Renesas H8/3834 Single-chip microcomputer Datasheet

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Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
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H8/3834 Series
H8/3837
HD6433837, HD6433837S, HD64473837
H8/3836
HD6433836, HD6433836S
H8/3835
HD6433835, HD6433835S
H8/3834
HD6433834, HD6433834S, HD6473834
H8/3833
HD6433833, HD6433833S
H8/3832
HD6433832S
Hardware Manual
ADE-602-054D
Rev. 5.0
3/5/03
Hitachi, Ltd.
MC-Setsu
Notice
When using this document, keep the following in mind:
1. This document may, wholly or partially, be subject to change without notice.
2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole
or part of this document without Hitachi’s permission.
3. Hitachi will not be held responsible for any damage to the user that may result from accidents
or any other reasons during operation of the user’s unit according to this document.
4. Circuitry and other examples described herein are meant merely to indicate the characteristics
and performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for
any intellectual property claims or other problems that may result from applications based on
the examples described herein.
5. No license is granted by implication or otherwise under any patents or other rights of any third
party or Hitachi, Ltd.
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales
company. Such use includes, but is not limited to, use in life support systems. Buyers of
Hitachi’s products are requested to notify the relevant Hitachi sales offices when planning to
use the products in MEDICAL APPLICATIONS.
Preface
The H8/300L Series of single-chip microcomputers has the high-speed H8/300L CPU at its core,
with many necessary peripheral functions on-chip. The H8/300L CPU instruction set is compatible
with the H8/300 CPU.
The H8/3834 Series has a system-on-a-chip architecture that includes such peripheral functions as
an LCD controller/driver, five types of timers, a 14-bit PWM, a three-channel serial
communication interface, and an A/D converter. This makes it ideal for use in systems requiring
an LCD display.
This manual describes the hardware of the H8/3834 Series. For details on the H8/3834 Series
instruction set, refer to the H8/300L Series Programming Manual.
Note: The terms H8/3834, H8/3834S, and H8/3834 Series used in the text refer to the products
shown below.
1. H8/3834:
HD6433837, HD6433836, HD6433835, HD6433834, HD6433833,
HD6473837, HD6473834
2. H8/3834S:
HD6433837S, HD6433836S, HD6433835S, HD6433834S, HD6433833S,
HD6433832S
3. H8/3834 Series: All products, including the H8/3834 and H8/3834S
Contents
Section 1
1.1
1.2
1.3
Overview ............................................................................................................
Overview ............................................................................................................................
Internal Block Diagram ......................................................................................................
Pin Arrangement and Functions .........................................................................................
1.3.1 Pin Arrangement ...................................................................................................
1.3.2 Pin Functions.........................................................................................................
Section 2
2.1
2.2
2.3
2.4
2.5
2.6
2.7
CPU......................................................................................................................
Overview ............................................................................................................................
2.1.1 Features .................................................................................................................
2.1.2 Address Space .......................................................................................................
2.1.3 Register Configuration ..........................................................................................
Register Descriptions..........................................................................................................
2.2.1 General Registers ..................................................................................................
2.2.2 Control Registers...................................................................................................
2.2.3 Initial Register Values ...........................................................................................
Data Formats ......................................................................................................................
2.3.1 Data Formats in General Registers........................................................................
2.3.2 Memory Data Formats ..........................................................................................
Addressing Modes..............................................................................................................
2.4.1 Addressing Modes.................................................................................................
2.4.2 Effective Address Calculation...............................................................................
Instruction Set ....................................................................................................................
2.5.1 Data Transfer Instructions .....................................................................................
2.5.2 Arithmetic Operations ...........................................................................................
2.5.3 Logic Operations ...................................................................................................
2.5.4 Shift Operations ....................................................................................................
2.5.5 Bit Manipulations..................................................................................................
2.5.6 Branching Instructions ..........................................................................................
2.5.7 System Control Instructions..................................................................................
2.5.8 Block Data Transfer Instruction............................................................................
Basic Operational Timing ..................................................................................................
2.6.1 Access to On-Chip Memory (RAM, ROM)..........................................................
2.6.2 Access to On-Chip Peripheral Modules................................................................
CPU States..........................................................................................................................
2.7.1 Overview ...............................................................................................................
2.7.2 Program Execution State .......................................................................................
2.7.3 Program Halt State ................................................................................................
2.7.4 Exception-Handling State .....................................................................................
1
1
5
6
6
8
13
13
13
14
14
15
15
15
17
17
18
19
20
20
22
26
28
30
31
31
33
37
39
40
41
41
42
43
43
45
45
45
i
2.8
2.9
Memory Map......................................................................................................................
2.8.1 Memory Map.........................................................................................................
2.8.2 LCD RAM Address Relocation ............................................................................
Application Notes...............................................................................................................
2.9.1 Notes on Data Access............................................................................................
2.9.2 Notes on Bit Manipulation ....................................................................................
2.9.3 Notes on Use of the EEPMOV Instruction ...........................................................
Section 3
3.1
3.2
3.3
3.4
Exception Handling ........................................................................................ 63
Overview ............................................................................................................................
Reset ...................................................................................................................................
3.2.1 Overview ...............................................................................................................
3.2.2 Reset Sequence......................................................................................................
3.2.3 Interrupt Immediately after Reset .........................................................................
Interrupts ............................................................................................................................
3.3.1 Overview ...............................................................................................................
3.3.2 Interrupt Control Registers....................................................................................
3.3.3 External Interrupts.................................................................................................
3.3.4 Internal Interrupts..................................................................................................
3.3.5 Interrupt Operations ..............................................................................................
3.3.6 Interrupt Response Time .......................................................................................
Application Notes...............................................................................................................
3.4.1 Notes on Stack Area Use ......................................................................................
3.4.2 Notes on Rewriting Port Mode Registers..............................................................
Section 4
4.1
4.2
4.3
4.4
4.5
Clock Pulse Generators..................................................................................
Overview ............................................................................................................................
4.1.1 Block Diagram ......................................................................................................
4.1.2 System Clock and Subclock..................................................................................
System Clock Generator.....................................................................................................
Subclock Generator ............................................................................................................
Prescalers............................................................................................................................
Note on Oscillators .............................................................................................................
Section 5
5.1
5.2
5.3
ii
46
46
52
53
53
55
61
Power-Down Modes .......................................................................................
Overview ............................................................................................................................
5.1.1 System Control Registers......................................................................................
Sleep Mode.........................................................................................................................
5.2.1 Transition to Sleep Mode ......................................................................................
5.2.2 Clearing Sleep Mode .............................................................................................
Standby Mode ....................................................................................................................
5.3.1 Transition to Standby Mode..................................................................................
5.3.2 Clearing Standby Mode ........................................................................................
63
63
63
63
65
66
66
67
75
76
76
81
81
81
82
85
85
85
85
86
88
91
92
93
93
96
99
99
99
99
99
100
5.4
5.5
5.6
5.7
5.8
5.3.3 Oscillator Settling Time after Standby Mode is Cleared ...................................... 100
5.3.4 Transition to Standby Mode and Port Pin States .................................................. 101
Watch Mode ....................................................................................................................... 101
5.4.1 Transition to Watch Mode .................................................................................... 101
5.4.2 Clearing Watch Mode ........................................................................................... 102
5.4.3 Oscillator Settling Time after Watch Mode is Cleared ......................................... 102
Subsleep Mode ................................................................................................................... 102
5.5.1 Transition to Subsleep Mode ................................................................................ 102
5.5.2 Clearing Subsleep Mode ....................................................................................... 103
Subactive Mode.................................................................................................................. 103
5.6.1 Transition to Subactive Mode ............................................................................... 103
5.6.2 Clearing Subactive Mode...................................................................................... 103
5.6.3 Operating Frequency in Subactive Mode.............................................................. 103
Active (medium-speed) Mode............................................................................................ 104
5.7.1 Transition to Active (medium-speed) Mode ......................................................... 104
5.7.2 Clearing Active (medium-speed) Mode................................................................ 104
5.7.3 Operating Frequency in Active (medium-speed) Mode........................................ 104
Direct Transfer.................................................................................................................... 104
5.8.1 Direct Transfer Overview...................................................................................... 104
5.8.2 Calculation of Direct Transfer Time before Transition ........................................ 106
Section 6
6.1
6.2
6.3
6.4
6.5
6.6
ROM .................................................................................................................... 109
Overview ............................................................................................................................ 109
6.1.1 Block Diagram ...................................................................................................... 109
H8/3834 PROM Mode ....................................................................................................... 110
6.2.1 Setting to PROM Mode......................................................................................... 110
6.2.2 Socket Adapter Pin Arrangement and Memory Map............................................ 110
H8/3834 Programming ....................................................................................................... 113
6.3.1 Writing and Verifying ........................................................................................... 113
6.3.2 Programming Precautions ..................................................................................... 117
H8/3837 PROM Mode ....................................................................................................... 118
6.4.1 Setting to PROM Mode......................................................................................... 118
6.4.2 Socket Adapter Pin Arrangement and Memory Map............................................ 118
H8/3837 Programming ....................................................................................................... 121
6.5.1 Writing and Verifying ........................................................................................... 121
6.5.2 Programming Precautions ..................................................................................... 126
Reliability of Programmed Data ........................................................................................ 127
Section 7
7.1
RAM .................................................................................................................... 129
Overview ............................................................................................................................ 129
7.1.1 Block Diagram ...................................................................................................... 129
Section 8
I/O Ports ............................................................................................................. 131
iii
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
iv
Overview ............................................................................................................................ 131
Port 1 .................................................................................................................................. 133
8.2.1 Overview ............................................................................................................... 133
8.2.2 Register Configuration and Description................................................................ 133
8.2.3 Pin Functions......................................................................................................... 137
8.2.4 Pin States ............................................................................................................... 139
Port 2 .................................................................................................................................. 140
8.3.1 Overview ............................................................................................................... 140
8.3.2 Register Configuration and Description................................................................ 140
8.3.3 Pin Functions......................................................................................................... 144
8.3.4 Pin States ............................................................................................................... 144
Port 3 .................................................................................................................................. 145
8.4.1 Overview ............................................................................................................... 145
8.4.2 Register Configuration and Description................................................................ 145
8.4.3 Pin Functions......................................................................................................... 149
8.4.4 Pin States ............................................................................................................... 151
8.4.5 MOS Input Pull-Up ............................................................................................... 151
Port 4 .................................................................................................................................. 152
8.5.1 Overview ............................................................................................................... 152
8.5.2 Register Configuration and Description................................................................ 152
8.5.3 Pin Functions......................................................................................................... 154
8.5.4 Pin States ............................................................................................................... 155
Port 5 .................................................................................................................................. 155
8.6.1 Overview ............................................................................................................... 155
8.6.2 Register Configuration and Description................................................................ 156
8.6.3 Pin Functions......................................................................................................... 158
8.6.4 Pin States ............................................................................................................... 158
8.6.5 MOS Input Pull-Up ............................................................................................... 159
Port 6 .................................................................................................................................. 159
8.7.1 Overview ............................................................................................................... 159
8.7.2 Register Configuration and Description................................................................ 160
8.7.3 Pin Functions......................................................................................................... 161
8.7.4 Pin States ............................................................................................................... 162
8.7.5 MOS Input Pull-Up ............................................................................................... 162
Port 7 .................................................................................................................................. 163
8.8.1 Overview ............................................................................................................... 163
8.8.2 Register Configuration and Description................................................................ 163
8.8.3 Pin Functions......................................................................................................... 164
8.8.4 Pin States ............................................................................................................... 165
Port 8 .................................................................................................................................. 165
8.9.1 Overview ............................................................................................................... 165
8.9.2 Register Configuration and Description................................................................ 165
8.9.3 Pin Functions......................................................................................................... 167
8.10
8.11
8.12
8.13
8.9.4 Pin States ............................................................................................................... 167
Port 9 .................................................................................................................................. 168
8.10.1 Overview ............................................................................................................... 168
8.10.2 Register Configuration and Description................................................................ 168
8.10.3 Pin Functions......................................................................................................... 169
8.10.4 Pin States ............................................................................................................... 171
Port A.................................................................................................................................. 171
8.11.1 Overview ............................................................................................................... 171
8.11.2 Register Configuration and Description................................................................ 172
8.11.3 Pin Functions......................................................................................................... 173
8.11.4 Pin States ............................................................................................................... 174
Port B.................................................................................................................................. 175
8.12.1 Overview ............................................................................................................... 175
8.12.2 Register Configuration and Description................................................................ 175
Port C.................................................................................................................................. 176
8.13.1 Overview ............................................................................................................... 176
8.13.2 Register Configuration and Description................................................................ 176
Section 9
9.1
9.2
9.3
9.4
9.5
9.6
Timers ................................................................................................................. 177
Overview ............................................................................................................................ 177
Timer A .............................................................................................................................. 178
9.2.1 Overview ............................................................................................................... 178
9.2.2 Register Descriptions ............................................................................................ 180
9.2.3 Timer Operation .................................................................................................... 182
9.2.4 Timer A Operation States...................................................................................... 183
Timer B .............................................................................................................................. 183
9.3.1 Overview ............................................................................................................... 183
9.3.2 Register Descriptions ............................................................................................ 185
9.3.3 Timer Operation .................................................................................................... 187
9.3.4 Timer B Operation States...................................................................................... 188
Timer C .............................................................................................................................. 188
9.4.1 Overview ............................................................................................................... 188
9.4.2 Register Descriptions ............................................................................................ 190
9.4.3 Timer Operation .................................................................................................... 192
9.4.4 Timer C Operation States...................................................................................... 194
Timer F ............................................................................................................................... 194
9.5.1 Overview ............................................................................................................... 194
9.5.2 Register Descriptions ............................................................................................ 197
9.5.3 Interface with the CPU.......................................................................................... 203
9.5.4 Timer Operation .................................................................................................... 206
9.5.5 Application Notes.................................................................................................. 208
Timer G .............................................................................................................................. 210
9.6.1 Overview ............................................................................................................... 210
v
9.6.2
9.6.3
9.6.4
9.6.5
9.6.6
Register Descriptions ............................................................................................ 212
Noise Canceller Circuit ......................................................................................... 215
Timer Operation .................................................................................................... 217
Application Notes.................................................................................................. 221
Sample Timer G Application ................................................................................ 224
Section 10 Serial Communication Interface ................................................................. 225
10.1 Overview ........................................................................................................................... 225
10.2 SCI1.................................................................................................................................... 225
10.2.1 Overview ............................................................................................................... 225
10.2.2 Register Descriptions ............................................................................................ 227
10.2.3 Operation ............................................................................................................... 231
10.2.4 Interrupts ............................................................................................................... 234
10.2.5 Application Notes.................................................................................................. 234
10.3 SCI2.................................................................................................................................... 234
10.3.1 Overview ............................................................................................................... 234
10.3.2 Register Descriptions ............................................................................................ 236
10.3.3 Operation ............................................................................................................... 240
10.3.4 Interrupts ............................................................................................................... 247
10.3.5 Application Notes.................................................................................................. 247
10.4 SCI3.................................................................................................................................... 248
10.4.1 Overview ............................................................................................................... 248
10.4.2 Register Descriptions ............................................................................................ 250
10.4.3 Operation ............................................................................................................... 266
10.4.4 Operation in Asynchronous Mode ........................................................................ 270
10.4.5 Operation in Synchronous Mode .......................................................................... 278
10.4.6 Multiprocessor Communication Function ............................................................ 285
10.4.7 Interrupts ............................................................................................................... 291
10.4.8 Application Notes.................................................................................................. 292
Section 11 14-Bit PWM ...................................................................................................... 297
11.1 Overview ............................................................................................................................ 297
11.1.1 Features ................................................................................................................. 297
11.1.2 Block Diagram ...................................................................................................... 297
11.1.3 Pin Configuration .................................................................................................. 298
11.1.4 Register Configuration .......................................................................................... 298
11.2 Register Descriptions.......................................................................................................... 298
11.2.1 PWM Control Register (PWCR)........................................................................... 298
11.2.2 PWM Data Registers U and L (PWDRU, PWDRL)............................................. 299
11.3 Operation ............................................................................................................................ 299
Section 12 A/D Converter .................................................................................................. 301
12.1 Overview ............................................................................................................................ 301
vi
12.2
12.3
12.4
12.5
12.6
12.1.1 Features ................................................................................................................. 301
12.1.2 Block Diagram ...................................................................................................... 301
12.1.3 Pin Configuration .................................................................................................. 302
12.1.4 Register Configuration.......................................................................................... 302
Register Descriptions.......................................................................................................... 303
12.2.1 A/D Result Register (ADRR)................................................................................ 303
12.2.2 A/D Mode Register (AMR) .................................................................................. 303
12.2.3 A/D Start Register (ADSR)................................................................................... 305
Operation ............................................................................................................................ 306
12.3.1 A/D Conversion Operation.................................................................................... 306
12.3.2 Start of A/D Conversion by External Trigger Input.............................................. 306
Interrupts ............................................................................................................................ 307
Typical Use ........................................................................................................................ 307
Application Notes............................................................................................................... 310
Section 13 LCD Controller/Driver .................................................................................. 311
13.1 Overview ............................................................................................................................ 311
13.1.1 Features ................................................................................................................. 311
13.1.2 Block Diagram ...................................................................................................... 312
13.1.3 Pin Configuration .................................................................................................. 313
13.1.4 Register Configuration .......................................................................................... 313
13.2 Register Descriptions.......................................................................................................... 314
13.2.1 LCD Port Control Register (LPCR)...................................................................... 314
13.2.2 LCD Control Register (LCR)................................................................................ 316
13.3 Operation ............................................................................................................................ 318
13.3.1 Settings Prior to LCD Display .............................................................................. 318
13.3.2 Relation of LCD RAM to Display ........................................................................ 320
13.3.3 Connection to HD66100........................................................................................ 320
13.3.4 Operation in Power-Down Modes ........................................................................ 329
13.3.5 Boosting the LCD Driver Power Supply .............................................................. 330
Section 14 Electrical Characteristics ............................................................................... 331
14.1 H8/3832S, H8/3833S, H8/3834S, H8/3835S, H8/3836S and H8/3837S
Absolute Maximum Ratings (Standard Specifications) ..................................................... 331
14.2 H8/3832S, H8/3833S and H8/3834S Electrical Characteristics
(Standard Specifications).................................................................................................... 332
14.2.1 Power Supply Voltage and Operating Range........................................................ 332
14.2.2 DC Characteristics ................................................................................................ 334
14.2.3 AC Characteristics ................................................................................................ 339
14.2.4 A/D Converter Characteristics .............................................................................. 343
14.2.5 LCD Characteristics .............................................................................................. 344
14.3 H8/3835S, H8/3836S and H8/3837S Electrical Characteristics
(Standard Specifications).................................................................................................... 345
vii
14.4
14.5
14.6
14.7
14.8
14.9
14.10
14.11
viii
14.3.1 Power Supply Voltage and Operating Range........................................................ 345
14.3.2 DC Characteristics ................................................................................................ 347
14.3.3 AC Characteristics ................................................................................................ 352
14.3.4 A/D Converter Characteristics .............................................................................. 356
14.3.5 LCD Characteristics .............................................................................................. 357
H8/3832S, H8/3833S, H8/3834S, H8/3835S, H8/3836S and H8/3837S
Absolute Maximum Ratings (Wide Temperature Range (I-Spec) Version)...................... 358
H8/3832S, H8/3833S and H8/3834S Electrical Characteristics
(Wide Temperature Range (I-Spec) Version) .................................................................... 359
14.5.1 Power Supply Voltage and Operating Range........................................................ 359
14.5.2 DC Characteristics ................................................................................................ 361
14.5.3 AC Characteristics ................................................................................................ 366
14.5.4 A/D Converter Characteristics .............................................................................. 370
14.5.5 LCD Characteristics .............................................................................................. 371
H8/3835S, H8/3836S and H8/3837S Electrical Characteristics
(Wide Temperature Range (I-Spec) Version) .................................................................... 373
14.6.1 Power Supply Voltage and Operating Range........................................................ 373
14.6.2 DC Characteristics ................................................................................................ 375
14.6.3 AC Characteristics ................................................................................................ 380
14.6.4 A/D Converter Characteristics .............................................................................. 384
14.6.5 LCD Characteristics .............................................................................................. 385
H8/3833, H8/3834, H8/3835, H8/3836, and H8/3837 (Standard Specification)
Absolute Maximum Ratings............................................................................................... 387
H8/3833 and H8/3834 Electrical Characteristics (Standard Specifications)...................... 388
14.8.1 Power Supply Voltage and Operating Range........................................................388
14.8.2 DC Characteristics ................................................................................................ 390
14.8.3 AC Characteristics ................................................................................................ 395
14.8.4 A/D Converter Characteristics .............................................................................. 399
14.8.5 LCD Characteristics .............................................................................................. 400
H8/3835 and H8/3836 and H8/3837 (Standard Specifications)
Electrical Characteristics.................................................................................................... 401
14.9.1 Power Supply Voltage and Operating Range........................................................ 401
14.9.2 DC Characteristics ................................................................................................ 403
14.9.3 AC Characteristics ................................................................................................ 408
14.9.4 A/D Converter Characteristics .............................................................................. 412
14.9.5 LCD Characteristics .............................................................................................. 413
H8/3833, H8/3834, H8/3835, H8/3836, and H8/3837 Absolute Maximum Ratings
(Wide Temperature Range (I-Spec) Version) .................................................................... 414
H8/3833 and H8/3834 Electrical Characteristics (Wide Temperature Range
(I-Spec) Version)................................................................................................................ 415
14.11.1 Power Supply Voltage and Operating Range........................................................ 415
14.11.2 DC Characteristics ................................................................................................ 417
14.11.3 AC Characteristics ................................................................................................ 422
14.11.4 A/D Converter Characteristics .............................................................................. 426
14.11.5 LCD Characteristics .............................................................................................. 427
14.12 H8/3835, H8/3836, and H8/3837 Electrical Characteristics
(Wide Temperature Range (I-Spec) Version) .................................................................... 429
14.12.1 Power Supply Voltage and Operating Range........................................................ 429
14.12.2 DC Characteristics ................................................................................................ 431
14.12.3 AC Characteristics ................................................................................................ 436
14.12.4 A/D Converter Characteristics .............................................................................. 440
14.12.5 LCD Characteristics .............................................................................................. 441
14.13 Operation Timing ............................................................................................................... 443
14.14 Output Load Circuit............................................................................................................ 448
Appendix A CPU Instruction Set ..................................................................................... 449
A.1
A.2
A.3
Instructions ......................................................................................................................... 449
Operation Code Map .......................................................................................................... 457
Number of Execution States............................................................................................... 459
Appendix B On-Chip Registers ........................................................................................ 466
B.1
B.2
I/O Registers (1) ................................................................................................................. 466
I/O Registers (2) ................................................................................................................. 470
Appendix C I/O Port Block Diagrams............................................................................ 513
C.1
C.2
C.3
C.4
C.5
C.6
C.7
C.8
C.9
C.10
C.11
C.12
Block Diagram of Port 1 .................................................................................................... 513
Block Diagram of Port 2 .................................................................................................... 518
Block Diagram of Port 3 .................................................................................................... 521
Block Diagram of Port 4 .................................................................................................... 527
Block Diagram of Port 5 .................................................................................................... 530
Block Diagram of Port 6 .................................................................................................... 531
Block Diagram of Port 7 .................................................................................................... 532
Block Diagram of Port 8 .................................................................................................... 533
Block Diagram of Port 9 .................................................................................................... 534
Block Diagram of Port A.................................................................................................... 535
Block Diagram of Port B.................................................................................................... 536
Block Diagram of Port C.................................................................................................... 536
Appendix D Port States in the Different Processing States ....................................... 537
Appendix E List of Products Codes ................................................................................. 538
Appendix F Package Dimensions ..................................................................................... 542
ix
Section 1 Overview
1.1
Overview
The H8/300L Series is a series of single-chip microcomputers (MCU: microcomputer unit), built
around the high-speed H8/300L CPU and equipped with peripheral system functions on-chip.
Within the H8/300L Series, the H8/3834 Series features an on-chip liquid crystal display (LCD)
controller/driver. Other on-chip peripheral functions include five timers, a 14-bit pulse width
modulator (PWM), three serial communication interface channels, and an analog-to-digital (A/D)
converter. Together these functions make the H8/3834 Series ideally suited for embedded control
of systems requiring an LCD display. On-chip memory is 16 kbytes of ROM and 1 kbyte of RAM
in the H8/3832S, 24 kbytes of ROM and 1 kbyte of RAM in the H8/3833(S), 32 kbytes of ROM
and 1 kbyte of RAM in the H8/3834(S), 40 kbytes of ROM and 2 kbytes of RAM in the
H8/3835(S), 48 kbytes of ROM and 2 kbytes of RAM in the H8/3836(S), and 60 kbytes of ROM
and 2 kbytes of RAM in the H8/3837(S).
The H8/3834 and H8/3837 both include a ZTAT™ version*, featuring a user-programmable onchip PROM.
Table 1.1 summarizes the features of the H8/3834 Series.
Note: * ZTAT is a trademark of Hitachi, Ltd.
Table 1.1
Features
Item
Description
CPU
High-speed H8/300L CPU
•
•
•
General-register architecture
General registers: Sixteen 8-bit registers (can be used as eight 16-bit
registers)
Operating speed
 Max. operating speed: 5 MHz
 Add/subtract: 0.4 µs (operating at 5 MHz)
 Multiply/divide: 2.8 µs (operating at 5 MHz)
 Can run on 32.768 kHz subclock
Instruction set compatible with H8/300 CPU
 Instruction length of 2 bytes or 4 bytes
 Basic arithmetic operations between registers
 MOV instruction for data transfer between memory and registers
1
Table 1.1
Features (cont)
Item
Description
CPU
Typical instructions
•
•
•
•
Interrupts
Multiply (8 bits × 8 bits)
Divide (16 bits ÷ 8 bits)
Bit accumulator
Register-indirect designation of bit position
33 interrupt sources
•
•
13 external interrupt pins: IRQ4 to IRQ 0, WKP 7 to WKP0
20 internal interrupt sources
Clock pulse generators Two on-chip clock pulse generators
•
•
Power-down modes
Six power-down modes
•
•
•
•
•
•
Memory
H8/3832S:
H8/3833(S):
H8/3834(S):
H8/3835(S):
H8/3836(S):
H8/3837(S):
16-kbyte ROM, 1-kbyte RAM
24-kbyte ROM, 1-kbyte RAM
32-kbyte ROM, 1-kbyte RAM
40-kbyte ROM, 2-kbyte RAM
48-kbyte ROM, 2-kbyte RAM
60-kbyte ROM, 2-kbyte RAM
84 I/O port pins
•
•
Timers
Sleep mode
Standby mode
Watch mode
Subsleep mode
Subactive mode
Active (medium-speed) mode
Large on-chip memory
•
•
•
•
•
•
I/O ports
System clock pulse generator: 1 to 10 MHz
Subclock pulse generator: 32.768 kHz
I/O pins: 71
Input pins: 13
Five on-chip timers
•
Timer A: 8-bit timer
Count-up timer with selection of eight internal clock signals divided
from the system clock (φ)* and four clock signals divided from the
watch clock (φ w )*
Note: * φ and φ w are defined in section 4, Clock Pulse Generators.
2
Table 1.1
Features (cont)
Item
Description
Timers
•
•
•
•
Serial communication
interface
Timer B: 8-bit timer
 Count-up timer with selection of seven internal clock signals or
event input from external pin
 Auto-reloading
Timer C: 8-bit timer
 Count-up/count-down timer with selection of seven internal clock
signals or event input from external pin
 Auto-reloading
Timer F: 16-bit timer
 Can be used as two independent 8-bit timers.
 Count-up timer with selection of four internal clock signals or
event input from external pin
 Compare-match function with toggle output
Timer G: 8-bit timer
 Count-up timer with selection of four internal clock signals
 Input capture function with built-in noise canceller circuit
Three channels on chip
•
SCI1: synchronous serial interface
•
Choice of 8-bit or 16-bit data transfer
SCI2: 8-bit synchronous serial interface
•
Automatic transfer of 32-byte data segments
SCI3: 8-bit synchronous or asynchronous serial interface
Built-in function for multiprocessor communication
14-bit PWM
A/D converter
Pulse-division PWM output for reduced ripple
•
Can be used as a 14-bit D/A converter by connecting to an external
low-pass filter.
•
Successive approximations using a resistance ladder resolution:
8 bits
12-channel analog input port
Conversion time: 31/ φ or 62/ φ per channel
•
•
LCD controller/driver
Up to 40 segment pins and 4 common pins
•
•
•
Choice of four duty cycles (static, 1/2, 1/3, 1/4)
Segments can be expanded externally
Segment pins can be switched to general-purpose ports in groups of
four
3
Table 1.1
Features (cont)
Item
Product lineup
4
Description
Product Code
Mask ROM Version
HD6433832SH
HD6433832SF
HD6433832SX
HD6433833H
HD6433833SH
HD6433833F
HD6433833SF
HD6433833X
HD6433833SX
HD6433834H
HD6433834SH
HD6433834F
HD6433834SF
HD6433834X
HD6433834SX
HD6433835H
HD6433835SH
HD6433835F
HD6433835SF
HD6433835X
HD6433835SX
HD6433836H
HD6433836SH
HD6433836F
HD6433836SF
HD6433836X
HD6433836SX
HD6433837H
HD6433837SH
HD6433837F
HD6433837SF
HD6433837X
HD6433837SX
HD6433832SD
HD6433832SE
HD6433832SL
HD6433833D
HD6433833SD
HD6433833E
HD6433833SE
HD6433833L
HD6433833SL
HD6433834D
HD6433834SD
HD6433834E
HD6433834SE
HD6433834L
HD6433834SL
HD6433835D
HD6433835SD
HD6433835E
HD6433835SE
HD6433835L
HD6433835SL
HD6433836D
HD6433836SD
HD6433836E
HD6433836SE
HD6433836L
HD6433836SL
HD6433837D
HD6433837SD
HD6433837E
HD6433837SE
HD6433837L
HD6433837SL
ZTAT™ Version
—
—
—
—
Package
100-pin QFP (FP-100B)
100-pin QFP (FP-100A)
100-pin TQFP (TFP-100B)
100-pin QFP (FP-100B)
—
100-pin QFP (FP-100A)
—
100-pin TQFP (TFP-100B)
HD6473834H
100-pin QFP (FP-100B)
HD6473834F
100-pin QFP (FP-100A)
HD6473834X
100-pin TQFP (TFP-100B)
—
100-pin QFP (FP-100B)
—
100-pin QFP (FP-100A)
—
100-pin TQFP (TFP-100B)
—
100-pin QFP (FP-100B)
—
100-pin QFP (FP-100A)
—
100-pin TQFP (TFP-100B)
HD6473837H
100-pin QFP (FP-100B)
HD6473837F
100-pin QFP (FP-100A)
HD6473837X
100-pin TQFP (TFP-100B)
—
—
—
—
100-pin QFP (FP-100B)
100-pin QFP (FP-100A)
100-pin TQFP (TFP-100B)
100-pin QFP (FP-100B)
—
100-pin QFP (FP-100A)
—
100-pin TQFP (TFP-100B)
HD6473834D
100-pin QFP (FP-100B)
HD6473834E
100-pin QFP (FP-100A)
—
100-pin TQFP (TFP-100B)
—
100-pin QFP (FP-100B)
—
100-pin QFP (FP-100A)
—
100-pin TQFP (TFP-100B)
—
100-pin QFP (FP-100B)
—
100-pin QFP (FP-100A)
—
100-pin TQFP (TFP-100B)
HD6473837D
100-pin QFP (FP-100B)
HD6473837E
100-pin QFP (FP-100A)
HD6473837L
100-pin TQFP (TFP-100B)
ROM/RAM Size
ROM: 16 kbytes
RAM: 1 kbyte
ROM: 24 kbytes
RAM: 1 kbyte
ROM: 32 kbytes
RAM: 1 kbyte
ROM: 40 kbytes
RAM: 2 kbytes
ROM: 48 kbytes
RAM: 2 kbytes
ROM: 60 kbytes
RAM: 2 kbytes
ROM: 16 kbytes
RAM: 1 kbyte
WTR (I-spec)
ROM: 24 kbytes
RAM: 1 kbyte
WTR (I-spec)
ROM: 32 kbytes
RAM: 1 kbyte
WTR (I-spec)
ROM: 40 kbytes
RAM: 2 kbytes
WTR (I-spec)
ROM: 48 kbytes
RAM: 2 kbytes
WTR (I-spec)
ROM: 60 kbytes
RAM: 2 kbytes
WTR (I-spec)
1.2
Internal Block Diagram
Port 9
P97/SEG40/CL1
P96/SEG39/CL2
P95/SEG38/DO
P94/SEG37/M
P93/SEG36
P92/SEG35
P91/SEG34
P90/SEG33
Port 8
P87/SEG32
P86/SEG31
P85/SEG30
P84/SEG29
P83/SEG28
P82/SEG27
P81/SEG26
P80/SEG25
Port 7
LCD driver
power supply
Port A
PA3/COM4
PA2/COM3
PA1/COM2
PA0/COM1
P77/SEG24
P76/SEG23
P75/SEG22
P74/SEG21
P73/SEG20
P72/SEG19
P71/SEG18
P70/SEG17
Port 6
Data bus (upper)
Address bus
RES
TEST
MDO
VSS
VSS
VCC
VCC
X1
X2
Port 1
Port 2
LCD
controller
Timer B
SCI1
Timer C
SCI2
Timer F
SCI3
Timer G
14-bit
PWM
P67/SEG16
P66/SEG15
P65/SEG14
P64/SEG13
P63/SEG12
P62/SEG11
P61/SEG10
P60/SEG9
A/D
converter
Port B
Port C
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
PC0/AN8
PC1/AN9
PC2/AN10
PC3/AN11
P50/WKP0/SEG1
P51/WKP1/SEG2
P52/WKP2/SEG3
P53/WKP3/SEG4
P54/WKP4/SEG5
P55/WKP5/SEG6
P56/WKP6/SEG7
P57/WKP7/SEG8
V1
V2
V3
RAM
Timer A
AVCC
AVSS
P40/SCK3
P41/RXD
P42/TXD
P43/IRQ0
ROM
Port 3
P30/SCK1
P31/SI1
P32/SO1
P33/SCK2
P34/SI2
P35/SO2
P36/STRB
P37/CS
Data bus (lower)
Port 4
P20/IRQ4/ADTRG
P21/UD
P22
P23
P24
P25
P26
P27
CPU
H8/300L
Port 5
P10/TMOW
P11/TMOFL
P12/TMOFH
P13/TMIG
P14/PWM
P15/IRQ1/TMIB
P16/IRQ2/TMIC
P17/IRQ3/TMIF
Subclock
oscillator
System clock
oscillator
OSC1
OSC2
Figure 1.1 shows a block diagram of the H8/3834 Series.
Figure 1.1 Block Diagram
5
1.3
Pin Arrangement and Functions
1.3.1
Pin Arrangement
VCC
P10/TMOW
P11/TMOFL
P12/TMOFH
P14/PWM
P13/TMIG
P16/IRQ2/TMIC
P15/IRQ1/TMIB
P40/SCK3
P17/IRQ3/TMIF
P41/RXD
P42/TXD
P43/IRQ0
AVCC
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
PC0/AN8
PC1/AN9
PC2/AN10
The pin arrangement of the H8/3834 Series is shown in figures 1.2 and 1.3.
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
67
P87/SEG32
MDO
10
66
P86/SEG31
P20/IRQ4/ADTRG
11
65
P85/SEG30
P21/UD
12
64
P84/SEG29
P22
13
63
P83/SEG28
P23
14
62
P82/SEG27
P24
15
61
P81/SEG26
P25
16
60
P80/SEG25
P26
17
59
P77/SEG24
P27
18
58
P76/SEG23
P30/SCK1
19
57
P75/SEG22
P31/SI1
20
56
P74/SEG21
P32/SO1
21
55
P73/SEG20
P33/SCK2
22
54
P72/SEG19
P34/SI2
23
53
P71/SEG18
P35/SO2
24
52
P70/SEG17
25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 5051
P67/SEG16
P37/CS
P36/STRB
P66/SEG15
9
P65/SEG14
P90/SEG33
RES
P64/SEG13
P91/SEG34
68
P63/SEG12
69
8
P62/SEG11
7
OSC2
P61/SEG10
OSC1
P60/SEG9
P92/SEG35
P57/WKP7/SEG8
70
P56/WKP6/SEG7
6
P55/WKP5/SEG6
P93/SEG36
VSS
P54/WKP4/SEG5
71
P53/WKP3/SEG4
5
P52/WKP2/SEG3
P94/SEG37/M
X1
P51/WKP1/SEG2
72
P50/WKP0/SEG1
4
PA0/COM1
P95/SEG38/DO
X2
PA1/COM2
73
PA2/COM3
3
PA3/COM4
P96/SEG39/CL2
TEST
VCC
74
V1
P97/SEG40/CL1
2
V2
75
AVSS
V3
1
VSS
PC3/AN11
Figure 1.2 Pin Arrangement (FP-100B, TFP-100B: Top View)
6
P11/TMOFL
P12/TMOFH
P14/PWM
P13/TMIG
P15/IRQ1/TMIB
P16/IRQ2/TMIC
P17/IRQ3/TMIF
P40/SCK3
P42/TXD
P41/RXD
P43/IRQ0
AVCC
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
PC0/AN8
1
80
P10/TMOW
PC1/AN9
2
79
VCC
PC2/AN10
3
78
P97/SEG40/CL1
PC3/AN11
4
77
P96/SEG39/CL2
AVSS
5
76
P95/SEG38/DO
TEST
6
75
P94/SEG37/M
X2
7
74
P93/SEG36
X1
8
73
P92/SEG35
VSS
9
72
P91/SEG34
OSC1
10
71
P90/SEG33
OSC2
11
70
P87/SEG32
RES
12
69
P86/SEG31
MDO
13
68
P85/SEG30
P20/IRQ4/ADTRG
14
67
P84/SEG29
P21/UD
15
66
P83/SEG28
P22
16
65
P82/SEG27
P23
17
64
P81/SEG26
P24
18
63
P80/SEG25
P25
19
62
P77/SEG24
P26
20
61
P76/SEG23
P27
21
60
P75/SEG22
P30/SCK1
22
58
P74/SEG21
P31/SI1
23
58
P73/SEG20
P32/SO1
24
57
P72/SEG19
P33/SCK2
25
56
P71/SEG18
P34/SI2
26
55
P70/SEG17
P35/SO2
27
54
P67/SEG16
P36/STRB
28
53
P66/SEG15
P37/CS
29
52
P65/SEG14
VSS
30
51
P64/SEG13
P63/SEG12
P62/SEG11
P61/SEG10
P60/SEG9
P57/WKP7/SEG8
P56/WKP6/SEG7
P55/WKP5/SEG6
P54/WKP4/SEG5
P53/WKP3/SEG4
P52/WKP2/SEG3
P51/WKP1/SEG2
P50/WKP0/SEG1
PA0/COM1
PA1/COM2
PA2/COM3
PA3/COM4
VCC
V1
V2
V3
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Figure 1.3 Pin Arrangement (FP-100A: Top View)
7
1.3.2
Pin Functions
Table 1.2 outlines the pin functions of the H8/3834 Series.
Table 1.2
Pin Functions
Pin No.
Type
FP-100B
TFP-100B FP-100A
I/O
Name and Functions
31, 76
34, 79
Input
Power supply: All V CC pins should be
connected to the system power
supply (+5 V)
VSS
6, 27
9, 30
Input
Ground: All V SS pins should be
connected to the system power
supply (0 V)
AVCC
89
92
Input
Analog power supply: This is the
power supply pin for the A/D
converter. When the A/D converter is
not used, connect this pin to the
system power supply (+5 V).
AVSS
2
5
Input
Analog ground: This is the A/D
converter ground pin. It should be
connected to the system power
supply (0 V).
V1,
V2,
V3
30,
29,
28
33,
32,
31
Input
LCD power supply: These are
power supply pins for the LCD
controller/ driver. A built-in resistor
divider is provided for the power
supply, so these pins are normally left
open.
Symbol
Power
VCC
source pins
Power supply conditions are
VCC ≥ V1 ≥ V2 ≥ V3 ≥ VSS .
Clock pins
8
OSC 1
7
10
Input
This pin connects to a crystal or
ceramic oscillator, or can be used to
input an external clock.
OSC 2
8
11
Output
See section 4, Clock Pulse
Generators, for a typical connection
diagram.
X1
5
8
Input
This pin connects to a 32.768-kHz
crystal oscillator.
X2
4
7
Output
See section 4, Clock Pulse
Generators, for a typical connection
diagram.
Table 1.2
Pin Functions (cont)
Pin No.
Type
Symbol
FP-100B
TFP-100B FP-100A
I/O
Name and Functions
System
control
RES
9
12
Input
Reset: When this pin is driven low,
the chip is reset
MDO
10
13
Input
Mode: This pin controls system clock
oscillation in the reset state
TEST
3
6
Input
Test: This is a test pin, not for use in
application systems. It should be
connected to VSS .
IRQ0
IRQ1
IRQ2
IRQ3
IRQ4
88
82
83
84
11
91
85
86
87
14
Input
External interrupt request 0 to 4:
These are input pins for external
interrupts for which there is a choice
between rising and falling edge
sensing
WKP 7 to
WKP 0
43 to 36
46 to 39
Input
Wakeup interrupt request 0 to 7:
These are input pins for external
interrupts that are detected at the
falling edge
TMOW
77
80
Output
Clock output: This is an output pin
for waveforms generated by the timer
A output circuit
TMIB
82
85
Input
Timer B event counter input: This is
an event input pin for input to the
timer B counter
TMIC
83
86
Input
Timer C event counter input: This is
an event input pin for input to the
timer C counter
UD
12
15
Input
Timer C up/down select: This pin
selects whether the timer C counter
isused for up- or down-counting. At
high level it selects up-counting, and
at low level down-counting.
TMIF
84
87
Input
Timer F event counter input: This is
an event input pin for input to the
timer F counter
TMOFL
78
81
Output
Timer FL output: This is an output
pin for waveforms generated by the
timer FL output compare function
Interrupt
pins
Timer pins
9
Table 1.2
Pin Functions (cont)
Pin No.
Type
Symbol
FP-100B
TFP-100B FP-100A
I/O
Name and Functions
Timer pins
TMOFH
79
82
Output
Timer FH output: This is an output
pin for waveforms generated by the
timer FH output compare function
TMIG
80
83
Input
Timer G capture input: This is an
input pin for the timer G input capture
function
14-bit PWM PWM
pin
81
84
Output
14-bit PWM output: This is an output
pin for waveforms generated by the
14-bit PWM
PB7 to PB 0 97 to 90
100 to 93
Input
Port B: This is an 8-bit input port
PC 3 to PC0 1, 100 to
98
4 to 1
Input
Port C: This is a 4-bit input port
P43
88
91
Input
Port 4 (bit 3): This is a 1-bit input
port
P42 to P4 0
87 to 85
90 to 88
I/O
Port 4 (bits 2 to 0): This is a 3-bit I/O
port. Input or output can be
designated for each bit by means of
port control register 4 (PCR4).
PA3 to PA 0 32 to 35
35 to 38
I/O
Port A: This is a 4-bit I/O port. Input
or output can be designated for each
bit by means of port control register A
(PCRA).
P17 to P1 0
84 to 77
87 to 80
I/O
Port 1: This is an 8-bit I/O port. Input
or output can be designated for each
bit by means of port control register 1
(PCR1).
P27 to P2 0
18 to 11
21 to 14
I/O
Port 2: This is an 8-bit I/O port. Input
or output can be designated for each
bit by means of port control register 2
(PCR2).
P37 to P3 0
26 to 19
29 to 22
I/O
Port 3: This is an 8-bit I/O port. Input
or output can be designated for each
bit by means of port control register 3
(PCR3).
P57 to P5 0
43 to 36
46 to 39
I/O
Port 5: This is an 8-bit I/O port. Input
or output can be designated for each
bit by means of port control register 5
(PCR5).
I/O ports
10
Table 1.2
Pin Functions (cont)
Pin No.
Type
Symbol
FP-100B
TFP-100B FP-100A
I/O
Name and Functions
I/O ports
P67 to P6 0
51 to 44
54 to 47
I/O
Port 6: This is an 8-bit I/O port. Input
or output can be designated for each
bit by means of port control register 6
(PCR6).
P77 to P7 0
59 to 52
62 to 55
I/O
Port 7: This is an 8-bit I/O port. Input
or output can be designated for each
bit by means of port control register 7
(PCR7).
P87 to P8 0
67 to 60
70 to 63
I/O
Port 8: This is an 8-bit I/O port. Input
or output can be designated for each
bit by means of port control register 8
(PCR8).
P97 to P9 0
75 to 68
78 to 71
I/O
Port 9: This is an 8-bit I/O port. Input
or output can be designated for each
bit by means of port control register 9
(PCR9).
20
23
Input
SCI1 receive data input: This is the
SCI1 data input pin
21
24
Output
SCI1 send data output: This is the
SCI1 data output pin
SCK 1
19
22
I/O
SCI1 clock I/O : This is the SCI1 clock
I/O pin
SI 2
23
26
Input
SCI2 receive data input: This is the
SCI2 data input pin
SO2
24
27
Output
SCI2 send data output: This is the
SCI2 data output pin
SCK 2
22
25
I/O
SCI2 clock I/O : This is the SCI2 clock
I/O pin
CS
26
29
Input
SCI2 chip select input: This pin
controls the start of SCI2 transfers
STRB
25
28
Output
SCI2 strobe output: This pin outputs
a strobe pulse each time a byte of
data is transferred
RXD
86
89
Input
SCI3 receive data input: This is the
SCI3 data input pin
Serial com- SI 1
munication
interface
SO1
(SCI)
11
Table 1.2
Pin Functions (cont)
Pin No.
Type
FP-100B
TFP-100B FP-100A
I/O
Name and Functions
87
90
Output
SCI3 send data output: This is the
SCI3 data output pin
85
88
I/O
SCI3 clock I/O : This is the SCI3 clock
I/O pin
AN 11 to AN0 1, 100 to 90 4 to 1
100 to 93
Input
Analog input channels 0 to 11:
These are analog data input channels
to the A/D converter
ADTRG
11
14
Input
A/D converter trigger input: This is
the external trigger input pin to the A/D
converter
COM4 to
COM1
32 to 35
35 to 38
Output
LCD common output: These are
LCD common output pins
SEG40 to
SEG1
75 to 36
78 to 39
Output
LCD segment output: These are LCD
segment output pins
CL 1
75
78
Output
LCD latch clock: This is the display
data latch clock output pin for external
segment expansion
CL 2
74
77
Output
LCD shift clock: This is the display
data shift clock output pin for external
segment expansion
DO
73
76
Output
LCD serial data output: This is the
serial display data output pin for
external segment expansion
M
72
75
Output
LCD alternating signal output: This
is the LCD alternating signal output pin
for external segment expansion
Symbol
Serial com- TXD
munication
interface
SCK 3
(SCI)
A/D
converter
LCD
controller/
driver
12
Section 2 CPU
2.1
Overview
The H8/300L CPU has sixteen 8-bit general registers, which can also be paired as eight 16-bit
registers. Its concise, optimized instruction set is designed for high-speed operation.
2.1.1
Features
Features of the H8/300L CPU are listed below.
• General-register architecture
Sixteen 8-bit general registers, also usable as eight 16-bit general registers
• Instruction set with 55 basic instructions, including:
 Multiply and divide instructions
 Powerful bit-manipulation instructions
• Eight addressing modes
 Register direct
 Register indirect
 Register indirect with displacement
 Register indirect with post-increment or pre-decrement
 Absolute address
 Immediate
 Program-counter relative
 Memory indirect
• 64-kbyte address space
• High-speed operation
 All frequently used instructions are executed in two to four states
 High-speed arithmetic and logic operations
8- or 16-bit register-register add or subtract: 0.4 µs*
8 × 8-bit multiply:
2.8 µs*
16 ÷ 8-bit divide:
2.8 µs*
Note: * These values are at φ = 5 MHz.
• Low-power operation modes
SLEEP instruction for transfer to low-power operation
13
2.1.2
Address Space
The H8/300L CPU supports an address space of up to 64 kbytes for storing program code and
data.
See 2.8, Memory Map, for details of the memory map.
2.1.3
Register Configuration
Figure 2.1 shows the register structure of the H8/300L CPU. There are two groups of registers: the
general registers and control registers.
General registers (Rn)
7
0 7
0
R0H
R0L
R1H
R1L
R2H
R2L
R3H
R3L
R4H
R4L
R5H
R5L
R6H
R7H
R6L
(SP)
SP: Stack Pointer
R7L
Control registers (CR)
15
0
PC
PC: Program Counter
7 6 5 4 3 2 1 0
CCR I U H U N Z V C
CCR: Condition Code Register
Carry flag
Overflow flag
Zero flag
Negative flag
Half-carry flag
Interrupt mask bit
User bit
User bit
Figure 2.1 CPU Registers
14
2.2
Register Descriptions
2.2.1
General Registers
All the general registers can be used as both data registers and address registers.
When used as data registers, they can be accessed as 16-bit registers (R0 to R7), or the high bytes
(R0H to R7H) and low bytes (R0L to R7L) can be accessed separately as 8-bit registers.
When used as address registers, the general registers are accessed as 16-bit registers (R0 to R7).
R7 also functions as the stack pointer (SP), used implicitly by hardware in exception processing
and subroutine calls. When it functions as the stack pointer, as indicated in figure 2.2, SP (R7)
points to the top of the stack.
Lower address side [H'0000]
Unused area
SP
(R7)
Stack area
Upper address side [H'FFFF]
Figure 2.2 Stack Pointer
2.2.2
Control Registers
The CPU control registers include a 16-bit program counter (PC) and an 8-bit condition code
register (CCR).
Program Counter (PC): This 16-bit register indicates the address of the next instruction the CPU
will execute. All instructions are fetched 16 bits (1 word) at a time, so the least significant bit of
the PC is ignored (always regarded as 0).
Condition Code Register (CCR): This 8-bit register contains internal status information,
including the interrupt mask bit (I) and half-carry (H), negative (N), zero (Z), overflow (V), and
carry (C) flags. These bits can be read and written by software (using the LDC, STC, ANDC,
ORC, and XORC instructions). The N, Z, V, and C flags are used as branching conditions for
conditional branching (Bcc) instructions.
15
Bit 7—Interrupt Mask Bit (I): When this bit is set to 1, interrupts are masked. This bit is set to 1
automatically at the start of exception handling. The interrupt mask bit may be read and written by
software. For further details, see section 3.3, Interrupts.
Bit 6—User Bit (U): Can be used freely by the user.
Bit 5—Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B
instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and is cleared to 0
otherwise.
The H flag is used implicitly by the DAA and DAS instructions.
When the ADD.W, SUB.W, or CMP.W instruction is executed, the H flag is set to 1 if there is a
carry or borrow at bit 11, and is cleared to 0 otherwise.
Bit 4—User Bit (U): Can be used freely by the user.
Bit 3—Negative Flag (N): Indicates the most significant bit (sign bit) of the result of an
instruction.
Bit 2—Zero Flag (Z): Set to 1 to indicate a zero result, and cleared to 0 to indicate a non-zero
result.
Bit 1—Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other
times.
Bit 0—Carry Flag (C): Set to 1 when operation execution generates a carry, and cleared to 0
otherwise. Used by:
• Add instructions, to indicate a carry
• Subtract instructions, to indicate a borrow
• Shift and rotate instructions
The carry flag is also used as a bit accumulator by bit manipulation instructions.
Some instructions leave some or all of the flag bits unchanged.
Refer to the H8/300L Series Programming Manual for the action of each instruction on the flag
bits.
16
2.2.3
Initial Register Values
When the CPU is reset, the program counter (PC) is initialized to the value stored at address
H'0000 in the vector table, and the I bit in the CCR is set to 1. The other CCR bits and the general
registers are not initialized. In particular, the stack pointer (R7) is not initialized. To prevent
program crashes the stack pointer should be initialized by software, by the first instruction
executed after a reset.
2.3
Data Formats
The H8/300L CPU can process 1-bit data, 4-bit (BCD) data, 8-bit (byte) data, and 16-bit (word)
data.
• Bit manipulation instructions operate on 1-bit data specified as bit n in a byte operand
(n = 0, 1, 2, ..., 7).
• All arithmetic and logic instructions except ADDS and SUBS can operate on byte data.
• The MOV.W, ADD.W, SUB.W, CMP.W, ADDS, SUBS, MULXU (8 bits × 8 bits), and
DIVXU (16 bits ÷ 8 bits) instructions operate on word data.
• The DAA and DAS instructions perform decimal arithmetic adjustments on byte data in
packed BCD form. Each nibble of the byte is treated as a decimal digit.
17
2.3.1
Data Formats in General Registers
The general register data formats are shown in figure 2.3.
Data Type
Register No.
Data Format
7
1-bit data
RnH
7
0
6
5
4
3
2
1
0
don’t care
7
1-bit data
Byte data
Byte data
Word data
RnL
RnH
don’t care
Rn
0
MSB
LSB
don’t care
RnH
6
5
2
1
0
7
0
MSB
LSB
0
MSB
LSB
4
3
Upper digit
0
Lower digit
don’t care
RnL
don’t care
4
Upper digit
Notation:
RnH: Upper byte of general register
RnL: Lower byte of general register
MSB: Most significant bit
LSB: Least significant bit
Figure 2.3 Register Data Formats
18
3
don’t care
7
4-bit BCD data
4
15
7
4-bit BCD data
7
7
RnL
0
0
3
Lower digit
2.3.2
Memory Data Formats
Figure 2.4 indicates the data formats in memory. For access by the H8/300L CPU, word data
stored in memory must always begin at an even address. In word access the least significant bit of
the address is regarded as 0. If an odd address is specified, the access is performed at the preceding
even address. This rule affects the MOV.W instruction, and also applies to instruction fetching.
Data Type
Address
Data Format
7
1-bit data
Address n
7
Byte data
Address n
MSB
Even address
MSB
Word data
Odd address
Byte data (CCR) on stack
Word data on stack
0
6
5
4
3
2
1
0
LSB
Upper 8 bits
Lower 8 bits
LSB
Even address
MSB
CCR
LSB
Odd address
MSB
CCR*
LSB
Even address
MSB
Odd address
LSB
CCR: Condition code register
Note: * Ignored on return
Figure 2.4 Memory Data Formats
When the stack is accessed using R7 as an address register, word access should always be
performed. For the CCR, the same value is stored in the upper 8 bits and lower 8 bits as word data.
On return, the lower 8 bits are ignored.
19
2.4
Addressing Modes
2.4.1
Addressing Modes
The H8/300L CPU supports the eight addressing modes listed in table 2.1. Each instruction uses a
subset of these addressing modes.
Table 2.1
Addressing Modes
No.
Address Modes
Symbol
1
Register direct
Rn
2
Register indirect
@Rn
3
Register indirect with displacement
@(d:16, Rn)
4
Register indirect with post-increment
@Rn+
Register indirect with pre-decrement
@–Rn
5
Absolute address
@aa:8 or @aa:16
6
Immediate
#xx:8 or #xx:16
7
Program-counter relative
@(d:8, PC)
8
Memory indirect
@@aa:8
1. Register Direct—Rn: The register field of the instruction specifies an 8- or 16-bit general
register containing the operand.
Only the MOV.W, ADD.W, SUB.W, CMP.W, ADDS, SUBS, MULXU (8 bits × 8 bits), and
DIVXU (16 bits ÷ 8 bits) instructions have 16-bit operands.
2. Register Indirect—@Rn: The register field of the instruction specifies a 16-bit general
register containing the address of the operand in memory.
3. Register Indirect with Displacement—@(d:16, Rn): The instruction has a second word
(bytes 3 and 4) containing a displacement which is added to the contents of the specified general
register to obtain the operand address in memory.
This mode is used only in MOV instructions. For the MOV.W instruction, the resulting address
must be even.
20
4. Register Indirect with Post-Increment or Pre-Decrement—@Rn+ or @–Rn:
• Register indirect with post-increment—@Rn+
The @Rn+ mode is used with MOV instructions that load registers from memory.
The register field of the instruction specifies a 16-bit general register containing the address of
the operand. After the operand is accessed, the register is incremented by 1 for MOV.B or 2 for
MOV.W. For MOV.W, the original contents of the 16-bit general register must be even.
• Register indirect with pre-decrement—@–Rn
The @–Rn mode is used with MOV instructions that store register contents to memory.
The register field of the instruction specifies a 16-bit general register which is decremented by
1 or 2 to obtain the address of the operand in memory. The register retains the decremented
value. The size of the decrement is 1 for MOV.B or 2 for MOV.W. For MOV.W, the original
contents of the register must be even.
5. Absolute Address—@aa:8 or @aa:16: The instruction specifies the absolute address of the
operand in memory.
The absolute address may be 8 bits long (@aa:8) or 16 bits long (@aa:16). The MOV.B and bit
manipulation instructions can use 8-bit absolute addresses. The MOV.B, MOV.W, JMP, and JSR
instructions can use 16-bit absolute addresses.
For an 8-bit absolute address, the upper 8 bits are assumed to be 1 (H'FF). The address range is
H'FF00 to H'FFFF (65280 to 65535).
6. Immediate—#xx:8 or #xx:16: The instruction contains an 8-bit operand (#xx:8) in its second
byte, or a 16-bit operand (#xx:16) in its third and fourth bytes. Only MOV.W instructions can
contain 16-bit immediate values.
The ADDS and SUBS instructions implicitly contain the value 1 or 2 as immediate data. Some bit
manipulation instructions contain 3-bit immediate data in the second or fourth byte of the
instruction, specifying a bit number.
7. Program-Counter Relative—@(d:8, PC): This mode is used in the Bcc and BSR
instructions. An 8-bit displacement in byte 2 of the instruction code is sign-extended to 16 bits and
added to the program counter contents to generate a branch destination address. The possible
branching range is –126 to +128 bytes (–63 to +64 words) from the current address. The
displacement should be an even number.
21
8. Memory Indirect—@@aa:8: This mode can be used by the JMP and JSR instructions. The
second byte of the instruction code specifies an 8-bit absolute address. The word located at this
address contains the branch destination address.
The upper 8 bits of the absolute address are assumed to be 0 (H'00), so the address range is from
H'0000 to H'00FF (0 to 255). Note that with the H8/300L Series, the lower end of the address area
is also used as a vector area. See 3.3, Interrupts, for details on the vector area.
If an odd address is specified as a branch destination or as the operand address of a MOV.W
instruction, the least significant bit is regarded as 0, causing word access to be performed at the
address preceding the specified address. See 2.3.2, Memory Data Formats, for further information.
2.4.2
Effective Address Calculation
Table 2.2 shows how effective addresses are calculated in each of the addressing modes.
Arithmetic and logic instructions use register direct addressing (1). The ADD.B, ADDX, SUBX,
CMP.B, AND, OR, and XOR instructions can also use immediate addressing (6).
Data transfer instructions can use all addressing modes except program-counter relative (7) and
memory indirect (8).
Bit manipulation instructions use register direct (1), register indirect (2), or absolute addressing (8bit) (5) to specify a byte operand, and 3-bit immediate addressing (6) to specify a bit position in
that byte. The BSET, BCLR, BNOT, and BTST instructions can also use register direct addressing
(1) to specify the bit position.
22
Table 2.2
No.
1
Effective Address Calculation
Addressing Mode and
Instruction Format
Effective Address
Calculation Method
Effective Address (EA)
3
Register direct, Rn
0
rm
15
87
op
2
43
rm
rn
3
76 43
15
0
15
0
15
0
15
0
15
0
0
rm
Register indirect with
displacement, @(d:16, Rn)
15
rn
Operand is contents of
registers indicated by rm/rn
Contents (16 bits) of
register indicated by rm
op
0
0
Register indirect, @Rn
15
3
76 43
op
15
0
Contents (16 bits) of
register indicated by rm
0
rm
disp
disp
4
Register indirect with
post-increment, @Rn+
15
76 43
op
15
0
Contents (16 bits) of
register indicated by rm
0
rm
1 or 2
Register indirect with
pre-decrement, @–Rn
15
76 43
op
rm
15
0
Contents (16 bits) of
register indicated by rm
0
Incremented or
decremented by 1 if
operand is byte size, 1 or 2
and by 2 if word size
23
Table 2.2
No.
5
Effective Address Calculation (cont)
Addressing Mode and
Instruction Format
Effective Address
Calculation Method
Effective Address (EA)
Absolute address
@aa:8
15
87
op
15
87
0
H'FF
0
abs
@aa:16
15
15
0
0
op
abs
6
Immediate
#xx:8
15
87
op
0
IMM
#xx:16
15
Operand is 1- or 2-byte
immediate data
0
op
IMM
7
Program-counter relative
@(d:8, PC)
15
87
op
24
0
disp
15
0
PC contents
15
Sign
extension
disp
0
Table 2.2
Effective Address Calculation (cont)
No.
Addressing Mode and
Instruction Format
8
Memory indirect, @@aa:8
15
87
op
Effective Address
Calculation Method
Effective Address (EA)
0
abs
15
87
H'00
0
abs
15
0
Memory contents
(16 bits)
Notation:
rm, rn: Register field
op:
Operation field
disp: Displacement
IMM: Immediate data
abs: Absolute address
25
2.5
Instruction Set
The H8/300L Series can use a total of 55 instructions, which are grouped by function in table 2.3.
Table 2.3
Instruction Set
Function
Instructions
Number
1
1
Data transfer
MOV, PUSH* , POP*
1
Arithmetic operations
ADD, SUB, ADDX, SUBX, INC, DEC, ADDS, SUBS,
DAA, DAS, MULXU, DIVXU, CMP, NEG
14
Logic operations
AND, OR, XOR, NOT
4
Shift
SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL,
ROTXR
8
Bit manipulation
BSET, BCLR, BNOT, BTST, BAND, BIAND, BOR,
BIOR, BXOR, BIXOR, BLD, BILD, BST, BIST
14
Branch
Bcc* 2, JMP, BSR, JSR, RTS
5
System control
RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP
8
Block data transfer
EEPMOV
1
Total: 55
Notes: 1. PUSH Rn is equivalent to MOV.W Rn, @–SP.
POP Rn is equivalent to MOV.W @SP+, Rn. The machine language is also the same.
2. Bcc is the generic term for conditional branch instructions.
The functions of the instructions are shown in tables 2.4 to 2.11. The meaning of the operation
symbols used in the tables is as follows.
26
Notation
Rd
General register (destination)
Rs
General register (source)
Rn
General register
(EAd), <EAd>
Destination operand
(EAs), <EAs>
Source operand
CCR
Condition code register
N
N (negative) flag of CCR
Z
Z (zero) flag of CCR
V
V (overflow) flag of CCR
C
C (carry) flag of CCR
PC
Program counter
SP
Stack pointer
#IMM
Immediate data
disp
Displacement
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
AND logical
∨
OR logical
⊕
Exclusive OR logical
→
Move
~
Logical negation (logical complement)
:3
3-bit length
:8
8-bit length
:16
16-bit length
( ), < >
Contents of operand indicated by effective address
27
2.5.1
Data Transfer Instructions
Table 2.4 describes the data transfer instructions. Figure 2.5 shows their object code formats.
Table 2.4
Data Transfer Instructions
Instruction
Size*
Function
MOV
B/W
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general
register and memory, or moves immediate data to a general register.
The Rn, @Rn, @(d:16, Rn), @aa:16, #xx:16, @–Rn, and @Rn+
addressing modes are available for byte or word data. The @aa:8
addressing mode is available for byte data only.
The @–R7 and @R7+ modes require word operands. Do not specify
byte size for these two modes.
POP
W
@SP+ → Rn
Pops a 16-bit general register from the stack. Equivalent to MOV.W
@SP+, Rn.
PUSH
W
Rn → @–SP
Pushes a 16-bit general register onto the stack. Equivalent to MOV.W
Rn, @–SP.
Note: * Size: Operand size
B:
Byte
W: Word
Certain precautions are required in data access. See 2.9.1, Notes on Data Access, for details.
28
15
8
7
0
op
rm
15
8
8
Rm→Rn
7
0
op
15
rn
MOV
rm
rn
rm
rn
@Rm←→Rn
7
0
op
@(d:16, Rm)←→Rn
disp
15
8
7
0
op
rm
15
8
op
7
0
rn
15
@Rm+→Rn, or
Rn →@–Rm
rn
abs
8
@aa:8←→Rn
7
0
op
rn
@aa:16←→Rn
abs
15
8
op
7
0
rn
15
IMM
8
#xx:8→Rn
7
0
op
rn
#xx:16→Rn
IMM
15
8
op
7
0
1
1
1
rn
PUSH, POP
@SP+ → Rn, or
Rn → @–SP
Notation:
op:
Operation field
rm, rn: Register field
disp: Displacement
abs:
Absolute address
IMM: Immediate data
Figure 2.5 Data Transfer Instruction Codes
29
2.5.2
Arithmetic Operations
Table 2.5 describes the arithmetic instructions.
Table 2.5
Arithmetic Instructions
Instruction
Size*
Function
ADD
B/W
Rd ± Rs → Rd, Rd + #IMM → Rd
SUB
ADDX
Performs addition or subtraction on data in two general registers, or
addition on immediate data and data in a general register. Immediate
data cannot be subtracted from data in a general register. Word data
can be added or subtracted only when both words are in general
registers.
B
SUBX
INC
Performs addition or subtraction with carry or borrow on byte data in
two general registers, or addition or subtraction on immediate data and
data in a general register.
B
DEC
ADDS
W
Rd ± 1 → Rd, Rd ± 2 → Rd
Adds or subtracts immediate data to or from data in a general register.
The immediate data must be 1 or 2.
B
DAS
MULXU
Rd ± 1 → Rd
Increments or decrements a general register
SUBS
DAA
Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Rd decimal adjust → Rd
Decimal-adjusts (adjusts to packed 4-bit BCD) an addition or
subtraction result in a general register by referring to the CCR
B
Rd × Rs → Rd
Performs 8-bit × 8-bit unsigned multiplication on data in two general
registers, providing a 16-bit result
DIVXU
B
Rd ÷ Rs → Rd
Performs 16-bit ÷ 8-bit unsigned division on data in two general
registers, providing an 8-bit quotient and 8-bit remainder
CMP
B/W
Rd – Rs, Rd – #IMM
Compares data in a general register with data in another general
register or with immediate data, and the result is stored in the CCR.
Word data can be compared only between two general registers.
NEG
B
0 – Rd → Rd
Obtains the two’s complement (arithmetic complement) of data in a
general register
Note: * Size: Operand size
B:
Byte
W: Word
30
2.5.3
Logic Operations
Table 2.6 describes the four instructions that perform logic operations.
Table 2.6
Logic Operation Instructions
Instruction
Size*
Function
AND
B
Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
Performs a logical AND operation on a general register and another
general register or immediate data
OR
B
Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register and another
general register or immediate data
XOR
B
Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general register and
another general register or immediate data
NOT
B
~ Rd → Rd
Obtains the one’s complement (logical complement) of general register
contents
Note: * Size: Operand size
B:
Byte
2.5.4
Shift Operations
Table 2.7 describes the eight shift instructions.
Table 2.7
Shift Instructions
Instruction
Size*
Function
SHAL
B
Rd shift → Rd
SHAR
SHLL
Performs an arithmetic shift operation on general register contents
B
SHLR
ROTL
Performs a logical shift operation on general register contents
B
ROTR
ROTXL
ROTXR
Rd shift → Rd
Rd rotate → Rd
Rotates general register contents
B
Rd rotate through carry → Rd
Rotates general register contents through the C (carry) bit
Notes: * Size: Operand size
B:
Byte
31
Figure 2.6 shows the instruction code format of arithmetic, logic, and shift instructions.
15
8
7
op
0
rm
15
8
7
0
op
15
7
op
0
rm
8
op
rn
7
7
op
0
rm
8
op
AND, OR, XOR (Rm)
0
IMM
8
op
rn
7
rn
15
ADD, ADDX, SUBX,
CMP (#XX:8)
IMM
8
15
MULXU, DIVXU
0
rn
15
ADDS, SUBS, INC, DEC,
DAA, DAS, NEG, NOT
rn
8
15
ADD, SUB, CMP,
ADDX, SUBX (Rm)
rn
AND, OR, XOR (#xx:8)
7
0
rn
SHAL, SHAR, SHLL, SHLR,
ROTL, ROTR, ROTXL, ROTXR
Notation:
Operation field
op:
rm, rn: Register field
IMM: Immediate data
Figure 2.6 Arithmetic, Logic, and Shift Instruction Codes
32
2.5.5
Bit Manipulations
Table 2.8 describes the bit-manipulation instructions. Figure 2.7 shows their object code formats.
Table 2.8
Bit-Manipulation Instructions
Instruction
Size*
Function
BSET
B
1 → (<bit-No.> of <EAd>)
Sets a specified bit to 1 in a general register or memory operand. The
bit number is specified by 3-bit immediate data or the lower three bits
of a general register.
BCLR
B
0 → (<bit-No.> of <EAd>)
Clears a specified bit to 0 in a general register or memory operand.
The bit number is specified by 3-bit immediate data or the lower three
bits of a general register.
BNOT
B
~ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory operand. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BTST
B
~ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory operand and sets
or clears the Z flag accordingly. The bit number is specified by 3-bit
immediate data or the lower three bits of a general register.
BAND
B
C ∧ (<bit-No.> of <EAd>) → C
ANDs the C flag with a specified bit in a general register or memory
operand, and stores the result in the C flag.
BIAND
B
C ∧ [~ (<bit-No.> of <EAd>)] → C
ANDs the C flag with the inverse of a specified bit in a general register
or memory operand, and stores the result in the C flag.
The bit number is specified by 3-bit immediate data.
BOR
B
C ∨ (<bit-No.> of <EAd>) → C
ORs the C flag with a specified bit in a general register or memory
operand, and stores the result in the C flag.
BIOR
B
C ∨ [~ (<bit-No.> of <EAd>)] → C
ORs the C flag with the inverse of a specified bit in a general register
or memory operand, and stores the result in the C flag.
The bit number is specified by 3-bit immediate data.
Note: * Size: Operand size
B:
Byte
33
Table 2.8
Bit-Manipulation Instructions (cont)
Instruction
Size*
Function
BXOR
B
C ⊕ (<bit-No.> of <EAd>) → C
XORs the C flag with a specified bit in a general register or memory
operand, and stores the result in the C flag.
BIXOR
B
C ⊕ [~(<bit-No.> of <EAd>)] → C
XORs the C flag with the inverse of a specified bit in a general register
or memory operand, and stores the result in the C flag.
The bit number is specified by 3-bit immediate data.
BLD
B
(<bit-No.> of <EAd>) → C
Copies a specified bit in a general register or memory operand to the C
flag.
BILD
B
~ (<bit-No.> of <EAd>) → C
Copies the inverse of a specified bit in a general register or memory
operand to the C flag.
The bit number is specified by 3-bit immediate data.
BST
B
C → (<bit-No.> of <EAd>)
Copies the C flag to a specified bit in a general register or memory
operand.
BIST
B
~ C → (<bit-No.> of <EAd>)
Copies the inverse of the C flag to a specified bit in a general register
or memory operand.
The bit number is specified by 3-bit immediate data.
Note: * Size: Operand size
B:
Byte
Certain precautions are required in bit manipulation. See 2.9.2, Notes on Bit Manipulation, for
details.
34
BSET, BCLR, BNOT, BTST
15
8
7
op
0
IMM
15
8
7
op
0
rm
15
8
Operand: register direct (Rn)
Bit No.: immediate (#xx:3)
rn
Operand: register direct (Rn)
Bit No.: register direct (Rm)
rn
7
0
rn
0
0
0
0 Operand: register indirect (@Rn)
IMM
0
0
0
0 Bit No.:
op
rn
0
0
0
0 Operand: register indirect (@Rn)
op
rm
0
0
0
0 Bit No.:
op
op
15
8
15
8
7
0
7
abs
IMM
15
8
0
Operand: absolute (@aa:8)
0
0
7
0 Bit No.:
immediate (#xx:3)
0
op
abs
op
register direct (Rm)
0
op
op
immediate (#xx:3)
rm
0
Operand: absolute (@aa:8)
0
0
0 Bit No.:
register direct (Rm)
BAND, BOR, BXOR, BLD, BST
15
8
7
op
0
IMM
15
8
7
op
op
15
8
Operand: register direct (Rn)
Bit No.: immediate (#xx:3)
rn
0
rn
0
0
0
0 Operand: register indirect (@Rn)
IMM
0
0
0
0 Bit No.:
7
0
op
abs
op
immediate (#xx:3)
IMM
0
Operand: absolute (@aa:8)
0
0
0 Bit No.:
immediate (#xx:3)
Notation:
op:
Operation field
rm, rn: Register field
abs:
Absolute address
IMM: Immediate data
Figure 2.7 Bit Manipulation Instruction Codes
35
BIAND, BIOR, BIXOR, BILD, BIST
15
8
7
op
0
IMM
15
8
7
op
op
15
8
Operand: register direct (Rn)
Bit No.: immediate (#xx:3)
rn
0
rn
0
0
0
0 Operand: register indirect (@Rn)
IMM
0
0
0
0 Bit No.:
7
0
op
abs
op
immediate (#xx:3)
IMM
0
Operand: absolute (@aa:8)
0
0
0 Bit No.:
immediate (#xx:3)
Notation:
op:
Operation field
rm, rn: Register field
abs:
Absolute address
IMM: Immediate data
Figure 2.7 Bit Manipulation Instruction Codes (cont)
36
2.5.6
Branching Instructions
Table 2.9 describes the branching instructions. Figure 2.8 shows their object code formats.
Table 2.9
Branching Instructions
Instruction
Size
Function
Bcc
—
Branches to the designated address if the specified condition is true. The
branching conditions are given below.
Mnemonic
Description
Condition
BRA (BT)
Always (true)
Always
BRN (BF)
Never (false)
Never
BHI
High
C∨Z=0
BLS
Low or same
C∨Z=1
BCC (BHS)
Carry clear (high or same)
C=0
BCS (BLO)
Carry set (low)
C=1
BNE
Not equal
Z=0
BEQ
Equal
Z=1
BVC
Overflow clear
V=0
BVS
Overflow set
V=1
BPL
Plus
N=0
BMI
Minus
N=1
BGE
Greater or equal
N⊕V=0
BLT
Less than
N⊕V=1
BGT
Greater than
Z ∨ (N ⊕ V) = 0
BLE
Less or equal
Z ∨ (N ⊕ V) = 1
JMP
—
Branches unconditionally to a specified address
BSR
—
Branches to a subroutine at a specified address
JSR
—
Branches to a subroutine at a specified address
RTS
—
Returns from a subroutine
37
15
8
op
7
0
cc
15
disp
8
7
op
0
rm
15
Bcc
8
0
0
0
7
0
JMP (@Rm)
0
op
JMP (@aa:16)
abs
15
8
7
0
op
abs
15
8
JMP (@@aa:8)
7
0
op
disp
15
8
7
op
0
rm
15
BSR
8
0
0
0
7
0
JSR (@Rm)
0
op
JSR (@aa:16)
abs
15
8
7
op
0
abs
15
8
7
op
Notation:
op: Operation field
cc: Condition field
rm: Register field
disp: Displacement
abs: Absolute address
Figure 2.8 Branching Instruction Codes
38
JSR (@@aa:8)
0
RTS
2.5.7
System Control Instructions
Table 2.10 describes the system control instructions. Figure 2.9 shows their object code formats.
Table 2.10 System Control Instructions
Instruction
Size*
Function
RTE
—
Returns from an exception-handling routine
SLEEP
—
Causes a transition from active mode to a power-down mode. See
section 5, Power-Down Modes, for details
LDC
B
Rs → CCR, #IMM → CCR
Moves immediate data or general register contents to the condition code
register
STC
CCR → Rd
B
Copies the condition code register to a specified general register
ANDC
CCR ∧ #IMM → CCR
B
Logically ANDs the condition code register with immediate data
ORC
CCR ∨ #IMM → CCR
B
Logically ORs the condition code register with immediate data
XORC
CCR ⊕ #IMM → CCR
B
Logically exclusive-ORs the condition code register with immediate data
NOP
PC + 2 → PC
—
Only increments the program counter
Note: * Size: Operand size
B:
Byte
15
8
7
0
op
15
8
RTE, SLEEP, NOP
7
0
op
15
rn
8
op
7
LDC, STC (Rn)
0
IMM
ANDC, ORC,
XORC, LDC (#xx:8)
Notation:
op: Operation field
rn: Register field
IMM: Immediate data
Figure 2.9 System Control Instruction Codes
39
2.5.8
Block Data Transfer Instruction
Table 2.11 describes the block data transfer instruction. Figure 2.10 shows its object code format.
Table 2.11 Block Data Transfer Instruction
Instruction
Size
Function
EEPMOV
—
If R4L ≠ 0 then
repeat
@R5+ → @R6+
R4L – 1 → R4L
until
R4L = 0
else next;
Block transfer instruction. Transfers the number of bytes specified by
R4L, from locations starting at the address specified by R5, to locations
starting at the address specified by R6. On completion of the transfer,
the next instruction is executed.
Certain precautions are required in using the EEPMOV instruction. See 2.9.3, Notes on Use of the
EEPMOV Instruction, for details.
15
8
7
op
op
Notation:
op: Operation field
Figure 2.10 Block Data Transfer Instruction Code
40
0
2.6
Basic Operational Timing
CPU operation is synchronized by a system clock (φ) or a subclock (φSUB). For details on these
clock signals see section 4, Clock Pulse Generators. The period from a rising edge of φ or φSUB to
the next rising edge is called one state. A bus cycle consists of two states or three states. The cycle
differs depending on whether access is to on-chip memory or to on-chip peripheral modules.
2.6.1
Access to On-Chip Memory (RAM, ROM)
Access to on-chip memory takes place in two states. The data bus width is 16 bits, allowing access
in byte or word size. Figure 2.11 shows the on-chip memory access cycle.
Bus cycle
T1 state
T2 state
φ or φ SUB
Internal address bus
Address
Internal read signal
Internal data bus
(read access)
Read data
Internal write signal
Internal data bus
(write access)
Write data
Figure 2.11 On-Chip Memory Access Cycle
41
2.6.2
Access to On-Chip Peripheral Modules
On-chip peripheral modules are accessed in two states or three states. The data bus width is 8 bits,
so access is by byte size only. This means that for accessing word data, two instructions must be
used. Figures 2.12 and 2.13 show the on-chip peripheral module access cycle.
Two-State Access to On-Chip Peripheral Modules
Bus cycle
T1 state
T2 state
φ or φ SUB
Internal address bus
Address
Internal read signal
Internal data bus
(read access)
Read data
Internal write signal
Internal data bus
(write access)
Write data
Figure 2.12 On-Chip Peripheral Module Access Cycle (2-State Access)
42
Three-State Access to On-Chip Peripheral Modules
Bus cycle
T1 state
T2 state
T3 state
φ or φ SUB
Internal
address bus
Address
Internal
read signal
Internal
data bus
(read access)
Read data
Internal
write signal
Internal
data bus
(write access)
Write data
Figure 2.13 On-Chip Peripheral Module Access Cycle (3-State Access)
2.7
CPU States
2.7.1
Overview
There are four CPU states: the reset state, program execution state, program halt state, and
exception-handling state. The program execution state includes active (high-speed or mediumspeed) mode and subactive mode. In the program halt state there are a sleep mode, standby mode,
watch mode, and sub-sleep mode. These states are shown in figure 2.14.
Figure 2.15 shows the state transitions.
43
CPU state
Reset state
The CPU is initialized.
Program
execution state
Active
(high speed) mode
The CPU executes successive program
instructions at high speed,
synchronized by the system clock
Active
(medium speed) mode
The CPU executes successive
program instructions at
reduced speed, synchronized
by the system clock
Subactive mode
The CPU executes
successive program
instructions at reduced
speed, synchronized
by the subclock
Program halt state
A state in which some
or all of the chip
functions are stopped
to conserve power
Low-power
modes
Sleep mode
Standby mode
Watch mode
Subsleep mode
Exceptionhandling state
A transient state entered when the CPU changes the processing
flow due to a reset or interrupt exception handling source.
Note: See section 5, Power-Down Modes, for details on the modes and their transitions.
Figure 2.14 CPU Operation States
44
Reset cleared
Reset state
Exception-handling state
Reset occurs
Reset
occurs
Reset
occurs
Interrupt
source
Program halt state
Exception- Exceptionhandling
handling
request
complete
Program execution state
SLEEP instruction executed
Figure 2.15 State Transitions
2.7.2
Program Execution State
In the program execution state the CPU executes program instructions in sequence.
There are three modes in this state, two active modes (high speed and medium speed) and one
subactive mode. Operation is synchronized with the system clock in active mode (high speed and
medium speed), and with the subclock in subactive mode. See section 5, Power-Down Modes for
details on these modes.
2.7.3
Program Halt State
In the program halt state there are four modes: sleep mode, standby mode, watch mode, and
subsleep mode. See section 5, Power-Down Modes for details on these modes.
2.7.4
Exception-Handling State
The exception-handling state is a transient state occurring when exception handling is started by a
reset or interrupt and the CPU changes its normal processing flow. In exception handling caused
by an interrupt, SP (R7) is referenced and the PC and CCR values are saved on the stack.
For details on interrupt handling, see section 3, Exception Handling.
45
2.8
Memory Map
2.8.1
Memory Map
Figure 2.16 shows the H8/3832 memory map. Figure 2.17 shows the H8/3833 memory map.
Figure 2.18 shows the H8/3834 memory map. Figure 2.19 shows the H8/3835 memory map.
Figure 2.20 shows the H8/3836 memory map. Figure 2.21 shows the H8/3837 memory map.
H'0000
Interrupt vector area
H'0029
H'002A
16 kbytes
(16,384 bytes)
On-chip ROM
H'3FFF
Reserved
H'F740
LCD RAM* (64 bytes)
H'F77F
Reserved
H'FB80
On-chip RAM
H'FF7F
H'FF80
H'FF9F
32-byte serial data buffer
H'FFA0
Internal I/O registers
(96 bytes)
H'FFFF
Note: * The LCD RAM addresses are the addresses after a reset.
Figure 2.16 H8/3832 Memory Map
46
1,024 bytes
H'0000
Interrupt vector area
H'0029
H'002A
24 kbytes
(24,576 bytes)
On-chip ROM
H'5FFF
Reserved
H'F740
LCD RAM* (64 bytes)
H'F77F
Reserved
H'FB80
On-chip RAM
1,024 bytes
H'FF7F
H'FF80
H'FF9F
32-byte serial data buffer
H'FFA0
Internal I/O registers
(96 bytes)
H'FFFF
Note: * The LCD RAM addresses are the addresses after a reset.
Figure 2.17 H8/3833 Memory Map
47
H'0000
Interrupt vector area
H'0029
H'002A
32 kbytes
(32,768 bytes)
On-chip ROM
H'7FFF
Reserved
H'F740
LCD RAM * (64 bytes)
H'F77F
Reserved
H'FB80
On-chip RAM
H'FF7F
H'FF80
H'FF9F
32-byte serial data buffer
H'FFA0
Internal I/O registers
(96 bytes)
H'FFFF
Note: * The LCD RAM addresses are the addresses after a reset.
Figure 2.18 H8/3834 Memory Map
48
1,024 bytes
H'0000
Interrupt vector area
H'0029
H'002A
40 kbytes
(40,960 bytes)
On-chip ROM
H'9FFF
Reserved
H'F740
LCD RAM * (64 bytes)
H'F77F
H'F780
On-chip RAM
2,048 bytes
H'FF7F
H'FF80
32-byte serial data buffer
H'FF9F
H'FFA0
Internal I/O registers
(96 bytes)
H'FFFF
Note: * The LCD RAM addresses are the addresses after a reset.
Figure 2.19 H8/3835 Memory Map
49
H'0000
Interrupt vector area
H'0029
H'002A
48 kbytes
(49,152 bytes)
On-chip ROM
H'BFFF
Reserved
H'F740
LCD RAM * (64 bytes)
H'F77F
H'F780
On-chip RAM
H'FF7F
H'FF80
32-byte serial data buffer
H'FF9F
H'FFA0
Internal I/O registers
(96 bytes)
H'FFFF
Note: * The LCD RAM addresses are the addresses after a reset.
Figure 2.20 H8/3836 Memory Map
50
2,048 bytes
H'0000
Interrupt vector area
H'0029
H'002A
60 kbytes
(60,928 bytes)
On-chip ROM
H'EDFF
Reserved
H'F740
LCD RAM * (64 bytes)
H'F77F
H'F780
On-chip RAM
2,048 bytes
H'FF7F
H'FF80
32-byte serial data buffer
H'FF9F
H'FFA0
Internal I/O registers
(96 bytes)
H'FFFF
Note: * The LCD RAM addresses are the addresses after a reset.
Figure 2.21 H8/3837 Memory Map
51
2.8.2
LCD RAM Address Relocation
After a reset, the LCD RAM area is located at addresses H'F740 to H'F77F. However, this area
can be relocated by setting the LCD RAM relocation register (RLCTR) bits. The LCD RAM
relocation register is explained below.
LCD RAM relocation register (RLCTR: H'FFCF)
Bit
7
6
5
4
3
2
1
0
—
—
—
—
—
—
RLCT1
RLCT0
Initial value
1
1
1
1
1
1
0
0
Read/Write
—
—
—
—
—
—
R/W
R/W
RLCTR is an 8-bit read/write register that selects the LCD RAM address space. Upon reset,
RLCTR is initialized to H'00.
Bits 7 to 2: Reserved Bits
Bits 7 to 2 are reserved; they are always read as 1, and cannot be modified.
