GSI GS8644V36B-225I

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GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
119-, 165-, & 209-Pin BGA
Commercial Temp
Industrial Temp
4M x 18, 2M x 36, 1M x 72
72Mb S/DCD Sync Burst SRAMs
Features
250 MHz–133MHz
1.8 V VDD
1.8 V I/O
Data Output Register. Holding FT high places the RAM in
Pipeline mode, activating the rising-edge-triggered Data Output
Register.
• FT pin for user-configurable flow through or pipeline operation
• Single/Dual Cycle Deselect selectable
• IEEE 1149.1 JTAG-compatible Boundary Scan
• ZQ mode pin for user-selectable high/low output drive
• 1.8 V +10%/–10% core power supply and I/O
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to SCD x18/x36 Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 119-, 165-, and 209-bump BGA package
SCD and DCD Pipelined Reads
The GS8644V18/36/72 is a SCD (Single Cycle Deselect) and
DCD (Dual Cycle Deselect) pipelined synchronous SRAM. DCD
SRAMs pipeline disable commands to the same degree as read
commands. SCD SRAMs pipeline deselect commands one stage
less than read commands. SCD RAMs begin turning off their
outputs immediately after the deselect command has been
captured in the input registers. DCD RAMs hold the deselect
command for one full cycle and then begin turning off their
outputs just after the second rising edge of clock. The user may
configure this SRAM for either mode of operation using the SCD
mode input.
Functional Description
Applications
The GS8644V18/36/72 is a 75,497,472-bit high performance
synchronous SRAM with a 2-bit burst address counter. Although
of a type originally developed for Level 2 Cache applications
supporting high performance CPUs, the device now finds
application in synchronous SRAM applications, ranging from
DSP main store to networking chip set support.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write control
inputs.
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV), and write control inputs (Bx, BW,
GW) are synchronous and are controlled by a positive-edgetriggered clock input (CK). Output enable (G) and power down
control (ZZ) are asynchronous inputs. Burst cycles can be initiated
with either ADSP or ADSC inputs. In Burst mode, subsequent
burst addresses are generated internally and are controlled by
ADV. The burst address counter may be configured to count in
either linear or interleave order with the Linear Burst Order (LBO)
input. The Burst function need not be used. New addresses can be
loaded on every cycle with no degradation of chip performance.
FLXDrive™
The ZQ pin allows selection between high drive strength (ZQ low)
for multi-drop bus applications and normal drive strength (ZQ
floating or high) point-to-point applications. See the Output Driver
Characteristics chart for details.
Sleep Mode
Low power (Sleep mode) is attained through the assertion (High)
of the ZZ signal, or by stopping the clock (CK). Memory data is
retained during Sleep mode.
Core and Interface Voltages
The GS8644V18/36/72 operates on a 2.5 V or 3.3 V power
supply. All input are 3.3 V and 2.5 V compatible. Separate output
power (VDDQ) pins are used to decouple output noise from the
internal circuits and are 3.3 V and 2.5 V compatible.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by the
user via the FT mode . Holding the FT mode pin low places the
RAM in Flow Through mode, causing output data to bypass the
Parameter Synopsis
-250 -225 -200 -166 -150 -133 Unit
Pipeline
3-1-1-1
Flow
Through
2-1-1-1
Rev: 1.03 11/2004
tKQ(x18/x36)
tKQ(x72)
tCycle
2.3
2.6
4.0
2.5
2.7
4.4
2.7
2.8
5.0
2.9
2.9
6.0
3.3
3.3
6.7
3.5
3.5
7.5
ns
ns
ns
Curr (x18)
Curr (x36)
Curr (x72)
385
450
540
360
415
505
335
385
460
305
345
405
295
325
385
265
295
345
mA
mA
mA
tKQ
tCycle
6.5
6.5
6.5
6.5
6.5
6.5
8.0
8.0
8.5
8.5
8.5
8.5
ns
ns
Curr (x18)
Curr (x36)
Curr (x72)
265
290
345
265
290
345
265
290
345
255
280
335
240
265
315
225
245
300
mA
mA
mA
1/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
GS8644V72C Pad Out—209-Bump BGA—Top View (Package C)
1
2
3
4
5
6
7
8
9
10
11
A
DQG
DQG
A
E2
ADSP
ADSC
ADV
E3
A
DQB
DQB
A
B
DQG
DQG
BC
BG
NC
BW
A
BB
BF
DQB
DQB
B
C
DQG
DQG
BH
BD
NC
E1
NC
BE
BA
DQB
DQB
C
D
DQG
DQG
VSS
NC
NC
G
GW
NC
VSS
DQB
DQB
D
E
DQPG
DQPC
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQPF
DQPB
E
F
DQC
DQC
VSS
VSS
VSS
ZQ
VSS
VSS
VSS
DQF
DQF
F
G
DQC
DQC
VDDQ
VDDQ
VDD
MCH
VDD
VDDQ
VDDQ
DQF
DQF
G
H
DQC
DQC
VSS
VSS
VSS
MCL
VSS
VSS
VSS
DQF
DQF
H
J
DQC
DQC
VDDQ
VDDQ
VDD
MCL
VDD
VDDQ
VDDQ
DQF
DQF
J
K
NC
NC
CK
NC
VSS
MCL
VSS
NC
NC
NC
NC
K
L
DQH
DQH
VDDQ
VDDQ
VDD
FT
VDD
VDDQ
VDDQ
DQA
DQA
L
M
DQH
DQH
VSS
VSS
VSS
MCL
VSS
VSS
VSS
DQA
DQA
M
N
DQH
DQH
VDDQ
VDDQ
VDD
SCD
VDD
VDDQ
VDDQ
DQA
DQA
N
P
DQH
DQH
VSS
VSS
VSS
ZZ
VSS
VSS
VSS
DQA
DQA
P
R
DQPD
DQPH
VDDQ
VDDQ
VDD
VDD
VDD
VDDQ
VDDQ
DQPA
DQPE
R
T
DQD
DQD
VSS
NC
NC
LBO
NC
NC
VSS
DQE
DQE
T
U
DQD
DQD
A
A
A
A
A
A
A
DQE
DQE
U
V
DQD
DQD
A
A
A
A1
A
A
A
DQE
DQE
V
W
DQD
DQD
TMS
TDI
A
A0
A
TDO
TCK
DQE
DQE
W
11 x 19 Bump BGA—14 x 22 mm2 Body—1 mm Bump Pitch
Rev: 1.03 11/2004
2/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
GS8644V72 209-Bump BGA Pin Description
Symbol
Type
Description
A 0, A 1
I
Address field LSBs and Address Counter Preset Inputs.
