeline/Flow Through
209 BGA
200/7.5
I
2M x 18
GS832418C-166I
DCD Pipeline/Flow Through
209 BGA
166/8.5
I
2M x 18
GS832418C-150I
DCD Pipeline/Flow Through
209 BGA
150/10
I
2M x 18
GS832418C-133I
DCD Pipeline/Flow Through
209 BGA
133/11
I
1M x 36
GS832436B-250I
SCD/DCD Pipeline/Flow Through
119 BGA
250/6
I
1M x 36
GS832436B-225I
SCD/DCD Pipeline/Flow Through
119 BGA
225/6.5
I
1M x 36
GS832436B-200I
SCD/DCD Pipeline/Flow Through
119 BGA
200/7.5
I
1M x 36
GS832436B-166I
SCD/DCD Pipeline/Flow Through
119 BGA
166/8.5
I
1M x 36
GS832436B-150I
SCD/DCD Pipeline/Flow Through
119 BGA
150/10
I
1M x 36
GS832436B-133I
SCD/DCD Pipeline/Flow Through
119 BGA
133/11
I
1M x 36
GS832436C-250I
SCD/DCD Pipeline/Flow Through
209 BGA
250/6
I
1M x 36
GS832436C-225I
SCD/DCD Pipeline/Flow Through
209 BGA
225/6.5
I
1M x 36
GS832436C-200I
SCD/DCD Pipeline/Flow Through
209 BGA
200/7.5
I
1M x 36
GS832436C-166I
SCD/DCD Pipeline/Flow Through
209 BGA
166/8.5
I
1M x 36
GS832436C-150I
SCD/DCD Pipeline/Flow Through
209 BGA
150/10
I
1M x 36
GS832436C-133I
SCD/DCD Pipeline/Flow Through
209 BGA
133/11
I
512K x 72
GS832472C-250I
SCD/DCD Pipeline/Flow Through
209 BGA
250/6
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832418B-150IB.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which
are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.00 10/2001
44/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
Ordering Information for GSI Synchronous Burst RAMs (Continued)
Org
Part Number1
Type
Package
Speed2
(MHz/ns)
TA3
512K x 72
GS832472C-225I
SCD/DCD Pipeline/Flow Through
209 BGA
225/6.5
I
512K x 72
GS832472C-200I
SCD/DCD Pipeline/Flow Through
209 BGA
200/7.5
I
512K x 72
GS832472C-166I
SCD/DCD Pipeline/Flow Through
209 BGA
166/8.5
I
512K x 72
GS832472C-150I
SCD/DCD Pipeline/Flow Through
209 BGA
150/10
I
512K x 72
GS832472C-133I
SCD/DCD Pipeline/Flow Through
209 BGA
133/11
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832418B-150IB.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which
are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.00 10/2001
45/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.
Preliminary
GS832418(B/C)/GS832436(B/C)/GS832472(C)
36Mb Sync SRAM Datasheet Revision History
DS/DateRev. Code: Old;
New
832418_r1
Rev: 1.00 10/2001
Types of Changes
Format or Content
Page;Revisions;Reason
• Creation of new datasheet
46/46
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2001, Giga Semiconductor, Inc.