Bits 1 and 0: LCD RAM relocation select (RLCT1, RLCT0)
Bits 1 and 0 select the LCD RAM address space.
Bit 1: RLCT1
Bit 0: RLCT0
Description
0
0
H'F740 toH'F77F
1
(initial value)
2
1
H'F940 to H'F97F*
0
H'FB40 to H'FB7F*2
1
H'FD40 to H'FD7F*1, 2
Notes: 1. In devices with 1,024-byte RAM, if RLCT1 to 0 are set to 11, on-chip RAM addresses
H'FB80 to H'FD7F become inaccessible.
2. In devices with 2,048-byte RAM, if RLCT1 to 0 are set to any value except 00, these onchip RAM addresses become inaccessible.
52
2.9
Application Notes
2.9.1
Notes on Data Access
Access to Empty Areas: The address space of the H8/300L CPU includes empty areas in addition
to the RAM, registers, and ROM areas available to the user. If these empty areas are mistakenly
accessed by an application program, the following results will occur.
• Data transfer from CPU to empty area
The transferred data will be lost. This action may also cause the CPU to misoperate.
• Data transfer from empty area to CPU
Unpredictable data is transferred.
Access to Internal I/O Registers: Internal data transfer to or from on-chip modules other than the
ROM and RAM areas makes use of an 8-bit data width. If word access is attempted to these areas,
the following results will occur.
• Word access from CPU to I/O register area
Upper byte: Will be written to I/O register.
Lower byte: Transferred data will be lost.
• Word access from I/O register to CPU
Upper byte: Will be written to upper part of CPU register.
Lower byte: Unpredictable data will be written to lower part of CPU register.
Byte size instructions should therefore be used when transferring data to or from I/O registers
other than the on-chip ROM and RAM areas. Figure 2.22 shows the data size and number of states
in which on-chip peripheral modules can be accessed.
53
Access
Word Byte States
H'0000
H'0029
H'002A
Interrupt vector area
(42 bytes)
2
32 kbytes *2
On-chip ROM
H'7FFF*2
—
Reserved
—
—
H'F740
2
LCD RAM *1 (64 bytes)
H'F77F
Reserved
—
—
—
H'FB80*3
On-chip RAM
1,024 bytes*3
2
H'FF7F
H'FF80
H'FF9F
32-byte serial data buffer
H'FFA0
Internal I/O registers
(96 bytes)
H'FFFF
H'FFA8
H'FFAD
×
2
×
2
×
3
×
2
Notes: The above example is a description of the H8/3834.
1. The indicated addresses for the LCD RAM area are initial values after system reset.
2. The H8/3832 has 16 kbytes of on-chip ROM, and its ending address is H'3FFF.
The H8/3833 has 24 kbytes of on-chip ROM, and its ending address is H'5FFF.
The H8/3835 has 40 kbytes of on-chip ROM, and its ending address is H'9FFF.
The H8/3836 has 48 kbytes of on-chip ROM, and its ending address is H'BFFF.
The H8/3837 has 60 kbytes of on-chip ROM, and its ending address is H'EDFF.
3. The H8/3832 and H8/3833 have 1,024 bytes of on-chip RAM and its starting address
is H8/3834.
The H8/3835, H8/3836, and H8/3837 each have 2,048 bytes of on-chip RAM, and
their starting address is H'F780.
Figure 2.22 Data Size and Number of States for Access to and from
On-Chip Peripheral Modules
54
2.9.2
Notes on Bit Manipulation
The BSET, BCLR, BNOT, BST, and BIST instructions read one byte of data, modify the data,
then write the data byte again. Special care is required when using these instructions in cases
where two registers are assigned to the same address, in the case of registers that include writeonly bits, and when the instruction accesses an I/O.
Order of Operation
Operation
1
Read
Read byte data at the designated address
2
Modify
Modify a designated bit in the read data
3
Write
Write the altered byte data to the designated address
Bit Manipulation in Two Registers Assigned to the Aame Address
Example 1: Timer load register and timer count bit manipulation
Figure 2.23 shows an example in which two timer registers share the same address. When a bit
manipulation instruction accesses the timer load register and timer counter of a reloadable timer,
since these two registers share the same address, the following operations take place.
Order of Operation
Operation
1
Read
Timer counter data is read (one byte)
2
Modify
The CPU modifies (sets or resets) the bit designated in the instruction
3
Write
The altered byte data is written to the timer load register
The timer counter is counting, so the value read is not necessarily the same as the value in the
timer load register. As a result, bits other than the intended bit in the timer load register may be
modified to the timer counter value.
R
Count clock
Timer counter
R: Read
W: Write
Reload
W
Timer load register
Internal bus
Figure 2.23 Timer Configuration Example
55
Example 2: When a BSET instruction is executed on port 3
Here a BSET instruction is executed designating port 3.
P3 7 and P36 are designated as input pins, with a low-level signal input at P37 and a high-level
signal at P3 6. The remaining pins, P35 to P30, are output pins and output low-level signals. In this
example, the BSET instruction is used to change pin P30 to high-level output.
[A: Prior to executing BSET]
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
0
[B: BSET instruction executed]
BSET
#0
,
@PDR3
The BSET instruction is executed designating port 3.
[C: After executing BSET]
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR3
0
0
1
1
1
1
1
1
PDR3
0
1
0
0
0
0
0
1
[D: Explanation of how BSET operates]
When the BSET instruction is executed, first the CPU reads port 3.
Since P37 and P36 are input pins, the CPU reads the pin states (low-level and high-level input). P35
to P30 are output pins, so the CPU reads the value in PDR3. In this example PDR3 has a value of
H'80, but the value read by the CPU is H'40.
Next, the CPU sets bit 0 of the read data to 1, changing the PDR3 data to H'41. Finally, the CPU
writes this value (H'41) to PDR3, completing execution of BSET.
56
As a result of this operation, bit 0 in PDR3 becomes 1, and P3 0 outputs a high-level signal.
However, bits 7 and 6 of PDR3 end up with different values.
To avoid this problem, store a copy of the PDR3 data in a work area in memory. Perform the bit
manipulation on the data in the work area, then write this data to PDR3.
[A: Prior to executing BSET]
MOV. B
MOV. B
MOV. B
#80,
R0L,
R0L,
R0L
@RAM0
@PDR3
The PDR3 value (H'80) is written to a work area in memory
(RAM0) as well as to PDR3.
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
0
RAM0
1
0
0
0
0
0
0
0
[B: BSET instruction executed]
BSET
#0
,
@RAM0
The BSET instruction is executed designating the PDR3
work area (RAM0).
[C: After executing BSET]
MOV. B
MOV. B
@RAM0, R0L
R0L, @PDR3
The work area (RAM0) value is written to PDR3.
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
1
RAM0
1
0
0
0
0
0
0
1
57
Bit Manipulation in a Register Containing a Write-Only Bit
Example 3: When a BCLR instruction is executed on PCR3 of port 3
In this example, the port 3 control register PCR3 is accessed by a BCLR instruction.
As in the examples above, P37 and P36 are input pins, with a low-level signal input at P37 and a
high-level signal at P36. The remaining pins, P35 to P30, are output pins that output low-level
signals. In this example, the BCLR instruction is used to change pin P30 to an input port. It is
assumed that a high-level signal will be input to this input pin.
[A: Prior to executing BCLR]
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
0
[B: BCLR instruction executed]
BCLR
#0
,
@PCR3
The BCLR instruction is executed designating PCR3.
[C: After executing BCLR]
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Output
Output
Output
Output
Output
Output
Output
Input
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR3
1
1
1
1
1
1
1
0
PDR3
1
0
0
0
0
0
0
0
[D: Explanation of how BCLR operates]
When the BCLR instruction is executed, first the CPU reads PCR3. Since PCR3 is a write-only
register, the CPU reads a value of H'FF, even though the PCR3 value is actually H'3F.
Next, the CPU clears bit 0 in the read data to 0, changing the data to H'FE. Finally, this value
(H'FE) is written to PCR3 and BCLR instruction execution ends.
58
As a result of this operation, bit 0 in PCR3 becomes 0, making P3 0 an input port. However, bits 7
and 6 in PCR3 change to 1, so that P3 7 and P36 change from input pins to output pins.
To avoid this problem, store a copy of the PCR3 data in a work area in memory. Perform the bit
manipulation on the data in the work area, then write this data to PCR3.
[A: Prior to executing BCLR]
MOV. B
MOV. B
MOV. B
#3F,
R0L,
R0L,
R0L
@RAM0
@PCR3
The PCR3 value (H'3F) is written to a work area in memory
(RAM0) as well as to PCR3.
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
Low
level
PCR3
0
0
1
1
1
1
1
1
PDR3
1
0
0
0
0
0
0
0
RAM0
0
0
1
1
1
1
1
1
[B: BCLR instruction executed]
BCLR
#0
,
@RAM0
The BCLR instruction is executed designating the PCR3
work area (RAM0).
[C: After executing BCLR]
MOV. B
MOV. B
@RAM0, R0L
R0L, @PCR3
The work area (RAM0) value is written to PCR3.
P37
P36
P35
P34
P33
P32
P31
P30
Input/output
Input
Input
Output
Output
Output
Output
Output
Output
Pin state
Low
level
High
level
Low
level
Low
level
Low
level
Low
level
Low
level
High
level
PCR3
0
0
1
1
1
1
1
0
PDR3
1
0
0
0
0
0
0
0
RAM0
0
0
1
1
1
1
1
0
Table 2.12 lists registers that share the same address, and table 2.13 lists registers that contain
write-only bits.
59
Table 2.12 Registers with shared addresses
Register Name
Abbreviation
Address
Timer counter B and timer load register B
TCB/TLB
H'FFB3
Timer counter C and timer load register C
TCC/TLC
H'FFB5
Port data register 1*
PDR1
H'FFD4
Port data register 2*
PDR2
H'FFD5
Port data register 3*
PDR3
H'FFD6
Port data register 4*
PDR4
H'FFD7
Port data register 5*
PDR5
H'FFD8
Port data register 6*
PDR6
H'FFD9
Port data register 7*
PDR7
H'FFDA
Port data register 8*
PDR8
H'FFDB
Port data register 9*
PDR9
H'FFDC
Port data register A*
PDRA
H'FFDD
Note: * These port registers are used also for pin input.
Table 2.13 Registers with write-only bits
Register Name
Abbreviation
Address
Port control register 1
PCR1
H'FFE4
Port control register 2
PCR2
H'FFE5
Port control register 3
PCR3
H'FFE6
Port control register 4
PCR4
H'FFE7
Port control register 5
PCR5
H'FFE8
Port control register 6
PCR6
H'FFE9
Port control register 7
PCR7
H'FFEA
Port control register 8
PCR8
H'FFEB
Port control register 9
PCR9
H'FFEC
Port control register A
PCRA
H'FFED
Timer control register F
TCRF
H'FFB6
PWM control register
PWCR
H'FFD0
PWM data register U
PWDRU
H'FFD1
PWM data register L
PWDRL
H'FFD2
60
2.9.3
Notes on Use of the EEPMOV Instruction
• The EEPMOV instruction is a block data transfer instruction. It moves the number of bytes
specified by R4L from the address specified by R5 to the address specified by R6.
R5 →
← R6
R5 + R4L →
← R6 + R4L
• When setting R4L and R6, make sure that the final destination address (R6 + R4L) does not
exceed H'FFFF. The value in R6 must not change from H'FFFF to H'0000 during execution of
the instruction.
R5 →
R5 + R4L →
← R6
H'FFFF
Not allowed
← R6 + R4L
61
62
Section 3 Exception Handling
3.1
Overview
Exception handling is performed in the H8/3834 Series when a reset or interrupt occurs. Table 3.1
shows the priorities of these two types of exception handling.
Table 3.1
Exception Handling Types and Priorities
Priority
Exception Source
Time of Start of Exception Handling
High
Reset
Exception handling starts as soon as the reset state is cleared
Interrupt
When an interrupt is requested, exception handling starts
after execution of the present instruction or the exception
handling in progress is completed
Low
3.2
Reset
3.2.1
Overview
A reset is the highest-priority exception. The internal state of the CPU and the registers of the onchip peripheral modules are initialized.
3.2.2
Reset Sequence
As soon as the RES pin goes low, all processing is stopped and the H8/3834 enters the reset state.
To make sure the chip is reset properly, observe the following precautions.
• At power on: Hold the RES pin low until the clock pulse generator output stabilizes.
• Resetting during operation: Hold the RES pin low for at least 10 system clock cycles.
If the MD0 pin is at the high level, reset exception handling begins when the RES pin is held low
for a given period, then returned to the high level. If the MD0 pin is low, however, when the RES
pin is held low for a given period and then returned to high level, the reset is not cleared
immediately. First the MD0 pin must go from low to high, then after 8,192 clock cycles the reset
is cleared and reset exception handling begins.
63
Reset exception handling takes place as follows.
• The CPU internal state and the registers of on-chip peripheral modules are initialized, with the
I bit of the condition code register (CCR) set to 1.
• The PC is loaded from the reset exception handling vector address (H'0000 to H'0001), after
which the program starts executing from the address indicated in PC.
When system power is turned on or off, the RES pin should be held low.
Figures 3.1 and 3.2 show the reset sequence.
Reset cleared
Program initial
instruction prefetch
Vector fetch Internal
processing
RES
MD0
High
φ
Internal
address bus
(1)
(2)
Internal read
signal
Internal write
signal
Internal data
bus (16-bit)
(2)
(1) Reset exception handling vector address (H'0000)
(2) Program start address
(3) First instruction of program
Figure 3.1 Reset Sequence (when MD0 Pin is High)
64
(3)
Reset cleared
Program initial
instruction prefetch
Vector fetch Internal
processing
RES
MD0
φ
8,192 clock
cycles
Internal
address bus
(2)
(1)
Internal read
signal
Internal write
signal
Internal data
bus (16-bit)
(2)
(3)
(1) Reset exception handling vector address (H'0000)
(2) Program start address
(3) First instruction of program
Figure 3.2 Reset Sequence (when MD0 Pin is Low)
3.2.3
Interrupt Immediately after Reset
After a reset, if an interrupt were to be accepted before the stack pointer (SP: R7) was initialized,
PC and CCR would not be pushed onto the stack correctly, resulting in program runaway. To
prevent this, immediately after reset exception handling all interrupts are masked. For this reason,
the initial program instruction is always executed immediately after a reset. This instruction should
initialize the stack pointer (e.g. MOV.W #xx: 16, SP).
65
3.3
Interrupts
3.3.1
Overview
The interrupt sources include 13 external interrupts (WKP0 to WKP7, IRQ0 to IRQ4), and 20
internal interrupts from on-chip peripheral modules. Table 3.2 shows the interrupt sources, their
priorities, and their vector addresses. When more than one interrupt is requested, the interrupt with
the highest priority is processed.
The interrupts have the following features:
• Both internal and external interrupts can be masked by the I bit of CCR. When this bit is set to
1, interrupt request flags are set but interrupts are not accepted.
• The external interrupt pins IRQ0 to IRQ4 can each be set independently to either rising edge
sensing or falling edge sensing.
Table 3.2
Interrupt Sources and Priorities
Priority
Interrupt Source
Interrupt
Vector
Number
Vector Address
High
RES
Reset
0
H'0000 to H'0001
IRQ0
IRQ0
4
H'0008 to H'0009
Low
66
IRQ1
IRQ1
5
H'000A to H'000B
IRQ2
IRQ2
6
H'000C to H'000D
IRQ3
IRQ3
7
H'000E to H'000F
IRQ4
IRQ4
8
H'0010 to H'0011
WKP 0
WKP 0
9
H'0012 to H'0013
WKP 1
WKP 1
WKP 2
WKP 2
WKP 3
WKP 3
WKP 4
WKP 4
WKP 5
WKP 5
WKP6
WKP 6
WKP 7
WKP 7
SCI1
SCI1 transfer complete
10
H'0014 to H'0015
Timer A
Timer A overflow
11
H'0016 to H'0017
Timer B
Timer B overflow
12
H'0018 to H'0019
Timer C
Timer C overflow or underflow
13
H'001A to H'001B
Table 3.2
Interrupt Sources and Priorities (cont)
Priority
Interrupt Source
High
Timer FL
Interrupt
Vector
Number
Vector Address
Timer FL compare match
14
H'001C to H'001D
15
H'001E to H'001F
16
H'0020 to H'0021
17
H'0022 to H'0023
18
H'0024 to H'0025
Timer FL overflow
Timer FH
Timer FH compare match
Timer FH overflow
Timer G
Timer G input capture
Timer G overflow
SCI2
SCI2 transfer complete
SCI2 transfer abort
SCI3
SCI3 transmit end
SCI3 transmit data empty
SCI3 receive data full
SCI3 overrun error
SCI3 framing error
SCI3 parity error
Low
A/D converter
A/D conversion end
19
H'0026 to H'0027
(SLEEP instruction
executed)
Direct transfer
20
H'0028 to H'0029
Note: Vector addresses H'0002 to H'0007 are reserved and cannot be used.
3.3.2
Interrupt Control Registers
Table 3.3 lists the registers that control interrupts.
Table 3.3
Interrupt Control Registers
Register Name
Abbreviation
R/W
Initial Value
Address
IRQ edge select register
IEGR
R/W
H'E0
H'FFF2
Interrupt enable register 1
IENR1
R/W
H'00
H'FFF3
Interrupt enable register 2
IENR2
R/W
H'00
H'FFF4
Interrupt request register 1
IRR1
R/W*
H'20
H'FFF6
Interrupt request register 2
IRR2
R/W*
H'00
H'FFF7
Wakeup interrupt request register
IWPR
R/W*
H'00
H'FFF9
Note: * Write is enabled only for writing of 0 to clear a flag.
67
IRQ Edge Select Register (IEGR)
Bit
7
6
5
4
3
2
1
0
—
—
—
IEG4
IEG3
IEG2
IEG1
IEG0
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
IEGR is an 8-bit read/write register, used to designate whether pins IRQ0 to IRQ4 are set to rising
edge sensing or falling edge sensing.
Bits 7 to 5—Reserved Bits: Bits 7 to 5 are reserved; they are always read as 1, and cannot be
modified.
Bit 4—IRQ4 Edge Select (IEG4): Bit 4 selects the input sensing of pin IRQ4/ADTRG.
Bit 4: IEG4
Description
0
Falling edge of IRQ4/ADTRG pin input is detected
1
Rising edge of IRQ4/ADTRG pin input is detected
(initial value)
Bit 3—IRQ3 Edge Select (IEG3): Bit 3 selects the input sensing of pin IRQ3/TMIF.
Bit 3: IEG3
Description
0
Falling edge of IRQ3/TMIF pin input is detected
1
Rising edge of IRQ3/TMIF pin input is detected
(initial value)
Bit 2—IRQ2 Edge Select (IEG2): Bit 2 selects the input sensing of pin IRQ2/TMIC.
Bit 2: IEG2
Description
0
Falling edge of IRQ2/TMIC pin input is detected
1
Rising edge of IRQ2/TMIC pin input is detected
(initial value)
Bit 1—IRQ1 Edge Select (IEG1): Bit 1 selects the input sensing of pin IRQ1/TMIB.
Bit 1: IEG1
Description
0
Falling edge of IRQ1/TMIB pin input is detected
1
Rising edge of IRQ1/TMIB pin input is detected
68
(initial value)
Bit 0—IRQ0 Edge Select (IEG0): Bit 0 selects the input sensing of pin IRQ0.
Bit 0: IEG0
Description
0
Falling edge of IRQ0 pin input is detected
1
Rising edge of IRQ0 pin input is detected
(initial value)
Interrupt Enable Register 1 (IENR1)
Bit
7
6
5
4
3
2
1
0
IENTA
IENS1
IENWP
IEN4
IEN3
IEN2
IEN1
IEN0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
IENR1 is an 8-bit read/write register that enables or disables interrupt requests.
Bit 7—Timer A Interrupt Enable (IENTA): Bit 7 enables or disables timer A overflow interrupt
requests.
Bit 7: IENTA
Description
0
Disables timer A interrupts
1
Enables timer A interrupts
(initial value)
Bit 6—SCI1 Interrupt Enable (IENS1): Bit 6 enables or disables SCI1 transfer complete
interrupt requests.
Bit 6: IENS1
Description
0
Disables SCI1 interrupts
1
Enables SCI1 interrupts
(initial value)
Bit 5—Wakeup Interrupt Enable (IENWP): Bit 5 enables or disables WKP7 to WKP0 interrupt
requests.
Bit 5: IENWP
Description
0
Disables interrupt requests from WKP 7 to WKP 0
1
Enables interrupt requests from WKP 7 to WKP 0
(initial value)
69
Bits 4 to 0—IRQ4 to IRQ0 Interrupt Enable (IEN4 to IEN0): Bits 4 to 0 enable or disable IRQ4
to IRQ0 interrupt requests.
Bit n: IENn
Description
0
Disables interrupt request IRQn
1
Enables interrupt request IRQn
(initial value)
(n = 4 to 0)
Interrupt Enable Register 2 (IENR2)
Bit
7
6
5
4
3
2
1
0
IENDT
IENAD
IENS2
IENTG
IENTFH
IENTFL
IENTC
IENTB
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
IENR2 is an 8-bit read/write register that enables or disables interrupt requests.
Bit 7—Direct Transfer Interrupt Enable (IENDT): Bit 7 enables or disables direct transfer
interrupt requests.
Bit 7: IENDT
Description
0
Disables direct transfer interrupt requests
1
Enables direct transfer interrupt requests
(initial value)
Bit 6—A/D Converter Interrupt Enable (IENAD): Bit 6 enables or disables A/D converter
interrupt requests.
Bit 6: IENAD
Description
0
Disables A/D converter interrupt requests
1
Enables A/D converter interrupt requests
(initial value)
Bit 5—SCI2 Interrupt Enable (IENS2): Bit 5 enables or disables SCI2 transfer complete and
transfer abort interrupt requests.
Bit 5: IENS2
Description
0
Disables SCI2 interrupts
1
Enables SCI2 interrupts
70
(initial value)
Bit 4—Timer G Interrupt Enable (IENTG): Bit 4 enables or disables timer G input capture and
overflow interrupt requests.
Bit 4: IENTG
Description
0
Disables timer G interrupts
1
Enables timer G interrupts
(initial value)
Bit 3—Timer FH Interrupt Enable (IENTFH): Bit 3 enables or disables timer FH compare
match and overflow interrupt requests.
Bit 3: IENTFH
Description
0
Disables timer FH interrupts
1
Enables timer FH interrupts
(initial value)
Bit 2—Timer FL Interrupt Enable (IENTFL): Bit 2 enables or disables timer FL compare
match and overflow interrupt requests.
Bit 2: IENTFL
Description
0
Disables timer FL interrupts
1
Enables timer FL interrupts
(initial value)
Bit 1—Timer C Interrupt Enable (IENTC): Bit 1 enables or disables timer C overflow or
underflow interrupt requests.
Bit 1: IENTC
Description
0
Disables timer C interrupts
1
Enables timer C interrupts
(initial value)
Bit 0—Timer B Interrupt Enable (IENTB): Bit 0 enables or disables timer B overflow or
underflow interrupt requests.
Bit 0: IENTB
Description
0
Disables timer B interrupts
1
Enables timer B interrupts
(initial value)
SCI3 interrupt control is covered in 10.4.2, in the description of serial control register 3.
71
Interrupt request register 1 (IRR1)
Bit
7
6
5
4
3
2
1
0
IRRTA
IRRS1
—
IRRI4
IRRI3
IRRI2
IRRI1
IRRI0
Initial value
0
0
1
0
0
0
0
0
Read/Write
R/W*
R/W*
—
R/W*
R/W*
R/W*
R/W*
R/W*
Note: * Only a write of 0 for flag clearing is possible.
IRR1 is an 8-bit read/write register, in which the corresponding bit is set to 1 when a timer A,
SCI1, or IRQ 4 to IRQ0 interrupt is requested. The flags are not cleared automatically when an
interrupt is accepted. It is necessary to write 0 to clear each flag.
Bit 7—Timer A Interrupt Request Flag (IRRTA)
Bit 7: IRRTA
Description
0
Clearing conditions:
When IRRTA = 1, it is cleared by writing 0
1
(initial value)
Setting conditions:
When the timer A counter value overflows (goes from H'FF to H'00)
Bit 6—SCI1 Interrupt Request Flag (IRRS1)
Bit 6: IRRS1
Description
0
Clearing conditions:
When IRRS1 = 1, it is cleared by writing 0
1
(initial value)
Setting conditions:
When an SCI1 transfer is completed
Bit 5—Reserved Bit: Bit 5 is reserved; it is always read as 1, and cannot be modified.
Bits 4 to 0—IRQ4 to IRQ0 Interrupt Request Flags (IRRI4 to IRRI0)
Bit n: IRRIn
Description
0
Clearing conditions:
When IRRIn = 1, it is cleared by writing 0 to IRRIn
1
(initial value)
Setting conditions:
IRRIn is set when pin IRQn is set to interrupt input, and the designated signal
edge is detected
(n = 4 to 0)
72
Interrupt Request Register 2 (IRR2)
Bit
7
6
5
4
3
2
1
0
IRRDT
IRRAD
IRRS2
IRRTG
IRRTFH
IRRTFL
IRRTC
IRRTB
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
Note: * Only a write of 0 for flag clearing is possible.
IRR2 is an 8-bit read/write register, in which the corresponding bit is set to 1 when a direct
transfer, A/D converter, SCI2, timer G, timer FH, timer FL, timer C, or timer B interrupt is
requested. The flags are not cleared automatically when an interrupt is accepted. It is necessary to
write 0 to clear each flag.
Bit 7—Direct Transfer Interrupt Request Flag (IRRDT)
Bit 7: IRRDT
Description
0
Clearing conditions:
When IRRDT = 1, it is cleared by writing 0
1
(initial value)
Setting conditions:
When DTON = 1 and a direct transfer is made immediately after a SLEEP
instruction is executed
Bit 6—A/D Converter Interrupt Request Flag (IRRAD)
Bit 6: IRRAD
Description
0
Clearing conditions:
When IRRAD = 1, it is cleared by writing 0
1
(initial value)
Setting conditions:
When A/D conversion is completed and ADSF is reset
Bit 5—SCI2 Interrupt Request Flag (IRRS2)
Bit 5: IRRS2
Description
0
Clearing conditions:
When IRRS2 = 1, it is cleared by writing 0
1
(initial value)
Setting conditions:
When an SCI2 transfer is completed or aborted
73
Bit 4—Timer G Interrupt Request Flag (IRRTG)
Bit 4: IRRTG
Description
0
Clearing conditions:
When IRRTG = 1, it is cleared by writing 0
1
(initial value)
Setting conditions:
When pin TMIG is set to TMIG input and the designated signal edge is
detected
Bit 3—Timer FH Interrupt Request Flag (IRRTFH)
Bit 3: IRRTFH
Description
0
Clearing conditions:
When IRRTFH = 1, it is cleared by writing 0
1
(initial value)
Setting conditions:
When counter FH matches output compare register FH in 8-bit timer mode, or
when 16-bit counter F (TCFL, TCFH) matches output compare register F
(OCRFL, OCRFH) in 16-bit timer mode
Bit 2—Timer FL Interrupt Request Flag (IRRTFL)
Bit 2: IRRTFL
Description
0
Clearing conditions:
When IRRTFL = 1, it is cleared by writing 0
1
(initial value)
Setting conditions:
When counter FL matches output compare register FL in 8-bit timer mode
Bit 1—Timer C Interrupt Request Flag (IRRTC)
Bit 1: IRRTC
Description
0
Clearing conditions:
When IRRTC = 1, it is cleared by writing 0
1
74
(initial value)
Setting conditions:
When the timer C counter value overflows (goes from H'FF to H'00) or
underflows (goes from H'00 to H'FF)
Bit 0—Timer B Interrupt Request Flag (IRRTB)
Bit 0: IRRTB
Description
0
Clearing conditions:
When IRRTB = 1, it is cleared by writing 0
1
(initial value)
Setting conditions:
When the timer B counter value overflows (goes from H'FF to H'00)
Wakeup Interrupt Request Register (IWPR)
Bit
7
6
5
4
3
2
1
0
IWPF7
IWPF6
IWPF5
IWPF4
IWPF3
IWPF2
IWPF1
IWPF0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
R/W*
Note: * Only a write of 0 for flag clearing is possible.
IWPR is an 8-bit read/write register, in which the corresponding bit is set to 1 when pins WKP to
WKP0 are set to wakeup input and a pin receives a falling edge input. The flags are not cleared
automatically when an interrupt is accepted. It is necessary to write 0 to clear each flag.
7
Bits 7 to 0—Wakeup Interrupt Request Flags (WKPF7 to WKPF0)
Bit n: IWPFn
Description
0
Clearing conditions:
When IWPFn = 1, it is cleared by writing 0 to IWPFn
1
Setting conditions:
IWPFn is set when pin WKP n is set to wakeup interrupt input, and a falling edge
input is detected at the pin
(n = 7 to 0)
3.3.3
External Interrupts
There are 13 external interrupts, WKP0 to WKP7 and IRQ 0 to IRQ4.
Interrupts WKP0 to WKP7: Interrupts WKP 0 to WKP7 are requested by falling edge inputs at
pins WKP0 to WKP7. When these pins are designated as WKP0 to WKP7 pins in port mode register
5 (PMR5) and falling edge input is detected, the corresponding bit in the wakeup interrupt request
register (IWPR) is set to 1, requesting an interrupt. Wakeup interrupt requests can be disabled by
clearing the IENWP bit in IENR1 to 0. It is also possible to mask all interrupts by setting the CCR
I bit to 1.
75
When an interrupt exception handling request is received for interrupts WKP0 to WKP7, the CCR I
bit is set to 1. The vector number for interrupts WKP0 to WKP7 is 9. Since all eight interrupts are
assigned the same vector number, the interrupt source must be determined by the exception
handling routine.
Interrupts IRQ0 to IRQ4: Interrupts IRQ0 to IRQ4 are requested by into pins inputs to IRQ0 to
IRQ4. These interrupts are detected by either rising edge sensing or falling edge sensing,
depending on the settings of bits IEG0 to IEG4 in the edge select register (IEGR).
When these pins are designated as pins IRQ0 to IRQ4 in port mode registers 1 and 2 (PMR1 and
PMR2) and the designated edge is input, the corresponding bit in IRR1 is set to 1, requesting an
interrupt. Interrupts IRQ0 to IRQ4 can be disabled by clearing bits IEN0 to IEN4 in IENR1 to 0.
All interrupts can be masked by setting the I bit in CCR to 1.
When IRQ 0 to IRQ4 interrupt exception handling is initiated, the I bit is set to 1. Vector numbers 4
to 8 are assigned to interrupts IRQ0 to IRQ4. The order of priority is from IRQ0 (high) to IRQ4
(low). Table 3.2 gives details.
3.3.4
Internal Interrupts
There are 20 internal interrupts that can be requested by the on-chip peripheral modules. When a
peripheral module requests an interrupt, the corresponding bit in IRR1 or IRR2 is set to 1.
Individual interrupt requests can be disabled by clearing the corresponding bit in IENR1 or IENR2
to 0. All interrupts can be masked by setting the I bit in CCR to 1. When an internal interrupt
request is accepted, the I bit is set to 1. Vector numbers 10 to 20 are assigned to these interrupts.
Table 3.2 shows the order of priority of interrupts from on-chip peripheral modules.
3.3.5
Interrupt Operations
Interrupts are controlled by an interrupt controller. Figure 3.3 shows a block diagram of the
interrupt controller. Figure 3.4 shows the flow up to interrupt acceptance.
Interrupt operation is described as follows.
• When an interrupt condition is met while the interrupt enable register bit is set to 1, an
interrupt request signal is sent to the interrupt controller.
• When the interrupt controller receives an interrupt request, it sets the interrupt request flag.
• From among the interrupts with interrupt request flags set to 1, the interrupt controller selects
the interrupt request with the highest priority and holds the others pending. (Refer to
table 3.2 for a list of interrupt priorities.)
• The interrupt controller checks the I bit of CCR. If the I bit is 0, the selected interrupt request is
accepted; if the I bit is 1, the interrupt request is held pending.
76
• If the interrupt is accepted, after processing of the current instruction is completed, both PC
and CCR are pushed onto the stack. The state of the stack at this time is shown in figure 3.5.
The PC value pushed onto the stack is the address of the first instruction to be executed upon
return from interrupt handling.
• The I bit of CCR is set to 1, masking all further interrupts.
• The vector address corresponding to the accepted interrupt is generated, and the interrupt
handling routine located at the address indicated by the contents of the vector address is
executed.
Notes: 1. When disabling interrupts by clearing bits in an interrupt enable register, or when
clearing bits in an interrupt request register, always do so while interrupts are masked
(I = 1).
2. If the above clear operations are performed while I = 0, and as a result a conflict arises
between the clear instruction and an interrupt request, exception processing for the
interrupt will be executed after the clear instruction has been executed.
External or
internal
interrupts
Priority decision logic
Interrupt controller
Interrupt
request
External
interrupts or
internal
interrupt
enable
signals
I
CCR (CPU)
Figure 3.3 Block Diagram of Interrupt Controller
77
Program execution state
IRRIO = 1
No
Yes
IENO = 1
No
Yes
IRRI1 = 1
No
Yes
IEN1 = 1
Yes
No
IRRI2 = 1
No
Yes
IEN2 = 1
No
Yes
IRRDT = 1
No
Yes
IENDT = 1
Yes
No
I=0
Yes
PC contents saved
CCR contents saved
I←1
Branch to interrupt
handling routine
Notation:
PC: Program counter
CCR: Condition code register
I:
I bit of CCR
Figure 3.4 Flow up to Interrupt Acceptance
78
No
SP – 4
SP (R7)
CCR
SP – 3
SP + 1
CCR*
SP – 2
SP + 2
PCH
SP – 1
SP + 3
PCL
SP (R7)
SP + 4
Even address
Stack area
Prior to start of interrupt
exception handling
PC and CCR
saved to stack
After completion of interrupt
exception handling
Notation:
PCH: Upper 8 bits of program counter (PC)
PCL: Lower 8 bits of program counter (PC)
CCR: Condition code register
SP: Stack pointer
Notes: 1. PC shows the address of the first instruction to be executed upon
return from the interrupt handling routine.
2. Register contents must always be saved and restored by word access,
starting from an even-numbered address.
* Ignored on return from interrupt.
Figure 3.5 Stack State after Completion of Interrupt Exception Handling
Figure 3.6 shows a typical interrupt sequence where the program area is in the on-chip ROM and
the stack area is in the on-chip RAM.
79
Figure 3.6 Interrupt Sequence
80
Internal data bus
(16 bits)
Internal write
signal
Internal read
signal
Internal
address bus
φ
Interrupt
request signal
(4)
Instruction
prefetch
(3)
Internal
processing
(5)
(1)
Stack access
(6)
(7)
(9)
Vector fetch
(8)
(10)
(9)
Prefetch instruction of
Internal
interrupt-handling routine
processing
(1) Instruction prefetch address (Instruction is not executed. Address is saved as PC contents, becoming return address.)
(2)(4) Instruction code (not executed)
(3) Instruction prefetch address (Instruction is not executed.)
(5) SP – 2
(6) SP – 4
(7) CCR
(8) Vector address
(9) Starting address of interrupt-handling routine (contents of vector address)
(10) First instruction of interrupt-handling routine
(2)
(1)
Interrupt level
decision and wait for
end of instruction
Interrupt is
accepted
3.3.6
Interrupt Response Time
Table 3.4 shows the number of wait states after an interrupt request flag is set until the first
instruction of the interrupt handler is executed.
Table 3.4
Interrupt Wait States
Item
States
Waiting time for completion of executing instruction*
1 to 13
Saving of PC and CCR to stack
4
Vector fetch
2
Instruction fetch
4
Internal processing
4
Total
15 to 27
Note: * Not including EEPMOV instruction.
3.4
Application Notes
3.4.1
Notes on Stack Area Use
When word data is accessed in the H8/3834 Series, the least significant bit of the address is
regarded as 0. Access to the stack always takes place in word size, so the stack pointer (SP: R7)
should never indicate an odd address. Use PUSH Rn (MOV.W Rn, @–SP) or POP Rn (MOV.W
@SP+, Rn) to save or restore register values.
Setting an odd address in SP may cause a program to crash. An example is shown in figure 3.7.
81
SP →
SP →
PCH
PC L
R1L
PC L
SP →
H'FEFC
H'FEFD
H'FEFF
BSR instruction
SP set to H'FEFF
MOV. B R1L, @–R7
Stack accessed beyond SP
Contents of PCH are lost
Notation:
PCH: Upper byte of program counter
PCL: Lower byte of program counter
R1L: General register R1L
SP: Stack pointer
Figure 3.7 Operation when Odd Address is Set in SP
When CCR contents are saved to the stack during interrupt exception handling or restored when
RTE is executed, this also takes place in word size. Both the upper and lower bytes of word data
are saved to the stack; on return, the even address contents are restored to CCR while the odd
address contents are ignored.
3.4.2
Notes on Rewriting Port Mode Registers
When a port mode register is rewritten to switch the functions of external interrupt pins, the
following points should be observed.
When an external interrupt pin function is switched by rewriting the port mode register that
controls these pins (IRQ4 to IRQ0, and WKP7 to WKP0), the interrupt request flag may be set to 1
at the time the pin function is switched, even if no valid interrupt is input at the pin. Be sure to
clear the interrupt request flag to 0 after switching pin functions. Table 3.5 shows the conditions
under which interrupt request flags are set to 1 in this way.
82
Table 3.5
Conditions under which Interrupt Request Flag is Set to 1
Interrupt Request
Flags Set to 1
Conditions
IRR1
•
When PMR2 bit IRQ4 is changed from 0 to 1 while pin IRQ4 is low and
IEGR bit IEG4 = 0.
•
When PMR2 bit IRQ4 is changed from 1 to 0 while pin IRQ4 is low and
IEGR bit IEG4 = 1.
•
When PMR1 bit IRQ3 is changed from 0 to 1 while pin IRQ3 is low and
IEGR bit IEG3 = 0.
•
When PMR1 bit IRQ3 is changed from 1 to 0 while pin IRQ3 is low and
IEGR bit IEG3 = 1.
•
When PMR1 bit IRQ2 is changed from 0 to 1 while pin IRQ2 is low and
IEGR bit IEG2 = 0.
•
When PMR1 bit IRQ2 is changed from 1 to 0 while pin IRQ2 is low and
IEGR bit IEG2 = 1.
•
When PMR1 bit IRQ1 is changed from 0 to 1 while pin IRQ1 is low and
IEGR bit IEG1 = 0.
•
When PMR1 bit IRQ1 is changed from 1 to 0 while pin IRQ1 is low and
IEGR bit IEG1 = 1.
•
When PMR2 bit IRQ0 is changed from 0 to 1 while pin IRQ0 is low and
IEGR bit IEG0 = 0.
•
When PMR2 bit IRQ0 is changed from 1 to 0 while pin IRQ0 is low and
IEGR bit IEG0 = 1.
IRRI4
IRRI3
IRRI2
IRRI1
IRRI0
IWPR
IWPF7
When PMR5 bit WKP7 is changed from 0 to 1 while pin WKP 7 is low
IWPF6
When PMR5 bit WKP6 is changed from 0 to 1 while pin WKP 6 is low
IWPF5
When PMR5 bit WKP5 is changed from 0 to 1 while pin WKP 5 is low
IWPF4
When PMR5 bit WKP4 is changed from 0 to 1 while pin WKP 4 is low
IWPF3
When PMR5 bit WKP3 is changed from 0 to 1 while pin WKP 3 is low
IWPF2
When PMR5 bit WKP2 is changed from 0 to 1 while pin WKP 2 is low
IWPF1
When PMR5 bit WKP1 is changed from 0 to 1 while pin WKP 1 is low
IWPF0
When PMR5 bit WKP0 is changed from 0 to 1 while pin WKP 0 is low
83
Figure 3.8 shows the procedure for setting a bit in a port mode register and clearing the interrupt
request flag.
When switching a pin function, mask the interrupt before setting the bit in the port mode register.
After accessing the port mode register, execute at least one instruction (e.g., NOP), then clear the
interrupt request flag from 1 to 0. If the instruction to clear the flag is executed immediately after
the port mode register access without executing an intervening instruction, the flag will not be
cleared.
An alternative method is to avoid the setting of interrupt request flags when pin functions are
switched by keeping the pins at the high level so that the conditions in table 3.5 do not occur.
CCR I bit ← 1
Interrupts masked. (Another possibility
is to disable the relevant interrupt in
interrupt enable register 1.)
Set port mode register bit
Execute NOP instruction
After setting the port mode register bit,
first execute at least one instruction
(e.g., NOP), then clear the interrupt
request flag to 0
Clear interrupt request flag to 0
CCR I bit ← 0
Interrupt mask cleared
Figure 3.8 Port Mode Register Setting and Interrupt Request Flag Clearing Procedure
84
Section 4 Clock Pulse Generators
4.1
Overview
Clock oscillator circuitry (CPG: clock pulse generator) is provided on-chip, including both a
system clock pulse generator and a subclock pulse generator. The system clock pulse generator
consists of a system clock oscillator and system clock dividers. The subclock pulse generator
consists of a subclock oscillator circuit and a subclock divider.
4.1.1
Block Diagram
Figure 4.1 shows a block diagram of the clock pulse generators.
OSC 1
OSC 2
System clock
oscillator
φ OSC
φ OSC /2
System clock
divider (1/2)
(fOSC )
System clock φ OSC /16
divider (1/8)
Prescaler S
(13 bits)
System clock pulse generator
X1
X2
Subclock
oscillator
φW
(f W )
φ
φ W /4
φ W /8
to
φ /8192
φW
φ W /2
Subclock
divider
(1/2, 1/4, 1/8)
φ /2
φ SUB
φ W /2
φ W /4
φ W /8
Subclock pulse generator
Prescaler W
(5 bits)
to
φ W /128
Figure 4.1 Block Diagram of Clock Pulse Generators
4.1.2
System Clock and Subclock
The basic clock signals that drive the CPU and on-chip peripheral modules are φ and φSUB. Four of
the clock signals have names: φ is the system clock, φSUB is the subclock, φOSC is the oscillator
clock, and φW is the watch clock.
The clock signals available for use by peripheral modules are φ/2, φ/4, φ/8, φ/16, φ/32, φ/64,
φ/128, φ/256, φ/512, φ/1024, φ/2048, φ/4096, φ/8192, φW, φW/2, φW/4, φW/8, φW/16, φW/32, φW/64,
and φW/128. The clock requirements differ from one module to another.
85
4.2
System Clock Generator
Clock pulse can be supplied to the system clock divider either by connecting a crystal or ceramic
oscillator, or by providing external clock input.
Connecting a Crystal Oscillator: Figure 4.2 shows a typical method of connecting a crystal
oscillator.
C1
OSC 1
Rf
R f = 1 MΩ ±20%
C1 = C 2 = 12 pF ±20%
OSC 2
C2
Figure 4.2 Typical Connection to Crystal Oscillator
Figure 4.3 shows the equivalent circuit of a crystal oscillator. An oscillator having the
characteristics given in table 4.1 should be used.
CS
LS
RS
OSC 1
OSC 2
C0
Figure 4.3 Equivalent Circuit of Crystal Oscillator
Table 4.1
Crystal Oscillator Parameters
Frequency (MHz)
2
4
8
10
Rs (max)
500 Ω
100 Ω
50 Ω
30 Ω
Co (max)
7 pF
7 pF
7 pF
7 pF
86
Connecting a Ceramic Oscillator: Figure 4.4 shows a typical method of connecting a ceramic
oscillator.
C1
OSC 1
Rf
OSC 2
C2
R f = 1 MΩ ±20%
C1 = 30 pF ±10%
C2 = 30 pF ±10%
Ceramic oscillator: Murata
Figure 4.4 Typical Connection to Ceramic Oscillator
Notes on Board Design: When generating clock pulses by connecting a crystal or ceramic
oscillator, pay careful attention to the following points.
Avoid running signal lines close to the oscillator circuit, since the oscillator may be adversely
affected by induction currents. (See figure 4.5.)
The board should be designed so that the oscillator and load capacitors are located as close as
possible to pins OSC1 and OSC2.
To be avoided
Signal A Signal B
C1
OSC 1
OSC 2
C2
Figure 4.5 Board Design of Oscillator Circuit
87
External Clock Input Method: Connect an external clock signal to pin OSC1, and leave pin
OSC2 open. Figure 4.6 shows a typical connection.
OSC 1
External clock input
OSC 2
Open
Figure 4.6 External Clock Input (Example)
Frequency
Oscillator Clock (φ OSC)
Duty cycle
45% to 55%
4.3
Subclock Generator
Connecting a 32.768-kHz Crystal Oscillator: Clock pulses can be supplied to the subclock
divider by connecting a 32.768-kHz crystal oscillator, as shown in figure 4.7. Following the same
connection precautions as mentioned in section 4.2.3, Notes on Board Design.
C1
X1
X2
C2
C1 = C 2 = 15 pF (typ.)
Figure 4.7 Typical Connection to 32.768-kHz Crystal Oscillator
88
Figure 4.8 shows the equivalent circuit of the 32.768-kHz crystal oscillator.
CS
LS
RS
X1
X2
C0
C0 = 1.5 pF typ
RS = 14 kΩ typ
f W = 32.768 kHz
Crystal oscillator: MX38T
(Nihon Denpa Kogyo)
Figure 4.8 Equivalent Circuit of 32.768-kHz Crystal Oscillator
2. Inputting an external clock (H8/3832S, H8/3833S, H8/3834S, H8/3835S, H8/3836S, H8/3837S
only)
(1) Circuit configuration
An external clock is input to the X1 pin. The X2 pin should be left open.
An example of the connection in this case is shown in figure 4.9.
External clock input
X1
X2
Open
Figure 4.9 Example of Connection when Inputting an External Clock
89
(2) External clock
Input a square waveform to the X1 pin. When using the CPU, timer A, timer C, timer G, or an
LCD, with a subclock (øw) clock selected, do not stop the clock supply to the X1 pin.
txH
VIH
VIL
txL
txr
txf
Figure 4.10 External Subclock Timing
The DC characteristics and timing of an external clock input to the X 1 pin are shown in table 4.2.
Table 4.2
DC Characteristics and Timing
(V CC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, V SS = AVSS = 0.0 V, T a = –20°C to + 75°C, unless
otherwise specified, including subactive mode)
Item
Applicable
Symbol Pin
Values
Min
Typ
Max
Unit Notes
Input high voltage
VIH
VCC –0.3 —
VCC +0.3 V
Input low voltage
VIL
–0.3
—
0.3
External subclock
rise time
txr
—
—
100
External subclock
fall time
txf
—
—
100
External subclock
fx
oscillation frequency
—
32.768
—
kHz
External subclock
high width
txH
12.0
—
—
µs
External subclock
low width
txL
12.0
—
—
µs
90
X1
Test
Conditions
ns
Figure 4.10
Figure 4.10
Figure 4.10
Pin Connection when Not Using Subclock: When the subclock is not used, connect pin X1 to
VCC and leave pin X2 open, as shown in figure 4.9.
VCC
X1
X2
Open
Figure 4.9 Pin Connection when Not Using Subclock
4.4
Prescalers
The H8/3834 Series is equipped with two on-chip prescalers having different input clocks
(prescaler S and prescaler W). Prescaler S is a 13-bit counter using the system clock (φ) as its
input clock. Its prescaled outputs provide internal clock signals for on-chip peripheral modules.
Prescaler W is a 5-bit counter using a 32.768-kHz signal divided by 4 (φW/4) as its input clock. Its
prescaled outputs are used by timer A as a time base for timekeeping.
Prescaler S (PSS): Prescaler S is a 13-bit counter using the system clock (φ) as its input clock. It
is incremented once per clock period.
Prescaler S is initialized to H'0000 by a reset, and starts counting on exit from the reset state.
In standby mode, watch mode, subactive mode, and subsleep mode, the system clock pulse
generator stops. Prescaler S also stops and is initialized to H'0000.
The CPU cannot read or write prescaler S.
The output from prescaler S is shared by timer A, timer B, timer C, timer F, timer G, SCI1, SCI2,
SCI3, the A/D converter, LCD controller, and 14-bit PWM. The divider ratio can be set separately
for each on-chip peripheral function.
In active (medium-speed) mode the clock input to prescaler S is φOSC/16.
Prescaler W (PSW): Prescaler W is a 5-bit counter using a 32.768 kHz signal divided by 4 (φW/4)
as its input clock.
Prescaler W is initialized to H'00 by a reset, and starts counting on exit from the reset state.
Even in standby mode, watch mode, subactive mode, or subsleep mode, prescaler W continues
functioning so long as clock signals are supplied to pins X1 and X2.
91
Prescaler W can be reset by setting 1s in bits TMA3 and TMA2 of timer mode register A (TMA).
Output from prescaler W can be used to drive timer A, in which case timer A functions as a time
base for timekeeping.
4.5
Note on Oscillators
Oscillator characteristics of both the masked ROM and ZTAT™ versions are closely related to
board design and should be carefully evaluated by the user, referring to the examples shown in this
section. Oscillator circuit constants will differ depending on the oscillator element, stray
capacitance in its interconnecting circuit, and other factors. Suitable constants should be
determined in consultation with the oscillator element manufacturer. Design the circuit so that the
oscillator element never receives voltages exceeding its maximum rating.
92
Section 5 Power-Down Modes
5.1
Overview
The H8/3834 Series has seven modes of operation after a reset. These include six power-down
modes, in which power dissipation is significantly reduced.
Table 5.1 gives a summary of the seven operation modes.
Table 5.1
Operation Modes
Operating Mode
Description
Active (high-speed) mode
The CPU runs on the system clock, executing program
instructions at high speed
Active (medium-speed) mode
The CPU runs on the system clock, executing program
instructions at reduced speed
Subactive mode
The CPU runs on the subclock, executing program instructions
at reduced speed
Sleep mode
The CPU halts. On-chip peripheral modules continue to
operate on the system clock.
Subsleep mode
The CPU halts. Timer A, timer C, timer G, and the LCD
controller/driver continue to operate on the subclock.
Watch mode
The CPU halts. The time-base function of timer A and the LCD
controller/driver continue to operate on the subclock.
Standby mode
The CPU and all on-chip peripheral modules stop operating
All the above operating modes except active (high-speed) mode are referred to as power-down
modes.
In this section the two active modes (high-speed and medium-speed) are referred to collectively as
active mode.
Figure 5.1 shows the transitions among these operation modes. Table 5.2 indicates the internal
states in each mode.
93
Program execution state
Program halt state
Reset state
LSON = 0, MSON = 0
Program halt state
ct
io
n
tru
*4
*1
SSBY = 0,
LSON = 0
ct
io
n
*3
st
ru
ct
LSON = 0,
MSON = 1
io
n
=
1
on
TO
cti
D
u
str
in
P
Watch mode
Sleep mode
Active
(medium-speed)
mode
*1
N
1
*3
*4
SSBY = 1,
TMA3 = 1
TO
D
=
tru
in
N
in
s
P
SL
EE
P
EE
SL
EE
P
SL
Standby mode
ct
io
n
in
s
tru
SSBY = 1,
TMA3 = 0,
LSON = 0
SL
EE
P
in
s
P ion
EE uct
SL str
in
Active (high-speed)
mode
E
LE
N
S
=
1
TO
D
*1
SL
LSON = 1,
TMA3 = 1
EE
P
in
st
ru
ct
io
n
SSBY = 0,
LSON = 1,
TMA3 = 1
SLEEP
instruction
Subactive mode
Subsleep mode
*2
: Transition caused by exception handling
Power-down mode
A transition between different modes cannot be made to occur simply because an interrupt request is
generated. Make sure that the interrupt is accepted and interrupt handling is performed.
Details on the mode transition conditions are given in the explanations of each mode, in sections 5.2
through 5.8.
Notes: 1. Timer A interrupt, IRQ 0 interrupt, WKP 0 to WKP 7 interrupts
2. Timer A interrupt, timer C interrupt, timer G interrupt, IRQ 0 to IRQ 4 interrupts,
WKP0 to WKP7 interrupts
3. All interrupts
4. IRQ 0 interrupt, IRQ 1 interrupt, WKP0 to WKP7 interrupts
Figure 5.1 Operation Mode Transition Diagram
94
Table 5.2
Internal State in Each Operation Mode
Active Mode
High
Speed
Medium
Speed
Sleep
Mode
Watch
Mode
Subactive Subsleep
Mode
Mode
Standby
Mode
System clock oscillator Functions
Functions
Functions
Halted
Halted
Halted
Halted
Subclock oscillator
Functions
Functions
Functions
Functions
Functions
Functions
Functions
Instructions Functions
Functions
Halted
Halted
Functions
Halted
Halted
Retained
Retained
Retained
Retained
Function
CPU
operation
RAM
Registers
Retained*1
I/O
External
interrupts
IRQ0
Functions
Functions
Functions
Functions
Functions
Functions
Functions
Retained*6
IRQ1
Retained*6
IRQ2
IRQ3
IRQ4
WKP0
Functions
Functions
Functions
Functions
Functions
Functions
Functions
Functions
Functions
Functions
Functions*5 Functions*5 Functions*5 Retained
WKP1
WKP2
WKP3
WKP4
WKP5
WKP6
WKP7
Peripheral Timer A
module
Timer B
functions
Timer C
Retained
Retained
Retained
Functions/ Functions/
Retained*2 Retained*2
Timer F
Retained
Timer G
Functions/ Functions/
Retained*3 Retained*3
SCI1
Functions
Functions
Functions
Retained
Retained
Retained
Retained
Retained
Reset
Reset
Reset
Reset
SCI2
SCI3
Notes:
1.
2.
3.
4.
5.
6.
PWM
Functions
Functions
Retained
Retained
Retained
Retained
Retained
A/D
Functions
Functions
Functions
Retained
Retained
Retained
Retained
LCD
Functions
Functions
Functions
Functions/ Functions/ Functions/ Retained
Retained*4 Retained*4 Retained*4
Register contents held; high-impedance output.
Functions only if external clock or φW/4 internal clock is selected; otherwise halted and retained.
Functions only if φW/2 internal clock is selected; otherwise halted and retained.
Functions only if φW or φW/2 internal clock is selected; otherwise halted and retained.
Functions when timekeeping time-base function is selected.
External interrupt requests are ignored. The interrupt request register contents are not affected.
95
5.1.1
System Control Registers
The operation mode is selected using the system control registers described in table 5.3.
Table 5.3
System Control Register
Name
Abbreviation
R/W
Initial Value
Address
System control register 1
SYSCR1
R/W
H'07
H'FFF0
System control register 2
SYSCR2
R/W
H'E0
H'FFF1
System Control Register 1 (SYSCR1)
Bit
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
LSON
—
—
—
Initial value
0
0
0
0
0
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
—
—
—
SYSCR1 is an 8-bit read/write register for control of the power-down modes.
Bit 7—Software Standby (SSBY): This bit designates transition to standby mode or watch mode.
Bit 7: SSBY
Description
0
•
•
1
•
•
When a SLEEP instruction is executed in active mode, a transition is made
to sleep mode
(initial value)
When a SLEEP instruction is executed in subactive mode, a transition is
made to subsleep mode.
When a SLEEP instruction is executed in active mode, a transition is made
to standby mode or watch mode.
When a SLEEP instruction is executed in subactive mode, a transition is
made to watch mode.
Bits 6 to 4—Standby Timer Select 2 to 0 (STS2 to STS0): These bits designate the time the
CPU and peripheral modules wait for stable clock operation after exiting from standby mode or
watch mode to active mode due to an interrupt. The designation should be made according to the
clock frequency so that the waiting time is at least 10 ms.
96
Bit 6: STS2
Bit 5: STS1
Bit 4: STS0
Description
0
0
0
Wait time = 8,192 states
1
Wait time = 16,384 states
0
Wait time = 32,768 states
1
Wait time = 65,536 states
*
Wait time = 131,072 states
1
1
*
(initial value)
Note: * Don’t care
Bit 3—Low Speed on Flag (LSON): This bit chooses the system clock (φ) or subclock (φSUB) as
the CPU operating clock when watch mode is cleared. The resulting operation mode depends on
the combination of other control bits and interrupt input.
Bit 3: LSON
Description
0
The CPU operates on the system clock ( φ )
1
The CPU operates on the subclock (φSUB)
(initial value)
Bits 2 to 0—Reserved Bits: These bits are reserved; they are always read as 1, and cannot be
modified.
System Control Register 2 (SYSCR2)
Bit
7
6
5
4
3
2
1
0
—
—
—
NESEL
DTON
MSON
SA1
SA0
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
SYSCR2 is an 8-bit read/write register for power-down mode control.
Bits 7 to 5—Reserved Bits: These bits are reserved; they are always read as 1, and cannot be
modified.
Bit 4—Noise Elimination Sampling Frequency Select (NESEL): This bit selects the frequency
at which the watch clock signal ( φW) generated by the subclock pulse generator is sampled, in
relation to the oscillator clock (φOSC) generated by the system clock pulse generator. When φOSC =
2 to 10 MHz, clear NESEL to 0.
Bit 4: NESEL
Description
0
Sampling rate is φ OSC/16
1
Sampling rate is φ OSC/4
(initial value)
97
Bit 3—Direct Transfer on Flag (DTON): This bit designates whether or not to make direct
transitions among active (high-speed), active (medium-speed) and subactive mode when a SLEEP
instruction is executed. The mode to which the transition is made after the SLEEP instruction is
executed depends on a combination of this and other control bits.
Bit 3: DTON
Description
0
When a SLEEP instruction is executed in active mode, a transition is made to
standby mode, watch mode, or sleep mode.
(initial value)
When a SLEEP instruction is executed in subactive mode, a transition is made
to watch mode or subsleep mode.
1
When a SLEEP instruction is executed in active (high-speed) mode, a direct
transition is made to active (medium-speed) mode if SSBY = 0, MSON = 1, and
LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1, and LSON = 1.
When a SLEEP instruction is executed in active (medium-speed) mode, a
direct transition is made to active (high-speed) mode if SSBY = 0, MSON = 0,
and LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1, and LSON = 1.
When a SLEEP instruction is executed in subactive mode, a direct transition is
made to active (high-speed) mode if SSBY = 1, TMA3 = 1, LSON = 0, and
MSON = 0, or to active (medium-speed) mode if SSBY = 1, TMA3 = 1, LSON =
0, and MSON = 1.
Bit 2—Medium Speed on Flag (MSON): After standby, watch, or sleep mode is cleared, this bit
selects active (high-speed) or active (medium-speed) mode.
Bit 2: MSON
Description
0
Operation is in active (high-speed) mode
1
Operation is in active (medium-speed) mode
(initial value)
Bits 1 and 0—Subactive Mode Clock Select (SA1 and SA0): These bits select the CPU clock
rate (φW/2, φW/4, or φW/8) in subactive mode. SA1 and SA0 cannot be modified in subactive mode.
Bit 1: SA1
Bit 0: SA0
Description
0
0
φ W /8
1
φ W /4
*
φ W /2
1
Note: * Don’t care
98
(initial value)
5.2
Sleep Mode
5.2.1
Transition to Sleep Mode
The system goes from active mode to sleep mode when a SLEEP instruction is executed while the
SSBY and LSON bits in system control register 1 (SYSCR1) are cleared to 0. In sleep mode CPU
operation is halted but the on-chip peripheral functions other than PWM are operational. The CPU
register contents are retained.
5.2.2
Clearing Sleep Mode
Sleep mode is cleared by an interrupt (timer A, timer B, timer C, timer F, timer G, IRQ0 to IRQ4,
WKP0 to WKP7, SCI1, SCI2, SCI3, A/D converter) or by input at the RES pin.
Clearing by Interrupt: When an interrupt is requested, sleep mode is cleared and interrupt
exception handling starts. Operation resumes in active (high-speed) mode if MSON = 0 in
SYSCR2, or active (medium-speed) mode if MSON = 1. Sleep mode is not cleared if the I bit of
the condition code register (CCR) is set to 1 or the particular interrupt is disabled in the interrupt
enable register.
Clearing by RES Input: When the RES pin goes low, the CPU goes into the reset state and sleep
mode is cleared.
5.3
Standby Mode
5.3.1
Transition to Standby Mode
The system goes from active mode to standby mode when a SLEEP instruction is executed while
the SSBY bit in SYSCR1 is set to 1, the LSON bit is cleared to 0, and bit TMA3 in timer
register A (TMA) is cleared to 0. In standby mode the clock pulse generator stops, so the CPU and
on-chip peripheral modules stop functioning. As long as a minimum required voltage is applied,
the contents of CPU registers and some on-chip peripheral registers, and data in the on-chip RAM,
are retained. Data in the on-chip RAM will be retained as long as the specified RAM data
retention voltage is supplied. The I/O ports go to the high-impedance state.
99
5.3.2
Clearing Standby Mode
Standby mode is cleared by an interrupt (IRQ0, IRQ1, WKP0 to WKP7) or by input at the RES pin.
Clearing by Interrupt: When an interrupt is requested, the system clock pulse generator starts.
After the time set in bits STS2–STS0 in SYSCR1 has elapsed, a stable system clock signal is
supplied to the entire chip, standby mode is cleared, and interrupt exception handling starts.
Operation resumes in active (high-speed) mode if MSON = 0 in SYSCR2, or active (mediumspeed) mode if MSON = 1. Standby mode is not cleared if the I bit of CCR is set to 1 or the
particular interrupt is disabled in the interrupt enable register.
Clearing by RES Input: When the RES pin goes low, the system clock pulse generator starts.
After the pulse generator output has stabilized, if the RES pin is driven high, the CPU starts reset
exception handling.
Since system clock signals are supplied to the entire chip as soon as the system clock pulse
generator starts functioning, the RES pin should be kept at the low level until the pulse generator
output stabilizes.
5.3.3
Oscillator Settling Time after Standby Mode is Cleared
Bits STS2 to STS0 in SYSCR1 should be set as follows.
• When a Crystal Oscillator is Used
The table below gives settings for various operating frequencies. Set bits STS2 to STS0 for a
waiting time of at least 10 ms.
Table 5.3
Clock Frequency and Settling Time (Times are in ms)
STS2
STS1
STS0
Waiting Time
5 MHz
4 MHz
2 MHz
1 MHz
0.5 MHz
0
0
0
8,192 states
1.6
2.0
4.1
8.2
16.4
1
16,384 states
3.2
4.1
8.2
16.4
32.8
0
32,768 states
6.6
8.2
16.4
32.8
65.5
1
65,536 states
13.1
16.4
32.8
65.5
131.1
*
131,072 states
26.2
32.8
65.5
131.1
262.1
1
1
*
Note: * Don’t care
• When an External Clock is Used
Any values may be set. Normally the minimum time (STS2 = STS1 = STS0 = 0) should be set.
100
5.3.4
Transition to Standby Mode and Port Pin States
The system goes from active (high-speed or medium-speed) mode to standby mode when a
SLEEP instruction is executed while the SSBY bit in SYSCR1 is set to 1, the LSON bit is cleared
to 0, and bit TMA3 in TMA is cleared to 0. Port pins (except those with their MOS pull-up turned
on) enter high-impedance state when the transition to standby mode is made. This timing is shown
in figure 5.2.
φ
Internal
data bus
SLEEP instruction fetch
Next instruction fetch
SLEEP instruction
execution
Output
Port pins
Active (high-speed or medium-speed) mode
Internal
processing
High-impedance
Standby mode
Figure 5.2 Transition to Standby Mode and Port Pin States
5.4
Watch Mode
5.4.1
Transition to Watch Mode
The system goes from active or subactive mode to watch mode when a SLEEP instruction is
executed while the SSBY bit in SYSCR1 is set to 1 and bit TMA3 in TMA is set to 1.
In watch mode, operation of on-chip peripheral modules other than timer A and the LCD
controller is halted. The LCD controller can be selected to operate or to halt. As long as a
minimum required voltage is applied, the contents of CPU registers and some registers of the onchip peripheral modules, and the on-chip RAM contents, are retained. I/O ports keep the same
states as before the transition.
101
5.4.2
Clearing Watch Mode
Watch mode is cleared by an interrupt (timer A, IRQ 0, WKP0 to WKP7) or by a input at the RES
pin.
Clearing by Interrupt: Watch mode is cleared when an interrupt is requested. The mode to which
a transition is made depends on the settings of LSON in SYSCR1 and MSON in SYSCR2. If both
LSON and MSON are cleared to 0, transition is to active (high-speed) mode; if LSON = 0 and
MSON = 1, transition is to active (medium-speed) mode; if LSON = 1, transition is to subactive
mode. When the transition is to active mode, after the time set in SYSCR1 bits STS2–STS0 has
elapsed, a stable clock signal is supplied to the entire chip, and interrupt exception handling starts.
Watch mode is not cleared if the I bit of CCR is set to 1 or the particular interrupt is disabled in the
interrupt enable register.
Clearing by RES Input: Clearing by RES pin is the same as for standby mode; see 5.3.2,
Clearing Standby Mode.
5.4.3
Oscillator Settling Time after Watch Mode is Cleared
The waiting time is the same as for standby mode; see 5.3.3, Oscillator Settling Time after
Standby Mode is Cleared.
5.5
Subsleep Mode
5.5.1
Transition to Subsleep Mode
The system goes from subactive mode to subsleep mode when a SLEEP instruction is executed
while the SSBY bit in SYSCR1 is cleared to 0, LSON bit in SYSCR1 is set to 1, and TMA3 bit in
TMA is set to 1.
In subsleep mode, operation of on-chip peripheral modules other than timer A, timer C, timer G,
and the LCD controller is halted. As long as a minimum required voltage is applied, the contents
of CPU registers and some registers of the on-chip peripheral modules, and the on-chip RAM
contents, are retained. I/O ports keep the same states as before the transition.
102
5.5.2
Clearing Subsleep Mode
Subsleep mode is cleared by an interrupt (timer A, timer C, timer G, IRQ0 to IRQ4, WKP0 to
WKP7) or by a low input at the RES pin.
Clearing by Interrupt: When an interrupt is requested, subsleep mode is cleared and interrupt
exception handling starts. Subsleep mode is not cleared if the I bit of CCR is set to 1 or the
particular interrupt is disabled in the interrupt enable register.
Clearing by RES Input: Clearing by RES pin is the same as for standby mode; see 5.3.2,
Clearing Standby Mode.
5.6
Subactive Mode
5.6.1
Transition to Subactive Mode
Subactive mode is entered from watch mode if a timer A, IRQ0, or WKP0 to WKP7 interrupt is
requested while the LSON bit in SYSCR1 is set to 1. From subsleep mode, subactive mode is
entered if a timer A, timer C, timer G, IRQ 0 to IRQ4, or WKP0 to WKP7 interrupt is requested.
A transition to subactive mode does not take place if the I bit of CCR is set to 1 or the particular
interrupt is disabled in the interrupt enable register.
5.6.2
Clearing Subactive Mode
Subactive mode is cleared by a SLEEP instruction or by a input at the RES pin.
Clearing by SLEEP Instruction: If a SLEEP instruction is executed while the SSBY bit in
SYSCR1 is set to 1 and TMA3 bit in TMA is set to 1, subactive mode is cleared and watch mode
is entered. If a SLEEP instruction is executed while SSBY = 0 and LSON = 1 in SYSCR1 and
TMA3 = 1 in TMA, subsleep mode is entered. Direct transfer to active mode is also possible; see
5.8, Direct Transfer, below.
Clearing by RES Pin: Clearing by RES pin is the same as for standby mode; see Clearing by
RES pin in section 5.3.2, Clearing Standby Mode.
5.6.3
Operating Frequency in Subactive Mode
The operating frequency in subactive mode is set in bits SA1 and SA0 in SYSCR2. The choices
are φW/2, φW/4, and φW/8.
103
5.7
Active (medium-speed) Mode
5.7.1
Transition to Active (medium-speed) Mode
If the MSON bit in SYSCR2 is set to 1 while the LSON bit in SYSCR1 is cleared to 0, a transition
to active (medium-speed) mode results from IRQ0, IRQ1, or WKP0 to WKP7 interrupts in standby
mode, timer A, IRQ0, or WKP0 to WKP7 interrupts in watch mode, or any interrupt in sleep mode.
A transition to active (medium-speed) mode does not take place if the I bit of CCR is set to 1 or
the particular interrupt is disabled in the interrupt enable register.
5.7.2
Clearing Active (medium-speed) Mode
Active (medium-speed) mode is cleared by a SLEEP instruction or by a input at the RES pin.
Clearing by SLEEP Instruction: A transition to standby mode takes place if a SLEEP
instruction is executed while the SSBY bit in SYSCR1 is set to 1, the LSON bit in SYSCR1 is
cleared to 0, and TMA3 bit in TMA is cleared to 0. The system goes to watch mode if the SSBY
bit in SYSCR1 is set to 1 and TMA3 bit in TMA is set to 1 when a SLEEP instruction is executed.
Sleep mode is entered if both SSBY and LSON are cleared to 0 when a SLEEP instruction is
executed. Direct transfer to active (high-speed) mode or to subactive mode is also possible. See
5.8, Direct Transfer, below for details.
Clearing by RES Pin: When the RES pin goes low, the CPU enters the reset state and active
(medium-speed) mode is cleared.
5.7.3
Operating Frequency in Active (medium-speed) Mode
In active (medium-speed) mode, the CPU is clocked at 1/8 the frequency in active (high-speed)
mode.
5.8
Direct Transfer
5.8.1
Direct Transfer Overview
The CPU can execute programs in three modes: active (high-speed) mode, active (medium-speed)
mode, and subactive mode. A direct transfer is a transition among these three modes without the
stopping of program execution. A direct transfer can be made by executing a SLEEP instruction
while the DTON bit in SYSCR2 is set to 1. After the mode transition, direct transfer interrupt
exception handling starts.
104
If the direct transfer interrupt is disabled in interrupt enable register 2 (IENR2), a transition is
made instead to sleep mode or watch mode. Note that if a direct transition is attempted while the I
bit in CCR is set to 1, sleep mode or watch mode will be entered, and it will be impossible to clear
the resulting mode by means of an interrupt.
Direct Transfer from Active (High-Speed) Mode to Active (Medium-Speed) Mode: When a
SLEEP instruction is executed in active (high-speed) mode while the SSBY and LSON bits in
SYSCR1 are cleared to 0, the MSON bit in SYSCR2 is set to 1, and the DTON bit in SYSCR2 is
set to 1, a transition is made to active (medium-speed) mode via sleep mode.
Direct Transfer from Active (Medium-Speed) Mode to Active (High-Speed) Mode: When a
SLEEP instruction is executed in active (medium-speed) mode while the SSBY and LSON bits in
SYSCR1 are cleared to 0, the MSON bit in SYSCR2 is cleared to 0, and the DTON bit in
SYSCR2 is set to 1, a transition is made to active (high-speed) mode via sleep mode.
Direct Transfer from Active (High-Speed) Mode to Subactive Mode: When a SLEEP
instruction is executed in active (high-speed) mode while the SSBY and LSON bits in SYSCR1
are set to 1, the DTON bit in SYSCR2 is set to 1, and TMA3 bit in TMA is set
to 1, a transition is made to subactive mode via watch mode.
Direct Transfer from Subactive Mode to Active (High-Speed) Mode: When a SLEEP
instruction is executed in subactive mode while the SSBY bit in SYSCR1 is set to 1, the LSON bit
in SYSCR1 is cleared to 0, the MSON bit in SYSCR2 is cleared to 0, the DTON bit in SYSCR2 is
set to 1, and TMA3 bit in TMA is set to 1, a transition is made directly to active (high-speed)
mode via watch mode after the waiting time set in SYSCR1 bits STS2 to STS0 has elapsed.
Direct Transfer from Active (Medium-Speed) Mode to Subactive Mode: When a SLEEP
instruction is executed in active (medium-speed) while the SSBY and LSON bits in SYSCR1 are
set to 1, the DTON bit in SYSCR2 is set to 1, and TMA3 bit in TMA is set to 1, a transition is
made to subactive mode via watch mode.
Direct Transfer from Subactive Mode to Active (Medium-Speed) Mode: When a SLEEP
instruction is executed in subactive mode while the SSBY bit in SYSCR1 is set
to 1, the LSON bit in SYSCR1 is cleared to 0, the MSON bit in SYSCR2 is set to 1, the DTON bit
in SYSCR2 is set to 1, and TMA3 bit in TMA is set to 1, a transition is made directly to active
(medium-speed) mode via watch mode after the waiting time set in SYSCR1 bits STS2 to STS0
has elapsed.
105
5.8.2
Calculation of Direct Transfer Time before Transition
Time Required before Direct Transfer from Active (High-speed) Mode to Active (MediumSpeed) Mode: A direct transfer is made from active (high-speed) mode to active (medium-speed)
mode when a SLEEP instruction is executed in active (high-speed) mode while the SSBY and
LSON bits in SYSCR1 are cleared to 0, the MSON bit in SYSCR2 is set to 1, and the DTON bit in
SYSCR2 is set to 1. A direct transfer time, that is, the time from SLEEP instruction execution to
interrupt exception handling completion is calculated by expression (1) below.
Direct transfer time = (number of states for SLEEP instruction execution + number of
states for internal processing) × tcyc before transition + number of
states for interrupt exception handling execution × tcyc after
transition
...... (1)
Example: Direct transfer time for the H8/3834 Series
= (2 + 1) × 2tosc + 14 × 16tosc = 230 tosc
Notation:
tosc: OSC clock cycle time
tcyc: System clock (φ) cycle time
Time Required before Direct Transfer from Active (Medium-Speed) Mode to Active (HighSpeed) Mode: A direct transfer is made from active (medium-speed) mode to active (high-speed)
mode when a SLEEP instruction is executed in active (medium-speed) mode while the SSBY and
LSON bits in SYSCR1 are cleared to 0, the MSON bit in SYSCR2 is cleared to 0, and the DTON
bit in SYSCR2 is set to 1. A direct transfer time, that is, the time from SLEEP instruction
execution to interrupt exception handling completion is calculated by expression (2) below.
Direct transfer time = (number of states for SLEEP instruction execution + number of
states for internal processing) × tcyc before transition + number of
states for interrupt exception handling execution × tcyc after
transition
...... (2)
Example: Direct transfer time for the H8/3834 Series
= (2 + 1) × 16tosc + 14 × 2tosc = 76 tosc
Notation:
tosc: OSC clock cycle time
tcyc: System clock (φ) cycle time
Time Required before Direct Transfer from Subactive Mode to Active (High-Speed) Mode:
A direct transfer is made from subactive mode to active (high-speed) mode when a SLEEP
instruction is executed in subactive mode while the SSBY bit in SYSCR1 is set to 1, the LSON bit
in SYSCR1 is cleared to 0, the MSON bit in SYSCR2 is cleared to 0, the DTON bit in SYSCR2 is
set to 1, and the TMA3 bit in TMA is set to 1. A direct transfer time, that is, the time from SLEEP
106
instruction execution to interrupt exception handling completion is calculated by expression (3)
below.
Direct transfer time = (number of states for SLEEP instruction execution + number of
states for internal processing) × tsubcyc before transition + (wait
time designated by STS2 to STS0 bits in SCR + number of states
for interrupt exception handling execution) × tcyc after transition
...... (3)
Example: Direct transfer time for the H8/3834 Series
(when CPU clock frequency is φ w/8 and wait time is 8192 states)
= (2 + 1) × 8tw + (8192 + 14) × 2tosc = 24tw + 16412tosc
Notation:
tosc:
OSC clock cycle time
tw:
Watch clock cycle time
tcyc:
System clock (φ) cycle time
tsubcyc: Subclock (φ SUB) cycle time
Time Required before Direct Transfer from Subactive Mode to Active (Medium-Speed)
Mode: A direct transfer is made from subactive mode to active (medium-speed) mode when a
SLEEP instruction is executed in subactive mode while the SSBY bit in SYSCR1 is set to 1, the
LSON bit in SYSCR1 is cleared to 0, the MSON and DTON bits in SYSCR2 are set to 1, and the
TMA3 bit in TMA is set to 1. A direct transfer time, that is, the time from SLEEP instruction
execution to interrupt exception handling completion is calculated by expression (4) below.
Direct transfer time = (number of states for SLEEP instruction execution + number of
states for internal processing) × tsubcyc before transition (wait time
designated by STS2 to STS0 bits in SCR + number of states for
interrupt exception handling execution) × tcyc after transition
...... (4)
Example: Direct transfer time for the H8/3834 Series
(when CPU clock frequency is φ w/8 and wait time is 8192 states)
= (2 + 1) × 8tw + (8192 + 14) × 16tosc = 24tw + 131296tosc
Notation:
tosc:
OSC clock cycle time
tw:
Watch clock cycle time
tcyc:
System clock (φ ) cycle time
tsubcyc: Subclock (φ SUB) cycle time
107
108
Section 6 ROM
6.1
Overview
The H8/3832 has 16 kbytes of on-chip ROM, while the H8/3833 has 24 kbytes, the H8/3834 has
32 kbytes, the H8/3835 has 40 kbytes, the H8/3836 has 48 kbytes, and the H8/3837 has 60 kbytes.
The ROM is connected to the CPU by a 16-bit data bus, allowing high-speed 2-state access for
both byte data and word data. The ZTAT™ versions of the H8/3834 and H8/3837 each have 32
kbytes and 60 kbytes of PROM.
With regard to ZTAT versions of the H8/3832S, H8/3833S, H8/3834S, H8/3835S, H8/3836S, and
H8/3837S, the ZTAT versions of the H8/3834 and H8/3837 should be used.
6.1.1
Block Diagram
Figure 6.1 shows a block diagram of the on-chip ROM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'0000
H'0000
H'0001
H'0002
H'0002
H'0003
On-chip ROM
H'7FFE
H'7FFE
H'7FFF
Even-numbered
address
Odd-numbered
address
Figure 6.1 ROM Block Diagram (H8/3834)
109
6.2
H8/3834 PROM Mode
6.2.1
Setting to PROM Mode
If the on-chip ROM is PROM, setting the chip to PROM mode stops operation as a
microcontroller and allows the PROM to be programmed in the same way as the standard
HN27C256. Table 6.1 shows how to set the chip to PROM mode.
Table 6.1
Setting to PROM Mode
Pin Name
Setting
TEST
High level
PB4/AN4
Low level
PB5/AN5
PB6/AN6
6.2.2
High level
Socket Adapter Pin Arrangement and Memory Map
A standard PROM programmer can be used to program the PROM. A socket adapter is required
for conversion to 28 pins, as listed in table 6.2.
Figure 6.2 shows the pin-to-pin wiring of the socket adapter. Figure 6.3 shows a memory map.
Table 6.2
Socket Adapter
Package
Socket Adapter
100-pin (FP-100B)
HS3834ESH01H
100-pin (FP-100A)
HS3834ESF01H
100-pin (TFP-100B)
HS3834ESN01H
110
EPROM socket
H8/3834
FP-100A
12
47
48
49
50
51
52
53
54
70
69
68
67
66
65
64
63
55
91
57
58
59
60
61
62
56
34, 79
92
6
8
99
13
81
82
83
9, 30
5
97
98
84
85
86
FP-100B
9
44
45
46
47
48
49
50
51
67
66
65
64
63
62
61
60
52
88
54
55
56
57
58
59
53
31, 76
89
3
5
96
10
78
79
80
6, 27
2
94
95
81
82
83
Pin
RES
P60
P61
P62
P63
P64
P65
P66
P67
P87
P86
P85
P84
P83
P82
P81
P80
P70
P43
P72
P73
P74
P75
P76
P77
P71
VCC
AV CC
TEST
X1
PB6
MD0
P11
P12
P13
VSS
AV SS
PB4
PB5
P14
P15
P16
Pin
VPP
EO0
EO1
EO2
EO3
EO4
EO5
EO6
EO7
EA0
EA1
EA2
EA3
EA4
EA5
EA6
EA7
EA8
EA9
EA10
EA11
EA12
EA13
EA14
CE
OE
VCC
HN27C256
1
11
12
13
15
16
17
18
19
10
9
8
7
6
5
4
3
25
24
21
23
2
26
27
20
22
28
VSS
14
Note: Pins not indicated in the figure should be left open.
Figure 6.2 Socket Adapter Pin Correspondence (with HN27C256)
111
Address in MCU mode
Address in PROM mode
H'0000
H'0000
On-chip PROM
H'7FFF
H'7FFF
Figure 6.3 H8/3834 Memory Map in PROM Mode
Note: When programming with a PROM programmer, be sure to specify addresses from H'0000
to H'7FFF.
112
6.3
H8/3834 Programming
The write, verify, and other modes are selected as shown in table 6.3 in H8/3834 PROM mode.
Table 6.3
Mode Selection in H8/3834 PROM Mode
Pin
Mode
CE
OE
VPP
VCC
EO7 to EO0
EA 14 to EA0
Write
L
H
VPP
VCC
Data input
Address input
Verify
H
L
VPP
VCC
Data output
Address input
Programming disabled
H
H
VPP
VCC
High impedance
Address input
Notation:
L: Low level
H: High level
VPP : VPP level
VCC: VCC level
The specifications for writing and reading the on-chip PROM are identical to those for the
standard HN27C256 EPROM.
6.3.1
Writing and Verifying
An efficient, high-performance programming method is available for writing and verifying the
PROM data. This method achieves high speed without voltage stress on the device and without
lowering the reliability of written data. H'FF data is written in unused address areas.
The basic flow of this high-performance programming method is shown in figure 6.4. Table 6.4
and table 6.5 give the electrical characteristics in programming mode. Figure 6.5 shows a
write/verify timing diagram.
113
Start
Set write/verify mode
VCC = 6.0 V ± 0.25 V, V PP = 12.5 V ± 0.3 V
Address = 0
n=0
n + 1→ n
Yes
No
Write time t PW = 1 ms ± 5%
n < 25
No Go
Address + 1 → address
Verify
Go
Write time t OPW = 3n ms
Last address?
No
Yes
Set read mode
VCC = 5.0 V ± 0.5 V, V PP = V CC
Error
No
All
addresses read?
Yes
End
Figure 6.4 High-Performance Programming Flowchart
114
Table 6.4
DC Characteristics
(Conditions: VCC = 6.0 V ±0.25 V, VPP = 12.5 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C)
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
Input highlevel voltage
EO7 to EO 0, EA14 to EA 0, VIH
OE, CE
2.4
—
VCC + 0.3
V
Input lowlevel voltage
EO7 to EO 0, EA14 to EA 0, VIL
OE, CE
–0.3
—
0.8
V
Output highlevel voltage
EO7 to EO 0
VOH
2.4
—
—
V
I OH = –200 µA
Output lowlevel voltage
EO7 to EO 0
VOL
—
—
0.45
V
I OL = 0.8 mA
Input leakage EO7 to EO 0, EA14 to EA 0, |ILI|
current
OE, CE
—
—
2
µA
VIN = 5.25 V/
0.5 V
VCC current
I CC
—
—
40
mA
VPP current
I PP
—
—
40
mA
115
Table 6.5
AC Characteristics
(Conditions: VCC = 6.0 V ±0.25 V, VPP = 12.5 V ±0.3 V, Ta = 25°C ±5°C)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Address setup time
t AS
2
—
—
µs
Figure 6.5* 1
OE setup time
t OES
2
—
—
µs
Data setup time
t DS
2
—
—
µs
Address hold time
t AH
0
—
—
µs
Data hold time
t DH
2
—
—
µs
0
—
130
ns
2
—
—
µs
0.95
1.0
1.05
ms
2.85
—
78.7
ms
Data output disable time
t DF *
VPP setup time
t VPS
Programming pulse width
t PW
2
3
CE pulse width for overwrite
programming
t OPW*
VCC setup time
t VCS
2
—
—
µs
Data output delay time
t OE
0
—
500
ns
Notes: 1. Input pulse level: 0.8 V to 2.2 V
Input rise time/fall time ≤ 20 ns
Timing reference levels: Input: 1.0 V, 2.0 V
Output: 0.8 V, 2.0 V
2. t DF is defined at the point at which the output is floating and the output level cannot be
read.
3. t OPW is defined by the value given in figure 6.4 high-performance programming flow
chart.
116
Write
Verify
Address
tAH
tAS
Input data
Data
tDS
VPP
VCC
VPP
VCC
Output data
tDH
tDF
tVPS
VCC +1
VCC
tVCS
CE
tPW
OE
tOES
tOE
tOPW*
Note: * tOPW is defined by the value given in figure 6-4 high-performance programming flow chart.
Figure 6.5 PROM Write/Verify Timing
6.3.2
Programming Precautions
• Use the specified programming voltage and timing.
The programming voltage in PROM mode (VPP) is 12.5 V. Use of a higher voltage can
permanently damage the chip. Be especially careful with respect to PROM programmer
overshoot.
Setting the PROM programmer to Hitachi specifications for the HN27C256 will result in a
correct VPP of 12.5 V.
• Make sure the index marks on the PROM programmer socket, socket adapter, and chip are
properly aligned. If they are not, the chip may be destroyed by excessive current flow. Before
programming, be sure that the chip is properly mounted in the PROM programmer.
• Avoid touching the socket adapter or chip during programming, since this may cause contact
faults and write errors.
117
6.4
H8/3837 PROM Mode
6.4.1
Setting to PROM Mode
If the on-chip ROM is PROM, setting the chip to PROM mode stops operation as a
microcontroller and allows the PROM to be programmed in the same way as the standard
HN27C101 EPROM. However, page programming is not supported. Table 6.6 shows how to set
the chip to PROM mode.
Table 6.6
Setting to PROM Mode
Pin Name
Setting
TEST
High level
PB4/AN4
Low level
PB5/AN5
PB6/AN6
6.4.2
High level
Socket Adapter Pin Arrangement and Memory Map
A standard PROM programmer can be used to program the PROM. A socket adapter is required
for conversion to 32 pins, as listed in table 6.7.