A
I
Address Inputs
DQA
DQB
DQC
DQD
DQE
DQF
DQG
DQH
I/O
Data Input and Output pins
BA, BB
I
Byte Write Enable for DQA, DQB I/Os; active low
BC,BD
I
Byte Write Enable for DQC, DQD I/Os; active low
BE, BF, BG,BH
I
Byte Write Enable for DQE, DQF, DQG, DQH I/Os; active low
NC
—
No Connect
CK
I
Clock Input Signal; active high
GW
I
Global Write Enable—Writes all bytes; active low
E1
I
Chip Enable; active low
E3
I
Chip Enable; active low
E2
I
Chip Enable; active high
G
I
Output Enable; active low
ADV
I
Burst address counter advance enable; active low
ADSP, ADSC
I
Address Strobe (Processor, Cache Controller); active low
ZZ
I
Sleep Mode control; active high
FT
I
Flow Through or Pipeline mode; active low
LBO
I
Linear Burst Order mode; active low
SCD
I
Single Cycle Deselect/Dual Cycle Deselect Mode Control
MCH
I
Must Connect High
Rev: 1.03 11/2004
3/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
GS8644V72 209-Bump BGA Pin Description (Continued)
Symbol
Type
Description
Must Connect Low
MCL
BW
I
Byte Enable; active low
ZQ
I
FLXDrive Output Impedance Control
(Low = Low Impedance [High Drive], High = High Impedance [Low Drive])
TMS
I
Scan Test Mode Select
TDI
I
Scan Test Data In
TDO
O
Scan Test Data Out
TCK
I
Scan Test Clock
VDD
I
Core power supply
VSS
I
I/O and Core Ground
VDDQ
I
Output driver power supply
Rev: 1.03 11/2004
4/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
165-Bump BGA—x18 Commom I/O—Top View (Package E)
1
2
3
4
5
6
7
8
9
10
11
A
NC
A
E1
BB
NC
E3
BW
ADSC
ADV
A
A
A
B
NC
A
E2
NC
BA
CK
GW
G
ADSP
A
NC
B
C
NC
NC
VDDQ
VSS
VSS
VSS
VSS
VSS
VDDQ
NC
DQPA
C
D
NC
DQB
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
NC
DQA
D
E
NC
DQB
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
NC
DQA
E
F
NC
DQB
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
NC
DQA
F
G
NC
DQB
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
NC
DQA
G
H
FT
MCL
NC
VDD
VSS
VSS
VSS
VDD
NC
ZQ
ZZ
H
J
DQB
NC
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQA
NC
J
K
DQB
NC
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQA
NC
K
L
DQB
NC
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQA
NC
L
M
DQB
NC
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQA
NC
M
N
DQPB
SCD
VDDQ
VSS
NC
A
NC
VSS
VDDQ
NC
NC
N
P
NC
A
A
A
TDI
A1
TDO
A
A
A
A
P
R
LBO
A
A
A
TMS
A0
TCK
A
A
A
A
R
11 x 15 Bump BGA—15 mm x 17 mm Body—1.0 mm Bump Pitch
Rev: 1.03 11/2004
5/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
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GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
165-Bump BGA—x36 Common I/O—Top View (Package E)
1
2
3
4
5
6
7
8
9
10
11
A
NC
A
E1
BC
BB
E3
BW
ADSC
ADV
A
NC
A
B
NC
A
E2
BD
BA
CK
GW
G
ADSP
A
NC
B
C
DQPC
NC
VDDQ
VSS
VSS
VSS
VSS
VSS
VDDQ
NC
DQPB
C
D
DQC
DQC
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQB
DQB
D
E
DQC
DQC
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQB
DQB
E
F
DQC
DQC
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQB
DQB
F
G
DQC
DQC
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQB
DQB
G
H
FT
MCL
NC
VDD
VSS
VSS
VSS
VDD
NC
ZQ
ZZ
H
J
DQD
DQD
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQA
DQA
J
K
DQD
DQD
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQA
DQA
K
L
DQD
DQD
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQA
DQA
L
M
DQD
DQD
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQA
DQA
M
N
DQPD
SCD
VDDQ
VSS
NC
A
NC
VSS
VDDQ
NC
DQPA
N
P
NC
A
A
A
TDI
A1
TDO
A
A
A
A
P
R
LBO
A
A
A
TMS
A0
TCK
A
A
A
A
R
11 x 15 Bump BGA—15 mm x 17 mm Body—1.0 mm Bump Pitch
Rev: 1.03 11/2004
6/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
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GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
GS8644V18/36 165-Bump BGA Pin Description
Symbol
Type
Description
A 0, A 1
I
Address field LSBs and Address Counter Preset Inputs
A
I
Address Inputs
DQA
DQB
DQC
DQD
I/O
Data Input and Output pins
BA , BB , BC , BD
I
Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low (x36 Version)
NC
—
No Connect
CK
I
Clock Input Signal; active high
BW
I
Byte Write—Writes all enabled bytes; active low
GW
I
Global Write Enable—Writes all bytes; active low
E1
I
Chip Enable; active low
E3
I
Chip Enable; active low
E2
I
Chip Enable; active high
G
I
Output Enable; active low
ADV
I
Burst address counter advance enable; active l0w
ADSC, ADSP
I
Address Strobe (Processor, Cache Controller); active low
ZZ
I
Sleep mode control; active high
FT
I
Flow Through or Pipeline mode; active low
LBO
I
Linear Burst Order mode; active low
ZQ
I
FLXDrive Output Impedance Control (Low = Low Impedance [High Drive], High = High Impedance [Low
Drive])
TMS
I
Scan Test Mode Select
TDI
I
Scan Test Data In
TDO
O
Scan Test Data Out
TCK
I
Scan Test Clock
MCL
—
Must Connect Low
SCD
—
Single Cycle Deselect/Dual Cyle Deselect Mode Control
VDD
I
Core power supply
VSS
I
I/O and Core Ground
VDDQ
I
Output driver power supply
Rev: 1.03 11/2004
7/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
GS8644V36B Pad Out—119-Bump BGA—Top View (Package B)
1
2
3
4
5
6
7
A
VDDQ
A
A
ADSP
A
A
VDDQ
A
B
NC
A
A
ADSC
A
A
NC
B
C
NC
A
A
VDD
A
A
NC
C
D
DQC
DQPC
VSS
ZQ
VSS
DQPB
DQB
D
E
DQC
DQC
VSS
E1
VSS
DQB
DQB
E
F
VDDQ
DQC
VSS
G
VSS
DQB
VDDQ
F
G
DQC
DQC
BC
ADV
BB
DQB
DQB
G
H
DQC
DQC
VSS
GW
VSS
DQB
DQB
H
J
VDDQ
VDD
NC
VDD
NC
VDD
VDDQ
J
K
DQD
DQD
VSS
CK
VSS
DQA
DQA
K
L
DQD
DQD
BD
SCD
BA
DQA
DQA
L
M
VDDQ
DQD
VSS
BW
VSS
DQA
VDDQ
M
N
DQD
DQD
VSS
A1
VSS
DQA
DQA
N
P
DQD
DQPD
VSS
A0
VSS
DQPA
DQA
P
R
NC
A
LBO
VDD
FT
A
NC
R