Figure 6.6 shows the pin-to-pin wiring of the socket adapter. Figure 6.7 shows a memory map.
Table 6.7
Socket Adapter
Package
Socket Adapter
100-pin (FP-100B)
HS3836ESH01H
100-pin (FP-100A)
HS3836ESF01H
100-pin (TFP-100B)
HS3836ESN01H
118
H8/3837
FP-100A
12
47
48
49
50
51
52
53
54
70
69
68
67
66
65
64
63
55
91
57
58
59
60
61
84
85
62
56
83
34, 79
92
6
8
99
13
81
82
86
9, 30
5
97
98
FP-100B
9
44
45
46
47
48
49
50
51
67
66
65
64
63
62
61
60
52
88
54
55
56
57
58
81
82
59
53
80
31, 76
89
3
5
96
10
78
79
83
6, 27
2
94
95
EPROM socket
Pin
RES
P60
P61
P62
P63
P64
P65
P66
P67
P87
P86
P85
P84
P83
P82
P81
P80
P70
P43
P72
P73
P74
P75
P76
P14
P15
P77
P71
P13
VCC
AV CC
TEST
X1
PB6
MD0
P11
P12
P16
VSS
AV SS
PB4
PB5
Pin
VPP
EO0
EO1
EO2
EO3
EO4
EO5
EO6
EO7
EA0
EA1
EA2
EA3
EA4
EA5
EA6
EA7
EA8
EA9
EA10
EA11
EA12
EA13
EA14
EA15
EA16
CE
OE
PGM
VCC
HN27C101 (32 pins)
1
13
14
15
17
18
19
20
21
12
11
10
9
8
7
6
5
27
26
23
25
4
28
29
3
2
22
24
31
32
VSS
16
Note: Pins not indicated in the figure should be left open.
Figure 6.6 Socket Adapter Pin Correspondence (with HN27C101)
119
Address in
MCU mode
Address in
PROM mode
H'0000
H'0000
On-chip PROM
H'EDFF
H'EDFF
Missing area*
H'1FFFF
Note: * If read in PROM mode, this address area returns unpredictable output data.
When programming with a PROM programmer, be sure to specify addresses
from H'0000 to H'EDFF.
If address H'EE00 and higher addresses are programmed by mistake, it may
become impossible to program the PROM or verify the programmed data.
When programming, assign H'FF data to this address area (H'EE00 to H'1FFFF).
Figure 6.7 H8/3837 Memory Map in PROM Mode
120
6.5
H8/3837 Programming
The write, verify, and other modes are selected as shown in table 6.8 in H8/3837 PROM mode.
Table 6.8
Mode Selection in H8/3837 PROM Mode
Pin
Mode
CE
OE
PGM
VPP
VCC
EO7 to EO0
EA 16 to EA0
Write
L
H
L
VPP
VCC
Data input
Address input
Verify
L
L
H
VPP
VCC
Data output
Address input
Programming
disabled
L
L
L
VPP
VCC
High impedance
Address input
L
H
H
H
L
L
H
H
H
Notation:
L: Low level
H: High level
VPP : VPP level
VCC: VCC level
The specifications for writing and reading the on-chip PROM are identical to those for the
standard HN27C101 EPROM. Page programming is not supported, however. The PROM writer
must not be set to page mode. A PROM programmer that provides only page programming mode
cannot be used. When selecting a PROM programer, check that it supports a byte-by-byte highspeed, high-reliability programming method. Be sure to set the address range to H'0000 to
H'EDFF.
6.5.1
Writing and Verifying
An efficient, high-speed, high-reliability method is available for writing and verifying the PROM
data. This method achieves high speed without voltage stress on the device and without lowering
the reliability of written data. The basic flow of this high-speed, high-reliability programming
method is shown in figure 6.8.
121
Start
Set write/verify mode
VCC = 6.0 V ± 0.25 V, VPP = 12.5 V ± 0.3 V
Address = 0
n=0
n+1 →n
No
Yes
n < 25
Write time t PW = 0.2 ms ± 5%
No Go
Address + 1 → address
Verify
Go
Write time t OPW = 0.2n ms
Last address?
No
Yes
Set read mode
VCC = 5.0 V ± 0.25 V, V PP = VCC
No
Error
All addresses
read?
Yes
End
Figure 6.8 High-Speed, High-Reliability Programming Flow Chart
122
Table 6.9 and table 6.10 give the electrical characteristics in programming mode.
Table 6.9
DC Characteristics (preliminary)
(Conditions: VCC = 6.0 V ±0.25 V, VPP = 12.5 V ±0.3 V, VSS = 0 V, Ta = 25°C ±5°C)
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
Input highlevel voltage
EO7 to EO 0, EA16 to EA 0, VIH
OE, CE, PGM
2.4
—
VCC + 0.3
V
Input lowlevel voltage
EO7 to EO 0, EA16 to EA 0, VIL
OE, CE, PGM
–0.3
—
0.8
V
Output highlevel voltage
EO7 to EO 0
VOH
2.4
—
—
V
I OH = –200 µA
Output lowlevel voltage
EO7 to EO 0
VOL
—
—
0.45
V
I OL = 0.8 mA
Input leakage EO7 to EO 0, EA16 to EA 0, |ILI|
current
OE, CE, PGM
—
—
2
µA
Vin = 5.25 V/
0.5 V
VCC current
I CC
—
—
40
mA
VPP current
I PP
—
—
40
mA
123
Table 6.10 AC Characteristics
(Conditions: VCC = 6.0 V ±0.25 V, VPP = 12.5 V ±0.3 V, Ta = 25°C ±5°C)
Item
Symbol
Min
Typ
Max
Unit
Test
Conditions
Address setup time
t AS
2
—
—
µs
Figure 6.9* 1
OE setup time
t OES
2
—
—
µs
Data setup time
t DS
2
—
—
µs
Address hold time
t AH
0
—
—
µs
Data hold time
t DH
2
—
—
µs
—
—
130
ns
2
—
—
µs
0.19
0.20
0.21
ms
0.19
—
5.25
ms
Data output disable time
t DF *
VPP setup time
t VPS
Programming pulse width
t PW
2
3
PGM pulse width for overwrite
programming
t OPW*
VCC setup time
t VCS
2
—
—
µs
CE setup time
t CES
2
—
—
µs
Data output delay time
t OE
0
—
200
ns
Notes: 1. Input pulse level: 0.45 V to 2.4 V
Input rise time/fall time ≤ 20 ns
Timing reference levels: Input: 0.8 V, 2.0 V
Output:0.8 V, 2.0 V
2. t DF is defined at the point at which the output is floating and the output level cannot be
read.
3. t OPW is defined by the value given in figure 6.8 high-speed, high-reliability programming
flow chart.
124
Figure 6.9 shows a write/verify timing diagram.
Write
Verify
Address
tAH
tAS
Data
Input data
tDH
tDS
VPP
VCC
Output data
tDF
VPP
VCC
tVPS
VCC +1
VCC
tVCS
CE
tCES
PGM
tPW
OE
tOES
tOE
tOPW*
Note: * tOPW is defined by the value given in figure 6-8 high-speed, high-reliability
programming flow chart.
Figure 6.9 PROM Write/Verify Timing
125
6.5.2
Programming Precautions
• Use the specified programming voltage and timing.
The programming voltage in PROM mode (VPP) is 12.5 V. Use of a higher voltage can
permanently damage the chip. Be especially careful with respect to PROM programmer
overshoot.
Setting the PROM programmer to Hitachi specifications for the HN27C101 will result in
correct VPP of 12.5 V.
• Make sure the index marks on the PROM programmer socket, socket adapter, and chip are
properly aligned. If they are not, the chip may be destroyed by excessive current flow. Before
programming, be sure that the chip is properly mounted in the PROM programmer.
• Avoid touching the socket adapter or chip while programming, since this may cause contact
faults and write errors.
• Select the programming mode carefully. The chip cannot be programmed in page
programming mode.
• When programming with a PROM programmer, be sure to specify addresses from H'0000 to
H'EDFF. If address H'EE00 and higher addresses are programmed by mistake, it may become
impossible to program the PROM or verify the programmed data. When programming, assign
H'FF data to the address area from H'EE00 to H'1FFFF.
126
6.6
Reliability of Programmed Data
A highly effective way of assuring data retention characteristics after programming is to screen the
chips by baking them at a temperature of 150°C. High-temperature baking is a screening method
that quickly eliminates PROM memory cells prone to initial data retention failure.
Figure 6.10 shows a flowchart of this screening procedure.
Write program and verify contents
Bake at high temperature with power off
125°C to 150°C, 24 hrs to 48 hrs
Read and check program
Install
Figure 6.10 Recommended Screening Procedure
If write errors occur repeatedly while the same PROM programmer is being used, stop
programming and check for problems in the PROM programmer and socket adapter, etc.
Please notify your Hitachi representative of any problems occurring during programming or in
screening after high-temperature baking.
127
128
Section 7 RAM
7.1
Overview
The H8/3832, H8/3833 and H8/3834 have 1 kbyte of high-speed static RAM on-chip, while the
H8/3835, H8/3836, and H8/3837 each have 2 kbytes. The RAM is connected to the CPU by a 16bit data bus, allowing high-speed 2-state access for both byte data and word data.
7.1.1
Block Diagram
Figure 7.1 shows a block diagram of the on-chip RAM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'FB80
H'FB80
H'FB81
H'FB82
H'FB82
H'FB83
On-chip RAM
H'FF7E
H'FF7E
H'FF7F
Even-numbered
address
Odd-numbered
address
Figure 7.1 RAM Block Diagram (H8/3834)
129
130
Section 8 I/O Ports
8.1
Overview
The H8/3834 Series is provided with eight 8-bit I/O ports, one 4-bit I/O port, one 3-bit I/O port,
one 8-bit input-only port, one 4-bit input-only port, and one 1-bit input-only port. Table 8.1
indicates the functions of each port.
Each port has of a port control register (PCR) that controls input and output, and a port data
register (PDR) for storing output data. Input or output can be assigned to individual bits.
See 2.9.2, Notes on Bit Manipulation, for information on executing bit-manipulation instructions
to write data in PCR or PDR.
Ports 5, 6, 7, 8, 9, and A double as liquid crystal display segment pins and common pins. The
choice of pin functions can be made in 4-bit groupings.
Block diagrams of each port are given in Appendix C, I/O Port Block Diagrams.
Table 8.1
Port Functions
Port
Description
Pins
Other Functions
Function
Switching
Register
Port 1
• 8-bit I/O port
P17 to P1 5/
IRQ3 to IRQ1/
TMIF, TMIC,
TMIB
External interrupts 3 to 1
PMR1
Timer event input TMIF, TMIC,
TMIB
TCRF,
TMC,
TMB
P14/PWM
14-bit PWM output
PMR1
P13/TMIG
Timer G input capture
PMR1
• Input pull-up MOS
option
Port 2
P12, P11/
Timer F output compare
TMOFH, TMOFL
PMR1
P10/TMOW
Timer A clock output
PMR1
• 8-bit I/O port
P27 to P2 2
None
• Open drain output
option
P21/UD
Timer C count-up/down selection
PMR2
• High-current port
P20/IRQ4/
ADTRG
External interrupt 4 and A/D
converter external trigger
PMR2
AMR
131
Table 8.1
Port Functions (cont)
Function
Switching
Register
Port
Description
Pins
Other Functions
Port 3
• 8-bit I/O port
P37/CS
PMR3
• Input pull-up MOS
option
P36/STRB
SCI2 chip select input (CS), strobe
output (STRB), data output (SO2),
data input (SI 2), clock input/output
(SCK2)
SCI1 data output (SO1), data input
(SI1), clock input/output (SCK1)
PMR3
• 1-bit input-only port P43/IRQ0
External interrupt 0
PMR2
• 3-bit I/O port
SCI3 data output (TXD), data input
(RXD), clock input/output (SCK3)
SCR3
P57 to P5 0/
WKP 7 to WKP 0/
SEG8 to SEG 1
• Wakeup input (WKP 7 to WKP 0)
PMR5
• Segment output (SEG8 to SEG 1)
LPCR
P67 to P6 0/
SEG16 to SEG 9
Segment output (SEG16 to SEG 9)
LPCR
• High-current port
P35/SO 2
P34/SI2
P33/SCK2
P32/SO 1
P31/SI1
P30/SCK1
Port 4
P42/TXD
P41/RXD
SMR3
P40/SCK3
Port 5
• 8-bit I/O port
• Input pull-up MOS
option
Port 6
• 8-bit I/O port
• Input pull-up MOS
option
Port 7
• 8-bit I/O port
P77 to P7 0/
SEG24 to SEG 17
Segment output (SEG24 to SEG 17 )
LPCR
Port 8
• 8-bit I/O port
P87 to P8 0/
SEG32 to SEG 25
Segment output (SEG32 to SEG 25 )
LPCR
Port 9
• 8-bit I/O port
P97/SEG 40 /CL1
• Segment output (SEG40 to SEG 37 )
LPCR
P96/SEG 39 /CL2
• Latch clock (CL1), for external
segment expansion, shift clock
(CL2), display data port (DO), and
alternating signal (M)
P95/SEG 38 /DO
P94/SEG 37 /M
P93 to P9 0/
SEG36 to SEG 33
• Segment output (SEG36 to SEG 33 )
Port A
• 4-bit I/O port
PA3 to PA 0/
COM4 to COM1
Common output (COM4 to COM1)
LPCR
Port B
• 8-bit input port
PB7 to PB 0/
AN 7 to AN0
A/D converter analog input
AMR
Port C
• 4-bit input port
PC 3 to PC0/
AN 11 to AN8
A/D converter analog input
AMR
132
8.2
Port 1
8.2.1
Overview
Port 1 is an 8-bit I/O port. Figure 8.1 shows its pin configuration.
P1 7 /IRQ 3 /TMIF
P1 6 /IRQ 2 /TMIC
P1 5 /IRQ 1 /TMIB
P1 4 /PWM
Port 1
P1 3 /TMIG
P1 2 /TMOFH
P1 1 /TMOFL
P1 0 /TMOW
Figure 8.1 Port 1 Pin Configuration
8.2.2
Register Configuration and Description
Table 8.2 shows the port 1 register configuration.
Table 8.2
Port 1 Registers
Name
Abbrev.
R/W
Initial Value
Address
Port data register 1
PDR1
R/W
H'00
H'FFD4
Port control register 1
PCR1
W
H'00
H'FFE4
Port pull-up control register 1
PUCR1
R/W
H'00
H'FFE0
Port mode register 1
PMR1
R/W
H'00
H'FFC8
133
Port Data Register 1 (PDR1)
Bit
7
6
5
4
3
2
1
0
P17
P16
P15
P14
P13
P12
P11
P10
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR1 is an 8-bit register that stores data for pins P17 through P10. If port 1 is read while PCR1 bits
are set to 1, the values stored in PDR1 are read, regardless of the actual pin states. If port 1 is read
while PCR1 bits are cleared to 0, the pin states are read.
Upon reset, PDR1 is initialized to H'00.
Port Control Register 1 (PCR1)
Bit
7
6
5
4
3
2
1
0
PCR17
PCR16
PCR15
PCR14
PCR13
PCR12
PCR11
PCR10
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR1 is an 8-bit register for controlling whether each of the port 1 pins P17 to P10 functions as an
input pin or output pin. Setting a PCR1 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCR1 and in PDR1 are valid only
when the corresponding pin is designated in PMR1 as a general I/O pin.
Upon reset, PCR1 is initialized to H'00.
PCR1 is a write-only register. All bits are read as 1.
Port Pull-Up Control Register 1 (PUCR1)
Bit
7
6
5
4
3
2
1
0
PUCR17 PUCR16 PUCR15 PUCR14 PUCR13 PUCR12 PUCR11 PUCR10
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PUCR1 controls whether the MOS pull-up of each port 1 pin is on or off. When a PCR1 bit is
cleared to 0, setting the corresponding PUCR1 bit to 1 turns on the MOS pull-up for the
corresponding pin, while clearing the bit to 0 turns off the MOS pull-up.
Upon reset, PUCR1 is initialized to H'00.
134
Port Mode Register 1 (PMR1)
Bit
7
6
5
4
3
2
1
0
IRQ3
IRQ2
IRQ1
PWM
TMIG
TMOFH
TMOFL
TMOW
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PMR1 is an 8-bit read/write register, controlling the selection of pin functions for port 1 pins.
Upon reset, PMR1 is initialized to H'00.
Bit 7—P17/IRQ3/TMIF Pin Function Switch (IRQ3): This bit selects whether pin
P1 7/IRQ3/TMIF is used as P17 or as IRQ3/TMIF.
Bit 7: IRQ3
Description
0
Functions as P1 7 I/O pin
1
Functions as IRQ3/TMIF input pin
(initial value)
Note: Rising or falling edge sensing can be designated for IRQ3/TMIF.
For details on TMIF pin settings, see 9.5.2 (3), timer control register F (TCRF).
Bit 6—P16/IRQ2/TMIC Pin Function Switch (IRQ2): This bit selects whether pin
P1 6/IRQ2/TMIC is used as P16 or as IRQ2/TMIC.
Bit 6: IRQ2
Description
0
Functions as P1 6 I/O pin
1
Functions as IRQ2/TMIC input pin
(initial value)
Note: Rising or falling edge sensing can be designated for IRQ2/TMIC.
For details on TMIC pin settings, see 9.4.2 (1), timer mode register C (TMC).
Bit 5—P15/IRQ1/TMIB Pin Function Switch (IRQ1): This bit selects whether pin
P1 5/IRQ1/TMIB is used as P15 or as IRQ1/TMIB.
Bit 5: IRQ1
Description
0
Functions as P1 5 I/O pin
1
Functions as IRQ1/TMIB input pin
(initial value)
Note: Rising or falling edge sensing can be designated for IRQ1/TMIB.
For details on TMIB pin settings, see 9.3.2 (1), timer mode register B (TMB).
135
Bit 4—P14/PWM Pin Function Switch (PWM): This bit selects whether pin P1 4/PWM is used as
P1 4 or as PWM.
Bit 4: PWM
Description
0
Functions as P1 4 I/O pin
1
Functions as PWM output pin
(initial value)
Bit 3—P13/TMIG Pin Function Switch (TMIG): This bit selects whether pin P13/TMIG is used
as P13 or as TMIG.
Bit 3: TMIG
Description
0
Functions as P1 3 I/O pin
1
Functions as TMIG input pin
(initial value)
Bit 2—P12/TMOFH Pin Function Switch (TMOFH): This bit selects whether pin P12/TMOFH
is used as P12 or as TMOFH.
Bit 2: TMOFH
Description
0
Functions as P1 2 I/O pin
1
Functions as TMOFH output pin
(initial value)
Bit 1: P1 1/TMOFL Pin Function Switch (TMOFL)
This bit selects whether pin P11/TMOFL is used as P1 1 or as TMOFL.
Bit 1: TMOFL
Description
0
Functions as P1 1 I/O pin
1
Functions as TMOFL output pin
(initial value)
Bit 0—P10/TMOW Pin Function Switch (TMOW): This bit selects whether pin P10/TMOW is
used as P10 or as TMOW.
Bit 0: TMOW
Description
0
Functions as P1 0 I/O pin
1
Functions as TMOW output pin
136
(initial value)
8.2.3
Pin Functions
Table 8.3 shows the port 1 pin functions.
Table 8.3
Port 1 Pin Functions
Pin
Pin Functions and Selection Method
P17/IRQ3/TMIF
The pin function depends on bit IRQ3 in PMR1, bits CKSL2 to CKSL0 in TCRF,
and bit PCR1 7 in PCR1.
IRQ3
PCR17
0
0
CKSL2 to CKSL0
Pin function
1
1
*
Not 0**
*
0**
P17 output pin IRQ3 input pin
P17 input pin
IRQ3/TMIF
input pin
Note: When using as TMIF input pin, clear bit IEN3 in IENR1 to 0, disabling
IRQ3 interrupts.
P16/IRQ2/TMIC
The pin function depends on bit IRQ2 in PMR1, bits TMC2 to TMC0 in TMC, and
bit PCR16 in PCR1.
IRQ2
PCR16
0
0
TMC2 to TMC0
Pin function
1
1
*
Not 111
*
111
P16 output pin IRQ2 input pin
P16 input pin
IRQ2/TMIC
input pin
Note: When using as TMIC input pin, clear bit IEN2 in IENR1 to 0, disabling
IRQ2 interrupts.
P15/IRQ1/TMIB
The pin function depends on bit IRQ1 in PMR1, bits TMB2 to TMB0 in TMB, and
bit PCR15 in PCR1.
IRQ1
PCR15
0
0
TMB2 to TMB0
Pin function
1
*
P15 input pin
1
*
Not 111
P15 output pin IRQ1 input pin
111
IRQ1/TMIB
input pin
Note: When using as TMIB input pin, clear bit IEN1 in IENR1 to 0, disabling
IRQ1 interrupts.
Note: * Don’t care
137
Table 8.3
Port 1 Pin Functions (cont)
Pin
Pin Functions and Selection Method
P14/PWM
The pin function depends on bit PWM in PMR1 and bit PCR14 in PCR1.
PWM
PCR14
Pin function
P13/TMIG
0
0
1
*
P14 input pin
P14 output pin
PWM output pin
The pin function depends on bit TMIG in PMR1 and bit PCR1 3 in PCR1.
TMIG
PCR13
Pin function
P12/TMOFH
0
1
*
P13 input pin
P13 output pin
TMIG input pin
The pin function depends on bit TMOFH in PMR1 and bit PCR12 in PCR1.
PCR12
Pin function
0
1
*
P12 input pin
P12 output pin
TMOFH output pin
The pin function depends on bit TMOFL in PMR1 and bit PCR1 1 in PCR1.
PCR11
Pin function
0
1
*
P11 input pin
P11 output pin
TMOFL output pin
The pin function depends on bit TMOW in PMR1 and bit PCR1 0 in PCR1.
PCR10
Pin function
138
1
0
TMOW
Note: * Don’t care
1
0
TMOFL
P10/TMOW
1
0
TMOFH
P11/TMOFL
1
0
1
0
1
*
P10 input pin
P10 output pin
TMOW output pin
8.2.4
Pin States
Table 8.4 shows the port 1 pin states in each operating mode.
Table 8.4
Port 1 Pin States
Pins
Reset
P17/IRQ3/TMIF
HighRetains Retains
impedance previous previous
state
state
P16/IRQ2/TMIC
P15/IRQ1/TMIB
Sleep
Subsleep Standby
Watch
Subactive Active
HighRetains Functional Functional
impedance* previous
state
P14/PWM
P13/TMIG
P12/TMOFH
P11/TMOFL
P10/TMOW
Note: * A high-level signal is output when the MOS pull-up is in the on state.
8.2.5
MOS Input Pull-Up
Port 1 has a built-in MOS input pull-up function that can be controlled by software. When a PCR1
bit is cleared to 0, setting the corresponding PUCR1 bit to 1 turns on the MOS input pull-up for
that pin. The MOS input pull-up function is in the off state after a reset.
PCR1n
PUCR1n
MOS input pull-up
0
1
0
1
*
Off
On
Off
Note: * Don’t care
n = 7 to 4
139
8.3
Port 2
8.3.1
Overview
Port 2 is an 8-bit I/O port. Figure 8.2 shows its pin configuration.
P2 7
P2 6
P2 5
P2 4
Port 2
P2 3
P2 2
P2 1 /UD
P2 0 /IRQ 4/ADTRG
Figure 8.2 Port 2 Pin Configuration
8.3.2
Register Configuration and Description
Table 8.5 shows the port 2 register configuration.
Table 8.5
Port 2 Registers
Name
Abbrev.
R/W
Initial Value
Address
Port data register 2
PDR2
R/W
H'00
H'FFD5
Port control register 2
PCR2
W
H'00
H'FFE5
Port mode register 2
PMR2
R/W
H'C0
H'FFC9
Port mode register 4
PMR4
R/W
H'00
H'FFCB
140
Port Data Register 2 (PDR2)
Bit
7
6
5
4
3
2
1
0
P27
P26
P25
P24
P23
P22
P21
P20
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR2 is an 8-bit register that stores data for pins P27 through P20. If port 2 is read while PCR2 bits
are set to 1, the values stored in PDR2 are read, regardless of the actual pin states. If port 2 is read
while PCR2 bits are cleared to 0, the pin states are read.
Upon reset, PDR2 is initialized to H'00.
Port Control Register 2 (PCR2)
Bit
7
6
5
4
3
2
1
0
PCR27
PCR26
PCR25
PCR24
PCR23
PCR22
PCR21
PCR20
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR2 is an 8-bit register for controlling whether each of the port 2 pins P27 to P20 functions as an
input pin or output pin. Setting a PCR2 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCR2 and in PDR2 are valid only
when the corresponding pin is designated in PMR2 as a general I/O pin.
Upon reset, PCR2 is initialized to H'00.
PCR2 is a write-only register. All bits are read as 1.
Port Mode Register 2 (PMR2)
Bit
7
6
5
4
3
2
1
0
—
—
POF2
NCS
IRQ0
POF1
UD
IRQ4
Initial value
1
1
0
0
0
0
0
0
Read/Write
—
—
R/W
R/W
R/W
R/W
R/W
R/W
PMR2 is an 8-bit read/write register, controlling the selection of pin functions for pins P20,
P2 1,and P43, controlling the PMOS on/off option for pins P35/SO 2 and P32/SO 1, and controlling the
TMIG input noise canceller.
Upon reset, PMR2 is initialized to H'C0.
141
Bits 7 to 6—Reserved Bits: Bits 7 to 6 are reserved; they are always read as 1, and cannot be
modified.
Bit 5—P35/SO2 Pin PMOS Control (POF2): This bit controls the on/off state of the PMOS
transistor in the P35/SO2 pin output buffer.
Bit 5: POF2
Description
0
CMOS output
1
NMOS open-drain output
(initial value)
Bit 4—TMIG Noise Canceller Select (NCS): This bit controls the noise canceller circuit for
input capture at pin TMIG.
Bit 4: NCS
Description
0
Noise canceller function not selected
1
Noise canceller function selected
(initial value)
Bit 3—P43/IRQ0 Pin Function Switch (IRQ0): This bit selects whether pin P43/IRQ0 is used as
P4 3 or as IRQ0.
Bit 3: IRQ0
Description
0
Functions as P4 3 input pin
1
Functions as IRQ0 input pin
(initial value)
Bit 2—P32/SO1 Pin PMOS Control (POF1): This bit controls the on/off state of the PMOS
transistor in the P32/SO1 pin output buffer.
Bit 2: POF1
Description
0
CMOS output
1
NMOS open-drain output
(initial value)
Bit 1—P21/UD Pin Function Switch (UD): This bit selects whether pin P21/UD is used as P21 or
as UD.
Bit 1: UD
Description
0
Functions as P2 1 I/O pin
1
Functions as UD input pin
142
(initial value)
Bit 0: P20/IRQ4/ADTRG Pin Function Switch (IRQ4): This bit selects whether pin
P2 0/IRQ4/ADTRG is used as P20 or as IRQ4/ADTRG.
Bit 0: IRQ4
Description
0
Functions as P2 0 I/O pin
1
Functions as IRQ4/ADTRG input pin
(initial value)
Note: See 12.3.2, Start of A/D Conversion by External Trigger Input, for the ADTRG pin setting.
Port Mode Register 4 (PMR4)
Bit
7
6
5
4
3
2
1
0
NMOD7
NMOD6
NMOD5
NMOD4
NMOD3
NMOD2
NMOD1
NMOD0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PMR4 is an 8-bit read/write register, used to select CMOS output or NMOS open drain output for
each port 2 pin.
Upon reset, PMR4 is initialized to H'00.
Bit n—NMOS Open-Drain Output Select (NMODn): This bit selects NMOS open-drain output
when pin P2n is used as an output pin.
Bit n: NMODn
Description
0
CMOS output
1
NMOS open-drain outputNMOS open-drain output
(n = 7 to 0)
143
8.3.3
Pin Functions
Table 8.6 shows the port 2 pin functions.
Table 8.6
Port 2 Pin Functions
Pin
Pin Functions and Selection Method
P27 to P2 2
Input or output is selected as follows by the bit settings in PCR2.
(n = 2 to 7)
PCR2n
Pin function
P21/UD
0
1
P2n input pin
P2n output pin
The pin function depends on bit UD in PMR2 and bit PCR21 in PCR2.
UD
0
PCR21
Pin function
1
0
1
*
P21 input pin
P21 output pin
UD input pin
P20/IRQ4/ADTRG The pin function depends on bit IRQ4 in PMR2, bit TRGE in AMR, and bit
PCR20 in PCR2.
IRQ4
0
PCR20
0
TRGE
1
1
*
0
*
Pin function
P20 input pin
P20 output pin IRQ4 input pin
1
IRQ4/ADTRG
input pin
Note: When using as ADTRG input pin, clear bit IEN4 in IENR1 to 0, disabling
IRQ4 interrupts.
Note: * Don’t care
8.3.4
Pin States
Table 8.7 shows the port 2 pin states in each operating mode.
Table 8.7
Port 2 Pin States
Pins
Reset
Sleep
Subsleep
Standby
Watch
P27 to P2 2
Highimpedance
Retains
previous
state
Retains
previous
state
Highimpedance
Retains Functional Functional
previous
state
P21/UD
P20/IRQ4/
ADTRG
144
Subactive Active
8.4
Port 3
8.4.1
Overview
Port 3 is an 8-bit I/O port, configured as shown in figure 8.3.
P3 7 /CS
P3 6 /STRB
P3 5 /SO 2
P3 4 /SI 2
Port 3
P3 3 /SCK 2
P3 2 /SO 1
P3 1 /SI1
P3 0 /SCK1
Figure 8.3 Port 3 Pin Configuration
8.4.2
Register Configuration and Description
Table 8.8 shows the port 3 register configuration.
Table 8.8
Port 3 Registers
Name
Abbrev.
R/W
Initial Value
Address
Port data register 3
PDR3
R/W
H'00
H'FFD6
Port control register 3
PCR3
W
H'00
H'FFE6
Port pull-up control register 3
PUCR3
R/W
H'00
H'FFE1
Port mode register 3
PMR3
R/W
H'00
H'FFCA
145
Port Data Register 3 (PDR3)
Bit
7
6
5
4
3
2
1
0
P37
P36
P35
P34
P33
P32
P31
P30
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR3 is an 8-bit register that stores data for port 3 pins P37 to P30. If port 3 is read while PCR3
bits are set to 1, the values stored in PDR3 are read, regardless of the actual pin states. If port 3 is
read while PCR3 bits are cleared to 0, the pin states are read.
Upon reset, PDR3 is initialized to H'00.
Port Control Register 3 (PCR3)
Bit
7
6
5
4
3
2
1
0
PCR37
PCR36
PCR35
PCR34
PCR33
PCR32
PCR31
PCR30
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR3 is an 8-bit register for controlling whether each of the port 3 pins P37 to P30 functions as an
input pin or output pin. Setting a PCR3 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCR3 and in PDR3 are valid only
when the corresponding pin is designated in PMR3 as a general I/O pin.
Upon reset, PCR3 is initialized to H'00.
PCR3 is a write-only register. All bits are read as 1.
Port Pull-Up Control Register 3 (PUCR3)
Bit
7
6
5
4
3
2
1
0
PUCR37 PUCR36 PUCR35 PUCR34 PUCR33 PUCR32 PUCR31 PUCR30
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PUCR3 bits control the on/off state of pin P3 7–P3 0 MOS pull-ups. When a PCR3 bit is cleared to
0, setting the corresponding PUCR3 bit to 1 turns on the MOS pull-up for the corresponding pin,
while clearing the bit to 0 turns off the MOS pull-up.
Upon reset, PUCR3 is initialized to H'00.
146
Port Mode Register 3 (PMR3)
Bit
7
6
5
4
3
2
1
0
CS
STRB
SO2
SI2
SCK2
SO1
SI1
SCK1
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PMR3 is an 8-bit read/write register, controlling the selection of pin functions for port 3 pins.
Upon reset, PMR3 is initialized to H'00.
Bit 7—P37/CS Pin Function Switch (CS): This bit selects whether pin P37/CS is used as P37 or
as CS.
Bit 7: CS
Description
0
Functions as P3 7 I/O pin
1
Functions as CS input pin
(initial value)
Bit 6—P36/STRB Pin Function Switch (STRB): This bit selects whether pin P36/STRB is used
as P36 or as STRB.
Bit 6: STRB
Description
0
Functions as P3 6 I/O pin
1
Functions as STRB output pin
(initial value)
Bit 5—P3 /SO2 Pin Function Switch (SO2): This bit selects whether pin P3 /SO 2 is used as P3 or
as SO 2.
5
5
Bit 5: SO2
Description
0
Functions as P3 5 I/O pin
1
Functions as SO 2 output pin
5
(initial value)
Bit 4—P34/SI2 Pin Function Switch (SI2): This bit selects whether pin P34/SI 2 is used as P34 or
as SI2.
Bit 4: SI2
Description
0
Functions as P3 4 I/O pin
1
Functions as SI2 input pin
(initial value)
147
Bit 3—P33/SCK2 Pin Function Switch (SCK2): This bit selects whether pin P33/SCK2 is used as
P3 3 or as SCK 2.
Bit 3: SCK2
Description
0
Functions as P3 3 I/O pin
1
Functions as SCK2 I/O pin
(initial value)
Bit 2—P32/SO1 Pin Function Switch (SO1): This bit selects whether pin P32/SO1 is used as P32
or as SO1.
Bit 2: SO1
Description
0
Functions as P3 2 I/O pin
1
Functions as SO 1 output pin
(initial value)
Bit 1—P31/SI1 Pin Function Switch (SI1): This bit selects whether pin P31/SI1 is used as P31 or
as SI1.
Bit 1: SI1
Description
0
Functions as P3 1 I/O pin
1
Functions as SI1 input pin
(initial value)
Bit 0—P30/SCK1 Pin Function Switch (SCK1): This bit selects whether pin P30/SCK1 is used as
P3 0 or as SCK 1.
Bit 0: SCK1
Description
0
Functions as P3 0 I/O pin
1
Functions as SCK1 I/O pin
148
(initial value)
8.4.3
Pin Functions
Table 8.9 shows the port 3 pin functions.
Table 8.9
Port 3 Pin Functions
Pin
Pin Functions and Selection Method
P37/CS
The pin function depends on bit CS in PMR3 and bit PCR3 7 in PCR3.
CS
PCR37
Pin function
P36/STRB
0
0
1
*
P37 input pin
P37 output pin
CS input pin
The pin function depends on bit STRB in PMR3 and bit PCR36 in PCR3.
STRB
PCR36
Pin function
P35/SO 2
0
1
*
P36 input pin
P36 output pin
STRB output pin
The pin function depends on bit SO2 in PMR3 and bit PCR35 in PCR3.
PCR35
Pin function
0
1
0
1
*
P35 input pin
P35 output pin
SO2 output pin
The pin function depends on bit SI2 in PMR3 and bit PCR3 4 in PCR3.
SI2
PCR34
Pin function
P33/SCK2
1
0
SO2
P34/SI2
1
0
1
0
1
*
P34 input pin
P34 output pin
SI 2 input pin
The pin function depends on bit SCK2 in PMR3, bits CKS2 to 0 in SCR2, and bit
PCR33 in PCR3.
SCK2
0
CKS2 to CKS0
*
PCR33
Pin function
1
Not 111
111
0
1
*
*
P33 input
pin
P33 output
pin
SCK 2 output
pin
SCK 2 input
pin
Note: * Don’t care
149
Table 8.9
Port 3 Pin Functions (cont)
Pin
Pin Functions and Selection Method
P32/SO 1
The pin function depends on bit SO1 in PMR3 and bit PCR32 in PCR3.
SO1
PCR32
Pin function
P31/SI1
0
0
1
*
P32 input pin
P32 output pin
SO1 output pin
The pin function depends on bit SI1 in PMR3 and bit PCR3 1 in PCR3.
SI1
PCR31
Pin function
P30/SCK1
1
0
1
*
P31 input pin
P31 output pin
SI 1 input pin
SCK1
0
CKS3
*
Pin function
150
0
The pin function depends on bit SCK1 in PMR3, bit CKS3 in SCR1, and bit
PCR30 in PCR3.
PCR30
Note: * Don’t care
1
1
0
1
0
1
*
*
P30 input
pin
P30 output
pin
SCK 1 output
pin
SCK 1 input
pin
8.4.4
Pin States
Table 8.10 shows the port 3 pin states in each operating mode.
Table 8.10 Port 3 Pin States
Pins
Reset
Sleep
Subsleep
Standby
P37/CS
Highimpedance
Retains
previous
state
Retains
previous
state
HighRetains Functional Functional
impedance* previous
state
P36/STRB
P35/SO 2
Watch
Subactive Active
P34/SI2
P33/SCK2
P32/SO 1
P31/SI1
P30/SCK1
Note: * A high-level signal is output when the MOS pull-up is in the on state.
8.4.5
MOS Input Pull-Up
Port 3 has a built-in MOS input pull-up function that can be controlled by software. When a PCR3
bit is cleared to 0, setting the corresponding PUCR3 bit to 1 turns on the MOS pull-up for that pin.
The MOS pull-up function is in the off state after a reset.
PCR3n
PUCR3n
MOS input pull-up
0
1
0
1
*
Off
On
Off
Note: * Don’t care
n = 7 to 0
151
8.5
Port 4
8.5.1
Overview
Port 4 consists of a 3-bit I/O port and a 1-bit input port, and is configured as shown in figure 8.4.
P4 3 /IRQ 0
P4 2 /TXD
Port 4
P4 1 /RXD
P4 0 /SCK 3
Figure 8.4 Port 4 Pin Configuration
8.5.2
Register Configuration and Description
Table 8.11 shows the port 4 register configuration.
Table 8.11 Port 4 Registers
Name
Abbrev.
R/W
Initial Value
Address
Port data register 4
PDR4
R/W
H'F8
H'FFD7
Port control register 4
PCR4
W
H'F8
H'FFE7
152
Port Data Register 4 (PDR4)
Bit
7
6
5
4
3
2
1
0
—
—
—
—
P43
P42
P41
P40
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
R
R/W
R/W
R/W
PDR4 is an 8-bit register that stores data for port 4 pins P42 to P40. If port 4 is read while PCR4
bits are set to 1, the values stored in PDR4 are read, regardless of the actual pin states. If port 4 is
read while PCR4 bits are cleared to 0, the pin states are read.
Upon reset, PDR4 is initialized to H'F8.
Port Control Register 4 (PCR4)
Bit
7
6
5
4
3
2
1
0
—
—
—
—
—
PCR42
PCR41
PCR40
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
—
W
W
W
PCR4 controls whether each of the port 4 pins P42 to P40 functions as an input pin or output pin.
Setting a PCR4 bit to 1 makes the corresponding pin an output pin, while clearing the bit to 0
makes the pin an input pin. The settings in PCR4 and in PDR4 are valid only when the
corresponding pin is designated in SCR3 as a general I/O pin.
Upon reset, PCR4 is initialized to H'F8.
PCR4 is a write-only register. All bits are read as 1.
153
8.5.3
Pin Functions
Table 8.12 shows the port 4 pin functions.
Table 8.12 Port 4 Pin Functions
Pin
Pin Functions and Selection Method
P43/IRQ0
The pin function depends on the IRQ0 bit setting in PMR2.
IRQ0
Pin function
P42/TXD
0
1
P43 input pin
IRQ0 input pin
The pin function depends on bit TE in SCR3 and bit PCR4 2 in PCR4.
TE
PCR42
Pin function
P41/RXD
0
0
1
*
P42 input pin
P42 output pin
TXD output pin
The pin function depends on bit RE in SCR3 and bit PCR4 1 in PCR4.
RE
PCR41
Pin function
P40/SCK3
1
0
1
0
1
*
P41 input pin
P41 output pin
RXD input pin
The pin function depends on bits CKE1 and CKE0 in SCR3, bit COM in SMR,
and bit PCR4 0 in PCR4.
CKE1
0
CKE0
0
COM
PCR40
Pin function
Note: * Don’t care
154
1
0
1
1
*
*
*
0
1
*
*
P40 input
pin
P40 output
pin
SCK 3 output
pin
SCK 3 input
pin
8.5.4
Pin States
Table 8.13 shows the port 4 pin states in each operating mode.
Table 8.13 Port 4 Pin States
Pins
Reset
Sleep
Subsleep
Standby
Watch
P43/IRQ0
Highimpedance
Retains
previous
state
Retains
previous
state
Highimpedance
Retains Functional Functional
previous
state
P42/TXD
P41/RXD
Subactive Active
P40/SCK3
8.6
Port 5
8.6.1
Overview
Port 5 is an 8-bit I/O port, configured as shown in figure 8.5.
P5 7 /WKP7 /SEG 8
P5 6 /WKP6 /SEG 7
P5 5 /WKP5 /SEG 6
Port 5
P5 4 /WKP4 /SEG 5
P5 3 /WKP3 /SEG 4
P5 2 /WKP2 /SEG 3
P5 1 /WKP1 /SEG 2
P5 0 /WKP0 /SEG 1
Figure 8.5 Port 5 Pin Configuration
155
8.6.2
Register Configuration and Description
Table 8.14 shows the port 5 register configuration.
Table 8.14 Port 5 Registers
Name
Abbrev.
R/W
Initial Value
Address
Port data register 5
PDR5
R/W
H'00
H'FFD8
Port control register 5
PCR5
W
H'00
H'FFE8
Port pull-up control register 5
PUCR5
R/W
H'00
H'FFE2
Port mode register 5
PMR5
R/W
H'00
H'FFCC
Port Data Register 5 (PDR5)
Bit
7
6
5
4
3
2
1
0
P57
P56
P55
P54
P53
P52
P51
P50
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR5 is an 8-bit register that stores data for port 5 pins P57 to P50. If port 5 is read while PCR5
bits are set to 1, the values stored in PDR5 are read, regardless of the actual pin states. If port 5 is
read while PCR5 bits are cleared to 0, the pin states are read.
Upon reset, PDR5 is initialized to H'00.
Port Control Register 5 (PCR5)
Bit
7
6
5
4
3
2
1
0
PCR57
PCR56
PCR55
PCR54
PCR53
PCR52
PCR51
PCR50
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR5 is an 8-bit register for controlling whether each of the port 5 pins P57 to P50 functions as an
input pin or output pin. Setting a PCR5 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCR5 and in PDR5 are valid only
when the corresponding pin is designated as a general I/O pin in PMR5 and in bits SGS3 to SGS0
of LPCR.
Upon reset, PCR5 is initialized to H'00.
PCR5 is a write-only register. All bits are read as 1.
156
Port Pull-up Control Register 5 (PUCR5)
Bit
7
6
5
4
3
2
1
0
PUCR57 PUCR56 PUCR55 PUCR54 PUCR53 PUCR52 PUCR51 PUCR50
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PUCR5 bits control the on/off state of pin P5 7–P5 0 MOS pull-ups. When a PCR5 bit is cleared to
0, setting the corresponding PUCR5 bit to 1 turns on the MOS pull-up for the corresponding pin,
while clearing the bit to 0 turns off the MOS pull-up.
Upon reset, PUCR5 is initialized to H'00.
Port Mode Register 5 (PMR5)
Bit
7
6
5
4
3
2
1
0
WKP7
WKP6
WKP5
WKP4
WKP3
WKP2
WKP1
WKP0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PMR5 is an 8-bit read/write register, controlling the selection of pin functions for port 5 pins.
Upon reset, PMR5 is initialized to H'00.
Bit n—P5n/WKPn/SEGn+1 Pin Function Switch (WKPn): When pin P5n/WKPn/SEGn+1 is not
used as a SEGn+1 pin, this bit selects whether it is used as
P5 n or as WKPn.
Bit n: WKPn
Description
0
Functions as P5 n I/O pin
1
Functions as WKP n input pin
(initial value)
(n = 7 to 0)
Note: For information on use as a SEGn+1 pin, see 13.2.1, LCD Port Control Register (LPCR).
157
8.6.3
Pin Functions
Table 8.15 shows the port 5 pin functions.
Table 8.15 Port 5 Pin Functions
Pin
Pin Functions and Selection Method
P57/WKP 7/
SEG8to P54/
WKP 4/SEG 5
The pin function depends on bit WKPn in PMR5, bit PCR5 n in PCR5, and bits
SGS3 to SGS0 in LPCR.
(n = 7 to 4)
SGS3 to SGS0
0***
WKPn
0
PCR5n
Pin function
P53/WKP 3/
SEG4 to P5 0/
WKP 0/SEG 1
1***
1
*
0
1
*
*
P5n input
pin
P5n output
pin
WKP n input
pin
SEGn+1 output
pin
The pin function depends on bit WKP n in PMR5, bit PCR5n in PCR5, and bits
SGS3 to SGS0 in LPCR.
(n = 3 to 0)
SGS3 to SGS0
0*** or 1**0
WKPn
1**1
0
PCR5n
Pin function
1
*
0
1
*
*
P5n input
pin
P5n output
pin
WKP n input
pin
SEGn+1 output
pin
Note: * Don’t care
8.6.4
Pin States
Table 8.16 shows the port 5 pin states in each operating mode.
Table 8.16 Port 5 Pin States
Pins
Reset
Sleep
HighRetains
P57/WKP 7/
SEG8 to P5 0/ impedance previous
state
WKP 0/SEG 1
Subsleep
Standby
Watch
Subactive Active
Retains
previous
state
HighRetains Functional Functional
impedance* previous
state
Note: * A high-level signal is output when the MOS pull-up is in the on state.
158
8.6.5
MOS Input Pull-Up
Port 5 has a built-in MOS input pull-up function that can be controlled by software. When a PCR5
bit is cleared to 0, setting the corresponding PUCR5 bit to 1 turns on the MOS pull-up for that pin.
The MOS pull-up function is in the off state after a reset.
PCR5n
0
PUCR5n
MOS input pull-up
1
0
1
*
Off
On
Off
Note: * Don’t care
n = 7 to 0
8.7
Port 6
8.7.1
Overview
Port 6 is an 8-bit I/O port, configured as shown in figure 8.6.
P6 7 /SEG 16
P6 6 /SEG 15
P6 5 /SEG 14
Port 6
P6 4 /SEG 13
P6 3 /SEG 12
P6 2 /SEG 11
P6 1 /SEG 10
P6 0 /SEG 9
Figure 8.6 Port 6 Pin Configuration
159
8.7.2
Register Configuration and Description
Table 8.17 shows the port 6 register configuration.
Table 8.17 Port 6 Registers
Name
Abbrev.
R/W
Initial Value
Address
Port data register 6
PDR6
R/W
H'00
H'FFD9
Port control register 6
PCR6
W
H'00
H'FFE9
Port pull-up control register 6
PUCR6
R/W
H'00
H'FFE3
Port Data Register 6 (PDR6)
Bit
7
6
5
4
3
2
1
0
P67
P66
P65
P64
P63
P62
P61
P60
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR6 is an 8-bit register that stores data for port 6 pins P67 to P60. If port 6 is read while PCR6
bits are set to 1, the values stored in PDR6 are read, regardless of the actual pin states. If port 6 is
read while PCR6 bits are cleared to 0, the pin states are read.
Upon reset, PDR6 is initialized to H'00.
Port Control Register 6 (PCR6)
Bit
7
6
5
4
3
2
1
0
PCR67
PCR66
PCR65
PCR64
PCR63
PCR62
PCR61
PCR60
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR6 is an 8-bit register for controlling whether each of the port 6 pins P67 to P60 functions as an
input pin or output pin. Setting a PCR6 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCR6 and in PDR6 are valid only
when the corresponding pin is designated in bits SGS3 to SGS0 in LPCR as a general I/O pin.
Upon reset, PCR6 is initialized to H'00.
PCR6 is a write-only register. All bits are read as 1.
160
Port Pull-Up Control Register 6 (PUCR6)
Bit
7
6
5
4
3
2
1
0
PUCR67 PUCR66 PUCR65 PUCR64 PUCR63 PUCR62 PUCR61 PUCR60
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PUCR6 controls whether the MOS pull-up of each port 6 pin P67–P6 0 is on or off. When a PCR6
bit is cleared to 0, setting the corresponding PUCR6 bit to 1 turns on the MOS pull-up for the
corresponding pin, while clearing the bit to 0 turns off the MOS pull-up.
Upon reset, PUCR6 is initialized to H'00.
8.7.3
Pin Functions
Table 8.18 shows the port 6 pin functions.
Table 8.18 Port 6 Pin Functions
Pin
Pin Functions and Selection Method
P67/SEG 16 to
P64/SEG 13
The pin function depends on bit PCR6n in PCR6 and bits SGS3 to SGS0 in
LPCR.
(n = 7 to 4)
SGS3 to SGS0
PCR6n
Pin function
P63/SEG 12 to
P60/SEG 9
00** or 010*
0
011* or 1***
1
P6n input pin P6n output pin
*
SEGn+9 output pin
The pin function depends on bit PCR6n in PCR6 and bits SGS3 to SGS0 in
LPCR.
(n = 3 to 0)
SGS3 to SGS0
PCR6n
Pin function
00**, 010* or 0110
0
1
P6n input pin P6n output pin
0111 or 1***
*
SEGn+9 output pin
Note: * Don’t care
161
8.7.4
Pin States
Table 8.19 shows the port 6 pin states in each operating mode.
Table 8.19 Port 6 Pin States
Pins
Reset
Sleep
Subsleep Standby
P67/SEG 16 to
P60/SEG 9
HighRetains Retains
impedance previous previous
state
state
Watch
Subactive Active
HighRetains Functional Functional
impedance* previous
state
Note: * A high-level signal is output when the MOS pull-up is in the on state.
8.7.5
MOS Input Pull-Up
Port 6 has a built-in MOS input pull-up function that can be controlled by software. When a PCR6
bit is cleared to 0, setting the corresponding PUCR6 bit to 1 turns on the MOS pull-up for that pin.
The MOS pull-up function is in the off state after a reset.
PCR6n
PUC6n
MOS input pull-up
Note: * Don’t care
n = 7 to 0
162
0
1
0
1
*
Off
On
Off
8.8
Port 7
8.8.1
Overview
Port 7 is an 8-bit I/O port, configured as shown in figure 8.7.
P7 7 /SEG 24
P7 6 /SEG 23
P7 5 /SEG 22
P7 4 /SEG 21
Port 7
P7 3 /SEG 20
P7 2 /SEG 19
P7 1 /SEG 18
P7 0 /SEG 17
Figure 8.7 Port 7 Pin Configuration
8.8.2
Register Configuration and Description
Table 8.20 shows the port 7 register configuration.
Table 8.20 Port 7 Registers
Name
Abbrev.
R/W
Initial Value
Address
Port data register 7
PDR7
R/W
H'00
H'FFDA
Port control register 7
PCR7
W
H'00
H'FFEA
Port Data Register 7 (PDR7)
Bit
7
6
5
4
3
2
1
0
P77
P76
P75
P74
P73
P72
P71
P70
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR7 is an 8-bit register that stores data for port 7 pins P77 to P70. If port 7 is read while PCR7
bits are set to 1, the values stored in PDR7 are read, regardless of the actual pin states. If port 7 is
read while PCR7 bits are cleared to 0, the pin states are read.
163
Upon reset, PDR7 is initialized to H'00.
Port Control Register 7 (PCR7)
Bit
7
6
5
4
3
2
1
0
PCR77
PCR76
PCR75
PCR74
PCR73
PCR72
PCR71
PCR70
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR7 is an 8-bit register for controlling whether each of the port 7 pins P77 to P70 functions as an
input pin or output pin. Setting a PCR7 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCR7 and in PDR7 are valid only
when the corresponding pin is designated in bits SGS3 to SGS0 in LPCR as a general I/O pin.
Upon reset, PCR7 is initialized to H'00.
PCR7 is a write-only register. All bits are read as 1.
8.8.3
Pin Functions
Table 8.21 shows the port 7 pin functions.
Table 8.21 Port 7 Pin Functions
Pin
Pin Functions and Selection Method
P77/SEG 24 to
P74/SEG 21
The pin function depends on bit PCR7n in PCR7 and bits SGS3 to SGS0 in
LPCR.
(n = 7 to 4)
SGS3 to SGS0
PCR7n
Pin function
P73/SEG 20 to
P70/SEG 17
00**
0
01** or 1***
1
P7n input pin P7n output pin
*
SEGn+17 output pin
The pin function depends on bit PCR7n in PCR7 and bits SGS3 to SGS0 in
LPCR.
(n = 3 to 0)
SGS3 to SGS0
PCR7n
Pin function
Note: * Don’t care
164
00** or 0100
0
0101, 011* or 1****
1
P7n input pin P7n output pin
*
SEGn+17 output pin
8.8.4
Pin States
Table 8.22 shows the port 7 pin states in each operating mode.
Table 8.22 Port 7 Pin States
Pins
Reset
P77/SEG 24 to
P70/SEG 17
HighRetains Retains
impedance previous previous
state
state
8.9
Port 8
8.9.1
Overview
Sleep
Subsleep Standby
Watch
Highimpedance
Subactive Active
Retains Functional Functional
previous
state
Port 8 is an 8-bit I/O port configured as shown in figure 8.9.
P8 7 /SEG 32
P8 6 /SEG 31
P8 5 /SEG 30
P8 4 /SEG 29
Port 8
P8 3 /SEG 28
P8 2 /SEG 27
P8 1 /SEG 26
P8 0 /SEG 25
Figure 8.8 Port 8 Pin Configuration
8.9.2
Register Configuration and Description
Table 8.23 shows the port 8 register configuration.
Table 8.23 Port 8 Registers
Name
Abbrev.
R/W
Initial Value
Address
Port data register 8
PDR8
R/W
H'00
H'FFDB
Port control register 8
PCR8
W
H'00
H'FFEB
165
Port Data Register 8 (PDR8)
Bit
7
6
5
4
3
2
1
0
P87
P86
P85
P84
P83
P82
P81
P80
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR8 is an 8-bit register that stores data for port 8 pins P87 to P80. If port 8 is read while PCR8
bits are set to 1, the values stored in PDR8 are read, regardless of the actual pin states. If port 8 is
read while PCR8 bits are cleared to 0, the pin states are read.
Upon reset, PDR8 is initialized to H'00.
Port Control Register 8 (PCR8)
PCR87
PCR86
PCR85
PCR84
PCR83
PCR82
PCR81
PCR80
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR8 is an 8-bit register for controlling whether each of the port 8 pins P87 to P80 functions as an
input or output pin. Setting a PCR8 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCR8 and in PDR8 are valid only
when the corresponding pin is designated in bits SGS3 to SGS0 in LPCR as a general I/O pin.
Upon reset, PCR8 is initialized to H'00.
PCR8 is a write-only register. All bits are read as 1.
166
8.9.3
Pin Functions
Table 8.24 shows the port 8 pin functions.
Table 8.24 Port 8 Pin Functions
Pin
Pin Functions and Selection Method
P87/SEG 32 to
P84/SEG 29
The pin function depends on bit PCR8n in PCR8 and bits SGS3 to SGS0 in
LPCR.
(n = 7 to 4)
SGS3 to SGS0
PCR8n
0
Pin function
P83/SEG 28 to
P80/SEG 25
000*
001*, 01** or 1***
1
*
P8n input pin P8n output pin
SEGn+25 output pin
The pin function depends on bit PCR8n in PCR8 and bits SGS3 to SGS0 in
LPCR.
(n = 3 to 0)
SGS3 to SGS0
PCR8n
000* or 0010
0
Pin function
0011, 01** or 1***
1
*
P8n input pin P8n output pin
SEGn+25 output pin
Note: * Don’t care
8.9.4
Pin States
Table 8.25 shows the port 8 pin states in each operating mode.
Table 8.25 Port 8 Pin States
Pins
Reset
Sleep
Subsleep Standby
P87/SEG 32 to
P80/SEG 25
HighRetains Retains
impedance previous previous
state
state
Highimpedance
Watch
Subactive Active
Retains Functional Functional
previous
state
167
8.10
Port 9
8.10.1
Overview
Port 9 is an 8-bit I/O port configured as shown in figure 8.9.
P9 7 /SEG 40 /CL 1
P9 6 /SEG 39 /CL 2
P9 5 /SEG 38 /DO
P9 4 /SEG 37 /M
Port 9
P9 3 /SEG 36
P9 2 /SEG 35
P9 1 /SEG 34
P9 0 /SEG 33
Figure 8.9 Port 9 Pin Configuration
8.10.2
Register Configuration and Description
Table 8.26 shows the port 9 register configuration.
Table 8.26 Port 9 Registers
Name
Abbrev.
R/W
Initial Value
Address
Port data register 9
PDR9
R/W
H'00
H'FFDC
Port control register 9
PCR9
W
H'00
H'FFEC
Port Data Register 9 (PDR9)
Bit
7
6
5
4
3
2
1
0
P97
P96
P95
P94
P93
P92
P91
P90
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR9 is an 8-bit register that stores data for port 9 pins P97 to P90. If port 9 is read while PCR9
bits are set to 1, the values stored in PDR9 are read, regardless of the actual pin states. If port 9 is
read while PCR9 bits are cleared to 0, the pin states are read.
168
Upon reset, PDR9 is initialized to H'00.
Port Control Register 9 (PCR9)
Bit
7
6
5
4
3
2
1
0
PCR97
PCR96
PCR95
PCR94
PCR93
PCR92
PCR91
PCR90
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
PCR9 is an 8-bit register for controlling whether each of the port 9 pins P97 to P90 functions as an
input or output pin. Setting a PCR9 bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCR9 and in PDR9 are valid only
when the corresponding pin is designated in bits SGS3 to SGS0 in LPCR as a general I/O pin.
Upon reset, PCR9 is initialized to H'00.
PCR9 is a write-only register. All bits are read as 1.
8.10.3
Pin Functions
Table 8.27 shows the port 9 pin functions.
Table 8.27 Port 9 Pin Functions
Pin
Pin Functions and Selection Method
P97/SEG 40 /CL1
The pin function depends on bit PCR97 in PCR9, and bits SGX and SGS3 to
SGS0 in LPCR.
SGS3 to SGS0
SGX
PCR97
Pin function
P96/SEG 39 /CL2
0000
Not 0000
*
0
0
1
0
1
*
*
P97 input
pin
P97 output
pin
SEG40 output
pin
CL 1 output
pin
The pin function depends on bit PCR96 in PCR9, and bits SGX and SGS3 to
SGS0 in LPCR.
SGS3 to SGS0
SGX
PCR96
Pin function
0000
Not 0000
*
0
0
1
0
1
*
*
P96 input
pin
P96 output
pin
SEG39 output
pin
CL 2 output
pin
Note: * Don’t care
169
Table 8.27 Port 9 Pin Functions (cont)
Pin
Pin Functions and Selection Method
P95/SEG 38 /DO
The pin function depends on bit PCR95 in PCR9, and bits SGX and SGS3 to
SGS0 in LPCR.
SGS3 to SGS0
0000
Not 0000
*
0
0
1
SGX
PCR95
Pin function
P94/SEG 37 /M
0
1
*
*
P95 input
pin
P95 output
pin
SEG38 output
pin
DO output
pin
The pin function depends on bit PCR94 in PCR9, and bits SGX and SGS3 to
SGS0 in LPCR.
SGS3 to SGS0
0000
Not 0000
*
0
0
1
SGX
PCR94
Pin function
93/SEG 36 to
P90/SEG 33
0
1
*
*
P94 input
pin
P94 output
pin
SEG37 output
pin
M output
pin
The pin function depends on bit PCR9n in PCR9 and bits SGS3 to SGS0 in
LPCR.
(n = 3 to 0)
SGS3 to SGS0
PCR9n
Pin function
Note: * Don’t care
170
0000
Not 0000
0
1
*
P9n input pin
P9n output pin
SEGn+33 output pin
8.10.4
Pin States
Table 8.28 shows the port 9 pin states in each operating mode.
Table 8.28 Port 9 Pin States
Pins
Reset
P97/SEG 40 /CL1
HighRetains Retains
impedance previous previous
state
state
P96/SEG 39 /CL2
P95/SEG 38 /DO
Sleep
Subsleep Standby
Highimpedance
Watch
Subactive Active
Retains Functional Functional
previous
state
P94/SEG 37 /M
P93/SEG 36 to
P90/SEG 33
8.11
Port A
8.11.1
Overview
Port A is a 4-bit I/O port, configured as shown in figure 8.10.
PA 3/COM 4
Port A
PA 2/COM 3
PA 1/COM 2
PA 0/COM 1
Figure 8.10 Port A Pin Configuration
171
8.11.2
Register Configuration and Description
Table 8.29 shows the port A register configuration.
Table 8.29 Port A Registers
Name
Abbrev.
R/W
Initial Value
Address
Port data register A
PDRA
R/W
H'F0
H'FFDD
Port control register A
PCRA
W
H'F0
H'FFED
Port Data Register A (PDRA)
Bit
7
6
5
4
3
2
1
0
—
—
—
—
PA3
PA2
PA1
PA0
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
PDRA is an 8-bit register that stores data for port A pins PA3 to PA 0. If port A is read while PCRA
bits are set to 1, the values stored in PDRA are read, regardless of the actual pin states. If port A is
read while PCRA bits are cleared to 0, the pin states are read.
Upon reset, PDRA is initialized to H'F0.
Port Control Register A (PCRA)
Bit
7
6
5
4
3
2
1
0
—
—
—
—
PCRA3
PCRA2
PCRA1
PCRA0
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
—
W
W
W
W
PCRA is an 8-bit register for controlling whether each of the port A pins PA3 to PA0 functions as
an input or output pin. Setting a PCRA bit to 1 makes the corresponding pin an output pin, while
clearing the bit to 0 makes the pin an input pin. The settings in PCRA and in PDRA are valid only
when the corresponding pin is designated in LPCR as a general I/O pin.
Upon reset, PCRA is initialized to H'F0.
PCRA is a write-only register. All bits are read as 1.
172
8.11.3
Pin Functions
Table 8.30 gives the port A pin functions.
Table 8.30 Port A Pin Functions
Pin
Pin Functions and Selection Method
PA3/COM4
The pin function depends on bit PCRA3 in PCRA and bits DTS1, DTS0, CMX,
SGX, and SGS3 to SGS0 in LPCR.
CMX
*
0
*
0
1
*
DTS1, DTS0
**
Not 11
**
Not 11
Not 11
11
SGX
0
SGS3 to SGS0
0000
1
PCRA3
Pin function
PA2/COM3
Not
0000
0
1
0000
*
1
*
1
*
Not
0000
0000
Not
0000
0000
Not
0000
0
1
*
PA3 input pin
PA3 output pin
COM4 output pin
The pin function depends on bit PCRA2 in PCRA and bits DTS1, DTS0, CMX,
SGX, and SGS3 to SGS0 in LPCR.
CMX
*
0
0
1
*
DTS1, DTS0
**
00 or 01 **
00 or 01
00 or 01
Not 00 or 01
SGX
0
1
1
*
1
*
1
*
SGS3 to SGS0
0000
Not
0000
0000
Not
0000
0000
Not
0000
PCRA2
Pin function
PA1/COM2
*
*
*
Not
0000
0
0000
0
1
*
PA2 input pin
PA2 output pin
COM3 output pin
The pin function depends on bit PCRA1 in PCRA and bits DTS1, DTS0, CMX,
SGX, and SGS3 to SGS0 in LPCR.
CMX
*
0
*
0
1
*
DTS1, DTS0
**
00
**
00
00
Not 00
SGX
0
SGS3 to SGS0
0000
PCRA1
Pin function
1
*
Not
0000
0
1
0000
*
1
*
1
*
Not
0000
0000
Not
0000
0000
Not
0000
0
1
*
PA1 input pin
PA1 output pin
COM2 output pin
Note: * Don’t care
173
Table 8.30 Port A Pin Functions (cont)
Pin
Pin Functions and Selection Method
PA0/COM1
The pin function depends on bit PCRA0 in PCRA, and bits SGX and SGS3 to
SGS0 in LPCR.
SGS3 to SGS0
0000
0000
Not 0000
0
1
*
SGX
PCRA0
Pin function
0
1
*
PA0 input pin
PA0 output pin
COM1 output pin
Note: * Don’t care
8.11.4
Pin States
Table 8.31 shows the port A pin states in each operating mode.
Table 8.31 Port A Pin States
Pins
Reset
Sleep
Subsleep
Standby
Watch
PA3/COM4
Highimpedance
Retains
previous
state
Retains
previous
state
Highimpedance
Retains Functional Functional
previous
state
PA2/COM3
PA1/COM2
PA0/COM1
174
Subactive Active
8.12
Port B
8.12.1
Overview
Port B is an 8-bit input-only port, configured as shown in figure 8.11.
PB7 /AN 7
PB6 /AN 6
PB5 /AN 5
PB4 /AN 4
Port B
PB3 /AN 3
PB2 /AN 2
PB1 /AN 1
PB0 /AN 0
Figure 8.11 Port B Pin Configuration
8.12.2
Register Configuration and Description
Table 8.32 shows the port B register configuration.
Table 8.32 Port B Register
Name
Abbrev.
R/W
Address
Port data register B
PDRB
R
H'FFDE
Port Data Register B (PDRB)
Bit
Read/Write
7
6
5
4
3
2
1
0
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
R
R
R
R
R
R
R
R
Reading PDRB always gives the pin states. However, if a port B pin is selected as an analog input
channel for the A/D converter by AMR bits CH3 to CH0, that pin reads 0 regardless of the input
voltage.
175
8.13
Port C
8.13.1
Overview
Port C is a 4-bit input-only port, configured as shown in figure 8.12.
PC3 /AN 11
PC2 /AN 10
Port C
PC1 /AN 9
PC0 /AN 8
Figure 8.12 Port C Pin Configuration
8.13.2
Register Configuration and Description
Table 8.33 shows the port C register configuration.
Table 8.33 Port C Register
Name
Abbrev.
R/W
Address
Port data register C
PDRC
R
H'FFDF
Port Data Register C (PDRC)
Bit
Read/Write
7
6
5
4
3
2
1
0
—
—
—
—
PC3
PC2
PC1
PC0
—
—
—
—
R
R
R
R
Reading PDRC always gives the pin states. However, if a port C pin is selected as an analog input
channel for the A/D converter by AMR bits CH3 to CH0, that pin reads 0 regardless of the input
voltage.
176
Section 9 Timers
9.1
Overview
The H8/3834 Series provides five timers (timers A, B, C, F, and G) on-chip.
Table 9.1 outlines the functions of timers A, B, C, F, and G.
Table 9.1
Name
Timer Functions
Functions
Timer A • 8-bit timer
• Interval timer
• 8-bit timer
• Time base
• 8-bit timer
• Clock output
Timer B • 8-bit timer
• Interval timer
Event
Input Pin
Waveform
Output Pin
—
—
—
φ W /128
(choice of 4
overflow periods)
—
φ /4 to φ /32,
φ W /4 to φ W /32
(8 choices)
—
TMOW
φ /4 to φ /8192
(7 choices)
TMIB
—
φ /4 to φ /8192,
φ W /4 (7 choices)
TMIC
—
φ /2 to φ /32
(4 choices)
TMIF
TMOFL
φ /2 to φ /64, φ W /2
(4 choices)
TMIG
Internal Clock
φ /8 to φ /8192
(8 choices)
Remarks
• Event counter
Timer C • 8-bit timer
• Interval timer
• Event counter
• Choice of up- or downcounting
Timer F
• 16-bit timer
• Event counter
• Can be used as two
independent 8-bit timers
Counting
direction can
be controlled
by software or
hardware
TMOFH
• Output compare
Timer G • 8-bit timer
• Input capture
• Interval timer
—
• Counter clear
designation
possible
• Built-in noise
canceller
circuit for
input capture
177
9.2
Timer A
9.2.1
Overview
Timer A is an 8-bit timer with interval timing and real-time clock time-base functions. The clock
time-base function is available when a 32.768-kHz crystal oscillator is connected. A clock signal
divided from 32.768 kHz or from the system clock can be output at the TMOW pin.
Features
Features of timer A are given below.
• Choice of eight internal clock sources (φ/8192, φ/4096, φ/2048, φ/512, φ/256, φ/128, φ/32, φ/8).
• Choice of four overflow periods (1 s, 0.5 s, 0.25 s, 31.25 ms) when timer A is used as a clock
time base (using a 32.768 kHz crystal oscillator).
• An interrupt is requested when the counter overflows.
• Any of eight clock signals can be output from pin TMOW: 32.768 kHz divided by 32, 16, 8, or
4 (1 kHz, 2 kHz, 4 kHz, 8 kHz), or the system clock divided by 32, 16, 8, or 4.
178
Block Diagram
Figure 9.1 shows a block diagram of timer A.
Internal data bus
φ W/4
φ W/32
φ W/16
φ W/8
φ W/4
φ W /128
φ /8192, φ /4096, φ /2048,
φ /512, φ /256, φ /128,
φ /32, φ /8
φ
÷256*
TCA
φ W/32
φ W/16
φ W/8
φ W/4
÷128*
TMOW
TMA
PSW
÷64*
1/4
÷8*
φW
PSS
IRRTA
Notation:
TMA: Timer mode register A
TCA: Timer counter A
IRRTA: Timer A overflow interrupt request flag
PSW: Prescaler W
PSS: Prescaler S
Note: Can be selected only when the prescaler W output (φ W/128) is used as the TCA input clock.
Figure 9.1 Block Diagram of Timer A
Pin Configuration
Table 9.2 shows the timer A pin configuration.
Table 9.2
Pin Configuration
Name
Abbrev.
I/O
Function
Clock output
TMOW
Output
Output of waveform generated by timer A output
circuit
179
Register Configuration
Table 9.3 shows the register configuration of timer A.
Table 9.3
Timer A Registers
Name
Abbrev.
R/W
Initial Value
Address
Timer mode register A
TMA
R/W
H'10
H'FFB0
Timer counter A
TCA
R
H'00
H'FFB1
9.2.2
Register Descriptions
Timer Mode Register A (TMA)
Bit
7
6
5
4
3
2
1
0
TMA7
TMA6
TMA5
—
TMA3
TMA2
TMA1
TMA0
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/W
R/W
R/W
—
R/W
R/W
R/W
R/W
TMA is an 8-bit read/write register for selecting the prescaler, input clock, and output clock.
Upon reset, TMA is initialized to H'10.
Bits 7 to 5—Clock Output Select (TMA7 to TMA5): Bits 7 to 5 choose which of eight clock
signals is output at the TMOW pin. The system clock divided by 32, 16, 8, or 4 can be output in
active mode and sleep mode. A 32.768 kHz signal divided by 32, 16, 8, or 4 can be output in
active mode, sleep mode, and subactive mode.
Bit 7: TMA7
Bit 6: TMA6
Bit 5: TMA5
Clock Output
0
0
0
φ /32
1
φ /16
0
φ /8
1
φ /4
0
φ W /32
1
φ W /16
0
φ W /8
1
φ W /4
1
1
0
1
(initial value)
Bit 4—Reserved Bit: Bit 4 is reserved; it is always read as 1, and cannot be modified.
180
Bits 3 to 0—Internal Clock Select (TMA3 to TMA0): Bits 3 to 0 select the clock input to TCA.
Description
Bit 3:
TMA3
Bit 2:
TMA2
Bit 1:
TMA1
Bit 0:
TMA0
Prescaler and Divider Ratio
or Overflow Period
Function
0
0
0
0
PSS, φ /8192
Interval timer
1
PSS, φ /4096
0
PSS, φ /2048
1
PSS, φ /512
0
PSS, φ /256
1
PSS, φ /128
0
PSS, φ /32
1
PSS, φ /8
0
PSW, 1 s
1
PSW, 0.5 s
0
PSW, 0.25 s
1
PSW, 0.03125 s
0
PSW and TCA are reset
1
1
0
1
1
0
0
1
1
0
(initial value)
Clock time base
1
1
0
1
Timer Counter A (TCA)
Bit
7
6
5
4
3
2
1
0
TCA7
TCA6
TCA5
TCA4
TCA3
TCA2
TCA1
TCA0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
TCA is an 8-bit read-only up-counter, which is incremented by internal clock input. The clock
source for input to this counter is selected by bits TMA3 to TMA0 in timer mode register A
(TMA). TCA values can be read by the CPU in active mode, but cannot be read in subactive
mode. When TCA overflows, the IRRTA bit in interrupt request register 1 (IRR1) is set to 1.
TCA is cleared by setting bits TMA3 and TMA2 of TMA to 11.
Upon reset, TCA is initialized to H'00.
181
9.2.3
Timer Operation
Interval Timer Operation: When bit TMA3 in timer mode register A (TMA) is cleared to 0,
timer A functions as an 8-bit interval timer.
Upon reset, TCA is cleared to H'00 and bit TMA3 is cleared to 0, so up-counting and interval
timing resume immediately. The clock input to timer A is selected by bits TMA2 to TMA0 in
TMA; any of eight internal clock signals output by prescaler S can be selected.
After the count value in TCA reaches H'FF, the next clock signal input causes timer A to
overflow, setting bit IRRTA to 1 in interrupt request register 1 (IRR1). If IENTA = 1 in interrupt
enable register 1 (IENR1), a CPU interrupt is requested.*
At overflow, TCA returns to H'00 and starts counting up again. In this mode timer A functions as
an interval timer that generates an overflow output at intervals of 256 input clock pulses.
Note: * For details on interrupts, see 3.3, Interrupts.
Real-Time Clock Time Base Operation: When bit TMA3 in TMA is set to 1, timer A functions
as a real-time clock time base by counting clock signals output by prescaler W.
The overflow period of timer A is set by bits TMA1 and TMA0 in TMA. A choice of four periods
is available. In time base operation (TMA3 = 1), setting bit TMA2 to 1 clears both TCA and
prescaler W to their initial values of H'00.
Clock Output: Setting bit TMOW in port mode register 1 (PMR1) to 1 causes a clock signal to be
output at pin TMOW. Eight different clock output signals can be selected by means of bits TMA7
to TMA5 in TMA. The system clock divided by 32, 16, 8, or 4 can be output in active mode and
sleep mode. A 32.768 kHz signal divided by 32, 16, 8, or 4 can be output in active mode, sleep
mode, and subactive mode.
182
9.2.4
Timer A Operation States
Table 9.4 summarizes the timer A operation states.
Table 9.4
Timer A Operation States
Watch
Subactive
Subsleep
Standby
Reset
Functions Functions Halted
Halted
Halted
Halted
Reset
Functions Functions Functions Functions Functions Halted
Reset
Functions Retained Retained Functions Retained Retained
Operation Mode
Reset Active
TCA Interval
Clock time base
TMA
Sleep
Note: When real-time clock time base function is selected as the internal clock of TCA in active
mode or sleep mode, the internal clock is not synchronous with the system clock, so it is
synchronized by a synchronizing circuit. This may result in a maximum error of 1/φ (s) in the
count cycle.
9.3
Timer B
9.3.1
Overview
Timer B is an 8-bit timer that increments each time a clock pulse is input. This timer has two
operation modes, interval and auto reload.
Features
Features of timer B are given below.
• Choice of seven internal clock sources (φ/8192, φ/2048, φ/512, φ/256, φ/64, φ/16, φ/4) or an
external clock (can be used to count external events).
• An interrupt is requested when the counter overflows.
Block Diagram
Figure 9.2 shows a block diagram of timer B.
183
φ
PSS
TCB
Internal data bus
TMB
TLB
TMIB
IRRTB
Notation:
TMB: Timer mode register B
TCB: Timer counter B
Timer load register B
TLB:
IRRTB: Timer B overflow interrupt request flag
PSS: Prescaler S
Figure 9.2 Block Diagram of Timer B
Pin Configuration
Table 9.5 shows the timer B pin configuration.
Table 9.5
Pin Configuration
Name
Abbrev.
I/O
Function
Timer B event input
TMIB
Input
Event input to TCB
Register Configuration
Table 9.6 shows the register configuration of timer B.
Table 9.6
Timer B Registers
Name
Abbrev.
R/W
Initial Value
Address
Timer mode register B
TMB
R/W
H'78
H'FFB2
Timer counter B
TCB
R
H'00
H'FFB3
Timer load register B
TLB
W
H'00
H'FFB3
184
9.3.2
Register Descriptions
Timer Mode Register B (TMB)
Bit
7
6
5
4
3
2
1
0
TMB7
—
—
—
—
TMB2
TMB1
TMB0
Initial value
0
1
1
1
1
0
0
0
Read/Write
R/W
—
—
—
—
R/W
R/W
R/W
TMB is an 8-bit read/write register for selecting the auto-reload function and input clock.
Upon reset, TMB is initialized to H'78.
Bit 7—Auto-Reload Function Select (TMB7): Bit 7 selects whether timer B is used as an
interval timer or auto-reload timer.
Bit 7: TMB7
Description
0
Interval timer function selected
1
Auto-reload function selected
(initial value)
Bits 6 to 3—Reserved Bits: Bits 6 to 3 are reserved; they always read 1, and cannot be modified.
Bits 2 to 0—Clock Select (TMB2 to TMB0): Bits 2 to 0 select the clock input to TCB. For
external event counting, either the rising or falling edge can be selected.
Bit 2: TMB2
Bit 1: TMB1
Bit 0: TMB0
Description
0
0
0
Internal clock: φ /8192
1
Internal clock: φ /2048
0
Internal clock: φ /512
1
Internal clock: φ /256
0
Internal clock: φ /64
1
Internal clock: φ /16
0
Internal clock: φ /4
1
External event (TMIB): rising or falling edge*
1
1
0
1
(initial value)
Note: * The edge of the external event signal is selected by bit IEG1 in the IRQ edge select register
(IEGR). See 3.3.2, Interrupt Control Registers, for details on the IRQ edge select register.
Be sure to set bit IRQ1 in port mode register 1 (PMR1) to 1 before setting bits TMB2 to
TMB0 to 111.
185
Timer Counter B (TCB)
Bit
7
6
5
4
3
2
1
0
TCB7
TCB6
TCB5
TCB4
TCB3
TCB2
TCB1
TCB0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
TCB is an 8-bit read-only up-counter, which is incremented by internal clock or external event
input. The clock source for input to this counter is selected by bits TMB2 to TMB0 in timer mode
register B (TMB). TCB values can be read by the CPU at any time.
When TCB overflows from H'FF to H'00 or to the value set in TLB, the IRRTB bit in interrupt
request register 2 (IRR2) is set to 1.
TCB is allocated to the same address as timer load register B (TLB).
Upon reset, TCB is initialized to H'00.
Timer Load Register B (TLB)
Bit
7
6
5
4
3
2
1
0
TLB7
TLB6
TLB5
TLB4
TLB3
TLB2
TLB1
TLB0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
TLB is an 8-bit write-only register for setting the reload value of timer counter B.
When a reload value is set in TLB, the same value is loaded into timer counter B (TCB) as well,
and TCB starts counting up from that value. When TCB overflows during operation in auto-reload
mode, the TLB value is loaded into TCB. Accordingly, overflow periods can be set within the
range of 1 to 256 input clocks.
The same address is allocated to TLB as to TCB.
Upon reset, TLB is initialized to H'00.
186
9.3.3
Timer Operation
Interval timer Operation: When bit TMB7 in timer mode register B (TMB) is cleared to 0, timer
B functions as an 8-bit interval timer.
Upon reset, TCB is cleared to H'00 and bit TMB7 is cleared to 0, so up-counting and interval
timing resume immediately. The clock input to timer B is selected from seven internal clock
signals output by prescaler S, or an external clock input at pin TMIB. The selection is made by bits
TMB2 to TMB0 of TMB.
After the count value in TCB reaches H'FF, the next clock signal input causes timer B to overflow,
setting bit IRRTB to 1 in interrupt request register 2 (IRR2). If IENTB = 1 in interrupt enable
register 2 (IENR2), a CPU interrupt is requested.*
At overflow, TCB returns to H'00 and starts counting up again.
During interval timer operation (TMB7 = 0), when a value is set in timer load register B (TLB),
the same value is set in TCB.
Note: * For details on interrupts, see 3.3, Interrupts.
Auto-Reload Timer Operation: Setting bit TMB7 in TMB to 1 causes timer B to function as an
8-bit auto-reload timer. When a reload value is set in TLB, the same value is loaded into TCB,
becoming the value from which TCB starts its count.
After the count value in TCB reaches H'FF, the next clock signal input causes timer B to overflow.
The TLB value is then loaded into TCB, and the count continues from that value. The overflow
period can be set within a range from 1 to 256 input clocks, depending on the TLB value.
The clock sources and interrupts in auto-reload mode are the same as in interval mode.
In auto-reload mode (TMB7 = 1), when a new value is set in TLB, the TLB value is also set in
TCB.
Event Counter Operation: Timer B can operate as an event counter, counting rising or falling
edges of an external event signal input at pin TMIB. External event counting is selected by setting
bits TMB2 to TMB0 in timer mode register B to all 1s (111).
When timer B is used to count external event input, bit IRQ1 in port mode register 1 (PMR1)
should be set to 1, and bit IEN1 in interrupt enable register 1 (IENR1) should be cleared to 0 to
disable IRQ1 interrupt requests.
187
9.3.4
Timer B Operation States
Table 9.7 summarizes the timer B operation states.
Table 9.7
Timer B Operation States
Operation Mode
Reset
Active
Sleep
Watch
Subactive
Subsleep
Standby
TCB Interval
Reset
Functions
Functions
Halted
Halted
Halted
Halted
Reset
Functions
Functions
Halted
Halted
Halted
Halted
Reset
Functions
Retained
Retained
Retained Retained Retained
Auto reload
TMB
9.4
Timer C
9.4.1
Overview
Timer C is an 8-bit timer that increments or decrements each time a clock pulse is input. This
timer has two operation modes, interval and auto reload.
Features
The main features of timer C are given below.
• Choice of seven internal clock sources (φ/8192, φ/2048, φ/512, φ/64, φ/16, φ/4, φW/4) or an
external clock (can be used to count external events).
• An interrupt is requested when the counter overflows.
• Can be switched between up- and down-counting by software or hardware.
• When φW/4 is selected as the internal clock source, or when an external clock is selected, timer
C can function in subactive mode and subsleep mode.
188
Block Diagram
Figure 9.3 shows a block diagram of timer C.
UD
φ
TCC
PSS
Internal data bus
TMC
TMIC
φ W/4
TLC
IRRTC
Notation:
TMC: Timer mode register C
TCC: Timer counter C
Timer load register C
TLC:
IRRTC: Timer C overflow interrupt request flag
PSS: Prescaler S
Figure 9.3 Block Diagram of Timer C
Pin Configuration
Table 9.8 shows the timer C pin configuration.
Table 9.8
Pin Configuration
Name
Abbrev.
I/O
Function
Timer C event input
TMIC
Input
Event input to TCC
Timer C up/down control
UD
Input
Selection of counting direction
Register Configuration
Table 9.9 shows the register configuration of timer C.
189
Table 9.9
Timer C Registers
Name
Abbrev.
R/W
Initial Value
Address
Timer mode register C
TMC
R/W
H'18
H'FFB4
Timer counter C
TCC
R
H'00
H'FFB5
Timer load register C
TLC
W
H'00
H'FFB5
9.4.2
Register Descriptions
Timer Mode Register C (TMC)
Bit
7
6
5
4
3
2
1
0
TMC7
TMC6
TMC5
—
—
TMC2
TMC1
TMC0
Initial value
0
0
0
1
1
0
0
0
Read/Write
R/W
R/W
R/W
—
—
R/W
R/W
R/W
TMC is an 8-bit read/write register for selecting the auto-reload function, counting direction, and
input clock.
Upon reset, TMC is initialized to H'18.
Bit 7—Auto-Reload Function Select (TMC7): Bit 7 selects whether timer C is used as an
interval timer or auto-reload timer.
Bit 7: TMC7
Description
0
Interval timer function selected
1
Auto-reload function selected
(initial value)
Bits 6 and 5—Counter Up/Down Control (TMC6 and TMC5): These bits select the counting
direction of timer counter C (TCC), or allow hardware to control the counting direction using pin
UD.
Bit 6: TMC6
Bit 5: TMC5
Description
0
0
TCC is an up-counter
1
TCC is a down-counter
*
TCC up/down control is determined by input at pin UD.
TCC is a down-counter if the UD input is high, and an upcounter if the UD input is low.
1
Note: * Don’t care
190
(initial value)
Bits 4 and 3—Reserved Bits: Bits 4 and 3 are reserved; they are always read as 1, and cannot be
modified.
Bits 2 to 0—Clock Select (TMC2 to TMC0): Bits 2 to 0 select the clock input to TCC. For
external clock counting, either the rising or falling edge can be selected.
Bit 2: TMC2
Bit 1: TMC1
Bit 0: TMC0
Description
0
0
0
Internal clock: φ /8192
1
Internal clock: φ /2048
0
Internal clock: φ /512
1
Internal clock: φ /64
0
Internal clock: φ /16
1
Internal clock: φ /4
0
Internal clock: φ W /4
1
External event (TMIC): rising or falling edge*
1
1
0
1
(initial value)
Note: * The edge of the external event signal is selected by bit IEG2 in the IRQ edge select register
(IEGR). See 3.3.2, for details on the IRQ edge select register. Be sure to set bit IRQ2 in
port mode register 1 (PMR1) to 1 before setting bits TMC2 to TMC0 to 111.
Timer Counter C (TCC)
Bit
7
6
5
4
3
2
1
0
TCC7
TCC6
TCC5
TCC4
TCC3
TCC2
TCC1
TCC0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
TCC is an 8-bit read-only up-/down-counter, which is incremented or decremented by internal or
external clock input. The clock source for input to this counter is selected by bits TMC2 to TMC0
in timer mode register C (TMC). TCC values can be read by the CPU at any time.
When TCC overflows (from H'FF to H'00 or to the value set in TLC) or underflows (from H'00 to
H'FF or to the value set in TLC), the IRRTC bit in interrupt request register 2 (IRR2) is set to 1.
TCC is allocated to the same address as timer load register C (TLC).
Upon reset, TCC is initialized to H'00.
191
Timer Load Register C (TLC)
Bit
7
6
5
4
3
2
1
0
TLC7
TLC6
TLC5
TLC4
TLC3
TLC2
TLC1
TLC0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
TLC is an 8-bit write-only register for setting the reload value of TCC.
When a reload value is set in TLC, the same value is loaded into timer counter C (TCC) as well,
and TCC starts counting up or down from that value. When TCC overflows or underflows during
operation in auto-reload mode, the TLC value is loaded into TCC. Accordingly, overflow and
underflow periods can be set within the range of 1 to 256 input clocks.
The same address is allocated to TLC as to TCC.
Upon reset, TLC is initialized to H'00.
9.4.3
Timer Operation
Interval Timer Operation: When bit TMC7 in timer mode register C (TMC) is cleared to 0,
timer C functions as an 8-bit interval timer.
Upon reset, timer counter C (TCC) is initialized to H'00 and TMC to H'18. After a reset, the
counter continues uninterrupted incrementing as an interval up-counter. The clock input to timer C
is selected from seven internal clock signals output by prescalers S and W, or an external clock
input at pin TMIC. The selection is made by bits TMC2 to TMC0 in TMC.
Either software or hardware can control whether TCC counts up or down. The selection is made
by TMC bits TMC6 and TMC5.
After the count value in TCC reaches H'FF (H'00), the next clock signal input causes timer C to
overflow (underflow), setting bit IRRTC to 1 in interrupt request register 2 (IRR2). If IENTC = 1
in interrupt enable register 2 (IENR2), a CPU interrupt is requested.
At overflow or underflow, TCC returns to H'00 or H'FF and starts counting up or down again.
During interval timer operation (TMC7 = 0), when a value is set in timer load register C (TLC),
the same value is set in TCC.
Note: * For details on interrupts, see 3.3, Interrupts.
192
Auto-Reload Timer Operation: Setting bit TMC7 in TMC to 1 causes timer C to function as an
8-bit auto-reload timer. When a reload value is set in TLC, the same value is loaded into TCC,
becoming the value from which TCC starts its count.
After the count value in TCC reaches H'FF (H'00), the next clock signal input causes timer C to
overflow (underflow). The TLC value is then loaded TCC, and the count continues from that
value. The overflow (underflow) period can be set within a range from 1 to 256 input clocks,
depending on the TLC value.
The clock sources, up/down control, and interrupts in auto-reload mode are the same as in interval
mode.
In auto-reload mode (TMC7 = 1), when a new value is set in TLC, the TLC value is also set in
TCC.
Event Counter Operation: Timer C can operate as an event counter, counting an event signal
input at pin TMIC. External event counting is selected by setting TMC bits TMC2 to TMC0 to all
1s (111). TCC counts up or down at the rising or falling edge of the input at pin TMIC.
When timer C is used to count external event inputs, bit IRQ2 in port mode register 1 (PMR1)
should be set to 1, and bit IEN2 in interrupt enable register 1 (IENR1) should be cleared to 0 to
disable IRQ2 interrupt requests.
TCC Up/Down Control by Hardware: The counting direction of timer C can be controlled by
input at pin UD. When bit TMC6 in TMC is set to 1, high-level input at the UD pin selects downcounting, while low-level input selects up-counting.
When using input at pin UD for this control function, set the UD bit in port mode register 2
(PMR2) to 1.
193
9.4.4
Timer C Operation States
Table 9.10 summarizes the timer C operation states.
Table 9.10 Timer C Operation States
Subactive
Subsleep
Reset Functions Functions Halted
Functions/
Halted*
Functions/ Halted
Halted*
TCC Auto reload Reset Functions Functions Halted
Functions/
Halted*
Functions/ Halted
Halted*
TMC
Functions
Retained
Operation Mode
Reset Active
TCC Interval
Sleep
Reset Functions Retained
Watch
Retained
Standby
Retained
Note: When φ W /4 is selected as the internal clock of TCC in active mode or sleep mode, the
internal clock is not synchronous with the system clock, so it is synchronized by a
synchronizing circuit. This may result in a maximum error of 1/φ (s) in the count cycle.
* When timer C is operated in subactive mode or subsleep mode, either an external clock
or the φ W /4 internal clock must be selected. The counter will not operate in these modes if
another clock is selected. If the internal φW /4 clock is selected when φ W /8 is being used as
the subclock φ SUB, the lower 2 bits of the counter will operate on the same cycle, with the
least significant bit not being counted.
9.5
Timer F
9.5.1
Overview
Timer F is a 16-bit timer with an output compare function. Compare match signals can be used to
reset the counter, request an interrupt, or toggle the output. Timer F can also be used for external
event counting, and can operate as two independent 8-bit timers, timer FH and timer FL.
Features
Features of timer F are given below.
• Choice of four internal clock sources (φ/32, φ/16, φ/4, φ/2) or an external clock (can be used as
an external event counter).
• Output from pin TMOFH is toggled by one compare match signal (the initial value of the
toggle output can be set).
• Counter can be reset by the compare match signal.
• Two interrupt sources: counter overflow and compare match.
• Can operate as two independent 8-bit timers (timer FH and timer FL) in 8-bit mode.
194
Timer FH
• 8-bit timer (clocked by timer FL overflow signals when timer F operates as a 16-bit timer).
• Choice of four internal clocks (φ/32, φ/16, φ/4, φ/2).
• Output from pin TMOFH is toggled by one compare match signal (the initial value of the
toggle output can be set).
• Counter can be reset by the compare match signal.
• Two interrupt sources: counter overflow and compare match.
Timer FL
• 8-bit timer/event counter
• Choice of four internal clocks (φ/32, φ/16, φ/4, φ/2) or event input at pin TMIF.
• Output from pin TMOFL is toggled by one compare match signal (the initial value of the
toggle output can be set).
• Counter can be reset by the compare match signal.
• Two interrupt sources: counter overflow and compare match.
195
Block Diagram
Figure 9.4 shows a block diagram of timer F.
φ
PSS
IRRTFL
TCRF
TCFL
TMIF
Toggle
circuit
Compare circuit
Internal data bus
TMOFL
OCRFL
TCFH
TMOFH
Toggle
circuit
Compare circuit
Match
OCRFH
TCSRF
Notation:
TCRF:
TCSRF:
TCFH:
TCFL:
OCRFH:
OCRFL:
IRRTFH:
IRRTFL:
PSS:
Timer control register F
Timer control status register F
8-bit timer counter FH
8-bit timer counter FL
Output compare register FH
Output compare register FL
Timer FH interrupt request flag
Timer FL interrupt request flag
Prescaler S
Figure 9.4 Block Diagram of Timer F
196
IRRTFH
Pin Configuration
Table 9.11 shows the timer F pin configuration.
Table 9.11 Pin Configuration
Name
Abbrev.
I/O
Function
Timer F event input
TMIF
Input
Event input to TCFL
Timer FH output
TMOFH
Output
Timer FH toggle output
Timer FL output
TMOFL
Output
Timer FL toggle output
Register Configuration:
Table 9.12 shows the register configuration of timer F.
Table 9.12 Timer F Registers
Name
Abbrev.
R/W
Initial Value
Address
Timer control register F
TCRF
W
H'00
H'FFB6
Timer control/status register F
TCSRF
R/W
H'00
H'FFB7
8-bit timer counter FH
TCFH
R/W
H'00
H'FFB8
8-bit timer counter FL
TCFL
R/W
H'00
H'FFB9
Output compare register FH
OCRFH
R/W
H'FF
H'FFBA
Output compare register FL
OCRFL
R/W
H'FF
H'FFBB
9.5.2
Register Descriptions
16-Bit Timer Counter (TCF)
8-Bit Timer Counter (TCFH)
8-Bit Timer Counter (TCFL)
TCF
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
TCFH
TCFL
197
TCF is a 16-bit read/write up-counter consisting of two cascaded 8-bit timer counters, TCFH and
TCFL. TCF can be used as a 16-bit counter, with TCFH as the upper 8 bits and TCFL as the lower
8 bits of the counter, or TCFH and TCFL can be used as independent 8-bit counters.
TCFH and TCFL can be read and written by the CPU, but in 16-bit mode, data transfer with the
CPU takes place via a temporary register (TEMP). For details see 9.5.3, Interface with the CPU.
Upon reset, TCFH and TCFL are each initialized to H'00.
• 16-bit mode (TCF)
16-bit mode is selected by clearing bit CKSH2 to 0 in timer control register F (TCRF). The
TCF input clock is selected by TCRF bits CKSL2 to CKSL0.
Timer control status register F (TCSRF) can be set so that counter TCF will be cleared by
compare match.
When TCF overflows from H'FFFF to H'0000, the overflow flag (OVFH) in TCSRF is set to 1.
If bit OVIEH in TCSRF is set to 1 when an overflow occurs, bit IRRTFH in interrupt request
register 2 (IRR2) will be set to 1; and if bit IENTFH in interrupt enable register 2 (IENR2) is
set to 1, a CPU interrupt will be requested.
• 8-bit mode (TCFH, TCFL)
When bit CKSH2 in timer control register F (TCRF) is set to 1, timer F functions as two
separate 8-bit counters, TCFH and TCFL. The TCFH (TCFL) input clock is selected by TCRF
bits CKSH2 to CKSH0 (CKSL2 to CKSL0).
TCFH (TCFL) can be cleared by a compare match signal. This designation is made in bit
CCLRH (CCLRL) in TCSRF.
When TCFH (TCFL) overflows from H'FF to H'00, the overflow flag OVFH (OVFL) in
TCSRF is set to 1. If bit OVIEH (OVIEL) in TCSRF is set to 1 when an overflow occurs, bit
IRRTFH (IRRTHL) in interrupt request register 2 (IRR2) will be set to 1; and if bit IENTFH
(IENTFL) in interrupt enable register 2 (IENR2) is set to 1, a CPU interrupt will be requested.
16-Bit Output Compare Register (OCRF)
8-Bit Output Compare Register (OCRFH)
8-Bit Output Compare Register (OCRFL)
OCRF
Bit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Initial value
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Read/Write
R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W
OCRFH
198
OCRFL
OCRF is a 16-bit read/write output compare register consisting of two 8-bit read/write registers
OCRFH and OCRFL. It can be used as a 16-bit output compare register, with OCRFH as the
upper 8 bits and OCRFL as the lower 8 bits of the register, or OCRFH and OCRFL can be used as
independent 8-bit registers.
OCRFH and OCRFL can be read and written by the CPU, but in 16-bit mode, data transfer with
the CPU takes place via a temporary register (TEMP). For details see 9.5.3, Interface with the
CPU.
Upon reset, OCRFH and OCRFL are each initialized to H'FF.
• 16-bit mode (OCRF)
16-bit mode is selected by clearing bit CKSH2 to 0 in timer control register F (TCRF). The
OCRF contents are always compared with the 16-bit timer counter (TCF). When the contents
match, the compare match flag (CMFH) in TCSRF is set to 1. Also, IRRTFH in interrupt
request register 2 (IRR2) is set to 1. If bit IENTFH in interrupt enable register 2 (IENR2) is set
to 1, a CPU interrupt is requested.
Output for pin TMOFH can be toggled by compare match. The output level can also be set to
high or low by bit TOLH of timer control register F (TCRF).
• 8-bit mode (OCRFH, OCRFL)
Setting bit CKSH2 in TCRF to 1 results in two 8-bit registers, OCRFH and OCRFL.
The OCRFH contents are always compared with TCFH, and the OCRFL contents are always
compared with TCFL. When the contents match, the compare match flag (CMFH or CMFL) in
TCSRF is set to 1. Also, bit IRRTFH (IRRTFL) in interrupt request register 2 (IRR2) set to 1.
If bit IENTFH (IENTFL) in interrupt enable register 2 (IENR2) is set to 1 at this time, a CPU
interrupt is requested.
The output at pin TMOFH (TMOFL) can be toggled by compare match. The output level can
also be set to high or low by bit TOLH (TOLL) of the timer control register (TCRF).
Timer Control Register F (TCRF)
Bit
7
6
5
4
3
2
1
0
TOLH
CKSH2
CKSH1
CKSH0
TOLL
CKSL2
CKSL1
CKSL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
TCRF is an 8-bit write-only register. It is used to switch between 16-bit mode and 8-bit mode, to
select among four internal clocks and an external clock, and to select the output level at pins
TMOFH and TMOFL.
Upon reset, TCRF is initialized to H'00.
199
Bit 7—Toggle Output Level H (TOLH): Bit 7 sets the output level at pin TMOFH. The setting
goes into effect immediately after this bit is written.
Bit 7: TOLH
Description
0
Low level
1
High level
(initial value)
Bits 6 to 4—Clock Select H (CKSH2 to CKSH0): Bits 6 to 4 select the input to TCFH from four
internal clock signals or the overflow of TCFL.
Bit 6: CKSH2
Bit 5: CKSH1
Bit 4: CKSH0
Description
0
*
*
16-bit mode selected. TCFL overflow signals
are counted
(initial value)
1
0
0
Internal clock: φ /32
1
Internal clock: φ /16
0
Internal clock: φ /4
1
Internal clock: φ /2
1
Note: * Don’t care
Bit 3—Toggle Output Level L (TOLL): Bit 3 sets the output level at pin TMOFL. The setting
goes into effect immediately after this bit is written.
Bit 3: TOLL
Description
0
Low level
1
High level
(initial value)
Bits 2 to 0—Clock Select L (CKSL2 to CKSL0): Bits 2 to 0 select the input to TCFL from four
internal clock signals or external event input.
200
Bit 2: CKSL2
Bit 1: CKSL1
Bit 0: CKSL0
Description
0
*
*
External event (TMIF). Rising or falling edge
is counted* 1
(initial value)
1
0
0
Internal clock: φ /32
1
Internal clock: φ /16
0
Internal clock: φ /4
1
Internal clock: φ /2
1
Note: 1. The edge of the external event signal is selected by bit IEG3 in the IRQ edge select
register (IEGR). See 3.3.2, for details on the IRQ edge select register. Note that
switching the TMIF pin function by changing bit IRQ3 in port mode register 1 (PMR1)
from 0 to 1 or from 1 to 0 while the TMIF pin is at the low level may cause the timer F
counter to be incremented.
* Don’t care
Timer Control/Status Register F (TCSRF)
Bit
7
6
5
4
3
2
1
0
OVFH
CMFH
OVIEH
CCLRH
OFL
CMFL
OVIEL
CCLRL
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W*
R/W*
R/W
R/W
R/W*
R/W*
R/W
R/W
Note: * Only 0 can be written, to clear flag.
TCSRF is an 8-bit read/write register. It is used for counter clear selection, overflow and compare
match indication, and enabling of interrupts caused by timer overflow.
Upon reset, TCSRF is initialized to H'00.
Bit 7—Timer overflow flag H (OVFH): Bit 7 is a status flag indicating TCFH overflow (H'FF to
H'00). This flag is set by hardware and cleared by software. It cannot be set by software.
Bit 7: OVFH
Description
0
Clearing conditions:
After reading OVFH = 1, cleared by writing 0 to OVFH
1
(initial value)
Setting conditions:
Set when the value of TCFH goes from H'FF to H'00
Bit 6—Compare Match Flag H (CMFH): Bit 6 is a status flag indicating a compare match
between TCFH and OCRFH. This flag is set by hardware and cleared by software. It cannot be set
by software.
201
Bit 6: CMFH
Description
0
Clearing conditions:
After reading CMFH = 1, cleared by writing 0 to CMFH
1
(initial value)
Setting conditions:
Set when the TCFH value matches OCRFH value
Bit 5—Timer Overflow Interrupt Enable H (OVIEH): Bit 5 enables or disables TCFH
overflow interrupts.
Bit 5: OVIEH
Description
0
TCFH overflow interrupt disabled
1
TCFH overflow interrupt enabled
(initial value)
Bit 4—Counter Clear H (CCLRH): In 16-bit mode, bit 4 selects whether or not TCF is cleared
when a compare match occurs between TCF and OCRF.
In 8-bit mode, bit 4 selects whether or not TCFH is cleared when a compare match occurs between
TCFH and OCRFH.
Bit 4: CCLRH
Description
0
16-bit mode: TCF clearing by compare match disabled
(initial value)
8-bit mode: TCFH clearing by compare match disabled
1
16-bit mode: TCF clearing by compare match enabled
8-bit mode: TCFH clearing by compare match enabled
Bit 3—Timer Overflow Flag L (OVFL): Bit 3 is a status flag indicating TCFL overflow (H'FF
to H'00). This flag is set by hardware and cleared by software. It cannot be set by software.
Bit 3: OVFL
Description
0
Clearing conditions:
After reading OVFL = 1, cleared by writing 0 to OVFL
1
(initial value)
Setting conditions:
Set when the value of TCFL goes from H'FF to H'00
Bit 2—Compare Match Flag L (CMFL): Bit 2 is a status flag indicating a compare match
between TCFL and OCRFL. This flag is set by hardware and cleared by software. It cannot be set
by software.
202
Bit 2: CMFL
Description
0
Clearing conditions:
After reading CMFL = 1, cleared by writing 0 to CMFL
1
(initial value)
Setting conditions:
Set when the TCFL value matches the OCRFL value
Bit 1—Timer Overflow Interrupt Enable L (OVIEL): Bit 1 enables or disables TCFL overflow
interrupts.
Bit 1: OVIEL
Description
0
TCFL overflow interrupt disabled
1
TCFL overflow interrupt enabled
(initial value)
Bit 0—Counter Clear L (CCLRL): Bit 0 selects whether or not TCFL is cleared when a
compare match occurs between TCFL and OCRFL.
Bit 0: CCLRL
Description
0
TCFL clearing by compare match disabled
1
TCFL clearing by compare match enabled
9.5.3
(initial value)
Interface with the CPU
TCF and OCRF are 16-bit read/write registers, whereas the data bus between the CPU and on-chip
peripheral modules has an 8-bit width. For this reason, when the CPU accesses TCF or OCRF, it
makes use of an 8-bit temporary register (TEMP).
In 16-bit mode, when reading or writing TCF or writing OCRF, always use two consecutive byte
size MOV instructions, and always access the upper byte first. Data will not be transferred
properly if only the upper byte or only the lower byte is accessed. In 8-bit mode there is no such
restriction on the order of access.
Write Access: When the upper byte is written, the upper-byte data is loaded into the TEMP
register. Next when the lower byte is written, the data in TEMP goes to the upper byte of the
register, and the lower-byte data goes directly to the lower byte of the register. Figure 9.5 shows a
TCF write operation when H'AA55 is written to TCF.
203
CPU
(H'AA)
Bus interface
Upper byte write
Internal data bus
TEMP
(H'AA)
TCFH
(
)
TCFL
(
)
CPU
(H'55)
Bus interface
Lower byte write
Internal data bus
TEMP
(H'AA)
TCFH
(H'AA)
TCFL
(H'55)
Figure 9.5 TCF Write Operation (CPU → TCF)
Read Access: When the upper byte of TCF is read, the upper-byte data is sent directly to the CPU,
and the lower byte is loaded into TEMP. Next when the lower byte is read, the lower byte in
TEMP is sent to the CPU.
When the upper byte of OCRF is read, the upper-byte data is sent directly to the CPU. Next when
the lower byte is read, the lower-byte data is sent directly to the CPU.
204
Figure 9.6 shows a TCF read operation when H'AAFF is read from TCF.
CPU
(H'AA)
Bus interface
Upper byte read
Internal data bus
TEMP
(H'FF)
TCFH
(H'AA)
TCFL
(H'FF)
CPU
(H'FF)
Bus interface
Lower byte read
Internal data bus
TEMP
(H'FF)
TCFH
(AB)*
TCFL
(00)*
Note: * Becomes H'AB00 if counter is incremented once.
Figure 9.6 TCF Read Operation (TCF → CPU)
205
9.5.4
Timer Operation
Timer F is a 16-bit timer/counter that increments with each input clock. The value set in output
compare register F is constantly compared with the value of timer counter F, and when they match
the counter can be cleared, an interrupt can be requested, and the port output can be toggled. Timer
F can also be used as two independent 8-bit timers.
Timer F Operation: Timer F can operate in either 16-bit timer mode or 8-bit timer mode. These
modes are described below.
• 16-bit timer mode
Timer F operates in 16-bit timer mode when the CKSH2 bit in timer control register F (TCRF)
is cleared to 0.
A reset initializes timer counter F (TCF) to H'0000, output compare register F (OCRF) to
H'FFFF, and timer control register F (TCRF) and timer control status register F (TCSRF) to
H'00. Timer F begins counting external event input signals (TMIF). The edge of the external
event signal is selected by the IEG3 bit in the IRQ edge select register (IEGR).
Any of four internal clocks output by prescaler S, or an external clock, can be selected as the
timer F operating clock by bits CKSL2 to CKSL0 in TCRF.
TCF is continuously compared with the contents of OCRF. When these two values match, the
CMFH bit in TCSRF is set to 1. At this time if IENTFH of IENR2 is 1, a CPU interrupt is
requested and the output at pin TMOFH is toggled. If the CCLRH bit in TCSRF is 1, timer F is
cleared. The output at pin TMOFH can also be set by the TOLH bit in TCRF.
If timer F overflows (from H'FFFF to H'0000), the OVFH bit in TCSRF is set. At this time, if
the OVIEH bit in TCSRF and the IENTFH bit in IENR2 are both 1, a CPU interrupt is
requested.
• 8-bit timer mode
When the CKSH2 bit in TCRF is set to 1, timer F operates as two independent 8-bit timers,
TCFH and TCFL. The input clock of TCFH/TCFL is selected by bits CKSH2 to
CKSH0/CKSL2 to CKSL0 in TCRF.
When TCFH/TCFL and the contents of OCRFH/OCRFL match, the CMFH/CMFL bit in
TCSRF is set to 1. If the IENTFH/IENTFL bit in IENR2 is 1, a CPU interrupt is requested and
the output at pin TMOFH/TMOFL is toggled. If the CCLRH/CCLRL bit in TCRF is 1,
TCFH/TCFL is cleared. The output at pin TMOFH/TMOFL can also be set by the
TOLH/TOLL bit in TCRF.
When TCFH/TCFL overflows from H'FF to H'00, the OVFH/OVFL bit in TCSRF is set to 1.
At this time, if the OVIEH/OVIEL bit in TCSRF and the IENTFH/IENTFL bit in IENR2 are
both 1, a CPU interrupt is requested.
206
TCF Count Timing: TCF is incremented by each pulse of the input clock (internal or external
clock).
• Internal clock
The settings of bits CKSH2 to CKSH0 or bits CKSL2 to CKSL0 in TCRF select one of four
internal clock signals divided from the system clock (φ), namely, φ/32, φ/16, φ/4, or φ/2.
• External clock
External clock input is selected by clearing bit CKSL2 to 0 in TCRF. Either rising or falling
edges of the clock input can be counted. The edge of an external event is selected by bit IEG3
in the interrupt controller’s IEGR register. An external event pulse width of at least two system
clock (φ) cycles is necessary for correct operation of the counter.
TMOFH and TMOFL Output Timing: The outputs at pins TMOFH and TMOFL are the values
set in bits TOLH and TOLL in TCRF. When a compare match occurs, the output value is inverted.
Figure 9.7 shows the output timing.
ø
TMIF
(when IEG3 = 1)
Count input
clock
TCF
OCRF
N
N+1
N
N
N+1
N
Compare match
signal
TMOFH, TMOFL
Figure 9.7 TMOFH, TMOFL Output Timing
TCF Clear Timing: TCF can be cleared at compare match with OCRF.
Timer Overflow Flag (OVF) Set Timing: OVF is set to 1 when TCF overflows (goes from
H'FFFF to H'0000).
207
Compare Match Flag Set Timing: The compare match flags (CMFH or CMFL) are set to 1
when a compare match occurs between TCF and OCRF. A compare match signal is generated in
the final state in which the values match (when TCF changes from the matching count value to the
next value). When TCF and OCRF match, a compare match signal is not generated until the next
counter clock pulse.
Timer F Operation States: Table 9.13 summarizes the timer F operation states.
Table 9.13 Timer F Operation States
Operation Mode
Reset
Active
Sleep
Watch
Subactive
Subsleep
Standby
TCF
Reset
Functions
Functions
Halted
Halted
Halted
Halted
OCRF
Reset
Functions
Retained
Retained
Retained
Retained
Retained
TCRF
Reset
Functions
Retained
Retained
Retained
Retained
Retained
TCSRF
Reset
Functions
Retained
Retained
Retained
Retained
Retained
9.5.5
Application Notes
The following conflicts can arise in timer F operation.
• 16-bit timer mode
The output at pin TMOFH toggles when all 16 bits match and a compare match signal is
generated. If the compare match signal occurs at the same time as new data is written in TCRF
by a MOV instruction, however, the new value written in bit TOLH will be output at pin
TMOFH. The TMOFL output in 16-bit mode is indeterminate, so this output should not be
used. Use the pin as a general input or output port.
If an OCRFL write occurs at the same time as a compare match signal, the compare match
signal is inhibited. If a compare match occurs between the written data and the counter value,
however, a compare match signal will be generated at that point. The compare match signal is
output in synchronization with the TCFL clock, so if this clock is stopped no compare match
signal will be generated, even if a compare match occurs.
Compare match flag CMFH is set when all 16 bits match and a compare match signal is
generated; bit CMFL is set when the setting conditions are met for the lower 8 bits.
The overflow flag (OVFH) is set when TCF overflows; bit OVFL is set if the setting
conditions are met when the lower 8 bits overflow. If a write to TCFL occurs at the same time
as an overflow signal, the overflow signal is not output.
208
• 8-bit timer mode
 TCFH and OCRFH
The output at pin TMOFH toggles when there is a compare match. If the compare match
signal occurs at the same time as new data is written in TCRF by a MOV instruction,
however, the new value written in bit TOLH will be output at pin TMOFH.
If an OCRFH write occurs at the same time as a compare match signal, the compare match
signal is inhibited. If a compare match occurs between the written data and the counter
value, however, a compare match signal will be generated at that point. The compare match
signal is output in synchronization with the TCFH clock.
If a TCFH write occurs at the same time as an overflow signal, the overflow signal is not
output.
 TCFL and OCRFL
The output at pin TMOFL toggles when there is a compare match. If the compare match
signal occurs at the same time as new data is written in TCRF by a MOV instruction,
however, the new value written in bit TOLL will be output at pin TMOFL.
If an OCRFL write occurs at the same time as a compare match signal, the compare match
signal is inhibited. If a compare match occurs between the written data and the counter
value, however, a compare match signal will be generated at that point. The compare match
signal is output in synchronization with the TCFL clock, so if this clock is stopped no
compare match signal will be generated, even if a compare match occurs.
If a TCFL write occurs at the same time as an overflow signal, the overflow signal is not
output.
209
9.6
Timer G
9.6.1
Overview
Timer G is an 8-bit timer, with input capture functions for separately capturing the rising edge and
falling edge of pulses input at the input capture pin (input capture input signal). Timer G has a
built-in noise canceller circuit that can eliminate high-frequency noise from the input capture
signal, enabling accurate measurement of its duty cycle. When timer G is not used for input
capture, it functions as an 8-bit interval timer.
Features
Features of timer G are given below.
• Choice of four internal clock sources (φ/64, φ/32, φ/2, φW/2)
• Input capture function
Separate input capture registers are provided for the rising and falling edges.
• Counter overflow detection
Can detect whether overflow occurred when the input capture signal was high or low.
• Choice of counter clear triggers
The counter can be cleared at the rising edge, falling edge, or both edges of the input capture
signal.
• Two interrupt sources
Interrupts can be requested by input capture and by overflow. For input capture, the rising or
falling edge can be selected.
• Built-in noise-canceller circuit
The noise canceller circuit can eliminate high-frequency noise in the input capture signal.
• Operates in subactive and subsleep modes
When φW/2 is selected as the internal clock source, timer G can operate in the subactive and
subsleep modes.
210
Block Diagram
Figure 9.8 shows a block diagram of timer G.
φ
PSS
TMG
φ W/2
TMIG
Internal data bus
Level
sense
circuit
ICRGF
Edge
sense
circuit
Noise
canceller
circuit
TCG
NCS
ICRGR
IRRTG
Notation:
Timer mode register G
TMG:
Timer counter G
TCG:
ICRGF: Input capture register GF
ICRGR: Input capture register GR
IRRTG: Timer G interrupt request flag
Noise canceller select
NCS:
Prescaler S
PSS:
Figure 9.8 Block Diagram of Timer G
Pin Configuration
Table 9.14 shows the timer G pin configuration.
Table 9.14 Pin Configuration
Name
Abbrev.
I/O
Function
Timer G capture input
TMIG
Input
Timer G capture input
211
Register Configuration
Table 9.15 shows the register configuration of timer G.
Table 9.15 Timer G Registers
Name
Abbrev.
R/W
Initial Value
Address
Timer mode register G
TMG
R/W
H'00
H'FFBC
Timer counter G
TCG
—
H'00
—
Input capture register GF
ICRGF
R
H'00
H'FFBD
Input capture register GR
ICRGR
R
H'00
H'FFBE
9.6.2
Register Descriptions
Timer Counter G (TCG)
Bit
7
6
5
4
3
2
1
0
TCG7
TCG6
TCG5
TCG4
TCG3
TCG2
TCG1
TCG0
Initial value
0
0
0
0
0
0
0
0
Read/Write
—
—
—
—
—
—
—
—
Timer counter G (TCG) is an 8-bit up-counter which is incremented by an input clock. The input
clock signal is selected by bits CKS1 and CKS0 in timer mode register G (TMG).
To use TCG as an input capture timer, set bit TMIG to 1 in PMR1; to use TCG as an interval
timer, clear bit TMIG to 0.* When TCG is used as an input capture timer, the TCG value can be
cleared at the rising edge, falling edge, or both edges of the input capture signal, depending on
settings in TMG.
When TCG overflows (goes from H'FF to H'00), if the timer overflow interrupt enable bit (OVIE)
is set to 1 in TMG, bit IRRTG in interrupt request register 2 (IRR2) is set to 1. If in addition bit
IENTG in interrupt enable register 2 (IENR2) is set to 1, a CPU interrupt is requested. Details on
interrupts are given in 3.3, Interrupts.
TCG cannot be read or written by the CPU.
Upon reset, TCG is initialized to H'00.
Note: * An input capture signal may be generated when TMIG is rewritten.
212
Input capture register GF (ICRGF)
Bit
7
6
5
4
3
2
1
0
ICRGF7 ICRGF6 ICRGF5 ICRGF4 ICRGF3 ICRGF2 ICRGF1 ICRGF0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
ICRGF is an 8-bit read-only register. When the falling edge of the input capture signal is detected,
the TCG value at that time is transferred to ICRGF. If the input capture interrupt select bit (IIEGS)
is set to 1 in TMG, bit IRRTG in interrupt request register 2 (IRR2) is set to 1. If in addition bit
IENTG in interrupt enable register 2 (IENR2) is set to 1, a CPU interrupt is requested. Details on
interrupts are given in 3.3, Interrupts.
To ensure proper input capture when the noise canceller is not used, the pulse width of the input
capture signal should be at least 2φ or 2φSUB.
Upon reset, ICRGF is initialized to H'00.
Input Capture Register GR (ICRGR)
Bit
7
6
5
4
3
2
1
0
ICRGR7 ICRGR6 ICRGR5 ICRGR4 ICRGR3 ICRGR2 ICRGR1 ICRGR0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
ICRGR is an 8-bit read-only register. When the rising edge of the input capture signal is detected,
the TCG value at that time is sent to ICRGR. If the IIEGS bit is cleared to 0 in TMG, bit IRRTG
in interrupt request register 2 (IRR2) is set to 1. If in addition bit IENTG in interrupt enable
register 2 (IENR2) is set to 1, a CPU interrupt is requested. Details on interrupts are given in 3.3,
Interrupts.
To ensure proper input capture when the noise canceller is not used, the pulse width of the input
capture signal should be at least 2φ or 2φSUB.
Upon reset, ICRGR is initialized to H'00.
213
Timer Bode Register G (TMG)
Bit
7
6
5
4
3
2
1
0
OVFH
OVFL
OVIE
IIEGS
CCLR1
CCLR0
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W*
R/W*
R/W
R/W
R/W
R/W
R/W
R/W
Note: * Only 0 can be written, to clear flag.
TMG is an 8-bit read/write register. It controls the choice of four input clocks, counter clear
selection, and edge selection for input capture interrupt requests. It also indicates overflow status
and enables or disables overflow interrupt requests.
Upon reset, TMG is initialized to H'00.
Bit 7—Timer Overflow Flag H (OVFH): Bit 7 is a status flag indicating that TCG overflowed
(from H'FF to H'00) when the input capture signal was high. This flag is set by hardware and
cleared by software. It cannot be set by software.
Bit 7: OVFH
Description
0
Clearing conditions:
After reading OVFH = 1, cleared by writing 0 to OVFH
1
(initial value)
Setting conditions:
Set when the value of TCG overflows from H'FF to H'00
Bit 6—Timer Overflow Flag L (OVFL): Bit 6 is a status flag indicating that TCG overflowed
(from H'FF to H'00) when the input capture signal was low, or in interval timer operation. This
flag is set by hardware and cleared by software. It cannot be set by software.
Bit 6: OVFL
Description
0
Clearing conditions:
After reading OVFL = 1, cleared by writing 0 to OVFL
1
(initial value)
Setting conditions:
Set when the value of TCG overflows from H'FF to H'00
Bit 5—Timer Overflow Interrupt Enable (OVIE): Bit 5 enables or disables TCG overflow
interrupts.
Bit 5: OVIE
Description
0
TCG overflow interrupt disabled
1
TCG overflow interrupt enabled
214
(initial value)
Bit 4—Input Capture Interrupt Edge Select (IIEGS): Bit 4 selects the input signal edge at
which input capture interrupts are requested.
Bit 4: IIEGS
Description
0
Interrupts are requested at the rising edge of the input capture signal
(initial value)
1
Interrupts are requested at the falling edge of the input capture signal
Bits 3, 2—Counter Clear 1, 0 (CCLR1, CCLR0): Bits 3 and 2 designate whether TCG is
cleared at the rising, falling, or both edges of the input capture signal, or is not cleared.
Bit 3: CCLR1
Bit 2: CCLR0
Description
0
0
TCG is not cleared
1
TCG is cleared at the falling edge of the input capture
signal
0
TCG is cleared at the rising edge of the input capture
signal
1
TCG is cleared at both edges of the input capture signal
1
(initial value)
Bits 1, 0—Clock Select (CKS1, CKS0): Bits 1 and 0 select the clock input to TCG from four
internal clock signals.
Bit 1: CKS1
Bit 0: CKS0
Description
0
0
Internal clock: φ /64
1
Internal clock: φ /32
0
Internal clock: φ /2
1
Internal clock: φ W /2
1
9.6.3
(initial value)
Noise Canceller Circuit
The noise canceller circuit built into the H8/3834 Series is a digital low-pass filter that rejects
high-frequency pulse noise in the input at the input capture pin. The noise canceller circuit is
enabled by the noise canceller select (NCS)* bit in port mode register 2 (PMR2).
Figure 9.9 shows a block diagram of the noise canceller circuit.
215
Sampling clock
Input capture
signal
C
D Q
latch
C
D Q
latch
C
D Q
latch
C
D Q
latch
C
D Q
latch
Match
detection
circuit
Noise
canceller
output
∆t
Sampling clock
∆ t: Selected by bits CKS1, CKS0.
Figure 9.9 Block Diagram of Noise Canceller Circuit
The noise canceller consists of five latch circuits connected in series, and a match detection
circuit. When the noise canceller function is disabled (NCS = 0), the system clock is selected as
the sampling clock. When the noise canceller is enabled (NCS = 1), the internal clock selected by
bits CKS1 and CKS0 in TMG becomes the sampling clock. The input signal is sampled at the
rising edge of this clock pulse. Data is considered correct when the outputs of all five latch circuits
match. If they do not match, the previous value is retained. Upon reset, the noise canceller output
is initialized after the falling edge of the input capture signal has been sampled five times.
Accordingly, after the noise canceller function is enabled, pulses that have a pulse width five times
greater than the sampling clock will be recognized as input capture signals.
If the noise canceller circuit is not used, the input capture signal pulse width must be at least 2φ or
2φSUB in order to ensure proper input capture operation.
Note: * Rewriting the NCS bit may cause an internal input capture signal to be generated.
Figure 9.10 shows a typical timing diagram for the noise canceller circuit. In this example, a highlevel input at the input capture pin is rejected as noise because its pulse width is less than five
sampling clock φ cycles.
216
Input capture
input signal
Sampling
clock
Noise canceller
output
Rejected as noise
Figure 9.10 Noise Canceller Circuit Timing (Example)
9.6.4
Timer Operation
Timer G is an 8-bit timer with input capture and interval timer functions.
Timer G Functions: Timer G is an 8-bit timer/counter that functions as an input capture timer or
an interval timer. These two functions are described below.
• Input capture timer operation
Timer G functions as an input capture timer when bit TMIG of port mode register 1 (PMR1) is
set to 1.*
At reset, timer mode register G (TMG), timer counter G (TCG), input capture register GF
(ICRGF), and input capture register GR (ICRGR) are all initialized to H'00.
Immediately after reset, TCG begins counting an internal clock with a frequency of φ divided
by 64 (φ/64). Four other internal clocks can be selected using bits CKS1 and CKS0 of TMG.
At the rising edge/falling edge of the input capture signal input to pin TMIG, the value of TCG
is copied into ICRGR/ICRGF. If the input edge is the same as the edge selected by the IIEGS
bit of TMG, then bit IRRTG is set to 1 in IRR2. If bit IENTG is also set to 1 in IENR2, a CPU
interrupt is requested. For details on interrupts, see section 3.3, Interrupts.
TCG can be cleared to 0 at the rising edge, falling edge, or both edges of the input capture
signal as determined with bits CCLR1 and CCLR0 of TMG. If TCG overflows while the input
capture signal is high, bit OVFH of TMG is set. If TCG overflows while the input capture
signal is low, bit OVFL of TMG is set. When either of these bits is set, if bit OVIE of TMG is
currently set to 1, then bit IRRTG is set to 1 in IRR2. If bit IENTG is also set to 1 in IENR2,
then timer G requests a CPU interrupt. For further details see 3.3, Interrupts.
Timer G has a noise canceller circuit that rejects high-frequency pulse noise in the input to pin
TMIG. See 9.6.3, Noise Canceller Circuit, for details.
217
Note: * Rewriting the TMIG bit may cause an internal input capture signal to be generated.
• Interval timer operation
Timer G functions as an interval timer when bit TMIG is cleared to 0 in PMR1. Following a
reset, TCG starts counting cycles of the φ/64 internal clock. This is one of four internal clock
sources that can be selected by bits CKS1 and CKS0 of TMG. TCG counts up according to the
selected clock source. When it overflows from H'FF to H'00, bit OVFL of TMG is set to 1. If
bit OVIE of TMG is currently set to 1, then bit IRRTG is set to 1 in IRR2. If bit IENTG is also
set to 1 in IENR2, then timer G requests a CPU interrupt. For further details see 3.3, Interrupts.
Count Timing: TCG is incremented by input pulses from an internal clock. TMG bits CKS1 and
CKS0 select one of four internal clocks ( φ/64, φ/32, φ/2, φW/2) derived by dividing the system
clock (φ) or the watch clock (φW).
Timing of Internal Input Capture Signals:
• Timing with noise canceller function disabled
Separate internal input capture signals are generated from the rising and falling edges of the
external input signal.
Figure 9.11 shows the timing of these signals.
External input
capture signal
Internal input
capture signal F
Internal input
capture signal R
Figure 9.11 Input Capture Signal Timing (Noise Canceller Function Disabled)
• Timing with noise canceller function enabled
When input capture noise cancelling is enabled, the external input capture signal is routed via
the noise canceller circuit, so the internal signals are delayed from the input edge by five
sampling clock cycles. Figure 9.12 shows the timing.
218
External input
capture signal
Sampling clock
Noise canceller
circuit output
Internal input
capture signal R
Figure 9.12 Input Capture Signal Timing (Noise Canceller Function Enabled)
Timing of Input Capture: Figure 9.13 shows the input capture timing in relation to the internal
input capture signal.
Internal input
capture signal
TCG
Input capture
register
N –1
N
H'XX
N +1
N
Figure 9.13 Input Capture Timing
219
TCG Clear Timing: TCG can be cleared at the rising edge, falling edge, or both edges of the
external input capture signal. Figure 9.14 shows the timing for clearing at both edges.
External input
capture signal
Internal input
capture signal F
Internal input
capture signal R
TCG
N
H'00
N
H'00
Figure 9.14 TCG Clear Timing
Timer G Operation States: Table 9.16 summarizes the timer G operation states.
Table 9.16 Timer G Operation States
Subactive
Subsleep
Functions/
Halted*
Functions/ Halted
Halted*
Reset
Functions* Functions* Retained Functions/
Halted*
Functions/ Halted
Halted*
ICRGF
Reset
Functions* Functions* Retained Functions/
Halted*
Functions/ Retained
Halted*
ICRGR
Reset
Functions* Functions* Retained Functions/
Halted*
Functions/ Retained
Halted*
TMG
Reset
Functions
Retained
Operation Mode
Reset
Active
Sleep
TCG
Input
capture
Reset
Functions* Functions* Halted
Interval
Retained
Watch
Retained Functions
Standby
Retained
Note: * In active mode and sleep mode, if φW /2 is selected as the TCG internal clock, since the
system clock and internal clock are not synchronized with each other, a synchronization
circuit is used. This may result in a count cycle error of up to 1/φ (s). In subactive mode and
subsleep mode, if φ W /2 is selected as the TCG internal clock, regardless of the subclock
φ / SUB (φW /2, φ W /4, φ W /8) TCG and the noise canceller circuit run on an internal clock of φW /2. If
any other internal clock is chosen, TCG and the noise canceller circuit will not run, and the
input capture function will not operate.
220
9.6.5
Application Notes
Input Clock Switching and TCG Operation: Depending on when the input clock is switched,
there will be cases in which TCG is incremented in the process. Table 9.17 shows the relation
between internal clock switchover timing (selected in bits CKS1 and CKS0) and TCG operation.
If an internal clock (derived from the system clock φ or subclock φSUB) is used, an increment pulse
is generated when a falling edge of the internal clock is detected. For this reason, in a case like No.
3 in table 9.17, where the clock is switched at a time such that the clock signal goes from high
level before switching to low level after switching, the switchover is seen as a falling edge, a count
clock pulse is generated, and TCG is incremented.
Table 9.17 Internal Clock Switching and TCG Operation
No.
1
Clock Level Before
and After Modifying
Bits CKS1 and CKS0
TCG Operation
Goes from low level
to low level
Clock before
switching
Clock after
switching
Count clock
TCG
N +1
N
CKS bits modified
2
Goes from low level
to high level
Clock before
switching
Clock after
switching
Count clock
TCG
N
N +1
N +2
CKS bits modified
221
Table 9.17 Internal Clock Switching and TCG Operation
No.
3
Clock Level Before
and After Modifying
Bits CKS1 and CKS0
TCG Operation
Goes from high level
to low level
Clock before
switching
Clock after
switching
*
Count clock
TCG
N
N +1
N +2
CKS bits modified
4
Goes from high level
to high level
Clock before
switching
Clock after
switching
Count clock
TCG
N
N +1
N +2
CKS bits modified
Note: * The switchover is seen as a falling edge of the clock pulse, and TCG is incremented.
Note on Rewriting Port Mode Registers: When a port mode register setting is modified to
enable or disable the input capture function or input capture noise canceling function, note the
following points.
• Switching the function of the input capture pin
When the function of the input capture pin is switched by modifying the TMIG bit in port
mode register 1 (PMR1) an input capture edge may be recognized even though no valid signal
edge has been input. This occurs under the conditions listed in table 9.18.
222
Table 9.18 Input Capture Input Signal Input Edges and Conditions by Switching of Input
Capture Pin Function
Input Capture Edge
Conditions
Rising edge recognized
TMIG pin level is high, and TMIG bit is changed from 0 to 1
TMIG pin level is high and NCS bit is changed from 0 to 1, then TMIG
bit is changed from 0 to 1 before noise canceller circuit completes five
samples
Falling edge recognized
TMIG pin level is high, and TMIG bit is changed from 1 to 0
TMIG pin level is low and NCS bit is changed from 0 to 1, then TMIG
bit is changed from 0 to 1 before noise canceller circuit completes five
samples
TMIG pin level is high and NCS bit is changed from 0 to 1, then TMIG
bit is changed from 1 to 0 before noise canceller circuit completes five
samples
Note: When pin P1 3 is not used for input capture, the input capture signal input to timer G is low.
• Switching the input capture noise canceling function
When modifying the NCS bit in port mode register 2 (PMR2) to enable or disable the input
capture noise canceling function, first clear the TMIG bit to 0. Otherwise an input capture edge
may be recognized even though no valid signal edge has been input. This occurs under the
conditions listed in table 9.19.
Table 9.19 Input Capture Input Signal Input Edges and Conditions by Switching of Noise
Canceling Function
Input Capture Edge
Conditions
Rising edge recognized
TMIG bit is set to 1 and TMIG pin level changes from low to high, then
NCS bit is changed from 1 to 0 before noise canceller circuit completes
five samples
Falling edge recognized
TMIG bit is set to 1 and TMIG pin level changes from high to low, then
NCS bit is changed from 1 to 0 before noise canceller circuit completes
five samples
If switching of the pin function generates a false input capture edge matching the edge selected
by the input capture interrupt edge select bit (IIEGS), the interrupt request flag will be set to 1,
making it necessary to clear this flag to 0 before using the interrupt function. Figure 9.15
shows the procedure for modifying port mode register settings and clearing the interrupt
request flag. The first step is to mask interrupts before modifying the port mode register. After
modifying the port mode register setting, wait long enough for an input capture edge to be
recognized (at least two system clocks when noise canceling is disabled; at least five sampling
clocks when noise canceling is enabled), then clear the interrupt request flag to 0 (assuming it
has been set to 1). An alternative procedure is to avoid having the interrupt request flag set
223
when the pin function is switched, either by controlling the level of the input capture pin so
that it does not satisfy the conditions in tables 9.18 and 9.19, or by setting the IIEGS bit of
TMG to select the edge opposite to the falsely generated edge.
Set I bit to 1 in CCR
Modify port mode register
Wait for TMIG to be recognized
Disable interrupts (or disable by clearing interrupt
enable bit in interrupt enable register 2)
Modify port mode register setting, wait for TMIG
to be recognized (at least two system clocks when
noise canceling is disabled; at least five sampling
clocks when noise canceling is enabled), then
clear interrupt request flag to 0
Clear interrupt request flag to 0
Clear I bit to 0 in CCR
Enable interrupts
Figure 9.15 Procedure for Modifying Port Mode Register and Clearing Interrupt
Request Flag
9.6.6
Sample Timer G Application
The absolute values of the high and low widths of the input capture signal can be measured by
using timer G. The CCLR1 and CCLR0 bits of TMG should be set to 1. Figure 9.16 shows an
example of this operation.
Input capture
signal
H'FF
Input capture
register GF
Input capture
register GR
H'00
TCG
Counter cleared
Figure 9.16 Sample Timer G Application
224
Section 10 Serial Communication Interface
10.1
Overview
The H8/3834 Series is provided with a three-channel serial communication interface (SCI). Table
10.1 summarizes the functions and features of the three SCI channels.
Table 10.1 Serial Communication Interface Functions
Channel
Functions
Features
SCI1
Synchronous serial transfer
• Choice of 8 internal clocks ( φ /1024 to φ /2)
or external clock
• Open drain output possible
• Interrupt requested at completion of
transfer
• Choice of 8-bit or 16-bit data
length
• Continuous clock output
SCI2
• Choice of 7 internal clocks ( φ /256 to φ /2) or
external clock
• Automatic transfer of up to 32 bytes
•
Open drain output possible
of data (send, receive, or
•
Interrupt requested at completion of
simultaneous send/receive)
transfer or error
• Chip select input
• Strobe pulse output
SCI3
Synchronous serial transfer
Synchronous serial transfer
• 8-bit data transfer
• Send, receive, or simultaneous
send/receive
Asynchronous serial transfer
•
•
•
•
Built-in baud rate generator
Receive error detection
Break detection
Interrupt requested at completion of
transfer or error
• Multiprocessor communication
function
• Choice of 7-bit or 8-bit data length
• Choice of 1-bit or 2-bit stop bit
length
• Parity addition
10.2
SCI1
10.2.1
Overview
Serial communication interface 1 (SCI1) performs synchronous serial transfer of 8-bit or 16-bit
data.
225
Features
• Choice of 8-bit or 16-bit data length
• Choice of eight internal clock sources (φ/1024, φ/256, φ/64, φ/32, φ/16, φ/8, φ/4, φ/2) or an
external clock
• Interrupt requested at completion of transfer
Block Diagram
Figure 10.1 shows a block diagram of SCI1.
PSS
SCR1
SCK1
Transmit/receive
control circuit
SCSR1
Internal data bus
φ
Transfer bit counter
SDRU
SI1
SDRL
SO1
IRRS1
Notation:
SCR1: Serial control register 1
SCSR1: Serial control/status register 1
SDRU: Serial data register U
SDRL: Serial data register L
IRRS1: SCI1 interrupt request flag
Prescaler S
PSS:
Figure 10.1 SCI1 Block Diagram
226
Pin Configuration
Table 10.2 shows the SCI1 pin configuration.
Table 10.2 Pin Configuration
Name
Abbrev.
I/O
Function
SCI1 clock pin
SCK 1
I/O
SCI1 clock input or output
SCI1 data input pin
SI 1
Input
SCI1 receive data input
SCI1 data output pin
SO1
Output
SCI1 transmit data output
Register Configuration
Table 10.3 shows the SCI1 register configuration.
Table 10.3 SCI1 Registers
Name
Abbrev.
R/W
Initial Value
Address
Serial control register 1
SCR1
R/W
H'00
H'FFA0
Serial control status register 1
SCSR1
R/W
H'80
H'FFA1
Serial data register U
SDRU
R/W
Not fixed
H'FFA2
Serial data register L
SDRL
R/W
Not fixed
H'FFA3
10.2.2
Register Descriptions
Serial Control Register 1 (SCR1)
Bit
7
6
5
4
3
2
1
0
SNC1
SNC0
—
—
CKS3
CKS2
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SCR1 is an 8-bit read/write register for selecting the operation mode, the transfer clock source,
and the prescaler division ratio.
Upon reset, SCR1 is initialized to H'00. Writing to this register during a transfer stops the transfer.
227
Bits 7 and 6—Operation Mode Select 1, 0 (SNC1, SNC0): Bits 7 and 6 select the operation
mode.
Bit 7: SNC1
Bit 6: SNC0
Description
0
0
8-bit synchronous transfer mode
1
16-bit synchronous transfer mode
0
Continuous clock output mode* 1
1
Reserved * 2
1
(initial value)
Notes: 1. Pins SI 1 and SO1 should be used as general input or output ports.
2. Don’t set bits SNC1 and SNC0 to 11.
Bits 5 and 4—Reserved Bits: Bits 5 and 4 are reserved, but they can be written and read.
Bit 3—Clock Source Select 3 (CKS3): Bit 3 selects the clock source and sets pin SCK1 as an
input or output pin.
Bit 3: CKS3
Description
0
Clock source is prescaler S, and pin SCK 1 is output pin
1
Clock source is external clock, and pin SCK1 is input pin
(initial value)
Bits 2 to 0—Clock Select 2 to 0 (CKS2 to CKS 0): When CKS3 = 0, bits 2 to 0 select the
prescaler division ratio and the serial clock cycle.
Serial Clock Cycle
Bit 2: CKS2
Bit 1: CKS1
Bit 0: CKS0
Prescaler Division
φ = 5 MHz
φ = 2.5 MHz
0
0
0
φ /1024 (initial value)
204.8 µs
409.6 µs
1
φ /256
51.2 µs
102.4 µs
0
φ /64
12.8 µs
25.6 µs
1
φ /32
6.4 µs
12.8 µs
0
φ /16
3.2 µs
6.4 µs
1
φ /8
1.6 µs
3.2 µs
0
φ /4
0.8 µs
1.6 µs
1
φ /2
—
0.8 µs
1
1
0
1
228
Serial Control/Status Register 1 (SCSR1)
Bit
7
6
5
4
3
2
1
0
—
SOL
ORER
—
—
—
—
STF
Initial value
1
0
0
0
0
0
0
0
Read/Write
—
R/W
R/(W)*
—
—
—
R/W
R/W
Note: * Only a write of 0 for flag clearing is possible.
SCSR1 is an 8-bit read/write register indicating operation status and error status.
Upon reset, SCSR1 is initialized to H'80.
Bit 7—Reserved Bit: Bit 7 is reserved; it is always read as 1, and cannot be modified.
Bit 6—Extended Data Bit (SOL): Bit 6 sets the SO1 output level. When read, SOL returns the
output level at the SO1 pin. After completion of a transmission, SO1 continues to output the value
of the last bit of transmitted data. The SO1 output can be changed by writing to SOL before or
after a transmission. The SOL bit setting remains valid only until the start of the next transmission.
To control the level of the SO1 pin after transmission ends, it is necessary to write to the SOL bit at
the end of each transmission. Do not write to this register while transmission is in progress,
because that may cause a malfunction.
Bit 6: SOL
Description
0
Read: SO 1 pin output level is low
(initial value)
Write: SO1 pin output level changes to low
1
Read: SO 1 pin output level is high
Write: SO1 pin output level changes to high
Bit 5—Overrun Error Flag (ORER): When an external clock is used, bit 5 indicates the
occurrence of an overrun error. If a clock pulse is input after transfer completion, this bit is set to 1
indicating an overrun. If noise occurs during a transfer, causing an extraneous pulse to be
superimposed on the normal serial clock, incorrect data may be transferred.
Bit 5: ORER
Description
0
Clearing conditions:
After reading ORER = 1, cleared by writing 0 to ORER
1
(initial value)
Setting conditions:
Set if a clock pulse is input after transfer is complete, when an external clock is
used
229
Bits 4 to 2—Reserved Bits: Bits 4 to 2 are reserved; they are always read as 0, and cannot be
modified.
Bit 1—Reserved Bit: Bit 1 is reserved; it should always be cleared to 0.
Bit 0—Start Flag (STF): Bit 0 controls the start of a transfer. Setting this bit to 1 causes SCI1 to
start transferring data.
During the transfer or while waiting for the first clock pulse, this bit remains set to 1. It is cleared
to 0 upon completion of the transfer. It can therefore be used as a busy flag.
Bit 0: STF
Description
0
Read: Indicates that transfer is stopped
(initial value)
Write: Invalid
1
Read: Indicates transfer in progress
Write: Starts a transfer operation
Serial Data Register U (SDRU)
Bit
Initial value
Read/Write
7
6
5
4
3
2
1
0
SDRU7
SDRU6
SDRU5
SDRU4
SDRU3
SDRU2
SDRU1
SDRU0
Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SDRU is an 8-bit read/write register. It is used as the data register for the upper 8 bits in 16-bit
transfer (SDRL is used for the lower 8 bits).
Data written to SDRU is output to SDRL starting from the least significant bit (LSB). This data is
then replaced by LSB-first data input at pin SI1, which is shifted in the direction from the most
significant bit (MSB) toward the LSB.
SDRU must be written or read only after data transmission or reception is complete. If this register
is written or read while a data transfer is in progress, the data contents are not guaranteed.
The SDRU value upon reset is not fixed.
230
Serial Data Register L (SDRL)
Bit
Initial value
Read/Write
7
6
5
4
3
2
1
0
SDRL7
SDRL6
SDRL5
SDRL4
SDRL3
SDRL2
SDRL1
SDRL0
Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SDRL is an 8-bit read/write register. It is used as the data register in 8-bit transfer, and as the data
register for the lower 8 bits in 16-bit transfer (SDRU is used for the upper 8 bits).
In 8-bit transfer, data written to SDRL is output from pin SO1 starting from the least significant bit
(LSB). This data is than replaced by LSB-first data input at pin SI 1, which is shifted in the
direction from the most significant bit (MSB) toward the LSB.
In 16-bit transfer, operation is the same as for 8-bit transfer, except that input data is fed in via
SDRU.
SDRL must be written or read only after data transmission or reception is complete. If this register
is read or written while a data transfer is in progress, the data contents are not guaranteed.
The SDRL value upon reset is not fixed.
10.2.3
Operation
Data can be sent and received in an 8-bit or 16-bit format, synchronized to an internal or external
serial clock. Overrun errors can be detected when an external clock is used.
Clock
The serial clock can be selected from a choice of eight internal clocks and an external clock. When
an internal clock source is selected, pin SCK1 becomes the clock output pin. When continuous
clock output mode is selected (SCR1 bits SNC1 and SNC0 are set to 10), the clock signal (φ/1024
to φ/2) selected in bits CKS2 to CKS0 is output continuously from pin SCK1. When an external
clock is used, pin SCK1 is the clock input pin.
Data Transfer Format
Figure 10.2 shows the data transfer format. Data is sent and received starting from the least
significant bit, in LSB-first format. Transmit data is output from one falling edge of the serial
clock until the next falling edge. Receive data is latched at the rising edge of the serial clock.
231
SCK 1
SO1 /SI 1
Bit 0
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Figure 10.2 Transfer Format
Data Transfer Operations
Transmitting: A transmit operation is carried out as follows.
• Set bits SO1 and SCK1 in PMR3 TO 1 so that the respective pins function as SO1 and SCK1. If
necessary, set bit POF1 in port mode register 2 (PMR2) for NMOS open drain output at pin
SO1.
• Clear bit SNC1 in SCR1 to 0, and set bit SNC0 to 1 or 0, designating 8- or 16-bit synchronous
transfer mode. Select the serial clock in bits CKS3 to CKS0. Writing data to SCR1 initializes
the internal state of SCI1.
• Write transmit data in SDRL and SDRU, as follows.
 8-bit transfer mode: SDRL
 16-bit transfer mode: Upper byte in SDRU, lower byte in SDRL
• Set the SCSR1 start flag (STF) to 1. SCI1 starts operating and outputs transmit data at pin SO1.
• After data transmission is complete, bit IRRS1 in interrupt request register 1 (IRR1) is set to 1.
When an internal clock is used, a serial clock is output from pin SCK1 in synchronization with the
transmit data. After data transmission is complete, the serial clock is not output until the next time
the start flag is set to 1. During this time, pin SO1 continues to output the value of the last bit
transmitted.
When an external clock is used, data is transmitted in synchronization with the serial clock input at
pin SCK1. After data transmission is complete, an overrun occurs if the serial clock continues to be
input; no data is transmitted and the SCSR1 overrun error flag (bit ORER) is set to 1.
While transmission is stopped, the output value of pin SO1 can be changed by rewriting bit SOL in
SCSR1.
Receiving: A receive operation is carried out as follows.
• Set bits SI1 and SCK1 in PMR3 TO 1 so that the respective pins function as SI1 and SCK1.
• Clear bit SNC1 in SCR1 to 0, and set bit SNC0 to 1 or 0, designating 8- or 16-bit synchronous
transfer mode. Select the serial clock in bits CKS3 to CKS0. Writing data to SCR1 initializes
the internal state of SCI1.
• Set the SCSR1 start flag (STF) to 1. SCI1 starts operating and receives data at pin SI 1.
• After data reception is complete, bit IRRS1 in interrupt request register 1 (IRR1) is set to 1.
232
• Read the received data from SDRL and SDRU, as follows.
 8-bit transfer mode: SDRL
 16-bit transfer mode: Upper byte in SDRU, lower byte in SDRL
• After data reception is complete, an overrun occurs if the serial clock continues to be input; no
data is received and the SCSR1 overrun error flag (bit ORER) is set to 1.
Simultaneous transmit/receive: A simultaneous transmit/receive operation is carried out as
follows.
• Set bits SO1, SI1, and SCK1 in PMR3 to 1 so that the respective pins function as SO1, SI1, and
SCK1. If necessary, set bit POF1 in port mode register 2 (PMR2) for NMOS open drain output
at pin SO1.
• Clear bit SNC1 in SCR1 to 0, and set bit SNC0 to 1 or 0, designating 8- or 16-bit synchronous
transfer mode. Select the serial clock in bits CKS3 to CKS0. Writing data to SCR1 initializes
the internal state of SCI1.
• Write transmit data in SDRL and SDRU, as follows.
 8-bit transfer mode: SDRL
 16-bit transfer mode: Upper byte in SDRU, lower byte in SDRL
• Set the SCSR1 start flag (STF) to 1. SCI1 starts operating. Transmit data is output at pin SO 1.
Receive data is input at pin SI1.
• After data transmission and reception are complete, bit IRRS1 in IRR1 is set to 1.
• Read the received data from SDRL and SDRU, as follows.
 8-bit transfer mode: SDRL
 16-bit transfer mode: Upper byte in SDRU, lower byte in SDRL
When an internal clock is used, a serial clock is output from pin SCK1 in synchronization with the
transmit data. After data transmission is complete, the serial clock is not output until the next time
the start flag is set to 1. During this time, pin SO1 continues to output the value of the last bit
transmitted.
When an external clock is used, data is transmitted and received in synchronization with the serial
clock input at pin SCK 1. After data transmission and reception are complete, an overrun occurs if
the serial clock continues to be input; no data is transmitted or received and the SCSR1 overrun
error flag (bit ORER) is set to 1.
While transmission is stopped, the output value of pin SO1 can be changed by rewriting bit SOL in
SCSR1.
233
10.2.4
Interrupts
SCI1 can generate an interrupt at the end of a data transfer.
When an SCI1 transfer is complete, bit IRRS1 in interrupt request register 1 (IRR1) is set to 1.
SCI1 interrupt requests can be enabled or disabled by bit IENS1 of interrupt enable register 1
(IENR1).
For further details, see 3.3, Interrupts.
10.2.5
Application Notes
When an external clock is input at pin SCK1, and an external clock is selected for use as the clock
source bit STF in SCSR1 must first be set to 1 to start data transfer before inputting the external
clock.
10.3
SCI2
10.3.1
Overview
Serial communication interface 2 (SCI2) has a 32-bit data buffer for synchronous serial transfer of
up to 32 bytes of data in one operation.
Features
Features of SCI are listed below.
• Automatic transfer of up to 32 bytes of data
• Choice of seven internal clock sources (φ/256, φ/64, φ/32, φ/16, φ/8, φ/4, φ/2) or an external
clock
• Interrupts requested at completion of transfer or when an error occurs
• Gaps of 56, 24, or 8 internal clock cycles can be inserted between successive bytes of
transferred data.
• Transfer can be started by chip select input.
• A strobe pulse can be output for each byte transferred.
234
Block Diagram
Figure 10.3 shows a block diagram of SCI2.
PSS
SCK 2
STAR
STRB
CS
SCR2
SCSR2
Shift register
SO 2
Internal data bus
EDAR
Transmit/receive
control circuit
Serial data buffer
SI 2
IRRS2
Notation:
STAR: Start address register
EDAR: End address register
IRRS2: SCI2 interrupt request flag (IRR2)
Prescaler S
PSS:
Figure 10.3 SCI2 Block Diagram
Pin Configuration
Table 10.4 shows the SCI2 pin configuration.
235
Table 10.4 Pin Configuration
Name
Abbrev.
I/O
Function
SCI2 clock pin
SCK 2
I/O
SCI2 clock input/output
SCI2 data input pin
SI 2
Input
SCI2 receive data input
SCI2 data output pin
SO2
Output
SCI2 transmit data output
SCI2 strobe pin
STRB
Output
SCI2 strobe signal output
SCI2 chip select pin
CS
Input
SCI2 chip select signal input
Register Configuration
Table 10.5 shows the SCI2 register configuration.
Table 10.5 SCI2 Registers
Name
Abbrev.
R/W
Initial Value
Address
Start address register
STAR
R/W
H'E0
H'FFA4
End address register
EDAR
R/W
H'E0
H'FFA5
Serial control register 2
SCR2
R/W
H'E0
H'FFA6
Serial control/status register 2
SCSR2
R/W
H'E0
H'FFA7
Serial data buffer (32 bytes)
—
R/W
Not fixed
H'FF80 to H'FF9F
10.3.2
Register Descriptions
Start Address Register (STAR)
Bit
7
6
5
4
3
2
1
0
—
—
—
STA4
STA3
STA2
STA1
STA0
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
STAR is an 8-bit read/write register, for designating a transfer start address in the address space
(H'FF80 to H'FF9F) allocated to the 32-byte data buffer. The lower 5 bits of STAR correspond to
the lower 5 bits of the address. The extent of continuous data transfer is defined in STAR and in
the end address register (EDAR). If the same value is designated by STAR and EDAR, only 1 byte
of data is transferred.
Bits 7 to 5 are reserved; they are always read as 1, and cannot be modified.
Upon reset, STAR is initialized to H'E0.
236
End Address Register (EDAR)
Bit
7
6
5
4
3
2
1
0
—
—
—
EDA4
EDA3
EDA2
EDA1
EDA0
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
EDAR is an 8-bit read/write register, for designating a transfer end address in the address space
(H'FF80 to H'FF9F) allocated to the 32-byte data buffer. The lower 5 bits of EDAR correspond to
the lower 5 bits of the address. The extent of continuous data transfer is defined in STAR and in
EDAR. If the same value is designated by STAR and EDAR, only 1 byte of data is transferred.
Bits 7 to 5 are reserved; they are always read as 1, and cannot be modified.
Upon reset, EDAR is initialized to H'E0.
Serial Control Register 2 (SCR2)
Bit
7
6
5
4
3
2
1
0
—
—
—
GAP1
GAP0
CKS2
CKS1
CKS0
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
SCR2 is an 8-bit read/write register for selecting the serial clock, and for setting the gap inserted
between data during continuous transfer when SCI2 uses an internal clock.
Upon reset, SCR2 is initialized to H'E0.
Bits 7 to 5—Reserved Bits: Bits 7 to 5 are reserved; they are always read as 1, and cannot be
modified.
Bits 4 and 3—Gap Select 1, 0 (GAP1 to GAP0): When SCI2 uses an internal clock, gaps can be
inserted between successive data bytes. Bits 4 and 3 designate the length of these gaps. During a
gap, pin SCK2 remains at the high level. When no gap is inserted, the STRB signal stays at the low
level.
Bit 4: GAP1
Bit 3: GAP0
Description
0
0
No gaps between bytes
1
A gap of 8 clock cycles is inserted between bytes
0
A gap of 24 clock cycles is inserted between bytes
1
A gap of 56 clock cycles is inserted between bytes
1
(initial value)
237
Bits 2 to 0—Clock Select 2 to 0 (CKS2 to CKS0): Bits 2 to 0 select one of seven internal clock
sources or an external clock as the transfer clock.
Bit 1:
CKS1
Bit 0:
CKS0
Pin SCK2
0
0
0
SCK 2 output Prescaler S φ /256 (initial value) 51.2 µs
1
1
0
1
Clock
Source
Serial Clock Cycle
Bit 2:
CKS2
Prescaler
Division
φ = 5 MHz φ = 2.5 MHz
102.4 µs
1
φ /64
12.8 µs
25.6 µs
0
φ /32
6.4 µs
12.8 µs
1
φ /16
3.2 µs
6.4 µs
0
φ /8
1.6 µs
3.2 µs
1
φ /4
0.8 µs
1.6 µs
0
φ /2
—
0.8 µs
—
—
—
1
SCK 2 input
External
clock
Serial Control/Status Register 2 (SCSR2)
Bit
7
6
5
4
3
2
1
0
—
—
—
SOL
ORER
WT
ABT
STF
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/(W)*
R/(W)*
R/(W)*
R/W
Note: * Only a write of 0 for flag clearing is possible.
SCSR2 is an 8-bit register indicating SCI2 operation status and error status.
Upon reset, SCSR2 is initialized to H'E0.
Bits 7 to 5—Reserved Bits: Bits 7 to 5 are reserved; they are always read as 1, and cannot be
modified.
Bit 4—Extended Data Bit (SOL): Bit 4 sets the SO2 output level. When read, SOL returns the
transmitted data output at the SO2 pin. After completion of a transmission, SO2 continues to output
the value of the last bit of transmitted data. The SO2 output can be changed by writing to SOL
before or after a transmission. The SOL bit setting remains valid only until the start of the next
transmission. To control the level of the SO2 pin after transmission ends, it is necessary to write to
the SOL bit at the end of each transmission. Note that if the STF bit is cleared to 0 to terminate a
transmission in progress, the transmitted data will be modified when the bit is cleared.
238
Bit 4: SOL
Description
0
Read: SO 2 pin output level is low
(initial value)
Write: SO2 pin output level changes to low
1
Read: SO 2 pin output level is high
Write: SO2 pin output level changes to high
Bit 3—Overrun Error Flag (ORER): When an external clock is used, bit 3 indicates the
occurrence of an overrun error. If a clock pulse is input after transfer completion, this bit is set to 1
indicating an overrun. If noise occurs during a transfer, causing an extraneous pulse to be
superimposed on the normal serial clock, incorrect data may be transferred. Overrun errors are not
detected while pin CS is at the high level.
Bit 3: ORER
Description
0
Clearing conditions:
After reading ORER = 1, cleared by writing 0 to ORER
1
(initial value)
Setting conditions:
Set if a clock pulse is input after transfer is complete, when an external clock is
used
Bit 2—Wait Flag (WT): Bit 2 indicates that an attempt was made to read or write the 32-byte
serial data buffer while a transfer was in progress, or while waiting for CS input. The read or write
access is not carried out, and this bit is set to 1.
Bit 2: WT
Description
0
Clearing conditions:
After reading WT = 1, cleared by writing 0 to WT
1
(initial value)
Setting conditions:
An attempt was made to read or write the (32-byte) serial data buffer during a
transfer operation or while waiting for CS input
Bit 1—Abort Flag (ABT): Bit 1 indicates that CS went to high during data transfer. When the CS
input function is selected, if a high-level signal is detected at pin CS during a transfer, the transfer
is immediately aborted and this bit is set to 1. At the same time bit IRRS2 in interrupt request
register 2 (IRR2) is set
to 1, and pins SCK2 and SO2 go to the high-impedance state. Data in the (32-byte) serial data
buffer and values in the internal registers other than SCSR2 remain unchanged.
Transfer cannot take place while this bit is set to 1. It must be cleared to 0 before resuming the
transfer.
239
Bit 1: ABT
Description
0
Clearing conditions:
After reading ABT = 1, cleared by writing 0 to ABT
1
(initial value)
Setting conditions:
When pin CS goes high during a transfer
Bit 0—Start Flag (STF): Bit 0 controls the start of a transfer. If bit CS = 0 in PMR2, setting bit
STF to 1 causes SCI2 to start transferring data. If bit CS = 1 in PMR2, SCI2 starts transferring
data when CS goes low. This bit stays at 1 during the transfer or while waiting for CS input; it is
cleared to 0 after the transfer is completed or when the transfer is aborted by CS. It can therefore
be used as a busy flag.
Clearing this bit to 0 during a transfer aborts the transfer. The contents of the (32-byte) serial data
buffer and of internal registers other than SCSR2 remain unchanged.
Bit 0: STF
Description
0
Read: Indicates that transfer is stopped
(initial value)
Write: Stops a transfer operation
1
Read: Indicates transfer in progress or waiting for CS input
Write: Starts a transfer operation
10.3.3
Operation
SCI2 has a 32-byte serial data buffer, making possible continuous transfer of up to 32 bytes of data
with one operation. SCI2 transmits and receives data in synchronization with clock pulses.
Depending on register settings, it can transmit, receive, or transmit and receive simultaneously.
When transmission is set, the serial data buffer values are retained after the transmission is
completed.
Either an internal clock or external clock may be selected as the serial clock. When an internal
clock is selected, gaps may be inserted between the data bytes. It is also possible to output a strobe
signal at pin STRB. When an external clock is selected, the overrun flag allows detection of
erroneous operation due to unwanted clock input.
Transfers can be started or aborted by input at pin CS. Abort is indicated by means of an abort
flag.
Clock
The serial clock can be selected from a choice of six internal clock sources or an external clock.
When an internal clock source is selected, pin SCK2 becomes the clock output pin.
240
Data Transfer Format
Figure 10.4 and figure 10.5 show the SCI2 data transfer format. Data is sent and received starting
from the least significant bit, in LSB-first format. Transmit data is output from one falling edge of
the serial clock until the next falling edge. Receive data is latched at the rising edge of the serial
clock.
When SCI2 operates on an internal clock, a gap can be inserted between each byte of transferred
data and the next, as shown in figure 10.5. During this gap, pin SCK 2 output remains high. Also, a
strobe pulse can be output at pin STRB.
The length of the gap is designated in bits GAP1 and GAP0 in serial control register 2 (SCR2).
241
Figure 10.4 Data Transfer Format (No Gaps between Data)
242
STRB
CS
SO 2 /SI 2
SCK 2
Transfer
started
Transfer
completed
bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7
Figure 10.5 Data Transfer Format (Gap Inserted between Data)
243
STRB
CS
SO2 /SI 2
SCK2
Transfer
started
bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7
8, 24, or 56 clock cycles
bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7
Transfer
completed
Data Transfer Operations
SCI2 Initialization: Data transfer on SCI2 first of all requires that SCI2 be initialized by software
as follows.
• With bit STF cleared to 0 in SCSR2, select pin functions and the transfer mode in registers
PMR2, PMR3, STAR, EDAR, and SCR2.
• The SCI2 pins double as general input/output ports. Switching between port and SCI2
functions is controlled in PMR3. CMOS output or NMOS open drain output can be selected in
PMR2. The serial clock and gaps between transferred bytes are set in SCR2.
• The start and end addresses of the transfer data area are set in STAR and EDAR. If the end
address is set smaller than the start address, as shown in figure 10.6, the transfer wraps around
from H'FF9F to H'FF80 and continues to the end address. If the start address and end address
are the same, only one byte of data will be transferred.
H'FF80
End
End address
Start
Start address
H'FF9F
Figure 10.6 Operation When End Address is Smaller than Start Address
Transmitting: A transmit operation is carried out as follows.
• Set bits SO2 and SCK2 in PMR3 TO 1 so that the respective pins function as SO2 and SCK2. If
necessary, set bit POF2 in port mode register 2 (PMR2) for NMOS open-drain output at pin
SO2, and set bits CS and STRB in PMR3 to designate use of the CS and STRB pin functions.
• Select the serial clock and, in the case of internal clock operation, the data gap in SCR2.
• Write transmit data in the serial data buffer. This data will remain in the data buffer after
completion of the transfer. It is not necessary to rewrite the buffer when the same data is
retransmitted.
• Set the start address in the lower 5 bits of STAR, and the end address in the lower 5 bits of
EDAR.
• Set the start/busy flag (STF) to 1. If bit CS = 0 in PMR3, transmission starts as soon as STF is
set to 1. If CS = 1 in PMR3, transmission starts when CS goes low.
• After data transmission is complete, bit IRRS2 in interrupt request register 2 (IRR2) is
set to 1, and bit STF is cleared to 0.
244
When an internal clock is used, a serial clock is output from pin SCK2 in synchronization with the
transmit data. After data transmission is completed, the serial clock is not output until bit STF is
set again. During this time, pin SO2 continues to output the value of the last bit transmitted.
When an external clock is used, data is transmitted in synchronization with the serial clock input at
pin SCK2. After data transmission is completed, an overrun occurs if the serial clock continues to
be input; no data is transmitted and the SCSR2 overrun error flag (bit ORER) is set to 1. Pin SO2
continues to output the value of the last preceding bit. Overrun errors are not detected when both
pin CS is at the high level and PMR3 bit CS = 1.
While transmission is stopped, the output value of pin SO2 can be changed by rewriting bit SOL in
SCSR2.
During a transmission or while waiting for CS input, the CPU cannot read or write the data buffer.
If a read instruction is executed, H'FF will be read; if a write instruction is executed, the buffer
contents will not change. In either case the wait flag (bit WT) in SCSR2 will be set to 1.
If bit CS = 1 in PMR3 and during transmission a high-level signal is detected at pin CS, the
transmit operation will immediately be aborted, setting the abort flag (bit ABT) to 1. At the same
time bit IRRS2 in interrupt request register 2 (IRR2) will be set to 1, and bit STF will be cleared to
0. Pins SCK2 and SO2 will go to the high-impedance state. Data transfer is not possible while bit
ABT is set to 1. It must be cleared before resuming the transfer.
Receiving: A receive operation is carried out as follows.
• Set bits SI2 and SCK2 in port mode register 3 (PMR3) to 1, designating use of the SI2 and
SCK2 pin functions. If necessary, set bit CS in PMR3 to select the CS pin function.
• Select the serial clock and, in the case of internal clock operation, the data gap in SCR2.
• Allocate an area to hold the received data in the serial data buffer by designating the receive
start address in the lower 5 bits of the start address register (STAR) and the receive end address
in the lower 5 bits of the end address register (EDAR).
• Set the start/busy flag (bit STF) to 1. If bit CS = 0 in PMR3, receiving starts as soon as STF is
set. If CS = 1 in PMR3, receiving starts when CS goes low.
• After receiving is completed, bit IRRS2 in interrupt request register 2 (IRR2) is set to 1, and bit
STF is cleared to 0.
• Read the received data from the serial data buffer.
If an internal clock is used, a serial clock is output from pin SCK2 when the receive operation
starts. After receiving is completed, the serial clock is not output until bit STF is set again. When
an external clock source is used, data is received in synchronization with the clock input at pin
SCK2. After receiving is completed, an overrun occurs if the serial clock continues to be input; no
further data is received and the SCSR2 overrun error flag (bit ORER) is set to 1. Overrun errors
are not detected when both pin CS is high and bit CS = 1 in PMR3.
245
While receiving or while waiting for CS input, the CPU cannot read or write the data buffer. If a
read instruction is executed, H'FF will be read; if a write instruction is executed the buffer contents
will not change. In either case the wait flag (bit WT) in SCSR2 will be set.
If bit CS = 1 in PMR3 and a high-level signal is detected at pin CS during receiving, the receive
operation will immediately be aborted, setting the abort flag (bit ABT) to 1. At the same time bit
IRRS2 in interrupt request register 2 (IRR2) will be set to 1, and bit STF will be cleared to 0. Pins
SCK2 and SO2 will go to the high-impedance state. Data transfer is not possible while bit ABT is
set to 1. It must be cleared before resuming the transfer.
Simultaneous Transmit/Receive: A simultaneous transmit/receive operation is carried out as
follows.
• Set bits SO2, SI2, and SCK2 in PMR3 to 1, designating use of the SO2, SI2, and SCK2 pin
functions. If necessary, set bit POF2 in port mode register 2 (PMR2) for NMOS open-drain
output at pin SO2, and set bits CS and STRB to designate use of the CS and STRB pin
functions.
• Select the transfer clock and, in the case of internal clock operation, the data gap in SCR2.
• Write transmit data in the serial data buffer. In simultaneous transmit/receive, received data
replaces transmitted data at the same buffer addresses.
• Set the transfer start address in the lower 5 bits of STAR, and the transfer end address in the
lower 5 bits of EDAR.
• Set the start/busy flag (bit STF) to 1. If bit CS = 0 in PMR3, the transfer starts as soon as STF
is set. If CS = 1 in PMR3, transfer operations start when CS goes low.
• After data transfer is completed, bit IRRS2 in interrupt request register 2 (IRR2) is set to 1, and
bit STF is cleared to 0.
• Read the received data from the serial data buffer.
If an internal clock is used, a serial clock is output from pin SCK2 when the transfer begins. After
the transfer is completed, the serial clock is not output until bit STF is set again. During this time,
pin SO2 continues to output the value of the last bit transmitted.
When an external clock is used, data is transferred in synchronization with the serial clock input at
pin SCK2. After the transfer is completed, an overrun occurs if the serial clock continues to be
input; no transfer operation takes place and the SCSR2 overrun error flag (bit ORER) is set to 1.
Pin SO 2 continues to output the value of the last transmitted bit. Overrun errors are not detected
when both pin CS is high and bit CS = 1 in PMR3.
While data transfer is stopped, the output value of pin SO2 can be changed by rewriting bit SOL in
SCSR2.
246
During a transfer or while waiting for CS input, the CPU cannot read or write the data buffer. If a
read instruction is executed, H'FF will be read; if a write instruction is executed the buffer contents
will not change. In either case the wait flag (bit WT) in SCSR2 will be set.
If bit CS = 1 in PMR3 and during the transfer a high-level signal is detected at pin CS, the transfer
will immediately be aborted, setting the abort flag (bit ABT) to 1. At the same time bit IRRS2 in
interrupt request register 2 (IRR2) will be set to 1, and bit STF will be cleared to 0. Pins SCK 2 and
SO2 will go to the high-impedance state. Data transfer is not possible while bit ABT is set to 1. It
must be cleared before resuming the transfer.
10.3.4
Interrupts
SCI2 can generate interrupts when a transfer is completed or when a transfer is aborted by CS.
These interrupts have the same vector address.
When the above conditions occur, bit IRRS2 in interrupt request register 2 (IRR2) is set to 1. SCI2
interrupt requests can be enabled or disabled in bit IENS2 of interrupt enable register 2 (IENR2).
For further details, see 3.3, Interrupts.
When a transfer is aborted by CS, an overrun error occurs, or a read or write of the serial data
buffer is attempted during a transfer or while waiting for CS input, the ABT, ORER, or WT bit in
SCSR2 is set to 1. These bits can be used to determine the cause of the error.
10.3.5
Application Notes
When an external clock is input at pin SCK2, and an external clock is selected for use as the clock
source bit STF in SCSR2 must first be set to 1 to start data transfer before inputting the external
clock.
247
10.4
SCI3
10.4.1
Overview
Serial communication interface 3 (SCI3) has both synchronous and asynchronous serial data
communication capabilities. It also has a multiprocessor communication function for serial data
communication among two or more processors.
Features
SCI3 features are listed below.
• Selection of asynchronous or synchronous mode
 Asynchronous mode
Serial data communication is performed using an asynchronous method in which
synchronization is established character by character.
SCI3 can communicate with a UART (universal asynchronous receiver/transmitter), ACIA
(asynchronous communication interface adapter), or other chip that employs standard
asynchronous serial communication. It can also communicate with two or more other
processors using the multiprocessor communication function. There are twelve selectable
serial data communication formats.
• Data length: seven or eight bits
• Stop bit length: one or two bits
• Parity: even, odd, or none
• Multiprocessor bit: one or none
• Receive error detection: parity, overrun, and framing errors
• Break detection: by reading the RXD level directly when a framing error occurs
•
•
•
•
 Synchronous mode
Serial data communication is synchronized with a clock signal. SCI3 can communicate
with other chips having a clocked synchronous communication function.
• Data length: eight bits
• Receive error detection: overrun errors
Full duplex communication
The transmitting and receiving sections are independent, so SCI3 can transmit and receive
simultaneously. Both sections use double buffering, so continuous data transfer is possible in
both the transmit and receive directions.
Built-in baud rate generator with selectable bit rates.
Internal or external clock may be selected as the transfer clock source.
There are six interrupt sources: transmit end, transmit data empty, receive data full, overrun
error, framing error, and parity error.
248
Block Diagram
Figure 10.7 shows a block diagram of SCI3.
SCK 3
External
clock
Baud rate
generator
BRC
Internal clock
(φ /64, φ /16, φ /4, φ)
BRR
Clock
Transmit/receive
control
SCR3
SSR
TXD
TSR
TDR
RXD
RSR
RDR
Notation:
RSR: Receive shift register
RDR: Receive data register
TSR: Transmit shift register
TDR: Transmit data register
SMR: Serial mode register
SCR3: Serial control register 3
SSR: Serial status register
BRR: Bit rate register
BRC: Bit rate counter
Internal data bus
SMR
Interrupt
requests
(TEI, TXI,
RXI, ERI)
Figure 10.7 SCI3 Block Diagram
249
Pin Configuration
Table 10.6 shows the SCI3 pin configuration.
Table 10.6 Pin Configuration
Name
Abbrev.
I/O
Function
SCI3 clock
SCK 3
I/O
SCI3 clock input/output
SCI3 receive data input
RXD
Input
SCI3 receive data input
SCI3 transmit data output
TXD
Output
SCI3 transmit data output
Register Configuration
Table 10.7 shows the SCI3 internal register configuration.
Table 10.7 SCI3 Registers
Name
Abbrev.
R/W
Initial Value
Address
Serial mode register
SMR
R/W
H'00
H'FFA8
Bit rate register
BRR
R/W
H'FF
H'FFA9
Serial control register 3
SCR3
R/W
H'00
H'FFAA
Transmit data register
TDR
R/W
H'FF
H'FFAB
Serial status register
SSR
R/W
H'84
H'FFAC
Receive data register
RDR
R
H'00
H'FFAD
Transmit shift register
TSR
*
—
—
Receive shift register
RSR
*
—
—
Bit rate counter
BRC
*
—
—
Note: —: Cannot be read or written.
10.4.2
Register Descriptions
Receive Shift Register (RSR)
Bit
7
6
5
4
3
2
1
0
Read/Write
—
—
—
—
—
—
—
—
The receive shift register (RSR) is for receiving serial data.
250
Serial data is input in LSB (bit 0) order into RSR from pin RXD, converting it to parallel data.
After each byte of data has been received, the byte is automatically transferred to the receive data
register (RDR).
RSR cannot be read or written directly by the CPU.
Receive Data Register (RDR)
Bit
7
6
5
4
3
2
1
0
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
The receive data register (RDR) is an 8-bit register for storing received serial data.
Each time a byte of data is received, the received data is transferred from the receive shift register
(RSR) to RDR, completing a receive operation. Thereafter RSR again becomes ready to receive
new data. RSR and RDR form a double buffer mechanism that allows data to be received
continuously.