T
NC
A
A
A
A
A
ZZ
T
U
VDDQ
TMS
TDI
TCK
TDO
NC
VDDQ
U
7 x 17 Bump BGA—14 x 22 mm2 Body—1.27 mm Bump Pitch
Rev: 1.03 11/2004
8/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
GS8644V18B Pad Out—119-Bump BGA—Top View (Package B)
1
2
3
4
5
6
7
A
VDDQ
A
A
ADSP
A
A
VDDQ
A
B
NC
A
A
ADSC
A
A
NC
B
C
NC
A
A
VDD
A
A
NC
C
D
DQB
NC
VSS
ZQ
VSS
DQPA
NC
D
E
NC
DQB
VSS
E1
VSS
NC
DQA
E
F
VDDQ
NC
VSS
G
VSS
DQA
VDDQ
F
G
NC
DQB
BB
ADV
NC
NC
DQA
G
H
DQB
NC
VSS
GW
VSS
DQA
NC
H
J
VDDQ
VDD
NC
VDD
NC
VDD
VDDQ
J
K
NC
DQB
VSS
CK
VSS
NC
DQA
K
L
DQB
NC
NC
SCD
BA
DQA
NC
L
M
VDDQ
DQB
VSS
BW
VSS
NC
VDDQ
M
N
DQB
NC
VSS
A1
VSS
DQA
NC
N
P
NC
DQPB
VSS
A0
VSS
NC
DQA
P
R
NC
A
LBO
VDD
FT
A
NC
R
T
A
A
A
A
A
A
ZZ
T
U
VDDQ
TMS
TDI
TCK
TDO
NC
VDDQ
U
7 x 17 Bump BGA—14 x 22 mm2 Body—1.27 mm Bump Pitch
Rev: 1.03 11/2004
9/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
GS8644V18/36 119-Bump BGA Pin Description
Symbol
Type
Description
A 0, A 1
I
Address field LSBs and Address Counter Preset Inputs
A
I
Address Inputs
DQA
DQB
DQC
DQD
I/O
Data Input and Output pins
BA , BB , BC , BD
I
Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low
NC
—
No Connect
CK
I
Clock Input Signal; active high
BW
I
Byte Write—Writes all enabled bytes; active low
GW
I
Global Write Enable—Writes all bytes; active low
E1
I
Chip Enable; active low
G
I
Output Enable; active low
ADV
I
Burst address counter advance enable; active low
ADSP, ADSC
I
Address Strobe (Processor, Cache Controller); active low
ZZ
I
Sleep mode control; active high
FT
I
Flow Through or Pipeline mode; active low
LBO
I
Linear Burst Order mode; active low
ZQ
I
FLXDrive Output Impedance Control (Low = Low Impedance [High Drive], High = High Impedance [Low
Drive])
SCD
I
Single Cycle Deselect/Dual Cyle Deselect Mode Control
TMS
I
Scan Test Mode Select
TDI
I
Scan Test Data In
TDO
O
Scan Test Data Out
TCK
I
Scan Test Clock
VDD
I
Core power supply
VSS
I
I/O and Core Ground
VSS
I
I/O and Core Ground
VDDQ
I
Output driver power supply
Rev: 1.03 11/2004
10/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
GS8644V18/36/72 Block Diagram
Register
A0–An
D
Q
A0
A0
D0
A1
Q0
A1
D1
Q1
Counter
Load
A
LBO
ADV
Memory
Array
CK
ADSC
ADSP
Q
D
Register
GW
BW
BA
D
Q
36
36
Register
D
Q
BB
4
Register
D
Q
D
Q
D
Q
Register
Register
D
Q
Register
BC
BD
Register
D
36
Q
36
Register
E1
D
Q
36
Register
D
Q
FT
G
ZZ
36
Power Down
SCD
DQx1–DQx9
Control
Note: Only x36 version shown for simplicity.
Rev: 1.03 11/2004
11/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Mode Pin Functions
Mode Name
Pin Name
Burst Order Control
LBO
Output Register Control
FT
Power Down Control
ZZ
Single/Dual Cycle Deselect Control
SCD
FLXDrive Output Impedance Control
ZQ
State
Function
L
Linear Burst
H
Interleaved Burst
L
Flow Through
H or NC
Pipeline
L or NC
Active
H
Standby, IDD = ISB
L
Dual Cycle Deselect
H or NC
Single Cycle Deselect
L
High Drive (Low Impedance)
H or NC
Low Drive (High Impedance)
Note:
There are pull-up devices onthe ZQ, SCD, and FT pins and a pull-down device on the ZZ pin, so those input pins can be unconnected and the
chip will operate in the default states as specified in the above tables.
Burst Counter Sequences
Linear Burst Sequence
Interleaved Burst Sequence
A[1:0] A[1:0] A[1:0] A[1:0]
A[1:0] A[1:0] A[1:0] A[1:0]
1st address
00
01
10
11
1st address
00
01
10
11
2nd address
01
10
11
00
2nd address
01
00
11
10
3rd address
10
11
00
01
3rd address
10
11
00
01
4th address
11
00
01
10
4th address
11
10
01
00
Note:
The burst counter wraps to initial state on the 5th clock.
Note:
The burst counter wraps to initial state on the 5th clock.
BPR 1999.05.18
Rev: 1.03 11/2004
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Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Byte Write Truth Table
Function
GW
BW
BA
BB
BC
BD
Notes
Read
H
H
X
X
X
X
1
Read
H
L
H
H
H
H
1
Write byte a
H
L
L
H
H
H
2, 3
Write byte b
H
L
H
L
H
H
2, 3
Write byte c
H
L
H
H
L
H
2, 3, 4
Write byte d
H
L
H
H
H
L
2, 3, 4
Write all bytes
H
L
L
L
L
L
2, 3, 4
Write all bytes
L
X
X
X
X
X
Notes:
1. All byte outputs are active in read cycles regardless of the state of Byte Write Enable inputs.
2. Byte Write Enable inputs BA, BB, BC, and/or BD may be used in any combination with BW to write single or multiple bytes.
3. All byte I/Os remain High-Z during all write operations regardless of the state of Byte Write Enable inputs.
4. Bytes “C” and “D” are only available on the x36 version.
Rev: 1.03 11/2004
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Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Synchronous Truth Table
Operation
Address Used
State
Diagram
Key5
Deselect Cycle, Power Down
None
X
H
X
L
X
X
High-Z
Read Cycle, Begin Burst
External
R
L
L
X
X
X
Q
Read Cycle, Begin Burst
External
R
L
H
L
X
F
Q
Write Cycle, Begin Burst
External
W
L
H
L
X
T
D
Read Cycle, Continue Burst
Next
CR
X
H
H
L
F
Q
Read Cycle, Continue Burst
Next
CR
H
X
H
L
F
Q
Write Cycle, Continue Burst
Next
CW
X
H
H
L
T
D
Write Cycle, Continue Burst
Next
CW
H
X
H
L
T
D
Read Cycle, Suspend Burst
Current
X
H
H
H
F
Q
Read Cycle, Suspend Burst
Current
H
X
H
H
F
Q
Write Cycle, Suspend Burst
Current
X
H
H
H
T
D
Write Cycle, Suspend Burst
Current
H
X
H
H
T
D
E1
ADSP
ADSC
ADV
W3
DQ4
Notes:
1. X = Don’t Care, H = High, L = Low
2. W = T (True) and F (False) is defined in the Byte Write Truth Table preceding
3. G is an asynchronous input. G can be driven high at any time to disable active output drivers. G low can only enable active drivers (shown
as “Q” in the Truth Table above).