RDR is exclusively for receiving data and cannot be written by the CPU.
RDR is initialized to H'00 upon reset or in standby mode, watch mode, subactive mode, or
subsleep mode.
Transmit Shift Register (TSR)
Bit
7
6
5
4
3
2
1
0
Read/Write
—
—
—
—
—
—
—
—
The transmit shift register (TSR) is for transmitting serial data.
Transmit data is first transferred from the transmit data register (TDR) to TSR, then is transmitted
from pin TXD, starting from the LSB (bit 0).
After one byte of data has been sent, the next byte is automatically transferred from TDR to TSR,
and the next transmission begins. If no data has been written to TDR (1 is set in TDRE), there is
no data transfer from TDR to TSR.
TSR cannot be read or written directly by the CPU.
251
Transmit Data Register (TDR)
Bit
7
6
5
4
3
2
1
0
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
The transmit data register (TDR) is an 8-bit register for holding transmit data.
When SCI3 detects that the transmit shift register (TSR) is empty, it shifts transmit data written in
TDR to TSR and starts serial data transmission. While TSR is transmitting serial data, the next
byte to be transmitted can be written to TDR, realizing continuous transmission.
TDR can be read or written by the CPU at all times.
TDR is initialized to H'FF upon reset or in standby mode, watch mode, subactive mode, or
subsleep mode.
Serial Mode Register (SMR)
Bit
7
6
5
4
3
2
1
0
COM
CHR
PE
PM
STOP
MP
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
The serial mode register (SMR) is an 8-bit register for setting the serial data communication
format and for selecting the clock source of the baud rate generator. SMR can be read and written
by the CPU at any time.
SMR is initialized to H'00 upon reset or in standby mode, watch mode, subactive mode, or
subsleep mode.
Bit 7—Communication Mode (COM): Bit 7 selects asynchronous mode or synchronous mode as
the serial data communication mode.
Bit 7: COM
Description
0
Asynchronous mode
1
Synchronous mode
252
(initial value)
Bit 6—Character Length (CHR): Bit 6 selects either 7 bits or 8 bits as the data length in
asynchronous mode. In synchronous mode the data length is always 8 bits regardless of the setting
here.
Bit 6: CHR
Description
0
8-bit data
1
7-bit data*
(initial value)
Note: * When 7-bit data is selected as the character length in asynchronous mode, the MSB (bit 7)
in the transmit data register is not transmitted.
Bit 5—Parity Enable (PE): In asynchronous mode, bit 5 selects whether or not a parity bit is to
be added to transmitted data and checked in received data. In synchronous mode there is no adding
or checking of parity regardless of the setting here.
Bit 5: PE
Description
0
Parity bit adding and checking disabled
1
Parity bit adding and checking enabled*
(initial value)
Note: * When PE is set to 1, then either odd or even parity is added to transmit data, depending on
the setting of the parity mode bit (PM). When data is received, it is checked for odd or even
parity as designated in bit PM.
Bit 4—Parity Mode (PM): In asynchronous mode, bit 4 selects whether odd or even parity is to
be added to transmitted data and checked in received data. The PM setting is valid only if bit PE is
set to 1, enabling parity adding/checking. In synchronous mode, or if parity adding/checking is
disabled in asynchronous mode, the PM setting is invalid.
Bit 4: PM
Description
0
Even parity* 1
1
Odd parity *
(initial value)
2
Notes: 1. When even parity is designated, a parity bit is added to the transmitted data so that the
sum of 1s in the resulting data is an even number. When data is received, the sum of 1s
in the data plus parity bit is checked to see if the result is an even number.
2. When odd parity is designated, a parity bit is added to the transmitted data so that the
sum of 1s in the resulting data is an odd number. When data is received, the sum of 1s
in the data plus parity bit is checked to see if the result is an odd number.
253
Bit 3—Stop Bit Length (STOP): Bit 3 selects 1 bit or 2 bits as the stop bit length in
asynchronous mode. This setting is valid only in asynchronous mode. In synchronous mode a stop
bit is not added, so this bit is ignored.
Bit 3: STOP
Description
0
1 stop bit * 1
1
2 stop bits*
(initial value)
2
Notes: 1. When data is transmitted, one 1 bit is added at the end of each transmitted character as
the stop bit.
2. When data is transmitted, two 1 bits are added at the end of each transmitted character
as the stop bits.
When data is received, only the first stop bit is checked regardless of the stop bit length. If the
second stop bit value is 1 it is treated as a stop bit; if it is 0, it is treated as the start bit of the next
character.
Bit 2—Multiprocessor Mode (MP): Bit 2 enables or disables the multiprocessor communication
function. When the multiprocessor communication function is enabled, the parity enable (PE) and
parity mode (PM) settings are ignored. The MP bit is valid only in asynchronous mode; it should
be cleared to 0 in synchronous mode.
See 10.4.6, for details on the multiprocessor communication function.
Bit 2: MP
Description
0
Multiprocessor communication function disabled
1
Multiprocessor communication function enabled
(initial value)
Bits 1 and 0—Clock Select 1, 0 (CKS1, CKS0): Bits 1 and 0 select the clock source for the builtin baud rate generator. A choice of φ/64, φ/16, φ/4, or φ is made in these bits.
See 8, Bit rate register (BRR), below for information on the clock source and bit rate register
settings, and their relation to the baud rate.
Bit 1: CKS1
Bit 0: CKS0
Description
0
0
φ clock
1
φ /4 clock
0
φ /16 clock
1
φ /64 clock
1
254
(initial value)
Serial Control Register 3 (SCR3)
Bit
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Serial control register 3 (SCR3) is an 8-bit register that controls SCI3 transmit and receive
operations, enables or disables serial clock output in asynchronous mode, enables or disables
interrupts, and selects the serial clock source. SCR3 can be read and written by the CPU at any
time.
SCR3 is initialized to H'00 upon reset or in standby mode, watch mode, subactive mode, or
subsleep mode.
Bit 7—Transmit Interrupt Enable (TIE): Bit 7 enables or disables the transmit data empty
interrupt (TXI) request when data is transferred from TDR to TSR and the transmit data register
empty bit (TDRE) in the serial status register (SSR) is set to 1. The TXI interrupt can be cleared
by clearing bit TDRE to 0, or by clearing bit TIE to 0.
Bit 7: TIE
Description
0
Transmit data empty interrupt request (TXI) disabled
1
Transmit data empty interrupt request (TXI) enabled
(initial value)
Bit 6—Receive Interrupt Enable (RIE): Bit 6 enables or disables the receive error interrupt
(ERI), and the receive data full interrupt (RXI) requested when data is transferred from RSR to
RDR and the receive data register full bit (RDRF) in the serial status register (SSR) is set to 1.
There are three kinds of receive error: overrun, framing, and parity. RXI and ERI interrupts can be
cleared by clearing SSR flag RDRF, or flags FER, PER, and OER to 0, or by clearing bit RIE to 0.
Bit 6: RIE
Description
0
Receive data full interrupt request (RXI) and receive error interrupt request
(ERI) disabled
(initial value)
1
Receive data full interrupt request (RXI) and receive error interrupt request
(ERI) enabled
255
Bit 5—Transmit Enable (TE): Bit 5 enables or disables the start of a transmit operation.
Bit 5: TE
Description
0
Transmit operation disabled* 1 (TXD is a general I/O port)
1
(initial value)
2
Transmit operation enabled * (TXD is the transmit data pin)
Notes: 1. The transmit data register empty bit (TDRE) in the serial status register (SSR) is fixed
at 1.
2. In this state, writing transmit data in TDR clears bit TDRE in SSR to 0 and starts serial
data transmission.
Before setting TE to 1 it is necessary to set the transmit format in SMR.
Bit 4—Receive Enable (RE): Bit 4 enables or disables the start of a receive operation.
Bit 4: RE
Description
0
Receive operation disabled * 1 (RXD is a general I/O port)
1
2
(initial value)
Receive operation enabled* (RXD is the receive data pin)
Notes: 1. When RE is cleared to 0, this has no effect on the SSR flags RDRF, FER, PER, and
OER, which retain their states.
2. Serial data receiving begins when, in this state, a start bit is detected in asynchronous
mode, or serial clock input is detected in synchronous mode.
Before setting RE to 1 it is necessary to set the receive format in SMR.
Bit 3—Multiprocessor Interrupt Enable (MPIE): Bit 3 enables or disables multiprocessor
interrupt requests. This setting is valid only in asynchronous mode, and only when the
multiprocessor mode bit (MP) in the serial mode register (SMR) is set to 1. This bit is ignored
when COM is set to 1 or when bit MP is cleared to 0.
Bit 3: MPIE
Description
0
Multiprocessor interrupt request disabled (ordinary receive operation)
(initial value)
Clearing condition:
Multiprocessor bit receives a data value of 1
1
Multiprocessor interrupt request enabled*
Note: * SCI3 does not transfer receive data from RSR to RDR, does not detect receive errors, and
does not set status flags RDRF, FER, and OER in SSR. Until a multiprocessor bit value of 1
is received, the receive data full interrupt (RXI) and receive error interrupt (ERI) are
disabled and serial status register (SSR) flags RDRF, FER, and OER are not set. When the
multiprocessor bit receives a 1, the MPBR bit of SSR is set to 1, MPIE is automatically
cleared to 0, RXI and ERI interrupts are enabled (provided bits TIE and RIE in SCR3 are
set to 1), and setting of the RDRF, FER, and OER flags is enabled.
256
Bit 2—Transmit End Interrupt Enable (TEIE): Bit 2 enables or disables the transmit end
interrupt (TEI) requested if there is no valid transmit data in TDR when the MSB is transmitted.
Bit 2: TEIE
Description
0
Transmit end interrupt (TEI) disabled
1
Transmit end interrupt (TEI) enabled*
(initial value)
Note: * A TEI interrupt can be cleared by clearing the SSR bit TDRE to 0 and clearing the transmit
end bit (TEND) to 0, or by clearing bit TEIE to 0.
Bits 1 and 0—Clock Enable 1, 0 (CKE1, CKE0): Bits 1 and 0 select the clock source and enable
or disable clock output at pin SCK3. The combination of bits CKE1 and CKE0 determines whether
pin SCK3 is a general I/O port, a clock output pin, or a clock input pin.
Note that the CKE0 setting is valid only when operation is in asynchronous mode using an internal
clock (CKE1 = 0). This bit is invalid in synchronous mode or when using an external clock
(CKE1 = 1). In synchronous mode and in external clock mode, clear CKE0 to 0. After setting bits
CKE1 and CKE0, the operation mode must first be set in the serial mode register (SMR).
See table 10.9 in 10.4.3, Operation, for details on clock source selection.
Bit 1: CKE1
Bit 0: CKE0
Communication Mode
Clock Source
SCK3 Pin Function
0
0
Asynchronous
Internal clock
I/O port* 1
Synchronous
Internal clock
Serial clock output * 1
Asynchronous
Internal clock
Clock output* 2
Synchronous
Reserved
Reserved
Asynchronous
External clock
Clock input * 3
Synchronous
External clock
Serial clock input
Asynchronous
Reserved
Reserved
Synchronous
Reserved
Reserved
0
1
1
0
1
1
Notes: 1. Initial value
2. A clock is output with the same frequency as the bit rate.
3. Input a clock with a frequency 16 times the bit rate.
Serial Status Register (SSR)
Bit
7
6
5
4
3
2
1
0
TDRE
RDRF
OER
FER
PER
TEND
MPBR
MPBT
Initial value
1
0
0
0
0
1
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R
R
R/W
Note: * Only 0 can be written for flag clearing.
257
The serial status register (SSR) is an 8-bit register containing status flags for indicating SCI3
states, and containing the multiprocessor bits.
SSR can be read and written by the CPU at any time, but the CPU cannot write a 1 to the status
flags TDRE, RDRF, OER, PER, and FER. To clear these flags to 0 it is first necessary to read a 1.
Bit 2 (TEND) and bit 1 (MPBR) are read-only bits and cannot be modified.
SSR is initialized to H'84 upon reset or in standby mode, watch mode, subactive mode, or
subsleep mode.
Bit 7—Transmit Data Register Empty (TDRE): Bit 7 is a status flag indicating that data has
been transferred from TDR to TSR.
Bit 7: TDRE
Description
0
Indicates that transmit data written to TDR has not been transferred to TSR
Clearing conditions:
After reading TDRE = 1, cleared by writing 0 to TDRE.
When data is written to TDR by an instruction.
1
Indicates that no transmit data has been written to TDR, or the transmit data
written to TDR has been transferred to TSR
(initial value)
Setting conditions:
When bit TE in SCR3 is cleared to 0.
When data is transferred from TDR to TSR.
Bit 6—Receive Data Register Full (RDRF): Bit 6 is a status flag indicating whether there is
receive data in RDR.
Bit 6: RDRF
Description
0
Indicates there is no receive data in RDR
(initial value)
Clearing conditions:
After reading RDRF = 1, cleared by writing 0 to RDRF.
When data is read from RDR by an instruction.
1
Indicates that there is receive data in RDR
Setting condition:
When receiving ends normally, with receive data transferred from RSR to RDR
Note: If a receive error is detected at the end of receiving, or if bit RE in serial control register 3
(SCR3) is cleared to 0, RDR and RDRF are unaffected and keep their previous states. An
overrun error (OER) occurs if receiving of data is completed while bit RDRF remains set
to 1. If this happens, receive data will be lost.
258
Bit 5—Overrun Error (OER): Bit 5 is a status flag indicating that an overrun error has occurred
during data receiving.
Bit 5: OER
Description
0
Indicates that data receiving is in progress or has been completed* 1 (initial value)
Clearing condition:
After reading OER = 1, cleared by writing 0 to OER
1
Indicates that an overrun error occurred in data receiving* 2
Setting condition:
When data receiving is completed while RDRF is set to 1
Notes: 1. When bit RE in serial control register 3 (SCR3) is cleared to 0, OER is unaffected and
keeps its previous state.
2. RDR keeps the data received prior to the overrun; data received after that is lost. While
OER is set to 1, data receiving cannot be continued. In synchronous mode, data
transmitting cannot be continued either.
Bit 4—Framing Error (FER): Bit 4 is a status flag indicating that a framing error has occurred
during asynchronous receiving.
Bit 4: FER
Description
0
Indicates that data receiving is in progress or has been completed* 1 (initial value)
Clearing condition:
After reading FER = 1, cleared by writing 0 to FER
1
Indicates that a framing error occurred in data receiving
Setting condition:
The stop bit at the end of receive data is checked for a value of 1 and found to be
0* 2
Notes: 1. When bit RE in serial control register 3 (SCR3) is cleared to 0, FER is unaffected and
keeps its previous state.
2. When two stop bits are used only the first stop bit is checked, not the second. When a
framing error occurs, receive data is transferred to RDR but RDRF is not set. While
FER is set to 1, data receiving cannot be continued. In synchronous mode, data
transmitting cannot be continued either.
259
Bit 3—Parity Error (PER): Bit 3 is a status flag indicating that a parity error has occurred during
asynchronous receiving.
Bit 3: PER
Description
0
Indicates that data receiving is in progress or has been completed* 1 (initial value)
Clearing condition:
After reading PER = 1, cleared by writing 0 to PER
1
Indicates that a parity error occurred in data receiving * 2
Setting condition:
When the sum of 1s in received data plus the parity bit does not match the parity
mode bit (PM) setting in the serial mode register (SMR)
Notes: 1. When bit RE in serial control register 3 (SCR3) is cleared to 0, PER is unaffected and
keeps its previous state.
2. When a parity error occurs, receive data is transferred to RDR but RDRF is not set.
While PER is set to 1, data receiving cannot be continued. In synchronous mode, data
transmitting cannot be continued either.
Bit 2—Transmit End (TEND): Bit 2 is a status flag indicating that TDRE was set to 1 when the
last bit of a transmitted character was sent. TEND is a read-only bit and cannot be modified
directly.
Bit 2: TEND
0
Description
Indicates that transmission is in progress
Clearing conditions:
After reading TDRE = 1, cleared by writing 0 to TDRE.
When data is written to TDR by an instruction.
1
Indicates that a transmission has ended
(initial value)
Setting conditions:
When bit TE in SCR3 is cleared to 0.
If TDRE is set to 1 when the last bit of a transmitted character is sent.
Bit 1—Multiprocessor Bit Receive (MPBR): Bit 1 holds the multiprocessor bit in data received
in asynchronous mode using a multiprocessor format. MPBR is a read-only bit and cannot be
modified.
Bit 1: MPBR
Description
0
Indicates reception of data in which the multiprocessor bit is 0*
1
Indicates reception of data in which the multiprocessor bit is 1
(initial value)
Note: * If bit RE is cleared to 0 while a multiprocessor format is in use, MPBR retains its previous
state.
260
Bit 0—Multiprocessor Bit Transmit (MPBT): Bit 0 holds the multiprocessor bit to be added to
transmitted data when a multiprocessor format is used in asynchronous mode. Bit MPBT is
ignored when synchronous mode is chosen, when the multiprocessor communication function is
disabled, or when data transmission is disabled.
Bit 0: MPBT
Description
0
The multiprocessor bit in transmit data is 0
1
The multiprocessor bit in transmit data is 1
(initial value)
Bit Rate Register (BRR)
Bit
7
6
5
4
3
2
1
0
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
The bit rate register (BRR) is an 8-bit register which, together with the baud rate generator clock
selected by bits CKS1 and CKS0 in the serial mode register (SMR), sets the transmit/receive bit
rate.
BRR can be read or written by the CPU at any time.
BRR is initialized to H'FF upon reset or in standby mode, watch mode, subactive mode, or
subsleep mode.
Table 10.8 gives examples of how BRR is set in asynchronous mode. The values in
table 10.8 are for active (high-speed) mode.
261
Table 10.8 BRR Settings and Bit Rates in Asynchronous Mode
OSC (MHz)
2
2.4576
4
4.194304
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
1
70
+0.03
1
86
+0.31
1
141
+0.03
1
148
–0.04
150
0
207
+0.16
0
255
0
1
103
+0.16
1
108
+0.21
300
0
103
+0.16
0
127
0
0
207
+0.16
0
217
+0.21
600
0
51
+0.16
0
63
0
0
103
+0.16
0
108
+0.21
1200
0
25
+0.16
0
31
0
0
51
+0.16
0
54
–0.70
2400
0
12
+0.16
0
15
0
0
25
+0.16
0
26
+1.14
4800
—
—
—
0
7
0
0
12
+0.16
0
13
–2.48
9600
—
—
—
0
3
0
—
—
—
0
6
–2.48
19200
—
—
—
0
1
0
—
—
—
—
—
—
31250
0
0
0
—
—
—
0
1
0
—
—
—
38400
—
—
—
0
0
0
—
—
—
—
—
—
Table 10.8 BRR Settings and Bit Rates in Asynchronous Mode (cont)
OSC (MHz)
4.9152
6
7.3728
8
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
n
N
Error
(%)
110
1
174
–0.26
1
212
+0.03
2
64
+0.70
2
70
+0.03
150
1
127
0
1
155
+0.16
1
191
0
1
207
+0.16
300
0
255
0
1
77
+0.16
1
95
0
1
103
+0.16
600
0
127
0
0
155
+0.16
0
191
0
0
207
+0.16
1200
0
63
0
0
77
+0.16
0
95
0
0
103
+0.16
2400
0
31
0
0
38
+0.16
0
47
0
0
51
+0.16
4800
0
15
0
0
19
–2.34
0
23
0
0
25
+0.16
9600
0
7
0
0
9
–2.34
0
11
0
0
12
+0.16
19200
0
3
0
0
4
–2.34
0
5
0
—
—
—
31250
—
—
—
0
2
0
—
—
—
0
3
0
38400
0
1
0
—
—
—
0
2
0
—
—
—
262
Table 10.8 BRR Settings and Bit Rates in Asynchronous Mode (cont)
OSC (MHz)
9.8304
10
Bit Rate
(bits/s)
n
N
Error
(%)
n
N
Error
(%)
110
2
86
+0.31
2
88
–0.25
150
1
255
0
2
64
+0.16
300
1
127
0
1
129
+0.16
600
0
255
0
1
64
+0.16
1200
0
127
0
0
129
+0.16
2400
0
63
0
0
64
+0.16
4800
0
31
0
0
32
–1.36
9600
0
15
0
0
15
+1.73
19200
0
7
0
0
7
+1.73
31250
0
4
–1.70
0
4
0
38400
0
3
0
0
3
+1.73
Notes: 1. Settings should be made so that error is within 1%.
2. BRR setting values are derived by the following equation.
N=
OSC
× 106 – 1
64 × 22n × B
B:
N:
OSC:
n:
Bit rate (bits/s)
BRR baud rate generator setting (0 ≤ N ≤ 255)
Value of φ OSC (MHz)
Baud rate generator input clock number (n = 0, 1, 2, 3)
3. The error values in table 10.8 were derived by performing the following calculation and
rounding off to two decimal places.
Error (%) =
B–R
× 100
R
B: Bit rate found from n, N, and OSC
R: Bit rate listed in left column of table 10.8
263
The meaning of n is shown in table 10.9.
Table 10.9 Relation between n and Clock
SMR Setting
n
Clock
CKS1
CKS0
0
φ
0
0
1
φ /4
0
1
2
φ /16
1
0
3
φ /64
1
1
Table 10.10 shows the maximum bit rate for selected frequencies in asynchronous mode. Values
in table 10.10 are for active (high-speed) mode.
Table 10.10 Maximum Bit Rate at Selected Frequencies (Asynchronous Mode)
Setting
OSC (MHz)
Maximum Bit Rate (bits/s)
n
N
2
31250
0
0
2.4576
38400
0
0
4
62500
0
0
4.194304
65536
0
0
4.9152
76800
0
0
6
93750
0
0
7.3728
115200
0
0
8
125000
0
0
9.8304
153600
0
0
10
156250
0
0
264
Table 10.11 shows typical BRR settings in synchronous mode. Values in table 10.11 are for active
(high-speed) mode.
Table 10.11 Typical BRR Settings and Bit Rates (Synchronous Mode)
OSC (MHz)
2
4
8
10
Bit Rate
(bits/s)
n
N
n
N
n
N
n
N
110
—
—
—
—
—
—
—
—
250
1
249
2
124
2
249
—
—
500
1
124
1
249
2
124
—
—
1K
0
249
1
124
1
249
—
—
2.5K
0
99
0
199
1
99
1
124
5K
0
49
0
99
0
199
0
249
10K
0
24
0
49
0
99
0
124
25K
0
9
0
19
0
39
0
49
50K
0
4
0
9
0
19
0
24
100K
—
—
0
4
0
9
—
—
250K
0
0*
0
1
0
3
0
4
0
0*
0
1
—
—
0
0*
—
—
500K
1M
2.5M
Note: Blank: Cannot be set
—:
Can be set, but error will result
*:
Continuous transfer not possible at this setting
BRR setting values are derived by the following equation.
N=
OSC
× 106 – 1
8 × 22n × B
B:
N:
OSC:
n:
Bit rate (bits/s)
BRR baud rate generator setting (0 ≤ N ≤ 255)
Value of φ OSC (MHz)
Baud rate generator input clock number (n = 0, 1, 2, 3)
265
The meaning of n is shown in table 10.12.
Table 10.12 Relation between n and Clock
SMR Setting
n
Clock
CKS1
CKS0
0
φ
0
0
1
φ /4
0
1
2
φ /16
1
0
3
φ /64
1
1
10.4.3
Operation
SCI3 supports serial data communication in both asynchronous mode, where each character
transferred is synchronized separately, and synchronous mode, where transfer is synchronized by
clock pulses.
The choice of asynchronous mode or synchronous mode, and the communication format, is made
in the serial mode register (SMR), as shown in table 10.13. The SCI3 clock source is determined
by bit COM in SMR and bits CKE1 and CKE0 in serial control register 3 (SCR3), as shown in
table 10.14.
Asynchronous Mode:
• Data length: choice of 7 bits or 8 bits
• Transmit/receive format options include addition of parity bit, multiprocessor bit, and one or
two stop bits (character length depends on this combination of options).
• Framing error (FER), parity error (PER), overrun error (OER), and line breaks can be detected
when data is received.
• Clock source: Choice of internal clocks or an external clock
When an internal clock is selected: Operates on baud rate generator clock. A clock can be
output with the same frequency as the bit rate.
When an external clock is selected: A clock input with a frequency 16 times the bit rate is
required (internal baud rate generator is not used).
266
Synchronous Mode:
• Transfer format: 8 bits
• Overrun error can be detected when data is received.
• Clock source: Choice of internal clocks or an external clock
When an internal clock is selected: Operates on baud rate generator clock, and outputs a serial
clock.
When an external clock is selected: The internal baud rate generator is not used. Operation is
synchronous with the input clock.
Table 10.13 SMR Settings and SCI3 Communication Format
SMR Setting
Communication Format
Bit 7: Bit 6: Bit 2: Bit 5: Bit 3:
COM CHR MP
PE
STOP Mode
MultiproData Length cessor Bit
Parity Stop Bit
Bit
Length
0
8-bit data
No
0
0
0
0
1
1
Asynchronous
mode
No
2 bits
0
Yes
1
1
0
0
7-bit data
No
1
0
1
1
*
0
*
0
*
1
*
0
*
1
*
*
1 bit
2 bits
Yes
1
0
1 bit
2 bits
1
1
1 bit
1 bit
2 bits
Asynchronous
mode
8-bit data
Yes
1 bit
2 bits
(multiprocessor 7-bit data
format)
Synchronous
mode
No
8-bit data
1 bit
2 bits
No
None
Note: * Don’t care
267
Table 10.14 SMR and SCR3 Settings and Clock Source Selection
SMR
SCR3
Transmit/Receive Clock
Bit 7:
COM
Bit 1:
CKE1
Bit 0:
CKE0
0
0
0
1
1
0
0
0
1
0
Mode
Asynchronous
mode
Clock
Source
Pin SCK3 Function
Internal
I/O port (SCK3 function not used)
Outputs clock with same frequency as
bit rate
External
Clock should be input with frequency
16 times the desired bit rate
Internal
Outputs a serial clock
0
Synchronous
mode
External
Inputs a serial clock
1
1
Reserved
(illegal settings)
1
1
0
1
1
1
1
Continuous Transmit/Receive Operation Using Interrupts: Continuous transmit and receive
operations are possible with SCI3, using the RXI or TXI interrupts. Table 10.15 explains this use
of these interrupts.
Table 10.15 Transmit/Receive Interrupts
Interrupt
Flag
Interrupt Conditions
Remarks
RXI
RDRF
When serial data is received normally
and receive data is transferred from
RSR to RDR, RDRF is set to 1. If RIE
is 1 at this time, RXI is enabled and an
interrupt occurs. (See figure
10.8 (a).)
The RXI interrupt handler routine
should read the receive data from
RDR and clear RDRF to 0.
Continuous receiving is possible if
these operations are completed
before the next data has been
completely received in RSR.
When TSR empty (previous transmission complete) is detected and the
transmit data set in TDR is transferred
to TSR, TDRE is set to 1. If TIE is 1 at
this time, TXI is enabled and an
interrupt occurs. (See figure 10.8 (b).)
The TXI interrupt handler routine
should write the next transmit data
to TDR and clear TDRE to
0.Continuous transmission is
possible if these operations are
completed before the data
transferred to TSR has been
completely transmitted.
When the last bit of the TSR transmit
character has been sent, if TDRE is 1,
then 1 is set in TEND. If TEIE is 1 at
this time, TEI is enabled and an
interrupt occurs. (See figure 10.8 (c).)
TEI indicates that, when the last bit
of the TSR transmit character was
sent, the next transmit data had
not been written to TDR.
RIE
TXI
TDRE
TIE
TEI
TEND
TEIE
268
RDR
RDR
RSR ↑ (received and transferred)
RSR (receiving)
RXD
pin
RXD
pin
RDRF ← 1
(RXI requested if RIE = 1)
RDRF = 0
Figure 10.8 (a) RDRF Setting and RXI Interrupt
TDR (next transmit data)
TDR
TSR (transmitting)
TSR ↓ (transmission complete,
next data transferred)
TXD
pin
TXD
pin
TDRE ← 1
(TXI requested if TIE = 1)
TDRE = 0
Figure 10.8 (b) TDRE Setting and TXI Interrupt
TDR
TDR
TSR (transmitting)
TXD
pin
TSR (transmission end)
TXD
pin
TEND = 0
TEND ← 1
(TEI requested if TEIE = 1)
Figure 10.8 (c) TEND Setting and TEI Interrupt
269
10.4.4
Operation in Asynchronous Mode
In asynchronous communication mode, a start bit indicating the start of communication and a stop
bit indicating the end of communication are added to each character that is sent. In this way
synchronization is achieved for each character as a self-contained unit.
SCI3 consists of independent transmit and receive modules, giving it the capability of full duplex
communication. Both the transmit and receive modules have a double-buffer configuration,
allowing data to be read or written during communication operations so that data can be
transmitted and received continuously.
Transmit/Receive Formats
Figure 10.9 shows the general format for asynchronous serial communication.
(LSB)
Serial
data
Start
bit
1 bit
(MSB)
Transmit or receive data
7 or 8 bits
1
Parity
bit
1 bit
or
none
Stop bit
Mark
state
1 or 2
bits
One unit of data (character or frame)
Figure 10.9 Data Format in Asynchronous Serial Communication Mode
The communication line in asynchronous communication mode normally stays at the high level, in
the “mark” state. SCI3 monitors the communication line, and begins serial data communication
when it detects a “space” (low-level signal), which is regarded as a start bit.
One character consists of a start bit (low level), transmit/receive data (in LSB-first order: starting
with the least significant bit), a parity bit (high or low level), and finally a stop bit (high level), in
this order.
In asynchronous data receiving, synchronization is with the falling edge of the start bit. SCI3
samples data on the 8th pulse of a clock that has 16 times the frequency of the bit rate, so each bit
of data is latched at its center.
Table 10.16 shows the 12 transmit/receive formats formats that can be selected in asynchronous
mode. The format is selected in the serial mode register (SMR).
270
Table 10.16 Serial Communication Formats in Asynchronous Mode
SMR Settings
Serial Transfer Format and Frame Length
CHR
PE
MP
STOP
1
2
3
4
5
6
7
8
9
10
11
12
0
0
0
0
S
8-bit data
STOP
0
0
0
1
S
8-bit data
STOP STOP
0
1
0
0
S
8-bit data
P
STOP
0
1
0
1
S
8-bit data
P
STOP STOP
1
0
0
0
S
7-bit data
STOP
1
0
0
1
S
7-bit data
STOP STOP
1
1
0
0
S
7-bit data
P
STOP
1
1
0
1
S
7-bit data
P
STOP STOP
0
*
1
0
S
8-bit data
MPB STOP
0
*
1
1
S
8-bit data
MPB STOP STOP
1
*
1
0
S
7-bit data
MPB STOP
1
*
1
1
S
7-bit data
MPB STOP STOP
Notation:
S:
Start bit
STOP: Stop bit
P:
Parity bit
MPB: Multiprocessor bit
Note: * Don”t care
271
Clock
The clock source is determined by bit COM in SMR and bits CKE1 and CKE0 in serial control
register 3 (SCR3). See table 10.14 for the settings. Either an internal clock source can be used to
run the built-in baud rate generator, or an external clock source can be input at pin SCK3.
When an external clock is input at pin SCK3, it should have a frequency 16 times the desired bit
rate.
When an internal clock source is used, SCK3 is used as the clock output pin. The clock output has
the same frequency as the serial bit rate, and is synchronized as in figure 10.10 so that the rising
edge of the clock occurs in the center of each bit of transmit/receive data.
Clock
Serial
data
0
D0
D1
D2
D3
D4
D5
D6
D7
0/1
1
1
1 character (1 frame)
Figure 10.10 Phase Relation of Output Clock and Communication Data in Asynchronous
Mode (8-Bit Data, Parity Bit Added, and 2 Stop Bits)
Data Transmit/Receive Operations
SCI3 Initialization: Before data is sent or received, bits TE and RE in serial control register 3
(SCR3) must be cleared to 0, after which initialization can be performed using the procedure
shown in figure 10.11.
Note: When modifying the operation mode, transfer format or other settings, always be sure to
clear bits TE and RE first. When TE is cleared to 0, bit TDRE will be set to 1. Clearing
RE does not clear the status flags RDRF, PER, FER, or OER, or alter the contents of the
receive data register (RDR).
When an external clock is used in asynchronous mode, do not stop the clock during
operation, including during initialization. When an external clock is used in synchronous
mode, do not supply the clock during initialization.
272
Figure 10.11 shows a typical flow chart for SCI3 initialization.
Start
Clear TE and RE to 0 in SCR3
1
Set bits CKE1 and CKE0
2
Select communication format in SMR
3
Set BRR value
Wait
Has a 1-bit
interval elapsed?
Yes
4
Set bits RIE, TIE, TEIE, and MPIE
in SCR3, and set TE or RE to 1
End
No
1. Select the clock in serial control register 3
(SCR3). Other bits must be cleared to 0.
If clock output is selected in asynchronous
mode, a clock signal will be output as soon
as CKE1 and CKE2 have been set.
During reception in synchronous mode, if
clock output is selected by bits CKE1 and
CKE0, a clock signal will be output as soon
as RE is set to 1.
2.
Set the transmit/receive format in the serial
mode register (SMR).
3.
Set the bit rate register (BRR) to the value
giving the desired bit rate.
This step is not required when an external
clock source is used.
4.
Wait for at least a 1-bit interval, then set
bits RIE, TIE, TEIE, and MPIE, and set bit
TE or RE in SCR3 to 1. Setting TE or RE
enables SCI3 to use the TXD or RXD pin.
The initial states in asynchronous mode
are the mark transmit state and the idle
receive state (waiting for a start bit).
Figure 10.11 Typical Flow Chart when SCI3 Is Initialized
273
Transmitting: Figure 10.12 shows a typical flow chart for data transmission. After SCI3
initialization, follow the procedure below.
Start
1
Read bit TDRE in SSR
TDRE = 1?
No
1. Read the serial status register (SRR),
and after confirming that bit TDRE = 1,
write transmit data in the transmit data
register (TDR). When data is written to
TDR, TDRE is automatically cleared to 0.
Yes
Write transmit data in TDR
2
Continue
data transmission?
No
Yes
2. To continue transmitting data, read bit TDRE
to make sure it is set to 1, then write the
next data to TDR. When data is written to
TDR, TDRE is automatically cleared to 0.
Read bit TEND in SSR
No
TEND = 1?
Yes
3
Break output?
Yes
No
3. To output a break signal when transmission
ends, first set the port values PCR = 1 and
PDR = 0, then clear bit TE in SCR3 to 0.
Set PDR = 0 and PCR = 1
Clear bit TE in SCR3 to 0
End
Figure 10.12 Typical Data Transmission Flow Chart (Asynchronous Mode)
SCI3 operates as follows during data transmission.
274
SCI3 monitors bit TDRE in SSR. When this bit is cleared to 0, SCI3 recognizes that there is data
written in the transmit data register (TDR), which it transfers to the transmit shift register (TSR).
Then TDRE is set to 1 and transmission starts. If bit TIE in SCR3 is set to 1, a TXI interrupt is
requested.
Serial data is transmitted from pin TXD using the communication format outlined in
table 10.16. Next, TDRE is checked as the stop bit is being transmitted.
If TDRE is 0, data is transferred from TDR to TSR, and after the stop bit is sent, transmission of
the next frame starts. If TDRE is 1, the TEND bit in SSR is set to 1, and after the stop bit is sent
the output remains at 1 (mark state). A TEI interrupt is requested in this state if bit TEIE in SCR3
is set to 1.
Figure 10.13 shows a typical operation in asynchronous transmission mode.
Transmit
data
Start
bit
Serial
data
1
0
D0
D1
D7
Transmit
data
Parity Stop Start
bit
bit
bit
0/1
1
1 frame
0
D0
D1
D7
Parity Stop Mark
bit
bit
state
0/1
1
1
1 frame
TDRE
TEND
SCI3
TXI request TDRE cleared to 0
operation
User
processing
TXI request
TEI request
Write data in TDR
Figure 10.13 Typical Transmit Operation in Asynchronous Mode
(8-Bit Data, Parity Bit Added, and 1 Stop Bit)
Receiving: Figure 10.14 shows a typical flow chart for receiving serial data. After SCI3
initialization, follow the procedure below.
275
Start
1
Read bits OER, PER, and
FER in SSR
Yes
OER + PER +
FER = 1
No
2
1. Read bits OER, PER, and
FER in the serial status
register (SSR) to
determine if a receive
error has occurred.
If a receive error has
occurred, receive error
processing is executed.
2. Read the serial status register
(SSR), and after confirming
that bit RDRF = 1, read
received data from the receive
data register (RDR).
When RDR data is read, RDRF
is automatically cleared to 0.
Read bit RDRF in SSR
No
RDRF = 1?
Yes
Read received data in RDR
3. To continue receiving data,
read bit RDRF and finish
reading RDR before the stop
bit of the present frame is
received.
When data is read from RDR,
RDRF is automatically cleared
to 0.
4 Receive error processing
Yes
3
Continue receiving?
No
A
Clear bit RE in SCR3 to 0
End
4
Start receive
error processing
Overrun error
processing
Yes
OER = 1?
No
Yes
Yes
FER = 1?
4. When a receive error occurs,
read bits OER, PER, and FER
in SSR to determine which
error (s) occurred.
After the necessary error
processing, be sure to clear
the above bits all to 0.
Data receiving cannot be resumed
while any of bits OER, PER, or
FER is set to 1.
When a framing error occurs,
a break can be detected by
reading the RXD pin value.
Break?
No
No
Framing error
processing
Yes
PER = 1?
No
Clear bits OER, PER, and
FER in SSR to 0
End receive error
processing
Parity error
processing
A
Figure 10.14 Typical Serial Data Receiving Flow Chart in Asynchronous Mode
276
SCI3 operates as follows when receiving serial data in asynchronous mode.
SCI3 monitors the communication line, and when a start bit (0) is detected it performs internal
synchronization and starts receiving. The communication format for data receiving is as outlined
in table 10.16. Received data is set in RSR from LSB to MSB, then the parity bit and stop bit(s)
are received. After receiving the data, SCI3 performs the following checks:
• Parity check: The number of 1s received is checked to see if it matches the odd or even parity
selected in bit PM of SMR.
• Stop bit check: The stop bit is checked for a value of 1. If there are two stop bits, only the first
bit is checked.
• Status check: The RDRF bit is checked for a value of 0 to make sure received data can be
transferred from RSR to RDR.
If no receive error is detected by the above checks, bit RDRF is set to 1 and the received data is
stored in RDR. At that time, if bit RIE in SCR3 is set to 1, an RXI interrupt is requested. If the
error check detects a receive error, the appropriate error flag (OER, PER, or FER) is set to 1.
RDRF retains the same value as before the data was received. If at this time bit RIE in SCR3 is set
to 1, an ERI interrupt is requested.
Table 10.17 gives the receive error detection conditions and the processing of received data in
each case.
Note: Data receiving cannot be continued while a receive error flag is set. Before continuing the
receive operation it is necessary to clear the OER, FER, PER, and RDRF flags to 0.
Table 10.17 Receive Error Conditions and Received Data Processing
Receive Error
Abbrev.
Detection Conditions
Received Data Processing
Overrun error
OER
Receiving of the next data ends while Received data is not
bit RDRF in SSR is still set to 1
transferred from RSR to RDR
Framing error
FER
Stop bit is 0
Received data is transferred
from RSR to RDR
Parity error
PER
Received data does not match the
parity (odd/even) set in SMR
Received data is not
transferred from RSR to RDR
277
Figure 10.15 shows a typical SCI3 data receive operation in asynchronous mode.
Start
bit
Serial 1
data
Receive
data
0
D0
D1
Parity Stop Start
bit
bit
bit
D7
0/1
1
0
Receive
data
D0
D1
Parity Stop
bit
bit
D7
0/1
0
Mark
(idle state)
1
1 frame
1 frame
RDRF
FER
SCI3 operation
RXI request
User processing
RDRF cleared
to 0
Detects stop bit = 0
ERI request due
to framing error
Read RDR data
Framing error
handling
Figure 10.15 Typical Receive Operation in Asynchronous Mode
(8-Bit Data, Parity Bit Added, and 1 Stop Bit)
10.4.5
Operation in Synchronous Mode
In synchronous mode, data is sent or received in synchronization with clock pulses. This mode is
suited to high-speed serial communication.
SCI3 consists of independent transmit and receive modules, so full duplex communication is
possible, sharing the same clock between both modules. Both the transmit and receive modules
have a double-buffer configuration. This allows data to be written during a transmit operation so
that data can be transmitted continuously, and enables data to be read during a receive operation so
that data can be received continuously.
278
Transmit/Receive Format
Figure 10.16 shows the general communication data format for synchronous communication.
*
*
Serial clock
LSB
Serial data
Don't
care
Bit 0
MSB
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Don't
care
8 bits
One unit of communication data (character or frame)
Note: * At high level except during continuous transmit/receive.
Figure 10.16 Data Format in Synchronous Communication Mode
In synchronous communication, data on the communication line is output from one falling edge of
the serial clock until the next falling edge. Data is guaranteed valid at the rising edge of the serial
clock.
One character of data starts from the LSB and ends with the MSB. The communication line retains
the MSB state after the MSB is output.
In synchronous receive mode, SCI3 latches receive data in synchronization with the rising edge of
the serial clock.
The transmit/receive format is fixed at 8-bit data. No parity bit or multiprocessor bit is added in
this mode.
Clock
Either an internal clock from the built-in baud rate generator is used, or an external clock is input
at pin SCK3. The choice of clock sources is designated by bit COM in SMR and bits CKE1 and
CKE0 in serial control register 3 (SCR3). See table 10.14 for details on selecting the clock source.
When operation is based on an internal clock, a serial clock is output at pin SCK3. Eight clock
pulses are output per character of transmit/receive data. When no transmit or receive operation is
being performed, the pin is held at the high level.
279
Data Transmit/Receive Operations
SCI3 Initialization: Before transmitting or receiving data, follow the SCI3 initialization
procedure explained under 10.4.4, SCI3 Initialization, and illustrated in figure 10.10.
Transmitting: Figure 10.17 shows a typical flow chart for data transmission. After SCI3
initialization, follow the procedure below.
Start
1
Read bit TDRE in SSR
No
TDRE = 1?
Yes
Write transmit data in TDR
1. Read the serial status register (SSR),
and after confirming that bit TDRE = 1,
write transmit data in the transmit
data register (TDR).
When data is written to TDR, TDRE is
automatically cleared to 0 and data
transmission begins.
If clock output has been selected, after
data is written to TDR, the clock is
output and data transmission begins.
Yes
2
Continue data transmission?
2. To continue transmitting data, read
bit TDRE to make sure it is set to 1,
then write the next data to TDR.
When data is written to TDR, TDRE
is automatically cleared to 0.
No
Read bit TEND in SSR
TEND = 1?
No
Yes
Write 0 to bit TE in SCR3
End
Figure 10.17 Typical Data Transmission Flow Chart in Synchronous Mode
280
SCI3 operates as follows during data transmission in synchronous mode.
SCI3 monitors bit TDRE in SSR. When this bit is cleared to 0, SCI3 recognizes that there is data
written in the transmit data register (TDR), which it transfers to the transmit shift register (TSR).
Then TDRE is set to 1 and transmission starts. If bit TIE in SCR3 is set to 1, a TXI interrupt is
requested.
If clock output is selected, SCI3 outputs eight serial clock pulses. If an external clock is used, data
is output in synchronization with the clock input.
Serial data is transmitted from pin TXD in order from LSB (bit 0) to MSB (bit 7).
Then TDRE is checked as the MSB (bit 7) is being transmitted. If TDRE is 0, data is transferred
from TDR to TSR, and after the MSB (bit 7) is sent, transmission of the next frame starts. If
TDRE is 1, the TEND bit in SSR is set to 1, and after the MSB (bit 7) has been sent, the MSB
state is maintained. A TEI interrupt is requested in this state if bit TEIE in SCR3 is set to 1.
After data transmission ends, pin SCK3 is held at the high level.
Note: Data transmission cannot take place while any of the receive error flags (OER, FER, PER)
is set to 1. Be sure to confirm that these error flags are cleared to 0 before starting
transmission.
Figure 10.18 shows a typical SCI3 transmit operation in synchronous mode.
Serial
clock
Serial data
Bit 0
Bit 1
Bit 7
1 frame
Bit 0
Bit 1
Bit 6
Bit 7
1 frame
TDRE
TEND
SCI3
operation
User
processing
TXI
request
TDRE cleared to 0
TXI
request
TEI request
Write data in TDR
Figure 10.18 Typical SCI3 Transmit Operation in Synchronous Mode
281
Receiving: Figure 10.19 shows a typical flow chart for receiving data. After SCI3 initialization,
follow the procedure below.
Start
Read bit OER in SSR
1
Yes
OER = 1?
1. Read bit OER in the serial status register (SSR)
to determine if an error has occurred. If an
overrun error has occurred, overrun error
processing is executed.
No
2
Read bit RDRF in SSR
No
RDRF = 1?
2. Read the serial status register (SSR), and after
confirming that bit RDRF = 1, read received
data from the receive data register (RDR).
When data is read from RDR, RDRF is
automatically cleared to 0.
Yes
Read received data in RDR
4 Overrun error processing
Continue
receiving?
3
No
Clear bit RE in SCR3 to 0
End
4
Yes
3. To continue receiving data, read bit RDRF and
read the received data in RDR before the MSB
(bit 7) of the present frame is received.
When data is read from RDR, RDRF is
automatically cleared to 0.
4. When an overrun error occurs, read bit OER in
SSR. After the necessary error processing,
be sure to clear OER to 0.
Data receiving cannot be resumed while bit
OER is set to 1.
Start overrun
processing
Overrun error
processing
Clear bit OER in
SSR to 0
End overrun
error processing
Figure 10.19 Typical Data Receiving Flow Chart in Synchronous Mode
282
SCI3 operates as follows when receiving serial data in synchronous mode.
SCI3 synchronizes internally with the input or output of the serial clock and starts receiving.
Received data is set in RSR from LSB to MSB.
After data has been received, SCI3 checks to confirm that the value of bit RDRF is 0 indicating
that received data can be transferred from RSR to RDR. If this check passes, RDRF is set to 1 and
the received data is stored in RDR. At this time, if bit RIE in SCR3 is set to 1, an RXI interrupt is
requested. If an overrun error is detected, OER is set to 1 and RDRF remains set to 1. Then if bit
RIE in SCR3 is set to 1, an ERI interrupt is requested.
For the overrun error detection conditions and receive data processing, see table 10.17.
Note: Data receiving cannot be continued while a receive error flag is set. Before continuing the
receive operation it is necessary to clear the OER, FER, PER, and RDRF flags to 0.
Figure 10.20 shows a typical receive operation in synchronous mode.
Serial
clock
Serial
data
Bit 7
Bit 0
Bit 7
Bit 0
1 frame
Bit 1
Bit 6
Bit 7
1 frame
RDRF
OER
SCI3
operation
User
processing
RXI request RDRF cleared
to 0
Read data
from RDR
RXI request
ERI request due
to overrun error
RDR data
not read
(RDRF = 1)
Overrun error
handling
Figure 10.20 Typical Receive Operation in Synchronous Mode
283
Simultaneous Transmit/Receive: Figure 10.21 shows a typical flow chart for transmitting and
receiving simultaneously. After SCI3 synchronization, follow the procedure below.
1. Read the serial status register (SSR),
and after confirming that bit TDRE = 1,
write transmit data in the transmit data
register (TDR). When data is written to
TDR, TDRE is automatically cleared to 0.
Start
1
Read bit TDRE in SSR
No
TDRE = 1?
Yes
2
Write transmit data in TDR
Read bit OER in SSR
Yes
OER = 1?
No
Read RDRF in SSR
No
RDRF = 1?
Yes
Read received data in RDR
4
3
Continue
transmitting and
receiving?
2. Read the serial status register (SSR),
and after confirming that bit RDRF = 1,
read the received data from the receive
data register (RDR). When data is read
from RDR, RDRF is automatically cleared
to 0.
3. To continue transmitting and receiving
serial data, read bit RDRF and finish
reading RDR before the MSB (bit 7) of the
present frame is received. Also read bit
TDRE, check that it is set to 1, and write
the next data in TDR before the MSB of
the current frame has been transmitted.
When data is written to TDR, TDRE is
automatically cleared to 0; and when data
is read from RDR, RDRF is automatically
cleared to 0.
4. When an overrun error occurs, read bit
OER in SSR. After the necessary error
processing, be sure to clear OER to 0.
Data transmission and reception cannot
take place while bit OER is set to 1. See
figure 10.19 for overrun error processing.
Overrun error processing
Yes
No
Clear bits TE and
RE in SCR3 to 0
End
Figure 10.21 Simultaneous Transmit/Receive Flow Chart in Synchronous Mode
284
Notes: 1. To switch from transmitting to simultaneous transmitting and receiving, use the
following procedure.
• First confirm that TDRE and TEND are both set to 1 and that SCI3 has finished
transmitting. Next clear TE to 0. Then set both TE and RE to 1.
2. To switch from receiving to simultaneous transmitting and rceiving, use the following
procedure.
• After confirming that SCI3 has finished receiving, clear RE to 0. Next, after
confirming that RDRF and the error flags (OER FER, PER) are all 0, set both TE
and RE to 1.
10.4.6
Multiprocessor Communication Function
The multiprocessor communication function enables several processors to share a single serial
communication line. The processors communicate in asynchronous mode using a format with an
additional multiprocessor bit (multiprocessor format).
In multiprocessor communication, each receiving processor is addressed by an ID code. A serial
communication cycle consists of two cycles: an ID-sending cycle that identifies the receiving
processor, and a data-sending cycle. The ID-sending cycle and data-sending cycle are
differentiated by the multiprocessor bit. The multiprocessor bit is 1 in an ID-sending cycle, and 0
in a data-sending cycle.
The transmitting processor starts by sending the ID of the receiving processor with which it wants
to communicate as data with the multiprocessor bit set to 1. Next the transmitting processor sends
transmit data with the multiprocessor bit cleared to 0. When a receiving processor receives data
with the multiprocessor bit set to 1, it compares the data with its own ID. If the data matches its
ID, the receiving processor continues to receive incoming data. If the data does not match its ID,
the receiving processor skips further incoming data until it again receives data with the
multiprocessor bit set to 1. Multiple processors can send and receive data in this way.
Figure 10.22 shows an example of communication among different processors using a
multiprocessor format.
285
Transmitting
processor
Communication line
Receiving
processor A
Receiving
processor B
Receiving
processor C
Receiving
processor D
(ID = 01)
(ID = 02)
(ID = 03)
(ID = 04)
Serial data
H'01
H'AA
(MPB = 1)
ID-sending cycle
(receiving processor
address)
(MPB = 0)
Data-sending cycle
(data sent to receiving
processor designated
by ID)
MPB: Multiprocessor bit
Figure 10.22 Example of Interprocessor Communication Using Multiprocessor Format
(Data H'AA Sent to Receiving Processor A)
Four communication formats are available. Parity-bit settings are ignored when a multiprocessor
format is selected. For details see table 10.16.
For a description of the clock used in multiprocessor communication, see 10.4.4, Operation in
Asynchronous Mode.
286
Transmitting Multiprocessor Data: Figure 10.23 shows a typical flow chart for multiprocessor
serial data transmission. After SCI3 initialization, follow the procedure below.
Start
1
Read bit TDRE in SSR
No
TDRE = 1?
Yes
1. Read the serial status register (SSR), and
after confirming that bit TDRE = 1, set bit
MPBT (multiprocessor bit transmit) in SSR
to 0 or 1, then write transmit data in the
transmit data register (TDR).
When data is written to TDR, TDRE is
automatically cleared to 0.
Set bit MPBT in SSR
Write transmit data to TDR
2
Continue
transmitting?
Yes
No
Read bit TEND in SSR
No
TEND = 1?
Yes
3
Break output?
No
2. To continue transmitting data, read bit
TDRE to make sure it is set to 1, then
write the next data to TDR.
When data is written to TDR, TDRE
is automatically cleared to 0.
3. To output a break signal at the end of data
transmission, first set the port values
PCR = 1 and PDR = 0, then clear bit TE
in SCR3 to 0.
Yes
Set PDR = 0 and PCR = 1
Clear bit TE in SCR3 to 0
End
Figure 10.23 Typical Multiprocessor Data Transmission Flow Chart
287
SCI3 operates as follows during data transmission using a multiprocessor format.
SCI3 monitors bit TDRE in SSR. When this bit is cleared to 0, SCI3 recognizes that there is data
written in the transmit data register (TDR), which it transfers to the transmit shift register (TSR).
Then TDRE is set to 1 and transmission starts. If bit TIE in SCR3 is set to 1, a TXI interrupt is
requested.
Serial data is transmitted from pin TXD using the communication format outlined in
table 10.16.
Next, TDRE is checked as the stop bit is being transmitted. If TDRE is 0, data is transferred from
TDR to TSR, and after the stop bit is sent, transmission of the next frame starts. If TDRE is 1, the
TEND bit in SSR is set to 1, and after the stop bit is sent the output remains at 1 (mark state). A
TEI interrupt is requested in this state if bit TEIE in SCR3 is set to 1.
Figure 10.24 shows a typical SCI3 operation in multiprocessor communication mode.
Start
bit
Serial
data
1
0
Transmit
data
D0
D1
D7
MPB
0/1
Stop Start
bit
bit
1
0
Transmit
data
D0
D1
D7
MPB
0/1
Stop Mark
bit
state
1
1 frame
1 frame
TDRE
TEND
SCI3
TXI request
operation
TDRE cleared
to 0
User
processing
Write data in
TDR
TXI
request
TEI
request
Figure 10.24 Typical Multiprocessor Format Transmit Operation
(8-Bit Data, Multiprocessor Bit Added, and 1 Stop Bit)
288
1
Receiving Multiprocessor Data: Figure 10.25 shows a typical flow chart for receiving data using
a multiprocessor format. After SCI3 initialization, follow the procedure below.
Start
1
Set bit MPIE in SCR3 to 1
2
Read bits OER and FER in SSR
1. Set bit MPIE in serial control register 3 (SCR3) to 1.
Yes
2. Read bits OER and FER in the serial status register (SSR)
to determine if an error has occurred. If a receive error has
occurred, receive error processing is executed.
No
3. Read the serial status register (SSR) and confirm that
RDRF = 1. If RDRF = 1, read the data in the received data
register (RDR) and compare it with the processor’s own ID.
If the received data does not match the ID, set bit MPIE to
1 again. Bit RDRF is automatically cleared to 0 when data
in the received data register (RDR) is read.
OER + FER = 1?
3
No
Read bit RDRF in SSR
RDRF = 1?
Yes
4. Read SSR, check that bit RDRF = 1, then read received
data from the receive data register (RDR).
Read received data in RDR
No
Own ID?
5. If a receive error occurs, read bits OER and FER in SSR
to determine which error occurred. After the necessary
error processing, be sure to clear the error flags to 0.
Serial data transfer cannot take place while
bit OER or FER is set to 1.
When a framing error occurs, a break can be detected by
reading the RXD pin value.
Yes
Read bits OER and FER in SSR
Yes
OER + FER = 1?
No
4
Read bit RDRF in SSR
No
RDRF = 1?
Yes
Read received data in RDR
5 Error processing
Yes
Continue receiving?
No
A
Start receive error processing
Clear bit RE in SCR3 to 0
Overrun error
processing
Yes
OER = 1?
End
No
Yes
Yes
Break?
FER = 1?
No
Clear bits OER and
FER in SSR to 0.
End receive error processing
No
Framing error
processing
A
Figure 10.25 Typical Flow Chart for Receiving Serial Data Using Multiprocessor Format
289
Figure 10.26 gives an example of data reception using a multiprocessor format.
Start
bit
Serial
data
1
0
Receive
data (ID1)
D0
D1
Stop Start
MPB bit
bit
D7
1
1
0
Receive
data (data 1)
D0
D1
1 frame
D7
Stop
MPB bit
0
Mark
(idle state)
1
1
1 frame
MPIE
RDRF
RDR
value
ID1
SCI3 operation
RXI request
MPIE cleared to 0
RDRF cleared to 0
User processing
Read data from RDR
No RXI request
RDR state retained
If not own ID,
set MPIE to 1 again
(a) Data does not match own ID
Start
bit
Serial
data
0
1
Receive
data (ID2)
D0
D1
Stop Start
MPB bit
bit
D7
1
1
0
Receive
data (data 2)
D0
D1
1 frame
D7
Stop
MPB bit
0
Mark
(idle state)
1
1
1 frame
MPIE
RDRF
RDR
value
ID1
SCI3 operation
User processing
Data 2
ID2
RXI request
MPIE cleared to 0
RDRF cleared to 0
Read data from RDR
RXI
request
RDRF
cleared
to 0
If own ID, continue
receiving
(b) Data matches own ID
Figure 10.26 Example of Multiprocessor Format Receive Operation
(8-Bit Data, Multiprocessor Bit Added, and 1 Stop Bit)
290
Read data
from RDR
and set
MPIE to 1
again
10.4.7
Interrupts
SCI3 has six interrupt sources: transmit end, transmit data empty, receive data full, and the three
receive error interrupts (overrun error, framing error, and parity error). All share a common
interrupt vector. Table 10.18 describes each interrupt.
Table 10.18 SCI3 Interrupts
Interrupt
Description
Vector Address
RXI
Interrupt request due to receive data register full (RDRF)
H'0024
TXI
Interrupt request due to transmit data register empty (TDRE)
TEI
Interrupt request due to transmit end (TEND)
ERI
Interrupt request due to receive error (OER, FER, or PER)
The interrupt requests are enabled and disabled by bits TIE and RIE of SCR3.
When bit TDRE in SSR is set to 1, TXI is requested. When bit TEND in SSR is set to 1, TEI is
requested. These two interrupt requests occur during data transmission.
The initial value of bit TDRE is 1. Accordingly, if the transmit data empty interrupt request (TXI)
is enabled by setting bit TIE to 1 in SCR3 before placing transmit data in TDR, TXI will be
requested even though no transmit data has been readied.
Likewise, the initial value of bit TEND is 1. Accordingly, if the transmit end interrupt request
(TEI) is enabled by setting bit TEIE to 1 in SCR3 before placing transmit data in TDR, TEI will be
requested even though no data has been transmitted.
These interrupt features can be used to advantage by programming the interrupt handler to move
the transmit data into TDR. When this technique is not used, the interrupt enable bits (TIE and
TEIE) should not be set to 1 until after TDR has been loaded with transmit data, to avoid
unwanted TXI and TEI interrupts.
When bit RDRF in SSR is set to 1, RXI is requested. When any of SSR bits OER, FER, or PER is
set to 1, ERI is requested. These two interrupt requests occur during the receiving of data.
Details on interrupts are given in 3.3, Interrupts.
291
10.4.8
Application Notes
When using SCI3, attention should be paid to the following matters.
Relation between Bit TDRE and Writing Data to TDR: Bit TDRE in the serial status register
(SSR) is a status flag indicating that TDR does not contain new transmit data. TDRE is
automatically cleared to 0 when data is written to TDR. When SCI3 transfers data from TDR to
TSR, bit TDRE is set to 1.
Data can be written to TDR regardless of the status of bit TDRE. However, if new data is written
to TDR while TDRE is cleared to 0, assuming the data held in TDR has not yet been shifted to
TSR, it will be lost. For this reason it is advisable to confirm that bit TDRE is set to 1 before each
write to TDR and not write to TDR more than once without checking TDRE in between.
Operation when Multiple Receive Errors Occur at the Same Time: When two or more receive
errors occur at the same time, the status flags in SSR are set as shown in table 10.19. If an overrun
error occurs, data is not transferred from RSR to RDR, and receive data is lost.
Table 10.19 SSR Status Flag States and Transfer of Receive Data
SSR Status Flags
RDRF OER
*
FER
PER
Receive Error Status
(RSR → RDR)
Receive Data Transfer
1
1
0
0
×
Overrun error
0
0
1
0
O
Framing error
0
0
0
1
O
Parity error
1
1
1
0
×
Overrun error + framing error
1
1
0
1
×
Overrun error + parity error
0
0
1
1
O
Framing error + parity error
1
1
1
1
×
Overrun error + framing error + parity error
Notation:
O: Receive data transferred from RSR to RDR
×: Receive data not transferred from RSR to RDR
Note: * RDRF keeps the same state as before the data was received. However, if due to a late read
of received data in one frame an overrun error occurs in the next frame, RDRF is cleared to
0 when RDR is read.
Break Detection and Processing: Break signals can be detected by reading the RXD pin directly
when a framing error (FER) is detected. In the break state the input from the RXD pin consists of
all 0s, so FER is set and the parity error flag (PER) may also be set. In the break state SCI3
continues to receive, so if the FER bit is cleared to 0 it will be set to 1 again.
292
Sending a Mark or Break Signal: When TE is cleared to 0 the TXD pin becomes an I/O port, the
level and direction (input or output) of which are determined by the PDR and PCR bits. This
feature can be used to place the TXD pin in the mark state or send a break signal.
To place the serial communication line in the mark (1) state before TE is set to 1, set the PDR and
PCR bits both to 1. Since TE is cleared to 0, TXD becomes a general output port outputting the
value 1.
To send a break signal during data transmission, set the PCR bit to 1 and clear the PDR bit to 0,
then clear TE to 0. When TE is cleared to 0 the transmitter is initialized, regardless of its current
state, so the TXD pin becomes an output port outputting the value 0.
Receive Error Flags and Transmit Operation (Sysnchronous Mode Only): When a receive
error flag (ORER, PER, or FER) is set to 1, SCI3 will not start transmitting even if TDRE is
cleared to 0. Be sure to clear the receive error flags to 0 when starting to transmit. Note that
clearing RE to 0 does not clear the receive error flags.
Receive Data Sampling Timing and Receive Margin in Asynchronous Mode: In asynchronous
mode SCI3 operates on a base clock with 16 times the bit rate frequency. In receiving, SCI3
synchronizes internally with the falling edge of the start bit, which it samples on the base clock.
Receive data is latched at the rising edge of the eighth base clock pulse. See figure 10.27.
16 clock cycles
8 clock cycles
Internal base
clock
Receive data
(RXD)
0
7
Start bit
15 0
7
D0
15 0
D1
Synchronization
sampling timing
Data sampling
timing
Figure 10.27 Receive Data Sampling Timing in Asynchronous Mode
293
The receive margin in asynchronous mode can therefore be derived from the following equation.
M = {(0.5 – 1/2N) – (D – 0.5) / N – (L – 0.5) F} × 100% ............................ Equation (1)
M:
N:
D:
L:
F:
Receive margin (%)
Ratio of clock frequency to bit rate (N = 16)
Clock duty cycle (D = 0.5 to 1)
Frame length (L = 9 to 12)
Absolute value of clock frequency error
In equation (1), if F (absolute value of clock frequency error) = 0 and D (clock duty cycle) = 0.5,
the receive margin is 46.875% as given by equation (2) below.
When D = 0.5 and F = 0,
M = {0.5 – 1/(2 × 16)} × 100% = 46.875% ................................................ Equation (2)
This value is theoretical. In actual system designs a margin of from 20 to 30 percent should be
allowed.
Relationship between Bit RDRF and Reading RDR: While SCI3 is receiving, it checks the
RDRF flag. When a frame of data has been received, if the RDRF flag is cleared to 0, data
receiving ends normally. If RDRF is set to 1, an overrun error occurs.
RDRF is automatically cleared to 0 when the contents of RDR are read. If RDR is read more than
once, the second and later reads will be performed with RDRF cleared to 0. While RDRF is 0, if
RDR is read when reception of the next frame is just ending, data from the next frame may be
read. This is illustrated in figure 10.28.
294
Communication line
Frame 1
Frame 2
Frame 3
Data 1
Data 2
Data 3
Data 1
Data 2
RDRF
RDR
A
RDR read
B
RDR read
At A , data 1 is read.
At B , data 2 is read.
Figure 10.28 Relationship between Data and RDR Read Timing
To avoid the situation described above, after RDRF is confirmed to be 1, RDR should only be read
once and should not be read twice or more.
When the same data must be read more than once, the data read the first time should be copied to
RAM, for example, and the copied data should be used. An alternative is to read RDR but leave a
safe margin of time before reception of the next frame is completed. In synchronous mode, all
reads of RDR should be completed before bit 7 is received. In asynchronous mode, all reads of
RDR should be completed before the stop bit is received.
Caution on Switching of SCK3 Function: If pin SCK3 is used as a clock output pin by SCI3 in
synchronous mode and is then switched to a general input/output pin (a pin with a different
function), the pin outputs a low level signal for half a system clock (φ) cycle immediately after it is
switched.
This can be prevented by either of the following methods according to the situation.
1. When an SCK3 function is switched from clock output to non clock-output
When stopping data transfer, issue one instruction to clear bits TE and RE to 0 and to set bits
CKE1 and CKE0 in SCR3 to 1 and 0, respectively. In this case, bit COM in SMR should be
left 1. The above prevents SCK3 from being used as a general input/output pin. To avoid an
intermediate level of voltage from being applied to SCK3, the line connected to SCK3 should
be pulled up to the VCC level via a resistor, or supplied with output from an external device.
295
2. When an SCK3 function is switched from clock output to general input/output
When stopping data transfer,
a. Issue one instruction to clear bits TE and RE to 0 and to set bits CKE1 and CKE0 in SCR3
to 1 and 0, respectively.
b. Clear bit COM in SCR3 to 0
c. Clear bits CKE1 and CKE0 in SCR3 to 0
Note that special care is also needed here to avoid an intermediate level of voltage from being
applied to SCK 3.
Caution on Switching TxD Function: If pin TxD is used as a data output pin by SCI3 in
synchronous mode and is then switched to a general input/output pin (a pin with a different
function), the pin outputs a high level signal for one system clock (φ) cycle immediately after it is
switched.
296
Section 11 14-Bit PWM
11.1
Overview
The H8/3834 Series is provided with a 14-bit PWM (pulse width modulator) on-chip, which can
be used as a D/A converter by connecting a low-pass filter.
11.1.1
Features
Features of the 14-bit PWM are as follows.
• Choice of two conversion periods
A conversion period of 3,268/φ, with a minimum modulation width of 2/φ (PWCR0 = 1), or a
conversion period of 16,384/ φ, with a minimum modulation width of 1/φ (PWCR0 = 0), can be
chosen.
• Pulse division method for less ripple
11.1.2
Block Diagram
Figure 11.1 shows a block diagram of the 14-bit PWM.
PWDRU
φ /2
PWM
waveform
generator
φ /4
Internal data bus
PWDRL
PWCR
PWM
Notation:
PWDRL: PWM data register L
PWDRU: PWM data register U
PWCR: PWM control register
Figure 11.1 Block Diagram of the 14 bit PWM
297
11.1.3
Pin Configuration
Table 11.1 shows the output pin assigned to the 14-bit PWM.
Table 11.1 Pin Configuration
Name
Abbrev.
I/O
Function
PWM output pin
PWM
Output
Pulse-division PWM waveform output
11.1.4
Register Configuration
Table 11.2 shows the register configuration of the 14-bit PWM.
Table 11.2 Register Configuration
Name
Abbrev.
R/W
Initial Value
Address
PWM control register
PWCR
W
H'FE
H'FFD0
PWM data register U
PWDRU
W
H'C0
H'FFD1
PWM data register L
PWDRL
W
H'00
H'FFD2
11.2
Register Descriptions
11.2.1
PWM Control Register (PWCR)
PWCR is an 8-bit write-only register for input clock selection.
Upon reset, PWCR is initialized to H'FE.
Bits 7 to 1—Reserved Bits: Bits 7 to 1 are reserved; they are always read as 1, and cannot be
modified.
Bit 0—Clock Select 0 (PWCR0): B it 0 selects the clock supplied to the 14-bit P WM. This bit is a
write-only bit; it is always read as 1.
Bit 0: PWCR0
Description
0
The input clock is φ /2 (tφ∗ = 2/φ ). The conversion period is 16,384/ φ , with a
minimum modulation width of 1/ φ .
(initial value)
1
The input clock is φ /4 (tφ∗ = 4/φ ). The conversion period is 32,768/ φ , with a
minimum modulation width of 2/ φ .
Note: t φ : Period of PWM input clock
298
11.2.2
PWM Data Registers U and L (PWDRU, PWDRL)
PWDRU and PWDRL form a 14-bit write-only register, with the upper 6 bits assigned to PWDRU
and the lower 8 bits to PWDRL. The value written to PWDRU and PWDRL gives the total highlevel width of one PWM waveform cycle.
When 14-bit data is written to PWDRU and PWDRL, the register contents are latched in the PWM
waveform generator, updating the PWM waveform generation data. The 14-bit data should always
be written in the following sequence, first to PWDRL and then to PWDRU.
1. Write the lower 8 bits to PWDRL.
2. Write the upper 6 bits to PWDRU.
PWDRU and PWDRL are write-only registers. If they are read, all bits are read as 1.
Upon reset, PWDRU and PWDRL are initialized to H'C000.
11.3
Operation
When using the 14-bit PWM, set the registers in the following sequence.
1. Set bit PWM in port mode register 1 (PMR1) to 1 so that pin P14/PWM is designated for PWM
output.
2. Set bit PWCR0 in the PWM control register (PWCR) to select a conversion period of either
32,768/φ (PWCR0 = 1) or 16,384/φ (PWCR0 = 0).
3. Set the output waveform data in PWM data registers U and L (PWDRU/L). Be sure to write in
the correct sequence, first PWDRL then PWDRU. When data is written to PWDRU, the data
in these registers will be latched in the PWM waveform generator, updating the PWM
waveform generation in synchronization with internal signals.
One conversion period consists of 64 pulses, as shown in figure 11.2. The total of the highlevel pulse widths during this period (TH) corresponds to the data in PWDRU and PWDRL.
This relation can be represented as follows.
TH = (data value in PWDRU and PWDRL + 64) × tφ /2
where tφ is the PWM input clock period, either 2/φ (bit PWCR0 = 0) or 4/φ (bit PWCR0 = 1).
Example: Settings in order to obtain a conversion period of 8,192 µs:
When bit PWCR0 = 0, the conversion period is 16,384/φ, so φ must be 2 MHz. In
this case tfn = 128 µs, with 1/ φ (resolution) = 0.5 µs.
When bit PWCR0 = 1, the conversion period is 32,768/φ, so φ must be 4 MHz. In
this case tfn = 128 µs, with 2/ φ (resolution) = 0.5 µs.
299
Accordingly, for a conversion period of 8,192 µs, the system clock frequency ( φ)
must be 2 MHz or 4 MHz.
1 conversion period
t f1
t H1
t f2
t H2
TH = t H1 + t H2 + t H3 +
t f63
t H3
t H63
..... t H64
t f1 = t f2 = t f3 ..... = t f84
Figure 11.2 PWM Output Waveform
300
t f64
t H64
Section 12 A/D Converter
12.1
Overview
The H8/3834 Series includes on-chip a resistance-ladder-based successive-approximation analogto-digital converter, and can convert up to 12 channels of analog input.
12.1.1
Features
The A/D converter has the following features.
•
•
•
•
•
•
8-bit resolution
12 input channels
Conversion time: approx. 12.4 µs per channel (at 5 MHz operation)
Built-in sample-and-hold function
Interrupt requested on completion of A/D conversion
A/D conversion can be started by external trigger input
12.1.2
Block Diagram
Figure 12.1 shows a block diagram of the A/D converter.
ADTRG
AV CC
+
Comparator
–
AV CC
Reference
voltage
AV SS
A/D start
register
Multiplexer
Control logic
Internal data bus
AN 0
AN 1
AN 2
AN 3
AN 4
AN 5
AN 6
AN 7
AN 8
AN 9
AN 10
AN 11
A/D mode
register
AV SS
A/D result register
IRRAD
Figure 12.1 Block Diagram of the A/D Converter
301
12.1.3
Pin Configuration
Table 12.1 shows the A/D converter pin configuration.
Table 12.1 Pin Configuration
Name
Abbrev.
I/O
Function
Analog power supply pin
AVCC
Input
Power supply and reference voltage of analog part
Analog ground pin
AVSS
Input
Ground and reference voltage of analog part
Analog input pin 0
AN 0
Input
Analog input channel 0
Analog input pin 1
AN 1
Input
Analog input channel 1
Analog input pin 2
AN 2
Input
Analog input channel 2
Analog input pin 3
AN 3
Input
Analog input channel 3
Analog input pin 4
AN 4
Input
Analog input channel 4
Analog input pin 5
AN 5
Input
Analog input channel 5
Analog input pin 6
AN 6
Input
Analog input channel 6
Analog input pin 7
AN 7
Input
Analog input channel 7
Analog input pin 8
AN 8
Input
Analog input channel 8
Analog input pin 9
AN 9
Input
Analog input channel 9
Analog input pin 10
AN 10
Input
Analog input channel 10
Analog input pin 11
AN 11
Input
Analog input channel 11
External trigger input pin
ADTRG
Input
External trigger input for starting A/D conversion
12.1.4
Register Configuration
Table 12.2 shows the A/D converter register configuration.
Table 12.2 Register Configuration
Name
Abbrev.
R/W
Initial Value
Address
A/D mode register
AMR
R/W
H'30
H'FFC4
A/D start register
ADSR
R/W
H'7F
H'FFC6
A/D result register
ADRR
R
Not fixed
H'FFC5
302
12.2
Register Descriptions
12.2.1
A/D Result Register (ADRR)
Bit
7
6
5
4
3
2
1
0
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
ADR0
Initial value
—
—
—
—
—
—
—
—
Read/Write
R
R
R
R
R
R
R
R
The A/D result register (ADRR) is an 8-bit read-only register for holding the results of analog-todigital conversion.
ADRR can be read by the CPU at any time, but the ADRR values during A/D conversion are not
fixed.
After A/D conversion is complete, the conversion result is stored in ADRR as 8-bit data; this data
is held in ADRR until the next conversion operation starts.
ADRR is not cleared on reset.
12.2.2
A/D Mode Register (AMR)
Bit
7
6
5
4
3
2
1
0
CKS
TRGE
—
—
CH3
CH2
CH1
CH0
Initial value
0
0
1
1
0
0
0
0
Read/Write
R/W
R/W
—
—
R/W
R/W
R/W
R/W
AMR is an 8-bit read/write register for specifying the A/D conversion speed, external trigger
option, and the analog input pins.
Upon reset, AMR is initialized to H'30.
303
Bit 7—Clock Select (CKS): Bit 7 sets the A/D conversion speed.
Conversion Time
Bit 7: CKS
Conversion Period
φ = 2 MHz
φ = 5 MHz
0
62/ φ (initial value)
31 µs
12.4 µs
1
31/ φ
15.5 µs
—*
Note: * Operation is not guaranteed if the conversion time is less than 12.4 µs. Set bit 7 for a value
of at least 12.4 µs.
Bit 6—External Trigger Select (TRGE): Bit 6 enables or disables the start of A/D conversion by
external trigger input.
Bit 6: TRGE
Description
0
Disables start of A/D conversion by external trigger
1
Enables start of A/D conversion by rising or falling edge of external trigger at
pin ADTRG*
(initial value)
Note: * The external trigger (ADTRG) edge is selected by bit INTEG4 of the IRQ edge select
register (IEGR). See 3.3.2, Interrupt Edge Select Register (IEGR), for details.
Bits 5 and 4—Reserved Bits: Bits 5 and 4 are reserved; they are always read as 1, and cannot be
modified.
Bits 3 to 0—Channel Select (CH3 to CH0): Bits 3 to 0 select the analog input channel.
The channel selection should be made while bit ADSF is cleared to 0.
304
Bit 3:
CH3
Bit 2:
CH2
Bit 1:
CH1
Bit 0:
CH0
Analog Input Channel
0
0
*
*
No channel selected
1
0
0
AN 0
1
AN 1
0
AN 2
1
AN 3
0
AN 4
1
AN 5
0
AN 6
1
AN 7
0
AN 8
1
AN 9
0
AN 10
1
AN 11
1
1
0
0
1
1
0
1
(initial value)
Note: * Don’t care
12.2.3
A/D Start Register (ADSR)
Bit
7
6
5
4
3
2
1
0
ADSF
—
—
—
—
—
—
—
Initial value
0
1
1
1
1
1
1
1
Read/Write
R/W
—
—
—
—
—
—
—
The A/D start register (ADSR) is an 8-bit read/write register for starting and stopping A/D
conversion.
A/D conversion is started by writing 1 to the A/D start flag (ADSF) or by input of the designated
edge of the external trigger signal, which also sets ADSF to 1. When conversion is complete, the
converted data is set in the A/D result register (ADRR), and at the same time ADSF is cleared
to 0.
305
Bit 7—A/D Start Flag (ADSF): Bit 7 controls and indicates the start and end of A/D conversion.
Bit 7: ADSF
Description
0
Read: Indicates the completion of A/D conversion
(initial value)
Write: Stops A/D conversion
1
Read: Indicates A/D conversion in progress
Write: Starts A/D conversion
Bits 6 to 0—Reserved Bits: Bits 6 to 0 are reserved; they are always read as 1, and cannot be
modified.
12.3
Operation
12.3.1
A/D Conversion Operation
The A/D converter operates by successive approximations, and yields its conversion result as 8-bit
data.
A/D conversion begins when software sets the A/D start flag (bit ADSF) to 1. Bit ADSF keeps a
value of 1 during A/D conversion, and is cleared to 0 automatically when conversion is complete.
The completion of conversion also sets bit IRRAD in interrupt request register 2 (IRR2) to 1. An
A/D conversion end interrupt is requested if bit IENAD in interrupt enable register 2 (IENR2) is
set to 1.
If the conversion time or input channel needs to be changed in the A/D mode register (AMR)
during A/D conversion, bit ADSF should first be cleared to 0, stopping the conversion operation,
in order to avoid malfunction.
12.3.2
Start of A/D Conversion by External Trigger Input
The A/D converter can be made to start A/D conversion by input of an external trigger signal.
External trigger input is enabled at pin ADTRG when bit IRQ4 in port mode register 2 (PMR2) is
set to 1, and bit TRGE in AMR is set to 1. Then when the input signal edge designated in bit IEG4
of the IRQ edge select register (IEGR) is detected at pin ADTRG, bit ADSF in ADSR will be set
to 1, starting A/D conversion.
Figure 12.2 shows the timing.
306
φ
Pin ADTRG
(when bit
IEG4 = 0)
ADSF
A/D conversion
Figure 12.2 External Trigger Input Timing
12.4
Interrupts
When A/D conversion ends (ADSF changes from 1 to 0), bit IRRAD in interrupt request
register 2 (IRR2) is set to 1.
A/D conversion end interrupts can be enabled or disabled by means of bit IENAD in interrupt
enable register 2 (IENR2).
For further details see 3.3, Interrupts.
12.5
Typical Use
An example of how the A/D converter can be used is given below, using channel 1 (pin AN1) as
the analog input channel. Figure 12.3 shows the operation timing.
• Bits CH3 to CH0 of the A/D mode register (AMR) are set to 0101, making pin AN1 the analog
input channel. A/D interrupts are enabled by setting bit IENAD to 1, and A/D conversion is
started by setting bit ADSF to 1.
• When A/D conversion is complete, bit IRRAD is set to 1, and the A/D conversion result is
stored in the A/D result register (ADRR). At the same time ADSF is cleared to 0, and the A/D
converter goes to the idle state.
• Bit IENAD = 1, so an A/D conversion end interrupt is requested.
• The A/D interrupt handling routine starts.
• The A/D conversion result is read and processed.
• The A/D interrupt handling routine ends.
If ADSF is set to 1 again afterward, A/D conversion starts and steps 2 through 6 take place.
Figures 12.4 and 12.5 show flow charts of procedures for using the A/D converter.
307
Figure 12.3 Typical A/D Converter Operation Timing
308
Idle
A/D conversion starts
A/D conversion (1)
Set *
Set *
Note: * ( ) indicates instruction execution by software.
ADRR
Channel 1 (AN1)
operation state
ADSF
IENAD
Interrupt
(IRRAD)
A/D conversion (2)
A/D conversion result (1)
Read conversion result
Idle
Set *
A/D conversion result (2)
Read conversion result
Idle
Start
Set A/D conversion speed
and input channel
Disable A/D conversion
end interrupt
Start A/D conversion
Read ADSR
No
ADSF = 0?
Yes
Read ADRR data
Yes
Perform A/D
conversion?
No
End
Figure 12.4 Flow Chart of Procedure for Using A/D Converter (1) (Polling by Software)
309
Start
Set A/D conversion speed
and input channels
Enable A/D conversion
end interrupt
Start A/D conversion
A/D conversion
end interrupt?
No
Yes
Clear bit IRRAD to
0 in IRR2
Read ADRR data
Yes
Perform A/D
conversion?
No
End
Figure 12.5 Flow Chart of Procedure for Using A/D Converter (2) (Interrupts Used)
12.6
Application Notes
• Data in the A/D result register (ADRR) should be read only when the A/D start flag (ADSF) in
the A/D start register (ADSR) is cleared to 0.
• Changing the digital input signal at an adjacent pin during A/D conversion may adversely
affect conversion accuracy.
310
Section 13 LCD Controller/Driver
13.1
Overview
The H8/3834 Series has an on-chip segment-type LCD controller circuit, LCD driver, and power
supply circuit, for direct driving of an LCD panel.
13.1.1
Features
Features of the LCD controller/driver are as follows.
• Display capacity
Duty
Internal Driver
External Segment
Expansion Driver
On-chip driver only
—
40 segments
0
Use with external segment
expansion driver
Static
36 segments
476 segments
1/2
36 segments
220 segments
1/3
36 segments
92 segments
1/4
36 segments
92 segments
The HD66100 can be used for external expansion of the number of segments.
• LCD RAM capacity
8 bits × 64 bytes (512 bits)
• Word access to LCD RAM
• Segment output pins can be switched to general-purpose ports in groups of 4
• Unused common output pins can be used either for boosting common output (by parallel
connection) or as ports.
• Displays in all operation modes except standby mode.
• Choice of 11 frame frequencies
• Internal voltage divider for liquid crystal driver power supply
311
13.1.2
Block Diagram
Figure 13.1 shows a block diagram of the LCD controller/driver.
VCC
M
φ /2 to φ /256
LCD driver
power supply
CL2
Common
data latch
φ W to φ W/4
Common
driver
Internal data bus
Display timing generator
COM 1
COM 4
SEG 40 /CL 1
SEG 39 /CL 2
SEG 38 /DO
SEG 37 /M
SEG 36
LPCR
LCR
40-bit
shift
register
CL1
Segment
driver
LCD RAM
64 bytes
SEG 1
SEG n , DO
Notation:
LPCR: LCD port control register
LCR:
LCD control register
Figure 13.1 LCD Controller/Driver Block Diagram
312
V1
V2
V3
VSS
13.1.3
Pin Configuration
Table 13.1 shows the output pins assigned to the LCD controller/driver.
Table 13.1 Pin Configuration
Name
Abbrev.
I/O
Function
LCD segment output
SEG40 to
SEG1
Output
Liquid crystal segment driver pins. All pins can be
programmed also as ports.
LCD common output
COM4 to
Output
Liquid crystal common driver pins. Parallel
COM1
External segment
expansion signal
LCD power supply
13.1.4
connection is possible at static and 1/2 duty.
CL 1
Output
Display data latch clock; doubles as SEG40
CL 2
Output
Display data shift clock; doubles as SEG 39
M
Output
LCD alternating signal; doubles as SEG 37
DO
Output
Serial display data; doubles as SEG 38
V1, V2, V3
Input
For external connection to bypass capacitor or for
use of external power supply circuit
Register Configuration
Table 13.2 shows the register configuration of the LCD controller/driver.
Table 13.2 Register Configuration
Name
Abbrev.
R/W
Initial Value
Address
LCD port control register
LPCR
R/W
H'00
H'FFC0
LCD control register
LCR
R/W
H'80
H'FFC1
LCD RAM
—
R/W
Not fixed
H'F740 to H'F77F*
Note: * Value after reset.
313
13.2
Register Descriptions
13.2.1
LCD Port Control Register (LPCR)
The LCD port control register is an 8-bit read/write register, used for selecting the duty cycle and
the LCD driver and pin functions, etc. Upon reset, LPCR is initialized to H'00.
Bits 7 to 5—Duty and Common Function Select (DTS1, DTS0, CMX): Bits 7 to 6 select a
driver duty of static, 1/2, 1/3, or 1/4. Bit 5 determines whether the common pins not used at a
given duty are to be used as ports or, in order to increase the common driving capacity, as multiple
pins outputting the same waveform.
Bit 7: Bit 6: Bit 5:
DTS1 DTS0 CMX
Duty
Common Driver*1
Other Uses
0
Static
COM1 (initial value)
COM4, COM3 and COM2 usable as ports
COM4 to COM1
COM4, COM3 and COM2 output the same
waveform as COM1
COM2 to COM1
COM4 and COM3 usable as ports
COM4 to COM1
COM4 outputs the same waveform as
COM3, and COM 2 the same waveform as
COM1
COM3 to COM1
COM4 usable as port
COM4 to COM1
COM4 outputs a non-select waveform* 2
COM4 to COM1
—
0
0
1
0
1
0
1/2 duty
1
1
0
0
1/3 duty
1
1
1
0
1/4 duty
1
Notes: 1. Pins COM4 to COM1 become ports when bit SGX = 0 and bits SGS3 to SGS0 = 0000.
Otherwise the common drivers are as indicated in the table above.
2. A non-select waveform is always output at pin COM4, which therefore should not be
used.
Bit 4—Expansion Signal Select (SGX): Bit 4 selects whether pins SEG40/CL1, SEG39/CL 2,
SEG38/DO, and SEG37/M are used as segment pins (SEG40 to SEG 37) or as external segment
expansion pins (CL1, CL2, DO, M).