4. All input combinations shown above are tested and supported. Input combinations shown in gray boxes need not be used to accomplish
basic synchronous or synchronous burst operations and may be avoided for simplicity.
5. Tying ADSP high and ADSC low allows simple non-burst synchronous operations. See BOLD items above.
6. Tying ADSP high and ADV low while using ADSC to load new addresses allows simple burst operations. See ITALIC items above.
Rev: 1.03 11/2004
14/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Simplified State Diagram
X
Deselect
W
R
Simple Burst Synchronous Operation
Simple Synchronous Operation
W
X
R
R
First Write
CW
First Read
CR
CR
W
X
R
R
X
Burst Write
Burst Read
X
CR
CW
CR
Notes:
1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low.
2. The upper portion of the diagram assumes active use of only the Enable (E1) and Write (BA, BB, BC, BD, BW, and GW) control inputs, and
that ADSP is tied high and ADSC is tied low.
3. The upper and lower portions of the diagram together assume active use of only the Enable, Write, and ADSC control inputs and
assumes ADSP is tied high and ADV is tied low.
Rev: 1.03 11/2004
15/40
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Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Simplified State Diagram with G
X
Deselect
W
R
W
X
R
R
First Write
CR
CW
W
CW
W
X
First Read
X
CR
R
Burst Write
R
CR
CW
W
Burst Read
X
CW
CR
Notes:
1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use of G.
2. Use of “Dummy Reads” (Read Cycles with G High) may be used to make the transition from read cycles to write cycles without passing
through a Deselect cycle. Dummy Read cycles increment the address counter just like normal read cycles.
3. Transitions shown in grey tone assume G has been pulsed high long enough to turn the RAM’s drivers off and for incoming data to meet
Data Input Set Up Time.
Rev: 1.03 11/2004
16/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Absolute Maximum Ratings
(All voltages reference to VSS)
Symbol
Description
Value
Unit
VDD
Voltage on VDD Pins
–0.5 to 3.6
V
VDDQ
Voltage in VDDQ Pins
–0.5 to 3.6
V
VI/O
Voltage on I/O Pins
–0.5 to VDDQ +0.5 (≤ 3.6 V max.)
V
VIN
Voltage on Other Input Pins
–0.5 to VDD +0.5 (≤ 3.6 V max.)
V
IIN
Input Current on Any Pin
+/–20
mA
IOUT
Output Current on Any I/O Pin
+/–20
mA
PD
Package Power Dissipation
1.5
W
TSTG
Storage Temperature
–55 to 125
o
TBIAS
Temperature Under Bias
–55 to 125
o
C
C
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of
this component.
Power Supply Voltage Ranges
Parameter
Symbol
Min.
Typ.
Max.
Unit
1.8 V Supply Voltage
VDD1
1.6
1.8
2.0
V
1.8 V VDDQ I/O Supply Voltage
VDDQ1
1.6
1.8
2.0
V
Notes
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 3.6 V maximum, with a pulse width not to exceed 20% tKC.
Rev: 1.03 11/2004
17/40
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Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
VDDQ Range Logic Levels
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
VDD Input High Voltage
VIH
0.6*VDD
—
VDD + 0.3
V
1
VDD Input Low Voltage
VIL
–0.3
—
0.3*VDD
V
1
VDDQ I/O Input High Voltage
VIHQ
0.6*VDD
—
VDDQ + 0.3
V
1,3
VDDQ I/O Input Low Voltage
VILQ
–0.3
—
0.3*VDD
V
1,3
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 3.6 V maximum, with a pulse width not to exceed 20% tKC.
3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V.
Undershoot Measurement and Timing
Overshoot Measurement and Timing
VIH
20% tKC
VDD + 2.0 V
VSS
50%
50%
VDD
VSS – 2.0 V
20% tKC
VIL
Capacitance
(TA = 25oC, f = 1 MHZ, VDD = 2.5 V)
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
Input Capacitance
CIN
VIN = 0 V
8
10
pF
Input/Output Capacitance
CI/O
VOUT = 0 V
12
14
pF
Note:
These parameters are sample tested.
Rev: 1.03 11/2004
18/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
AC Test Conditions
Parameter
Conditions
Input high level
VDD – 0.2 V
Input low level
0.2 V
Input slew rate
1 V/ns
Input reference level
VDD/2
Output reference level
VDDQ/2
Output load
Fig. 1
Notes:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig. 1
unless otherwise noted.
3. Device is deselected as defined by the Truth Table.
Output Load 1
DQ
30pF*
50Ω
VDDQ/2
* Distributed Test Jig Capacitance
DC Electrical Characteristics
Parameter
Symbol
Test Conditions
Min
Max
Input Leakage Current
(except mode pins)
IIL
VIN = 0 to VDD
–1 uA
1 uA
ZZ Input Current
IIN1
VDD ≥ VIN ≥ VIH
0 V ≤ VIN ≤ VIH
–1 uA
–1 uA
1 uA
100 uA
FT, SCD, and ZQ Input Current
IIN2
VDD ≥ VIN ≥ VIL
0 V ≤ VIN ≤ VIL
–100 uA
–1 uA
1 uA
1 uA
Output Leakage Current
IOL
Output Disable, VOUT = 0 to VDD
–1 uA
1 uA
Output High Voltage
VOH1
IOH = –4 mA, VDDQ = 1.6 V
VDDQ – 0.4 V
—
Output Low Voltage
VOL1
IOL = 4 mA, VDD = 1.6 V
—
0.4 V
Rev: 1.03 11/2004
19/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Rev: 1.03 11/2004
—
Device Deselected;
All other inputs
≥ VIH or ≤ VIL
Deselect
Current
270
20
IDD
IDD
170
200
IDD
Pipeline
Flow
Through
120
ISB
120
ISB
Pipeline
Flow
Through
250
15
IDDQ
IDD
IDDQ
IDD
Flow
Through
Pipeline
Flow
Through
360
25
400
50
IDD
IDDQ
IDDQ
315
30
IDD
IDDQ
Flow
Through
Pipeline
480
60
0
to
70°C
IDD
IDDQ
Symbol
Pipeline
Mode
200
230
160
160
275
15
395
25
295
20
435
50
340
30
515
60
–40
to
85°C
-250
170
190
120
120
250
15
335
25
270
20
370
45
315
30
445
60
200
220
160
160
275
15
370
25
295
20
405
45
340
30
480
60
–40
to
85°C
-225
0
to
70°C
Notes:
1. IDD and IDDQ apply to any combination of VDD3, VDD2, VDDQ3, and VDDQ2 operation.
2. All parameters listed are worst case scenario.
—
(x18)
(x36)
(x72)
ZZ ≥ VDD – 0.2 V
Device Selected;
All other inputs
≥VIH or ≤ VIL
Output open
Test Conditions
Standby
Current
Operating
Current
Parameter
Operating Currents
160
180
120
120
250
15
315
20
270
20
345
40
315
30
410
50
0
to
70°C
190
210
160
160
275
15
350
20
295
20
380
40
340
30
445
50
–40
to
85°C
-200
160
170
120
120
240
15
285
20
260
20
310
35
305
30
365
40
0
to
70°C
190
200
160
160
260
15
320
20
285
20
345
35
330
30
400
40
–40
to
85°C
-166
150
170
120
120
225
15
275
20
245
20
295
30
285
30
345
40
0
to
70°C
180
200
160
160
250
15
310
20
270
20
330
30
310
30
380
40
–40
to
85°C
-150
140
160
120
120
210
15
250
15
230
15
270
25
280
20
315
30
0
to
70°C
170
190
160
160
235
15
285
15
255
15
305
25
305
20
350
30
–40
to
85°C
-133
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
Unit
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
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20/40
© 2003, GSI Technology
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GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
AC Electrical Characteristics
Pipeline
Parameter
Symbol
Clock Cycle Time
Clock to Output Valid
(x18/x36)
Clock to Output Valid
(x72)
Clock to Output Invalid
Clock to Output in Low-Z
Flow
Through
Setup time
Hold time
Clock Cycle Time
Clock to Output Valid
Clock to Output Invalid
-250
-225
-200
-166
-150
-133
Unit
tKC
Min
4.0
Max
—
Min
4.4
Max
—
Min
5.0
Max
—
Min
6.0
Max
—
Min
6.7
Max
—
Min
7.5
Max
—
tKQ
—
2.3
—
2.5
—
2.7
—
2.9
—
3.3
—
3.5
ns
tKQ
—
2.6
—
2.7
—
2.8
—
2.9
—
3.3
—
3.5
ns
tKQX
1.0
—
1.0
—
1.0
—
1.0
—
1.0
—
1.0
—
ns
1
1.0
—
1.0
—
1.0
—
1.0
—
1.0
—
1.0
—
ns
1.3
0.2
6.5
—
3.0
—
—
—
6.5
—
1.3
0.3
6.5
—
3.0
—
—
—
6.5
—
1.4
0.4
6.5
—
3.0
—
—
—
6.5
—
1.5
0.5
7.0
—
3.0
—
—
—
7.0
—
1.5
0.5
7.5
—
3.0
—
—
—
7.5
—
1.5
0.5
8.5
—
3.0
—
—
—
8.5
—
ns
ns
ns
ns
ns
tLZ
tS
tH
tKC
tKQ
tKQX
ns
tLZ1
tS
tH
tKH
tKL
3.0
—
3.0
—
3.0
—
3.0
—
3.0
—
3.0
—
ns
1.5
0.5
1.3
1.5
—
—
—
—
1.5
0.5
1.3
1.5
—
—
—
—
1.5
0.5
1.3
1.5
—
—
—
—
1.5
0.5
1.3
1.5
—
—
—
—
1.5
0.5
1.5
1.7
—
—
—
—
1.5
0.5
1.7
2
—
—
—
—
ns
ns
ns
ns
tHZ1
1.0
2.3
1.0
2.5
1.0
2.7
1.0
2.9
1.0
3.0
1.0
3.0
ns
tHZ1
1.0
2.6
1.0
2.7
1.0
2.8
1.0
2.9
1.0
3.0
1.0
3.0
ns
tOE
—
2.3
—
2.5
—
2.7
—
2.9
—
3.3
—
3.5
ns
tOE
—
2.6
—
2.7
—
2.8
—
2.9
—
3.3
—
3.5
ns
tOLZ1
0
—
0
—
0
—
0
—
0
—
0
—
ns
tOHZ1
—
2.3
—
2.5
—
2.7
—
2.9
—
3.0
—
3.0
ns
tOHZ1
—
2.6
—
2.7
—
2.8
—
2.9
—
3.0
—
3.0
ns
ZZ setup time
tZZS2
5
—
5
—
5
—
5
—
5
—
5
—
ns
ZZ hold time
tZZH2
tZZR
1
—
1
—
1
—
1
—
1
—
1
—
ns
20
—
20
—
20
—
20
—
20
—
20
—
ns
Clock to Output in Low-Z
Setup time
Hold time
Clock HIGH Time
Clock LOW Time
Clock to Output in
High-Z
(x18/x36)
Clock to Output in
High-Z
(x72)
G to Output Valid
(x18/x36)
G to Output Valid
(x72)
G to output in Low-Z
G to output in High-Z
(x18/x36)
G to output in High-Z
(x72)
ZZ recovery
Notes:
1. These parameters are sampled and are not 100% tested.
2. ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold
times as specified above.