Bit 4: SGX
Description
0
Pins SEG40 to SEG 37 *
1
Pins CL 1, CL 2, DO, M
(initial value)
Note: * Selected as ports when bits SGS3 to SGS0 = 0000.
Bits 3 to 0—Segment Driver Select (SGS3 to SGS0): Bits 3 to 0 select the pins to be used as
segment drivers.
314
Functions of Pins SEG40 to SEG21
Bit 4:
SGX
Bit 3: Bit 2: Bit 1: Bit 0:
SGS3 SGS2 SGS1 SGS0
SEG40 to
SEG37
SEG36 to
SEG33
SEG32 to
SEG29
SEG28 to
SEG25
SEG24 to
SEG21
Remarks
0
0
0
0
0
Port
Port
Port
Port
Port
(initial value)
0
0
0
1
SEG
SEG
Port
Port
Port
0
0
1
0
SEG
SEG
SEG
Port
Port
0
0
1
1
SEG
SEG
SEG
SEG
Port
0
1
0
0
SEG
SEG
SEG
SEG
SEG
0
1
0
1
SEG
SEG
SEG
SEG
SEG
0
1
1
0
SEG
SEG
SEG
SEG
SEG
0
1
1
1
SEG
SEG
SEG
SEG
SEG
1
*
*
0
SEG
SEG
SEG
SEG
SEG
1
*
*
1
SEG
SEG
SEG
SEG
SEG
0
0
0
0
External Port
segment
expansion
Port
Port
Port
0
0
0
1
External SEG
segment
expansion
Port
Port
Port
0
0
1
0
External SEG
segment
expansion
SEG
Port
Port
0
0
1
1
External SEG
segment
expansion
SEG
SEG
Port
0
1
0
0
External SEG
segment
expansion
SEG
SEG
SEG
0
1
0
1
External SEG
segment
expansion
SEG
SEG
SEG
0
1
1
0
External SEG
segment
expansion
SEG
SEG
SEG
0
1
1
1
External SEG
segment
expansion
SEG
SEG
SEG
1
*
*
0
External SEG
segment
expansion
SEG
SEG
SEG
1
*
*
1
External SEG
segment
expansion
SEG
SEG
SEG
1
Note: * Don’t care
315
Functions of Pins SEG20 to SEG1
Bit 4: Bit 3: Bit 2: Bit 1: Bit 0:
SGX SGS3 SGS2 SGS1 SGS0
SEG20 to
SEG17
SEG16 to
SEG13
SEG12 to
SEG9
SEG8 to
SEG5
SEG4 to
SEG1
Remarks
0
(initial value)
1
0
0
0
0
Port
Port
Port
Port
Port
0
0
0
1
Port
Port
Port
Port
Port
0
0
1
0
Port
Port
Port
Port
Port
0
0
1
1
Port
Port
Port
Port
Port
0
1
0
0
Port
Port
Port
Port
Port
0
1
0
1
SEG
Port
Port
Port
Port
0
1
1
0
SEG
SEG
Port
Port
Port
0
1
1
1
SEG
SEG
SEG
Port
Port
1
*
*
0
SEG
SEG
SEG
SEG
Port
1
*
*
1
SEG
SEG
SEG
SEG
SEG
0
0
0
0
Port
Port
Port
Port
Port
0
0
0
1
Port
Port
Port
Port
Port
0
0
1
0
Port
Port
Port
Port
Port
0
0
1
1
Port
Port
Port
Port
Port
0
1
0
0
Port
Port
Port
Port
Port
0
1
0
1
SEG
Port
Port
Port
Port
0
1
1
0
SEG
SEG
Port
Port
Port
0
1
1
1
SEG
SEG
SEG
Port
Port
1
*
*
0
SEG
SEG
SEG
SEG
Port
1
*
*
1
SEG
SEG
SEG
SEG
SEG
Note: * Don’t care
13.2.2
LCD Control Register (LCR)
Bit
7
6
5
4
3
2
1
0
—
PSW
ACT
DISP
CKS3
CKS2
CKS1
CKS0
Initial value
1
0
0
0
0
0
0
0
Read/Write
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
The LCD control register is an 8-bit read/write register for on/off control of the resistive voltage
divider used as the LCD driver power supply, for display data control, and for frame frequency
selection. Upon reset, LCR is initialized to H'80.
Bit 7—Reserved Bit: Bit 7 is reserved; it is always read as 1, and cannot be modified.
316
Bit 6—Power Switch (PSW): Bit 6 switches the resistive voltage divider provided to power the
LCD driver on/off. In low-power modes when the LCD display is not used, or when an external
power supply is used for the LCD, the resistive voltage divider can be switched off. When bit
ACT = 0, or in standby mode, the resistive voltage divider is in the off state regardless of the bit 6
setting.
Bit 6: PSW
Description
0
LCD power supply resistive voltage divider off
1
LCD power supply resistive voltage divider on
(initial value)
Bit 5:—Display Active (ACT): Bit 5 selects whether the LCD controller/driver is used or not.
When this bit is cleared to 0, the LCD controller/driver module halts operation, and the resistive
voltage divider provided for the LCD driver power supply goes to the off state regardless of the
PSW setting. However, register contents are retained.
Bit 5: ACT
Description
0
LCD controller/driver operation stopped
1
LCD controller/driver operational
(initial value)
Bit 4—Display Data Control (DISP): Bit 4 selects whether the LCD RAM contents are
displayed or blank data is displayed regardless of the LCD RAM contents. This bit is valid also
when the HD66100 is used for external segment expansion.
Bit 4: DISP
Description
0
Blank data displayed
1
LCD RAM data displayed
(initial value)
Bits 3 to 0—Frame Frequency Select 3 to 0 (CKS3 to CKS0): Bits 3 to 0 select the clock used
by the LCD controller/driver, and the frame frequency. In subactive, watch, and subsleep modes
the system clock (φ) is stopped, so there will be no display in these modes if φ/2 to φ/256 is chosen
as the clock source. For display in these modes, clock φW/2 or φW/4 must be selected.
317
Frame Frequency* 3
Bit 3:
CKS3
Bit 2:
CKS2
Bit 1:
CKS1
Bit 0:
CKS0
Clock
φ = 5 MHz
φ = 625 kHz* 1
0
*
0
0
φW
128 Hz * 2
128 Hz*2
0
*
0
1
φ W /2
64 Hz
64 Hz
0
*
1
*
φ W /4
32 Hz
32 Hz
1
0
0
0
φ /2
—
610 Hz
1
0
0
1
φ /4
—
305 Hz
1
0
1
0
φ /8
—
153 Hz
1
0
1
1
φ /16
610 Hz
76.3 Hz
1
1
0
0
φ /32
305 Hz
38.1 Hz
1
1
0
1
φ /64
153 Hz
—
1
1
1
0
φ /128
76.3 Hz
—
1
1
1
1
φ /256
38.1 Hz
—
Notes: * Don’t care
1. Frame frequency in active (medium-speed) mode when φ = 5 MHz
2. Only the upper 32 bytes of the display RAM are used.
3. When a duty cycle of 1/3 is chosen, the frame frequency will be 4/3 times the
frequencies shown in the above table.
13.3
Operation
13.3.1
Settings Prior to LCD Display
Various decisions related to hardware and software must be made before using the LCD
controller/driver with an LCD display. The settings are described below.
Hardware Settings
• Use at 1/2 duty
To use at 1/2 duty, connect pins V2 and V3 as shown in figure 13.2.
318
VCC
V1
V2
V3
VSS
Figure 13.2 LCD Driver Power Supply Processing at 1/2 Duty
• Large-panel display
Because of the large impedance of the built-in resistive voltage divider, the H8/3834 Series
LCD controller/driver is not well suited to driving large-panel displays. If use of a large panel
leads to an unclear display, refer to 13.3.5 Boosting the LCD Driver Power Supply. At static
and 1/2 duty it is possible to boost the common output driving capacity. Set bit CMX to 1
when selecting the duty cycle. In this mode, at static duty pins COM4 to COM 1 output the same
waveform, while at 1/2 duty pins COM2 and COM1 output the COM1 waveform and pins
COM4 and COM3 output the COM2 waveform.
• Segment expansion
The HD66100 can be connected externally to expand the number of segments. See 13.3.3,
Connection to HD66100.
Software Settings
• Duty cycle selection
The duty cycle is selected in bits DTS1 and DTS0, with a choice of static, 1/2, 1/3, or 1/4 duty.
• Segment driver selection
The segment drivers to be used are selected in bits SGS3 to SGS0.
• Frame frequency selection
The frame frequency is selected in bits CKS3 to CKS0. The frame frequency should be
selected depending on the specification of the LCD panel to be used. Refer to 13.3.4,
Operation in Power-Down Modes, for information on clock selection in watch mode, subactive
mode, and subsleep mode.
319
13.3.2
Relation of LCD RAM to Display
The relation of the LCD RAM to segments depends on the duty cycle. LCD RAM memory maps
for each duty cycle when segments are not expanded externally are shown in figures 13.3 to 13.6.
When segments are expanded externally, the LCD RAM memory maps for each duty cycle are as
shown in figures 13.7 to 13.10. It is also possible to use only external segments and not use the
segment pins on this chip, in which case the LCD RAM memory map is as shown in figure 13.11.
After setting the registers that control the LCD display, write data to the area corresponding to the
duty cycle selected, using the same instructions as for the ordinary RAM. If the display is switched
on, the data will be displayed automatically. Both word and byte access instructions can be used
for writing to the LCD RAM.
13.3.3
Connection to HD66100
To expand the number of segments externally, connect the H8/3834 Series to the HD66100
segment chip. The HD66100 chip provides an additional 80 segments. When external segments
are used, set bit SGX in LPCR for use of pins SEG40 to SEG 37 as external segment expansion
signal pins. Data will be output starting from LCD RAM pin SEG37. When bits SGS3 to SGS0 in
LPCR are set to 0000, data will be output starting from LCD RAM pin SEG1.
Figure 13.12 shows typical connections to the HD66100. The output level is determined by the
combination of data pins and pin M; but that combination differs between the H8/3834 Series and
the HD66100. Table 13.3 shows the output level of the LCD driver power supply.
Figure 13.13 shows the common and segment waveforms at each duty.
If bit ACT = 0, then if CL2 = 0, CL1 = 0 and M = 0, DO stops with the data output at that moment
(1 or 0). In standby mode the expansion pins are in the high-impedance (floating) state.
External expansion increases the load on the LCD panel, as a result of which the internal power
supply may not have sufficient capacity. In that case refer to 13.3.5, Boosting the LCD Driver
Power Supply.
320
H'F740*
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SEG 2
SEG 2
SEG2
SEG 2
SEG 1
SEG 1
SEG 1
SEG 1
Internal driver
display area
H'F753*
SEG40
SEG40
SEG40
SEG40
SEG39
SEG39
SEG39
SEG39
Area not used
for display
H'F77F*
COM 4
COM 3
COM 2
COM 1
COM 4
COM 3
COM 2
COM 1
Note: * Values immediately after reset.
Figure 13.3 LCD RAM Map: No External Segment Expansion (1/4 Duty)
Bit 7
H'F740*
Bit 6
Bit 5
Bit 4
SEG 2
SEG 2
SEG 2
Bit 3
Bit 2
Bit 1
Bit 0
SEG 1
SEG 1
SEG 1
Internal driver
display area
H'F753*
SEG 40
SEG40
SEG40
SEG 39
SEG 39
SEG39
Area not used
for display
H'F77F*
COM 3
COM 2
COM 1
COM 3
COM 2
COM 1
Note: * Values immediately after reset.
Figure 13.4 LCD RAM Map: No External Segment Expansion (1/3 Duty)
321
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
H'F740*
SEG 4
SEG 4
SEG 3
SEG 3
SEG 2
SEG 2
SEG 1
SEG 1
H'F749*
SEG40
SEG 40
SEG 39
SEG39
SEG38
SEG38
SEG 37
SEG37
Internal driver
display area
Area not used
for display
H'F77F*
COM 2
COM 1
COM 2
COM 1
COM 2
COM 1
COM 2
COM 1
Note: * Values immediately after reset.
Figure 13.5 LCD RAM Map: No External Segment Expansion (1/2 Duty)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
H'F740*
SEG 8
SEG 7
SEG 6
SEG 5
SEG 4
SEG 3
SEG 2
SEG 1
H'F744*
SEG40
SEG39
SEG38
SEG37
SEG36
SEG35
SEG34
SEG33
Internal driver
display area
Area not used
for display
H'F77F*
COM 1
COM 1
COM 1
COM 1
COM 1
COM 1
COM 1
COM 1
Note: * Values immediately after reset.
Figure 13.6 LCD RAM Map: No External Segment Expansion (Static Duty)
322
H'F740*
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SEG2
SEG 2
SEG 2
SEG 2
SEG 1
SEG 1
SEG 1
SEG 1
Internal driver
display area
H'F751*
H'F75F*
SEG 36
SEG 36 SEG 36
SEG 36
SEG 35
SEG 35 SEG 35
SEG 35
SEG 38
SEG 38 SEG 38
SEG 38
SEG 37
SEG 37 SEG 37
SEG 37
SEG 64
SEG 64 SEG 64
SEG 64
SEG 63
SEG 63 SEG 63
SEG 63
External driver
display area
(when CKS3 = CKS1 = CKS0 = 0)
External driver
display area
H'F77F*
SEG128 SEG 128 SEG 128 SEG128 SEG127 SEG 127 SEG 127 SEG127
COM4
COM 3
COM 2
COM 1
COM 4
COM 3
COM 2
COM 1
Note: * Values immediately after reset.
Figure 13.7 LCD RAM Map: External Segment Expansion (1/4 Duty)
Bit 7
H'F740*
Bit 6
Bit 5
Bit 4
SEG 2
SEG 2
SEG 2
Bit 3
Bit 2
Bit 1
Bit 0
SEG1
SEG1
SEG1
Internal driver
display area
H'F751*
H'F75F*
SEG 36
SEG 36
SEG 36
SEG 35
SEG 35
SEG 35
SEG 38
SEG 38
SEG 38
SEG 37
SEG 37
SEG 37
SEG 64
SEG 64
SEG 64
SEG 63
SEG 63
SEG 63
External driver
display area
(when CKS3 = CKS1 = CKS0 = 0)
External driver
display area
H'F77F*
SEG128 SEG128 SEG128
SEG127 SEG127 SEG127
COM 3
COM 3
COM 2
COM 1
COM 2
COM 1
Note: * Values immediately after reset.
Figure 13.8 LCD RAM Map: External Segment Expansion (1/3 Duty)
323
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
H'F740*
SEG4
SEG4
SEG3
SEG3
SEG2
SEG 2
SEG 1
SEG1
H'F748*
SEG 36
SEG 36
SEG35
SEG35
SEG34
SEG 34
SEG 33
SEG 33
SEG 40
SEG 40
SEG39
SEG39
SEG38
SEG 38
SEG 37
SEG 37
Internal driver
display area
External driver
display area
(when CKS3 = CKS1 = CKS0 = 0)
H'F75F*
SEG128 SEG128 SEG127 SEG127 SEG126 SEG 126 SEG125 SEG125
External driver
display area
H'F77F*
SEG256 SEG256 SEG255 SEG255 SEG254 SEG 254 SEG253 SEG253
COM 2
COM 1
COM 2
COM 1
COM 2
COM 1
COM 2
COM 1
Note: * Values immediately after reset.
Figure 13.9 LCD RAM Map: External Segment Expansion (1/2 Duty)
Bit 7
H'F740*
H'F744*
SEG 8
SEG40
Bit 6
Bit 5
SEG 7 SEG 6
SEG 39 SEG 38
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SEG 5
SEG37
SEG 4
SEG 36
SEG 3
SEG 35
SEG 2
SEG 34
SEG 1
SEG33
Internal driver
display area
External driver
display area
(when CKS3 = CKS1 = CKS0 = 0)
H'F75F*
SEG 256 SEG 255 SEG 254 SEG 253 SEG 252 SEG 251 SEG 250 SEG 249
External driver
display area
H'F77F*
SEG 512 SEG 511 SEG 510 SEG 509 SEG 508 SEG 507 SEG 506 SEG 505
COM 1
COM 1
COM 1
COM 1
COM 1
COM 1
COM 1
COM 1
Note: * Values immediately after reset.
Figure 13.10 LCD RAM Map: External Segment Expansion (Static Duty)
324
H'F740*
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SEG2
SEG 2
SEG2
SEG2
SEG1
SEG1
SEG 1
SEG 1
External driver
display area
(when CKS3 = CKS1 = CKS0 = 0)
H'F75F*
SEG 64
H'F77F*
SEG128 SEG128 SEG128 SEG128 SEG127 SEG127 SEG 127 SEG 127
COM 4
SEG64
COM 3
SEG 64
COM 2
SEG 64
COM 1
SEG 63
COM 4
SEG 63
COM 3
SEG 63 SEG 63
COM 2
External driver
display area
COM 1
Note: * Values immediately after reset.
Figure 13.11 LCD RAM Map When All External Segments are Used
(Example: SGX = 1, SGS3 to SGS0 = 0000, 1/4 Duty)
325
1/3 bias; 1/4 duty or 1/3 duty
VCC
V1
V2
V3
H8/3834
VSS
SEG 40 /CL1
SEG 39 /CL2
SEG 38 /DO
SEG 37 /M
VCC
V1
V4
V3
V2
GND
VEE
SHL
CL1
CL2
DI
M
HD66100
VCC
V1
V4
V3
V2
GND
VEE
SHL
CL1
CL2
DI
M
HD66100
VCC
V1
V4
V3
V2
GND
VEE
SHL
CL1
CL2
DI
M
HD66100
1/2 duty
VCC
V1
V2
V3
H8/3834
VSS
SEG 40 /CL1
SEG 39 /CL2
SEG 38 /DO
SEG 37 /M
Static
VCC
V1
V2
V3
H8/3834
VSS
SEG 40 /CL1
SEG 39 /CL2
SEG 38 /DO
SEG 37 /M
Figure 13.12 Connection to HD66100
326
1 frame
M
Data
COM 1
V1
V2
V3
VSS
COM 2
V1
V2
V3
VSS
COM 3
V1
V2
V3
VSS
COM 4
V1
V2
V3
VSS
SEG n
V1
V2
V3
VSS
Figure 13.13 (a) Waveforms at 1/4 Duty
1 frame
M
Data
COM 1
V1
V2
V3
VSS
COM 2
V1
V2
V3
VSS
COM 3
V1
V2
V3
VSS
SEG n
V1
V2
V3
VSS
Figure 13.13 (b) Waveforms at 1/3 Duty
327
1 frame
M
Data
COM 1
V1
V2 , V 3
VSS
COM 2
V1
V2 , V 3
VSS
SEG n
Figure 13.13 (c) Waveforms at 1/2 Duty
1 frame
M
Data
V1
COM 1
VSS
V1
SEG n
VSS
Figure 13.13 (d) Waveforms at Static Duty
328
Table 13.3 Output Levels
Data
0
0
1
1
M
0
1
0
1
Common output
V1
VSS
V1
VSS
Segment output
V1
VSS
VSS
V1
Common output
V2, V3
V2, V3
V1
VSS
Segment output
V1
VSS
VSS
V1
Common output
V3
V2
V1
VSS
Segment output
V2
V3
VSS
V1
Common output
V3
V2
V1
VSS
Segment output
V2
V3
VSS
V1
Static
1/2 duty
1/3 duty
1/4 duty
13.3.4
Operation in Power-Down Modes
The LCD controller/driver can be operated in the low-power modes, as shown in table 13.4.
In the subactive, watch, and subsleep modes, the system clock pulse generator stops running, so no
clock signal will be supplied and the display will be stopped, unless φW or φW/2 was selected when
setting bits CKS3 to CKS0 in LCR. Since this may result in a direct current being applied to the
LCD panel, be sure to select φW or φW/2 as the clock if these modes are used. In active (mediumspeed) mode the system clock is changed, making it necessary to adjust the frame frequency
setting (in bits CKS3 to CKS0) to avoid a change in frame frequency.
Table 13.4 LCD Controller/Driver Operation in Power-Down Modes
Mode
Clock
Display
Reset
Active
Sleep
Watch
Subactive Subsleep
Standby
φ
Running Running Running Stopped Stopped
Stopped
Stopped
φW
Running Running Running Running Running
Running
Stopped * 1
ACT = 0 Stopped Stopped Stopped Stopped Stopped
Stopped
Stopped * 2
On* 3
Stopped * 2
ACT = 1 Stopped On
On
On* 3
On* 3
Notes: 1. The subclock pulse generator does not stop, but clock supply is stopped.
2. The LCD driver power supply resistive voltage divider is off regardless of bit PSW.
3. The display will not function unless φW or φ W /2 is selected as the clock.
329
13.3.5
Boosting the LCD Driver Power Supply
When a large LCD panel is driven, or if segments are expanded externally, the built-in power
supply capacity may be insufficient, making it necessary to lower the power supply impedance.
One method, shown in figure 13.12, is to connect a bypass capacitor of around 0.1 µF to 0.3 µF to
pins V1, V2, and V3. Another approach, shown in figure 13.14 below, is to connect a resistive
voltage divider externally.
VCC
R
V1
R
H8/3834
V2
R
V3
VSS
R = several kΩ
C = 0.1 µF to 0.3 µF
R
Figure 13.14 Connecting an External Resistive Voltage Divider
330
Section 14 Electrical Characteristics
14.1
H8/3832S, H8/3833S, H8/3834S, H8/3835S, H8/3836S and H8/3837S
Absolute Maximum Ratings (Standard Specifications)
Table 14.1 lists the absolute maximum ratings.
Table 14.1 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Power supply voltage
VCC
–0.3 to +7.0
V
Analog power supply voltage
AVCC
–0.3 to +7.0
V
Input voltage
Ports other than ports B and C
Vin
–0.3 to VCC + 0.3
V
Ports B and C
AVin
–0.3 to AVCC + 0.3
V
Operating temperature
Topr
–20 to +75
°C
Storage temperature
Tstg
–55 to +125
°C
Note: Permanent damage may occur to the chip if maximum ratings are exceeded. Normal
operation should be under the conditions specified in Electrical Characteristics. Exceeding
these values can result in incorrect operation and reduced reliability.
331
14.2
H8/3832S, H8/3833S and H8/3834S Electrical Characteristics
(Standard Specifications)
14.2.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range of the H8/3832S, H8/3833S and H8/3834S are
indicated by the shaded region in the figures below.
1. Power supply voltage vs. oscillator frequency range of H8/3832S, H8/3833S and H8/3834S
32.768
fw (kHz)
f OSC (MHz)
10.0
5.0
2.0
2.5
4.0
• Active mode (high speed)
• Sleep mode
332
5.5
VCC (V)
2.5
• All operating modes
4.0
5.5
VCC (V)
2. Power supply voltage vs. clock frequency range of H8/3832S, H8/3833S and H8/3834S
5.0
φ SUB (kHz)
φ (MHz)
16.384
2.5
8.192
4.096
0.5
2.5
4.0
5.5
VCC (V)
2.5
• Active mode (high speed)
• Sleep mode (except CPU)
4.0
5.5
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
625.0
φ (kHz)
500.0
312.5
62.5
2.5
4.0
5.5
VCC (V)
• Active mode (medium speed)
3. Analog power supply voltage vs. A/D converter operating range of H8/3832S, H8/3833S and
H8/3834S
5.0
625.0
φ (kHz)
φ (MHz)
500.0
2.5
0.5
312.5
62.5
2.5
4.0
• Active (high speed) mode
• Sleep mode
5.5
AVCC (V)
2.5
4.0
5.5
AVCC (V)
• Active (medium speed) mode
333
14.2.2
DC Characteristics
Table 14.2 lists the DC characteristics of the H8/3832S, H8/3833S and H8/3834S.
Table 14.2 DC Characteristics of H8/3832S, H8/3833S and H8/3834S
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Input high
voltage
VIH
RES, MD0,
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF
CS, TMIG,
SCK1, SCK2,
SCK3, ADTRG
0.8 V CC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
0.9 V CC
—
VCC + 0.3
UD, SI 1, SI2, RXD
0.7 V CC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
0.8 V CC
—
VCC + 0.3
VCC – 0.5 —
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
V
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
OSC1
Input low
voltage
VIL
VCC – 0.3 —
VCC + 0.3
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
0.7 V CC
—
VCC + 0.3
0.8 V CC
—
VCC + 0.3
PB 0 to PB7
PC0 to PC3
0.7 V CC
—
AV CC + 0.3 V
0.8 V CC
—
AV CC + 0.3
RES, MD0,
–0.3
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF,
CS, TMIG,
–0.3
SCK1, SCK2,
SCK3, ADTRG
—
0.2 V CC
—
0.1 V CC
UD, SI 1, SI2, RXD
–0.3
—
0.3 V CC
–0.3
—
0.2 V CC
–0.3
—
0.5
–0.3
—
0.3
OSC1
Note: Connect pin TEST to VSS .
334
V
VCC = 4.0 V to 5.5 V
V
VCC = 4.0 V to 5.5 V
V
VCC = 4.0 V to 5.5 V
Note
Table 14.2 DC Characteristics of H8/3832S, H8/3833S and H8/3834S (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Input low
voltage
VIL
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
PB 0 to PB7
PC0 to PC3
–0.3
—
0.3 V CC
V
VCC = 4.0 V to 5.5 V
–0.3
—
0.2 V CC
P10 to P17
P20 to P27
P30 to P37
VCC – 1.0 —
—
V
VCC = 4.0 V to 5.5 V
–I OH = 1.0 mA
P40 to P42
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
VCC – 0.5 —
—
VCC = 4.0 V to 5.5 V
–I OH = 0.5 mA
VCC – 0.5 —
—
–I OH = 0.1 mA
P10 to P17
P40 to P42
—
—
0.6
—
—
0.5
IOL = 0.4 mA
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
—
—
0.5
IOL = 0.4 mA
P20 to P27
P30 to P37
—
—
1.5
VCC = 4.0 V to 5.5 V
IOL = 10 mA
—
—
0.6
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
—
—
0.5
IOL = 0.4 mA
Output
high
voltage
VOH
Output
VOL
low voltage
V
Note
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
335
Table 14.2 DC Characteristics of H8/3832S, H8/3833S and H8/3834S (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Input
leakage
current
|IIL|
RES
OSC1, MD0
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
—
—
1.0
µA
VIN = 0.5 V to
VCC – 0.5 V
PB 0 to PB7
PC0 to PC3
—
—
1.0
P10 to P17
P30 to P37
50.0
—
300.0
µA
VCC = 5 V,
VIN = 0 V
P50 to P57
P60 to P67
—
35.0
—
µA
VCC = 2.7 V,
VIN = 0 V
All input pins
except power
supply
—
—
15.0
pF
f = 1 MHz,
VIN = 0 V
Ta = 25°C
Pull-up
MOS
current
–I P
Input
capacitance
CIN
336
Note
VIN = 0.5 V to
AV CC – 0.5 V
Reference
value
Table 14.2 DC Characteristics of H8/3832S, H8/3833S and H8/3834S (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
Active mode
current
dissipation
IOPE1
VCC
—
9.0
13.0
mA
Active mode (high speed),
VCC = 5 V, f osc = 10 MHz
1, 2
IOPE2
VCC
—
1.7
3.0
mA
Active mode (medium speed), 1, 2
VCC = 5 V, f osc = 10 MHz
Sleep mode
current
dissipation
ISLEEP
VCC
—
4.0
7.0
mA
VCC = 5 V, f osc = 10 MHz
1, 2
VCC
—
30.0
65.0
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
1, 2
—
22.0
—
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/8)
Reference
value
1, 2
Subactive mode ISUB
current
dissipation
Subsleep mode
current
dissipation
ISUBSP
VCC
—
20.0
45.0
µA
VCC = 2.7 V, LCD on, 32-kHz 1, 2
crystal oscillator (φSUB = φw/2)
Watch mode
current
dissipation
IWATCH
VCC
—
—
5.5
µA
VCC = 2.7 V, LCD not used,
32-kHz crystal oscillator
1, 2
Standby mode
current
dissipation
ISTBY
VCC
—
—
5.0
µA
32-kHz crystal oscillator not
used
1, 2
RAM data
VRAM
retaining voltage
VCC
2.0
—
—
V
1, 2
Notes: 1. Pin states during current measurement
Mode
Internal State
Other LCD Power
Pins Supply
Oscillator Pins
Active mode (high
Operates
and medium speed)
VCC
Open
Sleep mode
Only timer operates
VCC
Open
Subactive mode
Operates
VCC
Open
System clock oscillator: Crystal
Subsleep mode
Only timer operates, VCC
CPU stops
Open
Subclock oscillator: Crystal
Watch mode
Only time-base clock VCC
operates, CPU stops
Open
Standby mode
CPU and timers all
stop
Open
VCC
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
337
Table 14.2 DC Characteristics of H8/3832S, H8/3833S and H8/3834S (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Allowable output low
current (per pin)
IOL
Output pins except in
ports 2 and 3
—
—
2.0
mA
VCC = 4.0 V to 5.5 V
Ports 2 and 3
—
—
10.0
All output pins
—
—
0.5
Output pins except in
ports 2 and 3
—
—
40.0
Ports 2 and 3
—
—
80.0
All output pins
—
—
20.0
All output pins
—
—
2.0
—
—
0.2
—
—
15.0
—
—
10.0
Allowable output low
current (total)
Allowable output high
current (per pin)
Allowable output high
current (total)
338
ΣIOL
–I OH
Σ–I OH
All output pins
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
14.2.3
AC Characteristics
Table 14.3 lists the control signal timing, and tables 14.4 and 14.5 list the serial interface timing of
the H8/3832S, H8/3833S and H8/3834S.
Table 14.3 Control Signal Timing of H8/3832S, H8/3833S and H8/3834S
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Applicable
Symbol Pins
System clock
oscillation frequency
fOSC
OSC clock ( φOSC)
cycle time
tOSC
System clock (φ)
cycle time
tcyc
Subclock oscillation
frequency
fW
Watch clock (φw) cycle tW
time
Subclock (φSUB) cycle
time
Typ
Max
Unit
Test Condition
OSC1, OSC2 2.0
—
10.0
MHz
VCC = 4.0 V to 5.5 V
2.0
—
5.0
OSC1, OSC2 100.0 —
1000.0 ns
2
—
16
—
—
2000.0 ns
X1, X2
—
32.768 —
kHz
X1, X2
—
30.5
—
µs
2
—
8
tW
2
—
—
tcyc
tsubcyc
OSC1, OSC2 —
—
40.0
ms
—
—
60.0
—
—
100.0
—
2
s
ns
VCC = 4.0 V to 5.5 V Figure 14.1
ns
VCC = 4.0 V to 5.5 V Figure 14.1
ns
VCC = 4.0 V to 5.5 V Figure 14.1
ns
VCC = 4.0 V to 5.5 V Figure 14.1
Oscillation stabilization trc
time
X1, X2
—
External clock high
width
tCPH
OSC1
40.0 —
—
80.0 —
—
External clock low
width
tCPL
40.0 —
—
80.0 —
—
—
—
15.0
—
—
20.0
—
—
15.0
—
—
20.0
External clock fall time tCPf
VCC = 4.0 V to 5.5 V 1
1000.0
Instruction cycle time
External clock rise time tCPr
Reference
Figure
200.0 —
tsubcyc
Oscillation stabilization trc
time (crystal oscillator)
Min
OSC1
Figure 14.1
tOSC
1
2
VCC = 4.0 V to 5.5 V
VCC = 2.7 V to 5.5 V
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
339
Table 14.3 Control Signal Timing of H8/3832S, H8/3833S and H8/3834S (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Applicable
Symbol Pins
Pin RES low width
tREL
RES
Input pin high width
tIH
Input pin low width
Pin UD minimum
modulation width
340
Typ
Max
Unit
10
—
—
tcyc
Figure 14.2
IRQ0 to IRQ4
2
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
—
—
tcyc
tsubcyc
Figure 14.3
tIL
IRQ0 to IRQ4
2
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
—
—
tcyc
tsubcyc
Figure 14.3
tUDH
tUDL
UD
—
—
tcyc
tsubcyc
Figure 14.4
4
Test Condition
Reference
Figure
Min
Table 14.4 Serial Interface (SCI1, SCI2) Timing of H8/3832S, H8/3833S and H8/3834S
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless
otherwise specified.
Applicable
Pins
Min
Typ
Max
Unit
Input serial clock cycle tscyc
time
SCK1, SCK2
2
—
—
tcyc
Figure 14.5
Input serial clock
high width
tSCKH
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock
low width
tSCKL
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock rise
time
tSCKr
SCK1, SCK2
—
—
60.0
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
80.0
Input serial clock fall
time
tSCKf
—
—
60.0
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
80.0
Serial output data
delay time
tSOD
—
—
200.0 ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
350.0
Serial input data
setup time
tSIS
Serial input data
hold time
tSIH
CS setup time
tCSS
CS hold time
tCSH
Item
Symbol
SCK1, SCK2
SO 1, SO2
SI 1, SI2
200.0 —
—
400.0 —
—
200.0 —
—
400.0 —
—
CS
2
—
CS
2
—
SI 1, SI2
Test Condition
Reference
Figure
ns
VCC = 4.0 V to 5.5 V Figure 14.5
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
tcyc
Figure 14.6
—
tcyc
Figure 14.6
341
Table 14.5 Serial Interface (SCI3) Timing of H8/3832S, H8/3833S and H8/3834S
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless
otherwise specified.
Item
Typ
Max
Unit
tscyc
4
—
—
tcyc
Figure 14.7
6
—
—
Input clock pulse width
tSCKW
0.4
—
0.6
tscyc
Figure 14.7
Transmit data delay time
(synchronous mode)
tTXD
—
—
1
tcyc
VCC = 4.0 V to 5.5 V Figure 14.8
—
—
1
Receive data setup time
(synchronous mode)
tRXS
ns
VCC = 4.0 V to 5.5 V Figure 14.8
Receive data hold time
(synchronous mode)
tRXH
ns
VCC = 4.0 V to 5.5 V Figure 14.8
Input clock cycle
Asynchronous
Synchronous
342
200.0 —
—
400.0 —
—
200.0 —
—
400.0 —
—
Test Condition
Reference
Figure
Symbol Min
14.2.4
A/D Converter Characteristics
Table 14.6 shows the A/D converter characteristics of the H8/3832S, H8/3833S and H8/3834S.
Table 14.6 A/D Converter Characteristics of H8/3832S, H8/3833S and H8/3834S
VCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Analog power
supply voltage
AV CC
AV CC
2.5
—
5.5
V
Analog input
voltage
AV IN
AN0 to AN11
–0.3
—
AV CC + 0.3 V
Analog power
supply current
AI OPE
AV CC
—
—
1.5
AI STOP1
AV CC
—
150.0 —
µA
2
Reference
value
3
mA
AI STOP2
AV CC
—
—
5.0
µA
Analog input
capacitance
CAIN
AN0 to AN11
—
—
30.0
pF
Allowable
signal source
impedance
RAIN
—
—
10.0
kΩ
Resolution
(data length)
—
—
8
bit
Non-linearity
error
—
—
±2.0
LSB
—
—
±3.0
LSB
Quantization
error
—
—
±0.5
LSB
Absolute
accuracy
—
—
±2.5
LSB
—
—
±3.5
LSB
12.4
—
124
µs
24.8
—
124
µs
Conversion
time
Test Condition
Note
1
AV CC = 5.0 V
VCC = 2.7 V to 5.5 V
AV CC = 2.7 V to 5.5 V
VCC = 2.7 V to 5.5 V
AV CC = 2.7 V to 5.5 V
AV CC = 4.5 V to 5.5 V
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AI STOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AI STOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
343
14.2.5
LCD Characteristics
Table 14.7 lists the LCD characteristics, and table 14.8 lists the AC characteristics for external
segment expansion of the H8/3832S, H8/3833S and H8/3834S.
Table 14.7 LCD Characteristics of H8/3832S, H8/3833S and H8/3834S
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Segment driver
voltage drop
VDS
Common driver
voltage drop
VDC
LCD power supply
voltage divider
resistance
RLCD
LCD power supply
voltage
VLCD
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
SEG1 to
SEG40
—
—
0.6
V
ID = 2 µA
1
COM 1 to
COM 4
—
—
0.3
V
ID = 2 µA
1
100.0 300.0 600.0 kΩ
V1
2.7
—
VCC
Between V 1 and
VSS
V
2
Notes: 1. These are the voltage drops between the voltage supply pins V1, V2, V3 , and V SS , and
the segment pins or common pins.
2. When VLCD is supplied from an external source, the following relation must hold:
VCC ≥ V1 ≥ V2 ≥ V3 ≥ VSS
Table 14.8 AC Characteristics for External Segment Expansion of H8/3832S, H8/3833S
and H8/3834S
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Reference
Figure
Clock high width
tCWH
CL1, CL2
800.0
—
—
ns
*
Figure 14.9
Clock low width
tCWL
CL2
800.0
—
—
ns
*
Figure 14.9
Clock setup time
tCSU
CL1, CL2
500.0
—
—
ns
*
Figure 14.9
Data setup time
tSU
DO
300.0
—
—
ns
*
Figure 14.9
Data hold time
tDH
DO
300.0
—
—
ns
*
M delay time
tDM
M
–1000 —
1000.0 ns
Figure 14.9
Clock rise and fall
times
tCT
CL1, CL2
—
100.0
Figure 14.9
—
ns
Note: * Value when the frame frequency is set to between 30.5 Hz and 488 Hz.
344
Figure 14.9
14.3
H8/3835S, H8/3836S and H8/3837S Electrical Characteristics
(Standard Specifications)
14.3.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range of the H8/3835S, H8/3836S and H8/3837S are
indicated by the shaded region in the figures below.
1. Power supply voltage vs. oscillator frequency range of H8/3835S, H8/3836S and H8/3837S
32.768
fw (kHz)
f OSC (MHz)
10.0
5.0
2.0
2.5
4.0
• Active mode (high speeds)
• Sleep mode
5.5
VCC (V)
2.5
4.0
5.5
VCC (V)
• All operating modes
345
2. Power supply voltage vs. clock frequency range of H8/3835S, H8/3836S and H8/3837S
φSUB (kHz)
φ (MHz)
5.0
2.5
16.384
8.192
4.096
0.5
2.5
4.0
5.5
VCC (V)
2.5
• Active mode (high speed)
• Sleep mode (except CPU)
4.0
5.5
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
625.0
φ (kHz)
500.0
312.5
62.5
2.5
4.0
5.5
VCC (V)
• Active mode (medium speed)
3. Analog power supply voltage vs. A/D converter operating range of H8/3835S, H8/3836S and
H8/3837S
5.0
625.0
φ (kHz)
φ (MHz)
500.0
2.5
0.5
62.5
2.5
4.0
• Active (high speed) mode
• Sleep mode
346
312.5
5.5
AVCC (V)
2.5
4.0
5.5
AVCC (V)
• Active (medium speed) mode
14.3.2
DC Characteristics
Table 14.9 lists the DC characteristics of the H8/3835S, H8/3836S and H8/3837S.
Table 14.9 DC Characteristics of H8/3835S, H8/3836S and H8/3837S
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Input high
voltage
VIH
RES, MD0,
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF
0.8 V CC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
CS, TMIG,
SCK1, SCK2,
SCK3, ADTRG
0.9 V CC
—
VCC + 0.3
UD, SI 1, SI2, RXD
0.7 V CC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
0.8 V CC
—
VCC + 0.3
VCC – 0.5 —
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
VCC – 0.3 —
VCC + 0.3
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
0.7 V CC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
0.8 V CC
—
VCC + 0.3
PB 0 to PB7
PC0 to PC3
0.7 V CC
—
AV CC + 0.3 V
VCC = 4.0 V to 5.5 V
0.8 V CC
—
AV CC + 0.3
RES, MD0,
–0.3
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF,
CS, TMIG,
–0.3
SCK1, SCK2,
SCK3, ADTRG
—
0.2 V CC
—
0.1 V CC
UD, SI 1, SI2, RXD
–0.3
—
0.3 V CC
–0.3
—
0.2 V CC
–0.3
—
0.5
–0.3
—
0.3
OSC1
Input low
voltage
VIL
OSC1
V
VCC = 4.0 V to 5.5 V
V
VCC = 4.0 V to 5.5 V
V
VCC = 4.0 V to 5.5 V
Note
Note: Connect pin TEST to VSS .
347
Table 14.9 DC Characteristics of H8/3835S, H8/3836S and H8/3837S (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Input low
voltage
VIL
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
PB 0 to PB7
PC0 to PC3
–0.3
—
0.3 V CC
V
VCC = 4.0 V to 5.5 V
–0.3
—
0.2 V CC
P10 to P17
P20 to P27
P30 to P37
P40 to P42
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
VCC – 1.0 —
—
V
VCC = 4.0 V to 5.5 V
–I OH = 1.0 mA
VCC – 0.5 —
—
VCC = 4.0 V to 5.5 V
–I OH = 0.5 mA
VCC – 0.5 —
—
–I OH = 0.1 mA
P10 to P17
P40 to P42
—
—
0.6
—
—
0.5
IOL = 0.4 mA
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
—
—
0.5
IOL = 0.4 mA
P20 to P27
P30 to P37
—
—
1.5
VCC = 4.0 V to 5.5 V
IOL = 10 mA
—
—
0.6
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
—
—
0.5
IOL = 0.4 mA
Output
high
voltage
VOH
Output low VOL
voltage
Note: Connect pin TEST to VSS .
348
V
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
Note
Table 14.9 DC Characteristics of H8/3835S, H8/3836S and H8/3837S (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Input
leakage
current
|IIL|
RES
OSC1, MD0
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
—
—
1.0
µA
VIN = 0.5 V to
VCC – 0.5 V
PB 0 to PB7
PC0 to PC3
—
—
1.0
P10 to P17
P30 to P37
50.0
—
300.0
µA
VCC = 5 V,
VIN = 0 V
P50 to P57
P60 to P67
—
35.0
—
µA
VCC = 2.7 V,
VIN = 0 V
All input pins
except power
supply
—
—
15.0
pF
f = 1 MHz,
VIN = 0 V
Ta = 25°C
Pull-up
MOS
current
–I P
Input
capacitance
CIN
Note
VIN = 0.5 V to
AV CC – 0.5 V
Reference
value
349
Table 14.9 DC Characteristics of H8/3835S, H8/3836S and H8/3837S (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
Active mode
current
dissipation
IOPE1
VCC
—
9.0
13.0
mA
Active mode (high speed),
VCC = 5 V, f osc = 10 MHz
1, 2
IOPE2
VCC
—
1.7
3.0
mA
Active mode (medium speed), 1, 2
VCC = 5 V, f osc = 10 MHz
Sleep mode
current
dissipation
ISLEEP
VCC
—
4.0
7.0
mA
VCC = 5 V, f osc = 10 MHz
1, 2
Subactive
mode current
dissipation
ISUB
VCC
—
30.0
65.0
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
1, 2
—
22.0
—
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/8)
Reference
value
1, 2
Subsleep
mode current
dissipation
ISUBSP
VCC
—
20.0
45.0
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
1, 2
Watch mode
current
dissipation
IWATCH
VCC
—
—
5.5
µA
VCC = 2.7 V, LCD not used,
32-kHz crystal oscillator
1, 2
Standby
mode current
dissipation
ISTBY
VCC
—
—
5.0
µA
32-kHz crystal oscillator not
used
1, 2
RAM data
VRAM
retaining voltage
VCC
2.0
—
—
V
1, 2
Notes: 1. Pin states during current measurement
Mode
Internal State
Other LCD Power
Pins Supply
Oscillator Pins
Active mode (high
Operates
and medium speed)
VCC
Open
Sleep mode
Only timer operates
VCC
Open
Subactive mode
Operates
VCC
Open
System clock oscillator: Crystal
Subsleep mode
Only timer operates, VCC
CPU stops
Open
Subclock oscillator: Crystal
Watch mode
Only time-base clock VCC
operates, CPU stops
Open
Standby mode
CPU and timers all
stop
Open
VCC
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
350
Table 14.9 DC Characteristics of H8/3835S, H8/3836S and H8/3837S (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Allowable output low
current (per pin)
IOL
Output pins except in
ports 2 and 3
—
—
2.0
mA
VCC = 4.0 V to 5.5 V
Ports 2 and 3
—
—
10.0
All output pins
—
—
0.5
Output pins except in
ports 2 and 3
—
—
40.0
Ports 2 and 3
—
—
80.0
All output pins
—
—
20.0
All output pins
—
—
2.0
—
—
0.2
—
—
15.0
—
—
10.0
Allowable output low
current (total)
Allowable output high
current (per pin)
Allowable output high
current (total)
ΣIOL
–I OH
Σ–I OH
All output pins
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
351
14.3.3
AC Characteristics
Table 14.10 lists the control signal timing, and tables 14.11 and 14.12 list the serial interface
timing of the H8/3835S, H8/3836S and H8/3837S.
Table 14.10 Control Signal Timing of H8/3835S, H8/3836S and H8/3837S
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Applicable
Symbol Pins
System clock
oscillation frequency
fOSC
OSC clock ( φOSC)
cycle time
tOSC
System clock (φ)
cycle time
tcyc
Subclock oscillation
frequency
fW
Watch clock (φw) cycle tW
time
Subclock (φSUB) cycle
time
Typ
Max
Unit
Test Condition
OSC1, OSC2 2.0
—
10.0
MHz
VCC = 4.0 V to 5.5 V
2.0
—
5.0
OSC1, OSC2 100.0 —
1000.0 ns
2
—
16
—
—
2000.0 ns
X1, X2
—
32.768 —
kHz
X1, X2
—
30.5
—
µs
2
—
8
tW
2
—
—
tcyc
tsubcyc
OSC1, OSC2 —
—
40.0
ms
—
—
60.0
—
—
100.0
—
2.0
s
ns
VCC = 4.0 V to 5.5 V Figure 14.1
ns
VCC = 4.0 V to 5.5 V Figure 14.1
ns
VCC = 4.0 V to 5.5 V Figure 14.1
ns
VCC = 4.0 V to 5.5 V Figure 14.1
Oscillation stabilization trc
time
X1, X2
—
External clock high
width
tCPH
OSC1
40.0 —
—
80.0 —
—
External clock low
width
tCPL
40.0 —
—
80.0 —
—
—
—
15.0
—
—
20.0
—
—
15.0
—
—
20.0
External clock fall time tCPf
VCC = 4.0 V to 5.5 V 1
1000.0
Instruction cycle time
External clock rise time tCPr
Reference
Figure
200.0 —
tsubcyc
Oscillation stabilization trc
time (crystal oscillator)
Min
OSC1
Figure 14.1
tOSC
1
2
VCC = 4.0 V to 5.5 V
VCC = 2.7 V to 5.5 V
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system clock control register 2 (SYSCR2).
352
Table 14.10 Control Signal Timing of H8/3835S, H8/3836S and H8/3837S (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Applicable
Symbol Pins
Pin RES low width
tREL
RES
Input pin high width
tIH
Input pin low width
Pin UD minimum
modulation width
Typ
Max
Unit
10
—
—
tcyc
Figure 14.2
IRQ0 to IRQ4
2
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
—
—
tcyc
tsubcyc
Figure 14.3
tIL
IRQ0 to IRQ4
2
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
—
—
tcyc
tsubcyc
Figure 14.3
tUDH
tUDL
UD
—
—
tcyc
tsubcyc
Figure 14.4
4
Test Condition
Reference
Figure
Min
353
Table 14.11 Serial Interface (SCI1, SCI2) Timing of H8/3835S, H8/3836S and H8/3837S
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless
otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit Test Condition
Reference
Figure
Input serial clock
cycle time
tscyc
SCK1, SCK2
2
—
—
tcyc
Figure 14.5
Input serial clock
high width
tSCKH
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock
low width
tSCKL
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock rise tSCKr
time
SCK1, SCK2
—
—
60.0
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
80.0
Input serial clock fall tSCKf
time
SCK1, SCK2
—
—
60.0
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
80.0
Serial output data
delay time
tSOD
SO 1, SO2
—
—
200.0 ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
350.0
Serial input data
setup time
tSIS
Serial input data
hold time
tSIH
CS setup time
tCSS
CS hold time
tCSH
354
SI 1, SI2
200.0 —
—
400.0 —
—
200.0 —
—
400.0 —
—
CS
2
—
CS
2
—
SI 1, SI2
ns
VCC = 4.0 V to 5.5 V Figure 14.5
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
tcyc
Figure 14.6
—
tcyc
Figure 14.6
Table 14.12 Serial Interface (SCI3) Timing of H8/3835S, H8/3836S and H8/3837S
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless
otherwise specified.
Item
Typ
Max
Unit
tscyc
4
—
—
tcyc
Figure 14.7
6
—
—
Input clock pulse width
tSCKW
0.4
—
0.6
tscyc
Figure 14.7
Transmit data delay time
(synchronous mode)
tTXD
—
—
1
tcyc
VCC = 4.0 V to 5.5 V Figure 14.8
—
—
1
Receive data setup time
(synchronous mode)
tRXS
ns
VCC = 4.0 V to 5.5 V Figure 14.8
Receive data hold time
(synchronous mode)
tRXH
ns
VCC = 4.0 V to 5.5 V Figure 14.8
Input clock cycle
Asynchronous
Synchronous
200.0 —
—
400.0 —
—
200.0 —
—
400.0 —
—
Test Condition
Reference
Figure
Symbol Min
355
14.3.4
A/D Converter Characteristics
Table 14.13 shows the A/D converter characteristics of the H8/3835S, H8/3836S and H8/3837S.
Table 14.13 A/D Converter Characteristics of H8/3835S, H8/3836S and H8/3837S
VCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Analog power
supply voltage
AV CC
AV CC
2.5
—
5.5
V
Analog input
voltage
AV IN
AN0 to AN11
–0.3
—
AV CC + 0.3 V
Analog power
supply current
AI OPE
AV CC
—
—
1.5
AI STOP1
AV CC
—
150.0 —
µA
2
Reference
value
3
mA
AI STOP2
AV CC
—
—
5.0
µA
Analog input
capacitance
CAIN
AN0 to AN11
—
—
30.0
pF
Allowable
signal source
impedance
RAIN
—
—
10.0
kΩ
Resolution
(data length)
—
—
8
bit
Non-linearity
error
—
—
±2.0
LSB
—
—
±3.0
LSB
Quantization
error
—
—
±0.5
LSB
Absolute
accuracy
—
—
±2.5
LSB
—
—
±3.5
LSB
12.4
—
124
µs
24.8
—
124
µs
Conversion
time
Test Condition
Note
1
AV CC = 5.0 V
VCC = 2.7 V to 5.5 V
AV CC = 2.7 V to 5.5 V
VCC = 2.7 V to 5.5 V
AV CC = 2.7 V to 5.5 V
AV CC = 4.5 V to 5.5 V
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AI STOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AI STOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
356
14.3.5
LCD Characteristics
Table 14.14 lists the LCD characteristics, and table 14.15 lists the AC characteristics for external
segment expansion of the H8/3835S, H8/3836S and H8/3837S.
Table 14.14 LCD Characteristics of H8/3835S, H8/3836S and H8/3837S
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Segment driver
voltage drop
VDS
Common driver
voltage drop
VDC
LCD power supply
voltage divider
resistance
RLCD
LCD power supply
voltage
VLCD
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
SEG1 to
SEG40
—
—
0.6
V
ID = 2 µA
1
COM 1 to
COM 4
—
—
0.3
V
ID = 2 µA
1
100.0 300.0 600.0 kΩ
V1
2.7
—
VCC
Between V 1 and
VSS
V
2
Notes: 1. These are the voltage drops between the voltage supply pins V1, V2, V3 , and V SS , and
the segment pins or common pins.
2. When VLCD is supplied from an external source, the following relation must hold:
VCC ≥ V1 ≥ V2 ≥ V3 ≥ VSS
Table 14.15 AC Characteristics for External Segment Expansion of H8/3835S, H8/3836S
and H8/3837S
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Reference
Figure
Clock high width
tCWH
CL1, CL2
800.0
—
—
ns
*
Figure 14.9
Clock low width
tCWL
CL2
800.0
—
—
ns
*
Figure 14.9
Clock setup time
tCSU
CL1, CL2
500.0
—
—
ns
*
Figure 14.9
Data setup time
tSU
DO
300.0
—
—
ns
*
Figure 14.9
Data hold time
tDH
DO
300.0
—
—
ns
*
Figure 14.9
M delay time
tDM
M
–1000 —
1000.0 ns
Figure 14.9
Clock rise and fall
times
tCT
CL1, CL2
—
100.0
Figure 14.9
—
ns
Note: * Value when the frame frequency is set to between 30.5 Hz and 488 Hz.
357
14.4
H8/3832S, H8/3833S, H8/3834S, H8/3835S, H8/3836S and H8/3837S
Absolute Maximum Ratings (Wide Temperature Range (I-Spec)
Version)
Table 14.6 lists the absolute maximum ratings.
Table 14.6 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Power supply voltage
VCC
–0.3 to +7.0
V
Analog power supply voltage
AVCC
–0.3 to +7.0
V
Input voltage
Ports other than ports B and C
Vin
–0.3 to VCC + 3.0
V
Ports B and C
AVin
–0.3 to AVCC + 3.0
V
Operating temperature
Topr
–40 to +85
°C
Storage temperature
Tstg
–55 to +125
°C
Note: Permanent damage may occur to the chip if maximum ratings are exceeded. Normal
operation should be under the conditions specified in Electrical Characteristics. Exceeding
these values can result in incorrect operation and reduced reliability.
358
14.5
H8/3832S, H8/3833S and H8/3834S Electrical Characteristics (Wide
Temperature Range (I-Spec) Version)
14.5.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range of the H8/3832S, H8/3833S, and H8/3834S (wide
temperature range (I-spec) version) are indicated by the shaded region in the figures below.
1. Power supply voltage vs. oscillator frequency range
32.768
fw (kHz)
f OSC (MHz)
10.0
5.0
2.0
2.5
4.0
• Active mode (high speeds)
• Sleep mode
5.5
VCC (V)
2.5
4.0
5.5
VCC (V)
• All operating modes
359
2. Power supply voltage vs. clock frequency range
φSUB (kHz)
φ (MHz)
5.0
2.5
16.384
8.192
4.096
0.5
2.5
4.0
2.5
5.5
VCC (V)
• Active mode (high speed)
• Sleep mode (except CPU)
4.0
5.5
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
625.0
φ (kHz)
500.0
312.5
62.5
2.5
4.0
5.5
VCC (V)
• Active mode (medium speed)
3. Analog power supply voltage vs. A/D converter operating range
5.0
625.0
φ (kHz)
φ (MHz)
500.0
2.5
0.5
62.5
2.5
4.0
• Active (high speed) mode
• Sleep mode
360
312.5
5.5
AVCC (V)
2.5
4.0
5.5
AVCC (V)
• Active (medium speed) mode
14.5.2
DC Characteristics
Table 14.17 lists the DC characteristics of H8/3832S, H8/3833S and H8/3834S (wide temperature
range (I-spec) version).
Table 14.17 DC Characteristics of H8/3832S, H8/3833S and H8/3834S (Wide Temperature
Range (I-Spec) Version)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Input high
voltage
VIH
RES, MD0,
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF
CS, TMIG,
SCK1, SCK2,
SCK3, ADTRG
0.8 V CC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
0.9 V CC
—
VCC + 0.3
UD, SI 1, SI2, RXD
0.7 V CC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
0.8 V CC
—
VCC + 0.3
VCC – 0.5 —
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
V
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
OSC1
Input low
voltage
VIL
VCC – 0.3 —
VCC + 0.3
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
0.7 V CC
—
VCC + 0.3
0.8 V CC
—
VCC + 0.3
PB 0 to PB7
PC0 to PC3
0.7 V CC
—
AV CC + 0.3 V
0.8 V CC
—
AV CC + 0.3
RES, MD0,
–0.3
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF,
CS, TMIG,
–0.3
SCK1, SCK2,
SCK3, ADTRG
—
0.2 V CC
—
0.1 V CC
UD, SI 1, SI2, RXD
–0.3
—
0.3 V CC
–0.3
—
0.2 V CC
V
VCC = 4.0 V to 5.5 V
V
VCC = 4.0 V to 5.5 V
Note
Note: Connect pin TEST to VSS .
361
Table 14.17 DC Characteristics of H8/3832S, H8/3833S and H8/3834S (Wide Temperature
Range (I-Spec) Version) (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Input low
voltage
VIL
OSC1
–0.3
—
0.5
V
VCC = 4.0 V to 5.5 V
–0.3
—
0.3
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
PB 0 to PB7
PC0 to PC3
–0.3
—
0.3 V CC
V
VCC = 4.0 V to 5.5 V
–0.3
—
0.2 V CC
P10 to P17
P20 to P27
P30 to P37
P40 to P42
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
VCC – 1.0 —
—
V
VCC = 4.0 V to 5.5 V
–I OH = 1.0 mA
VCC – 0.5 —
—
VCC = 4.0 V to 5.5 V
–I OH = 0.5 mA
VCC – 0.5 —
—
–I OH = 0.1 mA
P10 to P17
P40 to P42
—
—
0.6
—
—
0.5
IOL = 0.4 mA
—
—
0.5
IOL = 0.4 mA
Output
high
voltage
VOH
Output low VOL
voltage
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
362
V
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
Note
Table 14.17 DC Characteristics of H8/3832S, H8/3833S and H8/3834S (Wide Temperature
Range (I-Spec) Version) (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Output low VOL
voltage
Input/
output
leakage
current
|IIL|
Pull-up
MOS
current
–I P
Input
capacitance
CIN
Applicable Pins
Min
Typ
Max
Unit
Test Condition
P20 to P27
P30 to P37
—
—
1.5
V
VCC = 4.0 V to 5.5 V
IOL = 10 mA
—
—
0.6
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
—
—
0.5
IOL = 0.4 mA
RES
OSC1, MD0
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
—
—
1.0
PB 0 to PB7
PC0 to PC3
—
—
1.0
P10 to P17
P30 to P37
50.0
—
300.0
µA
VCC = 5 V,
VIN = 0 V
P50 to P57
P60 to P67
—
35.0
—
µA
VCC = 2.7 V,
VIN = 0 V
All input pins
except power
supply
—
—
15.0
pF
f = 1 MHz,
VIN = 0 V
Ta = 25°C
µA
Note
VIN = 0.5 V to
VCC – 0.5 V
VIN = 0.5 V to
AV CC – 0.5 V
Reference
value
363
Table 14.17 DC Characteristics of H8/3832S, H8/3833S and H8/3834S (Wide Temperature
Range (I-Spec) Version) (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
Active mode
current
dissipation
IOPE1
VCC
—
9.0
13.0
mA
Active mode (high speed),
VCC = 5 V, f osc = 10 MHz
1, 2
IOPE2
VCC
—
1.7
3.0
mA
Active mode (medium speed), 1, 2
VCC = 5 V, f osc = 10 MHz
Sleep mode
current
dissipation
ISLEEP
VCC
—
4.0
7.0
mA
VCC = 5 V, f osc = 10 MHz
1, 2
Subactive
mode current
dissipation
ISUB
VCC
—
30.0
65.0
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
1, 2
—
22.0
—
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/8)
Reference
value
1, 2
Subsleep
mode current
dissipation
ISUBSP
VCC
—
20.0
45.0
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
1, 2
Watch mode
current
dissipation
IWATCH
VCC
—
—
5.5
µA
VCC = 2.7 V, LCD not used,
32-kHz crystal oscillator
1, 2
Standby
mode current
dissipation
ISTBY
VCC
—
—
5.0
µA
32-kHz crystal oscillator not
used
1, 2
RAM data
VRAM
retaining voltage
VCC
2.0
—
—
V
1, 2
Notes: 1. Pin states during current measurement
Mode
Internal State
Other LCD Power
Pins Supply
Oscillator Pins
Active mode (high
Operates
and medium speed)
VCC
Open
Sleep mode
Only timer operates
VCC
Open
Subactive mode
Operates
VCC
Open
System clock oscillator: Crystal
Subsleep mode
Only timer operates, VCC
CPU stops
Open
Subclock oscillator: Crystal
Watch mode
Only time-base clock VCC
operates, CPU stops
Open
Standby mode
CPU and timers all
stop
Open
VCC
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
364
Table 14.17 DC Characteristics of H8/3832S, H8/3833S and H8/3834S (Wide Temperature
Range (I-Spec) Version) (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Allowable output low
current (per pin)
IOL
Output pins except in
ports 2 and 3
—
—
2.0
mA
VCC = 4.0 V to 5.5 V
Ports 2 and 3
—
—
10.0
All output pins
—
—
0.5
Output pins except in
ports 2 and 3
—
—
40.0
Ports 2 and 3
—
—
80.0
All output pins
—
—
20.0
All output pins
—
—
2.0
—
—
0.2
—
—
15.0
—
—
10.0
Allowable output low
current (total)
Allowable output high
current (per pin)
Allowable output high
current (total)
ΣIOL
–I OH
Σ–I OH
All output pins
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
365
14.5.3
AC Characteristics
Table 14.18 lists the control signal timing, and tables 14.19 and 14.20 list the serial interface
timing of the H8/3832S, H8/3833S, and H8/3834S (wide temperature range (I-spec) version).
Table 14.18 Control Signal Timing of H8/3832S, H8/3833S, and H8/3834S (Wide
Temperature Range (I-Spec) Version)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise specified.
Item
Applicable
Symbol Pins
System clock
oscillation frequency
fOSC
OSC clock ( φOSC)
cycle time
tOSC
System clock (φ)
cycle time
tcyc
Subclock oscillation
frequency
fW
Watch clock (φw) cycle tW
time
Subclock (φSUB) cycle
time
Min
Typ
Max
Unit
Test Condition
OSC1, OSC2 2.0
—
10.0
MHz
VCC = 4.0 V to 5.5 V
2.0
—
5.0
OSC1, OSC2 100.0 —
1000.0 ns
200.0 —
1000.0
2
—
16
—
—
2000.0 ns
X1, X2
—
32.768 —
kHz
X1, X2
—
30.5
—
µs
2
—
8
tW
2
—
—
tcyc
tsubcyc
ms
tsubcyc
Instruction cycle time
Reference
Figure
VCC = 4.0 V to 5.5 V 1
Figure 14.1
tOSC
1
2
Oscillation stabilization trc
time (crystal oscillator)
OSC1, OSC2 —
—
40.0
—
—
60.0
—
—
100.0
Oscillation stabilization trc
time
X1, X2
—
—
2.0
s
External clock high
width
tCPH
OSC1
40.0 —
—
ns
VCC = 4.0 V to 5.5 V Figure 14.1
80.0 —
—
External clock low
width
tCPL
40.0 —
—
ns
VCC = 4.0 V to 5.5 V Figure 14.1
80.0 —
—
—
—
15.0
ns
VCC = 4.0 V to 5.5 V Figure 14.1
—
—
20.0
External clock rise time tCPr
OSC1
VCC = 4.0 V to 5.5 V
VCC = 2.7 V to 5.5 V
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system control register 2 (SYSCR2).
366
Table 14.18 Control Signal Timing of H8/3832S, H8/3833S, and H8/3834S (Wide
Temperature Range (I-Spec) Version) (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Applicable
Pins
External clock fall time tCPf
Reference
Figure
Min Typ
Max
Unit
Test Condition
—
—
15.0
ns
VCC = 4.0 V to
5.5 V
—
—
20.0
10
—
—
tcyc
Figure 14.2
Figure 14.1
Pin RES low width
tREL
RES
Input pin high width
tIH
IRQ0 to IRQ4
2
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
—
—
tcyc
tsubcyc
Figure 14.3
Input pin low width
tIL
IRQ0 to IRQ4
2
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
—
—
tcyc
tsubcyc
Figure 14.3
Pin UD minimum
modulation width
tUDH
tUDL
UD
—
—
tcyc
tsubcyc
Figure 14.4
4
367
Table 14.19 Serial Interface (SCI1, SCI2) Timing of H8/3832S, H8/3833S, and H8/3834S
(Wide Temperature Range (I-Spec) Version)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, unless
otherwise specified.
Applicable
Symbol Pins
Min
Typ
Max
Unit
Input serial clock
cycle time
tscyc
SCK1, SCK2
2
—
—
tcyc
Figure 14.5
Input serial clock
high width
tSCKH
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock
low width
tSCKL
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock rise tSCKr
time
SCK1, SCK2
—
—
60.0
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
80.0
Input serial clock fall tSCKf
time
SCK1, SCK2
—
—
60.0
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
80.0
Serial output data
delay time
tSOD
SO 1, SO2
—
—
200.0 ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
Serial input data
setup time
tSIS
SI 1, SI2
Serial input data
hold time
tSIH
SI 1, SI2
CS setup time
tCSS
CS
CS hold time
tCSH
CS
Item
368
Test Condition
Reference
Figure
350.0
200.0 —
—
ns
VCC = 4.0 V to 5.5 V Figure 14.5
400.0 —
—
200.0 —
—
ns
VCC = 4.0 V to 5.5 V Figure 14.5
400.0 —
—
2
—
—
tcyc
Figure 14.6
2
—
—
tcyc
Figure 14.6
Table 14.20 Serial Interface (SCI3) Timing of H8/3832S, H8/3833S, and H8/3834S (Wide
Temperature Range (I-Spec) Version)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, unless
otherwise specified.
Item
Input clock cycle
Asynchronous
Symbol Min
Typ
Max
Unit
tscyc
4
—
—
tcyc
6
—
—
Synchronous
Test Condition
Reference
Figure
Figure 14.7
Input clock pulse width
tSCKW
0.4
—
0.6
tscyc
Transmit data delay time
(synchronous mode)
tTXD
—
—
1
tcyc
VCC = 4.0 V to 5.5 V Figure 14.8
—
—
1
Receive data setup time
(synchronous mode)
tRXS
ns
VCC = 4.0 V to 5.5 V Figure 14.8
Receive data hold time
(synchronous mode)
tRXH
ns
VCC = 4.0 V to 5.5 V Figure 14.8
200.0 —
—
400.0 —
—
200.0 —
—
400.0 —
—
Figure 14.7
369
14.5.4
A/D Converter Characteristics
Table 14.21 shows the A/D converter characteristics of H8/3832S, H8/3833S, and H8/3834S
(wide temperature range (I-spec) version).
Table 14.21 A/D Converter Characteristics of H8/3832S, H8/3833S, and H8/3834S (Wide
Temperature Range (I-Spec) Version)
VCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Analog power
supply voltage
AV CC
AV CC
2.5
—
5.5
V
Analog input
voltage
AV IN
AN0 to AN11
–0.3
—
AV CC + 0.3 V
Analog power
supply current
AI OPE
AV CC
—
—
1.5
AI STOP1
AV CC
—
150.0 —
µA
2
Reference
value
AI STOP2
AV CC
—
—
5.0
µA
3
Analog input
capacitance
CAIN
AN0 to AN11
—
—
30.0
pF
Allowable
signal source
impedance
RAIN
—
—
10.0
kΩ
Resolution
(data length)
—
—
8
bit
Non-linearity
error
—
—
±2.0
LSB
—
—
±3.0
Quantization
error
—
—
±0.5
LSB
Absolute
accuracy
—
—
±2.5
LSB
VCC = 2.7 V to 5.5 V
AV CC = 2.7 V to 5.5 V
Conversion
time
12.4
—
124
µs
AV CC = 4.5 V to 5.5 V
24.8
—
124
mA
Test Condition
Note
1
AV CC = 5.0 V
VCC = 2.7 V to 5.5 V
AV CC = 2.7 V to 5.5 V
±3.5
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AI STOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AI STOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
370
14.5.5
LCD Characteristics
Table 14.22 lists the LCD characteristics, and table 14.23 lists the AC characteristics for external
segment expansion of H8/3832S, H8/3833S, and H8/3834S (wide temperature range (I-spec)
version).
Table 14.22 LCD Characteristics of H8/3832S, H8/3833S, and H8/3834S (Wide
Temperature Range (I-Spec) Version)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Segment driver
voltage drop
VDS
Common driver
voltage drop
VDC
LCD power supply
voltage divider
resistance
RLCD
LCD power supply
voltage
VLCD
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
SEG1 to
SEG40
—
—
0.6
V
ID = 2 µA
1
COM 1 to
COM 4
—
—
0.3
V
ID = 2 µA
1
100.0 300.0 600.0 kΩ
V1
2.7
—
VCC
V
Between V 1 and
VSS
2
Notes: 1. These are the voltage drops between the voltage supply pins V1, V2, V3 , and V SS , and
the segment pins or common pins.
2. When VLCD is supplied from an external source, the following relation must hold:
VCC ≥ V1 ≥ V2 ≥ V3 ≥ VSS
371
Table 14.23 AC Characteristics for External Segment Expansion of 8/3832S, H8/3833S, and
H8/3834S (Wide Temperature Range (I-Spec) Version)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Reference
Figure
Clock high width
tCWH
CL1, CL2
800.0
—
—
ns
*
Figure 14.9
Clock low width
tCWL
CL2
800.0
—
—
ns
*
Figure 14.9
Clock setup time
tCSU
CL1, CL2
500.0
—
—
ns
*
Figure 14.9
Data setup time
tSU
DO
300.0
—
—
ns
*
Figure 14.9
Data hold time
tDH
DO
300.0
—
—
ns
*
Figure 14.9
M delay time
tDM
M
–1000 —
1000.0 ns
Figure 14.9
Clock rise and fall
times
tCT
CL1, CL2
—
100.0
Figure 14.9
—
ns
Note: * Value when the frame frequency is set to between 30.5 Hz and 488 Hz.
372
14.6
H8/3835S, H8/3836S and H8/3837S Electrical Characteristics (Wide
Temperature Range (I-Spec) Version)
14.6.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range of the H8/3835S, H8/3836S, and H8/3837S are
indicated by the shaded region in the figures below.
1. Power supply voltage vs. oscillator frequency range of H8/3835S, H8/3836S, and H8/3837S
32.768
fw (kHz)
f OSC (MHz)
10.0
5.0
2.0
2.5
4.0
• Active mode (high speeds)
• Sleep mode
5.5
VCC (V)
2.5
4.0
5.5
VCC (V)
• All operating modes
373
2. Power supply voltage vs. clock frequency range of H8/3835S, H8/3836S, and H8/3837S
φSUB (kHz)
φ (MHz)
5.0
2.5
16.384
8.192
4.096
0.5
2.5
4.0
5.5
VCC (V)
2.5
• Active mode (high speed)
• Sleep mode (except CPU)
4.0
5.5
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
625.0
φ (kHz)
500.0
312.5
62.5
2.5
4.0
5.5
VCC (V)
• Active mode (medium speed)
3. Analog power supply voltage vs. A/D converter operating range of H8/3835S, H8/3836S, and
H8/3837S
5.0
625.0
φ (kHz)
φ (MHz)
500.0
2.5
0.5
62.5
2.5
4.0
• Active (high speed) mode
• Sleep mode
374
312.5
5.5
AVCC (V)
2.5
4.0
5.5
AVCC (V)
• Active (medium speed) mode
14.6.2
DC Characteristics
Table 14.24 lists the DC characteristics of the H8/3835S, H8/3836S and H8/3837S (wide
temperature range (I-spec) version).
Table 14.24 DC Characteristics of H8/3835S, H8/3836S and H8/3837S (Wide Temperature
Range (I-Spec) Version)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to + 85°C,
including subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Input high
voltage
VIH
RES, MD0,
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF
CS, TMIG,
SCK1, SCK2,
SCK3, ADTRG
UD, SI 1, SI2, RXD
0.8 V CC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
0.9 V CC
—
VCC + 0.3
0.7 V CC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
0.8 V CC
—
VCC + 0.3
VCC – 0.5 —
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
V
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
OSC1
Input low
voltage
VIL
VCC – 0.3 —
VCC + 0.3
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
0.7 V CC
—
VCC + 0.3
0.8 V CC
—
VCC + 0.3
PB 0 to PB7
PC0 to PC3
0.7 V CC
—
AV CC + 0.3 V
0.8 V CC
—
AV CC + 0.3
—
0.2 V CC
—
0.1 V CC
RES, MD0,
–0.3
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF,
–0.3
CS, TMIG,
SCK1, SCK2,
SCK3, ADTRG
V
Note
VCC = 4.0 V to 5.5 V
Note: Connect pin TEST to VSS .
375
Table 14.24 DC Characteristics of H8/3835S, H8/3836S and H8/3837S (Wide Temperature
Range (I-Spec) Version) (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to + 85°C,
including subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Input low
voltage
VIL
UD, SI 1, SI2, RXD
–0.3
—
0.3 V CC
V
VCC = 4.0 V to 5.5 V
–0.3
—
0.2 V CC
–0.3
—
0.5
V
VCC = 4.0 V to 5.5 V
–0.3
—
0.3
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
PB 0 to PB7
PC0 to PC3
–0.3
—
0.3 V CC
V
VCC = 4.0 V to 5.5 V
–0.3
—
0.2 V CC
P10 to P17
P20 to P27
P30 to P37
P40 to P42
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
VCC – 1.0 —
—
V
VCC = 4.0 V to 5.5 V
–I OH = 1.0 mA
VCC – 0.5 —
—
VCC = 4.0 V to 5.5 V
–I OH = 0.5 mA
VCC – 0.5 —
—
–I OH = 0.1 mA
P10 to P17
P40 to P42
—
—
0.6
—
—
0.5
IOL = 0.4 mA
—
—
0.5
IOL = 0.4 mA
OSC1
Output high VOH
voltage
Output
VOL
low voltage
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
Note: Connect pin TEST to VSS .
376
V
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
Note
Table 14.24 DC Characteristics of H8/3835S, H8/3836S and H8/3837S (Wide Temperature
Range (I-Spec) Version) (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to + 85°C,
including subactive mode, unless otherwise indicated.
Item
Symbol Applicable Pins
Output
VOL
low voltage
Input/output |IIL|
leakage
current
Pull-up
MOS
current
–I P
Input
CIN
capacitance
Min
Typ
Max
Unit
Test Condition
—
—
1.5
V
VCC = 4.0 V to 5.5 V
IOL = 10 mA
—
—
0.6
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
—
—
0.5
IOL = 0.4 mA
RES
OSC1, MD0
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
—
—
1.0
PB 0 to PB7
PC0 to PC3
—
—
1.0
P10
P30
P50
P60
50.0
—
300.0
—
35.0
—
—
—
15.0
P20 to P27
P30 to P37
to P17
to P37
to P57
to P67
All input pins
except power
supply
µA
Note
VIN = 0.5 V to
VCC – 0.5 V
VIN = 0.5 V to
AV CC – 0.5 V
µA
VCC = 5 V,
VIN = 0 V
VCC = 2.7 V,
VIN = 0 V
pF
Reference
value
f = 1 MHz,
VIN = 0 V
Ta = 25°C
377
Table 14.24 DC Characteristics of H8/3835S, H8/3836S and H8/3837S (Wide Temperature
Range (I-Spec) Version) (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to + 85°C,
including subactive mode, unless otherwise indicated.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
Active mode
current
dissipation
IOPE1
VCC
—
9.0
13.0
mA
Active mode (high speed),
VCC = 5 V, f osc = 10 MHz
1, 2
IOPE2
VCC
—
1.7
3.0
mA
Active mode (medium speed), 1, 2
VCC = 5 V, f osc = 10 MHz
Sleep mode
current
dissipation
ISLEEP
VCC
—
4.0
7.0
mA
VCC = 5 V, f osc = 10 MHz
1, 2
Subactive
mode current
dissipation
ISUB
VCC
—
30.0
65.0
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
1, 2
—
22.0
—
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/8)
Reference
value
1, 2
Subsleep
mode current
dissipation
ISUBSP
VCC
—
20.0
45.0
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
1, 2
Watch mode
current
dissipation
IWATCH
VCC
—
—
5.5
µA
VCC = 2.7 V, LCD not used,
32-kHz crystal oscillator
1, 2
Standby
mode current
dissipation
ISTBY
VCC
—
—
5.0
µA
32-kHz crystal oscillator not
used
1, 2
RAM data
VRAM
retaining voltage
VCC
2.0
—
—
V
1, 2
Notes: 1. Pin states during current measurement
Other
Pins
LCD
Power
Supply
Active mode (high
Operates
and medium speed)
VCC
Open
Sleep mode
Only timer operates
VCC
Open
Subactive mode
Operates
VCC
Open
System clock oscillator: Crystal
Subsleep mode
Only timer operates,
CPU stops
VCC
Open
Subclock oscillator: Crystal
Watch mode
Only time-base clock
operates, CPU stops
VCC
Open
Standby mode
CPU and timers all stop VCC
Open
Mode
Internal State
Oscillator Pins
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
378
Table 14.24 DC Characteristics of H8/3835S, H8/3836S and H8/3837S (Wide Temperature
Range (I-Spec) Version) (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to + 85°C,
including subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Allowable output low
current (per pin)
IOL
Output pins except in
ports 2 and 3
—
—
2.0
mA
VCC = 4.0 V to 5.5 V
Ports 2 and 3
—
—
10.0
All output pins
—
—
0.5
Output pins except in
ports 2 and 3
—
—
40.0
Ports 2 and 3
—
—
80.0
All output pins
—
—
20.0
All output pins
—
—
2.0
—
—
0.2
—
—
15.0
—
—
10.0
Allowable output low
current (total)
ΣIOL
Allowable output high
current (per pin)
–I OH
Allowable output high
current (total)
Σ–I OH
All output pins
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
379
14.6.3
AC Characteristics
Table 14.25 lists the control signal timing, and tables 14.26 and 14.27 list the serial interface
timing of the H8/3835S, H8/3836S, and H8/3837S (wide temperature range (I-spec) version).
Table 14.25 Control Signal Timing of H8/3835S, H8/3836S, and H8/3837S (Wide
Temperature Range (I-Spec) Version)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to + 85°C,
including subactive mode, unless otherwise specified.
Item
Symbol
Applicable
Pins
System clock
oscillation frequency
fOSC
OSC clock ( φOSC)
cycle time
tOSC
Min
Typ
Max
Unit
Test Condition
OSC1, OSC2 2.0
—
10.0
MHz
VCC = 4.0 V to 5.5 V
2.0
—
5.0
OSC1, OSC2 100.0 —
System clock (φ) cycle tcyc
time
1000.0 ns
200.0 —
1000.0
2
—
16
—
—
2000.0 ns
fW
X1, X2
—
32.768 —
kHz
Watch clock (φW)
cycle time
tW
X1, X2
—
30.5
—
µs
Subclock (φSUB) cycle
time
tsubcyc
2
—
8
tW
2
—
—
tcyc
Instruction cycle time
VCC = 4.0 V to 5.5 V 1
Figure 14.1
tOSC
Subclock oscillation
frequency
Reference
Figure
1
2
tsubcyc
Oscillation stabilization trc
time (crystal oscillator)
OSC1, OSC2 —
—
40.0
—
—
60.0
—
—
100.0
Oscillation stabilization trc
time
X1, X2
—
—
2.0
s
External clock high
width
tCPH
OSC1
40.0 —
—
ns
VCC = 4.0 V to 5.5 V Figure 14.1
80.0 —
—
External clock low
width
tCPL
40.0 —
—
ns
VCC = 4.0 V to 5.5 V Figure 14.1
80.0 —
—
—
—
15.0
ns
VCC = 4.0 V to 5.5 V Figure 14.1
—
—
20.0
External clock rise timetCPr
OSC1
ms
VCC = 4.0 V to 5.5 V
VCC = 2.7 V to 5.5 V
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system control register 2 (SYSCR2).
380
Table 14.25 Control Signal Timing of H8/3835S, H8/3836S, and H8/3837S (Wide
Temperature Range (I-Spec) Version) (cont)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Applicable
Pins
External clock fall time tCPf
Reference
Figure
Min
Typ
Max
Unit
Test Condition
—
—
15.0
ns
VCC = 4.0 V to 5.5 V Figure 14.1
—
—
20.0
10
—
—
tcyc
Figure 14.2
IRQ0 to IRQ4 2
WKP0 to
WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
—
—
tcyc
tsubcyc
Figure 14.3
tIL
IRQ0 to IRQ4 2
WKP0 to
WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
—
—
tcyc
tsubcyc
Figure 14.3
tUDH
tUDL
UD
—
—
tcyc
tsubcyc
Figure 14.4
Pin RES low width
tREL
RES
Input pin high width
tIH
Input pin low width
Pin UD minimum
modulation width
4
381
Table 14.26 Serial Interface (SCI1, SCI2) Timing of H8/3835S, H8/3836S, and H8/3837S
(Wide Temperature Range (I-Spec) Version)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, unless
otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Input serial clock
cycle time
tscyc
SCK1, SCK2
2
—
—
tcyc
Figure 14.5
Input serial clock
high width
tSCKH
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock low tSCKL
width
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock rise tSCKr
time
SCK1, SCK2
—
—
60.0
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
80.0
Input serial clock fall tSCKf
time
SCK1, SCK2
—
—
60.0
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
80.0
Serial output data
delay time
SO 1, SO2
—
—
200.0 ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
350.0
tSOD
Serial input data setup tSIS
time
SI 1, SI2
Serial input data hold tSIH
time
SI 1, SI2
CS setup time
tCSS
CS
CS hold time
tCSH
CS
382
200.0 —
—
400.0 —
—
200.0 —
—
400.0 —
—
2
—
2
—
Test Condition
Reference
Figure
ns
VCC = 4.0 V to 5.5 V Figure 14.5
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
tcyc
Figure 14.6
—
tcyc
Figure 14.6
Table 14.27 Serial Interface (SCI3) Timing of H8/3835S, H8/3836S, and H8/3837S (Wide
Temperature Range (I-Spec) Version)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, unless
otherwise specified.
Item
Input clock cycle
Asynchronous
Symbol Min
Typ
Max
Unit
tscyc
4
—
—
tcyc
6
—
—
Synchronous
Test Condition
Reference
Figure
Figure 14.7
Input clock pulse width
tSCKW
0.4
—
0.6
tscyc
Transmit data delay time
(synchronous mode)
tTXD
—
—
1
tcyc
VCC = 4.0 V to 5.5 V Figure 14.8
—
—
1
Receive data setup time
(synchronous mode)
tRXS
ns
VCC = 4.0 V to 5.5 V Figure 14.8
Receive data hold time
(synchronous mode)
tRXH
ns
VCC = 4.0 V to 5.5 V Figure 14.8
200.0 —
—
400.0 —
—
200.0 —
—
400.0 —
—
Figure 14.7
383
14.6.4
A/D Converter Characteristics
Table 14.28 shows the A/D converter characteristics of the H8/3835S, H8/3836S, and H8/3837S
(wide temperature range (I-spec) version).
Table 14.28 A/D Converter Characteristics of H8/3835S, H8/3836S, and H8/3837S (Wide
Temperature Range (I-Spec) Version)
VCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Analog power
supply voltage
AV CC
AV CC
2.5
—
5.5
V
Analog input
voltage
AV IN
AN0 to AN11
–0.3
—
AV CC + 0.3 V
Analog power
supply current
AI OPE
AV CC
—
—
1.5
AI STOP1
AV CC
—
150.0 —
µA
2
Reference
value
3
mA
Test Condition
Note
1
AV CC = 5.0 V
AI STOP2
AV CC
—
—
5.0
µA
Analog input
capacitance
CAIN
AN0 to AN11
—
—
30.0
pF
Allowable
signal source
impedance
RAIN
—
—
10.0
kΩ
Resolution
(data length)
—
—
8
bit
Non-linearity
error
—
—
±2.0
LSB
—
—
±3.0
Quantization
error
—
—
±0.5
LSB
Absolute
accuracy
—
—
±2.5
LSB
VCC = 2.7 V to 5.5 V
AV CC = 2.7 V to 5.5 V
µs
AV CC = 4.5 V to 5.5 V
VCC = 2.7 V to 5.5 V
AV CC = 2.7 V to 5.5 V
±3.5
Conversion
time
12.4
—
124
24.8
—
124
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AI STOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AI STOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
384
14.6.5
LCD Characteristics
Table 14.29 lists the LCD characteristics, and table 14.30 lists the AC characteristics for external
segment expansion of the H8/3835S, H8/3836S, and H8/3837S (wide temperature range (I-spec)
version).
Table 14.29 LCD Characteristics of H8/3835S, H8/3836S, and H8/3837S (Wide
Temperature Range (I-Spec) Version)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Segment driver
voltage drop
VDS
Common driver
voltage drop
VDC
LCD power supply
voltage divider
resistance
RLCD
LCD power supply
voltage
VLCD
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
SEG1 to
SEG40
—
—
0.6
V
ID = 2 µA
1
COM 1 to
COM 4
—
—
0.3
V
ID = 2 µA
1
100.0 300.0 600.0 kΩ
V1
2.7
—
VCC
V
Between V 1 and
VSS
2
Notes: 1. These are the voltage drops between the voltage supply pins V1, V2, V3, and V SS , and
the segment pins or common pins.
2. When VLCD is supplied from an external source, the following relation must hold:
VCC ≥ V1 ≥ V2 ≥ V3 ≥ VSS
385
Table 14.30 AC Characteristics for External Segment Expansion of H8/3835S, H8/3836S,
and H8/3837S (Wide Temperature Range (I-Spec) Version)
VCC = 2.5 V to 5.5 V, AVCC = 2.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Reference
Figure
Clock high width
tCWH
CL1, CL2
800.0
—
—
ns
*
Figure 14.9
Clock low width
tCWL
CL2
800.0
—
—
ns
*
Figure 14.9
Clock setup time
tCSU
CL1, CL2
500.0
—
—
ns
*
Figure 14.9
Data setup time
tSU
DO
300.0
—
—
ns
*
Figure 14.9
Data hold time
tDH
DO
300.0
—
—
ns
*
Figure 14.9
M delay time
tDM
M
–1000 —
1000.0 ns
Figure 14.9
Clock rise and fall
times
tCT
CL1, CL2
—
100.0
Figure 14.9
—
ns
Note: * Value when the frame frequency is set to between 30.5 Hz and 488 Hz.
386
14.7
H8/3833, H8/3834, H8/3835, H8/3836, and H8/3837 (Standard
Specification) Absolute Maximum Ratings
Table 14.31 lists the absolute maximum ratings.
Table 14.31 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Power supply voltage
VCC
–0.3 to +7.0
V
Analog power supply voltage
AVCC
–0.3 to +7.0
V
Programming voltage
VPP
–0.3 to + 13.0
V
Input voltage
Ports other than ports B and C
Vin
–0.3 to VCC + 3.0
V
Ports B and C
AVin
–0.3 to AVCC + 3.0
V
Operating temperature
Topr
–20 to +75
°C
Storage temperature
Tstg
–55 to +125
°C
Note: Permanent damage may occur to the chip if maximum ratings are exceeded. Normal
operation should be under the conditions specified in Electrical Characteristics. Exceeding
these values can result in incorrect operation and reduced reliability.
387
14.8
H8/3833 and H8/3834 Electrical Characteristics
(Standard Specifications)
14.8.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range of the H8/3833 and H8/3834 are indicated by the
shaded region in the figures below.
1. Power supply voltage vs. oscillator frequency range of H8/3833 and H8/3834
32.768
fw (kHz)
f OSC (MHz)
10.0
5.0
2.0
2.7
4.0
• Active mode (high speed)
• Sleep mode
388
5.5
VCC (V)
2.7
• All operating modes
4.0
5.5
VCC (V)
2. Power supply voltage vs. clock frequency range of H8/3833 and H8/3834
5.0
φ SUB (kHz)
φ (MHz)
16.384
2.5
8.192
4.096
0.5
2.7
4.0
5.5
VCC (V)
2.7
• Active mode (high speed)
• Sleep mode (except CPU)
4.0
5.5
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
625.0
φ (kHz)
500.0
312.5
62.5
2.7
4.0
5.5
VCC (V)
• Active mode (medium speed)
3. Analog power supply voltage vs. A/D converter operating range of H8/3833 and H8/3834
5.0
625.0
φ (kHz)
φ (MHz)
500.0
2.5
0.5
312.5
62.5
2.7
4.0
• Active (high speed) mode
• Sleep mode
5.5
AVCC (V)
2.7
4.0
5.5
AVCC (V)
• Active (medium speed) mode
389
14.8.2
DC Characteristics
Table 14.32 lists the DC characteristics of the H8/3833 and H8/3834.
Table 14.32 DC Characteristics of H8/3833 and H8/3834
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Input high VIH
voltage
Applicable Pins
Min
Typ
Max
Unit
Test Condition
RES, MD0,
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF
CS, TMIG,
SCK1, SCK2,
SCK3, ADTRG
UD, SI 1, SI2, RXD
0.8 V CC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
0.9 V CC
—
VCC + 0.3
0.7 V CC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
0.8 V CC
—
VCC + 0.3
VCC – 0.5 —
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
V
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
OSC1
Input low
voltage
VIL
VCC – 0.3 —
VCC + 0.3
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
0.7 V CC
—
VCC + 0.3
0.8 V CC
—
VCC + 0.3
PB 0 to PB7
PC0 to PC3
0.7 V CC
—
AV CC + 0.3 V
0.8 V CC
—
AV CC + 0.3
RES, MD0,
–0.3
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF,
–0.3
CS, TMIG,
SCK1, SCK2,
SCK3, ADTRG
UD, SI 1, SI2, RXD –0.3
—
0.2 V CC
—
0.1 V CC
—
0.3 V CC
–0.3
—
0.2 V CC
–0.3
—
0.5
–0.3
—
0.3
OSC1
Note: Connect pin TEST to VSS .
390
V
VCC = 4.0 V to 5.5 V
V
VCC = 4.0 V to 5.5 V
V
VCC = 4.0 V to 5.5 V
Note
Table 14.32 DC Characteristics of H8/3833 and H8/3834 (cont)
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Input low
voltage
VIL
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
PB 0 to PB7
PC0 to PC3
–0.3
—
0.3 V CC
V
VCC = 4.0 V to 5.5 V
–0.3
—
0.2 V CC
P10 to P17
P20 to P27
P30 to P37
P40 to P42
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
VCC – 1.0 —
—
V
VCC = 4.0 V to 5.5 V
–I OH = 1.0 mA
VCC – 0.5 —
—
VCC = 4.0 V to 5.5 V
–I OH = 0.5 mA
VCC – 0.5 —
—
–I OH = 0.1 mA
P10 to P17
P40 to P42
—
—
0.6
—
—
0.5
IOL = 0.4 mA
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
—
—
0.5
IOL = 0.4 mA
P20 to P27
P30 to P37
—
—
1.5
VCC = 4.0 V to 5.5 V
IOL = 10 mA
—
—
0.6
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
—
—
0.5
IOL = 0.4 mA
Output high VOH
voltage
Output
VOL
low voltage
V
Note
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
Note: Connect pin TEST to VSS .
391
Table 14.32 DC Characteristics of H8/3833 and H8/3834 (cont)
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Input/output |IIL|
leakage
current
Pull-up
MOS
current
–I P
Input
CIN
capacitance
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Note
RES, P43
—
—
20.0
µA
VIN = 0.5 V to
VCC – 0.5 V
2
µA
VIN = 0.5 V to
VCC – 0.5 V
—
—
1.0
OSC1, MD0
P10 to P17
P20 to P27
P30 to P37
P40 to P42
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
—
—
1.0
PB 0 to PB7
PC0 to PC3
—
—
1.0
P10
P30
P50
P60
50.0
—
300.0
—
35.0
—
All input pins except —
power supply, RES,
P43 pin
—
15.0
RES
—
—
60.0
2
—
—
15.0
1
—
—
30.0
2
—
—
15.0
1
P43
to P17
to P37
to P57
to P67
Notes: 1. Applies to HD6433833 and HD6433834.
2. Applies to HD6473834.
392
1
VIN = 0.5 V to
AV CC – 0.5 V
µA
VCC = 5 V,
VIN = 0 V
VCC = 2.7 V,
VIN = 0 V
pF
Reference
value
f = 1 MHz,
VIN = 0 V
Ta = 25°C
Table 14.32 DC Characteristics of H8/3833 and H8/3834 (cont)
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
Active mode
current
dissipation
IOPE1
VCC
—
12.0
24.0
mA
Active mode (high speed),
VCC = 5 V, f osc = 10 MHz
3, 4
IOPE2
VCC
—
2.5
5.0
mA
Active mode (medium speed), 3, 4
VCC = 5 V, f osc = 10 MHz
Sleep mode
current
dissipation
ISLEEP
VCC
—
5.0
10.0
mA
VCC = 5 V, f osc = 10 MHz
3, 4
Subactive
mode current
dissipation
ISUB
VCC
—
50.0
130.0 µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
Reference
value
3, 4
—
40.0
—
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/8)
Reference
value
3, 4
Subsleep
mode current
dissipation
ISUBSP
VCC
—
40.0
90.0
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
Reference
value
3, 4
Watch mode
current
dissipation
IWATCH
VCC
—
—
6.0
µA
VCC = 2.7 V, LCD not used,
32-kHz crystal oscillator
Reference
value
3, 4
Standby
mode current
dissipation
ISTBY
VCC
—
—
5.0
µA
32-kHz crystal oscillator not
used
3, 4
RAM data
VRAM
retaining voltage
VCC
2.0
—
—
V
3, 4
Notes: 3. Pin states during current measurement
Mode
Internal State
LCD
Other Power
Pins Supply Oscillator Pins
Active mode (high
and medium speed)
Operates
VCC
Open
Sleep mode
Only timer operates
VCC
Open
Subactive mode
Operates
VCC
Open
System clock oscillator: Crystal
Subsleep mode
Only timer operates, CPU VCC
stops
Open
Subclock oscillator: Crystal
Watch mode
Only time-base clock
operates, CPU stops
VCC
Open
Standby mode
CPU and timers all stop
VCC
Open
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
4. Excludes current in pull-up MOS transistors and output buffers.
393
Table 14.32 DC Characteristics of H8/3833 and H8/3834 (cont)
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Allowable output low
current (per pin)
IOL
Output pins except in
ports 2 and 3
—
—
2.0
mA
VCC = 4.0 V to 5.5 V
Ports 2 and 3
—
—
10.0
All output pins
—
—
0.5
Output pins except in
ports 2 and 3
—
—
40.0
Ports 2 and 3
—
—
80.0
All output pins
—
—
20.0
—
—
2.0
—
—
0.2
—
—
15.0
—
—
10.0
Allowable output low
current (total)
ΣIOL
Allowable output high
current (per pin)
–I OH
All output pins
Allowable output high
current (total)
Σ–I OH
All output pins
394
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
14.8.3
AC Characteristics
Table 14.33 lists the control signal timing, and tables 14.34 and 14.35 list the serial interface
timing of the H8/3833 and H8/3834.
Table 14.33 Control Signal Timing of H8/3833 and H8/3834
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Applicable
Symbol Pins
Min
Typ
Max
Unit
Test Condition
MHz
VCC = 4.0 V to 5.5 V
System clock oscillation fOSC
frequency
OSC1, OSC2 2.0
—
10.0
2.0
—
5.0
OSC clock ( φOSC)
cycle time
tOSC
OSC1, OSC2 100.0 —
System clock (φ)
tcyc
cycle time
1000.0 ns
200.0 —
1000.0
2
—
16
—
—
2000.0 ns
fW
X1, X2
—
32.768 —
kHz
Watch clock (φW)
cycle time
tW
X1, X2
—
30.5
—
µs
Subclock (φSUB) cycle
time
tsubcyc
2
—
8
tW
2
—
—
tcyc
tsubcyc
ms
Instruction cycle time
VCC = 4.0 V to 5.5 V 1
Figure 14.1
tOSC
Subclock oscillation
frequency
Reference
Figure
1
2
Oscillation stabilization trc
time (crystal oscillator)
OSC1, OSC2 —
—
40.0
—
—
60.0
Oscillation stabilization trc
time
X1, X2
—
—
2.0
s
External clock high
width
OSC1
40.0 —
—
ns
VCC = 4.0 V to 5.5 V Figure 14.1
80.0 —
—
40.0 —
—
ns
VCC = 4.0 V to 5.5 V Figure 14.1
80.0 —
—
—
—
15.0
ns
VCC = 4.0 V to 5.5 V Figure 14.1
—
—
20.0
—
—
15.0
ns
VCC = 4.0 V to 5.5 V Figure 14.1
—
—
20.0
10
—
—
tCPH
External clock low width tCPL
OSC1
External clock rise time tCPr
External clock fall time tCPf
Pin RES low width
tREL
RES
tcyc
VCC = 4.0 V to 5.5 V
Figure 14.2
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system control register 2 (SYSCR2).
395
Table 14.33 Control Signal Timing of H8/3833 and H8/3834
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Applicable
Pins
Item
Symbol
Input pin high width
tIH
IRQ0 to IRQ4
2
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
Input pin low width
tIL
Pin UD minimum
modulation width
tUDH
tUDL
396
Min Typ
Unit
—
—
tcyc
tsubcyc
Figure 14.3
IRQ0 to IRQ4
2
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
—
—
tcyc
tsubcyc
Figure 14.3
UD
—
—
tcyc
tsubcyc
Figure 14.4
4
Test Condition
Reference
Figure
Max
Table 14.34 Serial Interface (SCI1, SCI2) Timing of H8/3833 and H8/3834
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless
otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Input serial clock
cycle time
tscyc
SCK1, SCK2
2
—
—
tcyc
Figure 14.5
Input serial clock
high width
tSCKH
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock low tSCKL
width
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock rise tSCKr
time
SCK1, SCK2
—
—
60.0
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
80.0
Input serial clock fall tSCKf
time
SCK1, SCK2
—
—
60.0
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
80.0
Serial output data
delay time
tSOD
SO 1, SO2
—
—
200.0 ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
350.0
Serial input data
setup time
tSIS
SI 1, SI2
200.0 —
—
400.0 —
—
200.0 —
—
400.0 —
—
Test Condition
Reference
Figure
ns
VCC = 4.0 V to 5.5 V Figure 14.5
ns
VCC = 4.0 V to 5.5 V Figure 14.5
Serial input data hold tSIH
time
SI 1, SI2
CS setup time
tCSS
CS
2
—
—
tcyc
Figure 14.6
CS hold time
tCSH
CS
2
—
—
tcyc
Figure 14.6
397
Table 14.35 Serial Interface (SCI3) Timing of H8/3833 and H8/3834
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless
otherwise specified.
Item
Typ
Max
Unit
tscyc
4
—
—
tcyc
Figure 14.7
6
—
—
Input clock pulse width
tSCKW
0.4
—
0.6
tscyc
Figure 14.7
Transmit data delay time
(synchronous mode)
tTXD
—
—
1
tcyc
VCC = 4.0 V to 5.5 V Figure 14.8
—
—
1
Receive data setup time
(synchronous mode)
tRXS
ns
VCC = 4.0 V to 5.5 V Figure 14.8
Receive data hold time
(synchronous mode)
tRXH
ns
VCC = 4.0 V to 5.5 V Figure 14.8
Input clock cycle
Asynchronous
Synchronous
398
200.0 —
—
400.0 —
—
200.0 —
—
400.0 —
—
Test Condition
Reference
Figure
Symbol Min
14.8.4
A/D Converter Characteristics
Table 14.36 shows the A/D converter characteristics of the H8/3833 and H8/3834.
Table 14.36 A/D Converter Characteristics of H8/3833 and H8/3834
VCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Applicable
Pins
Min
Typ
Max
Unit
Analog power AV CC
supply voltage
AV CC
4.0
—
5.5
V
Analog input
voltage
AN0 to AN11
–0.3
—
AV CC + 0.3 V
Analog power AI OPE
supply current AI
STOP1
AV CC
—
—
1.5
AV CC
—
150.0 —
µA
2
Reference
value
AI STOP2
AV CC
—
—
5.0
µA
3
Analog input
capacitance
CAIN
AN0 to AN11
—
—
30.0
pF
Allowable
signal source
impedance
RAIN
—
—
10.0
kΩ
Resolution
(data length)
—
—
8
bit
Non-linearity
error
—
—
±2.0
LSB
Quantization
error
—
—
±0.5
LSB
Absolute
accuracy
—
—
±2.5
LSB
Conversion
time
12.4
—
124
µs
24.8
—
124
Item
Symbol
AV IN
mA
Test Condition
Note
1
AV CC = 5.0 V
AV CC = 4.5 V to 5.5 V
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AI STOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AI STOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
399
14.8.5
LCD Characteristics
Table 14.37 lists the LCD characteristics, and table 14.38 lists the AC characteristics for external
segment expansion of the H8/3833 and H8/3834.
Table 14.37 LCD Characteristics of H8/3833 and H8/3834
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Segment driver
voltage drop
VDS
Common driver
voltage drop
VDC
LCD power supply
voltage divider
resistance
RLCD
LCD power supply
voltage
VLCD
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
SEG1 to
SEG40
—
—
0.6
V
ID = 2 µA
1
COM 1 to
COM 4
—
—
0.3
V
ID = 2 µA
1
50.0
300.0 900.0 kΩ
2.7
—
V1
VCC
Between V 1 and
VSS
V
2
Notes: 1. These are the voltage drops between the voltage supply pins V1, V2, V3, and V SS , and
the segment pins or common pins.
2. When VLCD is supplied from an external source, the following relation must hold:
VCC ≥ V1 ≥ V2 ≥ V3 ≥ VSS
Table 14.38 AC Characteristics for External Segment Expansion of H8/3833 and H8/3834
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Reference
Figure
Clock high width
tCWH
CL1, CL2
800.0
—
—
ns
*
Figure 14.9
Clock low width
tCWL
CL2
800.0
—
—
ns
*
Figure 14.9
Clock setup time
tCSU
CL1, CL2
500.0
—
—
ns
*
Figure 14.9
Data setup time
tSU
DO
300.0
—
—
ns
*
Figure 14.9
Data hold time
tDH
DO
300.0
—
—
ns
*
Figure 14.9
M delay time
tDM
M
–1000 —
1000.0 ns
Figure 14.9
Clock rise and fall
times
tCT
CL1, CL2
—
100.0
Figure 14.9
—
ns
Note: * Value when the frame frequency is set to between 30.5 Hz and 488 Hz.
400
14.9
H8/3835 and H8/3836 and H8/3837 (Standard Specifications)
Electrical Characteristics
14.9.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range of the H8/3835, H8/3836 and H8/3837 are
indicated by the shaded region in the figures below.
1. Power supply voltage vs. oscillator frequency range of H8/3835, H8/3836 and H8/3837
32.768
fw (kHz)
f OSC (MHz)
10.0
5.0
2.0
2.7
4.0
• Active mode (high speed)
• Sleep mode
5.5
VCC (V)
2.7
4.0
5.5
VCC (V)
• All operating modes
401
2. Power supply voltage vs. clock frequency range of H8/3835, H8/3836 and H8/3837
5.0
φ SUB (kHz)
φ (MHz)
16.384
2.5
8.192
4.096
0.5
2.7
4.0
5.5
VCC (V)
2.7
• Active mode (high speed)
• Sleep mode (except CPU)
4.0
5.5
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
625.0
φ (kHz)
500.0
312.5
62.5
2.7
4.0
5.5
VCC (V)
• Active mode (medium speed)
3. Analog power supply voltage vs. A/D converter operating range of H8/3835, H8/3836 and
H8/3837
5.0
625.0
φ (kHz)
φ (MHz)
500.0
2.5
0.5
62.5
2.7
4.0
• Active (high speed) mode
• Sleep mode
402
312.5
5.5
AVCC (V)
2.7
4.0
5.5
AVCC (V)
• Active (medium speed) mode
14.9.2
DC Characteristics
Table 14.39 lists the DC characteristics of the H8/3835, H8/3836 and H8/3837.
Table 14.39 DC Characteristics of H8/3835, H8/3836 and H8/3837
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Input high
voltage
VIH
RES, MD0,
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF
CS, TMIG,
SCK1, SCK2,
SCK3, ADTRG
0.8 V CC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
0.9 V CC
—
VCC + 0.3
UD, SI 1, SI2, RXD
0.7 V CC
—
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
0.8 V CC
—
VCC + 0.3
VCC – 0.5 —
VCC + 0.3
V
VCC = 4.0 V to 5.5 V
V
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
OSC1
Input low
voltage
VIL
VCC – 0.3 —
VCC + 0.3
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
0.7 V CC
—
VCC + 0.3
0.8 V CC
—
VCC + 0.3
PB 0 to PB7
PC0 to PC3
0.7 V CC
—
AV CC + 0.3 V
0.8 V CC
—
AV CC + 0.3
RES, MD0,
–0.3
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF,
CS, TMIG,
–0.3
SCK1, SCK2,
SCK3, ADTRG
—
0.2 V CC
—
0.1 V CC
UD, SI 1, SI2, RXD
–0.3
—
0.3 V CC
–0.3
—
0.2 V CC
–0.3
—
0.5
–0.3
—
0.3
OSC1
V
VCC = 4.0 V to 5.5 V
V
VCC = 4.0 V to 5.5 V
V
VCC = 4.0 V to 5.5 V
Note
Note: Connect pin TEST to VSS .
403
Table 14.39 DC Characteristics of H8/3835, H8/3836 and H8/3837 (cont)
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Input low
voltage
VIL
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
PB 0 to PB7
PC0 to PC3
–0.3
—
0.3 V CC
V
VCC = 4.0 V to 5.5 V
–0.3
—
0.2 V CC
P10 to P17
P20 to P27
P30 to P37
VCC – 1.0 —
—
V
VCC = 4.0 V to 5.5 V
–I OH = 1.0 mA
P40 to P42
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
VCC – 0.5 —
—
VCC = 4.0 V to 5.5 V
–I OH = 0.5 mA
VCC – 0.5 —
—
–I OH = 0.1 mA
P10 to P17
P40 to P42
—
—
0.6
—
—
0.5
IOL = 0.4 mA
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
—
—
0.5
IOL = 0.4 mA
P20 to P27
P30 to P37
—
—
1.5
VCC = 4.0 V to 5.5 V
IOL = 10 mA
—
—
0.6
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
—
—
0.5
IOL = 0.4 mA
Output
high
voltage
VOH
Output
VOL
low voltage
Note: Connect pin TEST to VSS .
404
V
VCC = 4.0 V to 5.5 V
IOL = 1.6 mA
Note
Table 14.39 DC Characteristics of H8/3835, H8/3836 and H8/3837 (cont)
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Input/output |IIL|
leakage
current
Pull-up
MOS
current
–I P
Input
CIN
capacitance
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Note
RES, P43
—
—
20.0
µA
VIN = 0.5 V to
VCC – 0.5 V
2
µA
VIN = 0.5 V to
VCC – 0.5 V
—
—
1.0
OSC1, MD0
P10 to P17
P20 to P27
P30 to P37
P40 to P42
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
—
—
1.0
PB 0 to PB7
PC0 to PC3
—
—
1.0
P10 to P17
P30 to P37
50.0
—
330.0
µA
VCC = 5 V,
VIN = 0 V
P50 to P57
P60 to P67
—
35.0
—
µA
VCC = 2.7 V,
VIN = 0 V
All input pins
except power
supply, RES,
P43 pin
—
—
15.0
pF
f = 1 MHz,
VIN = 0 V
Ta = 25°C
RES
—
—
60.0
2
—
—
15.0
1
—
—
30.0
2
—
—
15.0
1
P43
1
VIN = 0.5 V to
AV CC – 0.5 V
Reference
value
Notes: 1. Applies to HD6433835, HD6433836 and HD6433837.
2. Applies to HD6473837.
405
Table 14.39 DC Characteristics of H8/3835, H8/3836 and H8/3837 (cont)
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
Active mode
current
dissipation
IOPE1
VCC
—
13.5
24.0
mA
Active mode (high speed),
VCC = 5 V, f osc = 10 MHz
3, 4
IOPE2
VCC
—
2.5
5.0
mA
Active mode (medium speed), 3, 4
VCC = 5 V, f osc = 10 MHz
Sleep mode
current
dissipation
ISLEEP
VCC
—
5.0
10.0
mA
VCC = 5 V, f osc = 10 MHz
3, 4
VCC
—
50.0
130.0 µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
Reference
value
3, 4
—
40.0
—
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/8)
Reference
value
3, 4
Subactive mode ISUB
current
dissipation
Subsleep mode
current
dissipation
ISUBSP
VCC
—
40.0
—
µA
VCC = 2.7 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
Reference
value
3, 4
Watch mode
current
dissipation
IWATCH
VCC
—
—
6.0
µA
VCC = 2.7 V, LCD not used,
32-kHz crystal oscillator
Reference
value
3, 4
Standby mode
current
dissipation
ISTBY
VCC
—
—
5.0
µA
32-kHz crystal oscillator not
used
3, 4
RAM data
VRAM
retaining voltage
VCC
2.0
—
—
V
3, 4
Notes: 3. Pin states during current measurement
Mode
Internal State
Other LCD Power
Pins Supply
Oscillator Pins
Active mode (high
Operates
and medium speed)
VCC
Open
Sleep mode
Only timer operates
VCC
Open
Subactive mode
Operates
VCC
Open
System clock oscillator: Crystal
Subsleep mode
Only timer operates, VCC
CPU stops
Open
Subclock oscillator: Crystal
Watch mode
Only time-base clock VCC
operates, CPU stops
Open
Standby mode
CPU and timers all
stop
Open
VCC
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
4. Excludes current in pull-up MOS transistors and output buffers.
406
Table 14.39 DC Characteristics of H8/3835, H8/3836 and H8/3837 (cont)
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Allowable output low
current (per pin)
IOL
Output pins except in
ports 2 and 3
—
—
2.0
mA
VCC = 4.0 V to 5.5 V
Ports 2 and 3
—
—
10.0
All output pins
—
—
0.5
Output pins except in
ports 2 and 3
—
—
40.0
Ports 2 and 3
—
—
80.0
All output pins
—
—
20.0
All output pins
—
—
2.0
—
—
0.2
—
—
15.0
—
—
10.0
Allowable output low
current (total)
Allowable output high
current (per pin)
Allowable output high
current (total)
ΣIOL
–I OH
Σ–I OH
All output pins
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
mA
VCC = 4.0 V to 5.5 V
407
14.9.3
AC Characteristics
Table 14.40 lists the control signal timing, and tables 14.41 and 14.42 list the serial interface
timing of the H8/3835, H8/3836 and H8/3837.
Table 14.40 Control Signal Timing of H8/3835, H8/3836 and H8/3837
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Applicable
Pins
System clock
oscillation frequency
fOSC
OSC clock ( φOSC)
cycle time
tOSC
System clock (φ)
cycle time
tcyc
Subclock oscillation
frequency
fW
Watch clock (φW)
cycle time
tW
Subclock (φSUB) cycle
time
tsubcyc
Min
Typ
Max
Unit
Test Condition
OSC1, OSC2 2.0
—
10.0
MHz
VCC = 4.0 V to 5.5 V
2.0
—
5.0
OSC1, OSC2 100.0 —
1000.0 ns
200.0 —
1000.0
2
—
16
—
—
2000.0 ns
X1, X2
—
32.768 —
kHz
X1, X2
—
30.5
—
µs
2
—
8
tW
2
—
—
tcyc
tsubcyc
ms
Instruction cycle time
Reference
Figure
VCC = 4.0 V to 5.5 V 1
Figure 14.1
tOSC
1
2
Oscillation stabilization trc
time (crystal oscillator)
OSC1, OSC2 —
—
40.0
—
—
60.0
Oscillation stabilization trc
time
X1, X2
—
—
2.0
s
External clock high
width
tCPH
OSC1
40.0 —
—
ns
VCC = 4.0 V to 5.5 V Figure 14.1
80.0 —
—
External clock low
width
tCPL
40.0 —
—
ns
VCC = 4.0 V to 5.5 V Figure 14.1
80.0 —
—
—
—
15.0
ns
VCC = 4.0 V to 5.5 V Figure 14.1
—
—
20.0
—
—
15.0
ns
VCC = 4.0 V to 5.5 V Figure 14.1
—
—
20.0
10
—
—
tcyc
Figure 14.2
OSC1
External clock rise time tCPr
External clock fall time tCPf
Pin RES low width
tREL
RES
VCC = 4.0 V to 5.5 V
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system control register 2 (SYSCR2).
408
Table 14.40 Control Signal Timing of H8/3835, H8/3836 and H8/3837 (cont)
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Input pin high width
tIH
Input pin low width
Pin UD minimum
modulation width
tIL
tUDH
tUDL
Applicable
Pins
Min Typ
IRQ0 to IRQ4
2
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
—
IRQ0 to IRQ4
2
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
—
UD
—
4
Max
Unit
—
tcyc
Test Condition
Reference
Figure
Figure 14.3
tsubcyc
—
tcyc
Figure 14.3
tsubcyc
—
tcyc
Figure 14.4
tsubcyc
409
Table 14.41 Serial Interface (SCI1, SCI2) Timing of H8/3835, H8/3836 and H8/3837
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless
otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Input serial clock
cycle time
tscyc
SCK1, SCK2
2
—
—
tcyc
Figure 14.5
Input serial clock
high width
tSCKH
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock
low width
tSCKL
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock rise tSCKr
time
SCK1, SCK2
—
—
60.0
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
80.0
Input serial clock fall tSCKf
time
SCK1, SCK2
—
—
60.0
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
80.0
Serial output data
delay time
tSOD
SO 1, SO2
—
—
200.0 ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
—
350.0
Serial input data
setup time
tSIS
Serial input data
hold time
tSIH
CS setup time
tCSS
CS hold time
tCSH
410
SI 1, SI2
200.0 —
—
400.0 —
—
200.0 —
—
400.0 —
—
CS
2
—
CS
2
—
SI 1, SI2
Test Condition
Reference
Figure
ns
VCC = 4.0 V to 5.5 V Figure 14.5
ns
VCC = 4.0 V to 5.5 V Figure 14.5
—
tcyc
Figure 14.6
—
tcyc
Figure 14.6
Table 14.42 Serial Interface (SCI3) Timing of H8/3835, H8/3836 and H8/3837
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, unless
otherwise specified.
Item
Typ
Max
Unit
tscyc
4
—
—
tcyc
Figure 14.7
6
—
—
Input clock pulse width
tSCKW
0.4
—
0.6
tscyc
Figure 14.7
Transmit data delay time
(synchronous mode)
tTXD
—
—
1
tcyc
VCC = 4.0 V to 5.5 V Figure 14.8
—
—
1
Receive data setup time
(synchronous mode)
tRXS
ns
VCC = 4.0 V to 5.5 V Figure 14.8
Receive data hold time
(synchronous mode)
tRXH
ns
VCC = 4.0 V to 5.5 V Figure 14.8
Input clock cycle
Asynchronous
Synchronous
200.0 —
—
400.0 —
—
200.0 —
—
400.0 —
—
Test Condition
Reference
Figure
Symbol Min
411
14.9.4
A/D Converter Characteristics
Table 14.43 shows the A/D converter characteristics of the H8/3835, H8/3836 and H8/3837.
Table 14.43 A/D Converter Characteristics of H8/3835, H8/3836 and H8/3837
VCC = 2.7 V to 5.5 V, AVSS = VSS = 0.0 V, Ta = –20°C to +75°C, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Analog power
supply voltage
AV CC
AV CC
4.0
—
5.5
V
Analog input
voltage
AV IN
AN0 to AN11
AV SS
– 0.3
—
AV CC + 0.3 V
Analog power
supply current
AI OPE
AV CC
—
—
1.5
AI STOP1
AV CC
—
150.0 —
µA
2
Reference
value
3
mA
AI STOP2
AV CC
—
—
5.0
µA
Analog input
capacitance
CAIN
AN0 to AN11
—
—
30.0
pF
Allowable
signal source
impedance
RAIN
—
—
10.0
kΩ
Resolution
(data length)
—
—
8
bit
Non-linearity
error
—
—
±2.0
LSB
Quantization
error
—
—
±0.5
LSB
Absolute
accuracy
—
—
±2.5
LSB
Conversion
time
12.4
—
124
µs
24.8
—
124
Test Condition
Note
1
AV CC = 5.0 V
VCC = 4.0 V to 5.5 V
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AI STOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AI STOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
412
14.9.5
LCD Characteristics
Table 14.44 lists the LCD characteristics, and table 14.45 lists the AC characteristics for external
segment expansion of the H8/3835, H8/3836 and H8/3837.
Table 14.44 LCD Characteristics of H8/3835, H8/3836 and H8/3837
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Segment driver
voltage drop
VDS
Common driver
voltage drop
VDC
LCD power supply
voltage divider
resistance
RLCD
LCD power supply
voltage
VLCD
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
SEG1 to
SEG40
—
—
0.6
V
ID = 2 µA
1
COM 1 to
COM 4
—
—
0.3
V
ID = 2 µA
1
50.0
300.0 900.0 kΩ
2.7
—
V1
VCC
Between V 1 and
VSS
V
2
Notes: 1. These are the voltage drops between the voltage supply pins V1, V2, V3 , and V SS , and
the segment pins or common pins.
2. When VLCD is supplied from an external source, the following relation must hold:
VCC ≥ V1 ≥ V2 ≥ V3 ≥ VSS
Table 14.45 AC Characteristics for External Segment Expansion of H8/3835, H8/3836 and
H8/3837
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –20°C to +75°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Reference
Figure
Clock high width
tCWH
CL1, CL2
800.0
—
—
ns
*
Figure 14.9
Clock low width
tCWL
CL2
800.0
—
—
ns
*
Figure 14.9
Clock setup time
tCSU
CL1, CL2
500.0
—
—
ns
*
Figure 14.9
Data setup time
tSU
DO
300.0
—
—
ns
*
Figure 14.9
Data hold time
tDH
DO
300.0
—
—
ns
*
M delay time
tDM
M
–1000 —
1000.0 ns
Figure 14.9
Clock rise and fall
times
tCT
CL1, CL2
—
100.0
Figure 14.9
—
ns
Figure 14.9
Note: * Value when the frame frequency is set to between 30.5 Hz and 488 Hz.
413
14.10
H8/3833, H8/3834, H8/3835, H8/3836, and H8/3837 Absolute
Maximum Ratings (Wide Temperature Range (I-Spec) Version)
Table 14.46 lists the absolute maximum ratings.
Table 14.46 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Power supply voltage
VCC
–0.3 to +7.0
V
Analog power supply voltage
AVCC
–0.3 to +7.0
V
Programming voltage
VPP
–0.3 to + 13.0
V
Input voltage
Ports other than ports B and C
Vin
–0.3 to VCC + 3.0
V
Ports B and C
AVin
–0.3 to AVCC + 3.0
V
Operating temperature
Topr
–20 to +75
°C
Storage temperature
Tstg
–55 to +125
°C
Note: Permanent damage may occur to the chip if maximum ratings are exceeded. Normal
operation should be under the conditions specified in Electrical Characteristics. Exceeding
these values can result in incorrect operation and reduced reliability.
414
14.11
H8/3833 and H8/3834 Electrical Characteristics (Wide Temperature
Range (I-Spec) Version)
14.11.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range of the H8/3833 and H8/3834 (wide temperature
range (I-spec) version) are indicated by the shaded region in the figures below.
1. Power supply voltage vs. oscillator frequency range
32.768
fw (kHz)
f OSC (MHz)
10.0
5.0
2.0
2.7
4.0 4.5
• Active mode (high speed)
• Sleep mode
5.5
VCC (V)
2.7
4.0 4.5
5.5
VCC (V)
• All operating modes
415
2. Power supply voltage vs. clock frequency range
φ SUB (kHz)
φ (MHz)
5.0
2.5
16.384
8.192
4.096
0.5
2.7
4.0 4.5
5.5
VCC (V)
2.7
• Active mode (high speed)
• Sleep mode (except CPU)
4.0 4.5
5.5
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
625.0
φ (kHz)
500.0
312.5
62.5
2.7
4.0 4.5
5.5
VCC (V)
• Active mode (medium speed)
3. Analog power supply voltage vs. A/D converter operating range
5.0
625.0
φ (kHz)
φ (MHz)
500.0
2.5
0.5
62.5
2.7
4.0 4.5
• Active (high speed) mode
• Sleep mode
416
312.5
5.5
AVCC (V)
2.7
4.0 4.5
5.5
AVCC (V)
• Active (medium speed) mode
14.11.2
DC Characteristics
Table 14.47 lists the DC characteristics of the H8/3833 and H8/3834 (wide temperature range (Ispec) version).
Table 14.47 DC Characteristics of H8/3833 and H8/3834 (Wide Temperature Range
(I-Spec) Version)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to + 85°C,
including subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Input high
voltage
VIH
RES, MD0,
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF
CS, TMIG,
SCK1, SCK2,
SCK3, ADTRG
UD, SI 1, SI2, RXD
0.8 V CC
—
VCC + 0.3
V
0.7 V CC
—
VCC + 0.3
V
OSC1
VCC – 0.5 —
VCC + 0.3
V
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
0.7 V CC
—
VCC + 0.3
V
PB 0 to PB7
PC0 to PC3
0.7 V CC
—
AV CC + 0.3 V
RES, MD0,
–0.3
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF,
CS, TMIG,
SCK1, SCK2,
SCK3, ADTRG
UD, SI 1, SI2, RXD –0.3
—
0.2 V CC
V
—
0.3 V CC
V
OSC1
—
0.5
V
Input low
voltage
VIL
–0.3
Test Condition
Note
Note: Connect pin TEST to VSS .
417
Table 14.47 DC Characteristics of H8/3833 and H8/3834 (Wide Temperature Range
(I-Spec) Version) (cont)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to + 85°C,
including subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Input low
voltage
VIL
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
PB 0 to PB7
PC0 to PC3
–0.3
—
0.3 V CC
V
Output
high
voltage
VOH
P10 to P17
P20 to P27
P30 to P37
VCC – 1.0 —
—
V
P40 to P42
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
VCC – 0.5 —
—
P10 to P17
P40 to P42
—
—
0.6
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
—
—
0.5
IOL = 0.4 mA
P20 to P27
P30 to P37
—
—
1.5
IOL = 10 mA
—
—
0.6
IOL = 1.6 mA
Output
VOL
low voltage
Note: Connect pin TEST to VSS .
418
Test Condition
–I OH = 1.0 mA
–I OH = 0.5 mA
V
IOL = 1.6 mA
Note
Table 14.47 DC Characteristics of H8/3833 and H8/3834 (Wide Temperature Range
(I-Spec) Version) (cont)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to + 85°C,
including subactive mode, unless otherwise indicated.
Item
Symbol
Input/output |IIL|
leakage
current
Pull-up
MOS
current
–I P
Input
CIN
capacitance
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Note
RES, P43
—
—
24.0
µA
VIN = 0.5 V to
VCC – 0.5 V
2
—
—
2.0
OSC1, MD0
P10 to P17
P20 to P27
P30 to P37
P40 to P42
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
—
—
2.0
PB 0 to PB7
PC0 to PC3
—
—
2.0
P10
P30
P50
P60
20.0
—
330.0
µA
VCC = 5 V,
VIN = 0 V
All input pins
except power
supply, RES,
P43 pin
—
—
15.0
pF
f = 1 MHz,
VIN = 0 V
Ta = 25°C
RES
—
—
60.0
2
—
—
15.0
1
—
—
30.0
2
—
—
15.0
1
P43
to P17
to P37
to P57
to P67
1
µA
VIN = 0.5 V to
VCC – 0.5 V
VIN = 0.5 V to
AV CC – 0.5 V
Notes: 1. Applies to HD6433833 and HD6433834 (wide temperature range version).
2. Applies to HD6473834 (wide temperature range version).
419
Table 14.47 DC Characteristics of H8/3833 and H8/3834 (Wide Temperature Range
(I-Spec) Version) (cont)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to + 85°C,
including subactive mode, unless otherwise indicated.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
Active mode
current
dissipation
IOPE1
VCC
—
12.0
30.0
mA
Active mode (high speed),
VCC = 5 V, f osc = 10 MHz
1, 2
IOPE2
VCC
—
2.5
6.0
mA
Active mode (medium speed), 1, 2
VCC = 5 V, f osc = 10 MHz
Sleep mode
current
dissipation
ISLEEP
VCC
—
5.0
12.0
mA
VCC = 5 V, f osc = 10 MHz
1, 2
Subactive
mode current
dissipation
ISUB
VCC
—
100.0 —
µA
VCC = 5 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
1, 2
Reference
value
—
70.0
—
µA
VCC = 5 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/8)
Reference
value
1, 2
Subsleep
mode current
dissipation
ISUBSP
VCC
—
60.0
—
µA
VCC = 5 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
1, 2
Reference
value
Watch mode
current
dissipation
IWATCH
VCC
—
6.0
—
µA
VCC = 5 V, LCD not used,
32-kHz crystal oscillator
1, 2
Reference
value
Standby
mode current
dissipation
ISTBY
VCC
—
—
10.0
µA
32-kHz crystal oscillator not
used
1, 2
RAM data
VRAM
retaining voltage
VCC
2.0
—
—
V
1, 2
Notes: 1. Pin states during current measurement
Mode
Internal State
LCD
Other Power
Pins Supply Oscillator Pins
Active mode (high
and medium speed)
Operates
VCC
Open
Sleep mode
Only timer operates
VCC
Open
Subactive mode
Operates
VCC
Open
System clock oscillator: Crystal
Subsleep mode
Only timer operates,
CPU stops
VCC
Open
Subclock oscillator: Crystal
Watch mode
Only time-base clock
operates, CPU stops
VCC
Open
Standby mode
CPU and timers all stop
VCC
Open
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
420
Table 14.47 DC Characteristics of H8/3833 and H8/3834 (Wide Temperature Range
(I-Spec) Version) (cont)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to + 85°C,
including subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Allowable output low
current (per pin)
IOL
Output pins except in
ports 2 and 3
—
—
2.0
mA
Ports 2 and 3
—
—
10.0
Output pins except in
ports 2 and 3
—
—
40.0
Ports 2 and 3
—
—
80.0
Allowable output low
current (total)
ΣIOL
Test Condition
mA
Allowable output high
current (per pin)
–I OH
All output pins
—
—
2.0
mA
Allowable output high
current (total)
Σ–I OH
All output pins
—
—
15.0
mA
421
14.11.3
AC Characteristics
Table 14.48 lists the control signal timing, and tables 14.49 and 14.50 list the serial interface
timing of the H8/3833 and H8/3834 (wide temperature range (I-spec) version).
Table 14.48 Control Signal Timing of H8/3833 and H8/3834 (Wide Temperature Range
(I-Spec) Version)
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to + 85°C,
including subactive mode, unless otherwise specified.
Item
Symbol
Applicable
Pins
System clock
oscillation frequency
fOSC
OSC1, OSC2 2.0
OSC clock ( φOSC)
cycle time
tOSC
OSC1, OSC2 100.0 —
System clock (φ)
tcyc
cycle time
Min
Typ
Max
Unit
—
10.0
MHz
Reference
Figure
1000.0 ns
1
Figure 14.1
1
2
—
16
tOSC
—
—
2000.0 ns
Subclock oscillation
frequency
fW
X1, X2
—
32.768 —
kHz
Watch clock (φW)
cycle time
tW
X1, X2
—
30.5
—
µs
Subclock (φSUB) cycle
time
tsubcyc
2
—
8
tW
2
—
—
tcyc
Instruction cycle time
Test Condition
2
tsubcyc
Oscillation stabilization trc
time (crystal oscillator)
OSC1, OSC2 —
—
40.0
ms
Oscillation stabilization trc
time
X1, X2
—
—
2.0
s
External clock high
width
tCPH
OSC1
40.0 —
—
ns
Figure 14.1
External clock low
width
tCPL
OSC1
40.0 —
—
ns
Figure 14.1
External clock rise time tCPr
—
—
15.0
ns
Figure 14.1
External clock fall time tCPf
—
—
15.0
ns
Figure 14.1
10
—
—
tcyc
Figure 14.2
Pin RES low width
tREL
RES
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system control register 2 (SYSCR2).
422
Table 14.48 Control Signal Timing of H8/3833 and H8/3834 (Wide Temperature Range
(I-Spec) Version) (cont)
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise specified.
Applicable
Pins
Item
Symbol
Min Typ
Input pin high width
tIH
IRQ0 to IRQ4
2
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
Input pin low width
tIL
Pin UD minimum
modulation width
tUDH
tUDL
Unit
—
—
tcyc
tsubcyc
Figure 14.3
IRQ0 to IRQ4
2
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
—
—
tcyc
tsubcyc
Figure 14.3
UD
—
—
tcyc
tsubcyc
Figure 14.4
4
Test Condition
Reference
Figure
Max
423
Table 14.49 Serial Interface (SCI1, SCI2) Timing of H8/3833 and H8/3834 (Wide
Temperature Range (I-Spec) Version)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, unless
otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Input serial clock
cycle time
tscyc
SCK1, SCK2
2
—
—
tcyc
Figure 14.5
Input serial clock
high width
tSCKH
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock low
width
tSCKL
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock rise
time
tSCKr
SCK1, SCK2
—
—
60.0
ns
Figure 14.5
Input serial clock fall
time
tSCKf
SCK1, SCK2
—
—
60.0
ns
Figure 14.5
Serial output data
delay time
tSOD
SO 1, SO2
—
—
200.0 ns
Figure 14.5
Serial input data
setup time
tSIS
SI 1, SI2
200.0 —
—
ns
Figure 14.5
Serial input data hold tSIH
time
SI 1, SI2
200.0 —
—
ns
Figure 14.5
CS setup time
tCSS
CS
2
—
—
tcyc
Figure 14.6
CS hold time
tCSH
CS
2
—
—
tcyc
Figure 14.6
424
Test Condition
Reference
Figure
Table 14.50 Serial Interface (SCI3) Timing of H8/3833 and H8/3834 (Wide Temperature
Range (I-Spec) Version)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, unless
otherwise specified.
Item
Input clock cycle
Asynchronous
Typ
Max
Unit
tscyc
4
—
—
tcyc
Figure 14.7
6
—
—
Synchronous
Test Condition
Reference
Figure
Symbol Min
Input clock pulse width
tSCKW
0.4
—
0.6
tscyc
Figure 14.7
Transmit data delay time
(synchronous mode)
tTXD
—
—
1
tcyc
Figure 14.8
Receive data setup time
(synchronous mode)
tRXS
200.0 —
—
ns
Figure 14.8
Receive data hold time
(synchronous mode)
tRXH
200.0 —
—
ns
Figure 14.8
425
14.11.4
A/D Converter Characteristics
Table 14.51 shows the A/D converter characteristics of the H8/3833S and H8/3834S (wide
temperature range (I-spec) version).
Table 14.51 A/D Converter Characteristics of H8/3833 and H8/3834 (Wide Temperature
Range (I-Spec) Version)
VCC = 4.5 V to 5.5 V, AVSS = VSS = 0.0 V, Ta = –40°C to +85°C, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Analog power
supply voltage
AV CC
AV CC
4.5
—
5.5
V
Analog input
voltage
AV IN
AN0 to AN11
–0.3
—
AV CC + 0.3 V
Analog power
supply current
AI OPE
AV CC
—
—
1.7
AI STOP1
AV CC
—
150.0 —
µA
2
Reference
value
AI STOP2
AV CC
—
—
7.0
µA
3
Analog input
capacitance
CAIN
AN0 to AN11
—
—
30.0
pF
Allowable
signal source
impedance
RAIN
—
—
10.0
kΩ
Resolution
(data length)
—
—
8
bit
Non-linearity
error
—
—
±2.0
LSB
Quantization
error
—
—
±0.5
LSB
Absolute
accuracy
—
—
±2.5
LSB
Conversion
time
12.4
—
124
µs
mA
Test Condition
Note
1
AV CC = 5.0 V
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AI STOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AI STOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
426
14.11.5
LCD Characteristics
Table 14.52 lists the LCD characteristics, and table 14.53 lists the AC characteristics for external
segment expansion of the H8/3833 and H8/3834 (wide temperature range (I-spec) version).
Table 14.52 LCD Characteristics of H8/3833 and H8/3834 (Wide Temperature Range
(I-Spec) Version)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise specified.
Applicable
Pins
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Note
Segment driver
voltage drop
VDS
SEG1 to
SEG40
—
—
0.6
V
ID = 2 µA
1
Common driver
voltage drop
VDC
COM 1 to
COM 4
—
—
0.3
V
ID = 2 µA
1
LCD power supply
voltage divider
resistance
RLCD
40.0
300.0 1000.0 kΩ
LCD power supply
voltage
VLCD
4.5
—
V1
VCC
V
Between V 1 and
VSS
2
Notes: 1. These are the voltage drops between the voltage supply pins V1, V2, V3, and V SS , and
the segment pins or common pins.
2. When VLCD is supplied from an external source, the following relation must hold:
VCC ≥ V1 ≥ V2 ≥ V3 ≥ VSS
427
Table 14.53 AC Characteristics for External Segment Expansion of H8/3833 and H8/3834
(Wide Temperature Range (I-Spec) Version)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Reference
Figure
Clock high width
tCWH
CL1, CL2
800.0
—
—
ns
*
Figure 14.9
Clock low width
tCWL
CL2
800.0
—
—
ns
*
Figure 14.9
Clock setup time
tCSU
CL1, CL2
500.0
—
—
ns
*
Figure 14.9
Data setup time
tSU
DO
300.0
—
—
ns
*
Figure 14.9
Data hold time
tDH
DO
300.0
—
—
ns
*
Figure 14.9
M delay time
tDM
M
–1000 —
1000.0 ns
Figure 14.9
Clock rise and fall
times
tCT
CL1, CL2
—
100.0
Figure 14.9
—
ns
Note: * Value when the frame frequency is set to between 30.5 Hz and 488 Hz.
428
14.12
H8/3835, H8/3836, and H8/3837 Electrical Characteristics (Wide
Temperature Range (I-Spec) Version)
14.12.1
Power Supply Voltage and Operating Range
The power supply voltage and operating range of the H8/3835, H8/3836, and H8/3837 (wide
temperature range (I-spec) version) are indicated by the shaded region in the figures below.
1. Power supply voltage vs. oscillator frequency range
32.768
fw (kHz)
f OSC (MHz)
10.0
5.0
2.0
2.7
4.0 4.5
• Active mode (high speeds)
• Sleep mode
5.5
VCC (V)
2.7
4.0 4.5
5.5
VCC (V)
• All operating modes
429
2. Power supply voltage vs. clock frequency range
φSUB (kHz)
φ (MHz)
5.0
2.5
16.384
8.192
4.096
0.5
2.7
4.0 4.5
5.5
VCC (V)
2.7
• Active mode (high speed)
• Sleep mode (except CPU)
4.0 4.5
5.5
VCC (V)
• Subactive mode
• Subsleep mode (except CPU)
• Watch mode (except CPU)
625.0
φ (kHz)
500.0
312.5
62.5
2.7
4.0 4.5
5.5
VCC (V)
• Active mode (medium speed)
3. Analog power supply voltage vs. A/D converter operating range
5.0
625.0
φ (kHz)
φ (MHz)
500.0
2.5
0.5
62.5
2.7
4.0 4.5
• Active (high speed) mode
• Sleep mode
430
312.5
5.5
AVCC (V)
2.7
4.0 4.5
5.5
AVCC (V)
• Active (medium speed) mode
14.12.2
DC Characteristics
Table 14.54 lists the DC characteristics of the H8/3835, H8/3836, and H8/3837 (wide temperature
range (I-spec) version).
Table 14.54 DC Characteristics of H8/3835, H8/3836, and H8/3837 (Wide Temperature
Range (I-Spec) Version)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Input high
voltage
VIH
RES, MD0,
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF
CS, TMIG,
SCK1, SCK2,
SCK3, ADTRG
UD, SI 1, SI2, RXD
0.8 V CC
—
VCC + 0.3
V
0.7 V CC
—
VCC + 0.3
V
OSC1
VCC – 0.5 —
VCC + 0.3
V
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
0.7 V CC
—
VCC + 0.3
V
PB 0 to PB7
PC0 to PC3
0.7 V CC
—
AV CC + 0.3 V
RES, MD0,
–0.3
WKP0 to WKP7,
IRQ0 to IRQ4,
TMIB, TMIC, TMIF,
CS, TMIG,
SCK1, SCK2,
SCK3, ADTRG
UD, SI 1, SI2, RXD –0.3
—
0.2 V CC
V
—
0.3 V CC
V
OSC1
—
0.5
V
Input low
voltage
VIL
–0.3
Test Condition
Note
Note: Connect pin TEST to VSS .
431
Table 14.54 DC Characteristics of H8/3835, H8/3836, and H8/3837 (Wide Temperature
Range (I-Spec) Version) (cont)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Input low
voltage
VIL
P10 to P17
P20 to P27
P30 to P37
P40 to P43
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
PB 0 to PB7
PC0 to PC3
–0.3
—
0.3 V CC
V
Output
high
voltage
VOH
P10 to P17
P20 to P27
P30 to P37
VCC – 1.0 —
—
V
P40 to P42
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
VCC – 0.5 —
—
P10 to P17
P40 to P42
—
—
0.6
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
—
—
0.5
IOL = 0.4 mA
P20 to P27
P30 to P37
—
—
1.5
IOL = 10 mA
—
—
0.6
IOL = 1.6 mA
Output
VOL
low voltage
Note: Connect pin TEST to VSS .
432
Test Condition
–I OH = 1.0 mA
–I OH = 0.5 mA
V
IOL = 1.6 mA
Note
Table 14.54 DC Characteristics of H8/3835, H8/3836, and H8/3837 (Wide Temperature
Range (I-Spec) Version) (cont)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Input/output |IIL|
leakage
current
Pull-up
MOS
current
–I P
Input
CIN
capacitance
Applicable Pins
Min
Typ
Max
Unit
Test Condition
Note
RES, P43
—
—
24.0
µA
VIN = 0.5 V to
VCC – 0.5 V
2
—
—
2.0
OSC1, MD0
P10 to P17
P20 to P27
P30 to P37
P40 to P42
P50 to P57
P60 to P67
P70 to P77
P80 to P87
P90 to P97
PA 0 to PA3
—
—
2.0
PB 0 to PB7
PC0 to PC3
—
—
2.0
P10
P30
P50
P60
20.0
—
330.0
µA
VCC = 5 V,
VIN = 0 V
All input pins
except power
supply, RES,
P43 pin
—
—
15.0
pF
f = 1 MHz,
VIN = 0 V
Ta = 25°C
RES
—
—
60.0
2
—
—
15.0
1
—
—
30.0
2
—
—
15.0
1
P43
to P17
to P37
to P57
to P67
1
µA
VIN = 0.5 V to
VCC – 0.5 V
VIN = 0.5 V to
AV CC – 0.5 V
Notes: 1. Applies to HD6433835, HD6433836, and HD6433837 (wide temperature range
version).
2. Applies to HD6473837 (wide temperature range version).
433
Table 14.54 DC Characteristics of H8/3835, H8/3836, and H8/3837 (Wide Temperature
Range (I-Spec) Version) (cont)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
Active mode
current
dissipation
IOPE1
VCC
—
13.5
30.0
mA
Active mode (high speed),
VCC = 5 V, f osc = 10 MHz
1, 2
IOPE2
VCC
—
2.5
6.0
mA
Active mode (medium speed), 1, 2
VCC = 5 V, f osc = 10 MHz
Sleep mode
current
dissipation
ISLEEP
VCC
—
5.0
12.0
mA
VCC = 5 V, f osc = 10 MHz
1, 2
Subactive
mode current
dissipation
ISUB
VCC
—
100.0 —
µA
VCC = 5 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
1, 2
Reference
value
—
70.0
—
µA
VCC = 5 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/8)
Reference
value
1, 2
Subsleep
mode current
dissipation
ISUBSP
VCC
—
60.0
—
µA
VCC = 5 V, LCD on,
32-kHz crystal oscillator
( φSUB = φw/2)
1, 2
Reference
value
Watch mode
current
dissipation
IWATCH
VCC
—
6.0
—
µA
VCC = 5 V, LCD not used,
32-kHz crystal oscillator
1, 2
Reference
value
Standby
mode current
dissipation
ISTBY
VCC
—
—
10.0
µA
32-kHz crystal oscillator not
used
1, 2
RAM data
VRAM
retaining voltage
VCC
2.0
—
—
V
1, 2
Notes: 1. Pin states during current measurement
Mode
Internal State
LCD
Other Power
Pins Supply
Active mode (high
and medium speed)
Operates
VCC
Open
Sleep mode
Only timer operates
VCC
Open
Subactive mode
Operates
VCC
Open
System clock oscillator: Crystal
Subsleep mode
Only timer operates, CPU VCC
stops
Open
Subclock oscillator: Crystal
Watch mode
Only time-base clock
operates, CPU stops
VCC
Open
Standby mode
CPU and timers all stop
VCC
Open
Oscillator Pins
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
System clock oscillator: Crystal
Subclock oscillator: Pin X1 = VCC
2. Excludes current in pull-up MOS transistors and output buffers.
434
Table 14.54 DC Characteristics of H8/3835, H8/3836, and H8/3837 (Wide Temperature
Range (I-Spec) Version) (cont)
VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise indicated.
Item
Symbol
Applicable Pins
Min
Typ
Max
Unit
Allowable output low
current (per pin)
IOL
Output pins except in
ports 2 and 3
—
—
2.0
mA
Ports 2 and 3
—
—
10.0
Output pins except in
ports 2 and 3
—
—
40.0
Ports 2 and 3
—
—
80.0
Allowable output low
current (total)
ΣIOL
Test Condition
mA
Allowable output high
current (per pin)
–I OH
All output pins
—
—
2.0
mA
Allowable output high
current (total)
Σ–I OH
All output pins
—
—
15.0
mA
435
14.12.3
AC Characteristics
Table 14.55 lists the control signal timing, and tables 14.56 and 14.57 list the serial interface
timing of the H8/3835, H8/3836, and H8/3837 (wide temperature range (I-spec) version).
Table 14.55 Control Signal Timing of H8/3835, H8/3836, and H8/3837 (Wide Temperature
Range (I-Spec) Version)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Applicable
Pins
System clock
oscillation frequency
fOSC
OSC1, OSC2 2.0
OSC clock ( φOSC)
cycle time
tOSC
OSC1, OSC2 100.0 —
System clock (φ)
tcyc
cycle time
Min
Typ
Max
Unit
—
10.0
MHz
Reference
Figure
1000.0 ns
1
Figure 14.1
1
2
—
16
tOSC
—
—
2000.0 ns
Subclock oscillation
frequency
fW
X1, X2
—
32.768 —
kHz
Watch clock (φW)
cycle time
tW
X1, X2
—
30.5
—
µs
Subclock (φSUB) cycle
time
tsubcyc
2
—
8
tW
2
—
—
tcyc
tsubcyc
Instruction cycle time
Test Condition
2
Oscillation
stabilization time
(crystal oscillator)
trc
OSC1, OSC2 —
—
40.0
ms
Oscillation
stabilization time
trc
X1, X2
—
—
2.0
s
External clock high
width
tCPH
OSC1
40.0
—
—
ns
Figure 14.1
External clock low
width
tCPL
OSC1
40.0
—
—
ns
Figure 14.1
External clock rise
time
tCPr
—
—
15.0
ns
Figure 14.1
External clock fall
time
tCPf
—
—
15.0
ns
Figure 14.1
Pin RES low width
tREL
10
—
—
tcyc
Figure 14.2
RES
Notes: 1. A frequency between 1 MHz to 10 MHz is required when an external clock is input.
2. Selected with SA1 and SA0 of system control register 2 (SYSCR2).
436
Table 14.55 Control Signal Timing of H8/3835, H8/3836, and H8/3837 (Wide Temperature
Range (I-Spec) Version) (cont)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise specified.
Applicable
Pins
Item
Symbol
Min Typ
Input pin high width
tIH
IRQ0 to IRQ4
2
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
Input pin low width
tIL
Pin UD minimum
modulation width
tUDH
tUDL
Unit
—
—
tcyc
tsubcyc
Figure 14.3
IRQ0 to IRQ4
2
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
—
—
tcyc
tsubcyc
Figure 14.3
UD
—
—
tcyc
tsubcyc
Figure 14.4
4
Test Condition
Reference
Figure
Max
437
Table 14.56 Serial Interface (SCI1, SCI2) Timing of H8/3835, H8/3836, and H8/3837 (Wide
Temperature Range (I-Spec) Version)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, unless
otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Input serial clock
cycle time
tscyc
SCK1, SCK2
2
—
—
tcyc
Figure 14.5
Input serial clock
high width
tSCKH
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock low
width
tSCKL
SCK1, SCK2
0.4
—
—
tscyc
Figure 14.5
Input serial clock rise
time
tSCKr
SCK1, SCK2
—
—
60.0
ns
Figure 14.5
Input serial clock fall
time
tSCKf
SCK1, SCK2
—
—
60.0
ns
Figure 14.5
Serial output data
delay time
tSOD
SO 1, SO2
—
—
200.0 ns
Figure 14.5
Serial input data
setup time
tSIS
SI 1, SI2
200.0 —
—
ns
Figure 14.5
Serial input data hold tSIH
time
SI 1, SI2
200.0 —
—
ns
Figure 14.5
CS setup time
tCSS
CS
2
—
—
tcyc
Figure 14.6
CS hold time
tCSH
CS
2
—
—
tcyc
Figure 14.6
438
Test Condition
Reference
Figure
Table 14.57 Serial Interface (SCI3) Timing of H8/3835, H8/3836, and H8/3837 (Wide
Temperature Range (I-Spec) Version)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, unless
otherwise specified.
Item
Input clock cycle
Asynchronous
Typ
Max
Unit
tscyc
4
—
—
tcyc
Figure 14.7
6
—
—
Synchronous
Test Condition
Reference
Figure
Symbol Min
Input clock pulse width
tSCKW
0.4
—
0.6
tscyc
Figure 14.7
Transmit data delay time
(synchronous mode)
tTXD
—
—
1
tcyc
Figure 14.8
Receive data setup time
(synchronous mode)
tRXS
200.0 —
—
ns
Figure 14.8
Receive data hold time
(synchronous mode)
tRXH
200.0 —
—
ns
Figure 14.8
439
14.12.4
A/D Converter Characteristics
Table 14.58 shows the A/D converter characteristics of the H8/3835, H8/3836, and H8/3837 (wide
temperature range (I-spec) version).
Table 14.58 A/D Converter Characteristics of H8/3835, H8/3836, and H8/3837 (Wide
Temperature Range (I-Spec) Version)
VCC = 4.5 V to 5.5 V, AVSS = VSS = 0.0 V, Ta = –40°C to +85°C, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Analog power
supply voltage
AV CC
AV CC
4.5
—
5.5
V
Analog input
voltage
AV IN
AN0 to AN11
AV SS
–0.3
—
AV CC + 0.3 V
Analog power
supply current
AI OPE
AV CC
—
—
1.7
AI STOP1
AV CC
—
150.0 —
µA
2
Reference
value
AI STOP2
AV CC
—
—
7.0
µA
3
Analog input
capacitance
CAIN
AN0 to AN11
—
—
30.0
pF
Allowable
signal source
impedance
RAIN
—
—
10.0
kΩ
Resolution
(data length)
—
—
8
bit
Non-linearity
error
—
—
±2.0
LSB
Quantization
error
—
—
±0.5
LSB
Absolute
accuracy
—
—
±2.5
LSB
Conversion
time
12.4
—
124
µs
mA
Test Condition
Note
1
AV CC = 5.0 V
Notes: 1. Set AVCC = VCC when the A/D converter is not used.
2. AI STOP1 is the current in active and sleep modes while the A/D converter is idle.
3. AI STOP2 is the current at reset and in standby, watch, subactive, and subsleep modes
while the A/D converter is idle.
440
14.12.5
LCD Characteristics
Table 14.59 lists the LCD characteristics, and table 14.60 lists the AC characteristics for external
segment expansion of the H8/3835, H8/3836, and H8/3837 (wide temperature range (I-spec)
version).
Table 14.59 LCD Characteristics of H8/3835, H8/3836, and H8/3837 (Wide Temperature
Range (I-Spec) Version)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Segment driver
voltage drop
VDS
Common driver
voltage drop
VDC
LCD power supply
voltage divider
resistance
RLCD
LCD power supply
voltage
VLCD
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Note
SEG1 to
SEG40
—
—
0.6
V
ID = 2 µA
1
COM 1 to
COM 4
—
—
0.3
V
ID = 2 µA
1
40.0
300.0 100.0 kΩ
4.5
—
V1
VCC
V
Between V 1 and
VSS
2
Notes: 1. These are the voltage drops between the voltage supply pins V1, V2, V3, and V SS , and
the segment pins or common pins.
2. When VLCD is supplied from an external source, the following relation must hold:
VCC ≥ V1 ≥ V2 ≥ V3 ≥ VSS
441
Table 14.60 AC Characteristics for External Segment Expansion of H8/3835, H8/3836, and
H8/3837 (Wide Temperature Range (I-Spec) Version)
VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VSS = AVSS = 0.0 V, Ta = –40°C to +85°C, including
subactive mode, unless otherwise specified.
Item
Symbol
Applicable
Pins
Min
Typ
Max
Unit
Test Condition
Reference
Figure
Clock high width
tCWH
CL1, CL2
800.0
—
—
ns
*
Figure 14.9
Clock low width
tCWL
CL2
800.0
—
—
ns
*
Figure 14.9
Clock setup time
tCSU
CL1, CL2
500.0
—
—
ns
*
Figure 14.9
Data setup time
tSU
DO
300.0
—
—
ns
*
Figure 14.9
Data hold time
tDH
DO
300.0
—
—
ns
*
Figure 14.9
M delay time
tDM
M
–1000 —
1000.0 ns
Figure 14.9
Clock rise and fall
times
tCT
CL1, CL2
—
100.0
Figure 14.9
—
ns
Note: * Value when the frame frequency is set to between 30.5 Hz and 488 Hz.
442
14.13
Operation Timing
Figures 14.1 to 14.9 show timing diagrams.
t OSC
VIH
OSC 1
VIL
t CPH
t CPL
t CPr
t CPf
Figure 14.1 System Clock Input Timing
RES
VIL
tREL
Figure 14.2 RES Low Width Timing
IRQ0 to IRQ 4
WKP0 to WKP7
ADTRG
TMIB, TMIC
TMIF, TMIG
VIH
VIL
t IL
t IH
Figure 14.3 Input Timing
443
VIH
UD
VIL
t UDL
t UDH
Figure 14.4 UD Pin Minimum Transition Width Timing
444
t scyc
SCK 1
SCK 2
V IH or V OH*
V IL or V OL *
t SCKL
t SCKH
t SCKf
t SCKr
t SOD
SO 1
SO 2
VOH*
VOL *
t SIS
t SIH
SI 1
SI 2
Notes: * Output timing reference levels
Output high: VOH = 1.8 V (VCC= 2.5 V to 5.5 V)/2.0 V (VCC= 2.7 V to 5.5 V)
Output low: VOL = 0.8 V
Load conditions are shown in figure 14-10.
Figure 14.5 Serial Interface 1 and 2 Input/Output Timing
445
V IH
CS
V IL
t CSS
t CSH
V IH
SCK 2
V IL
Figure 14.6 Serial Interface 2 Chip Select Timing
t SCKW
SCK 3
t scyc
Figure 14.7 SCK3 Input Clock Timing
446
t scyc
SCK 3
V IH or V OH*
V IL or V OL *
t TXD
TXD
(transmit data)
VOH*
VOL *
t RXS
t RXH
TXD
(receive data)
Notes: * Output timing reference levels
Output high: VOH= 1.8 V (VCC= 2.5 V to 5.5 V)/2.0 V (VCC= 2.7 V to 5.5 V)
Output low: VOL = 0.8 V
Load conditions are shown in figure 14-10.
Figure 14.8 Input/Output Timing of Serial Interface 3 in Synchronous Mode
t CT
CL 1
t CWH
VCC – 0.5 V
0.4 V
t CWH
t CSU
VCC – 0.5 V
CL 2
0.4 V
t CSU
t CWL
t CT
VCC – 0.5 V
0.4 V
DO
t SU
M
t DH
0.4 V
t DM
Figure 14.9 Segment Expansion Signal Timing
447
14.14
Output Load Circuit
VCC
2.4 kΩ
Output pin
30 pF
12 k Ω
Figure 14.10 Output Load Condition
448
Appendix A CPU Instruction Set
A.1
Instructions
Operation Notation
Rd8/16
General register (destination) (8 or 16 bits)
Rs8/16
General register (source) (8 or 16 bits)
Rn8/16
General register (8 or 16 bits)
CCR
Condition code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
PC
Program counter
SP
Stack pointer
#xx: 3/8/16
Immediate data (3, 8, or 16 bits)
d: 8/16
Displacement (8 or 16 bits)
@aa: 8/16
Absolute address (8 or 16 bits)
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
Logical AND
∨
Logical OR
⊕
Exclusive logical OR
→
Move
—
Logical complement
Condition Code Notation
Symbol
Modified according to the instruction result
*
Not fixed (value not guaranteed)
0
Always cleared to 0
—
Not affected by the instruction execution result
449
Table A.1 lists the H8/300L CPU instruction set.
Instruction Set
MOV.B #xx:8, Rd
B #xx:8 → Rd8
MOV.B Rs, Rd
B Rs8 → Rd8
MOV.B @Rs, Rd
B @Rs16 → Rd8
MOV.B @(d:16, Rs), Rd
B @(d:16, Rs16)→ Rd8
MOV.B @Rs+, Rd
B @Rs16 → Rd8
Rs16+1 → Rs16
MOV.B @aa:8, Rd
B @aa:8 → Rd8
MOV.B @aa:16, Rd
B @aa:16 → Rd8
MOV.B Rs, @Rd
B Rs8 → @Rd16
MOV.B Rs, @(d:16, Rd)
B Rs8 → @(d:16, Rd16)
MOV.B Rs, @–Rd
B Rd16–1 → Rd16
Rs8 → @Rd16
MOV.B Rs, @aa:8
B Rs8 → @aa:8
MOV.B Rs, @aa:16
B Rs8 → @aa:16
MOV.W #xx:16, Rd
W #xx:16 → Rd
MOV.W Rs, Rd
W Rs16 → Rd16
MOV.W @Rs, Rd
W @Rs16 → Rd16
W @Rs16 → Rd16
Rs16+2 → Rs16
MOV.W @aa:16, Rd
W @aa:16 → Rd16
MOV.W Rs, @Rd
W Rs16 → @Rd16
MOV.W Rs, @(d:16, Rd) W Rs16 → @(d:16, Rd16)
MOV.W Rs, @–Rd
W Rd16–2 → Rd16
Rs16 → @Rd16
MOV.W Rs, @aa:16
W Rs16 → @aa:16
POP Rd
W @SP → Rd16
SP+2 → SP
450
@@aa
Implied
I H N Z V C
0 — 2
— —
0 — 2
— —
0 — 4
— —
0 — 6
— —
0 — 6
2
— —
0 — 4
4
— —
0 — 6
2
4
2
2
— —
0 — 4
— —
0 — 6
— —
0 — 6
2
— —
0 — 4
4
— —
0 — 6
— —
0 — 4
— —
0 — 2
4
2
4
2
2
4
2
4
2
4
2
4
2
Condition Code
— —
2
MOV.W @(d:16, Rs), Rd W @(d:16, Rs16) → Rd16
MOV.W @Rs+, Rd
@aa: 8/16
2
@(d:8, PC)
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
Operation
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
No. of States
Table A.1
— —
0 — 4
— —
0 — 6
— —
0 — 6
— —
0 — 6
— —
0 — 4
— —
0 — 6
— —
0 — 6
— —
0 — 6
— —
0 — 6
Instruction Set (cont)
PUSH Rs
W SP–2 → SP
Rs16 → @SP
EEPMOV
— if R4L≠0 then
Repeat @R5 → @R6
R5+1 → R5
R6+1 → R6
R4L–1 → R4L
Until R4L=0
else next;
ADD.B #xx:8, Rd
B Rd8+#xx:8 → Rd8
ADD.B Rs, Rd
B Rd8+Rs8 → Rd8
ADD.W Rs, Rd
W Rd16+Rs16 → Rd16
ADDX.B #xx:8, Rd
B Rd8+#xx:8 +C → Rd8
ADDX.B Rs, Rd
B Rd8+Rs8 +C → Rd8
ADDS.W #1, Rd
2
@@aa
Implied
@aa: 8/16
@(d:8, PC)
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
Operation
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
Condition Code
I H N Z V C
— —
No. of States
Table A.1
0 — 6
4 — — — — — — (4)
2
—
2
2
—
2
2
— (1)
2
2
—
(2)
2
2
—
(2)
2
W Rd16+1 → Rd16
2
— — — — — — 2
ADDS.W #2, Rd
W Rd16+2 → Rd16
2
— — — — — — 2
INC.B Rd
B Rd8+1 → Rd8
2
— —
— 2
DAA.B Rd
B Rd8 decimal adjust → Rd8
2
— *
* (3) 2
SUB.B Rs, Rd
B Rd8–Rs8 → Rd8
2
—
SUB.W Rs, Rd
W Rd16–Rs16 → Rd16
2
— (1)
SUBX.B #xx:8, Rd
B Rd8–#xx:8 –C → Rd8
SUBX.B Rs, Rd
B Rd8–Rs8 –C → Rd8
SUBS.W #1, Rd
2
2
2
—
(2)
2
2
—
(2)
2
W Rd16–1 → Rd16
2
— — — — — — 2
SUBS.W #2, Rd
W Rd16–2 → Rd16
2
— — — — — — 2
DEC.B Rd
B Rd8–1 → Rd8
2
— —
— 2
DAS.B Rd
B Rd8 decimal adjust → Rd8
2
— *
* — 2
NEG.B Rd
B 0–Rd → Rd
2
—
2
CMP.B #xx:8, Rd
B Rd8–#xx:8
—
2
CMP.B Rs, Rd
B Rd8–Rs8
2
—
2
CMP.W Rs, Rd
W Rd16–Rs16
2
— (1)
2
MULXU.B Rs, Rd
B Rd8 × Rs8 → Rd16
2
— — — — — — 14
2
451
Instruction Set (cont)
DIVXU.B Rs, Rd
B Rd16÷Rs8 → Rd16 (RdH:
remainder, RdL: quotient)
AND.B #xx:8, Rd
B Rd8∧#xx:8 → Rd8
AND.B Rs, Rd
B Rd8∧Rs8 → Rd8
OR.B #xx:8, Rd
B Rd8∨#xx:8 → Rd8
OR.B Rs, Rd
B Rd8∨Rs8 → Rd8
XOR.B #xx:8, Rd
B Rd8⊕#xx:8 → Rd8
XOR.B Rs, Rd
2
@@aa
Implied
@aa: 8/16
Condition Code
I H N Z V C
— — (5) (6) — — 14
— —
0 — 2
— —
0 — 2
— —
0 — 2
2
— —
0 — 2
— —
0 — 2
B Rd8⊕Rs8 → Rd8
2
— —
0 — 2
NOT.B Rd
B Rd → Rd
2
— —
0 — 2
SHAL.B Rd
B
2
— —
2
2
— —
0
2
2
— —
0
2
2
— — 0
0
2
2
— —
0
2
2
— —
0
2
2
— —
0
2
2
— —
0
2
b0
C
B
b0
C
0
B
B
b0
0
C
b7
ROTXL.B Rd
2
B
b7
SHLR.B Rd
2
0
b7
SHLL.B Rd
2
C
b7
SHAR.B Rd
2
@(d:8, PC)
Operation
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
No. of States
Table A.1
b0
C
b7
ROTXR.B Rd
B
b7
ROTL.B Rd
B
b0
b0
B
C
b7
452
C
C
b7
ROTR.B Rd
b0
b0
Instruction Set (cont)
BSET #xx:3, Rd
B (#xx:3 of Rd8) ← 1
BSET #xx:3, @Rd
B (#xx:3 of @Rd16) ← 1
BSET #xx:3, @aa:8
B (#xx:3 of @aa:8) ← 1
BSET Rn, Rd
B (Rn8 of Rd8) ← 1
BSET Rn, @Rd
B (Rn8 of @Rd16) ← 1
BSET Rn, @aa:8
B (Rn8 of @aa:8) ← 1
BCLR #xx:3, Rd
B (#xx:3 of Rd8) ← 0
BCLR #xx:3, @Rd
B (#xx:3 of @Rd16) ← 0
BCLR #xx:3, @aa:8
B (#xx:3 of @aa:8) ← 0
BCLR Rn, Rd
B (Rn8 of Rd8) ← 0
BCLR Rn, @Rd
B (Rn8 of @Rd16) ← 0
BCLR Rn, @aa:8
B (Rn8 of @aa:8) ← 0
BNOT #xx:3, Rd
B (#xx:3 of Rd8) ←
(#xx:3 of Rd8)
BNOT #xx:3, @Rd
B (#xx:3 of @Rd16) ←
(#xx:3 of @Rd16)
BNOT #xx:3, @aa:8
B (#xx:3 of @aa:8) ←
(#xx:3 of @aa:8)
BNOT Rn, Rd
B (Rn8 of Rd8) ←
(Rn8 of Rd8)
BNOT Rn, @Rd
B (Rn8 of @Rd16) ←
(Rn8 of @Rd16)
BNOT Rn, @aa:8
B (Rn8 of @aa:8) ←
(Rn8 of @aa:8)
BTST #xx:3, Rd
B (#xx:3 of Rd8) → Z
BTST #xx:3, @Rd
B (#xx:3 of @Rd16) → Z
BTST #xx:3, @aa:8
B (#xx:3 of @aa:8) → Z
BTST Rn, Rd
B (Rn8 of Rd8) → Z
BTST Rn, @Rd
B (Rn8 of @Rd16) → Z
BTST Rn, @aa:8
B (Rn8 of @aa:8) → Z
@@aa
Implied
@aa: 8/16
2
@(d:8, PC)
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
Operation
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
Condition Code
I H N Z V C
No. of States
Table A.1
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
4
4
2
4
4
— — — — — — 8
— — —
— — 2
— — —
— — 6
— — —
— — 6
— — —
— — 2
— — —
— — 6
— — —
— — 6
453
Instruction Set (cont)
BLD #xx:3, Rd
B (#xx:3 of Rd8) → C
BLD #xx:3, @Rd
B (#xx:3 of @Rd16) → C
BLD #xx:3, @aa:8
B (#xx:3 of @aa:8) → C
BILD #xx:3, Rd
B (#xx:3 of Rd8) → C
BILD #xx:3, @Rd
B (#xx:3 of @Rd16) → C
BILD #xx:3, @aa:8
B (#xx:3 of @aa:8) → C
BST #xx:3, Rd
B C → (#xx:3 of Rd8)
BST #xx:3, @Rd
B C → (#xx:3 of @Rd16)
BST #xx:3, @aa:8
B C → (#xx:3 of @aa:8)
BIST #xx:3, Rd
B C → (#xx:3 of Rd8)
BIST #xx:3, @Rd
B C → (#xx:3 of @Rd16)
BIST #xx:3, @aa:8
B C → (#xx:3 of @aa:8)
BAND #xx:3, Rd
B C∧(#xx:3 of Rd8) → C
BAND #xx:3, @Rd
B C∧(#xx:3 of @Rd16) → C
BAND #xx:3, @aa:8
B C∧(#xx:3 of @aa:8) → C
BIAND #xx:3, Rd
B C∧(#xx:3 of Rd8) → C
BIAND #xx:3, @Rd
B C∧(#xx:3 of @Rd16) → C
BIAND #xx:3, @aa:8
B C∧(#xx:3 of @aa:8) → C
BOR #xx:3, Rd
B C∨(#xx:3 of Rd8) → C
BOR #xx:3, @Rd
B C∨(#xx:3 of @Rd16) → C
BOR #xx:3, @aa:8
B C∨(#xx:3 of @aa:8) → C
BIOR #xx:3, Rd
B C∨(#xx:3 of Rd8) → C
BIOR #xx:3, @Rd
B C∨(#xx:3 of @Rd16) → C
BIOR #xx:3, @aa:8
B C∨(#xx:3 of @aa:8) → C
BXOR #xx:3, Rd
B C⊕(#xx:3 of Rd8) → C
BXOR #xx:3, @Rd
B C⊕(#xx:3 of @Rd16) → C
BXOR #xx:3, @aa:8
B C⊕(#xx:3 of @aa:8) → C
BIXOR #xx:3, Rd
B C⊕(#xx:3 of Rd8) → C
454
4
4
2
4
4
2
Condition Code
I H N Z V C
— — — — —
2
— — — — —
6
— — — — —
6
— — — — —
2
— — — — —
6
— — — — —
6
— — — — — — 2
4
— — — — — — 8
4
2
— — — — — — 8
— — — — — — 2
4
— — — — — — 8
4
2
4
4
2
4
4
2
4
4
2
4
4
2
4
4
2
@@aa
Implied
@aa: 8/16
2
@(d:8, PC)
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
Operation
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
No. of States
Table A.1
— — — — — — 8
— — — — —
2
— — — — —
6
— — — — —
6
— — — — —
2
— — — — —
6
— — — — —
6
— — — — —
2
— — — — —
6
— — — — —
6
— — — — —
2
— — — — —
6
— — — — —
6
— — — — —
2
— — — — —
6
— — — — —
6
— — — — —
2
Instruction Set (cont)
@@aa
Implied
@aa: 8/16
@(d:8, PC)
Branching
Condition
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
Operation
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
Condition Code
I H N Z V C
No. of States
Table A.1
BIXOR #xx:3, @Rd
B C⊕(#xx:3 of @Rd16) → C
BIXOR #xx:3, @aa:8
B C⊕(#xx:3 of @aa:8) → C
BRA d:8 (BT d:8)
— PC ← PC+d:8
BRN d:8 (BF d:8)
— PC ← PC+2
2
— — — — — — 4
BHI d:8
— If
C∨Z=0
2
— — — — — — 4
BLS d:8
— condition
C∨Z=1
2
— — — — — — 4
BCC d:8 (BHS d:8)
— is true
C=0
2
— — — — — — 4
BCS d:8 (BLO d:8)
— then
C=1
2
— — — — — — 4
BNE d:8
— PC ←
Z=0
2
— — — — — — 4
BEQ d:8
— PC+d:8
Z=1
2
— — — — — — 4
BVC d:8
— else next;
V=0
2
— — — — — — 4
BVS d:8
—
V=1
2
— — — — — — 4
BPL d:8
—
N=0
2
— — — — — — 4
BMI d:8
—
N=1
2
— — — — — — 4
BGE d:8
—
N⊕V = 0
2
— — — — — — 4
BLT d:8
—
N⊕V = 1
2
— — — — — — 4
BGT d:8
—
Z ∨ (N⊕V) = 0
2
— — — — — — 4
BLE d:8
—
Z ∨ (N⊕V) = 1
2
— — — — — — 4
JMP @Rn
— PC ← Rn16
JMP @aa:16
— PC ← aa:16
JMP @@aa:8
— PC ← @aa:8
BSR d:8
— SP–2 → SP
PC → @SP
PC ← PC+d:8
JSR @Rn
— SP–2 → SP
PC → @SP
PC ← Rn16
JSR @aa:16
— SP–2 → SP
PC → @SP
PC ← aa:16
4
4
2
— — — — —
6
— — — — —
6
— — — — — — 4
2
— — — — — — 4
4
— — — — — — 6
2
2
2
— — — — — — 8
— — — — — — 6
— — — — — — 6
4
— — — — — — 8
455
Instruction Set (cont)
JSR @@aa:8
SP–2 → SP
PC → @SP
PC ← @aa:8
@@aa
Implied
@aa: 8/16
@(d:8, PC)
Rn
@Rn
@(d:16, Rn)
@–Rn/@Rn+
Operation
#xx: 8/16
Mnemonic
Operand Size
Addressing Mode/
Instruction Length (Bytes)
2
Condition Code
I H N Z V C
No. of States
Table A.1
— — — — — — 8
RTS
— PC ← @SP
SP+2 → SP
2 — — — — — — 8
RTE
— CCR ← @SP
SP+2 → SP
PC ← @SP
SP+2 → SP
2
SLEEP
— Transit to power-down
state
2 — — — — — — 2
LDC #xx:8, CCR
B #xx:8 → CCR
LDC Rs, CCR
B Rs8 → CCR
2
2
STC CCR, Rd
B CCR → Rd8
2
— — — — — — 2
ANDC #xx:8, CCR
B CCR∧#xx:8 → CCR
2
2
ORC #xx:8, CCR
B CCR∨#xx:8 → CCR
2
2
XORC #xx:8, CCR
B CCR⊕#xx:8 → CCR
2
2
NOP
— PC ← PC+2
10
2
2
2 — — — — — — 2
Notes: (1) Set to 1 when there is a carry or borrow from bit 11; otherwise cleared to 0.
(2) If the result is zero, the previous value of the flag is retained; otherwise the flag is
cleared to 0.
(3) Set to 1 if decimal adjustment produces a carry; otherwise retains value prior to
arithmetic operation.
(4) The number of states required for execution is 4n + 9 (n = value of R4L).
(5) Set to 1 if the divisor is negative; otherwise cleared to 0.
(6) Set to 1 if the divisor is zero; otherwise cleared to 0.
456
A.2
Operation Code Map
Table A.2 is an operation code map. It shows the operation codes contained in the first byte of the
instruction code (bits 15 to 8 of the first instruction word).
Instruction when first bit of byte 2 (bit 7 of first instruction word) is 0.
Instruction when first bit of byte 2 (bit 7 of first instruction word) is 1.
457
458
8
XOR
AND
MOV
D
E
F
SUB
ADD
MOV
BVS
9
JMP
BPL
DEC
INC
A
Note: * The PUSH and POP instructions are identical in machine language to MOV instructions.
OR
C
BVC
SUBX
BILD
BIST
BLD
BST
BEQ
MOV
NEG
NOT
LDC
7
B
BIAND
BAND
RTE
BNE
AND
ANDC
6
CMP
BIXOR
BXOR
BSR
BCS
XOR
XORC
5
A
BIOR
BOR
RTS
BCC
OR
ORC
4
ADDX
BTST
BLS
ROTR
ROTXR
LDC
3
9
BCLR
BHI
ROTL
ROTXL
STC
2
ADD
BNOT
DIVXU
BRN
SHAR
SHLR
SLEEP
1
8
7
BSET
MULXU
5
6
BRA
SHAL
SHLL
NOP
0
4
3
2
1
0
Low
C
CMP
MOV
BLT
D
JSR
BGT
SUBX
ADDX
E
Bit-manipulation instructions
BGE
MOV *
EEPMOV
BMI
SUBS
ADDS
B
#"#
High
BLE
DAS
DAA
F
Table A.2
Operation Code Map
A.3
Number of Execution States
The tables here can be used to calculate the number of states required for instruction execution.
Table A-3 indicates the number of states required for each cycle (instruction fetch, data read/write,
etc.) in instruction execution, and table A-4 indicates the number of cycles of each type occurring
in each instruction. The total number of states required for execution of an instruction can be
calculated from these two tables as follows:
Execution states = I × S I + J × S J + K × S K + L × S L + M × S M + N × S N
Examples: When instruction is fetched from on-chip ROM, and an on-chip RAM is accessed.
BSET #0, @FF00
From table A.4:
I = L = 2, J = K = M = N= 0
From table A.3:
S I = 2, SL = 2
Number of states required for execution = 2 × 2 + 2 × 2 = 8
When instruction is fetched from on-chip ROM, branch address is read from on-chip ROM, and
on-chip RAM is used for stack area.