Rev: 1.03 11/2004
21/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Pipeline Mode Timing (SCD)
Begin
Read A
Cont
Cont
Single Read
Deselect Write B
Read C
Read C+1 Read C+2 Read C+3 Cont
Single Write
tKL
tKH
tKC
Deselect
Burst Read
CK
ADSP
tS
tH
ADSC initiated read
ADSC
tS
tH
ADV
tS
tH
A0–An
A
B
C
tS
GW
tS
tH
BW
tH
tS
Ba–Bd
tS
Deselected with E1
tH
E1 masks ADSP
E1
tS
tH
E2 and E3 only sampled with ADSP and ADSC
E2
tS
tH
E3
G
tS
tOE
DQa–DQd
Rev: 1.03 11/2004
tOHZ
Q(A)
tKQ
tH
D(B)
tKQX
tLZ
tHZ
Q(C)
22/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Q(C+1)
Q(C+2)
Q(C+3)
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Flow Through Mode Timing (SCD)
Begin
Read A
Cont
Cont
Write B
Read C
Read C+1 Read C+2 Read C+3 Read C
Cont
Deselect
tKL
tKH
tKC
CK
ADSP
Fixed High
tS
tH
tS
tH
ADSC
initiated read
ADSC
tS
tH
ADV
tS
tH
A0–An
A
B
C
tS
tH
GW
tS
tH
BW
tS
tH
Ba–Bd
tS
Deselected with E1
tH
E1
tS
tH
E2 and E3 only sampled with ADSC
E2
tS
tH
E3
G
tH
tS
tOE
DQa–DQd
Rev: 1.03 11/2004
tOHZ
Q(A)
D(B)
tKQ
tLZ
tHZ
tKQX
Q(C)
Q(C+1)
Q(C+2)
23/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Q(C+3)
Q(C)
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Pipeline Mode Timing (DCD)
Begin
Read A
Cont
Deselect Deselect Write B
Read C
Read C+1 Read C+2 Read C+3 Cont
Deselect Deselect
tKL
tKH
tKC
CK
ADSP
tS
ADSC initiated read
tH
ADSC
tS
tH
ADV
tS
tH
Ao–An
A
B
C
tS
GW
tS
tH
BW
tH
tS
Ba–Bd
tS
Deselected with E1
tH
E1
tS
E2 and E3 only sampled with ADSC
tH
E2
tS
tH
E3
G
tS
tOE
DQa–DQd
Hi-Z
Rev: 1.03 11/2004
tOHZ
Q(A)
tKQ
tH
D(B)
tHZ
tLZ
tKQX
Q(C)
Q(C+1)
24/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Q(C+2)
Q(C+3)
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Flow Through Mode Timing (DCD)
Begin
Read A
Cont
Deselect Write B
Read C
Read C+1 Read C+2 Read C+3 Read C
Deselect
tKL
tKH
tKC
CK
ADSP
Fixed High
tS
tH
tS
tH
ADSC
initiated read
ADSC
tH
tS
tS
tH
ADV
tS
tH
Ao–An
A
B
C
tS
tH
GW
tS
tH
BW
tH
tS
Ba–Bd
tS
Deselected with E1
tH
E1 masks ADSP
E1
tS
tH
E2 and E3 only sampled with ADSP and ADSC
E2
tS
tH
E1 masks ADSP
E3
G
tH
tS
tOE
tKQ
DQa–DQd
Rev: 1.03 11/2004
tOHZ
Q(A)
tKQX
tHZ
tLZ
D(B)
Q(C)
Q(C+1)
Q(C+2)
25/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Q(C+3)
Q(C)
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Sleep Mode
During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high,
the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to
low, the SRAM operates normally after ZZ recovery time.
Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of
Sleep mode is dictated by the length of time the ZZ is in a High state. After entering Sleep mode, all inputs except ZZ become
disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode.
When the ZZ pin is driven high, ISB2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending
operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated
until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a Deselect or Read commands
may be applied while the SRAM is recovering from Sleep mode.
Sleep Mode Timing Diagram
tKH
tKC
tKL
CK
Setup
Hold
ADSP
ADSC
tZZR
tZZS
tZZH
ZZ
Application Tips
Single and Dual Cycle Deselect
SCD devices (like this one) force the use of “dummy read cycles” (read cycles that are launched normally, but that are ended with
the output drivers inactive) in a fully synchronous environment. Dummy read cycles waste performance, but their use usually
assures there will be no bus contention in transitions from reads to writes or between banks of RAMs. DCD SRAMs do not waste
bandwidth on dummy cycles and are logically simpler to manage in a multiple bank application (wait states need not be inserted at
bank address boundary crossings), but greater care must be exercised to avoid excessive bus contention.
JTAG Port Operation
Overview
The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan
interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with VDD. The JTAG output
drivers are powered by VDDQ.
Disabling the JTAG Port
It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless
clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG
Port unused, TCK, TDI, and TMS may be left floating or tied to either VDD or VSS. TDO should be left unconnected.
Rev: 1.03 11/2004
26/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
JTAG Pin Descriptions
Pin
Pin Name
I/O
Description
TCK
Test Clock
In
Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate
from the falling edge of TCK.
TMS
Test Mode Select
In
The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP
controller state machine. An undriven TMS input will produce the same result as a logic one input
level.
In
The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers
placed between TDI and TDO. The register placed between TDI and TDO is determined by the
state of the TAP Controller state machine and the instruction that is currently loaded in the TAP
Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce
the same result as a logic one input level.
TDI
Test Data In
TDO
Test Data Out
Output that is active depending on the state of the TAP state machine. Output changes in
Out response to the falling edge of TCK. This is the output side of the serial registers placed between
TDI and TDO.
Note:
This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is
held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.
JTAG Port Registers
Overview
The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s
and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the
rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the
TDI and TDO pins.
Instruction Register
The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or
the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the
TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the
controller is placed in Test-Logic-Reset state.
Bypass Register
The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through
the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.
Boundary Scan Register
The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.
The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The
Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the
device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan
Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in
Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,
SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
Rev: 1.03 11/2004
27/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
JTAG TAP Block Diagram (2-die module)
·
·
·
·
·
108
·
·
0
Bypass Register
2 1 0
TDO
TDI
·
·
·
·
·
0
Bypass Register
·
· · ·
TDI
Instruction Register
TDO
ID Code Register
·
TCK ·
·
2 1 0
Instruction Register
31 30 29
·
Boundary Scan Register
0
·
·
1
·
·
0
·
·
1
Boundary Scan Register
·
108
·
ID Code Register
2 1 0
31 30 29
Control Signals
·
· · ·
2 1 0
Control Signals
TMS
Test Access Port (TAP) Controller
Test Access Port (TAP) Controller
Identification (ID) Register
The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in
Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.
It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the
controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
Tap Controller Instruction Set
Overview
There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific
(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be
implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load
address, data or control signals into the RAM or to preload the I/O buffers.
When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.
When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired
instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the
TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this
device is listed in the following table.
Rev: 1.03 11/2004
28/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
JTAG Tap Controller State Diagram
1
0
Test Logic Reset
0
Run Test Idle
1
Select DR
1
Select IR
0
0
1
1
Capture DR
Capture IR
0
0
Shift DR
1
1
Shift IR
0
1
1
Exit1 DR
0
Exit1 IR
0
0
Pause DR
1
Exit2 DR
1
Update DR
1
1
0
0
Pause IR
1
Exit2 IR
0
1
0
0
Update IR
1
0
Instruction Descriptions
BYPASS
When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This
occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facilitate testing of other devices in the scan path.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is
loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and
I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and
are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because
the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents
while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will
not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the
TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP
operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then
places the boundary scan register between the TDI and TDO pins.
Rev: 1.03 11/2004
29/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
EXTEST
EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with
all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is
still determined by its input pins.
Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.
Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output
drivers on the falling edge of TCK when the controller is in the Update-IR state.
Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruction is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not associated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR
state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associated.
IDCODE
The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and
places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction
loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.
SAMPLE-Z
If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (highZ) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR
state.
RFU
These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction.
Rev: 1.03 11/2004
30/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
JTAG Port AC Test Conditions
Parameter
Conditions
Input high level
VDD – 0.2 V
Input low level
0.2 V
Input slew rate
1 V/ns
Input reference level
VDDQ/2
Output reference level
VDDQ/2
JTAG Port AC Test Load
DQ
50Ω
30pF*
VDDQ/2
* Distributed Test Jig Capacitance
Notes:
1. Include scope and jig capacitance.
2. Test conditions as as shown unless otherwise noted.
JTAG TAP Instruction Set Summary
Instruction
Code
Description
EXTEST
000
Places the Boundary Scan Register between TDI and TDO.
1
IDCODE
001
Preloads ID Register and places it between TDI and TDO.
1, 2
SAMPLE-Z
010
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
Forces all RAM output drivers to High-Z.
1
RFU
011
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
1
SAMPLE/
PRELOAD
100
Captures I/O ring contents. Places the Boundary Scan Register between TDI and
TDO.
1
GSI
101
GSI private instruction.
1
RFU
110
Do not use this instruction; Reserved for Future Use.
Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
1
BYPASS
111
Places Bypass Register between TDI and TDO.
Notes:
1. Instruction codes expressed in binary, MSB on left, LSB on right.
2. Default instruction automatically loaded at power-up and in test-logic-reset state.
Rev: 1.03 11/2004
31/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Notes
1
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
JTAG Port Recommended Operating Conditions and DC Characteristics
Parameter
Symbol
Min.
Max.
Unit Notes
1.8 V Test Port Input High Voltage
VIHJ
0.6 * VDD
VDD +0.3
V
1
1.8 V Test Port Input Low Voltage
VILJ
–0.3
0.3 * VDD
V
1
TMS, TCK and TDI Input Leakage Current
IINHJ
–300
1
uA
2
TMS, TCK and TDI Input Leakage Current
IINLJ
–1
100
uA
3
TDO Output Leakage Current
IOLJ
–1
1
uA
4
Test Port Output High Voltage
VOHJ
1.7
—
V
5, 6
Test Port Output Low Voltage
VOLJ
—
0.4
V
5, 7
Test Port Output CMOS High
VOHJC
VDDQ – 100 mV
—
V
5, 8
Test Port Output CMOS Low
VOLJC
—
100 mV
V
5, 9
Notes:
1. Input Under/overshoot voltage must be –2 V > Vi < VDDn +2 V not to exceed 3.6 V maximum, with a pulse width not to exceed 20% tTKC.
2. VILJ ≤ VIN ≤ VDDn
3. 0 V ≤ VIN ≤ VILJn
4. Output Disable, VOUT = 0 to VDDn
5. The TDO output driver is served by the VDDQ supply.
6. IOHJ = –4 mA
7. IOLJ = + 4 mA
8. IOHJC = –100 uA
9. IOHJC = +100 uA
JTAG Port Timing Diagram
tTKC
tTKH
tTKL
TCK
tTH
tTS
TDI
tTH
tTS
TMS
tTKQ
TDO
tTH
tTS
Parallel SRAM input
Rev: 1.03 11/2004
32/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
JTAG Port AC Electrical Characteristics
Parameter
Symbol
Min
Max
Unit
TCK Cycle Time
tTKC
50
—
ns
TCK Low to TDO Valid
tTKQ
—
20
ns
TCK High Pulse Width
tTKH
20
—
ns
TCK Low Pulse Width
tTKL
20
—
ns
TDI & TMS Set Up Time
tTS
10
—
ns
TDI & TMS Hold Time
tTH
10
—
ns
Boundary Scan (BSDL Files)
For information regarding the Boundary Scan Chain, or to obtain BSDL files for this part, please contact our Applications
Engineering Department at: [email protected].
Rev: 1.03 11/2004
33/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
209 BGA Package Drawing (Package C)
14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array
C A1
A
Side View
D
aaa
D1
∅b
E
E1
e
Bottom View
e
Symbol
Min
Typ
Max
Units
Symbol
Min
Typ
Max
Units
A
—
—
1.70
mm
D1
—
18.0 (BSC)
—
mm
A1
0.40
0.50
0.60
mm
E
13.9
14.0
14.1
mm
∅b
0.50
0.60
0.70
mm
E1
—
10.0 (BSC)
—
mm
c
0.31
0.36
0.38
mm
e
—
1.00 (BSC)
—
mm
D
21.9
22.0
22.1
mm
aaa
—
0.15
—
mm
Rev 1.0
Rev: 1.03 11/2004
34/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Package Dimensions—119-Bump FPBGA (Package B, Variation 2)
TOP VIEW
A1
1
2
3
4
5
6
BOTTOM VIEW
A1
Ø0.10S C
Ø0.30S C AS B S
Ø0.60~0.90 (119x)
7
7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
20.32
22±0.10
1.27
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
B
0.15 C
7.62
C
Rev: 1.03 11/2004
SEATING PLANE
A
0.20(4x)
14±0.10
0.50~0.70
1.86.±0.13
0.56±0.05
0.70±0.05
0.15 C
1.27
35/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Package Dimensions—165-Bump FPBGA (Package E; Variation 1)
A1
TOP VIEW
BOTTOM
Ø0.10M C
Ø0.25M C A B
Ø0.44~0.64(165x)
1 2 3 4 5 6 7 8 9 10 11
VIEW
A1
11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1.0
14.0
17±0.05
1.0
A
B
C
D
E
F
G
H
I
J
K
L
M
N
P
R
A
1.0
1.0
0.20 C
B
C
Rev: 1.03 11/2004
SEATING PLANE
15±0.05
0.20(4x)