JSR @@ 30
From table A.4:
I = 2, J = K = 1,
L=M=N=0
From table A.3:
S I = SJ = SK = 2
Number of states required for execution = 2 × 2 + 1 × 2+ 1 × 2 = 8
459
Table A.3
Number of Cycles in Each Instruction
Access Location
Execution Status
(Instruction Cycle)
On-Chip Memory
On-Chip Peripheral Module
2
—
Instruction fetch
SI
Branch address read
SJ
Stack operation
SK
Byte data access
SL
2 or 3*
Word data access
SM
—
Internal operation
SN
1
Note: * Depends on which on-chip module is accessed. See 2.9.1, Notes on Data Access for
details.
460
Table A.4
Number of Cycles in Each Instruction
Instruction Mnemonic
Instruction Branch
Stack
Byte Data
Fetch
Addr. Read Operation Access
I
J
K
L
ADD
1
ADD.B #xx:8, Rd
ADD.B Rs, Rd
1
ADD.W Rs, Rd
1
ADDS.W #1, Rd
1
ADDS.W #2, Rd
1
ADDX.B #xx:8, Rd
1
ADDX.B Rs, Rd
1
AND.B #xx:8, Rd
1
AND.B Rs, Rd
1
ANDC
ANDC #xx:8, CCR
1
BAND
BAND #xx:3, Rd
1
BAND #xx:3, @Rd
2
1
BAND #xx:3, @aa:8
2
1
BRA d:8 (BT d:8)
2
BRN d:8 (BF d:8)
2
BHI d:8
2
BLS d:8
2
BCC d:8 (BHS d:8)
2
BCS d:8 (BLO d:8)
2
BNE d:8
2
BEQ d:8
2
BVC d:8
2
BVS d:8
2
BPL d:8
2
BMI d:8
2
BGE d:8
2
ADDS
ADDX
AND
Bcc
BCLR
BLT d:8
2
BGT d:8
2
BLE d:8
2
BCLR #xx:3, Rd
1
BCLR #xx:3, @Rd
2
2
BCLR #xx:3, @aa:8
2
2
BCLR Rn, Rd
1
Word Data Internal
Access
Operation
M
N
461
Table A.4
Number of Cycles in Each Instruction (cont)
Instruction Mnemonic
Instruction Branch
Stack
Byte Data
Fetch
Addr. Read Operation Access
I
J
K
L
BCLR
BCLR Rn, @Rd
2
2
BCLR Rn, @aa:8
2
2
BIAND #xx:3, Rd
1
BIAND #xx:3, @Rd
2
1
BIAND #xx:3, @aa:8 2
1
BIAND
BILD
BIOR
BIST
BIXOR
BLD
BNOT
BOR
BSET
462
BILD #xx:3, Rd
1
BILD #xx:3, @Rd
2
1
BILD #xx:3, @aa:8
2
1
BIOR #xx:3, Rd
1
BIOR #xx:3, @Rd
2
1
BIOR #xx:3, @aa:8
2
1
BIST #xx:3, Rd
1
BIST #xx:3, @Rd
2
2
BIST #xx:3, @aa:8
2
2
BIXOR #xx:3, Rd
1
BIXOR #xx:3, @Rd
2
1
BIXOR #xx:3, @aa:8 2
1
BLD #xx:3, Rd
1
BLD #xx:3, @Rd
2
1
BLD #xx:3, @aa:8
2
1
BNOT #xx:3, Rd
1
BNOT #xx:3, @Rd
2
2
BNOT #xx:3, @aa:8
2
2
BNOT Rn, Rd
1
BNOT Rn, @Rd
2
2
BNOT Rn, @aa:8
2
2
BOR #xx:3, Rd
1
BOR #xx:3, @Rd
2
1
BOR #xx:3, @aa:8
2
1
BSET #xx:3, Rd
1
BSET #xx:3, @Rd
2
2
BSET #xx:3, @aa:8
2
2
BSET Rn, Rd
1
BSET Rn, @Rd
2
2
Word Data Internal
Access
Operation
M
N
Table A.4
Number of Cycles in Each Instruction (cont)
Instruction Mnemonic
Instruction Branch
Stack
Byte Data
Fetch
Addr. Read Operation Access
I
J
K
L
BSET
BSET Rn, @aa:8
2
BSR
BSR d:8
2
BST
BST #xx:3, Rd
1
BST #xx:3, @Rd
2
2
BST #xx:3, @aa:8
2
2
BTST #xx:3, Rd
1
BTST #xx:3, @Rd
2
1
BTST #xx:3, @aa:8
2
1
BTST Rn, Rd
1
BTST
BXOR
CMP
2
1
BTST Rn, @Rd
2
1
BTST Rn, @aa:8
2
1
BXOR #xx:3, Rd
1
BXOR #xx:3, @Rd
2
1
BXOR #xx:3, @aa:8 2
1
CMP. B #xx:8, Rd
1
CMP. B Rs, Rd
1
CMP.W Rs, Rd
1
DAA
DAA.B Rd
1
DAS
DAS.B Rd
1
DEC
DEC.B Rd
1
DIVXU
DIVXU.B Rs, Rd
1
EEPMOV
EEPMOV
2
INC
INC.B Rd
1
JMP
JMP @Rn
2
JMP @aa:16
2
JMP @@aa:8
2
JSR @Rn
2
1
JSR @aa:16
2
1
JSR @@aa:8
2
LDC #xx:8, CCR
1
LDC Rs, CCR
1
MOV.B #xx:8, Rd
1
MOV.B Rs, Rd
1
JSR
LDC
MOV
Word Data Internal
Access
Operation
M
N
12
2n+2*
1
2
1
1
2
2
1
Note: n: Initial value in R4L. The source and destination operands are accessed n + 1 times each.
463
Table A.4
Number of Cycles in Each Instruction (cont)
Instruction Mnemonic
Instruction Branch
Stack
Byte Data
Fetch
Addr. Read Operation Access
I
J
K
L
MOV
1
1
MOV.B @(d:16, Rs), 2
Rd
1
MOV.B @Rs+, Rd
1
1
MOV.B @aa:8, Rd
1
1
MOV.B @aa:16, Rd
2
1
MOV.B Rs, @Rd
1
1
MOV.B Rs, @(d:16,
Rd)
2
1
MOV.B Rs, @–Rd
1
1
MOV.B Rs, @aa:8
1
1
MOV.B Rs, @aa:16
2
1
MOV.W #xx:16, Rd
2
MOV.W Rs, Rd
1
MOV.W @Rs, Rd
1
1
MOV.W @(d:16, Rs), 2
Rd
1
MOV.W @Rs+, Rd
MOV.B @Rs, Rd
Word Data Internal
Access
Operation
M
N
2
2
1
1
MOV.W @aa:16, Rd 2
1
MOV.W Rs, @Rd
1
1
MOV.W Rs, @(d:16, 2
Rd)
1
MOV.W Rs, @–Rd
1
1
MOV.W Rs, @aa:16 2
1
2
2
MULXU
MULXU.B Rs, Rd
1
NEG
NEG.B Rd
1
NOP
NOP
1
NOT
NOT.B Rd
1
OR
OR.B #xx:8, Rd
1
OR.B Rs, Rd
1
ORC
ORC #xx:8, CCR
1
POP
POP Rd
1
1
2
PUSH
PUSH Rs
1
1
2
ROTL
ROTL.B Rd
1
ROTR
ROTR.B Rd
1
464
12
Table A.4
Number of Cycles in Each Instruction (cont)
Instruction Mnemonic
Instruction Branch
Stack
Byte Data
Fetch
Addr. Read Operation Access
I
J
K
L
ROTXL
ROTXL.B Rd
1
ROTXR
ROTXR.B Rd
1
RTE
RTE
2
2
2
RTS
RTS
2
1
2
SHLL
SHLL.B Rd
1
SHAL
SHAL.B Rd
1
SHAR
SHAR.B Rd
1
SHLR
SHLR.B Rd
1
SLEEP
SLEEP
1
STC
STC CCR, Rd
1
SUB
SUB.B Rs, Rd
1
SUB.W Rs, Rd
1
SUBS.W #1, Rd
1
SUBS.W #2, Rd
1
SUBX.B #xx:8, Rd
1
SUBX.B Rs, Rd
1
XOR.B #xx:8, Rd
1
XOR.B Rs, Rd
1
XORC #xx:8, CCR
1
SUBS
SUBX
XOR
XORC
Word Data Internal
Access
Operation
M
N
465
Appendix B On-Chip Registers
B.1
I/O Registers (1)
Bit NamesModule Name
Address Register
(low)
Name
Bit 7
Bit 6
H'A0
SCR1
SNC1
SNC0
—
—
CKS3
CKS2
H'A1
SCSR1
—
SOL
ORER
—
—
—
H'A2
SDRU
SDRU7
SDRU6
SDRU5
SDRU4
SDRU3
SDRU2
SDRU1
SDRU0
H'A3
SDRL
SDRL7
SDRL6
SDRL5
SDRL4
SDRL3
SDRL2
SDRL1
SDRL0
H'A4
STAR
—
—
—
STA4
STA3
STA2
STA1
STA0
H'A5
EDAR
—
—
—
EDA4
EDA3
EDA2
EDA1
EDA0
H'A6
SCR2
—
—
—
GAP1
GAP0
CKS2
CKS1
CKS0
H'A7
SCSR2
—
—
—
SOL
ORER
WT
ABT
STF
H'A8
SMR
COM
CHR
PE
PM
STOP
MP
CKS1
CKS0
H'A9
BRR
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
H'AA
SCR3
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
H'AB
TDR
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
H'AC
SSR
TDRE
RDRF
OER
FER
PER
TEND
MPBR
MPBT
H'AD
RDR
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
H'B0
TMA
TMA7
TMA6
TMA5
—
TMA3
TMA2
TMA1
TMA0
H'B1
TCA
TCA7
TCA6
TCA5
TCA4
TCA3
TCA2
TCA1
TCA0
H'B2
TMB
TMB7
—
—
—
—
TMB2
TMB1
TMB0
H'B3
TCB/TLB TCB7/
TLB7
TCB6/
TLB6
TCB5/
TLB5
TCB4/
TLB4
TCB3/
TLB3
TCB2/
TLB2
TCB1/
TLB1
TCB0/
TLB0
H'B4
TMC
TMC7
TMC6
TMC5
—
—
TMC2
TMC1
TMC0
H'B5
TCC/TLC TCC7/
TLC7
TCC6/
TLC6
TCC5/
TLC5
TCC4/
TLC4
TCC3/
TLC3
TCC2/
TLC2
TCC1/
TLC1
TCC0/
TLC0
H'B6
TCRF
TOLH
CKSH2
CKSH1
CKSH0
TOLL
CKSL2
CKSL1
CKSL0
H'B7
TCSRF
OVFH
CMFH
OVIEH
CCLRH
OVFL
CMFL
OVIEL
CCLRL
H'B8
TCFH
TCFH7
TCFH6
TCFH5
TCFH4
TCFH3
TCFH2
TCFH1
TCFH0
Bit 5
Bit 4
Bit 3
Bit 2
Bit 0
Module
Name
CKS1
CKS0
SCI1
—
STF
Bit 1
SCI2
SCI3
H'AE
H'AF
Notation:
SCI1: Serial communication interface 1
SCI2: Serial communication interface 2
SCI3: Serial communication interface 3
466
Timer A
Timer B
Timer C
Timer F
Bit NamesModule Name
Address Register
(low)
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
H'B9
TCFL
TCFL7
TCFL6
TCFL5
TCFL4
TCFL3
TCFL2
TCFL1
TCFL0
Timer F
H'BA
OCRFH
OCRFH7 OCRFH6 OCRFH5 OCRFH4 OCRFH3 OCRFH2 OCRFH1 OCRFH0
H'BB
OCRFL
OCRFL7 OCRFL6 OCRFL5 OCRFL4 OCRFL3 OCRFL2 OCRFL1 OCRFL0
H'BC
TMG
OVFH
H'BD
ICRGF
ICRGF7 ICRGF6 ICRGF5 ICRGF4 ICRGF3 ICRGF2 ICRGF1 ICRGF0
H'BE
ICRGR
ICRGR7 ICRGR6 ICRGR5 ICRGR4 ICRGR3 ICRGR2 ICRGR1 ICRGR0
H'C0
LPCR
DTS1
DTS0
CMX
SGX
SGS3
SGS2
SGS1
SGS0
H'C1
LCR
—
PSW
ACT
DISP
CKS3
CKS2
CKS1
CKS0
H'C4
AMR
CKS
TRGE
—
—
CH3
CH2
CH1
CH0
H'C5
ADRR
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
ADR0
H'C6
ADSR
ADSF
—
—
—
—
—
—
—
H'C8
PMR1
IRQ3
IRQ2
IRQ1
PWM
TMIG
TMOFH TMOFL
TMOW
H'C9
PMR2
—
—
POF2
NCS
IRQ0
POF1
UD
IRQ4
H'CA
PMR3
CS
STRB
SO2
SI2
SCK2
SO1
SI1
SCK1
H'CB
PMR4
NMOD7 NMOD6 NMOD5 NMOD4 NMOD3 NMOD2 NMOD1 NMOD0
H'CC
PMR5
WKP7
WKP6
WKP5
WKP4
WKP3
WKP2
WKP1
WKP0
H'CF
RLCTR
—
—
—
—
—
—
RLCT1
RLCT0
H'D0
PWCR
—
—
—
—
—
—
—
PWCR0
H'D1
PWDRU —
—
H'D2
PWDRL
PWDRL7 PWDRL6 PWDRL5 PWDRL4 PWDRL3 PWDRL2 PWDRL1 PWDRL0
H'D4
PDR1
P17
P16
P15
P14
P13
P12
P11
P10
H'D5
PDR2
P27
P26
P25
P24
P23
P22
P21
P20
H'D6
PDR3
P37
P36
P35
P34
P33
P32
P31
P30
H'D7
PDR4
—
—
—
—
P43
P42
P41
P40
H'D8
PDR5
P57
P56
P55
P54
P53
P52
P51
P50
H'D9
PDR6
P67
P66
P65
P64
P63
P62
P61
P60
OVFL
OVIE
IIEGS
CCLR1
CCLR0
CKS1
CKS0
Timer G
H'BF
LCD
controller/
driver
H'C2
H'C3
A/D
converter
H'C7
I/O ports
H'CD
H'CE
14-bit
PWM
PWDRU5 PWDRU4 PWDRU3 PWDRU2 PWDRU1 PWDRU0
H'D3
I/O ports
467
Bit NamesModule Name
Address Register
(low)
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
H'DA
PDR7
P77
P76
P75
P74
P73
P72
P71
P70
I/O ports
H'DB
PDR8
P87
P86
P85
P84
P83
P82
P81
P80
H'DC
PDR9
P97
P96
P95
P94
P93
P92
P91
P90
H'DD
PDRA
—
—
—
—
PA 3
PA 2
PA 1
PA 0
H'DE
PDRB
PB 7
PB 6
PB 5
PB 4
PB 3
PB 2
PB 1
PB 0
H'DF
PDRC
—
—
—
—
PC3
PC2
PC1
PC0
H'E0
PUCR1
PUCR17 PUCR16 PUCR15 PUCR14 PUCR13 PUCR12 PUCR11 PUCR10
H'E1
PUCR3
PUCR37 PUCR36 PUCR35 PUCR34 PUCR33 PUCR32 PUCR31 PUCR30
H'E2
PUCR5
PUCR57 PUCR56 PUCR55 PUCR54 PUCR53 PUCR52 PUCR51 PUCR50
H'E3
PUCR6
PUCR67 PUCR66 PUCR65 PUCR64 PUCR63 PUCR62 PUCR61 PUCR60
H'E4
PCR1
PCR17
PCR16
PCR15
PCR14
PCR13
PCR12
PCR11
PCR10
H'E5
PCR2
PCR27
PCR26
PCR25
PCR24
PCR23
PCR22
PCR21
PCR20
H'E6
PCR3
PCR37
PCR36
PCR35
PCR34
PCR33
PCR32
PCR31
PCR30
H'E7
PCR4
—
—
—
—
—
PCR42
PCR41
PCR40
H'E8
PCR5
PCR57
PCR56
PCR55
PCR54
PCR53
PCR52
PCR51
PCR50
H'E9
PCR6
PCR67
PCR66
PCR65
PCR64
PCR63
PCR62
PCR61
PCR60
H'EA
PCR7
PCR77
PCR76
PCR75
PCR74
PCR73
PCR72
PCR71
PCR70
H'EB
PCR8
PCR87
PCR86
PCR85
PCR84
PCR83
PCR82
PCR81
PCR80
H'EC
PCR9
PCR97
PCR96
PCR95
PCR94
PCR93
PCR92
PCR91
PCR90
H'ED
PCRA
—
—
—
—
PCRA3
PCRA2
PCRA1
PCRA0
H'EE
H'EF
H'F0
SYSCR1 SSBY
STS2
STS1
STS0
LSON
—
—
—
H'F1
SYSCR2 —
—
—
NESEL
DTON
MSON
SA1
SA0
H'F2
IEGR
—
—
—
IEG4
IEG3
IEG2
IEG1
IEG0
H'F3
IENR1
IENTA
IENS1
IENWP
IEN4
IEN3
IEN2
IEN1
IEN0
H'F4
IENR2
IENDT
IENAD
IENS2
IENTG
IENTFH IENTFL
IENTC
IENTB
H'F6
IRR1
IRRTA
IRRS1
—
IRRI4
IRRI3
IRRI1
IRRI0
H'F7
IRR2
IRRDT
IRRAD
IRRS2
IRRTG
IRRTFH IRRTFL
IRRTC
IRRTB
IWPR
IWPF7
IWPF6
IWPF5
IWPF4
IWPF3
IWPF1
IWPF0
System
control
H'F5
IRRI2
System
control
H'F8
H'F9
468
IWPF2
System
control
Address Register
(low)
Name
Bit 7
Bit NamesModule Name
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
Name
H'FA
H'FB
H'FC
H'FD
H'FE
H'FF
H'FF
469
B.2
I/O Registers (2)
Register
acronym
Register
name
Address to which the
register is mapped
Name of
on-chip
supporting
module
Timer C
H'B4
TMC—Timer mode register C
Bit
numbers
Bit
Initial bit
values
7
6
5
4
3
2
1
0
TMC7
TMC6
TMC5
—
—
TMC2
TMC1
TMC0
Initial value
0
0
0
1
1
0
0
0
Read/Write
R/W
R/W
R/W
—
—
R/W
R/W
R/W
Possible types of access
R
Read only
W
Write only
R/W Read and write
Clock select
0 0 0 Internal clock: φ /8192
1 Internal clock: φ /2048
1 0 Internal clock: φ /512
1 Internal clock: φ /64
1 0 0 Internal clock: φ /16
1 Internal clock: φ /4
1 0 Internal clock: φ W /4
1 External event (TMIC): Rising or falling edge
Counter up/down control
0 0 TCC is an up-counter
1 TCC is a down-counter
1 * TCC up/down control is determined by input at pin
UD. TCC is a down-counter if the UD input is high,
and an up-counter if the UD input is low.
Auto-reload function select
0 Interval function selected
1 Auto-reload function selected
470
Names of the
bits. Dashes
(—) indicate
reserved bits.
Full name
of bit
Descriptions
of bit settings
SCR1—Serial control register 1
Bit
H'A0
SCI1
7
6
5
4
3
2
1
0
SNC1
SNC0
—
—
CKS3
CKS2
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Clock Select (CKS2 to CKS0)
Bit 2 Bit 1 Bit 0
CKS2 CKS1 CKS0
0
0
0
1
1
0
1
1
0
0
1
1
0
1
Serial Clock Cycle
Synchronous
Prescaler
Division
φ = 5 MHz
φ = 2.5 MHz
φ /1024
204.8 µs
409.6 µs
φ /256
51.2 µs
102.4 µs
φ /64
12.8 µs
25.6 µs
φ /32
6.4 µs
12.8 µs
φ /16
3.2 µs
6.4 µs
φ /8
1.6 µs
3.2 µs
φ /4
0.8 µs
1.6 µs
φ /2
—
0.8 µs
Clock source select
0 Clock source is prescaler S, and pin SCK 1 is output pin
1 Clock source is external clock, and pin SCK 1 is input pin
Operation mode select
0 0 8-bit synchronous transfer mode
1 16-bit synchronous transfer mode
1 0 Continuous clock output mode
1 Reserved
471
SCSR1—Serial control/status register 1
Bit
H'A1
SCI1
7
6
5
4
3
2
1
0
—
SOL
ORER
—
—
—
—
STF
Initial value
1
0
0
0
0
0
0
0
Read/Write
—
R/W
R/(W)*
—
—
—
—
R/W
Start flag
0 Read
Write
1 Read
Write
Indicates that transfer is stopped
Invalid
Indicates transfer in progress
Starts a transfer operation
Overrun error flag
0 [Clearing condition]
After reading 1, cleared by writing 0
1 [Setting condition]
Set if a clock pulse is input after transfer
is complete, when an external clock is used
Extended data bit
0 Read SO 1 pin output level is low
Write SO 1 pin output level changes to low
1 Read SO 1 pin output level is high
Write SO 1 pin output level changes to high
Note: * Only a write of 0 for flag clearing is possible.
472
SDRU—Serial data register U
Bit
Initial value
Read/Write
H'A2
SCI1
7
6
5
4
3
2
1
0
SDRU7
SDRU6
SDRU5
SDRU4
SDRU3
SDRU2
SDRU1
SDRU0
Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Stores transmit and receive data
8-bit transfer mode: Not used
16-bit transfer mode: Upper 8 bits of data
SDRL—Serial data register L
Bit
Initial value
Read/Write
H'A3
SCI1
7
6
5
4
3
2
1
0
SDRL7
SDRL6
SDRL5
SDRL4
SDRL3
SDRL2
SDRL1
SDRL0
Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Stores transmit and receive data
8-bit transfer mode: 8-bit data
16-bit transfer mode: Lower 8 bits of data
STAR—Start address register
Bit
H'A4
SCI2
7
6
5
4
3
2
1
0
—
—
—
STA4
STA3
STA2
STA1
STA0
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
Transfer start address in range from
H'FF80 to H'FF9F
473
EDAR—End address register
Bit
H'A5
SCI2
7
6
5
4
3
2
1
0
—
—
—
EDA4
EDA3
EDA2
EDA1
EDA0
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
Transfer end address in range from
H'FF80 to H'FF9F
SCR2—Serial control register 2
Bit
H'A6
SCI2
7
6
5
4
3
2
1
0
—
—
—
GAP1
GAP0
CKS2
CKS1
CKS0
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
Clock Select (CKS2 to CKS0)
Bit 2 Bit 1 Bit 0
Clock Source
CKS2 CKS1 CKS0
Pin SCK 2
0
SCK 2 output Prescaler S
0
0
1
1
0
1
1
0
0
1
1
0
1
SCK 2 input
External clock
Serial Clock Cycle
Prescaler
φ = 5 MHz
φ = 2.5 MHz
Division
φ /256
51.2 µs
102.4 µs
φ /64
12.8 µs
25.6 µs
φ /32
6.4 µs
12.8 µs
φ /16
3.2 µs
6.4 µs
φ /8
1.6 µs
3.2 µs
φ /4
0.8 µs
1.6 µs
φ /2
—
0.8 µs
—
—
—
Gap select
0 0 No gaps between bytes
1 A gap of 8 clock cycles is inserted between bytes
1 0 A gap of 24 clock cycles is inserted between bytes
1 A gap of 56 clock cycles is inserted between bytes
474
SCSR2—Serial control/status register 2
Bit
H'A7
SCI2
7
6
5
4
3
2
1
0
—
—
—
SOL
ORER
WT
ABT
STF
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/(W)*
R/(W)*
R/(W)*
R/W
Start flag
0 Read
Write
1 Read
Write
Indicates that transfer is stopped
Stops a transfer operation
Indicates transfer in progress or waiting for CS input
Starts a transfer operation
Abort flag
0 [Clearing condition]
After reading 1, cleared by writing 0
1 [Setting condition]
When CS goes high during a transfer
Wait flag
0 [Clearing condition]
After reading 1, cleared by writing 0
1 [Setting condition]
An attempt was made to read or write the (32-byte) serial data buffer
during a transfer or while waiting for CS input
Overrun error flag
0 [Clearing condition]
After reading 1, cleared by writing 0
1 [Setting condition]
Set if a clock pulse is input after transfer is complete, when an
external clock is used
Extended data bit
0 Read SO 2 pin output level is low
Write SO 2 pin output level changes to low
1 Read SO 2 pin output level is high
Write SO 2 pin output level changes to high
Note: * Only a write of 0 for flag clearing is possible.
475
SMR—Serial mode register
Bit
H'A8
SCI3
7
6
5
4
3
2
1
0
COM
CHR
PE
PM
STOP
MP
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Multiprocessor mode
0 Multiprocessor communication function disabled
1 Multiprocessor communication function enabled
Clock select 0, 1
0 0 φ clock
1 φ /4 clock
1 0 φ /16 clock
1 φ /64 clock
Stop bit length
0 1 stop bit
1 2 stop bits
Parity mode
0 Even parity
1 Odd parity
Parity enable
0 Parity bit adding and checking disabled
1 Parity bit adding and checking enabled
Character length
0 8-bit data
1 7-bit data
Communication mode
0 Asynchronous mode
1 Synchronous mode
BRR—Bit rate register
Bit
H'A9
SCI3
7
6
5
4
3
2
1
0
BRR7
BRR6
BRR5
BRR4
BRR3
BRR2
BRR1
BRR0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
476
SCR3—Serial control register 3
Bit
H'AA
SCI3
7
6
5
4
3
2
1
0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Clock enable
Bit 1
CKE1
0
Bit 0
CKE0
0
1
1
0
1
Communication Mode
Asynchronous
Synchronous
Asynchronous
Synchronous
Asynchronous
Synchronous
Asynchronous
Synchronous
Description
Clock Source
Internal clock
Internal clock
Internal clock
Reserved
External clock
External clock
Reserved
Reserved (Do not set
this combination)
SCK 3 Pin Function
I/O port
Serial clock output
Clock output
Reserved (Do not set
this combination)
Clock input
Serial clock input
Reserved
Reserved (Do not set
this combination)
Transmit end interrupt enable
0
1
Transmit end interrupt (TEI) disabled
Transmit end interrupt (TEI) enabled
Multiprocessor interrupt enable
0
Multiprocessor interrupt request disabled (ordinary receive operation)
[Clearing condition]
Multiprocessor bit receives a data value of 1
1
Multiprocessor interrupt request enabled
Until a multiprocessor bit value of 1 is received, the receive data full interrupt (RXI) and receive
error interrupt (ERI) are disabled, and serial status register (SSR) flags RDRF, FER, and
OER are not set.
Receive enable
0
1
Receive operation disabled (RXD is a general I/O port)
Receive operation enabled (RXD is the receive data pin)
Transmit enable
0
1
Transmit operation disabled (TXD is a general I/O port)
Transmit operation enabled (TXD is the transmit data pin)
Receive interrupt enable
0
1
Receive data full interrupt request (RXI) and receive error interrupt request (ERI) disabled
Receive data full interrupt request (RXI) and receive error interrupt request (ERI) enabled
Transmit interrupt enable
0
1
Transmit data empty interrupt request (TXI) disabled
Transmit data empty interrupt request (TXI) enabled
477
TDR—Transmit data register
Bit
H'AB
SCI3
7
6
5
4
3
2
1
0
TDR7
TDR6
TDR5
TDR4
TDR3
TDR2
TDR1
TDR0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Data to be transferred to TSR
478
SSR—Serial status register
Bit
H'AC
SCI3
7
6
5
4
3
2
1
0
TDRE
RDRF
OER
FER
PER
TEND
MPBR
MPBT
Initial value
1
0
0
0
0
1
0
0
Read/Write
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R/(W)*
R
R
R/W
Multiprocessor bit receive
0 Indicates reception of data in which the multiprocessor bit is 0
1 Indicates reception of data in which the multiprocessor bit is 1
Multiprocessor bit transmit
0 The multiprocessor bit in transmit data is 0
1 The multiprocessor bit in transmit data is 1
Transmit end
0 Indicates that transmission is in progress
[Clearing conditions] After reading TDRE = 1, cleared by writing 0 to TDRE.
When data is written to TDR by an instruction.
1 Indicates that a transmission has ended
[Setting conditions]
When bit TE in serial control register 3 (SCR3) is 0.
If TDRE is set to 1 when the last bit of a transmitted character is sent.
Parity error
0 Indicates that data receiving is in progress or has been completed
[Clearing conditions] After reading PER = 1, cleared by writing 0
1 Indicates that a parity error occurred in data receiving
[Setting conditions]
When the sum of 1s in received data plus the parity bit does not match
the parity mode bit (PM) setting in the serial mode register (SMR)
Framing error
0 Indicates that data receiving is in progress or has been completed
[Clearing conditions] After reading FER = 1, cleared by writing 0
1 Indicates that a framing error occurred in data receiving
[Setting conditions]
The stop bit at the end of receive data is checked and found to be 0
Overrun error
0 Indicates that data receiving is in progress or has been completed
[Clearing conditions] After reading OER = 1, cleared by writing 0
1 Indicates that an overrun error occurred in data receiving
[Setting conditions]
When data receiving is completed while RDRF is set to 1
Receive data register full
0 Indicates there is no receive data in RDR
[Clearing conditions] After reading RDRF = 1, cleared by writing 0.
When data is read from RDR by an instruction.
1 Indicates that there is receive data in RDR
[Setting conditions]
When receiving ends normally, with receive data transferred from RSR to RDR
Transmit data register empty
0 Indicates that transmit data written to TDR has not been transferred to TSR
[Clearing conditions] After reading TDRE = 1, cleared by writing 0.
When data is written to TDR by an instruction.
1 Indicates that no transmit data has been written to TDR, or the transmit data written to TDR has been transferred to TSR
[Setting conditions]
When bit TE in serial control register 3 (SCR3) is 0.
When data is transferred from TDR to TSR.
Note: * Only a write of 0 for flag clearing is possible.
479
RDR—Receive data register
Bit
H'AD
SCI3
7
6
5
4
3
2
1
0
RDR7
RDR6
RDR5
RDR4
RDR3
RDR2
RDR1
RDR0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
TMA—Timer mode register A
Bit
H'B0
Timer A
7
6
5
4
3
2
1
0
TMA7
TMA6
TMA5
—
TMA3
TMA2
TMA1
TMA0
Initial value
0
0
0
1
0
0
0
0
Read/Write
R/W
R/W
R/W
—
R/W
R/W
R/W
R/W
Clock output select
0 0 0 φ /32
1 φ /16
1 0 φ /8
1 φ /4
1 0 0 φ W/32
1 φ W/16
1 0 φ W/8
1 φ W/4
480
Internal clock select
Prescaler and Divider Ratio
TMA3 TMA2 TMA1 TMA0 or Overflow Period
φ /8192
0
0
0
0
PSS
φ /4096
1
PSS
φ /2048
PSS
1
0
φ /512
PSS
1
φ /256
1
0
0
PSS
φ /128
1
PSS
φ /32
1
0
PSS
φ /8
1
PSS
0
0
0
1s
1
PSW
1
0.5 s
PSW
0.25 s
1
0
PSW
0.03125 s
1
PSW
1
0
0
PSW and TCA are reset
1
1
0
1
Function
Interval
timer
Time
base
TCA—Timer counter A
Bit
H'B1
Timer A
7
6
5
4
3
2
1
0
TCA7
TCA6
TCA5
TCA4
TCA3
TCA2
TCA1
TCA0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Count value
TMB—Timer mode register B
Bit
H'B2
Timer B
7
6
5
4
3
2
1
0
TMB7
—
—
—
—
TMB2
TMB1
TMB0
Initial value
0
1
1
1
1
0
0
0
Read/Write
R/W
—
—
—
—
R/W
R/W
R/W
Auto-reload function select
0 Interval timer function selected
1 Auto-reload function selected
Clock select
0 0 0 Internal clock: φ /8192
1 Internal clock: φ /2048
1 0 Internal clock: φ /512
1 Internal clock: φ /256
1 0 0 Internal clock: φ /64
1 Internal clock: φ /16
1 0 Internal clock: φ /4
1 External event (TMIB): Rising or falling edge
481
TCB—Timer counter B
Bit
H'B3
Timer B
7
6
5
4
3
2
1
0
TCB7
TCB6
TCB5
TCB4
TCB3
TCB2
TCB1
TCB0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Count value
TLB—Timer load register B
Bit
H'B3
Timer B
7
6
5
4
3
2
1
0
TLB7
TLB6
TLB5
TLB4
TLB3
TLB2
TLB1
TLB0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Reload value
482
TMC—Timer mode register C
Bit
H'B4
Timer C
7
6
5
4
3
2
1
0
TMC7
TMC6
TMC5
—
—
TMC2
TMC1
TMC0
Initial value
0
0
0
1
1
0
0
0
Read/Write
R/W
R/W
R/W
—
—
R/W
R/W
R/W
Auto-reload function select
0 Interval timer function selected
1 Auto-reload function selected
Clock select
0 0 0 Internal clock: φ /8192
1 Internal clock: φ /2048
1 0 Internal clock: φ /512
1 Internal clock: φ /64
1 0 0 Internal clock: φ /16
1 Internal clock: φ /4
1 0 Internal clock: φ W /4
1 External event (TMIC): Rising or falling edge
Counter up/down control
0 0 TCC is an up-counter
1 TCC is a down-counter
1 * TCC up/down operation is hardware-controlled by
input at the UD pin. TCC is a down-counter if the UD
input is high, and an up-counter if the UD input is low.
Note: * Don’t care
TCC—Timer counter C
Bit
H'B5
Timer C
7
6
5
4
3
2
1
0
TCC7
TCC6
TCC5
TCC4
TCC3
TCC2
TCC1
TCC0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
Count value
483
TLC—Timer load register C
Bit
H'B5
Timer C
7
6
5
4
3
2
1
0
TLC7
TLC6
TLC5
TLC4
TLC3
TLC2
TLC1
TLC0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Reload value
TCRF—Timer control register F
Bit
H'B6
Timer F
7
6
5
4
3
2
1
0
TOLH
CKSH2
CKSH1
CKSH0
TOLL
CKSL2
CKSL1
CKSL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Toggle output level H
0 Low level
1 High level
Clock select L
0 * * External event (TMIF): Rising or falling edge
1 0 0 Internal clock: φ /32
1 Internal clock: φ /16
1 0 Internal clock: φ /4
1 Internal clock: φ /2
Toggle output level L
0 Low level
1 High level
Clock select H
0 * * 16-bit mode selected. TCFL overflow signals are counted.
1 0 0 Internal clock: φ /32
1 Internal clock: φ /16
1 0 Internal clock: φ /4
1 Internal clock: φ /2
Note: * Don’t care
484
TCSRF—Timer control/status register F
Bit
H'B7
Timer F
7
6
5
4
3
2
1
0
OVFH
CMFH
OVIEH
CCLRH
OVFL
CMFL
OVIEL
CCLRL
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/W
R/W
R/(W)*
R/(W)*
R/W
R/W
Timer overflow interrupt enable L
0 TCFL overflow interrupt disabled
1 TCFL overflow interrupt enabled
Compare match flag L
0 [Clearing condition]
After reading CMFL = 1, cleared by writing 0 to CMFL
1 [Setting condition]
When the TCFL value matches the OCRFL value
Timer overflow flag L
0 [Clearing condition]
After reading OVFL = 1, cleared by writing 0 to OVFL
1 [Setting condition]
When the value of TCFL goes from H'FF to H'00
Counter clear H
0 16-bit mode:
8-bit mode:
1 16-bit mode:
8-bit mode:
TCF clearing by compare match disabled
TCFH clearing by compare match disabled
TCF clearing by compare match enabled
TCFH clearing by compare match enabled
Timer overflow interrupt enable H
0 TCFH overflow interrupt disabled
1 TCFH overflow interrupt enabled
Counter clear L
0 TCFL clearing by compare match disabled
1 TCFL clearing by compare match enabled
Compare match flag H
0 [Clearing condition]
After reading CMFH = 1, cleared by writing 0 to CMFH
1 [Setting condition]
When the TCFH value matches the OCRFH value
Timer overflow flag H
0 [Clearing condition]
After reading OVFH = 1, cleared by writing 0 to OVFH
1 [Setting condition]
When the value of TCFH goes from H'FF to H'00
Note: * Only a write of 0 for flag clearing is possible.
485
TCFH—8-bit timer counter FH
Bit
H'B8
Timer F
7
6
5
4
3
2
1
0
TCFH7
TCFH6
TCFH5
TCFH4
TCFH3
TCFH2
TCFH1
TCFH0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Count value
TCFL—8-bit timer counter FL
Bit
H'B9
Timer F
7
6
5
4
3
2
1
0
TCFL7
TCFL6
TCFL5
TCFL4
TCFL3
TCFL2
TCFL1
TCFL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Count value
OCRFH—Output compare register FH
Bit
7
6
5
H'BA
4
3
Timer F
2
1
0
OCRFH7 OCRFH6 OCRFH5 OCRFH4 OCRFH3 OCRFH2 OCRFH1 OCRFH0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
OCRFL—Output compare register FL
Bit
7
6
5
H'BB
4
3
Timer F
2
1
0
OCRFL7 OCRFL6 OCRFL5 OCRFL4 OCRFL3 OCRFL2 OCRFL1 OCRFL0
Initial value
1
1
1
1
1
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
486
TMG—Timer mode register G
Bit
H'BC
Timer G
7
6
5
4
3
2
1
0
OVFH
OVFL
OVIE
IIEGS
CCLR1
CCLR0
CKS1
CKS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/(W)*
R/(W)*
R/W
R/W
R/W
R/W
R/W
R/W
Clock select
0 0 Internal clock:
1 Internal clock:
1 0 Internal clock:
1 Internal clock:
Counter clear
0 0 TCG is not cleared
1 TCG is cleared at the falling edge of the input capture signal
1 0 TCG is cleared at the rising edge of the input capture signal
1 TCG is cleared at both edges of the input capture signal
φ /64
φ /32
φ /2
φ W /2
Input capture interrupt edge select
0 Interrupts are requested at the rising edge of the input capture signal
1 Interrupts are requested at the falling edge of the input capture signal
Timer overflow interrupt enable
0 TCG overflow interrupt disabled
1 TCG overflow interrupt enabled
Timer overflow flag L
0 [Clearing condition]
After reading OVFL = 1, cleared by writing 0 to OVFL
1 [Setting condition]
When the value of TCG goes from H'FF to H'00
Timer overflow flag H
0 [Clearing condition]
After reading OVFH = 1, cleared by writing 0 to OVFH
1 [Setting condition]
When the value of TCG goes from H'FF to H'00
Note: * Only a write of 0 for flag clearing is possible.
487
ICRGF—Input capture register GF
Bit
7
6
H'BD
5
4
3
Timer G
2
1
0
ICRGF7 ICRGF6 ICRGF5 ICRGF4 ICRGF3 ICRGF2 ICRGF1 ICRGF0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
ICRGR—Input capture register GR
Bit
7
6
H'BE
5
4
3
Timer G
2
1
0
ICRGR7 ICRGR6 ICRGR5 ICRGR4 ICRGR3 ICRGR2 ICRGR1 ICRGR0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R
R
R
R
R
R
R
R
488
LPCR—LCD port control register
Bit
H'C0
LCD controller/driver
7
6
5
4
3
2
1
0
DTS1
DTS0
CMX
SGX
SGS3
SGS2
SGS1
SGS0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Segment driver select
Bit 4
Bit 3
Bit 2
Bit 1
Functions of Pins SEG40 to SEG1
Bit 0
SEG40 to
SGX SGS3 SGS2 SGS1 SGS0 SEG37
0
0
0
0
1
1
0
1
1
1
0
*
0
*
0
1
1
0
1
1
*
*
SEG36 to SEG32 to SEG28 to SEG24 to SEG20 to SEG16 to SEG12 to SEG8 to SEG4 to
SEG33 SEG29 SEG25 SEG21 SEG17 SEG13 SEG9
SEG5 SEG1 Remarks
0
Port
Port
Port
Port
Port
Port
Port
Port
Port
Port
1
SEG
SEG
Port
Port
Port
Port
Port
Port
Port
Port
0
SEG
SEG
SEG
Port
Port
Port
Port
Port
Port
Port
1
SEG
SEG
SEG
SEG
Port
Port
Port
Port
Port
Port
0
SEG
SEG
SEG
SEG
SEG
Port
Port
Port
Port
Port
1
SEG
SEG
SEG
SEG
SEG
SEG
Port
Port
Port
Port
0
SEG
SEG
SEG
SEG
SEG
SEG
SEG
Port
Port
Port
1
SEG
SEG
SEG
SEG
SEG
SEG
SEG
SEG
Port
Port
0
SEG
SEG
SEG
SEG
SEG
SEG
SEG
SEG
SEG
Port
1
SEG
SEG
SEG
SEG
SEG
SEG
SEG
SEG
SEG
SEG
0
External segment Port
expansion
Port
Port
Port
Port
Port
Port
Port
Port
1
External segment SEG
expansion
Port
Port
Port
Port
Port
Port
Port
Port
0
External segment SEG
expansion
SEG
Port
Port
Port
Port
Port
Port
Port
1
External segment SEG
expansion
SEG
SEG
Port
Port
Port
Port
Port
Port
0
External segment SEG
expansion
SEG
SEG
SEG
Port
Port
Port
Port
Port
1
External segment SEG
expansion
SEG
SEG
SEG
SEG
Port
Port
Port
Port
0
External segment SEG
expansion
SEG
SEG
SEG
SEG
SEG
Port
Port
Port
1
External segment SEG
expansion
SEG
SEG
SEG
SEG
SEG
SEG
Port
Port
0
External segment SEG
expansion
SEG
SEG
SEG
SEG
SEG
SEG
SEG
Port
1
External segment SEG
expansion
SEG
SEG
SEG
SEG
SEG
SEG
SEG
SEG
(initial value)
Expansion signal select
0 Pins SEG40 to SEG37
1 Pins CL 1, CL 2, DO, and M
Duty and common function select
Bit 7
Bit 6
Bit 5
DTS1 DTS0 CMX Duty
0
0
0
Static
1
0
1
0
1/2 duty
1
1
0
0
1/3 duty
1
1
1
0
1/4 duty
Common Driver
Other Uses
COM 1
COM3 , COM2 , and COM1 usable as ports
COM 4 to COM 1
COM4 , COM3 , and COM2 output the same waveform as COM 1
COM 2 , COM1
COM4 and COM 3 usable as ports
COM 4 to COM 1
COM4 outputs the same waveform as COM 3 , and COM 2 the same waveform as COM 1
COM 3 to COM 1
COM4 usable as port
COM 4 to COM 1
COM4 outputs a non-select waveform
COM 4 to COM 1
—
1
489
LCR—LCD control register
Bit
H'C1
LCD controller/driver
7
6
5
4
3
2
1
0
—
PSW
ACT
DISP
CKS3
CKS2
CKS1
CKS0
Initial value
1
0
0
0
0
0
0
0
Read/Write
—
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Frame frequency select
Bit 3 Bit 2 Bit 1 Bit 0
CKS3 CKS2 CKS1 CKS0
0
0
0
*
1
1
*
1
0
0
0
1
1
0
1
1
0
0
1
1
0
1
Clock
φW
φW
φ W /2
φ /2
φ /4
φ /8
φ /16
φ /32
φ /64
φ /128
φ /256
Display data control
0 Blank data displayed
1 LCD RAM data displayed
Display active
0 LCD controller/driver operation stopped
1 LCD controller/driver operational
Power switch
0 LCD power supply resistive voltage divider off
1 LCD power supply resistive voltage divider on
Note: * Don’t care
490
Frame Frequency
φ = 5 MHz φ = 625 Hz
128 Hz (initial value)
64 Hz
32 Hz
—
610 Hz
—
305 Hz
—
153 Hz
610 Hz
76.3 Hz
305 Hz
38.1 Hz
153 Hz
—
76.3 Hz
—
38.1 Hz
—
AMR—A/D mode register
Bit
H'C4
A/D converter
7
6
5
4
3
2
1
0
CKS
TRGE
—
—
CH3
CH2
CH1
CH0
Initial value
0
0
1
1
0
0
0
0
Read/Write
R/W
R/W
—
—
R/W
R/W
R/W
R/W
Channel select
Bit 3 Bit 2 Bit 1
CH3 CH2 CH1
0
0
*
1
0
1
1
0
0
1
1
0
1
Bit 0
CH0
*
0
1
0
1
0
1
0
1
0
1
0
1
Analog input channel
No channel selected
AN 0
AN 1
AN 2
AN 3
AN 4
AN 5
AN 6
AN 7
AN 8
AN 9
AN 10
AN 11
External trigger select
0 Disables start of A/D conversion by external trigger
1 Enables start of A/D conversion by rising or falling edge
of external trigger at pin ADTRG
Clock select
Bit 7
Conversion Time
CKS Conversion Period φ = 2 MHz φ = 5 MHz
0
62/φ
31 µs
12.4 µs
1
31/φ
15.5 µs
— *1
Notes: * Don’t care
1. Operation is not guaranteed if the conversion time is less than 12.4 µs.
Set bit 7 for a value of at least 12.4 µs.
491
ADRR—A/D result register
Bit
Initial value
Read/Write
H'C5
A/D converter
7
6
5
4
3
2
1
0
ADR7
ADR6
ADR5
ADR4
ADR3
ADR2
ADR1
ADR0
Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed Not fixed
R
R
R
R
R
R
R
R
A/D conversion result
ADSR—A/D start register
Bit
H'C6
A/D converter
7
6
5
4
3
2
1
0
ADSF
—
—
—
—
—
—
—
Initial value
0
1
1
1
1
1
1
1
Read/Write
R/W
—
—
—
—
—
—
—
A/D status flag
0 Read Indicates the completion of A/D conversion
Write Stops A/D conversion
1 Read Indicates A/D conversion in progress
Write Starts A/D conversion
492
PMR1—Port mode register 1
Bit
H'C8
I/O ports
7
6
5
4
3
2
1
0
IRQ3
IRQ2
IRQ1
PWM
TMIG
TMOFH
TMOFL
TMOW
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P10 /TMOW pin function switch
0 Functions as P10 I/O pin
1 Functions as TMOW output pin
P11 /TMOFL pin function switch
0 Functions as P11 I/O pin
1 Functions as TMOFL output pin
P12 /TMOFH pin function switch
0 Functions as P12 I/O pin
1 Functions as TMOFH output pin
P13 /TMIG pin function switch
0 Functions as P13 I/O pin
1 Functions as TMIG input pin
P14 /PWM pin function switch
0 Functions as P14 I/O pin
1 Functions as PWM output pin
P15 /IRQ 1 /TMIB pin function switch
0 Functions as P15 I/O pin
1 Functions as IRQ 1 /TMIB input pin
P16 /IRQ 2 /TMIC pin function switch
0 Functions as P16 I/O pin
1 Functions as IRQ 2 /TMIC input pin
P17 /IRQ 3 /TMIF pin function switch
0 Functions as P17 I/O pin
1 Functions as IRQ 3 /TMIF input pin
493
PMR2—Port mode register 2
Bit
H'C9
I/O ports
7
6
5
4
3
2
1
0
—
—
POF2
NCS
IRQ0
POF1
UD
IRQ4
Initial value
1
1
0
0
0
0
0
0
Read/Write
—
—
R/W
R/W
R/W
R/W
R/W
R/W
P20 /IRQ 4 /ADTRG pin function switch
0 Functions as P20 I/O pin
1 Functions as IRQ 4 /ADTRG input pin
P21 /UD pin function switch
0 Functions as P21 I/O pin
1 Functions as UD input pin
P32 /SO 1 pin PMOS control
0 CMOS output
1 NMOS open-drain output
P43 /IRQ 0 pin function switch
0 Functions as P4 3 I/O pin
1 Functions as IRQ 0 input pin
TMIG noise canceller select
0 Noise canceller function not selected
1 Noise canceller function selected
P35 /SO 2 pin PMOS control
0 CMOS output
1 NMOS open-drain output
494
PMR3—Port mode register 3
Bit
H'CA
I/O ports
7
6
5
4
3
2
1
0
CS
STRB
SO2
SI2
SCK2
SO1
SI1
SCK 1
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
P3 0 /SCK 1 pin function switch
0 Functions as P3 0 I/O pin
1 Functions as SCK 1 I/O pin
P3 1 /SI 1 pin function switch
0 Functions as P3 1 I/O pin
1 Functions as SI 1 input pin
P3 2 /SO 1 pin function switch
0 Functions as P3 2 I/O pin
1 Functions as SO 1 output pin
P33 /SCK 2 pin function switch
0 Functions as P3 3 I/O pin
1 Functions as SCK 2 I/O pin
P34 /SI 2 pin function switch
0 Functions as P3 4 I/O pin
1 Functions as SI 2 input pin
P35 /SO 2 pin function switch
0 Functions as P3 5 I/O pin
1 Functions as SO 2 output pin
P36 /STRB pin function switch
0 Functions as P3 6 I/O pin
1 Functions as STRB output pin
P37 /CS pin function switch
0 Functions as P3 7 I/O pin
1 Functions as CS input pin
495
PMR4—Port mode register 4
Bit
7
H'CB
6
5
4
3
2
I/O ports
1
0
NMOD7 NMOD6 NMOD5 NMOD4 NMOD3 NMOD2 NMOD1 NMOD0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0 P2 n has CMOS output
1 P2 n has NMOS open-drain output
PMR5—Port mode register 5
H'CC
I/O ports
7
6
5
4
3
2
1
0
WKP7
WKP6
WKP5
WKP4
WKP3
WKP2
WKP1
WKP0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Bit
P5n /WKPn /SEG n + 1 pin function switch
0 Functions as P5 n I/O pin
1 Functions as WKP n input pin
RLCTR—LCD RAM relocation register
H'CF
7
6
5
4
3
2
1
0
—
—
—
—
—
—
RLCT1
RLCT0
Initial value
1
1
1
1
1
1
0
0
Read/Write
—
—
—
—
—
—
R/W
R/W
Bit
496
PWCR—PWM control register
Bit
H'D0
14-bit PWM
7
6
5
4
3
2
1
0
—
—
—
—
—
—
—
PWCR0
Initial value
1
1
1
1
1
1
1
0
Read/Write
—
—
—
—
—
—
—
W
Clock select
0 The input clock is φ /2 (tφ * = 2/φ ). The conversion period is 16,384/φ ,
with a minimum modulation width of 1/φ
1 The input clock is φ /4 (tφ * = 4/φ ). The conversion period is 32,768/φ ,
with a minimum modulation width of 2/φ
Note: * tø: Period of PWM input clock
PWDRU—PWM data register U
Bit
7
6
H'D1
5
4
3
14-bit PWM
2
1
0
PWDRU5 PWDRU4 PWDRU3 PWDRU2 PWDUR1 PWDRU0
—
—
Initial value
1
1
0
0
0
0
0
0
Read/Write
—
—
W
W
W
W
W
W
Upper 6 bits of data for generating PWM waveform
PWDRL—PWM data register L
Bit
7
PWDRL7
6
H'D2
5
PWDRL6 PWDRL5
4
3
PWDRL4 PWDRL3
14-bit PWM
2
PWDRL2
1
0
PWDRL1 PWDRL0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Lower 8 bits of data for generating PWM waveform
497
PDR1—Port data register 1
Bit
H'D4
I/O ports
7
6
5
4
3
2
1
0
P17
P16
P15
P14
P13
P12
P11
P10
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR2—Port data register 2
Bit
H'D5
I/O ports
7
6
5
4
3
2
1
0
P27
P26
P25
P24
P23
P22
P21
P20
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR3—Port data register 3
Bit
H'D6
I/O ports
7
6
5
4
3
2
1
0
P37
P36
P35
P34
P33
P32
P31
P30
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR4—Port data register 4
Bit
H'D7
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
P43
P42
P41
P40
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
R
R/W
R/W
R/W
PDR5—Port data register 5
Bit
H'D8
I/O ports
7
6
5
4
3
2
1
0
P5 7
P56
P55
P54
P53
P52
P51
P50
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
498
PDR6—Port data register 6
Bit
H'D9
I/O ports
7
6
5
4
3
2
1
0
P6 7
P66
P65
P64
P63
P62
P61
P60
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR7—Port data register 7
Bit
H'DA
I/O ports
7
6
5
4
3
2
1
0
P7 7
P76
P75
P74
P73
P72
P71
P70
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR8—Port data register 8
Bit
H'DB
I/O ports
7
6
5
4
3
2
1
0
P8 7
P86
P85
P84
P83
P82
P81
P80
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDR9—Port data register 9
Bit
H'DC
I/O ports
7
6
5
4
3
2
1
0
P9 7
P96
P95
P94
P93
P92
P91
P90
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PDRA—Port data register A
Bit
H'DD
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
PA 3
PA 2
PA 1
PA 0
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
—
R/W
R/W
R/W
R/W
499
PDRB—Port data register B
Bit
H'DE
I/O ports
7
6
5
4
3
2
1
0
PB 7
PB 6
PB 5
PB 4
PB 3
PB 2
PB 1
PB 0
R
R
R
R
R
R
R
R
Initial value
Read/Write
PDRC—Port data register C
Bit
H'DF
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
PC 3
PC 2
PC 1
PC 0
—
—
—
—
R
R
R
R
Initial value
Read/Write
PUCR1—Port pull-up control register 1
Bit
7
6
5
H'E0
4
3
I/O ports
2
1
0
PUCR17 PUCR16 PUCR15 PUCR14 PUCR13 PUCR12 PUCR11 PUCR10
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PUCR3—Port pull-up control register 3
Bit
7
6
5
H'E1
4
3
I/O ports
2
1
0
PUCR3 7 PUCR36 PUCR35 PUCR34 PUCR33 PUCR32 PUCR31 PUCR30
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PUCR5—Port pull-up control register 5
Bit
7
6
5
H'E2
4
3
I/O ports
2
1
0
PUCR5 7 PUCR56 PUCR55 PUCR54 PUCR53 PUCR52 PUCR51 PUCR50
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
500
PUCR6—Port pull-up control register 6
Bit
7
6
5
H'E3
4
3
I/O ports
2
1
0
PUCR6 7 PUCR66 PUCR65 PUCR64 PUCR63 PUCR62 PUCR61 PUCR60
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PCR1—Port control register 1
Bit
H'E4
I/O ports
7
6
5
4
3
2
1
0
PCR17
PCR16
PCR15
PCR14
PCR13
PCR12
PCR11
PCR10
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 1 input/output select
0 Input pin
1 Output pin
PCR2—Port control register 2
Bit
H'E5
I/O ports
7
6
5
4
3
2
1
0
PCR27
PCR26
PCR25
PCR24
PCR23
PCR22
PCR21
PCR20
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 2 input/output select
0 Input pin
1 Output pin
501
PCR3—Port control register 3
Bit
H'E6
I/O ports
7
6
5
4
3
2
1
0
PCR37
PCR36
PCR35
PCR34
PCR33
PCR32
PCR31
PCR30
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 3 input/output select
0 Input pin
1 Output pin
PCR4—Port control register 4
Bit
H'E7
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
—
PCR42
PCR41
PCR40
Initial value
1
1
1
1
1
0
0
0
Read/Write
—
—
—
—
—
W
W
W
Port 4 input/output select
0 Input pin
1 Output pin
PCR5—Port control register 5
Bit
H'E8
I/O ports
7
6
5
4
3
2
1
0
PCR57
PCR56
PCR55
PCR54
PCR53
PCR52
PCR51
PCR50
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 5 input/output select
0 Input pin
1 Output pin
502
PCR6—Port control register 6
Bit
H'E9
I/O ports
7
6
5
4
3
2
1
0
PCR6 7
PCR6 6
PCR6 5
PCR6 4
PCR6 3
PCR6 2
PCR6 1
PCR6 0
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 6 input/output select
0 Input pin
1 Output pin
PCR7—Port control register 7
Bit
H'EA
I/O ports
7
6
5
4
3
2
1
0
PCR77
PCR76
PCR75
PCR74
PCR73
PCR72
PCR71
PCR70
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 7 input/output select
0 Input pin
1 Output pin
PCR8—Port control register 8
Bit
H'EB
I/O ports
7
6
5
4
3
2
1
0
PCR87
PCR86
PCR85
PCR84
PCR83
PCR82
PCR81
PCR80
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 8 input/output select
0 Input pin
1 Output pin
503
PCR9—Port control register 9
Bit
H'EC
I/O ports
7
6
5
4
3
2
1
0
PCR97
PCR96
PCR95
PCR94
PCR93
PCR92
PCR91
PCR90
Initial value
0
0
0
0
0
0
0
0
Read/Write
W
W
W
W
W
W
W
W
Port 9 input/output select
0 Input pin
1 Output pin
PCRA—Port control register A
Bit
H'ED
I/O ports
7
6
5
4
3
2
1
0
—
—
—
—
PCRA 3
PCRA 2
PCRA 1
PCRA 0
Initial value
1
1
1
1
0
0
0
0
Read/Write
—
—
—
—
W
W
W
W
Port A input/output select
0 Input pin
1 Output pin
504
SYSCR1—System control register 1
Bit
H'F0
System control
7
6
5
4
3
2
1
0
SSBY
STS2
STS1
STS0
LSON
—
—
—
Initial value
0
0
0
0
0
1
1
1
Read/Write
R/W
R/W
R/W
R/W
R/W
—
—
—
Low speed on flag
0 The CPU operates on the system clock (φ )
1 The CPU operates on the subclock (φ SUB)
Standby timer select 2 to 0
0 0 0 Wait time = 8,192 states
1 Wait time = 16,384 states
1 0 Wait time = 32,768 states
1 Wait time = 65,536 states
1 * * Wait time = 131,072 states
Software standby
0 When a SLEEP instruction is executed in active mode, a transition is
made to sleep mode.
When a SLEEP instruction is executed in subactive mode, a transition is
made to subsleep mode.
1 When a SLEEP instruction is executed in active mode, a transition is
made to standby mode or watch mode.
When a SLEEP instruction is executed in subactive mode, a transition is
made to watch mode.
Note: * Don’t care
505
SYSCR2—System control register 2
Bit
H'F1
System control
7
6
5
4
3
2
1
0
—
—
—
NESEL
DTON
MSON
SA1
SA0
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
Medium speed on flag
0 Operates in active (high-speed) mode
1 Operates in active (medium-speed) mode
Subactive mode clock select
0 0 φ W /8
1 φ W /4
1 * φ W /2
Direct transfer on flag
0 When a SLEEP instruction is executed in active mode, a transition is
made to standby mode, watch mode, or sleep mode.
When a SLEEP instruction is executed in subactive mode, a transition is
made to watch mode or subsleep mode.
1 When a SLEEP instruction is executed in active (high-speed) mode, a direct
transition is made to active (medium-speed) mode if SSBY = 0, MSON = 1, and
LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1, and LSON = 1.
When a SLEEP instruction is executed in active (medium-speed) mode, a direct
transition is made to active (high-speed) mode if SSBY = 0, MSON = 0, and
LSON = 0, or to subactive mode if SSBY = 1, TMA3 = 1, and LSON = 1.
When a SLEEP instruction is executed in subactive mode, a direct
transition is made to active (high-speed) mode if SSBY = 1, TMA3 = 1, LSON = 0,
and MSON = 0, or to active (medium-speed) mode if SSBY = 1, TMA3 = 1,
LSON = 0, and MSON = 1.
Noise elimination sampling frequency select
0 Sampling rate is φ OSC /16
1 Sampling rate is φ OSC /4
Note: * Don’t care
506
IEGR—IRQ edge select register
Bit
H'F2
System control
7
6
5
4
3
2
1
0
—
—
—
IEG4
IEG3
IEG2
IEG1
IEG0
Initial value
1
1
1
0
0
0
0
0
Read/Write
—
—
—
R/W
R/W
R/W
R/W
R/W
IRQ 0 edge select
0 Falling edge of IRQ 0 pin input is detected
1 Rising edge of IRQ 0 pin input is detected
IRQ 1 edge select
0 Falling edge of IRQ 1 /TMIB pin input is detected
1 Rising edge of IRQ 1 /TMIB pin input is detected
IRQ 2 edge select
0 Falling edge of IRQ 2 /TMIC pin input is detected
1 Rising edge of IRQ 2 /TMIC pin input is detected
IRQ 3 edge select
0 Falling edge of IRQ 3 /TMIF pin input is detected
1 Rising edge of IRQ 3 /TMIF pin input is detected
IRQ 4 edge select
0 Falling edge of IRQ 4 /ADTRG pin input is detected
1 Rising edge of IRQ 4 /ADTRG pin input is detected
507
IENR1—Interrupt enable register 1
Bit
H'F3
System control
7
6
5
4
3
2
1
0
IENTA
IENS1
IENWP
IEN4
IEN3
IEN2
IEN1
IEN0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
IRQ 4 to IRQ 0 interrupt enable
0 Disables interrupt request IRQ n
1 Enables interrupt request IRQ n
Wakeup interrupt enable
(n = 4 to 0)
0 Disables interrupt requests from WKP7 to WKP 0
1 Enables interrupt requests from WKP7 to WKP 0
SCI1 interrupt enable
0 Disables SCI1 interrupts
1 Enables SCI1 interrupts
Timer A interrupt enable
0 Disables timer A interrupts
1 Enables timer A interrupts
508
IENR2—Interrupt enable register 2
Bit
H'F4
7
6
5
4
IENDT
IENAD
IENS2
IENTG
Initial value
0
0
0
0
0
Read/Write
R/W
R/W
R/W
R/W
R/W
3
System control
1
0
IENTC
IENTB
0
0
0
R/W
R/W
R/W
2
IENTFH IENTFL
Timer B interrupt enable
0 Disables timer B interrupts
1 Enables timer B interrupts
Timer C interrupt enable
0 Disables timer C interrupts
1 Enables timer C interrupts
Timer FL interrupt enable
0 Disables timer FL interrupts
1 Enables timer FL interrupts
Timer FH interrupt enable
0 Disables timer FH interrupts
1 Enables timer FH interrupts
Timer G interrupt enable
0 Disables timer G interrupts
1 Enables timer G interrupts
SCI2 interrupt enable
0 Disables SCI2 interrupts
1 Enables SCI2 interrupts
A/D converter interrupt enable
0 Disables A/D converter interrupt requests
1 Enables A/D converter interrupt requests
Direct transfer interrupt enable
0 Disables direct transfer interrupt requests
1 Enables direct transfer interrupt requests
509
IRR1—Interrupt request register 1
Bit
H'F6
System control
7
6
5
4
3
2
1
0
IRRTA
IRRS1
—
IRRI4
IRRI3
IRRI2
IRRI1
IRRI0
Initial value
0
0
1
0
0
0
0
0
Read/Write
R/W *
R/W *
—
R/W *
R/W *
R/W *
R/W *
R/W *
IRQ 4 to IRQ 0 interrupt request flag
0 [Clearing condition]
When IRRIn = 1, it is cleared by writing 0
1 [Setting condition]
When pin IRQ n is set to interrupt input and the designated signal edge is
detected
SCI1 interrupt request flag
0 [Clearing condition]
When IRRS1 = 1, it is cleared by writing 0
1 [Setting condition]
When an SCI1 transfer is completed
Timer A interrupt request flag
0 [Clearing condition]
When IRRTA = 1, it is cleared by writing 0
1 [Setting condition]
When the timer A counter overflows from H'FF to H'00
Note: * Only a write of 0 for flag clearing is possible.
510
(n = 4 to 0)
IRR2—Interrupt request register 2
Bit
H'F7
7
6
5
4
3
System control
2
1
0
IRRDT
IRRAD
IRRS2
IRRTG
IRRTC
IRRTB
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W *
R/W *
R/W *
R/W *
R/W *
R/W *
R/W *
R/W *
IRRTFH IRRTFL
Timer B interrupt request flag
0 [Clearing condition] When IRRTB = 1, it is cleared by writing 0
1 [Setting condition] When the timer B counter overflows from
H'FF to H'00
Timer C interrupt request flag
0 [Clearing condition] When IRRTC = 1, it is cleared by writing 0
1 [Setting condition] When the timer C counter overflows from H'FF to H'00
or underflows from H'00 to H'FF
Timer FL interrupt request flag
0 [Clearing condition] When IRRTFL = 1, it is cleared by writing 0
1 [Setting condition] When counter FL matches output compare register FL
in 8-bit mode
Timer FH interrupt request flag
0 [Clearing condition] When IRRTFH = 1, it is cleared by writing 0
1 [Setting condition] When counter FH matches output compare register FH in
8-bit mode, or when 16-bit counter F (TCFL, TCFH)
matches 16-bit output compare register F (OCRFL,
OCRFH) in 16-bit mode
Timer G interrupt request flag
0 [Clearing condition] When IRRTG = 1, it is cleared by writing 0
1 [Setting condition] When pin TMIG is set to TMIG input and the
designated signal edge is detected
SCI2 interrupt request flag
0 [Clearing condition] When IRRS2 = 1, it is cleared by writing 0
1 [Setting condition] When an SCI2 transfer is completed or aborted
A/D converter interrupt request flag
0 [Clearing condition] When IRRAD = 1, it is cleared by writing 0
1 [Setting condition] When A/D conversion is completed and ADSF is reset
Direct transfer interrupt request flag
0 [Clearing condition] When IRRDT = 1, it is cleared by writing 0
1 [Setting condition] A SLEEP instruction is executed when DTON = 1 and a direct
transfer is made
Note: * Only a write of 0 for flag clearing is possible.
511
IWPR—Wakeup interrupt request register
Bit
H'F9
System control
7
6
5
4
3
2
1
0
IWPF7
IWPF6
IWPF5
IWPF4
IWPF3
IWPF2
IWPF1
IWPF0
Initial value
0
0
0
0
0
0
0
0
Read/Write
R/W *
R/W *
R/W *
R/W *
R/W *
R/W *
R/W *
R/W *
Wakeup interrupt request flag
0 [Clearing condition]
When IWPFn = 1, it is cleared by writing 0
1 [Setting condition]
When pin WKPn is set to interrupt input and a falling signal edge is detected
(n = 7 to 0)
Note: * Only a write of 0 for flag clearing is possible.
512
Appendix C I/O Port Block Diagrams
C.1
Block Diagram of Port 1
SBY (low level during reset and in standby mode)
Internal
data bus
PUCR1n
VCC
VCC
PMR1n
P1n
PDR1n
VSS
PCR1n
IRQ n – 4
PDR1:
PCR1:
PMR1:
PUCR1:
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
n = 5 to 7
Figure C.1 (a) Port 1 Block Diagram (Pins P1 7 to P15)
513
PWM module
PWM
SBY
Internal
data bus
PUCR14
VCC
VCC
PMR14
P14
PDR14
VSS
PDR1:
PCR1:
PMR1:
PUCR1:
PCR14
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
Figure C.1 (b) Port 1 Block Diagram (Pin P14)
514
SBY
Internal
data bus
PUCR13
VCC
VCC
PMR13
P13
PDR13
VSS
PCR13
Timer G module
TMIG
PDR1:
PCR1:
PMR1:
PUCR1:
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
Figure C.1 (c) Port 1 Block Diagram (Pin P13)
515
Timer F module
TMOFH (P12 )
TMOFL (P1 1 )
SBY
Internal
data bus
PUCR1n
VCC
VCC
PMR1n
P1n
PDR1n
VSS
PDR1:
PCR1:
PMR1:
PUCR1:
PCR1n
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
n = 2, 1
Figure C.1 (d) Port 1 Block Diagram (Pins P12 and P11)
516
Timer A module
TMOW
SBY
Internal
data bus
PUCR10
VCC
VCC
PMR10
P10
PDR10
VSS
PDR1:
PCR1:
PMR1:
PUCR1:
PCR10
Port data register 1
Port control register 1
Port mode register 1
Port pull-up control register 1
Figure C.1 (e) Port 1 Block Diagram (Pin P10)
517
C.2
Block Diagram of Port 2
Internal
data bus
SBY
PMR4 n
VCC
P2n
PDR2 n
VSS
PDR2:
PCR2:
PMR4:
PCR2 n
Port data register 2
Port control register 2
Port mode register 4
n = 2 to 7
Figure C.2 (a) Port 2 Block Diagram (Pins P2 7 to P22)
518
SBY
Internal
data bus
PMR4 1
VCC
PMR21
P21
PDR21
VSS
PCR21
Timer C module
UD
PDR2:
PCR2:
PMR2:
PMR4:
Port data register 2
Port control register 2
Port mode register 2
Port mode register 4
Figure C.2 (b) Port 2 Block Diagram (Pin P21)
519
SBY
Internal
data bus
PMR4 0
VCC
PMR2 0
P20
PDR20
VSS
PCR2 0
IRQ 4
PDR2:
PCR2:
PMR2:
PMR4:
Port data register 2
Port control register 2
Port mode register 2
Port mode register 4
Figure C.2 (c) Port 2 Block Diagram (Pin P20)
520
C.3
Block Diagram of Port 3
SBY
Internal
data bus
PUCR37
VCC
VCC
PMR3 7
P3 7
PDR3 7
VSS
PCR3 7
SCI2 module
CS
PDR3:
PCR3:
PMR3:
PUCR3:
Port data register 3
Port control register 3
Port mode register 3
Port pull-up control register 3
Figure C.3 (a) Port 3 Block Diagram (Pin P3 7)
521
SCI2 module
STRB
SBY
Internal
data bus
PUCR3 6
VCC
VCC
PMR3 6
P3 6
PDR3 6
VSS
PCR3 6
PDR3: Port data register 3
PCR3: Port control register 3
PMR3: Port mode register 3
PUCR3: Port pull-up control register 3
Figure C.3 (b) Port 3 Block Diagram (Pin P36)
522
SCI2 module
HZS02N
SO 2
SBY
PMR2 5
Internal
data bus
PUCR35
VCC
VCC
PMR3 5
P3 5
PDR3 5
VSS
PDR3:
PCR3:
PMR3:
PMR2:
PUCR3:
PCR3 5
Port data register 3
Port control register 3
Port mode register 3
Port mode register 2
Port pull-up control register 3
Figure C.3 (c) Port 3 Block Diagram (Pin P35)
523
SBY
Internal
data bus
PUCR3n
VCC
VCC
PMR3 n
P3 n
PDR3 n
VSS
PCR3 n
SCI module
SI
PDR3:
PCR3:
PMR3:
PUCR3:
Port data register 3
Port control register 3
Port mode register 3
Port pull-up control register 3
n = 1, 4
Figure C.3 (d) Port 3 Block Diagram (Pins P34 and P31)
524
SCI module
EXCK
SCKO
SCKI
SBY
PUCR3n
VCC
VCC
P3 n
PDR3n
VSS
PDR3:
PCR3:
PMR3:
PUCR3:
Internal data bus
PMR3 n
PCR3n
Port data register 3
Port control register 3
Port mode register 3
Port pull-up control register 3
n = 3, 0
Figure C.3 (e) Port 3 Block Diagram (Pins P33 and P30)
525
SCI1 module
SO 1
SBY
PMR2 2
Internal
data bus
PUCR32
VCC
VCC
PMR3 2
P3 2
PDR3 2
VSS
PDR3:
PCR3:
PMR3:
PMR2:
PUCR3:
PCR3 2
Port data register 3
Port control register 3
Port mode register 3
Port mode register 2
Port pull-up control register 3
Figure C.3 (f) Port 3 Block Diagram (Pin P32)
526
C.4
Block Diagram of Port 4
Internal
data bus
PMR2 3
P4 3
IRQ 0
PMR2: Port mode register 2
Figure C.4 (a) Port 4 Block Diagram (Pin P4 3)
SBY
SCI3 module
VCC
TE
TXD
P4 2
PDR4 2
Internal
data bus
VSS
PDR4:
PCR4:
PCR4 2
Port data register 4
Port control register 4
Figure C.4 (b) Port 4 Block Diagram (Pin P42)
527
SBY
SCI3 module
VCC
RE
RXD
P4 1
VSS
PCR4 1
PDR4: Port data register 4
PCR4: Port control register 4
Figure C.4 (c) Port 4 Block Diagram (Pin P41)
528
Internal data bus
PDR4 1
SBY
SCI3 module
SCKIE
SCKOE
SCKO
SCKI
VCC
P4 0
VSS
PCR4 0
Internal data bus
PDR4 0
PDR4: Port data register 4
PCR4: Port control register 4
Figure C.4 (d) Port 4 Block Diagram (Pin P40)
529
C.5
Block Diagram of Port 5
SBY
Internal
data bus
PUCR5n
VCC
VCC
PMR5 n
P5 n
PDR5n
VSS
PCR5n
WKPn
PDR5:
PCR5:
PMR5:
PUCR5:
Port data register 5
Port control register 5
Port mode register 5
Port pull-up control register 5
n = 0 to 7
Figure C.5 Port 5 Block Diagram
530
C.6
Block Diagram of Port 6
SBY
Internal
data bus
PUCR6n
VCC
VCC
P6 n
PDR6n
VSS
PCR6n
PDR6: Port data register 6
PCR6: Port control register 6
PUCR4: Port pull-up control register 6
n = 0 to 7
Figure C.6 Port 6 Block Diagram
531
C.7
Block Diagram of Port 7
SBY
Internal
data bus
VCC
PDR7n
P7 n
PCR7n
VSS
PDR7:
PCR7:
Port data register 7
Port control register 7
n = 0 to 7
Figure C.7 Port 7 Block Diagram
532
C.8
Block Diagram of Port 8
SBY
Internal
data bus
VCC
PDR8 n
P8 n
PCR8 n
VSS
PDR8: Port data register 8
PCR8: Port control register 8
n = 0 to 7
Figure C.8 Port 8 Block Diagram
533
C.9
Block Diagram of Port 9
SBY
Internal
data bus
VCC
PDR9n
P9n
PCR9n
VSS
PDR9: Port data register 9
PCR9: Port control register 9
n = 0 to 7
Figure C.9 Port 9 Block Diagram
534
C.10
Block Diagram of Port A
SBY
Internal
data bus
VCC
PDRA n
PA n
PCRA n
VSS
PDRA: Port data register A
PCRA: Port control register A
n = 0 to 3
Figure C.10 Port A Block Diagram
535
C.11
Block Diagram of Port B
Internal
data bus
PBn
A/D module
DEC
AMR0 to AMR3
V IN
n = 0 to 7
Figure C.11 Port B Block Diagram
C.12
Block Diagram of Port C
Internal
data bus
PCn
A/D module
DEC
AMR0 to AMR3
V IN
n = 0 to 3
Figure C-12 Port C Block Diagram
536
Appendix D Port States in the Different Processing States
Table D.1
Port States Overview
Port
Reset
Sleep
Subsleep Standby
Watch
Subactive Active
P17 to P1 0
High
Retained
impedance
Retained
High
Retained
impedance*
Functions
Functions
P27 to P2 0
High
Retained
impedance
Retained
High
Retained
impedance*
Functions
Functions
P37 to P3 0
High
Retained
impedance
Retained
High
Retained
impedance*
Functions
Functions
P43 to P4 0
High
Retained
impedance
Retained
High
Retained
impedance*
Functions
Functions
P57 to P5 0
High
Retained
impedance
Retained
High
Retained
impedance*
Functions
Functions
P67 to P6 0
High
Retained
impedance
Retained
High
Retained
impedance*
Functions
Functions
P77 to P7 0
High
Retained
impedance
Retained
High
Retained
impedance*
Functions
Functions
P87 to P8 0
High
Retained
impedance
Retained
High
Retained
impedance*
Functions
Functions
P97 to P9 0
High
Retained
impedance
Retained
High
Retained
impedance*
Functions
Functions
PA3 to PA 0 High
Retained
impedance
Retained
High
Retained
impedance*
Functions
Functions
PB7 to PB 0 High
High
High
High
High
High
High
impedance impedance impedance impedance* impedance impedance impedance
PC 3 to PC0 High
High
High
High
High
High
High
impedance impedance impedance impedance* impedance impedance impedance
Note: * High level output when MOS pull-up is in on state.
537
Appendix E List of Product Codes
Table E.1
H8/3834 Series Product Code Lineup
Product Type
Product Code Mask Code
Package (Hitachi
Package Code)
Standard HD6473837H
models
HD6473837F
HD6473837H
100 pin QFP (FP-100B)
HD6473837F
100 pin QFP (FP-100A)
HD6473837X
HD6473837X
100 pin TQFP (TFP-100B)
HD6473837D
HD6473837HI
100 pin QFP (FP-100B)
HD6473837E
HD6473837FI
100 pin QFP (FP-100A)
Mask ROM Standard HD6433837H
versions
models
HD6433837F
HD6433837(***)H
100 pin QFP (FP-100B)
HD6433837(***)F
100 pin QFP (FP-100A)
HD6433837X
HD6433837(***)X
100 pin TQFP (TFP-100B)
HD6433837D
HD6433837(***)HI 100 pin QFP (FP-100B)
HD6433837E
HD6433837(***)FI
HD6433837L
HD6433837(***)XI 100 pin TQFP (TFP-100B)
H8/3837 PROM
versions
I-Spec
models
I-Spec
models
100 pin QFP (FP-100A)
H8/3836 Mask ROM Standard HD6433836H
versions
models
HD6433836F
HD6433836(***)H
100 pin QFP (FP-100B)
HD6433836(***)F
100 pin QFP (FP-100A)
HD6433836X
HD6433836(***)X
100 pin TQFP (TFP-100B)
HD6433836D
HD6433836(***)HI 100 pin QFP (FP-100B)
HD6433836E
HD6433836(***)FI
HD6433836L
HD6433836(***)XI 100 pin TQFP (TFP-100B)
I-Spec
models
100 pin QFP (FP-100A)
H8/3835 Mask ROM Standard HD6433835H
versions
models
HD6433835F
HD6433835(***)H
100 pin QFP (FP-100B)
HD6433835(***)F
100 pin QFP (FP-100A)
HD6433835X
HD6433835(***)X
100 pin TQFP (TFP-100B)
HD6433835D
HD6433835(***)HI 100 pin QFP (FP-100B)
HD6433835E
HD6433835(***)FI
HD6433835L
HD6433835(***)XI 100 pin TQFP (TFP-100B)
I-Spec
models
Note: For mask ROM versions, (***) is the ROM code.
538
100 pin QFP (FP-100A)
Table E.1
H8/3834 Series Product Code Lineup (cont)
Product Type
H8/3834 PROM
versions
Product Code Mask Code
Package (Hitachi
Package Code)
Standard HD6473834H
models
HD6473834F
HD6473834H
100 pin QFP (FP-100B)
HD6473834F
100 pin QFP (FP-100A)
HD6473834X
HD6473834X
100 pin TQFP (TFP-100B)
HD6473834D
HD6473834HI
100 pin QFP (FP-100B)
I-Spec
models
HD6473834FI
100 pin QFP (FP-100A)
Mask ROM Standard HD6433834H
versions
models
HD6433834F
HD6433834(***)H
100 pin QFP (FP-100B)
HD6433834(***)F
100 pin QFP (FP-100A)
HD6433834X
HD6433834(***)X
100 pin TQFP (TFP-100B)
HD6433834D
HD6433834(***)HI 100 pin QFP (FP-100B)
HD6433834E
HD6433834(***)FI
HD6433834L
HD6433834(***)XI 100 pin TQFP (TFP-100B)
I-Spec
models
HD6473834E
100 pin QFP (FP-100A)
H8/3833 Mask ROM Standard HD6433833H
versions
models
HD6433833F
HD6433833(***)H
100 pin QFP (FP-100B)
HD6433833(***)F
100 pin QFP (FP-100A)
HD6433833X
HD6433833(***)X
100 pin TQFP (TFP-100B)
HD6433833D
HD6433833(***)HI 100 pin QFP (FP-100B)
HD6433833E
HD6433833(***)FI
HD6433833L
HD6433833(***)XI 100 pin TQFP (TFP-100B)
I-Spec
models
100 pin QFP (FP-100A)
Note: For mask ROM versions, (***) is the ROM code.
539
Table E.2
H8/3834S Series Product Code Lineup
Product Type
Product Code Mask Code
Package (Hitachi
Package Code)
H8/3837S Mask ROM Standard HD6433837SH HD6433837(***)SH 100 pin QFP (FP-100B)
versions
models
HD6433837SF HD6433837(***)SF 100 pin QFP (FP-100A)
HD6433837SX HD6433837(***)SX 100 pin TQFP (TFP-100B)
I-Spec
models
HD6433837SD HD6433837(***)SHI 100 pin QFP (FP-100B)
HD6433837SE HD6433837(***)SFI 100 pin QFP (FP-100A)
HD6433837SL HD6433837(***)SXI 100 pin TQFP (TFP-100B)
H8/3836S Mask ROM Standard HD6433836SH HD6433836(***)SH 100 pin QFP (FP-100B)
versions
models
HD6433836SF HD6433836(***)SF 100 pin QFP (FP-100A)
HD6433836SX HD6433836(***)SX 100 pin TQFP (TFP-100B)
I-Spec
models
HD6433836SD HD6433836(***)SHI 100 pin QFP (FP-100B)
HD6433836SE HD6433836(***)SFI 100 pin QFP (FP-100A)
HD6433836SL HD6433836(***)SXI 100 pin TQFP (TFP-100B)
H8/3835S Mask ROM Standard HD6433835SH HD6433835(***)SH 100 pin QFP (FP-100B)
versions
models
HD6433835SF HD6433835(***)SF 100 pin QFP (FP-100A)
HD6433835SX HD6433835(***)SX 100 pin TQFP (TFP-100B)
I-Spec
models
HD6433835SD HD6433835(***)SHI 100 pin QFP (FP-100B)
HD6433835SE HD6433835(***)SFI 100 pin QFP (FP-100A)
HD6433835SL HD6433835(***)SXI 100 pin TQFP (TFP-100B)
H8/3834S Mask ROM Standard HD6433834SH HD6433834(***)SH 100 pin QFP (FP-100B)
versions
models
HD6433834SF HD6433834(***)SF 100 pin QFP (FP-100A)
HD6433834SX HD6433834(***)SX 100 pin TQFP (TFP-100B)
I-Spec
models
HD6433834SD HD6433834(***)SHI 100 pin QFP (FP-100B)
HD6433834SE HD6433834(***)SFI 100 pin QFP (FP-100A)
HD6433834SL HD6433834(***)SXI 100 pin TQFP (TFP-100B)
Note: For mask ROM versions, (***) is the ROM code.
540
Table E.2
H8/3834S Series Product Code Lineup (cont)
Product Type
Product Code Mask Code
Package (Hitachi
Package Code)
H8/3833S Mask ROM Standard HD6433833SH HD6433833(***)SH 100 pin QFP (FP-100B)
versions
models
HD6433833SF HD6433833(***)SF 100 pin QFP (FP-100A)
HD6433833SX HD6433833(***)SX 100 pin TQFP (TFP-100B)
I-Spec
models
HD6433833SD HD6433833(***)SHI 100 pin QFP (FP-100B)
HD6433833SE HD6433833(***)SFI 100 pin QFP (FP-100A)
HD6433833SL HD6433833(***)SXI 100 pin TQFP (TFP-100B)
H8/3832S Mask ROM Standard HD6433832SH HD6433832(***)SH 100 pin QFP (FP-100B)
versions
models
HD6433832SF HD6433832(***)SF 100 pin QFP (FP-100A)
HD6433832SX HD6433832(***)SX 100 pin TQFP (TFP-100B)
I-Spec
models
HD6433832SD HD6433832(***)SHI 100 pin QFP (FP-100B)
HD6433832SE HD6433832(***)SFI 100 pin QFP (FP-100A)
HD6433832SL HD6433832(***)SXI 100 pin TQFP (TFP-100B)
Note: For mask ROM versions, (***) is the ROM code.
541
Appendix F Package Dimensions
Dimensional drawings of H8/3834 Series packages FP-100B, FP-100A, and TFP-100B are shown
in figures F.1, F.2, and F.3 below.
Unit: mm
16.0 ± 0.3
14
75
51
50
100
26
0.10
0.17 ± 0.05
0.15 ± 0.04
0.08 M
1.0
2.70
25
0.12 +0.13
–0.12
1
0.22 ± 0.05
0.20 ± 0.04
3.05 Max
0.5
16.0 ± 0.3
76
1.0
0° – 8°
0.5 ± 0.2
Dimension including the plating thickness
Base material dimension
Figure F.1 FP-100B Package Dimensions
542
Unit: mm
24.8 ± 0.4
20
51
50
100
31
M
0.58
0.15
2.70
0.13
0.17 ± 0.05
0.15 ± 0.04
30
0.20 +0.10
–0.20
1
0.32 ± 0.08
0.30 ± 0.06
3.10 Max
0.65
81
14
18.8 ± 0.4
80
2.4
0.83
0° – 10°
1.2 ± 0.2
Dimension including the plating thickness
Base material dimension
Figure F.2 FP-100A Package Dimensions
543
Unit: mm
16.0 ± 0.2
14
75
51
50
100
26
1.0
0.10
1.00
0.08 M
0.17 ± 0.05
0.15 ± 0.04
25
0.10 ± 0.10
1
0.22 ± 0.05
0.20 ± 0.04
1.20 Max
0.5
16.0 ± 0.2
76
1.0
0° – 8°
0.5 ± 0.1
Dimension including the plating thickness
Base material dimension
Figure F.3 TFP-100B Package Dimensions
Note: In case of inconsistencies arising within figures, dimensional drawings listed in the
Hitachi Semiconductor Packages Manual take precedence and are considered correct.
544
H8S/3834 Series Hardware Manual
Publication Date: 1st Edition, March 1993
5th Edition, September 1997
Published by:
Semiconductor and IC Div.
Hitachi, Ltd.
Edited by:
Technical Documentation Center
Hitachi Microcomputer System Ltd.
Copyright © Hitachi, Ltd., 1993. All rights reserved. Printed in Japan.