0.36~0.46
1.40 MAX.
0.36 REF
0.53 REF
0.35 C
10.0
36/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Ordering Information for GSI Synchronous Burst RAMs
Org
Part Number1
Type
Package
Speed2
(MHz/ns)
TA3
4M x 18
GS8644V18B-250
Pipeline/Flow Through
119 BGA (var. 2)
250/6.5
C
4M x 18
GS8644V18B-225
Pipeline/Flow Through
119 BGA (var. 2)
225/6.5
C
4M x 18
GS8644V18B-200
Pipeline/Flow Through
119 BGA (var. 2)
200/6.5
C
4M x 18
GS8644V18B-166
Pipeline/Flow Through
119 BGA (var. 2)
166/8
C
4M x 18
GS8644V18B-150
Pipeline/Flow Through
119 BGA (var. 2)
150/8.5
C
4M x 18
GS8644V18B-133
Pipeline/Flow Through
119 BGA (var. 2)
133/8.5
C
4M x 18
GS8644V18E-250
Pipeline/Flow Through
165 BGA (var. 1)
250/6.5
C
4M x 18
GS8644V18E-225
Pipeline/Flow Through
165 BGA (var. 1)
225/6.5
C
4M x 18
GS8644V18E-200
Pipeline/Flow Through
165 BGA (var. 1)
200/6.5
C
4M x 18
GS8644V18E-166
Pipeline/Flow Through
165 BGA (var. 1)
166/8
C
4M x 18
GS8644V18E-150
Pipeline/Flow Through
165 BGA (var. 1)
150/8.5
C
4M x 18
GS8644V18E-133
Pipeline/Flow Through
165 BGA (var. 1)
133/8.5
C
2M x 36
GS8644V36B-250
Pipeline/Flow Through
119 BGA (var. 2)
250/6.5
C
2M x 36
GS8644V36B-225
Pipeline/Flow Through
119 BGA (var. 2)
225/6.5
C
2M x 36
GS8644V36B-200
Pipeline/Flow Through
119 BGA (var. 2)
200/6.5
C
2M x 36
GS8644V36B-166
Pipeline/Flow Through
119 BGA (var. 2)
166/8
C
2M x 36
GS8644V36B-150
Pipeline/Flow Through
119 BGA (var. 2)
150/8.5
C
2M x 36
GS8644V36B-133
Pipeline/Flow Through
119 BGA (var. 2)
133/8.5
C
2M x 36
GS8644V36E-250
Pipeline/Flow Through
165 BGA (var. 1)
250/6.5
C
2M x 36
GS8644V36E-225
Pipeline/Flow Through
165 BGA (var. 1)
225/6.5
C
2M x 36
GS8644V36E-200
Pipeline/Flow Through
165 BGA (var. 1)
200/6.5
C
2M x 36
GS8644V36E-166
Pipeline/Flow Through
165 BGA (var. 1)
166/8
C
2M x 36
GS8644V36E-150
Pipeline/Flow Through
165 BGA (var. 1)
150/8.5
C
2M x 36
GS8644V36E-133
Pipeline/Flow Through
165 BGA (var. 1)
133/8.5
C
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS8644V18B-150IB.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.03 11/2004
37/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Ordering Information for GSI Synchronous Burst RAMs (Continued)
Org
Part Number1
Type
Package
Speed2
(MHz/ns)
TA3
1M x 72
GS8644V72C-250
Pipeline/Flow Through
209 BGA
250/6.5
C
1M x 72
GS8644V72C-225
Pipeline/Flow Through
209 BGA
225/6.5
C
1M x 72
GS8644V72C-200
Pipeline/Flow Through
209 BGA
200/6.5
C
1M x 72
GS8644V72C-166
Pipeline/Flow Through
209 BGA
166/8
C
1M x 72
GS8644V72C-150
Pipeline/Flow Through
209 BGA
150/8.5
C
1M x 72
GS8644V72C-133
Pipeline/Flow Through
209 BGA
133/8.5
C
4M x 18
GS8644V18B-250I
Pipeline/Flow Through
119 BGA (var. 2)
250/6.5
I
4M x 18
GS8644V18B-225I
Pipeline/Flow Through
119 BGA (var. 2)
225/6.5
I
4M x 18
GS8644V18B-200I
Pipeline/Flow Through
119 BGA (var. 2)
200/6.5
I
4M x 18
GS8644V18B-166I
Pipeline/Flow Through
119 BGA (var. 2)
166/8
I
4M x 18
GS8644V18B-150I
Pipeline/Flow Through
119 BGA (var. 2)
150/8.5
I
4M x 18
GS8644V18B-133I
Pipeline/Flow Through
119 BGA (var. 2)
133/8.5
I
4M x 18
GS8644V18E-250I
Pipeline/Flow Through
165 BGA (var. 1)
250/6.5
I
4M x 18
GS8644V18E-225I
Pipeline/Flow Through
165 BGA (var. 1)
225/6.5
I
4M x 18
GS8644V18E-200I
Pipeline/Flow Through
165 BGA (var. 1)
200/6.5
I
4M x 18
GS8644V18E-166I
Pipeline/Flow Through
165 BGA (var. 1)
166/8
I
4M x 18
GS8644V18E-150I
Pipeline/Flow Through
165 BGA (var. 1)
150/8.5
I
4M x 18
GS8644V18E-133I
Pipeline/Flow Through
165 BGA (var. 1)
133/8.5
I
2M x 36
GS8644V36B-250I
Pipeline/Flow Through
119 BGA (var. 2)
250/6.5
I
2M x 36
GS8644V36B-225I
Pipeline/Flow Through
119 BGA (var. 2)
225/6.5
I
2M x 36
GS8644V36B-200I
Pipeline/Flow Through
119 BGA (var. 2)
200/6.5
I
2M x 36
GS8644V36B-166I
Pipeline/Flow Through
119 BGA (var. 2)
166/8
I
2M x 36
GS8644V36B-150I
Pipeline/Flow Through
119 BGA (var. 2)
150/8.5
I
2M x 36
GS8644V36B-133I
Pipeline/Flow Through
119 BGA (var. 2)
133/8.5
I
2M x 36
GS8644V36E-250I
Pipeline/Flow Through
165 BGA (var. 1)
250/6.5
I
2M x 36
GS8644V36E-225I
Pipeline/Flow Through
165 BGA (var. 1)
225/6.5
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS8644V18B-150IB.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.03 11/2004
38/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
Ordering Information for GSI Synchronous Burst RAMs (Continued)
Org
Part Number1
Type
Package
Speed2
(MHz/ns)
TA3
2M x 36
GS8644V36E-200I
Pipeline/Flow Through
165 BGA (var. 1)
200/6.5
I
2M x 36
GS8644V36E-166I
Pipeline/Flow Through
165 BGA (var. 1)
166/8
I
2M x 36
GS8644V36E-150I
Pipeline/Flow Through
165 BGA (var. 1)
150/8.5
I
2M x 36
GS8644V36E-133I
Pipeline/Flow Through
165 BGA (var. 1)
133/8.5
I
1M x 72
GS8644V72C-250I
Pipeline/Flow Through
209 BGA
250/6.5
I
1M x 72
GS8644V72C-225I
Pipeline/Flow Through
209 BGA
225/6.5
I
1M x 72
GS8644V72C-200I
Pipeline/Flow Through
209 BGA
200/6.5
I
1M x 72
GS8644V72C-166I
Pipeline/Flow Through
209 BGA
166/8
I
1M x 72
GS8644V72C-150I
Pipeline/Flow Through
209 BGA
150/8.5
I
1M x 72
GS8644V72C-133I
Pipeline/Flow Through
209 BGA
133/8.5
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS8644V18B-150IB.
2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range.
4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.03 11/2004
39/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
Product Preview
GS8644V18(B/E)/GS8644V36(B/E)/GS8644V72(C)
72Mb Sync SRAM Data Sheet Revision History
DS/DateRev. Code: Old;
New
Types of Changes
Format or Content
Page;Revisions;Reason
• Creation of new datasheet
8644Vxx_r1
Content
• Updated Operating Currents table
• Updated FT AC Characteristics for tKQ
8644Vxx_r1_01;
8644Vxx_r1_02
Content
• Updated FT tKQ and PL tS/tH and FT current numbers for 250
and 225 MHz (match 200 MHz)
• Updated basic format
• Added thermal characteristics to mechanical drawings
• Updated JTAG section for module
8644Vxx_r1_02;
8644Vxx_r1_03
Format/Content
8644Vxx_r1; 8644Vxx_r1_01
Rev: 1.03 11/2004
• Updated format
• Added variation information for package mechanicals
40/40
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology