Renesas H8S-2212 Renesas 16-bit single-chip microcomputer h8s family h8s-2200 sery Datasheet

REJ09B0074-0600
The revision list can be viewed directly by clicking the title page.
The revision list summarizes the locations of revisions and additions.
Details should always be checked by referring to the relevant text.
16
H8S/2218 Group, H8S/2212 Group
Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer
H8S Family/H8S/2200 Series
H8S/2218
H8S/2212
Rev.6.00
Revision date: Jun. 03, 2008
HD64F2218
HD64F2218U
HD6432217
HD64F2212
HD64F2212U
HD64F2211
HD64F2211U
HD6432211
HD6432210
HD6432210S
Notes regarding these materials
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate
Renesas products for their use. Renesas neither makes warranties or representations with respect to the
accuracy or completeness of the information contained in this document nor grants any license to any
intellectual property rights or any other rights of Renesas or any third party with respect to the information in
this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising
out of the use of any information in this document, including, but not limited to, product data, diagrams, charts,
programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military
applications such as the development of weapons of mass destruction or for the purpose of any other military
use. When exporting the products or technology described herein, you should follow the applicable export
control laws and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and
application circuit examples, is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas products listed in this
document, please confirm the latest product information with a Renesas sales office. Also, please pay regular
and careful attention to additional and different information to be disclosed by Renesas such as that disclosed
through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas
assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information
included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in
light of the total system before deciding about the applicability of such information to the intended application.
Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any
particular application and specifically disclaims any liability arising out of the application and use of the
information in this document or Renesas products.
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas
products are not designed, manufactured or tested for applications or otherwise in systems the failure or
malfunction of which may cause a direct threat to human life or create a risk of human injury or which require
especially high quality and reliability such as safety systems, or equipment or systems for transportation and
traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication
transmission. If you are considering the use of our products for such purposes, please contact a Renesas
sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who
elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas
Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect
to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or
damages arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific
characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use
conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and
injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for
hardware and software including but not limited to redundancy, fire control and malfunction prevention,
appropriate treatment for aging degradation or any other applicable measures. Among others, since the
evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or
system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas
products are attached or affixed, the risk of accident such as swallowing by infants and small children is very
high. You should implement safety measures so that Renesas products may not be easily detached from your
products. Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written
approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this
document, Renesas semiconductor products, or if you have any other inquiries.
Rev.6.00 Jun. 03, 2008 Page ii of xlviii
REJ09B0074-0600
General Precautions in the Handling of MPU/MCU Products
The following usage notes are applicable to all MPU/MCU products from Renesas. For detailed usage notes
on the products covered by this manual, refer to the relevant sections of the manual. If the descriptions under
General Precautions in the Handling of MPU/MCU Products and in the body of the manual differ from each
other, the description in the body of the manual takes precedence.
1. Handling of Unused Pins
Handle unused pins in accord with the directions given under Handling of Unused Pins in
the manual.
⎯ The input pins of CMOS products are generally in the high-impedance state. In
operation with an unused pin in the open-circuit state, extra electromagnetic noise is
induced in the vicinity of LSI, an associated shoot-through current flows internally, and
malfunctions may occur due to the false recognition of the pin state as an input signal.
Unused pins should be handled as described under Handling of Unused Pins in the
manual.
2. Processing at Power-on
The state of the product is undefined at the moment when power is supplied.
⎯ The states of internal circuits in the LSI are indeterminate and the states of register
settings and pins are undefined at the moment when power is supplied.
In a finished product where the reset signal is applied to the external reset pin, the
states of pins are not guaranteed from the moment when power is supplied until the
reset process is completed.
In a similar way, the states of pins in a product that is reset by an on-chip power-on
reset function are not guaranteed from the moment when power is supplied until the
power reaches the level at which resetting has been specified.
3. Prohibition of Access to Reserved Addresses
Access to reserved addresses is prohibited.
⎯ The reserved addresses are provided for the possible future expansion of functions. Do
not access these addresses; the correct operation of LSI is not guaranteed if they are
accessed.
4. Clock Signals
After applying a reset, only release the reset line after the operating clock signal has
become stable. When switching the clock signal during program execution, wait until the
target clock signal has stabilized.
⎯ When the clock signal is generated with an external resonator (or from an external
oscillator) during a reset, ensure that the reset line is only released after full stabilization
of the clock signal. Moreover, when switching to a clock signal produced with an
external resonator (or by an external oscillator) while program execution is in progress,
wait until the target clock signal is stable.
5. Differences between Products
Before changing from one product to another, i.e. to one with a different type number,
confirm that the change will not lead to problems.
⎯ The characteristics of MPU/MCU in the same group but having different type numbers
may differ because of the differences in internal memory capacity and layout pattern.
When changing to products of different type numbers, implement a system-evaluation
test for each of the products.
Rev.6.00 Jun. 03, 2008 Page iii of xlviii
REJ09B0074-0600
Configuration of This Manual
This manual comprises the following items:
1. General Precautions on Handling of Product
2. Configuration of This Manual
3. Preface
4. Main Revisions for This Edition (only for revised versions)
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
5. Contents
6. Overview
7. Description of Functional Modules
•
•
CPU and System-Control Modules
On-Chip Peripheral Modules
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
When designing an application system that includes this LSI, take notes into account. Each section
includes notes in relation to the descriptions given, and usage notes are given, as required, as the
final part of each section.
8. List of Registers
9. Electrical Characteristics
10. Appendix
11. Index
Rev.6.00 Jun. 03, 2008 Page iv of xlviii
REJ09B0074-0600
Preface
This LSI is a microcomputer (MCU) made up of the H8S/2000 CPU with Renesas Technology's
original architecture as its core, and the peripheral functions required to configure a system.
The H8S/2000 CPU has an internal 32-bit configuration, sixteen 16-bit general registers, and a
simple and optimized instruction set for high-speed operation. The H8S/2000 CPU can handle a
16-Mbyte linear address space.
This LSI is equipped with ROM and RAM, a direct memory access controller (DMAC), a bus
master, a 16-bit timer pulse unit (TPU), a watchdog timer (WDT), a realtime clock (RTC), a
universal serial bus (USB), two types of serial communication interfaces (SCIs), an A/D converter,
and I/O ports as on-chip peripheral modules for system configuration.
A single-power flash memory (F-ZTAT™*) version and masked ROM version are available for
this LSI's ROM. The F-ZTAT version provides flexibility as it can be reprogrammed in no time to
cope with all situations from the early stages of mass production to full-scale mass production.
This is particularly applicable to application devices with specifications that will most probably
change.
This manual describes this LSI's hardware.
Note: * F-ZTAT is a trademark of Renesas Technology, Corp.
Target Users: This manual was written for users who will be using the H8S/2218 Group and
H8S/2212 Group in the design of application systems. Target users are expected to
understand the fundamentals of electrical circuits, logical circuits, and
microcomputers.
Objective:
This manual was written to explain the hardware functions and electrical
characteristics of the H8S/2218 Group and H8S/2212 Group to the target users.
Refer to the H8S/2600 Series, H8S/2000 Series Software Manual for a detailed
description of the instruction set.
Notes on reading this manual:
• In order to understand the overall functions of the chip
Read the manual according to the contents. This manual can be roughly categorized into parts
on the CPU, system control functions, peripheral functions and electrical characteristics.
• In order to understand the details of the CPU's functions
Read the H8S/2600 Series, H8S/2000 Series Software Manual.
Rev.6.00 Jun. 03, 2008 Page v of xlviii
REJ09B0074-0600
• In order to understand the details of a register when its name is known
Read the index that is the final part of the manual to find the page number of the entry on the
register. The addresses, bits, and initial values of the registers are summarized in section 21,
List of Registers.
Examples:
Register name:
The following notation is used for cases when the same or a
similar function, e.g. 16-bit timer pulse unit or serial
communication, is implemented on more than one channel:
XXX_N (XXX is the register name and N is the channel
number)
Bit order:
The MSB is on the left and the LSB is on the right.
Number notation: Binary is B'xxxx, hexadecimal is H'xxxx.
Signal notation:
Related Manuals:
An overbar is added to a low-active signal: xxxx
The latest versions of all related manuals are available from our web site.
Please ensure you have the latest versions of all documents you require.
http://www.renesas.com/eng/
H8S/2218 Group, H8S/2212 Group Manuals:
Document Title
Document No.
H8S/2218 Group, H8S/2212 Group Hardware Manual
This manual
H8S/2600 Series, H8S/2000 Series Software Manual
REJ09B0139
User's manuals for Development Tools:
Document Title
Document No.
H8S, H8/300 Series C/C++ Compiler, Assembler, Optimizing Linkage Editor
Compiler Package Ver. 6.01 User's Manual
REJ10B0161
H8S, H8/300 Series Simulator/Debugger (for Windows) User’s Manual
ADE-702-037
H8S, H8/300 Series High-performance Embedded Workshop,
High-performance Debugging Interface Tutorial
ADE-702-231
High-performance Embedded Workshop User's Manual
ADE-702-201
Application Notes:
Document Title
Document No.
H8S, H8/300 Series C/C++ Compiler Package Application Note
REJ05B0464
Rev.6.00 Jun. 03, 2008 Page vi of xlviii
REJ09B0074-0600
Main Revisions for This Edition
Item
Page
Revision (See Manual for Details)
All
⎯
H8S/2210S (HD6432210S) added
1.1 Overview
2
Table amended
•
•
On-chip memory
H8S/2212 Group
ROM
Part No.
ROM
RAM
Remarks
Masked ROM Version
HD6432211
64 kbytes
8 kbytes
⎯
HD6432210
32 kbytes
4 kbytes
⎯
HD6432210S
32 kbytes
4 kbytes
⎯
Note deleted
Compact package
Package
Code*
Body Size
Pin Pitch
Remarks
TQFP-100
TFP-100G, TFP-100GV
12.0 × 2.0 mm
0.4 mm
H8S/2218 Group
P-LFBGA-112
BP-112, BP-112V
10.0 × 10.0 mm
0.8 mm
LQFP-64
FP-64E, FP-64EV
10.0 × 10.0 mm
0.5 mm
VQFN-64
TNP-64B, TNP-64BV
8.0 × 8.0 mm
0.4 mm
H8S/2212 Group
Note: * A V appended to the end of the package code
indicates a lead-free version.
.
1.2 Internal Block
Diagram
3
Description amended
…The internal block diagram of the HD6432211, HD6432210
and HD6432210S is shown in figure 1.4.
Figure 1.1 Internal
Block Diagram of
HD64F2218 and
HD64F2218U
Notes amended
Notes: 1.The FWE pin is provided only in the HD64F2218 and
HD64F2218U.
2.When EMLE = 0, boundary scan is available and the
pins function as TDO, TCK, TMS, TRST, and TDI,
respectively.
When EMLE = 1, H-UDI function is available and the
pins function as TDO, TCK, TMS, TRST, and TDI,
respectively.
Figure 1.4 Internal
Block Diagram of
HD6432211,
HD6432210 and
HD6432210S
6
1.3 Pin Arrangement 7
Title amended
Description amended
…The pin arrangements of the HD6432211, HD6432210 and
HD6432210S is shown in figures 1.10 and 1.12.
Rev.6.00 Jun. 03, 2008 Page vii of xlviii
REJ09B0074-0600
Item
Page
1.3 Pin Arrangement 12
Revision (See Manual for Details)
Title amended
Figure 1.10 Pin
Arrangements of
HD6432211,
HD6432210 and
HD6432210S
(FP-64E, FP-64EV)
Figure 1.12 Pin
14
Arrangements of
HD6432211,
HD6432210 and
HD6432210S
(TNP-64B, TNP-64BV)
Title amended
3.4 Memory Map in 79
Each Operating Mode
Title and Figure amended
HD6432210, HD6432210S
ROM: 32 kbytes
RAM: 4 kbytes
Figure 3.3 Memory
Map in Each
Operating Mode for
HD64F2212,
HD64F2212U,
HD64F2211,
HD64F2211U,
HD6432211,
HD6432210 and
HD6432210S
12.3.10 Serial
Extended Mode
Register B_0
(SEMRB_0)
Mode 7
(advanced single-chip mode)
H'000000
On-chip ROM
H'007FFF
390
Figure amended
When φ = 24 MHz
Base clock with 115.132-kbps average transfer rate (ACS3 to ACS0 = B'1000)
Figure 12.3 Examples
of Base Clock when
Average Transfer Rate
Is Selected (3)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37
Base clock
24 MHz/8 = 3 MHz
3 MHz × (35/57)
= 1.8421 MHz
(Average)
3 MHz
1
1.8421 MHz
2 3
4 5
6 7
8 9
10 11
12
13 14
15 16
1 bit = base clock × 16*
Average transfer rate =1.8421 MHz/16 = 115.132 kbps
Average error with 115.2 kbps = -0.0059%
Base clock with 460.526-kbps average transfer rate (ACS3 to ACS0 = B'1001)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37
Base clock
24 MHz/2 = 12 MHz
12 MHz × (35/57)
= 7.3684 MHz
(Average)
12 MHz
1
7.3684 MHz
2 3
4 5
6 7
8 9
10 11
1 bit = base clock × 16*
Average transfer rate = 7.3684 MHz/16 = 460.526 kbps
Average error with 460.6kbps = -0.059%
Rev.6.00 Jun. 03, 2008 Page viii of xlviii
REJ09B0074-0600
12
13 14
15 16
Item
Page
Revision (See Manual for Details)
12.7.7 Serial Data
432
Transmission (Except
for Block Transfer
Mode)
Description amended and added
12.7.8 Serial Data
435
Reception (Except for
Block Transfer Mode)
Description amended
Figure 12.31 shows a flowchart for transmission. A sequence of
transmit operations can be performed automatically by
specifying the DMAC to be activated with a TXI interrupt source.
In a transmit operation, the TDRE flag is set to 1 at the same
time as the TEND flag in SSR is set, and a TXI interrupt will be
generated if the TIE bit in SCR has been set to 1. If the TXI
request is designated beforehand as a DMAC activation source,
the DMAC will be activated by the TXI request, and transfer of
the transmit data will be carried out. The TDRE and TEND flags
are automatically cleared to 0 when data is transferred by the
DMAC. In the event of an error, the SCI retransmits the same
data automatically. During this period, the TEND flag remains
cleared to 0 and the DMAC is not activated. Therefore, the SCI
and DMAC will automatically transmit the specified number of
bytes in the event of an error, including retransmission.
However, the ERS flag is not cleared automatically when an
error occurs, and so the RIE bit should be set to 1 beforehand
so that an ERI request will be generated in the event of an error,
and the ERS flag will be cleared. When using the DMAC for
data transmission or reception, always make DMAC settings
and enable the DMAC before making SCI settings. For details
on DMAC settings, see section 7, DMA Controller (DMAC).
Figure 12.33 shows a flowchart for reception. A sequence of
receive operations can be performed automatically by
specifying the DMAC to be activated using an RXI interrupt
source. In a receive operation, an RXI interrupt request is
generated when the RDRF flag in SSR is set to 1. If the RXI
request is designated beforehand as a DMAC activation source,
the DMAC will be activated by the RXI request, and the receive
data will be transferred. The RDRF flag is cleared to 0
automatically when data is transferred by the DMAC. If an error
occurs in receive mode and the ORER or PER flag is set to 1, a
transfer error interrupt (ERI) request will be generated. Hence,
so the error flag must be cleared to 0. In the event of an error,
the DMAC is not activated and receive data is skipped.
Therefore, receive data is transferred for only the specified
number of bytes in the event of an error. Even when a parity
error occurs in receive mode and the PER flag is set to 1, the
data that has been received is transferred to RDR and can be
read from there.
Rev.6.00 Jun. 03, 2008 Page ix of xlviii
REJ09B0074-0600
Item
Page
Revision (See Manual for Details)
14.5.3 Suspend and
Resume Operations
503
Figure amended
Suspend interrupt
processing
Figure 14.8 Example
Flowchart of Suspend
and Resume Interrupt
Processing
Yes
Suspend
state confirmed?
(SPRSs in UIFR3 =
1?)
No
Yes
*2
Prohibit IRQ6
(Clear IRQ6E in IER to 0)
Clear suspend flag
(Clear SPRSi in UIFR3
to 0)
Clear suspend flag
(Clear SPRSi in UIFR3
to 0)
Suspend
state confirmed?
(SPRSs in UIFR3 =
1?)
Enable IRQ6 interrupt
(Set IRQ6E in IER to 1)
Remote*3
wakeup enabled?
(RWUPs in UDRR
= 1)
No
Yes
Confirm that
remote-wakeup is enabled
Confirm that
remote-wakeup is
prohibited
Enable USB module
stop mode
(Set MSTPB0
in MSTPCRB to 1)
*1
Set standby enable
flag to 1
14.5.9 Stall
Operations
Figure 14.20 Forcible
Stall by Firmware
518
Figure amended
(1-3)
Stall
Stall handshake
Internal status bit
0→1
EPnSTL
1 (SCME = 0)
To (2-1) or (3-1)
Rev.6.00 Jun. 03, 2008 Page x of xlviii
REJ09B0074-0600
1. SCME is set to 0
2. EPnSTL is set to 1
3. Set internal status
bit to 1
4. Transmit stall
handshake
Item
Page
Revision (See Manual for Details)
15.1 Features
535
Description amended
•
16 RAM
551
Conversion time: 8.1 µs per channel (at 16-MHz operation),
10.7 µs per channel (at 24-MHz operation), 21.8 µs per
channel (at 6-MHz operation)
Description amended
…The H8S/2210 and H8S/2210S has 4 kbytes of on-chip highspeed static RAM.
Table amended
17.4 Input/Output Pins 560
Table 17.2 Pin
Configuration
18.1 Features
593
Product Class
ROM Type
RAM Size
RAM Address
H8S/2212
HD6432210
Masked ROM Version
4 kbytes
H'FFE000 to H'FFEFBF
Group
HD6432210S
H'FFFFC0 to H'FFFFFF
Table amended
Pin Name
I/O
Function
PF3, PF0, P16,
P14
Input
Sets this LSI's operating mode in programmer All
mode
EMLE
Input
Emulator enable
TxD2
Output
Serial transmit data output
RxD2
Input
Serial receive data input
Table amended
Product Class
ROM Size
ROM Address (Modes 6 and 7)
H8S/2218 Group HD6432217
64 kbytes
H'000000 to H'00FFFF
H8S/2212 Group HD6432211
64 kbytes
H'000000 to H'00FFFF
32 kbytes
H'000000 to H'007FFF
HD6432210, HD6432210S
19.8 PLL Circuit for
USB
604
HD64F2218,
HD64F2212,
HD64F2211
Description amended
The PLL circuit has the function of doubling or tripling the 16MHz or 24-MHz clock from the main oscillator to generate the
48-MHz USB operating clock.
.
When the PLL circuit is used, set the UCKS3 to UCKS0 bits of
UCTLR. For details, refer to section 14, Universal Serial Bus
(USB).
When the PLL circuit is not used, connect the PLVCC pin to Vcc
and the PLLVSS pin to the ground (Vss). Figure 19.9 shows
examples of external circuits peripheral to the PLL.
Figure 19.9 Example
of PLL Circuit
Figure added
Rev.6.00 Jun. 03, 2008 Page xi of xlviii
REJ09B0074-0600
Item
Page
658
22.2 Power Supply
Voltage and Operating
Frequency Range
Revision (See Manual for Details)
Figure replaced
Figure 22.1 Power
Supply Voltage and
Operating Ranges
22.3 DC
Characteristics
659
Table 22.3
Permissible Output
Currents
662
22.4.1 Clock Timing
664
Table 22.4 Clock
Timing
Condition D added
Condition D: VCC = PLL VCC = Dr VCC = 3.0 V to 3.6 V, Vref =
3.0 V to VCC, VSS = PLLVSS = Dr VSS = 0 V, f = 32.768 kHz,
16 MHz to 24 MHz, Ta = −20°C to +75°C (regular
specifications), Ta = −40°C to +85°C (wide-range specifications)
Condition D added
Condition D: VCC = PLL VCC = Dr VCC = 3.0 V to 3.6 V, Vref =
3.0 V to VCC, VSS = PLLVSS = Dr VSS = 0 V, f = 32.768 kHz,
16 MHz to 24 MHz, Ta = −20°C to +75°C (regular
specifications), Ta = −40°C to +85°C (wide-range specifications)
Condition D added
Condition D: VCC = PLL VCC = Dr VCC = 3.0 V to 3.6 V, Vref =
3.0 V to VCC, VSS = PLLVSS = Dr VSS = 0 V, f = 32.768 kHz,
16 MHz to 24 MHz, Ta = −20°C to +75°C (regular
specifications), Ta = −40°C to +85°C (wide-range specifications)
664 - 665 Table amended
Condition A Condition B
Item
Clock cycle time
Clock high pulse width
Clock low pulse width
Clock rise time
Clock fall time
Oscillation stabilization
time at reset (crystal)
Oscillation stabilization
Symbol
tcyc
tCH
Min.
Max. Min.
166.6
Condition C
Condition D
Max.
Min.
Max.
Min.
Test
Max. Unit Conditions
tCf
tOSC1
⎯
⎯
25
25
⎯
62.5
20
20
⎯
⎯
20
166.6
⎯
⎯
10
10
⎯
41.6
13
13
⎯
⎯
20
166.6
⎯
⎯
7
7
⎯
41.6
13
13
⎯
⎯
20
62.5
⎯
⎯
7
7
⎯
ns
ns
ns
ns
ns
ms
Figure 22.3
50
50
⎯
⎯
40
tOSC2
16
⎯
8
⎯
8
⎯
8
⎯
ms
16
⎯
8
⎯
4
⎯
4
⎯
ms
Figures 20.4,
19.2
CL1 = CL2 =
10 to 22 pF
Figures 20.4,
19.2
CL1 = CL2 =
10 to 15 pF
1000
⎯
500
⎯
500
⎯
500
⎯
μs
⎯
4
⎯
2
⎯
2
⎯
2
s
tCL
tCr
time in software
standby (crystal)
External clock output
tDEXT
stabilization delay time
Subclock stabilization tOSC3
time
fSUB
Subclock oscillator
32.768
32.768
32.768
32.768
30.5
30.5
30.5
30.5
kHz
frequency
Subclock (φSUB) cycle fSUB
time
Rev.6.00 Jun. 03, 2008 Page xii of xlviii
REJ09B0074-0600
μs
Figure 22.4
Figure 22.4
Item
Page
22.4.2 Control Signal 666
Timing
Table 22.5 Control
Signal Timing
22.4.3 Bus Timing
668
Revision (See Manual for Details)
Condition D added
Condition D: VCC = PLL VCC = Dr VCC = 3.0 V to 3.6 V, Vref =
3.0 V to VCC, VSS = PLLVSS = Dr VSS = 0 V, f = 32.768 kHz,
16 MHz to 24 MHz, Ta = −20°C to +75°C (regular
specifications), Ta = −40°C to +85°C (wide-range specifications)
Condition D added
Table 22.6 Bus
Timing
Condition D: VCC = PLL VCC = Dr VCC = 3.0 V to 3.6 V, Vref =
3.0 V to VCC, VSS = PLLVSS = Dr VSS = 0 V, f = 32.768 kHz,
16 MHz to 24 MHz, Ta = −20°C to +75°C (regular
specifications), Ta = −40°C to +85°C (wide-range specifications)
22.4.4 Timing of On- 675
Chip Supporting
Modules
Condition D added
Table 22.7 Timing of
On-Chip Supporting
Modules
22.6 A/D Conversion 682
Characteristics
Table 22.9 A/D
Conversion
Characteristics
682
Condition D: VCC = PLL VCC = Dr VCC = 3.0 V to 3.6 V, Vref =
3.0 V to VCC, VSS = PLLVSS = Dr VSS = 0 V, f = 32.768 kHz,
16 MHz to 24 MHz, Ta = −20°C to +75°C (regular
specifications), Ta = −40°C to +85°C (wide-range specifications)
Condition D added
Condition D: VCC = PLL VCC = Dr VCC = 3.0 V to 3.6 V, Vref =
3.0 V to VCC, VSS = PLLVSS = Dr VSS = 0 V, f = 32.768 kHz,
16 MHz to 24 MHz, Ta = −20°C to +75°C (regular
specifications), Ta = −40°C to +85°C (wide-range specifications)
Table amended
Condition A
Condition B, C, D
Item
Min.
Typ.
Max.
Min.
Typ.
Max.
Unit
Resolution
Conversion time
Analog input capacitance
Permissible signal-source
impedance
Nonlinearity error
Offset error
Full-scale error
Quantization
Absolute accuracy
10
21.8
⎯
⎯
10
⎯
⎯
⎯
10
⎯
20
5
10
8.1
⎯
⎯
10
⎯
⎯
⎯
10
⎯
20
5
bits
μs
pF
kΩ
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
±6.0
±4.0
±4.0
±0.5
±8.0
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
±6.0
±4.0
±4.0
±0.5
±6.0
LSB
LSB
LSB
LSB
LSB
Rev.6.00 Jun. 03, 2008 Page xiii of xlviii
REJ09B0074-0600
Item
Page
Revision (See Manual for Details)
B. Product Model
Lineup
689 - 690 Table amended and note deleted
Product Class
Part No.
Model Name
Marking
Package (code)
H8S/2212
Masked
HD6432211
HD6432211(***)FP
2211(***)FP
64-pin LQFP
Group
ROM
HD6432211(***)NP
2211(***)NP
HD6432210(***)FP
2210(***)FP
HD6432210(***)NP
2210(***)NP
HD6432210S(***)FP
2210S(***)FP
HD6432210S(***)NP
2210S(***)NP
(FP-64E, FP-64EV)
Version
64-pin VQFN
(TNP-64B, TNP-64BV)
HD6432210
64-pin LQFP
(FP-64E, FP-64EV)
64-pin VQFN
(TNP-64B, TNP-64BV)
HD6432210S
64-pin LQFP
(FP-64E, FP-64EV)
64-pin VQFN
(TNP-64B, TNP-64BV)
All trademarks and registered trademarks are the property of their respective owners.
Rev.6.00 Jun. 03, 2008 Page xiv of xlviii
REJ09B0074-0600
Contents
Section 1 Overview .............................................................................................................1
1.1
1.2
1.3
1.4
1.5
Overview...........................................................................................................................1
Internal Block Diagram.....................................................................................................3
Pin Arrangements..............................................................................................................7
Pin Functions in Each Operating Mode ............................................................................15
Pin Functions ....................................................................................................................21
Section 2 CPU ......................................................................................................................31
2.1
2.2
2.3
2.4
2.5
2.6
2.7
Features .............................................................................................................................31
2.1.1 Differences between H8S/2600 CPU and H8S/2000 CPU ..................................32
2.1.2 Differences from H8/300 CPU.............................................................................33
2.1.3 Differences from H8/300H CPU..........................................................................33
CPU Operating Modes ......................................................................................................34
2.2.1 Normal Mode .......................................................................................................34
2.2.2 Advanced Mode ...................................................................................................36
Address Space ...................................................................................................................38
Register Configuration ......................................................................................................39
2.4.1 General Registers .................................................................................................40
2.4.2 Program Counter (PC) .........................................................................................41
2.4.3 Extended Control Register (EXR) .......................................................................41
2.4.4 Condition-Code Register (CCR) ..........................................................................42
2.4.5 Initial Register Values..........................................................................................43
Data Formats .....................................................................................................................43
2.5.1 General Register Data Formats ............................................................................43
2.5.2 Memory Data Formats .........................................................................................45
Instruction Set ...................................................................................................................45
2.6.1 Table of Instructions Classified by Function .......................................................47
2.6.2 Basic Instruction Formats ....................................................................................57
Addressing Modes and Effective Address Calculation .....................................................58
2.7.1 Register Direct—Rn.............................................................................................58
2.7.2 Register Indirect—@ERn ....................................................................................58
2.7.3 Register Indirect with Displacement—@(d:16, ERn) or @(d:32, ERn) ..............59
2.7.4 Register Indirect with Post-Increment or Pre-Decrement—@ERn+ or @-ERn ..59
2.7.5 Absolute Address—@aa:8, @aa:16, @aa:24, or @aa:32....................................59
2.7.6 Immediate—#xx:8, #xx:16, or #xx:32 .................................................................60
2.7.7 Program-Counter Relative—@(d:8, PC) or @(d:16, PC)....................................60
2.7.8 Memory Indirect—@@aa:8 ................................................................................61
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REJ09B0074-0600
2.8
2.9
2.7.9 Effective Address Calculation ..............................................................................62
Processing States ...............................................................................................................64
Usage Notes.......................................................................................................................66
2.9.1 Note on TAS Instruction Usage ...........................................................................66
2.9.2 STM/LTM Instruction Usage ...............................................................................66
2.9.3 Note on Bit Manipulation Instructions .................................................................66
2.9.4 Accessing Registers Containing Write-Only Bits ................................................68
Section 3 MCU Operating Modes ...................................................................................71
3.1
3.2
3.3
3.4
Operating Mode Selection .................................................................................................71
Register Descriptions.........................................................................................................72
3.2.1 Mode Control Register (MDCR)..........................................................................72
3.2.2 System Control Register (SYSCR) ......................................................................72
Operating Mode Descriptions............................................................................................74
3.3.1 Mode 4 (Supported Only by the H8S/2218 Group)..............................................74
3.3.2 Mode 5 (Supported Only by the H8S/2218 Group)..............................................74
3.3.3 Mode 6 (Supported Only by the H8S/2218 Group)..............................................75
3.3.4 Mode 7 .................................................................................................................75
3.3.5 Pin Functions........................................................................................................76
Memory Map in Each Operating Mode.............................................................................77
Section 4 Exception Handling ..........................................................................................81
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
Exception Handling Types and Priority ............................................................................81
Exception Sources and Exception Vector Table................................................................81
Reset ..................................................................................................................................83
4.3.1 Reset Types ..........................................................................................................83
4.3.2 Reset Exception Handling ....................................................................................84
4.3.3 Interrupts after Reset ............................................................................................86
4.3.4 State of On-Chip Peripheral Modules after Reset Release ...................................86
Traces ................................................................................................................................87
Interrupts ...........................................................................................................................87
Trap Instruction .................................................................................................................88
Stack Status after Exception Handling ..............................................................................89
Notes on Use of the Stack .................................................................................................90
Section 5 Interrupt Controller ...........................................................................................91
5.1
5.2
5.3
Features .............................................................................................................................91
Input/Output Pins ..............................................................................................................93
Register Descriptions.........................................................................................................93
5.3.1 Interrupt Priority Registers A to G, J, K, M
(IPRA to IPRG, IPRJ, IPRK, IPRM) ...................................................................94
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REJ09B0074-0600
5.4
5.5
5.6
5.7
5.3.2 IRQ Enable Register (IER) ..................................................................................95
5.3.3 IRQ Sense Control Registers H and L (ISCRH, ISCRL).....................................96
5.3.4 IRQ Status Register (ISR)....................................................................................98
Interrupt Sources ...............................................................................................................99
5.4.1 External Interrupts ...............................................................................................99
5.4.2 Internal Interrupts.................................................................................................100
Interrupt Exception Handling Vector Table......................................................................101
Interrupt Control Modes and Interrupt Operation .............................................................103
5.6.1 Interrupt Control Mode 0 .....................................................................................103
5.6.2 Interrupt Control Mode 2 .....................................................................................105
5.6.3 Interrupt Exception Handling Sequence ..............................................................107
5.6.4 Interrupt Response Times ....................................................................................108
5.6.5 DMAC Activation by Interrupt............................................................................109
Usage Notes ......................................................................................................................112
5.7.1 Contention between Interrupt Generation and Disabling.....................................112
5.7.2 Instructions that Disable Interrupts ......................................................................113
5.7.3 Times when Interrupts Are Disabled ...................................................................113
5.7.4 Interrupts during Execution of EEPMOV Instruction..........................................113
5.7.5 IRQ Interrupt........................................................................................................113
5.7.6 NMI Interrupt Usage Notes..................................................................................114
Section 6 Bus Controller....................................................................................................115
6.1
6.2
6.3
6.4
6.5
6.6
Features .............................................................................................................................115
Input/Output Pins ..............................................................................................................117
Register Descriptions ........................................................................................................118
6.3.1 Bus Width Control Register (ABWCR)...............................................................118
6.3.2 Access State Control Register (ASTCR) .............................................................119
6.3.3 Wait Control Registers H and L (WCRH, WCRL)..............................................120
6.3.4 Bus Control Register H (BCRH)..........................................................................124
6.3.5 Bus Control Register L (BCRL) ..........................................................................125
6.3.6 Pin Function Control Register (PFCR) ................................................................126
Bus Control .......................................................................................................................127
6.4.1 Area Divisions .....................................................................................................127
6.4.2 Bus Specifications................................................................................................128
6.4.3 Bus Interface for Each Area.................................................................................129
6.4.4 Chip Select Signals ..............................................................................................130
Basic Timing .....................................................................................................................131
6.5.1 On-Chip Memory (ROM, RAM) Access Timing ................................................131
6.5.2 On-Chip Peripheral Module Access Timing ........................................................132
6.5.3 External Address Space Access Timing ..............................................................133
Basic Bus Interface ...........................................................................................................134
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REJ09B0074-0600
6.6.1 Data Size and Data Alignment (Supported Only by the H8S/2218 Group) .........134
6.6.2 Valid Strobes ........................................................................................................135
6.6.3 Basic Timing ........................................................................................................136
6.6.4 Wait Control.........................................................................................................145
6.7 Burst ROM Interface .........................................................................................................147
6.7.1 Basic Timing ........................................................................................................147
6.7.2 Wait Control.........................................................................................................149
6.8 Idle Cycle ..........................................................................................................................149
6.9 Bus Release .......................................................................................................................153
6.9.1 Bus Release Usage Note.......................................................................................154
6.10 Bus Arbitration ..................................................................................................................155
6.10.1 Operation..............................................................................................................155
6.10.2 Bus Transfer Timing ............................................................................................155
6.10.3 External Bus Release Usage Note ........................................................................156
6.11 Resets and the Bus Controller ...........................................................................................156
Section 7 DMA Controller (DMAC)..............................................................................157
7.1
7.2
7.3
7.4
7.5
Features .............................................................................................................................157
Register Configuration ......................................................................................................159
Register Descriptions.........................................................................................................161
7.3.1 Memory Address Registers (MAR)......................................................................161
7.3.2 I/O Address Register (IOAR) ...............................................................................161
7.3.3 Execute Transfer Count Register (ETCR)............................................................162
7.3.4 DMA Control Register (DMACR) .......................................................................163
7.3.5 DMA Band Control Register (DMABCR) ...........................................................169
Operation ...........................................................................................................................177
7.4.1 Transfer Modes ....................................................................................................177
7.4.2 Sequential Mode...................................................................................................178
7.4.3 Idle Mode .............................................................................................................181
7.4.4 Repeat Mode ........................................................................................................183
7.4.5 Normal Mode .......................................................................................................186
7.4.6 Block Transfer Mode............................................................................................189
7.4.7 DMAC Activation Sources...................................................................................194
7.4.8 Basic DMAC Bus Cycles .....................................................................................196
7.4.9 DMAC Bus Cycles (Dual Address Mode) ...........................................................197
7.4.10 DMAC Multi-Channel Operation.........................................................................202
7.4.11 Relation between the DMAC and External Bus Requests....................................203
7.4.12 NMI Interrupts and DMAC ..................................................................................203
7.4.13 Forced Termination of DMAC Operation ............................................................204
7.4.14 Clearing Full Address Mode ................................................................................205
Interrupts ...........................................................................................................................206
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REJ09B0074-0600
7.6
Usage Notes ......................................................................................................................207
7.6.1 DMAC Register Access during Operation...........................................................207
7.6.2 Module Stop.........................................................................................................208
7.6.3 Medium-Speed Mode...........................................................................................208
7.6.4 Activation Source Acceptance .............................................................................209
7.6.5 Internal Interrupt after End of Transfer................................................................209
7.6.6 Channel Re-Setting ..............................................................................................209
Section 8 I/O Ports ..............................................................................................................211
8.1
8.2
8.3
8.4
8.5
8.6
8.7
Port 1.................................................................................................................................216
8.1.1 Port 1 Data Direction Register (P1DDR).............................................................216
8.1.2 Port 1 Data Register (P1DR)................................................................................217
8.1.3 Port 1 Register (PORT1)......................................................................................217
8.1.4 Pin Functions .......................................................................................................218
Port 3.................................................................................................................................223
8.2.1 Port 3 Data Direction Register (P3DDR).............................................................223
8.2.2 Port 3 Data Register (P3DR)................................................................................224
8.2.3 Port 3 Register (PORT3)......................................................................................224
8.2.4 Port 3 Open-Drain Control Register (P3ODR) ....................................................225
8.2.5 Pin Functions .......................................................................................................225
Port 4.................................................................................................................................227
8.3.1 Port 4 Register (PORT4)......................................................................................227
8.3.2 Pin Function .........................................................................................................227
Port 7.................................................................................................................................228
8.4.1 Port 7 Data Direction Register (P7DDR).............................................................228
8.4.2 Port 7 Data Register (P7DR)................................................................................229
8.4.3 Port 7 Register (PORT7)......................................................................................230
8.4.4 Pin Functions .......................................................................................................231
Port 9.................................................................................................................................232
8.5.1 Port 9 Register (PORT9)......................................................................................232
8.5.2 Pin Function .........................................................................................................232
Port A................................................................................................................................233
8.6.1 Port A Data Direction Register (PADDR) ...........................................................233
8.6.2 Port A Data Register (PADR) ..............................................................................234
8.6.3 Port A Register (PORTA) ....................................................................................234
8.6.4 Port A Pull-Up MOS Control Register (PAPCR) ................................................235
8.6.5 Port A Open-Drain Control Register (PAODR) ..................................................235
8.6.6 Pin Functions .......................................................................................................236
8.6.7 Port A Input Pull-Up MOS States........................................................................238
Port B (H8S/2218 Group Only) ........................................................................................239
8.7.1 Port B Data Direction Register (PBDDR)............................................................239
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REJ09B0074-0600
8.8
8.9
8.10
8.11
8.12
8.13
8.7.2 Port B Data Register (PBDR)...............................................................................240
8.7.3 Port B Register (PORTB).....................................................................................240
8.7.4 Port B Pull-Up MOS Control Register (PBPCR) .................................................241
8.7.5 Pin Functions........................................................................................................242
8.7.6 Port B Input Pull-Up MOS States ........................................................................244
Port C (H8S/2218 Group Only).........................................................................................245
8.8.1 Port C Data Direction Register (PCDDR) ............................................................245
8.8.2 Port C Data Register (PCDR)...............................................................................246
8.8.3 Port C Register (PORTC).....................................................................................246
8.8.4 Port C Pull-Up MOS Control Register (PCPCR) .................................................247
8.8.5 Pin Functions........................................................................................................247
8.8.6 Port C Input Pull-Up MOS States ........................................................................249
Port D (H8S/2218 Group Only).........................................................................................250
8.9.1 Port D Data Direction Register (PDDDR) ...........................................................250
8.9.2 Port D Data Register (PDDR) ..............................................................................251
8.9.3 Port D Register (PORTD) ....................................................................................251
8.9.4 Port D Pull-Up MOS Control Register (PDPCR).................................................252
8.9.5 Pin Functions........................................................................................................252
8.9.6 Port D Input Pull-Up MOS States ........................................................................254
Port E.................................................................................................................................255
8.10.1 Port E Data Direction Register (PEDDR) ............................................................255
8.10.2 Port E Data Register (PEDR) ...............................................................................256
8.10.3 Port E Register (PORTE) .....................................................................................256
8.10.4 Port E Pull-Up MOS Control Register (PEPCR) .................................................257
8.10.5 Pin Functions........................................................................................................257
8.10.6 Port E Input Pull-Up MOS States.........................................................................260
Port F .................................................................................................................................261
8.11.1 Port F Data Direction Register (PFDDR).............................................................262
8.11.2 Port F Data Register (PFDR)................................................................................263
8.11.3 Port F Register (PORTF)......................................................................................263
8.11.4 Clock Output Control Register (OUTCR)............................................................264
8.11.5 Pin Functions........................................................................................................264
Port G ................................................................................................................................267
8.12.1 Port G Data Direction Register (PGDDR) ...........................................................268
8.12.2 Port G Data Register (PGDR) ..............................................................................269
8.12.3 Port G Register (PORTG) ....................................................................................269
8.12.4 Pin Functions........................................................................................................270
Handling of Unused Pins...................................................................................................271
Section 9 16-Bit Timer Pulse Unit (TPU).....................................................................273
9.1
Features .............................................................................................................................273
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REJ09B0074-0600
9.2
9.3
9.4
9.5
9.6
9.7
9.8
Input/Output Pins ..............................................................................................................277
Register Descriptions ........................................................................................................278
9.3.1 Timer Control Register (TCR) .............................................................................279
9.3.2 Timer Mode Register (TMDR) ............................................................................282
9.3.3 Timer I/O Control Register (TIOR) .....................................................................284
9.3.4 Timer Interrupt Enable Register (TIER) ..............................................................293
9.3.5 Timer Status Register (TSR)................................................................................294
9.3.6 Timer Counter (TCNT)........................................................................................297
9.3.7 Timer General Register (TGR) ............................................................................297
9.3.8 Timer Start Register (TSTR)................................................................................297
9.3.9 Timer Synchro Register (TSYR) .........................................................................298
Interface to Bus Master .....................................................................................................299
9.4.1 16-Bit Registers ...................................................................................................299
9.4.2 8-Bit Registers .....................................................................................................299
Operation...........................................................................................................................301
9.5.1 Basic Functions....................................................................................................301
9.5.2 Synchronous Operation........................................................................................307
9.5.3 Buffer Operation ..................................................................................................309
9.5.4 PWM Modes ........................................................................................................313
9.5.5 Phase Counting Mode ..........................................................................................317
Interrupts ...........................................................................................................................322
9.6.1 Interrupt Source and Priority................................................................................322
9.6.2 DMAC Activation................................................................................................323
9.6.3 A/D Converter Activation ....................................................................................323
Operation Timing ..............................................................................................................324
9.7.1 Input/Output Timing ............................................................................................324
9.7.2 Interrupt Signal Timing........................................................................................327
Usage Notes ......................................................................................................................331
Section 10 Watchdog Timer (WDT) ..............................................................................339
10.1 Features .............................................................................................................................339
10.2 Register Descriptions ........................................................................................................340
10.2.1 Timer Counter (TCNT)........................................................................................340
10.2.2 Timer Control/Status Register (TCSR) ................................................................340
10.2.3 Reset Control/Status Register (RSTCSR) ............................................................342
10.3 Operation...........................................................................................................................343
10.3.1 Watchdog Timer Mode ........................................................................................343
10.3.2 Timing of Setting of Watchdog Timer Overflow Flag (WOVF) .........................344
10.3.3 Interval Timer Mode ............................................................................................344
10.3.4 Timing of Setting of Overflow Flag (OVF) .........................................................345
10.4 Interrupts ...........................................................................................................................345
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REJ09B0074-0600
10.5 Usage Notes.......................................................................................................................346
10.5.1 Notes on Register Access .....................................................................................346
10.5.2 Contention between Timer Counter (TCNT) Write and Increment......................347
10.5.3 Changing Value of CKS2 to CKS0 ......................................................................348
10.5.4 Switching between Watchdog Timer Mode and Interval Timer Mode ................348
10.5.5 Internal Reset in Watchdog Timer Mode .............................................................348
10.5.6 OVF Flag Clearing in Interval Timer Mode.........................................................348
Section 11 Realtime Clock (RTC) ..................................................................................349
11.1 Features .............................................................................................................................349
11.2 Input/Output Pin ................................................................................................................350
11.3 Register Descriptions.........................................................................................................350
11.3.1 Second Data Register (RSECDR) ........................................................................350
11.3.2 Minute Data Register (RMINDR) ........................................................................351
11.3.3 Hour Data Register (RHRDR)..............................................................................352
11.3.4 Day-of-Week Data Register (RWKDR)...............................................................353
11.3.5 RTC Control Register 1 (RTCCR1) .....................................................................354
11.3.6 RTC Control Register 2 (RTCCR2) .....................................................................355
11.3.7 Clock Source Select Register (RTCCSR) ............................................................356
11.3.8 Extended Module Stop Register (EXMDLSTP) ..................................................357
11.4 Operation ...........................................................................................................................358
11.4.1 Initial Settings of Registers after Power-On and Resetting Procedure .................358
11.4.2 Time Data Reading Procedure..............................................................................359
11.5 Interrupt Source .................................................................................................................360
11.6 Operating State in Each Mode...........................................................................................361
11.7 Usage Notes.......................................................................................................................362
Section 12 Serial Communication Interface.................................................................363
12.1 Features .............................................................................................................................363
12.1.1 Block Diagram .....................................................................................................365
12.2 Input/Output Pins ..............................................................................................................367
12.3 Register Descriptions.........................................................................................................367
12.3.1 Receive Shift Register (RSR) ...............................................................................368
12.3.2 Receive Data Register (RDR) ..............................................................................368
12.3.3 Transmit Data Register (TDR) .............................................................................368
12.3.4 Transmit Shift Register (TSR)..............................................................................368
12.3.5 Serial Mode Register (SMR) ................................................................................369
12.3.6 Serial Control Register (SCR) ..............................................................................373
12.3.7 Serial Status Register (SSR) .................................................................................377
12.3.8 Smart Card Mode Register (SCMR) ....................................................................383
12.3.9 Serial Extended Mode Register A_0 (SEMRA_0) ...............................................384
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REJ09B0074-0600
12.4
12.5
12.6
12.7
12.8
12.9
12.10
12.3.10 Serial Extended Mode Register B_0 (SEMRB_0) ...............................................386
12.3.11 Bit Rate Register (BRR) ......................................................................................395
Operation in Asynchronous Mode ....................................................................................403
12.4.1 Data Transfer Format ...........................................................................................404
12.4.2 Receive Data Sampling Timing and Reception Margin in Asynchronous Mode 405
12.4.3 Clock....................................................................................................................406
12.4.4 SCI Initialization (Asynchronous Mode) .............................................................407
12.4.5 Data Transmission (Asynchronous Mode)...........................................................408
12.4.6 Serial Data Reception (Asynchronous Mode)......................................................410
Multiprocessor Communication Function.........................................................................413
12.5.1 Multiprocessor Serial Data Transmission ............................................................415
12.5.2 Multiprocessor Serial Data Reception..................................................................416
Operation in Clocked Synchronous Mode ........................................................................419
12.6.1 Clock....................................................................................................................419
12.6.2 SCI Initialization (Clocked Synchronous Mode) .................................................420
12.6.3 Serial Data Transmission (Clocked Synchronous Mode) ....................................421
12.6.4 Serial Data Reception (Clocked Synchronous Mode)..........................................424
12.6.5 Simultaneous Serial Data Transmission and Reception
(Clocked Synchronous Mode) .............................................................................425
Operation in Smart Card Interface ....................................................................................427
12.7.1 Pin Connection Example......................................................................................427
12.7.2 Data Format (Except for Block Transfer Mode) ..................................................428
12.7.3 Clock....................................................................................................................429
12.7.4 Block Transfer Mode ...........................................................................................429
12.7.5 Receive Data Sampling Timing and Reception Margin.......................................430
12.7.6 Initialization .........................................................................................................431
12.7.7 Serial Data Transmission (Except for Block Transfer Mode)..............................432
12.7.8 Serial Data Reception (Except for Block Transfer Mode) ...................................435
12.7.9 Clock Output Control...........................................................................................436
SCI Select Function (Clocked Synchronous Mode)..........................................................438
Interrupts ...........................................................................................................................440
12.9.1 Interrupts in Normal Serial Communication Interface Mode...............................440
12.9.2 Interrupts in Smart Card Interface Mode .............................................................441
Usage Notes ......................................................................................................................441
12.10.1 Module Stop Mode Setting ..................................................................................441
12.10.2 Break Detection and Processing (Asynchronous Mode Only).............................441
12.10.3 Mark State and Break Detection (Asynchronous Mode Only) ............................442
12.10.4 Receive Error Flags and Transmit Operations
(Clocked Synchronous Mode Only).....................................................................442
12.10.5 Restrictions on Use of DMAC .............................................................................442
12.10.6 Operation in Case of Mode Transition.................................................................443
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12.10.7 Switching from SCK Pin Function to Port Pin Function:.....................................447
Section 13 Boundary Scan Function ..............................................................................449
13.1 Features .............................................................................................................................449
13.2 Pin Configuration ..............................................................................................................451
13.3 Register Descriptions.........................................................................................................452
13.3.1 Instruction Register (INSTR) ...............................................................................452
13.3.2 IDCODE Register (IDCODE) ..............................................................................454
13.3.3 BYPASS Register (BYPASS) ..............................................................................454
13.3.4 Boundary Scan Register (BSCANR)....................................................................454
13.4 Boundary Scan Function Operation ..................................................................................462
13.4.1 TAP Controller .....................................................................................................462
13.5 Usage Notes.......................................................................................................................463
Section 14 Universal Serial Bus (USB).........................................................................465
14.1 Features .............................................................................................................................465
14.2 Input/Output Pins ..............................................................................................................467
14.3 Register Descriptions.........................................................................................................467
14.3.1 USB Control Register (UCTLR) ..........................................................................468
14.3.2 USB DMAC Transfer Request Register (UDMAR) ............................................471
14.3.3 USB Device Resume Register (UDRR) ...............................................................472
14.3.4 USB Trigger Register 0 (UTRG0) .......................................................................473
14.3.5 USB FIFO Clear Register 0 (UFCLR0) ...............................................................475
14.3.6 USB Endpoint Stall Register 0 (UESTL0) ...........................................................476
14.3.7 USB Endpoint Stall Register 1 (UESTL1) ...........................................................477
14.3.8 USB Endpoint Data Register 0s (UEDR0s) .........................................................477
14.3.9 USB Endpoint Data Register 0i (UEDR0i) ..........................................................477
14.3.10 USB Endpoint Data Register 0o (UEDR0o) ........................................................478
14.3.11 USB Endpoint Data Register 3 (UEDR3) ............................................................478
14.3.12 USB Endpoint Data Register 1 (UEDR1) ............................................................478
14.3.13 USB Endpoint Data Register 2 (UEDR2) ............................................................479
14.3.14 USB Endpoint Receive Data Size Register 0o (UESZ0o)....................................479
14.3.15 USB Endpoint Receive Data Size Register 2 (UESZ2)........................................479
14.3.16 USB Interrupt Flag Register 0 (UIFR0) ...............................................................480
14.3.17 USB Interrupt Flag Register 1 (UIFR1) ...............................................................482
14.3.18 USB Interrupt Flag Register 3 (UIFR3) ...............................................................483
14.3.19 USB Interrupt Enable Register 0 (UIER0) ...........................................................484
14.3.20 USB Interrupt Enable Register 1 (UIER1) ...........................................................485
14.3.21 USB Interrupt Enable Register 3 (UIER3) ...........................................................485
14.3.22 USB Interrupt Select Register 0 (UISR0).............................................................486
14.3.23 USB Interrupt Select Register 1 (UISR1).............................................................486
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14.4
14.5
14.6
14.7
14.8
14.3.24 USB Interrupt Select Register 3 (UISR3) ............................................................487
14.3.25 USB Data Status Register (UDSR) ......................................................................487
14.3.26 USB Configuration Value Register (UCVR) .......................................................488
14.3.27 USB Test Register 0 (UTSTR0) ..........................................................................489
14.3.28 USB Test Register 1 (UTSTR1) ..........................................................................490
14.3.29 USB Test Registers 2 and A to F (UTSTR2, UTSTRA to UTSTRF)..................492
14.3.30 Module Stop Control Register B (MSTPCRB)....................................................492
14.3.31 Extended Module Stop Register (EXMDLSTP) ..................................................493
Interrupt Sources ...............................................................................................................494
Communication Operation ................................................................................................497
14.5.1 Initialization .........................................................................................................497
14.5.2 USB Cable Connection/Disconnection ................................................................498
14.5.3 Suspend and Resume Operations .........................................................................502
14.5.4 Control Transfer...................................................................................................506
14.5.5 Interrupt-In Transfer (Endpoint 3) .......................................................................512
14.5.6 Bulk-In Transfer (Dual FIFOs) (Endpoint 1).......................................................513
14.5.7 Bulk-Out Transfer (Dual FIFOs) (Endpoint 2) ....................................................515
14.5.8 Processing of USB Standard Commands and Class/Vendor Commands.............516
14.5.9 Stall Operations....................................................................................................517
DMA Transfer Specifications ...........................................................................................520
14.6.1 DMAC Transfer by USB Request........................................................................520
14.6.2 DMA Transfer by Auto-Request..........................................................................522
USB External Circuit Example .........................................................................................525
Usage Notes ......................................................................................................................527
14.8.1 Emulator Usage Notes .........................................................................................527
14.8.2 Bus Interface ........................................................................................................527
14.8.3 Operating Frequency............................................................................................527
14.8.4 Setup Data Reception...........................................................................................528
14.8.5 FIFO Clear ...........................................................................................................528
14.8.6 IRQ6 Interrupt......................................................................................................528
14.8.7 Data Register Overread or Overwrite ..................................................................528
14.8.8 Reset.....................................................................................................................529
14.8.9 EP0 Interrupt Sources Assignment ......................................................................529
14.8.10 Level Shifter for VBUS and IRQx Pins ...............................................................530
14.8.11 USB Endpoint Data Read and Write....................................................................530
14.8.12 Restrictions on Entering and Canceling Power-Down Mode...............................530
14.8.13 USB External Circuit Example ............................................................................532
14.8.14 Pin Processing when USB Not Used ...................................................................533
14.8.15 Notes on TR Interrupt ..........................................................................................533
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Section 15 A/D Converter .................................................................................................535
15.1 Features .............................................................................................................................535
15.2 Input/Output Pins ..............................................................................................................537
15.3 Register Descriptions.........................................................................................................537
15.3.1 A/D Data Registers A to D (ADDRA to ADDRD) ..............................................538
15.3.2 A/D Control/Status Register (ADCSR) ................................................................538
15.3.3 A/D Control Register (ADCR).............................................................................540
15.4 Interface to Bus Master .....................................................................................................541
15.5 Operation ...........................................................................................................................542
15.5.1 Single Mode .........................................................................................................542
15.5.2 Scan Mode............................................................................................................543
15.5.3 Input Sampling and A/D Conversion Time ..........................................................544
15.5.4 External Trigger Input Timing .............................................................................545
15.6 Interrupts ...........................................................................................................................546
15.7 A/D Conversion Precision Definitions ..............................................................................546
15.8 Usage Notes.......................................................................................................................548
15.8.1 Module Stop Mode Setting...................................................................................548
15.8.2 Permissible Signal Source Impedance..................................................................548
15.8.3 Influences on Absolute Precision .........................................................................548
15.8.4 Range of Analog Power Supply and Other Pin Settings ......................................549
15.8.5 Notes on Board Design.........................................................................................549
Section 16 RAM ...................................................................................................................551
Section 17 Flash Memory (F-ZTAT Version) .............................................................553
17.1
17.2
17.3
17.4
17.5
Features .............................................................................................................................553
Mode Transitions...............................................................................................................554
Block Configuration ..........................................................................................................558
Input/Output Pins ..............................................................................................................560
Register Descriptions.........................................................................................................560
17.5.1 Flash Memory Control Register 1 (FLMCR1) .....................................................561
17.5.2 Flash Memory Control Register 2 (FLMCR2) .....................................................562
17.5.3 Erase Block Register 1 (EBR1) ............................................................................563
17.5.4 Erase Block Register 2 (EBR2) ............................................................................564
17.5.5 RAM Emulation Register (RAMER) ...................................................................565
17.5.6 Serial Control Register X (SCRX) .......................................................................566
17.6 On-Board Programming Modes ........................................................................................567
17.6.1 SCI Boot Mode (HD64F2218, HD64F2212, and HD64F2211)...........................567
17.6.2 USB Boot Mode (HD64F2218U, HD64F2212U, and HD64F2211U).................571
17.6.3 Programming/Erasing in User Program Mode .....................................................576
17.7 Flash Memory Emulation in RAM ....................................................................................577
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17.8 Flash Memory Programming/Erasing ...............................................................................579
17.8.1 Program/Program-Verify .....................................................................................579
17.8.2 Erase/Erase-Verify ...............................................................................................581
17.9 Program/Erase Protection..................................................................................................583
17.9.1 Hardware Protection ............................................................................................583
17.9.2 Software Protection..............................................................................................583
17.9.3 Error Protection....................................................................................................583
17.10 Interrupt Handling when Programming/Erasing Flash Memory .......................................584
17.11 Programmer Mode ............................................................................................................585
17.12 Power-Down States for Flash Memory.............................................................................586
17.13 Flash Memory Programming and Erasing Precautions .....................................................587
17.14 Note on Switching from F-ZTAT Version to Masked ROM Version ..............................592
Section 18 Masked ROM ..................................................................................................593
18.1 Features .............................................................................................................................593
Section 19 Clock Pulse Generator ..................................................................................595
19.1 Register Descriptions ........................................................................................................596
19.1.1 System Clock Control Register (SCKCR) ...........................................................596
19.1.2 Low Power Control Register (LPWRCR)............................................................597
19.2 System Clock Oscillator....................................................................................................600
19.2.1 Connecting a Crystal Resonator...........................................................................600
19.2.2 Inputting External Clock......................................................................................601
19.3 Duty Adjustment Circuit ...................................................................................................602
19.4 Medium-Speed Clock Divider ..........................................................................................602
19.5 Bus Master Clock Selection Circuit ..................................................................................602
19.6 Subclock Oscillator ...........................................................................................................603
19.6.1 Connecting 32.768-kHz Crystal Resonator..........................................................603
19.6.2 Handling Pins when Subclock Not Required .......................................................603
19.7 Subclock Waveform Generation Circuit ...........................................................................604
19.8 PLL Circuit for USB .........................................................................................................604
19.9 Usage Notes ......................................................................................................................605
19.9.1 Note on Crystal Resonator ...................................................................................605
19.9.2 Note on Board Design..........................................................................................605
19.9.3 Note on Switchover of External Clock ................................................................605
Section 20 Power-Down Modes ......................................................................................607
20.1 Register Descriptions ........................................................................................................611
20.1.1 Standby Control Register (SBYCR) ....................................................................611
20.1.2 Timer Control/Status Register (TCSR_1) ............................................................613
20.1.3 Module Stop Control Registers A to C (MSTPCRA to MSTPCRC)...................614
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20.1.4 Extended Module Stop Register (EXMDLSTP) ..................................................617
20.2 Medium-Speed Mode ........................................................................................................617
20.3 Sleep Mode........................................................................................................................618
20.3.1 Transition to Sleep Mode .....................................................................................618
20.3.2 Exiting Sleep Mode ..............................................................................................618
20.4 Software Standby Mode ....................................................................................................619
20.4.1 Transition to Software Standby Mode..................................................................619
20.4.2 Clearing Software Standby Mode ........................................................................619
20.4.3 Setting Oscillation Stabilization Time after Clearing Software Standby Mode ...620
20.4.4 Software Standby Mode Application Example ....................................................620
20.5 Hardware Standby Mode...................................................................................................621
20.5.1 Transition to Hardware Standby Mode ................................................................621
20.5.2 Clearing Hardware Standby Mode .......................................................................621
20.5.3 Hardware Standby Mode Timing .........................................................................622
20.5.4 Hardware Standby Mode Timings........................................................................622
20.6 Module Stop Mode............................................................................................................623
20.7 Watch Mode ......................................................................................................................624
20.7.1 Transition to Watch Mode....................................................................................624
20.7.2 Exiting Watch Mode ............................................................................................624
20.8 Subsleep Mode ..................................................................................................................625
20.8.1 Transition to Sleep Mode .....................................................................................625
20.8.2 Exiting Subsleep Mode ........................................................................................625
20.9 Subactive Mode.................................................................................................................626
20.9.1 Transition to Subactive Mode ..............................................................................626
20.9.2 Exiting Subactive Mode .......................................................................................626
20.10 Direct Transitions ..............................................................................................................627
20.10.1 Direct Transitions from High-Speed Mode to Subactive Mode ...........................627
20.10.2 Direct Transitions from Subactive Mode to High-Speed Mode ...........................627
20.11 φ Clock Output Disabling Function...................................................................................627
20.12 Usage Notes.......................................................................................................................628
20.12.1 I/O Port Status ......................................................................................................628
20.12.2 Current Dissipation during Oscillation Stabilization Wait Period........................628
20.12.3 Flash Memory Module Stop.................................................................................628
20.12.4 DMAC Module Stop ............................................................................................628
20.12.5 On-Chip Peripheral Module Interrupt ..................................................................628
20.12.6 Entering Subactive/Watch Mode and DMAC and DTC Module Stop.................629
20.12.7 Writing to MSTPCR.............................................................................................629
Section 21 List of Registers ..............................................................................................631
21.1 Register Addresses (Address Order) .................................................................................632
21.2 Register Bits ......................................................................................................................640
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21.3 Register States in Each Operating Mode...........................................................................649
Section 22 Electrical Characteristics..............................................................................657
22.1
22.2
22.3
22.4
22.5
22.6
22.7
22.8
Absolute Maximum Ratings .............................................................................................657
Power Supply Voltage and Operating Frequency Range ..................................................658
DC Characteristics ............................................................................................................659
AC Characteristics ............................................................................................................663
22.4.1 Clock Timing .......................................................................................................664
22.4.2 Control Signal Timing .........................................................................................666
22.4.3 Bus Timing ..........................................................................................................668
22.4.4 Timing of On-Chip Supporting Modules .............................................................675
USB Characteristics ..........................................................................................................680
A/D Conversion Characteristics........................................................................................682
Flash Memory Characteristics...........................................................................................683
Usage Note........................................................................................................................684
Appendix
A.
B.
C.
.............................................................................................................................685
I/O Port States in Each Processing State ...........................................................................685
Product Model Lineup ......................................................................................................689
Package Dimensions .........................................................................................................691
Index
.............................................................................................................................695
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Figures
Section 1 Overview
Figure 1.1 Internal Block Diagram of HD64F2218 and HD64F2218U ..................................3
Figure 1.2 Internal Block Diagram of HD6432217 .................................................................4
Figure 1.3 Internal Block Diagram of HD64F2212, HD64F2212U, HD64F2211, and
HD64F2211U .........................................................................................................5
Figure 1.4 Internal Block Diagram of HD6432211, HD6432210 and HD6432210S..............6
Figure 1.5 Pin Arrangements of HD64F2218 and HD64F2218U (TFP-100G, TFP-100GV) .7
Figure 1.6 Pin Arrangements of HD64F2218 and HD64F2218U (BP-112, BP-112V)...........8
Figure 1.7 Pin Arrangements of HD6432217 (TFP-100G, TFP-100GV)................................9
Figure 1.8 Pin Arrangements of HD6432217 (BP-112, BP-112V) .........................................10
Figure 1.9 Pin Arrangements of HD64F2212, HD64F2212U, HD64F2211,
and HD64F2211U (FP-64E, FP-64EV)..................................................................11
Figure 1.10 Pin Arrangements of HD6432211, HD6432210 and HD6432210S
(FP-64E, FP-64EV) ................................................................................................12
Figure 1.11 Pin Arrangements of HD64F2212, HD64F2212U, HD64F2211,
and HD64F2211U (TNP-64B, TNP-64BV)...........................................................13
Figure 1.12 Pin Arrangements of HD6432211, HD6432210 and HD6432210S
(TNP-64B, TNP-64BV) .........................................................................................14
Section 2 CPU
Figure 2.1 Exception Vector Table (Normal Mode)................................................................35
Figure 2.2 Stack Structure in Normal Mode............................................................................35
Figure 2.3 Exception Vector Table (Advanced Mode)............................................................36
Figure 2.4 Stack Structure in Advanced Mode........................................................................37
Figure 2.5 Memory Map..........................................................................................................38
Figure 2.6 CPU Registers ........................................................................................................39
Figure 2.7 Usage of General Registers ....................................................................................40
Figure 2.8 Stack .......................................................................................................................41
Figure 2.9 General Register Data Formats (1).........................................................................44
Figure 2.9 General Register Data Formats (2).........................................................................44
Figure 2.10 Memory Data Formats............................................................................................45
Figure 2.11 Instruction Formats (Examples) .............................................................................57
Figure 2.12 Branch Address Specification in Memory Indirect Mode ......................................61
Figure 2.13 State Transitions .....................................................................................................65
Figure 2.14 Flowchart of Method for Accessing Registers Containing Write-Only Bits ..........69
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Section 3 MCU Operating Modes
Figure 3.1 Memory Map in Each Operating Mode for HD64F2218 and HD64F2218U .........77
Figure 3.2 Memory Map in Each Operating Mode for HD6432217........................................78
Figure 3.3 Memory Map in Each Operating Mode for HD64F2212, HD64F2212U,
HD64F2211, HD64F2211U, HD6432211, HD6432210, HD6432210S and
HD6432210S ..........................................................................................................79
Section 4 Exception Handling
Figure 4.1 Reset Sequence (Mode 4) .......................................................................................85
Figure 4.2 Reset Sequence (Modes 6 and 7) ............................................................................86
Figure 4.3 Stack Status after Exception Handling ...................................................................89
Figure 4.4 Operation when SP Value Is Odd ...........................................................................90
Section 5 Interrupt Controller
Figure 5.1 Block Diagram of Interrupt Controller ...................................................................92
Figure 5.2 Block Diagram of Interrupts IRQn .........................................................................99
Figure 5.3 Timing of Setting IRQnF........................................................................................100
Figure 5.4 Flowchart of Procedure Up to Interrupt Acceptance in Interrupt Control
Mode 0....................................................................................................................104
Figure 5.5 Flowchart of Procedure Up to Interrupt Acceptance in Interrupt Control
Mode 2....................................................................................................................106
Figure 5.6 Interrupt Exception Handling .................................................................................107
Figure 5.7 Interrupt Control for DMAC...................................................................................110
Figure 5.8 Contention between Interrupt Generation and Disabling........................................112
Section 6 Bus Controller
Figure 6.1 Block Diagram of Bus Controller ...........................................................................116
Figure 6.2 Overview of Area Divisions ...................................................................................127
Figure 6.3 CSn Signal Output Timing (n = 0 to 5)...................................................................130
Figure 6.4 On-Chip Memory Access Cycle .............................................................................131
Figure 6.5 Pin States during On-Chip Memory Access ...........................................................132
Figure 6.6 On-Chip Peripheral Module Access Cycle .............................................................132
Figure 6.7 Pin States during On-Chip Peripheral Module Access ...........................................133
Figure 6.8 Access Sizes and Data Alignment Control (8-Bit Access Space)...........................134
Figure 6.9 Access Sizes and Data Alignment Control (16-Bit Access Space).........................135
Figure 6.10 Bus Timing for 8-Bit 2-State Access Space............................................................136
Figure 6.11 Bus Timing for 8-Bit 3-State Access Space (Except Area 6) .................................137
Figure 6.12 Bus Timing for Area 6 and RTC.............................................................................138
Figure 6.13 Bus Timing for 16-Bit 2-State Access Space (1) (Even Address Byte Access) .....139
Figure 6.14 Bus Timing for 16-Bit 2-State Access Space (2) (Odd Address Byte Access).......140
Figure 6.15 Bus Timing for 16-Bit 2-State Access Space (3) (Word Access) ...........................141
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Figure 6.16
Figure 6.17
Figure 6.18
Figure 6.19
Figure 6.20
Figure 6.21
Figure 6.22
Figure 6.23
Figure 6.24
Figure 6.25
Bus Timing for 16-Bit 3-State Access Space (1) (Even Address Byte Access) .....142
Bus Timing for 16-Bit 3-State Access Space (2) (Odd Address Byte Access) ......143
Bus Timing for 16-Bit 3-State Access Space (3) (Word Access)...........................144
Example of Wait State Insertion Timing ................................................................146
Example of Burst ROM Access Timing (When AST0 = BRSTS1 = 1).................148
Example of Burst ROM Access Timing (When AST0 = BRSTS1 = 0).................148
Example of Idle Cycle Operation (1) .....................................................................150
Example of Idle Cycle Operation (2) .....................................................................151
Relationship between Chip Select (CS) and Read (RD).........................................152
Bus-Released State Transition Timing ...................................................................154
Section 7 DMA Controller (DMAC)
Figure 7.1 Block Diagram of DMAC ......................................................................................158
Figure 7.2 Operation in Sequential Mode................................................................................179
Figure 7.3 Example of Sequential Mode Setting Procedure ....................................................180
Figure 7.4 Operation in Idle Mode ..........................................................................................181
Figure 7.5 Example of Idle Mode Setting Procedure...............................................................182
Figure 7.6 Operation in Repeat mode ......................................................................................184
Figure 7.7 Example of Repeat Mode Setting Procedure..........................................................185
Figure 7.8 Operation in Normal Mode ....................................................................................187
Figure 7.9 Example of Normal Mode Setting Procedure.........................................................188
Figure 7.10 Operation in Block Transfer Mode (BLKDIR = 0) ................................................190
Figure 7.11 Operation in Block Transfer Mode (BLKDIR = 1) ................................................191
Figure 7.12 Operation Flow in Block Transfer Mode ...............................................................192
Figure 7.13 Example of Block Transfer Mode Setting Procedure.............................................193
Figure 7.14 Example of DMA Transfer Bus Timing.................................................................196
Figure 7.15 Example of Short Address Mode Transfer .............................................................197
Figure 7.16 Example of Full Address Mode (Cycle Steal) Transfer .........................................198
Figure 7.17 Example of Full Address Mode (Burst Mode) Transfer.........................................199
Figure 7.18 Example of Full Address Mode (Block Transfer Mode) Transfer .........................200
Figure 7.19 Example of DREQ Level Activated Normal Mode Transfer .................................201
Figure 7.20 Example of Multi-Channel Transfer ......................................................................202
Figure 7.21 Example of Procedure for Continuing Transfer on Channel Interrupted
by NMI Interrupt ....................................................................................................204
Figure 7.22 Example of Procedure for Forcibly Terminating DMAC Operation......................204
Figure 7.23 Example of Procedure for Clearing Full Address Mode ........................................205
Figure 7.24 Block Diagram of Transfer End/Transfer Break Interrupt .....................................206
Figure 7.25 DMAC Register Update Timing ............................................................................207
Figure 7.26 Contention between DMAC Register Update and CPU Read................................208
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Section 9 16-Bit Timer Pulse Unit (TPU)
Figure 9.1 Block Diagram of TPU...........................................................................................274
Figure 9.2 16-Bit Register Access Operation [Bus Master ↔ TCNT (16 Bits)] .....................299
Figure 9.3 8-Bit Register Access Operation [Bus Master ↔ TCR (Upper 8 Bits)] .................300
Figure 9.4 8-Bit Register Access Operation [Bus Master ↔ TMDR (Lower 8 Bits)].............300
Figure 9.5 8-Bit Register Access Operation [Bus Master ↔ TCR and TMDR (16 Bits)].......300
Figure 9.6 Example of Counter Operation Setting Procedure..................................................301
Figure 9.7 Free-Running Counter Operation ...........................................................................302
Figure 9.8 Periodic Counter Operation ....................................................................................303
Figure 9.9 Example of Setting Procedure for Waveform Output by Compare Match .............303
Figure 9.10 Example of 0 Output/1 Output Operation...............................................................304
Figure 9.11 Example of Toggle Output Operation.....................................................................304
Figure 9.12 Example of Input Capture Operation Setting Procedure.........................................305
Figure 9.13 Example of Input Capture Operation......................................................................306
Figure 9.14 Example of Synchronous Operation Setting Procedure..........................................307
Figure 9.15 Example of Synchronous Operation .......................................................................308
Figure 9.16 Compare Match Buffer Operation ..........................................................................309
Figure 9.17 Input Capture Buffer Operation ..............................................................................309
Figure 9.18 Example of Buffer Operation Setting Procedure ....................................................310
Figure 9.19 Example of Buffer Operation (1)............................................................................311
Figure 9.20 Example of Buffer Operation (2)............................................................................312
Figure 9.21 Example of PWM Mode Setting Procedure............................................................314
Figure 9.22 Example of PWM Mode Operation (1) ..................................................................315
Figure 9.23 Example of PWM Mode Operation (2) ..................................................................315
Figure 9.24 Example of PWM Mode Operation (3) ..................................................................316
Figure 9.25 Example of Phase Counting Mode Setting Procedure ............................................317
Figure 9.26 Example of Phase Counting Mode 1 Operation......................................................318
Figure 9.27 Example of Phase Counting Mode 2 Operation......................................................319
Figure 9.28 Example of Phase Counting Mode 3 Operation......................................................320
Figure 9.29 Example of Phase Counting Mode 4 Operation......................................................321
Figure 9.30 Count Timing in Internal Clock Operation .............................................................324
Figure 9.31 Count Timing in External Clock Operation............................................................324
Figure 9.32 Output Compare Output Timing.............................................................................325
Figure 9.33 Input Capture Input Signal Timing .........................................................................325
Figure 9.34 Counter Clear Timing (Compare Match)................................................................326
Figure 9.35 Counter Clear Timing (Input Capture) ...................................................................326
Figure 9.36 Buffer Operation Timing (Compare Match) ...........................................................327
Figure 9.37 Buffer Operation Timing (Input Capture)...............................................................327
Figure 9.38 TGI Interrupt Timing (Compare Match).................................................................328
Figure 9.39 TGI Interrupt Timing (Input Capture) ....................................................................328
Figure 9.40 TCIV Interrupt Setting Timing ...............................................................................329
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Figure 9.41
Figure 9.42
Figure 9.43
Figure 9.44
Figure 9.45
Figure 9.46
Figure 9.47
Figure 9.48
Figure 9.49
Figure 9.50
Figure 9.51
Figure 9.52
Figure 9.53
TCIU Interrupt Setting Timing...............................................................................329
Timing for Status Flag Clearing by CPU ...............................................................330
Timing for Status Flag Clearing by DMAC Activation .........................................330
Phase Difference, Overlap, and Pulse Width in Phase Counting Mode .................331
Contention between TCNT Write and Clear Operations........................................332
Contention between TCNT Write and Increment Operations ................................332
Contention between TGR Write and Compare Match............................................333
Contention between Buffer Register Write and Compare Match...........................334
Contention between TGR Read and Input Capture ................................................334
Contention between TGR Write and Input Capture ...............................................335
Contention between Buffer Register Write and Input Capture...............................336
Contention between Overflow and Counter Clearing.............................................336
Contention between TCNT Write and Overflow....................................................337
Section 10
Figure 10.1
Figure 10.2
Figure 10.3
Figure 10.4
Figure 10.5
Figure 10.6
Figure 10.7
Figure 10.8
Watchdog Timer (WDT)
Block Diagram of WDT .........................................................................................340
Operation in Watchdog Timer Mode......................................................................343
Timing of WOVF Setting.......................................................................................344
Operation in Interval Timer Mode..........................................................................344
Timing of OVF Setting...........................................................................................345
Format of Data Written to TCNT and TCSR .........................................................346
Format of Data Written to RSTCSR (Example of WDT0) ....................................347
Contention between TCNT Write and Increment...................................................347
Section 11
Figure 11.1
Figure 11.2
Figure 11.3
Figure 11.4
Figure 11.5
Figure 11.6
Realtime Clock (RTC)
Block Diagram of RTC ..........................................................................................349
Definition of Time Expression ...............................................................................354
Initial Setting Procedure.........................................................................................358
Example: Reading of Inaccurate Time Data...........................................................359
Initializing Procedure in Using RTC Interrupt .......................................................361
Example of RTC Interrupt Handling Routine ........................................................361
Section 12
Figure 12.1
Figure 12.2
Figure 12.3
Figure 12.3
Figure 12.3
Figure 12.4
Figure 12.4
Figure 12.4
Serial Communication Interface
Block Diagram of SCI_0 ........................................................................................365
Block Diagram of SCI_2 ........................................................................................366
Examples of Base Clock when Average Transfer Rate Is Selected (1) ..................388
Examples of Base Clock when Average Transfer Rate Is Selected (2) ..................389
Examples of Base Clock when Average Transfer Rate Is Selected (3) ..................390
Example of Average Transfer Rate Setting when TPU Clock Is Input (1)............391
Example of Average Transfer Rate Setting when TPU Clock Is Input (2)............392
Example of Average Transfer Rate Setting when TPU Clock Is Input (3)............393
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Figure 12.4 Example of Average Transfer Rate Setting when TPU Clock Is Input (4) ............394
Figure 12.5 Data Format in Asynchronous Communication
(Example with 8-Bit Data, Parity, Two Stop Bits) .................................................403
Figure 12.6 Receive Data Sampling Timing in Asynchronous Mode........................................405
Figure 12.7 Relationship between Output Clock and Transfer Data Phase
(Asynchronous Mode) ............................................................................................406
Figure 12.8 Sample SCI Initialization Flowchart.......................................................................407
Figure 12.9 Example of Operation in Transmission in Asynchronous Mode
(Example with 8-Bit Data, Parity, One Stop Bit) ...................................................408
Figure 12.10 Sample Serial Data Transmission Flowchart ..........................................................409
Figure 12.11 Example of SCI Operation in Reception
(Example with 8-Bit Data, Parity, One Stop Bit) ...................................................410
Figure 12.12 Sample Serial Data Reception Flowchart (1)..........................................................411
Figure 12.12 Sample Serial Data Reception Flowchart (2)..........................................................412
Figure 12.13 Example of Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A)............................................414
Figure 12.14 Sample Multiprocessor Serial Data Transmission Flowchart .................................415
Figure 12.15 Example of SCI Operation in Reception
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit) ...............................416
Figure 12.16 Sample Multiprocessor Serial Data Reception Flowchart (1).................................417
Figure 12.16 Sample Multiprocessor Serial Data Reception Flowchart (2).................................418
Figure 12.17 Data Format in Synchronous Communication (For LSB-First)..............................419
Figure 12.18 Sample SCI Initialization Flowchart.......................................................................420
Figure 12.19 Sample SCI Transmission Operation in Clocked Synchronous Mode....................422
Figure 12.20 Sample Serial Data Transmission Flowchart ..........................................................423
Figure 12.21 Example of SCI Operation in Reception ................................................................424
Figure 12.22 Sample Serial Data Reception Flowchart ...............................................................425
Figure 12.23 Sample Flowchart of Simultaneous Serial Data Transmit
and Receive Operations ..........................................................................................426
Figure 12.24 Schematic Diagram of Smart Card Interface Pin Connections ...............................427
Figure 12.25 Normal Smart Card Interface Data Format.............................................................428
Figure 12.26 Direct Convention (SDIR = SINV = O/E = 0)........................................................428
Figure 12.27 Inverse Convention (SDIR = SINV = O/E = 1) ......................................................429
Figure 12.28 Receive Data Sampling Timing in Smart Card Mode
(Using Clock of 372 Times the Transfer Rate).......................................................430
Figure 12.29 Retransfer Operation in SCI Transmit Mode..........................................................433
Figure 12.30 TEND Flag Generation Timing in Transmission Operation...................................433
Figure 12.31 Example of Transmission Processing Flow ...........................................................434
Figure 12.32 Retransfer Operation in SCI Receive Mode ...........................................................435
Figure 12.33 Example of Reception Processing Flow .................................................................436
Figure 12.34 Timing for Fixing Clock Output Level ...................................................................436
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Figure 12.35 Clock Halt and Restart Procedure ..........................................................................437
Figure 12.36 Example of Communication Using the SCI Select Function .................................438
Figure 12.37 Example of Communication Using the SCI Select Function .................................439
Figure 12.38 Example of Clocked Synchronous Transmission by DMAC .................................442
Figure 12.39 Sample Flowchart for Mode Transition during Transmission................................444
Figure 12.40 Port Pin State of Asynchronous Transmission Using Internal Clock .....................444
Figure 12.41 Port Pin State of Synchronous Transmission Using Internal Clock .......................445
Figure 12.42 Sample Flowchart for Mode Transition during Reception .....................................446
Figure 12.43 Operation when Switching from SCK Pin Function to Port Pin Function .............447
Figure 12.44 Operation when Switching from SCK Pin Function to Port Pin Function
(Example of Preventing Low-Level Output) ..........................................................448
Section 13
Figure 13.1
Figure 13.2
Figure 13.3
Figure 13.4
Figure 13.5
Boundary Scan Function
Block Diagram of Boundary Scan Function...........................................................450
Boundary Scan Register Configuration..................................................................455
TAP Controller Status Transition ...........................................................................462
Recommended Reset Signal Design.......................................................................463
Serial Data Input/Output ........................................................................................463
Section 14
Figure 14.1
Figure 14.2
Figure 14.3
Universal Serial Bus (USB)
Block Diagram of USB ..........................................................................................466
USB Initialization...................................................................................................497
USB Cable Connection
(When USB Module Stop or Power-Down Mode Is not Used) .............................498
Figure 14.4 USB Cable Connection
(When USB Module Stop or Power-Down Mode Is Used)....................................499
Figure 14.5 USB Cable Disconnection
(When USB Module Stop or Power-Down Mode Is not Used) .............................500
Figure 14.6 USB Cable Disconnection
(When USB Module Stop or Power-Down Mode Is Used)....................................501
Figure 14.7 Example Flowchart of Suspend and Resume Operations.......................................502
Figure 14.8 Example Flowchart of Suspend and Resume Interrupt Processing ........................503
Figure 14.9 Example Flowchart of Suspend and Remote-Wakeup Operations.........................504
Figure 14.10 Example Flowchart of Remote-Wakeup Interrupt Processing ...............................505
Figure 14.11 Control Transfer Stage Configuration ....................................................................506
Figure 14.12 Setup Stage Operation ............................................................................................507
Figure 14.13 Data Stage Operation (Control-In) .........................................................................508
Figure 14.14 Data Stage Operation (Control-Out) ......................................................................509
Figure 14.15 Status Stage Operation (Control-In) .......................................................................510
Figure 14.16 Status Stage Operation (Control-Out) ....................................................................511
Figure 14.17 EP3 Interrupt-In Transfer Operation ......................................................................512
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Figure 14.18 EP1 Bulk-In Transfer Operation.............................................................................514
Figure 14.19 EP2 Bulk-Out Transfer Operation ..........................................................................515
Figure 14.20 Forcible Stall by Firmware .....................................................................................518
Figure 14.21 Automatic Stall by USB Function Module .............................................................519
Figure 14.22 EP1PKTE Operation in UTRG0.............................................................................521
Figure 14.23 EP2RDFN Operation in UTRG0 ............................................................................522
Figure 14.24 EP1PKTE Operation in UTRG0 (Auto-Request) ...................................................523
Figure 14.25 EP2RDFN Operation in UTRG0 (Auto-Request)...................................................524
Figure 14.26 USB External Circuit in Bus-Powered Mode .........................................................525
Figure 14.27 USB External Circuit in Self-Powered Mode .........................................................526
Figure 14.28 Flowchart ................................................................................................................531
Figure 14.29 Timing Chart...........................................................................................................532
Figure 14.30 TR Interrupt Flag Set Timing .................................................................................533
Section 15 A/D Converter
Figure 15.1 Block Diagram of A/D Converter...........................................................................536
Figure 15.2 Access to ADDR (When Reading H'AA40) ...........................................................541
Figure 15.3 A/D Conversion Timing (Single-Chip Mode, Channel 1 Selected)........................542
Figure 15.4 A/D Conversion Timing (Scan Mode, Channels AN0 to AN2 Selected) ...............543
Figure 15.5 A/D Conversion Timing .........................................................................................544
Figure 15.6 External Trigger Input Timing................................................................................545
Figure 15.7 A/D Conversion Precision Definitions (1)..............................................................547
Figure 15.8 A/D Conversion Precision Definitions (2)..............................................................547
Figure 15.9 Example of Analog Input Circuit............................................................................548
Figure 15.10 Analog Input Pin Equivalent Circuit.......................................................................549
Section 17
Figure 17.1
Figure 17.2
Figure 17.3
Figure 17.4
Figure 17.5
Flash Memory (F-ZTAT Version)
Block Diagram of Flash Memory ...........................................................................554
Flash Memory State Transitions .............................................................................555
Boot Mode (Sample)...............................................................................................556
User Program Mode (Sample) ................................................................................557
Flash Memory Block Configuration
(HD64F2218, HD64F2218U, HD64F2212, HD64F2212U) ..................................558
Figure 17.6 Flash Memory Block Configuration (HD64F2211, HD64F2211U) .......................559
Figure 17.7 System Configuration in SCI Boot Mode...............................................................568
Figure 17.8 System Configuration Diagram when Using USB Boot Mode...............................572
Figure 17.9 Programming/Erasing Flowchart Example in User Program Mode .......................576
Figure 17.10 Flowchart for Flash Memory Emulation in RAM ..................................................577
Figure 17.11 Example of RAM Overlap Operation .....................................................................578
Figure 17.12 Program/Program-Verify Flowchart .......................................................................580
Figure 17.13 Erase/Erase-Verify Flowchart.................................................................................582
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Figure 17.14 Memory Map in Programmer Mode.......................................................................585
Figure 17.15 Power-On/Off Timing (Boot Mode).......................................................................589
Figure 17.16 Power-On/Off Timing (User Program Mode) ........................................................590
Figure 17.17 Mode Transition Timing
(Example: Boot Mode → User Mode ↔ User Program Mode).............................591
Section 18 Masked ROM
Figure 18.1 Block Diagram of On-Chip Masked ROM (64 kbytes)..........................................593
Section 19 Clock Pulse Generator
Figure 19.1 Block Diagram of Clock Pulse Generator ..............................................................595
Figure 19.2 Connection of Crystal Resonator (Example)..........................................................600
Figure 19.3 Crystal Resonator Equivalent Circuit .....................................................................600
Figure 19.4 External Clock Input (Examples) ...........................................................................601
Figure 19.5 External Clock Input Timing..................................................................................602
Figure 19.6 Example Connection of 32.768-kHz Quartz Oscillator..........................................603
Figure 19.7 Equivalence Circuit for 32.768-kHz Oscillator ......................................................603
Figure 19.8 Pin Handling when Subclock Not Required...........................................................603
Figure 19.9 Example of PLL Circuit .........................................................................................604
Figure 19.10 Note on Board Design of Oscillator Circuit ...........................................................605
Figure 19.11 Example of External Clock Switching Circuit .......................................................606
Figure 19.12 Example of External Clock Switchover Timing.....................................................606
Section 20
Figure 20.1
Figure 20.2
Figure 20.3
Figure 20.4
Figure 20.5
Figure 20.6
Figure 20.7
Power-Down Modes
Mode Transition Diagram ......................................................................................609
Example of Flash Memory Module Stop Mode Usage ..........................................616
Medium-Speed Mode Transition and Clearance Timing .......................................618
Software Standby Mode Application Example ......................................................621
Hardware Standby Mode Timing (Example) .........................................................622
Timing of Transition to Hardware Standby Mode .................................................622
Timing of Recovery from Hardware Standby Mode ..............................................623
Section 22
Figure 22.1
Figure 22.2
Figure 22.3
Figure 22.4
Figure 22.5
Figure 22.6
Figure 22.7
Figure 22.8
Electrical Characteristics
Power Supply Voltage and Operating Ranges........................................................658
Output Load Circuit................................................................................................ 663
System Clock Timing.............................................................................................665
Oscillation Stabilization Timing.............................................................................665
Reset Input Timing.................................................................................................667
Interrupt Input Timing............................................................................................667
Basic Bus Timing (Two-State Access)...................................................................670
Basic Bus Timing (Three-State Access).................................................................671
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Figure 22.9 Basic Bus Timing (Three-State Access with One Wait State)................................672
Figure 22.10 Burst ROM Access Timing (Two-State Access) ....................................................673
Figure 22.11 External Bus Release Timing .................................................................................674
Figure 22.12 I/O Port Input/Output Timing .................................................................................677
Figure 22.13 TPU Input/Output Timing ......................................................................................677
Figure 22.14 TPU Clock Input Timing ........................................................................................677
Figure 22.15 SCK Clock Input Timing........................................................................................678
Figure 22.16 SCI Input/Output Timing (Clock Synchronous Mode)...........................................678
Figure 22.17 A/D Converter External Trigger Input Timing .......................................................678
Figure 22.18 Boundary Scan TCK Input Timing.........................................................................678
Figure 22.19 Boundary Scan TRST Input Timing (At Reset Hold).............................................678
Figure 22.20 Boundary Scan Data Transmission Timing ............................................................679
Figure 22.21 Data Signal Timing.................................................................................................681
Figure 22.22 Test Load Circuit ....................................................................................................681
Appendix
Figure C.1
Figure C.2
Figure C.3
Figure C.4
TFP-100G and TFP-100GV Package Dimensions .................................................691
BP-112 and BP-112V Package Dimensions ...........................................................692
FP-64E and FP-64EV Package Dimensions ...........................................................693
TNP-64B and TNP-64BV Package Dimensions ....................................................694
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Tables
Section 1 Overview
Table 1.1
Pin Functions in Each Operating Mode for H8S/2218 Group................................15
Table 1.2
Pin Functions in Each Operating Mode for H8S/2212 Group................................18
Section 2 CPU
Table 2.1
Instruction Classification........................................................................................46
Table 2.2
Operation Notation .................................................................................................47
Table 2.3
Data Transfer Instructions ......................................................................................48
Table 2.4
Arithmetic Operations Instructions ........................................................................49
Table 2.5
Logic Operations Instructions ................................................................................50
Table 2.6
Shift Instructions ....................................................................................................51
Table 2.7
Bit Manipulation Instructions.................................................................................52
Table 2.8
Branch Instructions.................................................................................................54
Table 2.9
System Control Instruction.....................................................................................55
Table 2.10 Block Data Transfer Instruction .............................................................................56
Table 2.11 Addressing Modes..................................................................................................58
Table 2.12 Absolute Address Access Ranges ..........................................................................60
Table 2.13 Effective Address Calculation ................................................................................62
Section 3 MCU Operating Modes
Table 3.1
MCU Operating Mode Selection............................................................................71
Table 3.2
Pin Functions in Each Operating Mode..................................................................76
Section 4 Exception Handling
Table 4.1
Exception Types and Priority .................................................................................81
Table 4.2
Exception Handling Vector Table ..........................................................................82
Table 4.3
Reset Types ............................................................................................................84
Table 4.4
Status of CCR and EXR after Trace Exception Handling ......................................87
Table 4.5
Status of CCR and EXR after Trap Instruction Exception Handling .....................88
Section 5 Interrupt Controller
Table 5.1
Pin Configuration ...................................................................................................93
Table 5.2
Interrupt Sources, Vector Addresses, and Interrupt Priorities ................................101
Table 5.3
Interrupt Control Modes .........................................................................................103
Table 5.4
Interrupt Response Times.......................................................................................108
Table 5.5
Number of States in Interrupt Handling Routine Execution Statuses.....................109
Table 5.6
Interrupt Source Selection and Clearing Control....................................................111
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Section 6 Bus Controller
Table 6.1
Pin Configuration....................................................................................................117
Table 6.2
Bus Specifications for Each Area (Basic Bus Interface) ........................................129
Table 6.3
Data Buses Used and Valid Strobes........................................................................135
Table 6.4
Pin States in Idle Cycle...........................................................................................152
Table 6.5
Pin States in Bus Released State.............................................................................153
Section 7 DMA Controller (DMAC)
Table 7.1
Short Address Mode and Full Address Mode
(For 1 Channel: Example of Channel 0) .................................................................160
Table 7.2
DMAC Transfer Modes ..........................................................................................177
Table 7.3
Register Functions in Sequential Mode ..................................................................178
Table 7.4
Register Functions in Idle Mode.............................................................................181
Table 7.5
Register Functions in Repeat Mode........................................................................183
Table 7.6
Register Functions in Normal Mode.......................................................................186
Table 7.7
Register Functions in Block Transfer Mode ...........................................................189
Table 7.8
DMAC Activation Sources .....................................................................................194
Table 7.9
DMAC Channel Priority Order...............................................................................202
Table 7.10 Interrupt Source Priority Order...............................................................................206
Section 8 I/O Ports
Table 8.1
Port Functions of H8S/2218 Group ........................................................................211
Table 8.2
Port Functions of H8S/2212 Group ........................................................................214
Table 8.3
P17 Pin Function.....................................................................................................218
Table 8.4
P16 Pin Function.....................................................................................................218
Table 8.5
P15 Pin Function.....................................................................................................218
Table 8.6
P14 Pin Function.....................................................................................................219
Table 8.7
P13 Pin Function.....................................................................................................219
Table 8.8
P12 Pin Function.....................................................................................................219
Table 8.9
P11 Pin Function.....................................................................................................220
Table 8.10 P10 Pin Function.....................................................................................................220
Table 8.11 P17 Pin Function.....................................................................................................220
Table 8.12 P16 Pin Function.....................................................................................................221
Table 8.13 P15 Pin Function.....................................................................................................221
Table 8.14 P14 Pin Function.....................................................................................................221
Table 8.15 P13 Pin Function.....................................................................................................222
Table 8.16 P12 Pin Function.....................................................................................................222
Table 8.17 P11 Pin Function.....................................................................................................222
Table 8.18 P10 Pin Function.....................................................................................................222
Table 8.19 P36 Pin Function.....................................................................................................225
Table 8.20 P32 Pin Function.....................................................................................................226
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Table 8.21
Table 8.22
Table 8.23
Table 8.24
Table 8.25
Table 8.26
Table 8.27
Table 8.28
Table 8.29
Table 8.30
Table 8.31
Table 8.32
Table 8.33
Table 8.34
Table 8.35
Table 8.36
Table 8.37
Table 8.38
Table 8.39
Table 8.40
Table 8.41
Table 8.42
Table 8.43
Table 8.44
Table 8.45
Table 8.46
Table 8.47
Table 8.48
Table 8.49
Table 8.50
Table 8.51
Table 8.52
Table 8.53
Table 8.54
Table 8.55
Table 8.56
Table 8.57
Table 8.58
Table 8.59
Table 8.60
Table 8.61
P31 Pin Function ....................................................................................................226
P30 Pin Function ....................................................................................................226
P74 Pin Function ....................................................................................................231
P71 Pin Function ....................................................................................................231
P70 Pin Function ....................................................................................................231
P77 Pin Function ....................................................................................................231
P76 Pin Function ....................................................................................................232
P75 Pin Function ....................................................................................................232
PA3 Pin Function ...................................................................................................236
PA2 Pin Function ...................................................................................................236
PA1 Pin Function ...................................................................................................237
PA0 Pin Function ...................................................................................................237
PA3 Pin Function ...................................................................................................237
PA2 Pin Function ...................................................................................................238
PA1 Pin Function ...................................................................................................238
Input Pull-Up MOS States (Port A)........................................................................238
PB7 Pin Function ...................................................................................................242
PB6 Pin Function ...................................................................................................242
PB5 Pin Function ...................................................................................................242
PB4 Pin Function ...................................................................................................243
PB3 Pin Function ...................................................................................................243
PB2 Pin Function ...................................................................................................243
PB1 Pin Function ...................................................................................................243
PB0 Pin Function ...................................................................................................244
Input Pull-Up MOS States (Port B)........................................................................244
PC7 Pin Function ...................................................................................................247
PC6 Pin Function ...................................................................................................247
PC5 Pin Function ...................................................................................................248
PC4 Pin Function ...................................................................................................248
PC3 Pin Function ...................................................................................................248
PC2 Pin Function ...................................................................................................248
PC1 Pin Function ...................................................................................................248
PC0 Pin Function ...................................................................................................249
Input Pull-Up MOS States (Port C)........................................................................249
PD7 Pin Function ...................................................................................................252
PD6 Pin Function ...................................................................................................252
PD5 Pin Function ...................................................................................................252
PD4 Pin Function ...................................................................................................253
PD3 Pin Function ...................................................................................................253
PD2 Pin Function ...................................................................................................253
PD1 Pin Function ...................................................................................................253
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Table 8.62
Table 8.63
Table 8.64
Table 8.65
Table 8.66
Table 8.67
Table 8.68
Table 8.69
Table 8.70
Table 8.71
Table 8.72
Table 8.73
Table 8.74
Table 8.75
Table 8.76
Table 8.77
Table 8.78
Table 8.79
Table 8.80
Table 8.81
Table 8.82
Table 8.83
Table 8.84
Table 8.85
Table 8.86
Table 8.87
Table 8.88
Table 8.89
Table 8.90
Table 8.91
Table 8.92
Table 8.93
Table 8.94
Table 8.95
Table 8.96
Table 8.97
Table 8.98
PD0 Pin Function....................................................................................................253
Input Pull-Up MOS States (Port D) ........................................................................254
PE7 Pin Function ....................................................................................................257
PE6 Pin Function ....................................................................................................257
PE5 Pin Function ....................................................................................................258
PE4 Pin Function ....................................................................................................258
PE3 Pin Function ....................................................................................................258
PE2 Pin Function ....................................................................................................258
PE1 Pin Function ....................................................................................................259
PE0 Pin Function ....................................................................................................259
PE7 Pin Function ....................................................................................................259
PE6 Pin Function ....................................................................................................259
PE5 Pin Function ....................................................................................................259
PE4 Pin Function ....................................................................................................260
PE3 Pin Function ....................................................................................................260
PE2 Pin Function ....................................................................................................260
PE1 Pin Function ....................................................................................................260
PE0 Pin Function ....................................................................................................260
Input Pull-Up MOS States (Port E) ........................................................................261
PF7 Pin Function ....................................................................................................264
PF6 Pin Function ....................................................................................................264
PF5 Pin Function ....................................................................................................265
PF4 Pin Function ....................................................................................................265
PF3 Pin Function ....................................................................................................265
PF2 Pin Function ....................................................................................................265
PF1 Pin Function ....................................................................................................266
PF0 Pin Function ....................................................................................................266
PF7 Pin Function ....................................................................................................266
PF3 Pin Function ....................................................................................................267
PF0 Pin Function ....................................................................................................267
PG4 Pin Function....................................................................................................270
PG3 Pin Function....................................................................................................270
PG2 Pin Function....................................................................................................270
PG1 Pin Function....................................................................................................270
PG1 Pin Function....................................................................................................271
PG0 Pin Function....................................................................................................271
Examples of Ways to Handle Unused Input Pins ...................................................272
Section 9 16-Bit Timer Pulse Unit (TPU)
Table 9.1
TPU Functions ........................................................................................................275
Table 9.2
Pin Configuration....................................................................................................277
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Table 9.3
Table 9.4
Table 9.5
Table 9.6
Table 9.7
Table 9.8
Table 9.9
Table 9.10
Table 9.11
Table 9.12
Table 9.13
Table 9.14
Table 9.15
Table 9.16
Table 9.17
Table 9.18
Table 9.19
Table 9.20
Table 9.21
Table 9.22
Table 9.23
Table 9.24
CCLR2 to CCLR0 (channel 0) ...............................................................................280
CCLR2 to CCLR0 (channels 1 and 2)....................................................................280
TPSC2 to TPSC0 (channel 0).................................................................................281
TPSC2 to TPSC0 (channel 1).................................................................................281
TPSC2 to TPSC0 (channel 2).................................................................................282
MD3 to MD0..........................................................................................................283
TIORH_0 (channel 0).............................................................................................285
TIORH_0 (channel 0).............................................................................................286
TIORL_0 (channel 0) .............................................................................................287
TIORL_0 (channel 0) .............................................................................................288
TIOR_1 (channel 1)................................................................................................289
TIOR_1 (channel 1)................................................................................................290
TIOR_2 (channel 2)................................................................................................291
TIOR_2 (channel 2)................................................................................................292
Register Combinations in Buffer Operation ...........................................................309
PWM Output Registers and Output Pins................................................................314
Phase Counting Mode Clock Input Pins.................................................................317
Up/Down-Count Conditions in Phase Counting Mode 1 .......................................318
Up/Down-Count Conditions in Phase Counting Mode 2 .......................................319
Up/Down-Count Conditions in Phase Counting Mode 3 .......................................320
Up/Down-Count Conditions in Phase Counting Mode 4 .......................................321
TPU Interrupts........................................................................................................322
Section 10 Watchdog Timer (WDT)
Table 10.1 WDT Interrupt Source............................................................................................345
Section 11 Realtime Clock (RTC)
Table 11.1 Pin Configuration ...................................................................................................350
Table 11.2 Interrupt Source......................................................................................................360
Table 11.3 Operating State in Each Mode................................................................................362
Section 12 Serial Communication Interface
Table 12.1 Pin Configuration ...................................................................................................367
Table 12.2 Relationships between the N Setting in BRR and Bit Rate B ................................395
Table 12.3 BRR Settings for Various Bit Rates (Asynchronous Mode) ..................................396
Table 12.4 Maximum Bit Rate for Each Frequency (Asynchronous Mode) ............................399
Table 12.5 Maximum Bit Rate with External Clock Input (Asynchronous Mode) ..................400
Table 12.6 BRR Settings for Various Bit Rates (Clocked Synchronous Mode) ......................401
Table 12.7 Maximum Bit Rate with External Clock Input (Clocked Synchronous Mode) ......401
Table 12.8 BRR Settings for Various Bit Rates
(Smart Card Interface Mode, when n = 0 and S = 372)..........................................402
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Table 12.9
Table 12.10
Table 12.11
Table 12.12
Table 12.13
Maximum Bit Rate at Various Frequencies (Smart Card Interface Mode).............402
Serial Transfer Formats (Asynchronous Mode)......................................................404
SSR Status Flags and Receive Data Handling ........................................................411
SCI Interrupt Sources .............................................................................................440
Interrupt Sources in Smart Card Interface Mode ....................................................441
Section 13 Boundary Scan Function
Table 13.1 Pin Configuration....................................................................................................451
Table 13.2 Instruction Configuration........................................................................................452
Table 13.3 IDCODE Register Configuration............................................................................454
Table 13.4 Correspondence between LSI Pins and Boundary Scan Register ...........................455
Section 14 Universal Serial Bus (USB)
Table 14.1 Pin Configuration....................................................................................................467
Table 14.2 Relationship between UTSTR0 Setting and Pin Output .........................................490
Table 14.3 Relationship between Pin Input and UTSTR1 Monitoring Value ..........................491
Table 14.4 Interrupt Sources.....................................................................................................495
Table 14.5 Command Decoding by Firmware..........................................................................516
Section 15 A/D Converter
Table 15.1 Pin Configuration....................................................................................................537
Table 15.2 Analog Input Channels and Corresponding ADDR Registers ................................538
Table 15.3 A/D Conversion Time (Single Mode).....................................................................545
Table 15.4 A/D Conversion Time (Scan Mode) .......................................................................545
Table 15.5 A/D Converter Interrupt Source..............................................................................546
Table 15.6 Analog Pin Specifications.......................................................................................549
Section 17 Flash Memory (F-ZTAT Version)
Table 17.1 Differences between Boot Mode and User Program Mode ....................................555
Table 17.2 Pin Configuration....................................................................................................560
Table 17.3 Setting On-Board Programming Modes .................................................................567
Table 17.4 Boot Mode Operation .............................................................................................570
Table 17.5 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate Is
Possible...................................................................................................................570
Table 17.6 Enumeration Information........................................................................................571
Table 17.7 USB Boot Mode Operation.....................................................................................574
Table 17.8 Flash Memory Operating States..............................................................................586
Table 17.9 Registers Present in F-ZTAT Version but Absent in Masked ROM Version.........592
Section 19 Clock Pulse Generator
Table 19.1 Damping Resistance Value .....................................................................................600
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Table 19.2
Table 19.3
Table 19.4
Crystal Resonator Characteristics...........................................................................600
External Clock Input Conditions ............................................................................601
External Clock Input Conditions when Duty Adjustment Circuit Is not Used .......602
Section 20 Power-Down Modes
Table 20.1 LSI Internal States in Each Mode...........................................................................608
Table 20.2 Transition Conditions of Power-Down Modes.......................................................610
Table 20.3 Oscillation Stabilization Time Settings ..................................................................620
Table 20.4 φ Pin State in Each Processing State ......................................................................627
Section 22 Electrical Characteristics
Table 22.1 Absolute Maximum Ratings...................................................................................657
Table 22.2 DC Characteristics..................................................................................................659
Table 22.3 Permissible Output Currents...................................................................................662
Table 22.4 Clock Timing..........................................................................................................664
Table 22.5 Control Signal Timing............................................................................................666
Table 22.6 Bus Timing.............................................................................................................668
Table 22.7 Timing of On-Chip Supporting Modules ...............................................................675
Table 22.8 USB Characteristics (USD+ and USD- pins) when On-Chip USB Transceiver Is
Used........................................................................................................................680
Table 22.9 A/D Conversion Characteristics .............................................................................682
Table 22.10 Flash Memory Characteristics ................................................................................683
Rev.6.00 Jun. 03, 2008 Page xlv of xlvi
REJ09B0074-0600
Rev.6.00 Jun. 03, 2008 Page xlvi of xlvi
REJ09B0074-0600
Section 1 Overview
Section 1 Overview
1.1
Overview
• High-speed H8S/2000 central processing unit with 16-bit architecture
⎯ Upward-compatible with H8/300 and H8/300H CPUs on an object level
⎯ Sixteen 16-bit general registers
⎯ 65 basic instructions
• Various peripheral functions
⎯ DMA controller (DMAC)
⎯ 16-bit timer-pulse unit (TPU)
⎯ Watchdog timer (WDT)
⎯ Realtime clock (RTC)
⎯ Serial communication interface (SCI)
⎯ Boundary scan
⎯ Universal serial bus (USB)
⎯ 10-bit A/D converter
⎯ High-performance user debugging interface (H-UDI)
⎯ Clock pulse generator
• On-chip memory
H8S/2218 Group
ROM
Part No.
ROM
RAM
Remarks
Flash memory Version
HD64F2218
128 kbytes
12 kbytes
SCI boot mode
HD64F2218U
128 kbytes
12 kbytes
USB boot mode
HD6432217
64 kbytes
8 kbytes
⎯
Masked ROM Version
Rev.6.00 Jun. 03, 2008 Page 1 of 698
REJ09B0074-0600
Section 1 Overview
H8S/2212 Group
ROM
Part No.
ROM
RAM
Remarks
Flash memory Version
HD64F2212
128 kbytes
12 kbytes
SCI boot mode
HD64F2212U
128 kbytes
12 kbytes
USB boot mode
Masked ROM Version
HD64F2211
64 kbytes
8 kbytes
SCI boot mode
HD64F2211U
64 kbytes
8 kbytes
USB boot mode
HD6432211
64 kbytes
8 kbytes
⎯
HD6432210
32 kbytes
4 kbytes
⎯
HD6432210S
32 kbytes
4 kbytes
⎯
• General I/O ports
I/O pins: 69 for the H8S/2218 Group, 37 for the H8S/2212 Group
• Supports various power-down states
• Compact package
Package
Code*
Body Size
Pin Pitch
Remarks
TQFP-100
TFP-100G, TFP-100GV
12.0 × 12.0 mm
0.4 mm
H8S/2218 Group
P-LFBGA-112
BP-112, BP-112V
10.0 × 10.0 mm
0.8 mm
LQFP-64
FP-64E, FP-64EV
10.0 × 10.0 mm
0.5 mm
VQFN-64
TNP-64B, TNP-64BV
8.0 × 8.0 mm
0.4 mm
Note:
*
H8S/2212 Group
A V appended to the end of the package code indicates a lead-free version.
Rev.6.00 Jun. 03, 2008 Page 2 of 698
REJ09B0074-0600
Section 1 Overview
1.2
Internal Block Diagram
PE7/D7
PE6/D6
PE5/D5
PE4/D4
PE3/D3
PE2/D2
PE1/D1
PE0/D0
PD7 / D15
PD6 / D14
PD5 / D13
PD4 / D12
PD3 / D11
PD2 / D10
PD1 / D9
PD0 / D8
EMLE*2
TDO*2
TCK*2
TMS*2
TRST*2
TDI*2
Port D
WDT
ROM
PC7 / A7
PC6 / A6
PC5 / A5
PC4 / A4
PC3 / A3
PC2 / A2
PC1 / A1
PC0 / A0
SCI0 (High speed UART)
Port 3
Port F
RAM
Port A
Peripheral data bus
USB
Peripheral address bus
Internal data bus
Internal address bus
DMAC
PB7/A15
PB6/A14
PB5/A13
PB4/A12
PB3 / A11
PB2/A10
PB1/A9
PB0/A8
SCI2
RTC
P36 (PUPD+)
P32 / SCK0/IRQ4
P31/RxD0
P30/TxD0
A/D converter (6 channels)
Vref
TPU (3 channels)
Port 4
P70/CS4
P71/CS5
P74 / MRES
P43/AN3
P42/AN2
P41/AN1
P40/AN0
Port 9
P96/AN14
Port 7
P97/AN15
Port 1
P10/TIOCA0/A20
P11/TIOCB0/A21
P12 / TIOCC0 / TCLKA/A22
P13 / TIOCD0 / TCLKB/A23
P14/TIOCA1/IRQ0
P15 / TIOCB1 / TCLKC
P16/TIOCA2/IRQ1
P17 / TIOCB2/ TCLKD
Port G
PG4/ CS0
PG3/ CS1
PG2/ CS2
PG1/ CS3/IRQ7
Interrupts controller
Port B
Main clock
pulse
generator
Sub-clock
pulse
generator
STBY
RES
NMI
FWE*1
USPND/TMOW
USD+
USDUBPM
VBUS
PF7/ φ
PF6/ AS
PF5/ RD
PF4/ HWR
PF3/ LWR/ADTRG/IRQ3
PF2/ WAIT
PF1/ BACK
PF0/ BREQ/IRQ2
H8S/2000 CPU
PA3 / A19/SCK2
PA2/A18/RxD2
PA1/A17/TxD2
PA0/A16
Port C
Boundary scan/H-UDI*
MD2
MD1
MD0
EXTAL
XTAL
PLLVCC
PLLVSS
OSC1
OSC2
Port E
2
Bus controller
VCC
VCC
VSS
VSS
DrVCC
DrVSS
The internal block diagram of the HD64F2218 and HD64F2218U is shown in figure 1.1. The
internal block diagram of the HD6432217 is shown in figure 1.2. The internal block diagram of the
HD64F2212, HD64F2212U, HD64F2211, and HD64F2211U is shown in figure 1.3. The internal
block diagram of the HD6432211, HD6432210 and HD6432210S is shown in figure 1.4.
Notes: 1. The FWE pin is provided only in the HD64F2218 and HD64F2218U.
2. When EMLE = 0, boundary scan is available and the pins function as TDO, TCK, TMS, TRST, and TDI, respectively.
When EMLE = 1, H-UDI function is available and the pins function as TDO, TCK, TMS, TRST, and TDI, respectively.
Figure 1.1 Internal Block Diagram of HD64F2218 and HD64F2218U
Rev.6.00 Jun. 03, 2008 Page 3 of 698
REJ09B0074-0600
PE7/D7
PE6/D6
PE5/D5
PE4/D4
PE3/D3
PE2/D2
PE1/D1
PE0/D0
PD7/D15
PD6/D14
PD5/D13
PD4 /D12
PD3/D11
PD2/D10
PD1/D9
PD0/D8
USB
WDT
ROM
PA3 / A19/SCK2
PA2 / A18/RxD2
PA1 / A17/TxD2
PA0 / A16
PB7 / A15
PB6 / A14
PB5 / A13
PB4 /A12
PB3 / A11
PB2 / A10
PB1 / A9
PB0 / A8
PC7/ A7
PC6/ A6
PC5/ A5
PC4 /A4
PC3/ A3
PC2/ A2
PC1/ A1
PC0/ A0
SCI0 (High speed UART)
Port 3
Port F
RAM
Peripheral address bus
Bus controller
Peripheral data bus
Internal data bus
DMAC
SCI2
RTC
P36 (PUPD+)
P32/ SCK0/IRQ4
P31/ RxD0
P30/ TxD0
A/D converter (6 channels)
Vref
TPU (3 channels)
Port 4
P70/CS4
P71/CS5
P74/MRES
P43/AN3
P42/AN2
P41/AN1
P40/AN0
Port 9
P96/AN14
Port 7
P97/AN15
Port 1
P10/TIOCA0 /A20
P11/TIOCB0 /A21
P12/TIOCC0/TCLKA/A22
P13/TIOCD0/TCLKB/A23
P14/TIOCA1/IRQ0
P15/TIOCB1 /TCLKC
P16/TIOCA2/IRQ1
P17/TIOCB2/TCLKD
Port G
PG4 /CS0
PG3 / CS1
PG2 / CS2
PG1 / CS3/IRQ7
Interrupts controller
Internal address bus
Sub-clock
pulse
generator
STBY
RES
NMI
FWE*1
USPND/TMOW
USD+
USDUBPM
VBUS
PF7 / φ
PF6 / AS
PF5 / RD
PF4/ HWR
PF3 / LWR/ ADTRG/IRQ3
PF2 / WAIT
PF1 / BACK
PF0 / BREQ/IRQ2
H8S/2000 CPU
Port A
Main clock
pulse
generator
MD2
MD1
MD0
EXTAL
XTAL
PLLVCC
PLLVSS
OSC1
OSC2
Port E
Port B
Port D
Port C
NC*2
NC*2
NC*2
NC*2
NC*2
NC*2
VCC
VCC
VSS
VSS
DrVCC
DrVSS
Section 1 Overview
Notes: NC (no connection): These pins should not be connected; they should be left open.
1. The FWE pin is provided only in the HD64F2218 and HD64F2218U. It should be fixed low.
2. Neither boundary scan nor H-UDI function is available and the pins function as NC.
Figure 1.2 Internal Block Diagram of HD6432217
Rev.6.00 Jun. 03, 2008 Page 4 of 698
REJ09B0074-0600
PE7
PE6
PE5
PE4
PE3
PE2
PE1
PE0
EMLE*2
TDO/P77*2
TCK/P76*2
TMS/P75*2
TRST/NC*2
TDI/PG0*2
VCC
VCC
VSS
VSS
DrVCC
DrVSS
Section 1 Overview
Port E
H-UDI/ports
7 and G*2
Bus controller
PA3/SCK2
PA2/RxD2
PA1/TxD2
USB
WDT
ROM
Peripheral address bus
DMAC
Peripheral data bus
Interrupts controller
Internal data bus
Sub-clock
pulse
generator
STBY
RES
NMI
FWE*1
USPND/TMOW
USD+
USDUBPM
VBUS
RAM
Port F
SCI0 (High speed UART)
Port 3
PF7/φ
PF3/ADTRG/IRQ3
PF0/IRQ2
H8S/2000 CPU
Internal address bus
Main clock
pulse
generator
Port A
MD2
MD1
MD0
EXTAL
XTAL
PLLVCC
PLLVSS
OSC1
OSC2
SCI2
RTC
P36(PUPD+)
P32/SCK0/IRQ4
P31/RxD0
P30/ TxD0
A/D converter (6 channels)
TPU (3 channels)
P43/AN3
P42/AN2
P41/AN1
P40/AN0
Port 9
P96/AN14
Port 4
P97/AN15
Port 1
P10/ TIOCA0
P11/ TIOCB0
P12/ TIOCC0 / TCLKA
P13/ TIOCD0 / TCLKB
P14 / TIOCA1/IRQ0
P15/ TIOCB1 / TCLKC
P16/ TIOCA2/IRQ1
P17/ TIOCB2/TCLKD
Port G
PG1 /IRQ7
Vref
Notes: NC (no connection): This pin should not be connected; it should be left open.
1. The FWE pin is provided only in the HD64F2212, HD64F2212U, HD64F2211, and HD64F2211U.
2. When EMLE = 0, port function is available and the pins function as P77, P76, P75, NC, and PG0, respectively.
When EMLE = 1, H-UDI function is available and the pins function as TDO, TCK, TMS, TRST, and TDI, respectively.
Figure 1.3 Internal Block Diagram of HD64F2212, HD64F2212U, HD64F2211, and
HD64F2211U
Rev.6.00 Jun. 03, 2008 Page 5 of 698
REJ09B0074-0600
PE7
PE6
PE5
PE4
PE3
PE2
PE1
PE0
NC*2
P77*2
P76*2
P75*2
NC*2
PG0*2
VCC
VCC
VSS
VSS
DrVCC
DrVSS
Section 1 Overview
Port E
Ports 7 and G*2
Bus controller
PA3/SCK2
PA2/RxD2
PA1/TxD2
USB
WDT
ROM
Peripheral address bus
DMAC
Peripheral data bus
Interrupts controller
Internal data bus
Sub-clock
pulse
generator
STBY
RES
NMI
FWE*1
USPND/TMOW
USD+
USDUBPM
VBUS
RAM
Port F
SCI0 (High speed UART)
Port 3
PF7/φ
PF3/ADTRG/IRQ3
PF0/IRQ2
H8S/2000 CPU
Internal address bus
Main clock
pulse
generator
Port A
MD2
MD1
MD0
EXTAL
XTAL
PLLVCC
PLLVSS
OSC1
OSC2
SCI2
RTC
P36(PUPD+)
P32/SCK0/IRQ4
P31/RxD0
P30/ TxD0
A/D converter (6 channels)
TPU (3 channels)
P43/AN3
P42/AN2
P41/AN1
P40/AN0
Port 9
P96/AN14
Port 4
P97/AN15
Port 1
P10 / TIOCA0
P11 / TIOCB0
P12 / TIOCC0 / TCLKA
P13 / TIOCD0 / TCLKB
P14 / TIOCA1/IRQ0
P15 / TIOCB1 /TCLKC
P16 / TIOCA2/IRQ1
P17 / TIOCB2/TCLKD
Port G
PG1 /IRQ7
Vref
Notes: NC (no connection): These pins should not be connected; they should be left open.
1. The FWE pin is provided only in the HD64F2212, HD64F2212U, HD64F2211, and HD64F2211U. It should be fixed low.
2. The port function is available and the pins function as NC, P77, P76, P75, NC, and PG0, respectively.
Figure 1.4 Internal Block Diagram of HD6432211, HD6432210 and HD6432210S
Rev.6.00 Jun. 03, 2008 Page 6 of 698
REJ09B0074-0600
Section 1 Overview
1.3
Pin Arrangements
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
TFP-100G
TFP-100GV
(Top View)
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
PB5/A13
PB4/A12
PLLVCC
UBPM
PLLVSS
P40/AN0
P41/AN1
P42/AN2
P43/AN3
Vref
PB3/A11
PB2/A10
PB1/A9
PB0/A8
P96/AN14
P97/AN15
DrVSS
USDUSD+
DrVCC
P36(PUPD+)
VBUS
PG4/CS0
PG3/CS1
PG2/CS2
PA0/A16
P10/TIOCA0/A20
P11/TIOCB0/A21
P12/TIOCC0/TCLKA/A22
P13/TIOCD0/TCLKB/A23
P14/TIOCA1/IRQ0
P15/TIOCB1/TCLKC
P16/TIOCA2/IRQ1
P17/TIOCB2/TCLKD
PC0/A0
PC1/A1
PC2/A2
PC3/A3
MD0
MD1
MD2
PC4/A4
PC5/A5
PC6/A6
PC7/A7
USPND/TMOW
P30/TxD0
P31/RxD0
P32/SCK0/IRQ4
PG1/CS3/IRQ7
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
PD4/D12
PD5/D13
PD6/D14
PD7/D15
FWE*1
NMI
EMLE*2
TDO*2
TCK*2
TMS*2
TRST*2
TDI*2
VCC
PF7/φ
VSS
PF6/AS
PF5/RD
PF4/HWR
PF3/LWR/ADTRG/IRQ3
PF2/WAIT
PF1/BACK
PF0/BREQ/IRQ2
PA3/A19/SCK2
PA2/A18/RxD2
PA1/A17/TxD2
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
PD3/D11
PD2/D10
PD1/D9
PD0/D8
PE7/D7
PE6/D6
PE5/D5
PE4/D4
PE3/D3
PE2/D2
PE1/D1
PE0/D0
P70/CS4
VCC
EXTAL
XTAL
VSS
RES
STBY
P71/CS5
P74/MRES
OSC1
OSC2
PB7/A15
PB6/A14
The pin arrangements of the HD64F2218 and HD64F2218U are shown in figures 1.5 and 1.6. The
pin arrangements of the HD6432217 are shown in figures 1.7 and 1.8. The pin arrangements of the
HD64F2212, HD64F2212U, HD64F2211, and HD64F2211U are shown in figures 1.9 and 1.11.
The pin arrangements of the HD6432211, HD6432210 and HD6432210S is shown in figures 1.10
and 1.12.
Notes: 1. The FWE pin is provided only in the HD64F2218 and HD64F2218U.
2. When EMLE = 0, boundary scan is available and the pins function as TDO, TCK, TMS, TRST, and TDI, respectively.
When EMLE = 1, H-UDI function is available and the pins function as TDO, TCK, TMS, TRST, and TDI, respectively.
Figure 1.5 Pin Arrangements of HD64F2218 and HD64F2218U (TFP-100G, TFP-100GV)
Rev.6.00 Jun. 03, 2008 Page 7 of 698
REJ09B0074-0600
Section 1 Overview
A
11
10
B
C
D
E
F
G
H
J
K
L
PD3/D11
PD0/D8
PE5/D5
PE2/D2
P70/CS4
XTAL
STBY
OSC1
PB7/A15
NC
PD5/D13 PD4/D12
PD2/D10
PE7/D7
PE3/D3
PE0/D0
EXTAL
P71/CS5
OSC2
PB6/A14
PB5/A13
NC
9
FWE*1
PD7/D15
NC
PD1/D9
PE4/D4
VCC
VSS
P74/
MRES
NC
PB4/A12
UBPM
8
TDO
*2
EMLE*2
NMI
PD6/D14
PE6/D6
PE1/D1
RES
NC
PLLVCC
PLLVSS
P41/AN1
7
TRST*2
6
PF7/φ
5
*2
TDI
VSS
*2
TMS
VCC
*2
TCK
P40/AN0 P42/AN2 P43/AN3
BP-112
BP-112V
(Top view)
PF6/AS
Vref
PB1/A9
PB3/A11
PB2/A10
DrVSS
P97/
AN15
PB0/A8
P96/
AN14
DrVCC
USD+
USD-
VBUS
P36
(PUDP+)
PF3/LWR/
PF5/RD PF4/HWR ADTRG/
IRQ3
PF1/
BACK
PF0/
BREQ/
IRQ2
P11/
TIOCB0/
A21
P17/
TIOCB2/
TCLKD
MD2
P14/
TIOCA1/
IRQ0
PC0/A0
PC3/A3
PC6/A6
P32/
SCK0/
IRQ4
NC
P15/
TIOCB1/
TCLKC
PC2/A2
MD1
PC5/A5
P30/TxD0
PG1/
CS3/
IRQ7
P16/
TIOCA2/
IRQ1
PC1/A1
MD0
PC4/A4
D
E
F
G
4
PF2/WAIT
3
PA3/A19/ PA1/A17/
SCK2
TxD2
2
NC
PA0/A16
1
NC
P10/
TIOCA0/
A20
A
B
PA2/A18/
RxD2
NC
P12/
TIOCC0/
TCLKA/
A22
P13/
TIOCD0/
TCLKB/
A23
C
NC
USPND/
PG4/CS0
TMOW
PC7/A7 P31/RxD0
H
J
PG2/CS2 PG3/CS1
NC
NC
K
L
INDEX
Notes: NC (no connection): These pins should not be connected; they should be left open.
1. The FWE pin is provided only in the HD64F2218 and HD64F2218U.
2. When EMLE = 0, boundary scan is available and the pins function as TDO, TCK, TMS,
TRST, and TDI, respectively.
When EMLE = 1, H-UDI function is available and the pins function as TDO, TCK, TMS,
TRST, and TDI, respectively.
Figure 1.6 Pin Arrangements of HD64F2218 and HD64F2218U (BP-112, BP-112V)
Rev.6.00 Jun. 03, 2008 Page 8 of 698
REJ09B0074-0600
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
TFP-100G
TFP-100GV
(Top View)
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
PB5/A13
PB4/A12
PLLVCC
UBPM
PLLVSS
P40/AN0
P41/AN1
P42/AN2
P43/AN3
Vref
PB3/A11
PB2/A10
PB1/A9
PB0/A8
P96/AN14
P97/AN15
DrVSS
USDUSD+
DrVCC
P36(PUPD+)
VBUS
PG4/CS0
PG3/CS1
PG2/CS2
PA0/A16
P10/TIOCA0/A20
P11/TIOCB0/A21
P12/TIOCC0/TCLKA/A22
P13/TIOCD0/TCLKB/A23
P14/TIOCA1/IRQ0
P15/TIOCB1/TCLKC
P16/TIOCA2/IRQ1
P17/TIOCB2/TCLKD
PC0/A0
PC1/A1
PC2/A2
PC3/A3
MD0
MD1
MD2
PC4/A4
PC5/A5
PC6/A6
PC7/A7
USPND/TMOW
P30/TxD0
P31/RxD0
P32/SCK0/IRQ4
PG1/CS3/IRQ7
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
PD4/D12
PD5/D13
PD6/D14
PD7/D15
FWE*1
NMI
NC*2
NC*2
NC*2
NC*2
NC*2
NC*2
VCC
PF7/φ
VSS
PF6/AS
PF5/RD
PF4/HWR
PF3/LWR/ADTRG/IRQ3
PF2/WAIT
PF1/BACK
PF0/BREQ/IRQ2
PA3/A19/SCK2
PA2/A18/RxD2
PA1/A17/TxD2
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
PD3/D11
PD2/D10
PD1/D9
PD0/D8
PE7/D7
PE6/D6
PE5/D5
PE4/D4
PE3/D3
PE2/D2
PE1/D1
PE0/D0
P70/CS4
VCC
EXTAL
XTAL
VSS
RES
STBY
P71/CS5
P74/MRES
OSC1
OSC2
PB7/A15
PB6/A14
Section 1 Overview
Notes:
NC (no connection): These pins should not be connected; they should be left open.
1. The FWE pin is provided only in the HD64F2218 and HD64F2218U. It should be fixed low.
2. Neither boundary scan nor H-UDI function is available and the pins function as NC.
Figure 1.7 Pin Arrangements of HD6432217 (TFP-100G, TFP-100GV)
Rev.6.00 Jun. 03, 2008 Page 9 of 698
REJ09B0074-0600
Section 1 Overview
A
11
10
9
B
D
E
F
G
H
J
K
L
PD3/D11
PD0/D8
PE5/D5
PE2/D2
P70/CS4
XTAL
STBY
OSC1
PB7/A15
NC
PD5/D13 PD4/D12
PD2/D10
PE7/D7
PE3/D3
PE0/D0
EXTAL
P71/CS5
OSC2
PB6/A14
PB5/A13
NC
PD1/D9
PE4/D4
VCC
VSS
P74/
MRES
NC
PB4/A12
UBPM
NMI
PD6/D14
PE6/D6
PE1/D1
RES
NC
PLLVCC
PLLVSS
P41/AN1
NC
FWE*1
PD7/D15
8
NC
*2
NC
*2
7
NC*2
NC
*2
6
PF7/φ
VSS
5
C
NC
*2
VCC
NC
*2
P40/AN0 P42/AN2 P43/AN3
BP-112
BP-112V
(Top view)
PF6/AS
Vref
PB1/A9
PB3/A11
PB2/A10
DrVSS
P97/
AN15
PB0/A8
P96/
AN14
DrVCC
USD+
USD-
VBUS
P36
(PUDP+)
PF3/LWR/
PF5/RD PF4/HWR ADTRG/
IRQ3
PF1/
BACK
PF0/
BREQ/
IRQ2
P11/
TIOCB0/
A21
P17/
TIOCB2/
TCLKD
MD2
P14/
TIOCA1/
IRQ0
PC0/A0
PC3/A3
PC6/A6
P32/
SCK0/
IRQ4
NC
P15/
TIOCB1/
TCLKC
PC2/A2
MD1
PC5/A5
P30/TxD0
PG1/
CS3/
IRQ7
P16/
TIOCA2/
IRQ1
PC1/A1
MD0
PC4/A4
D
E
F
G
4
PF2/WAIT
3
PA3/A19/ PA1/A17/
SCK2
TxD2
2
NC
PA0/A16
1
NC
P10/
TIOCA0/
A20
A
B
PA2/A18/
RxD2
NC
P12/
TIOCC0/
TCLKA/
A22
P13/
TIOCD0/
TCLKB/
A23
C
NC
USPND/
PG4/CS0
TMOW
PC7/A7 P31/RxD0
H
J
PG2/CS2 PG3/CS1
NC
NC
K
L
INDEX
Notes: NC (no connection): These pins should not be connected; they should be left open.
1. The FWE pin is provided only in the HD64F2218 and HD64F2218U. It should be fixed low.
2. Neither boundary scan nor H-UDI function is available and the pins function as NC.
Figure 1.8 Pin Arrangements of HD6432217 (BP-112, BP-112V)
Rev.6.00 Jun. 03, 2008 Page 10 of 698
REJ09B0074-0600
OSC2
OSC1
STBY
RES
VSS
XTAL
EXTAL
VCC
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
Section 1 Overview
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
FWE*1
49
32
PLLVCC
NMI
50
31
UBPM
EMLE*2
51
30
PLLVSS
TDO/P77*2
52
29
P40/AN0
TCK/P76*2
53
28
P41/AN1
TMS/P75*2
54
27
P42/AN2
TRST/NC*2
55
26
P43/AN3
TDI/PG0*2
56
25
Vref
VCC
57
24
P96/AN14
PF7/φ
58
23
P97/AN15
VSS
59
22
DrVSS
PF3/ADTRG/IRQ3
60
21
USD-
PF0/IRQ2
61
20
USD+
PA3/SCK2
62
19
DrVCC
PA2/RXD2
63
18
P36 (PUPD+)
PA1/TXD2
64
17
VBUS
Notes:
8
9 10 11 12 13 14 15 16
P11/TIOCB0
P12/TIOCC0/TCLKA
P13/TIOCD0/TCLKB
P14/TIOCA1/IRQ0
P15/TIOCB1/TCLKC
P16/TIOCA2/IRQ1
P17/TIOCB2/TCLKD
MD0
PG1/IRQ7
7
P32/SCK0/IRQ4
6
P31/RxD0
5
P30/TxD0
4
USPND/TMOW
3
MD2
2
MD1
1
P10/TIOCA0
FP-64E
FP-64EV
(Top View)
NC (no connection): This pin should not be connected; it should be left open.
1. The FWE pin is provided only in the HD64F2212, HD64F2212U, HD64F2211, and HD64F2211U.
2. When EMLE = 0, port function is available and the pins function as P77, P76, P75, NC,
and PG0, respectively.
When EMLE = 1, H-UDI function is available and the pins function as TDO, TCK, TMS, TRST,
and TDI, respectively.
Figure 1.9 Pin Arrangements of HD64F2212, HD64F2212U, HD64F2211, and HD64F2211U
(FP-64E, FP-64EV)
Rev.6.00 Jun. 03, 2008 Page 11 of 698
REJ09B0074-0600
OSC2
OSC1
STBY
RES
VSS
XTAL
EXTAL
VCC
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
Section 1 Overview
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
FWE*1
49
32
PLLVCC
NMI
50
31
UBPM
NC*2
51
30
PLLVSS
P77*2
52
29
P40/AN0
P76*2
53
28
P41/AN1
P75*2
54
27
P42/AN2
NC*2
55
26
P43/AN3
PG0*2
56
25
Vref
VCC
57
24
P96/AN14
PF7/φ
58
23
P97/AN15
VSS
59
22
DrVSS
PF3/ADTRG/IRQ3
60
21
USD-
PF0/IRQ2
61
20
USD+
PA3/SCK2
62
19
DrVCC
PA2/RXD2
63
18
P36 (PUPD+)
PA1/TXD2
64
17
VBUS
Notes:
8
9 10 11 12 13 14 15 16
P11/TIOCB0
P12/TIOCC0/TCLKA
P13/TIOCD0/TCLKB
P14/TIOCA1/IRQ0
P15/TIOCB1/TCLKC
P16/TIOCA2/IRQ1
P17/TIOCB2/TCLKD
MD0
PG1/IRQ7
7
P32/SCK0/IRQ4
6
P31/RxD0
5
P30/TxD0
4
USPND/TMOW
3
MD2
2
MD1
1
P10/TIOCA0
FP-64E
FP-64EV
(Top View)
NC (no connection): These pins should not be connected; they should be left open.
1. The FWE pin is provided only in the HD64F2212, HD64F2212U, HD64F2211, and HD64F2211U.
It should be fixed low.
2. The port function is available and the pins function as NC, P77, P76, P75, NC, and PG0, respectively.
Figure 1.10 Pin Arrangements of HD6432211, HD6432210 and HD6432210S
(FP-64E, FP-64EV)
Rev.6.00 Jun. 03, 2008 Page 12 of 698
REJ09B0074-0600
OSC2
OSC1
STBY
RES
VSS
XTAL
EXTAL
VCC
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
Section 1 Overview
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
FWE*1
49
32
PLLVCC
NMI
50
31
UBPM
EMLE*2
51
30
PLLVSS
TDO/P77*2
52
29
P40/AN0
TCK/P76*2
53
28
P41/AN1
TMS/P75*2
54
27
P42/AN2
TRST/NC*2
55
26
P43/AN3
TDI/PG0*2
56
25
Vref
VCC
57
24
P96/AN14
PF7/φ
58
23
P97/AN15
VSS
59
22
DrVSS
PF3/ADTRG/IRQ3
60
21
USD-
PF0/IRQ2
61
20
USD+
PA3/SCK2
62
19
DrVCC
PA2/RXD2
63
18
P36 (PUPD+)
PA1/TXD2
64
17
VBUS
Notes:
8
9 10 11 12 13 14 15 16
P11/TIOCB0
P12/TIOCC0/TCLKA
P13/TIOCD0/TCLKB
P14/TIOCA1/IRQ0
P15/TIOCB1/TCLKC
P16/TIOCA2/IRQ1
P17/TIOCB2/TCLKD
MD0
PG1/IRQ7
7
P32/SCK0/IRQ4
6
P31/RxD0
5
P30/TxD0
4
USPND/TMOW
3
MD2
2
MD1
1
P10/TIOCA0
TNP-64B
TNP-64BV
(Top View)
NC (no connection): This pin should not be connected; it should be left open.
1. The FWE pin is provided only in the HD64F2212, HD64F2212U, HD64F2211, and HD64F2211U.
2. When EMLE = 0, the port function is enabled (P77, P76, P75, NC, and PG0).
When EMLE = 1, the H-UDI function is enabled (TDO, TCK, TMS, TRST, and TDI).
Figure 1.11 Pin Arrangements of HD64F2212, HD64F2212U, HD64F2211,
and HD64F2211U (TNP-64B, TNP-64BV)
Rev.6.00 Jun. 03, 2008 Page 13 of 698
REJ09B0074-0600
OSC2
OSC1
STBY
RES
VSS
XTAL
EXTAL
VCC
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
Section 1 Overview
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
FWE*1
49
32
PLLVCC
NMI
50
31
UBPM
NC*2
51
30
PLLVSS
P77*2
52
29
P40/AN0
P76*2
53
28
P41/AN1
P75*2
54
27
P42/AN2
NC*2
55
26
P43/AN3
PG0*2
56
25
Vref
VCC
57
24
P96/AN14
PF7/φ
58
23
P97/AN15
VSS
59
22
DrVSS
PF3/ADTRG/IRQ3
60
21
USD-
PF0/IRQ2
61
20
USD+
PA3/SCK2
62
19
DrVCC
PA2/RXD2
63
18
P36 (PUPD+)
PA1/TXD2
64
17
VBUS
Notes:
8
9 10 11 12 13 14 15 16
P11/TIOCB0
P12/TIOCC0/TCLKA
P13/TIOCD0/TCLKB
P14/TIOCA1/IRQ0
P15/TIOCB1/TCLKC
P16/TIOCA2/IRQ1
P17/TIOCB2/TCLKD
MD0
PG1/IRQ7
7
P32/SCK0/IRQ4
6
P31/RxD0
5
P30/TxD0
4
USPND/TMOW
3
MD2
2
MD1
1
P10/TIOCA0
TNP-64B
TNP-64BV
(Top View)
NC (no connection): These pins should not be connected; they should be left open.
1. The FWE pin is provided only in the HD64F2212, HD64F2212U, HD64F2211,
and HD64F2211U. It should be fixed low.
2. The port function is enabled (P77, P76, P75, NC, and PG0).
Figure 1.12 Pin Arrangements of HD6432211, HD6432210 and HD6432210S
(TNP-64B, TNP-64BV)
Rev.6.00 Jun. 03, 2008 Page 14 of 698
REJ09B0074-0600
Section 1 Overview
1.4
Pin Functions in Each Operating Mode
Table 1.1 shows the pin functions in each operating mode for the H8S/2218 Group, and table 1.2
shows that for the H8S/2212 Group.
Table 1.1
Pin Functions in Each Operating Mode for H8S/2218 Group
Pin No.
Pin Name*
TFP-100G, BP-112,
TFP-100GV BP-112V
Modes 4, 5
Mode 6
Mode 7
Programmer
Mode
1
B2
PA0/A16
PA0/A16
PA0
NC
2
B1
P10/TIOCA0/A20
P10/TIOCA0/A20
P10/TIOCA0
A2
3
D4
P11/TIOCB0/A21
P11/TIOCB0/A21
P11/TIOCB0
A3
4
C2
P12/TIOCC0/TCLKA/A22
P12/TIOCC0/TCLKA/A22 P12/TIOCC0/TCLKA
A4
5
C1
P13/TIOCD0/TCLKB/A23
P13/TIOCD0/TCLKB/A23 P13/TIOCD0/TCLKB
A5
6
D3
P14/TIOCA1/IRQ0
P14/TIOCA1/IRQ0
P14/TIOCA1/IRQ0
VSS
7
D2
P15/TIOCB1/TCLKC
P15/TIOCB1/TCLKC
P15/TIOCB1/TCLKC
WE
8
D1
P16/TIOCA2/IRQ1
P16/TIOCA2/IRQ1
P16/TIOCA2/IRQ1
VSS
9
E4
P17/TIOCB2/TCLKD
P17/TIOCB2/TCLKD
P17/TIOCB2/TCLKD
CE
10
E3
A0
PC0/A0
PC0
NC
11
E1
A1
PC1/A1
PC1
NC
12
E2
A2
PC2/A2
PC2
NC
13
F3
A3
PC3/A3
PC3
NC
14
F1
MD0
MD0
MD0
VSS
15
F2
MD1
MD1
MD1
VSS
16
F4
MD2
MD2
MD2
VSS
17
G1
A4
PC4/A4
PC4
NC
18
G2
A5
PC5/A5
PC5
NC
19
G3
A6
PC6/A6
PC6
NC
20
H1
A7
PC7/A7
PC7
NC
21
G4
USPND/TMOW
USPND/TMOW
USPND/TMOW
NC
22
H2
P30/TxD0
P30/TxD0
P30/TxD0
A10
23
J1
P31/RxD0
P31/RxD0
P31/RxD0
A11
24
H3
P32/SCK0/IRQ4
P32/SCK0/IRQ4
P32/SCK0/IRQ4
A12
25
J2
PG1/CS3/IRQ7
PG1/CS3/IRQ7
PG1/IRQ7
A15
Rev.6.00 Jun. 03, 2008 Page 15 of 698
REJ09B0074-0600
Section 1 Overview
Pin No.
Pin Name*
TFP-100G, BP-112,
TFP-100GV BP-112V
Modes 4, 5
Mode 6
Mode 7
Programmer
Mode
26
K2
PG2/CS2
PG2/CS2
PG2
NC
27
L2
PG3/CS1
PG3/CS1
PG3
NC
28
H4
PG4/CS0
PG4/CS0
PG4
NC
29
K3
VBUS
VBUS
VBUS
VSS
30
L3
P36 (PUDP+)
P36 (PUDP+)
P36 (PUDP+)
A16
31
J4
DrVCC
DrVCC
DrVCC
VCC
32
K4
USD+
USD+
USD+
NC
33
L4
USD-
USD-
USD-
NC
34
H5
DrVSS
DrVSS
DrVSS
VSS
35
J5
P97/AN15
P97/AN15
P97/AN15
A7
36
L5
P96/AN14
P96/AN14
P96/AN14
A6
37
K5
PB0/A8
PB0/A8
PB0
NC
38
J6
PB1/A9
PB1/A9
PB1
NC
39
L6
PB2/A10
PB2/A10
PB2
NC
40
K6
PB3/A11
PB3/A11
PB3
NC
41
H6
Vref
Vref
Vref
VCC
42
K7
P43/AN3
P43/AN3
P43/AN3
A14
43
J7
P42/AN2
P42/AN2
P42/AN2
A13
44
L8
P41/AN1
P41/AN1
P41/AN1
A9
45
H7
P40/AN0
P40/AN0
P40/AN0
A8
46
K8
PLLVSS
PLLVSS
PLLVSS
VSS
47
L9
UBPM
UBPM
UBPM
A17
48
J8
PLLVCC
PLLVCC
PLLVCC
VCC
49
K9
PB4/A12
PB4/A12
PB4
NC
50
L10
PB5/A13
PB5/A13
PB5
NC
51
K10
PB6/A14
PB6/A14
PB6
NC
52
K11
PB7/A15
PB7/A15
PB7
NC
53
J10
OSC2
OSC2
OSC2
NC
54
J11
OSC1
OSC1
OSC1
VCC
55
H9
P74/MRES
P74/MRES
P74/MRES
NC
Rev.6.00 Jun. 03, 2008 Page 16 of 698
REJ09B0074-0600
Section 1 Overview
Pin No.
Pin Name*
TFP-100G, BP-112,
TFP-100GV BP-112V
Modes 4, 5
Mode 6
Mode 7
Programmer
Mode
56
H10
P71/CS5
P71/CS5
P71
NC
57
H11
STBY
STBY
STBY
VCC
58
G8
RES
RES
RES
RES
59
G9
VSS
VSS
VSS
VSS
60
G11
XTAL
XTAL
XTAL
XTAL
61
G10
EXTAL
EXTAL
EXTAL
EXTAL
62
F9
VCC
VCC
VCC
VCC
63
F11
P70/CS4
P70/CS4
P70
NC
64
F10
PE0/D0
PE0/D0
PE0
D0
65
F8
PE1/D1
PE1/D1
PE1
D1
66
E11
PE2/D2
PE2/D2
PE2
D2
67
E10
PE3/D3
PE3/D3
PE3
D3
68
E9
PE4/D4
PE4/D4
PE4
D4
69
D11
PE5/D5
PE5/D5
PE5
D5
70
E8
PE6/D6
PE6/D6
PE6
D6
71
D10
PE7/D7
PE7/D7
PE7
D7
72
C11
D8
D8
PD0
NC
73
D9
D9
D9
PD1
NC
74
C10
D10
D10
PD2
NC
75
B11
D11
D11
PD3
NC
76
B10
D12
D12
PD4
NC
77
A10
D13
D13
PD5
NC
78
D8
D14
D14
PD6
NC
79
B9
D15
D15
PD7
NC
80
A9
FWE
FWE
FWE
FWE
81
C8
NMI
NMI
NMI
VCC
82
B8
EMLE/NC
EMLE/NC
EMLE/NC
VSS
83
A8
TDO/NC
TDO/NC
TDO/NC
NC
84
D7
TCK/NC
TCK/NC
TCK/NC
VCC
85
C7
TMS/NC
TMS/NC
TMS/NC
VCC
Rev.6.00 Jun. 03, 2008 Page 17 of 698
REJ09B0074-0600
Section 1 Overview
Pin No.
Pin Name*
TFP-100G, BP-112,
TFP-100GV BP-112V
Modes 4, 5
Mode 6
Mode 7
Programmer
Mode
86
A7
TRST/NC
TRST/NC
TRST/NC
RES
87
B7
TDI/NC
TDI/NC
TDI/NC
VSS
88
C6
VCC
VCC
VCC
VCC
89
A6
PF7/φ
PF7/φ
PF7/φ
NC
90
B6
VSS
VSS
VSS
VSS
91
D6
AS
AS
PF6
NC
92
A5
RD
RD
PF5
NC
93
B5
HWR
HWR
PF4
NC
94
C5
PF3/LWR/ADTRG/IRQ3
PF3/LWR/ADTRG/IRQ3
PF3/ADTRG/IRQ3
VCC
95
A4
PF2/WAIT
PF2/WAIT
PF2
NC
96
D5
PF1/BACK
PF1/BACK
PF1
NC
97
B4
PF0/BREQ/IRQ2
PF0/BREQ/IRQ2
PF0/IRQ2
VCC
98
A3
PA3/A19/SCK2
PA3/A19/SCK2
PA3/SCK2
A1
99
C4
PA2/A18/RxD2
PA2/A18/RxD2
PA2/RxD2
A0
100
B3
PA1/A17/TxD2
PA1/A17/TxD2
PA1/TxD2
OE
Note: * The NC should be left open.
Table 1.2
Pin Functions in Each Operating Mode for H8S/2212 Group
Pin No.
Pin Name*
FP-64E,
FP-64EV,
TNP-64B,
TNP-64BV Mode 7
Programmer Mode
1
P10/TIOCA0
A2
2
P11/TIOCB0
A3
3
P12/TIOCC0/TCLKA
A4
4
P13/TIOCD0/TCLKB
A5
5
P14/TIOCA1/IRQ0
VSS
6
P15/TIOCB1/TCLKC
WE
7
P16/TIOCA2/IRQ1
VSS
8
P17/TIOCB2/TCLKD
CE
9
MD0
VSS
Rev.6.00 Jun. 03, 2008 Page 18 of 698
REJ09B0074-0600
Section 1 Overview
Pin No.
Pin Name*
FP-64E,
FP-64EV,
TNP-64B,
TNP-64BV Mode 7
Programmer Mode
10
MD1
VSS
11
MD2
VSS
12
USPND/TMOW
NC
13
P30/TxD0
A10
14
P31/RxD0
A11
15
P32/SCK0/IRQ4
A12
16
PG1/IRQ7
A15
17
VBUS
VSS
18
P36(PD+)
A16
19
DrVCC
VCC
20
USD+
NC
21
USD-
NC
22
DrVSS
VSS
23
P97/AN15
A7
24
P96/AN14
A6
25
Vref
VCC
26
P43/AN3
A14
27
P42/AN2
A13
28
P41/AN1
A9
29
P40/AN0
A8
30
PLLVSS
VSS
31
UBPM
A17
32
PLLVCC
VCC
33
OSC2
NC
34
OSC1
VCC
35
STBY
VCC
36
RES
RES
37
VSS
VSS
38
XTAL
XTAL
Rev.6.00 Jun. 03, 2008 Page 19 of 698
REJ09B0074-0600
Section 1 Overview
Pin No.
Pin Name*
FP-64E,
FP-64EV,
TNP-64B,
TNP-64BV Mode 7
Programmer Mode
39
EXTAL
EXTAL
40
VCC
VCC
41
PE0
D0
42
PE1
D1
43
PE2
D2
44
PE3
D3
45
PE4
D4
46
PE5
D5
47
PE6
D6
48
PE7
D7
49
FWE
FWE
50
NMI
VCC
51
EMLE/NC
VSS
52
TDO/P77
NC
53
TCK/P76
VCC
54
TMS/P75
VCC
55
TRST/NC
RES
56
TDI/PG0
VSS
57
VCC
VCC
58
PF7/φ
NC
59
VSS
VSS
60
PF3/ADTRG/IRQ3
VCC
61
PF0/IRQ2
VCC
62
PA3/SCK2
A1
63
PA2/RxD2
A0
64
PA1/TxD2
OE
Note: * The NC should be left open.
Rev.6.00 Jun. 03, 2008 Page 20 of 698
REJ09B0074-0600
Section 1 Overview
1.5
Pin Functions
Pin No.
Type
Symbol
TFP-100G, BP-112,
TFP-100GV BP-112V
FP-64E,
FP-64EV,
TNP-64B,
TNP-64BV
Power
supply
VCC
62
F9
40
88
C6
57
59
G9
37
90
B6
59
PLLVCC
48
J8
32
Input
Power supply pin for an on-chip
PLL oscillator. Connect this pin to
the system power supply.
PLLVSS
46
K8
30
Input
Ground pin for an on-chip PLL
oscillator
XTAL
60
G11
38
Input
For connection to a crystal
resonator. For examples of crystal
resonator connection and external
clock input, see section 19, Clock
Pulse Generator.
EXTAL
61
G10
39
Input
For connection to a crystal
resonator. An external clock can be
supplied from the EXTAL pin. For
examples of crystal resonator
connection and external clock input,
see section 19, Clock Pulse
Generator.
OSC1
54
J11
34
Input
OSC2
53
J10
33
For connection to a 32.768-kHz
crystal resonator. For examples of
crystal resonator connection, see
section 19, Clock Pulse Generator.
φ
89
A6
58
Output
Supplies the system clock to
external devices.
MD2
16
F4
11
Input
MD1
15
F2
10
Set the operating mode. Inputs at
these pins cannot be modified
during operation.
MD0
14
F1
9
VSS
Clock
Operating
mode
control
I/O
Function
Input
Power supply pins. Connect all
these pins to the system power
supply.
Input
Ground pins. Connect all these pins
to the system power supply (0 V).
Sets the operating mode. Inputs at
these pins should not be changed
during operation. Except for mode
changing, be sure to fix the levels
of the mode pins (MD2 to MD0) by
pulling them down or pulling them
up until the power turns off.
Rev.6.00 Jun. 03, 2008 Page 21 of 698
REJ09B0074-0600
Section 1 Overview
Pin No.
Type
Symbol
TFP-100G, BP-112,
TFP-100GV BP-112V
FP-64E,
FP-64EV,
TNP-64B,
TNP-64BV
System
control
RES*
58
G8
36
Input
Reset pin. When this pin is driven
low, the chip is reset.
STBY*
57
H11
35
Input
When this pin is driven low, a
transition is made to hardware
standby mode.
MRES
55
H9
⎯
Input
When this pin is driven low, a
transition is made to manual reset
mode. (Supported only by the
H8S/2218 Group)
BREQ
97
B4
⎯
Input
Used by an external bus master to
issue a bus request to this LSI
(Supported only by the H8S/2218
Group)
BACK
96
D5
⎯
Output
Indicates that the bus has been
released to an external bus master.
(Supported only by the H8S/2218
Group)
FWE
80
A9
49
Input
Pin for use by flash memory. This
pin is only used in the flash memory
version. In the masked ROM
version, it should be connected to
the system power supply (0 V).
EMLE
82
B8
51
Input
I/O
Function
Emulator enable
When E10A is not used, connect
this pin to the system power supply
(0 V). When E10A is used, this pin
should be fixed high.
Interrupts
NMI*
81
C8
50
Input
Nonmaskable interrupt pin. If this
pin is not used, it should be fixed
high.
IRQ7
25
J2
16
Input
IRQ4
24
H3
15
These pins request a maskable
interrupt.
IRQ3
94
C5
60
IRQ2
97
B4
61
IRQ1
8
D1
7
IRQ0
6
D3
5
Rev.6.00 Jun. 03, 2008 Page 22 of 698
REJ09B0074-0600
Section 1 Overview
Pin No.
TFP-100G, BP-112,
TFP-100GV BP-112V
FP-64E,
FP-64EV,
TNP-64B,
TNP-64BV
I/O
Function
Address bus A23
5
C1
⎯
Output
A22
4
C2
⎯
A21
3
D4
⎯
These pins output an address.
(Supported only by the H8S/2218
Group)
A20
2
B1
⎯
A19
98
A3
⎯
A18
99
C4
⎯
A17
100
B3
⎯
A16
1
B2
⎯
A15
52
K11
⎯
A14
51
K10
⎯
A13
50
L10
⎯
A12
49
K9
⎯
A11
40
K6
⎯
A10
39
L6
⎯
A9
38
J6
⎯
A8
37
K5
⎯
A7
20
H1
⎯
A6
19
G3
⎯
A5
18
G2
⎯
A4
17
G1
⎯
A3
13
F3
⎯
A2
12
E2
⎯
A1
11
E1
⎯
A0
10
E3
⎯
Type
Symbol
Rev.6.00 Jun. 03, 2008 Page 23 of 698
REJ09B0074-0600
Section 1 Overview
Pin No.
Type
Symbol
TFP-100G, BP-112,
TFP-100GV BP-112V
FP-64E,
FP-64EV,
TNP-64B,
TNP-64BV
Data bus
D15
79
B9
⎯
D14
78
D8
⎯
D13
77
A10
⎯
D12
76
B10
⎯
D11
75
B11
⎯
D10
74
C10
⎯
D9
73
D9
⎯
D8
72
C11
⎯
D7
71
D10
⎯
D6
70
E8
⎯
D5
69
D11
⎯
D4
68
E9
⎯
D3
67
E10
⎯
D2
66
E11
⎯
D1
65
F8
⎯
Bus control
I/O
Function
I/O
These pins constitute a bidirectional data bus. (Supported
only by the H8S/2218 Group)
Output
Signals for selecting areas 5 to 0 in
the external address space.
(Supported only by the H8S/2218
Group)
D0
64
F10
⎯
CS5
56
H10
⎯
CS4
63
F11
⎯
CS3
25
J2
⎯
CS2
26
K2
⎯
CS1
27
L2
⎯
CS0
28
H4
⎯
AS
91
D6
⎯
Output
When this pin is low, it indicates
that address output on the address
bus is enabled. (Supported only by
the H8S/2218 Group)
RD
92
A5
⎯
Output
When this pin is low, it indicates
that the external address space can
be read. (Supported only by the
H8S/2218 Group)
Rev.6.00 Jun. 03, 2008 Page 24 of 698
REJ09B0074-0600
Section 1 Overview
Pin No.
Type
Symbol
TFP-100G, BP-112,
TFP-100GV BP-112V
FP-64E,
FP-64EV,
TNP-64B,
TNP-64BV
Bus control
HWR
93
B5
⎯
Output
A strobe signal that writes to
external address space and
indicates that the upper half (D15 to
D8) of the data bus is enabled.
(Supported only by the H8S/2218
Group)
LWR
94
C5
⎯
Output
A strobe signal that writes to
external address space and
indicates that the lower half (D7 to
D0) of the data bus is enabled.
(Supported only by the H8S/2218
Group)
WAIT
95
A4
⎯
Input
Requests insertion of a wait state in
the bus cycle when accessing
external 3-state address space.
(Supported only by the H8S/2218
Group)
TCLKA
4
C2
3
Input
TPU external clock input pins
TCLKB
5
C1
4
TCLKC
7
D2
6
TCLKD
9
E4
8
TIOCA0
2
B1
1
I/O
TIOCB0
3
D4
2
The TGRA_0 to TGRD_0 input
capture input/output compare
output/PWM output pins
TIOCC0
4
C2
3
TIOCD0
5
C1
4
TIOCA1
6
D3
5
I/O
TIOCB1
7
D2
6
The TGRA_1 and TGRB_1 input
capture input/output compare
output/PWM output pins
TIOCA2
8
D1
7
I/O
TIOCB2
9
E4
8
The TGRA_2 and TGRB_2 input
capture input/output compare
output/PWM output pins
21
G4
12
Output
The divided clock output pin
16-bit timer
pulse unit
(TPU)
Realtime
TMOW
clock (RTC)
I/O
Function
Rev.6.00 Jun. 03, 2008 Page 25 of 698
REJ09B0074-0600
Section 1 Overview
Pin No.
TFP-100G, BP-112,
TFP-100GV BP-112V
FP-64E,
FP-64EV,
TNP-64B,
TNP-64BV
I/O
Function
100
B3
64
Output
Data output pins
22
H2
13
99
C4
63
Input
Data input pins
RxD0
23
J1
14
SCK2
98
A3
62
I/O
Clock input/output pins
SCK0
24
H3
15
AN15
35
J5
23
Input
AN14
36
L5
24
Analog input pins for the A/D
converter
AN3
42
K7
26
AN2
43
J7
27
AN1
44
L8
28
AN0
45
H7
29
ADTRG
94
C5
60
Input
Pin for input of an external trigger to
start A/D conversion
Vref
41
H6
25
Input
The reference voltage input pin for
the A/D converter. When the A/D
converter is not used, this pin
should be connected to the system
power supply (VCC).
Boundary
TMS
scan
(Supported
TCK
only by the
HD64F2218
TDO
and
HD64F2218U)
85
C7
54
Input
Control signal input pin for the
boundary scan
84
D7
53
Input
Clock input pin for the boundary
scan
83
A8
52
Output
Data output pin for the boundary
scan
TDI
87
B7
56
Input
Data input pin for the boundary
scan
TRST
86
A7
55
Input
Reset pin for the TAP controller
DrVCC
31
J4
19
Input
Power supply pin for the on-chip
transceiver. Connect this pin to the
system power supply.
DrVSS
34
H5
22
Input
Ground pin for the on-chip
transceiver.
Type
Symbol
Serial
TxD2
communicaTxD0
tion interface
RxD2
(SCI)
A/D
converter
USB
Rev.6.00 Jun. 03, 2008 Page 26 of 698
REJ09B0074-0600
Section 1 Overview
Pin No.
Type
Symbol
TFP-100G, BP-112,
TFP-100GV BP-112V
FP-64E,
FP-64EV,
TNP-64B,
TNP-64BV
USB
USD+*
32
K4
20
USD-*
33
L4
21
VBUS*
29
K3
17
Input
Connection/disconnection detecting
input pin for the USB cable
USPND
21
G4
12
Output
USB suspend output
I/O
Function
I/O
USB data I/O pin
This pin is driven high when a
transition is made to suspend state.
UBPM
47
L9
31
Input
Bus power/self power mode setting
Input
When the USB is used in bus
power mode, this input pin must be
fixed low.
When the USB is used in self
power mode, this input pin must be
fixed high.
I/O port
P36
(PUPD+)
30
L3
18
I/O
Use as D+ signal pull-up control
pin.
P17
9
E4
8
I/O
8-bit I/O pins
P16
8
D1
7
P15
7
D2
6
P14
6
D3
5
P13
5
C1
4
P12
4
C2
3
P11
3
D4
2
P10
2
B1
1
P36
30
L3
18
I/O
4-bit I/O pins
P32
24
H3
15
P31
23
J1
14
P30
22
H2
13
P43
42
K7
26
P42
43
J7
27
P41
44
L8
28
P40
45
H7
29
(Use P36 as D+ signal pull-up
control pin of USB.)
Input
4-bit input pins
Rev.6.00 Jun. 03, 2008 Page 27 of 698
REJ09B0074-0600
Section 1 Overview
Pin No.
Type
Symbol
TFP-100G, BP-112,
TFP-100GV BP-112V
FP-64E,
FP-64EV,
TNP-64B,
TNP-64BV
I/O port
P77
⎯
⎯
52
P76
⎯
⎯
53
P75
⎯
⎯
54
P74
55
H9
⎯
P71
56
H10
⎯
P70
63
F11
⎯
P97
35
J5
23
P96
36
L5
24
PA3
98
A3
62
PA2
99
C4
63
PA1
100
B3
64
PA0
1
B2
⎯
PB7
52
K11
⎯
PB6
51
K10
⎯
PB5
50
L10
⎯
PB4
49
K9
⎯
PB3
40
K6
⎯
PB2
39
L6
⎯
PB1
38
J6
⎯
PB0
37
K5
⎯
PC7
20
H1
⎯
PC6
19
G3
⎯
PC5
18
G2
⎯
PC4
17
G1
⎯
PC3
13
F3
⎯
PC2
12
E2
⎯
PC1
11
E1
⎯
PC0
10
E3
⎯
Rev.6.00 Jun. 03, 2008 Page 28 of 698
REJ09B0074-0600
I/O
Function
I/O
3-bit I/O pins
Input
2-bit input pins
I/O
4-bit I/O pins for the H8S/2218
Group. 3-bit I/O pins for the
H8S/2212 Group.
I/O
8-bit I/O pins (Supported only by
the H8S/2218 Group)
I/O
8-bit I/O pins (Supported only by
the H8S/2218 Group)
Section 1 Overview
Pin No.
Type
Symbol
TFP-100G, BP-112,
TFP-100GV BP-112V
FP-64E,
FP-64EV,
TNP-64B,
TNP-64BV
I/O port
PD7
79
B9
⎯
PD6
78
D8
⎯
PD5
77
A10
⎯
PD4
76
B10
⎯
PD3
75
B11
⎯
PD2
74
C10
⎯
PD1
73
D9
⎯
PD0
72
C11
⎯
PE7
71
D10
48
PE6
70
E8
47
PE5
69
D11
46
PE4
68
E9
45
PE3
67
E10
44
PE2
66
E11
43
PE1
65
F8
42
PE0
64
F10
41
PF7
89
A6
58
PF6
91
D6
⎯
PF5
92
A5
⎯
PF4
93
B5
⎯
PF3
94
C5
60
PF2
95
A4
⎯
PF1
96
D5
⎯
PF0
97
B4
61
PG4
28
H4
⎯
PG3
27
L2
⎯
PG2
26
K2
⎯
PG1
25
J2
16
PG0
⎯
⎯
56
I/O
Function
I/O
8-bit I/O pins (Supported only by
the H8S/2218 Group)
I/O
8-bit I/O pins
I/O
8-bit I/O pins for the H8S/2218
Group. 3-bit I/O pins for the
H8S/2212 Group.
I/O
4-bit I/O pins for the H8S/2218
Group. 2-bit I/O pins for the
H8S/2212 Group.
Note: * Anti-noise measures should be taken to prevent malfunction.
Rev.6.00 Jun. 03, 2008 Page 29 of 698
REJ09B0074-0600
Section 1 Overview
Rev.6.00 Jun. 03, 2008 Page 30 of 698
REJ09B0074-0600
Section 2 CPU
Section 2 CPU
The H8S/2000 CPU is a high-speed central processing unit with an internal 32-bit architecture that
is upward compatible with the H8/300 and H8/300H CPUs. The H8S/2000 CPU has sixteen 16-bit
general registers, can address a 16-Mbyte linear address space, and is ideal for realtime control.
This section describes the H8S/2000 CPU. The usable modes and address spaces differ depending
on the product. For details on each product, refer to section 3, MCU Operating Modes.
2.1
Features
• Upward-compatible with H8/300 and H8/300H CPUs
⎯ Can execute H8/300 and H8/300H CPU object programs
• General-register architecture
⎯ Sixteen 16-bit general registers also usable as sixteen 8-bit registers or eight 32-bit registers
• Sixty-five basic instructions
⎯ 8/16/32-bit arithmetic and logic instructions
⎯ Multiply and divide instructions
⎯ Powerful bit-manipulation instructions
• Eight addressing modes
⎯ Register direct [Rn]
⎯ Register indirect [@ERn]
⎯ Register indirect with displacement [@(d:16,ERn) or @(d:32,ERn)]
⎯ Register indirect with post-increment or pre-decrement [@ERn+ or @–ERn]
⎯ Absolute address [@aa:8, @aa:16, @aa:24, or @aa:32]
⎯ Immediate [#xx:8, #xx:16, or #xx:32]
⎯ Program-counter relative [@(d:8,PC) or @(d:16,PC)]
⎯ Memory indirect [@@aa:8]
• 16-Mbyte address space
⎯ Program: 16 Mbytes
⎯ Data: 16 Mbytes
• High-speed operation
⎯ All frequently-used instructions execute in one or two states
⎯ 8/16/32-bit register-register add/subtract: 1 state
⎯ 8 × 8-bit register-register multiply: 12 states
⎯ 16 ÷ 8-bit register-register divide: 12 states
CPUS211A_010020011200
Rev.6.00 Jun. 03, 2008 Page 31 of 698
REJ09B0074-0600
Section 2 CPU
⎯ 16 × 16-bit register-register multiply: 20 states
⎯ 32 ÷ 16-bit register-register divide: 20 states
• Two CPU operating modes
⎯ Normal mode*
⎯ Advanced mode
Note: * Normal mode is not available in this LSI.
• Power-down state
⎯ Transition to power-down state by SLEEP instruction
⎯ CPU clock speed selection
2.1.1
Differences between H8S/2600 CPU and H8S/2000 CPU
The differences between the H8S/2600 CPU and the H8S/2000 CPU are as shown below.
• Register configuration
The MAC register is supported only by the H8S/2600 CPU.
• Basic instructions
The four instructions MAC, CLRMAC, LDMAC, and STMAC are supported only by the
H8S/2600 CPU.
• The number of execution states of the MULXU and MULXS instructions
Execution States
Instruction
Mnemonic
H8S/2600
H8S/2000
MULXU
MULXU.B Rs, Rd
3
12
MULXU.W Rs, ERd
4
20
MULXS.B Rs, Rd
4
13
MULXS.W Rs, ERd
5
21
MULXS
In addition, there are differences in address space, CCR and EXR register functions, power-down
modes, etc., depending on the model.
Rev.6.00 Jun. 03, 2008 Page 32 of 698
REJ09B0074-0600
Section 2 CPU
2.1.2
Differences from H8/300 CPU
In comparison to the H8/300 CPU, the H8S/2000 CPU has the following enhancements.
• More general registers and control registers
⎯ Eight 16-bit extended registers, and one 8-bit and two 32-bit control registers, have been
added.
• Extended address space
⎯ Normal mode supports the same 64-kbyte address space as the H8/300 CPU.
⎯ Advanced mode supports a maximum 16-Mbyte address space.
• Enhanced addressing
⎯ The addressing modes have been enhanced to make effective use of the 16-Mbyte address
space.
• Enhanced instructions
⎯ Addressing modes of bit-manipulation instructions have been enhanced.
⎯ Signed multiply and divide instructions have been added.
⎯ Two-bit shift instructions have been added.
⎯ Instructions for saving and restoring multiple registers have been added.
⎯ A test and set instruction has been added.
• Higher speed
⎯ Basic instructions execute twice as fast.
2.1.3
Differences from H8/300H CPU
In comparison to the H8/300H CPU, the H8S/2000 CPU has the following enhancements.
• Additional control register
⎯ One 8-bit control registers have been added.
• Enhanced instructions
⎯ Addressing modes of bit-manipulation instructions have been enhanced.
⎯ Two-bit shift instructions have been added.
⎯ Instructions for saving and restoring multiple registers have been added.
⎯ A test and set instruction has been added.
• Higher speed
⎯ Basic instructions execute twice as fast.
Rev.6.00 Jun. 03, 2008 Page 33 of 698
REJ09B0074-0600
Section 2 CPU
2.2
CPU Operating Modes
The H8S/2000 CPU has two operating modes: normal and advanced. Normal mode supports a
maximum 64-kbyte address space. Advanced mode supports a maximum 16-Mbyte total address
space. The mode is selected by the mode pins.
2.2.1
Normal Mode
The exception vector table and stack have the same structure as in the H8/300 CPU.
• Address Space
A maximum address space of 64 kbytes can be accessed.
• Extended Registers (En)
The extended registers (E0 to E7) can be used as 16-bit registers, or as the upper 16-bit
segments of 32-bit registers. When En is used as a 16-bit register it can contain any value, even
when the corresponding general register (Rn) is used as an address register. If the general
register is referenced in the register indirect addressing mode with pre-decrement (@–Rn) or
post-increment (@Rn+) and a carry or borrow occurs, however, the value in the corresponding
extended register (En) will be affected.
• Instruction Set
All instructions and addressing modes can be used. Only the lower 16 bits of effective
addresses (EA) are valid.
• Exception Vector Table and Memory Indirect Branch Addresses
In normal mode the top area starting at H'0000 is allocated to the exception vector table. One
branch address is stored per 16 bits. The exception vector table in normal mode is shown in
figure 2.1. For details of the exception vector table, see section 4, Exception Handling.
The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions
uses an 8-bit absolute address included in the instruction code to specify a memory operand
that contains a branch address. In normal mode the operand is a 16-bit (word) operand,
providing a 16-bit branch address. Branch addresses can be stored in the top area from H'0000
to H'00FF. Note that this area is also used for the exception vector table.
• Stack Structure
When the program counter (PC) is pushed onto the stack in a subroutine call, and the PC,
condition-code register (CCR), and extended control register (EXR) are pushed onto the stack
in exception handling, they are stored as shown in figure 2.2. EXR is not pushed onto the stack
in interrupt control mode 0. For details, see section 4, Exception Handling.
Note: Normal mode is not available in this LSI.
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Section 2 CPU
H'0000
H'0001
H'0002
H'0003
H'0004
H'0005
H'0006
H'0007
H'0008
H'0009
H'000A
H'000B
Reset exception vector
(Reserved for system use)
(Reserved for system use)
Exception
vector table
Exception vector 1
Exception vector 2
Figure 2.1 Exception Vector Table (Normal Mode)
SP
PC
(16 bits)
EXR*1
SP
Reserved*1 *3
( SP*2
)
CCR
CCR*3
PC
(16 bits)
(a) Subroutine Branch
Notes: 1.
2.
3.
(b) Exception Handling
When EXR is not used, it is not stored on the stack.
SP when EXR is not used.
Ignored when returning.
Figure 2.2 Stack Structure in Normal Mode
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Section 2 CPU
2.2.2
Advanced Mode
• Address Space
Linear access is provided to a 16-Mbyte maximum address space.
• Extended Registers (En)
The extended registers (E0 to E7) can be used as 16-bit registers, or as the upper 16-bit
segments of 32-bit registers or address registers.
• Instruction Set
All instructions and addressing modes can be used.
• Exception Vector Table and Memory Indirect Branch Addresses
In advanced mode the top area starting at H'00000000 is allocated to the exception vector table
in units of 32 bits. In each 32 bits, the upper 8 bits are ignored and a branch address is stored in
the lower 24 bits (figure 2.3). For details of the exception vector table, see section 4, Exception
Handling.
H'00000000
Reserved
Reset exception vector
H'00000003
H'00000004
Reserved
(Reserved for system use)
H'00000007
H'00000008
Exception vector table
H'0000000B
H'0000000C
H'00000010
(Reserved for system use)
Reserved
Exception vector 1
Figure 2.3 Exception Vector Table (Advanced Mode)
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Section 2 CPU
The memory indirect addressing mode (@@aa:8) employed in the JMP and JSR instructions
uses an 8-bit absolute address included in the instruction code to specify a memory operand
that contains a branch address. In advanced mode the operand is a 32-bit longword operand,
providing a 32-bit branch address. The upper 8 bits of these 32 bits are a reserved area that is
regarded as H'00. Branch addresses can be stored in the area from H'00000000 to H'000000FF.
Note that the first part of this range is also the exception vector table.
• Stack Structure
In advanced mode, when the program counter (PC) is pushed onto the stack in a subroutine
call, and the PC, condition-code register (CCR), and extended control register (EXR) are
pushed onto the stack in exception handling, they are stored as shown in figure 2.4. When EXR
is invalid, it is not pushed onto the stack. For details, see section 4, Exception Handling.
EXR*1
SP
SP
Reserved*1 *3
Reserved
( SP*2
)
PC
(24 bits)
CCR
PC
(24 bits)
(a) Subroutine Branch
(b) Exception Handling
Notes: 1. When EXR is not used, it is not stored on the stack.
2. SP when EXR is not used.
3. Ignored when returning.
Figure 2.4 Stack Structure in Advanced Mode
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Section 2 CPU
2.3
Address Space
Figure 2.5 shows a memory map of the H8S/2000 CPU. The H8S/2000 CPU provides linear
access to a maximum 64-kbyte address space in normal mode, and a maximum 16-Mbyte
(architecturally 4-Gbyte) address space in advanced mode. The usable modes and address spaces
differ depending on the product. For details on each product, refer to section 3, MCU Operating
Modes.
H'0000
H'00000000
64 kbytes
H'FFFF
16 Mbytes
H'00FFFFFF
Data area
Not available
in this LSI.
H'FFFFFFFF
(a) Normal Mode*
(b) Advanced Mode
Note: * Not available in this LSI.
Figure 2.5 Memory Map
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Program area
Section 2 CPU
2.4
Register Configuration
The H8S/2000 CPU has the internal registers shown in figure 2.6. There are two types of registers:
general registers and control registers. Control registers are a 24-bit program counter (PC), an 8-bit
extended control register (EXR), and an 8-bit condition code register (CCR).
General Registers (Rn) and Extended Registers (En)
15
0 7
0 7
0
ER0
E0
R0H
R0L
ER1
E1
R1H
R1L
ER2
E2
R2H
R2L
ER3
E3
R3H
R3L
ER4
E4
R4H
R4L
ER5
E5
R5H
R5L
ER6
E6
R6H
R6L
ER7 (SP)
E7
R7H
R7L
Control Registers (CR)
23
0
PC
7 6 5 4 3 2 1 0
- - - - I2 I1 I0
EXR T
7 6 5 4 3 2 1 0
CCR I UI H U N Z V C
Legend:
SP:
PC:
EXR:
T:
I2 to I0:
CCR:
I:
UI:
Stack pointer
Program counter
Extended control register
Trace bit
Interrupt mask bits
Condition-code register
Interrupt mask bit
User bit or interrupt mask bit*
H:
U:
N:
Z:
V:
C:
Half-carry flag
User bit
Negative flag
Zero flag
Overflow flag
Carry flag
Note: * Cannot be used as an interrupt mask bit in this LSI.
Figure 2.6 CPU Registers
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Section 2 CPU
2.4.1
General Registers
The H8S/2000 CPU has eight 32-bit general registers. These general registers are all functionally
alike and can be used as both address registers and data registers. When a general register is used
as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. Figure 2.7 illustrates the
usage of the general registers. When the general registers are used as 32-bit registers or address
registers, they are designated by the letters ER (ER0 to ER7).
The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R
(R0 to R7). These registers are functionally equivalent, providing a maximum sixteen 16-bit
registers. The E registers (E0 to E7) are also referred to as extended registers.
The R registers divide into 8-bit general registers designated by the letters RH (R0H to R7H) and
RL (R0L to R7L). These registers are functionally equivalent, providing a maximum sixteen 8-bit
registers.
The usage of each register can be selected independently.
General register ER7 has the function of stack pointer (SP) in addition to its general-register
function, and is used implicitly in exception handling and subroutine calls. Figure 2.8 shows the
stack.
• Address registers
• 32-bit registers
• 16-bit registers
• 8-bit registers
E registers (extended registers)
(E0 to E7)
ER registers
(ER0 to ER7)
RH registers
(R0H to R7H)
R registers
(R0 to R7)
RL registers
(R0L to R7L)
Figure 2.7 Usage of General Registers
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Section 2 CPU
Free area
SP (ER7)
Stack area
Figure 2.8 Stack
2.4.2
Program Counter (PC)
This 24-bit counter indicates the address of the next instruction the CPU will execute. The length
of all CPU instructions is two bytes (one word), so the least significant PC bit is ignored. (When an
instruction is fetched, the least significant PC bit is regarded as 0.)
2.4.3
Extended Control Register (EXR)
EXR is an 8-bit register that manipulates the LDC, STC, ANDC, ORC, and XORC instructions.
When these instructions except for the STC instruction is executed, all interrupts including NMI
will be masked for three states after execution is completed.
Bit
Bit Name
Initial Value R/W
Description
7
T
0
Trace Bit
R/W
When this bit is set to 1, a trace exception is generated
each time an instruction is executed. When this bit is
cleared to 0, instructions are executed in sequence.
6 to 3 –
All 1
–
Reserved
These bits are always read as 1.
2
I2
1
I1
0
I0
1
R/W
These bits designate the interrupt mask level (0 to 7).
For details, refer to section 5, Interrupt Controller.
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Section 2 CPU
2.4.4
Condition-Code Register (CCR)
This 8-bit register contains internal CPU status information, including an interrupt mask bit (I) and
half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags.
Operations can be performed on the CCR bits by the LDC, STC, ANDC, ORC, and XORC
instructions. The N, Z, V, and C flags are used as branching conditions for conditional branch
(Bcc) instructions.
Bit
Bit Name
Initial Value
R/W Description
7
I
1
R/W Interrupt Mask Bit
Masks interrupts other than NMI when set to 1. NMI is
accepted regardless of the I bit setting. The I bit is set to 1
by hardware at the start of an exception-handling
sequence. For details, refer to section 5, Interrupt
Controller.
6
UI
undefined
R/W User Bit or Interrupt Mask Bit
Can be written and read by software using the LDC, STC,
ANDC, ORC, and XORC instructions. This bit cannot be
used as an interrupt mask bit in this LSI.
5
H
undefined
R/W Half-Carry Flag
When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B or
NEG.B instruction is executed, this flag is set to 1 if there is
a carry or borrow at bit 3, and cleared to 0 otherwise. When
the ADD.W, SUB.W, CMP.W, or NEG.W instruction is
executed, the H flag is set to 1 if there is a carry or borrow
at bit 11, and cleared to 0 otherwise. When the ADD.L,
SUB.L, CMP.L, or NEG.L instruction is executed, the H flag
is set to 1 if there is a carry or borrow at bit 27, and cleared
to 0 otherwise.
4
U
undefined
R/W User Bit
Can be written and read by software using the LDC, STC,
ANDC, ORC, and XORC instructions.
3
N
undefined
R/W Negative Flag
Stores the value of the most significant bit of data as a sign
bit.
2
Z
undefined
R/W Zero Flag
Set to 1 to indicate zero data, and cleared to 0 to indicate
non-zero data.
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Section 2 CPU
Bit
Bit Name
Initial Value
R/W Description
1
V
undefined
R/W Overflow Flag
Set to 1 when an arithmetic overflow occurs, and cleared to
0 at other times.
0
C
undefined
R/W Carry Flag
Set to 1 when a carry occurs, and cleared to 0 otherwise.
Used by:
•
Add instructions, to indicate a carry
•
Subtract instructions, to indicate a carry
•
Shift and rotate instructions, to indicate a carry
They carry flag is also used as a bit accumulator by bit
manipulation instructions.
2.4.5
Initial Register Values
Reset exception handling loads the CPU's program counter (PC) from the vector table, clears the
trace bit in EXR to 0, and sets the interrupt mask bits in CCR and EXR to 1. The other CCR bits
and the general registers are not initialized. In particular, the stack pointer (ER7) is not initialized.
The stack pointer should therefore be initialized by an MOV.L instruction executed immediately
after a reset.
2.5
Data Formats
The H8S/2000 CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit
(longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2,
…, 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two
digits of 4-bit BCD data.
2.5.1
General Register Data Formats
Figure 2.9 shows the data formats in general registers.
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Section 2 CPU
Data Type
Register Number
Data Image
7
0
1-bit data
RnH
7 6 5 4 3 2 1 0
1-bit data
RnL
Don't care
4-bit BCD data
RnH
4-bit BCD data
RnL
Byte data
RnH
Don't care
7
7
4 3
Upper
0
7 6 5 4 3 2 1 0
0
Lower
Don't care
7
Don't care
7
4 3
Upper
0
Don't care
MSB
LSB
7
RnL
Byte data
0
Lower
0
Don't care
MSB
LSB
Figure 2.9 General Register Data Formats (1)
Data Type
Register Number
Word data
Rn
Data Image
15
0
MSB
Word data
15
0
MSB
Longword data
LSB
En
LSB
ERn
31
16 15
MSB
En
0
Rn
Legend:
ERn:
En:
Rn:
RnH:
RnL:
MSB:
LSB:
General register ER
General register E
General register R
General register RH
General register RL
Most significant bit
Least significant bit
Figure 2.9 General Register Data Formats (2)
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LSB
Section 2 CPU
2.5.2
Memory Data Formats
Figure 2.10 shows the data formats in memory. The H8S/2000 CPU can access word data and
longword data in memory, but word or longword data must begin at an even address. If an attempt
is made to access word or longword data at an odd address, no address error occurs but the least
significant bit of the address is regarded as 0, so the access starts at the preceding address. This
also applies to instruction fetches.
When SP (ER7) is used as an address register to access the stack, the operand size should be word
size or longword size.
Data Type
Address
Data Image
1-bit data
Address L
7
Byte data
Address L
MSB
Word data
Address 2M
MSB
7
0
6
5
4
3
2
Address 2N
0
LSB
LSB
Address 2M+1
Longword data
1
MSB
Address 2N+1
Address 2N+2
LSB
Address 2N+3
Figure 2.10 Memory Data Formats
2.6
Instruction Set
The H8S/2000 CPU has 65 types of instructions. The instructions are classified by function in
table 2.1.
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Section 2 CPU
Table 2.1
Instruction Classification
Function
Instructions
Data transfer
MOV
1
1
POP* , PUSH*
5
LDM* , STM*
Arithmetic
operations
Types
B/W/L
5
W/L
5
3
Size
L
3
MOVFPE* , MOVTPE*
B
ADD, SUB, CMP, NEG
B/W/L
ADDX, SUBX, DAA, DAS
B
INC, DEC
B/W/L
ADDS, SUBS
L
MULXU, DIVXU, MULXS, DIVXS
B/W
EXTU, EXTS
W/L
4
19
TAS*
B
Logic operations
AND, OR, XOR, NOT
B/W/L
4
Shift
SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL,
ROTXR
B/W/L
8
Bit manipulation
BSET, BCLR, BNOT, BTST, BLD, BILD, BST, BIST, BAND, B
BIAND, BOR, BIOR, BXOR, BIXOR
Branch
Bcc* , JMP, BSR, JSR, RTS
–
5
System control
TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC,
NOP
–
9
–
1
2
Block data transfer EEPMOV
14
Total: 65
Legend:
Notes: 1.
2.
3.
4.
5.
B: Byte size
W: Word size
L: Longword size
POP.W Rn and PUSH.W Rn are identical to MOV.W @SP+, Rn and MOV.W Rn, @SP. POP.L ERn and PUSH.L ERn are identical to MOV.L @SP+, ERn and MOV.L ERn,
@-SP.
Bcc is the general name for conditional branch instructions.
Cannot be used in this LSI.
Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
ER7 is used as a stack pointer in STM and LDM instructions. ER7, therefore, should not
be used as a saving (STM) or restoring (LDM) register.
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Section 2 CPU
2.6.1
Table of Instructions Classified by Function
Tables 2.3 to 2.10 summarizes the instructions in each functional category. The notation used in
tables 2.3 to 2.10 is defined below.
Table 2.2
Operation Notation
Symbol
Description
Rd
General register (destination)*
Rs
General register (source) *
Rn
General register*
ERn
General register (32-bit register)
(EAd)
Destination operand
(EAs)
Source operand
EXR
Extended control register
CCR
Condition-code register
N
N (negative) flag in CCR
Z
Z (zero) flag in CCR
V
V (overflow) flag in CCR
C
C (carry) flag in CCR
PC
Program counter
SP
Stack pointer
#IMM
Immediate data
disp
Displacement
+
Addition
–
Subtraction
×
Multiplication
÷
Division
∧
Logical AND
∨
Logical OR
⊕
Logical exclusive OR
→
Move
∼
NOT (logical complement)
:8/:16/:24/:32
8-, 16-, 24-, or 32-bit length
Note: * General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to
R7, E0 to E7), and 32-bit registers (ER0 to ER7).
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Section 2 CPU
Table 2.3
Data Transfer Instructions
1
Instruction
Size*
Function
MOV
B/W/L
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
MOVFPE
B
Cannot be used in this LSI.
MOVTPE
B
Cannot be used in this LSI.
POP
W/L
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn
PUSH
W/L
Rn → @-SP
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @-SP. PUSH.L ERn is identical to MOV.L ERn, @-SP.
2
LDM*
L
@SP+ → Rn (register list)
Pops two or more general registers from the stack.
2
STM*
L
Rn (register list) → @-SP
Pushes two or more general registers onto the stack.
Notes: 1. Size refers to the operand size.
B: Byte
W: Word
L: Longword
2. ER7 is used as a stack pointer in STM and LDM instructions. ER7, therefore, should not
be used as a saving (STM) or restoring (LDM) register.
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Section 2 CPU
Table 2.4
Arithmetic Operations Instructions
1
Instruction Size*
Function
ADD
Rd ± Rs → Rd, Rd ± #IMM → Rd
B/W/L
SUB
ADDX
Performs addition or subtraction on data in two general registers, or on
immediate data and data in a general register. (Immediate byte data
cannot be subtracted from byte data in a general register. Use the SUBX
or ADD instruction.)
B
SUBX
INC
Performs addition or subtraction with carry or borrow on byte data in two
general registers, or on immediate data and data in a general register.
B/W/L
DEC
ADDS
L
Rd ± 1 → Rd, Rd ± 2 → Rd, Rd ± 4 → Rd
Adds or subtracts the value 1,2, or 4 to or from data in a 32-bit register.
B
DAS
MULXU
Rd ± 1 → Rd, Rd ± 2 → Rd
Increments or decrements a general register by 1 or 2. (Byte operands
can be incremented or decremented by 1 only.)
SUBS
DAA
Rd ± Rs ± C → Rd, Rd ± #IMM ± C → Rd
Rd (decimal adjust) → Rd
Decimal-adjusts an addition or subtraction result in a general register by
referring to the OCR to produce 4-bit BCD data.
B/W
Rd × Rs → Rd
Performs unsigned multiplication on data in two general registers: either
8 bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
MULXS
B/W
Rd × Rs → Rd
Performs signed multiplication on data in two general registers: either 8
bits × 8 bits → 16 bits or 16 bits × 16 bits → 32 bits.
DIVXU
B/W
Rd ÷ Rs → Rd
Performs unsigned division on data in two general registers: either 16
bits ÷ 8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits →
16-bit quotient and 16-bit remainder.
DIVXS
B/W
Rd ÷ Rs → Rd
Performs signed division on data in two general registers: either 16 bits ÷
8 bits → 8-bit quotient and 8-bit remainder or 32 bits ÷ 16 bits → 16-bit
quotient and 16-bit remainder.
CMP
B/W/L
Rd – Rs, Rd – #IMM
Compares data in a general register with data in another general register
or with immediate data, and sets CCR bits according to the result.
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Section 2 CPU
1
Instruction Size*
Function
NEG
0 – Rd → Rd
B/W/L
Takes the two's complement (arithmetic complement) of data in a
general register.
EXTU
W/L
Rd (zero extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16
bits of a 32-bit register to longword size, by padding with zeros on the
left.
EXTS
W/L
Rd (sign extension) → Rd
Extends the lower 8 bits of a 16-bit register to word size, or the lower 16
bits of a 32-bit register to longword size, by extending the sign bit.
2
TAS*
B
@ERd – 0, 1 → (<bit 7> of @ERd)
Tests memory contents, and sets the most significant bit (bit 7) to 1.
Notes: 1. Size refers to the operand size.
B: Byte
W: Word
L: Longword
2. Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction.
Table 2.5
Logic Operations Instructions
Instruction Size*
Function
AND
Rd ∧ Rs → Rd, Rd ∧ #IMM → Rd
B/W/L
Performs a logical AND operation on a general register and another
general register or immediate data.
OR
B/W/L
Rd ∨ Rs → Rd, Rd ∨ #IMM → Rd
Performs a logical OR operation on a general register and another
general register or immediate data.
XOR
B/W/L
Rd ⊕ Rs → Rd, Rd ⊕ #IMM → Rd
Performs a logical exclusive OR operation on a general register and
another general register or immediate data.
NOT
B/W/L
∼ Rd → Rd
Takes the one's complement (logical complement) of general register
contents.
Note: * Size refers to the operand size.
B: Byte
W: Word
L: Longword
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Section 2 CPU
Table 2.6
Shift Instructions
Instruction Size*
Function
SHAL
Rd (shift) → Rd
B/W/L
SHAR
SHLL
Performs an arithmetic shift on general register contents. 1-bit or 2 bit
shift is possible.
B/W/L
SHLR
ROTL
B/W/L
ROTR
ROTXL
ROTXR
Rd (shift) → Rd
Performs an logical shift on general register contents. 1-bit or 2 bit shift is
possible.
Rd (rotate) → Rd
Rotates general register contents. 1-bit or 2 bit rotation is possible.
B/W/L
Rd (rotate) → Rd
Rotates general register contents through the carry flag. 1-bit or 2 bit
rotation is possible.
Note: * Size refers to the operand size.
B: Byte
W: Word
L: Longword
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Section 2 CPU
Table 2.7
Bit Manipulation Instructions
Instruction Size*
Function
BSET
1 → (<bit-No.> of <EAd>)
B
Sets a specified bit in a general register or memory operand to 1. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BCLR
B
0 → (<bit-No.> of <EAd>)
Clears a specified bit in a general register or memory operand to 0. The
bit number is specified by 3-bit immediate data or the lower three bits of
a general register.
BNOT
B
∼ (<bit-No.> of <EAd>) → (<bit-No.> of <EAd>)
Inverts a specified bit in a general register or memory operand. The bit
number is specified by 3-bit immediate data or the lower three bits of a
general register.
BTST
B
∼ (<bit-No.> of <EAd>) → Z
Tests a specified bit in a general register or memory operand and sets or
clears the Z flag accordingly. The bit number is specified by 3-bit
immediate data or the lower three bits of a general register.
BAND
B
C ∧ (<bit-No.> of <EAd>) → C
ANDs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIAND
B
C ∧ ∼ (<bit-No.> of <EAd>) → C
ANDs the carry flag with the inverse of a specified bit in a general
register or memory operand and stores the result in the carry flag. The
bit number is specified by 3-bit immediate data.
BOR
B
C ∨ (<bit-No.> of <EAd>) → C
ORs the carry flag with a specified bit in a general register or memory
operand and stores the result in the carry flag.
BIOR
B
C ∨ ∼ (<bit-No.> of <EAd>) → C
ORs the carry flag with the inverse of a specified bit in a general register
or memory operand and stores the result in the carry flag. The bit
number is specified by 3-bit immediate data.
Note: * Size refers to the operand size.
B: Byte
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Section 2 CPU
Instruction Size*
Function
BXOR
C ⊕ (<bit-No.> of <EAd>) → C
B
Exclusive-ORs the carry flag with a specified bit in a general register or
memory operand and stores the result in the carry flag.
BIXOR
B
C ⊕ ∼ (<bit-No.> of <EAd>) → C
Exclusive-ORs the carry flag with the inverse of a specified bit in a
general register or memory operand and stores the result in the carry
flag. The bit number is specified by 3-bit immediate data.
BLD
B
(<bit-No.> of <EAd>) → C
Transfers a specified bit in a general register or memory to the carry flag.
BILD
B
∼ (<bit-No.> of <EAd>) → C
Transfers the inverse of a specified bit in a general register or memory
operand to the carry flag. The bit number is specified by 3-bit immediate
data.
BST
B
C → (<bit-No.> of <EAd>)
Transfers the carry flag value to a specified bit in a general register or
memory operand.
BIST
B
∼ C → (<bit-No.> of <EAd>)
Transfers the inverse of the carry flag value to a specified bit in a general
register or memory operand. The bit number is specified by 3-bit
immediate data.
Note:* Size refers to the operand size.
B: Byte
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Section 2 CPU
Table 2.8
Branch Instructions
Instruction
Size
Function
Bcc
–
Branches to a specified address if a specified condition is true. The
branching conditions are listed below.
Mnemonic
Description
Condition
BRA (BT)
Always (true)
Always
BRN (BF)
Never (false)
Never
BHI
High
C∨Z=0
BLS
Low or same
C∨Z=1
BCC (BHS)
Carry clear
C=0
(high or same)
BCS (BLO)
Carry set (low)
C=1
BNE
Not equal
Z=0
BEQ
Equal
Z=1
BVC
Overflow clear
V=0
BVS
Overflow set
V=1
BPL
Plus
N=0
BMI
Minus
N=1
BGE
Greater or equal
N⊕V=0
BLT
Less than
N⊕V=1
BGT
Greater than
Z ∨ (N ⊕ V) = 0
BLE
Less or equal
Z ∨ (N ⊕ V) = 1
JMP
–
Branches unconditionally to a specified address.
BSR
–
Branches to a subroutine at a specified address
JSR
–
Branches to a subroutine at a specified address
RTS
–
Returns from a subroutine
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Section 2 CPU
Table 2.9
System Control Instruction
Instruction
Size*
Function
TRAPA
–
Starts trap-instruction exception handling.
RTE
–
Returns from an exception-handling routine.
SLEEP
–
Causes a transition to a power-down state.
LDC
B/W
(EAs) → CCR, (EAs) → EXR
Moves the source operand contents or immediate data to CCR or EXR.
Although CCR and EXR are 8-bit registers, word-size transfers are
performed between them and memory. The upper 8 bits are valid.
STC
B/W
CCR → (EAd), EXR → (EAd)
Transfers CCR or EXR contents to a general register or memory.
Although CCR and EXR are 8-bit registers, word-size transfers are
performed between them and memory. The upper 8 bits are valid.
ANDC
B
CCR ∧ #IMM → CCR, EXR ∧ #IMM → EXR
Logically ANDs the CCR or EXR contents with immediate data.
ORC
B
CCR ∨ #IMM → CCR, EXR ∨ #IMM → EXR
XORC
B
CCR ⊕ #IMM → CCR, EXR ⊕ #IMM → EXR
Logically ORs the CCR or EXR contents with immediate data.
Logically exclusive-ORs the CCR or EXR contents with immediate data.
NOP
–
PC + 2 → PC
Only increments the program counter.
Note:* Size refers to the operand size.
B: Byte
W: Word
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Section 2 CPU
Table 2.10 Block Data Transfer Instruction
Instruction
Size
Function
EEPMOV.B
–
if R4L ≠ 0 then
Repeat @ER5+ → @ER6+
R4L–1 → R4L
Until R4L = 0
else next;
EEPMOV.W
–
if R4 ≠ 0 then
Repeat @ER5+ → @ER6+
R4–1 → R4
Until R4 = 0
else next;
Transfer a data block. Starting from the address set in ER5, transfers
data for the number of bytes set in R4L or R4 to the address location
set in ER6.
Execution of the next instruction begins as soon as the transfer is
completed.
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Section 2 CPU
2.6.2
Basic Instruction Formats
The H8S/2000 CPU instructions consist of 2-byte (1-word) units. An instruction consists of an
operation field (op), a register field (r), an effective address extension (EA), and a condition field
(cc).
Figure 2.11 shows examples of instruction formats.
• Operation Field
Indicates the function of the instruction, the addressing mode, and the operation to be carried
out on the operand. The operation field always includes the first four bits of the instruction.
Some instructions have two operation fields.
• Register Field
Specifies a general register. Address registers are specified by 3 bits, data registers by 3 bits or
4 bits. Some instructions have two register fields. Some have no register field.
• Effective Address Extension
8, 16, or 32 bits specifying immediate data, an absolute address, or a displacement.
• Condition Field
Specifies the branching condition of Bcc instructions.
(1) Operation field only
op
NOP, RTS, etc.
(2) Operation field and register fields
op
rm
rn
ADD.B Rn, Rm, etc.
(3) Operation field, register fields, and effective address extension
op
rn
rm
MOV.B @(d:16, Rn), Rm, etc.
EA(disp)
(4) Operation field, effective address extension, and condition field
op
cc
EA(disp)
BRA d:16, etc.
Figure 2.11 Instruction Formats (Examples)
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Section 2 CPU
2.7
Addressing Modes and Effective Address Calculation
The H8S/2000 CPU supports the eight addressing modes listed in table 2.11. Each instruction uses
a subset of these addressing modes. Arithmetic and logic instructions can use the register direct
and immediate modes. Data transfer instructions can use all addressing modes except programcounter relative and memory indirect. Bit manipulation instructions use register direct, register
indirect, or absolute addressing mode to specify an operand, and register direct (BSET, BCLR,
BNOT, and BTST instructions) or immediate (3-bit) addressing mode to specify a bit number in
the operand.
Table 2.11 Addressing Modes
No. Addressing Mode
Symbol
1
Register direct
Rn
2
Register indirect
@ERn
3
Register indirect with displacement
@(d:16,ERn)/@(d:32,ERn)
4
Register indirect with post-increment
@ERn+
Register indirect with pre-decrement
@–ERn
5
Absolute address
@aa:8/@aa:16/@aa:24/@aa:32
6
Immediate
#xx:8/#xx:16/#xx:32
7
Program-counter relative
@(d:8,PC)/@(d:16,PC)
8
Memory indirect
@@aa:8
2.7.1
Register Direct—Rn
The register field of the instruction specifies an 8-, 16-, or 32-bit general register containing the
operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7
can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers.
2.7.2
Register Indirect—@ERn
The register field of the instruction code specifies an address register (ERn) which contains the
address of the operand on memory. If the address is a program instruction address, the lower 24
bits are valid and the upper 8 bits are all assumed to be 0 (H'00).
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Section 2 CPU
2.7.3
Register Indirect with Displacement—@(d:16, ERn) or @(d:32, ERn)
A 16-bit or 32-bit displacement contained in the instruction is added to an address register (ERn)
specified by the register field of the instruction, and the sum gives the address of a memory
operand. A 16-bit displacement is sign-extended when added.
2.7.4
Register Indirect with Post-Increment or Pre-Decrement—@ERn+ or @-ERn
Register Indirect with Post-Increment—@ERn+: The register field of the instruction code
specifies an address register (ERn) which contains the address of a memory operand. After the
operand is accessed, 1, 2, or 4 is added to the address register contents and the sum is stored in the
address register. The value added is 1 for byte access, 2 for word transfer instruction, or 4 for
longword transfer instruction. For word or longword transfer instruction, the register value should
be even.
Register Indirect with Pre-Decrement—@-ERn: The value 1, 2, or 4 is subtracted from an
address register (ERn) specified by the register field in the instruction code, and the result becomes
the address of a memory operand. The result is also stored in the address register. The value
subtracted is 1 for byte access, 2 for word transfer instruction, or 4 for longword transfer
instruction. For word or longword transfer instruction, the register value should be even.
2.7.5
Absolute Address—@aa:8, @aa:16, @aa:24, or @aa:32
The instruction code contains the absolute address of a memory operand. The absolute address
may be 8 bits long (@aa:8), 16 bits long (@aa:16), 24 bits long (@aa:24), or 32 bits long
(@aa:32). Table 2.12 indicates the accessible absolute address ranges.
To access data, the absolute address should be 8 bits (@aa:8), 16 bits (@aa:16), or 32 bits
(@aa:32) long. For an 8-bit absolute address, the upper 24 bits are all assumed to be 1 (H'FFFF).
For a 16-bit absolute address the upper 16 bits are a sign extension. A 32-bit absolute address can
access the entire address space.
A 24-bit absolute address (@aa:24) indicates the address of a program instruction. The upper 8 bits
are all assumed to be 0 (H'00).
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Section 2 CPU
Table 2.12 Absolute Address Access Ranges
Absolute Address
Data address
Normal Mode*
Advanced Mode
8 bits (@aa:8)
H'FF00 to H'FFFF
H'FFFF00 to H'FFFFFF
16 bits (@aa:16)
H'0000 to H'FFFF
H'000000 to H'007FFF,
H'FF8000 to H'FFFFFF
32 bits (@aa:32)
Program instruction
address
H'000000 to H'FFFFFF
24 bits (@aa:24)
Note: * Not available in this LSI.
2.7.6
Immediate—#xx:8, #xx:16, or #xx:32
The instruction contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an
operand.
The ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. Some bit
manipulation instructions contain 3-bit immediate data in the instruction code, specifying a bit
number. The TRAPA instruction contains 2-bit immediate data in its instruction code, specifying a
vector address.
2.7.7
Program-Counter Relative—@(d:8, PC) or @(d:16, PC)
This mode is used in the Bcc and BSR instructions. An 8-bit or 16-bit displacement contained in
the instruction is sign-extended and added to the 24-bit PC contents to generate a branch address.
Only the lower 24 bits of this branch address are valid; the upper 8 bits are all assumed to be 0
(H'00). The PC value to which the displacement is added is the address of the first byte of the next
instruction, so the possible branching range is –126 to +128 bytes (–63 to +64 words) or –32766 to
+32768 bytes (–16383 to +16384 words) from the branch instruction. The resulting value should
be an even number.
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Section 2 CPU
2.7.8
Memory Indirect—@@aa:8
This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit
absolute address specifying a memory operand. This memory operand contains a branch address.
The upper bits of the absolute address are all assumed to be 0, so the address range is 0 to 255
(H'0000 to H'00FF in normal mode*, H'000000 to H'0000FF in advanced mode). In normal mode
the memory operand is a word operand and the branch address is 16 bits long. In advanced mode
the memory operand is a longword operand, the first byte of which is assumed to be H'00.
Note that the first part of the address range is also the exception vector area. For further details,
refer to section 4, Exception Handling.
If an odd address is specified in word or longword memory access, or as a branch address, the least
significant bit is regarded as 0, causing data to be accessed or instruction code to be fetched at the
address preceding the specified address. (For further information, see section 2.5.2, Memory Data
Formats.)
Note: * Not available in this LSI.
Specified
by @aa:8
Branch address
Specified
by @aa:8
Reserved
Branch address
(a) Normal Mode*
(b) Advanced Mode
Note: * Normal mode is not available in this LSI.
Figure 2.12 Branch Address Specification in Memory Indirect Mode
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Section 2 CPU
2.7.9
Effective Address Calculation
Table 2.13 indicates how effective addresses are calculated in each addressing mode. In normal
mode the upper 8 bits of the effective address are ignored in order to generate a 16-bit address.
Table 2.13 Effective Address Calculation
No
1
Addressing Mode and Instruction Format
op
2
Effective Address Calculation
Effective Address (EA)
Register direct (Rn)
rm
Operand is general register contents.
rn
Register indirect (@ERn)
31
0
op
3
31
24 23
0
Don't care
General register contents
r
Register indirect with displacement
@(d:16,ERn) or @(d:32,ERn)
31
0
General register contents
op
r
31
disp
31
Register indirect with post-increment or
pre-decrement
•Register indirect with post-increment @ERn+
op
disp
31
0
31
24 23
1, 2, or 4
31
0
General register contents
31
24 23
Don't care
op
0
Don't care
General register contents
r
•Register indirect with pre-decrement @-ERn
0
0
Sign extension
4
24 23
Don't care
r
1, 2, or 4
Operand Size
Byte
Word
Longword
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Offset
1
2
4
0
Section 2 CPU
No
5
Addressing Mode and Instruction Format
Effective Address Calculation
Effective Address (EA)
Absolute address
@aa:8
31
op
@aa:16
31
op
0
H'FFFF
24 23
16 15
0
Don't care Sign extension
abs
@aa:24
31
op
8 7
24 23
Don't care
abs
24 23
0
Don't care
abs
@aa:32
op
31
6
Immediate
#xx:8/#xx:16/#xx:32
op
7
0
24 23
Don't care
abs
Operand is immediate data.
IMM
23
Program-counter relative
0
PC contents
@(d:8,PC)/@(d:16,PC)
op
disp
0
23
Sign
extension
disp
31
24 23
0
Don't care
8
Memory indirect @@aa:8
•Normal mode*
31
op
abs
8 7
0
abs
H'000000
15
0
31
24 23
Don't care
Memory contents
16 15
0
H'00
•Advanced mode
8 7
31
op
abs
H'000000
0
abs
0
31
31
24 23
Don't care
0
Memory contents
Note: * Normal mode is not available in this LSI.
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Section 2 CPU
2.8
Processing States
The H8S/2000 CPU has five main processing states: the reset state, exception handling state,
program execution state, bus-released state, and power-down state. Figure 2.13 indicates the state
transitions.
• Reset State
In this state the CPU and internal peripheral modules are all initialized and stop. When the RES
input goes low all current processing stops and the CPU enters the reset state. All interrupts are
masked in the reset state. Reset exception handling starts when the RES signal changes from
low to high. For details, refer to section 4, Exception Handling.
The reset state can also be entered by a watchdog timer overflow.
• Exception-Handling State
The exception-handling state is a transient state that occurs when the CPU alters the normal
processing flow due to an exception source, such as, a reset, trace, interrupt, or trap instruction.
The CPU fetches a start address (vector) from the exception vector table and branches to that
address. For further details, refer to section 4, Exception Handling.
• Program Execution State
In this state the CPU executes program instructions in sequence.
• Bus-Released State
In a product which has a bus master other than the CPU, such as a direct memory access
controller (DMAC) and a data transfer controller (DTC), the bus-released state occurs when the
bus has been released in response to a bus request from a bus master other than the CPU. While
the bus is released, the CPU halts operations.
• Power-Down State
This is a power-down state in which the CPU stops operating. The program stop state occurs
when a SLEEP instruction is executed or the CPU enters hardware standby mode. For details,
refer to section 20, Power-Down Modes.
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Section 2 CPU
End of bus request
Bus request
ha
nd
lin
g
SLEEP instruction,
SSBY = 0
Sleep mode
equ
pt r
rru
Inte
est
SLEEP instruction,
SSBY = 1
En
Re
qu
es
tf
or
n
ex
ce
Bus-released state
d
o
ha f ex
nd ce
lin pti
g o
Program execution state
pt
io n
s
bu
t
of est
d
es
qu
En requ
re
s
Bu
Exception handling state
RES = High
MRES = High
External interrupt request
Software standby mode
STBY = High, RES = Low
Reset state*1
Hardware standby mode*2
Power-down state*3
Notes: 1. From any state except hardware standby mode, a transition to the reset state occurs whenever RES
goes low. A transition can also be made to the reset state when the watchdog timer overflows.
From any state except hardware standby mode and power-on reset state, a transition to the manual
reset state occurs whenever MRES goes low.
2. From any state, a transition to hardware standby mode occurs when STBY goes low.
3. Apart from these states, there are also the watch mode, subactive mode, and the subsleep mode.
See section 20, Power-Down Modes.
Figure 2.13 State Transitions
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Section 2 CPU
2.9
Usage Notes
2.9.1
Note on TAS Instruction Usage
Only register ER0, ER1, ER4, or ER5 should be used when using the TAS instruction. The TAS
instruction is not generated by the Renesas Technology H8S and H8/300 Series C/C++ compilers.
If the TAS instruction is used as a user-defined intrinsic function, ensure that only register ER0,
ER1, ER4, or ER5 is used.
2.9.2
STM/LTM Instruction Usage
With the STM or LDM instruction, the ER7 register is used as the stack pointer, and thus cannot
be used as a register that allows save (STM) or restore (LDM) operation.
With a single STM or LDM instruction, two to four registers can be saved or restored. The
available registers are as follows:
For two registers: ER0 and ER1, ER2 and ER3, or ER4 and ER5
For three registers: ER0 to ER2, or ER4 to ER6
For four registers: ER0 to ER3
For the Renesas Technology H8S or H8/300 Series C/C++ Compiler, the STM/LDM instruction
including ER7 is not created.
2.9.3
Note on Bit Manipulation Instructions
Using bit manipulation instructions on registers containing write-only bits can result in the bits that
should have been manipulated not being manipulated as intended or in the wrong bits being
manipulated.
Reading data from a register containing write-only bits may return fixed or undefined values.
Consequently, bit manipulation instructions that use the read values to perform operations (BNOT,
BTST, BAND, BIAND, BOR, BIOR, BXOR, BIXOR, BLD, and BILD) will not work properly.
In addition, bit manipulation instructions that write data following operations based on the data
values read (BSET, BCLR, BNOT, BST, and BIST) may change the values of bits unrelated to the
intended bit manipulation. Therefore, caution is necessary when using bit manipulation
instructions on registers containing write-only bits.
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Section 2 CPU
The instructions BSET, BCLR, BNOT, BST, and BIST perform the following operations in the
order shown:
1. Read data in byte units
2. Perform bit manipulation on the read data according to the instruction
3. Write data in byte units
Example: Using the BCLR instruction to clear pin 14 only of P1DDR for port 1
P1DDR is an 8-bit register that contains write-only bits. It is used to specify the I/O setting of the
individual pins in port 1. Reading produces invalid data. Attempting to read from P1DDR returns
undefined values.
In this example, the BCLR instruction is used to set pin 14 as an input port. Let us assume that
pins 17 to 14 are presently set as output pins and pins 13 to 10 are set as input pins. Thus, the value
of P1DDR is initially H'F0.
P17
P16
P15
P14
P13
P12
P11
P10
I/O
Output
Output
Output
Output
Input
Input
Input
Input
P1DDR
1
1
1
1
0
0
0
0
To change pin 14 from an output pin to an input pin, the value of bit 4 in P1DDR must be changed
from 1 to 0 (H'F0 to H'E0). Now assume that the BCLR instruction is used to clear bit 4 in P1DDR
to 0.
BCLR
#4, @P1DDR
However, using the above bit manipulation instruction on the write-only register P1DDR can cause
problems, as described below.
The BCLR instruction first reads data from P1DDR in byte units, but in this case the read values
are undefined. These undefined values can be 0 or 1 for each bit in the register, but there is no way
of telling which. Since all of the bits in P1DDR are write-only, undefined values are returned for
all of the bits when the register is read. In this example the value of P1DDR is H'F0, but we will
assume that the value returned when the register was read is H'F8, which would give bit 3 a value
of 1.
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Section 2 CPU
P17
P16
P15
P14
P13
P12
P11
P10
I/O
Output
Output
Output
Output
Input
Input
Input
Input
P1DDR
1
1
1
1
0
0
0
0
Read value
1
1
1
1
1
0
0
0
The BCLR instruction performs bit manipulation on the read value, which is H'F8 in this example.
It clears bit 4 to 0.
P17
P16
P15
P14
P13
P12
P11
P10
I/O
Output
Output
Output
Output
Input
Input
Input
Input
P1DDR
1
1
1
1
0
0
0
0
After bit
manipulation
1
1
1
0
1
0
0
0
Following bit manipulation the data is written to P1DDR and the BCLR instruction terminates.
P17
P16
P15
P14
P13
P12
P11
P10
I/O
Output
Output
Output
Input
Output
Input
Input
Input
P1DDR
1
1
1
0
1
0
0
0
Write value
1
1
1
0
1
0
0
0
The contents of P1DDR should have been overwritten with a value of H'E0, but in fact a value of
H'E8 was written to the register. This changed pin 13, which should have been an input pin, to an
output pin. In this example we assumed that the value of bit 1 in P1DDR was 1. However, since
the values of bits 7 to 0 in P1DDR are all undefined when read, there is the possibility that
individual bit values could be changed from 0 to 1 or from 1 to 0. To prevent this from happening,
the recommendations in section 2.9.4, Accessing Registers Containing Write-Only Bits, should be
followed when changing the values of registers containing write-only bits.
In addition, the BCLR instruction can be used to clear flags in internal I/O registers to 0. In such
cases it is not necessary to read the relevant flag beforehand so long as it is clear that it has been
set to 1 by an interrupt processing routine or the like.
2.9.4
Accessing Registers Containing Write-Only Bits
Using data transfer instructions or bit manipulation instructions on registers containing write-only
bits can result in undefined values being read. To prevent the reading of undefined values, the
procedure described below should be used to access registers containing write-only bits.
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Section 2 CPU
In order to write to a register containing write-only bits, set aside a work area in memory (in onchip RAM, for example) and write the data to be manipulated to it. After accessing and
manipulating the data in the work area in memory, write the resulting data to the register
containing write-only bits.
Figure 2.14 Example Flowchart of Method for Accessing Registers Containing Write-Only Bits
Write data to work area
Write initial value
Write data from work area to
register containing write-only bits
Access data in work area
(using either data transfer instructions
or bit manipulation instructions)
Change value of register containing
write-only bits
Write data from work area to
register containing write-only bits
Figure 2.14 Flowchart of Method for Accessing Registers Containing Write-Only Bits
Example: Clearing pin 14 only of P1DDR for port 1
P1DDR is an 8-bit register that contains write-only bits. It is used to specify the I/O setting of the
individual pins in port 1. Reading produces invalid data. Attempting to read from P1DDR returns
undefined values.
In this example, the BCLR instruction is used to set pin 14 as an input port. To start, the initial
value H'F0 to be written to P1DDR is written ahead of time to the work area (RAM0) in memory.
MOV.B
#H'F0,
R0L
MOV.B
R0L,
@RAM0
MOV.B
R0L,
@P1DDR
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Section 2 CPU
P17
P16
P15
P14
P13
P12
P11
P10
I/O
Output
Output
Output
Output
Input
Input
Input
Input
P1DDR
1
1
1
1
0
0
0
0
RAM0
1
1
1
1
0
0
0
0
To change pin 14 from an output pin to an input pin, the value of bit 4 in P1DDR must be changed
from 1 to 0 (H'F0 to H'E0). Here the BCLR instruction will be used to clear bit 4 in P1DDR to 0.
BCLR
#4,
@RAM0
P17
P16
P15
P14
P13
P12
P11
P10
I/O
Output
Output
Output
Output
Input
Input
Input
Input
P1DDR
1
1
1
1
0
0
0
0
RAM0
1
1
1
0
0
0
0
0
Since RAM0 is a read/write area of memory, performing the above bit manipulation using the
BCLR instruction causes only bit 4 in RAM0 to be cleared to 0. The value of RAM0 is then
written to P1DDR.
MOV.B
@RAM0,
R0L
MOV.B
R0L,
@P1DDR
P17
P16
P15
P14
P13
P12
P11
P10
I/O
Output
Output
Output
Input
Input
Input
Input
Input
P1DDR
1
1
1
0
0
0
0
0
RAM0
1
1
1
0
0
0
0
0
By using the above procedure to access registers containing write-only bits, it is possible to create
programs that are not dependent on the type of instructions used.
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Section 3 MCU Operating Modes
Section 3 MCU Operating Modes
3.1
Operating Mode Selection
This LSI supports four operating modes (modes 4 to 7). These modes enable selection of the CPU
operating mode, enabling/disabling of on-chip ROM, and the initial bus width setting, by setting
the mode pins (MD2 to MD0) as show in table 3.1. Modes 4 to 6 are external extended modes that
allow access to the external memory and peripheral devices. In external extended mode, 8-bit or
16-bit address space can be set for each area depending on the bus controller setting after program
execution starts. If 16-bit access is selected for any one area, 16-bit bus mode is set; if 8-bit access
is selected for all areas, 8-bit bus mode is set. In mode 7, the external address space cannot be
used. Do not change the mode pin settings during operation. Only mode 7 is available in the
H8S/2212 Group.
Table 3.1
MCU Operating Mode Selection
MCU
Operating
CPU Operating
Mode
MD2 MD1 MD0 Mode
External Data Bus
Description
On-chip
ROM
Maximum
Initial Value Value
4
1
0
0
Advanced mode
On-chip ROM
disabled, extended
mode
Disabled
16 bits
16 bits
5
1
0
1
Advanced mode
On-chip ROM
disabled, extended
mode
Disabled
8 bits
16 bits
6
1
1
0
Advanced mode
On-chip ROM
enabled, extended
mode
Enabled
8 bits
16 bits
7
1
1
1
Advanced mode
Single-chip mode
Enabled
–
–
Note: When using the E6000 emulator:
•
Mode 7 is not available in the H8S/2218 Group. (The E6000 emulator does not support
mode 7.)
•
Note following restrictions to use the RTC and USB in mode 6.
Specify PFCR so that A9 and A8 are output on the PB1 and PB0 pins.
Set H'FF in PCDDR so that A7 to A0 are output on the PC7 to PC0 pins.
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Section 3 MCU Operating Modes
3.2
Register Descriptions
The following registers are related to the operating mode.
• Mode control register (MDCR)
• System control register (SYSCR)
3.2.1
Mode Control Register (MDCR)
MDCR is used to monitor the current operating mode of this LSI. MDCR should not be modified.
Bit
Bit Name
Initial Value R/W
7 to 4
⎯
Undefined
⎯
Description
Reserved
These bits are always read as undefined value and
cannot be modified.
3
FWE
⎯*
1
R
Flash Programming Enable
Reflects the input level at the FWE pin. This bit
functions same as the FWE bit in the FLMCR1
register.
MDS2
⎯*
R
Mode Select 2 to 0
1
MDS1
⎯*
R
0
MDS0
⎯*
R
These bits indicate the input levels at pins MD2 to
MD0 (the current operating mode). Bits MDS2 to
MDS0 correspond to MD2 to MD0. MDS2 to MDS0
are read-only bits and they cannot be written to. The
mode pin (MD2 to MD0) input levels are latched into
these bits when MDCR is read.
2
1
1
1
These latches are canceled by a power-on reset, but
2
maintained at manual reset* .
Notes: 1. Determined by the FWE and MD2 to MD0 pin settings.
2. Supported only by the H8S/2218 Group.
3.2.2
System Control Register (SYSCR)
SYSCR is used to select the interrupt control mode and the detected edge for NMI, select the
MRES input pin* enable or disable, and enables or disables on-chip RAM.
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Section 3 MCU Operating Modes
Bit
Bit Name
Initial Value R/W
Description
7
–
0
Reserved
R/W
The write value should always be 0.
6
–
0
–
Reserved
This bit is always read as 0 and cannot be modified.
5
INTM1
0
R/W
4
INTM0
0
R/W
These bits select the control mode of the interrupt
controller. For details of the interrupt control modes,
see section 5.6, Interrupt Control Modes and Interrupt
Operation.
00: Interrupt control mode 0
01: Setting prohibited
10: Interrupt control mode 2
11: Setting prohibited
3
NMIEG
0
R/W
NMI Edge Select
Selects the valid edge of the NMI interrupt input.
0: An interrupt is requested at the falling edge of NMI
input
1: An interrupt is requested at the rising edge of NMI
input
2
MRESE
0
R/W
Manual Reset Select
Enables or disables the MRES pin* input.
0: Manual reset is disabled
1: Manual reset is enabled
The MRES input pin* can be used.
1
–
0
–
Reserved
This bit is always read as 0 and cannot be modified.
0
RAME
1
R/W
RAM Enable
Enables or disables the on-chip RAM. The RAME bit
is initialized when the reset status is released.
0: On-chip RAM is disabled
1: On-chip RAM is enabled
Note: * Supported only by the H8S/2218 Group.
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Section 3 MCU Operating Modes
3.3
Operating Mode Descriptions
3.3.1
Mode 4 (Supported Only by the H8S/2218 Group)
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is disabled.
Pins P13 to P10, and ports A, B, and C function as an address bus, ports D and E function as a data
bus, and part of port F carries bus control signals.
Pins P13 to P11 function as input ports immediately after a reset. Pin 10 and ports A and B
function as address (A20 to A8) outputs immediately after a reset. Address (A23 to A21) output
can be enabled or disabled by bits AE3 to AE0 in the pin function control register (PFCR)
regardless of the corresponding data direction register (DDR) values. Pins for which address
output is disabled among pins P13 to P10 and in ports A and B become port outputs when the
corresponding DDR bits are set to 1.
Port C always has an address (A7 to A0) output function.
The initial bus mode after a reset is 16 bits, with 16-bit access to all areas. However, note that if 8bit access is designated by the bus controller for all areas, the bus mode switches to 8 bits.
3.3.2
Mode 5 (Supported Only by the H8S/2218 Group)
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is disabled.
Pins P13 to P10, and ports A, B, and C function as an address bus, ports D and E function as a data
bus, and part of port F carries bus control signals.
Pins P13 to P11 function as input ports immediately after a reset. Pin 10 and ports A and B
function as address (A20 to A8) outputs immediately after a reset. Address (A23 to A21) output
can be enabled or disabled by bits AE3 to AE0 in the pin function control register (PFCR)
regardless of the corresponding data direction register (DDR) values. Pins for which address
output is disabled among pins P13 to P10 and in ports A and B become port outputs when the
corresponding DDR bits are set to 1.
Port C always has an address (A7 to A0) output function.
The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. However, note that if 16bit access is designated by the bus controller for any area, the bus mode switches to 16 bits and
port E becomes a data bus.
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Section 3 MCU Operating Modes
3.3.3
Mode 6 (Supported Only by the H8S/2218 Group)
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is enabled.
Pins P13 to P10, and ports A, B and C function as input ports immediately after a reset. Address
(A23 to A8) output can be enabled or disabled by bits AE3 to AE0 in the pin function control
register (PFCR) regardless of the corresponding data direction register (DDR) values. Pins for
which address output is disabled among pins P13 to P10 and in ports A and B become port outputs
when the corresponding DDR bits are set to 1.
Port C is an input port immediately after a reset. Addresses A7 to A0 are output by setting the
corresponding DDR bits to 1.
Ports D and E function as a data bus, and part of port F carries data bus signals.
The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. However, note that if 16bit access is designated by the bus controller for any area, the bus mode switches to 16 bits and
port E becomes a data bus.
3.3.4
Mode 7
The CPU can access a 16-Mbyte address space in advanced mode. The on-chip ROM is enabled,
but external addresses cannot be accessed.
All I/O ports are available for use as input-output ports.
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Section 3 MCU Operating Modes
3.3.5
Pin Functions
The pin functions of ports 1, and A to F vary depending on the operating mode. Table 3.2 shows
their functions in each operating mode.
Table 3.2
Pin Functions in Each Operating Mode
Port
Port 1
Port A
Mode 4
Mode 5
Mode 6
Mode 7
P13 to P11
P*/A
P*/A
P*/A
P
P10
P/A*
P/A*
P*/A
P
PA3 to PA0
P/A*
P/A*
P*/A
P
P/A*
P/A*
P*/A
P
Port B
Port C
A
A
P*/A
P
Port D
D
D
D
P
Port E
P/D*
P*/D
P*/D
P
PF7
P/C*
P/C*
P/C*
P*/C
PF6 to PF4
C
C
C
P
PF3
P/C*
P*/C
P*/C
PF2 to PF0
P*/C
P*/C
P*/C
Port F
Legend:
P: I/O port
A: Address bus output
D: Data bus I/O
C: Control signals, clock I/O
*: After reset
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Section 3 MCU Operating Modes
3.4
Memory Map in Each Operating Mode
Figures 3.1 to 3.3 show the memory map in each operation mode, respectively.
ROM: ⎯
RAM: 12 kbytes
ROM: 128 kbytes
RAM: 12 kbytes
ROM: 128 kbytes
RAM: 12 kbytes
Modes 4 and 5
(advanced extended modes
with on-chip ROM desabled)
Mode 6
(advanced extended mode
with on-chip ROM enabled)
Mode 7
(advanced single-chip mode)
H'000000
H'000000
H'000000
On-chip ROM
On-chip ROM
H'01FFFF
External address
space
H'020000
External address
space
H'C00000
H'E00000
H'FEE800
USB registers*1
External address
space
Reserved*2
H'C00000
H'E00000
USB registers*1
Reserved*2
Reserved*2
H'FFC000
On-chip RAM*3
H'FFEFC0
External address
space
H'FFEFC0
External address
space
H'FFF800
Internal I/O registers*1
On-chip RAM*3
Internal I/O
H'FFFFC0
H'FFFFFF
USB registers
H'FEE800
H'FEE800
On-chip RAM*3
H'FFFFC0
H'FFFFFF
H'DFFFFF
External address
space
H'FFC000
H'FFF800
H'C00000
H'FFC000
H'FFEFBF
H'FFF800
registers*1
On-chip RAM*3
On-chip RAM
Internal I/O registers
H'FFFFC0
H'FFFFFF
On-chip RAM
Notes: 1. Though RTC and USB registers are provided inside the chip, ASN, RDN, and WRN are asserted and
the addresses are output when these areas are accessed.
Therefore, care should be taken when connecting memory externally.
2. The reserved area of H'FEE800 to H'FFBFFF should not be accessed.
3. The external address can be used instead, by clearing the RAME bit in SYSCR to 0.
Figure 3.1 Memory Map in Each Operating Mode for HD64F2218 and HD64F2218U
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Section 3 MCU Operating Modes
ROM: ⎯
RAM: 8 kbytes
Modes 4 and 5
(advanced extended modes
with on-chip ROM desabled)
ROM: 64 kbytes
RAM: 8 kbytes
Mode 6
(advanced extended mode
with on-chip ROM enabled)
H'000000
H'000000
ROM: 64 kbytes
RAM: 8 kbytes
Mode 7
(advanced single-chip mode)
H'000000
On-chip ROM
On-chip ROM
H'00FFFF
H'010000
H'00FFFF
Reserved
H'020000
External address
space
External address
space
H'C00000
H'C00000
USB registers*1
USB registers*1
H'E00000
H'FEE800
H'FFD000
H'FFEFC0
External address
space
Reserved*2
On-chip RAM*3
External address
space
H'FFF800
Internal I/O
H'FFFFC0
H'FFFFFF
H'E00000
H'FEE800
H'FFD000
H'FFEFC0
H'FFF800
registers*1
On-chip RAM*3
External address
space
Reserved*2
On-chip RAM*3
External address
space
Internal I/O
H'FFFFC0
H'FFFFFF
H'C00000
H'DFFFFF
H'FEE800
Reserved*2
H'FFD000
H'FFEFBF
On-chip RAM
H'FFF800
registers*1
On-chip RAM*3
USB registers
Internal I/O registers
H'FFFFC0
H'FFFFFF
On-chip RAM
Notes: 1. Though RTC and USB registers are provided inside the chip, ASN, RDN, and WRN are asserted and
the addresses are output when these areas are accessed.
Therefore, care should be taken when connecting memory externally.
2. The reserved area of H'FEE800 to H'FFCFFF should not be accessed.
3. The external address can be used instead, by clearing the RAME bit in SYSCR to 0.
Figure 3.2 Memory Map in Each Operating Mode for HD6432217
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Section 3 MCU Operating Modes
HD64F2212, HD64F2212U
ROM: 128 kbytes
RAM: 12 kbytes
HD64F2211, HD64F2211U,
HD6432211
ROM: 64 kbytes
RAM: 8 kbytes
HD6432210, HD6432210S
ROM: 32 kbytes
RAM: 4 kbytes
Mode 7
(advanced single-chip mode)
Mode 7
(advanced single-chip mode)
Mode 7
(advanced single-chip mode)
H'000000
H'000000
On-chip ROM
H'00FFFF
USB registers
H'C00000
H'DFFFFF
H'000000
On-chip ROM
H'007FFF
USB registers
H'C00000
H'DFFFFF
On-chip ROM
H'01FFFF
H'C00000
H'DFFFFF
H'FEE800
H'FEE800
Reserved*
H'FFC000
H'FFEFBF
On-chip RAM
Internal I/O registers
Note: *
Reserved*
On-chip RAM
H'FFF800
H'FFF800
H'FFFFC0
H'FFFFFF
H'FEE800
Reserved*
H'FFD000
H'FFEFBF
On-chip RAM
H'FFE000
H'FFEFBF
On-chip RAM
H'FFF800
Internal I/O registers
H'FFFFC0
H'FFFFFF
USB registers
On-chip RAM
Internal I/O registers
H'FFFFC0
H'FFFFFF
On-chip RAM
The reserved area should not be accessed.
Figure 3.3 Memory Map in Each Operating Mode for HD64F2212, HD64F2212U,
HD64F2211, HD64F2211U, HD6432211, HD6432210 and HD6432210S
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Section 3 MCU Operating Modes
Rev.6.00 Jun. 03, 2008 Page 80 of 698
REJ09B0074-0600
Section 4 Exception Handling
Section 4 Exception Handling
4.1
Exception Handling Types and Priority
As table 4.1 indicates, exception handling may be caused by a reset, trace, trap instruction, or
interrupt. Exception handling is prioritized as shown in table 4.1. If two or more exceptions occur
simultaneously, they are accepted and processed in order of priority. Exception sources, the stack
structure, and operation of the CPU vary depending on the interrupt control mode. For details on
the interrupt control mode, refer to section 5, Interrupt Controller.
Table 4.1
Exception Types and Priority
Priority
Exception Type
Start of Exception Handling
High
Reset
Starts immediately after a low-to-high transition at the RES or
MRES* pin, or when the watchdog timer overflows. The CPU
enters the reset state when the RES pin is low. The CPU enters
the manual reset state when the MRES pin* is low.
Trace
Starts when execution of the current instruction or exception
handling ends, if the trace (T) bit in the EXR is set to 1. This is
enabled only in trace interrupt control mode 2. Trace exception
processing is not performed after RTE instruction execution.
Interrupt
Starts when execution of the current instruction or exception
handling ends, if an interrupt request has been issued. Note that
after executing the ANDC, ORC, XORC, or LDC instruction or at
the completion of reset exception processing, no interrupt is
detected.
Trap instruction
(TRAPA)
Started by execution of a trap instruction (TRAPA). Trap exception
processing is always accepted in program execution state.
Low
Note:
4.2
*
Supported only by the H8S/2218 Group.
Exception Sources and Exception Vector Table
Different vector addresses are assigned to different exception sources. Table 4.2 lists the exception
sources and their vector addresses. Since the usable modes differ depending on the product, for
details on each product, refer to section 3, MCU Operating Modes.
Rev.6.00 Jun. 03, 2008 Page 81 of 698
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Section 4 Exception Handling
Table 4.2
Exception Handling Vector Table
Vector Address*
4
1
Exception Source
Vector Number
Normal Mode*
Advanced Mode
Power-on reset
0
H'0000 to H'0001
H'0000 to H'0003
Manual reset
1
H'0002 to H'0003
H'0004 to H'0007
Reserved for system use
2
H'0004 to H'0005
H'0008 to H'000B
3
H'0006 to H'0007
H'000C to H'000F
4
H'0008 to H'0019
H'0010 to H'0013
5
H'000A to H'000B
H'0014 to H'0017
Direct transitions*
6
H'000C to H'000D
H'0018 to H'001B
External interrupt (NMI)
7
H'000E to H'000F
H'001C to H'001F
Trap instruction
#0
8
H'0010 to H'0011
H'0020 to H'0023
#1
9
H'0012 to H'0013
H'0024 to H'0027
#2
10
H'0014 to H'0015
H'0028 to H'002B
#3
11
H'0016 to H'0017
H'002C to H'002F
12
H'0018 to H'0019
H'0030 to H'0033
13
H'001A to H'001B
H'0034 to H'0037
14
H'001C to H'001D
H'0038 to H'003B
15
H'001E to H'001F
H'003C to H'003F
Trace
2
Reserved for system use
External interrupt
IRQ0
16
H'0020 to H'0021
H'0040 to H'0043
External interrupt
IRQ1
17
H'0022 to H'0023
H'0044 to H'0047
External interrupt
IRQ2
18
H'0024 to H'0025
H'0048 to H'004B
External interrupt
IRQ3
19
H'0026 to H'0027
H'004C to H'004F
External interrupt
IRQ4
20
H'0028 to H'0029
H'0050 to H'0053
RTC interrupt
IRQ5
21
H'002A to H'002B
H'0054 to H'0057
USB interrupt
IRQ6
22
H'002C to H'002D
H'0058 to H'005B
External interrupt
IRQ7
23
H'002E to H'002F
H'005C to H'005F
24
H'0030 to H'0031
H'0060 to H'0063
⏐
⏐
⏐
127
H'00FE to H'00FF
H'01FC to H'01FF
3
Internal interrupt*
Notes: 1. Lower 16 bits of the address.
2. For direct transfer, see section 20.10, Direct Transitions.
3. For details of internal interrupt vectors, see section 5.5, Interrupt Exception Handling
Vector Table.
4. Not available in this LSI.
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Section 4 Exception Handling
4.3
Reset
A reset has the highest exception priority.
When the RES or MRES* pin goes low, all processing halts and this LSI enters the reset state. To
ensure that this LSI is reset, hold the RES pin low for at least 20 ms at power-up or hold the RES
or MRES* pin low for at least 20 states during operation.
A reset initializes the internal state of the CPU and the registers of on-chip peripheral modules.
This LSI can also be reset by overflow of the watchdog timer. For details, see section 10,
Watchdog Timer (WDT).
Immediately after a reset, interrupt control mode 0 is set.
Notes: TRST in the HD64F2218 and HD64F2218U, which incorporate a boundary scan function,
should be brought low when power is on. For details, see section 13, Boundary Scan
Function.
* Supported only by the H8S/2218 Group.
4.3.1
Reset Types
A reset can be of either of two types for the H8S/2218 Group: a power-on reset or a manual reset.
A reset for the H8S/2212 Group is power-on reset. Reset types are shown in table 4.3. A power-on
reset should be used when powering on.
The internal state of the CPU is initialized by either type of reset. A power-on reset also initializes
all the registers in the on-chip peripheral modules, while a manual reset initializes all the registers
in the on-chip peripheral modules except for the bus controller and I/O ports, which retain their
previous states.
With a manual reset, since the on-chip peripheral modules are initialized, ports used as on-chip
peripheral module I/O pins are switched to I/O ports controlled by DDR and DR.
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Section 4 Exception Handling
Table 4.3
Reset Types
Reset Transition Condition
Internal State
Type
MRES
RES
CPU
On-Chip Peripheral Modules
Power-on reset
×
Low
Initialized
Initialized
Manual reset
Low
High
Initialized
Initialized, except for bus
controller and I/O ports
Legend:
×: Don't care
A reset caused by the watchdog timer can also be of either of two types: a power-on reset or a
manual reset.
When the MRES pin* is used, MRES pin* input must be enabled by setting the MRESE bit to 1 in
SYSCR.
Note:* Supported only by the H8S/2218 Group.
4.3.2
Reset Exception Handling
When the RES or MRES* pin goes low, this LSI enters the reset. To ensure that this LSI is reset,
hold the RES pin low for at least 20 ms at power-up. To reset the chip during operation, hold the
RES or MRES* pin low for at least 20 states.
When the RES or MRES* pin goes high after being held low for the necessary time, this LSI starts
reset exception handling as follows.
1. The internal state of the CPU and the registers of the on-chip peripheral modules are initialized,
the T bit is cleared to 0 in EXR, and the I bit is set to 1 in EXR and CCR.
2. The reset exception handling vector address is read and transferred to the PC, and program
execution starts from the address indicated by the PC.
Note: * Supported only by the H8S/2218 Group.
Figures 4.1 and 4.2 show examples of the reset sequence.
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Section 4 Exception Handling
Internal
Prefetch of first
processing program instruction
Vector fetch
*
*
*
φ
RES, MRES
Address bus
(1)
(3)
(5)
RD
HWR, LWR
High
D15 to D0
(1) (3)
(2) (4)
(5)
(6)
(2)
(4)
(6)
Reset exception handling vector address (for power-on reset, (1) = H'000000,
(3) = H'000002; for manual reset, (1) = H'000004, (3) = H'000006)
Start address (contents of reset exception handling vector address)
Start address ((5) = (2) (4))
First program instruction
Note: * Three program wait states are inserted.
Figure 4.1 Reset Sequence (Mode 4)
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Section 4 Exception Handling
Internal
processing
Vector
fetch
Prefetch of first program
instruction
φ
RES, MRES
Internal
Address bus
(1)
(3)
(5)
Internal
read signal
Internal
write signal
High
Internal
data bus
(2)
(4)
(6)
(1) (3) : Reset exception handling vector address (for a power-on reset, (1) = H'000000, (3) = H'000002
for a manual reset, (1) = H'000004, (3) = H'000006)
(2) (4) : Start address (contents of reset exceptiion handling vector address)
: Start address ((5) = (2) (4))
(5)
: First program instruction
(6)
Figure 4.2 Reset Sequence (Modes 6 and 7)
4.3.3
Interrupts after Reset
If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, the PC and
CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests,
including NMI, are disabled immediately after a reset. Since the first instruction of a program is
always executed immediately after the reset state ends, make sure that this instruction initializes
the stack pointer (example: MOV.L #xx: 32,SP).
4.3.4
State of On-Chip Peripheral Modules after Reset Release
After reset release, MSTPCRA, MSTPCRB, and MSTPCRC are initialized and all modules except
the DMAC enter module stop mode. Consequently, on-chip peripheral module registers cannot be
read from or written to. Register reading and writing is enabled when module stop mode is exited.
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Section 4 Exception Handling
4.4
Traces
Traces are enabled in interrupt control mode 2. Trace mode is not activated in interrupt control
mode 0, irrespective of the state of the T bit. For details of interrupt control modes, see section 5,
Interrupt Controller.
If the T bit in EXR is set to 1, trace mode is activated. In trace mode, a trace exception occurs on
completion of each instruction. Trace mode is not affected by interrupt masking. Table 4.4 shows
the state of CCR and EXR after execution of trace exception handling. Trace mode is canceled by
clearing the T bit in EXR to 0. The T bit saved on the stack retains its value of 1, and when control
is returned from the trace exception handling routine by the RTE instruction, trace mode resumes.
Trace exception handling is not carried out after execution of the RTE instruction.
Interrupts are accepted even within the trace exception handling routine.
Table 4.4
Status of CCR and EXR after Trace Exception Handling
CCR
Interrupt Control Mode
I
0
EXR
UI
I2 to I0
T
Trace exception handling cannot be used.
2
1
–
–
0
Legend:
1: Set to 1
0: Cleared to 0
–: Retains value prior to execution.
4.5
Interrupts
Interrupts are controlled by the interrupt controller. The interrupt controller has two interrupt
control modes and can assign interrupts other than NMI to eight priority/mask levels to enable
multiplexed interrupt control. The source to start interrupt exception handling and the vector
address differ depending on the product. For details, refer to section 5, Interrupt Controller.
The interrupt exception handling is as follows:
1. The values in the program counter (PC), condition code register (CCR), and extended control
register (EXR) are saved in the stack.
2. The interrupt mask bit is updated and the T bit is cleared.
3. A vector address corresponding to the interrupt source is generated, the start address is loaded
from the vector table to the PC, and program execution starts from that address.
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Section 4 Exception Handling
4.6
Trap Instruction
Trap instruction exception handling starts when a TRAPA instruction is executed. Trap instruction
exception handling can be executed at all times in the program execution state.
The trap instruction exception handling is as follows:
1. The values in the program counter (PC), condition code register (CCR), and extended control
register (EXR) are saved in the stack.
2. The interrupt mask bit is updated and the T bit is cleared.
3. A vector address corresponding to the interrupt source is generated, the start address is loaded
from the vector table to the PC, and program execution starts from that address.
The TRAPA instruction fetches a start address from a vector table entry corresponding to a vector
number from 0 to 3, as specified in the instruction code.
Table 4.5 shows the status of CCR and EXR after execution of trap instruction exception handling.
Table 4.5
Status of CCR and EXR after Trap Instruction Exception Handling
CCR
EXR
Interrupt Control Mode
I
UI
I2 to I0
T
0
1
–
–
–
2
1
–
–
0
Legend:
1: Set to 1
0: Cleared to 0
–: Retains value prior to execution.
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Section 4 Exception Handling
4.7
Stack Status after Exception Handling
Figure 4.3 shows the stack after completion of trap instruction exception handling and interrupt
exception handling.
(a) Normal Modes*2
SP
EXR
Reserved*1
SP
CCR
CCR
CCR*1
CCR*1
PC (16 bits)
PC (16 bits)
Interrupt control mode 0
Interrupt control mode 2
(b) Advanced Modes
SP
EXR
Reserved*1
SP
CCR
PC (24 bits)
Interrupt control mode 0
CCR
PC (24 bits)
Interrupt control mode 2
Notes: 1. Ignored on return.
2. Normal modes are not available in this LSI.
Figure 4.3 Stack Status after Exception Handling
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Section 4 Exception Handling
4.8
Notes on Use of the Stack
When accessing word data or longword data, this LSI assumes that the lowest address bit is 0. The
stack should always be accessed by word transfer instruction or longword transfer instruction, and
the value of the stack pointer (SP: ER7) should always be kept even. Use the following
instructions to save registers:
PUSH.W Rn (or MOV.W Rn, @-SP)
PUSH.L ERn (or MOV.L ERn, @-SP)
Use the following instructions to restore registers:
POP.W Rn (or MOV.W @SP+, Rn)
POP.L ERn (or MOV.L @SP+, ERn)
Setting SP to an odd value may lead to a malfunction. Figure 4.4 shows an example of what
happens when the SP value is odd.
Address
CCR
SP
R1L
SP
H'FFFEFA
H'FFFEFB
PC
PC
H'FFFEFC
H'FFFEFD
H'FFFEFE
SP
H'FFFEFF
SP set to H'FFFEFF
TRAPA instruction executed
MOV.B R1L, @-ER7 executed
Data saved above SP
Contents of CCR lost
Legend:
CCR:
PC:
R1L:
SP:
Condition code register
Program counter
General register R1L
Stack pointer
Note: This diagram illustrates an example in which the interrupt control mode is 0, in advanced mode.
Figure 4.4 Operation when SP Value Is Odd
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Section 5 Interrupt Controller
Section 5 Interrupt Controller
5.1
Features
• Two interrupt control modes
⎯ Any of two interrupt control modes can be set by means of the INTM1 and INTM0 bits in
the system control register (SYSCR).
• Priorities settable with IPR
⎯ An interrupt priority register (IPR) is provided for setting interrupt priorities. Eight priority
levels can be set for each module for all interrupts except NMI. NMI is assigned the highest
priority level of 8, and can be accepted at all times.
• Independent vector addresses
⎯ All interrupt sources are assigned independent vector addresses, making it unnecessary for
the source to be identified in the interrupt handling routine.
• Seven external interrupts (NMI, IRQ7, and IRQ4 to IRQ0)
⎯ NMI is the highest-priority interrupt, and is accepted at all times. Rising edge or falling
edge can be selected for NMI. Falling edge, rising edge, or both edge detection, or level
sensing, can be selected for IRQ7 and IRQ4 to IRQ0. IRQ6 is an interrupt only for the onchip USB. IRQ5 is an interrupt only for the on-chip RTC.
• DMAC control
⎯ DMAC activation is performed by means of interrupts.
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Section 5 Interrupt Controller
A block diagram of the interrupt controller is shown in figure 5.1.
CPU
INTM1, INTM0
SYSCR
NMIEG
NMI input
NMI input unit
IRQ input
IRQ input unit
ISR
ISCR
IER
Interrupt
request
Vector number
Priority
determination
I
Internal interrupt
request
WOVI to EXIRQ1
CCR
I2 to I0
IPR
Interrupt controller
Legend:
ISCR:
IER:
ISR:
IPR:
SYSCR:
IRQ sense control register
IRQ enable register
IRQ status register
Interrupt priority register
System control register
Figure 5.1 Block Diagram of Interrupt Controller
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EXR
Section 5 Interrupt Controller
5.2
Input/Output Pins
Table 5.1 summarizes the pins of the interrupt controller.
Table 5.1
Pin Configuration
Name
I/O
Function
NMI
Input
Nonmaskable external interrupt
IRQ7
Input
Maskable external interrupts
IRQ4
Input
IRQ3
Input
IRQ2
Rising, falling, or both edges, or level sensing can be selected (IRQ6 is
an interrupt signal only for the on-chip USB. IRQ5 is an interrupt signal
only for the on-chip RTC.)
Input
IRQ1
Input
IRQ0
Input
Rising or falling edge can be selected
5.3
Register Descriptions
The interrupt controller has the following registers. For details on the system control register, refer
to section 3.2.2, System Control Register (SYSCR).
• System control register (SYSCR)
• IRQ sense control register H (ISCRH)
• IRQ sense control register L (ISCRL)
• IRQ enable register (IER)
• IRQ status register (ISR)
• Interrupt priority register A (IPRA)
• Interrupt priority register B (IPRB)
• Interrupt priority register C (IPRC)
• Interrupt priority register D (IPRD)
• Interrupt priority register E (IPRE)
• Interrupt priority register F (IPRF)
• Interrupt priority register G (IPRG)
• Interrupt priority register J (IPRJ)
• Interrupt priority register K (IPRK)
• Interrupt priority register M (IPRM)
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Section 5 Interrupt Controller
5.3.1
Interrupt Priority Registers A to G, J, K, M (IPRA to IPRG, IPRJ, IPRK, IPRM)
The IPR registers set priorities (levels 7 to 0) for interrupts other than NMI.
The correspondence between interrupt sources and IPR settings is shown in section 5.5, Interrupt
Exception Handling Vector Table. Setting a value in the range from H'0 to H'7 in the 3-bit groups
of bits 6 to 4 and 2 to 0 sets the priority of the corresponding interrupt.
Bit
Bit Name
Initial Value R/W
Description
7
–
0
–
Reserved
6
IPR6
1
R/W
5
IPR5
1
R/W
These bits set the priority of the corresponding
interrupt source.
4
IPR4
1
R/W
000: Priority level 0 (Lowest)
This bit is always read as 0 and cannot be modified.
001: Priority level 1
010: Priority level 2
011: Priority level 3
100: Priority level 4
101: Priority level 5
110: Priority level 6
111: Priority level 7 (Highest)
3
–
0
–
Reserved
This bit is always read as 0 and cannot be modified.
2
IPR2
1
R/W
1
IPR1
1
R/W
These bits set the priority of the corresponding
interrupt source.
0
IPR0
1
R/W
000: Priority level 0 (Lowest)
001: Priority level 1
010: Priority level 2
011: Priority level 3
100: Priority level 4
101: Priority level 5
110: Priority level 6
111: Priority level 7 (Highest)
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Section 5 Interrupt Controller
5.3.2
IRQ Enable Register (IER)
IER controls enabling and disabling of interrupt requests IRQ7 to IRQ0.
Bit
Bit Name
Initial Value R/W
7
IRQ7E
0
R/W
Description
IRQ7 Enable
The IRQ7 interrupt request is enabled when this bit is 1.
6
IRQ6E
0
R/W
1
IRQ6 Enable*
The IRQ6 interrupt request is enabled when this bit is 1.
5
IRQ5E
0
R/W
4
IRQ4E
0
R/W
2
IRQ5 Enable*
The IRQ5 interrupt request is enabled when this bit is 1.
IRQ4 Enable
The IRQ4 interrupt request is enabled when this bit is 1.
3
IRQ3E
0
R/W
IRQ3 Enable
The IRQ3 interrupt request is enabled when this bit is 1.
2
IRQ2E
0
R/W
IRQ2 Enable
The IRQ2 interrupt request is enabled when this bit is 1.
1
IRQ1E
0
R/W
IRQ1 Enable
The IRQ1 interrupt request is enabled when this bit is 1.
0
IRQ0E
0
R/W
IRQ0 Enable
The IRQ0 interrupt request is enabled when this bit is 1.
Notes: 1. IRQ6 is an interrupt only for the on-chip USB.
2. IRQ5 is an interrupt only for the on-chip RTC.
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Section 5 Interrupt Controller
5.3.3
IRQ Sense Control Registers H and L (ISCRH, ISCRL)
The ISCR registers select the source that generates an interrupt request at pins IRQ7 to IRQ0.
Bit
Bit Name
Initial Value R/W
Description
15
IRQ7SCB
0
R/W
IRQ7 Sense Control B
14
IRQ7SCA
0
R/W
IRQ7 Sense Control A
00: Interrupt request generated at IRQ7 input low level
01: Interrupt request generated at falling edge of IRQ7
input
10: Interrupt request generated rising edge of IRQ7
input
11: Interrupt request generated at both falling and
rising edges of IRQ7 input
1
13
IRQ6SCB
0
R/W
IRQ6* Sense Control B
12
IRQ6SCA
0
R/W
IRQ6* Sense Control A
1
00: Setting prohibited when using on-chip USB
suspend or resume interrupt
01: Interrupt request generated at falling edge of IRQ6
input
1x: Setting prohibited
2
11
IRQ5SCB
0
R/W
IRQ5* Sense Control B
10
IRQ5SCA
0
R/W
IRQ5* Sense Control A
2
00: Setting prohibited when using RTC interrupt
01: Interrupt request generated at falling edge of IRQ5
input
1x: Setting prohibited
9
IRQ4SCB
0
R/W
IRQ4 Sense Control B
8
IRQ4SCA
0
R/W
IRQ4 Sense Control A
00: Interrupt request generated at IRQ4 input low level
01: Interrupt request generated at falling edge of IRQ4
input
10: Interrupt request generated at rising edge of IRQ4
input
11: Interrupt request generated at both falling and
rising edges of IRQ4 input
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Section 5 Interrupt Controller
Bit
Bit Name
Initial Value R/W
Description
7
IRQ3SCB
0
R/W
IRQ3 Sense Control B
6
IRQ3SCA
0
R/W
IRQ3 Sense Control A
00: Interrupt request generated at IRQ3 input low level
01: Interrupt request generated at falling edge of IRQ3
input
10: Interrupt request generated at rising edge of IRQ3
input
11: Interrupt request generated at both falling and
rising edges of IRQ3 input
5
IRQ2SCB
0
R/W
IRQ2 Sense Control B
4
IRQ2SCA
0
R/W
IRQ2 Sense Control A
00: Interrupt request generated at IRQ2 input low level
01: Interrupt request generated at falling edge of IRQ2
input
10: Interrupt request generated at rising edge of IRQ2
input
11: Interrupt request generated at both falling and
rising edges of IRQ2 input
3
IRQ1SCB
0
R/W
IRQ1 Sense Control B
2
IRQ1SCA
0
R/W
IRQ1 Sense Control A
00: Interrupt request generated at IRQ1 input low level
01: Interrupt request generated at falling edge of IRQ1
input
10: Interrupt request generated at rising edge of IRQ1
input
11: Interrupt request generated at both falling and rising
edges of IRQ1 input
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Section 5 Interrupt Controller
Bit
Bit Name
Initial Value R/W
Description
1
IRQ0SCB
0
R/W
IRQ0 Sense Control B
0
IRQ0SCA
0
R/W
IRQ0 Sense Control A
00: Interrupt request generated at IRQ0 input low level
01: Interrupt request generated at falling edge of IRQ0
input
10: Interrupt request generated at rising edge of IRQ0
input
11: Interrupt request generated at both falling and
rising edges of IRQ0 input
Legend:
×: Don’t care
Notes: 1. IRQ6 is an interrupt only for the on-chip USB.
2. IRQ5 is an interrupt only for the on-chip RTC.
5.3.4
IRQ Status Register (ISR)
ISR indicates the status of IRQ7 to IRQ0 interrupt requests.
Bit
Bit Name
Initial Value R/W
Description
7
IRQ7F
0
R/(W)* [Setting condition]
6
IRQ6F
0
5
IRQ5F
0
4
IRQ4F
0
3
IRQ3F
0
2
IRQ2F
0
1
IRQ1F
0
0
IRQ0F
0
R/(W)* When the interrupt source selected by the ISCR
registers occurs
R/(W)*
[Clearing conditions]
R/(W)*
• Cleared by reading IRQnF flag when IRQnF = 1,
R/(W)*
then writing 0 to IRQnF flag
R/(W)*
• When interrupt exception handling is executed
R/(W)*
when low-level detection is set and , IRQn input is
R/(W)*
high
•
Note: * Only 0 can be written, to clear flags.
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When IRQn interrupt exception handling is executed
when falling, rising, or both-edge detection is set
Section 5 Interrupt Controller
5.4
Interrupt Sources
5.4.1
External Interrupts
There are seven external interrupts: NMI, IRQ7, and IRQ4 to IRQ0. These interrupts can be used
to restore this LSI from software standby mode. Though IRQ5 is only for the on-chip RTC and
IRQ6 is only for the on-chip USB, the interrupts can be used to restore this LSI from software
standby mode. IRQ5 and IRQ6 are functionally same as IRQ7 and IRQ4 to IRQ0.
NMI Interrupt: NMI is the highest-priority interrupt, and is always accepted by the CPU
regardless of the interrupt control mode or the status of the CPU interrupt mask bits. The NMIEG
bit in SYSCR can be used to select whether an interrupt is requested at a rising edge or a falling
edge on the NMI pin.
IRQ7 to IRQ0 Interrupts: Interrupts IRQ7 to IRQ0 are requested by an input signal at pins IRQ7
to IRQ0. Interrupts IRQ7 to IRQ0 have the following features:
• Using ISCR, it is possible to select whether an interrupt is generated by a low level, falling
edge, rising edge, or both edges, at pins IRQ7 to IRQ0
• Enabling or disabling of interrupt requests IRQ7 to IRQ0 can be selected with IER.
• The interrupt priority level can be set with IPR.
• The status of interrupt requests IRQ7 to IRQ0 is indicated in ISR. ISR flags can be cleared to 0
by software.
A block diagram of IRQn interrupts is shown in figure 5.2.
IRQnE
IRQnSCA, IRQnSCB
IRQnF
Edge/level
detection circuit
IRQn input
S
Q
IRQn interrupt
request
R
Clear signal
Note: n = 7 to 0
Figure 5.2 Block Diagram of Interrupts IRQn
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Section 5 Interrupt Controller
The set timing for IRQnF is shown in figure 5.3.
φ
IRQn
input pin
IRQnF
Note: n = 7 to 0
Figure 5.3 Timing of Setting IRQnF
The detection of IRQn interrupts does not depend on whether the relevant pin has been set for
input or output. However, when a pin is used as an external interrupt input pin, do not clear the
corresponding DDR to 0; and use the pin as an I/O pin for another function. IRQnF interrupt
request flag is set when the setting condition is satisfied, regardless of IER settings. Accordingly,
refer to only necessary flags.
5.4.2
Internal Interrupts
The sources for internal interrupts from on—chip peripheral modules have the following features:
• For each on—chip peripheral module there are flags that indicate the interrupt request status,
and enable bits that select enabling or disabling of these interrupts. If both of these are set to 1
for a particular interrupt source, an interrupt request is issued to the interrupt controller.
• The interrupt priority level can be set by means of IPR.
• The DMAC can be activated by a TPU, SCI, or other interrupt request.
• When the DMAC is activated by an interrupt request, it is not affected by the interrupt control
mode or CPU interrupt mask bit.
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Section 5 Interrupt Controller
5.5
Interrupt Exception Handling Vector Table
Table 5.2 shows interrupt exception handling sources, vector addresses, and interrupt priorities.
For default priorities, the lower the vector number, the higher the priority. Priorities among
modules can be set by means of the IPR. Modules set at the same priority will conform to their
default priorities. Priorities within a module are fixed.
Table 5.2
Interrupt Sources, Vector Addresses, and Interrupt Priorities
Vector Address*
Interrupt
Source
Origin of Interrupt
Source
Vector
Number
Advanced Mode
External pins
NMI
7
H'001C
IRQ0
16
H'0040
IPRA6 to IPRA4
IRQ1
17
H'0044
IPRA2 to IPRA0
IRQ2
18
H'0048
IPRB6 to IPRB4
IRQ3
19
H'004C
IRQ4
20
H'0050
RTC
IRQ5
21
H'0054
USB
IRQ6
22
H'0058
External pins
IRQ7
23
H'005C
Watchdog Timer WOVI
25
H'0064
IPRD6 to IPRD4
A/D
ADI
28
H'0070
IPRE2 to IPRE0
TPU channel 0
TGI0A
32
H'0080
IPRF6 to IPRF4
TGI0B
33
H'0084
TGI0C
34
H'0088
TGI0D
35
H'008C
TGI0V
36
H'0090
TGI1A
40
H'00A0
TGI1B
41
H'00A4
TGI1V
42
H'00A8
TGI1U
43
H'00AC
TPU channel 1
IPR
Priority
High
IPRB2 to IPRB0
IPRC6 to IPRC4
IPRF2 to IPRF0
Low
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Section 5 Interrupt Controller
Vector Address*
Interrupt
Source
Origin of Interrupt
Source
Vector
Number
Advanced Mode
IPR
Priority
TPU channel 2
TGI2A
44
H'00B0
IPRG6 to IPRG4
High
TGI2B
45
H'00B4
TGI2V
46
H'00B8
TGI2U
47
H'00BC
DEND0A
72
H'0120
DEND0B
73
H'0124
DEND1A
74
H'0128
DEND1B
75
H'012C
ERI0
80
H'0140
RXI0
81
H'0144
TXI0
82
H'0148
TEI0
83
H'014C
DMAC
SCI channel 0
SCI channel 2
USB
ERI2
88
H'0160
RXI2
89
H'0164
TXI2
90
H'0168
TEI2
91
H'016C
EXIRQ0
104
H'01A0
EXIRQ1
105
H'01A4
Note: * Lower 16 bits of the start address.
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IPRJ6 to IPRJ4
IPRJ2 to IPRJ0
IPRK2 to IPRK0
IPRM6 to IPRM4
Low
Section 5 Interrupt Controller
5.6
Interrupt Control Modes and Interrupt Operation
The interrupt controller has two modes: interrupt control mode 0 and interrupt control mode 2.
Interrupt operations differ depending on the interrupt control mode. The interrupt control mode is
selected by SYSCR. Table 5.3 shows the differences between interrupt control mode 0 and
interrupt control mode 2.
Table 5.3
Interrupt Control Modes
Interrupt
Control Mode
Priority Setting Interrupt Mask
Register
Bits
Description
0
Default
I
The priority of interrupt sources are fixed at
the default settings.
Interrupt sources except for NMI is marked by
the I bit.
2
IPR
I2 to I0
8-level interrupt mask control is performed by
bits I2 to I0.
8 priority levels other than NMI can be set with
IPR.
5.6.1
Interrupt Control Mode 0
In interrupt control mode 0, interrupt requests except for NMI is masked by the I bit of CCR in the
CPU. Figure 5.4 shows a flowchart of the interrupt acceptance operation in this case.
1. If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an interrupt
request is sent to the interrupt controller.
2. If the I bit is set to 1, only an NMI interrupt is accepted, and other interrupt requests are held
pending. If the I bit is cleared, an interrupt request is accepted.
3. Interrupt requests are sent to the interrupt controller, the highest-ranked interrupt according to
the priority system is accepted, and other interrupt requests are held pending.
4. When the CPU accepts an interrupt request, it starts interrupt exception handling after
execution of the current instruction has been completed.
5. The PC and CCR are saved to the stack area by interrupt exception handling. The PC saved on
the stack shows the address of the first instruction to be executed after returning from the
interrupt handling routine.
6. Next, the I bit in CCR is set to 1. This masks all interrupts except NMI.
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Section 5 Interrupt Controller
7. The CPU generates a vector address for the accepted interrupt and starts execution of the
interrupt handling routine at the address indicated by the contents of the vector address in the
vector table.
Program execution status
No
Interrupt generated?
Yes
Yes
NMI
No
I=0
No
Hold
pending
Yes
No
IRQ0
No
Yes
IRQ1
Yes
EXIRQ1
Yes
Save PC and CCR
I←1
Read vector address
Branch to interrupt handling routine
Figure 5.4 Flowchart of Procedure Up to Interrupt Acceptance
in Interrupt Control Mode 0
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Section 5 Interrupt Controller
5.6.2
Interrupt Control Mode 2
In interrupt control mode 2, mask control is done in eight levels for interrupt requests except for
NMI by comparing the EXR interrupt mask level (I2 to I0 bits) in the CPU and the IPR setting.
Figure 5.5 shows a flowchart of the interrupt acceptance operation in this case.
1. If an interrupt source occurs when the corresponding interrupt enable bit is set to 1, an interrupt
request is sent to the interrupt controller.
2. When interrupt requests are sent to the interrupt controller, the interrupt with the highest
priority according to the interrupt priority levels set in IPR is selected, and lower-priority
interrupt requests are held pending. If a number of interrupt requests with the same priority are
generated at the same time, the interrupt request with the highest priority according to the
priority system shown in table 5.2 is selected.
3. Next, the priority of the selected interrupt request is compared with the interrupt mask level set
in EXR. An interrupt request with a priority no higher than the mask level set at that time is
held pending, and only an interrupt request with a priority higher than the interrupt mask level
is accepted.
4. When the CPU accepts an interrupt request, it starts interrupt exception handling after
execution of the current instruction has been completed.
5. The PC, CCR, and EXR are saved to the stack area by interrupt exception handling. The PC
saved on the stack shows the address of the first instruction to be executed after returning from
the interrupt handling routine.
6. The T bit in EXR is cleared to 0. The interrupt mask level is rewritten with the priority level of
the accepted interrupt.
If the accepted interrupt is NMI, the interrupt mask level is set to H'7.
7. The CPU generates a vector address for the accepted interrupt and starts execution of the
interrupt handling routine at the address indicated by the contents of the vector address in the
vector table.
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Section 5 Interrupt Controller
Program execution status
Interrupt generated?
No
Yes
Yes
NMI
No
Level 7 interrupt?
No
Yes
Mask level 6
or below?
No
Level 6 interrupt?
No
Yes
Level 1 interrupt?
Yes
Mask level 5
or below?
No
No
Yes
Yes
Mask level 0?
No
Yes
Save PC, CCR, and EXR
Hold
pending
Clear T bit to 0
Update mask level
Read vector address
Branch to interrupt handling routine
Figure 5.5 Flowchart of Procedure Up to Interrupt Acceptance in
Interrupt Control Mode 2
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(2) (4)
(3)
(5)
(7)
(1)
(1)
(2)
(4)
(3)
Internal
operation
Instruction prefetch address (Not executed.
This is the contents of the saved PC, the return address)
Instruction code (Not executed)
Instruction prefetch address (Not executed)
SP-2
SP-4
Internal
data bus
Internal
write signal
Internal
read signal
Internal
address bus
Interrupt
request signal
φ
Interrupt level determination Instruction
Wait for end of instruction
prefetch
(6) (8)
(9) (11)
(10) (12)
(13)
(14)
(5)
(7)
(8)
(9)
(10)
Vector fetch
(12)
(11)
Internal
operation
Saved PC and saved CCR
Vector address
Interrupt handling routine start address (Vector address contents)
Interrupt handling routine start address ((13) = (10) (12))
First instruction of interrupt handling routine
(6)
stack
(14)
(13)
Interrupt service
routine instruction
prefetch
5.6.3
Interrupt
acceptance
Section 5 Interrupt Controller
Interrupt Exception Handling Sequence
Figure 5.6 shows the interrupt exception handling sequence. The example shown is for the case
where interrupt control mode 0 is set in advanced mode, and the program area and stack area are in
on-chip memory.
Figure 5.6 Interrupt Exception Handling
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Section 5 Interrupt Controller
5.6.4
Interrupt Response Times
Table 5.4 shows interrupt response times ⎯ the interval between generation of an interrupt request
and execution of the first instruction in the interrupt handling routine. The execution status
symbols used in table 5.4 are explained in table 5.5.
This LSI is capable of fast word transfer to on-chip memory, and have the program area in on-chip
ROM and the stack area in on-chip RAM, enabling high-speed processing.
Table 5.4
Interrupt Response Times
5
Normal Mode*
Advanced Mode
Interrupt
Control
Mode 0
Interrupt
Control
Mode 2
Interrupt
Control
Mode 0
Interrupt
Control
Mode 2
3
3
3
No.
Execution State
1
Interrupt priority determination*
3
2
Number of wait states until
2
executing instruction ends*
1 to 19+2·SI 1 to 19+2·SI 1 to 19+2·SI 1 to 19+2·SI
3
PC, CCR, EXR stack save
2·SK
3·SK
2·SK
3·SK
4
Vector fetch
SI
SI
2·SI
2·SI
1
3
5
Instruction fetch*
6
Internal processing*
4
Total (using on-chip memory)
Notes: 1.
2.
3.
4.
5.
2·SI
2·SI
2·SI
2·SI
2
2
2
2
11 to 31
12 to 32
12 to 32
13 to 33
Two states in case of internal interrupt.
Refers to MULXS and DIVXS instructions.
Prefetch after interrupt acceptance and interrupt handling routine prefetch.
Internal processing after interrupt acceptance and internal processing after vector fetch.
Not available in this LSI.
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Section 5 Interrupt Controller
Table 5.5
Number of States in Interrupt Handling Routine Execution Statuses
Object of Access
External Device
8-Bit Bus
Symbol
Instruction fetch
SI
Branch address read
SJ
Stack manipulation
SK
16-Bit Bus
Internal
Memory
2-State
Access
3-State
Access
2-State
Access
3-State
Access
1
4
6 + 2m
2
3+m
Legend:
m: Number of wait states in an external device access.
5.6.5
DMAC Activation by Interrupt
The DMAC can be activated by an interrupt. In this case, the following options are available:
• Interrupt request to CPU
• Activation request to DMAC
• Selection of a number of the above
For details of interrupt requests that can be used with to activate the DMAC, see section 7, DMA
Controller (DMAC).
Figure 5.7 shows a block diagram of the interrupt controller of DMAC.
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Section 5 Interrupt Controller
DMAC
Disenable
signal
IRQ
interrupt
On-chip
peripheral
module
Interrupt
request
Clear
signal
Selection
circuit
Interrupt source
clear signal
Control logic
Determination of
priority
CPU interrupt
request vector
number
CPU
I, I2 to I0
Interrupt controller
Figure 5.7 Interrupt Control for DMAC
Selection of Interrupt Source: An activation factor is directly input to each channel of the
DMAC. The activation factors for each channel of the DMAC are selected by the DTF3 to DTF0
bits of DMACR. The DTA bit of DMABCR can be used to select whether the selected activation
factors are managed by the DMAC. By setting the DTA bit to 1, the interrupt factor which was the
activation factor for that DMAC cannot act as the CPU interrupt factor.
Interrupt factors other than the interrupts managed by the DMAC is CPU interrupt request.
Determination of Priority: The activation source is directly input to each channel of DMAC.
Operation Order: If the same interrupt is selected as the DMAC activation factor or CPU
interrupt factor, these operate independently. They operate in accordance with the respective
operating states and bus priorities.
Table 5.6 shows the interrupt factor clear control and selection of interrupt factors by specification
of the DTA bit of DMAC's DMABCR.
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Section 5 Interrupt Controller
Table 5.6
Interrupt Source Selection and Clearing Control
Settings
DMAC
Interrupt Sources Selection/Clearing Control
DTA
DMAC
CPU
0
Δ
Ο
1
Ο
X
Legend:
Ο: The relevant interrupt is used. Interrupt source clearing is performed.
(The CPU should clear the source flag in the interrupt handling routine.)
Δ: The relevant interrupt is used. The interrupt source is not cleared.
X: The relevant bit cannot be used.
Notes on Use: The SCI interrupt source is cleared when the DMAC reads or writes to the
prescribed register, and is not dependent upon the DTA bit.
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Section 5 Interrupt Controller
5.7
Usage Notes
5.7.1
Contention between Interrupt Generation and Disabling
When an interrupt enable bit is cleared to 0 to disable interrupts, the disabling becomes effective
after execution of the instruction.
When an interrupt enable bit is cleared to 0 by an instruction such as BCLR or MOV, if an
interrupt is generated during execution of the instruction, the interrupt concerned will still be
enabled on completion of the instruction, and so interrupt exception handling for that interrupt will
be executed on completion of the instruction. However, if there is an interrupt request of higher
priority than that interrupt, interrupt exception handling will be executed for the higher-priority
interrupt, and the lower-priority interrupt will be ignored.
The same also applies when an interrupt source flag is cleared to 0.
Figure 5.8 shows an example in which the TGIEA bit in the TPU's TIER_0 is cleared to 0.
The above contention will not occur if an enable bit or interrupt source flag is cleared to 0 while
the interrupt is masked.
TIER0 write cycle by CPU
TGI0A exception handling
φ
Internal
address bus
TIER_0 address
Internal
write signal
TGIEA
TGFA
TGI0A
Interrupt signal
Figure 5.8 Contention between Interrupt Generation and Disabling
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Section 5 Interrupt Controller
5.7.2
Instructions that Disable Interrupts
Instructions that disable interrupts are LDC, ANDC, ORC, and XORC. After any of these
instructions is executed, all interrupts including NMI are disabled and the next instruction is
always executed. When the I bit is set by one of these instructions, the new value becomes valid
two states after execution of the instruction ends.
5.7.3
Times when Interrupts Are Disabled
There are times when interrupt acceptance is disabled by the interrupt controller.
The interrupt controller disables interrupt acceptance for a 3-state period after the CPU has
updated the mask level with an LDC, ANDC, ORC, or XORC instruction.
5.7.4
Interrupts during Execution of EEPMOV Instruction
Interrupt operation differs between the EEPMOV.B instruction and the EEPMOV.W instruction.
With the EEPMOV.B instruction, an interrupt request (including NMI) issued during the transfer
is not accepted until the move is completed.
With the EEPMOV.W instruction, if an interrupt request is issued during the transfer, interrupt
exception handling starts at a break in the transfer cycle. The PC value saved on the stack in this
case is the address of the next instruction.
Therefore, if an interrupt is generated during execution of an EEPMOV.W instruction, the
following coding should be used.
L1: EEPMOV.W
MOV.W
BNE
5.7.5
R4, R4
L1
IRQ Interrupt
When operating by clock input, acceptance of input to an IRQ is synchronized with the clock. In
software standby mode and watch mode, the input is accepted asynchronously. For details on the
input conditions, see section 22.4.2, Control Signal Timing.
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Section 5 Interrupt Controller
5.7.6
NMI Interrupt Usage Notes
The NMI interrupt is part of the exception processing performed cooperatively by the LSI’s
internal interrupt controller and the CPU when the system is operating normally under the
specified electrical conditions. No operations, including NMI interrupts, are guaranteed when
operation is not normal (runaway status) due to software problems or abnormal input to the LSI’s
pins. In such cases, the LSI may be restored to the normal program execution state by applying an
external reset.
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Section 6 Bus Controller
Section 6 Bus Controller
This LSI has a built-in bus controller (BSC) that manages the external address space divided into
eight areas. The bus controller also has a bus arbitration function, and controls the operation of the
internal bus masters: the CPU and DMA controller (DMAC).
6.1
Features
• Manages external address space in area units
⎯ Manages the external space as 8 areas of 2-Mbytes
⎯ Bus specifications can be set independently for each area
⎯ Burst ROM interface can be set
• Basic bus interface*1
⎯ Chip select (CS0 to CS5) can be output for areas 0 to 5*2
⎯ 8-bit access or 16-bit access can be selected for each area
⎯ 2-state access or 3-state access can be selected for each area
⎯ Program wait states can be inserted for each area
• Burst ROM interface*2
⎯ Burst ROM interface can be selected for area 0
⎯ One or two states can be selected for the burst cycle
• Idle cycle insertion*2
⎯ Idle cycle can be inserted between consecutive read accesses to different areas
⎯ Idle cycle can be inserted before a write access to an external area immediately after a read
access to an external area
• Bus arbitration
⎯ The on-chip bus arbiter arbitrates bus mastership among CPU and DMAC
• Other features
⎯ External bus release function*2
Notes: 1. Chip select CS6 in area 6 is for the on-chip USB. Therefore it cannot be used as an
external area. 8-bit bus mode, 3-state access, and no program wait state should be set
for area 6. Access to the RTC related registers (address: H'FFFF40 to H'FFFF5F)
follows the specification of area 7. 8-bit access, 3-state access, and no program wait
state should be set for area 7.
2. These functions are not available in the H8S/2212 Group.
BSCS207A_010020020100
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Section 6 Bus Controller
Figure 6.1 shows a block diagram of the bus controller.
Chip select signals
Internal
address bus
Area decorder
ABWCR
External bus control signals
ASTCR
BCRH
BCRL
BACK*
WAIT*
Bus
controller
Wait
controller
Internal data bus
BREQ*
Internal control
signals
Bus mode signal
WCRH
WCRL
Bus arbiter
CPU bus request signal
DMAC bus request signal
CPU bus acknowledge signal
DMAC bus acknowledge signal
Legend:
ABWCR:
ASTCR:
WCRH, WCRL:
BCRH, BCRL:
Bus width control register
Access state control register
Waite control registers H, L
Bus control registers H, L
Note: * Supported only by the H8S/2218 Group.
Figure 6.1 Block Diagram of Bus Controller
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Section 6 Bus Controller
6.2
Input/Output Pins
Table 6.1 summarizes the pins of the bus controller.
These pins are supported only by the H8S/2218 Group.
Table 6.1
Pin Configuration
Name
Symbol
I/O
Function
Address strove
AS
Output
Strobe signal indicating that address output on
address bus is enabled.
Read
RD
Output
Strobe signal indicating that external space is being
read.
High write
HWR
Output
Strobe signal indicating that external space is to be
written, and upper half (D15 to D8) of data bus is
enabled.
Low write
LWR
Output
Strobe signal indicating that external space is to be
written, and lower half (D7 to D0) of data bus is
enabled.
Chip select 0 to 5 CS0 to CS5
Output
Strobe signal indicating that areas 0 to 5 are selected.
Wait
WAIT
Input
Wait request signal when accessing external 3-state
access space.
Bus request
BREQ
Input
Request signal that releases bus to external device.
Bus request
acknowledge
BACK
Output
Acknowledge signal indicating that bus has been
released.
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Section 6 Bus Controller
6.3
Register Descriptions
The following shows the registers of the bus controller.
• Bus width control register (ABWCR)
• Access state control register (ASTCR)
• Wait control register H (WCRH)
• Wait control register L (WCRL)
• Bus control register H (BCRH)
• Bus control register L (BCRL )
• Pin function control register (PFCR)
6.3.1
Bus Width Control Register (ABWCR)
ABWCR designates each area for either 8-bit access or 16-bit access.
ABWCR sets the data bus width for the external memory space. The bus width for on-chip
memory and internal I/O registers except for the on-chip USB and RTC is fixed regardless of the
settings in ABWCR.
Bit
Bit Name
1/0*
2
1/0*
7
ABW7*
6
ABW6*
5
4
3
ABW5
ABW4
ABW3
Initial Value R/W
2
R/W
Area 7 to 0 Bus Width Control:
1
R/W
1
R/W
These bits select whether the corresponding area is to
be designated for 8-bit access or 16-bit access.
1
R/W
0: Area n is designated for 16-bit access
1
R/W
1: Area n is designated for 8-bit access
1
R/W
Legend: n = 7 to 0
1
R/W
1
R/W
1/0*
1/0*
1/0*
2
ABW2
1/0*
1
ABW1
1/0*
0
ABW0
Description
1
1/0*
Notes: 1. In modes 5 to 7, initial value of each bit is 1. In mode 4, initial value of each bit is 0.
These bits should be set to 1 in the H8S/2212 Group.
2. The on-chip USB and on-chip RTC are allocated to area 6 and area 7, respectively.
Therefore, these bits should be set to 1.
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Section 6 Bus Controller
6.3.2
Access State Control Register (ASTCR)
ASTCR designates each area as either a 2-state access space or a 3-state access space.
ASTCR sets the number of access states for the external memory space. The number of access
states for on-chip memory and internal I/O registers except for the on-chip USB is fixed regardless
of the settings in ASTCR.
Bit
Bit Name
Initial Value R/W
Description
7
AST7*
1
R/W
Area 7 to 0 Access State Control:
6
AST6*
1
R/W
5
AST5
1
R/W
4
AST4
1
R/W
These bits select whether the corresponding area is to
be designated as a 2-state access space or a 3-state
access space. Wait state insertion is enabled or disabled
at the same time.
3
AST3
1
R/W
0: Area n is designated for 2-state access
2
AST2
1
R/W
1
AST1
1
R/W
0
AST0
1
R/W
Wait state insertion in area n external space is
disabled
1: Area n is designated for 3-state access
Wait state insertion in area n external space is
enabled
Legend: n = 7 to 0
Note: * The on-chip USB and on-chip RTC are allocated to area 6 and area 7, respectively.
Therefore, these bits should be set to 1.
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Section 6 Bus Controller
6.3.3
Wait Control Registers H and L (WCRH, WCRL)
WCRH and WCRL select the number of program wait states for each area.
Program waits are not inserted in the case of on-chip memory or internal I/O registers except for
the on-chip USB.
•
WCRH
Bit
Bit Name
Initial Value R/W
Description
7
W71*
1
R/W
Area 7 Wait Control 1 and 0
6
W70*
1
R/W
These bits select the number of program wait states
when area 7 in external space is accessed while the
AST7 bit in ASTCR is set to 1.
00: Program wait not inserted when external space area
7 is accessed
01: 1 program wait state inserted when external space
area 7 is accessed
10: 2 program wait states inserted when external space
area 7 is accessed
11: 3 program wait states inserted when external space
area 7 is accessed
5
W61*
1
R/W
Area 6 Wait Control 1 and 0
4
W60*
1
R/W
These bits select the number of program wait states
when area 6 in external space is accessed while the
AST6 bit in ASTCR is set to 1.
00: Program wait not inserted when external space area
6 is accessed
01: 1 program wait state inserted when external space
area 6 is accessed
10: 2 program wait states inserted when external space
area 6 is accessed
11: 3 program wait states inserted when external space
area 6 is accessed
Note: * The on-chip USB and on-chip RTC are allocated to area 6 and area 7, respectively.
Therefore, these bits should be set to 0.
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Section 6 Bus Controller
Bit
Bit Name
Initial Value R/W
Description
3
W51
1
R/W
Area 5 Wait Control 1 and 0
2
W50
1
R/W
These bits select the number of program wait states
when area 5 in external space is accessed while the
AST5 bit in ASTCR is set to 1.
00: Program wait not inserted when external space area
5 is accessed
01: 1 program wait state inserted when external space
area 5 is accessed
10: 2 program wait states inserted when external space
area 5 is accessed
11: 3 program wait states inserted when external space
area 5 is accessed
1
W41
1
R/W
Area 4 Wait Control 1 and 0
0
W40
1
R/W
These bits select the number of program wait states
when area 4 in external space is accessed while the
AST4 bit in ASTCR is set to 1.
00: Program wait not inserted when external space area
4 is accessed
01: 1 program wait state inserted when external space
area 4 is accessed
10: 2 program wait states inserted when external space
area 4 is accessed
11: 3 program wait states inserted when external space
area 4 is accessed
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Section 6 Bus Controller
• WCRL
Bit
Bit Name
Initial Value R/W
Description
7
W31
1
R/W
Area 3 Wait Control 1 and 0
6
W30
1
R/W
These bits select the number of program wait states
when area 3 in external space is accessed while the
AST3 bit in ASTCR is set to 1.
00: Program wait not inserted when external space area
3 is accessed
01: 1 program wait state inserted when external space
area 3 is accessed
10: 2 program wait states inserted when external space
area 3 is accessed
11: 3 program wait states inserted when external space
area 3 is accessed
5
W21
1
R/W
Area 2 Wait Control 1 and 0
4
W20
1
R/W
These bits select the number of program wait states
when area 2 in external space is accessed while the
AST2 bit in ASTCR is set to 1.
00: Program wait not inserted when external space area
2 is accessed
01: 1 program wait state inserted when external space
area 2 is accessed
10: 2 program wait states inserted when external space
area 2 is accessed
11: 3 program wait states inserted when external space
area 2 is accessed
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Section 6 Bus Controller
Bit
Bit Name
Initial Value R/W
Description
3
W11
1
R/W
Area 1 Wait Control 1 and 0
2
W10
1
R/W
These bits select the number of program wait states
when area 1 in external space is accessed while the
AST1 bit in ASTCR is set to 1.
00: Program wait not inserted when external space area
1 is accessed
01: 1 program wait state inserted when external space
area 1 is accessed
10: 2 program wait states inserted when external space
area 1 is accessed
11: 3 program wait states inserted when external space
area 1 is accessed
1
W01
1
R/W
Area 0 Wait Control 1 and 0
0
W00
1
R/W
These bits select the number of program wait states
when area 0 in external space is accessed while the
AST0 bit in ASTCR is set to 1.
00: Program wait not inserted when external space area
0 is accessed
01: 1 program wait state inserted when external space
area 0 is accessed
10: 2 program wait states inserted when external space
area 0 is accessed
11: 3 program wait states inserted when external space
area 0 is accessed
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Section 6 Bus Controller
6.3.4
Bus Control Register H (BCRH)
BCRH selects enabling or disabling of idle cycle insertion, and the memory interface for area 0.
This register should be set initial value and not be modified in the H8S/2212 Group.
Bit
Bit Name
Initial Value R/W
Description
7
ICIS1
1
Idle Cycle Insert 1:
R/W
Selects whether or not one idle cycle state is to be
inserted between bus cycles when successive external
read cycles are performed in different areas.
0: Idle cycle not inserted in case of successive external
read cycles in different areas
1: Idle cycle inserted in case of successive external read
cycles in different areas
6
ICIS0
1
R/W
Idle Cycle Insert 0:
Selects whether or not one idle cycle state is to be
inserted between bus cycles when successive external
read and write cycles are performed.
0: Idle cycle not inserted in case of successive external
read and write cycles
1: Idle cycle inserted in case of successive external read
and write cycles
5
BRSTRM
0
R/W
Burst ROM enable:
Selects whether area 0 is used as a burst ROM interface.
0: Area 0 is basic bus interface
1: Area 0 is burst ROM interface
4
BRSTS1
1
R/W
Burst Cycle Select 1:
Selects the number of burst cycles for the burst ROM
interface.
0: Burst cycle comprises 1 state
1: Burst cycle comprises 2 states
3
BRSTS0
0
R/W
Burst Cycle Select 0:
Selects the number of words that can be accessed in a
burst ROM interface burst access.
0: Max. 4 words in burst access
1: Max. 8 words in burst access
2 to –
0
All 0
R/W
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Reserved
The write value should always be 0.
Section 6 Bus Controller
6.3.5
Bus Control Register L (BCRL)
BCRL performs selection of the external bus-released state protocol, and enabling or disabling of
WAIT pin input.
The functions selected by this register are available only in the H8S/2218 Group. This register
should not be modified in the H8S/2212 Group.
Bit
Bit Name
Initial Value R/W
Description
7
BRLE*
0
Bus Release Enable
R/W
Enables or disables external bus release.
0: External bus release is disabled. BREQ and BACK
can be used as I/O ports.
1: External bus release is enabled.
6
–
0
R/W
Reserved
The write value should always be 0.
5
–
0
–
Reserved
This bit is always read as 0 and cannot be modified.
4
–
0
R/W
Reserved
The write value should always be 0.
3
–
1
R/W
Reserved
The write value should always be 1.
2, 1 –
All 0
R/W
Reserved
The write value should always be 0.
0
WAITE*
0
R/W
WAIT Pin Enable
Selects enabling or disabling of wait input by the WAIT
pin.
0: Wait input by WAIT pin disabled. WAIT pin can be
used as I/O port.
1: Wait input by WAIT pin enabled.
Note: * These bits should be set to 0 in the H8S/2212 Group.
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Section 6 Bus Controller
6.3.6
Pin Function Control Register (PFCR)
PFCR performs address output control in external extended mode. When using the USB with the
emulator (E6000), enable the A8 and A9 output by setting AE3 to AE0 to 0010.
Bit
Bit Name Initial Value R/W
7 to ⎯
Undefined
R/W
4
Description
Reserved
The write value should always be 0.
3
AE3
1/0*
R/W
Address Output Enable 3 to 0
2
AE2
1/0*
R/W
1
AE1
0
R/W
0
AE0
1/0*
R/W
These bits select enabling or disabling of address outputs
A8 to A23 in ROMless extended mode and modes with
ROM.
When a pin is enabled for address output, the address is
output regardless of the corresponding DDR setting. When
a pin is disabled for address output, it becomes an output
port when the corresponding DDR bit is set to 1.
0000:
A8 to A23 output disabled (initial value of mode 6 and 7)
0001:
A8 output enabled; A9 to A23 output disabled
0010:
A8, A9 output enabled; A10 to A23 output disabled
0011:
A8 to A10 output enabled; A11 to A23 output disabled
0100:
A8 to A11 output enabled; A12 to A23 output disabled
0101:
A8 to A12 output enabled; A13 to A23 output disabled
0110:
A8 to A13 output enabled; A14 to A23 output disabled
0111:
A8 to A14 output enabled; A15 to A23 output disabled
1000:
A8 to A15 output enabled; A16 to A23 output disabled
1001:
A8 to A16 output enabled; A17 to A23 output disabled
1010:
A8 to A17 output enabled; A18 to A23 output disabled
1011:
A8 to A18 output enabled; A19 to A23 output disabled
1100:
A8 to A19 output enabled; A20 to A23 output disabled
1101:
A8 to A20 output enabled; A21 to A23 output disabled
(initial value of modes 4 and 5)
1110:
A8 to A21 output enabled; A22, A23 output disabled
1111:
A8 to A23 output enabled
Note: * In modes 4 and 5, initial value of each bit is 1. In modes 6 and 7, initial value of each bit is 0.
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Section 6 Bus Controller
6.4
Bus Control
6.4.1
Area Divisions
In advanced mode, the bus controller partitions the 16 Mbytes address space into eight areas, 0 to
7, in 2-Mbyte units, and performs bus control for external space in area units. In normal mode*, it
controls a 64-kbyte address space comprising part of area 0.
Figure 6.2 shows an outline of the memory map.
Chip select signals (CS0 to CS5) can be output for areas 0 to 5.
Note: * Not available in this LSI.
H'000000
H'0000
Area 0
(2 Mbytes)
H'1FFFFF
H'200000
Area 1
(2 Mbytes)
H'3FFFFF
H'400000
Area 2
(2 Mbytes)
H'FFFF
H'5FFFFF
H'600000
Area 3
(2 Mbytes)
H'7FFFFF
H'800000
Area 4
(2 Mbytes)
H'9FFFFF
H'A00000
Area 5
(2 Mbytes)
H'BFFFFF
H'C00000
2
Area 6 *
(2 Mbytes)
H'DFFFFF
H'E00000
Area 7
(2 Mbytes)
H'FFFFFF
(1)
Advanced mode
(2)
Normal mode*1
Notes: 1. Not available in this LSI.
2. This area is allocated to the on-chip USB in this LSI.
Figure 6.2 Overview of Area Divisions
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Section 6 Bus Controller
6.4.2
Bus Specifications
The external space bus specifications consist of three elements: bus width, number of access states,
and number of program wait states.
The bus width and number of access states for memory and internal I/O registers except for the onchip USB and RTC are fixed, and are not affected by the bus controller.
Bus Width: A bus width of 8 or 16 bits can be selected with ABWCR. An area for which an 8-bit
bus is selected functions as an 8-bit access space, and an area for which a 16-bit bus is selected
functions as a16-bit access space.
If all areas are designated for 8-bit access, 8-bit bus mode is set; if any area is designated for 16-bit
access, 16-bit bus mode is set. When the burst ROM interface is designated, 16-bit bus mode is
always set. 8-bit bus mode should be set for area 6 and area 7 in this LSI.
Number of Access States: Two or three access states can be selected with ASTCR.
An area for which 2-state access is selected functions as a 2-state access space, and an area for
which 3-state access is selected functions as a 3-state access space.
With the burst ROM interface, the number of access states may be determined without regard to
ASTCR.
When 2-state access space is designated, wait insertion is disabled.
Area 6 and area 7 should be set to function as a 3-state access space in this LSI.
Number of Program Wait States: When 3-state access space is designated by ASTCR, the
number of program wait states to be inserted automatically is selected with WCRH and WCRL.
From 0 to 3 program wait states can be selected.
The number of program wait states in area 6 and area 7 should be set to 0 in this LSI.
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Section 6 Bus Controller
Table 6.2
Bus Specifications for Each Area (Basic Bus Interface)
ABWCR
ASTCR
WCRH, WCRL
ABWn
0
ASTn
0
1
Wn1
⎯
0
1
1
0
1
⎯
0
1
6.4.3
Wn0
⎯
0
1
0
1
⎯
0
1
0
1
Bus Specifications (Basic Bus Interface)
Number of
Number of
Bus Width Access States
Program Wait States
16
2
0
3
0
1
2
3
8
2
0
3
0
1
2
3
Bus Interface for Each Area
The initial state of each area is basic bus interface, 3-state access space. The initial bus width is
selected according to the operating mode. The bus specifications described here cover basic items
only, and the sections on each memory interface (section 6.6, Basic Bus Interface and section 6.7,
Burst ROM Interface) should be referred to for further details. Note that the ROM is always
enabled and no external extended mode in the H8S/2212 Group.
Area 0: Area 0 includes on-chip ROM, and in ROM-disabled extended mode, all of area 0 is
external space. In ROM-enabled extended mode, the space excluding on-chip ROM is external
space.
When area 0 external space is accessed, the CS0 signal can be output.
Either basic bus interface or burst ROM interface can be selected for area 0.
Areas 1 to 6: In external extended mode, all of areas 1 to 6 is external space. When area 1 to 5
external space is accessed, the CS1 to CS5 pin signals respectively can be output. Only the basic
bus interface can be used for areas 1 to 5. Area 6 is only for the on-chip USB. For details, see
section 14, Universal Serial Bus (USB).
Area 7: Area 7 includes the on-chip RAM and internal l/O registers. In external extended mode,
the space excluding the reserved area (for details, see section 3.4, Memory Map in Each Operating
Mode) the on-chip RAM and internal l/O registers except on-chip RTC, is external space. The onchip RAM is enabled when the RAME bit in the system control register (SYSCR) is set to 1; when
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Section 6 Bus Controller
the RAME bit is cleared to 0, the on-chip RAM is disabled and the corresponding space becomes
external space.
Only the basic bus interface can be used for the area 7.
6.4.4
Chip Select Signals
In the H8S/2218 Group chip select signals (CS0 to CS5) can be output to areas 0 to 5, the signal
being driven low when the corresponding external space area is accessed. Figure 6.3 shows an
example of CSn (n = 0 to 5) output timing. Enabling or disabling of the CSn signal is performed
by setting the data direction register (DDR) for the port corresponding to the particular CSn pin.
In ROM-disabled extended mode, the CS0 pin is placed in the output state after a power-on reset.
Pins CS1 to CS5 are placed in the input state after a power-on reset, and so the corresponding
DDR should be set to 1 when outputting signals CS1 to CS5.
In ROM-enabled extended mode, pins CS0 to CS5 are all placed in the input state after a power-on
reset, and so the corresponding DDR should be set to 1 when outputting signals CS0 to CS5. For
details, see section 8, I/O Ports.
Bus cycle
T1
T2
T3
φ
Address bus
Area n external address
CSn
Figure 6.3 CSn Signal Output Timing (n = 0 to 5)
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Section 6 Bus Controller
6.5
Basic Timing
The CPU is driven by a system clock (φ), denoted by the symbol φ. The period from one rising
edge of φ to the next is referred to as a "state." The memory cycle or bus cycle consists of one,
two, or three states. Different methods are used to access on-chip memory, on-chip peripheral
modules, and the external address space.
6.5.1
On-Chip Memory (ROM, RAM) Access Timing
On-chip memory is accessed in one state. The data bus is 16 bits wide, permitting both byte and
word transfer instruction. Figure 6.4 shows the on-chip memory access cycle. Figure 6.5 shows the
pin states.
Bus cycle
T1
φ
Internal address bus
Read
access
Internal read signal
Internal data bus
Write
access
Address
Read data
Internal write signal
Internal data bus
Write data
Figure 6.4 On-Chip Memory Access Cycle
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Section 6 Bus Controller
Bus cycle
T1
φ
Address bus*
Unchanged
AS*
High
RD*
High
HWR, LWR*
High
Data bus*
High-impedance state
Note: * Supported only by the H8S/2218 Group.
Figure 6.5 Pin States during On-Chip Memory Access
6.5.2
On-Chip Peripheral Module Access Timing
The on-chip peripheral modules are accessed in two states except on-chip USB and RTC. The data
bus is either 8 bits or 16 bits wide, depending on the particular internal I/O register being accessed.
Figure 6.6 shows the access timing for the on-chip peripheral modules. Figure 6.7 shows the pin
states.
Bus cycle
T1
T2
φ
Internal address bus
Read
access
Internal read signal
Internal data bus
Write
access
Address
Read data
Internal write signal
Internal data bus
Write data
Figure 6.6 On-Chip Peripheral Module Access Cycle
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Section 6 Bus Controller
Bus cycle
T1
T2
φ
Address bus*
Unchanged
AS*
High
RD*
High
HWR, LWR*
High
Data bus*
High-impedance state
Note: * Supported only by the H8S/2218 Group.
Figure 6.7 Pin States during On-Chip Peripheral Module Access
6.5.3
External Address Space Access Timing
The external address space is accessed with an 8-bit or 16-bit data bus width in a two-state or
three-state bus cycle. In three-state access, wait states can be inserted. For further details, refer to
section 6.6.3, Basic Timing.
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Section 6 Bus Controller
6.6
Basic Bus Interface
The basic bus interface enables direct connection of ROM, SRAM, and so on.
6.6.1
Data Size and Data Alignment (Supported Only by the H8S/2218 Group)
Data sizes for the CPU and other internal bus masters are byte, word, and longword. The bus
controller has a data alignment function, and when accessing external space, controls whether the
upper data bus (D15 to D8) or lower data bus (D7 to D0) is used according to the bus
specifications for the area being accessed (8-bit access space or 16-bit access space) and the data
size.
8-Bit Access Space: Figure 6.8 illustrates data alignment control for the 8-bit access space. With
the 8-bit access space, the upper data bus (D15 to D8) is always used for accesses. The amount of
data that can be accessed at one time is one byte: a word transfer instruction is performed as twobyte accesses, and a longword transfer instruction, as four-byte accesses.
Upper data bus
Lower data bus
D15
D8 D7
D0
Byte size
Word size
1st bus cycle
2nd bus cycle
1st bus cycle
Longword
size
2nd bus cycle
3rd bus cycle
4th bus cycle
Figure 6.8 Access Sizes and Data Alignment Control (8-Bit Access Space)
16-Bit Access Space: Figure 6.9 illustrates data alignment control for the 16-bit access space.
With the 16-bit access space, the upper data bus (D15 to D8) and lower data bus (D7 to D0) are
used for accesses. The amount of data that can be accessed at one time is one byte or one word,
and a longword transfer instruction is executed as two word transfer instructions.
In byte access, whether the upper or lower data bus is used is determined by whether the address is
even or odd. The upper data bus is used for an even address, and the lower data bus for an odd
address.
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Section 6 Bus Controller
Upper data bus
Lower data bus
D15
D8 D7
D0
Byte size
· Even address
Byte size
· Odd address
Word size
1st bus cycle
Longword
size
2nd bus cycle
Figure 6.9 Access Sizes and Data Alignment Control (16-Bit Access Space)
6.6.2
Valid Strobes
Table 6.3 shows the data buses used and valid strobes for the access spaces in the H8S/2218
Group.
In a read, the RD signal is valid without discrimination between the upper and lower halves of the
data bus.
In a write, the HWR signal is valid for the upper half of the data bus, and the LWR signal for the
lower half.
The RD, HWR, and LWR signals are not available in the H8S/2212 Group.
Table 6.3
Area
Data Buses Used and Valid Strobes
Access
Size
8-bit access Byte
space
16-bit
access
space
Byte
Read/
Write
Address
Valid Strobe
Upper Data Bus Lower Data Bus
(D15 to D8)
(D7 to D0)
Read
–
RD
Valid
Write
–
HWR
Read
Even
RD
Hi-Z
Odd
Valid
Invalid
Invalid
Valid
Even
HWR
Valid
Hi-Z
Odd
LWR
Hi-Z
Valid
Read
–
RD
Valid
Valid
Write
–
HWR, LWR
Write
Word
Invalid
Notes:
Hi-Z:
High impedance.
Invalid: Input state: input value is ignored.
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Section 6 Bus Controller
6.6.3
Basic Timing
8-Bit 2-State Access Space: Figure 6.10 shows the bus timing for an 8-bit 2-state access space in
the H8S/2218 Group. When an 8-bit access space is accessed, the upper half (D15 to D8) of the
data bus is used.
Wait states cannot be inserted.
Bus cycle
T1
T2
φ
Address bus
CSn
AS
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR
(16-bit bus
mode)
Write
LWR
(8-bit bus
mode)
D15 to D8
D7 to D0
High
High impedance
Valid
High impedance
Note: n = 0 to 5
Figure 6.10 Bus Timing for 8-Bit 2-State Access Space
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Section 6 Bus Controller
8-Bit 3-State Access Space (Except Area 6): Figure 6.11 shows the bus timing for an 8-bit 3state access space in the H8S/2218 Group. When an 8-bit access space is accessed, the upper half
(D15 to D8) of the data bus is used.
Wait states can be inserted.
Bus cycle
T1
T2
T3
φ
Address bus
CSn
AS
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR
(16-bit bus
mode)
Write
LWR
(8-bit bus
mode)
D15 to D8
D7 to D0
High
High impedance
Valid
High impedance
Note: n = 0 to 5
Figure 6.11 Bus Timing for 8-Bit 3-State Access Space (Except Area 6)
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Section 6 Bus Controller
8-Bit 3-State Access Space (Area 6 and RTC): Figure 6.12 shows the bus timing for area 6 and
RTC area (address = H'FFFF40 to H'FFFF5F). When the areas are accessed, the data bus cannot be
used.
Wait states cannot be inserted.
Bus cycle
T1
T2
T3
φ
Address bus*
AS*
RD*
Read
D15 to D8*
Invalid
D7 to D0*
Invalid
HWR*
LWR*
(16-bit bus
mode)
Write
LWR*
(8-bit bus
mode)
D15 to D8*
High
High impedance
High impedance
High impedance
D7 to D0*
Note: * Supported only by the H8S/2218 Group.
Figure 6.12 Bus Timing for Area 6 and RTC
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Section 6 Bus Controller
16-Bit 2-State Access Space: Figures 6.13 to 6.15 show bus timings for a 16-bit 2-state access
space in the H8S/2218 Group. When a 16-bit access space is accessed, the upper half (D15 to D8)
of the data bus is used for the even address, and the lower half (D7 to D0) for the odd address.
Wait states cannot be inserted.
Bus cycle
T1
T2
φ
Address bus
CSn
AS
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR
High
Write
D15 to D8
D7 to D0
Valid
High impedance
Note: n = 0 to 5
Figure 6.13 Bus Timing for 16-Bit 2-State Access Space (1) (Even Address Byte Access)
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Section 6 Bus Controller
Bus cycle
T1
T2
φ
Address bus
CSn
AS
RD
Read
D15 to D8
Invalid
D7 to D0
Valid
HWR
High
LWR
Write
High impedance
D15 to D8
D7 to D0
Valid
Note: n = 0 to 5
Figure 6.14 Bus Timing for 16-Bit 2-State Access Space (2) (Odd Address Byte Access)
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Section 6 Bus Controller
Bus cycle
T1
T2
φ
Address bus
CSn
AS
RD
Read
D15 to D8
Valid
D7 to D0
Valid
HWR
LWR
Write
D15 to D8
Valid
D7 to D0
Valid
Note: n = 0 to 5
Figure 6.15 Bus Timing for 16-Bit 2-State Access Space (3) (Word Access)
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Section 6 Bus Controller
16-Bit 3-State Access Space: Figures 6.16 to 6.18 show bus timings for a 16-bit 3-state access
space in the H8S/2218 Group. When a 16-bit access space is accessed , the upper half (D15 to D8)
of the data bus is used for the even address, and the lower half (D7 to D0) for the odd address.
Wait states can be inserted.
Bus cycle
T1
T2
T3
φ
Address bus
CSn
AS
RD
Read
D15 to D8
Valid
D7 to D0
Invalid
HWR
LWR
High
Write
D15 to D8
D7 to D0
Valid
High impedance
Note: n = 0 to 5
Figure 6.16 Bus Timing for 16-Bit 3-State Access Space (1) (Even Address Byte Access)
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Section 6 Bus Controller
Bus cycle
T1
T2
T3
φ
Address bus
CSn
AS
RD
Read
D15 to D8
Invalid
D7 to D0
Valid
HWR
High
LWR
Write
D15 to D8
D7 to D0
High impedance
Valid
Note: n = 0 to 5
Figure 6.17 Bus Timing for 16-Bit 3-State Access Space (2) (Odd Address Byte Access)
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Section 6 Bus Controller
Bus cycle
T1
T2
T3
φ
Address bus
CSn
AS
RD
Read
D15 to D8
Valid
D7 to D0
Valid
HWR
LWR
Write
D15 to D8
Valid
D7 to D0
Valid
Note: n = 0 to 5
Figure 6.18 Bus Timing for 16-Bit 3-State Access Space (3) (Word Access)
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Section 6 Bus Controller
6.6.4
Wait Control
When accessing external space, this LSI can extend the bus cycle by inserting one or more wait
states (Tw). There are two ways of inserting wait states: program wait insertion and pin wait
insertion using the WAIT pin.
Program Wait Insertion: From 0 to 3 wait states can be inserted automatically between the T2
state and T3 state on an individual area basis in 3-state access space, according to the settings of
WCRH and WCRL.
Pin Wait Insertion: Setting the WAITE bit in BCRH to 1 enables wait insertion by means of the
WAIT pin in the H8S/2218 Group. When external space is accessed in this state, program wait
insertion is first carried out according to the settings in WCRH and WCRL. Then, if the WAIT pin
is low at the falling edge of φ in the last T2 or TW state, a TW state is inserted. If the WAIT pin is
held low, TW states are inserted until it goes high.
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Section 6 Bus Controller
Figure 6.19 shows an example of wait state insertion timing.
In the H8S/2212 Group, the WAITE bit in BCRH should not be set to 1.
By program
wait
T1
T2
Tw
By WAIT pin
Tw
Tw
T3
φ
WAIT
Address bus
AS
RD
Read
Data bus
Read data
HWR, LWR
Write
Data bus
Write data
Note: ↓ indicates the timing of WAIT pin sampling.
Figure 6.19 Example of Wait State Insertion Timing
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Section 6 Bus Controller
6.7
Burst ROM Interface
With the H8S/2218 Group, external space area 0 can be designated as burst ROM space, and burst
ROM interfacing can be performed. The burst ROM space interface enables 16-bit configuration
ROM with burst access capability to be accessed at high speed.
Area 0 can be designated as burst ROM space by means of the BRSTRM bit in BCRH.
Consecutive burst accesses of a maximum of 4 words or 8 words can be performed for CPU
instruction fetches only. One or two states can be selected for burst access.
6.7.1
Basic Timing
The number of states in the initial cycle (full access) of the burst ROM interface is in accordance
with the setting of the AST0 bit in ASTCR. Also, when the AST0 bit is set to 1, wait state
insertion is possible. One or two states can be selected for the burst cycle, according to the setting
of the BRSTS1 bit in BCRH. Wait states cannot be inserted. When area 0 is designated as burst
ROM space, it becomes 16-bit access space regardless of the setting of the ABW0 bit in ABWCR.
When the BRSTS0 bit in BCRH is cleared to 0, burst access of up to 4 words is performed; when
the BRSTS0 bit is set to 1, burst access of up to 8 words is performed.
The basic access timing for burst ROM space is shown in figures 6.20 and 6.21. The timing shown
in figure 6.20 is for the case where the AST0 and BRSTS1 bits are both set to 1, and that in figure
6.21 is for the case where both these bits are cleared to 0.
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Section 6 Bus Controller
Full access
T1
T2
Burst access
T3
T1
T2
T1
T2
φ
Only lower address changed
Address bus
CS0
AS
RD
Data bus
Read data
Read data
Read data
Figure 6.20 Example of Burst ROM Access Timing (When AST0 = BRSTS1 = 1)
Full access
T1
T2
Burst access
T1
T1
φ
Address bus
Only lower address changed
CS0
AS
RD
Data bus
Read data
Read data Read data
Figure 6.21 Example of Burst ROM Access Timing (When AST0 = BRSTS1 = 0)
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6.7.2
Wait Control
As with the basic bus interface, either program wait insertion or pin wait insertion using the WAIT
pin can be used in the initial cycle (full access) of the burst ROM interface. See section 6.6.4, Wait
Control.
Wait states cannot be inserted in a burst cycle.
6.8
Idle Cycle
When the H8S/2218 Group accesses external space, it can insert a 1-state idle cycle (TI) between
bus cycles in the following two cases: (1) when read accesses between different areas occur
consecutively, and (2) when a write cycle occurs immediately after a read cycle. By inserting an
idle cycle it is possible, for example, to avoid data collisions between ROM, with a long output
floating time, and high-speed memory, I/O interfaces, and so on.
Consecutive Reads between Different Areas: If consecutive reads between different areas occur
while the ICIS1 bit in BCRH is set to 1, an idle cycle is inserted at the start of the second read
cycle.
Figure 6.22 shows an example of the operation in this case. In this example, bus cycle A is a read
cycle from ROM with a long output floating time, and bus cycle B is a read cycle from SRAM,
each being located in a different area. In (a), an idle cycle is not inserted, and a collision occurs in
cycle B between the read data from ROM and that from SRAM. In (b), an idle cycle is inserted,
and a data collision is prevented.
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Section 6 Bus Controller
Bus cycle A
T1
T2
T3
Bus cycle B
T1
Bus cycle A
T1
T2
φ
φ
Address bus
Address bus
CS (area A)
CS (area A)
CS (area B)
CS (area B)
RD
RD
Data bus
Data bus
Long output floating time
(a) Idle cycle not inserted
(ICIS1 = 0)
T2
T3
TI
T1
Data collision
(b) Idle cycle inserted
(Initial value ICIS1 = 1)
Figure 6.22 Example of Idle Cycle Operation (1)
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Bus cycle B
T2
Section 6 Bus Controller
Write after Read: If an external write occurs after an external read while the ICIS0 bit in BCRH
is set to 1, an idle cycle is inserted at the start of the write cycle.
Figure 6.23 shows an example of the operation in this case. In this example, bus cycle A is a read
cycle from ROM with a long output floating time, and bus cycle B is a CPU write cycle. In (a), an
idle cycle is not inserted, and a collision occurs in cycle B between the read data from ROM and
the CPU write data. In (b), an idle cycle is inserted, and a data collision is prevented.
Bus cycle A
T1
T2
T3
Bus cycle B
T1
Bus cycle A
T2
T1
φ
φ
Address bus
Address bus
CS (area A)
CS (area A)
CS (area B)
CS (area B)
RD
RD
HWR
HWR
Data bus
Data bus
Long output floating time
(a) Idle cycle not inserted
(ICIS0 = 0)
T2
T3
Bus cycle B
TI
T1
T2
Data collision
(b) Idle cycle inserted
(Initial value ICIS0 = 1)
Figure 6.23 Example of Idle Cycle Operation (2)
Relationship between Chip Select (CS) Signal and Read (RD) Signal: Depending on the
system's load conditions, the RD signal may lag behind the CS signal. An example is shown in
figure 6.24.
In this case, with the setting for no idle cycle insertion (a), there may be a period of overlap
between the bus cycle A RD signal and the bus cycle B CS signal.
Setting idle cycle insertion, as in (b), however, will prevent any overlap between the RD and CS
signals.
In the initial state after reset release, idle cycle insertion (b) is set.
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Section 6 Bus Controller
Bus cycle A
T1
T2
T3
Bus cycle B
T1
Bus cycle A
T2
T1
φ
φ
Address bus
Address bus
CS (area A)
CS (area A)
CS (area B)
CS (area B)
RD
RD
T2
T3
Bus cycle B
TI
T1
Possibility of overlap between
CS (area B) and RD
(a) Idle cycle not inserted
(ICIS1 = 0)
(b) Idle cycle inserted
(Initial value ICIS1 = 1)
Figure 6.24 Relationship between Chip Select (CS) and Read (RD)
Table 6.4 shows pin states in an idle cycle.
Table 6.4
Pin States in Idle Cycle
Pins
Pin State
A23 to A0
Contents of next bus cycle
D15 to D0
High impedance
CSn
High
AS
High
RD
High
HWR
High
LWR
High
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T2
Section 6 Bus Controller
6.9
Bus Release
The H8S/2218 Group can release the external bus in response to a bus request from an external
device. In the external bus released state, the internal bus master continues to operate as long as
there is no external access.
In external extended mode, the bus can be released to an external device by setting the BRLE bit in
BCRL to 1. Driving the BREQ pin low issues an external bus request to this LSI. When the BREQ
pin is sampled, at the prescribed timing the BACK pin is driven low, and the address bus, data bus,
and bus control signals are placed in the high-impedance state, establishing the external busreleased state.
In the external bus released state, an internal bus master can perform accesses using the internal
bus. When an internal bus master wants to make an external access, it temporarily defers activation
of the bus cycle, and waits for the bus request from the external bus master to be dropped.
When the BREQ pin is driven high, the BACK pin is driven high at the prescribed timing and the
external bus released state is terminated.
In the event of simultaneous external bus release request and external access request generation,
the order of priority is as follows:
(High) External bus release > Internal bus master external access (Low)
Table 6.5 shows pin states in the external bus released state.
In the H8S/2212 Group, the BRLE bit in BCRL should not be set to 1.
Table 6.5
Pins
Pin States in Bus Released State
Pin State
A23 to A0
High impedance
D15 to D0
High impedance
CSn
High impedance
AS
High impedance
RD
High impedance
HWR
High impedance
LWR
High impedance
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Section 6 Bus Controller
Figure 6.25 shows the timing for transition to the bus-released state.
CPU cycle
T0
T1
CPU
cycle
External bus released state
T2
φ
High impedance
Address bus
Address
High impedance
Data bus
High impedance
CSn
High impedance
AS
High impedance
RD
High impedance
HWR, LWR
BREQ
BACK
Minimum
1 state
[1]
[1]
[2]
[3]
[4]
[5]
[2]
[3]
[4]
[5]
Low level of BREQ pin is sampled at rise of T2 state.
BACK pin is driven low at end of CPU read cycle, releasing bus to external bus
master.
BREQ pin state is still sampled in external bus released state.
High level of BREQ pin is sampled.
BACK pin is driven high, ending bus release cycle.
Note : n = 0 to 5
Figure 6.25 Bus-Released State Transition Timing
6.9.1
Bus Release Usage Note
When MSTPCR is set to H'FFFFFF and transmitted to sleep mode, the external bus release does
not function. To activate the external bus release in sleep mode, do not set MSTPCR to H'FFFFFF.
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Section 6 Bus Controller
6.10
Bus Arbitration
This LSI has a bus arbiter that arbitrates bus master operations.
There are two bus masters, the CPU and DMAC, which perform read/write operations when they
have possession of the bus. Each bus master requests the bus by means of a bus request signal. The
bus arbiter determines priorities at the prescribed timing, and permits use of the bus by means of a
bus request acknowledge signal. The selected bus master then takes possession of the bus and
begins its operation.
6.10.1
Operation
The bus arbiter detects the bus masters' bus request signals, and if the bus is requested, sends a bus
request acknowledge signal to the bus master making the request. If there are bus requests from
more than one bus master, the bus request acknowledge signal is sent to the one with the highest
priority. When a bus master receives the bus request acknowledge signal, it takes possession of the
bus until that signal is canceled.
The order of priority of the bus masters is as follows:
(High) DMAC > CPU (Low)
An internal bus access by an internal bus master, and external bus release, can be executed in
parallel in the H8S/2218 Group.
In the event of simultaneous external bus release request, and internal bus master external access
request generation, the order of priority is as follows:
(High) External bus release > Internal bus master external access (Low)
The H8S/2212 Group does not have the external bus release function.
6.10.2
Bus Transfer Timing
Even if a bus request is received from a bus master with a higher priority than that of the bus
master that has acquired the bus and is currently operating, the bus is not necessarily transferred
immediately. There are specific times at which each bus master can relinquish the bus.
CPU: The CPU is the lowest-priority bus master, and if a bus request is received from the DMAC,
the bus arbiter transfers the bus to the bus master that issued the request. The timing for transfer of
the bus is as follows:
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Section 6 Bus Controller
• The bus is transferred at a break between bus cycles. However, if a bus cycle is executed in
discrete operations, as in the case of a longword-size access, the bus is not transferred between
the operations.
• If the CPU is in sleep mode, it transfers the bus immediately.
DMAC: The DMAC sends the bus arbiter a request for the bus when an activation request is
generated.
In the case of a USB request in short address mode or normal mode, and in cycle steal mode, the
DMAC releases the bus after a single transfer.
In block transfer mode, it releases the bus after transfer of one block, and in burst mode, after
completion of the transfer.
6.10.3
External Bus Release Usage Note
External bus release can be performed on completion of an external bus cycle in the H8S/2218
Group. The CS signal remains low until the end of the external bus cycle. Therefore, when
external bus release is performed, the CS signal may change from the low level to the highimpedance state.
6.11
Resets and the Bus Controller
In a power-on reset, this LSI, including the bus controller, enters the reset state at that point, and an
executing bus cycle is discontinued.
In a manual reset*, the bus controller's registers and internal state are maintained, and an executing
external bus cycle is completed. In this case, WAIT input is ignored and write data is not
guaranteed.
Note: * Supported only by the H8S/2218 Group.
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Section 7 DMA Controller (DMAC)
Section 7 DMA Controller (DMAC)
This LSI has a built-in DMA controller (DMAC) which can carry out data transfer on up to 4
channels.
7.1
Features
The features of the DMAC are listed below.
• Choice of short address mode or full address mode
(1) Short address mode
— Maximum of 4 channels can be used
— Choice of dual address mode
— In dual address mode, one of the two addresses, transfer source and transfer destination,
is specified as 24 bits and the other as16 bits
— Choice of sequential mode, idle mode, or repeat mode for dual address mode
(2) Full address mode
— Maximum of 2 channels can be used
— Transfer source and transfer destination address specified as 24 bits
— Choice of normal mode or block transfer mode
• 16-Mbyte address space can be specified directly
• Byte or word can be set as the transfer unit
• Activation sources: internal interrupt, USB request, auto-request (depending on transfer mode)
⎯ 16-bit timer-pulse unit (TPU) compare match/input capture interrupts
⎯ Serial communication interface (SCI_0) transmission complete interrupt, reception
complete interrupt
⎯ A/D conversion end Interrupt
⎯ USB request
⎯ Auto-request
• Module stop mode can be set
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Section 7 DMA Controller (DMAC)
A block diagram of the DMAC is shown in figure 7.1.
Internal address bus
Internal interrupts
TGI0A
TGI1A
TGI2A
TXI0
RXI0
ADI
Addres buffer
USB request signals
DREQ0
DREQ1
DMATCR
Channel 1
DMACR0A
DMACR0B
Interrupt signals
DEND0A
DEND0B
DEND1A
DEND1B
DMACR1A
DMACR1B
DMABCR
MAR0A
IOAR0A
ETCR0A
MAR0B
IOAR0B
ETCR0B
MAR1A
IOAR1A
ETCR1A
MAR1B
Data buffer
Internal address bus
Legend:
DMATCR:
DMABCR:
DMACR:
MAR:
IOAR:
ETCR:
DMA terminal control register*
DMA band control register (for all channels)
DMA control register
Memory address register
I/O address register
Executive transfer counter register
Note: * Reserved register
Figure 7.1 Block Diagram of DMAC
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IOAR1B
ETCR1B
Module data bus
Channel 0
Control logic
Channel 1B Channel 1A Channel 0B Channel 0A
Processor
Section 7 DMA Controller (DMAC)
7.2
Register Configuration
The DMAC registers are listed below.
• Memory address register 0A (MAR0A)
• I/O address register 0A (IOAR0A)
• Transfer count register 0A (ETCR0A)
• Memory address register 0B (MAR0B)
• I/O address register 0B (IOAR0B)
• Transfer count register 0B (ETCR0B)
• Memory address register 1A (MAR1A)
• I/O address register 1A (IOAR1A)
• Transfer count register 1A (ETCR1A)
• Memory address register 1B (MAR1B)
• I/O address register 1B (IOAR1B)
• Transfer count register 1B (ETCR1B)
• DMA control register 0A (DMACR0A)
• DMA control register 0B (DMACR0B)
• DMA control register 1A (DMACR1A)
• DMA control register 1B (DMACR1B)
• DMA band control register (DMABCR)
The DMAC register functions differs depending on the address modes: short address mode and full
address mode. The DMAC register functions are described in each address mode. Short address
mode or full address mode can be selected for channels 1 and 0 independently by means of bits
FAE1 and FAE0.
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Section 7 DMA Controller (DMAC)
Table 7.1
FAE0
0
Short Address Mode and Full Address Mode (For 1 Channel: Example of
Channel 0)
Description
Short address mode specified (channels A and B operate independently)
Specifies transfer source/transfer destination address
Channel 0A
MAR0A
IOAR0A
Specifies transfer destination/transfer source address
ETCR0A
Specifies number of transfers
DMACR0A
Specifies transfer source/transfer destination address
Channel 0B
MAR0B
IOAR0B
Specifies transfer destination/transfer source address
ETCR0B
Specifies number of transfers
DMACR0B
Specifies transfer size, mode, activation source, etc.
Full address mode specified (channels A and B operate combination)
Channel 0
1
Specifies transfer size, mode, activation source, etc.
MAR0A
Specifies transfer source address
MAR0B
Specifies transfer destination address
IOAR0A
Not used
IOAR0B
Not used
ETCR0A
Specifies number of transfers
ETCR0B
Specifies number of transfers (used in block transfer mode only)
DMACR0A DMACR0B
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Specifies transfer size, mode, activation source, etc.
Section 7 DMA Controller (DMAC)
7.3
7.3.1
Register Descriptions
Memory Address Registers (MAR)
• Short Address Mode
MAR is a 32-bit readable/writable register that specifies the transfer source address or
destination address. The upper 8 bits of MAR are reserved: they are always read as 0, and
cannot be modified. Whether MAR functions as the source address register or as the
destination address register can be selected by means of the DTDIR bit in DMACR.
MAR is incremented or decremented each time a byte or word transfer is executed, so that the
address specified by MAR is constantly updated. For details, see section 7.3.4, DMA Control
Register (DMACR). MAR is not initialized by a reset or in standby mode.
• Full Address Mode
MAR is a 32-bit readable/writable register; MARA functions as the transfer source address
register, and MARB as the destination address register.
MAR is composed of two 16-bit registers, MARH and MARL. The upper 8 bits of MARH are
reserved: they are always read as 0, and cannot be modified. MAR is incremented or
decremented each time a byte or word transfer is executed, so that the source or destination
memory address can be updated automatically. For details, see section 7.3.4, DMA Control
Register (DMACR). MAR is not initialized by a reset or in standby mode.
7.3.2
I/O Address Register (IOAR)
• Short Address Mode
IOAR is a 16-bit readable/writable register that specifies the lower 16 bits of the transfer
source address or destination address. The upper 8 bits of the transfer address are automatically
set to H'FF. Whether IOAR functions as the source address register or as the destination
address register can be selected by means of the DTDIR bit in DMACR.
IOAR is not incremented or decremented each time a transfer is executed, so that the address
specified by IOAR is fixed. IOAR is not initialized by a reset or in standby mode.
• Full Address Mode:
IOAR is not used in full address mode transfer.
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Section 7 DMA Controller (DMAC)
7.3.3
Execute Transfer Count Register (ETCR)
• Short Address Mode
ETCR is a 16-bit readable/writable register that specifies the number of transfers. The setting
of this register is different for sequential mode and idle mode on the one hand, and for repeat
mode on the other. ETCR is not initialized by a reset or in standby mode.
⎯ Sequential Mode and Idle Mode
In sequential mode and idle mode, ETCR functions as a 16-bit transfer counter (with a
count range of 1 to 65,536). ETCR is decremented by 1 each time a transfer is performed,
and when the count reaches H'0000, the DTE bit in DMABCR is cleared, and transfer ends.
⎯ Repeat Mode
In repeat mode, ETCR functions as an 8-bit transfer counter ETCRL (with a count range of
1 to 256) and transfer number storage register ETCRH. ETCRL is decremented by 1 each
time a transfer is performed, and when the count reaches H'00, ETCRL is loaded with the
value in ETCRH. At this point, MAR is automatically restored to the value it had when the
count was started. The DTE bit in DMABCR is not cleared, and so transfers can be
performed repeatedly until the DTE bit is cleared by the user.
• Full Address Mode
ETCR is a 16-bit readable/writable register that specifies the number of transfers. The function
of this register is different in normal mode and in block transfer mode. ETCR is not initialized
by a reset or in standby mode.
⎯ Normal Mode
(a) ETCRA
In normal mode, ETCRA functions as a 16-bit transfer counter. ETCRA is decremented by
1 each time a transfer is performed, and transfer ends when the count reaches H'0000.
(b) ETCRB
ETCRB is not used in normal mode.
⎯ Block Transfer Mode
(a) ETCRA
In block transfer mode, ETCRAL functions as an 8-bit block size counter and ETCRAH
holds the block size. ETCRAL is decremented each time a 1-byte or 1-word transfer is
performed, and when the count reaches H'00, ETCRAL is loaded with the value in
ETCRAH. So by setting the block size in ETCRAH and ETCRAL, it is possible to
repeatedly transfer blocks consisting of any desired number of bytes or words.
(b) ETCRB
ETCRB functions in block transfer mode, as a 16-bit block transfer counter. ETCRB is
decremented by 1 each time a block is transferred, and transfer ends when the count reaches
H'0000.
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Section 7 DMA Controller (DMAC)
7.3.4
DMA Control Register (DMACR)
DMACR controls the operation of each DMAC channel.
• Short Address Mode (common to DMACRA and DMACRB)
Bit Bit Name Initial Value R/W
Description
7
Data Transfer Size
DTSZ
0
R/W
Selects the size of data to be transferred at one time.
0: Byte-size transfer
1: Word-size transfer
6
DTID
0
R/W
Data Transfer Increment/Decrement
Selects incrementing or decrementing of MAR every data
transfer in sequential mode or repeat mode.
In idle mode, MAR is neither incremented nor decremented.
0: MAR is incremented after a data transfer
•
When DTSZ = 0, MAR is incremented by 1 after a
transfer
•
When DTSZ = 1, MAR is incremented by 2 after a
transfer
1: MAR is decremented after a data transfer
•
When DTSZ = 0, MAR is decremented by 1 after a
transfer
•
When DTSZ = 1, MAR is decremented by 2 after a
transfer
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Section 7 DMA Controller (DMAC)
Bit Bit Name Initial Value R/W
Description
5
Repeat Enable
RPE
0
R/W
Used in combination with the DTIE bit in DMABCR to select
the mode (sequential, idle, or repeat) in which transfer is to
be performed.
RPE DTIE
0
0:
Transfer in sequential mode (no transfer end
interrupt)
0
1:
Transfer in sequential mode (with transfer end
interrupt)
1
0:
Transfer in repeat mode (no transfer end
interrupt)
1
1:
Transfer in idle mode (with transfer end
interrupt)
Note: For details of operation in sequential, idle, and repeat
mode, see section 7.4.2, Sequential Mode, section
7.4.3, Idle Mode, and section 7.4.4, Repeat Mode.
4
DTDIR
0
R/W
Data Transfer Direction
Specifies the data transfer direction (source or destination).
0: Transfer with MAR as source address and IOAR as
destination address
1: Transfer with IOAR as source address and MAR as
destination address
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Section 7 DMA Controller (DMAC)
Bit Bit Name Initial Value R/W
Description
3
DTF3
0
R/W
Data Transfer Factor
2
DTF2
0
R/W
These bits select the data transfer factor (activation source).
1
DTF1
0
R/W
0000: ⎯
0
DTF0
0
R/W
0001: Activated by A/D conversion end interrupt
0010: ⎯
0011: ⎯
0100: Activated by SCI channel 0 transmission complete
interrupt
0101: Activated by SCI channel 0 reception complete
interrupt
0110: ⎯
0111: ⎯
1000: Activated by TPU channel 0 compare match/input
capture A interrupt
1001: Activated by TPU channel 1 compare match/input
capture A interrupt
1010: Activated by TPU channel 2 compare match/input
capture A interrupt
1011: ⎯
1100: ⎯
1101: ⎯
1110: ⎯
1111: ⎯
The same factor can be selected for more than one channel. In this case, activation starts with the
highest-priority channel according to the relative channel priorities. For relative channel priorities,
see section 7.4.10, DMAC Multi-Channel Operation.
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Section 7 DMA Controller (DMAC)
• Full Address Mode (DMACRA)
Bit Bit Name Initial Value R/W
Description
15 DTSZ
Data Transfer Size
0
R/W
Selects the size of data to be transferred at one time.
0: Byte-size transfer
1: Word-size transfer
14 SAID
0
R/W
Source Address Increment/Decrement
13 SAIDE
0
R/W
Source Address Increment/Decrement Enable
These bits specify whether source address register MARA is
to be incremented, decremented, or left unchanged, when
data transfer is performed.
00: MARA is fixed
01: MARA is incremented after a data transfer
•
When DTSZ = 0, MARA is incremented by 1 after a
transfer
•
When DTSZ = 1, MARA is incremented by 2 after a
transfer
10: MARA is fixed
11: MARA is decremented after a data transfer
•
When DTSZ = 0, MARA is decremented by 1 after a
transfer
•
When DTSZ = 1, MARA is decremented by 2 after a
transfer
12 BLKDIR
0
R/W
Block Direction
11 BLKE
0
R/W
Block Enable
These bits specify whether normal mode or block transfer
mode is to be used. If block transfer mode is specified, the
BLKDIR bit specifies whether the source side or the
destination side is to be the block area.
00: Transfer in normal mode
01: Transfer in block transfer mode, destination side is block
area
10: Transfer in normal mode
11: Transfer in block transfer mode, source side is block area
For operation in normal mode and block transfer mode, see
section 7.4, Operation.
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Section 7 DMA Controller (DMAC)
Bit Bit Name Initial Value R/W
Description
10 ⎯
to
8
Reserved
All 0
R/W
Although these bits are readable/writable, only 0 should be
written to.
• Full Address Mode (DMACRB)
Bit Bit Name Initial Value R/W
7
⎯
0
R/W
Description
Reserved
Although this bit is readable/writable, only 0 should be written
to.
6
DAID
0
R/W
Destination Address Increment/Decrement
5
DAIDE
0
R/W
Destination Address Increment/Decrement Enable
These bits specify whether destination address register
MARB is to be incremented, decremented, or left unchanged,
when data transfer is performed.
00: MARB is fixed
01: MARB is incremented after a data transfer
•
When DTSZ = 0, MARB is incremented by 1 after a
transfer
•
When DTSZ = 1, MARB is incremented by 2 after a
transfer
10: MARB is fixed
11: MARB is decremented after a data transfer
4
⎯
0
R/W
•
When DTSZ = 0, MARB is decremented by 1 after a
transfer
•
When DTSZ = 1, MARB is decremented by 2 after a
transfer
Reserved
Although this bit is readable/writable, only 0 should be written
to.
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Section 7 DMA Controller (DMAC)
Bit Bit Name Initial Value R/W
Description
3
2
1
0
Data Transfer Factor
These bits select the data transfer factor (activation source).
In normal mode:
0000: ⎯
0001: ⎯
0010: ⎯
0011: Activated by DREQ signal's low level input from USB
(USB request)
010×: ⎯
0110: Auto-request (cycle steal)
0111: Auto-request (burst)
1×××: ⎯
In block transfer mode:
0000: ⎯
0001: Activated by A/D conversion end interrupt
0010: ⎯
0011: ⎯
0100: Activated by SCI channel 0 transmission complete
interrupt
0101: Activated by SCI channel 0 reception complete
interrupt
0110: ⎯
0111: ⎯
1000: Activated by TPU channel 0 compare match/input
capture A interrupt
1001: Activated by TPU channel 1 compare match/input
capture A interrupt
1010: Activated by TPU channel 2 compare match/input
capture A interrupt
1011: ⎯
11××: ⎯
The same factor can be selected for more than one channel.
In this case, activation starts with the highest-priority channel
according to the relative channel priorities. For relative
channel priorities, see section 7.4.10, DMAC Multi-Channel
Operation.
Legend:
×: Don't care
DTF3
DTF2
DTF1
DTF0
0
0
0
0
R/W
R/W
R/W
R/W
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Section 7 DMA Controller (DMAC)
7.3.5
DMA Band Control Register (DMABCR)
DMABCR controls the operation of each DMAC channel.
• Short Address Mode
Bit Bit Name Initial Value R/W
Description
15 FAE1
Full Address Enable 1
0
R/W
Specifies whether channel 1 is to be used in short address
mode or full address mode.
In short address mode, channels 1A and 1B are used as
independent channels.
0: Short address mode
1: Full address mode
14 FAE0
0
R/W
Full Address Enable 0
Specifies whether channel 0 is to be used in short address
mode or full address mode.
In short address mode, channels 0A and 0B are used as
independent channels.
0: Short address mode
1: Full address mode
13, ⎯
12
⎯
R/W
Reserved
The write value should always be 0.
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Section 7 DMA Controller (DMAC)
Bit Bit Name Initial Value R/W
Description
11
10
9
8
Data Transfer Acknowledge
These bits enable or disable clearing, when DMA transfer is
performed, of the internal interrupt source selected by the
data transfer factor setting.
When DTE = 1 and DTA = 1, the internal interrupt source
selected by the data transfer factor setting is cleared
automatically by DMA transfer. When DTE = 1 and DTA = 1,
the internal interrupt source selected by the data transfer
factor setting does not issue an interrupt request to the CPU.
When DTE = 1 and DTA = 0, the internal interrupt source
selected by the data transfer factor setting is not cleared
when a transfer is performed, and can issue an interrupt
request to the CPU in parallel. In this case, the interrupt
source should be cleared by the CPU.
When DTE = 0, the internal interrupt source selected by the
data transfer factor setting issues an interrupt request to the
CPU regardless of the DTA bit setting.
0: Clearing of selected internal interrupt source at time of
DMA transfer is disabled
1: Clearing of selected internal interrupt source at time of
DMA transfer is enabled
DTA1B
DTA1A
DTA0B
DTA0A
0
0
0
0
R/W
R/W
R/W
R/W
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Section 7 DMA Controller (DMAC)
Bit Bit Name Initial Value R/W
Description
7
DTE1B
0
R/W
Data Transfer Enable
6
DTE1A
0
R/W
5
DTE0B
0
R/W
4
DTE0A
0
R/W
When DTE = 0, data transfer is disabled and the activation
source selected by the data transfer factor setting is ignored.
If the activation source is an internal interrupt, an interrupt
request is issued to the CPU. If the DTIE bit is set to 1when
DTE = 0, the DMAC regards this as indicating the end of a
transfer, and issues a transfer end interrupt request to the
CPU.
The conditions for the DTE bit being cleared to 0 are as
follows:
•
When initialization is performed
•
When the specified number of transfers have been
completed in a transfer mode other than repeat mode
•
When 0 is written to the DTE bit to forcibly abort the
transfer, or for a similar reason
When DTE = 1, data transfer is enabled and the DMAC waits
for a request by the activation source selected by the data
transfer factor setting. When a request is issued by the
activation source, DMA transfer is executed. The condition for
the DTE bit being set to 1 is as follows:
•
When 1 is written to the DTE bit after the DTE bit is read
as 0
0: Data transfer disabled
1: Data transfer enabled
3
DTIE1B
0
R/W
Data Transfer End Interrupt Enable
2
DTIE1A
0
R/W
1
DTIE0B
0
R/W
0
DTIE0A
0
R/W
These bits enable or disable an interrupt to the CPU when
transfer ends. If the DTIE bit is set to 1 when DTE = 0, the
DMAC regards this as indicating the end of a transfer, and
issues a transfer end interrupt request to the CPU.
A transfer end interrupt can be canceled either by clearing
the DTIE bit to 0 in the interrupt handling routine, or by
performing processing to continue transfer by setting the
transfer counter and address register again, and then setting
the DTE bit to 1.
0: Transfer end interrupt disabled
1: Transfer end interrupt enabled
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Section 7 DMA Controller (DMAC)
• Full Address Mode
Bit
Bit Name
Initial Value R/W
Description
15
FAE1
0
Full Address Enable 1
R/W
Specifies whether channel 1 is to be used in short
address mode or full address mode.
In full address mode, channels 1A and 1B are used
together as a single channel.
0: Short address mode
1: Full address mode
14
FAE0
0
R/W
Full Address Enable 0
Specifies whether channel 0 is to be used in short
address mode or full address mode.
In full address mode, channels 0A and 0B are used
together as a single channel.
0: Short address mode
1: Full address mode
13,12 —
All 0
R/W
Reserved
Although these bits are readable/writable, only 0 should
be written to.
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Section 7 DMA Controller (DMAC)
Bit
Bit Name
Initial Value R/W
Description
Data Transfer Acknowledge
Enables or disables clearing, when DMA transfer is
performed, of the internal interrupt source selected by the
data transfer factor setting.
When DTE = 1 and DTA = 1, the internal interrupt source
selected by the data transfer factor setting is cleared
automatically by DMA transfer. When DTE = 1 and DTA
= 1, the internal interrupt source selected by the data
transfer factor setting does not issue an interrupt request
to the CPU.
When DTE = 1 and DTA = 0, the internal interrupt source
selected by the data transfer factor setting is not cleared
when a transfer is performed, and can issue an interrupt
request to the CPU in parallel. In this case, the interrupt
source should be cleared by the CPU transfer.
When DTE = 0, the internal interrupt source selected by
the data transfer factor setting issues an interrupt request
to the CPU regardless of the DTA bit setting.
The state of the DTME bit does not affect the above
operations.
11
DTA1
0
R/W
Data transfer acknowledge 1
Enables or disables clearing, when DMA transfer is
performed, of the internal interrupt source selected by the
channel 1 data transfer factor setting.
0: Clearing of selected internal interrupt source at time of
DMA transfer is disabled
1: Clearing of selected internal interrupt source at time of
DMA transfer is enabled
10
–
0
R/W
Reserved
Although this bit is readable/writable, only 0 should be
written to.
9
DTA0
0
R/W
Data Transfer Acknowledge 0
Enables or disables clearing, when DMA transfer is
performed, of the internal interrupt source selected by the
channel 0 data transfer factor setting.
0: Clearing of selected internal interrupt source at time of
DMA transfer is disabled
1: Clearing of selected internal interrupt source at time of
DMA transfer is enabled
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Section 7 DMA Controller (DMAC)
Bit Bit Name Initial Value R/W
Description
8
Reserved
–
0
R/W
Although this bit is readable/writable, only 0 should be written
to.
Data Transfer Master Enable
Together with the DTE bit, this bit controls enabling or
disabling of data transfer on the relevant channel. When both
the DTME bit and the DTE bit are set to 1, transfer is enabled
for the channel. If the relevant channel is in the middle of a
burst mode transfer when an NMI interrupt is generated, the
DTME bit is cleared, the transfer is interrupted, and bus
mastership passes to the CPU. When the DTME bit is
subsequently set to 1 again, the interrupted transfer is
resumed. In block transfer mode, however, the DTME bit is
not cleared by an NMI interrupt, and transfer is not
interrupted.
The conditions for the DTME bit being cleared to 0 are as
follows:
•
When initialization is performed
•
When NMI is input in burst mode
•
When 0 is written to the DTME bit
The condition for DTME being set to 1 is as follows:
•
7
DTME1
0
R/W
When 1 is written to DTME after DTME is read as 0
Data Transfer Master Enable 1
Enables or disables data transfer on channel 1
0: Data transfer disabled. In burst mode, cleared to 0 by an
NMI interrupt
1: Data transfer enabled
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Section 7 DMA Controller (DMAC)
Bit Bit Name Initial Value R/W
Description
Data Transfer Enable
When DTE = 0, data transfer is disabled and the activation
source selected by the data transfer factor setting is ignored.
If the activation source is an internal interrupt, an interrupt
request is issued to the CPU. If the DTIE bit is set to 1 when
DTE = 0, the DMAC regards this as indicating the end of a
transfer, and issues a transfer end interrupt request to the
CPU.
The conditions for the DTE bit being cleared to 0 are as
follows:
•
When initialization is performed
•
When the specified number of transfers have been
completed
•
When 0 is written to the DTE bit to forcibly abort the
transfer, or for a similar reason
When DTE = 1 and DTME = 1, data transfer is enabled and
the DMAC waits for a request by the activation source
selected by the data transfer factor setting. When a request is
issued by the activation source, DMA transfer is executed.
The condition for the DTE bit being set to 1 is as follows:
•
6
DTE1
0
R/W
When 1 is written to the DTE bit after the DTE bit is read
as 0
Data Transfer Enable 1
Enables or disables data transfer on channel 1.
0: Data transfer disabled
1: Data transfer enabled
5
DTME0
0
R/W
Data Transfer Master Enable 0
Enables or disables data transfer on channel 0.
0: Data transfer disabled. In burst mode, cleared to 0 by an
NMI interrupt
1: Data transfer enabled
4
DTE0
0
R/W
Data Transfer Enable 0
Enables or disables data transfer on channel 0.
0: Data transfer disabled
1: Data transfer enabled
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Section 7 DMA Controller (DMAC)
Bit Bit Name Initial Value R/W
Description
Data Transfer Interrupt Enable B
Enables or disables an interrupt to the CPU when transfer is
interrupted. If the DTIEB bit is set to 1 when DTME = 0, the
DMAC regards this as indicating a break in the transfer, and
issues a transfer break interrupt request to the CPU. A
transfer break interrupt can be canceled either by clearing the
DTIEB bit to 0 in the interrupt handling routine, or by
performing processing to continue transfer by setting the
DTME bit to 1.
3
DTIE1B
0
R/W
Data Transfer Interrupt Enable 1B
Enables or disables the channel 1 transfer break interrupt.
0: Transfer break interrupt disabled
1: Transfer break interrupt enabled
Data Transfer End Interrupt Enable A
Enables or disables an interrupt to the CPU when transfer
ends. If the DTIEA bit is set to 1 when DTE = 0, the DMAC
regards this as indicating the end of a transfer, and issues a
transfer end interrupt request to the CPU. A transfer end
interrupt can be canceled either by clearing the DTIEA bit to 0
in the interrupt handling routine, or by performing processing
to continue transfer by setting the DTE bit to 1.
2
DTIE1A
0
R/W
Data Transfer End Interrupt Enable 1A
Enables or disables the channel 1 transfer end interrupt.
0: Transfer end interrupt disabled
1: Transfer end interrupt enabled
1
DTIE0B
0
R/W
Data Transfer Interrupt Enable 0B
Enables or disables the channel 0 transfer break interrupt.
0: Transfer break interrupt disabled
1: Transfer break interrupt enabled
0
DTIE0A
0
R/W
Data Transfer End Interrupt Enable 0A
Enables or disables the channel 0 transfer end interrupt.
0: Transfer end interrupt disabled
1: Transfer end interrupt enabled
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Section 7 DMA Controller (DMAC)
7.4
Operation
7.4.1
Transfer Modes
Table 7.2 lists the DMAC modes.
Table 7.2
DMAC Transfer Modes
Transfer Mode
Short
address
mode
Full
address
mode
Dual
address
mode
Transfer Source
(1) Sequential mode •
(2) Idle mode
(3) Repeat Mode
(4) Normal mode
(5) Block transfer
mode
Remarks
TPU channel 0 to 2
•
compare match/input
capture A interrupt
•
SCI transmission
complete interrupt
•
SCI reception
complete interrupt
•
A/D conversion end
interrupt
•
USB request
Up to 4 channels can
operate
independently
•
•
Auto-request
Max. 2-channel
operation, combining
channels A and B
•
TPU channel 0 to 2
•
compare match/input
capture A interrupt
•
SCI transmission
complete interrupt
With auto-request,
burst mode transfer
or cycle steal transfer
can be selected
•
SCI reception
complete interrupt
•
A/D conversion end
interrupt
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Section 7 DMA Controller (DMAC)
7.4.2
Sequential Mode
Sequential mode can be specified by clearing the RPE bit in DMACR to 0. In sequential mode,
MAR is updated after each byte or word transfer in response to a single transfer request, and this is
executed the number of times specified in ETCR. One address is specified by MAR, and the other
by IOAR. The transfer direction can be specified by the DTDIR bit in DMACR. Table 7.3
summarizes register functions in sequential mode.
Table 7.3
Register Functions in Sequential Mode
Function
Register
23
DTDIR = 0
DTDIR = 1
Initial Setting
Operation
0
Source
address
register
Destination
address
register
Start address of
transfer destination
or transfer source
Incremented/
decremented every
transfer
0
Destination
address
register
Source
address
register
Start address of
transfer source or
transfer destination
Fixed
MAR
23
15
H'FF
IOAR
15
0
Transfer counter
ETCR
Number of transfers Decremented every
transfer, transfer
ends when count
reaches H'0000
MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is
incremented or decremented by 1 or 2 each time a byte or word is transferred. IOAR specifies the
lower 16 bits of the other address. The 8 bits above IOAR have a value of H'FF. Figure 7.2
illustrates operation in sequential mode.
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Section 7 DMA Controller (DMAC)
Address T
Transfer
IOAR
1 byte or word transfer performed in
response to 1 transfer request
Address B
Notes:
Address T = L
Address B = L + (–1)DTID · (2DTSZ · (N–1))
Where: L = Value set in MAR
N = Value set in ETCR
Figure 7.2 Operation in Sequential Mode
The number of transfers is specified as 16 bits in ETCR. ETCR is decremented by 1 each time a
transfer is executed, and when its value reaches H'0000, the DTE bit is cleared and transfer ends. If
the DTIE bit is set to 1 at this time, an interrupt request is sent to the CPU. The maximum number
of transfers, when H'0000 is set in ETCR, is 65,536. Transfer requests (activation sources) consist
of A/D conversion end interrupt, SCI transmission complete and reception complete interrupts, and
TPU channel 0 to 2 compare match/input capture A interrupts. Figure 7.3 shows an example of the
setting procedure for sequential mode.
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Section 7 DMA Controller (DMAC)
Sequential mode
setting
Set DMABCRH
[1]
Set transfer source
and transfer destination
addresses
[2]
Set number of transfers
[3]
Set DMACR
[4]
Read DMABCRL
[5]
Set DMABCRL
[6]
[1] Set each bit in DMABCRH.
· Clear the FAE bit to 0 to select short address mode.
· Specify enabling or disabling of internal interrupt
clearing with the DTA bit.
[2] Set the transfer source address and transfer
destination address in MAR and IOAR.
[3] Set the number of transfers in ETCR.
[4] Set each bit in DMACR.
· Set the transfer data size with the DTSZ bit.
· Specify whether MAR is to be incremented or
decremented with the DTID bit.
· Clear the RPE bit to 0 to select sequential mode.
· Specify the transfer direction with the DTDIR bit.
· Select the activation source with bits DTF3 to DTF0.
[5] Read the DTE bit in DMABCRL as 0.
[6] Set each bit in DMABCRL.
· Specify enabling or disabling of transfer
andinterrupts with the DTIE bit.
· Set the DTE bit to 1 to enable transfer.
Sequential mode
Figure 7.3 Example of Sequential Mode Setting Procedure
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Section 7 DMA Controller (DMAC)
7.4.3
Idle Mode
Idle mode can be specified by setting the RPE bit and DTIE bit in DMACR to 1. In idle mode, one
byte or word is transferred in response to a single transfer request, and this is executed the number
of times specified in ETCR. One address is specified by MAR, and the other by IOAR. The
transfer direction can be specified by the DTDIR bit in DMACR. Table 7.4 summarizes register
functions in idle mode.
Table 7.4
Register Functions in Idle Mode
Function
Register
23
DTDIR = 0
DTDIR = 1
Initial Setting
Operation
0
Source
address
register
Destination
address
register
Start address of
transfer destination
or transfer source
Fixed
0
Destination
address
register
Source
address
register
Start address of
transfer source or
transfer destination
Fixed
MAR
23
15
H'FF
IOAR
15
0
Transfer counter
Number of transfers Decremented every
transfer, transfer
ends when count
reaches H'0000
ETCR
MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is
neither incremented nor decremented each time a byte or word is transferred. IOAR specifies the
lower 16 bits of the other address. The 8 bits above IOAR have a value of H'FF. Figure 7.4
illustrates operation in idle mode.
MAR
Transfer
IOAR
1 byte or word transfer performed in
response to 1 transfer request
Figure 7.4 Operation in Idle Mode
The number of transfers is specified as 16 bits in ETCR. ETCR is decremented by 1 each time a
transfer is executed, and when its value reaches H'0000, the DTE bit is cleared and transfer ends. If
the DTIE bit is set to 1 at this time, an interrupt request is sent to the CPU. The maximum number
of transfers, when H'0000 is set in ETCR, is 65,536.
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Section 7 DMA Controller (DMAC)
Transfer requests (activation sources) consist of A/D conversion end interrupt, SCI transmission
complete and reception complete interrupts, and TPU channel 0 to 2 compare match/input capture
A interrupts. Figure 7.5 shows an example of the setting procedure for idle mode.
Idle mode setting
Set DMABCRH
[1]
Set transfer source
and transfer destination
addresses
[2]
Set number of transfers
[3]
Set DMACR
[4]
Read DMABCRL
[5]
Set DMABCRL
[6]
[1] Set ech bit in DMABCRH.
· Clear the FAE bit to 0 to select short address
mode.
· Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address and transfer
destinatiln address in MAR and IOAR.
[3] Set the number of transfers in ETCR.
[4] Set each bit in DMACR.
· Set the transfer data size with the DTSZ bit.
· Specify whether MAR is to be incremented or
decremented with the DTID bit.
· Set the RPE bit to 1.
· Specify the transfer direction with the DTDIR
bit.
· Select the activation source with bits DTF3 to
DTF0.
[5] Read the DTE bit in DMABCRL as 0.
[6] Set each bit in DMABCRL.
· Set the DTIE bit to 1.
· Set the DTE bit to 1 to enable transfer.
Idle mode
Figure 7.5 Example of Idle Mode Setting Procedure
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Section 7 DMA Controller (DMAC)
7.4.4
Repeat Mode
Repeat mode can be specified by setting the RPE bit in DMACR to 1, and clearing the DTIE bit to
0. In repeat mode, MAR is updated after each byte or word transfer in response to a single transfer
request, and this is executed the number of times specified in ETCR. On completion of the
specified number of transfers, MAR and ETCRL are automatically restored to their original
settings and operation continues. One address is specified by MAR, and the other by IOAR. The
transfer direction can be specified by the DTDIR bit in DMACR. Table 7.5 summarizes register
functions in repeat mode.
Table 7.5
Register Functions in Repeat Mode
Function
Register
23
DTDIR = 0
DTDIR = 1
Initial Setting
Operation
0
Source
address
register
Destination
address
register
Start address of
transfer destination
or transfer source
Incremented/decrem
ented every transfer.
Initial setting is
restored when value
reaches H'0000
0
Destination
address
register
Source
address
register
Start address of
transfer source or
transfer destination
Fixed
MAR
23
15
H'FF
IOAR
Holds number of transfers
Number of transfers Fixed
Transfer counter
Number of transfers Decremented every
transfer. Loaded
with ETCRH value
when count reaches
H'00
0
7
ETCRH
0
7
ETCRL
MAR specifies the start address of the transfer source or transfer destination as 24 bits. MAR is
incremented or decremented by 1 or 2 each time a byte or word is transferred. IOAR specifies the
lower 16 bits of the other address. The 8 bits above IOAR have a value of H'FF. The number of
transfers is specified as 8 bits by ETCRH and ETCRL. The maximum number of transfers, when
H'00 is set in both ETCRH and ETCRL, is 256.
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Section 7 DMA Controller (DMAC)
In repeat mode, ETCRL functions as the transfer counter, and ETCRH is used to hold the number
of transfers. ETCRL is decremented by 1 each time a transfer is executed, and when its value
reaches H'00, it is loaded with the value in ETCRH. At the same time, the value set in MAR is
restored in accordance with the values of the DTSZ and DTID bits in DMACR. The MAR
restoration operation is as shown below.
DTID
MAR = MAR – (–1)
·2
DTSZ
· ETCRH
The same value should be set in ETCRH and ETCRL.
In repeat mode, operation continues until the DTE bit is cleared. To end the transfer operation,
therefore, you should clear the DTE bit to 0. A transfer end interrupt request is not sent to the
CPU. By setting the DTE bit to 1 again after it has been cleared, the operation can be restarted
from the transfer after that terminated when the DTE bit was cleared. Figure 7.6 illustrates
operation in repeat mode.
Transfer
Address T
1 byte or word transfer performed in
rewponse to 1 transfer request
Notes:
Address T = L
Address B = L + (–1)DTID · (2DTSZ · (N–1))
Where: L = Value set in MAR
N = Value set in ETCR
Address B
Figure 7.6 Operation in Repeat mode
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IOAR
Section 7 DMA Controller (DMAC)
Transfer requests (activation sources) consist of A/D conversion end interrupt, SCI transmission
complete and reception complete interrupts, and TPU channel 0 to 2 compare match/input capture
A interrupts. Figure 7.7 shows an example of the setting procedure for repeat mode.
Repeat mode
setting
Read DMABCRH
[1]
Set transfer source
and transfer destination [2]
addresses
Set number of transfers [3]
Set DMACR
[4]
Read DMABCRL
[5]
Set DMABCRL
[6]
[1] Set each bit in DMABCRH.
· Clear the FAE bit to 0 to select short address
mode.
· Specify enabling or disabling of internal interrupt
clearing with the DTA bit.
[2] Set the transfer source address and transfer
destination address in MAR and IOAR.
[3] Set the number of transfers in ETCR.
[4] Set each bit in DMACR.
· Set the transfer data size with the DTSZ bit.
· Specify whether MAR is to be incremented or
decremented with the DTID bit.
· Set the RPE bit to 1.
· Specify the transfer direction with the DTDIR bit.
· Select the activation source with bits DTF3 to
DTF0.
[5] Read the DTE bit in DMABCRL as 0.
[6] Set each bit in DMABCRL.
· Clear the DTIE bit to 1.
· Set the DTE bit to 1 to enable transfer.
Repeat mode
Figure 7.7 Example of Repeat Mode Setting Procedure
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Section 7 DMA Controller (DMAC)
7.4.5
Normal Mode
In normal mode, transfer is performed with channels A and B used in combination. Normal mode
can be specified by setting the FAE bit in DMABCR to 1 and clearing the BLKE bit in DMACRA
to 0. In normal mode, MAR is updated after each byte or word transfer in response to a single
transfer request, and this is executed the number of times specified in ETCRA. The transfer source
is specified by MARA, and the transfer destination by MARB. Table 7.6 summarizes register
functions in normal mode.
Table 7.6
Register Functions in Normal Mode
Register
Function
Initial Setting
Operation
0
Source address
register
Start address of
transfer source
Incremented/decremented
every transfer, or fixed
0
Destination address Start address of
register
transfer destination
23
MARA
23
MARB
15
0
Transfer counter
ETCRA
Incremented/decremented
every transfer, or fixed
Number of transfers Decremented every
transfer; transfer ends
when count reaches
H'0000
MARA and MARB specify the start addresses of the transfer source and transfer destination,
respectively, as 24 bits. MAR can be incremented or decremented by 1 or 2 each time a byte or
word is transferred, or can be fixed. Incrementing, decrementing, or holding a fixed value can be
set separately for MARA and MARB.
The number of transfers is specified by ETCRA as 16 bits. ETCRA is decremented each time a
transfer is performed, and when its value reaches H'0000 the DTE bit is cleared and transfer ends.
If the DTIE bit is set to 1 at this time, an interrupt request is sent to the CPU. The maximum
number of transfers, when H'0000 is set in ETCRA, is 65,536.
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Section 7 DMA Controller (DMAC)
Figure 7.8 illustrates operation in normal mode.
Address TA
Transfer
Address TB
Address BB
Address BA
Notes:
Address TA = LA
Address TB = LB
Address BA = LA + SAIDE · (–1)SAID · (2DTSZ · (N–1))
Address BB = LB + DAIDE · (–1)DAID · (2DTSZ · (N–1))
LA = Value set in MARA
LB = Value set in MARB
N = Value set in ETCRA
Figure 7.8 Operation in Normal Mode
Transfer requests (activation sources) are external requests and auto-requests. With auto-request,
the DMAC is only activated by register setting, and the specified number of transfers are
performed automatically. With auto-request, cycle steal mode or burst mode can be selected. In
cycle steal mode, the bus is released to another bus master each time a transfer is performed. In
burst mode, the bus is held continuously until transfer ends. For setting details, see section 7.3.4,
DMA Controller Register (DMACR).
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Section 7 DMA Controller (DMAC)
Figure 7.9 shows an example of the setting procedure for normal mode.
Normal mode
setting
Set DMABCRH
[1]
Set transfer source
and transfer destination [2]
addresses
Set number of transfers [3]
Set DMACR
[4]
Read DMABCRL
[5]
Set DMABCRL
[6]
Normal mode
[1] Set each bit in DMABCRH.
· Set the FAE bit to 1 to select full address
mode.
· Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address in MARA, and
the transfer destination address in MARB.
[3] Set the number of transfers in ETCRA.
[4] Set each bit in DMACRA and DMACRB.
· Set the transfer data size with the DTSZ bit.
· Specify whether MARA is to be
incremented, decremented, or fixed, with
the SAID and SAIDE bits.
· Clear the BLKE bit to 0 to select normal
mode.
· Specify whether MARB is to be
incremented, decremented, or fixed, with
the DAID and DAIDE bits.
· Select the activation source with bits DTF3
to DTF0.
[5] Read the DTE = 0 and DTME = 0 in
DMABCRL.
[6] Set each bit in DMABCRL.
· Specify enabling or desabling of transfer
end interrupts with the DTIE bit.
· Set both the DTME bit and the DTE bit to 1
to enable transfer.
Figure 7.9 Example of Normal Mode Setting Procedure
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Section 7 DMA Controller (DMAC)
7.4.6
Block Transfer Mode
In block transfer mode, transfer is performed with channels A and B used in combination. Block
transfer mode can be specified by setting the FAE bit in DMABCR and the BLKE bit in
DMACRA to 1. In block transfer mode, a transfer of the specified block size is carried out in
response to a single transfer request, and this is executed the specified number of times. The
transfer source is specified by MARA, and the transfer destination by MARB. Either the transfer
source or the transfer destination can be selected as a block area (an area composed of a number of
bytes or words). Table 7.7 summarizes register functions in block transfer mode.
Table 7.7
Register Functions in Block Transfer Mode
Register
23
Function
Initial Setting
Operation
0
Source address
register
Start address of
transfer source
Incremented/decremented
every transfer, or fixed
0
Description address Start address of
register
transfer destination
Incremented/decremented
every transfer, or fixed
Holds block size
Block size
Fixed
Block size counter
Block size
decremented every
transfer; ETCRH value
copied when count reaches
H'00
Block transfer
counter
Number of block
transfers
Decremented every block
transfer; transfer ends
when count reaches
H'0000
MARA
23
MARB
0
7
ETCRAH
0
7
ETCRAL
15
0
ETCRB
MARA and MARB specify the start addresses of the transfer source and transfer destination,
respectively, as 24 bits. MAR can be incremented or decremented by 1 or 2 each time a byte or
word is transferred, or can be fixed. Incrementing, decrementing, or holding a fixed value can be
set separately for MARA and MARB. Whether a block is to be designated for MARA or for
MARB is specified by the BLKDIR bit in DMACRA.
To specify the number of transfers, if M is the size of one block (where M = 1 to 256) and N
transfers are to be performed (where N = 1 to 65,536), M is set in both ETCRAH and ETCRAL,
and N in ETCRB.
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Section 7 DMA Controller (DMAC)
Figure 7.10 illustrates operation in block transfer mode when MARB is designated as a block area.
Address TB
Address TA
1st block
2nd block
Transfer
Consecutive transfer
of M bytes or words
is performed in
response to one
request
Block area
Address BB
Nth block
Address BA
Notes:
Address TA = LA
Address TB = LB
Address BA = LA + SAIDE · (–1)SAID · (2DTSZ · (M · N–1))
Address BB = LB + DAIDE · (–1)DAID · (2DTSZ · (N–1))
LA = Value set in MARA
LB = Value set in MARB
N = Value set in ETCRA
M = Value set in ETCRAH and ETCRAL
Figure 7.10 Operation in Block Transfer Mode (BLKDIR = 0)
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Section 7 DMA Controller (DMAC)
Figure 7.11 illustrates operation in block transfer mode when MARA is designated as a block area.
Address TA
Address TB
Block area
Address BA
1st block
Transfer
Consecutive transfer
of M bytes or words
is performed in
response to one
request
2nd block
Nth block
Address BB
Notes:
Address TA = LA
Address TB = LB
Address BA = LA + SAIDE · (–1)SAID · (2DTSZ · (N–1))
Address BB = LB + DAIDE · (–1)DAID · (2DTSZ · (M · N–1))
LA = Value set in MARA
LB = Value set in MARB
N = Value set in ETCRB
M = Value set in ETCRAH and ETCRAL
Figure 7.11 Operation in Block Transfer Mode (BLKDIR = 1)
ETCRAL is decremented by 1 each time a byte or word transfer is performed. In response to a
single transfer request, burst transfer is performed until the value in ETCRAL reaches H'00.
ETCRAL is then loaded with the value in ETCRAH. At this time, the value in the MAR register
for which a block designation has been given by the BLKDIR bit in DMACRA is restored in
accordance with the DTSZ, SAID/DAID, and SAIDE/DAIDE bits in DMACR.
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Section 7 DMA Controller (DMAC)
ETCRB is decremented by 1 every block transfer, and when the count reaches H'0000 the DTE bit
is cleared and transfer ends. If the DTIE bit is set to 1 at this point, an interrupt request is sent to
the CPU. Figure 7.12 shows the operation flow in block transfer mode.
Start
(DTE = DTME = 1)
Transfer request?
No
Yes
Acquire bus
Read address specified by MARA
MARA = MARA + SAIDE · (–1)SAID · 2DTSZ
Write to address specified by MARB
MARB = MARB + DAIDE · (–1)DAID · 2DTSZ
ETCRAL = ETCRAL–1
ETCRAL = H'00
No
Yes
Release bus
ETCRAL = ETCRAH
BLKDIR = 0
No
Yes
MARB = MARB – DAIDE · (–1)DAID · 2DTSZ · ETCRAH
MARA = MARA – SAIDE · (–1)SAID · 2DTSZ · ETCRAH
ETCRB = ETCRB – 1
No
ETCRB = H'0000
Yes
Clear DTE bit to 0
to end transfer
Figure 7.12 Operation Flow in Block Transfer Mode
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Section 7 DMA Controller (DMAC)
Transfer requests (activation sources) consist of A/D conversion end interrupt, SCI transmission
complete and reception complete interrupts, and TPU channel 0 to 2 compare match/input capture
A interrupts. For details, see section 7.3.4, DMA Control Register (DMACR). Figure 7.13 shows
an example of the setting procedure for block transfer mode.
Block transfer
mode setting
Set DMABCRH
[1]
Set transfer source
and transfer destination [2]
addresses
Set number of transfers [3]
Set DMACR
[4]
Read DMABCRL
[5]
Set DMABCRL
[6]
Block transfer mode
[1] Set each bit in DMABCRH.
· Set the FAE bit to 1 to select full address
mode.
· Specify enabling or disabling of internal
interrupt clearing with the DTA bit.
[2] Set the transfer source address in MARA, and
the transfer destination address in MARB.
[3] Set the transfer source address in ETCRAH
and ETCRAL. Set the number of transfers in
ETCRB.
[4] Set each bit in DMACRA and DMACRB.
· Set the transfer data size with the DTSZ bit.
· Specify whether MARA is to be incremented,
decremented, or fixed, with the SAID and
SAIDE bits.
· Set the BLKE bit to 1 to select block transfer
mode.
· Specify whether the transfer source or the
transfer destination is a block area with the
BLKDIR bit.
· Specify whether MARB is to be incremented,
decremented, or fixed, with the DAID and
DAIDE bits.
· Select the activation source with bits DTF3
to DTF0.
[5] Read the DTE = 0 and DTME = 0 in
DMABCRL.
[6] Set each bit in DMABCRL.
· Specify enabling or desabling of transfer end
interrupts to the CPU with the DTIE bit.
· Set both the DTME bit and the DTE bit to 1
to enable transfer.
Figure 7.13 Example of Block Transfer Mode Setting Procedure
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Section 7 DMA Controller (DMAC)
7.4.7
DMAC Activation Sources
DMAC activation sources consist of internal interrupts, external requests, and auto-requests. The
activation sources that can be specified depend on the transfer mode, as shown in table 7.8.
Table 7.8
DMAC Activation Sources
Full Address Mode
Activation
Source
Short Address
Mode
Normal Mode
Internal
ADI
×
Interrupt
TXI0
×
RXI0
×
TGI0A
×
TGI1A
×
TGI2A
×
Block Transfer
Mode
USB request Low level input of the DREQ
signal
×
×
Auto-request
×
×
Legend:
: Can be specified
×: Cannot be specified
Activation by Internal Interrupt: An interrupt request selected as a DMAC activation source can
be sent simultaneously to the CPU. For details, see section 5, Interrupt Controller.
With activation by an internal interrupt, the DMAC accepts the request independently of the
interrupt controller. Consequently, interrupt controller priority settings are not accepted.
If the DMAC is activated by an interrupt request that is not used as a CPU interrupt source (DTA =
1), the interrupt source flag is cleared automatically by the DMA transfer. With ADI, TXI, and
RXI interrupts, however, the interrupt source flag is not cleared unless the prescribed register is
accessed in a DMA transfer. If the same interrupt is used as an activation source for more than one
channel, the interrupt request flag is cleared when the highest-priority channel is activated first.
Transfer requests for other channels are held pending in the DMAC, and activation is carried out in
order of priority.
When DTE = 0, such as after completion of a transfer, a request from the selected activation
source is not sent to the DMAC, regardless of the DTA bit. In this case, the relevant interrupt
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Section 7 DMA Controller (DMAC)
request is sent to the CPU. In case of overlap with a CPU interrupt source (DTA = 0), the interrupt
request flag is not cleared by the DMAC.
Activation by USB Request: The USB request (DREQ signal) is specified as a DMAC activation
source. The USB request is generated by the level sense. In full-address normal mode, the USB
request is carried out as follows.
While the DREQ signal is kept high, the DMAC waits for the transfer request. While the DREQ
signal is kept low, the DMAC releases the bus each time a byte is transferred and the transfer is
performed continuously. When the DREQ signal is driven high during the transfer, the transfer is
halted and the DMAC waits for the transfer request.
Activation by Auto-Request: Auto-request activation is performed by register setting only, and
transfer continues to the end. With auto-request activation, cycle steal mode or burst mode can be
selected.
In cycle steal mode, the DMAC releases the bus to another bus master each time a byte or word is
transferred. DMA and CPU cycles usually alternate. In burst mode, the DMAC keeps possession
of the bus until the end of the transfer, and transfer is performed continuously.
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Section 7 DMA Controller (DMAC)
7.4.8
Basic DMAC Bus Cycles
An example of the basic DMAC bus cycle timing is shown in figure 7.14. In this example, wordsize transfer is performed from 16-bit, 2-state access space to 8-bit, 3-state access space. When the
bus is transferred from the CPU to the DMAC, a source address read and destination address write
are performed. The bus is not released in response to another bus request, etc., between these read
and write operations. As with CPU cycles, DMA cycles conform to the bus controller settings.
CPU cycle
DMAC cycle (1-word transfer)
T1
T2
T1
T2
T3
T1
T2
CPU cycle
T3
φ
Source
address
Destination address
Address bus
RD
HWR
LWR
Figure 7.14 Example of DMA Transfer Bus Timing
The address is not output to the external address bus in an access to on-chip memory or an internal
I/O register.
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Section 7 DMA Controller (DMAC)
7.4.9
DMAC Bus Cycles (Dual Address Mode)
Short Address Mode: Figure 7.15 shows a transfer example in which TEND* output is enabled
and byte-size short address mode transfer (sequential/idle/repeat mode) is performed from external
8-bit, 2-state access space to internal I/O space.
DMA read DMA write
DMA read DMA write
DMA
DMA read DMA write dead
φ
Address bus
RD
HWR
LWR
TEND*
Bus release
Bus release
Bus release
Last transfer cycle
Bus release
Note: * This LSI does not support TEND output.
Figure 7.15 Example of Short Address Mode Transfer
A one-byte or one-word transfer is performed for one transfer request, and after the transfer the
bus is released. While the bus is released one or more bus cycles are inserted by the CPU.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead
cycle is inserted after the DMA write cycle.
In repeat mode, when TEND* output is enabled, TEND* output goes low in the transfer cycle in
which the transfer counter reaches 0.
Note: * This LSI does not support TEND output.
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Section 7 DMA Controller (DMAC)
Full Address Mode (Cycle Steal Mode): Figure 7.16 shows a transfer example in which TEND*
output is enabled and word-size full address mode transfer (cycle steal mode) is performed from
external 16-bit, 2-state access space to external 16-bit, 2-state access space.
DMA read
DMA write
DMA read DMA write
DMA
DMA read DMA write dead
φ
Address bus
RD
HWR
LWR
TEND*
Bus release
Bus release
Bus release
Last transfer cycle
Bus release
Note: * This LSI does not support TEND output.
Figure 7.16 Example of Full Address Mode (Cycle Steal) Transfer
A one-byte or one-word transfer is performed, and after the transfer the bus is released. While the
bus is released one bus cycle is inserted by the CPU.
In the transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead
cycle is inserted after the DMA write cycle.
Note: * This LSI does not support TEND output.
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Section 7 DMA Controller (DMAC)
Full Address Mode (Burst Mode): Figure 7.17 shows a transfer example in which TEND* output
is enabled and word-size full address mode transfer (burst mode) is performed from external 16bit, 2-state access space to external 16-bit, 2-state access space.
DMA
DMA read DMA write DMA read DMA write DMA read DMA write dead
φ
Address bus
RD
HWR
LWR
TEND*
Last transfer cycle
Bus release
Bus release
Burst transfer
Note: * This LSI does not support TEND output.
Figure 7.17 Example of Full Address Mode (Burst Mode) Transfer
In burst mode, one-byte or one-word transfers are executed consecutively until transfer ends. In the
transfer end cycle (the cycle in which the transfer counter reaches 0), a one-state DMA dead cycle
is inserted after the DMA write cycle.
If a request from another higher-priority channel is generated after burst transfer starts, that
channel has to wait until the burst transfer ends.
If an NMI is generated while a channel designated for burst transfer is in the transfer enabled state,
the DTME bit is cleared and the channel is placed in the transfer disabled state. If burst transfer
has already been activated inside the DMAC, the bus is released on completion of a one-byte or
one-word transfer within the burst transfer, and burst transfer is suspended. If the last transfer
cycle of the burst transfer has already been activated inside the DMAC, execution continues to the
end of the transfer even if the DTME bit is cleared.
Note: * This LSI does not support TEND output.
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Section 7 DMA Controller (DMAC)
Full Address Mode (Block Transfer Mode): Figure 7.18 shows a transfer example in which
TEND* output is enabled and word-size full address mode transfer (block transfer mode) is
performed from internal 16-bit, 1-state access space to external 16-bit, 2-state access space.
DMA
read
DMA
write
DMA
read
DMA
write
DMA
dead
DMA
read
DMA
write
DMA
read
DMA
write
DMA
dead
φ
Address bus
RD
HWR
LWR
TEND*
Bus release
Block transfer
Bus release
Last block transfer
Bus release
Note: * This LSI does not support TEND output.
Figure 7.18 Example of Full Address Mode (Block Transfer Mode) Transfer
A one-block transfer is performed for one transfer request, and after the transfer the bus is
released. While the bus is released, one or more bus cycles are inserted by the CPU.
In the transfer end cycle of each block (the cycle in which the transfer counter reaches 0), a onestate DMA dead cycle is inserted after the DMA write cycle.
One block is transmitted without interruption. NMI generation does not affect block transfer
operation.
Note: * This LSI does not support TEND output.
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Section 7 DMA Controller (DMAC)
DREQ Signal Level Activation Timing (Normal Mode): Set the DTA bit for the channel for
which the DREQ signal is selected to 1.
Figure 7.19 shows an example of DREQ level activated normal mode transfer.
Bus release
DMA
read
DMA
write
Bus
release
Transfer
source
Transfer
destination
DMA
read
DMA
write
Transfer
source
Transfer
destination
Bus
release
φ
DREQ
Address bus
DMA control
Channel
Read Write
Idle
Request
Request clear period
Minimum of 2 cycles
[1]
[2]
[3]
Read
Idle
Request
Write
Idle
Request clear period
Minimum of 2 cycles
[4]
[5]
Acceptance resumes
[6]
[7]
Acceptance resumes
Acceptance after transfer enabling; the DREQ signal low level is sampled on the rising
edge of f, and the request is held.
[2] [5] The request is cleared at the next bus break, and activation is started in the DMAC.
[3] [6] Start of DMA cycle.
[4] [7] Acceptance is resumed after the write cycle is completed.
(As in [1], the DREQ signal low level is sampled on the rising edge of φ, and the request
is held.)
[1]
Figure 7.19 Example of DREQ Level Activated Normal Mode Transfer
DREQ signal sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle for setting the transfer enabled state as the starting point.
When the DREQ signal low level is sampled while acceptance by means of the DREQ signal is
possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the
request is cleared. Acceptance resumes after the end of the write cycle, DREQ signal low level
sampling is performed again, and this operation is repeated until the transfer ends.
Note: The DREQ signal of this chip is an internal signal of chip, so it is not output from the pin.
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Section 7 DMA Controller (DMAC)
7.4.10
DMAC Multi-Channel Operation
The DMAC channel priority order is: channel 0 > channel 1, and channel A > channel B. Table 7.9
summarizes the priority order for DMAC channels.
Table 7.9
DMAC Channel Priority Order
Short Address Mode
Full Address Mode
Priority
Channel 0A
Channel 0
High
Channel 0B
Channel 1A
Channel 1
Channel 1B
Low
If transfer requests are issued simultaneously for more than one channel, or if a transfer request for
another channel is issued during a transfer, when the bus is released the DMAC selects the highestpriority channel from among those issuing a request according to the priority order shown in table
7.9. During burst transfer, or when one block is being transferred in block transfer, the channel will
not be changed until the end of the transfer. Figure 7.20 shows a transfer example in which transfer
requests are issued simultaneously for channels 0A, 0B, and 1.
DMA read
DMA write
DMA read
DMA write
DMA read
DMA
DMA write read
φ
Address bus
RD
HWR
LWR
DMA control Idle Read
Channel 0A
Write
Idle
Read
Write
Idle
Read
Write
Read
Request clear
Channel 0B
Request
hold
Selection
Channel 1
Request
hold
Nonselection
Bus
release
Channel 0A
transfer
Request clear
Request
hold
Bus
release
Selection
Channel 0B
transfer
Request clear
Bus
release
Figure 7.20 Example of Multi-Channel Transfer
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Channel 1 transfer
Section 7 DMA Controller (DMAC)
7.4.11
Relation between the DMAC and External Bus Requests
There can be no break between a DMA cycle read and a DMA cycle write. This means that an
external bus release cycle is not generated between the external read and external write in a DMA
cycle.
In the case of successive read and write cycles, such as in burst transfer or block transfer, an
external bus released state may be inserted after a write cycle.
When DMA cycle reads or writes are accesses to on-chip memory or internal I/O registers, these
DMA cycles can be executed at the same time as refresh cycles or external bus release. However,
simultaneous operation may not be possible when a write buffer is used.
7.4.12
NMI Interrupts and DMAC
When an NMI interrupt is requested, burst mode transfer in full address mode is interrupted. An
NMI interrupt does not affect the operation of the DMAC in other modes.
In full address mode, transfer is enabled for a channel when both the DTE bit and the DTME bit
are set to 1. With burst mode setting, the DTME bit is cleared when an NMI interrupt is requested.
If the DTME bit is cleared during burst mode transfer, the DMAC discontinues transfer on
completion of the 1-byte or 1-word transfer in progress, then releases the bus, which passes to the
CPU.
The channel on which transfer was interrupted can be restarted by setting the DTME bit to 1 again.
Figure 7.21 shows the procedure for continuing transfer when it has been interrupted by an NMI
interrupt on a channel designated for burst mode transfer.
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Section 7 DMA Controller (DMAC)
Resumption of
transfer on interrupted
channel
DTE = 1
DTME = 0
[1]
Check that DTE = 1 and
DTME = 0 in DMABCRL
[2]
Write 1 to the DTME bit.
[1]
No
Yes
Set DTME bit to 1
[2]
Transfer continues
Transfer ends
Figure 7.21 Example of Procedure for Continuing Transfer on Channel Interrupted by
NMI Interrupt
7.4.13
Forced Termination of DMAC Operation
If the DTE bit for the channel currently operating is cleared to 0, the DMAC stops on completion
of the 1-byte or 1-word transfer in progress. DMAC operation resumes when the DTE bit is set to
1 again. In full address mode, the same applies to the DTME bit. Figure 7.22 shows the procedure
for forcibly terminating DMAC operation by software.
[1]
Forced termination
of DMAC
Clear DTE bit to 0
Clear the DTE bit in DMABCRL to 0.
If you want to prevent interrupt generation after
forced termination of DMAC operation, clear the
DTIE bit to 0 at the same time.
[1]
Forced termination
Figure 7.22 Example of Procedure for Forcibly Terminating DMAC Operation
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Section 7 DMA Controller (DMAC)
7.4.14
Clearing Full Address Mode
Figure 7.23 shows the procedure for releasing and initializing a channel designated for full address
mode. After full address mode has been cleared, the channel can be set to another transfer mode
using the appropriate setting procedure.
Clearing full
address mode
Stop the channel
[1]
[1] Clear both the DTE bit and the DTME bit in
DMABCRL to 0; or wait until the transfer ends
and the DTE bit is cleared to 0, then clear the
DTME bit to 0.
Also clear the corresponding DTIE bit to 0 at the
same time.
[2] Clear all bits in DMACRA and DMACRB to 0.
[3] Clear the FAE bit in DMABCRH to 0.
Initialize DMACR
[2]
Clear FAE bit to 0
[3]
Initialization;
operation halted
Figure 7.23 Example of Procedure for Clearing Full Address Mode
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Section 7 DMA Controller (DMAC)
7.5
Interrupts
The sources of interrupts generated by the DMAC are transfer end and transfer break. Table 7.10
shows the interrupt sources and their priority order.
Table 7.10 Interrupt Source Priority Order
Interrupt
Name
Interrupt Source
Interrupt
Priority Order
Short Address Mode
Full Address Mode
DEND0A
Interrupt due to end of transfer
on channel 0A
Interrupt due to end of transfer
on channel 0
DEND0B
Interrupt due to end of transfer
on channel 0B
Interrupt due to break in transfer
on channel 0
DEND1A
Interrupt due to end of transfer
on channel 1A
Interrupt due to end of transfer
on channel 1
DEND1B
Interrupt due to end of transfer
on channel 1B
Interrupt due to break in transfer
on channel 1
Low
High
Enabling or disabling of each interrupt source is set by means of the DTIE bit for the
corresponding channel in DMABCR, and interrupts from each source are sent to the interrupt
controller independently. The relative priority of transfer end interrupts on each channel is decided
by the interrupt controller, as shown in table 7.10.
Figure 7.24 shows a block diagram of a transfer end/transfer break interrupt. An interrupt is always
generated when the DTIE bit is set to 1 while DTE bit is cleared to 0.
DTE/
DTME
Transfer end/transfer
break interrupt
DTIE
Figure 7.24 Block Diagram of Transfer End/Transfer Break Interrupt
In full address mode, a transfer break interrupt is generated when the DTME bit is cleared to 0
while DTIEB bit is set to 1. In both short address mode and full address mode, DMABCR should
be set so as to prevent the occurrence of a combination that constitutes a condition for interrupt
generation during setting.
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Section 7 DMA Controller (DMAC)
7.6
Usage Notes
7.6.1
DMAC Register Access during Operation
Except for forced termination, the operating (including transfer waiting state) channel setting
should not be changed. The operating channel setting should only be changed when transfer is
disabled. Also, the DMAC register should not be written to in a DMA transfer.
DMAC register reads during operation (including the transfer waiting state) are described below.
1. DMAC control starts one cycle before the bus cycle, with output of the internal address.
Consequently, MAR is updated in the bus cycle before DMAC transfer.
Figure 7.25 shows an example of the update timing for DMAC registers in dual address
transfer mode.
DMA last transfer cycle
DMA transfer cycle
DMA read
DMA read
DMA write
DMA write
DMA
dead
φ
DMA Internal
address
Idle
DMA control
DMA register
operation
[1]
[1]
[2]
[2']
[3]
Transfer
source
Transfer
destination
Read
Write
[2]
Transfer
destination
Transfer
source
Read
Idle
[1]
Write
[2']
Dead
Idle
[3]
Transfer source address register MAR operation (incremented/decremented/fixed)
Transfer counter ETCR operation (decremented)
Block size counter ETCR operation (decremented in block transfer mode)
Transfer destination address register MAR operation (incremented/decremented/fixed)
Transfer destination address register MAR operation (incremented/decremented/fixed)
Block transfer counter ETCR operation (decremented, in last transfer cycle of
a block in block transfer mode)
Transfer address register MAR restore operation (in block or repeat transfer mode)
Transfer counter ETCR restore (in repeat transfer mode)
Block size counter ETCR restore (in block transfer mode)
Note:
The MAR operation is post-incrementing/decrementing of the DMA internal address value.
Figure 7.25 DMAC Register Update Timing
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Section 7 DMA Controller (DMAC)
2. If a DMAC transfer cycle occurs immediately after a DMAC register read cycle, the DMAC
register is read as shown in figure 7.26.
DMA transfer cycle
CPU longword read
MAR upper
word read
MAR lower
word read
DMA read
DMA write
φ
DMA internal
address
DMA control
Idle
DMA register
operation
Note:
Transfer
source
Transfer
destination
Read
Write
[1]
Idle
[2]
The lower word of MAR is the updated value after the operation in [1].
Figure 7.26 Contention between DMAC Register Update and CPU Read
7.6.2
Module Stop
When the MSTPA7 bit in MSTPCR is set to 1, the DMAC clock stops, and the module stop state
is entered. However, 1 cannot be written to the MSTPA7 bit if any of the DMAC channels is
enabled. This setting should therefore be made when DMAC operation is stopped.
When the DMAC clock stops, DMAC register accesses can no longer be made. Since the
following DMAC register settings are valid even in the module stop state, they should be
invalidated, if necessary, before a module stop.
•
Transfer end/suspend interrupt (DTE = 0 and DTIE = 1)
For details, refer to section 20, Power-Down Modes.
7.6.3
Medium-Speed Mode
When the DTA bit is 0, internal interrupt signals specified as DMAC transfer sources are edgedetected. In medium-speed mode, the DMAC operates on a medium-speed clock, while on-chip
peripheral modules operate on a high-speed clock.
Consequently, if the period in which the relevant interrupt source is cleared by the CPU or another
DMAC channel, and the next interrupt is generated, is less than one state with respect to the
DMAC clock (bus master clock), edge detection may not be possible and the interrupt may be
ignored.
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Section 7 DMA Controller (DMAC)
7.6.4
Activation Source Acceptance
At the start of activation source acceptance, a low level is detected in both DREQ signal falling
edge sensing and low level sensing. Similarly, in the case of an internal interrupt, the interrupt
request is detected. Therefore, a request is accepted from an internal interrupt or DREQ pin low
level that occurs before execution of the DMABCRL write to enable transfer.
When the DMAC is activated, take any necessary steps to prevent an internal interrupt or DREQ
signal low level remaining from the end of the previous transfer, etc.
7.6.5
Internal Interrupt after End of Transfer
When the DTE bit is cleared to 0 by the end of transfer or an abort, the selected internal interrupt
request will be sent to the CPU even if DTA is set to 1.
Also, if internal DMAC activation has already been initiated when operation is aborted, the
transfer is executed but flag clearing is not performed for the selected internal interrupt even if
DTA is set to 1.
An internal interrupt request following the end of transfer or an abort should be handled by the
CPU as necessary.
7.6.6
Channel Re-Setting
To reactivate a number of channels when multiple channels are enabled, use exclusive handling of
transfer end interrupts, and perform DMABCR control bit operations exclusively. Note, in
particular, that in cases where multiple interrupts are generated between reading and writing of
DMABCR, and a DMABCR operation is performed during new interrupt handling, the DMABCR
write data in the original interrupt handling routine will be incorrect, and the write may invalidate
the results of the operations by the multiple interrupts. Ensure that overlapping DMABCR
operations are not performed by multiple interrupts, and that there is no separation between read
and write operations by the use of a bit-manipulation instruction. Also, when the DTE and DTME
bits are cleared by the DMAC or are written with 0, they must first be read while cleared to 0
before the CPU can write a 1 to them.
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Section 7 DMA Controller (DMAC)
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Section 8 I/O Ports
Section 8 I/O Ports
Table 8.1 and table 8.2 summarize the port functions of the H8S/2218 Group and H8S/2212 Group
respectively. The pins of each port also have other functions such as input/output or external
interrupt input pins of on-chip peripheral modules. Each I/O port includes a data direction register
(DDR) that controls input/output, a data register (DR) that stores output data, and a port register
(PORT) used to read the pin states. The input-only ports do not have DR and DDR.
Ports A to E have an on-chip input pull-up MOS and a input pull-up MOS control register (PCR)
to control the on/off state of the input pull-up MOS. Ports 3 and A include an open-drain control
register (ODR) that controls the on/off state of the output buffer PMOS.
All the I/O ports can drive a single TTL load and 30-pF capacitive load.
Table 8.1
Port Functions of H8S/2218 Group
Port
Description
Modes 4 and 5
Port 1
General I/O port
also functioning
as TPU I/O pins,
interrupt input
pins, and address
bus output pins
P17/TIOCB2/TCLKD
Port 3
Port 4
Port 7
General I/O port
also functioning
as SCI_0 I/O pins
and interrupt
input pins
Mode 6
Mode 7
Input/Output
Type
Schmitt trigger
input
P16/TIOCA2/IRQ1
(IRQ1, IRQ0)
P15/TIOCB1/TCLKC
P14/TIOCA1/IRQ0
P13/TIOCD0/TCLKB/A23
P13/TIOCD0/TCLKB
P12/TIOCC0/TCLKA/A22
P12/TIOCC0/TCLKA
P11/TIOCB0/A21
P11/TIOCB0
P10/TIOCA0/A20
P10/TIOCA0
P36
Open-drain
output
P32/SCK0/IRQ4
Schmitt trigger
input (IRQ4)
P31/RxD0
P30/TxD0
General input
port also
functioning as
A/D converter
analog input pins
P43/AN3
General I/O port
also functioning
as bus control
output pins and
manual reset
input pins
P74/MRES
P74/MRES
P71/CS5
P71
P70/CS4
P70
P42/AN2
P41/AN1
P40/AN0
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Section 8 I/O Ports
Port
Description
Port 9
General input
P97/AN15
port also
P96/AN14
functioning as
A/D converter
analog input pins
Port A
General I/O port
also functioning
as SCI_2 I/O pins
and address bus
output pins
PA3/A19/SCK2
PA3/SCK2
PA2/A18/RxD2
PA2/RxD2
PA1/A17/TxD2
PA1/TxD2
PA0/A16
PA0
General I/O port
also functioning
as address bus
output pins
PB7/A15
PB7
PB6/A14
PB6
PB5/A13
PB5
PB4/A12
PB4
PB3/A11
PB3
PB2/A10
PB2
PB1/A9
PB1
PB0/A8
PB0
Port B
Port C
Port D
General I/O port
also functioning
as address bus
output pins
General I/O port
also functioning
as data bus I/O
pins
Modes 4 and 5
Mode 6
Mode 7
A7
When DDR = 0: PC7
When DDR = 1: A7
PC7
A6
When DDR = 0: PC6
When DDR = 1: A6
PC6
A5
When DDR = 0: PC5
When DDR = 1: A5
PC5
A4
When DDR = 0: PC4
When DDR = 1: A4
PC4
A3
When DDR = 0: PC73
When DDR = 1: A3
PC3
A2
When DDR = 0: PC2
When DDR = 1: A2
PC2
A1
When DDR = 0: PC1
When DDR = 1: A1
PC1
A0
When DDR = 0: PC0
When DDR = 1: A0
PC0
D15
PD7
D14
PD6
D13
PD5
D12
PD4
D11
PD3
D10
PD2
D9
PD1
D8
PD0
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Input/Output
Type
On-chip input
pull-up MOS
Open-drain
output
On-chip input
pull-up MOS
On-chip input
pull-up MOS
On-chip input
pull-up MOS
Section 8 I/O Ports
Port
Description
Modes 4 and 5
Port E
8-bit bus mode: PE7
General I/O port
also functioning as 16-bit bus mode: D7
data bus I/O pins
8-bit bus mode: PE6
Mode 6
Mode 7
PE7
Input/Output
Type
On-chip input
pull-up MOS
PE6
16-bit bus mode: D6
8-bit bus mode: PE5
PE5
16-bit bus mode: D5
8-bit bus mode: PE4
PE4
16-bit bus mode: D4
8-bit bus mode: PE3
PE3
16-bit bus mode: D3
8-bit bus mode: PE2
PE2
16-bit bus mode: D2
8-bit bus mode: PE1
PE1
16-bit bus mode: D1
8-bit bus mode: PE0
PE0
16-bit bus mode: D0
Port F
General I/O port
also functioning as
bus control signal
I/O pins and
interrupt input pins
When DDR = 0: PF7
When DDR = 1 (after
reset): φ
AS
When DDR = 0
(after reset): PF7
Schmitt trigger
input
When DDR = 1: φ
(IRQ3, IRQ2)
PF6
RD
PF5
HWR
PF4
8-bit bus mode:
PF3/ADTRG/IRQ3
PF3/ADTRG/IRQ3
16-bit bus mode: LWR
When WAITE = 0
(after reset): PF2
PF2
When WAITE = 1:
WAIT
When BRLE = 0
(after reset): PF1
PF1
When BRLE = 1:
BACK
When BRLE = 0
(after reset): PF0/IRQ2
PF0/IRQ2
When BRLE = 1:
BREQ/IRQ2
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Section 8 I/O Ports
Port
Description
Modes 4 and 5
Mode 6
Port G
General I/O port
also functioning
as bus control
output pins and
interrupt Input
pins
When DDR = 0 (after reset in mode 6):
PG4
Mode 7
PG4
When DDR = 1 (after reset in modes 4, 5):
CS0
When DDR = 0: PG3
Input/Output
Type
Schmitt trigger
input
(IRQ7)
PG3
When DDR = 1: CS1
When DDR = 0: PG2
PG2
When DDR = 1: CS2
When DDR = 0: PG1/IRQ7
PG1/IRQ7
When DDR = 1: CS3/IRQ7
Table 8.2
Port Functions of H8S/2212 Group
Port
Description
Mode 7
Port 1
General I/O port
also functioning
as TPU I/O pins
and interrupt
input pins
P17/TIOCB2/TCLKD
P16/TIOCA2/IRQ1
P15/TIOCB1/TCLKC
Input/Output
Type
Schmitt trigger
input
(IRQ1, IRQ0)
P14/TIOCA1/IRQ0
P13/TIOCD0/TCLKB
P12/TIOCC0/TCLKA
P11/TIOCB0
P10/TIOCA0
Port3
Port 4
Port 7
General I/O port
also functioning
as SCI_0 I/O pins
and interrupt
input pins
General input
port also
functioning as
A/D converter
analog input pins
General I/O port
P36
P32/SCK0/IRQ4
P31/RxD0
P30/TxD0
P43/AN3
P42/AN2
P41/AN1
P40/AN0
P77*
P76*
P75*
Port 9
General input
P97/AN15
port also
P96/AN14
functioning as
A/D converter
analog input pins
Rev.6.00 Jun. 03, 2008 Page 214 of 698
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Open-drain
output
Schmitt trigger
input
(IRQ4)
Section 8 I/O Ports
Description
Port A
General I/O port PA3/SCK2
also functioning PA2/RxD2
as SCI_2 I/O pins
PA1/TxD2
On-chip input
pull-up MOS
General I/O port
On-chip input
pull-up MOS
Port E
Mode 7
Input/Output
Type
Port
PE7
PE6
Open-drain
output
PE5
PE4
PE3
PE2
PE1
PE0
Port F
Port G
General I/O port When DDR = 0 (after reset): PF7
also functioning When DDR = 1: φ
as interrupt input
PF3/ADTRG/IRQ3
pins
PF0/IRQ2
Schmitt trigger
input
General I/O port PG1/IRQ7
also functioning PG0*
as interrupt input
pins
Schmitt trigger
input
(IRQ3, IRQ2)
(IRQ7)
Note: * These pins are available only when EMLE = 0. These pins are not available when the
H-UDI is used.
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Section 8 I/O Ports
8.1
Port 1
In the H8S/2218 Group, the port 1 is an 8-bit I/O port also functioning as address bus pins, TPU
I/O pins, and external interrupt input pins. In the H8S/2212 Group, the port 1 is an 8-bit I/O port
also functioning as TPU I/O pins and external interrupt input pins. The port 1 has the following
registers.
• Port 1 data direction register (P1DDR)
• Port 1 data register (P1DR)
• Port 1 register (PORT1)
8.1.1
Port 1 Data Direction Register (P1DDR)
P1DDR specifies input or output for the pins of the port 1.
Since P1DDR is a write-only register, the bit manipulation instructions must not be used to write
P1DDR. For details, see section 2.9.4, Accessing Registers Containing Write-Only Bits.
Bit
Bit Name Initial Value
R/W
Description
7
P17DDR
0
W
(H8S/2218 Group)
6
P16DDR
0
W
5
P15DDR
0
W
4
P14DDR
0
W
3
P13DDR
0
W
2
P12DDR
0
W
Modes 4 to 6:
If address output is enabled by the setting of bits AE3 to
AE0 in PFCR, pins P13 to P10 are address outputs. Pins
P17 to P14, and pins P13 to P10 when address output is
disabled, are output ports when the corresponding
P1DDR bits are set to 1, and input ports when the
corresponding P1DDR bits are cleared to 0.
1
P11DDR
0
W
0
P10DDR
0
W
Mode 7:
Setting a P1DDR bit to 1 makes the corresponding port 1
pin an output port, while clearing the bit to 0 makes the
pin an input port.
(H8S/2212 Group)
Setting a P1DDR bit to 1 makes the corresponding port 1
pin an output port, while clearing the bit to 0 makes the
pin an input port.
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Section 8 I/O Ports
8.1.2
Port 1 Data Register (P1DR)
P1DR stores output data for the port 1 pins.
Bit
Bit Name Initial Value
R/W
Description
7
P17DR
0
R/W
6
P16DR
0
R/W
Store output data for a pin that functions as a general
output port.
5
P15DR
0
R/W
4
P14DR
0
R/W
3
P13DR
0
R/W
2
P12DR
0
R/W
1
P11DR
0
R/W
0
P10DR
0
R/W
8.1.3
Port 1 Register (PORT1)
PORT1 indicates the pin states of the port 1.
Bit
Bit Name Initial Value
R/W
Description
7
P17
6
P16
⎯*
R
⎯*
R
P15
⎯*
R
If the port 1 is read while P1DDR bits are set to 1, the
P1DR value is read. If the port 1 is read while P1DDR bits
are cleared to 0, the pin states are read.
5
4
P14
⎯*
R
3
P13
⎯*
R
2
P12
⎯*
R
1
P11
⎯*
R
0
P10
⎯*
R
Note: * Determined by the states of pins P17 to P10.
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Section 8 I/O Ports
8.1.4
Pin Functions
Pin Functions of H8S/2218 Group
Port 1 pins also function as address bus (A23 to A20) output pins, TPU I/O pins, and external
interrupt input (IRQ0 and IRQ1) pins. The correspondence between the register specification and
the pin functions is shown below.
Table 8.3
P17 Pin Function
TPU Channel 2 Setting*
Output Setting
⎯
0
1
TIOCB2 output pin
P17 input pin
P17 output pin
P17DDR
Pin Function
Input Setting or Initial Value
TIOCB2 input pin
TCLKD input pin
Note: * For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit (TPU).
Table 8.4
P16 Pin Function
1
TPU Channel 2 Setting*
Output Setting
⎯
0
1
TIOCA2 output pin
P16 input pin
P16 output pin
P16DDR
Pin Function
Input Setting or Initial Value
TIOCA2 input pin
IRQ1 input pin*
2
Notes: 1. For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit
(TPU).
2. When this pin is used as an external interrupt pin, this pin must not be used for another
function.
Table 8.5
P15 Pin Function
TPU Channel 1 Setting*
P15DDR
Pin Function
Output Setting
Input Setting or Initial Value
⎯
0
1
TIOCB1 output pin
P15 input pin
P15 output pin
TIOCB1 input pin
TCLKC input pin
Note: * For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit (TPU).
Rev.6.00 Jun. 03, 2008 Page 218 of 698
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Section 8 I/O Ports
Table 8.6
P14 Pin Function
1
TPU Channel 1 Setting*
Output Setting
⎯
0
1
TIOCA1 output pin
P14 input pin
P14 output pin
P14DDR
Pin Function
Input Setting or Initial Value
TIOCA1 input pin
IRQ0 input pin*
2
Notes: 1. For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit
(TPU).
2. When this pin is used as an external interrupt pin, this pin must not be used for another
function.
Table 8.7
P13 Pin Function
2
AE3 to AE0*
Other than B'1111
1
TPU Channel 0 Setting*
Output Setting
Input Setting or Initial Value
⎯
⎯
0
1
⎯
TIOCD0 output pin
P13 input pin
P13 output pin
A23 output
2
pin*
P13DDR
Pin Function
B'1111
TIOCD0 input pin
TCLKB input pin
Notes: 1. For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit
(TPU).
2. Valid in modes 4, 5, and 6.
Table 8.8
P12 Pin Function
2
AE3 to AE0*
Other than B'1111
1
TPU Channel 0 Setting*
P12DDR
Pin Function
Output Setting
B'1111
Input Setting or Initial Value
⎯
⎯
0
1
⎯
TIOCC0 output pin
P12 input pin
P12 output pin
A22 output
2
pin*
TIOCC0 input pin
TCLKA input pin
Notes: 1. For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit
(TPU).
2. Valid in modes 4, 5, and 6.
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Section 8 I/O Ports
Table 8.9
P11 Pin Function
2
AE3 to AE0*
Other than B'1110 to B'1111
1
TPU Channel 0 Setting*
Output Setting
⎯
Input Setting or Initial Value
⎯
0
1
⎯
TIOCB0 output pin
P11 input pin
P11 output pin
A21 output
2
pin*
P11DDR
Pin Function
B'1110 to
B'1111
TIOCB0 input pin
Notes: 1. For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit
(TPU).
2. Valid in modes 4, 5, and 6.
Table 8.10 P10 Pin Function
2
AE3 to AE0*
Other than B'1101 to B'1111
1
TPU Channel 0 Setting*
Output Setting
⎯
Input Setting or Initial Value
⎯
0
1
⎯
TIOCA0 output pin
P10 input pin
P10 output pin
A20 output
2
pin*
P10DDR
Pin Function
B'1101 to
B'1111
TIOCA0 input pin
Notes: 1. For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit
(TPU).
2. Valid in modes 4, 5, and 6.
Pin Functions of H8S/2212 Group
Port 1 pins also function as TPU I/O pins and external interrupt input (IRQ0 and IRQ1) pins. The
correspondence between the register specification and the pin functions is shown below.
Table 8.11 P17 Pin Function
TPU Channel 2 Setting*
P17DDR
Pin Function
Output Setting
Input Setting or Initial Value
⎯
0
1
TIOCB2 output pin
P17 input pin
P17 output pin
TIOCB2 input pin
TCLKD input pin
Note: * For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit (TPU).
Rev.6.00 Jun. 03, 2008 Page 220 of 698
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Section 8 I/O Ports
Table 8.12 P16 Pin Function
1
TPU Channel 2 Setting*
Output Setting
⎯
0
1
TIOCA2 output pin
P16 input pin
P16 output pin
P16DDR
Pin Function
Input Setting or Initial Value
TIOCA2 input pin
IRQ1 input pin*
2
Notes: 1. For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit
(TPU).
2. When this pin is used as an external interrupt pin, this pin must not be used for another
function.
Table 8.13 P15 Pin Function
TPU Channel 1 Setting*
Output Setting
⎯
0
1
TIOCB1 output pin
P15 input pin
P15 output pin
P15DDR
Pin Function
Input Setting or Initial Value
TIOCB1 input pin
TCLKC input pin
Note: * For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit (TPU).
Table 8.14 P14 Pin Function
1
TPU Channel 1 Setting*
P14DDR
Pin Function
Output Setting
Input Setting or Initial Value
⎯
0
1
TIOCA1 output pin
P14 input pin
P14 output pin
TIOCA1 input pin
IRQ0 input pin*
2
Notes: 1. For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit
(TPU).
2. When this pin is used as an external interrupt pin, this pin must not be used for another
function.
Rev.6.00 Jun. 03, 2008 Page 221 of 698
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Section 8 I/O Ports
Table 8.15 P13 Pin Function
TPU Channel 0 Setting*
Output Setting
⎯
0
1
TIOCD0 output pin
P13 input pin
P13 output pin
P13DDR
Pin Function
Input Setting or Initial Value
TIOCD0 input pin
TCLKB input pin
Note: * For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit (TPU).
Table 8.16 P12 Pin Function
TPU Channel 0 Setting*
Output Setting
⎯
0
1
TIOCC0 output pin
P12 input pin
P12 output pin
P12DDR
Pin Function
Input Setting or Initial Value
TIOCC0 input pin
TCLKA input pin
Note: * For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit (TPU).
Table 8.17 P11 Pin Function
TPU Channel 0 Setting*
Output Setting
⎯
0
1
TIOCB0 output pin
P11 input pin
P11 output pin
P11DDR
Pin Function
Input Setting or Initial Value
TIOCB0 input pin
Note: * For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit (TPU).
Table 8.18 P10 Pin Function
TPU Channel 0 Setting*
P10DDR
Pin Function
Output Setting
Input Setting or Initial Value
⎯
0
TIOCA0 output pin
P10 input pin
1
P10 output pin
TIOCA0 input pin
Note: * For details on the TPU channel setting, refer to section 9, 16-Bit Timer Pulse Unit (TPU).
Rev.6.00 Jun. 03, 2008 Page 222 of 698
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Section 8 I/O Ports
8.2
Port 3
The port 3 is a 4-bit I/O port also functioning as the SCI I/O pins and external interrupt input
(IRQ4) pins. The port 3 of the H8S/2218 Group has the same function as that of the H8S/2212
Group. The port 3 has the following registers.
• Port 3 data direction register (P3DDR)
• Port 3 data register (P3DR)
• Port 3 register (PORT3)
• Port 3 open-drain control register (P3ODR)
8.2.1
Port 3 Data Direction Register (P3DDR)
P3DDR specifies input or output for the pins of the port 3.
Since P3DDR is a write-only register, the bit manipulation instructions must not be used to write
P3DDR. For details, see section 2.9.4, Accessing Registers Containing Write-Only Bits.
Bit
Bit Name Initial Value
R/W
7
⎯
⎯
Undefined
Description
Reserved
This bit is undefined and cannot be modified.
6
P36DDR
0
W
5 to ⎯
3
Undefined
⎯
2
P32DDR
0
W
1
P31DDR
0
W
0
P30DDR
0
W
Setting a P3DDR bit to 1 makes the corresponding port 3
pin an output pin, while clearing the bit to 0 makes the pin
an input pin.
Reserved
These bits are undefined and cannot be modified.
Setting a P3DDR bit to 1 makes the corresponding port 3
pin an output pin, while clearing the bit to 0 makes the pin
an input pin.
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Section 8 I/O Ports
8.2.2
Port 3 Data Register (P3DR)
P3DR stores output data for the port 3 pins.
Bit
Bit Name Initial Value
R/W
7
⎯
⎯
Undefined
Description
Reserved
This bit is undefined and cannot be modified.
6
P36DR
0
R/W
Stores output data for a pin that functions as a general
output port.
5 to ⎯
3
Undefined
⎯
Reserved
2
P32DR
0
R/W
1
P31DR
0
R/W
0
P30DR
0
R/W
8.2.3
These bits are undefined and cannot be modified.
Store output data for a pin that functions as a general
output port.
Port 3 Register (PORT3)
PORT3 indicates the pin states of the port 3.
Bit
Bit Name Initial Value
R/W
Description
7
⎯
⎯
Reserved
Undefined
This bit is undefined.
⎯*
R
If the port 3 is read while P3DDR bits are set to 1, the
P3DR value is read. If the port 3 is read while P3DDR bits
are cleared to 0, the pin states are read.
5 to ⎯
3
Undefined
⎯
Reserved
2
P32
⎯*
R
1
P31
⎯*
R
0
P30
⎯*
R
6
P36
These bits are undefined.
If the port 3 is read while P3DDR bits are set to 1, the
P3DR value is read. If the port 3 is read while P3DDR bits
are cleared to 0, the pin states are read.
Note: * Determined by the states of pins P36 and P32 to P30.
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Section 8 I/O Ports
8.2.4
Port 3 Open-Drain Control Register (P3ODR)
P3ODR controls the PMOS on/off state for each port 3 pin.
Bit
Bit Name Initial Value
R/W
7
⎯
⎯
Undefined
Description
Reserved
This bit is undefined and cannot be modified.
6
P36ODR
0
R/W
5 to ⎯
3
Undefined
⎯
2
P32ODR
0
R/W
1
P31ODR
0
R/W
0
P30ODR
0
R/W
8.2.5
Setting a P3ODR bit to 1 makes the corresponding port 3
pin an NMOS open-drain output pin, while clearing the bit
to 0 makes the pin a CMOS output pin.
Reserved
These bits are undefined and cannot be modified.
Setting a P3ODR bit to 1 makes the corresponding port 3
pin an NMOS open-drain output pin, while clearing the bit
to 0 makes the pin a CMOS output pin.
Pin Functions
Port 3 pins also function as SCI I/O pins and external interrupt input (IRQ4) pins. The
correspondence between the register specification and the pin functions is shown below. The P36
pin must be used as the D+ pull-up control output pin of the USB. For details, refer to section 14,
Universal Serial Bus (USB).
Table 8.19 P36 Pin Function
P36DDR
Pin Function
0
1
P36 input pin
P36 output pin
(D+ pull-up control output pin of USB)
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Section 8 I/O Ports
Table 8.20 P32 Pin Function
CKE1 in SCR_0
0
C/A in SMR_0
Pin Function
1
⎯
1
⎯
⎯
0
CKE0 in SCR_0
P32DDR
1
0
0
1
⎯
⎯
⎯
P32 input pin
P32 output pin
SCK0 output pin
SCK0 output pin
SCK0 input pin
IRQ4 input pin*
Note: * When this pin is used as an external interrupt pin, this pin must not be used for another
function.
Table 8.21 P31 Pin Function
RE in SCR_0
0
0
1
⎯
P31 input pin
P31 output pin
RxD0 input pin
0
1
⎯
P30 input pin
P30 output pin
TxD0 output pin
P31DDR
Pin Function
1
Table 8.22 P30 Pin Function
TE in SCR_0
P30DDR
Pin Function
0
Rev.6.00 Jun. 03, 2008 Page 226 of 698
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1
Section 8 I/O Ports
8.3
Port 4
The port 4 is a 4-bit input port also functioning as A/D converter analog input pins. The port 4 of
the H8S/2218 Group has the same function as that of the H8S/2212 Group. The port 4 has the
following register.
• Port 4 register (PORT4)
8.3.1
Port 4 Register (PORT4)
PORT4 indicates the pin states of the port 4.
Bit
Bit Name Initial Value
R/W
Description
⎯
Reserved
7 to ⎯
4
Undefined
3
P43
⎯*
R
2
P42
⎯*
R
1
P41
⎯*
R
0
P40
⎯*
R
These bits are undefined.
The pin states are always read when these bits are read.
Note: * Determined by the states of pins P43 to P40.
8.3.2
Pin Function
The port 4 also functions as A/D converter analog input (AN3 to AN0) pins.
Rev.6.00 Jun. 03, 2008 Page 227 of 698
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Section 8 I/O Ports
8.4
Port 7
In the H8S/2218 Group, the port 7 is a 3-bit I/O port also functioning as bus control output pins
and manual reset input pins. In the H8S/2212 Group, the port 7 is a 3-bit I/O port also functioning
as H-UDI pins. The port 7 has the following registers.
• Port 7 data direction register (P7DDR)
• Port 7 data register (P7DR)
• Port 7 register (PORT7)
8.4.1
Port 7 Data Direction Register (P7DDR)
P7DDR specifies input or output for the pins of the port 7.
Since P7DDR is a write-only register, the bit manipulation instructions must not be used to write
P7DDR. For details, see section 2.9.4, Accessing Registers Containing Write-Only Bits.
Bit
Bit Name
Initial Value R/W
Description
7
P77DDR
0
W
(H8S/2218 Group)
6
P76DDR
0
W
5
P75DDR
0
W
Reserved
These bits are undefined and cannot be modified.
(H8S/2212 Group)
When EMLE = 1: Pins P77 to P75 function as the H-UDI
pins (TDO, TMS, TCK).
When EMLE = 0: If a P7DDR bit is set to 1, pins P77 to
P75 function as output ports. If a P7DDR bit is cleared to
0, pins P77 to P75 function as input ports.
4
P74DDR
0
W
(H8S/2218 Group)
Setting a P7DDR bit to 1 makes the corresponding port 7
pin an output pin, while clearing the bit to 0 makes the pin
an input pin.
(H8S/2212 Group)
Reserved
This bit is undefined and cannot be modified.
3, 2
⎯
Undefined
⎯
Reserved
These bits are undefined and cannot be modified.
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Section 8 I/O Ports
Bit
Bit Name
Initial Value R/W
Description
1
P71DDR
0
W
(H8S/2218 Group)
0
P70DDR
0
W
Setting a P7DDR bit to 1 makes the corresponding port
7 pin an output pin, while clearing the bit to 0 makes the
pin an input pin.
(H8S/2212 Group)
Reserved
These bits are undefined and cannot be modified.
8.4.2
Port 7 Data Register (P7DR)
P7DR stores output data for the port 7 pins.
Bit
Bit Name
Initial Value R/W
Description
7
P77DR
0
R/W
(H8S/2218 Group)
6
P76DR
0
R/W
5
P75DR
0
R/W
Reserved
These bits are undefined and cannot be modified.
(H8S/2212 Group)
Store output data for the port 7 pins.
4
P74DR
0
R/W
(H8S/2218 Group)
Stores output data for the port 7 pins.
(H8S/2212 Group)
Reserved
This bit is undefined and cannot be modified.
3, 2
⎯
Undefined
⎯
Reserved
These bits are undefined and cannot be modified.
1
P71DR
0
R/W
(H8S/2218 Group)
0
P70DR
0
R/W
Store output data for the port 7 pins.
(H8S/2212 Group)
Reserved
These bits are undefined and cannot be modified.
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Section 8 I/O Ports
8.4.3
Port 7 Register (PORT7)
PORT7 indicates the pin states of the port 7.
Bit
Bit Name
Initial Value
R/W
Description
7
P77
⎯*
⎯
(H8S/2218 Group)
6
P76
⎯*
⎯
5
P75
⎯*
⎯
Reserved
These bits are undefined and cannot be modified.
(H8S/2212 Group)
If P7DDR bits are set to 1, the P7DR value is read. If
P7DDR bits are cleared to 0, the pin states are read.
4
P74
⎯*
R
(H8S/2218 Group)
If the port 7 is read while P7DDR bits are set to 1, the
P7DR value is read. If the port 7 is read while P7DDR
bits are cleared to 0, the pin states are read.
(H8S/2212 Group)
Reserved
This bit is undefined and cannot be modified.
3, 2
⎯
Undefined
⎯
Reserved
These bits are undefined and cannot be modified.
1
P71
⎯*
R
(H8S/2218 Group)
0
P70
⎯*
R
If the port 7 is read while P7DDR bits are set to 1, the
P7DR value is read. If the port 7 is read while P7DDR
bits are cleared to 0, the pin states are read.
(H8S/2212 Group)
Reserved
These bits are undefined and cannot be modified.
Note: * Determined by the states of pins P77 to P74, P71, and P70.
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Section 8 I/O Ports
8.4.4
Pin Functions
Pin Functions of H8S/2218 Group
Port 7 pins also function as bus control output pins and manual reset input pins. The
correspondence between the register specification and the pin functions is shown below.
Table 8.23 P74 Pin Function
MRESE
0
0
1
⎯
P74 input pin
P74 output pin
MRES input pin
P74DDR
Pin Function
1
Table 8.24 P71 Pin Function
Operating Mode
Modes 4 to 6
P71DDR
Pin Function
Mode 7
0
1
0
1
P71 input pin
CS5 output pin
P71 input pin
P71 output pin
Table 8.25 P70 Pin Function
Operating Mode
Modes 4 to 6
P70DDR
Pin Function
Mode 7
0
1
0
1
P70 input pin
CS4 output pin
P70 input pin
P70 output pin
Pin Functions of H8S/2212 Group
Port 7 pins also function as H-UDI pins. The correspondence between the register specification
and the pin functions is shown below.
Table 8.26 P77 Pin Function
EMLE
P77DDR
Pin Function
0
1
0
1
⎯
P77 input pin
P77 output pin
TDO output pin
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Section 8 I/O Ports
Table 8.27 P76 Pin Function
EMLE
0
0
1
⎯
P76 input pin
P76 output pin
TCK input pin
P76DDR
Pin Function
1
Table 8.28 P75 Pin Function
EMLE
0
0
1
⎯
P75 input pin
P75 output pin
TMS input pin
P75DDR
Pin Function
8.5
1
Port 9
The port 9 is a 2-bit input port also functioning as A/D converter analog input pins. The port 9 of
the H8S/2218 Group has the same function as that of the H8S/2212 Group.
• Port 9 register (PORT9)
8.5.1
Port 9 Register (PORT9)
PORT9 indicates the pin states of the port 9.
Bit
Bit Name Initial Value
R/W
Description
7
P97
⎯*
R
The pin states are always read when these bits are read.
6
P96
⎯*
R
Undefined
⎯
5 to ⎯
0
Reserved
These bits are undefined.
Note: * Determined by the states of pins P97 and P96.
8.5.2
Pin Function
The port 9 also functions as A/D converter analog input (AN15 and AN14) pins.
Rev.6.00 Jun. 03, 2008 Page 232 of 698
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Section 8 I/O Ports
8.6
Port A
In the H8S/2218 Group, the port A is a 4-bit I/O port also functioning as address bus (A19 to A16)
output pins and SCI I/O pins. In the H8S/2212 Group, the port A is a 3-bit I/O port also
functioning as SCI I/O pins. The port A has the following registers.
• Port A data direction register (PADDR)
• Port A data register (PADR)
• Port A register (PORTA)
• Port A pull-up MOS control register (PAPCR)
• Port A open-drain control register (PAODR)
8.6.1
Port A Data Direction Register (PADDR)
PADDR specifies input or output for the pins of the port A.
Since PADDR is a write-only register, the bit manipulation instructions must not be used to write
PADDR. For details, see section 2.9.4, Accessing Registers Containing Write-Only Bits.
Bit
Bit Name Initial Value
7 to ⎯
4
Undefined
R/W
Description
⎯
Reserved
These bits are undefined and cannot be modified.
3
PA3DDR 0
W
(H8S/2218 Group)
2
PA2DDR 0
W
1
PA1DDR 0
W
0
PA0DDR* 0
W
Modes 4 to 6:
If address output is enabled by the setting of bits AE3 to
AE0 in PFCR, the corresponding port A pins are address
outputs. When address output is disabled, setting a
PADDR bit to 1 makes the corresponding port A pin an
output port, while clearing the bit to 0 makes the pin an
input port.
Mode 7:
Setting a PADDR bit to 1 makes the corresponding port A
pin an output port, while clearing the bit to 0 makes the
pin an input port.
(H8S/2212 Group)
Setting a PADDR bit to 1 makes the corresponding port A
pin an output port, while clearing the bit to 0 makes the
pin an input port.
Note: * Reserved in the H8S/2212 Group. If this bit is read, an undefined value will be read. This bit
cannot be modified.
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Section 8 I/O Ports
8.6.2
Port A Data Register (PADR)
PADR stores output data for the port A pins.
Bit
Bit Name Initial Value
R/W
Description
⎯
Reserved
7 to ⎯
4
Undefined
3
PA3DR
0
R/W
2
PA2DR
0
R/W
1
PA1DR
0
R/W
0
PA0DR*
0
R/W
These bits are undefined and cannot be modified.
Store output data for a pin that functions as a general
output port.
Note: * Reserved in the H8S/2212 Group. If this bit is read, an undefined value will be read. This bit
cannot be modified.
8.6.3
Port A Register (PORTA)
PORTA indicates the pin states of the port A.
Bit
Bit Name Initial Value
R/W
Description
⎯
Reserved
7 to ⎯
4
Undefined
3
PA3
⎯*
R
2
PA2
⎯*
R
1
PA1
⎯*
R
⎯*
R
0
These bits are undefined.
1
1
1
2
PA0*
1
If the port A is read while PADDR bits are set to 1, the
PADR value is read. If the port A is read while PADDR
bits are cleared to 0, the pin states are read.
Notes: 1. Determined by the states of pins PA3 to PA0.
2. Reserved in the H8S/2212 Group. If this bit is read, an undefined value will be read.
Rev.6.00 Jun. 03, 2008 Page 234 of 698
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Section 8 I/O Ports
8.6.4
Port A Pull-Up MOS Control Register (PAPCR)
PAPCR controls the on/off state of the port A input pull-up MOS. PAPCR is valid for port input
and SCI input pins.
Bit
Bit Name Initial Value
R/W
Description
7 to ⎯
4
Undefined
⎯
Reserved
3
PA3PCR
0
R/W
2
PA2PCR
0
R/W
1
PA1PCR
0
R/W
When a pin functions as an input port, setting the
corresponding bit to 1 turns on the input pull-up MOS for
that pin.
0
PA0PCR* 0
R/W
These bits are undefined and cannot be modified.
Note: * Reserved in the H8S/2212 Group. If this bit is read, an undefined value will be read. This bit
cannot be modified.
8.6.5
Port A Open-Drain Control Register (PAODR)
PAODR specifies an output type of the port A. PAODR is valid for port output and SCI output
pins.
Bit
Bit Name Initial Value
7 to ⎯
4
Undefined
R/W
Description
⎯
Reserved
These bits are undefined and cannot be modified.
3
PA3ODR 0
R/W
2
PA2ODR 0
R/W
1
PA1ODR 0
R/W
0
PA0ODR* 0
R/W
Setting a PAODR bit to 1 makes the corresponding port A
pin an NMOS open-drain output pin, while clearing the bit
to 0 makes the pin a CMOS output pin.
Note: * Reserved in the H8S/2212 Group. If this bit is read, an undefined value will be read. This bit
cannot be modified.
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Section 8 I/O Ports
8.6.6
Pin Functions
Pin Functions of H8S/2218 Group
Port A pins also function as address bus (A19 to A16) output pins and SCI_2 I/O pins. The
correspondence between the register specification and the pin functions is shown below.
Table 8.29 PA3 Pin Function
Operating Mode
AE3 to AE0
Modes 4 to 6
B'11××
CKE1 in SCR_2
—
C/A in SMR_2
—
CKE0 in SCR_2
—
PA3DDR
—
Pin Function
Mode 7
Other than B'11××
—
0
1
0
0
0
1
0
1
—
1
—
—
—
—
—
1
0
0
0
1
1
—
1
—
—
—
—
—
A19
PA3
PA3
SCK2
SCK2
SCK2
PA3
PA3
SCK2
SCK2
SCK2
output
input
output
output
output
input
input
output
output
output
input
pin
pin
pin
pin
pin
pin
pin
pin
pin
pin
pin
Table 8.30 PA2 Pin Function
Operating mode
AE3 to AE0
Modes 4 to 6
B'1011 or
B'11××
Mode 7
Other than B'1011 or B'11××
RE in SCR_2
—
PA2DDR
—
0
1
—
A18
output pin
PA2
input pin
PA2
output pin
RxD2
input pin
Pin Function
0
Legend:
×: Don't care.
Rev.6.00 Jun. 03, 2008 Page 236 of 698
REJ09B0074-0600
—
1
0
0
1
1
PA2
PA2
input pin output pin
—
RxD2
input pin
Section 8 I/O Ports
Table 8.31 PA1 Pin Function
Operating mode
AE3 to AE0
Modes 4 to 6
B'101× or
B'11××
TE in SCR_2
—
PA1DDR
—
Pin Function
Mode 7
Other than B'101× or B'11××
0
0
—
1
1
—
0
1
0
1
—
A17
PA1
PA1
TxD2
PA1
PA1
TxD2
output pin input pin output pin output pin input pin output pin output pin
Table 8.32 PA0 Pin Function
Operating
mode
AE3 to AE0
Modes 4 to 6
Other than
B'0××× or B'1000
PA0DDR
Pin Function
Mode 7
B'0××× or B'1000
—
0
1
A16 output pin
PA0 input pin
PA0 output pin
—
0
1
PA0 input pin PA0 output pin
Legend:
×: Don't care.
Pin Functions of H8S/2212 Group
Port A pins also function as SCI_2 I/O pins. The correspondence between the register specification
and the pin functions is shown below.
Table 8.33 PA3 Pin Function
CKE1 in SCR_2
0
C/A in SMR_2
0
Pin Function
1
⎯
1
⎯
⎯
0
1
⎯
⎯
⎯
PA3 input
pin
PA3 output
pin
SCK2 output
pin
SCK2 output
pin
SCK2 input
pin
CKE0 in SCR_2
PA3DDR
1
0
Rev.6.00 Jun. 03, 2008 Page 237 of 698
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Section 8 I/O Ports
Table 8.34 PA2 Pin Function
RE in SCR_2
PA2DDR
Pin Function
0
1
0
1
⎯
PA2 input pin
PA2 output pin
RxD2 input pin
Table 8.35 PA1 Pin Function
TE in SCR_2
PA1DDR
Pin Function
8.6.7
0
1
0
1
⎯
PA1 input pin
PA1 output pin
TxD2 output pin
Port A Input Pull-Up MOS States
The port A has an on-chip input pull-up MOS function that can be controlled by software. The
input pull-up MOS can be specified as the on or off state for individual bits.
Table 8.36 summarizes the input pull-up MOS states.
Table 8.36 Input Pull-Up MOS States (Port A)
Pins
Address output, port
output, SCI output
Power-On
Reset
Off
Port input, SCI input
Hardware
Standby
Mode
Manual
Reset
Off
On/Off
Legend:
Off: Input pull-up MOS is always off.
On/Off: On when PADDR = 0 and PAPCR = 1; otherwise off.
Rev.6.00 Jun. 03, 2008 Page 238 of 698
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Software
Standby
Mode
In Other
Operations
Section 8 I/O Ports
8.7
Port B (H8S/2218 Group Only)
The port B is an 8-bit I/O port also functioning as address bus (A15 to A8) output pins. The port B
has the following registers.
Note: When the USB is used while the E6000 emulator is used, the AE3 to AE0 bits in PFCR
must be set so that the PB1 and PB0 pins output addresses A9 and A8. This note applies to
both the H8S/2218 Group and H8S/2212 Group.
• Port B data direction register (PBDDR)
• Port B data register (PBDR)
• Port B register (PORTB)
• Port B pull-up MOS control register (PBPCR)
8.7.1
Port B Data Direction Register (PBDDR)
PBDDR specifies input or output for the pins of the port B.
Since PBDDR is a write-only register, the bit manipulation instructions must not be used to write
PBDDR. For details, see section 2.9.4, Accessing Registers Containing Write-Only Bits.
Bit
Bit Name Initial Value
R/W
Description
7
PB7DDR 0
W
6
PB6DDR 0
W
5
PB5DDR 0
W
4
PB4DDR 0
W
3
PB3DDR 0
W
Modes 4 to 6:
If address output is enabled by the setting of bits AE3 to
AE0 in PFCR, the corresponding port B pins are address
outputs. When address output is disabled, setting a
PBDDR bit to 1 makes the corresponding port B pin an
output port, while clearing the bit to 0 makes the pin an
input port.
2
PB2DDR 0
W
1
PB1DDR 0
W
0
PB0DDR 0
W
Mode 7:
Setting a PBDDR bit to 1 makes the corresponding port B
pin an output port, while clearing the bit to 0 makes the
pin an input port.
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Section 8 I/O Ports
8.7.2
Port B Data Register (PBDR)
PBDR stores output data for the port B pins.
Bit
Bit Name Initial Value
R/W
Description
7
PB7DR
0
R/W
6
PB6DR
0
R/W
Store output data for a pin that functions as a general
output port.
5
PB5DR
0
R/W
4
PB4DR
0
R/W
3
PB3DR
0
R/W
2
PB2DR
0
R/W
1
PB1DR
0
R/W
0
PB0DR
0
R/W
8.7.3
Port B Register (PORTB)
PORTB indicates the pin states of the port B.
Bit
Bit Name Initial Value
R/W
Description
7
PB7
6
PB6
⎯*
R
⎯*
R
PB5
⎯*
R
If the port B is read while PBDDR bits are set to 1, the
PBDR value is read. If the port B is read while PBDDR
bits are cleared to 0, the pin states are read.
5
4
PB4
⎯*
R
3
PB3
⎯*
R
2
PB2
⎯*
R
1
PB1
⎯*
R
0
PB0
⎯*
R
Note: * Determined by the states of pins PB7 to PB0.
Rev.6.00 Jun. 03, 2008 Page 240 of 698
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Section 8 I/O Ports
8.7.4
Port B Pull-Up MOS Control Register (PBPCR)
PBPCR controls the on/off state of the port B input pull-up MOS. PBPCR is valid for port input
pins.
Bit
Bit Name Initial Value
R/W
Description
7
PB7PCR
0
R/W
6
PB6PCR
0
R/W
5
PB5PCR
0
R/W
When a pin functions as an input port, setting the
corresponding bit to 1 turns on the input pull-up MOS for
that pin.
4
PB4PCR
0
R/W
3
PB3PCR
0
R/W
2
PB2PCR
0
R/W
1
PB1PCR
0
R/W
0
PB0PCR
0
R/W
Rev.6.00 Jun. 03, 2008 Page 241 of 698
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Section 8 I/O Ports
8.7.5
Pin Functions
Port B pins also function as address bus (A15 to A9) output pins. The correspondence between the
register specification and the pin functions is shown below.
Note: When using the USB with the emulator (E6000), set A9 and A8 as address bus output pins.
Table 8.37 PB7 Pin Function
Operating mode
AE3 to AE0
PB7DDR
Pin Function
Modes 4 to 6
B'1×××
Mode 7
Other than B'1×××
—
0
A15
output pin
1
PB7
PB7
input pin output pin
—
0
1
PB7
input pin
PB7
output pin
Table 8.38 PB6 Pin Function
Operating mode
AE3 to AE0
PB6DDR
Pin Function
Modes 4 to 6
B'0111 or B'1×××
Mode 7
Other than B'0111 or
B'1×××
—
—
0
1
0
1
A14
output pin
PB6
input pin
PB6
output pin
PB6
input pin
PB6
output pin
Table 8.39 PB5 Pin Function
Operating mode
AE3 to AE0
PB5DDR
Pin Function
Modes 4 to 6
B'011× or B'1×××
Mode 7
Other than B'011× or
B'1×××
—
—
0
1
0
1
A13
output pin
PB5
input pin
PB5
output pin
PB5
input pin
PB5
output pin
Rev.6.00 Jun. 03, 2008 Page 242 of 698
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Section 8 I/O Ports
Table 8.40 PB4 Pin Function
Operating mode
AE3 to AE0
PB4DDR
Pin Function
Modes 4 to 6
Other than B'0100
or B'00××
—
Mode 7
B'0100 or B'00××
0
A12
output pin
1
PB4
PB4
input pin output pin
—
0
1
PB4
input pin
PB4
output pin
Table 8.41 PB3 Pin Function
Operating mode
AE3 to AE0
PB3DDR
Pin Function
Modes 4 to 6
Other than B'00××
Mode 7
B'00××
—
—
0
1
0
1
A11
output pin
PB3
input pin
PB3
output pin
PB3
input pin
PB3
output pin
Table 8.42 PB2 Pin Function
Operating mode
AE3 to AE0
PB2DDR
Pin Function
Modes 4 to 6
Other than B'0010
or B'000×
Mode 7
B'0010 or B'000×
—
—
0
1
0
1
A10
output pin
PB2
input pin
PB2
output pin
PB2
input pin
PB2
output pin
Table 8.43 PB1 Pin Function
Operating mode
AE3 to AE0
PB1DDR
Pin Function
Modes 4 to 6
Other than B'000×
Mode 7
B'000×
—
—
0
1
0
1
A9
output pin
PB1
input pin
PB1
output pin
PB1
input pin
PB1
output pin
Rev.6.00 Jun. 03, 2008 Page 243 of 698
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Section 8 I/O Ports
Table 8.44 PB0 Pin Function
Operating mode
AE3 to AE0
Modes 4 to 6
Other than B'0000
PB0DDR
Pin Function
Mode 7
B'0000
—
—
0
1
0
1
A8
output pin
PB0
input pin
PB0
output pin
PB0
input pin
PB0
output pin
Legend:
×: Don't care.
8.7.6
Port B Input Pull-Up MOS States
The port B has an on-chip input pull-up MOS function that can be controlled by software. The
input pull-up MOS can be specified as the on or off state for individual bits.
Table 8.45 summarizes the input pull-up MOS states.
Table 8.45 Input Pull-Up MOS States (Port B)
Pins
Address output, port
output
Power-On
Reset
Off
Port input
Hardware
Standby
Mode
Manual
Reset
Off
On/Off
Legend:
Off: Input pull-up MOS is always off.
On/Off: On when PBDDR = 0 and PBPCR = 1; otherwise off.
Rev.6.00 Jun. 03, 2008 Page 244 of 698
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Software
Standby
Mode
In Other
Operations
Section 8 I/O Ports
8.8
Port C (H8S/2218 Group Only)
The port C is an 8-bit I/O port also functioning as address bus (A7 to A0) output pins. The port C
has the following registers.
Note: When the RTC and USB are used while the E6000 emulator is used, the PC7DDR to
PC0DDR bits in PCDDR must be set so that the PC7 to PC0 pins output addresses A7 to
A0. This note applies to both the H8S/2218 Group and H8S/2212 Group.
• Port C data direction register (PCDDR)
• Port C data register (PCDR)
• Port C register (PORTC)
• Port C pull-up MOS control register (PCPCR)
8.8.1
Port C Data Direction Register (PCDDR)
PCDDR specifies input or output for the pins of the port C.
Since PCDDR is a write-only register, the bit manipulation instructions must not be used to write
PCDDR. For details, see section 2.9.4, Accessing Registers Containing Write-Only Bits.
Bit
Bit Name Initial Value
R/W
Description
7
PC7DDR 0
W
6
PC6DDR 0
W
Modes 4 and 5:
Port C pins are address output pins.
5
PC5DDR 0
W
4
PC4DDR 0
W
3
PC3DDR 0
W
2
PC2DDR 0
W
1
PC1DDR 0
W
0
PC0DDR 0
W
Mode 6:
Setting a PCDDR bit to 1 makes the corresponding port C
pin an address output pin, while clearing the bit to 0
makes the pin an input port.
Mode 7:
Setting a PCDDR bit to 1 makes the corresponding port C
pin an output port, while clearing the bit to 0 makes the
pin an input port.
Rev.6.00 Jun. 03, 2008 Page 245 of 698
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Section 8 I/O Ports
8.8.2
Port C Data Register (PCDR)
PCDR stores output data for the port C pins.
Bit
Bit Name Initial Value
R/W
Description
7
PC7DR
0
R/W
6
PC6DR
0
R/W
Store output data for a pin that functions as a general
output port.
5
PC5DR
0
R/W
4
PC4DR
0
R/W
3
PC3DR
0
R/W
2
PC2DR
0
R/W
1
PC1DR
0
R/W
0
PC0DR
0
R/W
8.8.3
Port C Register (PORTC)
PORTC indicates the pin states of the port C.
Bit
Bit Name Initial Value
R/W
Description
7
PC7
6
PC6
⎯*
R
⎯*
R
PC5
⎯*
R
If the port C is read while PCDDR bits are set to 1, the
PCDR value is read. If the port C is read while PCDDR
bits are cleared to 0, the pin states are read.
5
4
PC4
⎯*
R
3
PC3
⎯*
R
2
PC2
⎯*
R
1
PC1
⎯*
R
0
PC0
⎯*
R
Note: * Determined by the states of pins PC7 to PC0.
Rev.6.00 Jun. 03, 2008 Page 246 of 698
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Section 8 I/O Ports
8.8.4
Port C Pull-Up MOS Control Register (PCPCR)
PCPCR controls the on/off state of the port C input pull-up MOS.
Bit
Bit Name Initial Value
R/W
Description
7
PC7PCR 0
R/W
6
PC6PCR 0
R/W
5
PC5PCR 0
R/W
When a pin functions as an input port, setting the
corresponding bit to 1 turns on the input pull-up MOS for
that pin.
4
PC4PCR 0
R/W
3
PC3PCR 0
R/W
2
PC2PCR 0
R/W
1
PC1PCR 0
R/W
0
PC0PCR 0
R/W
8.8.5
Pin Functions
Port C pins also function as address bus (A7 to A0) output pins. The correspondence between the
register specification and the pin functions is shown below.
Note: When using the RTC and USB with the emulator (E6000), set A7 to A0 as address bus
output pins.
Table 8.46 PC7 Pin Function
Operating Mode
PC7DDR
Pin Function
Modes 4 and 5
Mode 6
Mode 7
⎯
0
1
0
1
A7
output pin
PC7
input pin
A7
output pin
PC7
input pin
PC7
output pin
Table 8.47 PC6 Pin Function
Operating Mode
PC6DDR
Pin Function
Modes 4 and 5
Mode 6
Mode 7
⎯
0
1
0
1
A6
output pin
PC6
input pin
A6
output pin
PC6
input pin
PC6
output pin
Rev.6.00 Jun. 03, 2008 Page 247 of 698
REJ09B0074-0600
Section 8 I/O Ports
Table 8.48 PC5 Pin Function
Operating Mode
PC5DDR
Pin Function
Modes 4 and 5
Mode 6
Mode 7
⎯
0
1
0
1
A5
output pin
PC5
input pin
A5
output pin
PC5
input pin
PC5
output pin
Table 8.49 PC4 Pin Function
Operating Mode
PC4DDR
Pin Function
Modes 4 and 5
Mode 6
Mode 7
⎯
0
1
0
1
A4
output pin
PC4
input pin
A4
output pin
PC4
input pin
PC4
output pin
Table 8.50 PC3 Pin Function
Operating Mode
PC3DDR
Pin Function
Modes 4 and 5
Mode 6
Mode 7
⎯
0
1
0
1
A3
output pin
PC3
input pin
A3
output pin
PC3
input pin
PC3
output pin
Table 8.51 PC2 Pin Function
Operating Mode
PC2DDR
Pin Function
Modes 4 and 5
Mode 6
Mode 7
⎯
0
1
0
1
A2
output pin
PC2
input pin
A2
output pin
PC2
input pin
PC2
output pin
Table 8.52 PC1 Pin Function
Operating Mode
PC1DDR
Pin Function
Modes 4 and 5
Mode 6
Mode 7
⎯
0
1
0
1
A1
output pin
PC1
input pin
A1
output pin
PC1
input pin
PC1
output pin
Rev.6.00 Jun. 03, 2008 Page 248 of 698
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Section 8 I/O Ports
Table 8.53 PC0 Pin Function
Operating Mode
Modes 4 and 5
8.8.6
Mode 7
⎯
0
1
0
1
A0
output pin
PC0
input pin
A0
output pin
PC0
input pin
PC0
output pin
PC0DDR
Pin Function
Mode 6
Port C Input Pull-Up MOS States
The port C has an on-chip input pull-up MOS function that can be controlled by software. The
input pull-up MOS can be used in modes 6 and 7, and can be specified as the on or off state for
individual bits.
Table 8.54 summarizes the input pull-up MOS states.
Table 8.54 Input Pull-Up MOS States (Port C)
Pins
Hardware
Power-On Standby
Manual
Reset
Mode
Reset
Address output (modes 4 and 5), Off
port output (modes 6 and 7)
Off
Port input (modes 6 and 7)
On/Off
Software
Standby
Mode
In Other
Operations
Legend:
Off: Input pull-up MOS is always off.
On/Off: On when PCDDR = 0 and PCPCR = 1; otherwise off.
Rev.6.00 Jun. 03, 2008 Page 249 of 698
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Section 8 I/O Ports
8.9
Port D (H8S/2218 Group Only)
The port D is an 8-bit I/O port also functioning as data bus (D15 to D8) I/O pins. The port D has
the following registers.
• Port D data direction register (PDDDR)
• Port D data register (PDDR)
• Port D register (PORTD)
• Port D pull-up MOS control register (PDPCR)
8.9.1
Port D Data Direction Register (PDDDR)
PDDDR specifies input or output for the pins of the port D.
Since PDDDR is a write-only register, the bit manipulation instructions must not be used to write
PDDDR. For details, see section 2.9.4, Accessing Registers Containing Write-Only Bits.
Bit
Bit Name Initial Value
R/W
Description
7
PD7DDR 0
W
6
PD6DDR 0
W
5
PD5DDR 0
W
Modes 4 to 6:
Port D pins automatically function as data input/output
pins.
4
PD4DDR 0
W
3
PD3DDR 0
W
2
PD2DDR 0
W
1
PD1DDR 0
W
0
PD0DDR 0
W
Mode 7:
Setting a PDDDR bit to 1 makes the corresponding port D
pin an output port, while clearing the bit to 0 makes the
pin an input port.
Rev.6.00 Jun. 03, 2008 Page 250 of 698
REJ09B0074-0600
Section 8 I/O Ports
8.9.2
Port D Data Register (PDDR)
PDDR stores output data for the port D pins.
Bit
Bit Name Initial Value
R/W
Description
7
PD7DR
0
R/W
6
PD6DR
0
R/W
Store output data for a pin that functions as a general
output port.
5
PD5DR
0
R/W
4
PD4DR
0
R/W
3
PD3DR
0
R/W
2
PD2DR
0
R/W
1
PD1DR
0
R/W
0
PD0DR
0
R/W
8.9.3
Port D Register (PORTD)
PORTD indicates the pin states of the port D.
Bit
Bit Name Initial Value
R/W
Description
7
PD7
6
PD6
⎯*
R
⎯*
R
PD5
⎯*
R
If the port D is read while PDDDR bits are set to 1, the
PDDR value is read. If the port D is read while PDDDR
bits are cleared to 0, the pin states are read.
5
4
PD4
⎯*
R
3
PD3
⎯*
R
2
PD2
⎯*
R
1
PD1
⎯*
R
0
PD0
⎯*
R
Note: After accessing EXMDLSTP or the RTC register
(address range: H'FFFF40 to H'FFFF5F), you
must perform a dummy read to the external
address space (such as H'FFEF00 to H'FF7FF)
outside the range H'FFFF40 to H'FFFF5F before
reading PORTD.
Note: * Determined by the states of pins PD7 to PD0.
Rev.6.00 Jun. 03, 2008 Page 251 of 698
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Section 8 I/O Ports
8.9.4
Port D Pull-Up MOS Control Register (PDPCR)
PDPCR controls the on/off state of the port D input pull-up MOS.
Bit
Bit Name Initial Value
R/W
Description
7
PD7PCR 0
R/W
6
PD6PCR 0
R/W
5
PD5PCR 0
R/W
When a pin functions as an input port, setting the
corresponding bit to 1 turns on the input pull-up MOS for
that pin.
4
PD4PCR 0
R/W
3
PD3PCR 0
R/W
2
PD2PCR 0
R/W
1
PD1PCR 0
R/W
0
PD0PCR 0
R/W
8.9.5
Pin Functions
Port D pins also function as data bus (D15 to D8) I/O pins. The correspondence between the
register specification and the pin functions is shown below.
Table 8.55 PD7 Pin Function
Operating Mode
Modes 4 to 6
⎯
0
1
D15 input/output pin
PD7 input pin
PD7 output pin
PD7DDR
Pin Function
Mode 7
Table 8.56 PD6 Pin Function
Operating Mode
Modes 4 to 6
⎯
0
1
D14 input/output pin
PD6 input pin
PD6 output pin
PD6DDR
Pin Function
Mode 7
Table 8.57 PD5 Pin Function
Operating Mode
PD5DDR
Pin Function
Modes 4 to 6
Mode 7
⎯
0
1
D13 input/output pin
PD5 input pin
PD5 output pin
Rev.6.00 Jun. 03, 2008 Page 252 of 698
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Section 8 I/O Ports
Table 8.58 PD4 Pin Function
Operating Mode
Modes 4 to 6
⎯
0
1
D12 input/output pin
PD4 input pin
PD4 output pin
PD4DDR
Pin Function
Mode 7
Table 8.59 PD3 Pin Function
Operating Mode
Modes 4 to 6
⎯
0
1
D11 input/output pin
PD3 input pin
PD3 output pin
PD3DDR
Pin Function
Mode 7
Table 8.60 PD2 Pin Function
Operating Mode
Modes 4 to 6
⎯
0
1
D10 input/output pin
PD2 input pin
PD2 output pin
PD2DDR
Pin Function
Mode 7
Table 8.61 PD1 Pin Function
Operating Mode
PD1DDR
Pin Function
Modes 4 to 6
Mode 7
⎯
0
1
D9 input/output pin
PD1 input pin
PD1 output pin
Table 8.62 PD0 Pin Function
Operating Mode
PD0DDR
Pin Function
Modes 4 to 6
Mode 7
⎯
0
1
D8 input/output pin
PD0 input pin
PD0 output pin
Rev.6.00 Jun. 03, 2008 Page 253 of 698
REJ09B0074-0600
Section 8 I/O Ports
8.9.6
Port D Input Pull-Up MOS States
The port D has an on-chip input pull-up MOS function that can be controlled by software. The
input pull-up MOS can be used in mode 7, and can be specified as the on or off state for individual
bits.
Table 8.63 summarizes the input pull-up MOS states.
Table 8.63 Input Pull-Up MOS States (Port D)
Pins
Hardware
PowerStandby
Manual
On Reset Mode
Reset
Data input/output (modes 4 to 6), Off
port output (mode 7)
Off
Port input (mode 7)
On/Off
Legend:
Off: Input pull-up MOS is always off.
On/Off: On when PDDDR = 0 and PDPCR = 1; otherwise off.
Rev.6.00 Jun. 03, 2008 Page 254 of 698
REJ09B0074-0600
Software
Standby
Mode
In Other
Operations
Section 8 I/O Ports
8.10
Port E
The port E is an 8-bit I/O port also functioning as data bus (D7 to D0) I/O pins. The port E has the
following registers.
• Port E data direction register (PEDDR)
• Port E data register (PEDR)
• Port E register (PORTE)
• Port E pull-up MOS control register (PEPCR)
8.10.1
Port E Data Direction Register (PEDDR)
PEDDR specifies input or output for the pins of the port E.
Since PEDDR is a write-only register, the bit manipulation instructions must not be used to write
PEDDR. For details, see section 2.9.4, Accessing Registers Containing Write-Only Bits.
Bit
Bit Name Initial Value
R/W
Description
7
PE7DDR 0
W
(H8S/2218 Group)
6
PE6DDR 0
W
5
PE5DDR 0
W
4
PE4DDR 0
W
3
PE3DDR 0
W
2
PE2DDR 0
W
1
PE1DDR 0
W
0
PE0DDR 0
W
Modes 4 to 6:
When 8-bit bus mode is selected, port E functions as an
I/O port. Setting a PEDDR bit to 1 makes the
corresponding port E pin an output port, while clearing the
bit to 0 makes the pin an input port.
When 16-bit bus mode is selected, the input/output
direction settings in PEDDR are ignored, and port E pins
automatically function as data input/output pins.
For details on 8-bit/16-bit bus mode, refer to section 6,
Bus Controller.
Mode 7:
Setting a PEDDR bit to 1 makes the corresponding port E
pin an output port, while clearing the bit to 0 makes the
pin an input port.
(H8S/2212 Group)
Setting a PEDDR bit to 1 makes the corresponding port E
pin an output port, while clearing the bit to 0 makes the
pin an input port.
Rev.6.00 Jun. 03, 2008 Page 255 of 698
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Section 8 I/O Ports
8.10.2
Port E Data Register (PEDR)
PEDR stores output data for the port E pins.
Bit
Bit Name Initial Value
R/W
Description
7
PE7DR
0
R/W
6
PE6DR
0
R/W
Store output data for a pin that functions as a general
output port.
5
PE5DR
0
R/W
4
PE4DR
0
R/W
3
PE3DR
0
R/W
2
PE2DR
0
R/W
1
PE1DR
0
R/W
0
PE0DR
0
R/W
8.10.3
Port E Register (PORTE)
PORTE indicates the pin states of the port E.
Bit
Bit Name Initial Value
R/W
Description
7
PE7
6
PE6
⎯*
R
⎯*
R
PE5
⎯*
R
If the port E is read while PEDDR bits are set to 1, the
PEDR value is read. If the port E is read while PEDDR
bits are cleared to 0, the pin states are read.
5
4
PE4
⎯*
R
3
PE3
⎯*
R
2
PE2
⎯*
R
1
PE1
⎯*
R
0
PE0
⎯*
R
Note: * Determined by the states of pins PE7 to PE0.
Rev.6.00 Jun. 03, 2008 Page 256 of 698
REJ09B0074-0600
Section 8 I/O Ports
8.10.4
Port E Pull-Up MOS Control Register (PEPCR)
PEPCR controls the on/off state of the port E input pull-up MOS.
Bit
Bit Name Initial Value
R/W
Description
7
PE7PCR
0
R/W
6
PE6PCR
0
R/W
5
PE5PCR
0
R/W
When a pin functions as an input port, setting the
corresponding bit to 1 turns on the input pull-up MOS for
that pin.
4
PE4PCR
0
R/W
3
PE3PCR
0
R/W
2
PE2PCR
0
R/W
1
PE1PCR
0
R/W
0
PE0PCR
0
R/W
8.10.5
Pin Functions
Pin Functions of H8S/2218 Group
Port E pins also function as data bus (D7 to D0) I/O pins. The correspondence between the register
specification and the pin function is shown below.
Table 8.64 PE7 Pin Function
Operating Mode
Modes 4 to 6
Mode 7
⎯
Bus Mode
8-bit bus mode
PE7DDR
0
1
⎯
0
1
PE7
input pin
PE7
output pin
D7
input/output pin
PE7
input pin
PE7
output pin
Pin Function
16-bit bus mode
Table 8.65 PE6 Pin Function
Operating Mode
Modes 4 to 6
Mode 7
⎯
Bus Mode
8-bit bus mode
PE6DDR
0
1
⎯
0
1
PE6
input pin
PE6
output pin
D6
input/output pin
PE6
input pin
PE6
output pin
Pin Function
16-bit bus mode
Rev.6.00 Jun. 03, 2008 Page 257 of 698
REJ09B0074-0600
Section 8 I/O Ports
Table 8.66 PE5 Pin Function
Operating Mode
Modes 4 to 6
Mode 7
⎯
Bus Mode
8-bit bus mode
PE5DDR
0
1
⎯
0
1
PE5
input pin
PE5
output pin
D5
input/output pin
PE5
input pin
PE5
output pin
Pin Function
16-bit bus mode
Table 8.67 PE4 Pin Function
Operating Mode
Modes 4 to 6
Bus Mode
8-bit bus mode
⎯
16-bit bus mode
0
1
⎯
0
1
PE4
input pin
PE4
output pin
D4
input/output pin
PE4
input pin
PE4
output pin
PE4DDR
Pin Function
Mode 7
Table 8.68 PE3 Pin Function
Operating Mode
Modes 4 to 6
Mode 7
⎯
Bus Mode
8-bit bus mode
PE3DDR
0
1
⎯
0
1
PE3
input pin
PE3
output pin
D3
input/output pin
PE3
input pin
PE3
output pin
Pin Function
16-bit bus mode
Table 8.69 PE2 Pin Function
Operating Mode
Modes 4 to 6
Mode 7
⎯
Bus Mode
8-bit bus mode
PE2DDR
0
1
⎯
0
1
PE2
input pin
PE2
output pin
D2
input/output pin
PE2
input pin
PE2
output pin
Pin Function
Rev.6.00 Jun. 03, 2008 Page 258 of 698
REJ09B0074-0600
16-bit bus mode
Section 8 I/O Ports
Table 8.70 PE1 Pin Function
Operating Mode
Modes 4 to 6
Mode 7
⎯
Bus Mode
8-bit bus mode
PE1DDR
0
1
⎯
0
1
PE1
input pin
PE1
output pin
D1
input/output pin
PE1
input pin
PE1
output pin
Pin Function
16-bit bus mode
Table 8.71 PE0 Pin Function
Operating Mode
Modes 4 to 6
Bus Mode
8-bit bus mode
⎯
16-bit bus mode
0
1
⎯
0
1
PE0
input pin
PE0
output pin
D0
input/output pin
PE0
input pin
PE0
output pin
PE0DDR
Pin Function
Mode 7
Pin Functions of H8S/2212 Group
The port E function as a general I/O port. The correspondence between the register specification
and the pin function is shown below.
Table 8.72 PE7 Pin Function
PE7DDR
Pin Function
0
1
PE7 input pin
PE7 output pin
0
1
PE6 input pin
PE6 output pin
0
1
PE5 input pin
PE5 output pin
Table 8.73 PE6 Pin Function
PE6DDR
Pin Function
Table 8.74 PE5 Pin Function
PE5DDR
Pin Function
Rev.6.00 Jun. 03, 2008 Page 259 of 698
REJ09B0074-0600
Section 8 I/O Ports
Table 8.75 PE4 Pin Function
PE4DDR
Pin Function
0
1
PE4 input pin
PE4 output pin
0
1
PE3 input pin
PE3 output pin
0
1
PE2 input pin
PE2 output pin
0
1
PE1 input pin
PE1 output pin
0
1
PE0 input pin
PE0 output pin
Table 8.76 PE3 Pin Function
PE3DDR
Pin Function
Table 8.77 PE2 Pin Function
PE2DDR
Pin Function
Table 8.78 PE1 Pin Function
PE1DDR
Pin Function
Table 8.79 PE0 Pin Function
PE0DDR
Pin Function
8.10.6
Port E Input Pull-Up MOS States
The port E has an on-chip input pull-up MOS function that can be controlled by software. The
input pull-up MOS can be used in modes 4 to 6 and in 8-bit bus mode, or in mode 7, and can be
specified as the on or off state for individual bits.
Table 8.80 summarizes the input pull-up MOS states.
Rev.6.00 Jun. 03, 2008 Page 260 of 698
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Section 8 I/O Ports
Table 8.80 Input Pull-Up MOS States (Port E)
Power-On
Reset
Pins
Data input/output (16-bit
bus mode in modes 4 to
6), port output (8-bit bus
mode in modes 4 to 6,
mode 7)
Hardware
Standby
Mode
Off
Port input (8-bit bus
mode in modes 4 to 6,
mode 7)
Manual
Reset
Software
Standby
Mode
In Other
Operations
Off
On/Off
Legend:
Off: Input pull-up MOS is always off.
On/Off: On when PEDDR = 0 and PEPCR = 1; otherwise off.
8.11
Port F
In the H8S/2218 Group, the port F is an 8-bit I/O port also functioning as external interrupt input
(IRQ2, IRQ3) pins, bus control signal I/O pins, and system clock output pins. In the H8S/2212
Group, the port F is a 3-bit I/O port also functioning as external interrupt input (IRQ2, IRQ3) pins
and system clock output pins. The port F has the following registers.
• Port F data direction register (PFDDR)
• Port F data register (PFDR)
• Port F register (PORTF)
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Section 8 I/O Ports
8.11.1
Port F Data Direction Register (PFDDR)
PFDDR specifies input or output for the pins of the port F.
Since PFDDR is a write-only register, the bit manipulation instructions must not be used to write
PFDDR. For details, see section 2.9.4, Accessing Registers Containing Write-Only Bits.
Bit
Bit Name
Initial Value
1
7
PF7DDR
6
PF6DDR* 0
5
1/0*
R/W
Description
W
(H8S/2218 Group)
2
W
2
W
2
Modes 4 to 6:
Pin PF7 functions as the φ output pin when the PF7DDR
bit is set to 1, and as an input port when the bit is cleared
to 0. Pins PF6 to PF3 are automatically designated as bus
control output pins. Pins PF2 to PF0 are made bus control
input/output pins by bus controller settings. Otherwise,
setting a PFDDR bit to 1 makes the corresponding pin an
output port, while clearing the bit to 0 makes the pin an
input port.
PF5DDR* 0
4
PF4DDR* 0
W
3
PF3DDR
2
0
W
PF2DDR* 0
2
W
2
1
PF1DDR* 0
W
0
PF0DDR
W
0
Mode 7
Setting a PFDDR bit to 1 makes the corresponding port F
pin PF6 to PF0 an output port, or in the case of pin PF7,
the φ output pin. Clearing the bit to 0 makes the pin an
input port.
(H8S/2212 Group)
Setting a PFDDR bit to 1 makes the corresponding port F
pin PF6 to PF0 an output port, or in the case of pin PF7,
the φ output pin. Clearing the bit to 0 makes the pin an
input port.
Notes: 1. The initial value becomes 1 in modes 4 to 6 and 0 in mode 7.
2. Reserved in the H8S/2212 Group. If this bit is read, an undefined value will be read.
This bit cannot be modified.
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Section 8 I/O Ports
8.11.2
Port F Data Register (PFDR)
PFDR stores output data for the port F pins.
Bit
Bit Name Initial Value
R/W
Description
7
PF7DR
0
R/W
6
PF6DR*
0
R/W
Store output data for a pin that functions as a general
output port.
5
PF5DR*
0
R/W
4
PF4DR*
0
R/W
3
PF3DR
0
R/W
2
PF2DR*
0
R/W
1
PF1DR*
0
R/W
0
PF0DR
0
R/W
Note: * Reserved in the H8S/2212 Group. If this bit is read, an undefined value will be read. This bit
cannot be modified.
8.11.3
Port F Register (PORTF)
PORTF indicates the pin states of the port F.
Bit
Bit Name Initial Value
R/W
Description
If the port F is read while PFDDR bits are set to 1, the
PFDR value is read. If the port F is read while PFDDR bits
are cleared to 0, the pin states are read.
⎯*
R
2
⎯*
R
2
⎯*
R
2
PF4*
⎯*
R
3
PF3
2
PF2*
1
7
PF7
6
PF6*
5
PF5*
4
1
0
1
1
1
⎯*
R
2
⎯*
R
2
PF1*
⎯*
R
PF0
⎯*
R
1
1
1
1
Notes: 1. Determined by the states of pins PF7 to PF0.
2. Reserved in the H8S/2212 Group. If this bit is read, an undefined value will be read.
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Section 8 I/O Ports
8.11.4
Clock Output Control Register (OUTCR)
OUTCR specifies the clock frequency output from the PF7 pin.
Bit
Bit Name
7 to ⎯
3
Initial Value
R/W
Undefined
⎯
Description
Reserved
The write value should always be 0.
2
PF7OUT2 0
R/W
PF7 Pin Output Select 2 to 0
1
PF7OUT1 0
R/W
000: Main oscillation clock
0
PF7OUT0 0
R/W
001: Outputs 1/2 of main oscillation clock
010: Outputs 1/3 of main oscillation clock
011: Outputs 1/4 of main oscillation clock
1xx: Reserved
This function is not supported by the E6000 emulator.
φ in section 22, Electrical Characteristics is in the case
when PF7OUT2 to PF7OUT0 = 000.
8.11.5
Pin Functions
Pin Functions of H8S/2218 Group
The port F is an 8-bit I/O port. Port F pins also function as external interrupt input (IRQ2, IRQ3)
pins, bus control signal I/O pins, and system clock output (φ) pins. The correspondence between
the register specification and the pin functions is shown below.
Table 8.81 PF7 Pin Function
PF7DDR
0
PF7OUT2 to PF7OUT0
⎯
Pin Function
1
B'000
B'001
B'010
B'011
PF7 input pin φ output pin φ/2 output pin φ/3 output pin φ/4 output pin
Table 8.82 PF6 Pin Function
Operating Mode
PF6DDR
Pin Function
Modes 4 to 6
Mode 7
⎯
0
1
AS output pin
PF6 input pin
PF6 output pin
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Section 8 I/O Ports
Table 8.83 PF5 Pin Function
Operating Mode
Modes 4 to 6
⎯
0
1
RD output pin
PF5 input pin
PF5 output pin
PF5DDR
Pin Function
Mode 7
Table 8.84 PF4 Pin Function
Operating Mode
Modes 4 to 6
⎯
0
1
HWR output pin
PF4 input pin
PF4 output pin
PF4DDR
Pin Function
Mode 7
Table 8.85 PF3 Pin Function
Operating Mode
Modes 4 to 6
Mode 7
⎯
Bus Mode
16-bit bus
mode
PF3DDR
⎯
0
1
0
1
LWR
output pin
PF3
input pin
PF3
output pin
PF3
input pin
PF3
output pin
Pin Function
8-bit bus mode
ADTRG input pin*
1
IRQ3 input pin*
2
Notes: 1. ADTRG input pin when TRGS0 = TRGS1 = 1.
2. When this pin is used as an external interrupt input pin, this pin must not be used as an
I/O pin for another function.
Table 8.86 PF2 Pin Function
Operating Mode
Modes 4 to 6
WAITE
PF2DDR
Pin Function
0
Mode 7
⎯
1
0
1
⎯
0
1
PF2
input pin
PF2
output pin
WAIT
input pin
PF2
input pin
PF2
output pin
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Section 8 I/O Ports
Table 8.87 PF1 Pin Function
Operating Mode
Modes 4 to 6
BRLE
0
⎯
1
0
1
⎯
0
1
PF1
input pin
PF1
output pin
BACK
output pin
PF1
input pin
PF1
output pin
PF1DDR
Pin Function
Mode 7
Table 8.88 PF0 Pin Function
Operating Mode
Modes 4 to 6
BRLE
0
⎯
1
0
1
⎯
0
1
PF0
input pin
PF0
output pin
BREQ
input pin
PF0
input pin
PF0
output pin
PF0DDR
Pin Function
Mode 7
IRQ2 input pin*
Note: * When this pin is used as an external interrupt input pin, this pin must not be used as an I/O
pin for another function.
Pin Functions of H8S/2212 Group
The port F is a 3-bit I/O port. Port F pins also function as external interrupt input (IRQ2, IRQ3)
pins and system clock output (φ) pins. The correspondence between the register specification and
the pin functions is shown below.
Table 8.89 PF7 Pin Function
PF7DDR
0
PF7OUT2 to PF7OUT0
⎯
Pin Function
1
B'000
B'001
B'010
B'011
PF7 input pin φ output pin φ/2 output pin φ/3 output pin φ/4 output pin
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Section 8 I/O Ports
Table 8.90 PF3 Pin Function
PF3DDR
0
Pin Function
1
PF3 input pin
PF3 output pin
ADTRG input pin*
1
IRQ3 input pin*
2
Notes: 1. ADTRG input pin when TRGS0 = TRGS1 = 1.
2. When this pin is used as an external interrupt input pin, this pin must not be used as an
I/O pin for another function.
Table 8.91 PF0 Pin Function
PF0DDR
Pin Function
0
1
PF0 input pin
PF0 output pin
IRQ2 input pin*
Note: * When this pin is used as an external interrupt input pin, this pin must not be used as an I/O
pin for another function.
8.12
Port G
In the H8S/2218 Group, the port G is a 4-bit I/O port also functioning as external interrupt input
(IRQ7) pins and bus control output (CS0 to CS3) pins. In the H8S/2212 Group, the port G is a 2bit I/O port also functioning as external interrupt input (IRQ7) pins and H-UDI (TDI) pins. The
port G has the following registers.
• Port G data direction register (PGDDR)
• Port G data register (PGDR)
• Port G register (PORTG)
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Section 8 I/O Ports
8.12.1
Port G Data Direction Register (PGDDR)
PGDDR specifies input or output for the pins of the port G.
Since PGDDR is a write-only register, the bit manipulation instructions must not be used to write
PGDDR. For details, see section 2.9.4, Accessing Registers Containing Write-Only Bits.
Bit
Bit Name
7 to ⎯
5
4
3
Initial Value
R/W
Description
Undefined
⎯
Reserved
These bits are undefined and cannot be modified.
2
1
PG4DDR* 0/1*
2
PG3DDR* 0
2
W
(H8S/2218 Group)
W
Modes 4 to 6:
Setting a PGDDR bit to 1 makes the PG4 to PG1 pins bus
control signal output pins, while clearing the bit to 0
makes the pins input ports.
2
PG2DDR* 0
W
1
PG1DDR
W
0
Mode 7:
Setting a PGDDR bit to 1 makes the corresponding port G
pin an output port, while clearing the bit to 0 makes the
pin an input port.
(H8S/2212 Group)
Setting a PG1DDR bit to 1 makes the corresponding port
G pin an output port, while clearing the bit to 0 makes the
pin an input port.
0
3
PG0DDR* 0
W
(H8S/2212 Group)
When EMLE = 1: Pin PG0 function as the H-UDI (TDI)
pin.
When EMLE = 0: If a PG0DDR bit is set to 1, pin PG0
function as output ports. If a PG0DDR bit is cleared to 0,
pin PG0 function as input ports.
Notes: 1. The initial value becomes 1 in modes 4 and 5 and 0 in modes 6 and 7.
2. Reserved in the H8S/2212 Group. If this bit is read, an undefined value will be read.
This bit cannot be modified.
3. Reserved in the H8S/2218 Group. If this bit is read, an undefined value will be read.
This bit cannot be modified.
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Section 8 I/O Ports
8.12.2
Port G Data Register (PGDR)
PGDR stores output data for the port G pins.
Bit
Bit Name Initial Value
7 to ⎯
5
4
3
Undefined
R/W
⎯
Reserved
These bits are undefined and cannot be modified.
1
0
R/W
1
0
R/W
1
PG4DR*
PG3DR*
2
PG2DR*
0
R/W
1
PG1DR
0
R/W
0
R/W
0
Description
2
PG0DR*
Store output data for a pin that functions as a general
output port.
Notes: 1. Reserved in the H8S/2212 Group. If this bit is read, an undefined value will be read.
This bit cannot be modified.
2. Reserved in the H8S/2218 Group. If this bit is read, an undefined value will be read.
This bit cannot be modified.
8.12.3
Port G Register (PORTG)
PORTG indicates the pin states of the port G.
Bit
Bit Name Initial Value
7 to ⎯
5
Undefined
R/W
Description
⎯
Reserved
These bits are undefined.
2
⎯*
R
2
⎯*
R
2
PG2*
⎯*
R
1
PG1
⎯*
R
0
PG0*
⎯*
R
4
3
2
PG4*
PG3*
1
1
1
1
3
1
If the port G is read while PGDDR bits are set to 1, the
PGDR value is read. If the port G is read while PGDDR
bits are cleared to 0, the pin states are read.
Notes: 1. Determined by the states of pins PG4 to PG0.
2. Reserved in the H8S/2212 Group. If this bit is read, an undefined value will be read.
3. Reserved in the H8S/2218 Group. If this bit is read, an undefined value will be read.
Rev.6.00 Jun. 03, 2008 Page 269 of 698
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Section 8 I/O Ports
8.12.4
Pin Functions
Pin Functions of H8S/2218 Group
Port G pins also function as external interrupt input (IRQ7) pins and bus control signal output
(CS0 to CS3) pins. The correspondence between the register specification and the pin functions is
shown below.
Table 8.92 PG4 Pin Function
Operating Mode
Modes 4 to 6
PG4DDR
Pin Function
Mode 7
0
1
0
1
PG4 input pin
CS0 output pin
PG4 input pin
PG4 output pin
Table 8.93 PG3 Pin Function
Operating Mode
Modes 4 to 6
PG3DDR
Pin Function
Mode 7
0
1
0
1
PG3 input pin
CS1 output pin
PG3 input pin
PG3 output pin
Table 8.94 PG2 Pin Function
Operating Mode
Modes 4 to 6
PG2DDR
Pin Function
Mode 7
0
1
0
1
PG2 input pin
CS2 output pin
PG2 input pin
PG2 output pin
Table 8.95 PG1 Pin Function
Operating Mode
PG1DDR
Pin Function
Modes 4 to 6
Mode 7
0
1
0
1
PG1 input pin
CS3 output pin
PG1 input pin
PG1 output pin
IRQ7 input pin*
Note: * When this pin is used as an external interrupt input pin, this pin must not be used as an I/O
pin for another function.
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Section 8 I/O Ports
Pin Functions of H8S/2212 Group
Port G pins also function as external interrupt input (IRQ7) pins and H-UDI (TDI) pins. The
correspondence between the register specification and the pin functions is shown below.
Table 8.96 PG1 Pin Function
PG1DDR
Pin Function
0
1
PG1 input pin
PG1 output pin
IRQ7 input pin*
Note: * When this pin is used as an external interrupt input pin, this pin must not be used as an I/O
pin for another function.
Table 8.97 PG0 Pin Function
EMLE
0
PG0DDR
Pin Function
8.13
1
0
1
⎯
PG0 input pin
PG0 output pin
TDI input pin
Handling of Unused Pins
Unused input pins should be fixed high or low. Generally, the input pins of CMOS products are
high-impedance. Leaving unused pins open can cause the generation of intermediate levels due to
peripheral noise induction. This can result in shoot-through current inside the device and cause it
to malfunction. Table 8.98 lists examples of ways to handle unused pins. For the handling of
dedicated boundary scan pins that are unused, see section 13.2, Pin Configuration, and section
13.5, Usage Notes. Pins marked NC should be left open. For the handling of dedicated USB pins
that are unused, see section 14.8.14, Pin Processing when USB Not Used.
Rev.6.00 Jun. 03, 2008 Page 271 of 698
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Section 8 I/O Ports
Table 8.98 Examples of Ways to Handle Unused Input Pins
Port Name
Pin Handling Example
Port 1
Connect each pin to Vcc (pull-up) or to Vss (pull-down) via a resistor.
Port 3
Port 4
Connect each pin to AVcc (pull-up) or to AVss (pull-down) via a resistor.
Port 7
Connect each pin to Vcc (pull-up) or to Vss (pull-down) via a resistor.
Port 9
Connect each pin to AVcc (pull-up) or to AVss (pull-down) via a resistor.
Port A
Connect each pin to Vcc (pull-up) or to Vss (pull-down) via a resistor.
Port B*
* Ports B, C, and D apply to the H8S/2218 Group only.
Port C*
Port D*
Port E
Port F
Port G
Rev.6.00 Jun. 03, 2008 Page 272 of 698
REJ09B0074-0600
Section 9 16-Bit Timer Pulse Unit (TPU)
Section 9 16-Bit Timer Pulse Unit (TPU)
This LSI has an on-chip 16-bit timer pulse unit (TPU) that comprises three 16-bit timer channels.
The function list of the 16-bit timer unit and its block diagram are shown in table 9.1 and figure
9.1, respectively.
9.1
Features
• Maximum 8-pulse input/output
• Selection of 8 counter input clocks for each channel
• The following operations can be set for each channel
Waveform output at compare match, input capture function, counter clear operation,
simultaneous writing to multiple timer counters (TCNT), simultaneous clearing using compare
match or input capture, simultaneous input/output for individual registers using counter
synchronous operation, PWM output using user-defined duty, up to 7-phase PWM output by
combination with synchronous operation
• Buffer operation settable for channel 0
• Phase counting mode settable independently for each of channels 1 and 2
• Fast access via internal 16-bit bus
• 13 interrupt sources
• Automatic transfer of register data
• A/D converter conversion start trigger can be generated
• Module stop mode can be set
• Baud rate clock for the SCI0 can be generated
TIMTPU2C_000020020900
Rev.6.00 Jun. 03, 2008 Page 273 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
Legend:
TSTR:
TSYR:
TCR:
TMDR:
Timer start register
Timer synchro register
Timer control register
Timer mode register
TIOR(H, L):
TIER:
TSR:
TGR(A, B, C, D):
Timer I/O control registers (H, L)
Timer interrupt enable register
Timer status register
TImer general registers (A, B, C, D)
Figure 9.1 Block Diagram of TPU
Rev.6.00 Jun. 03, 2008 Page 274 of 698
REJ09B0074-0600
Internal data bus
A/D converter convertion
start signal
TCNT
TGRA
TGRB
TCNT
TGRA
TGRB
TCNT
TGRA
TGRB
TGRC
TGRD
Module data bus
Bus
interface
TSTR TSYR
Common
Channel 2
TCR TMDR
TIOR
TIER TSR
Channel 1
TCR TMDR
TIOR
TIER TSR
Channel 2:
Channel 0
Channel 1:
TIOCA0
TIOCB0
TIOCC0
TIOCD0
TIOCA1
TIOCB1
TIOCA2
TIOCB2
Control logic for channel 0 to 2
Input/output pins
Channel 0:
TCR TMDR
TIORH TIORL
TIER TSR
External clock:
φ/1
φ/4
φ/16
φ/64
φ/256
φ/1024
TCLKA
TCLKB
TCLKC
TCLKD
Control logic
Clock input
Internal clock:
Interrupt request signals
Channel 0: TGI0A
TGI0B
TGI0C
TGI0D
TCI0V
Channel 1: TGI1A
TGI1B
TCI1V
TCI1U
Channel 2: TGI2A
TGI2B
TCI2V
TCI2U
Section 9 16-Bit Timer Pulse Unit (TPU)
Table 9.1
TPU Functions
Item
Channel 0
Channel 1
Channel 2
Count clock
φ/1
φ/1
φ/1
φ/4
φ/4
φ/4
φ/16
φ/16
φ/16
φ/64
φ/64
φ/64
TCLKA
φ/256
φ/1024
TCLKB
TCLKA
TCLKA
TCLKC
TCLKB
TCLKB
TCLKD
General registers
TCLKC
TGRA_0
TGRA_1
TGRA_2
TGRB_0
TGRB_1
TGRB_2
General registers/buffer TGRC_0
registers
TGRD_0
–
–
I/O pins
TIOCA0
TIOCA1
TIOCA2
TIOCB0
TIOCB1
TIOCB2
TIOCC0
TIOCD0
Counter clear function
TGR compare match TGR compare match TGR compare match or
or input capture
or input capture
input capture
Compare
match
output
0 output
O
O
O
1 output
O
O
O
Toggle
output
O
O
O
O
O
O
Synchronous operation O
O
O
PWM mode
O
O
O
Phase counting mode
–
O
O
Buffer operation
O
–
–
Input capture function
Rev.6.00 Jun. 03, 2008 Page 275 of 698
REJ09B0074-0600
Section 9 16-Bit Timer Pulse Unit (TPU)
Item
Channel 0
Channel 1
Channel 2
DMAC activation
TGRA_0 compare
match or input capture
TGRA_1 compare
match or input capture
TGRA_2 compare
match or input capture
A/D converter trigger
TGRA_0 compare
match or input capture
TGRA_1 compare
match or input capture
TGRA_2 compare
match or input capture
Interrupt sources
5 sources
4 sources
4 sources
•
Compare match or
input capture 0A
•
Compare match or
input capture 1A
•
Compare match or
input capture 2A
•
Compare match or
input capture 0B
•
Compare match or
input capture 1B
•
Compare match or
input capture 2B
•
Compare match or
input capture 0C
•
Overflow
•
Overflow
•
Underflow
•
Underflow
•
Compare match or
input capture 0D
•
Overflow
Legend:
O: Possible
–: Not possible
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.2
Table 9.2
Input/Output Pins
Pin Configuration
Channel
Symbol
I/O
Function
All
TCLKA
Input
External clock A input pin
(Channel 1 phase counting mode A phase input)
TCLKB
Input
External clock B input pin
(Channel 1 phase counting mode B phase input)
TCLKC
Input
External clock C input pin
(Channel 2 phase counting mode A phase input)
TCLKD
Input
External clock D input pin
(Channel 2 phase counting mode B phase input)
TIOCA0
I/O
TGRA_0 input capture input/output compare
output/PWM output pin
TIOCB0
I/O
TGRB_0 input capture input/output compare
output/PWM output pin
TIOCC0
I/O
TGRC_0 input capture input/output compare
output/PWM output pin
TIOCD0
I/O
TGRD_0 input capture input/output compare
output/PWM output pin
TIOCA1
I/O
TGRA_1 input capture input/output compare
output/PWM output pin
TIOCB1
I/O
TGRB_1 input capture input/output compare
output/PWM output pin
TIOCA2
I/O
TGRA_2 input capture input/output compare
output/PWM output pin
TIOCB2
I/O
TGRA_2 input capture input/output compare
output/PWM output pin
0
1
2
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.3
Register Descriptions
The TPU has the following registers.
• Timer control register_0 (TCR_0)
• Timer mode register_0 (TMDR_0)
• Timer I/O control register H_0 (TIORH_0)
• Timer I/O control register L_0 (TIORL_0)
• Timer interrupt enable register_0 (TIER_0)
• Timer status register_0 (TSR_0)
• Timer counter_0 (TCNT_0)
• Timer general register A_0 (TGRA_0)
• Timer general register B_0 (TGRB_0)
• Timer general register C_0 (TGRC_0)
• Timer general register D_0 (TGRD_0)
• Timer control register_1 (TCR_1)
• Timer mode register_1 (TMDR_1)
• Timer I/O control register _1 (TIOR_1)
• Timer interrupt enable register_1 (TIER_1)
• Timer status register_1 (TSR_1)
• Timer counter_1 (TCNT_1)
• Timer general register A_1 (TGRA_1)
• Timer general register B_1 (TGRB_1)
• Timer control register_2 (TCR_2)
• Timer mode register_2 (TMDR_2)
• Timer I/O control register_2 (TIOR_2)
• Timer interrupt enable register_2 (TIER_2)
• Timer status register_2 (TSR_2)
• Timer counter_2 (TCNT_2)
• Timer general register A_2 (TGRA_2)
• Timer general register B_2 (TGRB_2)
Common Registers
• Timer start register (TSTR)
• Timer synchro register (TSYR)
Rev.6.00 Jun. 03, 2008 Page 278 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.3.1
Timer Control Register (TCR)
The TCR registers control the TCNT operation for each channel. The TPU has a total of three TCR
registers, one for each channel (channel 0 to 2). TCR register settings should be made only when
TCNT operation is stopped.
Bit
Bit Name Initial value
R/W
Description
7
CCLR2
0
R/W
Counter Clear 2 to 0
6
CCLR1
0
R/W
5
CCLR0
0
R/W
These bits select the TCNTcounter clearing source. See
tables 9.3 and 9.4 for details.
4
CKEG1
0
R/W
Clock Edge 1 and 0
3
CKEG0
0
R/W
These bits select the input clock edge. When the internal
clock is counted using both edges, the input clock
frequency is halved (e.g., φ/4 both edges = φ/2 rising
edge). If phase counting mode is used on channels 1, 2,
4, and 5, this setting is ignored and the phase counting
mode setting has priority. Internal clock edge selection is
valid when the input clock is φ/4 or slower. If φ/1 is
selected as the input clock, this setting is ignored and
count at falling edge of φ is selected.
00: Count at rising edge
01: Count at falling edge
1×: Count at both edges
Legend:
×: Don’t care
2
TPSC2
0
R/W
Time Prescaler 2 to 0
1
TPSC1
0
R/W
0
TPSC0
0
R/W
These bits select the TCNT counter clock. The clock
source can be selected independently for each channel.
See tables 9.5 to 9.7 for details.
Rev.6.00 Jun. 03, 2008 Page 279 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
Table 9.3
CCLR2 to CCLR0 (channel 0)
Bit 7
Bit 6
Bit 5
Channel
CCLR2
CCLR1
CCLR0
Description
0
0
0
0
TCNT clearing disabled
1
TCNT cleared by TGRA compare
match/input capture
0
TCNT cleared by TGRB compare
match/input capture
1
TCNT cleared by counter clearing for
another channel performing synchronous
1
clearing/synchronous operation*
0
TCNT clearing disabled
1
TCNT cleared by TGRC compare
2
match/input capture*
0
TCNT cleared by TGRD compare
2
match/input capture*
1
TCNT cleared by counter clearing for
another channel performing synchronous
1
clearing/synchronous operation*
1
1
0
1
Notes: 1. Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1.
2. When TGRC or TGRD is used as a buffer register. TCNT is not cleared because the
buffer register setting has priority, and compare match/input capture dose not occur.
Table 9.4
CCLR2 to CCLR0 (channels 1 and 2)
Bit 7
2
Bit 6
Bit 5
Channel
Reserved*
CCLR1
CCLR0
Description
1, 2
0
0
0
TCNT clearing disabled
1
TCNT cleared by TGRA compare
match/input capture
0
TCNT cleared by TGRB compare
match/input capture
1
TCNT cleared by counter clearing for
another channel performing synchronous
1
clearing/synchronous operation*
1
Notes: 1. Synchronous operation setting is performed by setting the SYNC bit in TSYR to 1.
2. Bit 7 is reserved in channels 1 and 2. It is always read as 0 and cannot be modified.
Rev.6.00 Jun. 03, 2008 Page 280 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
Table 9.5
TPSC2 to TPSC0 (channel 0)
Bit 2
Bit 1
Bit 0
Channel
TPSC2
TPSC1
TPSC0
Description
0
0
0
0
Internal clock: counts on φ/1
1
Internal clock: counts on φ/4
0
Internal clock: counts on φ/16
1
Internal clock: counts on φ/64
0
External clock: counts on TCLKA pin input
1
External clock: counts on TCLKB pin input
0
External clock: counts on TCLKC pin input
1
External clock: counts on TCLKD pin input
1
1
0
1
Table 9.6
TPSC2 to TPSC0 (channel 1)
Bit 2
Bit 1
Bit 0
Channel
TPSC2
TPSC1
TPSC0
Description
1
0
0
0
Internal clock: counts on φ/1
1
Internal clock: counts on φ/4
0
Internal clock: counts on φ/16
1
Internal clock: counts on φ/64
0
External clock: counts on TCLKA pin input
1
External clock: counts on TCLKB pin input
0
Internal clock: counts on φ/256
1
Setting prohibited
1
1
0
1
Note: This setting is ignored when channel 1 is in phase counting mode.
Rev.6.00 Jun. 03, 2008 Page 281 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
Table 9.7
TPSC2 to TPSC0 (channel 2)
Bit 2
Bit 1
Bit 0
Channel
TPSC2
TPSC1
TPSC0
Description
2
0
0
0
Internal clock: counts on φ/1
1
Internal clock: counts on φ/4
0
Internal clock: counts on φ/16
1
Internal clock: counts on φ/64
0
External clock: counts on TCLKA pin input
1
External clock: counts on TCLKB pin input
1
1
0
1
0
External clock: counts on TCLKC pin input
1
Internal clock: counts on φ/1024
Note: This setting is ignored when channel 1 is in phase counting mode.
9.3.2
Timer Mode Register (TMDR)
The TMDR registers are used to set the operating mode for each channel. The TPU has three
TMDR registers, one for each channel. TMDR register settings should be made only when TCNT
operation is stopped.
Bit
Bit Name
Initial value
R/W
Description
7, 6
—
All 1
—
Reserved
These bits are always read as 1 and cannot be modified.
5
BFB
0
R/W
Buffer Operation B
Specifies whether TGRB is to operate in the normal way,
or TGRB and TGRD are to be used together for buffer
operation. When TGRD is used as a buffer register.
TGRD input capture/output compare is not generation. In
channels 1 and 2, which have no TGRD, bit 5 is reserved.
It is always read as 0 and cannot be modified.
0: TGRB operates normally
1: TGRB and TGRD used together for buffer operation
Rev.6.00 Jun. 03, 2008 Page 282 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
Bit
Bit Name Initial value
R/W
Description
4
BFA
R/W
Buffer Operation A
0
Specifies whether TGRA is to operate in the normal way,
or TGRA and TGRC are to be used together for buffer
operation. When TGRC is used as a buffer register,
TGRC input capture/output compare is not generated. In
channels 1 and 2, which have no TGRC, bit 4 is reserved.
It is always read as 0 and cannot be modified.
0: TGRA operates normally
1: TGRA and TGRC used together for buffer operation
3
MD3
0
R/W
Modes 3 to 0
2
MD2
0
R/W
These bits are used to set the timer operating mode.
1
MD1
0
R/W
0
MD0
0
R/W
MD3 is a reserved bit. In a write, the write value should
always be 0. See table 9.8, for details.
Table 9.8
MD3 to MD0
Bit 3
Bit2
1
2
Bit 1
Bit 0
MD3*
MD2*
MD1
MD0
Description
0
0
0
0
Normal operation
1
Reserved
0
PWM mode 1
1
PWM mode 2
0
Phase counting mode 1
1
Phase counting mode 2
0
Phase counting mode 3
1
Phase counting mode 4
×
—
1
1
0
1
1
×
×
Legend:
×: Don’t care
Notes: 1. MD3 is reserved bit. In a write, it should be written with 0.
2. Phase counting mode cannot be set for channels 0 and 3. In this case, 0 should always
be written to MD2.
Rev.6.00 Jun. 03, 2008 Page 283 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.3.3
Timer I/O Control Register (TIOR)
The TIOR registers control the TGR registers. The TPU has eight TIOR registers, two each for
channels 0, and one each for channels 1 and 2. Care is required since TIOR is affected by the
TMDR setting. The initial output specified by TIOR is valid when the counter is stopped (the CST
bit in TSTR is cleared to 0). Note also that, in PWM mode 2, the output at the point at which the
counter is cleared to 0 is specified. When TGRC or TGRD is designated for buffer operation, this
setting is invalid and the register operates as a buffer register.
• TIORH_0, TIOR_1, TIOR_2
Bit
Bit Name Initial value
R/W
Description
7
IOB3
0
R/W
I/O Control B3 to B0
6
IOB2
0
R/W
Specify the function of TGRB.
5
IOB1
0
R/W
4
IOB0
0
R/W
3
IOA3
0
R/W
I/O Control A3 to A0
2
IOA2
0
R/W
Specify the function of TGRA.
1
IOA1
0
R/W
0
IOA0
0
R/W
Bit
Bit Name Initial value
R/W
Description
7
IOD3
0
R/W
I/O Control D3 to D0
6
IOD2
0
R/W
Specify the function of TGRD.
5
IOD1
0
R/W
4
IOD0
0
R/W
3
IOC3
0
R/W
I/O Control C3 to C0
2
IOC2
0
R/W
Specify the function of TGRC.
1
IOC1
0
R/W
0
IOC0
0
R/W
• TIORL_0
Rev.6.00 Jun. 03, 2008 Page 284 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
Table 9.9
TIORH_0 (channel 0)
Description
Bit 7
Bit 6
Bit 5
Bit 4
TGRB_0
IOB3
IOB2
IOB1
IOB0
Function
TIOCB0 Pin Function
0
0
0
0
Output
compare
register
Output disabled
1
Initial output is 0 output
0 output at compare match
1
0
Initial output is 0 output
1 output at compare match
1
Initial output is 0 output
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1 output
0 output at compare match
1
0
Initial output is 1 output
1 output at compare match
1
Initial output is 1 output
Toggle output at compare match
1
0
1
0
0
Input capture
register
Capture input source is TIOCB0 pin
Input capture at rising edge
1
Capture input source is TIOCB0 pin
Input capture at falling edge
1
×
Capture input source is TIOCB0 pin
Input capture at both edges
×
×
Setting prohibited
Legend:
×: Don’t care
Rev.6.00 Jun. 03, 2008 Page 285 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
Table 9.10 TIORH_0 (channel 0)
Description
Bit 3
Bit 2
Bit 1
Bit 0
TGRA_0
IOA3
IOA2
IOA1
IOA0
Function
TIOCA0 Pin Function
0
0
0
0
Output
compare
register
Output disabled
1
Initial output is 0 output
0 output at compare match
1
0
Initial output is 0 output
1
Initial output is 0 output
1 output at compare match
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1 output
0 output at compare match
1
0
Initial output is 1 output
1 output at compare match
1
Initial output is 1 output
Toggle output at compare match
1
0
0
0
1
Input capture
register
Capture input source is TIOCA0 pin
Input capture at rising edge
Capture input source is TIOCA0 pin
Input capture at falling edge
1
×
Capture input source is TIOCA0 pin
Input capture at both edges
1
×
×
Legend:
×: Don’t care
Rev.6.00 Jun. 03, 2008 Page 286 of 698
REJ09B0074-0600
Setting prohibited
Section 9 16-Bit Timer Pulse Unit (TPU)
Table 9.11 TIORL_0 (channel 0)
Description
Bit 7
Bit 6
Bit 5
Bit 4
TGRD_0
IOD3
IOD2
IOD1
IOD0
Function
TIOCD0 Pin Function
0
0
0
0
Output
Compare
register*
Output disabled
1
Initial output is 0 output
0 output at compare match
1
0
Initial output is 0 output
1 output at compare match
1
Initial output is 0 output
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1 output
0 output at compare match
1
0
Initial output is 1 output
1
Initial output is 1 output
Toggle output at compare match
1
0
1
0
0
Input capture
register*
Capture input source is TIOCD0 pin
Input capture at rising edge
1
Capture input source is TIOCD0 pin
Input capture at falling edge
1
×
Capture input source is TIOCD0 pin
Input capture at both edges
×
×
Setting prohibited
Legend:
×: Don’t care
Note: * When the BFB bit in TMDR_0 is set to 1 and TGRD_0 is used as a buffer register, this
setting is invalid and input capture/output compare is not generated.
Rev.6.00 Jun. 03, 2008 Page 287 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
Table 9.12 TIORL_0 (channel 0)
Description
Bit 3
Bit 2
Bit 1
Bit 1
TGRC_0
IOC3
IOC2
IOC1
IOC0
Function
TIOCC0 Pin Function
0
0
0
0
Output
compare
register*
Output disabled
1
Initial output is 0 output
0 output at compare match
1
0
Initial output is 0 output
1 output at compare match
1
Initial output is 0 output
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1 output
0 output at compare match
1
0
Initial output is 1 output
1 output at compare match
1
Initial output is 1 output
Toggle output at compare match
1
0
1
0
0
Input capture
register*
Capture input source is TIOCC0 pin
Input capture at rising edge
1
Capture input source is TIOCC0 pin
Input capture at falling edge
1
×
Capture input source is TIOCC0 pin
Input capture at both edges
×
×
Setting prohibited
Legend:
×: Don’t care
Note: * When the BFA bit in TMDR_0 is set to 1and TGRC_0 is used as a buffer register, this
setting is invalid and input capture/output compare is not generated.
Rev.6.00 Jun. 03, 2008 Page 288 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
Table 9.13 TIOR_1 (channel 1)
Description
Bit 7
Bit 6
Bit 5
Bit 4
TGRB_1
IOB3
IOB2
IOB1
IOB0
Function
TIOCB1 Pin Function
0
0
0
0
Output
compare
register
Output disabled
1
Initial output is 0 output
0 output at compare match
1
0
Initial output is 0 output
1 output at compare match
1
Initial output is 0 output
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1 output
0 output at compare match
1
0
Initial output is 1 output
1 output at compare match
1
Initial output is 1 output
Toggle output at compare match
1
0
1
0
0
Input capture
register
Capture input source is TIOCB1 pin
Input capture at rising edge
1
Capture input source is TIOCB1 pin
Input capture at falling edge
1
×
Capture input source is TIOCB1 pin
Input capture at both edges
×
×
Setting prohibited
Legend:
×: Don’t care
Rev.6.00 Jun. 03, 2008 Page 289 of 698
REJ09B0074-0600
Section 9 16-Bit Timer Pulse Unit (TPU)
Table 9.14 TIOR_1 (channel 1)
Description
Bit 3
Bit 2
Bit 1
Bit 0
TGRA_1
IOA3
IOA2
IOA1
IOA0
Function
TIOCA1 Pin Function
0
0
0
0
Output
compare
register
Output disabled
1
Initial output is 0 output
0 output at compare match
1
0
Initial output is 0 output
1
Initial output is 0 output
1 output at compare match
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1 output
0 output at compare match
1
0
Initial output is 1 output
1 output at compare match
1
Initial output is 1 output
Toggle output at compare match
1
0
1
0
0
Input capture
register
Capture input source is TIOCA1 pin
Input capture at rising edge
1
Capture input source is TIOCA1 pin
Input capture at falling edge
1
×
Capture input source is TIOCA1 pin
Input capture at both edges
×
×
Setting prohibited
Legend:
×: Don’t care
Rev.6.00 Jun. 03, 2008 Page 290 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
Table 9.15 TIOR_2 (channel 2)
Description
Bit 7
Bit 6
Bit 5
Bit 4
TGRB_2
IOB3
IOB2
IOB1
IOB0
Function
TIOCB2 Pin Function
0
0
0
0
Output
compare
register
Output disabled
1
Initial output is 0 output
0 output at compare match
1
0
Initial output is 0 output
1 output at compare match
1
Initial output is 0 output
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1 output
0 output at compare match
1
0
Initial output is 1 output
1 output at compare match
1
Initial output is 1 output
Toggle output at compare match
1
×
0
1
0
Input capture
register
Capture input source is TIOCB2 pin
Input capture at rising edge
1
Capture input source is TIOCB2 pin
Input capture at falling edge
×
Capture input source is TIOCB2 pin
Input capture at both edges
Legend:
×: Don’t care
Rev.6.00 Jun. 03, 2008 Page 291 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
Table 9.16 TIOR_2 (channel 2)
Description
Bit 3
Bit 2
Bit 1
Bit 0
TGRA_2
IOA3
IOA2
IOA1
IOA0
Function
TIOCA2 Pin Function
0
0
0
0
Output
compare
register
Output disabled
1
Initial output is 0 output
0 output at compare match
1
0
Initial output is 0 output
1
Initial output is 0 output
1 output at compare match
Toggle output at compare match
1
0
0
Output disabled
1
Initial output is 1 output
0 output at compare match
1
0
Initial output is 1 output
1 output at compare match
1
Initial output is 1 output
Toggle output at compare match
1
×
0
1
0
Input capture
register
Capture input source is TIOCA2 pin
Input capture at rising edge
1
Capture input source is TIOCA2 pin
Input capture at falling edge
×
Capture input source is TIOCA2 pin
Input capture at both edges
Legend:
×: Don’t care
Rev.6.00 Jun. 03, 2008 Page 292 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.3.4
Timer Interrupt Enable Register (TIER)
The TIER registers control enabling or disabling of interrupt requests for each channel. The TPU
has three TIER registers, one for each channel.
Bit
Bit Name Initial value
R/W
Description
7
TTGE
R/W
A/D Conversion Start Request Enable
0
Enables or disables generation of A/D conversion start
requests by TGRA input capture/compare match.
0: A/D conversion start request generation disabled
1: A/D conversion start request generation enabled
6
–
1
–
Reserved
This bit is always read as 1 and cannot be modified.
5
TCIEU
0
R/W
Underflow Interrupt Enable
Enables or disables interrupt requests (TCU) by the TCFU
flag when the TCFU flag in TSR is set to 1 in channels 1
and 2. In channel 0, bit 5 is reserved.
0: Interrupt requests (TCIU) by TCFU disabled
1: Interrupt requests (TCIU) by TCFU enabled
4
TCIEV
0
R/W
Overflow Interrupt Enable
Enables or disables interrupt requests (TCIV) by the
TCFV flag when the TCFV flag in TSR is set to 1.
0: Interrupt requests (TCIV) by TCFV disabled
1: Interrupt requests (TCIV) by TCFV enabled
3
TGIED
0
R/W
TGR Interrupt Enable D
Enables or disables interrupt requests (TGID) by the
TGFD bit when the TGFD bit in TSR is set to 1 in channel
0. In channels 1 and 2, bit 3 is reserved. It is always read
as 0 and cannot be modified.
0: Interrupt requests (TGID) by TGFD disabled
1: Interrupt requests (TGID) by TGFD enabled.
2
TGIEC
0
R/W
TGR Interrupt Enable C
Enables or disables interrupt requests (TGIC) by the
TGFC bit when the TGFC bit in TSR is set to 1 in channel
0. In channels 1 and 2, bit 2 is reserved. It is always read
as 0 and cannot be modified.
0: Interrupt requests (TGIC) by TGFC disabled
1: Interrupt requests (TGIC) by TGFC enabled
Rev.6.00 Jun. 03, 2008 Page 293 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
Bit
Bit Name Initial value
R/W
Description
1
TGIEB
R/W
TGR Interrupt Enable B
0
Enables or disables interrupt requests (TGIB) by the
TGFB bit when the TGFB bit in TSR is set to 1.
0: Interrupt requests (TGIB) by TGFB disabled
1: Interrupt requests (TGIB) by TGFB enabled
0
TGIEA
0
R/W
TGR Interrupt Enable A
Enables or disables interrupt requests (TGIA) by the
TGFA bit when the TGFA bit in TSR is set to 1.
0: Interrupt requests (TGIA) by TGFA disabled
1: Interrupt requests (TGIA) by TGFA enabled
9.3.5
Timer Status Register (TSR)
The TSR registers indicate the status of each channel. The TPU has three TSR registers, one for
each channel.
Bit
Bit Name Initial value
R/W
Description
7
TCFD
R
Count Direction Flag
1
Status flag that shows the direction in which TCNT counts
in channel 1 and 2. In channel 0, bit 7 is reserved. It is
always read as 0 and cannot be modified.
0: TCNT counts down
1: TCNT counts up
6
–
1
–
Reserved
This bit is always read as 1 and cannot be modified.
5
TCFU
0
R/(W)* Underflow Flag
Status flag that indicates that TCNT underflow has
occurred when channels 1 and 2 are set to phase
counting mode. The write value should always be 0 to
clear this flag. In channel 0, bit 5 is reserved.
[Setting condition]
When the TCNT value underflows (change from H'0000
to H'FFFF)
[Clearing condition]
When 0 is written to TCFU after reading TCFU = 1
Rev.6.00 Jun. 03, 2008 Page 294 of 698
REJ09B0074-0600
Section 9 16-Bit Timer Pulse Unit (TPU)
Bit
Bit Name Initial value
R/W
4
TCFV
R/(W)* Overflow Flag
0
Description
Status flag that indicates that TCNT overflow has
occurred. The write value should always be 0 to clear this
flag.
[Setting condition]
When the TCNT value overflows (change from H'FFFF
to H'0000)
[Clearing condition]
When 0 is written to TCFV after reading TCFV = 1
3
TGFD
0
R/(W)* Input Capture/Output Compare Flag D
Status flag that indicates the occurrence of TGRD input
capture or compare match in channel 0. The write value
should always be 0 to clear this flag. In channels 1 and 2,
bit 3 is reserved. It is always read as 0 and cannot be
modified.
[Setting conditions]
•
When TCNT = TGRD while TGRD is functioning as
output compare register
•
When TCNT value is transferred to TGRD by input
capture signal while TGRD is functioning as input
capture register
[Clearing condition]
When 0 is written to TGFD after reading TGFD = 1
2
TGFC
0
R/(W)* Input Capture/Output Compare Flag C
Status flag that indicates the occurrence of TGRC input
capture or compare match in channel 0. The write value
should always be 0 to clear this flag. In channels 1 and 2,
bit 2 is reserved. It is always read as 0 and cannot be
modified.
[Setting conditions]
•
When TCNT = TGRC while TGRC is functioning as
output compare register
•
When TCNT value is transferred to TGRC by input
capture signal while TGRC is functioning as input
capture register
[Clearing condition]
When 0 is written to TGFC after reading TGFC = 1
Rev.6.00 Jun. 03, 2008 Page 295 of 698
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Section 9 16-Bit Timer Pulse Unit (TPU)
Bit
Bit Name Initial value
R/W
1
TGFB
R/(W)* Input Capture/Output Compare Flag B
0
Description
Status flag that indicates the occurrence of TGRB input
capture or compare match. The write value should always
be 0 to clear this flag.
[Setting conditions]
•
When TCNT = TGRB while TGRB is functioning as
output compare register
•
When TCNT value is transferred to TGRB by input
capture signal while TGRB is functioning as input
capture register
[Clearing condition]
When 0 is written to TGFB after reading TGFB = 1
0
TGFA
0
R/(W)* Input Capture/Output Compare Flag A
Status flag that indicates the occurrence of TGRA input
capture or compare match. The write value should always
be 0 to clear this flag.
[Setting conditions]
•
When TCNT = TGRA while TGRA is functioning as
output compare register
•
When TCNT value is transferred to TGRA by input
capture signal while TGRA is functioning as input
capture register
[Clearing conditions]
Note:
*
•
When DMAC is activated by TGIA interrupt while DTA
bit of DMABCR in DMAC is 1
•
When 0 is written to TGFA after reading TGFA = 1
Only 0 can be written to clear the flags.
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.3.6
Timer Counter (TCNT)
The TCNT registers are 16-bit counters. The TPU has three TCNT counters, one for each channel.
The TCNT counters are initialized to H'0000 by a reset, and in hardware standby mode. The
TCNT counters cannot be accessed in 8-bit units; they must always be accessed as a 16-bit unit.
9.3.7
Timer General Register (TGR)
The TGR registers are 16-bit registers with a dual function as output compare and input capture
registers. The TPU has 16 TGR registers, four each for channel 0 and two each for channels 1 and
2. TGRC and TGRD for channel 0 can also be designated for operation as buffer registers. The
TGR registers cannot be accessed in 8-bit units; they must always be accessed as a 16-bit unit.
TGR buffer register combinations are TGRA—TGRC and TGRB—TGRD.
9.3.8
Timer Start Register (TSTR)
TSTR is an 8-bit readable/writable register that selects operation/stoppage for channels 0 to 2.
When setting the operating mode in TMDR or setting the count clock in TCR, first stop the TCNT
counter.
Bit
Bit Name Initial Value
R/W
Description
–
Reserved
7 to –
3
All 0
2
CST2
0
R/W
Counter Start 2 to 0 (CST2 to CST0)
1
CST1
0
R/W
These bits select operation or stoppage for TCNT.
0
CST0
0
R/W
If 0 is written to the CST bit during operation with the
TIOC pin designated for output, the counter stops but the
TIOC pin output compare output level is retained.
The write value should always be 0.
If TIOR is written to when the CST bit is cleared to 0, the
pin output level will be changed to the set initial output
value.
0: TCNT_2 to TCNT_0 count operation is stopped
1: TCNT_2 to TCNT_0 performs count operation
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.3.9
Timer Synchro Register (TSYR)
TSYR selects independent operation or synchronous operation for the channel 0 to 2 TCNT
counters. A channel performs synchronous operation when the corresponding bit in TSYR is set to
1.
Bit
Bit Name Initial Value
R/W
Description
–
Reserved
7 to –
3
All 0
2
SYNC2
0
R/W
Timer Synchro 2 to 0
1
SYNC1
0
R/W
0
SYNC0
0
R/W
These bits select whether operation is independent of or
synchronized with other channels.
When synchronous operation is selected, synchronous
presetting of multiple channels, and synchronous clearing
through counter clearing on another channel are possible.
To set synchronous operation, the SYNC bits for at least
two channels must be set to 1. To set synchronous
clearing, in addition to the SYNC bit, the TCNT clearing
source must also be set by means of bits CCLR2 to
CCLR0 in TCR.
The write value should always be 0.
0: TCNT_2 to TCNT_0 operates independently
(TCNT presetting /clearing is unrelated to other
channels)
1: TCNT_2 to TCNT_0 performs synchronous operation
TCNT synchronous presetting/synchronous clearing is
possible
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.4
9.4.1
Interface to Bus Master
16-Bit Registers
TCNT and TGR are 16-bit registers. As the data bus to the bus master is 16 bits wide, these
registers can be read and written to in 16-bit units.
These registers cannot be read from or written to in 8-bit units; 16-bit access must always be used.
An example of 16-bit register access operation is shown in figure 9.2.
Internal data bus
H
Bus
master
L
Module
data bus
Bus interface
TCNTH
TCNTL
Figure 9.2 16-Bit Register Access Operation [Bus Master ↔ TCNT (16 Bits)]
9.4.2
8-Bit Registers
Registers other than TCNT and TGR are 8-bit. As the data bus to the CPU is 16 bits wide, these
registers can be read and written to in 16-bit units. They can also be read and written to in 8-bit
units.
Examples of 8-bit register access operation are shown in figures 9.3 to 9.5.
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Section 9 16-Bit Timer Pulse Unit (TPU)
Internal data bus
H
Bus
master
L
Module
data bus
Bus interface
TCR
Figure 9.3 8-Bit Register Access Operation [Bus Master ↔ TCR (Upper 8 Bits)]
Internal data bus
H
Bus
master
L
Module
data bus
Bus interface
TMDR
Figure 9.4 8-Bit Register Access Operation [Bus Master ↔ TMDR (Lower 8 Bits)]
Internal data bus
H
Bus
master
L
Module
data bus
Bus interface
TCR
TMDR
Figure 9.5 8-Bit Register Access Operation [Bus Master ↔ TCR and TMDR (16 Bits)]
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.5
Operation
9.5.1
Basic Functions
Each channel has a TCNT and TGR. TCNT performs up-counting, and is also capable of freerunning operation, synchronous counting, and external event counting. Each TGR can be used as
an input capture register or output compare register.
Counter Operation: When one of bits CST0 to CST2 is set to 1 in TSTR, the TCNT counter for
the corresponding channel starts counting. TCNT can operate as a free-running counter, periodic
counter, and so on.
1. Example of count operation setting procedure
Figure 9.6 shows an example of the count operation setting procedure.
Operation selection
Select counter clock
[1]
Periodic counter
Select counter clearing source
Select output compare register
Set period
Start count operation
<Periodic counter>
Free-running counter
[2]
[3]
[4]
[5]
Start count operation
<Free-running counter>
[1] Select the counter
clock with bits
TPSC2 to TPSC0 in
TCR. At the same
time, select the
input clock edge
with bits CKEG1
and CKEG0 in TCR.
[2] For periodic counter
operation, select the
TGR to be used as
the TCNT clearing
source with bits
CCLR2 to CCLR0 in
TCR.
[3] Designate the TGR
selected in [2] as an
output compare
register by means of
TIOR.
[4] Set the periodic
counter cycle in the
TGR selected in [2].
[5] Set the CST bit in
TSTR to 1 to start
the counter
operation.
Figure 9.6 Example of Counter Operation Setting Procedure
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Section 9 16-Bit Timer Pulse Unit (TPU)
2. Free-running count operation and periodic count operation
Immediately after a reset, the TPU's TCNT counters are all designated as free-running
counters. When the relevant bit in TSTR is set to 1 the corresponding TCNT counter starts upcount operation as a free-running counter. When TCNT overflows (from H'FFFF to H'0000),
the TCFV bit in TSR is set to 1. If the value of the corresponding TCIEV bit in TIER is 1 at
this point, the TPU requests an interrupt. After overflow, TCNT starts counting up again from
H'0000. Figure 9.7 illustrates free-running counter operation.
TCNT value
H'FFFF
H'0000
Time
CST bit
TCFV
Figure 9.7 Free-Running Counter Operation
When compare match is selected as the TCNT clearing source, the TCNT counter for the
relevant channel performs periodic count operation. The TGR register for setting the period is
designated as an output compare register, and counter clearing by compare match is selected by
means of bits CCLR2 to CCLR0 in TCR. After the settings have been made, TCNT starts upcount operation as periodic counter when the corresponding bit in TSTR is set to 1. When the
count value matches the value in TGR, the TGF bit in TSR is set to 1 and TCNT is cleared to
H'0000. If the value of the corresponding TGIE bit in TIER is 1 at this point, the TPU requests
an interrupt. After a compare match, TCNT starts counting up again from H'0000. Figure 9.8
illustrates periodic counter operation.
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Section 9 16-Bit Timer Pulse Unit (TPU)
Counter cleared by TGR
compare match
TCNT value
TGR
H'0000
Time
CST bit
Flag cleared by software or
DMAC activation
TGF
Figure 9.8 Periodic Counter Operation
Waveform Output by Compare Match: The TPU can perform 0, 1, or toggle output from the
corresponding output pin using compare match.
1. Example of setting procedure for waveform output by compare match
Figure 9.9 shows an example of the setting procedure for waveform output by compare match.
Output selection
Select waveform output mode
[1]
Set output timing
[2]
Start count operation
[3]
[1] Select initial value 0 output or 1 output, and
compare match output value 0 output, 1 output,
or toggle output, by means of TIOR. The set
initial value is output at the TIOC pin unit the
first compare match occurs.
[2] Set the timing for compare match generation in
TGR.
[3] Set the CST bit in TSTR to 1 to start the count
operation.
<Waveform output>
Figure 9.9 Example of Setting Procedure for Waveform Output by Compare Match
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Section 9 16-Bit Timer Pulse Unit (TPU)
2. Examples of waveform output operation
Figure 9.10 shows an example of 0 output/1 output. In this example TCNT has been designated
as a free-running counter, and settings have been made so that 1 is output by compare match A,
and 0 is output by compare match B. When the set level and the pin level coincide, the pin
level does not change.
TCNT value
H'FFFF
TGRA
TGRB
Time
H'0000
No change
No change
1 output
TIOCA
No change
TIOCB
No change
0 output
Figure 9.10 Example of 0 Output/1 Output Operation
Figure 9.11 shows an example of toggle output.
In this example TCNT has been designated as a periodic counter (with counter clearing
performed by compare match B), and settings have been made so that output is toggled by both
compare match A and compare match B.
TCNT value
Counter cleared by TGRB compare match
H'FFFF
TGRB
TGRA
Time
H'0000
Toggle output
TIOCB
Toggle output
TIOCA
Figure 9.11 Example of Toggle Output Operation
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Section 9 16-Bit Timer Pulse Unit (TPU)
Input Capture Function: The TCNT value can be transferred to TGR on detection of the TIOC
pin input edge. Rising edge, falling edge, or both edges can be selected as the detected edge.
1. Example of input capture operation setting procedure
Figure 9.12 shows an example of the input capture operation setting procedure.
Input selection
Select input capture input
Start count
[1] Designate TGR as an input capture register by
means of TIOR, and select rising edge, falling
edge, or both edges as the input capture source
and input signal edge.
[2] Set the CST bit in TSTR to 1 to start the count
operation.
[1]
[2]
<Input capture operation>
Figure 9.12 Example of Input Capture Operation Setting Procedure
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Section 9 16-Bit Timer Pulse Unit (TPU)
2. Example of input capture operation
Figure 9.13 shows an example of input capture operation. In this example both rising and
falling edges have been selected as the TIOCA pin input capture input edge, falling edge has
been selected as the TIOCB pin input capture input edge, and counter clearing by TGRB input
capture has been designated for TCNT.
Counter cleared by TIOCB
input (falling edge)
TCNT value
H'0180
H'0160
H'0010
H'0005
Time
H'0000
TIOCA
TGRA
H'0005
H'0160
H'0010
TIOCB
TGRB
H'0180
Figure 9.13 Example of Input Capture Operation
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.5.2
Synchronous Operation
In synchronous operation, the values in a number of TCNT counters can be rewritten
simultaneously (synchronous presetting). Also, a number of TCNT counters can be cleared
simultaneously by making the appropriate setting in TCR (synchronous clearing). Synchronous
operation enables TGR to be incremented with respect to a single time base. Channels 0 to 2 can
all be designated for synchronous operation.
Example of Synchronous Operation Setting Procedure: Figure 9.14 shows an example of the
synchronous operation setting procedure.
Synchronous operation
selection
Set synchronous
operation
[1]
Synchronous presetting
Set TCNT
Synchronous clearing
[2]
Clearing
source generation
channel?
No
Yes
<Synchronous presetting>
Select counter
clearing source
[3]
Set synchronous
counter clearing
[4]
Start count
[5]
Start count
[5]
<Counter clearing>
<Synchronous clearing>
[1] Set to 1 the SYNC bits in TSYR corresponding to the channels to be designated for synchronous
operation.
[2] When the TCNT counter of any of the channels designated for synchronous operation is
written to, the same value is simultaneously written to the other TCNT counters.
[3] Use bits CCLR2 to CCLR0 in TCR to specify TCNT clearing by input capture/output compare,
etc.
[4] Use bits CCLR2 to CCLR0 in TCR to designate synchronous clearing for the counter clearing
source.
[5] Set to 1 the CST bits in TSTR for the relevant channels, to start the count operation.
Figure 9.14 Example of Synchronous Operation Setting Procedure
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Section 9 16-Bit Timer Pulse Unit (TPU)
Example of Synchronous Operation: Figure 9.15 shows an example of synchronous operation.
In this example, synchronous operation and PWM mode 1 have been designated for channels 0 to
2, TGRB_0 compare match has been set as the channel 0 counter clearing source, and synchronous
clearing has been set for the channel 1 and 2 counter clearing source. Three-phase PWM
waveforms are output from pins TIOC0A, TIOC1A, and TIOC2A. At this time, synchronous
presetting, and synchronous clearing by TGRB_0 compare match, is performed for channel 0 to 2
TCNT counters, and the data set in TGRB_0 is used as the PWM cycle. For details of PWM
modes, see section 9.5.4, PWM Modes.
Synchronous clearing by TGRB_0 compare match
TCNT0 to TCNT2 values
TGRB_0
TGRB_1
TGRA_0
TGRB_2
TGRA_1
TGRA_2
Time
H'0000
TIOCA_0
TIOCA_1
TIOCA_2
Figure 9.15 Example of Synchronous Operation
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.5.3
Buffer Operation
Buffer operation, provided for channel 0, enables TGRC and TGRD to be used as buffer registers.
Buffer operation differs depending on whether TGR has been designated as an input capture
register or as a compare match register. Table 9.17 shows the register combinations used in buffer
operation.
Table 9.17 Register Combinations in Buffer Operation
Channel
Timer General Register
Buffer Register
0
TGRA_0
TGRC_0
TGRB_0
TGRD_0
• When TGR is an output compare register
When a compare match occurs, the value in the buffer register for the corresponding channel is
transferred to the timer general register. This operation is illustrated in figure 9.16.
Compare match signal
Buffer register
Timer general
register
Comparator
TCNT
Figure 9.16 Compare Match Buffer Operation
• When TGR is an input capture register
When input capture occurs, the value in TCNT is transferred to TGR and the value previously
held in the timer general register is transferred to the buffer register. This operation is
illustrated in figure 9.17.
Input capture
signal
Buffer register
Timer general
register
TCNT
Figure 9.17 Input Capture Buffer Operation
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Section 9 16-Bit Timer Pulse Unit (TPU)
Example of Buffer Operation Setting Procedure: Figure 9.18 shows an example of the buffer
operation setting procedure.
Buffer operation
Select TGR function
[1]
Set buffer operation
[2]
Start count
[3]
[1] Designate TGR as an input capture register or
output compare register by means of TIOR.
[2] Designate TGR for buffer operation with bits
BFA and BFB in TMDR.
[3] Set the CST bit in TSTR to 1 start the count
operation.
<Buffer operation>
Figure 9.18 Example of Buffer Operation Setting Procedure
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Section 9 16-Bit Timer Pulse Unit (TPU)
Examples of Buffer Operation
1. When TGR is an output compare register
Figure 9.19 shows an operation example in which PWM mode 1 has been designated for
channel 0, and buffer operation has been designated for TGRA and TGRC. The settings used in
this example are TCNT clearing by compare match B, 1 output at compare match A, and 0
output at compare match B. As buffer operation has been set, when compare match A occurs
the output changes and the value in buffer register TGRC is simultaneously transferred to timer
general register TGRA. This operation is repeated each time compare match A occurs. For
details of PWM modes, see section 9.5.4, PWM Modes.
TCNT value
TGRB_0
H'0520
H'0450
H'0200
TGRA_0
Time
H'0000
TGRC_0 H'0200
H'0450
H'0520
Transfer
TGRA_0
H'0200
H'0450
TIOCA
Figure 9.19 Example of Buffer Operation (1)
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Section 9 16-Bit Timer Pulse Unit (TPU)
2. When TGR is an input capture register
Figure 9.20 shows an operation example in which TGRA has been designated as an input
capture register, and buffer operation has been designated for TGRA and TGRC. Counter
clearing by TGRA input capture has been set for TCNT, and both rising and falling edges have
been selected as the TIOCA pin input capture input edge. As buffer operation has been set,
when the TCNT value is stored in TGRA upon occurrence of input capture A, the value
previously stored in TGRA is simultaneously transferred to TGRC.
TCNT value
H'0F07
H'09FB
H'0532
H'0000
Time
TIOCA
TGRA
H'0532
TGRC
H'0F07
H'09FB
H'0532
H'0F07
Figure 9.20 Example of Buffer Operation (2)
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.5.4
PWM Modes
In PWM mode, PWM waveforms are output from the output pins. 0, 1, or toggle output can be
selected as the output level in response to compare match of each TGR. Settings of TGR registers
can output a PWM waveform in the range of 0 % to 100 % duty. Designating TGR compare match
as the counter clearing source enables the period to be set in that register. All channels can be
designated for PWM mode independently. Synchronous operation is also possible. There are two
PWM modes, as described below.
• PWM mode 1
PWM output is generated from the TIOCA and TIOCC pins by pairing TGRA with TGRB and
TGRC with TGRD. The output specified by bits IOA3 to IOA0 and IOC3 to IOC0 in TIOR is
output from the TIOCA and TIOCC pins at compare matches A and C, and the output specified
by bits IOB3 to IOB0 and IOD3 to IOD0 in TIOR is output at compare matches B and D. The
initial output value is the value set in TGRA or TGRC. If the set values of paired TGRs are
identical, the output value does not change when a compare match occurs. In PWM mode 1, a
maximum 4-phase PWM output is possible.
• PWM mode 2
PWM output is generated using one TGR as the cycle register and the others as duty registers.
The output specified in TIOR is performed by means of compare matches. Upon counter
clearing by a synchronization register compare match, the output value of each pin is the initial
value set in TIOR. If the set values of the cycle and duty registers are identical, the output
value does not change when a compare match occurs. In PWM mode 2, a maximum 7-phase
PWM output is possible by combined use with synchronous operation. The correspondence
between PWM output pins and registers is shown in table 9.18.
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Section 9 16-Bit Timer Pulse Unit (TPU)
Table 9.18 PWM Output Registers and Output Pins
Output Pins
Channel
Registers
PWM Mode 1
PWM Mode 2
0
TGRA_0
TIOCA0
TIOCA0
TGRB_0
TIOCB0
TIOCC0
TGRC_0
TGRD_0
1
TIOCD0
TGRA_1
TIOCA1
TGRB_1
2
TIOCC0
TIOCA1
TIOCB1
TGRA_2
TIOCA2
TGRB_2
TIOCA2
TIOCB2
Note: In PWM mode 2, PWM output is not possible for the TGR register in which the period is set.
Example of PWM Mode Setting Procedure: Figure 9.21 shows an example of the PWM mode
setting procedure.
PWM mode
Select counter clock
[1]
Select counter clearing source
[2]
Select waveform output level
[3]
Set TGR
[4]
Set PWM mode
[5]
Start count
[6]
[1] Select the counter clock with bits TPSC2 to
TPSC0 in TCR. At the same time, select the
input clock edge with bits CKEG1 and CKEG0
in TCR.
[2] Use bits CCLR2 to CCLR0 in TCR to select the
TGR to be used as the TCNT clearing source.
[3] Use TIOR to designate the TGR as an output
compare register, and select the initial value and
output value.
[4] Set the cycle in the TGR selected in [2], and set
the duty in the other the TGR.
[5] Select the PWM mode with bits MD3 to MD0 in
TMDR.
[6] Set the CST bit in TSTR to 1 start the count
operation.
<PWM mode>
Figure 9.21 Example of PWM Mode Setting Procedure
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Section 9 16-Bit Timer Pulse Unit (TPU)
Examples of PWM Mode Operation: Figure 9.22 shows an example of PWM mode 1 operation.
In this example, TGRA compare match is set as the TCNT clearing source, 0 is set for the TGRA
initial output value and output value, and 1 is set as the TGRB output value. In this case, the value
set in TGRA is used as the period, and the values set in TGRB registers as the duty.
TCNT value
Counter cleared by
TGRA compare match
TGRA
TGRB
H'0000
Time
TIOCA
Figure 9.22 Example of PWM Mode Operation (1)
Figure 9.23 shows an example of PWM mode 2 operation. In this example, synchronous operation
is designated for channels 0 and 1, TGRB_1 compare match is set as the TCNT clearing source,
and 0 is set for the initial output value and 1 for the output value of the other TGR registers
(TGRA_0 to TGRD_0, TGRA_1), to output a 5-phase PWM waveform. In this case, the value set
in TGRB_1 is used as the cycle, and the values set in the other TGRs as the duty.
TCNT value
Counter cleared by
TGRB_1 compare match
TGRB_1
TGRA_1
TGRD_0
TGRC_0
TGRB_0
TGRA_0
H'0000
Time
TIOCA0
TIOCB0
TIOCC0
TIOCD0
TIOCA1
Figure 9.23 Example of PWM Mode Operation (2)
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Section 9 16-Bit Timer Pulse Unit (TPU)
Figure 9.24 shows examples of PWM waveform output with 0% duty and 100% duty in PWM
mode.
TCNT value
TGRB rewritten
TGRA
TGRB
TGRB rewritten
TGRB
rewritten
H'0000
Time
0% duty
TIOCA
Output does not change when cycle register and duty register
compare matches occur simultaneously
TCNT value
TGRB rewritten
TGRA
TGRB rewritten
TGRB rewritten
TGRB
H'0000
Time
100% duty
TIOCA
Output does not change when cycle register and duty
register compare matches occur simultaneously
TCNT value
TGRB rewritten
TGRA
TGRB rewritten
TGRB
TGRB rewritten
Time
H'0000
100% duty
TIOCA
0% duty
Figure 9.24 Example of PWM Mode Operation (3)
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.5.5
Phase Counting Mode
In phase counting mode, the phase difference between two external clock inputs is detected and
TCNT is incremented/decremented accordingly. This mode can be set for channels 1 and 2. When
phase counting mode is set, an external clock is selected as the counter input clock and TCNT
operates as an up/down-counter regardless of the setting of bits TPSC2 to TPSC0 and bits CKEG1
and CKEG0 in TCR. However, the functions of bits CCLR1 and CCLR0 in TCR, and of TIOR,
TIER, and TGR are valid, and input capture/compare match and interrupt functions can be used.
This can be used for two-phase encoder pulse input. When overflow occurs while TCNT is
counting up, the TCFV flag in TSR is set; when underflow occurs while TCNT is counting down,
the TCFU flag is set. The TCFD bit in TSR is the count direction flag. Reading the TCFD flag
provides an indication of whether TCNT is counting up or down. Table 9.19 shows the
correspondence between external clock pins and channels.
Table 9.19 Phase Counting Mode Clock Input Pins
External Clock Pins
Channels
A-Phase
B-Phase
When channel 1 is set to phase counting mode
TCLKA
TCLKB
When channel 2 is set to phase counting mode
TCLKC
TCLKD
Example of Phase Counting Mode Setting Procedure: Figure 9.25 shows an example of the
phase counting mode setting procedure.
[1] Select phase counting mode with bits MD3 to
MD0 in TMDR.
[2] Set the CST bit in TSTR to 1 to start the count
operation.
Phase counting mode
Select phase counting mode
[1]
Start count
[2]
<Phase counting mode>
Figure 9.25 Example of Phase Counting Mode Setting Procedure
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Section 9 16-Bit Timer Pulse Unit (TPU)
Examples of Phase Counting Mode Operation: In phase counting mode, TCNT counts up or
down according to the phase difference between two external clocks. There are four modes,
according to the count conditions.
1. Phase counting mode 1
Figure 9.26 shows an example of phase counting mode 1 operation, and table 9.20 summarizes
the TCNT up/down-count conditions.
TCLKA (channel 1)
TCLKC (channel 2)
TCLKB (channel 1)
TCLKD (channel 2)
TCNT value
Down-count
Up-count
Time
Figure 9.26 Example of Phase Counting Mode 1 Operation
Table 9.20 Up/Down-Count Conditions in Phase Counting Mode 1
TCLKA (Channel 1)
TCLKB (Channel 1)
TCLKC (Channel 2)
TCLKD (Channel 2)
Operation
Up-count
High level
Low level
Low level
High level
High level
Down-count
Low level
High level
Low level
Legend:
: Rising edge
: Falling edge
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Section 9 16-Bit Timer Pulse Unit (TPU)
2. Phase counting mode 2
Figure 9.27 shows an example of phase counting mode 2 operation, and table 9.21 summarizes
the TCNT up/down-count conditions.
TCLKA (channel 1)
TCLKC (channel 2)
TCLKB (channel 1)
TCLKD (channel 2)
TCNT value
Up-count
Down-count
Time
Figure 9.27 Example of Phase Counting Mode 2 Operation
Table 9.21 Up/Down-Count Conditions in Phase Counting Mode 2
TCLKA (Channel 1)
TCLKB (Channel 1)
TCLKC (Channel 2)
TCLKD (Channel 2)
Operation
High level
Don't care
Low level
Don't care
Low level
Don't care
High level
Up-count
High level
Don't care
Low level
Don't care
High level
Don't care
Low level
Down-count
Legend:
: Rising edge
: Falling edge
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Section 9 16-Bit Timer Pulse Unit (TPU)
3. Phase counting mode 3
Figure 9.28 shows an example of phase counting mode 3 operation, and table 9.22 summarizes
the TCNT up/down-count conditions.
TCLKA (channel 1)
TCLKC (channel 2)
TCLKB (channel 1)
TCLKD (channel 2)
TCNT value
Down-count
Up-count
Time
Figure 9.28 Example of Phase Counting Mode 3 Operation
Table 9.22 Up/Down-Count Conditions in Phase Counting Mode 3
TCLKA (Channel 1)
TCLKB (Channel 1)
TCLKC (Channel 2)
TCLKD (Channel 2)
Operation
High level
Don't care
Low level
Don't care
Low level
Don't care
High level
Up-count
High level
Down-count
Low level
Don't care
High level
Don't care
Low level
Don't care
Legend:
: Rising edge
: Falling edge
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Section 9 16-Bit Timer Pulse Unit (TPU)
4. Phase counting mode 4
Figure 9.29 shows an example of phase counting mode 4 operation, and table 9.23 summarizes
the TCNT up/down-count conditions.
TCLKA (channel 1)
TCLKC (channel 2)
TCLKB (channel 1)
TCLKD (channel 2)
TCNT value
Down-count
Up-count
Time
Figure 9.29 Example of Phase Counting Mode 4 Operation
Table 9.23 Up/Down-Count Conditions in Phase Counting Mode 4
TCLKA (Channel 1)
TCLKB (Channel 1)
TCLKC (Channel 2)
TCLKD (Channel 2)
Operation
Up-count
High level
Low level
Low level
Don't care
High level
Down-count
High level
Low level
High level
Don't care
Low level
Legend:
: Rising edge
: Falling edge
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.6
Interrupts
9.6.1
Interrupt Source and Priority
There are three kinds of TPU interrupt source: TGR input capture/compare match, TCNT
overflow, and TCNT underflow. Each interrupt source has its own status flag and enable/disabled
bit, allowing generation of interrupt request signals to be enabled or disabled individually. When
an interrupt request is generated, the corresponding status flag in TSR is set to 1. If the
corresponding enable/disable bit in TIER is set to 1 at this time, an interrupt is requested. The
interrupt request is cleared by clearing the status flag to 0. Relative channel priorities can be
changed by the interrupt controller, but the priority order within a channel is fixed. For details, see
section 5, Interrupt Controller. Table 9.24 lists the TPU interrupt sources.
Table 9.24 TPU Interrupts
Channel Name
0
1
2
Interrupt Source
Interrupt Flag
DMAC Activation
Priority*
TGI0A
TGRA_0 input
capture/compare match
TGFA
Possible
High
TGI0B
TGRB_0 input
capture/compare match
TGFB
Not possible
TGI0C
TGRC_0 input
capture/compare match
TGFC
Not possible
TGI0D
TGRD_0 input
capture/compare match
TGFD
Not possible
TCI0V
TCNT_0 overflow
TCFV
Not possible
TGI1A
TGRA_1 input
capture/compare match
TGFA
Possible
TGI1B
TGRB_1 input
capture/compare match
TGFB
Not possible
TCI1V
TCNT_1 overflow
TCFV
Not possible
TCI1U
TCNT_1 underflow
TCFU
Not possible
TGI2A
TGRA_2 input
capture/compare match
TGFA
Possible
TGI2B
TGRB_2 input
capture/compare match
TGFB
Not possible
TCI2V
TCNT_2 overflow
TCFV
Not possible
TCI2U
TCNT_2 underflow
TCFU
Not possible
Low
Note: * This table shows the initial state immediately after a reset. The relative channel priorities
can be changed by the interrupt controller.
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Section 9 16-Bit Timer Pulse Unit (TPU)
Input Capture/Compare Match Interrupt: An interrupt is requested if the TGIE bit in TIER is
set to 1 when the TGF flag in TSR is set to 1 by the occurrence of a TGR input capture/compare
match on a particular channel. The interrupt request is cleared by clearing the TGF flag to 0. The
TPU has 8 input capture/compare match interrupts, four each for channel 0, and two each for
channels 1 and 2.
Overflow Interrupt: An interrupt is requested if the TCIEV bit in TIER is set to 1 when the
TCFV flag in TSR is set to 1 by the occurrence of TCNT overflow on a channel. The interrupt
request is cleared by clearing the TCFV flag to 0. The TPU has three overflow interrupts, one for
each channel.
Underflow Interrupt: An interrupt is requested if the TCIEU bit in TIER is set to 1 when the
TCFU flag in TSR is set to 1 by the occurrence of TCNT underflow on a channel. The interrupt
request is cleared by clearing the TCFU flag to 0. The TPU has two underflow interrupts, one each
for channels 1 and 2.
9.6.2
DMAC Activation
The DMAC can be activated by the TGRA input capture/compare match interrupt for a channel.
For details, see section 7, DMA Controller (DMAC). With the TPU, a total of three TGRA input
capture/compare match interrupts can be used as DMAC activation sources, one for each channel.
9.6.3
A/D Converter Activation
The A/D converter can be activated by the TGRA input capture/compare match for a channel. If
the TTGE bit in TIER is set to 1 when the TGFA flag in TSR is set to 1 by the occurrence of a
TGRA input capture/compare match on a particular channel, a request to start A/D conversion is
sent to the A/D converter. If the TPU conversion start trigger has been selected on the A/D
converter side at this time, A/D conversion is started. In the TPU, a total of three TGRA input
capture/compare match interrupts can be used as A/D converter conversion start sources, one for
each channel.
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.7
Operation Timing
9.7.1
Input/Output Timing
TCNT Count Timing: Figure 9.30 shows TCNT count timing in internal clock operation, and
figure 9.31 shows TCNT count timing in external clock operation.
φ
Falling edge
Internal clock
Rising edge
TCNT
input clock
N-1
TCNT
N
N+1
N+2
Figure 9.30 Count Timing in Internal Clock Operation
φ
External clock
Falling edge
Rising edge
Falling edge
TCNT
input clock
TCNT
N-1
N
N+1
Figure 9.31 Count Timing in External Clock Operation
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N+2
Section 9 16-Bit Timer Pulse Unit (TPU)
Output Compare Output Timing: A compare match signal is generated in the final state in
which TCNT and TGR match (the point at which the count value matched by TCNT is updated).
When a compare match signal is generated, the output value set in TIOR is output at the output
compare output pin. After a match between TCNT and TGR, the compare match signal is not
generated until the TCNT input clock is generated. Figure 9.32 shows output compare output
timing.
φ
TCNT
input clock
N
TCNT
N+1
N
TGR
Compare
match signal
TIOC pin
Figure 9.32 Output Compare Output Timing
Input Capture Signal Timing: Figure 9.33 shows input capture signal timing.
φ
Input capture
input
Input capture
signal
TCNT
TGR
N
N+1
N+2
N
N+2
Figure 9.33 Input Capture Input Signal Timing
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Section 9 16-Bit Timer Pulse Unit (TPU)
Timing for Counter Clearing by Compare Match/Input Capture: Figure 9.34 shows the
timing when counter clearing by compare match occurrence is specified, and figure 9.35 shows the
timing when counter clearing by input capture occurrence is specified.
φ
Compare
match signal
Counter
clear signal
TCNT
N
TGR
N
H'0000
Figure 9.34 Counter Clear Timing (Compare Match)
φ
Input capture
signal
Counter clear
signal
TCNT
N
H'0000
N
TGR
Figure 9.35 Counter Clear Timing (Input Capture)
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Section 9 16-Bit Timer Pulse Unit (TPU)
Buffer Operation Timing: Figures 9.36 and 9.37 show the timing in buffer operation.
φ
TCNT
n
n+1
Compare
match signal
TGRA,
TGRB
n
TGRC,
TGRD
N
N
Figure 9.36 Buffer Operation Timing (Compare Match)
φ
Input capture
signal
TCNT
N
TGRA,
TGRB
n
TGRC,
TGRD
N+1
N
N+1
n
N
Figure 9.37 Buffer Operation Timing (Input Capture)
9.7.2
Interrupt Signal Timing
TGF Flag Setting Timing in Case of Compare Match: Figure 9.38 shows the timing for setting
of the TGF flag in TSR by compare match occurrence, and TGI interrupt request signal timing.
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Section 9 16-Bit Timer Pulse Unit (TPU)
φ
TCNT input
clock
TCNT
N
TGR
N
N+1
Compare
match signal
TGF flag
TGI interrupt
Figure 9.38 TGI Interrupt Timing (Compare Match)
TGF Flag Setting Timing in Case of Input Capture: Figure 9.39 shows the timing for setting of
the TGF flag in TSR by input capture occurrence, and TGI interrupt request signal timing.
φ
Input capture
signal
TCNT
N
TGR
N
TGF flag
TGI interrupt
Figure 9.39 TGI Interrupt Timing (Input Capture)
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Section 9 16-Bit Timer Pulse Unit (TPU)
TCFV Flag/TCFU Flag Setting Timing: Figure 9.40 shows the timing for setting of the TCFV
flag in TSR by overflow occurrence, and TCIV interrupt request signal timing. Figure 9.41 shows
the timing for setting of the TCFU flag in TSR by underflow occurrence, and TCIU interrupt
request signal timing.
φ
TCNT input
clock
TCNT
(overflow)
H'FFFF
H'0000
Overflow
signal
TCFV flag
TCIV interrupt
Figure 9.40 TCIV Interrupt Setting Timing
φ
TCNT
input clock
TCNT
(underflow)
H'0000
H'FFFF
Underflow
signal
TCFU flag
TCIU interrupt
Figure 9.41 TCIU Interrupt Setting Timing
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Section 9 16-Bit Timer Pulse Unit (TPU)
Status Flag Clearing Timing: After a status flag is read as 1 by the CPU, it is cleared by writing
0 to it. When the DMAC is activated, the flag is cleared automatically. Figure 9.42 shows the
timing for status flag clearing by the CPU, and figure 9.43 shows the timing for status flag clearing
by the DMAC.
TSR write cycle
T1
T2
φ
Address
TSR address
Write signal
Status flag
Interrupt
request
signal
Figure 9.42 Timing for Status Flag Clearing by CPU
DMAC
read cycle
T1
T2
DMAC
write cycle
T1
T2
φ
Address
Source address
Destination
address
Status flag
Interrupt
request
signal
Figure 9.43 Timing for Status Flag Clearing by DMAC Activation
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Section 9 16-Bit Timer Pulse Unit (TPU)
9.8
Usage Notes
Input Clock Restrictions: The input clock pulse width must be at least 1.5 states in the case of
single-edge detection, and at least 2.5 states in the case of both-edge detection. The TPU will not
operate properly with a narrower pulse width. In phase counting mode, the phase difference and
overlap between the two input clocks must be at least 1.5 states, and the pulse width must be at
least 2.5 states. Figure 9.44 shows the input clock conditions in phase counting mode.
Overlap
Phase
Phase
differdifference Overlap ence
Pulse width
Pulse width
TCLKA
(TCLKC)
TCLKB
(TCLKD)
Pulse width
Pulse width
Notes: Phase difference and overlap : 1.5 states or more
Pulse width
: 2.5 states or more
Figure 9.44 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode
Caution on Period Setting: When counter clearing by compare match is set, TCNT is cleared in
the final state in which it matches the TGR value (the point at which the count value matched by
TCNT is updated). Consequently, the actual counter frequency is given by the following formula:
φ
f = ————
(N + 1)
Where f : Counter frequency
φ : Operating frequency
N : TGR set value
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Section 9 16-Bit Timer Pulse Unit (TPU)
Contention between TCNT Write and Clear Operations: If the counter clear signal is generated
in the T2 state of a TCNT write cycle, TCNT clearing takes precedence and the TCNT write is not
performed. Figure 9.45 shows the timing in this case.
TCNT write cycle
T2
T1
φ
TCNT address
Address
Write signal
Counter clear
signal
TCNT
N
H'0000
Figure 9.45 Contention between TCNT Write and Clear Operations
Contention between TCNT Write and Increment Operations: If incrementing occurs in the T2
state of a TCNT write cycle, the TCNT write takes precedence and TCNT is not incremented.
Figure 9.46 shows the timing in this case.
TCNT write cycle
T2
T1
φ
TCNT address
Address
Write signal
TCNT input
clock
TCNT
N
M
TCNT write data
Figure 9.46 Contention between TCNT Write and Increment Operations
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Section 9 16-Bit Timer Pulse Unit (TPU)
Contention between TGR Write and Compare Match: If a compare match occurs in the T2
state of a TGR write cycle, the TGR write takes precedence and the compare match signal is
inhibited. A compare match does not occur even if the same value as before is written. Figure 9.47
shows the timing in this case.
TGR write cycle
T2
T1
φ
TGR address
Address
Write signal
Compare
match signal
Prohibited
TCNT
N
N+1
TGR
N
M
TGR write data
Figure 9.47 Contention between TGR Write and Compare Match
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Section 9 16-Bit Timer Pulse Unit (TPU)
Contention between Buffer Register Write and Compare Match: If a compare match occurs in
the T2 state of a TGR write cycle, the data transferred to TGR by the buffer operation will be the
data prior to the write. Figure 9.48 shows the timing in this case.
TGR write cycle
T2
T1
φ
Buffer register
address
Address
Write signal
Compare
match signal
Buffer register write data
Buffer
register
N
M
N
TGR
Figure 9.48 Contention between Buffer Register Write and Compare Match
Contention between TGR Read and Input Capture: If the input capture signal is generated in
the T1 state of a TGR read cycle, the data that is read will be the data after input capture transfer.
Figure 9.49 shows the timing in this case.
TGR read cycle
T2
T1
φ
TGR address
Address
Read signal
Input capture
signal
TGR
X
Internal
data bus
M
M
Figure 9.49 Contention between TGR Read and Input Capture
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Section 9 16-Bit Timer Pulse Unit (TPU)
Contention between TGR Write and Input Capture: If the input capture signal is generated in
the T2 state of a TGR write cycle, the input capture operation takes precedence and the write to
TGR is not performed. Figure 9.50 shows the timing in this case.
TGR write cycle
T2
T1
φ
Address
TGR address
Write signal
Input capture
signal
TCNT
TGR
M
M
Figure 9.50 Contention between TGR Write and Input Capture
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Section 9 16-Bit Timer Pulse Unit (TPU)
Contention between Buffer Register Write and Input Capture: If the input capture signal is
generated in the T2 state of a buffer register write cycle, the buffer operation takes precedence and
the write to the buffer register is not performed. Figure 9.51 shows the timing in this case.
Buffer register write cycle
T2
T1
φ
Buffer register
address
Address
Write signal
Input capture
signal
TCNT
N
M
TGR
Buffer
register
N
M
Figure 9.51 Contention between Buffer Register Write and Input Capture
Contention between Overflow/Underflow and Counter Clearing: If overflow/underflow and
counter clearing occur simultaneously, the TCFV/TCFU flag in TSR is not set and TCNT clearing
takes precedence. Figure 9.52 shows the operation timing when a TGR compare match is specified
as the clearing source, and H'FFFF is set in TGR.
φ
TCNT input
clock
TCNT
H'FFFF
H'0000
Counter
clearing signal
TGF flag
Prohibited
TCFV flag
Figure 9.52 Contention between Overflow and Counter Clearing
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Section 9 16-Bit Timer Pulse Unit (TPU)
Contention between TCNT Write and Overflow/Underflow: If there is an up-count or downcount in the T2 state of a TCNT write cycle, and overflow/underflow occurs, the TCNT write takes
precedence and the TCFV/TCFU flag in TSR is not set. Figure 9.53 shows the operation timing
when there is contention between TCNT write and overflow.
TCNT write cycle
T2
T1
φ
TCNT address
Address
Write signal
TCNT
TCFV flag
TCNT write data
H'FFFF
M
Prohibited
Figure 9.53 Contention between TCNT Write and Overflow
Multiplexing of I/O Pins: In this LSI, the TCLKA input pin is multiplexed with the TIOCC0 I/O
pin, the TCLKB input pin with the TIOCD0 I/O pin, the TCLKC input pin with the TIOCB1 I/O
pin, and the TCLKD input pin with the TIOCB2 I/O pin. When an external clock is input, compare
match output should not be performed from a multiplexed pin.
Interrupts in Module Stop Mode: If module stop mode is entered when an interrupt has been
requested, it will not be possible to clear the CPU interrupt source or the DMAC activation source.
Interrupts should therefore be disabled before entering module stop mode.
Module Stop Mode Setting: TPU operation can be disabled or enabled using the module stop
control register. The initial setting is for TPU operation to be halted. Register access is enabled by
clearing module stop mode. For details, refer to section 20, Power-Down Modes.
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Section 9 16-Bit Timer Pulse Unit (TPU)
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Section 10 Watchdog Timer (WDT)
Section 10 Watchdog Timer (WDT)
The watchdog timer (WDT) is an 8-bit timer that can generate an internal reset signal for this LSI
if a system crash prevents the CPU from writing to the timer counter, thus allowing it to overflow.
When this watchdog function is not needed, the WDT can be used as an interval timer. In interval
timer operation, an interval timer interrupt is generated each time the counter overflows.
The block diagram of the WDT is shown in figure 10.1.
10.1
Features
• Selectable from eight counter input clocks
• Switchable between watchdog timer mode and interval timer mode
In watchdog timer mode:
• If the counter overflows, it is possible to select whether this LSI is internally reset or not.
In interval timer mode:
• If the counter overflows, the WDT generates an interval timer interrupt (WOVI).
WDT0104A_000020011200
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Section 10 Watchdog Timer (WDT)
Internal reset signal*
Interrupt
control
Clock
Clock
select
Reset
control
RSTCSR
TCNT
φ/2
φ/64
φ/128
φ/512
φ/2048
φ/8192
φ/32768
φ/131072
Internal clock
sources
TSCR
Module bus
Bus
interface
Internal bus
Overflow
WOVI
(interrupt request
signal)
WDT
Legend:
Timer control/status register
TCSR:
Timer counter
TCNT:
RSTCSR: Reset control/status register
Notes: When a sub-block is operating, φ will be φSUB.
* The type of internal reset signal depends on a register setting.
Figure 10.1 Block Diagram of WDT
10.2
Register Descriptions
The WDT has the following three registers. For details, refer to section 21, List of Registers. To
prevent accidental overwriting, TCSR, TCNT, and RSTCSR have to be written to by a different
method to normal registers. For details, refer to section 10.5.1, Notes on Register Access.
• Timer counter (TCNT)
• Timer control/status register (TCSR)
• Reset control/status register (RSTCSR)
10.2.1
Timer Counter (TCNT)
TCNT is an 8-bit readable/writable up-counter. TCNT is initialized to H'00 by a reset, when the
TME bit in TCSR is cleared to 0.
10.2.2
Timer Control/Status Register (TCSR)
TCSR is an 8-bit readable/writable register. Its functions include selecting the clock source to be
input to TCNT, and selecting the timer mode.
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Section 10 Watchdog Timer (WDT)
Bit
Bit Name
Initial Value
R/W
Description
7
OVF
0
R/(W)*
6
WT/IT
0
R/W
Overflow Flag
Indicates that TCNT has overflowed. Only a write of
0 is permitted, to clear the flag.
[Setting condition]
When TCNT overflows (changes from H'FF to H'00)
When internal reset request generation is selected
in watchdog timer mode, OVF is cleared
automatically by the internal reset.
[Clearing condition]
Cleared by reading TCSR when OVF = 1, then
writing 0 to OVF
When polling CVF when the interval timer interrupt
has been prohibited, OVF = 1 status should be read
two or more times.
Timer Mode Select
Selects whether the WDT is used as a watchdog
timer or interval timer.
0: Interval timer mode
1: Watchdog timer mode
5
TME
0
R/W
Timer Enable
When this bit is set to 1, TCNT starts counting.
When this bit is cleared, TCNT stops counting and
is initialized to H'00.
4, 3
—
All 1
—
Reserved
These bits are always read as 1 and cannot be
modified.
2
1
0
CKS2
CKS1
CKS0
0
0
0
R/W
R/W
R/W
Clock Select 0 to 2
Selects the clock source to be input to TCNT. The
overflow frequency for φ = 16 MHz is enclosed in
parentheses. The overflow period is the time from
when TCNT starts counting up from H'00 until
overflow occurs.
000: Clock φ/2 (frequency: 32.0 μs)
001: Clock φ/64 (frequency: 1.0 ms)
010: Clock φ/128 (frequency: 2.0 ms)
011: Clock φ/512 (frequency: 8.2 ms)
100: Clock φ/2048 (frequency: 32.8 ms)
101: Clock φ/8192 (frequency: 131.1 ms)
110: Clock φ/32768 (frequency: 524.3 ms)
111: Clock φ/131072 (frequency: 2.1 s)
Note: * The write value should always be 0 to clear this flag.
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Section 10 Watchdog Timer (WDT)
10.2.3
Reset Control/Status Register (RSTCSR)
RSTCSR is an 8-bit readable/writable register that controls the generation of the internal reset
signal when TCNT overflows, and selects the type of internal reset signal. RSTCSR is initialized
to H'1F by a reset signal from the RES pin, and not by the WDT internal reset signal caused by
overflows.
Bit
7
Bit Name
WOVF
Initial Value
0
R/W
Description
1
R/(W)*
Watchdog Overflow Flag
This bit is set when TCNT overflows in watchdog
timer mode. This bit cannot be set in interval timer
mode, and the write value should always be 0.
[Setting condition]
Set when TCNT overflows (changed from H'FF to
H'00) in watchdog timer mode
[Clearing condition]
Cleared by reading RSTCSR when WOVF = 1, and
then writing 0 to WOVF
6
RSTE
0
R/W
Reset Enable
Specifies whether or not a reset signal is generated
in the chip if TCNT overflows during watchdog timer
operation.
0: Reset signal is not generated even if TCNT
overflows
(Though this LSI is not reset, TCNT and TCSR in
WDT are reset)
1: Reset signal is generated if TCNT overflows
5
RSTS
0
R/W
Reset Select
Selects the type of internal reset generated if TCNT
overflows during watchdog timer operation.
2
0: Power-on reset*
3
1: Manual reset*
4 to 0 —
All 1
—
Reserved
These bits are always read as 1 and cannot be
modified.
Notes: 1. The write value should always be 0 to clear this flag.
2. Bear in mind that the USB register is not initialized by a power-on reset trigged by the
WDT. For details, see section 14.8.8, Reset.
3. Supported only by the H8S/2218 Group.
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Section 10 Watchdog Timer (WDT)
10.3
Operation
10.3.1
Watchdog Timer Mode
To use the WDT as a watchdog timer, set the WT/IT bit in TCSR and the TME bit to 1.
TCNT does not overflow while the system is operating normally. Software must prevent TCNT
overflows by rewriting the TCNT value (normally be writing H'00) before overflows occurs.
When the RSTE bit of the RSTCSR is set to 1, and if the TCNT overflows, an internal reset signal
for this LSI is issued. In this case, select power-on reset or manual reset* by setting the RSTS bit
of the RSTCSR to 0.
If a reset caused by a signal input to the RES pin occurs at the same time as a reset caused by a
WDT overflow, the RES pin reset has priority and the WOVF bit in RSTCSR is cleared to 0. The
internal reset signal is output for 518 states.
When the TCNT overflows in watchdog timer mode, the WOVF bit of the RSTCSR is set to 1. If
the RSTE bit of the RSTCSR has been set to 1, an internal reset signal for the entire LSI is
generated at TCNT overflow.
Note: * Supported only by the H8S/2218 Group.
TCNT value
Overflow
H'FF
Time
H'00
WT/IT = 1
TME = 1
H'00 written
to TCNT
WOVF = 1
Internal reset
generated
WT/IT = 1 H'00 written
TME = 1 to TCNT
Internal reset signal*
518 states (WDT0)
Legend:
WT/IT: Timer mode select bit
TME: Timer enabl bit
Note: * With WDT0, the internal reset signal is generated only when the RSTE bit is set to 1.
Figure 10.2 Operation in Watchdog Timer Mode
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Section 10 Watchdog Timer (WDT)
10.3.2
Timing of Setting of Watchdog Timer Overflow Flag (WOVF)
With WDT, the WOVF bit in RSTCSR is set to 1 if TCNT overflows in watchdog timer mode. If
TCNT overflows while the RSTE bit in RSTCSR is set to 1, an internal reset signal is generated
for the entire chip. This timing is illustrated in figure 10.3.
φ
TCNT
H'FF
H'00
Overflow signal
(internal signal)
WOVF
Internal reset
signal
518 states (WDT0)
Figure 10.3 Timing of WOVF Setting
10.3.3
Interval Timer Mode
To use the WDT as an interval timer, clear bit WT/IT in TCSR to 0 and set bit TME to 1. When
the interval timer is operating, an interval timer interrupt (WOVI) is generated each time the
TCNT overflows. Therefore, an interrupt can be generated at intervals.
TCNT count
Overflow
H'FF
Overflow
Overflow
Overflow
Time
H'00
WT/IT = 0
TME = 1
WOVI
WOVI
WOVI
Legend:
WOVI: Interval interrupt request generation
Figure 10.4 Operation in Interval Timer Mode
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WOVI
Section 10 Watchdog Timer (WDT)
10.3.4
Timing of Setting of Overflow Flag (OVF)
The OVF flag is set to 1 if TCNT overflows during interval timer operation. At the same time, an
interval timer interrupt (WOVI) is requested. This timing is shown in figure 10.5.
φ
TCNT
H'FF
H'00
Overflow signal
(internal signal)
OVF
Figure 10.5 Timing of OVF Setting
10.4
Interrupts
During interval timer mode operation, an overflow generates an interval timer interrupt (WOVI).
The interval timer interrupt is requested whenever the OVF flag is set to 1 in TCSR. OVF must be
cleared to 0 in the interrupt handling routine.
Table 10.1 WDT Interrupt Source
Name
Interrupt Source
Interrupt Flag
WOVI
TCNT overflow
WOVF
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Section 10 Watchdog Timer (WDT)
10.5
Usage Notes
10.5.1
Notes on Register Access
The watchdog timer’s TCNT, TCSR, and RSTCSR registers differ from other registers in being
more difficult to write to. The procedures for writing to and reading these registers are given
below.
Writing to TCNT and TCSR: These registers must be written to by a word transfer instruction.
They cannot be written to with byte transfer instructions. Figure 10.6 shows the format of data
written to TCNT and TCSR. TCNT and TCSR both have the same write address. For a write to
TCNT, the upper byte of the written word must contain H'5A and the lower byte must contain the
write data. For a write to TCSR, the upper byte of the written word must contain H'A5 and the
lower byte must contain the write data. This transfers the write data from the lower byte to TCNT
or TCSR.
TCNT write
15
8 7
H'5A
Address: H'FF74
0
Write data
TCSR write
15
Address: H'FF74
8 7
H'A5
0
Write data
Figure 10.6 Format of Data Written to TCNT and TCSR
Writing to RSTCSR: RSTCSR must be written to by a word transfer to address H'FF76. It cannot
be written to with byte instructions. Figure 10.7 shows the format of data written to RSTCSR. The
method of writing 0 to the WOVF bit differs from that for writing to the RSTE and RSTS bits.
To write 0 to the WOVF bit, the upper byte of the written word must contain H'A5 and the lower
byte must contain H'00. This clears the WOVF bit to 0, but has no effect on the RSTE and RSTS
bits. To write to the RSTE and RSTS bits, the upper byte must contain H'5A and the lower byte
must contain the write data. This writes the values in bits 6 and 5 of the lower byte into the RSTE
and RSTS bits, but has no effect on the WOVF bit.
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Section 10 Watchdog Timer (WDT)
Writing 0 to WOVF bit
15
8 7
H'A5
Address: H'FF76
0
H'00
Write to RSTE, RSTS bits
15
Address: H'FF76
8 7
H'5A
0
Write data
Figure 10.7 Format of Data Written to RSTCSR (Example of WDT0)
Reading from TCNT, TCSR, and RSTCSR: TCNT, TCSR, and RSTCSR are read by using the
same method as for the general registers. TCSR, TCNT, and RSTCSR are allocated in addresses
H'FF74, H'FF75, and H'FF77 respectively.
10.5.2
Contention between Timer Counter (TCNT) Write and Increment
If a timer counter clock pulse is generated during the T2 state of a TCNT write cycle, the write
takes priority and the timer counter is not incremented. Figure 10.8 shows this operation.
TCNT write cycle
T1
T2
φ
Address
Internal write
signal
TCNT input
clock
TCNT
N
M
Counter write data
Figure 10.8 Contention between TCNT Write and Increment
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Section 10 Watchdog Timer (WDT)
10.5.3
Changing Value of CKS2 to CKS0
If bits CKS0 to CKS2 in TCSR are written to while the WDT is operating, errors could occur in
the incrementation. Software must be used to stop the watchdog timer (by clearing the TME bit to
0) before changing the value of bits CKS0 to CKS2.
10.5.4
Switching between Watchdog Timer Mode and Interval Timer Mode
If the mode is switched from watchdog timer to interval timer while the WDT is operating, errors
could occur in the incrementation. Software must be used to stop the watchdog timer (by clearing
the TME bit to 0) before switching the mode.
10.5.5
Internal Reset in Watchdog Timer Mode
This LSI is not reset internally if TCNT overflows while the RSTE bit is cleared to 0 during
watchdog timer operation, however TCNT and TCSR of the WDT are reset.
TCNT, TCSR, or RSTCR cannot be written to for 132 states following an overflow. During this
period, any attempt to read the WOVF flag is not acknowledged. Accordingly, wait 132 states after
overflow to write 0 to the WOVF flag for clearing.
10.5.6
OVF Flag Clearing in Interval Timer Mode
When the OVF flag setting conflicts with the OVF flag reading in interval timer mode, writing 0 to
the OVF bit may not clear the flag even though the OVF bit has been read while it is 1. If there is a
possibility that the OVF flag setting and reading will conflict, such as when the OVF flag is polled
with the interval timer interrupt disabled, read the OVF bit while it is 1 at least twice before
writing 0 to the OVF bit to clear the flag.
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Section 11 Realtime Clock (RTC)
Section 11 Realtime Clock (RTC)
The realtime clock (RTC) is a timer used to count time ranging from a second to a week. Figure
11.1 shows the block diagram of the RTC.
11.1
Features
• Counts seconds, minutes, hours, and day-of-week
• Start/stop function
• Reset function
• Readable/writable counter of seconds, minutes, hours, and day-of-week with BCD codes
• Periodic (seconds, minutes, hours, days, and weeks) interrupts
• 8-bit free running counter
• Selection of clock source
32-kHz
oscillator
circuit
PSS
RTCCSR
1/4
RSECDR
RMINDR
RHRDR
TMOW
Clock count
control circuit
RWKDR
Internal data bus
• 8-bit bus (3 cycle access timing) connected to the external bus
RTC register is allocated to a part of area 7 of external address (H'FFFF48 to H'FFFF4F)
RTCCR1
RTCCR2
Interrupt
control circuit
Legend:
RTCCSR:
RSECDR:
RMINDR:
RHRDR:
RWKDR:
RTCCR1:
RTCCR2:
PSS:
Interrupt IRQ5
Clock source select register
Second date register
Minute date register
Hour date register
Day-of-week date register
RTC control register 1
RTC control register 2
Prescaler S
Figure 11.1 Block Diagram of RTC
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Section 11 Realtime Clock (RTC)
11.2
Input/Output Pin
Table 11.1 shows the RTC input/output pin.
Table 11.1 Pin Configuration
Name
Abbreviation I/O
Function
Clock output
TMOW
RTC divided clock output
11.3
Output
Register Descriptions
The RTC has the following registers.
• Second data register (RSECDR)
• Minute data register (RMINDR)
• Hour data register (RHRDR)
• Day-of-week data register (RWKDR)
• RTC control register 1 (RTCCR1)
• RTC control register 2 (RTCCR2)
• Clock source select register (RTCCSR)
• Extended module stop register (EXMDLSTP)
11.3.1
Second Data Register (RSECDR)
RSECDR counts the BCD-coded second value. This register is initialized to H'00 by a STBY input
or the RST bit in RTCCR1, but not initialized by a RES input. The setting range is decimal 00 to
59. For more information on reading seconds, minutes, hours, and day-of-week, see section 11.4.2,
Time Data Reading Procedure.
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Section 11 Realtime Clock (RTC)
Bit
Bit Name
Initial Value* R/W
Description
7
BSY
—
RTC Busy
R
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6
SC12
—
R/W
Counting Ten’s Position of Seconds
5
SC11
—
R/W
Counts on 0 to 5 for 60-second counting.
4
SC10
—
R/W
3
SC03
—
R/W
Counting One’s Position of Seconds
2
SC02
—
R/W
1
SC01
—
R/W
Counts on 0 to 9 once per second. When a carry is
generated, 1 is added to the ten’s position.
0
SC00
—
R/W
Note: * Initial value after RES.
11.3.2
Minute Data Register (RMINDR)
RMINDR counts the BCD-coded minute value on the carry generated once per minute by the
RSECDR counting. This register is initialized to H'00 a STBY input or the RST bit in RTCCR1,
but not initialized by a RES input. The setting range is decimal 00 to 59.
Bit
Bit Name
Initial Value* R/W
Description
7
BSY
—
RTC Busy
R
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6
MN12
—
R/W
Counting Ten’s Position of Minutes
5
MN11
—
R/W
Counts on 0 to 5 for 60-minute counting.
4
MN10
—
R/W
3
MN03
—
R/W
Counting One’s Position of Minutes
2
MN02
—
R/W
1
MN01
—
R/W
Counts on 0 to 9 once per minute. When a carry is
generated, 1 is added to the ten’s position.
0
MN00
—
R/W
Note: * Initial value after RES.
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Section 11 Realtime Clock (RTC)
11.3.3
Hour Data Register (RHRDR)
RHRDR counts the BCD-coded hour value on the carry generated once per hour by RMINDR.
This register is initialized to H'00 by a STBY input or the RST bit in RTCCR1, but not initialized
by a RES input. The setting range is either decimal 0 to 11 or 0 to 23 by the selection of the 12/24
bit in RTCCR1.
Bit
Bit Name
Initial Value* R/W
Description
7
BSY
—
RTC Busy
R
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6
—
0
—
Reserved
This bit is always read as 0.
5
HR11
—
R/W
Counting Ten’s Position of Hours
4
HR10
—
R/W
Counts on 0 to 2 for ten’s position of hours.
3
HR03
—
R/W
Counting One’s Position of Hours
2
HR02
—
R/W
1
HR01
—
R/W
Counts on 0 to 9 once per hour. When a carry is
generated, 1 is added to the ten’s position.
0
HR00
—
R/W
Note: * Initial value after RES.
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Section 11 Realtime Clock (RTC)
11.3.4
Day-of-Week Data Register (RWKDR)
RWKDR counts the BCD-coded day-of-week value on the carry generated once per day by
RHRDR. This register is initialized to H'00 by a STBY input or the RST bit in RTCCR1, but not
initialized by a RES input. The setting range is decimal 0 to 6 using bits WK2 to WK0.
Bit
Bit Name
Initial Value* R/W
Description
7
BSY
—
RTC Busy
R
This bit is set to 1 when the RTC is updating (operating)
the values of second, minute, hour, and day-of-week data
registers. When this bit is 0, the values of second, minute,
hour, and day-of-week data registers must be adopted.
6 to —
3
All 0
—
Reserved
2
WK2
—
R/W
Day-of-Week Counting
1
WK1
—
R/W
Day-of-week is indicated with a binary code.
0
WK0
—
R/W
000: Sunday
These bits are always read as 0.
001: Monday
010: Tuesday
011: Wednesday
100: Thursday
101: Friday
110: Saturday
111: Reserved (Setting prohibited)
Note: * Initial value after RES.
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Section 11 Realtime Clock (RTC)
11.3.5
RTC Control Register 1 (RTCCR1)
RTCCR1 controls start/stop and reset of the clock timer. Bits 7 to 5 of this register are initialized
to H'00 by a STBY input or the RST bit in RTCCR1, but not initialized by a RES input. For the
definition of time expression, see figure 11.2.
Bit
Bit Name
Initial Value* R/W
Description
7
RUN
—
RTC Operation Start
R/W
0: Stops RTC and free running counter operation
1: Starts RTC and free running counter operation
6
12/24
—
R/W
Operating Mode
0: RTC operates in 12-hour mode. RHRDR counts on 0
to 11.
1: RTC operates in 24-hour mode. RHRDR counts on 0
to 23.
5
PM
—
R/W
A.M./P.M.
0: Indicates a.m. when RTC is in the 12-hour mode.
1: Indicates p.m. when RTC is in the 12-hour mode.
4
RST
0
R/W
Reset
0: Normal operation
1: Resets registers and control circuits except RTCCSR
and this bit. Clear this bit to 0 after having been set to 1.
3 to —
0
All 0
—
Reserved
These bits are always read as 0.
Note: * Initial value after RES.
Noon
24-hour count 0
12-hour count 0
PM
1
1
2
2
3
3
4
4
5 6 7
5 6 7
0 (Morning)
8
8
9 10 11 12 13 14 15 16 17
9 10 11 0 1 2 3 4 5
1 (Afternoon)
24-hour count 18 19 20 21 22 23 0
12-hour count 6 7 8 9 10 11 0
1 (Afternoon)
0
PM
Figure 11.2 Definition of Time Expression
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Section 11 Realtime Clock (RTC)
11.3.6
RTC Control Register 2 (RTCCR2)
RTCCR2 controls RTC periodic interrupts of weeks, days, hours, minutes, and seconds. This
register is initialized to H'00 by a STBY input or the RST bit in RTCCR1, but not initialized by a
RES input. Enabling interrupts of weeks, days, hours, minutes, and seconds sets the IRRTA flag to
1 in the interrupt flag register 1 (IRR1) when an interrupt occurs. It also controls an overflow
interrupt of a free running counter when RTC operates as a free running counter.
Bit
Bit Name
7, 6 —
Initial Value* R/W
All 0
—
Description
Reserved
These bits are always read as 0.
5
FOIE
—
R/W
Free Running Counter Overflow Interrupt Enable
0: Disables an overflow interrupt
1: Enables an overflow interrupt
4
WKIE
—
R/W
Week Periodic Interrupt Enable
0: Disables a week periodic interrupt
1: Enables a week periodic interrupt
3
DYIE
—
R/W
Day Periodic Interrupt Enable
0: Disables a day periodic interrupt
1: Enables a day periodic interrupt
2
HRIE
—
R/W
Hour Periodic Interrupt Enable
0: Disables an hour periodic interrupt
1: Enables an hour periodic interrupt
1
MNIE
—
R/W
Minute Periodic Interrupt Enable
0: Disables a minute periodic interrupt
1: Enables a minute periodic interrupt
0
SEIE
—
R/W
Second Periodic Interrupt Enable
0: Disables a second periodic interrupt
1: Enables a second periodic interrupt
Note: * Initial value after RES.
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Section 11 Realtime Clock (RTC)
11.3.7
Clock Source Select Register (RTCCSR)
RTCCSR selects clock source. This register is initialized to H'08 by a STBY input or RES input. A
free running counter controls start/stop of counter operation by the RUN bit in RTCCR1. When a
clock other than 32.768 MHz is selected, the RTC is disabled and operates as an 8-bit free running
counter. An interrupt can be generated by setting 1 to the FOIE bit in RTCCR2 and enabling an
overflow interrupt of the free running counter. A clock in which the system clock is divided by 32,
16, 8, or 4 is output in high-speed mode, medium-speed mode, sleep mode, subactive mode, or
subsleep mode.
Bit
Bit Name
Initial Value R/W
Description
7
—
0
Reserved
—
This bit is always read as 0.
6
RCS6
0
R/W
Clock Output Selection
5
RCS5
0
R/W
Selects a clock output from the TMOW pin when the
TMOWE bit in UCTLR is set to 1.
00: φ/4
01: φ/8
10: φ/16
11: φ/32
4
—
0
—
Reserved
This bit is always read as 0.
3
RCS3
1
R/W
Clock Source Selection
2
RCS2
0
R/W
0000: φ/8⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
1
RCS1
0
R/W
0001: φ/32⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0
RCS0
0
R/W
0010: φ/128⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0011: φ/256⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0100: φ/512⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0101: φ/2048⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0110: φ/4096⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
0111: φ/8192⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅⋅ Free running counter operation
1000: 32.768 kHz⋅⋅⋅⋅⋅RTC operation
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Section 11 Realtime Clock (RTC)
11.3.8
Extended Module Stop Register (EXMDLSTP)
EXMDLSTP controls the clock supply of the RTC and USB.
Note: When reading pin states using the port D register (PORTD), after accessing EXMDLSTP
(address range: H'FFFF40 to H'FFFF5F), you must perform a dummy read to the external
address space (such as H'FFEF00 to H'FF7FF) outside the range H'FFFF40 to H'FFFF5F
before reading PORTD.
Bit
Bit Name
Initial Value
R/W
Module
7 to
2
⎯
Undefined
⎯
Reserved
1
RTCSTOP
These bits are always read as undefined values.
These bits should not to be modified.
0
R/W
RTC Module Stop
0: RTC module stop cancelled
1: RTC module stop
0
USBSTOP1
0
R/W
USB Module Stop
0: USB module stop partly cancelled
1: USB module completely stop
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Section 11 Realtime Clock (RTC)
11.4
Operation
11.4.1
Initial Settings of Registers after Power-On and Resetting Procedure
The RTC registers that store second, minute, hour, day-of week, operating mode, and A.M./P.M.
data are not reset by an STBY input. Therefore, all registers must be set to their initial values after
power-on and STBY input. Figure 11.3 shows the initial setting and resetting procedures of the
RTC. Once the register setting are made, the RTC provides an accurate time as long as power is
supplied regardless of a RES input.
RST in RTCCR1=1
Clock count controller is reset.
RST in RTCCR1=0
Set RSECDR, RMINDR,
RHRDR, RWKDR,
12/24 in RTCCR1, and PM
RUN in RTCCR1=1
Second, minute, hour, day-of-week,
operating mode, and a.m/p.m are set.
RTC operation is started.
Figure 11.3 Initial Setting Procedure
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Section 11 Realtime Clock (RTC)
11.4.2
Time Data Reading Procedure
When the seconds, minutes, hours, or day-of-week datum is updated while time data is being read,
the data obtained may not be correct, and so the time data must be read again. Figure 11.4 shows
an example in which correct data is not obtained. In this example, since only RSECDR is read
after data update, about 1-minute inconsistency occurs.
To avoid reading in this timing, the following processing must be performed.
1. Check the setting of the BSY bit, and when the BSY bit changes from 1 to 0, read from the
second, minute, hour, and day-of-week registers. When about 62.5 ms is passed after the BSY
bit is set to 1, the registers are updated, and the BSY bit is cleared to 0.
2. Making use of interrupts, read from the second, minute, hour, and day-of week registers after
the IRQ5F flag in ISR is set to 1 and the BSY bit is confirmed to be 0.
3. Read from the second, minute, hour, and day-of week registers twice in a row, and if there is
no change in the read data, the read data is used.
Before update
RWKDR = H'03, RHDDR = H'13, RMINDR = H'46, RSECDR = H'59
Processing flow
BSY bit = 0
(1) Day-of-week data register read
H'03
(2) Hour data register read
H'13
(3) Minute data register read
H'46
BSY bit -> 1 (under data update)
After update
RWKDR = H'03, RHDDR = H'13, RMINDR = H'47, RSECDR = H'00
BSY bit -> 0
(4) Second data register read
H'00
Figure 11.4 Example: Reading of Inaccurate Time Data
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Section 11 Realtime Clock (RTC)
11.5
Interrupt Source
The RTC interrupt sources are listed in table 11.2. There are five kinds of RTC interrupts: week
interrupts, day interrupts, hour interrupts, minute interrupts, and second interrupts.
When using an interrupt, initiate the RTC last after other registers (include ISCRH and IER of
interrupt controller) are set. Do not set multiple interrupt enable bits in RTCCR2 simultaneously
to 1.
When an interrupt request of the RTC occurs, the IRQ5F flag in ISR is set to 1. When clearing the
flag, write 0 after reading the flag = 1.
Figure 11.5 shows the initializing setting procedure in using the RTC interrupt and figure 11.6
shows an example of the RTC interrupt handling routine.
Table 11.2 Interrupt Source
Interrupt Name
Interrupt Source
Interrupt Enable Bit
Overflow interrupt
Occurs when the free running counter is
overflown.
FOIE
Week periodic interrupt
Occurs every week when the day-of-week
date register value becomes 0.
WKIE
Day periodic interrupt
Occurs every day when the day-of-week date
register is counted.
DYIE
Hour periodic interrupt
Occurs every hour when the hour date
register is counted.
HRIE
Minute periodic interrupt
Occurs every minute when the minute date
register is counted.
MNIE
Second periodic interrupt
Occurs every second when the second date
register is counted.
SEIE
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Section 11 Realtime Clock (RTC)
Set IRQ5SCB = 0 and
IRQ5SCA = 1 in
ISCRH register
Set the falling edge of IRQ5
Read ISR register
Clear the IRQ5F flag
Write 0 to bit 5 in ISR register
Set RTC register
Write 1 to bit 5 in IER
IRQ5 is enabled
RUN in RTCCR1 = 1
Figure 11.5 Initializing Procedure in Using RTC Interrupt
Read ISR register
Clear the IRQ5F flag
Write 0 to bit 5 in ISR register
Interrupt handling
RTE
Figure 11.6 Example of RTC Interrupt Handling Routine
11.6
Operating State in Each Mode
Table 11.3 shows the operating state in each mode when the RTC is set for clock operation and
free running timer operation. The clock operation is performed continuously even in low power
mode. Therefore, when the clock operation is unnecessary, cancel it by EXMDLSTP.
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Section 11 Realtime Clock (RTC)
Table 11.3 Operating State in Each Mode
High-
Medium-
Software
Hard-ware
Function
Speed
Speed
Sleep
Stop
Watch
Subactive
Subsleep
Standby
Standby
Clock operation
Subclock
Subclock
Subclock
Halted
Subclock
Subclock
Subclock
Subclock
Halted
operation
operation
operation
(Retained)
operation
operation
operation
operation
(Reset)
Operating
Operating
Operating
Halted
Halted
Halted
Halted
Halted
Halted
(Retained)
(Retained)
(Retained)
(Retained)
(Retained)
(Reset)
Free running
Module
timer operation
11.7
Usage Notes
(1) Notes on Using the Emulator
In the E6000 emulator the RTC module is mounted on an external extended board. Since it must
be accessed as an external module, the limitations listed below apply. These limitations do not
apply to the E10A or to product chips.
• RTC operation is not supported in the H8S/2218 Group's mode 7 (single-chip mode).
• When using the RTC module in the H8S/2218 Group's mode 6 (on-chip ROM-enabled mode)
or the H8S/2212 Group's mode 7 (single-chip mode), A7 to A0 are input pins in the initial
status. Therefore, A7 to A0 must be set as output pins by setting PC7DDR to PC0DDR to H'FF
before accessing the RTC module.
• The above setting is not necessary when using the RTC module in the H8S/2218 Group's
modes 4 and 5 (on-chip ROM-disabled mode) because A7 to A0 are output pins.
(2) Bus Interface
The bus interface of the module conforms to the bus specifications for external area 7.
Consequently, before accessing the RTC module, area 7 must be specified as having an 8-bit bus
width and 3-state access using the bus controller register.
(3) Method for Reading Pin States Using the Port D Register (PORTD)
First access EXMDLSTP or the RTC register (address range: H'FFFF40 to H'FFFF5F). Then, you
must perform a dummy read to the external address space (such as H'FFEF00 to H'FF7FF) outside
the range H'FFFF40 to H'FFFF5F before reading PORTD.
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Section 12 Serial Communication Interface
Section 12 Serial Communication Interface
This LSI has two independent serial communication interface (SCI) channels. The SCI can handle
both asynchronous and clocked synchronous serial communication. Asynchronous serial data
communication can be carried out using standard asynchronous communication chips such as a
Universal Asynchronous Receiver/Transmitter (UART) or an Asynchronous Communication
Interface Adapter (ACIA). A function is also provided for serial communication between
processors (multiprocessor communication function). The SCI also supports the smart card (IC
card) interface based on ISO/IEC 7816-3 (Identification Card) as an enhanced asynchronous
communication function.
12.1
Features
• Choice of asynchronous or clocked synchronous serial communication mode
• Full-duplex communication capability
The transmitter and receiver are mutually independent, enabling transmission and reception to
be executed simultaneously.
Double-buffering is used in both the transmitter and the receiver, enabling continuous
transmission and continuous reception of serial data.
On-chip baud rate generator allows any bit rate to be selected
External clock can be selected as a transfer clock source (except for in Smart Card interface
mode).
• Choice of LSB-first or MSB-first transfer (except in the case of asynchronous mode 7-bit data)
• Four interrupt sources
Transmit-end, transmit-data-empty, receive-data-full, and receive error — that can issue
requests.
The transmit-data-empty interrupt and receive data full interrupts can be used to activate the
direct memory access controller (DMAC).
• Module stop mode can be set
Asynchronous Mode
• Data length: 7 or 8 bits
• Stop bit length: 1 or 2 bits
• Parity: Even, odd, or none
• Receive error detection: Parity, overrun, and framing errors
• Break detection: Break can be detected by reading the RxD pin level directly in the case of a
framing error
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Section 12 Serial Communication Interface
• Average transfer rate generator (SCI_0):
921.569 kbps, 720 kbps, 460.784 kbps, or 115.196 kbps can be selected at 16 MHz
921.053 kbps, 720 kbps, 460.526 kbps, or 115.132 kbps can be selected at 24 MHz
• A transfer rate clock can be input from the TPU (SCI_0)
• Communication between multiple processors is supported
Clocked Synchronous Mode
• Data length: 8 bits
• Receive error detection: Overrun errors detected
• SCI select function (SCI_0): TxD0 = high-impedance and SCK0 = fixed high-level input can
selected when IRQ7 = 1)
• Serial data communication can be carried out with other chips that have a synchronous
communication function
Smart Card Interface
• An error signal can be automatically transmitted on detection of a parity error during reception
• Data can be automatically re-transmitted on detection of a error signal during transmission
• Both direct convention and inverse convention are supported
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Section 12 Serial Communication Interface
12.1.1
Block Diagram
Module data bus
RxD0
RDR
TDR
RSR
TSR
PG1/IRQ7
Parity generation
Parity
check
BRR
SCMR
SSR
SCR
SMR
SEMRA_0
SEMRB_0
control
transmission
and reception
TxD0
Internal data bus
Bus interface
Figure 12.1 shows the block diagram of the SCI_0. Figure 12.2 shows the block diagram of the
SCI_2.
φ
Baud rate
generator
φ/4
φ/16
φ/64
Clock
TEI
TXI
RXI
ERI
C/A
CKE1
SSE
Average transfer
rate generator
External clock
SCK0
SCI transfer
clock generator
in TPU
10.667 MHz
· 115.152 kbps
· 460.606 kbps
16 MHz
· 115.196 kbps
· 460.784 kbps
· 720 kbps
· 921.569 kbps
24 MHz
· 115.132 kbps
· 460.526 kbps
· 720 kbps
· 921.053 kbps
TIOCA0
TIOCC0
TIOCA1 TPU
TIOCA2
Legend:
RSR: Receive shift register
RDR: Receive data register
TSR: Transmit shift register
TDR: Transmit data register
SMR: Serial mode register
SCR:
SSR:
SCMR:
BRR:
SEMRA_0:
SEMRB_0:
Serial control register
Serial status register
Smart card mode register
Bit rate register
Serial extended mode register A_0
Serial extended mode register B_0
Figure 12.1 Block Diagram of SCI_0
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Module data bus
TDR
RDR
SCMR
BRR
SSR
φ
SCR
RxD
RSR
TSR
Baud rate
generator
SMR
φ/16
control
transmission
and reception
TxD
Detecting parity
φ/4
φ/64
Clock
Parity check
External clock
SCK
Legend:
RSR: Receive shift register
RDR: Receive data register
TSR: Transmit shift register
TDR: Transmit data register
SMR: Serial mode register
SCR: Serial control register
SSR: Serial status register
SCMR: Smart card register
BRR: Bit rate register
Figure 12.2 Block Diagram of SCI_2
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TEI
TXI
RXI
ERI
Internal data bus
Bus interface
Section 12 Serial Communication Interface
Section 12 Serial Communication Interface
12.2
Input/Output Pins
Table 12.1 shows the serial pins for each SCI channel.
Table 12.1 Pin Configuration
Channel
Pin Name*
I/O
Function
0
SCK0
I/O
SCI_0 clock input/output
RxD0
Input
SCI_0 receive data input
2
TxD0
Output
SCI_0 transmit data output
SCK2
I/O
SCI_2 clock input/output
RxD2
Input
SCI_2 receive data input
TxD2
Output
SCI_2 transmit data output
Note: * Pin names SCK, RxD, and TxD are used in the text for all channels, omitting the channel
designation.
12.3
Register Descriptions
The SCI has the following registers for each channel. Some bits in the serial mode register (SMR),
serial status register (SSR), and serial control register (SCR) have different functions in different
modes⎯normal serial communication interface mode and smart card interface mode; therefore,
the bits are described separately for each mode in the corresponding register sections.
• Receive shift register (RSR)
• Receive data register (RDR)
• Transmit data register (TDR)
• Transmit shift register (TSR)
• Serial mode register (SMR)
• Serial control register (SCR)
• Serial status register (SSR)
• Smart card mode register (SCMR)
• Serial extended mode register A_0 (SEMRA_0) (only for channel 0)
• Serial extended mode register B_0 (SEMRB_0) (only for channel 0)
• Bit rate register (BRR)
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Section 12 Serial Communication Interface
12.3.1
Receive Shift Register (RSR)
RSR is a shift register that is used to receive serial data input to the RxD pin and convert it into
parallel data. When one byte of data has been received, it is transferred to RDR automatically.
RSR cannot be directly accessed by the CPU.
12.3.2
Receive Data Register (RDR)
RDR is an 8-bit register that stores received data. When the SCI has received one byte of serial
data, it transfers the received serial data from RSR to RDR, where it is stored. After this, RSR is
receive-enabled. As RSR and RDR function as a double buffer in this way, continuous receive
operations are possible. After confirming that the RDRF bit in SSR is set to 1, read RDR only
once. RDR cannot be written to by the CPU. RDR is initialized to H'00 by a reset, and in standby
mode, watch mode, subactive mode, subsleep mode, or module stop mode.
12.3.3
Transmit Data Register (TDR)
TDR is an 8-bit register that stores data for transmission. When the SCI detects that TSR is empty,
it transfers the transmit data written in TDR to TSR and starts transmission. The double-buffered
structure of TDR and TSR enables continuous serial transmission. If the next transmit data has
already been written to TDR during serial transmission, the SCI transfers the written data to TSR
to continue transmission. Although TDR can be read from or written to by the CPU at all times, to
achieve reliable serial transmission, write transmit data to TDR only once after confirming that the
TDRE bit in SSR is set to 1. TDR is initialized to H'FF by a reset, and in standby mode, watch
mode, subactive mode, subsleep mode, or module stop mode.
12.3.4
Transmit Shift Register (TSR)
TSR is a shift register that transmits serial data. To perform serial data transmission, the SCI first
transfers transmit data from TDR to TSR, then sends the data to the TxD pin. TSR cannot be
directly accessed by the CPU.
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Section 12 Serial Communication Interface
12.3.5
Serial Mode Register (SMR)
SMR is used to set the SCI's serial transfer format and select the baud rate generator clock source.
Some bits in SMR have different functions in normal mode and smart card interface mode.
• Normal Serial Communication Interface Mode (When SMIF in SCMR is 0)
Bit
Bit Name Initial Value
R/W
7
C/A
R/W
0
Description
Communication Mode
0: Asynchronous mode
1: Clocked synchronous mode
6
CHR
0
R/W
Character Length (enabled only in asynchronous mode)
0: Selects 8 bits as the data length
1: Selects 7 bits as the data length. LSB-first is fixed
and the MSB of TDR is not transmitted in
transmission
In clocked synchronous mode, a fixed data length of 8
bits is used.
5
PE
0
R/W
Parity Enable (enabled only in asynchronous mode)
When this bit is set to 1, the parity bit is added to
transmit data before transmission, and the parity bit is
checked in reception. For a multiprocessor format, parity
bit addition and checking are not performed regardless
of the PE bit setting.
4
O/E
0
R/W
Parity Mode (enabled only when the PE bit is 1 in
asynchronous mode)
0: Selects even parity
1: Selects odd parity
3
STOP
0
R/W
Stop Bit Length (enabled only in asynchronous mode)
Selects the stop bit length in transmission.
0: 1 stop bit
1: 2 stop bits
In reception, only the first stop bit is checked. If the
second stop bit is 0, it is treated as the start bit of the
next transmit character.
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Section 12 Serial Communication Interface
Bit
Bit Name Initial Value
R/W
Description
2
MP
R/W
Multiprocessor Mode (enabled only in asynchronous
mode)
0
When this bit is set to 1, the multiprocessor
communication function is enabled. The PE bit and O/E
bit settings are invalid in multiprocessor mode. For
details, see section 12.5, Multi Processor
Communication Function.
1
CKS1
0
R/W
Clock Select 0 and 1:
0
CKS0
0
R/W
These bits select the clock source for the baud rate
generator.
00: φ clock (n = 0)
01: φ/4 clock (n = 1)
10: φ/16 clock (n = 2)
11: φ/64 clock (n = 3)
For the relationship between the bit rate register setting
and the baud rate, see section 12.3.11, Bit Rate Register
(BRR). n is the decimal representation of the value of n
in BRR (see section 12.3.11, Bit Rate Register (BRR)).
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Section 12 Serial Communication Interface
• Smart Card Interface Mode (When SMIF in SCMR is 1)
Bit
Bit Name Initial Value
R/W
Description
7
GM
0
R/W
6
BLK
0
R/W
GSM Mode
Setting this bit to 1 allows GSM mode operation. In GSM
mode, the TEND set timing is put forward to 11.0 etu
from the start and the clock output control function is
appended. For details, see section 12.7.9, Clock Output
Control.
0: Normal smart card interface mode operation
(initial value)
(1) The TEND flag is generated 12.5 etu (11.5 etu in the
block transfer mode) after the beginning of the start
bit.
(2) Clock output on/off control only.
1: GSM mode operation in smart card interface mode
(1) The TEND flag is generated 11.0 etu after the
beginning of the start bit.
(2) In addition to clock output on/off control, high/how
fixed control is supported (set using SCR).
Setting this bit to 1 allows block transfer mode operation.
For details, see section 12.7.4, Block Transfer Mode.
0: Normal smart card interface mode operation
(initial value)
(1) Error signal transmission, detection, and automatic
data retransmission are performed.
(2) The TXI interrupt is generated by the TEND flag.
(3) The TEND flag is set 12.5 etu (11.0 etu in the GSM
mode) after transmission starts.
1: Operation in block transfer mode
(1) Error signal transmission, detection, and automatic
data retransmission are not performed.
(2) The TXI interrupt is generated by the TDRE flag.
(3) The TEND flag is set 11.5 etu (11.0 etu in the GSM
mode) after transmission starts.
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Section 12 Serial Communication Interface
Bit
Bit Name Initial Value
R/W
Description
5
PE
R/W
Parity Enable
0
When this bit is set to 1, the parity bit is added to
transmit data before transmission, and the parity bit is
checked in reception. Set this bit to 1 in smart card
interface mode.
4
O/E
0
R/W
Parity Mode (valid only when the PE bit is 1)
0: Selects even parity
1: Selects odd parity
For details on the usage of this bit in smart card interface
mode, see section 12.7.2, Data Format (Except in Block
Transfer Mode).
3
BCP1
0
R/W
Basic Clock Pulse 1 and 0
2
BCP0
0
R/W
These bits select the number of basic clock cycles in a 1bit data transfer time in smart card interface mode.
00: 32 clock cycles (S = 32)
01: 64 clock cycles (S = 64)
10: 372 clock cycles (S = 372)
11: 256 clock cycles (S = 256)
For details, see section 12.7.5, Receive Data Sampling
Timing and Reception Margin. S is described in section
12.3.11, Bit Rate Register (BRR).
1
CKS1
0
R/W
Clock Select 1 and 0
0
CKS0
0
R/W
These bits select the clock source for the baud rate
generator.
00: φ clock (n = 0)
01: φ/4 clock (n = 1)
10: φ/16 clock (n = 2)
11: φ/64 clock (n = 3)
For the relation between the bit rate register setting and
the baud rate, see section 12.3.11, Bit Rate Register
(BRR). n is the decimal display of the value of n in BRR
(see section 12.3.11, Bit Rate Register (BRR)).
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Section 12 Serial Communication Interface
12.3.6
Serial Control Register (SCR)
SCR is a register that enables or disables SCI transfer operations and interrupt requests, and is also
used to selection of the transfer clock source. For details on interrupt requests, refer to section
12.9, Interrupts. Some bits in SCR have different functions in normal mode and smart card
interface mode.
• Normal Serial Communication Interface Mode (When SMIF in SCMR is 0)
Bit
Bit Name Initial Value
R/W
Description
7
TIE
R/W
Transmit Interrupt Enable
0
When this bit is set to 1, the TXI interrupt request is
enabled.
TXI interrupt request cancellation can be performed by
reading 1 from the TDRE flag, then
clearing it to 0, or clearing the TIE bit to 0.
6
RIE
0
R/W
Receive Interrupt Enable
When this bit is set to 1, RXI and ERI interrupt requests
are enabled.
RXI and ERI interrupt request cancellation can be
performed by reading 1 from the RDRF flag, or the FER,
PER, or ORER flag, then clearing the flag to 0, or
clearing the RIE bit to 0.
5
TE
0
R/W
Transmit Enable
When this bit s set to 1, transmission is enabled.
In this state, serial transmission is started when transmit
data is written to TDR and the TDRE flag in SSR is
cleared to 0. SMR setting must be performed to decide
the transfer format before setting the TE bit to 1. The
TDRE flag in SSR is fixed at 1 if transmission is disabled
by clearing this bit to 0.
4
RE
0
R/W
Receive Enable
When this bit is set to 1, reception is enabled.
Serial reception is started in this state when a start bit is
detected in asynchronous mode or serial clock input is
detected in clocked synchronous mode. SMR setting
must be performed to decide the transfer format before
setting the RE bit to 1.
Clearing the RE bit to 0 does not affect the RDRF, FER,
PER, and ORER flags, which retain their states.
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Section 12 Serial Communication Interface
Bit
Bit Name Initial Value
R/W
Description
3
MPIE
R/W
Multiprocessor Interrupt Enable (enabled only when the
MP bit in SMR is 1 in asynchronous mode)
0
When this bit is set to 1, receive data in which the
multiprocessor bit is 0 is skipped, and setting of the
RDRF, FER, and ORER status flags in SSR is
prohibited. On receiving data in which the multiprocessor
bit is 1, this bit is automatically cleared and normal
reception is resumed. For details, refer to section 12.5,
Multiprocessor Communication Function.
When receive data including MPB = 0 is received,
receive data transfer from RSR to RDR, receive error
detection, and setting of the RDRF, FER, and ORER
flags in SSR, is not performed. When receive data
including MPB = 1 is received, the MPB bit in SSR is set
to 1, the MPIE bit is cleared to 0 automatically, and
generation of RXI and ERI interrupts (when the TIE and
RIE bits in SCR are set to 1) and FER and ORER flag
setting is enabled.
2
TEIE
0
R/W
Transmit End Interrupt Enable
This bit is set to 1, TEI interrupt request is enabled. TEI
cancellation can be performed by reading 1 from the
TDRE flag in SSR, then clearing it to 0 and clearing the
TEND flag to 0, or clearing the TEIE bit to 0.
1
CKE1
0
R/W
Clock Enable 0 and 1
0
CKE0
0
R/W
Selects the clock source and SCK pin function.
Asynchronous mode
00: Internal baud rate generator
SCK pin functions as I/O port
01: Internal baud rate generator
Outputs a clock of the same frequency as the bit
rate from the SCK pin.
1×: External clock
Inputs a clock with a frequency 16 times the bit rate
from the SCK pin.
Clocked synchronous mode
0×: Internal clock (SCK pin functions as clock output)
1×: External clock (SCK pin functions as clock input)
Legend:
×: Don’t care
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Section 12 Serial Communication Interface
• Smart Card Interface Mode (When SMIF in SCMR is 1)
Bit
7
Bit Name Initial Value
TIE
0
R/W
R/W
Description
Transmit Interrupt Enable
When this bit is set to 1, TXI interrupt request is enabled.
TXI interrupt request cancellation can be performed by
reading 1 from the TDRE flag in SSR, then clearing it to
0, or clearing the TIE bit to 0.
6
RIE
0
R/W
Receive Interrupt Enable
When this bit is set to 1, RXI and ERI interrupt requests
are enabled.
RXI and ERI interrupt request cancellation can be
performed by reading 1 from the RDRF, FER, PER, or
ORER flag in SSR, then clearing the flag to 0, or clearing
the RIE bit to 0.
5
TE
0
R/W
Transmit Enable
When this bit s set to 1, transmission is enabled.
In this state, serial transmission is started when transmit
data is written to TDR and the TDRE flag in SSR is
cleared to 0.
SMR setting must be performed to decide the transfer
format before setting the TE bit to 1. When this bit is
cleared to 0, the transmission operation is disabled, and
the TDRE flag is fixed at 1.
4
RE
0
R/W
Receive Enable
When this bit is set to 1, reception is enabled.
Serial reception is started in this state when a start bit is
detected in asynchronous mode or serial clock input is
detected in clocked synchronous mode.
SMR setting must be performed to decide the reception
format before setting the RE bit to 1.
Clearing the RE bit to 0 does not affect the RDRF,
FER,PER, and ORER flags, which retain their states.
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Section 12 Serial Communication Interface
Bit
Bit Name Initial Value
R/W
Description
3
MPIE
R/W
Multiprocessor Interrupt Enable (enabled only when the MP
bit in SMR is 1 in asynchronous mode)
0
Write 0 to this bit in Smart Card interface mode.
When receive data including MPB = 0 is received, receive
data transfer from RSR to RDR, receive error detection,
and setting of the RERF, FER, and ORER flags in SSR,
are not performed.
When receive data including MPB = 1 is received, the MPB
bit in SSR is set to 1, the MPIE bit is cleared to 0
automatically, and generation of RXI and ERI interrupts
(when the TIE and RIE bits in SCR are set to 1) and FER
and ORER flag setting are enabled.
2
TEIE
0
R/W
Transmit End Interrupt Enable
Write 0 to this bit in Smart Card interface mode.
TEI cancellation can be performed by reading 1 from the
TDRE flag in SSR, then clearing it to 0 and clearing the
TEND flag to 0, or clearing the TEIE bit to 0.
1
CKE1
0
0
CKE0
0
R/W
Clock Enable 0 and 1
Enables or disables clock output from the SCK pin. The
clock output can be dynamically switched in GSM mode.
For details, refer to section 12.7.9, Clock Output Control.
When the GM bit in SMR is 0:
00: Output disabled (SCK pin can be used as an I/O port
pin)
01: Clock output
1×: Reserved
When the GM bit in SMR is 1:
00: Output fixed low
01: Clock output
10: Output fixed high
11: Clock output
Legend:
×: Don’t care
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Section 12 Serial Communication Interface
12.3.7
Serial Status Register (SSR)
SSR is a register containing status flags of the SCI and multiprocessor bits for transfer. 1 cannot be
written to flags TDRE, RDRF, ORER, PER, and FER; they can only be cleared. Some bits in SSR
have different functions in normal mode and smart card interface mode.
• Normal Serial Communication Interface Mode (When SMIF in SCMR is 0)
Bit
Bit Name Initial Value
R/W
7
TDRE
R/(W)* Transmit Data Register Empty
1
Description
Displays whether TDR contains transmit data.
[Setting conditions]
•
When the TE bit in SCR is 0
•
When data is transferred from TDR to TSR and data
can be written to TDR
[Clearing conditions]
6
RDRF
0
•
When 0 is written to TDRE after reading TDRE = 1
•
When the DMAC is activated by a TXI interrupt
request and writes data to TDR
R/(W)* Receive Data Register Full
Indicates that the received data is stored in RDR.
[Setting condition]
When serial reception ends normally and receive data is
transferred from RSR to RDR
[Clearing conditions]
•
When 0 is written to RDRF after reading RDRF = 1
•
When the DMAC is activated by an RXI interrupt and
transferred data from RDR
RDR and the RDRF flag are not affected and retain their
previous values when the RE bit in SCR is cleared to 0.
The RDRF flag is not affected and retains their previous
values when the RE bit in SCR is cleared to 0.
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Section 12 Serial Communication Interface
Bit
Bit Name Initial Value
R/W
5
ORER
R/(W)* Overrun Error
0
Description
[Setting condition]
•
When the next serial reception is completed while
RDRF = 1
The receive data prior to the overrun error is retained
in RDR, and the data received subsequently is lost.
Also, subsequent serial reception cannot be
continued while the ORER flag is set to 1. In clocked
synchronous mode, serial transmission cannot be
continued, either.
[Clearing condition]
•
4
FER
0
When 0 is written to ORER after reading ORER = 1
The ORER flag is not affected and retains its
previous state when the RE bit in SCR is cleared to
0.
R/(W)* Framing Error
[Setting condition]
•
When the stop bit is 0
In 2-stop-bit mode, only the first stop bit is checked
for a value of 0; the second stop bits not checked. If
a framing error occurs, the receive data is transferred
to RDR but the RDRF flag is not set. Also,
subsequent serial reception cannot be continued
while the FER flag is set to 1. In clocked
synchronous mode, serial transmission cannot be
continued, either.
[Clearing condition]
•
Rev.6.00 Jun. 03, 2008 Page 378 of 698
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When 0 is written to FER after reading FER = 1
The FER flag is not affected and retains its previous
state when the RE bit in SCR is cleared to 0.
Section 12 Serial Communication Interface
Bit
Bit Name Initial Value
R/W
3
PER
R/(W)* Parity Error
0
Description
[Setting condition]
•
When a parity error is detected during reception
If a parity error occurs, the receive data is transferred
to RDR but the RDRF flag is not set. Also,
subsequent serial reception cannot be continued
while the PER flag is set to 1. In clocked
synchronous mode, serial transmission cannot be
continued, either.
[Clearing condition]
•
2
TEND
1
R
When 0 is written to PER after reading PER = 1
The PER flag is not affected and retains its previous
state when the RE bit in SCR is cleared to 0.
Transmit End
[Setting conditions]
•
When the TE bit in SCR is 0
•
When TDRE = 1 at transmission of the last bit of a 1byte serial transmit character
[Clearing conditions]
1
MPB
0
R
•
When 0 is written to TDRE after reading TDRE = 1
•
When the DMAC is activated by a TXI interrupt and
writes data to TDR
Multiprocessor Bit
MPB stores the multiprocessor bit in the receive data.
When the RE bit in SCR is cleared to 0 its previous state
is retained. This bit retains its previous state when the
RE bit in SCR is cleared to 0.
0
MPBT
0
R/W
Multiprocessor Bit Transfer
MPBT stores the multiprocessor bit to be added to the
transmit data.
Note:* The write value should always be 0 to clear the flag.
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Section 12 Serial Communication Interface
• Smart Card Interface Mode (When SMIF in SCMR is 1)
Bit
Bit Name Initial Value R/W
7
TDRE
1
Description
R/(W)* Transmit Data Register Empty
Indicates whether TDR contains transmit data.
[Setting conditions]
•
When the TE bit in SCR is 0
•
When data is transferred from TDR to TSR and data
can be written to TDR
[Clearing conditions]
6
RDRF
0
•
When 0 is written to TDRE after reading TDRE = 1
•
When the DMAC is activated by a TXI interrupt
request and writes data to TDR
R/(W)* Receive Data Register Full
Indicates that the received data is stored in RDR.
[Setting condition]
When serial reception ends normally and receive data is
transferred from RSR to RDR
[Clearing conditions]
•
When 0 is written to RDRF after reading RDRF = 1
•
When the DMAC is activated by an RXI interrupt and
transferred data from RDR
The RDRF flag is not affected and retains their previous
values when the RE bit in SCR is cleared to 0.
If reception of the next data is completed while the RDRF
flag is still set to 1, an overrun error will occur and the
receive data will be lost.
Rev.6.00 Jun. 03, 2008 Page 380 of 698
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Section 12 Serial Communication Interface
Bit
Bit Name Initial Value R/W
5
ORER
0
Description
R/(W)* Overrun Error
Indicates that an overrun error occurred during reception,
causing abnormal termination.
[Setting condition]
•
When the next serial reception is completed while
RDRF = 1
The receive data prior to the overrun error is retained
in RDR, and the data received subsequently is lost.
Also, subsequent serial cannot be continued while the
ORER flag is set to 1. In clocked synchronous mode,
serial transmission cannot be continued, either.
[Clearing condition]
•
When 0 is written to ORER after reading ORER = 1
The ORER flag is not affected and retains its previous
state when the RE bit in SCR is cleared to 0.
4
ERS
0
R/(W)* Error Signal Status
Indicates that the status of an error, signal 1 returned from
the reception side at reception
[Setting condition]
•
When the low level of the error signal is sampled
[Clearing condition]
•
When 0 is written to ERS after reading ERS = 1
The ERS flag is not affected and retains its previous
state when the RE bit in SCR is cleared to 0.
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Section 12 Serial Communication Interface
Bit
Bit Name Initial Value R/W
3
PER
0
Description
R/(W)* Parity Error
Indicates that a parity error occurred during reception
using parity addition in asynchronous mode, causing
abnormal termination.
[Setting condition]
•
When a parity error is detected during reception
If a parity error occurs, the receive data is transferred
to RDR but the RDRF flag is not set. Also, subsequent
serial reception cannot be continued while the PER
flag is set to 1. In clocked synchronous mode, serial
transmission cannot be continued, either.
[Clearing condition]
•
When 0 is written to PER after reading PER = 1
The PER flag is not affected and retains its previous
state when the RE bit in SCR is cleared to 0.
2
TEND
1
R
Transmit End
This bit is set to 1 when no error signal has been sent
back from the receiving end and the next transmit data is
ready to be transferred to TDR.
[Setting conditions]
•
When the TE bit in SCR is 0 and the ERS bit is also 0
•
When the ERS bit is 0 and the TDRE bit is 1 after the
specified interval following transmission of 1-byte data.
The timing of bit setting differs according to the register
setting as follows:
When GM = 0 and BLK = 0, 12.5 etu after transmission
starts
When GM = 0 and BLK = 1, 11.5 etu after transmission
starts
When GM = 1 and BLK = 0, 11.0 etu after transmission
starts
When GM = 1 and BLK = 1, 11.0 etu after transmission
starts
[Clearing conditions]
•
When 0 is written to TDRE after reading TDRE = 1
•
When the DMAC is activated by a TXI interrupt and
transfers transmission data to TDR
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Section 12 Serial Communication Interface
Bit
Bit Name Initial Value R/W
Description
1
MPB
Multiprocessor Bit
0
R
This bit is not used in Smart Card interface mode.
0
MPBT
0
R/W
Multiprocessor Bit Transfer
Write 0 to this bit in Smart Card interface mode.
Note:* The write value should always be 0 to clear the flag.
12.3.8
Smart Card Mode Register (SCMR)
SCMR is a register that selects the transfer format. In this LSI, Smart Card interface mode cannot
be specified.
Bit
Bit Name Initial Value
7 to 4 —
All 1
R/W
—
Description
Reserved
These bits are always read as 1.
3
DIR
0
R/W
Data Transfer Direction
Selects the serial/parallel conversion format.
0: LSB-first in transfer
1: MSB-first in transfer
The bit setting is valid only when the transfer data format
is 8 bits.
2
INV
0
R/W
Data Invert
Specifies inversion of the data logic level. The SINV bit
does not affect the logic level of the parity bit. To invert
the parity bit, invert the O/E bit in SMR.
0: TDR contents are transmitted as they are. Receive
data is stored as it is in RDR
1: TDR contents are inverted before being transmitted.
Receive data is stored in inverted form in RDR
1
—
1
—
Reserved
This bit is always read as 1.
0
SMIF
0
R/W
Smart Card Interface Mode Select
When this bit is set to 1, smart card interface mode is
selected.
0: Normal asynchronous or clocked synchronous mode
1: Smart card interface mode
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Section 12 Serial Communication Interface
12.3.9
Serial Extended Mode Register A_0 (SEMRA_0)
SEMRA_0 extends the functions of SCI_0. SEMR0 enables selection of the SCI_0 select function
in synchronous mode, base clock setting in asynchronous mode, and also clock source selection
and automatic transfer rate setting. Figure 12.3 shows an example of the internal base clock when
an average transfer rate is selected and figure 12.4 shows as example of the setting when the TPU
clock input is selected.
Bit
Bit Name Initial Value R/W Description
7
SSE
0
R/W SCI_0 Select Enable
Allows selection of the SCI0 select function when an
external clock is input in synchronous mode.
The SSE setting is valid when external clock input is used
(CKE1 = 1 in SCR) in synchronous mode (C/A = 1 in SMR).
0: SCI_0 select function disabled
1: SCI_0 select function enabled
When the SCI_0 select function is enabled, if 1 is input to
the PG1/IRQ7 pin, TxD0 output goes to the high-impedance
state, SCK0 input is fixed high.
6
TCS2
0
R/W TPU Clock Select
5
TCS1
0
4
TCS0
0
R/W When the TPU clock is input (ACS3 to ACS0 = B'0100) as
R/W the clock source in asynchronous mode, serial transfer
clock is generated depending on the combination of the
TPU clock.
Base Clock
Clock Enable
TCLKA
TCLKB
TCLKC
000
TIOCA1
TIOCA2
Base clock written
in the left column
Pin input
Pin input
001
TIOCA0 | TIOCC0
TIOCA1
Pin input
Base clock written
in the left column
Pin input
010
TIOCA0
TIOCA1 & TIOCA2
Pin input
Base clock written
in the left column
Pin input
011
TIOCA0 | TIOCC0
TIOCA1 & TIOCA2
Pin input
Base clock written
in the left column
Pin input
1××
Reserved (Setting prohibited)
Legend:
&: AND (logical multiplication)
I : OR (logical addition)
Note: The functions of bits 6 to 4 are not supported by the
E6000 emulator. Figure 12.4 shows the setting
examples.
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Section 12 Serial Communication Interface
Bit
Bit Name Initial Value R/W Description
3
ABCS
0
R/W Asynchronous Base Clock Select
Selects the 1-bit-interval base clock in asynchronous mode.
The ABCS setting is valid in asynchronous mode (C/A = 0
in SMR).
0: SCI_0 operates on base clock with frequency of 16
times transfer rate
1: SCI_0 operates on base clock with frequency of 8 times
transfer rate
2
ACS2
0
R/W Asynchronous Clock Source Select 2 to 0
1
ACS1
0
0
ACS0
0
R/W These bits select the clock source in asynchronous mode
R/W depending on the combination with the bit 7 (ACS3) in
SEMRB_0 (serial extended mode register B_0). When an
average transfer rate is selected, the base clock is set
automatically regardless of the ABCS value. Note that
average transfer rates support only 10.667 MHz, 16 MHz,
and 24 MHz, and not support other operating frequencies.
Set ACS3 to ACS0 when inputting the external clock (the
CKE1 bit in the SCR register is 1) in asynchronous mode
(the C/A bit in the SMR register is 0). Figures 12.3 and 12.4
show the setting examples.
ACS 3210
0000: External clock input
0001: 115.152 kbps average transfer rate (for φ =
10.667 MHz only) is selected (SCI_0 operates
on base clock with frequency of 16 times
transfer rate)
0010: 460.606 kbps average transfer rate (for φ =
10.667 MHz only) is selected (SCI_0 operates
on base clock with frequency of eight times
transfer rate)
0011: 921.569 kbps average transfer rate (for φ = 16
MHz only) is selected (SCI_0 operates on base
clock with frequency of eight times transfer rate)
0100: TPU clock input
The signal generated by TIOCA0, TIOCC0,
TIOCA1, and TIOCA2, which are the compare
match outputs for TPU_0 to TPU_2 or PWM
outputs, is used as a base clock. Note that
IRQ0 and IRQ1 cannot be used since TIOCA1
and TIOCA2 are used as outputs.
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Section 12 Serial Communication Interface
Bit
Bit Name Initial Value R/W Description
2
ACS2
0
1
ACS1
0
0
ACS0
0
R/W 0101: 115.196 kbps average transfer rate (for φ = 16 MHz
only) is selected (SCI_0 operates on base clock with
R/W
frequency of 16 times transfer rate)
R/W
0110: 460.784 kbps average transfer rate (for φ = 16 MHz
only) is selected (SCI_0 operates on base clock with
frequency of eight times transfer rate)
0111: 720 kbps average transfer rate (for φ = 16 MHz only)
is selected (SCI_0 operates on base clock with
frequency of eight times transfer rate)
1000: 115.132 kbps average transfer rate (for φ = 24 MHz
only) is selected* (SCI_0 operates on base clock
with frequency of 16 times transfer rate)
1001: 460.526 kbps average transfer rate (for φ = 24 MHz
only) is selected* (SCI_0 operates on base clock
with frequency of 16 times transfer rate)
1010: 720 kbps average transfer rate (for φ = 24 MHz only)
is selected* (SCI_0 operates on base clock with
frequency of eight times transfer rate)
1011: 921.053 kbps average transfer rate (for φ = 24 MHz
only) is selected* (SCI_0 operates on base clock
with frequency of eight times transfer rate)
11××: Reserved (Setting prohibited)
Note: * The average transfer rate select functions for 24 MHz only (ACS3 to ACS0 = B'10XX) are
not supported by the E6000 emulator.
12.3.10 Serial Extended Mode Register B_0 (SEMRB_0)
SEMRB_0 enables clock source selection with the combination of SEMRA_0, automatic transfer
rate setting, and control of port 1 pins (P16, P14, P12, and P10) at the transfer clock generation by
TPU.
Note: SEMRB_0 is not supported by the E6000 emulator.
Rev.6.00 Jun. 03, 2008 Page 386 of 698
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Section 12 Serial Communication Interface
Bit
Bit Name Initial Value
R/W
Description
7
ACS3
R/W
Asynchronous Clock Source Select
0
Selects the clock source in asynchronous mode
depending on the combination with the ACS2 to ACS0
(bits 2 to 0 in SEMRA_0). For details, see section 12.3.9,
Serial Extended Mode Register A_0 (SEMRA_0).
6 to
4
—
Undefined
3
TIOCA2E 1
—
Reserved
The write value should always be 0.
R/W
TIOCA2 Output Enable
Controls the TIOCA2 output on the P16 pin.
When the TIOCA2 in TPU is output to generate the
transfer clock, P16 is used as other function pin by
setting this bit to 0.
0: Disables output of TIOCA2 in TPU
1: Enables output of TIOCA2 in TPU
2
TIOCA1E 1
R/W
TIOCA1 Output Enable
Controls the TIOCA1 output on the P14 pin.
When the TIOCA1 in TPU is output to generate the
transfer clock, P14 is used as other function pin by
setting this bit to 0.
0: Disables output of TIOCA1 in TPU
1: Enables output TIOCA1 in TPU
1
TIOCC0E 1
R/W
TIOCC0 Output Enable
Controls the TIOCC0 output on the P12 pin.
When the TIOCC0 in TPU is output to generate the
transfer clock, P12 is used as other function pin by
setting this bit to 0.
0: Disables output of TIOCC0 in TPU
1: Enables output of TIOCC0 in TPU
0
TIOCA0E 1
R/W
TIOCA0 Output Enable
Controls the TIOCA0 output on the P10 pin.
When the TIOCA0 in TPU is output to generate the
transfer clock, P10 is used as other function pin by
setting this bit to 0.
0: Disables output of TIOCA0 in TPU
1: Enables output of TIOCA0 in TPU
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2
2
4
5
6
8
1.8424 MHz
4 5
6
7
7
8 9
10 11 12
2
2
4
5
6
3
7
8
15 16
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 1
1 bit = base clock × 8*
3.6848 MHz
4 5
6
5.333 MHz
3
Average transfer rate = 3.6848 MHz/8 = 460.606 kbps
Average error with 460.6 kbps = -0.043%
1
1
Note: * The lengh of one bit varies according to the base clock synchronization.
Base clock
10.667 MHz/2 = 5.333 MHz
5.333 MHz × (38/55)
= 3.6848 MHz
(Average)
13 14
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 1
1 bit = Base clock × 16*
3
2.667 MHz
3
Average transfer rate = 1.8424 MHz/16 = 115.152 kbps
Average error with 115.2 kbps = -0.043%
1
1
Base clock with 460.606-kbps average transfer rate (ACS3 to ACS0 = B'0010)
Base clock
10.667 MHz/4= 2.667 MHz
2.667 MHz × (38/55)
= 1.8424 MHz
(Average)
Base clock with 115.152-kbps average transfer rate (ACS3 to ACS0 = B'0001)
When φ = 10.667 MHz
2
2
3 4
3 4
Section 12 Serial Communication Interface
Figure 12.3 Examples of Base Clock when Average Transfer Rate Is Selected (1)
2
2
3
3
4
5
4
6
7
8
9 10 11 12
13 14 15 16
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 1
1 bit = base clock × 16*
1.8431 MHz
5 6 7 8
2 MHz
Average transfer rate = 1.8431 MHz/16 = 115.196 kbps
Average error with 115.2 kbps = -0.004%
1
1
2
2
3
3
4
5
4
6
7
8
9 10 11 12
13 14 15 16
2
2
4
5
6
7
8
5.76 MHz
4 5
6
8 MHz
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 1
1 bit = base clock × 8*
3
3
Average transfer rate = 5.76 MHz/8 = 720 kbps
Average error with 720 kbps = ±0%
1
1
3
3
4
5
6
7
7.3725 MHz
4 5 6 7
8 MHz
8
8
1 bit = base clock × 8*
2
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 1
Average transfer rate = 7.3725 MHz/8 = 921.569 kbps
Average error with 921.6 kbps = -0.003%
1
1
Note: * The lengh of one bit varies according to the base clock synchronization.
Base clock
16 MHz/2 = 8 MHz
8 MHz × (47/51)
= 7.3725 MHz
(Average)
Base clock with 921.569-kbps average transfer rate (ACS3 to ACS0 = B'0011)
Base clock
16 MHz/2 = 8 MHz
8 MHz × (18/25)
= 5.76 MHz
(Average)
2
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 1
1 bit = base clock × 16*
7.3725 MHz
5 6 7 8
8 MHz
Average transfer rate = 7.3725 MHz/16 = 460.784 kbps
Average error with 460.8 kbps = -0.004%
1
1
Base clock with 720-kbps average transfer rate (ACS3 to ACS0 = B'0111)
Base clock
16 MHz/2 = 8 MHz
8 MHz × (47/51)
= 7.3725 MHz
(Average)
Base clock with 460.784-kbps average transfer rate (ACS3 to ACS0 = B'0110)
Base clock
16 MHz/8 = 2 MHz
2 MHz × (47/51)
= 1.8431 MHz
(Average)
Base clock with 115.196-kbps average transfer rate (ACS3 to ACS0 = B'0101)
When φ = 16 MHz
2
2
2
3 4
3 4
3 4
5
5
5
6
6
6
7 8
7 8
7 8
Section 12 Serial Communication Interface
Figure 12.3 Examples of Base Clock when Average Transfer Rate Is Selected (2)
Rev.6.00 Jun. 03, 2008 Page 389 of 698
REJ09B0074-0600
6 7
8 9
1 bit = base clock × 16*
1.8421 MHz
2 3
4 5
10 11
Average transfer rate =1.8421 MHz/16 = 115.132 kbps
Average error with 115.2 kbps = -0.0059%
1
3 MHz
12
13 14
15 16
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 1 2
Rev.6.00 Jun. 03, 2008 Page 390 of 698
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6 7
8 9
1 bit = base clock × 16*
7.3684 MHz
2 3
4 5
1
5
6
1 bit = base clock × 8*
5.76 MHz
3
4
7
Average transfer rate = 5.76 MHz/8= 720 kbps
Average error with 720 kbps = ±0%
2
12 MHz
13 14
15 16
5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
1
6 7
8
Average transfer rate = 7.3684 MHz/8= 921.053 kbps
Average error with 921.1 kbps = -0.059%
1 bit = base clock × 8*
7.3684 MHz
2 3
4 5
12 MHz
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 1 2
8
Note: * The lengh of one bit varies according to the base clock synchronization.
Base clock
24 MHz/2 = 12 MHz
12 MHz × (35/57)
= 7.3684 MHz
(Average)
12
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 1 2 3 4
Base clock with 921.053-kbps average transfer rate (ACS3 to ACS0 = B'1011)
Base clock
24 MHz/2 = 12 MHz
12 MHz × (12/25)
= 5.76 MHz
(Average)
10 11
Average transfer rate = 7.3684 MHz/16 = 460.526 kbps
Average error with 460.6kbps = -0.059%
1
12 MHz
Base clock with 720-kbps average transfer rate (ACS3 to ACS0 = B'1010)
Base clock
24 MHz/2 = 12 MHz
12 MHz × (35/57)
= 7.3684 MHz
(Average)
Base clock with 460.526-kbps average transfer rate (ACS3 to ACS0 = B'1001)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 1 2
Base clock
24 MHz/8 = 3 MHz
3 MHz × (35/57)
= 1.8421 MHz
(Average)
Base clock with 115.132-kbps average transfer rate (ACS3 to ACS0 = B'1000)
When φ = 24 MHz
Section 12 Serial Communication Interface
Figure 12.3 Examples of Base Clock when Average Transfer Rate Is Selected (3)
SCK0
Base clock
= 4 MHz × 3/4
= 3 MHz (Average)
Clock enable
TIOCA2 output
Base clock
TIOCA1output
= 4 MHz
3 MHz
3
4 MHz
3
3
4
4
1
1
5
2
2
6
3
3
4
Average transfer rate = 3 MHz/16 = 187.5 kbps
1 bit = Base clock × 16*
2
2
2
7
1
1
8
2
2
9
3
3
Note: * The lengh of one bit varies according to the base clock synchronization.
1
1
1
4
10
1
1
2
2
11
• TCR_1 = H'20 [TCNT_1 cleared by TGRA_1 compare match, TCNT_1 incremented at rising edge of φ/1]
• TCR_2 = H'2C [TCNT_2 cleared by TGRA_2 compare match, TCNT_2 incremented at falling edge of TCLKA
• TMDR_1 = TMDR_2 = H'C2 [PWM mode 1]
• TIOR_1 = H'21 [0 as TIOCA1 initial output, 0 output on TGRA_1 compare match, 1 output on TGRB_1 compare match]
• TIOR_2 = H'21 [0 as TIOCA2 initial output, 0 output on TGRA_2 compare match, 1 output on TGRB_2 compare match]
• TCNT_1 = TCNT_2 = H'0000
• TGRA_1 = H'0003, TGRB_1 = H'0001
• TGRA_2 = H'0003, TGRB_2 = H'0001
• SCR_0 = H'03 (external clock)
• SEMRA_0 = H'04 (TCS2 to TCS0 = B'000, ABCS = 0, ACS2 to ACS0 = B'100)
• SEMRB_0 = H'00 (ACS3 = 0)
TPU and SCI settings
Example for TPU clock generation for 187.5 kbps average transfer rate when φ = 16 MHz (TCS2 to TCS0 = B'000)
(1) 4-MHz base clock provided by TPU_1 is multiplied by 3/4 by TPU_2 to generate 3-MHz base clock
(2) By making 1 bit = 16 base clocks, the average transfer will be 3 MHz/16 = 187.5 kbps
12
3
3
4
13
1
1
14
2
2
TCLKB
TCLKA
TIOCA0
TIOCC0
TIOCA1
TIOCA2
TPU
15
3
3
4
16
1
1
Base clock
Clock enable
1
2
2
2
3
3
4
SCK0
3
1
1
SCI_0
4
2
2
5
3
3
Section 12 Serial Communication Interface
Figure 12.4 Example of Average Transfer Rate Setting when TPU Clock Is Input (1)
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SCK0
Base clock
= 9.6 MHz × 15/16
= 9 MHz (Average)
Clock enable
TIOCA1 output
Base clock
(TIOCA0 + TIOCC0) output
= 9.6 MHz
TIOCC0 output
= 4.8 MHz
TIOCA0 output
= 4.8 MHz
5
5
9.6 MHz
4
4
6
6
6
7
7
7
8
8
8
1 bit = Base clock × 16*
9 MHz
3
4
5
3
3
9
9
9
10 11 12 13 14 15
10 11 12 13 14 15
10 11 12 13 14 15 16
Average transfer rate = 9 MHz/16 = 562.5 kbps
2
2
2
16
1
1
Note: * The length of one bit varies according to the base clock synchronization.
1
1
1
1
2
2
2
3
3
3
4
4
4
5
5
5
6
6
• TCR_0 = H'20 [TCNT_0 cleared by TGRA_0 compare match, TCNT_0 incremented at rising edge of φ/1]
• TCR_1 = H'2D [TCNT_1 cleared by TGRA_1 compare match, TCNT_1 incremented at falling edge of TCLKB
• TMDR_0 = TMDR_1 = H'C2 [PWM mode 1]
• TIORH_0 = H'21 [0 as TIOCA0 initial output, 0 output on TGRA_0 compare match, 1 output on TGRB_0 compare match]
• TIORL_0 = H'21 [0 as TIOCC0 initial output, 0 output on TGRC_0 compare match, 1 output on TGRD_0 compare match]
• TIOR_1 = H'21 [0 as TIOCA1 initial output, 0 output on TGRA_1 compare match, 1 output on TGRB_1 compare match]
• TCNT_0 = TCNT_1 = H'0000
• TGRA_0 = H'0004, TGRB_0 = H'0002, TGRC_0 = H'0001, TGRD_0 = H'0000
• TGRA_1 = H'000F, TGRB_1 = H'0000
• SCR_0 = H'03 (external clock)
• SEMRA_0 = H'14 (TCS2 to TCS0 = B'001, ABCS = 0, ACS2 to ACS0 = B'100)
• SEMRB_0 = H'00 (ACS3 = 0)
TPU and SCI settings
Example for TPU clock generation for 562.5 kbps average transfer rate when φ = 24 MHz (TCS2 to TCS0 = B'001)
(1) 9.6-MHz base clock provided by TPU_0 is multiplied by 15/16 by TPU_1 to generate 9-MHz base clock
(2) By making 1 bit = 16 base clocks, the average transfer will be 9 MHz/16 = 562.5 kbps
6
7
7
7
8
8
8
9
9
Q
φ
>CK
D
9
10 11 12 13 14
10 11 12 13 14 15
10 11 12 13 14 15 16
TCLKB
TCLKA
TIOCA0
TIOCC0
TIOCA1
TIOCA2
TPU
2
2
15 16
1
1
1
3
3
2
4
4
Base clock
Clock enable
3
5
5
4
6
6
5
7
7
6
8
8
SCK0
7
9
9
SCI_0
8
9
10 11
10 11
Section 12 Serial Communication Interface
Figure 12.4 Example of Average Transfer Rate Setting when TPU Clock Is Input (2)
SCK0
Base clock
= 6 MHz × 23/25
= 5.52 MHz (Average)
25
1
1
1
2
4
5
5
5
6
6
6
7
7
7
8
8
8
9
9
9
10 11 12
10 11 12
10 11 12 13
Average transfer rate = 5.52 MHz/16 = 345 kbps
1 bit = Base clock × 16*
4
6 MHz
3
4
5.52 MHz
2 3
2
3
13
13
14 15 16
1
2
3
4
24 25
5
6
7
1
TCLKB
TCLKA
TIOCA0
TIOCC0
TIOCA1
TIOCA2
TPU
21 22 23
21 22 23
18 19 20
18 19 20
14 15 16 17
14 15 16 17
Note: * The length of one bit varies according to the base clock synchronization.
Clock enable
(TIOCA1×TIOCA2) output
TIOCA2(TPU_2) output
TIOCA1(TPU_1) output
Base clock
TIOCA0 (TPU_0) output
= 6 MHz
• TCR_0 = H'20 [TCNT_0 cleared by TGRA_0 compare match, TCNT_0 incremented at rising edge of φ/1]
• TCR_1 = H'2D [TCNT_1 cleared by TGRA_1 compare match, TCNT_1 incremented at falling edge of TCLKB]
• TCR_2 = H'2D [TCNT_2 cleared by TGRA_2 compare match, TCNT_2 incremented at falling edge of TCLKB
• TMDR_0 = TMDR_1 = TMDR_2 = H'C2 [PWM mode 1]
• TIORH_0 = H'21 [0 as TIOCA0 initial output, 0 output on TGRA_0 compare match, 1 output on TGRB_0 compare match]
• TIOR_1 = H'21 [0 as TIOCA1 initial output, 0 output on TGRA_1 compare match, 1 output on TGRB_1 compare match]
• TIOR_2 = H'21 [0 as TIOCA2 initial output, 0 output on TGRA_2 compare match, 1 output on TGRB_2 compare match]
• TCNT_0 = TCNT_1 = H'0000, TCNT_2 = H'000C
• TGRA_0 = H'0003, TGRB_0 = H'0001
• TGRA_1 = H'0018, TGRB_1 = H'0000
• TGRA_2 = H'0018, TGRB_2 = H'0000
• SCR_0 = H'03 (external clock)
• SEMRA_0 = H'24 (TCS2 to TCS0 = B'010, ABCS = 0, ACS2 to ACS0 = B'100)
• SEMRB_0 = H'00 (ACS3 = 0)
TPU and SCI settings
Example for TPU clock generation for 345 kbps average transfer rate when φ = 24 MHz (TCS2 to TCS0 = B'010)
(1) 6-MHz base clock provided by TPU_0 is multiplied by 23/25 by TPU_1 and TPU_2 to generate 5.52-MHz base clock
(2) By making 1 bit = 16 base clocks, the average transfer will be 5.52 MHz/16 = 345 kbps
8
1
2
9
2
3
4
5
10 11
3
4
12
5
6
7
8
8
9
13 14 15
6
7
φ
16
9
1
2
3
10 11 12
10 11 12 13
Base clock
Q Clock enable
>CK
D
4
5
6
13 14 15
14 15 16 17
SCK0
SCI_0
7
8
16 17
9
10
24 25
11 12 13 14
20 21 22 23
21 22 23
18 19
18 19 20
1
2
3
15 16
1
2
Section 12 Serial Communication Interface
Figure 12.4 Example of Average Transfer Rate Setting when TPU Clock Is Input (3)
Rev.6.00 Jun. 03, 2008 Page 393 of 698
REJ09B0074-0600
Rev.6.00 Jun. 03, 2008 Page 394 of 698
REJ09B0074-0600
SCK0
Base clock
= 9.6 MHz × 23/25
= 8.832 MHz (Average)
Clock enable
(TIOCA1×TIOCA2) output
TIOCA2 output
TIOCA1 output
Base clock
(TIOCA0 + TIOCC0) output
= 9.6 MHz
TIOCC0 output
= 4.8 MHz
TIOCA0 output
= 4.8 MHz
5
5
6
6
8.832 MHz
4
5
6
9.6 MHz
4
4
7
7
7
8
8
8
1 bit = Base clock × 16*
3
3
3
9
9
9
10 11 12
10 11 12
13
13
14 15
14 15
16
1
2
3
4
5
6
7
16 17 18 19 20 21 22 23
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
Average transfer rate = 8.832 MHz/16 = 552 kbps
2
2
2
Note: * The length of one bit varies according to the base clock synchronization.
1
1
1
TCLKB
TCLKA
TIOCA0
TIOCC0
TIOCA1
TPU and SCI settings
• TCR_0 = H'20 [TCNT_0 cleared by TGRA_0 compare match, TCNT_0 incremented at rising edge of φ/1]
• TCR_1 = H'2D [TCNT_1 cleared by TGRA_1 compare match, TCNT_1 incremented at falling edge of TCLKB]
• TCR_2 = H'2D [TCNT_2 cleared by TGRA_2 compare match, TCNT_2 incremented at falling edge of TCLKB
• TMDR_0 = TMDR_1 = TMDR_2 = H'C2 [PWM mode 1]
• TIORH_0 = H'21 [0 as TIOCA0 initial output, 0 output on TGRA_0 compare match, 1 output on TGRB_0 compare match]
• TIORL_0 = H'21 [0 as TIOCC0 initial output, 0 output on TGRC_0 compare match, 1 output on TGRD_0 compare match]
• TIOR_1 = H'21 [0 as TIOCA1 initial output, 0 output on TGRA_1 compare match, 1 output on TGRB_1 compare match]
• TIOR_2 = H'21 [0 as TIOCA2 initial output, 0 output on TGRA_2 compare match, 1 output on TGRB_2 compare match]
• TCNT_0 = TCNT_1 = H'0000, TCNT_2 = H'000C
• TGRA_0 = H'0004, TGRB_0 = H'0002, TGRC_0 = H'0001, TGRD_0 = H'0000
• TGRA_1 = H'0018, TGRB_1 = H'0000
• TGRA_2 = H'0018, TGRB_2 = H'0000
• SCR_0 = H'03 (external clock)
• SEMRA_0 = H'34 (TCS2 to TCS0 = B'011, ABCS = 0, ACS2 to ACS0 = B'100)
• SEMRB_0 = H'00 (ACS3 = 0)
TIOCA2
TPU
Example for TPU clock generation for 552 kbps average transfer rate when φ = 24 MHz (TCS2 to TCS0 = B'011)
(1) 9.6-MHz base clock provided by TPU_0 is multiplied by 23/25 by TPU_1 and TPU_2 to generate 8.832-MHz base clock
(2) By making 1 bit = 16 base clocks, the average transfer will be 8.832 MHz/16 = 552 kbps
8
1
1
9
2
2
4
4
5
5
6
6
7
7
10 11 12 13 14
3
3
φ
>CK
D
9
9
15 16
8
8
SCK0
SCI_0
1
2
3
10 11 12
4
5
6
7
8
13 14 15 16 17
10 11 12 13 14 15 16 17 18
Base clock
Q Clock enable
Section 12 Serial Communication Interface
Figure 12.4 Example of Average Transfer Rate Setting when TPU Clock Is Input (4)
Section 12 Serial Communication Interface
12.3.11 Bit Rate Register (BRR)
BRR is an 8-bit register that adjusts the bit rate. As the SCI performs baud rate generator control
independently for each channel, different bit rates can be set for each channel. Table 12.2 shows
the relationships between the N setting in BRR and bit rate B for normal asynchronous mode,
clocked synchronous mode, and Smart Card interface mode. The initial value of BRR is H'FF, and
it can be read from or written to by the CPU at all times.
Table 12.2 Relationships between the N Setting in BRR and Bit Rate B
Mode
ABCS
Asynchronous
mode
0
1
Clocked
synchronous
mode
×
Smart Card
interface mode
×
Bit Rate
Error
B=
φ × 106
64 × 22n-1 × (N + 1)
Error (%) =
φ × 106
– 1 × 100
B × 64 × 22n-1 × (N + 1)
B=
φ × 106
32 × 22n-1 × (N + 1)
Error (%) =
φ × 106
– 1 × 100
B × 32 × 22n-1 × (N + 1)
B=
φ × 106
8 × 22n-1 × (N + 1)
⎯
B=
φ × 106
S × 22n+1 × (N + 1)
Error (%) =
φ × 106
– 1 × 100
B × S × 22n+1 × (N + 1)
Legend:
B:
Bit rate (bps)
N:
BRR setting for baud rate generator (0 ≤ N ≤ 255)
φ:
Operating frequency (MHz)
n, S: Determined by the SMR settings shown in the following tables.
×:
Don’t care
SMR Setting
SMR Setting
CKS1
CKS0
Clock Source
n
BCP1
BCP0
S
0
0
φ
0
0
0
32
0
1
φ/4
1
0
1
64
1
0
φ/16
2
1
0
372
1
1
φ/64
3
1
1
256
Table 12.3 shows sample N settings in BRR in normal asynchronous mode. Table 12.4 shows the
maximum bit rate for each frequency in normal asynchronous mode. Table 12.6 shows sample N
settings in BRR in clocked synchronous mode. Table 12.8 shows sample N settings in BRR in
Smart Card interface mode. In Smart Card interface mode, S (the number of basic clock periods in
a 1-bit transfer interval) can be selected. For details, see section 12.7.5, Receive Data Sampling
Rev.6.00 Jun. 03, 2008 Page 395 of 698
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Section 12 Serial Communication Interface
Timing and Reception Margin. Tables 12.5 and 12.7 show the maximum bit rates with external
clock input.
When the ABCS bit in SCI_0’s serial extended mode register A_0 (SEMRA_0) is set to 1 in
asynchronous mode, the maximum bit rates are twice those shown in table 12.3.
Table 12.3 BRR Settings for Various Bit Rates (Asynchronous Mode)
Operating Frequency φ (MHz)
2
Bit Rate
(bps)
n
N
110
1
150
Error (%)
2.097152
n
N
141 0.03
1
1
103 0.16
300
0
600
3
n
N
Error (%) n
N
148 –0.04
1
174
–0.26
1
212 0.03
1
108 0.21
1
127
0.00
1
155 0.16
207 0.16
0
217 0.21
0
255
0.00
1
77
0
103 0.16
0
108 0.21
0
127
0.00
0
155 0.16
1200
0
51
0.16
0
54
–0.70
0
63
0.00
0
77
0.16
2400
0
25
0.16
0
26
1.14
0
31
0.00
0
38
0.16
4800
0
12
0.16
0
13
–2.48
0
15
0.00
0
19
–2.34
9600
—
—
—
0
6
–2.48
0
7
0.00
0
9
–2.34
19200
—
—
—
—
—
—
0
3
0.00
0
4
–2.34
31250
0
1
0.00
—
—
—
—
—
—
0
2
0.00
38400
—
—
—
—
—
—
0
1
0.00
—
—
—
Rev.6.00 Jun. 03, 2008 Page 396 of 698
REJ09B0074-0600
Error (%)
2.4576
Error (%)
0.16
Section 12 Serial Communication Interface
Operating Frequency φ (MHz)
3.6864
4
4.9152
5
Bit Rate
(bps)
n
N
Error (%)
n
N
Error (%)
n
N
Error (%) n
N
Error (%)
110
2
64
0.70
2
70
0.03
2
86
0.31
2
88
–0.25
150
1
191 0.00
1
207 0.16
1
255
0.00
2
64
0.16
300
1
95
0.00
1
103 0.16
1
127
0.00
1
129 0.16
600
0
191 0.00
0
207 0.16
0
255
0.00
1
64
1200
0
95
0.00
0
103 0.16
0
127
0.00
0
129 0.16
2400
0
47
0.00
0
51
0.16
0
63
0.00
0
64
0.16
4800
0
23
0.00
0
25
0.16
0
31
0.00
0
32
–1.36
9600
0
11
0.00
0
12
0.16
0
15
0.00
0
15
1.73
19200
0
5
0.00
—
—
—
0
7
0.00
0
7
1.73
31250
—
—
—
0
3
0.00
0
4
–1.70
0
4
0.00
38400
0
2
0.00
—
—
—
0
3
0.00
0
3
1.73
0.16
Operating Frequency φ (MHz)
6
6.144
7.3728
8
Bit Rate
(bps)
n
N
110
2
106 –0.44
2
108
0.08
2
130
–0.07
2
141
0.03
150
2
77
0.16
2
79
0.00
2
95
0.00
2
103
0.16
300
1
155 0.16
1
159
0.00
1
191
0.00
1
207
0.16
600
1
77
0.16
1
79
0.00
1
95
0.00
1
103
0.16
1200
0
155 0.16
0
159
0.00
0
191
0.00
0
207
0.16
2400
0
77
0.16
0
79
0.00
0
95
0.00
0
103
0.16
4800
0
38
0.16
0
39
0.00
0
47
0.00
0
51
0.16
9600
0
19
–2.34
0
19
0.00
0
23
0.00
0
25
0.16
19200
0
9
–2.34
0
9
0.00
0
11
0.00
0
12
0.16
31250
0
5
0.00
0
5
2.40
—
—
—
0
7
0.00
38400
0
4
–2.34
0
4
0.00
0
5
0.00
—
—
—
Error (%)
n
N
Error (%) n
N
Error (%)
n
N
Error (%)
Rev.6.00 Jun. 03, 2008 Page 397 of 698
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Section 12 Serial Communication Interface
Operating Frequency φ (MHz)
9.8304
Bit Rate
(bps)
n
N
110
2
150
Error (%)
10
12
n
N
Error (%)
n
N
174 –0.26
2
177
–0.25
2
2
127 0.00
2
129
0.16
300
1
255 0.00
2
64
600
1
127 0.00
1
1200
0
255 0.00
2400
0
127 0.00
4800
0
63
9600
0
19200
Error (%)
12.288
n
N
Error (%)
212 0.03
2
217
0.08
2
155 0.16
2
159
0.00
0.16
2
77
0.16
2
79
0.00
129
0.16
1
155 0.16
1
159
0.00
1
64
0.16
1
77
0.16
1
79
0.00
0
129
0.16
0
155 0.16
0
159
0.00
0.00
0
64
0.16
0
77
0.16
0
79
0.00
31
0.00
0
32
–1.36
0
38
0.16
0
39
0.00
0
15
0.00
0
15
1.73
0
19
–2.34
0
19
0.00
31250
0
9
–1.70
0
9
0.00
0
11
0.00
0
11
2.40
38400
0
7
0.00
0
7
1.73
0
9
–2.34
0
9
0.00
Operating Frequency φ (MHz)
14
Bit Rate
(bps)
n
N
110
2
248 –0.17
150
2
181 0.16
300
2
90
0.16
600
1
1200
Error (%)
14.7456
n
16
17.2032
N
Error (%) n
N
Error (%)
n
N
Error (%)
3
64
0.70
3
70
0.03
3
75
0.48
2
191
0.00
2
207
0.16
2
223
0.00
2
95
0.00
2
103
0.16
2
111
0.00
181 0.16
1
191
0.00
1
207
0.16
1
223
0.00
1
90
0.16
1
95
0.00
1
103
0.16
1
111
0.00
2400
0
181 0.16
0
191
0.00
0
207
0.16
0
223
0.00
4800
0
90
0.16
0
95
0.00
0
103
0.16
0
111
0.00
9600
0
45
–0.93
0
47
0.00
0
51
0.16
0
55
0.00
19200
0
22
–0.93
0
23
0.00
0
25
0.16
0
27
0.00
31250
0
13
0.00
0
14
–1.70
0
15
0.00
0
16
1.20
38400
–
–
–
0
11
0.00
0
12
0.16
0
13
0.00
Rev.6.00 Jun. 03, 2008 Page 398 of 698
REJ09B0074-0600
Section 12 Serial Communication Interface
Operating Frequency φ (MHz)
18
Bit Rate
(bps)
n
N
110
3
79
150
2
300
19.6608
Error (%)
–0.12
n
N
20
Error (%)
n
N
24
Error (%)
n
N
Error (%)
3
86
0.31
3
88
–0.25
3
106
–0.44
233 0.16
2
255
0.00
3
64
0.16
3
77
0.16
2
116 0.16
2
127
0.00
2
129 0.16
2
155
0.16
600
1
233 0.16
1
255
0.00
2
64
0.16
2
77
0.16
1200
1
116 0.16
1
127
0.00
1
129 0.16
1
155
0.16
2400
0
233 0.16
0
255
0.00
1
64
0.16
1
77
0.16
4800
0
116 0.16
0
127
0.00
0
129 0.16
0
155
0.16
9600
0
58
–0.69
0
63
0.00
0
64
0.16
0
77
0.16
19200
0
28
1.02
0
31
0.00
0
32
–1.36
0
38
0.16
31250
0
17
0.00
0
19
–1.70
0
19
0.00
0
23
0.00
38400
0
14
–2.34
0
15
0.00
0
15
1.73
0
19
–2.34
Note: This table shows bit rates when the ABCS bit in SEMRA_0 is cleared to 0.
When the ABCS bit in SEMR0 is set to 1, the bit rates are twice those shown in this table.
In this LSI, operating frequency φ must be 6 MHz or greater.
Table 12.4 Maximum Bit Rate for Each Frequency (Asynchronous Mode)
Maximum Bit Rate
(kbps)
Maximum Bit Rate
(kbps)
φ (MHz)
ABCS = 0 ABCS = 1 n
N
φ (MHz)
ABCS = 0
ABCS = 1 n
N
2
62.5
125.0
0
0
9.8304
307.2
614.4
0
0
2.097152
65.536
131.027
0
0
10
312.5
625.0
0
0
2.4576
76.8
153.6
0
0
12
375.0
750.0
0
0
3
93.75
187.5
0
0
12.288
384.0
768.0
0
0
3.6864
115.2
230.4
0
0
14
437.5
875.0
0
0
4
125.0
250.0
0
0
14.7456
460.8
921.6
0
0
4.9152
153.6
307.2
0
0
16
500.0
1000.0
0
0
5
156.25
312.5
0
0
17.2032
537.6
1075.2
0
0
6
187.5
375.0
0
0
18
562.5
1125.0
0
0
6.144
192.0
384.0
0
0
19.6608
614.4
1228.8
0
0
7.3728
230.4
460.8
0
0
20
625.0
1250.0
0
0
8
250.0
500.0
0
0
24
750.0
1500.0
0
0
Rev.6.00 Jun. 03, 2008 Page 399 of 698
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Section 12 Serial Communication Interface
Table 12.5 Maximum Bit Rate with External Clock Input (Asynchronous Mode)
φ (MHz)
External
Input
Clock
(MHz)
ABCS = 0 ABCS = 1
φ (MHz)
Maximum Bit Rate
External
(kbps)
Input
Clock
(MHz)
ABCS = 0 ABCS = 1
2
0.5000
31.25
62.5
9.8304
2.4576
153.6
307.2
2.097152
0.5243
327.68
65.536
10
2.5000
156.25
312.5
Maximum Bit Rate
(kbps)
2.4576
0.6144
38.4
76.8
12
3.0000
187.5
375.0
3
0.7500
46.875
93.75
12.288
3.0720
192.0
384.0
3.6864
0.9216
57.6
115.2
14
3.5000
218.75
437.0
4
1.0000
62.5
125.0
14.7456
3.6864
230.4
460.8
4.9152
1.2288
76.8
153.6
16
4.0000
250.0
500.0
5
1.2500
78.125
156.25
17.2032
4.3008
268.8
537.6
6
1.5000
93.75
187.5
18
4.5000
281.25
562.5
6.144
1.5360
96.0
192.0
19.6608
4.9152
307.2
614.4
7.3728
1.8432
115.2
230.4
20
5.0000
312.5
625.0
8
2.0000
125.0
250.0
24
6.0000
375.0
750.0
Note: In this LSI, operating frequency φ must be 6 MHz or greater.
Rev.6.00 Jun. 03, 2008 Page 400 of 698
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Section 12 Serial Communication Interface
Table 12.6 BRR Settings for Various Bit Rates (Clocked Synchronous Mode)
Operating Frequency φ (MHz)
Bit Rate
2
4
6
(bps)
n
N
n
N
110
3
70
—
—
250
2
124
2
249
n
N
8
10
16
n
N
n
N
n
N
3
124
—
—
3
249
20
24
n
N
n
N
—
500
1
249
2
124
2
249
—
—
3
124
—
—
—
1k
1
124
1
249
2
124
—
—
2
249
—
—
—
—
2.5 k
0
199
1
99
1
149
1
199
1
249
2
99
2
124
2
149
5k
0
99
0
199
1
74
1
99
1
124
1
199
1
249
2
74
10 k
0
49
0
99
0
149
0
199
0
249
1
99
1
124
1
149
25 k
0
19
0
39
0
59
0
79
0
99
0
159
0
199
0
239
50 k
0
9
0
19
0
29
0
39
0
49
0
79
0
99
0
119
100 k
0
4
0
9
0
14
0
19
0
24
0
39
0
49
0
59
250 k
0
1
0
3
0
5
0
7
0
9
0
15
0
19
0
23
500 k
0
0*
0
1
0
2
0
3
0
4
0
7
0
9
0
11
0
0*
0
1
0
3
0
4
0
5
0
0*
0
1
0
2
0
0*
1M
2M
2.5 M
0
0*
4M
5M
0
1
—
—
0
0*
—
—
0
0*
6M
Legend:
Blank: Cannot be set.
—:
Can be set, but there will be a degree of error.
*:
Continuous transfer is not possible.
Table 12.7 Maximum Bit Rate with External Clock Input (Clocked Synchronous Mode)
φ (MHz)
External Input
Clock (MHz)
Maximum Bit
Rate (Mbps)
φ (MHz)
External Input
Clock (MHz)
Maximum Bit
Rate (Mbps)
2
0.333
0.333
14
2.333
2.333
4
0.667
0.667
16
2.667
2.667
6
1.000
1.000
18
3.000
3.000
8
1.333
1.333
20
3.333
3.333
10
1.667
1.667
24
4.000
4.000
12
2.000
2.000
Note: In this LSI, operating frequency φ must be 6 MHz or greater.
Rev.6.00 Jun. 03, 2008 Page 401 of 698
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Section 12 Serial Communication Interface
Table 12.8 BRR Settings for Various Bit Rates
(Smart Card Interface Mode, when n = 0 and S = 372)
Operating Frequency φ (MHz)
5.00
7.00
N
Error
(%)
7.1424
N
Error
(%)
10.00
N
Error
(%)
10.7136
13.00
N
Error
(%)
N
Error
(%)
Bit Rate
(bps)
N
Error
(%)
6720
0
0.01
1
30.00
1
28.57
1
0.01
1
7.14
2
13.33
9600
0
30.00
0
1.99
0
0.00
1
30.00
1
25.00
1
8.99
Operating Frequency φ (MHz)
14.2848
16.00
18.00
Error
(%)
20.00
Error
(%)
24.00
Error
(%)
Bit Rate
(bps)
N
Error
(%)
N
Error
(%)
6720
2
4.76
2
6.67
3
0.01
3
0.01
4
3.99
9600
1
0.00
1
12.01
2
15.99
2
6.66
2
12.01
N
N
N
Table 12.9 Maximum Bit Rate at Various Frequencies (Smart Card Interface Mode)
Maximum Bit Rate (bps)
φ (MHz)
S = 32
S = 64
S = 256
S = 372
n
N
5.00
78125
39063
9766
6720
0
0
6.00
93750
46875
11719
8065
0
0
7.00
109375
54688
13672
9409
0
0
7.1424
111600
55800
13950
9600
0
0
10.00
156250
78125
19531
13441
0
0
10.7136
167400
83700
20925
14400
0
0
13.00
203125
101563
25391
17473
0
0
14.2848
223200
111600
27900
19200
0
0
16.00
250000
125000
31250
21505
0
0
18.00
281250
140625
35156
24194
0
0
20.00
312500
156250
39063
26882
0
0
24.00
375000
187500
46875
32258
0
0
Note: In this LSI, operating frequency φ must be 6 MHz or greater.
Rev.6.00 Jun. 03, 2008 Page 402 of 698
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Section 12 Serial Communication Interface
12.4
Operation in Asynchronous Mode
Figure 12.5 shows the general format for asynchronous serial communication. One frame consists
of a start bit (low level), followed by data (in LSB-first order), a parity bit (high or low level), and
finally stop bits (high level). In asynchronous serial communication, the transmission line is
usually held in the mark state (high level). The SCI monitors the transmission line. When the
transmission line goes to the space state (low level), the SCI recognizes a start bit and starts serial
communication. Inside the SCI, the transmitter and receiver are independent units, enabling fullduplex. Both the transmitter and the receiver also have a double-buffered structure, so data can be
read from or written during transmission or reception, enabling continuous data transfer.
1
Serial
data
LSB
0
D0
Idle state
(mark state)
1
MSB
D1
D2
D3
D4
D5
Start
bit
Transmit/receive data
1 bit
7 or 8 bits
D6
D7
0/1
Parity
bit
1 bit,
or none
1
1
Stop bit
1 or
2 bits
One unit of transfer data (character or frame)
Figure 12.5 Data Format in Asynchronous Communication
(Example with 8-Bit Data, Parity, Two Stop Bits)
Rev.6.00 Jun. 03, 2008 Page 403 of 698
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Section 12 Serial Communication Interface
12.4.1
Data Transfer Format
Table 12.10 shows the data transfer formats that can be used in asynchronous mode. Any of 12
transfer formats can be selected according to the SMR setting. For details on the multiprocessor
bit, refer to section 12.5, Multiprocessor Communication Function.
Table 12.10 Serial Transfer Formats (Asynchronous Mode)
CHR
SMR Settings
PE
MP
STOP
1
2
Serial Transfer Format and Frame Length
3
4
5
6
7
8
9 10 11
12
0
0
0
0
S
8-bit data
STOP
0
0
0
1
S
8-bit data
STOP STOP
0
1
0
0
S
8-bit data
P
STOP
0
1
0
1
S
8-bit data
P
STOP STOP
1
0
0
0
S
7-bit data
STOP
1
0
0
1
S
7-bit data
STOP STOP
1
1
0
0
S
7-bit data
P
STOP
1
1
0
1
S
7-bit data
P
STOP STOP
0
–
1
0
S
8-bit data
MPB STOP
0
–
1
1
S
8-bit data
MPB STOP STOP
1
–
1
0
S
7-bit data
MPB STOP
1
–
1
1
S
7-bit data
MPB STOP STOP
Legend:
S:
Start bit
STOP: Stop bit
P:
Parity bit
MPB: Multiprocessor bit
Rev.6.00 Jun. 03, 2008 Page 404 of 698
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Section 12 Serial Communication Interface
12.4.2
Receive Data Sampling Timing and Reception Margin in Asynchronous Mode
In asynchronous mode, the SCI operates on a basic clock with a frequency of 16 times* the
transfer rate. In reception, the SCI samples the falling edge of the start bit using the basic clock,
and performs internal synchronization. Receive data is latched internally at the rising edge of the
8th* pulse of the basic clock as shown in Figure 12.6. Thus, the reception margin in asynchronous
mode is given by formula (1) below.
M = | (0.5 –
1
| D – 0.5 |
) – (L – 0.5) F –
(1+ F) | × 100 [%]
2N
N
... Formula (1)
Where M: Reception margin
N: Ratio of bit rate to clock (N = 16 if ABCS = 0, N = 8 if ABCS = 1)
D: Clock duty (D = 0 to 1.0)
L: Frame length (L = 9 to 12)
F: Absolute value of clock rate deviation
Assuming values of F (absolute value of clock rate deviation) = 0, D (clock duty) = 0.5, and N
(ratio of bit rate to clock) = 16 in formula (1), the reception margin can be given by the formula.
M = {0.5 – 1/(2 × 16)} × 100 [%] = 46.875%
However, this is only the computed value, and a margin of 20% to 30% should be allowed for in
system design.
16 clocks *
8 clocks *
0
7
15 0
7
15 0
Internal basic
clock
Receive data
(RxD)
Start bit
D0
D1
Synchronization
sampling timing
Data sampling
timing
Figure 12.6 Receive Data Sampling Timing in Asynchronous Mode
Rev.6.00 Jun. 03, 2008 Page 405 of 698
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Section 12 Serial Communication Interface
Note: * Figure 12.6 shows an example when the ABCS bit of SEMRA_0 is cleared to 0. When
ABCS is set to 1, the clock frequency of basic clock is 8 times the bit rate and the
receive data is sampled at the rising edge of the 4th pulse of the basic clock.
12.4.3
Clock
Either an internal clock generated by the on-chip baud rate generator or an external clock input at
the SCK pin can be selected as the SCI's serial clock, according to the setting of the C/A bit in
SMR and the CKE0 and CKE1 bits in SCR. When an external clock is input at the SCK pin, the
clock frequency should be 16 times the bit rate used. When an external clock is selected, the basic
clock of average transfer rate can be selected according to the ACS2 to ACS0 bit setting of
SEMR_0.
When the SCI is operated on an internal clock, the clock can be output from the SCK pin by
setting CKE1 = 0 and CKE0 = 1. The frequency of the clock output in this case is equal to the bit
rate, and the phase is such that the rising edge of the clock is in the middle of the transmit data, as
shown in figure 12.7.
SCK
TxD
0
D0
D1
D2
D3
D4
D5
D6
D7
0/1
1
1
1 frame
Figure 12.7 Relationship between Output Clock and Transfer Data Phase
(Asynchronous Mode)
Rev.6.00 Jun. 03, 2008 Page 406 of 698
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Section 12 Serial Communication Interface
12.4.4
SCI Initialization (Asynchronous Mode)
Before transmitting and receiving data, you should first clear the TE and RE bits in SCR to 0, then
initialize the SCI as described in a sample flowchart in figure 12.8. When the operating mode, or
transfer format, is changed for example, the TE and RE bits must be cleared to 0 before making the
change using the following procedure. When the TE bit is cleared to 0, the TDRE flag is set to 1.
Note that clearing the RE bit to 0 does not initialize the contents of the RDRF, PER, FER, and
ORER flags, or the contents of RDR. When the external clock is used in asynchronous mode, the
clock must be supplied even during initialization.
[1]
Start initialization
Set the clock selection in SCR.
Be sure to clear bits RIE, TIE, TEIE, and
MPIE, and bits TE and RE, to 0.
Clear TE and RE bits in SCR to 0
Set CKE1 and CKE0 bits in SCR
(TE, RE bits 0)
[1]
Set data transfer format in
SMR, SCMR, and SEMRA_0
[2]
Set value in BRR
[3]
When the clock is selected in
asynchronous mode, it is output
immediately after SCR settings are
made.
[2]
Set the data transfer format in SMR,
SCMR, and SEMRA_0.
[3]
Write a value corresponding to the bit
rate to BRR. Not necessary if an
external clock or average transfer rate
clock by ACS2 to ACS0 is used.
[4]
Wait at least one bit interval, then set the
TE bit or RE bit in SCR to 1. Also set
the RIE, TIE, TEIE, and MPIE bits.
Wait
No
1-bit interval elapsed?
Yes
Set TE and RE* bits in
SCR to 1, and set RIE, TIE, TEIE,
and MPIE bits
[4]
Setting the TE and RE bits enables use
of the TxD and RxD pins.
<Initialization completion>
Note: * Perform this set operation with the RxD pin in the 1 state. If the RE bit is set to 1 with the RxD pin
in the 0 state, it may be misinterpreted as a start bit.
Figure 12.8 Sample SCI Initialization Flowchart
Rev.6.00 Jun. 03, 2008 Page 407 of 698
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Section 12 Serial Communication Interface
12.4.5
Data Transmission (Asynchronous Mode)
Figure 12.9 shows an example of operation for transmission in asynchronous mode. In
transmission, the SCI operates as described below.
1. The SCI monitors the TDRE flag in SSR. If the flag is cleared to 0, the SCI recognizes that
data has been written to TDR, and transfers the data from TDR to TSR.
2. After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmission. If the TIE bit is set to 1 at this time, a transmit data empty interrupt request (TXI)
is generated. Continuous transmission is possible because the TXI interrupt routine writes next
transmit data to TDR before transmission of the current transmit data has been completed.
3. Data is sent from the TxD pin in the following order: start bit, transmit data, parity bit or
multiprocessor bit (may be omitted depending on the format), and stop bit.
4. The SCI checks the TDRE flag at the timing for sending the stop bit.
5. If the TDRE flag is 0, the data is transferred from TDR to TSR, the stop bit is sent, and then
serial transmission of the next frame is started.
6. If the TDRE flag is 1, the TEND flag in SSR is set to 1, the stop bit is sent, and then the "mark
state" is entered, in which 1 is output. If the TEIE bit in SCR is set to 1 at this time, a TEI
interrupt request is generated.
1
Start
bit
0
Data
D0
D1
Parity Stop Start
bit
bit
bit
D7
0/1
1
0
Data
D0
D1
Parity Stop
bit
bit
D7
0/1
1
1
Idle state
(mark state)
TDRE
TEND
TXI interrupt
Data written to TDR and
TXI interrupt
request generated TDRE flag cleared to 0 in
request generated
TXI interrupt service routine
TEI interrupt
request generated
1 frame
Figure 12.9 Example of Operation in Transmission in Asynchronous Mode
(Example with 8-Bit Data, Parity, One Stop Bit)
Figure 12.10 shows a sample flowchart for transmission in asynchronous mode.
Rev.6.00 Jun. 03, 2008 Page 408 of 698
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Section 12 Serial Communication Interface
Initialization
[1]
[1]
SCI initialization:
The TxD pin is automatically designated
as the transmit data output pin.
After the TE bit is set to 1, a frame of 1s
is output, and transmission is enabled.
[2]
SCI status check and transmit data write:
Read SSR and check that the TDRE flag
is set to 1, then write transmit data to
TDR and clear the TDRE flag to 0.
[3]
Serial transmission continuation
procedure:
To continue serial transmission, read 1
from the TDRE flag to confirm that writing
is possible, then write data to TDR, and
then clear the TDRE flag to 0. Checking
and clearing of the TDRE flag is
automatic when the DMAC is activated
by a transmit data empty interrupt (TXI)
request, and data is written to TDR.
[4]
Break output at the end of serial
transmission:
To output a break in serial transmission,
set DDR for the port corresponding to the
TxD pin to 1, clear DR to 0, then clear the
TE bit in SCR to 0.
Start transmission
Read TDRE flag in SSR
TDRE = 1
[2]
No
Yes
Write transmit data to TDR
and clear TDRE flag in SSR to 0
All data transmitted?
No
Yes
[3]
Read TEND flag in SSR
TEND = 1
No
Yes
Break output?
No
[4]
Yes
Clear DR to 0 and set DDR to 1
Clear TE bit in SCR to 0
<End>
Figure 12.10 Sample Serial Data Transmission Flowchart
Rev.6.00 Jun. 03, 2008 Page 409 of 698
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Section 12 Serial Communication Interface
12.4.6
Serial Data Reception (Asynchronous Mode)
Figure 12.11 shows an example of operation for reception in asynchronous mode. In serial
reception, the SCI operates as described below.
1. The SCI monitors the communication line. If a start bit is detected, the SCI performs internal
synchronization, receives receive data in RSR, and checks the parity bit and stop bit.
2. If an overrun error occurs (when reception of the next data is completed while the RDRF flag
is still set to 1), the ORER bit in SSR is set to 1. If the RIE bit in SCR is set to 1 at this time, an
ERI interrupt request is generated. Receive data is not transferred to RDR. The RDRF flag
remains to be set to 1.
3. If a parity error is detected, the PER bit in SSR is set to 1 and receive data is transferred to
RDR. If the RIE bit in SCR is set to 1 at this time, an ERI interrupt request is generated.
4. If a framing error is detected (when the stop bit is 0), the FER bit in SSR is set to 1 and receive
data is transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an ERI interrupt
request is generated.
5. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is
transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an RXI interrupt request is
generated. Continuous reception is possible because the RXI interrupt routine reads the receive
data transferred to RDR before reception of the next receive data has been completed.
1
Start
bit
0
Data
D0
D1
Parity Stop Start
bit
bit
bit
D7
0/1
1
0
Data
D0
D1
Parity Stop
bit
bit
D7
0/1
0
1
Idle state
(mark state)
RDRF
FER
RXI interrupt
request
generated
1 frame
RDR data read and RDRF
flag cleared to 0 in RXI
interrupt service routine
ERI interrupt request
generated by framing
error
Figure 12.11 Example of SCI Operation in Reception
(Example with 8-Bit Data, Parity, One Stop Bit)
Table 12.11 shows the states of the SSR status flags and receive data handling when a receive error
is detected. If a receive error is detected, the RDRF flag retains its state before receiving data.
Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the ORER,
FER, PER, and RDRF bits to 0 before resuming reception. Figure 12.12 shows a sample flow chart
for serial data reception.
Rev.6.00 Jun. 03, 2008 Page 410 of 698
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Section 12 Serial Communication Interface
Table 12.11 SSR Status Flags and Receive Data Handling
SSR Status Flag
RDRF*
ORER
FER
PER
Receive Data
Receive Error Type
1
1
0
0
Lost
Overrun error
0
0
1
0
Transferred to RDR
Framing error
0
0
0
1
Transferred to RDR
Parity error
1
1
1
0
Lost
Overrun error + framing error
1
1
0
1
Lost
Overrun error + parity error
0
0
1
1
Transferred to RDR
Framing error + parity error
1
1
1
1
Lost
Overrun error + framing error +
parity error
Note: * The RDRF flag retains the state it had before data reception.
[1]
Initialization
Start reception
[1]
SCI initialization:
The RxD pin is automatically designated as
the receive data input pin.
[2]
[3] Receive error processing and break
detection:
If a receive error occurs, read the ORER,
PER, and FER flags in SSR to identify the
error. After performing the appropriate error
processing, ensure that the ORER, PER, and
FER flags are all cleared to 0. Reception
cannot be resumed if any of these flags are
set to 1. In the case of a framing error, a
break can be detected by reading the value
of the input port corresponding to the RxD
pin.
[4]
SCI status check and receive data read:
Read SSR and check that RDRF = 1, then
read the receive data in RDR and clear the
RDRF flag to 0. Transition of the RDRF flag
from 0 to 1 can also be identified by an RXI
interrupt.
[5]
Serial reception continuation procedure:
To continue serial reception, before the end
bit for the current frame is received, reading
the RDRF flag and RDR, and clearing the
RDRF flag to 0 should be finished. The
RDRF flag is cleared automatically when
DMAC is activated by a reception complete
interrupt (RXI) and the RDR value is read.
[2]
Read ORER, PER, and
FER flags in SSR
Yes
PER ∨ FER ∨ ORER = 1
[3]
No
Error processing
(Continued on next page)
Read RDRF flag in SSR
[4]
No
RDRF = 1
Yes
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
All data received?
Yes
[5]
Clear RE bit in SCR to 0
<End>
Figure 12.12 Sample Serial Data Reception Flowchart (1)
Rev.6.00 Jun. 03, 2008 Page 411 of 698
REJ09B0074-0600
Section 12 Serial Communication Interface
[3]
Error processing
No
ORER = 1
Yes
Overrun error processing
No
FER = 1
Yes
Break?
Yes
No
Framing error processing
No
Clear RE bit in SCR to 0
PER = 1
Yes
Parity error processing
Clear ORER, PER, and
FER flags in SSR to 0
<End>
Figure 12.12 Sample Serial Data Reception Flowchart (2)
Rev.6.00 Jun. 03, 2008 Page 412 of 698
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Section 12 Serial Communication Interface
12.5
Multiprocessor Communication Function
Use of the multiprocessor communication function enables data transfer between a number of
processors sharing communication lines by asynchronous serial communication using the
multiprocessor format, in which a multiprocessor bit is added to the transfer data. When
multiprocessor communication is performed, each receiving station is addressed by a unique ID
code. The serial communication cycle consists of two component cycles; an ID transmission cycle
that specifies the receiving station, and a data transmission cycle. The multiprocessor bit is used to
differentiate between the ID transmission cycle and the data transmission cycle. If the
multiprocessor bit is 1, the cycle is an ID transmission cycle; if the multiprocessor bit is 0, the
cycle is a data transmission cycle. Figure 12.13 shows an example of inter-processor
communication using the multiprocessor format. The transmitting station first sends the ID code of
the receiving station with which it wants to perform serial communication as data with a 1
multiprocessor bit added. It then sends transmit data as data with a 0 multiprocessor bit added.
When data with a 1 multiprocessor bit is received, the receiving station compares that data with its
own ID. The station whose ID matches then receives the data sent next. Stations whose ID do not
match continue to skip data until data with a 1 multiprocessor bit is again received.
The SCI uses the MPIE bit in SCR to implement this function. When the MPIE bit is set to 1,
transfer of receive data from RSR to RDR, error flag detection, and setting the SSR status flags,
RDRF, FER, and ORER to 1, are inhibited until data with a 1 multiprocessor bit is received. On
reception of a receive character with a 1 multiprocessor bit, the MPB bit in SSR is set to 1 and the
MPIE bit is automatically cleared, thus normal reception is resumed. If the RIE bit in SCR is set to
1 at this time, an RXI interrupt is generated.
When the multiprocessor format is selected, the parity bit setting is rendered invalid. All other bit
settings are the same as those in normal asynchronous mode. The clock used for multiprocessor
communication is the same as that in normal asynchronous mode.
Rev.6.00 Jun. 03, 2008 Page 413 of 698
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Section 12 Serial Communication Interface
Transmitting
station
Serial transmission line
Receiving
station A
Receiving
station B
Receiving
station C
Receiving
station D
(ID = 01)
(ID = 02)
(ID = 03)
(ID = 04)
Serial
data
H'01
H'AA
(MPB = 1)
Legend:
MPB: Multiprocessor bit
ID transmission cycle =
receiving station
specification
(MPB = 0)
Data transmission cycle =
Data transmission to
receiving station specified by ID
Figure 12.13 Example of Communication Using Multiprocessor Format
(Transmission of Data H'AA to Receiving Station A)
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Section 12 Serial Communication Interface
12.5.1
Multiprocessor Serial Data Transmission
Figure 12.14 shows a sample flowchart for multiprocessor serial data transmission. For an ID
transmission cycle, set the MPBT bit in SSR to 1 before transmission. For a data transmission
cycle, clear the MPBT bit in SSR to 0 before transmission. All other SCI operations are the same
as those in asynchronous mode.
[1]
Initialization
[1]
SCI initialization:
The TxD pin is automatically
designated as the transmit data
output pin.
After the TE bit is set to 1, a frame of
1s is output, and transmission is
enabled.
[2]
SCI status check and transmit data
write:
Read SSR and check that the TDRE
flag is set to 1, then write transmit
data to TDR. Set the MPBT bit in
SSR to 0 or 1. Finally, clear the
TDRE flag to 0.
[3]
Serial transmission continuation
procedure:
To continue serial transmission, be
sure to read 1 from the TDRE flag to
confirm that writing is possible, then
write data to TDR, and then clear the
TDRE flag to 0. Checking and
clearing of the TDRE flag is automatic
when the DMAC is activated by a
transmit data empty interrupt (TXI)
request, and data is written to TDR.
[4]
Break output at the end of serial
transmission:
To output a break in serial
transmission, set the port DDR to 1,
clear DR to 0, then clear the TE bit in
SCR to 0.
Start transmission
Read TDRE flag in SSR
[2]
No
TDRE = 1
Yes
Write transmit data to TDR and
set MPBT bit in SSR
Clear TDRE flag to 0
No
[3]
All data transmitted?
Yes
Read TEND flag in SSR
No
TEND = 1
Yes
No
Break output?
[4]
Yes
Clear DR to 0 and set DDR to 1
Clear TE bit in SCR to 0
<End>
Figure 12.14 Sample Multiprocessor Serial Data Transmission Flowchart
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Section 12 Serial Communication Interface
12.5.2
Multiprocessor Serial Data Reception
Figure 12.16 shows a sample flowchart for multiprocessor serial data reception. If the MPIE bit in
SCR is set to 1, data is skipped until data with a 1 multiprocessor bit is sent. On receiving data
with a 1 multiprocessor bit, the receive data is transferred to RDR. An RXI interrupt request is
generated at this time. All other SCI operations are the same as in asynchronous mode. Figure
12.15 shows an example of SCI operation for multiprocessor format reception.
Start
1 bit
0
Data (ID1)
MPB
D0
D1
D7
1
Stop
bit
Start
bit
1
0
Data (Data1)
D0
D1
D7
Stop
MPB bit
0
1
1 Idle state
(mark state)
MPIE
RDRF
RDR
value
ID1
MPIE = 0
RXI interrupt
request
(multiprocessor
interrupt)
generated
If not this station’s ID, RXI interrupt request is
not generated, and RDR
MPIE bit is set to 1
retains its state
again
RDR data read
and RDRF flag
cleared to 0 in
RXI interrupt
service routine
(a) Data does not match station’s ID
1
Start
bit
0
Data (ID2)
D0
D1
D7
Stop
MPB bit
1
1
Start
bit
0
Data (Data2)
D0
D1
D7
Stop
MPB bit
0
1
1 Idle state
(mark state)
MPIE
RDRF
RDR
value
ID2
ID1
MPIE = 0
RXI interrupt
request
(multiprocessor
interrupt)
generated
RDR data read and
RDRF flag cleared
to 0 in RXI interrupt
service routine
MPIE bit set to 1
Matches this station’s ID,
so reception continues, and again
data is received in RXI
interrupt service routine
(b) Data matches station’s ID
Figure 12.15 Example of SCI Operation in Reception
(Example with 8-Bit Data, Multiprocessor Bit, One Stop Bit)
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Data2
Section 12 Serial Communication Interface
Initialization
Start reception
Read MPIE bit in SCR
[1]
SCI initialization:
The RxD pin is automatically designated as
the receive data input pin.
[2]
ID reception cycle:
Set the MPIE bit in SCR to 1.
[3]
SCI status check, ID reception and
comparison:
Read SSR and check that the RDRF flag is
set to 1, then read the receive data in RDR
and compare it with this station’s ID.
If the data is not this station’s ID, set the MPIE
bit to 1 again, and clear the RDRF flag to 0.
If the data is this station’s ID, clear the RDRF
flag to 0.
[4]
SCI status check and data reception:
Read SSR and check that the RDRF flag is
set to 1, then read the data in RDR.
[5]
Receive error processing and break detection:
If a receive error occurs, read the ORER and
FER flags in SSR to identify the error. After
performing the appropriate error processing,
ensure that the ORER and FER flags are all
cleared to 0.
Reception cannot be resumed if either of
these flags is set to 1.
In the case of a framing error, a break can be
detected by reading the RxD pin value.
[1]
[2]
Read ORER and FER flags in SSR
Yes
FER∨ORER = 1
No
Read RDRF flag in SSR
[3]
No
RDRF = 1
Yes
Read receive data in RDR
No
This station’s ID?
Yes
Read ORER and FER flags in SSR
FER ∨ ORER = 1
Yes
No
Read RDRF flag in SSR
[4]
No
RDRF = 1
Yes
Read receive data in RDR
No
All data received?
[5]
Error processing
Yes
Clear RE bit in SCR to 0
(Continued on
next page)
<End>
Figure 12.16 Sample Multiprocessor Serial Data Reception Flowchart (1)
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Section 12 Serial Communication Interface
[5]
Error processing
No
ORER = 1
Yes
Overrun error processing
No
FER = 1
Yes
Yes
Break?
No
Framing error processing
Clear RE bit in SCR to 0
Clear ORER, PER, and
FER flags in SSR to 0
<End>
Figure 12.16 Sample Multiprocessor Serial Data Reception Flowchart (2)
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Section 12 Serial Communication Interface
12.6
Operation in Clocked Synchronous Mode
Figure 12.17 shows the general format for clocked synchronous communication. In clocked
synchronous mode, data is transmitted or received synchronous with clock pulses. In clocked
synchronous serial communication, data on the transmission line is output from one falling edge of
the serial clock to the next. In clocked synchronous mode, the SCI receives data in synchronous
with the rising edge of the serial clock. After 8-bit data is output, the transmission line holds the
MSB state. In clocked synchronous mode, no parity or multiprocessor bit is added. Inside the SCI,
the transmitter and receiver are independent units, enabling full-duplex communication through the
use of a common clock. Both the transmitter and the receiver also have a double-buffered
structure, so data can be read from or written during transmission or reception, enabling
continuous data transfer.
One unit of transfer data (character or frame)
*
*
Synchronization
clock
LSB
Bit 0
Serial data
MSB
Bit 1
Don't care
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Don't care
Note: * High except in continuous transfer
Figure 12.17 Data Format in Synchronous Communication (For LSB-First)
12.6.1
Clock
Either an internal clock generated by the on-chip baud rate generator or an external
synchronization clock input at the SCK pin can be selected, according to the setting of CKE0 and
CKE1 bits in SCR. When the SCI is operated on an internal clock, the serial clock is output from
the SCK pin. Eight serial clock pulses are output in the transfer of one character, and when no
transfer is performed the clock is fixed high.
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Section 12 Serial Communication Interface
12.6.2
SCI Initialization (Clocked Synchronous Mode)
Before transmitting and receiving data, the TE and RE bits in SCR should be cleared to 0, then the
SCI should be initialized as described in a sample flowchart in figure 12.18. When the operating
mode, or transfer format, is changed for example, the TE and RE bits must be cleared to 0 before
making the change using the following procedure. When the TE bit is cleared to 0, the TDRE flag
is set to 1. Note that clearing the RE bit to 0 does not change the contents of the RDRF, PER,
FER, and ORER flags, or the contents of RDR.
Start initialization
Clear TE and RE bits in SCR to 0
[1]
Set the clock selection in SCR. Be sure to
clear bits RIE, TIE, TEIE, and MPIE, TE and
RE, to 0.
[2]
Set the data transfer format in SMR and
SCMR.
Set CKE1 and CKE0 bits in SCR
(TE, RE bits 0)
[1]
[3]
Write a value corresponding to the bit rate to
BRR. Not necessary if an external clock is
used.
Set data transfer format in
SMR and SCMR
[2]
[4]
Set value in BRR
[3]
Wait at least one bit interval, then set the TE
bit or RE bit in SCR to 1.
Also set the RIE, TIE TEIE, and MPIE bits.
Setting the TE and RE bits enables the TxD
and RxD pins to be used.
Wait
No
1-bit interval elapsed?
Yes
Set TE and RE bits in SCR to 1, and
set RIE, TIE, TEIE, and MPIE bits
[4]
<Transfer start>
Note: In simultaneous transmit and receive operations, the TE and RE bits should both be cleared
to 0 or set to 1 simultaneously.
Figure 12.18 Sample SCI Initialization Flowchart
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Section 12 Serial Communication Interface
12.6.3
Serial Data Transmission (Clocked Synchronous Mode)
Figure 12.19 shows an example of SCI operation for transmission in clocked synchronous mode.
In serial transmission, the SCI operates as described below.
1. The SCI monitors the TDRE flag in SSR, and if the flag is 0, the SCI recognizes that data has
been written to TDR, and transfers the data from TDR to TSR.
2. After transferring data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts
transmission. If the TIE bit in SCR is set to 1 at this time, a transmit data empty interrupt
(TXI) is generated. Continuous transmission is possible because the TXI interrupt routine
writes the next transmit data to TDR before transmission of the current transmit data has been
completed.
3. 8-bit data is sent from the TxD pin synchronized with the output clock when output clock mode
has been specified, and synchronized with the input clock when use of an external clock has
been specified.
4. The SCI checks the TDRE flag at the timing for sending the MSB (bit 7).
5. If the TDRE flag is cleared to 0, data is transferred from TDR to TSR, and serial transmission
of the next frame is started.
6. If the TDRE flag is set to 1, the TEND flag in SSR is set to 1, and the TDRE flag maintains the
output state of the last bit. If the TEIE bit in SCR is set to 1 at this time, a TEI interrupt request
is generated. The SCK pin is fixed high.
Figure 12.20 shows a sample flow chart for serial data transmission. Even if the TDRE flag is
cleared to 0, transmission will not start while a receive error flag (ORER, FER, or PER) is set to 1.
Make sure that the receive error flags are cleared to 0 before starting transmission. Note that
clearing the RE bit to 0 does not clear the receive error flags.
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Section 12 Serial Communication Interface
Transfer direction
Synchronization
clock
Serial data
Bit 0
Bit 1
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
TDRE
TEND
TXI interrupt request
generated
Data written to TDR and
TDRE flag cleared to 0 in
TXI interrupt service
routine
TXI interrupt request
generated
TEI interrupt request
generated
1 frame
Figure 12.19 Sample SCI Transmission Operation in Clocked Synchronous Mode
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Section 12 Serial Communication Interface
Initialization
[1]
Start transmission
Read TDRE flag in SSR
[1]
SCI initialization:
The TxD pin is automatically designated as
the transmit data output pin.
[2]
SCI status check and transmit data write:
Read SSR and check that the TDRE flag is
set to 1, then write transmit data to TDR
and clear the TDRE flag to 0.
[3]
Serial transmission continuation procedure:
To continue serial transmission, be sure to
read 1 from the TDRE flag to confirm that
writing is possible, then write data to TDR,
and then clear the TDRE flag to 0.
Checking and clearing of the TDRE flag is
automatic when the DMAC is activated by a
transmit data empty interrupt (TXI) request
and data is written to TDR.
[2]
No
TDRE = 1
Yes
Write transmit data to TDR and
clear TDRE flag in SSR to 0
No
All data transmitted?
[3]
Yes
Read TEND flag in SSR
No
TEND = 1
Yes
Clear TE bit in SCR to 0
<End>
Figure 12.20 Sample Serial Data Transmission Flowchart
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Section 12 Serial Communication Interface
12.6.4
Serial Data Reception (Clocked Synchronous Mode)
Figure 12.21 shows an example of SCI operation for reception in clocked synchronous mode. In
serial reception, the SCI operates as described below.
1. The SCI performs internal initialization synchronous with a synchronous clock input or output,
starts receiving data, and stores the received data in RSR.
2. If an overrun error occurs (when reception of the next data is completed while the RDRF flag
in SSR is still set to 1), the ORER bit in SSR is set to 1. If the RIE bit in SCR is set to 1 at this
time, an ERI interrupt request is generated, receive data is not transferred to RDR, and the
RDRF flag remains to be set to 1.
3. If reception is completed successfully, the RDRF bit in SSR is set to 1, and receive data is
transferred to RDR. If the RIE bit in SCR is set to 1 at this time, an RXI interrupt request is
generated. Continuous reception is possible because the RXI interrupt routine reads the receive
data transferred to RDR before reception of the next receive data has finished.
Synchronization
clock
Bit 7
Serial data
Bit 0
Bit 7
Bit 0
Bit 1
Bit 6
Bit 7
RDRF
ORER
RXI interrupt
request
generated
RDR data read and
RDRF flag cleared to 0
in RXI interrupt service
routine
RXI interrupt request
generated
ERI interrupt request
generated by overrun
error
1 frame
Figure 12.21 Example of SCI Operation in Reception
Reception cannot be resumed while a receive error flag is set to 1. Accordingly, clear the ORER,
FER, PER, and RDRF bits to 0 before resuming reception. Figure 12.22 shows a sample flow chart
for serial data reception.
When the internal clock is selected during reception, the synchronization clock will be output until
an overrun error occurs or the RE bit is cleared. To receive data in frame units, a dummy data of
one frame must be transmitted simultaneously.
Rev.6.00 Jun. 03, 2008 Page 424 of 698
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Section 12 Serial Communication Interface
Initialization
[1]
[1]
SCI initialization:
The RxD pin is automatically designated as
the receive data input pin.
[2]
[3] Receive error processing:
If a receive error occurs, read the ORER
flag in SSR, and after performing the
appropriate error processing, clear the
ORER flag to 0. Transfer cannot be
resumed if the ORER flag is set to 1.
[4]
SCI status check and receive data read:
Read SSR and check that the RDRF flag is
set to 1, then read the receive data in RDR
and clear the RDRF flag to 0.
Transition of the RDRF flag from 0 to 1 can
also be identified by an RXI interrupt.
[5]
Serial reception continuation procedure:
To continue serial reception, before the
MSB (bit 7) of the current frame is received,
reading the RDRF flag, reading RDR, and
clearing the RDRF flag to 0 should be
finished. The RDRF flag is cleared
automatically when the DMAC is activated
by a receive data full interrupt (RXI) request
and the RDR value is read.
Start reception
Read ORER flag in SSR
[2]
Yes
ORER = 1
[3]
No
Error processing
(Continued below)
Read RDRF flag in SSR
No
[4]
RDRF = 1
Yes
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
All data received?
[5]
Yes
Clear RE bit in SCR to 0
<End>
[3]
Error processing
Overrun error processing
Clear ORER flag in SSR to 0
<End>
Figure 12.22 Sample Serial Data Reception Flowchart
12.6.5
Simultaneous Serial Data Transmission and Reception
(Clocked Synchronous Mode)
Figure 12.23 shows a sample flowchart for simultaneous serial transmit and receive operations.
The following procedure should be used for simultaneous serial data transmit and receive
operations. To switch from transmit mode to simultaneous transmit and receive mode, after
checking that the SCI has finished transmission and the TDRE and TEND flags are set to 1, clear
TE to 0. Then simultaneously set TE and RE to 1 with a single instruction. To switch from receive
mode to simultaneous transmit and receive mode, after checking that the SCI has finished
reception, clear RE to 0. Then after checking that the RDRF and receive error flags (ORER, FER,
and PER) are cleared to 0, simultaneously set TE and RE to 1 with a single instruction.
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Section 12 Serial Communication Interface
Initialization
[1]
[1]
SCI initialization:
The TxD pin is designated as the
transmit data output pin, and the RxD pin
is designated as the receive data input
pin, enabling simultaneous transmit and
receive operations.
[2]
SCI status check and transmit data write:
Read SSR and check that the TDRE flag
is set to 1, then write transmit data to
TDR and clear the TDRE flag to 0.
Transition of the TDRE flag from 0 to 1
can also be identified by a TXI interrupt.
Receive error processing:
If a receive error occurs, read the ORER
flag in SSR, and after performing the
appropriate error processing, clear the
ORER flag to 0. Transmission/reception
cannot be resumed if the ORER flag is
set to 1.
Start transmission/reception
Read TDRE flag in SSR
[2]
No
TDRE = 1
Yes
Write transmit data to TDR and
clear TDRE flag in SSR to 0
[3]
Read ORER flag in SSR
ORER = 1
No
Read RDRF flag in SSR
Yes
[3]
[4]
SCI status check and receive data read:
Read SSR and check that the RDRF flag
is set to 1, then read the receive data in
RDR and clear the RDRF flag to 0.
Transition of the RDRF flag from 0 to 1
can also be identified by an RXI
interrupt.
[5]
Serial transmission/reception
continuation procedure:
To continue serial transmission/
reception, before the MSB (bit 7) of the
current frame is received, finish reading
the RDRF flag, reading RDR, and
clearing the RDRF flag to 0. Also,
before the MSB (bit 7) of the current
frame is transmitted, read 1 from the
TDRE flag to confirm that writing is
possible. Then write data to TDR and
clear the TDRE flag to 0.
Checking and clearing of the TDRE flag
is automatic when the DMAC is activated
by a transmit data empty interrupt (TXI)
request and data is written to TDR.
Also, the RDRF flag is cleared
automatically when the DMAC is
activated by a receive data full interrupt
(RXI) request and the RDR value is
read.
Error processing
[4]
No
RDRF = 1
Yes
Read receive data in RDR, and
clear RDRF flag in SSR to 0
No
All data received?
[5]
Yes
Clear TE and RE bits in SCR to 0
<End>
Note: When switching from transmit or receive operation to simultaneous
transmit and receive operations, first clear the TE bit and RE bit to 0,
then set both these bits to 1 simultaneously.
Figure 12.23 Sample Flowchart of Simultaneous Serial Data Transmit and
Receive Operations
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Section 12 Serial Communication Interface
12.7
Operation in Smart Card Interface
The SCI supports an IC card (Smart Card) interface that conforms to ISO/IEC 7816-3
(Identification Card) as a serial communication interface extension function. Switching between
the normal serial communication interface and the Smart Card interface mode is carried out by
means of a register setting.
12.7.1
Pin Connection Example
Figure 12.24 shows an example of connection with the Smart Card. In communication with an IC
card, as both transmission and reception are carried out on a single data transmission line, the TxD
pin and RxD pin should be connected to the LSI pin. The data transmission line should be pulled
up to the VCC power supply with a resistor. If an IC card is not connected, and the TE and RE bits
are both set to 1, closed transmission/reception is possible, enabling self-diagnosis to be carried
out. When the clock generated on the Smart Card interface is used by an IC card, the SCK pin
output is input to the CLK pin of the IC card. This LSI port output is used as the reset signal.
VCC
TxD
RxD
SCK
Px (port)
This LSI
Data line
Clock line
Reset line
I/O
CLK
RST
IC card
Connected equipment
Figure 12.24 Schematic Diagram of Smart Card Interface Pin Connections
Rev.6.00 Jun. 03, 2008 Page 427 of 698
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Section 12 Serial Communication Interface
12.7.2
Data Format (Except for Block Transfer Mode)
Figure 12.25 shows the transfer data format in Smart Card interface mode.
• One frame consists of 8-bit data plus a parity bit in asynchronous mode.
• In transmission, a guard time of at least 2 etu (Elementary time unit: the time for transfer of
one bit) is left between the end of the parity bit and the start of the next frame.
• If a parity error is detected during reception, a low error signal level is output for one etu
period, 10.5 etu after the start bit.
• If an error signal is sampled during transmission, the same data is retransmitted automatically
after a delay of 2 etu or longer.
When there is no parity error
Ds
D0
D1
D2
D3
D4
D5
D6
D7
Dp
D6
D7
Dp
Transmitting station output
When a parity error occurs
Ds
D0
D1
D2
D3
D4
D5
DE
Transmitting station output
Legend:
DS:
D0 to D7:
Dp:
DE:
Receiving station
output
Start bit
Data bits
Parity bit
Error signal
Figure 12.25 Normal Smart Card Interface Data Format
Data transfer with other types of IC cards (direct convention and inverse convention) are
performed as described in the following.
(Z)
A
Z
Z
A
Z
Z
Z
A
A
Z
Ds
D0
D1
D2
D3
D4
D5
D6
D7
Dp
(Z)
State
Figure 12.26 Direct Convention (SDIR = SINV = O/E = 0)
With the direction convention type IC and the above sample start character, the logic 1 level
corresponds to state Z and the logic 0 level to state A, and transfer is performed in LSB-first order.
The start character data above is H'3B. For the direct convention type, clear the SDIR and SINV
Rev.6.00 Jun. 03, 2008 Page 428 of 698
REJ09B0074-0600
Section 12 Serial Communication Interface
bits in SCMR to 0. According to Smart Card regulations, clear the O/E bit in SMR to 0 to select
even parity mode.
(Z)
A
Z
Z
A
A
A
A
A
A
Z
Ds
D7
D6
D5
D4
D3
D2
D1
D0
Dp
(Z)
State
Figure 12.27 Inverse Convention (SDIR = SINV = O/E = 1)
With the inverse convention type, the logic 1 level corresponds to state A and the logic 0 level to
state Z, and transfer is performed in MSB-first order. The start character data for the above is
H'3F. For the inverse convention type, set the SDIR and SINV bits in SCMR to 1. According to
Smart Card regulations, even parity mode is the logic 0 level of the parity bit, and corresponds to
state Z. In this LSI, the SINV bit inverts only data bits D0 to D7. Therefore, set the O/E bit in
SMR to 1 to invert the parity bit for both transmission and reception.
12.7.3
Clock
As a transmit/receive clock, only an internal clock which is generated by an on-chip baud rate
generator can be used. When clock output is selected by setting CKE0 to 1, a clock with a
frequency S times the bit rate is output from the SCK pin.
Note: Symbol S is the value of S described in section 12.3.11, Bit Rate Register (BRR).
12.7.4
Block Transfer Mode
Operation in block transfer mode is the same as that in the normal Smart Card interface mode,
except for the following points.
• In reception, though the parity check is performed, no error signal is output even if an error is
detected. However, the PER bit in SSR is set to 1 and must be cleared before receiving the
parity bit of the next frame.
• In transmission, a guard time of at least 1 etu is left between the end of the parity bit and the
start of the next frame.
• In transmission, because retransmission is not performed, the TEND flag is set to 1, 11.5 etu
after transmission start.
• As with the normal Smart Card interface, the ERS flag indicates the error signal status, but
since error signal transfer is not performed, this flag is always cleared to 0.
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Section 12 Serial Communication Interface
12.7.5
Receive Data Sampling Timing and Reception Margin
In Smart Card interface mode an internal clock generated by the on-chip baud rate generator can
only be used as a transmission/reception clock. In this mode, the SCI operates on a basic clock
with a frequency of 32, 64, 372, or 256 times the transfer rate (fixed to 16 times in normal
asynchronous mode) as determined by bits BCP1 and BCP0. In reception, the SCI samples the
falling edge of the start bit using the basic clock, and performs internal synchronization. As shown
in figure 12.28, by sampling receive data at the rising-edge of the 16th, 32nd, 186th, or 128th pulse
of the basic clock, data can be latched at the middle of the bit. The reception margin is given by the
following formula.
M = | (0.5 –
1
| D – 0.5 |
) – (L – 0.5) F –
(1+ F) | × 100 [%]
2N
N
Where M: Reception margin (%)
N: Ratio of bit rate to clock (N = 32, 64, 372, and 256)
D: Clock duty (D = 0 to 1.0)
L: Frame length (L = 10)
F: Absolute value of clock frequency deviation
Assuming values of F = 0, D = 0.5 and N = 372 in the above formula, the reception margin
formula is as follows.
M = (0.5 – 1/2 × 372) × 100%
= 49.866%
372 clocks
186 clocks
0
185
185
371 0
371 0
Internal
basic clock
Receive data
(RxD)
Start bit
D0
D1
Synchronization
sampling timing
Data sampling
timing
Figure 12.28 Receive Data Sampling Timing in Smart Card Mode
(Using Clock of 372 Times the Transfer Rate)
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Section 12 Serial Communication Interface
12.7.6
Initialization
Before transmitting and receiving data, initialize the SCI as described below. Initialization is also
necessary when switching from transmit mode to receive mode, or vice versa.
1. Clear the TE and RE bits in SCR to 0.
2. Clear the error flags ERS, PER, and ORER in SSR to 0.
3. Set the GM, BLK, O/E, BCP0, BCP1, CKS0, CKS1 bits in SMR. Set the PE bit to 1.
4. Set the SMIF, SDIR, and SINV bits in SCMR.
When the SMIF bit is set to 1, the TxD and RxD pins are both switched from ports to SCI pins,
and are placed in the high-impedance state.
5. Set the value corresponding to the bit rate in BRR.
6. Set the CKE0 and CKE1 bits in SCR. Clear the TIE, RIE, TE, RE, MPIE, and TEIE bits to 0.
If the CKE0 bit is set to 1, the clock is output from the SCK pin.
7. Wait at least one bit interval, then set the TIE, RIE, TE, and RE bits in SCR. Do not set the TE
bit and RE bit at the same time, except for self-diagnosis.
To switch from receive mode to transmit mode, after checking that the SCI has finished reception,
initialize the SCI, and set RE to 0 and TE to 1. Whether SCI has finished reception or not can be
checked with the RDRF, PER, or ORER flags. To switch from transmit mode to receive mode,
after checking that the SCI has finished transmission, initialize the SCI, and set TE to 0 and RE to
1. Whether SCI has finished transmission or not can be checked with the TEND flag.
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Section 12 Serial Communication Interface
12.7.7
Serial Data Transmission (Except for Block Transfer Mode)
As data transmission in Smart Card interface mode involves error signal sampling and
retransmission processing, the operations are different from those in normal serial communication
interface mode (except for block transfer mode). Figure 12.29 illustrates the retransfer operation
when the SCI is in transmit mode.
1. If an error signal is sent back from the receiving end after transmission of one frame is
complete, the ERS bit in SSR is set to 1. If the RIE bit in SCR is enabled at this time, an ERI
interrupt request is generated. The ERS bit in SSR should be cleared to 0 by the time the next
parity bit is sampled.
2. The TEND bit in SSR is not set for a frame in which an error signal indicating an abnormality
is received. Data is retransferred from TDR to TSR, and retransmitted automatically.
3. If an error signal is not sent back from the receiving end, the ERS bit in SSR is not set.
Transmission of one frame, including a retransfer, is judged to have been completed, and the
TEND bit in SSR is set to 1. If the TIE bit in SCR is enabled at this time, a TXI interrupt
request is generated. Writing transmit data to TDR transfers the next transmit data.
Figure 12.31 shows a flowchart for transmission. A sequence of transmit operations can be
performed automatically by specifying the DMAC to be activated with a TXI interrupt source. In a
transmit operation, the TDRE flag is set to 1 at the same time as the TEND flag in SSR is set, and
a TXI interrupt will be generated if the TIE bit in SCR has been set to 1. If the TXI request is
designated beforehand as a DMAC activation source, the DMAC will be activated by the TXI
request, and transfer of the transmit data will be carried out. The TDRE and TEND flags are
automatically cleared to 0 when data is transferred by the DMAC. In the event of an error, the SCI
retransmits the same data automatically. During this period, the TEND flag remains cleared to 0
and the DMAC is not activated. Therefore, the SCI and DMAC will automatically transmit the
specified number of bytes in the event of an error, including retransmission. However, the ERS
flag is not cleared automatically when an error occurs, and so the RIE bit should be set to 1
beforehand so that an ERI request will be generated in the event of an error, and the ERS flag will
be cleared. When using the DMAC for data transmission or reception, always make DMAC
settings and enable the DMAC before making SCI settings. For details on DMAC settings, see
section 7, DMA Controller (DMAC).
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Section 12 Serial Communication Interface
nth transfer frame
Transfer
frame n + 1
Retransferred frame
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
(DE)
Ds D0 D1 D2 D3 D4
TDRE
Transfer to TSR from TDR
Transfer to TSR
from TDR
Transfer to TSR from TDR
TEND
FER/ERS
Figure 12.29 Retransfer Operation in SCI Transmit Mode
The timing for setting the TEND flag depends on the value of the GM bit in SMR. The TEND flag
set timing is shown in figure 12.30.
I/O data
Ds
TXI
(TEND interrupt)
D0
D1
D2
D3
D4
D5
D6
D7
Dp
DE
Guard
time
12.5 etu
When GM = 0
11.0 etu
When GM = 1
Legend:
Ds:
D0 to D7:
Dp:
DE:
Start bit
Data bits
Parity bit
Error signal
Figure 12.30 TEND Flag Generation Timing in Transmission Operation
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Section 12 Serial Communication Interface
Start
Initialization
Start transmission
ERS = 0?
No
Yes
Error processing
No
TEND = 1?
Yes
Write data to TDR,
and clear TDRE flag
in SSR to 0
No
All data transmitted ?
Yes
No
ERS = 0?
Yes
Error processing
No
TEND = 1?
Yes
Clear TE bit to 0
End
Figure 12.31 Example of Transmission Processing Flow
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Section 12 Serial Communication Interface
12.7.8
Serial Data Reception (Except for Block Transfer Mode)
Data reception in Smart Card interface mode uses the same operation procedure as for normal
serial communication interface mode. Figure 12.32 illustrates the retransfer operation when the
SCI is in receive mode.
1. If an error is found when the received parity bit is checked, the PER bit in SSR is automatically
set to 1. If the RIE bit in SCR is set at this time, an ERI interrupt request is generated. The PER
bit in SSR should be kept cleared to 0 until the next parity bit is sampled.
2. The RDRF bit in SSR is not set for a frame in which an error has occurred.
3. If no error is found when the received parity bit is checked, the PER bit in SSR is not set to 1,
the receive operation is judged to have been completed normally, and the RDRF flag in SSR is
automatically set to 1. If the RIE bit in SCR is enabled at this time, an RXI interrupt request is
generated.
Figure 12.33 shows a flowchart for reception. A sequence of receive operations can be performed
automatically by specifying the DMAC to be activated using an RXI interrupt source. In a receive
operation, an RXI interrupt request is generated when the RDRF flag in SSR is set to 1. If the RXI
request is designated beforehand as a DMAC activation source, the DMAC will be activated by the
RXI request, and the receive data will be transferred. The RDRF flag is cleared to 0 automatically
when data is transferred by the DMAC. If an error occurs in receive mode and the ORER or PER
flag is set to 1, a transfer error interrupt (ERI) request will be generated. Hence, so the error flag
must be cleared to 0. In the event of an error, the DMAC is not activated and receive data is
skipped. Therefore, receive data is transferred for only the specified number of bytes in the event
of an error. Even when a parity error occurs in receive mode and the PER flag is set to 1, the data
that has been received is transferred to RDR and can be read from there.
Note: For details on receive operations in block transfer mode, refer to section 12.4, Operation in
Asynchronous Mode.
nth transfer frame
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE
Retransferred frame
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
Transfer
frame n + 1
(DE)
Ds D0 D1 D2 D3 D4
RDRF
PER
Figure 12.32 Retransfer Operation in SCI Receive Mode
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Section 12 Serial Communication Interface
Start
Initialization
Start reception
ORER = 0 and
PER = 0
No
Yes
Error processing
No
RDRF = 1?
Yes
Read RDR and clear
RDRF flag in SSR to 0
No
All data received?
Yes
Clear RE bit to 0
Figure 12.33 Example of Reception Processing Flow
12.7.9
Clock Output Control
When the GM bit in SMR is set to 1, the clock output level can be fixed with bits CKE0 and CKE1
in SCR. At this time, the minimum clock pulse width can be made the specified width. Figure
12.34 shows the timing for fixing the clock output level. In this example, GM is set to 1, CKE1 is
cleared to 0, and the CKE0 bit is controlled.
CKE0
SCK
Specified pulse width
Specified pulse width
Figure 12.34 Timing for Fixing Clock Output Level
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Section 12 Serial Communication Interface
When turning on the power or switching between Smart Card interface mode and software standby
mode, the following procedures should be followed in order to maintain the clock duty.
Powering On: To secure clock duty from power-on, the following switching procedure should be
followed.
1. The initial state is port input and high impedance. Use a pull-up resistor or pull-down
resistor to fix the potential.
2. Fix the SCK pin to the specified output level with the CKE1 bit in SCR.
3. Set SMR and SCMR, and switch to smart card mode operation.
4. Set the CKE0 bit in SCR to 1 to start clock output.
When changing from smart card interface mode to software standby mode:
1. Set the data register (DR) and data direction register (DDR) corresponding to the SCK pin
to the value for the fixed output state in software standby mode.
2. Write 0 to the TE bit and RE bit in the serial control register (SCR) to halt transmit/receive
operation. At the same time, set the CKE1 bit to the value for the fixed output state in
software standby mode.
3. Write 0 to the CKE0 bit in SCR to halt the clock.
4. Wait for one serial clock period.
During this interval, clock output is fixed at the specified level, with the duty preserved.
5. Make the transition to the software standby state.
When returning to smart card interface mode from software standby mode:
1. Exit the software standby state.
2. Write 1 to the CKE0 bit in SCR and output the clock. Signal generation is started with the
normal duty.
Normal operation
Software
standby
Normal operation
Figure 12.35 Clock Halt and Restart Procedure
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Section 12 Serial Communication Interface
12.8
SCI Select Function (Clocked Synchronous Mode)
The SCI_0 supports the SCI select function which allows clock synchronous communication
between master LSI and one of multiple slave LSI. Figure 12.36 shows an example of
communication using the SCI select function. Figure 12.37 shows the operation.
The master LSI can communicate with slave LSI_A by bringing SEL_A and SEL_B signals low
and high, respectively. In this case, the TxD0_B pin of the slave LSI_B is brought highimpedance state and the internal SCK0_A signal is fixed high. This halts the communication
operation of slave LSI_B. The master LSI can communicate with slave LSI_B by bringing the
SEL_A and SEL_B signals high and low, respectively.
The slave LSI detects the selection by receiving the low level input from the IRQ7 pin and
immediately executes data transmission/reception processing.
Note: The selection signals (SEL_A and SEL_B) of the LSI must be switched while the serial
clock (M_SCK) is high after the end bit of the transmit data has been send. Note that one
selection signal can be brought low at the same time.
Master LSI
SEL_A
M_TxD
M_RxD
M_SCK
Slave LSI_A (This LSI)
IRQ7_A
Interrupt
controller
RxD0_A
RSR0_A
TSR0_A
TxD0_A
SCK0_A
SCK0
Transmission/
reception
control
C/A = CKE1 = SSE = 1
Slave LSI_B (This LSI)
SEL_B
IRQ7_B
RxD0_B
TxD0_B
SCK0
SCK0_B
Figure 12.36 Example of Communication Using the SCI Select Function
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Section 12 Serial Communication Interface
Communication between master LSI
Communication between master LSI
and slave LSI_A
and slave LSI_B
Period of M_SCK = high
[Master LSI]
M_SCK
M_TxD
D0
D1
D7
D0
D1
D7
M_RxD
D0
D1
D7
D0
D1
D7
SEL_A
SEL_B
[Slave LSI_A]
IRQ7_A
(SEL_A)
SCK0_A
Fixed high level
RSR0_A
TxD0_A
D0
Hi-Z
D0
D6
D1
D7
Hi-Z
D7
[Slave LSI_B]
IRQ7_B
(SEL_B)
Fixed high level
SCK0_B
RSR0_B
TxD0_B
D0
Hi-Z
D0
D6
D1
D7
D7
Hi-Z
Figure 12.37 Example of Communication Using the SCI Select Function
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Section 12 Serial Communication Interface
12.9
Interrupts
12.9.1
Interrupts in Normal Serial Communication Interface Mode
Table 12.12 shows the interrupt sources in normal serial communication interface mode. A
different interrupt vector is assigned to each interrupt source, and individual interrupt sources can
be enabled or disabled using the enable bits in SCR.
When the TDRE flag in SSR is set to 1, a TXI interrupt request is generated. When the TEND flag
in SSR is set to 1, a TEI interrupt request is generated. A TXI interrupt can activate the DMAC to
perform data transfer. The TDRE flag is cleared to 0 automatically when data is transferred by the
DMAC.
When the RDRF flag in SSR is set to 1, an RXI interrupt request is generated. When the ORER,
PER, or FER flag in SSR is set to 1, an ERI interrupt request is generated. An RXI interrupt
request can activate the DMAC to transfer data. The RDRF flag is cleared to 0 automatically when
data is transferred by the DMAC.
A TEI interrupt is requested when the TEND flag is set to 1 and the TEIE bit is set to 1. If a TEI
interrupt and a TXI interrupt are requested simultaneously, the TXI interrupt has priority for
acceptance. However, if the TDRE and TEND flags are cleared simultaneously by the TXI
interrupt routine, the SCI cannot branch to the TEI interrupt routine later.
Table 12.12 SCI Interrupt Sources
Channel Name
0
2
Interrupt Source
Interrupt Flag
DMAC Activation Priority*
ERI0
Receive Error
ORER, FER, PER
Not possible
RXI0
Receive Data Full
RDRF
Possible
TXI0
Transmit Data Empty
TDRE
Possible
TEI0
Transmission End
TEND
Not possible
ERI2
Receive Error
ORER, FER, PER
Not possible
RXI2
Receive Data Full
RDRF
Not possible
TXI2
Transmit Data Empty
TDRE
Not possible
TEI2
Transmission End
TEND
Not possible
High
Low
Note: * This table shows the initial state immediately after a reset. The relative channel priorities
can be changed by the interrupt controller.
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Section 12 Serial Communication Interface
12.9.2
Interrupts in Smart Card Interface Mode
Table 12.13 shows the interrupt sources in Smart Card interface mode. The transmit end interrupt
(TEI) request cannot be used in this mode.
Note: In case of block transfer mode, see section 12.9.1, Interrupts in Normal Serial
Communication Interface Mode.
Table 12.13 Interrupt Sources in Smart Card Interface Mode
Channel
Name
Interrupt Source
Interrupt Flag
DMAC
Activation
Priority*
0
ERI0
Receive Error, detection
ORER, PER, ERS
Not possible
High
RXI0
Receive Data Full
RDRF
Possible
2
TXI0
Transmit Data Empty
TEND
Possible
ERI2
Receive Error, detection
ORER, PER, ERS
Not possible
RXI2
Receive Data Full
RDRF
Not possible
TXI2
Transmit Data Empty
TEND
Not possible
Low
Note: * Indicates the initial state immediately after a reset.
Priorities in channels can be changed by the interrupt controller.
12.10
Usage Notes
12.10.1 Module Stop Mode Setting
SCI operation can be disabled or enabled using the module stop control register. The initial setting
is for SCI operation to be halted. Register access is enabled by clearing module stop mode. For
details, refer to section 20, Power-Down Modes.
12.10.2 Break Detection and Processing (Asynchronous Mode Only)
When framing error detection is performed, a break can be detected by reading the RxD pin value
directly. In a break, the input from the RxD pin becomes all 0s, setting the FER flag, and possibly
the PER flag. Note that as the SCI continues the receive operation after receiving a break, even if
the FER flag is cleared to 0, it will be set to 1 again.
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Section 12 Serial Communication Interface
12.10.3 Mark State and Break Detection (Asynchronous Mode Only)
When TE is 0, the TxD pin is used as an I/O port whose direction (input or output) and level are
determined by DR and DDR. This can be used to set the TxD pin to mark state (high level) or send
a break during serial data transmission. To maintain the communication line at mark state until TE
is set to 1, set both DDR and DR to 1. As TE is cleared to 0 at this point, the TxD pin becomes an
I/O port, and 1 is output from the TxD pin. To send a break during serial transmission, first set
PCR to 1 and PDR to 0, and then clear TE to 0. When TE is cleared to 0, the transmitter is
initialized regardless of the current transmission state, the TxD pin becomes an I/O port, and 0 is
output from the TxD pin.
12.10.4 Receive Error Flags and Transmit Operations (Clocked Synchronous Mode Only)
Transmission cannot be started when a receive error flag (ORER, PER, or FER) is set to 1, even if
the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 before starting
transmission. Note also that receive error flags cannot be cleared to 0 even if the RE bit is cleared
to 0.
12.10.5 Restrictions on Use of DMAC
• When an external clock source is used as the serial clock, the transmit clock should not be
input until at least 5 φ clock cycles after TDR is updated by the DMAC. Misoperation may
occur if the transmit clock is input within 4 φ clocks after TDR is updated. (figure 12.38)
• When RDR is read by the DMAC, be sure to set the activation source to the relevant SCI
reception end interrupt (RXI).
SCK
t
TDRE
LSB
Serial data
D0
D1
D2
D3
D4
D5
D6
D7
Note: When operating on an external clock, set t>4 clocks.
Figure 12.38 Example of Clocked Synchronous Transmission by DMAC
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Section 12 Serial Communication Interface
12.10.6 Operation in Case of Mode Transition
• Transmission
Operation should be stopped (by clearing TE, TIE, and TEIE to 0) before making a module
stop mode, software standby mode, watch mode, subactive mode, or subsleep mode transition.
TSR, TDR, and SSR are reset. The output pin states in module stop mode, software standby
mode, watch mode, subactive mode, or subsleep mode depend on the port settings, and
becomes high-level output after the relevant mode is cleared. If a transition is made during
transmission, the data being transmitted will be undefined. When transmitting without
changing the transmit mode after the relevant mode is cleared, transmission can be started by
setting TE to 1 again, and performing the following sequence:
SSR read -> TDR write -> TDRE clearance. To transmit with a different transmit mode after
clearing the relevant mode, the procedure must be started again from initialization. Figure
12.39 shows a sample flowchart for mode transition during transmission. Port pin states are
shown in figures 12.40 and 12.41.
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Section 12 Serial Communication Interface
<Transmission>
No
All data
transmitted?
[1]
[1] Data being transmitted is interrupted.
After exiting software standby
mode, etc., normal CPU transmission
is possible by setting TE to 1, reading
SSR, writing TDR, and clearing TDRE
to 0.
Yes
Read TEND flag in SSR
[2] If TIE and TEIE are set to 1, clear
them to 0 in the same way.
No
TEND = 1
[3] Includes module stop mode, watch mode,
subactive mode, and subsleep mode.
Yes
TE= 0
[2]
Transition to software
standby mode, etc.
[3]
Exit from software
standby mode, etc.
Change
operating mode?
No
Yes
Initialization
TE = 1
<Start of transmission>
Figure 12.39 Sample Flowchart for Mode Transition during Transmission
Start of transmission
End of
transmission
Exit from
software
standby
Transition
to software
standby
TE bit
Port input/output
SCK output pin
TxD output pin
Port input/output
High output
Port
Start
SCI TxD output
Stop
Port input/output
Port
High output
SCI TxD
output
Figure 12.40 Port Pin State of Asynchronous Transmission Using Internal Clock
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Section 12 Serial Communication Interface
Start of transmission
End of
transmission
Exit from
software
standby
Transition
to software
standby
TE bit
SCK output pin
Port input/output
TxD output pin Port input/output
Final TxD
bit retention
High output
Port
SCI TxD output
Port input/output
Port
High output*
SCI TxD
output
Note: * Initialized by the software standby.
Figure 12.41 Port Pin State of Synchronous Transmission Using Internal Clock
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Section 12 Serial Communication Interface
• Reception
Receive operation should be stopped (by clearing RE to 0) before making a module stop mode,
software standby mode, watch mode, subactive mode, or subsleep mode transition. RSR, RDR,
and SSR are reset. If a transition is made without stopping operation, the data being received
will be invalid.
To continue receiving without changing the reception mode after the relevant mode is cleared,
set RE to 1 before starting reception. To receive with a different receive mode, the procedure
must be started again from initialization.
Figure 12.42 shows a sample flowchart for mode transition during reception.
<Reception>
Read RDRF flag in SSR
RDRF = 1
No
[1]
Yes
[1] Receive data being received becomes invalid.
[2] Includes module stop mode, watch mode,
subactive mode, and subsleep mode.
Read receive data in RDR
RE = 0
Transition to software
standby mode, etc.
[2]
Exit from software
standby mode, etc.
Change
operating mode?
No
Yes
Initialization
RE = 1
<Start of reception>
Figure 12.42 Sample Flowchart for Mode Transition during Reception
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Section 12 Serial Communication Interface
12.10.7 Switching from SCK Pin Function to Port Pin Function:
When switching the SCK pin function to the output port function (high-level output) by making
the following settings while DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1
(synchronous mode), low-level output occurs for one half-cycle.
1. End of serial data transmission
2. TE bit = 0
3. C/A bit = 0 ... switchover to port output
4. Occurrence of low-level output (see figure 12.43)
Half-cycle low-level output
SCK/port
1. End of transmission
Data
TE
C/A
Bit 6
4. Low-level output
Bit 7
2.TE= 0
3.C/A= 0
CKE1
CKE0
Figure 12.43 Operation when Switching from SCK Pin Function to Port Pin Function
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Section 12 Serial Communication Interface
Sample Procedure for Avoiding Low-Level Output: As this sample procedure temporarily
places the SCK pin in the input state, the SCK/port pin should be pulled up beforehand with an
external circuit.
With DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1, make the following
settings in the order shown.
1. End of serial data transmission
2. TE bit = 0
3. CKE1 bit = 1
4. C/A bit = 0 ... switchover to port output
5. CKE1 bit = 0
High-level output
SCK/port
Data
1. End of transmission
Bit 6
Bit 7
2.TE= 0
TE
4.C/A= 0
C/A
3.CKE1= 1
CKE1
5.CKE1= 0
CKE0
Figure 12.44 Operation when Switching from SCK Pin Function to Port Pin Function
(Example of Preventing Low-Level Output)
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Section 13 Boundary Scan Function
Section 13 Boundary Scan Function
The HD64F2218 and HD64F2218U incorporate a boundary scan function, which is a serial I/O
interface based on the JTAG (Joint Test Action Group, IEEEStd.1149.1 and IEEE Standard Test
Access Port and Boundary Scan Architecture). Figure 13.1 shows the block diagram of the
boundary scan function.
13.1
Features
• Five test signals
⎯ TCK, TDI, TDO, TMS, TRST
• Six test modes supported
⎯ BYAPASS, SAMPLE/PRELOAD, EXTEST, CLAMP, HIGHZ, IDCODE
• Boundary scan function cannot be performed on the following pins.
⎯ Power supply pins: VCC, VSS, Vref, PLLVCC, PLLVSS, DrVCC, DrVSS
⎯ Clock signals:
EXTAL, XTAL, OSC2, OSC1
⎯ Analog signals:
P40 to P43, P96, P97, USD+, USD-
⎯ Boundary scan signals: TCK, TDI, TDO, TMS, TRST
⎯ H-UDI control signal: EMLE
Rev.6.00 Jun. 03, 2008 Page 449 of 698
REJ09B0074-0600
Section 13 Boundary Scan Function
BSCANR
(Boundary scan cell chain)
IDCODE
MUX
MUX
BYPASS
TDI
INSTR
TCK
TMS
TAP controller
TRST
Legend:
BSCANR:
IDCODE:
BYPASS:
INSTR:
TAP:
Boundary scan register
IDCODE register
BYPASS register
Instruction register
Test access port
Figure 13.1 Block Diagram of Boundary Scan Function
Rev.6.00 Jun. 03, 2008 Page 450 of 698
REJ09B0074-0600
TDO
Section 13 Boundary Scan Function
13.2
Pin Configuration
Table 13.1 shows the I/O pins used in the boundary scan function.
Table 13.1 Pin Configuration
Pin Name
I/O
Function
TMS
Input
Test Mode Select
Controls the TAP controller which is a 16-state Finite State
Machine.
The TMS input value at the rising edge of TCK determines the
status transition direction on the TAP controller.
The TMS is fixed high when the boundary scan function is not
used.
The protocol is based on JTAG standard (IEEE Std.1149.1).
This pin has a pull-up resistor.
TCK
Input
Test Clock
A clock signal for the boundary scan function.
When the boundary scan function is used, input a clock of
50% duty to this pin.
This pin has a pull-up resistor.
TDI
Input
Test Data Input
A data input signal for the boundary scan function.
Data input from the TDI is latched at the rising edge of TCK.
TDI is fixed high when the boundary scan function is not used.
This pin has a pull-up register.
TDO
Output
Test Data Output
A data output signal for the boundary scan function. Data
output from the TDO changes at the falling edge of TCK. The
output driver of the TDO is driven only when it is necessary
only in Shift-IR or Shift-DR states, and is brought to the highimpedance state when not necessary.
TRST
Input
Test Reset
Asynchronously resets the TAP controller when TRST is
brought low.
The user must apply power-on reset signal specific to the
boundary scan function when the power is supplied. (For
details on signal design, refer to section 13.5, Usage Notes.)
This pin has a pull-up resister.
Rev.6.00 Jun. 03, 2008 Page 451 of 698
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Section 13 Boundary Scan Function
13.3
Register Descriptions
The boundary scan function has the following registers. These registers cannot be accessed by the
CPU.
• Instruction register (INSTR)
• IDCODE register (IDCODE)
• BYPASS register (BYPASS)
• Boundary scan register (BSCANR)
13.3.1
Instruction Register (INSTR)
INSTR is a 3-bit register. At initialization, this register is specified to IDCODE mode. When
TRST is pulled low, or when the TAP controller is in the Test-Logic-Reset state, INSTR is
initialized. INSTR can be written by the serial data input from the TDI. If more than three bits of
instruction is input from the TDI, INSTR stores the last three bits of serial data.
If a command reserved in INSTR is used, the correct operation cannot be guaranteed.
Bit
Bit Name
Initial Value R/W
Description
2
TI2
1
—
Test Instruction Bits
1
TI1
0
—
Instruction configuration is shown in table 13.2.
0
TI0
1
—
Table 13.2 Instruction Configuration
Bit 2
Bit1
Bit 0
TI2
TI1
TI0
Instruction
0
0
0
EXTEST
0
0
1
SAMPLE/PRELOAD
0
1
0
CLAMP
0
1
1
HIGHZ
1
0
0
Reserved
1
0
1
IDCODE (initial value)
1
1
0
Reserved
1
1
1
BYPASS
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Section 13 Boundary Scan Function
EXTEST: The EXTEST instruction is used to test external circuits when this LSI is installed on
the print circuit board. If this instruction is executed, output pins are used to output test data
(specified by the SAMPLE/PRELOAD instruction) from the boundary scan register to the print
circuit board, and input pins are used to input test results.
SAMPLE/PRELOAD: The SAMPLE/PRELOAD instruction is used to input data from the LSI
internal circuits to the boundary scan register, output data from scan path, and reload the data to
the scan path. While this instruction is executed, input signals are directly input to the LSI and
output signals are also directly output to the external circuits. The LSI system circuit is not
affected by this instruction.
In SAMPLE operation, the boundary scan register latches the snap shot of data transferred from
input pins to internal circuit or data transferred from internal circuit to output pins. The latched
data is read from the scan path. The scan register latches the snap data at the rising edge of the
TCK in Capture-DR state. The scan register latches snap shot without affecting the LSI normal
operation.
In PRELOAD operation, initial value is written from the scan path to the parallel output latch of
the boundary scan register prior to the EXTEST instruction execution. If the EXTEST is executed
without executing this RELOAD operation, undefined values are output from the beginning to the
end (transfer to the output latch) of the EXTEST sequence. (In EXTEST instruction, output
parallel latches are always output to the output pins.)
CLAMP: When the CLAMP instruction is selected output pins output the boundary scan register
value which was specified by the SAMPLE/PRELOAD instruction in advance. While the CLAMP
instruction is selected, the status of boundary scan register is maintained regardless of the TAP
controller state. BYPASS is connected between TDI and TDO, the same operation as BYPASS
instruction can be achieved.
HIGHZ: When the HIGHZ instruction is selected, all outputs enter high-impedance state. While
this instruction is selected, the status of boundary scan register is maintained regardless of the TAP
controller state. BYPASS resistor is connected between TDI and TDO, the same operation as
BYPASS instruction can be achieved.
IDCODE: When the IDCODE instruction is selected, IDCODE register value is output to the
TDO in Shift-DR state of TAP controller. In this case, IDCODE register value is output from the
LSB. During this instruction execution, test circuit does not affect the system circuit. INSTR is
initialized by the IDCODE instruction in Test-Logic-Reset state of TAP controller.
BYPASS: The BYPASS instruction is a standard instruction necessary to operate bypass register.
The BYPASS instruction improves the serial data transfer speed by bypassing the scan path.
During this instruction execution, test circuit does not affect the system circuit.
Rev.6.00 Jun. 03, 2008 Page 453 of 698
REJ09B0074-0600
Section 13 Boundary Scan Function
13.3.2
IDCODE Register (IDCODE)
IDCODE register is a 32-bit register. If INSTR is set to IDCODE mode, IDCODE is connected
between TDI and TDO. The HD64F2218, HD64F2218U output fixed codes H'002A200F from
the TDO. Serial data cannot be written to IDCODE register through TDI. Table 13.3 shows the
IDCODE register configuration.
Table 13.3 IDCODE Register Configuration
Bits
31 to 28
27 to 12
11 to 1
0
HD64F2218,
HD64F2218U codes
0000
0000 0010 1010 0010
0000 0000 111
1
Contents
Version
(4 bits)
Part No.
(16 bits)
Product No.
(11 bits)
Fixed code
(1 bit)
13.3.3
BYPASS Register (BYPASS)
BYPASS is a 1-bit register. If INSTR is specified to BYPASS mode, CLAMP mode, or HIGHZ
mode, BYPASS is connected between TDI and TDO.
13.3.4
Boundary Scan Register (BSCANR)
BSCAN is a 199-bit shift register assigned on the pins to control input/output pins.
The I/O pins consists of three bits (IN, Control, OUT), input pins 1 bit (IN), and output pins 1 bit
(OUT) of shift registers. The boundary scan test based on the JTAG standard can be performed by
using instructions listed in table 13.2. Table 13.4 shows the correspondence between the LSI pins
and boundary scan registers. (In table 13.4, Control indicates the high active pin. By specifying
Control to high, the pin is driven by OUT. ) Figure 13.2 shows the boundary scan register
configuration example.
Rev.6.00 Jun. 03, 2008 Page 454 of 698
REJ09B0074-0600
Section 13 Boundary Scan Function
TDI pin
IN
Control
I/O pin
OUT
TDO pin
Figure 13.2 Boundary Scan Register Configuration
Table 13.4 Correspondence between LSI Pins and Boundary Scan Register
TFP-100G
TFP-100GV
Pin No.
BP-112
BP-112V
Pin No.
Pin Name
I/O
Bit Name
IN
198
Control
197
OUT
196
IN
195
Control
194
OUT
193
IN
192
Control
191
OUT
190
IN
189
Control
188
OUT
187
IN
186
Control
185
OUT
184
IN
183
Control
182
OUT
181
From TDI
89
91
92
93
94
95
A6
D6
A5
B5
C5
A4
PF7/φ
PF6/AS
PF5/RD
PF4/HWR
PF3/LWR/ADTRG/IRQ3
PF2/WAIT
Rev.6.00 Jun. 03, 2008 Page 455 of 698
REJ09B0074-0600
Section 13 Boundary Scan Function
TFP-100G
TFP-100GV
Pin No.
BP-112
BP-112V
Pin No.
Pin Name
96
D5
PF1/BACK
97
98
99
100
1
2
3
4
5
B4
A3
C4
B3
B2
B1
D4
C2
C1
PF0/BREQ/IRQ2
PA3/A19/SCK2
PA2/A18/RxD2
PA1/A17/TxD2
PA0/A16
P10/TIOCA0/A20
P11/TIOCB0/A21
P12/TIOCC0/TCLKA/A22
P13/TIOCD0/TCLKB/A23
Rev.6.00 Jun. 03, 2008 Page 456 of 698
REJ09B0074-0600
I/O
Bit Name
IN
180
Control
179
OUT
178
IN
177
Control
176
OUT
175
IN
174
Control
173
OUT
172
IN
171
Control
170
OUT
169
IN
168
Control
167
OUT
166
IN
165
Control
164
OUT
163
IN
162
Control
161
OUT
160
IN
159
Control
158
OUT
157
IN
156
Control
155
OUT
154
IN
153
Control
152
OUT
151
Section 13 Boundary Scan Function
TFP-100G
TFP-100GV
Pin No.
BP-112
BP-112V
Pin No.
Pin Name
6
D3
P14/TIOCA1/IRQ0
7
8
9
10
11
12
13
D2
D1
E4
E3
E1
E2
F3
P15/TIOCB1/TCLKC
P16/TIOCA2/IRQ1
P17/TIOCB2/TCLKD
PC0/A0
PC1/A1
PC2/A2
PC3/A3
I/O
Bit Name
IN
150
Control
149
OUT
148
IN
147
Control
146
OUT
145
IN
144
Control
143
OUT
142
IN
141
Control
140
OUT
139
IN
138
Control
137
OUT
136
IN
135
Control
134
OUT
133
IN
132
Control
131
OUT
130
IN
129
Control
128
OUT
127
14
F1
MD0
IN
126
15
F2
MD1
IN
125
16
F4
MD2
IN
124
17
G1
PC4/A4
IN
123
Control
122
OUT
121
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REJ09B0074-0600
Section 13 Boundary Scan Function
TFP-100G
TFP-100GV
Pin No.
BP-112
BP-112V
Pin No.
Pin Name
18
G2
PC5/A5
19
20
G3
H1
PC6/A6
PC7/A7
I/O
Bit Name
IN
120
Control
119
OUT
118
IN
117
Control
116
OUT
115
IN
114
Control
113
OUT
112
21
G4
USPND/TMOW
OUT
111
22
H2
P30/TxD0
IN
110
Control
109
OUT
108
IN
107
Control
106
OUT
105
IN
104
Control
103
OUT
102
IN
101
Control
100
OUT
99
IN
98
Control
97
23
24
25
26
27
28
J1
H3
J2
K2
L2
H4
P31/RxD0
P32/SCK0/IRQ4
PG1/CS3/IRQ7
PG2/CS2
PG3/CS1
PG4/CS0
Rev.6.00 Jun. 03, 2008 Page 458 of 698
REJ09B0074-0600
OUT
96
IN
95
Control
94
OUT
93
IN
92
Control
91
OUT
90
Section 13 Boundary Scan Function
TFP-100G
TFP-100GV
Pin No.
BP-112
BP-112V
Pin No.
Pin Name
29
K3
VBUS
IN
89
30
L3
P36
IN
88
Control
87
OUT
86
IN
85
Control
84
OUT
83
IN
82
37
38
39
40
K5
J6
L6
K6
PB0/A8
PB1/A9
PB2/A10
PB3/A11
I/O
Bit Name
Control
81
OUT
80
IN
79
Control
78
OUT
77
IN
76
Control
75
OUT
74
47
L9
UBPM
IN
73
49
K9
PB4/A12
IN
72
Control
71
OUT
70
IN
69
Control
68
OUT
67
IN
66
50
51
52
L10
K10
K11
PB5/A13
PB6/A14
PB7/A15
Control
65
OUT
64
IN
63
Control
62
OUT
61
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REJ09B0074-0600
Section 13 Boundary Scan Function
TFP-100G
TFP-100GV
Pin No.
BP-112
BP-112V
Pin No.
Pin Name
55
H9
P74/MRES
56
H10
P71/CS5
I/O
Bit Name
IN
60
Control
59
OUT
58
IN
57
Control
56
OUT
55
57
H11
STBY
IN
54
58
G8
RES
IN
53
63
F11
P70/CS4
IN
52
Control
51
OUT
50
IN
49
Control
48
OUT
47
IN
46
Control
45
OUT
44
IN
43
Control
42
OUT
41
IN
40
Control
39
OUT
38
IN
37
Control
36
OUT
35
IN
34
Control
33
OUT
32
64
65
66
67
68
69
F10
F8
E11
E10
E9
D11
PE0/D0
PE1/D1
PE2/D2
PE3/D3
PE4/D4
PE5/D5
Rev.6.00 Jun. 03, 2008 Page 460 of 698
REJ09B0074-0600
Section 13 Boundary Scan Function
TFP-100G
TFP-100GV
Pin No.
BP-112
BP-112V
Pin No.
Pin Name
70
E8
PE6/D6
71
72
73
74
75
76
77
78
79
D10
C11
D9
C10
B11
B10
A10
D8
B9
PE7/D7
PD0/D8
PD1/D9
PD2/D10
PD3/D11
PD4/D12
PD5/D13
PD6/D14
PD7/D15
I/O
Bit Name
IN
31
Control
30
OUT
29
IN
28
Control
27
OUT
26
IN
25
Control
24
OUT
23
IN
22
Control
21
OUT
20
IN
19
Control
18
OUT
17
IN
16
Control
15
OUT
14
IN
13
Control
12
OUT
11
IN
10
Control
9
OUT
8
IN
7
Control
6
OUT
5
IN
4
Control
3
OUT
2
Rev.6.00 Jun. 03, 2008 Page 461 of 698
REJ09B0074-0600
Section 13 Boundary Scan Function
TFP-100G
TFP-100GV
Pin No.
BP-112
BP-112V
Pin No.
80
A9
FWE
IN
1
81
C8
NMI
IN
0
Pin Name
I/O
Bit Name
to TDO
13.4
Boundary Scan Function Operation
13.4.1
TAP Controller
Figure 13.3 shows the TAP controller status transition diagram, based on the JTAG standard.
Test-Logic-Reset
0
1
Run-Test/Idle
1
0
1
Select-DR
0
1
0
Select-IR
0
Capture-DR
0
1
Shift-DR
1
Exit1-DR
1
Update-DR
1
0
Capture-IR
0
Shift-IR
1
0
Exit1-IR
1
Pause-DR
0
1
0
1
Exit2-DR
0
1
Update-IR
0
Pause-IR
1
0
1
0
Exit2-IR
0
Figure 13.3 TAP Controller Status Transition
Note: The transition condition is the TMS value at the rising edge of TCK. The TDI value is
sampled at the rising edge of the TCK and shifted at the falling edge of the TCK. The
TDO value changes at the falling edge of the TCK. In addition, TDO is high-impedance
state in a state other than Shift-DR or Shift-IR state. If TRST is 0, Test-Logic-Reset state
is entered asynchronously with the TCK.
Rev.6.00 Jun. 03, 2008 Page 462 of 698
REJ09B0074-0600
Section 13 Boundary Scan Function
13.5
Usage Notes
1. When using the boundary scan function, clear TRST to 0 at power-on and after the tRESW time
has elapsed set TRST to 1 and set TCK, TMS, and TDI appropriately. During normal operation
when the boundary scan function is not used, set TCK, TMS, and TDI to Hi-Z, clear TRST to 0
at power-on, and after the tRESW time has elapsed set TRST to 1 or to Hi-Z. These pins are
pulled up internally, so care must be taken in standby mode because breakthrough current flow
can occur if there is a potential difference between the pin input voltage value when set to 1
and the power supply voltage Vcc.
2. The following must be noted on the power-on reset signal applied to the TRST pin.
• Reset signal must be applied at power-on.
• TRST must be separated in order not to affect the system operation.
• TRST must be separated from the system circuitry in order not to affect the system
operation.
• System circuitry must also be separated from the TRST in order not to affect TRST
operation as shown in figure 13.4.
Board edge pin
LSI
System
reset
RES
Power-on
reset circuit
TRST
TRST
Figure 13.4 Recommended Reset Signal Design
3. TCK clock speed should be slower than system clock frequency.
4. In serial communication, data is input or output from the LSB as shown in figure 13.5.
TDI
Bit n
Boundary scan register
Bit n - 1
Bit 1
Bit 0
TDO
Figure 13.5 Serial Data Input/Output
Rev.6.00 Jun. 03, 2008 Page 463 of 698
REJ09B0074-0600
Section 13 Boundary Scan Function
5. If a pin with pull-up function is SAMPLEed with pull-up function enabled, the corresponding
IN register is set to 1. In this case, the corresponding Control register must be cleared to 0.
6. If a pin with open-drain function is SAMPLEed while its open-drain function is enabled and
while the corresponding OUT register is set to 1, the corresponding Control register is cleared
to 0 (the pin status is Hi-Z). If the pin is SAMPLEed while the corresponding OUT register is
cleared to 0, the corresponding Control register is set to 1 (the pin status is 0).
7. If EXTEST, CLAMP, or HIGHZ state is entered, this LSI enters guarded mode such as
hardware standby mode (RES = STBY = 0). Before entering normal operating mode from
EXTEST, CLAMP, or HIGHZ state, specify RES, STBY, FWE, and MD2 to MD0 pin to the
designated mode.
8. The EMLE pin must be cleared to 0. When the pin is set to 1, this chip functions as Highperformance user debugging interface (H-UDI).
EMLE Pin
Chip State
0
Normal operation, boundary scan function
1
High-performance user debugging interface (H-UDI)
Rev.6.00 Jun. 03, 2008 Page 464 of 698
REJ09B0074-0600
Section 14 Universal Serial Bus (USB)
Section 14 Universal Serial Bus (USB)
This LSI incorporates a USB function module complying with USB standard version 1.1. Figure
14.1 shows the block diagram of the USB.
14.1
Features
• USB standard version 2.0 full speed mode (12 Mbps) support
• Bus-powered mode or self-powered mode is selectable via the USB specific pin (UBPM)
• On-chip PLL circuit to generate the USB operation clock (24 MHz × 2 = 48 MHz, 16 MHz × 3
= 48 MHz)
• On-chip bus transceiver
• Standard commands are processed automatically by hardware
⎯ Only Set_Descriptor, Get_Descriptor, Class/VendorCommand, and SynchFrame
commands should be processed by software
• Current Configuration value can be checked by Set_Configuration interrupt
• Three transfer modes supported (Control, Bulk, Interrupt)
• Configuration of four endpoints; EP0, EP1, EP2, and EP3
Configuration 1
Interface0
Alternate 0
EP0s (Control_setup transfer, FIFO 8 bytes)
EP0i (Control_in transfer, FIFO 64 bytes)
EP0o (Control_out tranfer, FIFO 64 bytes)
EP1 (Bulk_in transfer, FIFO 64 bytes × 2 [dual-buffer confifugraion])
EP2 (Bulk_out transfer, FIFO 64 bytes × 2 [dual-buffer confifugraion])
EP3 (Interrup_in transfer, FIFO 64 bytes)
Total 456-byte FIFO incorporated
• 16 kinds of interrupts
⎯ Suspend/resume interrupt source can be assigned for IRQ6
⎯ Each interrupt source except the suspend/resume interrupt source can be assigned for
EXIRQ0 or EXIRQ1 via registers
• DMA transfer interface
⎯ DMA transfer is enabled for the Bulk transfer data of EP1 and EP2
• 8-bit bus (3 cycle access timing) connected to the external bus interface
⎯ Internal registers are addressed to a part of area 6 of external address (H'C00000 to
H'DFFFFF)
⎯ Address H'C00100 to H'DFFFFF is for USB reserved area and thus access prohibited.
Rev.6.00 Jun. 03, 2008 Page 465 of 698
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Section 14 Universal Serial Bus (USB)
Note: In this section, power-down mode represents watch, subactive, subsleep, and software
standby modes.
USB
456-byte FIFO
EP0s
EP1
EP0i
EP2
EP0o
[Power mode selection]
UBPM
[Connection/disconnection]
EP3
VBUS
[Interrupt request signal]
IRQ6
EXIRQ0, EXIRQ1
[DMA transfer request signal]
DREQ0, DREQ1
Registers
[Internal bus]
Peripheral data bus
Interface
Peripheral address bus
Peripheral bus control
signal
UDC synchronization
circuit
(12MHz)
[Main clock]
φ
PLL
curcuit
[Power supply]
DrVCC
(48MHz)
UDC core
On-chip
transceiver
DrVSS
[Data]
Rs
USD+
USD-
Rs
D+
D-
USPND
Legend:
UDC: USB Device Controller
EP0s: Endpoint 0 setup FIFO
EP0i: Endpoint 0 In FIFO
EP0o: Endpoint 0 Out FIFO
EP1: End Point 1 FIFO
EP2: End Point 2 FIFO
EP3: End Point 3 FIFO
Figure 14.1 Block Diagram of USB
Rev.6.00 Jun. 03, 2008 Page 466 of 698
REJ09B0074-0600
Section 14 Universal Serial Bus (USB)
14.2
Input/Output Pins
Table 14.1 shows the USB pin configuration.
Table 14.1 Pin Configuration
Pin Name
I/O
Function
USD+
I/O
I/O pin for USB data
DrVCC
Input
USB internal transceiver power supply pin
DrVSS
Input
USB internal transceiver ground pin
VBUS
Input
USB cable connection/disconnection detection signal pin
UBPM
Input
USB bus-powered/self-powered mode set pin
USD-
When USB is used in bus-powered mode, UBPM must be fixed low.
When USB is used in self-powered mode, UBPM must be fixed high.
USPND
Output
USB suspend output pin
When USB enters the suspend state, USPND is set to high.
14.3
Register Descriptions
The USB has the following registers.
• USB control register (UCTLR)
• USB DMAC transfer request register (UDMAR)
• USB device resume register (UDRR)
• USB trigger register 0 (UTRG0)
• USB FIFO clear register 0 (UFCLR0)
• USB endpoint stall register 0 (UESTL0)
• USB endpoint stall register 1 (UESTL1)
• USB endpoint data register 0s (UEDR0s) [for Setup data reception]
• USB endpoint data register 0i (UEDR0i) [for Control_in data transmission]
• USB endpoint data register 0o (UEDR0o) [for Control_out data reception]
• USB endpoint data register 3 (UEDR3) [for Interrupt_in data transmission]
• USB endpoint data register 1 (UEDR1) [for Bulk_in data transmission]
• USB endpoint data register 2 (UEDR2) [for Bulk_out data reception]
• USB endpoint receive data size register 0o (UESZ0o) [for Control _out data reception]
Rev.6.00 Jun. 03, 2008 Page 467 of 698
REJ09B0074-0600
Section 14 Universal Serial Bus (USB)
• USB endpoint receive data size register 2 (UESZ2) [for Bulk_out data reception]
• USB interrupt flag register 0 (UIFR0)
• USB interrupt flag register 1 (UIFR1)
• USB interrupt flag register 3 (UIFR3)
• USB interrupt enable register 0 (UIER0)
• USB interrupt enable register 1 (UIER1)
• USB interrupt enable register 3 (UIER3)
• USB interrupt select register 0 (UISR0)
• USB interrupt select register 1 (UISR1)
• USB interrupt select register 3 (UISR3)
• USB data status register (UDSR)
• USB Configuration value register (UCVR)
• USB test register 0 (UTSTR0)
• USB test register 1 (UTSTR1)
• USB test registers 2 and A to F (UTSTR2, UTSTRA to UTSTRF)
• Module stop control register B (MSTPCRB)
• Extended module stop register (EXMDLSTP)
14.3.1
USB Control Register (UCTLR)
UCTLR is used to select the USB operation clock and control the USB module internal reset.
UCTLR can be read from or written to even when the USB module stop 2 bit (MSTPB0) in
MSTPCRB is 1. For details on UCTLR setting procedure, refer to section 14.5, Communication
Operation.
Bit
Bit Name
Initial Value R/W
Description
7
—
0
Reserved
R/W
The write value should always be 0.
6
TMOWE
0
R/W
TMOW Pin Enable
0: The USPND/TMOW pin outputs USPND of USB.
1: The USPND/TMOW pin outputs TMOW of RTC.
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Section 14 Universal Serial Bus (USB)
Bit
Bit Name
Initial Value R/W
Description
5
UCKS3
0
USB Operation Clock Select 3 to 0
4
UCKS2
3
UCKS1
2
UCKS0
R/W
These bits control the on-chip PLL, which generates
the USB operation clock (48 MHz). When UCKS3 to
UCKS0 are 0000, the PLL circuit stops and thus the
USB operation clock must be selected according to
the clock source.
The on-chip PLL circuit starts operating after the USB
module stop 2 bit has been cancelled. In addition, the
USB operation clock is supplied to the UDC core after
the USB operating clock stabilization time has been
passed. The completion timing of the USB operating
clock stabilization time can be detected by the
CK48READY flag in UIFR3.
UCKS0 to UCKS3 muse be written while the USB
module stop 2 bit (MSTPB0) is 1.
0000: USB operation clock stops (PLL stops)
0001: Reserved
001×: Reserved
010×: Reserved
0110: Uses a clock (48 MHz) generated by doubling
the 24-MHz main oscillation by the PLL.
0111: Uses a clock (48 MHz) generated by tripling the
16-MHz main oscillation by the PLL.
1×××: Reserved
The USB operating clock stabilization time is 2 ms.
Legend:
×: Don't care
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Section 14 Universal Serial Bus (USB)
Bit
Bit Name
Initial Value R/W
Description
1
UIFRST
1
USB Interface Software Reset
R/W
Controls USB module internal reset. When the
UIFRST bit is set to 1, the USB internal modules other
than UCTLR, UIER3, and the CK48READY bit in
UIFR3 are all reset. At initialization, the UIFRST bit
must be cleared to 0 after the USB operating clock (48
MHz) stabilization time has passed following the
clearing of the USB module stop 2 bit.
0: Sets the USB internal modules to the operating
state. (At initialization, this bit must be cleared after
the USB operating clock stabilization time has
passed.)
1: Sets the USB internal modules other than UCTLR,
UIER3, and the CK48READY bit in UIFR3 to the
reset state.
If the UIFRST bit is set to 1 after it is cleared to 0, the
UDCRST bit should also be set to 1 simultaneously.
0
UDCRST
1
R/W
UDC Core Software Reset
Controls reset of the UDC core in the USB module.
When the UDCRST bit is set to 1, the UDC core is
reset and the USB bus synchronization operation
stops. At initialization, UDCRST must be cleared to 0
after D+ pull-up by the port (P36) control following the
clearing of the UIFRST bit. In the suspend state, to
maintain the internal state of the UDC core, enter
power-down mode after setting the USB module stop
2 bit with the UDCRST bit to be maintained to 0. After
VBUS disconnection detection, UDCRST must be set
to 1.
0: Sets the UDC core in the USB module to operating
state. (At initialization, UDCRST must be cleared
to 0 after D+ pull-up by the port control following
the clearing of the UIFRST bit.)
1: Sets the UDC core in the USB module to reset
state. (In the suspend state, UDCRST must not be
set to 1; after VBUS disconnection detection,
UDCRST must be set to 1.)
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Section 14 Universal Serial Bus (USB)
14.3.2
USB DMAC Transfer Request Register (UDMAR)
UDMAR is set when data transfer by means of a USB request of the on-chip DMAC is performed
for data registers UEDR1 and UEDR2 corresponding to EP1 and EP2 respectively used for Bulk
transfer. For the DMAC transfer, set DREQ0 and DREQ1 separately. If DREQ0 and DREQ1
usage overlaps, the USB cannot operate correctly. For details on DMAC transfer, refer to section
14.6, DMA Transfer Specifications.
Note: As the DREQ signal is not used in the data transfer by auto request of the on-chip DMAC,
set UDMAR to H'00.
Bit
Bit Name
7 to 4 —
Initial Value R/W
All 0
R
Description
Reserved
These bits are always read as 0 and cannot be
modified.
3
EP2T1
2
EP2T0
0
R/W
EP2 DMAC Transfer Request Select 1, 0
00: Does not request EP2 DMAC transfer
01: Reserved
10: Requests EP2 DMAC transfer by DREQ0
11: Requests EP2 DMAC transfer by DREQ1
1
EP1T1
0
EP1T0
0
R/W
EP1 DMAC Transfer Request Select 1, 0
00: Does not request EP1 DMAC transfer
01: Reserved
10: Requests EP1 DMAC transfer by DREQ0
11: Requests EP1 DMAC transfer by DREQ1
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Section 14 Universal Serial Bus (USB)
14.3.3
USB Device Resume Register (UDRR)
UDRR indicates the enabled or disabled state of remote wakeup by the host, and executes the
remote wakeup of the USB modules in the suspend state.
Bit
Bit Name
7 to 2 —
Initial Value R/W
Description
All 0
Reserved
R
These bits are always read as 0 and cannot be
modified.
1
RWUPs
0
R
Remote Wakeup Status
Indicates the enabled or disabled state of remote
wakeup by the host. This bit is a status bit and cannot
be written to. If the remote wakeup from the host is
disabled by Device_Remote_Wakeup through the
Set_Feature/Clear _Feature request, this bit is cleared
to 0. If the remote wakeup is enabled, this bit is set to
1.
0: Remote wakeup disabled state
1: Remote wakeup enabled state
0
DVR
0
W
Device Resume
Cancels the suspend state (executes the remote
wakeup). This bit can be written to 1 and is always
read as 0. Before executing the remote wakeup,
power-down mode or USB module stop mode must be
cancelled to provide a clock for the USB module.
0: Performs no operation
1: Cancels the suspend state (executes the remote
wakeup)
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Section 14 Universal Serial Bus (USB)
14.3.4
USB Trigger Register 0 (UTRG0)
UTRG0 is a one-shot register to generate triggers to the FIFO for each endpoint EP0 to EP3. For
details, see section 2.9.4, Accessing Registers Containing Write-Only Bits.
Bit
Bit Name
Initial Value R/W
7, 6
—
All 0
R
Description
Reserved
These bits are always read as 0 and cannot be
modified.
5
EP2RDFN
0
W
EP2 Read Complete
0: Performs no operation.
1: Writes 1 to this bit after reading data for EP2 OUT
FIFO. EP2 has a dual-FIFO configuration. This
trigger is generated to the currently effective FIFO.
4
EP1PKTE
0
W
EP1 Packet Enable
0: Performs no operation.
1: Generates a trigger to enable the transmission to
EP1 IN FIFO. EP1 has a dual-FIFO configuration.
This trigger is generated to the currently effective
FIFO.
3
EP3PKTE
0
W
EP3 Packet Enable
0: Performs no operation.
1: Generates a trigger to enable the transmission to
EP3 IN FIFO.
2
EP0oRDFN 0
W
EP0o Read Complete
0: Performs no operation.
1: Writes 1 to this bit after reading data for EP0o OUT
FIFO. This trigger enables EP0o to receive the
next packet.
1
EP0iPKTE
0
W
EP0i Packet Enable
0: Performs no operation.
1: Generates a trigger to enable the transmission to
EP0i IN FIFO.
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Section 14 Universal Serial Bus (USB)
Bit
Bit Name
Initial Value R/W
0
EP0sRDFN 0
W
Description
EP0s Read Complete
0: Performs no operation. A NAK handshake is
returned in response to transmit/receive requests in
the data stage until 1 is written to this bit.
1: Writes 1 to this bit after reading data for EP0s
command FIFO. After receiving the setup command,
this trigger enables the next packet in the data stage
to be received by EP0i and EP0o. EP0s can always
be overwritten and receive data regardless of this
trigger.
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Section 14 Universal Serial Bus (USB)
14.3.5
USB FIFO Clear Register 0 (UFCLR0)
UFCLR0 is a one-shot register used to clear the FIFO for each endpoint EP0 to EP3. Writing 1 to a
bit clears the data in the corresponding FIFO.
For IN FIFO, writing 1 to a bit in UFCLR0 clears the data for which the corresponding PKTE bit
in UTRG0 is not set to 1 after data write, or data that is validated by setting the corresponding
PKTE bit in UTRG0.
For OUT FIFO, writing 1 to a bit in UFCLR0 clears data that has not been fixed during reception
or received data for which the corresponding RDFN bit is not set to 1. Accordingly, care must be
taken not to clear data that is currently being received or transmitted. EP1 and EP2, having a dualFIFO configuration, are cleared by entire FIFOs. Note that this trigger does not clear the
corresponding interrupt flag. For details, see section 2.9.4, Accessing Registers Containing WriteOnly Bits.
Bit
Bit Name
Initial Value R/W
Description
7, 6
—
All 0
Reserved
R
These bits are always read as 0 and cannot be
modified.
5
EP2CLR
0
W
EP2 Clear
0: Performs no operation.
1: Clears EP2 OUT FIFO.
4
EP1CLR
0
W
EP1 Clear
0: Performs no operation.
1: Clears EP1 IN FIFO.
3
EP3CLR
0
W
EP3 Clear
0: Performs no operation.
1: Clears EP3 IN FIFO.
2
EP0oCLR
0
W
EP0o Clear
0: Performs no operation.
1: Clears EP0o OUT FIFO.
1
EP0iCLR
0
W
EP0i Clear
0: Performs no operation.
1: Clears EP0i IN FIFO.
0
—
0
R
Reserved
This bit is always read as 0 and cannot be modified.
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Section 14 Universal Serial Bus (USB)
14.3.6
USB Endpoint Stall Register 0 (UESTL0)
UESTL0 is used to forcibly stall each endpoint EP0 to EP3. When the bit is set to 1, the
corresponding endpoint returns a stall handshake to the host, following from the next transfer.
The stall bit for endpoint 0 is cleared automatically on reception of 8-byte command data for
which decoding is performed by the function, and thus the EP0STL bit is cleared to 0. When the
SetupTS flag in UIFR0 is set to 1, a write of 1 to the EP0STL bit is ignored. For details, refer to
section 14.5.9, Stall Operations.
Bit
Bit Name
Initial Value R/W
Description
7, 6
—
All 0
Reserved
R
These bits are always read as 0 and cannot be
modified.
5
EP2STL
0
R/W
EP2 Stall
0: Cancels the EP2 stall state.
1: Sets the EP2 stall state.
4
EP1STL
0
R/W
EP1 Stall
0: Cancels the EP1 stall state.
1: Sets the EP1 stall state.
3
EP3STL
0
R/W
EP3 Stall
0: Cancels the EP3 stall state.
1: Sets the EP3 stall state.
2, 1
—
All 0
R
Reserved
These bits are always read as 0 and cannot be
modified.
0
EP0STL
0
R/W
EP0 Stall
0: Cancels the EP0 stall state.
1: Sets the EP0 stall state.
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Section 14 Universal Serial Bus (USB)
14.3.7
USB Endpoint Stall Register 1 (UESTL1)
UESTL1 is used to control stall cancellation mode for all endpoints.
Bit
Bit Name
Initial Value R/W
7
SCME
0
R/W
Description
Reserved
The write value should always be 0.
6 to
0
14.3.8
—
All 0
R
Reserved
These bits are always read as 0 and cannot be
modified.
USB Endpoint Data Register 0s (UEDR0s)
UEDR0s stores the setup command for endpoint 0 (for Control_out transfer). UEDR0s stores 8byte command data sent from the host in setup stage.
For details on the USB operation when data for the next setup stage is received while data in
UEDR0s is being read, refer to section 14.8, Usage Notes.
UEDR0s is a byte register to which 4-byte address area is assigned. Accordingly, UEDR0s allows
the user to read 2-byte or 4-byte data continuously by word transfer or longword transfer.
Bit
Bit Name
7 to 0 D7 to D0
14.3.9
Initial Value R/W
Description
—
These bits store the setup command for Control_out
transfer
R
USB Endpoint Data Register 0i (UEDR0i)
UEDR0i is a data register for endpoint 0 (for Control_in transfer). UEDR0i stores data to be sent
to the host. The number of data items to be written continuously must be the maximum packet size
or less.
UEDR0i is a byte register to which 4-byte address area is assigned. Accordingly, UEDR0i allows
the user to write 2-byte or 4-byte data continuously by word transfer or longword transfer. For
details, see section 2.9.4, Accessing Registers Containing Write-Only Bits.
Bit
Bit Name
7 to 0 D7 to D0
Initial Value R/W
Description
All 0
These bits store data for Control_in transfer
W
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Section 14 Universal Serial Bus (USB)
14.3.10 USB Endpoint Data Register 0o (UEDR0o)
UEDR0o is a data register for endpoint 0 (for Control_out transfer). UEDR0o stores data received
from the host. The number of data items to be read must be the number of bytes specified by
UESZ0o.
When 1 byte is read from UEDR0o, UESZ0o is decremented by1.
UEDR0o is a byte register to which 4-byte address area is assigned. Accordingly, UEDR0o allows
the user to read 2-byte or 4-byte data continuously by word transfer or longword transfer.
Bit
Bit Name
7 to 0 D7 to D0
Initial Value R/W
Description
—
These bits store data for Control_out transfer
R
14.3.11 USB Endpoint Data Register 3 (UEDR3)
UEDR3 is a data register for endpoint 3 (for Interrupt_in transfer). UEDR3 stores data to be sent to
the host. The number of data items to be written continuously must be the maximum packet size or
less.
UEDR3 is a byte register to which 4-byte address area is assigned. Accordingly, UEDR3 allows
the user to write 2-byte or 4-byte data continuously by word transfer or longword transfer. For
details, see section 2.9.4, Accessing Registers Containing Write-Only Bits.
Bit
Bit Name
7 to 0 D7 to D0
Initial Value R/W
Description
All 0
These bits store data for Interrupt_in transfer
W
14.3.12 USB Endpoint Data Register 1 (UEDR1)
UEDR1 is a data register for endpoint 1 (for Bulk_in transfer). UEDR1 stores data to be sent to the
host. The number of data items to be written continuously must be the maximum packet size or
less.
UEDR1 is a byte register to which 4-byte address area is assigned. Accordingly, UEDR1 allows
the user to write 2-byte or 4-byte data continuously by word transfer or longword transfer. For
details, see section 2.9.4, Accessing Registers Containing Write-Only Bits.
Bit
Bit Name
7 to 0 D7 to D0
Initial Value R/W
Description
All 0
These bits store data for Bulk_in transfer
W
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Section 14 Universal Serial Bus (USB)
14.3.13 USB Endpoint Data Register 2 (UEDR2)
UEDR2 is a data register for endpoint 2 (for Bulk_out transfer). UEDR2 stores data received from
the host. The number of data items to be read must be the number of bytes specified by UESZ2.
When 1 byte is read from UEDR2, UESZ2 is decremented by1.
UEDR2 is a byte register to which 4-byte address area is assigned. Accordingly, UEDR2 allows
the user to read 2-byte or 4-byte data continuously by word transfer or longword transfer.
Bit
Bit Name
7 to 0 D7 to D0
Initial Value R/W
Description
—
These bits store data for Bulk_out transfer
R
14.3.14 USB Endpoint Receive Data Size Register 0o (UESZ0o)
UESZ0o is a receive data size register for endpoint 0 (for Control_out transfer). UESZ0o indicates
the number of bytes of data to be received from the host.
Note that UESZ0o is decremented by 1 every time when 1 byte is read from UEDR0o.
Bit
Bit Name
Initial Value R/W
Description
7
—
—
R
Reserved
6 to 0 D6 to D0
—
R
These bits indicate the size of data to be received in
Control_out transfer
14.3.15
USB Endpoint Receive Data Size Register 2 (UESZ2)
UESZ2 is a receive data size register for endpoint 2 (for Bulk_out transfer). UESZ2 indicates the
number of bytes of data to be received from the host.
Note that UESZ2 is decremented by 1 every time when 1 byte is read from UEDR2.
The FIFO for endpoint 2 (for Bulk_out transfer) has a dual-FIFO configuration. The data size
indicated by this register refers to the currently selected FIFO.
Bit
Bit Name
Initial Value R/W
Description
7
—
—
R
Reserved
6 to 0 D6 to D0
—
R
These bits indicate the size of data to be received in
Bulk_out transfer
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Section 14 Universal Serial Bus (USB)
14.3.16 USB Interrupt Flag Register 0 (UIFR0)
UIFR0 is an interrupt flag register indicating the setup command reception, EP0 and EP3
transmission/reception, and bus reset state. If the corresponding bit is set to 1, the corresponding
EXIRQ0 or EXIRQ1 interrupt is requested to the CPU. A bit in this register can be cleared by
writing 0 to it. Writing 1 to a bit is invalid and causes no operation. Consequently, to clear a flag,
write 0 to the corresponding bit and 1 to all the other bits. (For example, write H'DF to clear bit 5.)
The bit-clear instruction is a read/modify/write instruction, so if a new flag is set between the read
and write operations, there is a danger that it may be cleared erroneously. Therefore, do not use the
bit-clear instruction to clear bits in this interrupt flag resister.
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Section 14 Universal Serial Bus (USB)
Bit
Bit Name
Initial Value R/W
7
BRST
0
Description
R/(W)* Bus Reset
Set to 1 when the bus reset signal is detected on the
USB bus. The corresponding interrupt output is
EXIRQ0 or EXIRQ1.
Note that BRST is also set to 1 if D+ is not pulled-up
during USB cable connection.
6
—
0
R
Reserved
This bit is always read as 0 and cannot be modified.
5
EP3TR
0
R/(W)* EP3 Transfer Request
Set to 1 if there is no valid data in the FIFO when an IN
token is sent from the host to EP3. The corresponding
interrupt output is EXIRQ0 or EXIRQ1.
4
EP3TS
0
R/(W)* EP3 Transmit Complete
Set to 1 if the data written in EP3 is transmitted to the
host normally and the ACK handshake is returned. The
corresponding interrupt output is EXIRQ0 or EXIRQ1.
3
EP0oTS
0
R/(W)* EP0o Receive Complete
Set to 1 if EP0o receives data from the host normally
and returns the ACK handshake to the host. The
corresponding interrupt output is EXIRQ0 or EXIRQ1.
2
EP0iTR
0
R/(W)* EP0i Transfer Request
Set to 1 if there is no valid data in the FIFO when an
IN token is sent from the host to EP0i. The
corresponding interrupt output is EXIRQ0 or EXIRQ1.
1
EP0iTS
0
R/(W)* EP0i Transmit Complete
Set to 1 if the data written in EP0i is transmitted to the
host normally and the ACK handshake is returned.
The corresponding interrupt output is EXIRQ0 or
EXIRQ1.
0
SetupTS
0
R/(W)* Setup Command Receive Complete
Set to 1 if EP0s normally receives 8-byte command
data to be decoded by the function from the host and
returns the ACK handshake to the host. The
corresponding interrupt output is EXIRQ0 or EXIRQ1.
Note:* The write value should always be 0 to clear this flag.
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Section 14 Universal Serial Bus (USB)
14.3.17
USB Interrupt Flag Register 1 (UIFR1)
UIFR1 is an interrupt flag register indicating the EP1 and EP2 status. If the corresponding bit is set
to 1, the corresponding EXIRQ0 or EXIRQ1 interrupt is requested to the CPU. EP1TR flags can
be cleared by writing 0 to them. Writing 1 to them is invalid and causes no operation.
Consequently, to clear a flag, write 0 to the corresponding bit and 1 to all the other bits. (For
example, write H'FD to clear bit 1.) The bit-clear instruction is a read/modify/write instruction, so
if a new flag is set between the read and write operations, there is a danger that it may be cleared
erroneously. Therefore, do not use the bit-clear instruction to clear bits in this interrupt flag
resister. However, EP1EMPTY, EP2READY, and EP1ALLEMPTYs are status bits to indicate the
EP1, EP2, and FIFO state respectively, and cannot be cleared.
Bit
Bit Name
7 to 4 —
Initial Value R/W
Description
All 0
Reserved
R
These bits are always read as 0 and cannot be
modified.
3
EP1ALL
EMPTYs
1
R
EP1 FIFO All Empty Status
EP1 FIFO has a dual-FIFO configuration. This bit is set
to 1 if there is no valid data in both FIFOs. This
corresponds to the negative-electrode signal for the
EP1DE bit in UDSR.
An interrupt cannot be required by EP1ALLEMPTY.
2
EP2READY 0
R
EP2 Data Ready
EP2 FIFO has a dual-FIFO configuration. This bit is set
to 1 if there is valid data at least in either of FIFOs.
This bit is cleared to 0 if there is no valid data in both
FIFOs. This bit is a status bit and cannot be cleared.
The corresponding interrupt output is EXIRQ0 or
EXIRQ1.
1
EP1TR
0
R/(W)* EP1 Transfer Request
Set to 1 if there is no valid data in both FIFOs when an
IN token is sent from the host to EP1. The
corresponding interrupt output is EXIRQ0 or EXIRQ1.
0
EP1EMPTY 1
R
EP1 FIFO Empty
EP1 FIFO has a dual-FIFO configuration. This bit is set
to 1 if there is no valid data at least in either of FIFOs.
This bit is cleared to 0 if there is valid data in both
FIFOs. This bit is a status bit and cannot be cleared.
The corresponding interrupt output is EXIRQ0 or
EXIRQ1.
Note:* The write value should always be 0 to clear this flag.
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Section 14 Universal Serial Bus (USB)
14.3.18
USB Interrupt Flag Register 3 (UIFR3)
UIFR3 is an interrupt flag register indicating the USB status. If the corresponding bit is set to 1,
the corresponding EXIRQ0, EXIRQ1, or IRQ6 interrupt is requested to the CPU. VBUSi, SPRSi,
SETC, SOF, and CK48READY flags can be cleared by writing 0 to them. Writing 1 to them is
invalid and causes no operation. Consequently, to clear a flag, write 0 to the corresponding bit and
1 to all the other bits. (For example, write H'DF to clear bit 5.) The bit-clear instruction is a
read/modify/write instruction, so if a new flag is set between the read and write operations, there is
a danger that it may be cleared erroneously. Therefore, do not use the bit-clear instruction to clear
bits in this interrupt flag resister. VBUSs and SPRSs are status bits and cannot be cleared.
Bit
Bit Name
Initial Value R/W
7
CK48READY 0
Description
R/(W)* USB Operating Clock (48 MHz) Stabilization Detection
Set to 1 when the USB operating clock (48 MHz)
stabilization time has been automatically counted after
USB module stop mode cancellation. The
corresponding interrupt output is EXIRQ0 or EXIRQ1.
CK48READY can also operate in the USB interface
software reset state (the UIFRST bit in UCTLR is set
to 1).
Refer to the UCKS3 to UCKS0 bits in section 14.3.1,
USB Control Register (UCTLR).
6
SOF
0
R/(W)* Start of Frame Packet Detection
Set to 1 if the Start of Frame (SOF) packet is
detected. The corresponding interrupt output is
EXIRQ0 or EXIRQ1.
5
SETC
0
R/(W)* Set_Configuration Command Detection
Set to 1 if the Set_Configuration command is
detected. The corresponding interrupt output is
EXIRQ0 or EXIRQ1.
4
—
0
R
Reserved
This bit is always read as 0 and cannot be modified.
3
SPRSs
0
R
Suspend/Resume Status
SPRSs indicates the suspend/resume status.
However, an interrupt cannot be requested by SPRSs.
0: Indicates that the bus is in the normal state.
1: Indicates that the bus is in the suspend state.
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Section 14 Universal Serial Bus (USB)
Bit
Bit Name
Initial Value R/W
2
SPRSi
0
Description
R/(W)* Suspend/Resume Interrupt
Set to 1 if a transition from normal state to suspend
state or suspend state to normal state has occurred.
The corresponding interrupt output is IRQ6. This bit
can be used to cancel power-down mode at resuming.
1
VBUSs
0
R
VBUS Status
VBUSs is a status bit to indicate the VBUS state by
the USB cable connection or disconnection. However,
an interrupt cannot be requested by VBUSs.
0: Indicates that the VBUS (USB cable) bus is
disconnected.
1: Indicates that the VBUS (USB cable) bus is
connected.
0
VBUSi
0
R/(W)* VBUS Interrupt
Set to 1 if a VBUS state changes by the USB cable
connection or disconnection. The corresponding
interrupt output is EXIRQ0 or EXIRQ1.
Note:* The write value should always be 0 to clear this flag.
14.3.19
USB Interrupt Enable Register 0 (UIER0)
UIER0 enables the interrupt request indicated in the interrupt flag register 0 (UIFR0). When an
interrupt flag is set while the corresponding bit in UIER0 is set to 1, an interrupt is requested by
asserting the corresponding EXIRQ0 or EXIRQ1. Either EXIRQ0 or EXIRQ1 must be selected by
the interrupt select register 0 (UISR0).
Bit
Bit Name
Initial Value R/W
Description
7
BRSTE
0
R/W
Enables the BRST interrupt.
6
—
0
R
Reserved
This bit is always read as 0.
5
EP3TRE
0
R/W
Enables the EP3TR interrupt.
4
EP3TSE
0
R/W
Enables the EP3TS interrupt.
3
EP0oTSE
0
R/W
Enables the EP0oTS interrupt.
2
EP0iTRE
0
R/W
Enables the EP0iTR interrupt.
1
EP0iTSE
0
R/W
Enables the EP0iTS interrupt.
0
SetupTSE
0
R/W
Enables the SetupTS interrupt.
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Section 14 Universal Serial Bus (USB)
14.3.20 USB Interrupt Enable Register 1 (UIER1)
UIER1 enables the interrupt request indicated in the interrupt flag register 1 (UIFR1). When an
interrupt flag is set while the corresponding bit in UIER1 is set to 1, an interrupt is requested by
asserting the corresponding EXIRQ0 or EXIRQ1. Either EXIRQ0 or EXIRQ1 must be selected by
the interrupt select register 1 (UISR1).
Bit
Bit Name
7 to 4 —
Initial Value R/W
Description
All 0
Reserved
R
These bits are always read as 0.
3
—
0
R/W
Reserved
The write value should always be 0.
2
EP2READYE 0
R/W
Enables the EP2READY interrupt.
1
EP1TRE
0
R/W
Enables the EP1TR interrupt.
0
EP1EMPTYE 0
R/W
Enables the EP1EMPTYE interrupt.
14.3.21 USB Interrupt Enable Register 3 (UIER3)
UIER3 enables the interrupt request indicated in the interrupt flag register 3 (UIFR3). This register
is readable/writable while the USB module stop 2 bit (MSTPB0) in MSTPCRB is 1.
When an interrupt flag is set while the corresponding bit in UIER3 is set to 1, an interrupt is
requested by asserting the corresponding EXIRQ0 or EXIRQ1. Either EXIRQ0 or EXIRQ1 must
be selected by the interrupt select register 3 (UISR3). Note, however, that the SPRSiE bit is an
interrupt enable bit specific to the IRQ6 pin and cannot be selected by UISR3.
Bit
Bit Name
7
Initial Value
R/W
Description
CK48READYE 1
R/W
Enables the CK48READY interrupt.
6
SOFE
0
R/W
Enables the SOF interrupt.
5
SETCE
0
R/W
Enables the SETC interrupt.
4, 3
—
All 0
R
Reserved
These bits are always read as 0.
2
SPRSiE
0
R/W
Enables the SPRSi interrupt. (only for IRQ6)
1
—
0
R
Reserved
This bit is always read as 0.
0
VBUSiE
0
R/W
Enables the VBUSi interrupt.
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Section 14 Universal Serial Bus (USB)
14.3.22 USB Interrupt Select Register 0 (UISR0)
UISR0 sets EXIRQ to output interrupt request indicated in the interrupt flag register 0 (UIFR0).
When a bit in UIER0 corresponding to the UISR0 bit is cleared to 0, an interrupt request is output
from EXIRQ0. When a bit in UIER0 corresponding to the UISR0 bit is set to 1, an interrupt
request is output from EXIRQ1.
Bit
Bit Name
Initial Value
R/W
Description
7
BRSTS
0
R/W
Selects the BRST interrupt.
6
—
0
R
Reserved
This bit is always read as 0.
5
EP3TRS
0
R/W
Selects the EP3TR interrupt.
4
EP3TSS
0
R/W
Selects the EP3TS interrupt
3
EP0oTSS
0
R/W
Selects the EP0oTS interrupt.
2
EP0iTRS
0
R/W
Selects the EP0iTR interrupt.
1
EP0iTSS
0
R/W
Selects the EP0iTS interrupt.
0
SetupTSS
0
R/W
Selects the SetupTS interrupt.
14.3.23 USB Interrupt Select Register 1 (UISR1)
UISR1 sets EXIRQ to output interrupt request indicated in the interrupt flag register 1 (UIFR1).
When a bit in UIER1 corresponding to the UISR1 bit is cleared to 0, an interrupt request is output
from EXIRQ0. When a bit in UIER1 corresponding to the UISR1 bit is set to 1, an interrupt
request is output from EXIRQ1.
Bit
Bit Name
7 to 4 —
Initial Value R/W
All 0
R
Description
Reserved
These bits are always read as 0.
3
—
0
R/W
Reserved
The write value should always be 0.
2
EP2READYS 0
R/W
Selects the EP2READY interrupt.
1
EP1TRS
0
R/W
Selects the EP1TR interrupt.
0
EP1EMPTYS 0
R/W
Selects the EP1EMPTY interrupt.
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Section 14 Universal Serial Bus (USB)
14.3.24 USB Interrupt Select Register 3 (UISR3)
UISR3 sets EXIRQ to output interrupt request indicated in the interrupt flag register 3 (UIFR3).
When a bit in UIER3 corresponding to the UISR3 bit is cleared to 0, an interrupt request is output
from EXIRQ0. When a bit in UIER3 corresponding to the UISR3 bit is set to 1, an interrupt
request is output from EXIRQ1.
Bit
Bit Name
7
CK48READYS 0
R/W
Selects the CK48READY interrupt.
6
SOFS
0
R/W
Selects the SOF interrupt.
5
SETCS
0
R/W
Selects the SETC interrupt.
All 0
R
Reserved
4 to 1 —
Initial Value R/W
Description
These bits are always read as 0.
0
14.3.25
VBUSiS
0
R/W
Selects the VBUSi interrupt.
USB Data Status Register (UDSR)
UDSR indicates whether the IN FIFO data registers (EP1, and EP3) contain valid data or not. A bit
in USDR is set when data written to the corresponding IN FIFO becomes valid after the
corresponding PKTE bit in UTRG is set to 1. A bit in USDR is cleared when all valid data is sent
to the host. For EP1, having a dual-FIFO configuration, the corresponding bit in USDR is cleared
to 0 and FIFO becomes empty.
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Section 14 Universal Serial Bus (USB)
Bit
Bit Name
7 to 3 —
Initial Value R/W
Description
All 0
Reserved
R
These bits are always read as 0 and cannot be
modified.
2
EP1DE
0
R
EP1 Data Enable
0: Indicates that the EP1 contains no valid data.
1: Indicates that the EP1 contains valid data.
EP1DE corresponds to the negative-electrode
signal for EP1ALLEMPTYs in UIFR1.
1
EP3DE
0
R
EP3 Data Enable
0: Indicates that the EP3 contains no valid data.
1: Indicates that the EP3 contains valid data.
0
EP0iDE
0
R
EP0i Data Enable
0: Indicates that the EP0i contains no valid data.
1: Indicates that the EP0i contains valid data.
14.3.26
USB Configuration Value Register (UCVR)
UCVR stores the Configuration value when the Set_Configuration command is received from the
host.
Bit
Bit Name
Initial Value R/W
7, 6
—
All 0
R
Description
Reserved
These bits are always read as 0 and cannot be
modified.
5
CNFV0
0
R
Configuration Value 0
Stores the Configuration value when the
Set_Configuration command is received. CNFV0 is
modified when the SETC bit in UIFR3 is set to 1.
4 to 0 —
All 0
R
Reserved
These bits are always read as 0 and cannot be
modified.
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Section 14 Universal Serial Bus (USB)
14.3.27
USB Test Register 0 (UTSTR0)
UTSTR0 controls the on-chip transceiver output signals. Setting the PTSTE bit to 1 after setting
UIFRST and UDCRST in UCTLR to 0 specifies the transceiver output signals (USD+ and USD-)
arbitrarily. Table 14.2 shows the relationship between UTSTR0 setting and pin output.
Bit
Bit Name
Initial Value R/W
Description
7
PTSTE
0
Pin Test Enable
R/W
Enables the test control for the on-chip transceiver
output pins (USD+ and USD-) and USPND pin.
6 to 4 —
All 0
R
Reserved
These bits are always read as 0 and cannot be
modified.
3
SUSPEND
0
R/W
On-Chip Transceiver Output Signal Setting
2
OE
1
R/W
1
FSE0
0
R/W
SUSPEND: Sets the USPND pin signal of the on-chip
transceiver.
0
VPO
0
R/W
OE:
Sets the output enable (OE) signal of the
on-chip transceiver.
FSE0:
Sets the single-ended 0 (FSE0) signal of
the on-chip transceiver.
VPO:
Sets the USD+ (VPO) signal of the onchip transceiver.
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Section 14 Universal Serial Bus (USB)
Table 14.2 Relationship between UTSTR0 Setting and Pin Output
Register Setting
Pin Output
UCTLR/
Pin Input
Register Setting
Pin Output
USPND/
TMOWE
PTSTE
SUSPEND
TMOW
VBUS
PTSTE
OE
FSE0
VPO
USD+
USD-
1
×
×
—
0
×
×
×
×
Hi-Z
Hi-Z
0
0
×
—
1
0
×
×
×
—
—
0
1
0
0
1
1
0
0
0
0
1
0
1
1
1
1
1
0
0
1
1
0
1
1
0
1
×
0
0
1
1
1
×
×
Hi-Z
Hi-Z
Legend:
×: Don’t care
—: Cannot be controlled. Indicates state in normal operation according to the USB operation and
port settings.
14.3.28
USB Test Register 1 (UTSTR1)
UTSTR1 allows the USB control pin and on-chip transceiver input signals to be monitored. Table
14.3 shows the relationship between pin input and UTSTR1 monitoring value.
Bit
Bit Name
Initial Value R/W
Description
7
VBUS
—*
R
On-Chip Transceiver Input Signal Monitor
6
UBPM
—*
R
VBUS: Monitors the VBUS pin.
UBPM: Monitors the UBPM pin.
5 to 3 —
All 0
R
Reserved
These bits are always read as 0 and cannot be
modified.
2
RCV
—*
R
On-Chip Transceiver Input Signal Monitor
1
VP
—*
R
0
VM
—*
R
RCV: Monitors the differential input level (RCV)
signal of the on-chip transceiver.
VP:
Monitors the USD+ (VP) signal of the on-chip
transceiver.
VM:
Monitors the USD- (VM) signal of the on-chip
transceiver.
Note: * Determined by the state of pins. VBUS, UBPM, USD+, USD-
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Section 14 Universal Serial Bus (USB)
Table 14.3 Relationship between Pin Input and UTSTR1 Monitoring Value
UTSTR1 Monitoring
Pin Input
Value
Register Setting
Pin Input
UTSTR1 Monitoring Value
UTSTR0/
UTSTR0/
VBUS
UBPM
VBUS
UBPM
PTSTE
SUSPEND
VBUS
USD+
USD-
RCV
VP
VM
0/1
×
0/1
×
×
×
0
×
×
0
0
0
×
0/1
×
0/1
0
×
1
0
0
×
0
0
0
×
1
0
1
0
0
1
0
×
1
1
0
1
1
0
0
×
1
1
1
×
1
1
1
0
1
0
0
×
0
0
1
0
1
0
1
0
0
1
1
0
1
1
0
1
1
0
1
0
1
1
1
×
1
1
1
1
1
0
0
0
0
0
1
1
1
0
1
0
0
1
1
1
1
1
0
0
1
0
1
1
1
1
1
0
1
1
Legend:
×: Don’t care
0/1: Combination for pin input = UTSTR1 monitoring value.
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Section 14 Universal Serial Bus (USB)
14.3.29 USB Test Registers 2 and A to F (UTSTR2, UTSTRA to UTSTRF)
UTSTR2 and UTSRTA to UTSRTF are test registers and cannot be written to.
14.3.30 Module Stop Control Register B (MSTPCRB)
Bit
Bit Name
Initial Value
R/W
Description
7
MSTPB7
1
R/W
Module Stop
6
MSTPB6
1
5
MSTPB5
1
4
MSTPB4
1
3
MSTPB3
1
2
MSTPB2
1
1
MSTPB1
1
0
MSTPB0
1
For details, refer to section 20.1.3, Module Stop
Control Registers A to C (MSTPCRA to MSTPCRC).
R/W
USB Module Stop 2
0: Cancels the stop state of the USB module
completely.
A clock is provided for the USB module completely.
Before clearing this bit, make sure to clear the
USBSTOP1 bit in EXMDLSTP. After this bit has
been cleared, the internal PLL circuit starts
operation. Registers in the USB module must be
accessed after the USB operating clock stabilization
time (the CK48READY bit in UIFR3 is set to 1) has
passed.
1: Places the USB module partly in the stop state.
The internal PLL circuit and the most of the clocks in
the USB module stop operation. However, register
values in the USB module are maintained.
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Section 14 Universal Serial Bus (USB)
14.3.31 Extended Module Stop Register (EXMDLSTP)
Bit
Bit Name
7 to 2 —
Initial Value
R/W
Description
Undefined
—
Reserved
These bits are always read as an undefined value and
cannot be modified.
1
RTCSTOP
0
R/W
RTC Module Stop
0: Cancels the RTC module stop.
1: Sets the RTC module stop.
0
USBSTOP1 0
R/W
USB Module Stop 1
0: Cancels the stop state of the USB module partly.
A clock is provided for the USB module partly. After
this bit has been cleared, only the UCTLR and
UIER3 registers in the USB module can be
accessed. To access the other registers, clear the
MSTPB0 bit in MSTPCRB to 0.
1: Places the USB module completely in the stop state.
The clocks in the USB module stop operation
completely. However, register values in the USB
module are maintained.
Notes: 1. For details on USB module stop mode cancellation procedure, refer to section 14.5,
Communication Operation.
2. When reading pin states using the port D register (PORTD), after accessing
EXMDLSTP (address range: H'FFFF40 to H'FFFF5F), you must perform a dummy read
to the external address space (such as H'FFEF00 to H'FF7FF) outside the range
H'FFFF40 to H'FFFF5F before reading PORTD.
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Section 14 Universal Serial Bus (USB)
14.4
Interrupt Sources
This module has three interrupt signals. Table 14.4 shows the interrupt sources and their
corresponding interrupt request signals. The EXIRQ interrupt signals are activated at low level.
The EXIRQ interrupt requests can only be detected at low level (specified as level sensitive). The
suspend/resume interrupt request IRQ6 must be specified to be detected at the falling edge (fallingedge sensitive) by the interrupt controller register.
Rev.6.00 Jun. 03, 2008 Page 494 of 698
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Section 14 Universal Serial Bus (USB)
Table 14.4 Interrupt Sources
Description
SetupTS*1
Setup command
receive complete
EXIRQ0 or
EXIRQ1
×
1
EP0iTS*1
EP0i transfer complete EXIRQ0 or
EXIRQ1
×
2
EP0iTR*1
EP0i transfer request
EXIRQ0 or
EXIRQ1
×
3
EP0oTS*1
EP0o receive
complete
EXIRQ0 or
EXIRQ1
×
EP3 transfer complete EXIRQ0 or
EXIRQ1
×
Register
Bit
UIFR0
0
UIFR1
DMAC
Activation by
USB
Request*5
Interrupt
Request
Signal
Transfer
Mode
Interrupt
Source
Control transfer
(EP0)
4
Interrupt_in transfer EP3TS
(EP3)
5
EP3TR
EP3 transfer request
EXIRQ0 or
EXIRQ1
×
6
—
Reserved
—
—
—
7
(Status)
BRST
Bus reset
EXIRQ0 or
EXIRQ1
×
0
Bulk_in transfer
(EP1)
EP1EMPTY
EP1 FIFO empty
EXIRQ0 or
EXIRQ1
DREQ0 or
DREQ1*2
EP1TR
EP1 transfer request
EXIRQ0 or
EXIRQ1
×
EP2 data ready
EXIRQ0 or
EXIRQ1
DREQ0 or
DREQ1*3
1
2
Bulk_out transfer
(EP2)
EP2READY
3
Bulk_in transfer
(EP1)
(EP1ALLEMPTYs) EP1 FIFO all empty
status
×
×
4
—
Reserved
—
—
—
5
6
7
Rev.6.00 Jun. 03, 2008 Page 495 of 698
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Section 14 Universal Serial Bus (USB)
Register
Bit
UIFR3
0
Interrupt
Request
Signal
DMAC
Activation by
USB
Request*5
Transfer
Mode
Interrupt
Source
Description
⎯
(Status)
VBUSi
VBUS interrupt
EXIRQ0 or
EXIRQ1
×
(VBUSs)
VBUS status
×
×
1
2
SPRSi
Suspend/resume
interrupt
IRQ6 *
×
3
(SPRSs)
Suspend/resume
status
×
×
4
Reserved
⎯
⎯
⎯
5
SETC
Set_Configuration
detection
EXIRQ0 or
EXIRQ1
×
6
SOF
Start of Frame packet
detection
EXIRQ0 or
EXIRQ1
×
7
CK48READY
USB operating clock
stabilization detection
EXIRQ0 or
EXIRQ1
×
4
Notes: 1. EP0 interrupts must be assigned to the same interrupt request signal.
2. An EP1 DMA transfer by a USB request is specified by the EP1T1 and EP1T0 bits in
UDMAR.
3. An EP2 DMA transfer by a USB request is specified by the EP2T1 and EP2T0 bits in
UDMAR.
4. The suspend/resume interrupt request IRQ6 must be specified to be detected at the
falling edge (IRQ6SCB and IRQ6SCA in ISCRH = 01) by the interrupt controller register.
5. The DREQ signal is not used for auto-request. The CPU can activate the DMAC using
any flags and interrupts.
• EXIRQ0 signal
The EXIRQ0 signal requests interrupt sources for which the corresponding bits in interrupt
select registers 0 to 3 (UISR0 to UISR3) are cleared to 0. The EXIRQ0 is driven low if a
corresponding bit in the interrupt flag register is set to 1.
• EXIRQ1 signal
The EXIRQ1 signal requests interrupt sources for which the corresponding bits in interrupt
select registers 0 to 3 (UISR0 to UISR3) are cleared to 0. The EXIRQ1 is driven low if a
corresponding bit in the interrupt flag register is set to 1.
• IRQ6 signal
The IRQ6 signal is specific to the suspend/resume interrupt request. The falling edge of the
IRQ6 signal is output at the transition from the suspend state or from the resume state.
Rev.6.00 Jun. 03, 2008 Page 496 of 698
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Section 14 Universal Serial Bus (USB)
14.5
Communication Operation
14.5.1
Initialization
The USB must be initialized as described in the flowchart in figure 14.2.
USB function
Firmware
Cancel power-on reset
Cancel USB module stop 1
(Clear USBSTP1 in
EXMDLSTP to 0)
Start USB operationg clock
oscillation.
Select USB operating clock
(Write 1 to UCKS3 to UCKS0
in UCTLR)
USB
operating clock
stabilization time has
passed?
Yes
Cancel USB module stop 2
(Clear MSTPB0 in
MSTPCRB to 0)
No
Wait for USB operating
clock stabilization
EXIRQ0
USB operating clock stabilization
detection interrupt occurs.
Cancel USB interface reset
(Clear UIFRST in UCTLR to 0)
USB interface operation OK
Clear CK48READY in UIFR3 to 0
Set each interrupt
Set each interrupt
(Bus powered)
Self powered?
No
Yes
(Self powered)
System needs to
enter power-down
mode?
Yes
No
USB module stop 2
*
(Write to 1 MSTPB0 in MSTPCRB)
Enter power-down mode
(If necessary)
*
To USB cable
connecting procedure
Wait for USB cable
connection
To 14.5.2 (1)
Note: * Before entering power-down mode, set USB module stop 2 by setting the MSTPB0 bit in MSTPCRB to 1.
Figure 14.2 USB Initialization
Rev.6.00 Jun. 03, 2008 Page 497 of 698
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Section 14 Universal Serial Bus (USB)
14.5.2
USB Cable Connection/Disconnection
(1) USB Cable Connection (When USB module stop or power-down mode is not used)
If the USB cable enters the connection state from the disconnection state in an application (self
powered) where USB module stop or power-down mode is not used, perform the operation as
shown in figure 14.3. In bus-powered mode, perform the operation according to note 2 in
figure 14.3.
USB function
Firmware
Connect the USB cable
*1
A VBUS interrupt occurs
EXIRQx
Clear VBUSi in UIFR3
Check if VBUSs in UIFR3
is set to 1
from 14.5.1
After completing the buspowered mode initialization
*2
Check the USB cable
connection state
Clear all FIFOs
System ready?
No
Yes
Enable D+ pull-up
by port 36 (P36)
Set USB module operation
Receive bus reset from the host
Bus reset interrupt occurs.
Cancel UDC core reset
(Clear UDCRST in UCTLR to 0)
EXIRQx
Initialize the firmware
Wait for a setup interrupt
Notes: 1. VBUS interrupts in the USB module cannot be detected in power-down mode or
in the USB module stop state.
2. In bus-powered mode, power is applied after the USB cable has been connected.
Accordingly, immediately after completing the power-on reset, initialization (14.5.1), clearing all FIFOs,
and system preparation, enable the D+ pull-up by the port 36 (P36) and cancel the UDC core reset state.
Figure 14.3 USB Cable Connection
(When USB Module Stop or Power-Down Mode Is not Used)
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Section 14 Universal Serial Bus (USB)
(2) USB Cable Connection (When USB module stop or power-down mode is used)
If the USB cable enters the connection state from the disconnection state in an application (self
powered) where USB module stop or power-down mode is used, perform the operation as
shown in figure 14.4.
USB function
Connect the USB cable
Firmware
External interrupt IRQx*
*
Yes
Power-down mode?
No
USB module
stopped?
No
Yes
Start USB operating
clock oscillation
USB operating
clock stabilization time has
passed?
Cancel USB module stop 2
Clear MSTPB0 in MSTPCRB to 0
Wait for USB operating clock
stabilization
No
Yes
A USB operating clock
stabilization detection
interrupt occurs.
EXIRQx
Clear CK48READY in UIFR3 to 0
Check by using the
port function in IRQx
Check the USB
cable connection
state
Clear all FIFOs
System ready?
No
Yes
Enable D+ pull-up by
port 36 (P36)
Start USB module
operation
Receive bus reset from the host
A bus reset interrupt occurs
Cancel UDC core reset
(Clear UDCRST in UCTLR to 0)
EXIRQx
Initialize the firmware
Wait for setup interrupt
Note: * A VBUS interrupts in the USB module cannot be detected in power-down mode or in the USB module stop state.
Accordingly, in an application (self powered) where power-down mode or USB module stop is used,VBUS
interrupts of the USB must be detected via the external interrupt pin IRQx.
In this case, the IRQx pin must be specified as both-edge sensitive. When IRQx is used, VBUS interrupts in the
USB module need not to be used.
Figure 14.4 USB Cable Connection
(When USB Module Stop or Power-Down Mode Is Used)
Rev.6.00 Jun. 03, 2008 Page 499 of 698
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Section 14 Universal Serial Bus (USB)
(3) USB Cable Disconnection (When USB module stop or power-down mode is not used)
If the USB cable enters the disconnection state from the connection state in an application (self
powered) where USB module stop or power-down mode is not used, perform the operation as
shown in figure 14.5. In bus-powered mode, the power is automatically turned off when the
USB cable is disconnected and the following processing is not required.
USB function
Firmware
Disconnect the USB cable
VBUS interrupt occurs
*
EXIRQx
Clear VBUSi in UIFR3 to 0
Check if VBUSs in UIFR3
is cleared to 0
Reset the UDC core
Write UDCRST in UCTLR to 1
Reset the UDC core
Cancel D + pull-up by
port 36 (P36)
Wait for USB cable connection
Note: * VBUS interrupts in the USB module cannot be detected in power-down mode
or in the USB module stop state.
Figure 14.5 USB Cable Disconnection
(When USB Module Stop or Power-Down Mode Is not Used)
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Section 14 Universal Serial Bus (USB)
(4) USB Cable Disconnection (When USB module stop or power-down mode is used)
If the USB cable enters the disconnection state from the connection state in an application (self
powered) where USB module stop or power-down mode is used, perform the operation as
shown in figure 14.6.
USB function
Disconnect the USB cable
Firmware
*1
External interrupt
Yes
IRQx*1
Powe-down mode ?
No
USB module
stopped?
Yes
Start USB operating
clock oscillation
USB operating
clock stabilization time
has passed?
Cancel USB module stop 2
Clear MSTPB0 in MSTPCRB to 0
No
Wait for USB operating clock
stabilization
Yes
USB operating clock
stabilization detection
interrupt occurs.
No
EXIRQx
Clear CK48READY in UIFR3 to 0
Check the USB cable
disconnection state
Check connections by using
the port function of IRQx
Reset UDC core
Reset UDC core
Write UDCRST in UCTRL to 1
Enable D+ pull-up
by port 36 (P36)
System needs to
enter power-down
mode?
Yes
No
Stop USB module
2
Write MSTPB0 in MSTPCRB to 1 *
Enter power-down mode
(only if necessary)
*2
Wait for USB
cable connection
Notes: 1. VBUS interrupts in the USB module cannot be detected in power-down mode or in the USB
module stop state. Accordingly, in an application (self powered) where power-down mode or
USB module stop is used , VBUS interrupts of the USB must bedetected via the external
interrupt pin IRQx. In this case, the IRQx pin must be specified as both edge sensitive.
When IRQx is used, VBUS interrupts in the USB module need not to be used.
2. Before entering power-down mode, make sure to set USB module stop2 (the MSTPB0 bit of
MSTPCRB = 1).
Figure 14.6 USB Cable Disconnection
(When USB Module Stop or Power-Down Mode Is Used)
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Section 14 Universal Serial Bus (USB)
14.5.3
Suspend and Resume Operations
(1) Suspend and Resume Operations
Figures 14.7 and 14.8 are flowcharts of the suspend and resume operations. If the USB bus
enters the suspend state from a non-suspend state, or if it enters a non-suspend state from the
suspend state due to a resume signal from up-stream, perform the operations shown below.
USB function
Firmware
Main process
Suspend/resume interrupt
processing
Enable SPRSi and
IRQ6 interrupts
(Set SPRSiE in UIER3 to 1)
(Set IRQ6E in IER to 1) *1
Initialize standby
enable flag
(Clear standby enable
flag to 0)
USB cable connected
A bus idle of 3 ms or
more occurs
A suspend/resume
interrupt occurs
IRQ6
Run user program
Suspend interrupt
processing
(see figure 14.8)
*1
Suspend state
Standby enable
flag = 1?
No
Yes
Mask all interrupts
(Manipulate bit I using
LDC instruction, etc.)
*2
Enable IRQ6 interrupt
(Set IRQ6E in IER to 1)
*2
Unmask all interrupts
*2
(Clear bit I using LDC
instruction, etc.)
Transition to one
of the power-down modes
(Execute SLEEP
instruction)
A resume interrupt is
generated from up-stream
A suspend/resume
interrupt occurs
In one of the power-down
modes
IRQ6
Resume interrupt
processing
(see figure 14.8)
*1
Standby enable
flag = 0?
Notes: 1. The standby enable flag is a software flag for controlling transition to the
standby state (one of the power-down modes). There is no such hardware flag.
2. Interrupts should be masked from when the IRQ6 interrupt is received until the
SLEEP instruction is executed. Finally, unmask the interrupts using the LDC
instruction or the like and execute the SLEEP instruction immediately afterward.
No
Yes
Figure 14.7 Example Flowchart of Suspend and Resume Operations
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Section 14 Universal Serial Bus (USB)
(2) Suspend and Resume Interrupt Processing
Figure 14.8 is a flowchart of suspend and resume interrupt processing.
USB function
Firmware
IRQ6
Suspend interrupt
processing
Resume interrupt
processing
No
Yes
Standby enable
flag = 0?
Suspend
state confirmed?
(SPRSs in UIFR3 =
1?)
*4
Clear USB module
stop 2 mode
(Clear MSTPB0
in MSTPCRB to 0)
No
Yes
Clear resume flag
(Clear SPRSi in UIFR3
to 0)
Start USB operating
clock oscillation
USB operating
clock stabilization time
has passed?
*2
Prohibit IRQ6
(Clear IRQ6E in IER to 0)
*1
Clear standby enable
flag to 0
No
Clear suspend flag
(Clear SPRSi in UIFR3
to 0)
Clear suspend flag
(Clear SPRSi in UIFR3
to 0)
*4
Wait for USB operating
clock stabilization
Suspend
state confirmed?
(SPRSs in UIFR3 =
1?)
Yes
A USB operating clock
stabilization detection
interrupt occurs
Enable IRQ6 interrupt
(Set IRQ6E in IER to 1)
EXIRQx
USB operating clock stabilization
detection interrupt processing
Clear USB operating clock
stabilization detection flag
(Clear CK48READY
in UIFR3 to 0)
*5
Suspend
state confirmed?
(SPRSs in UIFR3 =
1?)
Remote*3
wakeup enabled?
(RWUPs in UDRR
= 1)
*5
No
Yes
Confirm that
remote-wakeup is enabled
Confirm that
remote-wakeup is
prohibited
Yes
Enable USB module
stop mode
(Set MSTPB0
in MSTPCRB to 1)
No
Set standby enable
flag to 1
*1
Resume main process
Notes: 1. The standby enable flag is a software flag for controlling transition to the standby state (one of the power-down modes). There is no such
hardware flag.
2. Interrupts should be masked from when the IRQ6 interrupt is received until the SLEEP instruction is executed. Finally, unmask the interrupts
using the LDC instruction or the like and execute the SLEEP instruction immediately afterward.
3. The remote-wakeup function cannot be used unless it is enabled by the host. Accordingly, the remote-wakeup function cannot be used
unless it is enabled by the host. Accordingly, make sure to check RWUPs in UDRR before using the remote-wakeup function. However, it is
not necessary to confirm that the remote-wakeup function is enabled by the host if the application does not make use of this function.
4. When resuming using the remote wakeup function, the USB module stop state must already be cleared.
5. Return to the main process and wait for the USB operating clock stabilization detection interrupt. When resuming by means of remotewakeup the USB operating clock has already stabilized, so this step is not necessary.
Figure 14.8 Example Flowchart of Suspend and Resume Interrupt Processing
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Section 14 Universal Serial Bus (USB)
(3) Suspend and Remote-Wakeup Operations
Figures 14.9 and 14.10 are flowcharts of the suspend and remote-wakeup operations. If the
USB bus enters a non-suspend state from the suspend state due to a remote-wakeup signal from
this function, perform the operations shown below.
USB function
Firmware
Main process
Suspend/remote-wakeup
interrupt processing
Enable SPRSi and
IRQ6 interrupts
(Set SPRSiE in UIER3 to 1)
(Set IRQ6E in IER to 1) *1
Initialize standby
enable flag
(Clear standby enable
flag to 0)
USB cable connected
A bus idle of 3 ms or
more occurs
IRQ6
A suspend/resume
interrupt occurs
Run user program
Suspend interrupt
processing
(see figure 14.8)
*1
Suspend state
Standby enable
flag = 1?
No
Yes
Mask all interrupts
(Manipulate bit I using
LDC instruction, etc.)
Enable IRQ6 interrupt
(Set IRQ6E in IER to 1)
*2
*2
Unmask all interrupts
*2
(Clear bit I using LDC
instruction, etc.)
Transition to one
of the power-down modes
(Execute SLEEP
instruction)
In one of the power-down
modes
Output resume signal
to USB bus
A suspend/resume
interrupt occurs
NMI or IRQx
Remotewakeup
Remote-wakeup
interrupt processing
(see figure 14.10)
IRQ6
*1
Standby enable
flag = 0?
Notes: 1. The standby enable flag is a software flag for controlling transition to the standby
state (one of the power-down modes). There is no such hardware flag.
2. Interrupts should be masked from when the IRQ6 interrupt is received until the
SLEEP instruction is executed. Finally, unmask the interrupts using the LDC
instruction or the like and execute the SLEEP instruction immediately afterward.
No
Yes
Figure 14.9 Example Flowchart of Suspend and Remote-Wakeup Operations
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Section 14 Universal Serial Bus (USB)
(4) Remote-Wakeup Interrupt Processing
Figure 14.10 is a flowchart of remote-wakeup interrupt processing.
USB function
Firmware
NMI or IRQx
Remote-wakeup
interrupt processing
Is remotewakeup enabled
by host?
No
Wait for resume signal
from up-stream
Clear USB module
stop mode
(Clear SPRSi in UIFR3
to 0)
Start USB operating
clock oscillation
USB operating
clock stabilization time
has passed?
Wait for USB operating
clock stabilization
No
USB operating clock stabilization
detection interrupt processing
Yes
A USB operating clock
stabilization detection
interrupt occurs
EXIRQx
Remotewakeup
Output resume signal
to USB bus
A suspend/resume
interrupt occurs
Yes
Clear USB operating clock
stabilization detection flag
(Clear CK48READY
in UIFR3 to 0)
Execute remote-wakeup
(Set DVR in UDRR to 1)
IRQ6
Resume interrupt
processing
(see figure 14.8)
Resume main process
Figure 14.10 Example Flowchart of Remote-Wakeup Interrupt Processing
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Section 14 Universal Serial Bus (USB)
14.5.4
Control Transfer
The control transfer consists of three stages; setup, data (sometimes omitted), and status, as shown
in figure 14.11. The data stage consists of multiple bus transactions. Figures 14.12 to 14.16 show
operation flows in each stage.
Setup stage
Control-in
Control-out
No data
Data stage
SETUP (0)
IN (1)
IN (0)
DATA0
DATA1
DATA0
SETUP (0)
OUT (1)
OUT (0)
DATA0
DATA1
DATA0
Status stage
...
...
IN (0/1)
OUT (1)
DATA0/1
DATA1
OUT (0/1)
IN (1)
DATA0/1
DATA1
SETUP (0)
IN (1)
DATA0
DATA1
Figure 14.11 Control Transfer Stage Configuration
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Section 14 Universal Serial Bus (USB)
(1) Setup Stage
USB function
Firmware
Receive SETUP token
Receive 8-byte command
data in UEDR0s
Command
to be processed by
firmware?
No
Automatic
processing by
this module
Yes
Set setup command
recive complete flag
(SetupTS in UIFR0 = 1)
To data stage
EXIRQx
Clear SetupTS flag
(SetupTS in UIFR0 = 0)
Clear EP0i FIFO (EP0iCLR in UFCLR = 1)
Clear EP0o FIFO (EP0oCLR in UFCLR = 1)
Read 8-byte data from UEDR0s
Decode command data
Determine data stage direction*1
Write 1 to EP0s read complete bit
(EP0sRDFN in UTRG0 = 1)
*2
To control-in
data stage
To control-out
data stage
Notes: 1. In the setup stage, the firmware first analyzes the command data that is sent from the host and
required to be processed by the firmware, and determines subsequent processing.
(For example, the data stage direction.)
2. When the transfer direction is control-out, the EP0i transfer request interrupt that is required in the
status stage should be enabled. When the transfer direction is control-in, this interrupt is not
required and must be disabled.
Figure 14.12 Setup Stage Operation
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Section 14 Universal Serial Bus (USB)
(2) Data Stage (Control-In)
The firmware first analyzes the command data that is sent from the host in the setup stage, and
determines the subsequent data stage direction. If the result of command data analysis is that
the data stage is in-transfer, one packet of data to be sent to the host is written to the FIFO. If
there is more data to be sent, this data is written to the FIFO after the data written first has been
sent to the host (EP0iTS in UIFR0 is set to 1).
The end of the data stage is identified when the host transmits an OUT token and the status
stage is entered.
USB function
Firmware
Receive IN token
From setup stage
1 written
to EP0sRDFN
in UTRG0?
Write data to USB endpoint
data register 0i (UEDR0i)
No
NAK
Yes
Valid data
in EP0i FIFO?
Write 1 to EP0i packet
enable bit
(EP0iPKTE in UTRG0 = 1)
No
NAK
Yes
Transmit data to host
ACK
Set EP0i transmit
complete flag
(EP0iTS in UIFR0 = 1)
EXIRQx
Clear EP0i transmit
complete flag
(EP0iTS in UIFR0 = 0)
Write data to USB endpoint
data register 0i (UEDR0i)
Write 1 to EP0i packet
enable bit
(EP0iPKTE in UTRG0 = 1)
Note:
If the size of the data transmitted by the function is smaller than the data size requested by the host,
the function indicates the end of the data stage by returnning to the host a packet shorter than the
maximum packet size. If the size of the data transmitted by the function is an integral multiple of the
maximum packet size, the function indicates the end of the data stage by transmitting a zero-length
packet.
Figure 14.13 Data Stage Operation (Control-In)
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Section 14 Universal Serial Bus (USB)
(3) Data Stage (Control-Out)
The firmware first analyzes the command data that is sent from the host in the setup stage, and
determines the subsequent data stage direction. If the result of command data analysis is that
the data stage is out-transfer, data from the host is waited for, and after data is received
(EP0oTS in UIFR0 is set to 1), data is read from the FIFO. Next, the firmware writes 1 to the
EP0o read complete bit, empties the receive FIFO, and waits for reception of the next data.
The end of the data stage is identified when the host transmits an IN token and the status stage
is entered.
USB function
Firmware
Receive OUT token
1 written
to EP0sRDFN
in UTRG0?
No
NAK
Yes
Receive data from host
ACK
EXIRQx
Set EP0o receive
complete flag
(EP0oTS in UIFR0 = 1)
Read data from USB endpoint
receive data size register 0o
(UESZ0o)
Receive OUT token
1 written
to EP0oRDFN
in UTRG0?
Clear EP0o receive
complete flag
(EP0oTS in UIFR0 = 0)
No
NAK
Read data from USB endpoint
data register 0o (UEDR0o)
Yes
Write 1 to EP0o read
complete bit
(EP0oRDFN in UTRG0 = 1)
Figure 14.14 Data Stage Operation (Control-Out)
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Section 14 Universal Serial Bus (USB)
(4) Status Stage (Control-In)
The control-in status stage starts with an OUT token from the host. The firmware receives 0byte data from the host, and ends control transfer.
USB function
Firmware
OUT token reception
0-byte reception from host
ACK
Set EP0o reception
complete flag
(UIFR0/EP0oTS = 1)
End of control transfer
EXIRQx
Clear EP0o reception
complete flag
(UIFR0/EP0oTS = 0)
Write 1 to EP0o read
complete bit
(UTRG0/EP0oRDFN = 1)
End of control transfer
Figure 14.15 Status Stage Operation (Control-In)
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Section 14 Universal Serial Bus (USB)
(5) Status Stage (Control-Out)
The control-out status stage starts with an IN token from the host. When an IN-token is
received at the start of the status stage, there is not yet any data in the EP0i FIFO, and so an
EP0i transfer request interrupt is generated. The firmware recognizes from this interrupt that
the status stage has started. Next, in order to transmit 0-byte data to the host, 1 is written to the
EP0i packet enable bit but no data is written to the EP0i FIFO. As a result, the next IN token
causes 0-byte data to be transmitted to the host, and control transfer ends.
After the firmware has finished all processing relating to the data stage, 1 should be written to
the EP0i packet enable bit.
USB function
Firmware
Receive IN token
Valid data
in EP0i FIFO?
No
EXIRQx
NAK
Clear EP0i transfer
request flag
(EP0iTR in UIFR0 = 0)
Yes
Write 1 to EP0i packet
enable bit
(EP0iPKTE in UTRG0 = 1)
Transfer 0-byte data to host
ACK
Write 0 to EP0i transfer
request interrupt enable bit
(EP0iTRE in UIER0 = 0)
Set EP0i transmit
complete flag
(EP0iTS in UIFR0 = 1)
End of control transfer
EXIRQx
Clear EP0i transmit
complete flag
(EP0iTS in UIFR0 = 0)
End of control transfer
Figure 14.16 Status Stage Operation (Control-Out)
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Section 14 Universal Serial Bus (USB)
14.5.5
Interrupt-In Transfer (Endpoint 3)
USB function
Firmware
Is there
transmit data
to host?
Receive IN token
Valid data
in EP3 FIFO?
No
Yes
Write data to USB endpoint
data register 3 (UEDR3)
No
NAK
Write 1 to EP3 packet
enable bit
(EP3PKTE in UTRG0 = 1)
Yes
Transmit data to host
ACK
Set EP3 transmit
complete flag
(EP3TS in UIFR0 = 1)
EXIRQx
Clear EP3 transmit
complete flag
(EP3TS in UIFR0 = 0)
Is there
transmit data
to host?
No
Yes
Write data to USB endpoint
data register3 (UEDR3)
Write 1 to EP3 packet
enable bit
(EP3PKTE in UTRG0 = 1)
Note:
This flowchart shows just one example of interrupt-in transfer processing. Other possibilities include an
operation flow in which, if there is data to be transmited, the EP3DE bit UDSR is referred to confirm that the
FIFO is empty, and then data is written to the FIFO.
Figure 14.17 EP3 Interrupt-In Transfer Operation
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Section 14 Universal Serial Bus (USB)
14.5.6
Bulk-In Transfer (Dual FIFOs) (Endpoint 1)
EP1 has two 64-byte FIFOs, but the user can transmit data and write transmit data without being
aware of this dual-FIFO configuration. However, one data write should be performed for one
FIFO. For example, even if both FIFOs are empty, it is not possible to perform EP1PKTE at one
time after consecutively writing 128 bytes of data. EP1PKTE must be performed for each 64- byte
write.
When transmitting data to the host by bulk-in transfer, first enable the EP1 FIFO empty interrupt
by writing 1 to EP1EMPTYE in UIER1. At first, both EP1 FIFOs are empty, and so an EP1 FIFO
empty interrupt is generated immediately. The data to be transmitted is written to the data register
using this interrupt. After the first transmit data write for one FIFO, the other FIFO is empty, and
so the next transmit data can be written to the other FIFO immediately. When both FIFOs are full,
EP1EMPTY is cleared to 0. If at least one FIFO is empty, UIFR1/EP1EMPTY is set to 1. When
ACK is returned from the host after data transmission is completed, the FIFO used in the data
transmission becomes empty. If the other FIFO contains valid transmit data at this time,
transmission can be continued.
When transmission of all data has been completed, write 0 to UIER1/EP1EMPTYE and disable
EXIRQ0 or EXIRQ1 interrupt requests.
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Section 14 Universal Serial Bus (USB)
USB function
Firmware
Receive IN token
No
Valid data
in EP1 FIFO?
Is there
data to be transmitted
to host?
NAK
Yes
Yes
Write 1 to EP1 FIFO
empty enable
(EP1EMPTYE in UIER1 = 1)
Transmit data to host
ACK
Yes
Space
in EP1 FIFO?
Set EP1 FIFO empty status
(EP1EMPTY in UIFR1 = 1)
EXIRQx
No
UIFR1/EP1EMPTY interrupt
USB endpoint data register 1
(write one packet of data
to UEDR1)
Clear EP1 FIFO empty status
(EP1EMPTY in UIFR1 = 0)
Write 1 to EP1 packet enable bit
(EP1PKTE in UTRG0 = 1)
No
Is there
data to be transmitted
in host?
Yes
Write 0 to EP1 FIFO empty
interrupt enable bit
(EP1EMPTYE in UIER1 = 0)
Figure 14.18 EP1 Bulk-In Transfer Operation
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No
Section 14 Universal Serial Bus (USB)
14.5.7
Bulk-Out Transfer (Dual FIFOs) (Endpoint 2)
EP2 has two 64-byte FIFOs, but the user can receive data and read receive data without being
aware of this dual-FIFO configuration.
When one FIFO is full after reception is completed, the UIFR1/EP2READY bit is set. After the
first receive operation into one of the FIFOs when both FIFOs are empty, the other FIFO is empty,
and so the next packet can be received immediately. When both FIFOs are full, NAK is returned to
the host automatically. When reading of the receive data is completed following data reception, 1
is written to the UTRG0/EP2RDFN bit. This operation empties the FIFO that has just been read,
and makes it ready to receive the next packet.
USB function
Firmware
Receive OUT token
Space
in EP2 FIFO?
No
NAK
Yes
Receive data from host
ACK
EXIRQx
Set EP2 data ready status
(EP2READY in UIFR1 = 1)
Read USB endpoint receive
data size register 2 (UESZ2)
Read data from USB endpoint
data register 2 (UEDR2)
Write 1 to EP2o read
complete bit
(EP2RDFN in UTRG0 = 1)
Both
EP2 FIFOs empty?
No
EXIRQI
Yes
Clear EP2 data ready status
(EP2READY in UIFR1 = 0)
Figure 14.19 EP2 Bulk-Out Transfer Operation
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Section 14 Universal Serial Bus (USB)
14.5.8
Processing of USB Standard Commands and Class/Vendor Commands
(1) Processing of Commands Transmitted by Control Transfer
A command transmitted from the host by control transfer may require decoding and execution
of command processing by the firmware. Whether or not command decoding is required by the
firmware is indicated in table 14.5 below.
Table 14.5 Command Decoding by Firmware
Decoding not Necessary by Firmware
Decoding Necessary by Firmware
Clear Feature
Get Descriptor
Get Configuration
Synch Frame
Get Interface
Set Descriptor
Get Status
Class/Vendor command
Set Address
Set Configuration
Set Feature
Set Interface
If decoding is not necessary by the firmware, command decoding and data stage and status
stage processing are performed automatically. No processing is necessary by the user. An
interrupt is not generated in this case.
If decoding is necessary by the firmware, the USB function module stores the command in the
EP0s FIFO. After normal reception is completed, the SetupTS flag in UIER0 is set and an
interrupt request is generated from the EXIRQx pin. In the interrupt routine, eight bytes of data
must be read from the EP0s data register (UEDR0s) and decoded by the firmware. The
necessary data stage and status stage processing should then be carried out according to the
result of the decoding operation.
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Section 14 Universal Serial Bus (USB)
14.5.9
Stall Operations
(1) Overview
This section describes stall operations in the USB function module. There are two cases in
which the USB function module stall function is used:
Α. When the firmware forcibly stalls an endpoint for some reason
Β. When a stall is performed automatically within the USB function module due to a USB
specification violation.
The USB function module has internal status bits that hold the status (stall or non-stall) of each
endpoint. When a transaction is sent from the host, the module refers these internal status bits
and determines whether to return a stall to the host. These bits cannot be cleared by the
firmware; they must be cleared with a Clear Feature command from the host. However, the
internal status bit for EP0 is cleared automatically at the reception of the setup command.
(2) Forcible Stall by Firmware
The firmware uses the UESTL register to issue a stall request for the USB function module.
When the firmware wishes to stall a specific endpoint, it sets the corresponding EPnSTL bit (11 in figure 14.20). The internal status bits are not changed at this time.
When a transaction is sent from the host for the endpoint for which the EPnSTL bit was set, the
USB function module refers the internal status bit, and if this is not set, refers the
corresponding EPnSTL bit (1-2 in figure 14.20). If the corresponding EPnSTL bit is not set, the
internal status bit is not changed and the transaction is accepted. If the corresponding EPnSTL
bit is set, the USB function module sets the internal status bit and returns a stall handshake to
the host (1-3 in figure 14.20).
Once an internal status bit is set, it remains set until cleared by a Clear Feature command from
the host, without regarding to EPnSTL. Even after a bit is cleared by the Clear Feature
command (3-1 in figure 14.20), the USB function module continues to return a stall handshake
while the EPnSTL bit is set, since the internal status bit is set each time a transaction is
executed for the corresponding endpoint (1-2 in figure 14.20). To clear a stall, therefore, it is
necessary for the corresponding EPnSTL bit to be cleared by the firmware, and also for the
internal status bit to be cleared with a Clear Feature command (2-1 to 2-3 in figure 14.20).
Rev.6.00 Jun. 03, 2008 Page 517 of 698
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Section 14 Universal Serial Bus (USB)
(1) Transition from normal operation to stall
USB function module
(1-1)
USB
EPnSTL
0→1
Internal status bit
0
1. Set EPnSTL to 1 by
firmware
(1-2)
Reference
Transaction request
EPnSTL
1
Internal status bit
0
1. Receive IN/OUT
token from the host
2. Refer to EPnSTL
To (1-3)
(1-3)
Stall
Stall handshake
EPnSTL
1 (SCME = 0)
Internal status bit
0→1
To (2-1) or (3-1)
1. SCME is set to 0
2. EPnSTL is set to 1
3. Set internal status
bit to 1
4. Transmit stall
handshake
(2) When Clear Feature is sent after EPnSTL has been cleared
(2-1)
Transaction request
Internal status bit
1
EPnSTL
1→0
Internal status bit
1
EPnSTL
0
Internal status bit
1→0
EPnSTL
0
1. Clear EPnSTL to 0
by firmware
2. Receive IN/OUT
token from the host
3. Internal status bit
has been set to 1
4. EPnSTL is not
referred to
5. No change in
internal status bit
(2-2)
Stall handshake
1. Transmit stall
handshake
(2-3)
Clear Feature command
1. Clear internal status
bit to 0
Normal status restored
(3) When Clear Feature is sent before EPnSTL is cleared to 0
(3-1)
Clear Feature command
EPnSTL
1
Internal status bit
1→0
To (1-2)
Figure 14.20 Forcible Stall by Firmware
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1. Clear internal status
bit to 0
2. No change in
EPnSTL bit
Section 14 Universal Serial Bus (USB)
(3) Automatic Stall by USB Function Module
When a stall setting is made with the Set Feature command, when the information of this
module differs from that returned to the host by the Get Descriptor, or in the event of a USB
specification violation, the USB function module automatically sets the internal status bit for
the corresponding endpoint without regarding to EPnSTL, and returns a stall handshake (1-1 in
figure 14.21).
Once an internal status bit is set, it remains set until cleared by a Clear Feature command from
the host, without regarding to EPnSTL. After a bit is cleared by the Clear Feature command,
EPnSTL is referred (3-1 in figure 14.21). The USB function module continues to return a stall
handshake while the internal status bit is set, since the internal status bit is set even if a
transaction is executed for the corresponding endpoint (2-1 and 2-2 in figure 14.21). To clear a
stall, therefore, the internal status bit must be cleared with a Clear Feature command (3-1 in
figure 14.21). If set by the firmware, EPnSTL should also be cleared (2-1 in figure 14.21).
(1) Transition from normal operation to stall
USB function module
(1-1)
Stall handshake
EPnSTL
0
Internal status bit
0→1
To (2-1) or (3-1)
1. In case of USB
specification violation,
USB function module
stalls endpoint
automatically.
(2) When transaction is performed whill internal status bit is set
(2-1)
Transaction request
Internal status bit
1
EPnSTL
0
Internal status bit
1
EPnSTL
0
1. Receive IN/OUT
token from the host
2. Internal status bit has
been set to 1
3. EPnSTL is not
referred to
4. No change internal
status bit
(2-2)
Stall handshake
1. Transmit stall
handshake
Stall status maintained
(3) When Clear Feature is sent before transaction is performed
(3-1)
Clear Feature command
Internal status bit
1→0
EPnSTL
0
1. Clear the internal
status bit to 0
2. No change in
EPnSTL bit
Normal status restored
Figure 14.21 Automatic Stall by USB Function Module
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Section 14 Universal Serial Bus (USB)
14.6
DMA Transfer Specifications
Two methods of USB request and auto request are available for the DMA transfer of USB data.
14.6.1
DMAC Transfer by USB Request
(1) Overview
Only normal mode in full address mode (cycle steal mode) supports the transfer by a USB request
of the on-chip DMAC. Endpoints that can be transferred by the on-chip DMAC are EP1 and EP2
in Bulk transfer (corresponding registers are UEDR1 and UEDR2). In DMA transfer, the USB
module must be accessed as an external device in area 6. The USB module cannot be accessed as a
device with external ACK (single-address transfer cannot be performed). 0-byte data transfer to
EP2 is ignored even if the DMA transfer is enabled by setting the EP2T1 bit in UDMAR to 1.
(2) On-Chip DMAC Settings
The on-chip DMAC must be specified as follows: A USB request (DREQ signal is used), activated
by low-level input, byte size, full-address mode transfer, and the DTA bit in DMABCR = 1. After
completing the DMA transfer of specified times, the DMAC automatically stops. Note, however,
that the USB module keeps the DREQ signal low while data to be transferred by the on-chip
DMAC remains regardless of the DMAC status.
(3) EP1 DMA Transfer
The EP1T1 bit in UDMAR enables the DMA transfer. The EP1T0 bit in UDMAR specifies the
DREQ signal to be used by the DMA transfer. When 1 is written to the EP1T1 bit, the DREQ
signal is driven low if at least one of EP1 data FIFOs is empty; the DREQ signal is driven high if
both EP1 data FIFOs are full.
(a) EP1PKTE in UTRG0
When DMA transfer is performed on EP1 transmit data, the USB module automatically performs
the same processing as writing 1 to EP1PKTE if one data FIFO (64 bytes) becomes full.
Accordingly, to transfer data of integral multiples of 64 bytes, the user needs not to write 1 to
EP1PKTE. To transfer data of less than 64 bytes, the user must write 1 to EP1PKTE using the
DMA transfer end interrupt of the on-chip DMAC. If the user writes 1 to EP1PKTE in cases other
than the case when data of less than 64 bytes is transferred, excess transfer occurs and correct
operation cannot be guaranteed.
Figure 14.22 shows an example for transmitting 150 bytes of data from EP1 to the host. In this
case, internal processing as the same as writing 1 to EP1PKTE is automatically performed twice.
This kind of internal processing is performed when the currently selected data FIFO becomes full.
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Section 14 Universal Serial Bus (USB)
Accordingly, this processing is automatically performed only when 64-byte data is sent. This
processing is not performed automatically when data less than 64 bytes is sent.
(b) EP1 DMA transfer procedure
1. Set the bits EP1T1 and EP1T0 in UDMAR.
2. Set DMAC (specifies the number of transfers in DMAC to transmit 150 bytes of data).
3. Activate DMAC.
4. Perform DMA transfer.
5. Write 1 to the EP1PKTE bit in UTRG0 by a DMA transfer end interrupt.
64 bytes
64 bytes
EP1PKTE
(Automatically
performed)
22 bytes
EP1PKTE
(Automatically
performed)
EP1PKTE is
not performed
Executed by DMA transfer
end interrupt (user)
Figure 14.22 EP1PKTE Operation in UTRG0
(4) EP2 DMA Transfer
The EP2T1 bit in UDMAR enables the DMA transfer. The EP2T0 bit in the UDMAR specifies the
DREQ signal to be used by the DMA transfer. When 1 is written to the EP2T1 bit, the DREQ
signal is driven low if at least one of EP2 data FIFOs is full (ready state); the DREQ signal is
driven high if both EP2 data FIFOs are empty when all receive data items are read.
(a) EP2RDFN in UTRG0
When DMA transfer is performed on EP2 receive data, do not write 1 to EP2RDFN after one data
FIFO (64 bytes) has been read. In data transfer other than DMA transfer, the next data cannot be
read after one data FIFO (64 bytes) has been read unless 1 is written to EP2RDFN. While in DMA
transfer, the USB module automatically performs the same processing as writing 1 to EP2RDFN if
the currently selected data FIFO becomes empty. Accordingly, in DMA transfer, the user needs
not to write 1 to EP2RDFN. If the user writes 1 to EP2RDFN in DMA transfer, excess transfer
occurs and correct operation cannot be guaranteed.
Figure 14.23 shows an example of EP2 receiving 150 bytes of data from the host. In this case,
internal processing as the same as writing 1 to EP2RDFN is automatically performed three times.
This kind of internal processing is performed when the currently selected data FIFO becomes
empty. Accordingly, this processing is automatically performed both when 64-byte data is sent and
when data less than 64 bytes is sent.
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Section 14 Universal Serial Bus (USB)
(b) EP2 DMA transfer procedure
Perform DMAC transfer in 1 packet units. After setting the EP2READY flag, check the size of
data received from the host and then set the data size as the number of DMAC transfers.
1. Set the bits EP2T1 and EP2T0 in UDMAR.
2. Wait for the EP2READY flag in UIFR1 to be set.
3. Set DMAC.
Read the value in UESZ2 and specifies the size of received data (not more than 64 bytes) as the
number of transfers.
4. Activate DMAC.
5. Perform DMA transfer (not more than 64 bytes).
6. Wait for DMA transfer end.
7. Repeat steps 2 to 6.
64 bytes
64 bytes
EP2RDFN
(Automatically
performed)
22 bytes
EP2RDFN
EP2RDFN
(Automatically (Automatically
performed)
performed)
Figure 14.23 EP2RDFN Operation in UTRG0
14.6.2
DMA Transfer by Auto-Request
(1) Overview
Burst mode transfer or ycle steal transfer can be selected for the on-chip DMAC auto-request
transfer. Endpoints that can be transferred by the on-chip DMAC are all registers (UEDR0s,
UEDR0i, UEDR0o, UEDR1, UEDR2, UEDR3). Confirm flags and interrupts corresponding to
each data register before activating the DMA. As UDMAR is not used in auto-request mode, set
UDMAR to H'00.
(2) On-Chip DMAC Settings
The on-chip DMAC must be specified as follows: Auto-request, byte size, full-address mode
transfer, and number of transfers equal to or less than the maximum packet size of the data
register. After completing the DMAC transfers of specified time, the DMAC automatically stops.
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Section 14 Universal Serial Bus (USB)
(3) EP0, EP1, or EP3 DMA Transfer
(a) EPnPKTE Bits of UTRG0 (n = 0i, 1, or 3)
Note that 1 is not automatically written to EPnPKTE in case of auto-request transfer. Always write
1 to EPnPKTE by the CPU. The following example shows when 150-byte data is transmitted from
EP1 to the host. In this case, 1 should be written to EP2PKTE three times as shown in figure
14.24.
(b) EP1 DMA Transfer Procedure
The DMAC transfer unit should be one packet. Therefore, set the number of transfers so that it is
equal to or less than the maximum packet size of each endpoint.
1. Confirm that UIFR1/EP1EMPTY flag is 1.
2. DMAC settings for EP1 data transfer (such as auto-request and address setting).
3. Set the number of transfers for 64 bytes (the maximum packet size or less) in the DMAC.
4. Activate the DMAC (write 1 to DTE after reading DTE as 0).
5. DMA transfer.
6. Write 1 to the UTRG0/EP1PKTE bit after the DMA transfer is completed.
7. Repeat steps 1 to 6 above.
8. Confirm that UIFR1/EP1EMPTY flag is 1.
9. Set the number of transfer for 22 bytes in the DMAC.
10. Activate the DMAC (write 1 to DTE after reading DTE as 0).
11. DMA transfer.
12. Write 1 to the UTRG0/EP1PKTE bit after the DMA transfer is completed.
64 bytes
64 bytes
Write 1 to
EP1PKTE
22 bytes
Write 1 to
EP1PKTE
Write 1 to
EP1PKTE
Figure 14.24 EP1PKTE Operation in UTRG0 (Auto-Request)
(4) EP0o or EP2 DMA Transfer
(a) EPnRDFN Bits of UTRG0 (n = 0o or 2)
Note that 1 is not automatically written to EPnRDFN in case of auto-request transfer. Always write
1 to EPnRDFN by the CPU. The following example shows when EP2 receives 150-byte data from
the host. In this case, 1 should be written to EP2RDFN three times as shown in figure 14.25.
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Section 14 Universal Serial Bus (USB)
(b) EP2 DMA Transfer Procedure
The DMAC transfer unit should be one packet. Therefore, set the number of transfers so that it is
equal to or less than the maximum packet size of each endpoint.
1. Wait for the UIFR1/EP2READY flag to be set.
2. DMAC settings for EP2 data transfer (such as auto-request and address setting). Read value of
UESZ2 and specify number of transfers to match size of received data (64 bytes or less).
3. Activate the DMAC (write 1 to DTE after reading DTE as 0).
4. DMA transfer (transfer of 64 bytes or less).
5. Write 1 to the UTRG0/EP2RDFN bit after the DMA transfer is completed.
6. Repeat steps 1 to 5 above.
64 bytes
64 bytes
Write 1 to
EP2RDFN
22 bytes
Write 1 to
EP2RDFN
Write 1 to
EP2RDFN
Figure 14.25 EP2RDFN Operation in UTRG0 (Auto-Request)
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Section 14 Universal Serial Bus (USB)
14.7
USB External Circuit Example
Figures 14.26 and 14.27 show the USB external circuit examples of this LIS.
USB
Internal transceiver
P36
VCC
*3 DrVCC
(3.3 V) VBUS (3.3 V)
USD+
VCC
(3.3 V)
1
Regulator *
USD-
24 Ω
DrVSS
24 Ω
VSS
UBPM
0: Bus-powered mode
VCC
*2
Pull-up
control external
circuit for
full speed
D+
1.5 kΩ
DGND
VBUS
(5 V)
USB connector
Notes: 1. Step-down to the operating voltage VCC (3.3 V) of this LSI.
2. To protect the LSI, voltage applicable IC such as HD74LV-A series must be used
even when the system power is turned off.
3. Prevent the VBUS pin from being affected by noise while USB is in communication.
Figure 14.26 USB External Circuit in Bus-Powered Mode
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Section 14 Universal Serial Bus (USB)
USB
Internal transceiver
VCC
*2
*3 DrVCC
P36 (3.3 V)IRQx VBUS (3.3 V) USD+ USD-
DrVSS
VSS
UBPM
VCC
VCC
3.3V
24 Ω
24 Ω
1: Self-powered mode
*1
VCC
*1
1.5 kΩ
Pull-up control
external circuit
for full speed
VBUS D+
(5 V)
D-
GND
USB connector
Notes: 1. To protect the LSI, voltage applicable IC such as HD74LV-A series must be used
even when the system power is turned off.
2. To cancel power-down mode by detecting the USB cable connection, theVBUS
signal must be connected to the IRQx pin. Note that power-down mode
state cannot be canceled by the USB interrupt EXIRQx.
3. Prevent the VBUS pin from being affected by noise while USB is in communication.
Figure 14.27 USB External Circuit in Self-Powered Mode
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Section 14 Universal Serial Bus (USB)
14.8
14.8.1
Usage Notes
Emulator Usage Notes
1. If UEDR0o and UEDR2 are displayed using the I/O register window function, or the like, the
EP0o FIFO or EP2 FIFO read pointer will not operate properly, preventing UEDR0o, UESZ0o,
UEDR2, and UESZ2 from being read correctly. Therefore, UEDR0o and UEDR2 should not
be displayed.
2. In the E6000, since the USB module is mounted on the external extended board and accessed
as an external module, there are some limitations as shown below. These limitations do not
apply to the E10A or to product chips.
• USB operation is not supported in the H8S/2218 Group’s mode 7 (single-chip mode).
• When using the USB module in the H8S/2218 Group’s mode 6 (on-chip ROM-enabled mode)
or the H8S/2212 Group’s mode 7 (single-chip mode), CS6 and A9 to A0 are input pins in the
initial status. Therefore, CS6 and A9 to A0 must be set as output pins (= B'0010) by setting
P72DDR to 1, AE3 to AE0 to B'0010, and PC7DDR to PC0DDR to H'FF before accessing the
USB module.
• When using the USB module in the H8S/2218 Group’s modes 4 and 5 (on-chip ROM-disabled
mode), CS6 and A9 to A8 must be set as output pins by setting P72DDR to 1 and AE3 to AE0
to B'0010.
14.8.2
Bus Interface
The USB module's interface is based on the bus specifications of external area 6. Accordingly,
before accessing the USB module, area 6 must be specified as having an 8-bit bus width and 3state access using the bus controller register.
Address H'C00100 to H'DFFFFF is for USB reserved area and thus access prohibited.
14.8.3
Operating Frequency
The main clock of this LSI must be 24 MHz or 16 MHz. This 24-MHz main clock, used as base
clock, is doubled in the on-chip PLL circuit or this 16-MHz main clock, also used as base clock, is
tripled in the on-chip PLL circuit, to generate the 48-MHz USB operating clock. Since the USB
module does not support medium-speed mode, sleep mode, watch mode, subactive mode, and
subsleep mode, make sure to use full-speed mode.
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Section 14 Universal Serial Bus (USB)
14.8.4
Setup Data Reception
The following must be noted for the EP0s FIFO used to receive 8-byte setup data. The USB is
designed to always receive setup commands. Accordingly, write from the UDC has higher priority
than read from the LSI. If the reception of the next setup command starts while the LSI is reading
data after completing reception, this data read from the LSI is forcibly cancelled and the next setup
command write starts. After the next setup command write, data read from the LSI is thus
undefined. Read operation is forcibly disabled because data cannot be guaranteed if DP-RAM used
as FIFO accesses the same address for write and read.
14.8.5
FIFO Clear
If the USB cable is disconnected during communication, old data may be contained in the FIFO.
Accordingly, FIFOs must be cleared immediately after USB cable connection. In addition, after
bus reset, all FIFOs must also be cleared. Note, however, that FIFOs that are currently used for
data transfer to or from the host must not be cleared.
14.8.6
IRQ6 Interrupt
A suspend/resume interrupt requested by IRQ6 must be specified as falling-edge sensitive.
14.8.7
Data Register Overread or Overwrite
When the CPU reads or writes to data registers, the following must be noted:
• Transmit data registers (UEDR0i, UEDR3, UEDR1)
Data to be written to the transmit data registers must be within the maximum packet size. For
the transmit data register of EP1 having a dual-FIFO configuration, data to be written at any
time must be within the maximum packet size. In this case, after a data write, the FIFO is
switched to the other FIFO, enabling an further data write, when the PKTE bit in UTRG0 is set
to 1. Accordingly, data of size corresponding to two FIFOs must not be written to the transmit
data registers at a time.
• Receive data registers (UEDR0o, UEDR2)
Receive data registers must not read a data size that is greater than the effective size of the read
data item. In other words, receive data registers must not read data with data size larger than
that specified by the receive data size register. For the receive data register of EP2 having a
dual-FIFO configuration, data to be read at any time must be within the maximum packet size.
In this case, after reading the currently selected FIFO, set the RDFN bit in UTRG to 1. This
switches the FIFO to the other FIFO and updates the receive data size, enabling the next data
read. In addition, if there is no receive data in a FIFO, data must not be read. Otherwise, the
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Section 14 Universal Serial Bus (USB)
pointer that controls the internal module FIFO is updated and correct operation cannot be
guaranteed.
14.8.8
Reset
⎯ The manual reset during USB communication operations must not be executed, since the
LSI may stop with the state of USD+ and USD- pins maintained.
This USB module uses synchronous reset for some registers. The reset state of these registers
must be cancelled after the clock oscillation stabilization time has passed. At initialization,
reset must be cancelled using the following procedure:
1. Cancel the USB module stop 1: Clear the USBSTOP1 bit in EXMDLSTP to 0.
2. Select the USB operating clock: Write 1 to the UCKS3 to UCKS0 bits in UCTLR.
3. Cancel the USB module stop 2: Clear the MSTPB0 bit in MSTPCRB to 0.
4. Wait for the USB operating clock stabilization: Wait until the CK48READY bit in UIFR3
is set to 1.
5. Cancel the USB interface reset state: Clear the UIFRST bit in UCTLR to 0.
6. Cancel the UDC core reset state: Clear the UDCRST bit in UCTLR to 0.
For details, see the flowcharts in section 14.5.1, Initialization and section 14.5.2, USB Cable
Connection/Disconnection.
⎯ The USB registers are not initialized when the watchdog timer (WDT) triggers a power-on
reset. Therefore, the USB may not operate properly after a power-on reset is triggered by
the WDT due to CPU runaway or a similar cause. (If a power-on reset is triggered by input
of a power-on reset signal from the RES pin, the USB registers are initialized and there is
no problem.) Consequently, an initialization routine should be used to write the initial
values listed below to the following three registers, thereby ensuring that all the USB
registers are properly initialized, immediately following a reset.
UCTLR = H'03, UIER3 = H'80, UIFR3 = H'00
14.8.9
EP0 Interrupt Sources Assignment
EP0 interrupt sources assigned to bits 3 to 0 in UIFR0 must be assigned to the same interrupt
signal (EXIRQx) by setting UISR0. There are no other restrictions on interrupt sources.
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Section 14 Universal Serial Bus (USB)
14.8.10 Level Shifter for VBUS and IRQx Pins
The VBUS and IRQx pins of this USB module must be connected to the USB connector’s VBUS
pin via a level shifter. This is because the USB module has a circuit that operates by detecting
USB cable connection or disconnection.
Even if the power of the device incorporating this USB module is turned off, 5-V power is applied
to the USB connector’s VBUS pin while the USB cable is connected to the device set. To protect
the LSI from destruction, use a level shifter such as the HD74LV-A Series, which allows voltage
application to the pin even when the power is off.
14.8.11 USB Endpoint Data Read and Write
To write data to an USB endpoint data register (UEDR0i, UEDR1, or UEDR3) on the transmit side
using a CPU word or longword transfer instruction, the size of data to be written must be smaller
than the size of data that is to be transmitted.
For example, when 7-byte data is transferred to the host, 8-byte data is sent to the host if data is
written twice by the longword transfer instructions or if data is written four times by the word
transfer instructions. To write 7-byte data correctly, data must be written once by a longword
transfer instruction, once by a word transfer instruction, and once by a byte transfer instruction, or
data must be written three times by a word transfer instruction and once by a byte transfer
instruction.
To read data from the USB endpoint data register (UEDR0o or UEDR2) on the receive side, the
correct size of data must be read. In this case, the data size is specified by the USB endpoint
receive size register (UESZ0o or UESZ2).
To execute DMA transfer on data in the USB endpoint data register using the on-chip DMAC,
byte transfer musts be used. In word transfer, odd-byte data cannot be transferred. Word transfer is
thus disabled.
14.8.12 Restrictions on Entering and Canceling Power-Down Mode
Before entering the power-down mode, set the USB module stop 2 state. The UDC core must not
be reset.
To access the USB module after canceling power-down mode, cancel the USB module stop 2 state
and wait for the USB operating clock (48 MHz) stabilization time.
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Section 14 Universal Serial Bus (USB)
Procedure to enter power-down mode
(1)
Specify IRQ6 to falling edge sensitive
(Set IRQ6E in IER to 1)
(Write IRQ6SCB and IRQ6SCA
in ISCRH to 01
(2)
Detect USB bus suspend state
USPND pin = High
(3)
IRQ6 = Low (falling edge output)
Set IRQ6F in ISR to 1
Set SPRSi and SPRSs in UIFR3 to 1
(4)
Confirm SPRSs in UIFR3 as 1
Clear IRQ6E in IER to 0*
Clear SPRSi in UIFR3 to 0
(5)
IRQ6 = High
(6)
Enter USB module stop 2 state
(Stop MSTPB0 in MSTPCRB to 1)
Procedure to cancel power-down mode
(10)
Detect USB bus resume
USPND pin = Low
(11)
IRQ6 = Low (falling edge output)
Set IRQ6F in ISR to 1
(12)
(13)
Cancel power-down mode
Wait for system clock stabilization time
(For external clok: 16 states min.)
(For crystal oscillator clock: 4 ms min.)
Enter active mode
(LSI internal clock starts oscillation)
(14)
(15)
Cancel USB module stop2 mode
(Clear MSTPB0 in MSTPCRB to 0)
(16)
(17)
USB module intenal clock operation starts
Wait 2 ms for USB operation clock
to stabilize
(Wait for CK48READY in UIFR3 is set to 1)
(7)
All USB module internal clocks stop
(8)
Mask all interrupts with LDC instruction, etc.*
Set IRQ6E in IER to 1*
Unmask all interrupts with LDC instruction, etc.*
Enter power-down mode*
(Execute SLEEP instruction)
(18)
(9)
Set SPRSi of UIFR3 to 1
Clear SPRSs of UIFR3 to 0
(19)
Clear SPRSi in UIFR3 to 0
(20)
IRQ6 = High
(21)
(22)
Set CK48READY in UIFR3 to 1
(USB operating clock stabilized)
(23)
(24)
Detect SOF packet
Set SOF of UIFR3 to 1
All LSI internal clocks stop
Guide to Flowchart Figures
: Indicates operations to be done
by firmware.
: Indicates operations to be
automatically done by hardware
in this LSI.
USB communication operations can be
restarted by using various USB registers
Note: * Interrupts should be masked from when the IRQ6 interrupt is received until the SLEEP instruction is executed.
Finally, unmask the interrupts using the LDC instruction or the like and execute the SLEEP instruction immediately
afterward.
Figure 14.28 Flowchart
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Section 14 Universal Serial Bus (USB)
USB bus state
(10)
Resume → Normal
(1) (2)
Normal Suspend
USPND
(23)
SOF
(10)
IRQ6
(3)
(5)
(11)
ISR/IRQ6F
(3)
(4)
(11)
UIFR3/SPRSi
(3)
(4)
(18)
(19)
UIFR3/SPRSs
(3)
(4)
(18)
(19)
(20)
(14)
UIFR3/SOF
USB module
stop
power-down mode
(24)
(15)
(6)
(8)
(12)
System clock
(9)
φ
USB internal
clock
(13)
(14)
(9)
(7)
(16)
UIFR3/
CK48READY
(21)
CLK48
(48MHz)
(7)
USB operating
clock (48MHz)
(7)
(17)
(22)
Power-down
mode
4 ms
wait for
oscillator
to stabilize
2 ms wait
for USB
operation
clock
to stabilize
USB operation
resumes
USB module stop state
Figure 14.29 Timing Chart
14.8.13 USB External Circuit Example
The USB external circuit examples are used for reference only. In actual board design, carefully
check the system operation.
In addition, the USB external circuit examples cannot guarantee the correct system operation. The
user must individually take measures against external surges or ESD noise by incorporating
protective diodes or other components if necessary.
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Section 14 Universal Serial Bus (USB)
14.8.14 Pin Processing when USB Not Used
Pin processing should be performed as follows.
DrVCC = VCC, DrVSS = 0 V, USD+ = USD− = USPND = open state, VBUS = UBPM = 0 V
14.8.15 Notes on TR Interrupt
Note the following when using the transfer request interrupt (TR interrupt) for IN transfer to EP0i,
EP1, or EP3.
The TR interrupt flag is set if the FIFO for the target EP has no data when the IN token is sent
from the USB host. However, at the timing shown in figure 14.30, multiple TR interrupts occur
successively. Take appropriate measures against malfunction in such a case.
Note: This module determines whether to return NAK if the FIFO of the target EP has no data
when receiving the IN token, but the TR interrupt flag is set only after a NAK handshake
is sent. If the next IN token is sent before PKTE of UTRG0 is written to, the TR interrupt
flag is set again.
TR interrupt routine
Clear
TR flag
CPU
Host
USB
TR interrupt routine
Writes
UTRG0/
transmit data PKTE
IN token
IN token
Determines whether
to return NAK
Determines whether
to return NAK
NAK
IN token
Transmits data
NAK
Sets TR flag
Sets TR flag
(Sets the flag again)
ACK
Figure 14.30 TR Interrupt Flag Set Timing
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Section 14 Universal Serial Bus (USB)
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Section 15 A/D Converter
Section 15 A/D Converter
This LSI includes a successive approximation type 10-bit A/D converter that allows up to six
analog input channels to be selected. The block diagram of the A/D converter is shown in figure
15.1.
15.1
Features
• 10-bit resolution
• Six input channels
• Conversion time: 8.1 µs per channel (at 16-MHz operation), 10.7 µs per channel (at 24-MHz
operation), 21.8 µs per channel (at 6-MHz operation)
• Two operating modes
⎯ Single mode: Single-channel A/D conversion
⎯ Scan mode: Continuous A/D conversion on 1 to 4 channels
• Four data registers
⎯ Conversion results are held in a 16-bit data register for each channel
• Sample and hold function
• Three methods conversion start
⎯ Software
⎯ Timer (TPU) conversion start trigger
⎯ External trigger signal (ADTRG)
• Interrupt request
⎯ An A/D conversion end interrupt request (ADI) can be generated
• Module stop mode can be set
• Settable analog conversion voltage range
Analog conversion voltage range settable using the reference voltage pin (Vref) as the
reference voltage
ADCMS34A_000120011200
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Section 15 A/D Converter
Bus interface
Module data bus
VCC
Successive
approximation register
10 bit D/A
Vref
A
D
D
R
A
A
D
D
R
B
A
D
D
R
C
A
D
D
R
D
A
D
C
S
R
Internal data bus
A
D
C
R
+
AN0
AN2
AN3
AN14
φ/2
Multiplexer
AN1
AN15
Comparator
φ/4
Control circuit
φ/8
φ/16
Sample and
hold circuit
ADI interrupt signal
ADTRG
Time conversion start trigger from TPU
Off during A/D conversion standby
On during A/D conversion
VSS
Legend:
ADCR:
ADCSR:
ADDRA:
ADDRB:
ADDRC:
ADDRD:
A/D control register
A/D control/status register
A/D data register A
A/D data register B
A/D data register C
A/D data register D
Figure 15.1 Block Diagram of A/D Converter
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Section 15 A/D Converter
15.2
Input/Output Pins
Table 15.1 summarizes the input pins used by the A/D converter. The AN0 to AN3 and AN14 to
AN15 pins are analog input pins. The VCC and VSS pins are the power supply pins for the
analog block in the A/D converter. The Vref pin is the reference voltage pin for the A/D
conversion.
Table 15.1 Pin Configuration
Pin Name
Symbol
I/O
Function
Power supply pin
VCC
Input
Analog block power supply and reference voltage
(also used for digital block)
Ground pin
VSS
Input
Analog block ground and reference voltage
(also used for digital block)
Reference voltage pin
Vref
Input
Reference voltage pin for A/D conversion
Analog input pin 0
AN0
Input
Analog input pins
Analog input pin 1
AN1
Input
Analog input pin 2
AN2
Input
Analog input pin 3
AN3
Input
Analog input pin 14
AN14
Input
Analog input pin 15
AN15
Input
A/D external trigger
input pin
ADTRG
Input
15.3
External trigger input pin for starting A/D
conversion
Register Descriptions
The A/D converter has the following registers.
• A/D data register A (ADDRA)
• A/D data register B (ADDRB)
• A/D data register C (ADDRC)
• A/D data register D (ADDRD)
• A/D control/status register (ADCSR)
• A/D control register (ADCR)
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Section 15 A/D Converter
15.3.1
A/D Data Registers A to D (ADDRA to ADDRD)
There are four 16-bit read-only ADDR registers; ADDRA to ADDRD, used to store the results of
A/D conversion. The ADDR registers, which store a conversion result for each channel, are
shown in table 15.2.
The converted 10-bit data is stored in bits 6 to 15. The lower 6 bits are always read as 0.
The data bus between the CPU and the A/D converter is 8 bits wide. The upper byte can be read
directly from the CPU, however the lower byte should be read via a temporary register. The
temporary register contents are transferred from the ADDR when the upper byte data is read.
When reading the ADDR, read the upper byte before the lower byte, or read in word unit. The
initial value of the ADDR is H'0000.
Table 15.2 Analog Input Channels and Corresponding ADDR Registers
Analog Input Channel
A/D Data Register to Be Stored the Results of A/D Conversion
AN0
ADDRA
AN1
ADDRB
AN2, AN14
ADDRC
AN3, AN15
ADDRD
15.3.2
A/D Control/Status Register (ADCSR)
ADCSR controls A/D conversion operations.
Bit
Bit Name Initial Value
R/W
7
ADF
R/(W)* A/D End Flag
0
Description
A status flag that indicates the end of A/D conversion.
[Setting conditions]
•
When A/D conversion ends in single mode
•
When A/D conversion ends on all channels
specified in scan mode
[Clearing conditions]
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•
When 0 is written after reading ADF = 1
•
When DMAC is activated by an ADI interrupt and
ADDR is read
Section 15 A/D Converter
Bit
Bit Name Initial Value
R/W
Description
6
ADIE
R/W
A/D Interrupt Enable
0
A/D conversion end interrupt (ADI) request enabled
when 1 is set.
5
ADST
0
R/W
A/D Start
Clearing this bit to 0 stops A/D conversion, and the A/D
converter enters the wait state.
Setting this bit to 1 starts A/D conversion. It can be set to
1 by software, the timer conversion start trigger, and the
A/D external trigger (ADTRG). In single mode, this bit is
cleared to 0 automatically when conversion on the
specified channel is complete. In scan mode, conversion
continues sequentially on the specified channels until
this bit is cleared to 0 by software, a reset, a transition to
standby mode, or module stop mode.
4
SCAN
0
R/W
Scan Mode
Selects single mode or scan mode as the A/D
conversion operating mode.
0: Single mode
1: Scan mode
3
CH3
0
R/W
Channel Select 3 to 0
2
CH2
0
R/W
Select analog input channels.
1
CH1
0
R/W
When SCAN = 0
When SCAN = 1
0
CH0
0
R/W
0000: AN0
0000: AN0
0001: AN1
0001: AN0 to AN1
0010: AN2
0010: AN0 to AN2
0011: AN3
0011: AN0 to AN3
01××: Setting prohibited
01xx: Setting prohibited
10××: Setting prohibited
1xxx: Setting prohibited
11××: Setting prohibited
1110: AN14
1111: AN15
Legend:
×: Don’t care
Note: * The write value should always be 0 to clear this flag.
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Section 15 A/D Converter
15.3.3
A/D Control Register (ADCR)
The ADCR enables A/D conversion started by an external trigger signal.
Bit
Bit Name Initial Value
R/W
Description
7
TRGS1
0
R/W
Timer Trigger Select 1 and 0
6
TRGS0
0
R/W
Enables the start of A/D conversion by a trigger signal.
Only set bits TRGS1 and TRGS0 while conversion is
stopped (ADST = 0).
00: A/D conversion start by software
01: A/D conversion start by TPU
10: Setting prohibited
11: A/D conversion start by external trigger pin
(ADTRG)
5, 4
—
All 1
—
Reserved
These bits are always read as 1 cannot be modified.
3
CKS1
0
R/W
Clock Select 1 and 0
2
CKS0
0
R/W
These bits specify the A/D conversion time. The
conversion time should be changed only when ADST =
0.
00: Conversion time = 530 states (Max.)
01: Conversion time = 266 states (Max.)
10: Conversion time = 134 states (Max.)
11:
Conversion time = 68 states (Max.)
The conversion time setting should exceed the
conversion time shown in section 22.6, A/D Converter
Characteristics.
1, 0
—
All 1
—
Reserved
These bits are always read as 1, and only 1 should be
written to them.
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Section 15 A/D Converter
15.4
Interface to Bus Master
ADDRA to ADDRD are 16-bit registers. As the data bus to the bus master is 8 bits wide, the bus
master accesses to the upper byte of the registers directly while to the lower byte of the registers
via the temporary register (TEMP).
Data in ADDR is read in the following way: When the upper-byte data is read, the upper-byte data
will be transferred to the CPU and the lower-byte data will be transferred to TEMP. Then, when
the lower-byte data is read, the lower-byte data will be transferred to the CPU.
When data in ADDR is read, the data should be read from the upper byte and lower byte in the
order. When only the upper-byte data is read, the data is guaranteed. However, when only the
lower-byte data is read, the data is not guaranteed.
Figure 15.2 shows data flow when accessing to ADDR.
Read the upper byte
Bus master
(H'AA)
Module data bus
Bus interface
TEMP
(H'40)
ADDRnH
(H'AA)
ADDRnL
(H'40)
(n = A to D)
Read the lower byte
Bus master
(H'40)
Module data bus
Bus interface
TEMP
(H'40)
ADDRnH
(H'AA)
ADDRnL
(H'40)
(n = A to D)
Figure 15.2 Access to ADDR (When Reading H'AA40)
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Section 15 A/D Converter
15.5
Operation
The A/D converter operates by successive approximation with 10-bit resolution. It has two
operating modes; single mode and scan mode. When changing the operating mode or analog input
channel, in order to prevent incorrect operation, first clear the bit ADST to 0 in ADCSR. The
ADST bit can be set at the same time as the operating mode or analog input channel is changed.
15.5.1
Single Mode
In single mode, A/D conversion is to be performed only once on the specified single channel. The
operations are as follows.
1. A/D conversion is started when the ADST bit is set to 1, according to software or external
trigger input.
2. When A/D conversion is completed, the result is transferred to the corresponding A/D data
register to the channel.
3. On completion of conversion, the ADF bit in ADCSR is set to 1. If the ADIE bit is set to 1 at
this time, an ADI interrupt request is generated.
4. The ADST bit remains set to 1 during A/D conversion. When A/D conversion ends, the ADST
bit is automatically cleared to 0 and the A/D converter enters the wait state.
Set*
ADIE
ADST
A/D
conversion
starts
Set*
Set*
Clear*
ADF
State of channel 0 (AN0)
Clear*
Idle
State of channel 1 (AN1)
Idle
State of channel 2 (AN2)
Idle
State of channel 3 (AN3)
Idle
A/D conversion 1
Idle
A/D conversion 2
Idle
ADDRA
Read conversion result*
ADDRB
A/D conversion result 1
Read conversion result*
A/D conversion result 2
ADDRC
ADDRD
Note: * Vertical arrows ( ) indicate instructions executed by software.
Figure 15.3 A/D Conversion Timing (Single-Chip Mode, Channel 1 Selected)
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Section 15 A/D Converter
15.5.2
Scan Mode
In scan mode, A/D conversion is to be performed sequentially on the specified channels (four
channels maximum). The operations are as follows.
1. When the ADST bit is set to 1 by software, TPU or external trigger input, A/D conversion
starts on the first channel in the group (AN0 when CH3 and CH2 = 00, AN4 when CH3 and
CH2 = 01, or AN8 when CH3 and CH2 = 10).
2. When A/D conversion for each channel is completed, the result is sequentially transferred to
the A/D data register corresponding to each channel.
3. When conversion of all the selected channels is completed, the ADF flag is set to 1. If the
ADIE bit is set to 1 at this time, an ADI interrupt is requested after A/D conversion ends.
Conversion of the first channel in the group starts again.
4. Steps 2 to 3 are repeated as long as the ADST bit remains set to 1. When the ADST bit is
cleared to 0, A/D conversion stops.
Continuous A/D conversion execution
Clear*1
Set*1
ADST
ADF
Clear*1
A/D conversion time
State of
channel 0 (AN0)
State of
channel 1 (AN1)
State of
channel 2 (AN2)
State of
channel 3 (AN3)
ADDRA
Idle
Idle
A/D conversion 1
Idle
A/D conversion 2
Idle
Idle
Idle
A/D conversion 4
A/D conversion 5*2
Idle
Idle
A/D conversion 3
Idle
Transfer
A/D conversion result 1
ADDRB
A/D conversion result 4
A/D conversion result 2
ADDRC
A/D conversion result 3
ADDRD
Notes: 1. Vertical arrows ( ) indicate instructions executed by software.
2. Data currently being converted is ignored.
Figure 15.4 A/D Conversion Timing (Scan Mode, Channels AN0 to AN2 Selected)
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Section 15 A/D Converter
15.5.3
Input Sampling and A/D Conversion Time
The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog
input when the A/D conversion start delay time (tD) has passed after the ADST bit is set to 1, then
starts conversion. Figure 15.5 shows the A/D conversion timing. Tables 15.3 and 15.4 show the
A/D conversion time.
As indicated in figure 15.5, the A/D conversion time (tCONV) includes tD and the input sampling
time (tSPL). The length of tD varies depending on the timing of the write access to ADCSR. The
total conversion time therefore varies within the ranges indicated in table 15.4.
In scan mode, the values given in table 15.4 apply to the first conversion time. The values given in
table 15.3 apply to the second and subsequent conversions.
(1)
φ
Address
(2)
Write signal
Input sampling
timing
ADF
tD
Legend:
(1):
ADCSR write cycle
(2):
ADCSR address
tD:
A/D conversion start delay
tSPL: Input sampling time
tCONV: A/D conversion time
tSPL
tCONV
Figure 15.5 A/D Conversion Timing
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Section 15 A/D Converter
Table 15.3 A/D Conversion Time (Single Mode)
CKS1 = 0
CKS0 = 0
CKS1 = 1
CKS0 = 1
CKS0 = 0
CKS0 = 1
Item
Symbol
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
A/D conversion start
delay
tD
18
—
33
10
—
17
6
—
9
4
—
5
Input sampling time
tSPL
—
127
—
—
63
—
—
31
—
—
15
—
A/D conversion time
tCONV
515
—
530
259
—
266
131
—
134
67
—
68
Note: All values represent the number of states.
Table 15.4 A/D Conversion Time (Scan Mode)
CKS1
CKS0
Conversion Time (State)
0
0
512 (Fixed)
1
256 (Fixed)
0
128 (Fixed)
1
64 (Fixed)
1
15.5.4
External Trigger Input Timing
A/D conversion can be externally triggered. When the TRGS0 and TRGS1 bits are set to 11 in
ADCR, external trigger input is enabled at the ADTRG pin. A falling edge at the ADTRG pin sets
the ADST bit to 1 in ADCSR, starting A/D conversion. Other operations, in both single and scan
modes, are the same as when the bit ADST has been set to 1 by software. Figure 15.6 shows the
timing.
φ
ADTRG
Internal trigger signal
ADST
A/D conversion
Figure 15.6 External Trigger Input Timing
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Section 15 A/D Converter
15.6
Interrupts
The A/D converter generates an A/D conversion end interrupt (ADI) at the end of A/D conversion.
Setting the ADIE bit to 1 enables ADI interrupt requests while the bit ADF in ADCSR is set to 1
after A/D conversion is completed. The DMAC can be activated by an ADI interrupt.
Table 15.5 A/D Converter Interrupt Source
Name
Interrupt Source
Interrupt Source Flag DMAC Activation
ADI
A/D conversion completed ADF
15.7
A/D Conversion Precision Definitions
Possible
This LSI’s A/D conversion precision definitions are given below.
• Resolution
The number of A/D converter digital output codes
• Quantization error
The deviation inherent in the A/D converter, given by 1/2 LSB (see figure 15.7).
• Offset error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from the minimum voltage value B'0000000000 (H'000) to
B'0000000001 (H'001) (see figure 15.8).
• Full-scale error
The deviation of the analog input voltage value from the ideal A/D conversion characteristic
when the digital output changes from B'1111111110 (H'3FE) to B'1111111111 (H'3FF) (see
figure 15.8).
• Nonlinearity error
The error with respect to the ideal A/D conversion characteristic between zero voltage and fullscale voltage. Does not include offset error, full-scale error, or quantization error (see figure
15.8).
• Absolute precision
The deviation between the digital value and the analog input value. Includes offset error, fullscale error, quantization error, and nonlinearity error.
Rev.6.00 Jun. 03, 2008 Page 546 of 698
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Section 15 A/D Converter
Digital output
Ideal A/D conversion
characteristic
111
110
101
100
011
010
Quantization error
001
000
1
2
1024 1024
1022 1023 FS
1024 1024
Analog
input voltage
Figure 15.7 A/D Conversion Precision Definitions (1)
Full-scale error
Digital output
Ideal A/D conversion
characteristic
Nonlinearity
error
Actual A/D conversion
characteristic
FS
Offset error
Analog
input voltage
Figure 15.8 A/D Conversion Precision Definitions (2)
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Section 15 A/D Converter
15.8
Usage Notes
15.8.1
Module Stop Mode Setting
Operation of the A/D converter can be disabled or enabled using the module stop control register.
The initial setting is for operation of the A/D converter to be halted. Register access is enabled by
clearing module stop mode. For details, refer to section 20, Power-Down Modes.
15.8.2
Permissible Signal Source Impedance
This LSI's analog input is designed such that conversion precision is guaranteed for an input signal
for which the signal source impedance is 5 kΩ or less. This specification is provided to enable the
A/D converter’s sample-and-hold circuit input capacitance to be charged within the sampling time;
if the sensor output impedance exceeds 5 kΩ, charging may be insufficient and it may not be
possible to guarantee A/D conversion precision. However, for A/D conversion in single mode with
a large capacitance provided externally, the input load will essentially comprise only the internal
input resistance of 10 kΩ, and the signal source impedance is ignored. However, as a low-pass
filter effect is obtained in this case, it may not be possible to follow an analog signal with a large
differential coefficient (e.g., 5 mV/Ωs or greater) (see figure 15.9). When converting a high-speed
analog signal, a low-impedance buffer should be inserted.
15.8.3
Influences on Absolute Precision
Adding capacitance results in coupling with GND, and therefore noise in GND may adversely
affect absolute precision. Be sure to make the connection to an electrically stable GND such as
AVSS.
Care is also required to insure that filter circuits do not communicate with digital signals on the
mounting board (i.e., acting as antennas).
This LSI
Sensor output
impedance
to 5 kΩ
A/D converter
equivalent circuit
10 kΩ
Sensor input
Low-pass
filter C
to 0.1 μF
Cin =
15 pF
Figure 15.9 Example of Analog Input Circuit
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20 pF
Section 15 A/D Converter
15.8.4
Range of Analog Power Supply and Other Pin Settings
If the conditions below are not met, the reliability of the device may be adversely affected.
• Analog input voltage range
The voltage applied to analog input pin ANn during A/D conversion should be in the range
VSS ≤ ANn ≤ Vref.
• Vref input range
The analog reference voltage input at the Vref pin set is the range Vref ≤ Vcc.
15.8.5
Notes on Board Design
Careful consideration is required in board design for noise countermeasures and in order to prevent
damage due to abnormal voltage, such as an excessive surge at the analog input pins (AN0 to AN3
or AN14 to AN15) and analog reference voltage pin (Vref).
Table 15.6 Analog Pin Specifications
Item
Min.
Max.
Unit
Analog input capacitance
—
20
pF
Permissible signal source impedance
—
5*
kΩ
Note: * Vcc = 2.7 to 3.6 V
10 kΩ
ANn
To A/D converter
20 pF
Note: Values are reference values.
Figure 15.10 Analog Input Pin Equivalent Circuit
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Section 15 A/D Converter
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Section 16 RAM
Section 16 RAM
The H8S/2218 and H8S/2212 have 12 kbytes of on-chip high-speed static RAM. The H8S/2217
and H8S/2211 have 8 kbytes of on-chip high-speed static RAM. The H8S/2210 and H8S/2210S
has 4 kbytes of on-chip high-speed static RAM. The RAM is connected to the CPU by a 16-bit
data bus, enabling one-state access by the CPU to both byte data and word data. This makes it
possible to perform fast word data transfer.
The on-chip RAM can be enabled or disabled by means of the RAM enable bit (RAME) in the
system control register (SYSCR). For details on SYSCR, refer to section 3.2.2, System Control
Register (SYSCR).
Product Class
H8S/2218
Group
HD64F2218
ROM Type
RAM Size
RAM Address
Flash memory Version
12 kbytes
H'FFC000 to H'FFEFBF
HD64F2218U
HD6432217
H'FFFFC0 to H'FFFFFF
Masked ROM Version
8 kbytes
H'FFD000 to H'FFEFBF
H'FFFFC0 to H'FFFFFF
H8S/2212
Group
HDF64F2212
Flash memory Version
12 kbytes
HDF64F2212U
H'FFFFC0 to H'FFFFFF
HD64F2211
8 kbytes
HD64F2211U
HD6432211
H'FFC000 to H'FFEFBF
H'FFD000 to H'FFEFBF
H'FFFFC0 to H'FFFFFF
Masked ROM Version
8 kbytes
H'FFD000 to H'FFEFBF
H'FFFFC0 to H'FFFFFF
HD6432210
HD6432210S
4 kbytes
H'FFE000 to H'FFEFBF
H'FFFFC0 to H'FFFFFF
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Section 16 RAM
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Section 17 Flash Memory (F-ZTAT Version)
Section 17 Flash Memory (F-ZTAT Version)
The features of the on-chip flash memory are summarized below. The block diagram of the flash
memory is shown in figure 17.1.
17.1
Features
• Size:
Product Class
H8S/2218 Group
HD64F2218, HD64F2218U
H8S/2212 Group
HD64F2212, HD64F2212U
HD64F2211, HD64F2211U
ROM Size
ROM Address
128 kbytes
H'000000 to H'01FFFF
(Modes 6 and 7)
H'000000 to H'01FFFF
(Mode 7)
64 kbytes
H'000000 to H'00FFFF
(Mode 7)
• Programming/erase methods
⎯ The flash memory is programmed 128 bytes at a time. Erase is performed in single-block
units. The flash memory is configured as follows: 32 kbytes × 2 blocks, 28 kbytes × 1
block, 16 kbytes × 8 blocks, 8 kbytes × 1 block, and 1 kbyte × 4 blocks. To erase the entire
flash memory, each block must be erased in turn.
• Reprogramming capability
⎯ Flash memory can be reprogrammed a minimum of 100 times.
• Two flash memory operating modes
⎯ Boot mode
SCI boot mode: HD64F2218, HD64F2212, and HD64F2211
USB boot mode: HD64F2218U, HD64F2212U, and HD64F2211U
⎯ User program mode
On-board programming/erasing can be done in boot mode in which the boot program built
into the chip is started for erase or programming of the entire flash memory. In normal user
program mode, individual blocks can be erased or programmed.
• Automatic bit rate adjustment
⎯ With data transfer in SCI boot mode, this LSI's bit rate can be automatically adjusted to
match the transfer bit rate of the host.
• Programming/erasing protection
⎯ Sets hardware protection, software protection, and error protection against flash memory
programming/erasing.
Rev.6.00 Jun. 03, 2008 Page 553 of 698
REJ09B0074-0600
Section 17 Flash Memory (F-ZTAT Version)
• Programmer mode
⎯ Flash memory can be programmed/erased in programmer mode, using a PROM
programmer, as well as in on-board programming mode.
• Flash memory emulation in RAM
⎯ Flash memory programming can be emulated in real time by overlapping a part of RAM
onto flash memory.
Internal data bus (upper 8 bits)
Module bus
Internal data bus (lower 8 bits)
FLMCR1
FLMCR2
EBR1
Bus interface/controller
Operating
mode
EBR2
FWE pin
Mode pins
(MD2 to MD0)
PF3, PF0, P16, P14
RAMER
H'000000
H'000002
H'000001
H'000003
Flash memory*
(128 kbytes)
H'01FFFE
Legend:
FLMCR1:
FLMCR2:
EBR1:
EBR2:
RAMER:
H'01FFFF
Flash memory control register 1
Flash memory control register 2
Erase block register 1
Erase block register 2
RAM emulation register
Note: * 128 kbytes in the HD64F2218, HD64F2218U, HD64F2212, and HD64F2212U;
64 kbytes in the HD64F2211 and HD64F2211U.
Figure 17.1 Block Diagram of Flash Memory
17.2
Mode Transitions
When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, this
LSI enters an operating mode as shown in figure 17.2. In user mode, flash memory can be read but
not programmed or erased. The boot and user program modes are provided as modes to write and
erase the flash memory.
The differences between boot mode and user program mode are shown in table 17.1. Boot mode
and user program mode operations are shown in figures 17.3 and 17.4, respectively.
Rev.6.00 Jun. 03, 2008 Page 554 of 698
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Section 17 Flash Memory (F-ZTAT Version)
MD2 to 0 = 11x,
FWE = 0
*1
User mode
(on-chip ROM
enabled)
FWE = 1
Reset state
RES = 0
FWE = 0
RES = 0
RES = 0
MD2 to 0 = 11x,
FWE = 1
MD2 to 0 = 01x,
FWE = 1
*2
RES = 0
Programmer
mode
*1
User
program mode
SCI, USB
boot mode
On-board programming mode
Notes: Only make a transition between user mode and user program mode when the CPU is
not accessing the flash memory.
1. RAM emulation possible
2. MD2 to MD0 = 000, PF3, PF0, P16, P14 = 1100
Figure 17.2 Flash Memory State Transitions
Table 17.1 Differences between Boot Mode and User Program Mode
SCI, USB Boot Mode
User Program Mode
User Mode
Total erase
Yes
Yes
No
Block erase
No
Yes
No
Programming control
program*
Program/program-verify Erase/erase-verify
—
Program/program-verify
Emulation
Note: * To be provided by the user, in accordance with the recommended algorithm.
Rev.6.00 Jun. 03, 2008 Page 555 of 698
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Section 17 Flash Memory (F-ZTAT Version)
1. Initial state
The old program version or data remains written
in the flash memory. The user should prepare the
programming control program and new
application program beforehand in the host.
2. Programming control program transfer
When boot mode is entered, the boot program in
this LSI (originally incorporated in the chip) is
started and the programming control program in
the host is transferred to RAM via SCI or USB
communication. The boot program required for
flash memory erasing is automatically transferred
to the RAM boot program area.
Host
Host
Programming control
program
New application
program
New application
program
This LSI
This LSI
SCI
or USB
Boot program
Flash memory
SCI
or USB
Boot program
Flash memory
RAM
RAM
Boot program area
Application program
(old version)
Application program
(old version)
3. Flash memory initialization
The erase program in the boot program area (in
RAM) is executed, and the flash memory is
initialized (to H'FF). In boot mode, total flash
memory erasure is performed, without regard to
blocks.
Host
Programming control
program
4. Writing new application program
The programming control program transferred
from the host to RAM is executed, and the new
application program in the host is written into the
flash memory.
Host
New application
program
This LSI
This LSI
Boot program
Flash memory
SCI
or USB
RAM
Boot program
Flash memory
Boot program area
Flash memory
preprogramming
erase
Programming control
program
SCI
or USB
RAM
Boot program area
New application
program
Programming control
program
Program execution state
Figure 17.3 Boot Mode (Sample)
Rev.6.00 Jun. 03, 2008 Page 556 of 698
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Section 17 Flash Memory (F-ZTAT Version)
1. Initial state
The FWE assessment program that confirms that
user program mode has been entered, and the
program that will transfer the programming/erase
control program from flash memory to on-chip
RAM should be written into the flash memory by
the user beforehand. The programming/erase
control program should be prepared in the host
or in the flash memory.
2. Programming/erase control program transfer
When user program mode is entered, user
software confirms this fact, executes transfer
program in the flash memory, and transfers the
programming/erase control program to RAM.
Host
Host
Programming/
erase control program
New application
program
New application
program
This LSI
This LSI
SCI
or USB
Boot program
Flash memory
SCI
or USB
Boot program
Flash memory
RAM
FWE assessment
program
Transfer program
RAM
FWE assessment
program
Transfer program
Programming/
erase control program
Application program
(old version)
Application program
(old version)
3. Flash memory initialization
The programming/erase program in RAM is
executed, and the flash memory is initialized (to
H'FF). Erasing can be performed in block units,
but not in byte units.
4. Writing new application program
Next, the new application program in the host is
written into the erased flash memory blocks. Do
not write to unerased blocks.
Host
Host
New application
program
This LSI
This LSI
SCI
or USB
Boot program
Flash memory
RAM
FWE assessment
program
Transfer program
Boot program
Flash memory
RAM
FWE assessment
program
Transfer program
Programming/
erase control program
Flash memory
erase
SCI
or USB
Programming/
erase control program
New application
program
Program execution state
Figure 17.4 User Program Mode (Sample)
Rev.6.00 Jun. 03, 2008 Page 557 of 698
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Section 17 Flash Memory (F-ZTAT Version)
17.3
Block Configuration
Figure 17.5 shows the block configuration of 128-kbyte flash memory in the HD64F2218,
HD64F2218U, HD64F2212, and HD64F2212U. The thick lines indicate erasing units, the narrow
lines indicate programming units, and the values are addresses. The flash memory is divided into
one kbyte (four blocks), 28 kbytes (one block), 16 kbytes (one block), eight kbytes (two blocks),
and 32 kbytes (two blocks). Erasing is performed in these divided units. Programming is
performed in 128-byte units starting from an address whose lower eight bits are H'00 or H'80.
EB0
Erase unit
1 kbyte
H'000000
H'000001
H'000002
H'000380
H'000381
H'000382
EB1
Erase unit
1 kbyte
H'000400
H'000401
H'000402
H'000780
H'000781
H'000782
EB2
Erase unit
1 kbyte
H'000800
H'000801
H'000802
Programming unit: 128 bytes
H'000B80
H'000C00
H'000B81
H'000C01
H'000B82
H'000C02
Programming unit: 128 bytes
EB3
Erase unit
1 kbyte
EB4
Erase unit
28 kbytes
EB5
Erase unit
16 kbytes
EB6
Erase unit
8 kbytes
H'000F80
H'000F81
H'000F82
H'001000
H'001001
H'001002
Programming unit: 128 bytes
H'00007F
H'0003FF
Programming unit: 128 bytes
H'00047F
H'0007FF
H'00087F
H'000BFF
H'000C7F
H'000FFF
Programming unit: 128 bytes
H'00107F
H'007FFF
H'007F80
H'007F81
H'007F82
H'008000
H'008001
H'008002
Programming unit: 128 bytes
H'00BF80
H'00C000
H'00BF81
H'00C001
H'00BF82
H'00C002
Programming unit: 128 bytes
H'00C07F
Programming unit: 128 bytes
H'00DFFF
H'00E07F
H'00DF80
H'00DF81
H'00DF82
EB7
Erase unit
8 kbytes
H'00E000
H'00E001
H'00E002
H'00FF80
H'00FF81
H'00FF82
EB8
Erase unit
32 kbytes
H'010000
H'010001
H'010002
H'017F80
H'017F81
H'017F82
EB9
Erase unit
32 kbytes
H'018000
H'018001
H'018002
H'01FF80
H'01FF81
H'01FF82
H'00BFFF
H'00FFFF
Programming unit: 128 bytes
H'01007F
H'017FFF
Programming unit: 128 bytes
Figure 17.5 Flash Memory Block Configuration
(HD64F2218, HD64F2218U, HD64F2212, HD64F2212U)
Rev.6.00 Jun. 03, 2008 Page 558 of 698
REJ09B0074-0600
H'00807F
H'01807F
H'01FFFF
Section 17 Flash Memory (F-ZTAT Version)
Figure 17.6 shows the block configuration of 64-kbyte flash memory in the HD64F2211 and
HD64F2211U. The thick lines indicate erasing units, the narrow lines indicate programming units,
and the values are addresses. The flash memory is divided into one kbyte (four blocks), 28 kbytes
(one block), and 16 kbytes (one block), eight kbytes (two blocks). Erasing is performed in these
divided units. Programming is performed in 128-byte units starting from an address whose lower
eight bits are H'00 or H'80.
EB0
Erase unit
1 kbyte
H'000000
H'000001
H'000002
H'000380
H'000381
H'000382
EB1
Erase unit
1 kbyte
H'000400
H'000401
H'000402
H'000780
H'000781
H'000782
EB2
Erase unit
1 kbyte
H'000800
H'000801
H'000802
Programming unit: 128 bytes
H'000B80
H'000C00
H'000B81
H'000C01
H'000B82
H'000C02
Programming unit: 128 bytes
EB3
Erase unit
1 kbyte
EB4
Erase unit
28 kbytes
EB5
Erase unit
16 kbytes
EB6
Erase unit
8 kbytes
EB7
Erase unit
8 kbytes
H'000F80
H'000F81
H'000F82
H'001000
H'001001
H'001002
Programming unit: 128 bytes
H'00007F
H'0003FF
Programming unit: 128 bytes
H'00047F
H'0007FF
H'00087F
H'000BFF
H'000C7F
H'000FFF
Programming unit: 128 bytes
H'00107F
H'007FFF
H'007F80
H'007F81
H'007F82
H'008000
H'008001
H'008002
Programming unit: 128 bytes
H'00BF80
H'00C000
H'00BF81
H'00C001
H'00BF82
H'00C002
Programming unit: 128 bytes
H'00C07F
Programming unit: 128 bytes
H'00DFFF
H'00E07F
H'00DF80
H'00DF81
H'00DF82
H'00E000
H'00E001
H'00E002
H'00FF80
H'00FF81
H'00FF82
H'00807F
H'00BFFF
H'00FFFF
Figure 17.6 Flash Memory Block Configuration
(HD64F2211, HD64F2211U)
Rev.6.00 Jun. 03, 2008 Page 559 of 698
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Section 17 Flash Memory (F-ZTAT Version)
17.4
Input/Output Pins
The flash memory is controlled by means of the pins shown in table 17.2.
Table 17.2 Pin Configuration
Pin Name
I/O
Function
RES
Input
Reset
FWE
Input
Flash program/erase protection by hardware
MD2, MD1, MD0
Input
Sets this LSI's operating mode
PF3, PF0, P16,
P14
Input
Sets this LSI's operating mode in programmer
mode
EMLE
Input
Emulator enable
TxD2
Output
Serial transmit data output
RxD2
Input
Serial receive data input
USD+, USD−
Input/output
USB data input/output
VBUS
Input
USB cable connect/cut detect
UBPM
Input
USB bus power mode/self power mode select
USPND
Output
USB suspend output
P36 (PUPD+)
Output
D+ pull-up control
17.5
All
HD64F2218,
HD64F2212,
HD64F2211
HD64F2218U,
HD64F2212U,
HD64F2211U
Register Descriptions
The flash memory has the following registers. For details on register addresses and register states
during each processing, refer to section 21, List of Registers.
• Flash memory control register 1 (FLMCR1)
• Flash memory control register 2 (FLMCR2)
• Erase block register 1 (EBR1)
• Erase block register 2 (EBR2)
• RAM emulation register (RAMER)
• Serial control register X ( SCRX)
The masked ROM version is not equipped with the above registers. Attempting to read them with
produce an undetermined value, and writing to them is invalid.
Rev.6.00 Jun. 03, 2008 Page 560 of 698
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Section 17 Flash Memory (F-ZTAT Version)
17.5.1
Flash Memory Control Register 1 (FLMCR1)
FLMCR1 is a register that makes the flash memory transit to program mode, program-verify
mode, erase mode, or erase-verify mode. For details on register setting, refer to section 17.8, Flash
Memory Programming/Erasing.
Bit
Bit Name Initial Value
R/W
Description
7
FWE
R
Flash Write Enable
—*
Reflects the input level at the FWE pin. It is set to 1
when a low level is input to the FWE pin, and cleared to
0 when a high level is input.
6
SWE1
0
R/W
Software Write Enable
When this bit is set to 1, flash memory
programming/erasing is enabled. When this bit is
cleared to 0, other FLMCR1 register bits and all EBR1,
EBR2 bits cannot be set.
[Setting condition]
When FWE = 1
5
ESU1
0
R/W
Erase Setup
When this bit is set to 1, the flash memory transits to the
erase setup state. When it is cleared to 0, the erase
setup state is cancelled. Set this bit to 1 before setting
the E1 bit in FLMCR1.
[Setting condition]
When FWE = 1 and SWE1 = 1
4
PSU1
0
R/W
Program Setup
When this bit is set to 1, the flash memory transits to the
program setup state. When it is cleared to 0, the
program setup state is cancelled. Set this bit to 1 before
setting the P1 bit in FLMCR1.
[Setting condition]
When FWE = 1 and SWE1 = 1
3
EV1
0
R/W
Erase-Verify
When this bit is set to 1, the flash memory transits to
erase-verify mode. When it is cleared to 0, erase-verify
mode is cancelled.
[Setting condition]
When FWE = 1 and SWE1 = 1
Rev.6.00 Jun. 03, 2008 Page 561 of 698
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Section 17 Flash Memory (F-ZTAT Version)
Bit
Bit Name Initial Value
R/W
Description
2
PV1
R/W
Program-Verify
0
When this bit is set to 1, the flash memory transits to
program-verify mode. When it is cleared to 0, programverify mode is cancelled.
[Setting condition]
When FWE = 1 and SWE1 = 1
1
E1
0
R/W
Erase
When this bit is set to 1 while the SWE1 and ESU1 bits
are 1, the flash memory transits to erase mode. When it
is cleared to 0, erase mode is cancelled.
[Setting condition]
When FWE = 1, SWE1 = 1, and ESU1 = 1
0
P1
0
R/W
Program
When this bit is set to 1 while the SWE1 and PSU1 bits
are 1, the flash memory transits to program mode.
When it is cleared to 0, program mode is cancelled.
[Setting condition]
When FWE = 1, SWE1 = 1, and PSU1 = 1
Note: * Set according to the FWE pin state.
17.5.2
Flash Memory Control Register 2 (FLMCR2)
FLMCR2 is a register that displays the state of flash memory programming/erasing. FLMCR2 is a
read-only register, and should not be written to.
Bit
Bit Name Initial Value
R/W
Description
7
FLER
R
Indicates that an error has occurred during an operation
on flash memory (programming or erasing). When
FLER is set to 1, flash memory goes to the errorprotection state.
0
See section 17.9.3, Error Protection, for details.
6 to 0 —
All 0
—
Reserved
These bits are always read as 0.
Rev.6.00 Jun. 03, 2008 Page 562 of 698
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Section 17 Flash Memory (F-ZTAT Version)
17.5.3
Erase Block Register 1 (EBR1)
EBR1 specifies the flash memory erase area block. EBR1 is initialized to H'00 when the SWE1
bit in FLMCR is 0. Do not set more than one bit at a time, as this will cause all the bits in EBR1
and EBR2 to be automatically cleared to 0.
Bit
Bit
Name
Initial
Value
R/W
Description
7
EB7
0
R/W
When this bit is set to 1, 8 kbytes of EB7 (H'00E000 to H'00FFFF)
are to be erased.
6
EB6
0
R/W
When this bit is set to 1, 8 kbytes of EB6 (H'00C000 to H'00DFFF)
are to be erased.
5
EB5
0
R/W
When this bit is set to 1, 16 kbytes of EB5 (H'008000 to H'00BFFF)
are to be erased.
4
EB4
0
R/W
When this bit is set to 1, 28 kbytes of EB4 (H'001000 to H'007FFF)
are to be erased.
3
EB3
0
R/W
When this bit is set to 1, 1 kbyte of EB3 (H'000C00 to H'000FFF) is
to be erased.
2
EB2
0
R/W
When this bit is set to 1, 1 kbyte of EB2 (H'000800 to H'000BFF) is
to be erased.
1
EB1
0
R/W
When this bit is set to 1, 1 kbyte of EB1 (H'000400 to H'0007FF) is
to be erased.
0
EB0
0
R/W
When this bit is set to 4, 1 kbyte of EB0 (H'000000 to H'0003FF) is
to be erased.
Rev.6.00 Jun. 03, 2008 Page 563 of 698
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Section 17 Flash Memory (F-ZTAT Version)
17.5.4
Erase Block Register 2 (EBR2)
EBR2 specifies the flash memory erase area block. EBR2 is initialized to H'00 when the SWE1
bit in FLMCR1 is 0. Do not set more than one bit at a time, as this will cause all the bits in EBR1
and EBR2 to be automatically cleared to 0.
Note: These registers are reserved on the HD64F2211 and HD64F2211U. Only H'00 should be
written to them.
Bit
Bit
Initial
Name Value
R/W
Description
Reserved
7 to 2 —
All 0
R/W
1
EB9
0
R/W
When this bit is set to 1, 32 kbytes of EB9 (H'018000 to H'01FFFF)
are to be erased.
0
EB8
0
R/W
When this bit is set to 1, 32 kbytes of EB8 (H'010000 to H'017FFF)
are to be erased.
The write value should always be 0.
Rev.6.00 Jun. 03, 2008 Page 564 of 698
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Section 17 Flash Memory (F-ZTAT Version)
17.5.5
RAM Emulation Register (RAMER)
RAMER specifies the area of flash memory to be overlapped with part of RAM when emulating
real-time flash memory programming. RAMER settings should be made in user mode or user
program mode. To ensure correct operation of the emulation function, the ROM for which RAM
emulation is performed should not be accessed immediately after this register has been modified.
Normal execution of an access immediately after register modification is not guaranteed. For
details, refer to section 17.7, Flash Memory Emulation in RAM.
Bit
Bit Name Initial Value
7 to 4 —
All 0
R/W
Description
R/W
Reserved
These bits always read as 0. The write value should
always be 0.
3
RAMS
0
R/W
RAM Select
Specifies selection or non-selection of flash memory
emulation in RAM. When RAMS = 1, the flash memory
is overlapped with part of RAM, and all flash memory
block are program/erase-protected.
2
RAM2
0
R/W
Flash Memory Area Selection
1
RAM1
0
R/W
0
RAM0
0
R/W
When the RAMS bit is set to 1, selects one of the
following flash memory areas to overlap the RAM area.
The areas correspond with 1-kbyte erase blocks.
000: H'000000 to H'0003FF (EB0)
001: H'000400 to H'0007FF (EB1)
010: H'000800 to H'000BFF (EB2)
011: H'000C00 to H'000FFF (EB3)
100: Setting prohibited
101: Setting prohibited
110: Setting prohibited
111: Setting prohibited
Rev.6.00 Jun. 03, 2008 Page 565 of 698
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Section 17 Flash Memory (F-ZTAT Version)
17.5.6
Serial Control Register X (SCRX)
SCRX performs register access control.
Bit
Bit Name Initial Value
7 to 4 —
All 0
R/W
R/W
Description
Reserved
The write value should always be 0.
3
FLSHE
0
R/W
Flash Memory Control Register Enable:
Controls CPU access to the flash memory control
registers (FLMCR1, FLMCR2, EBR1, and EBR2).
Setting the FLSHE bit to 1 enables read/write access to
the flash memory control registers. If FLSHE is cleared
to 0, the flash memory control registers are deselected.
In this case, the flash memory control register contents
are retained.
0: Flash control registers deselected in area H'FFFFA8
to H'FFFFAC
1: Flash control registers selected in area H'FFFFA8 to
H'FFFFAC
2 to 0 —
All 0
R/W
Reserved
The write value should always be 0.
Rev.6.00 Jun. 03, 2008 Page 566 of 698
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Section 17 Flash Memory (F-ZTAT Version)
17.6
On-Board Programming Modes
When pins are set to on-board programming mode and a reset-start is executed, a transition is
made to the on-board programming state in which program/erase/verify operations can be
performed on the on-chip flash memory. There are two on-board programming modes: boot mode
and user program mode. The pin settings for transition to each of these modes are shown in table
17.3. For a diagram of the transitions to the various flash memory modes, see figure 17.2.
Table 17.3 Setting On-Board Programming Modes
Mode
EMLE
FWE
MD2
MD1
MD0
SCI boot mode
(HD64F2218,
HD64F2212,
HD64F2211)
Advanced: single-chip mode
0
1
0
1
×
USB boot mode
(HD64F2218U,
HD64F2212U,
HD64F2211U)
Advanced: single-chip mode
0
1
0
1
0
0
1
0
1
1
0
1
1
1
0
0
1
1
1
1
24 MHz system clock
Advanced: single-chip mode
16 MHz system clock
User program mode
Advanced: on-chip ROM
extended mode
(MCU operating mode 6)
Advanced: Single-chip mode
(MCU operating mode 7)
17.6.1
SCI Boot Mode (HD64F2218, HD64F2212, and HD64F2211)
When a reset-start is executed after the LSI's pins have been set to boot mode, the boot program
built into the LSI is started and the programming control program prepared in the host is serially
transmitted to the LSI via the SCI. In the LSI, the programming control program received via the
SCI is written into the programming control program area in on-chip RAM. After the transfer is
completed, control branches to the start address of the programming control program area and the
programming control program execution state is entered (flash memory programming is
performed). The system configuration in boot mode is shown in figure 17.7.
Rev.6.00 Jun. 03, 2008 Page 567 of 698
REJ09B0074-0600
Section 17 Flash Memory (F-ZTAT Version)
0
1
01×
EMLE
This LSI
FWE
MD2 to MD0*
Flash memory
Host
Write data reception
Verify data transmission
RxD2
SCI_2
TxD2
On-chip RAM
Legend:
× : Don’t care
Note: * Mode pin and FWE pin input must satisfy the mode programming setup time (tMDS = 200ns)
with respect to the reset release timing.
Figure 17.7 System Configuration in SCI Boot Mode
Table 17.4 shows the boot mode operations between reset end and branching to the programming
control program.
1. When boot mode is used, the flash memory programming control program must be prepared in
the host beforehand. Prepare a programming control program in accordance with the
description in section 17.8, Flash Memory Programming/Erasing. In boot mode, if any data has
been programmed into the flash memory (if all data is not 1), all flash memory blocks are
erased. Boot mode is for use in enforced exit when user program mode is unavailable, such as
the first time on-board programming is performed, or if the program activated in user program
mode is accidentally erased.
2. The SCI_2 should be set to asynchronous mode, and the transfer format as follows: 8-bit data,
1 stop bit, and no parity.
3. When the boot program is initiated, the chip measures the low-level period of asynchronous
SCI communication data (H'00) transmitted continuously from the host. The chip then
calculates the bit rate of transmission from the host, and adjusts the SCI_2 bit rate to match that
of the host. The reset should end with the RxD pin high. The RxD and TxD pins should be
pulled up on the board if necessary. After the reset ends, it takes approximately 100 states
before the chip is ready to measure the low-level period.
4. After matching the bit rates, the chip transmits one H'00 byte to the host to indicate the end of
bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has
been received normally, and transmit one H'55 byte to the chip. If reception could not be
performed normally, initiate boot mode again by a reset. Depending on the host’s transfer bit
rate and system clock frequency of this LSI, there will be a discrepancy between the bit rates of
the host and the chip. To operate the SCI properly, set the host’s transfer bit rate and system
clock frequency of this LSI within the ranges listed in table 17.5.
Rev.6.00 Jun. 03, 2008 Page 568 of 698
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Section 17 Flash Memory (F-ZTAT Version)
5. In boot mode, a part of the on-chip RAM area (four kbytes) is used by the boot program. The
area to which the programming control program is transferred from the host is 8 kbytes
(H'FFC000 to H'FFDFFF) in the HD64F2218, HD64F2218U, HD64F2212, and HD64F2212U
and 4 kbytes (H'FFD000 to H'FFDFFF) in the HD64F2211 and HD64F2211U. The boot
program area cannot be used until the execution state in boot mode switches to the
programming control program.
6. Before branching to the programming control program, the chip terminates transfer operations
by the SCI_2 (by clearing the RE and TE bits in SCR to 0), but the adjusted bit rate value
remains set in BRR. Therefore, the programming control program can still use it for transfer of
write data or verify data with the host. The TxD pin is high. The contents of the CPU general
registers are undefined immediately after branching to the programming control program.
These registers must be initialized at the beginning of the programming control program, since
the stack pointer (SP), in particular, is used implicitly in subroutine calls, etc.
7. Boot mode can be cleared by a reset. End the reset* after driving the reset pin low, waiting at
least 20 states, and then setting the FWE pin and the mode (MD) pins. Boot mode is also
cleared when a WDT overflow occurs.
8. Do not change the MD pin input levels in boot mode. If the mode pin input levels are changed
(for example, from low to high) during a reset, the state of ports with multiplexed address
functions and bus control output pins (AS, RD, WR) will change according to the change in
the microcomputer’s operating mode . Therefore, care must be taken to make pin settings to
prevent these pins from becoming output signal pins during a reset, or to prevent collision with
signals outside the microcomputer.
9. All interrupts are disabled during programming or erasing of the flash memory.
Note:* Mode pin and FWE pin input must satisfy the mode programming setup time (tMDS = 200
ns) with respect to the reset release timing.
Rev.6.00 Jun. 03, 2008 Page 569 of 698
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Section 17 Flash Memory (F-ZTAT Version)
Table 17.4 Boot Mode Operation
Item
Host Operation
LSI Operation
Branches to boot program at resetstart
Bit rate adjustment
Continuously transmits data H'00
at specified bit rate
Measures low-level period of
receive data H'00
Calculates bit rate and sets it in
BRR of SCI_2
Transmits data H'55 when data
H'00 is received error-free
Transmits data H'00 to host as
adjustment end indication
Transmits data H'AA to host when
data H'55 is received
Transmits number of bytes (N) of Echobacks the 2-byte data received
Transmits number of
as verification data
bytes (N) of programming programming control program to
be transferred as 2-byte data (lowcontrol program
order byte following high-order
byte)
Transmits 1-byte of
programming control
program (repeated for N
times)
Transmits 1-byte of programming
control program
Echobacks received data to host
and also transfers it to RAM
Flash memory erase
Checks flash memory data, erases
all flash memory blocks in case of
written data existing, and transmits
data H'AA to host. (If erase could
not be done, transmits data H'FF to
host and aborts operation)
Programming control
program execution
Branches to programming control
program transferred to on-chip RAM
and starts execution
Table 17.5 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate Is
Possible
Host Bit Rate
System Clock Frequency Range of LSI
19,200 bps
8 to 24 MHz
9,600 bps
6 to 24 MHz
4,800 bps
6 to 24 MHz
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Section 17 Flash Memory (F-ZTAT Version)
17.6.2
USB Boot Mode (HD64F2218U, HD64F2212U, and HD64F2211U)
• Features
⎯ Selection of bus-powered mode or self-powered mode
⎯ Supports the USB operating clock generation by 16 MHz system clock with PLL3
multiplication (FWE = 1, MD2 to MD0 = 011) or 24 MHz system clock with PLL2
multiplication (FWE = 1, MD2 to MD0 = 010)
⎯ D+ pull up control connection supported for P36 pin only
⎯ See table 17.6 for enumeration information
Table 17.6 Enumeration Information
USB Standard
Ver.1.1
Transfer modes
Control (in, out), Bulk (in, out)
Maximum power
Self power mode (UBPM pin = 1)
100 mA
Bus power mode (UBPM pin = 0)
500 mA
Endpoint configuration
EP0 Control (in, out) 64 bytes
Configuration 1
Interface Number 0
Alternate Setting 0
EP1 Bulk (in) 64 bytes
EP2 Bulk (out) 64 bytes
• Notes on USB Boot Mode Execution
⎯ Specify 16 MHz or 24 MHz system clock and the FWE and MD2 to MD0 pins correctly.
⎯ Use the P36 pin for D+ pull-up control connection.
⎯ To ensure stable power supply during flash memory programming/erasing, do not use cable
connection via a bus powered HUB.
⎯ Note in particular that, in the worst case, the LSI may be permanently damaged if the USB
cable is detached during flash memory programming/erasing.
⎯ A transition is not made to power-down modes even if the USB bus enters suspend mode
when in bus power mode.
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Section 17 Flash Memory (F-ZTAT Version)
• Overview
When a reset start preformed after the pins of this LSI have been set to boot mode, a boot
program incorporated in the microcomputer beforehand is activated, and the prepared
programming control program is transmitted sequentially to the host using the USB. With this
LSI, the programming control program received by the USB is written to a programming
control program area in on-chip RAM. After transfer is completed, control branches to the start
address of the programming control program area, and the programming control program
execution state is established (flash memory programming is performed). Figure 17.8 shows a
system configuration diagram when using USB boot mode.
0
1
01×
Host or
self-powerd HUB
EMLE
FWE*
MD2 to MD0*
This LSI
EXTAL
XTAL
System clock:
16 MHz or 24MHz
Flash memory
P36
1.5kΩ
D+
D-
Rs
USD+
USB
Data transmission/reception
Rs
USD-
On-chip RAM
UBPM
1: Self power setting
0: Bus power setting
VBUS
Legend:
×: Don’t care
Note: * FWE pin and mode pin input must satisfy the mode programming setup time (tMDS = 200ns) when a reset is released.
Figure 17.8 System Configuration Diagram when Using USB Boot Mode
Table 17.7 shows operations from reset release in USB boot mode until processing branches to
the programming control program.
1. When boot mode is used, the flash memory programming control program must be prepared in
the host beforehand. Prepare a programming control program in accordance with the
description in section 17.8, Flash Memory Programming/Erasing. In boot mode, if any data has
been programmed into the flash memory (if all data is not 1), all flash memory blocks are
erased. Boot mode is for use in enforced exit when user program mode is unavailable, such a
the first time on-board programming control program, or performed, or if the program
activated in user program mode is accidentally erased.
2. When the boot program is activated, enumeration with respect to the host is carried out.
Enumeration information is shown in table 17.6. When enumeration is completed, transmit a
single H'55 byte from the host. If reception has not been preformed normally, restart boot mode
by means of a reset.
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Section 17 Flash Memory (F-ZTAT Version)
3. Set the frequency for transmission from the host as a numeric value in units of MHz × 100 (ex:
16.00 MHz → H'0640, 24.00 MHz → H'0960).
4. In boot mode, the 4-kbyte on-chip RAM area H'FFE000 to H'FFEFBF is used by the boot
program. The programming control program is transferred from the host stored in the 8-kbyte
area H'FFC000 to H'FFDFFF in the HD64F2218, HD64F2218U, HD64F2212, and
HD64F2212U and the 4-kbyte area H'FFD000 to H'FFDFFF in the HD64F2211 and
HD64F2211U. The boot program area cannot be used until program execution switches to the
programming control program. Also note that the boot program remains in RAM even after
control passes to the programming control program.
5. When a branch is made to the programming control program, the USB remains connected and
can be used immediately for transmission/reception of write data or verify data between the
programming control program and the host. The contents of CPU general registers are
undefined after a branch to the programming control program. Note, in particular, that since the
stack pointer is used implicitly in subroutine calls ad the like, it should be initialized at the start
of the programming control program.
6. Boot mode is by means of a reset. Drive the reset pin low, wait for the elapse of at least 20
states, then set the FWE pin and mode pins to release the reset.* Boot mode is also exited in
the event of a WDT overflow reset.
7. Do not change the input level of the mode pins while in boot mode. In the input level of a
mode pin is changed (from low to high) during a reset, the states of ports with a dual function
as address output s, and bus control output signals (AS, RD, WR), will change due to switching
of the operating mode. Either make pin settings so that these pins do not become output signal
pins during a reset, or take precautions to prevent collisions with external signals.
8. Interrupt cannot be used during flash memory programming or erasing.
Note: * FWE pin and mode pin input must satisfy the mode programming set up time (tMDS =
200 ns) when a reset is released.
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Section 17 Flash Memory (F-ZTAT Version)
Table 17.7 USB Boot Mode Operation
Item
Host Operation
Operation of this LSI
Branches to boot program
after reset start
Start of USB boot mode
Transmits one H'55 byte on
completion of USB enumeration
Transmits one H'AA byte to
host on reception of H'55
Transfer clock information
Transmits frequency (2 bytes),
number of multiplication
Classification (1 byte), multiplication
ratio (1 byte)
With 16 MHz system clock, H'0640,
H'01, H'01 are transmitted
With 24 MHz system clock, H'0960,
H'01, H'01 are transmitted
If received data are within
respective ranges, transmits
H'AA to host
If any received data is out-ofranges, transmits H'FF to host
and halts operation
Transfer number of bytes
Performs 2-byte transfer number of
(N) of programming control bytes (N) of programming control
program
program
If received number of bytes is
within ranges, transmits H'AA
to host
If received number of bytes is
out-of- ranges, transmits H'FF
to host and halts operation
Rev.6.00 Jun. 03, 2008 Page 574 of 698
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Section 17 Flash Memory (F-ZTAT Version)
Item
Host Operation
Operation of this LSI
Transfer of programming
control program and sum
value
Transmits programming control
program in N-byte divisions.
Transfers received data to onchip RAM
Transmits sum value (two's
complement of sum total of
programming control program
(1 byte))
Calculates sum total of
received sum value and 1 byte
units of programming control
program transferred to on-chip
RAM
If sum is 0, transmits H'AA to
host
If sum is not 0, transmits H'FF
to host halts operation
Memory erase
Starts total erase of flash
memory
Transmits total erase status
command (H'3A)
Transmits H'11 to host if total
erase processing is being
executed when total erase
status command is received
Transmits H'06 to host if total
erase of all blocks has been
completed when total erase
status command is received
Retransmits total erase status
command (H'3A) when H'11 is
received
Execution of programming
control program
If erase cannot be performed
when total erase status
command is received,
transmits H'EE to host and
halts operation
Branches to programming
control program transferred to
on-chip RAM and starts
execution.
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Section 17 Flash Memory (F-ZTAT Version)
17.6.3
Programming/Erasing in User Program Mode
On-board programming/erasing of an individual flash memory block can also be performed in user
program mode by branching to a user program/erase control program. The user must set branching
conditions and provide on-board FWE control and supply of programming data, and storing a
program/erase control program in part of the program area as necessary. The flash memory must
contain the user program/erase control program or a program which provides the user
program/erase control program from external memory. Because the flash memory itself cannot be
read during programming/erasing, transfer the user program/erase control program to on-chip
RAM, as like in boot mode. Figure 17.9 shows a sample procedure for programming/erasing in
user program mode. Prepare a user program/erase control program in accordance with the
description in section 17.8, Flash Memory Programming/Erasing.
MD2 to MD0 = 110,111 Reset start
No
Program/erase?
Yes
Transfer user program /erase
control program to RAM
Branch to flash memory
application program
Branch to user program/erase
control in RAM
Execute user program/erase
control pogram (flash memory rewrite)
Branch to flash memory
application program
Figure 17.9 Programming/Erasing Flowchart Example in User Program Mode
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REJ09B0074-0600
Section 17 Flash Memory (F-ZTAT Version)
17.7
Flash Memory Emulation in RAM
Making a setting in the RAM emulation register (RAMER) enables part of RAM to be overlapped
onto the flash memory area so that data to be written to flash memory can be emulated in RAM in
real time. Emulation can be performed in user mode or user program mode. Figure 17.10 shows
an example of emulation of real-time flash memory programming.
1. Set RAMER to overlap part of RAM onto the area for which real-time programming is
required.
2. Emulation is performed using the overlapping RAM.
3. After the program data has been confirmed, the RAMS bit is cleared, thus releasing RAM
overlap.
4. The data written in the overlapping RAM is written into the flash memory space (EB0).
Start of emulation program
Set RAMER
Write tuning data to overlap
RAM
Execute application program
No
Tuning OK?
Yes
Clear RAMER
Write to flash memory
emulation block
End of emulation program
Figure 17.10 Flowchart for Flash Memory Emulation in RAM
Rev.6.00 Jun. 03, 2008 Page 577 of 698
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Section 17 Flash Memory (F-ZTAT Version)
An example in which flash memory block area EB0 is overlapped is shown in figure 17.11.
1. The RAM area to be overlapped is fixed at a 1-kbyte area in the range of H'FFD000 to
H'FFD3FF.
2. The flash memory area to overlap is selected by RAMER from a 1-kbyte area among one of
the EB0 to EB3 blocks.
3. The overlapped RAM area can be accessed from both the flash memory addresses and RAM
addresses.
4. When the RAMS bit in RAMER is set to 1, program/erase protection is enabled for all flash
memory blocks (emulation protection). In this state, setting the P1 or E1 bit in FLMCR1 to 1
does not cause a transition to program mode or erase mode.
5. A RAM area cannot be erased by execution of software in accordance with the erase algorithm.
6. Block area EB0 contains the vector table. When performing RAM emulation, the vector table
is needed in the overlap RAM.
H'000000
Flash memory
Flash memory
(EB0)
(EB0)
(EB1)
On-chip RAM
(1-kbyte shadow)
H'000400
H'000800
(EB2)
Flash memory
(EB2)
H'000C00
H'FFC000
H'FFD000
H'FFD3FF
H'FFD400
H'FFEFBF
On-chip RAM
(4 kbytes)
On-chip RAM
(4 kbytes)
On-chip RAM
(1 kbyte)
On-chip RAM
(1 kbyte)
On-chip RAM
(7 kbytes - 64 bytes)
On-chip RAM
(7 kbytes - 64 bytes)
H'FFFFC0
H'FFFFFF On-chip RAM (64 bytes)
Normal memory map
On-chip RAM (64 bytes)
RAM overlap memory map
Figure 17.11 Example of RAM Overlap Operation
Rev.6.00 Jun. 03, 2008 Page 578 of 698
REJ09B0074-0600
Section 17 Flash Memory (F-ZTAT Version)
17.8
Flash Memory Programming/Erasing
A software method, using the CPU, is employed to program and erase flash memory in the onboard programming modes. Depending on the FLMCR1 setting, the flash memory operates in one
of the following four modes: program mode, erase mode, program-verify mode, and erase-verify
mode. The programming control program in boot mode and the user program/erase control
program in user program mode use these operating modes in combination to perform
programming/erasing. Flash memory programming and erasing should be performed in
accordance with the descriptions in section 17.8.1, Program/Program-Verify and section 17.8.2,
Erase/Erase-Verify, respectively.
17.8.1
Program/Program-Verify
When writing data or programs to the flash memory, the program/program-verify flowchart shown
in figure 17.12 should be followed. Performing programming operations according to this
flowchart will enable data or programs to be written to the flash memory without subjecting the
chip to voltage stress or sacrificing program data reliability.
1. Programming must be done to an empty address. Do not reprogram an address to which
programming has already been performed.
2. Programming should be carried out 128 bytes at a time. A 128-byte data transfer must be
performed even if writing fewer than 128 bytes. In this case, H'FF data must be written to the
extra addresses.
3. Prepare the following data storage areas in RAM: a 128-byte programming data area, a 128byte reprogramming data area, and a 128-byte additional-programming data area. Perform
reprogramming data computation and additional programming data computation according to
figure 17.12.
4. Consecutively transfer 128 bytes of data in byte units from the reprogramming data area or
additional-programming data area to the flash memory. The program address and 128-byte
data are latched in the flash memory. The lower 8 bits of the start address in the flash memory
destination area must be H'00 or H'80.
5. The time during which the P1 bit is set to 1 is the programming time. Figure 17.12 shows the
allowable programming times.
6. The watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc.
An overflow cycle of approximately (y + z1 + α + β) μs is allowed.
7. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower 1 bit
is B'0. Verify data can be read in words from the address to which a dummy write was
performed.
8. The maximum number of repetitions of the program/program-verify sequence to the same bit is
(N1 + N2).
Rev.6.00 Jun. 03, 2008 Page 579 of 698
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Section 17 Flash Memory (F-ZTAT Version)
Write pulse application subroutine
Start of programming
Subroutine Write Pulse
START
Perform programming in the erased state.
Do not perform additional programming
on previously programmed addresses.
Set SWE1 bit in FLMCR1
WDT enable
Wait (x) µs
*6
Set PSU1 bit in FLMCR1
Wait (y) µs
Store 128-byte program data in program
data area and reprogram data area
*6
*4
n=1
Set P1 bit in FLMCR1
m=0
Wait (z0), (z1), or (z2) µs
*5* 6
Write 128-byte data in RAM reprogram
data area consecutively to flash memory
Clear P1 bit in FLMCR1
*1
Sub-Routine-Call
Wait (α) µs
Apply Write pulse Z0µs or Z1µs
*6
See Note 7 for pulse width
*6
Set PV1 bit in FLMCR1
Clear PSU1 bit in FLMCR1
Wait (γ) µs
Wait (β) µs
*6
*6
H'FF dummy write to verify address
Disable WDT
End Sub
Wait (ε) µs
*6
Read verify data
*2
Write data =
verify data?
No
n←n+1
Increment address
Number of Writes n
1
2
m=1
Yes
Note: 7. Write Pulse Width
P1 bit set time (µs)*6
Program
Re -program
z0
z2
z0
z2
No
N1 ≥ n ?
Yes
Additional-programming data computation
Transfer additional-programming data to
additional-programming data area
z0
z0
z1
z1
z1
N1-1
N1
N1+1
N1+2
N1+3
z2
z2
_
_
_
Reprogram data computation
Transfer reprogram data to reprogram data area
No
_
_
_
z1
z1
z1
N1+N2-2
N1+N2-1
N1+N2
*4
*3
*4
128-byte
data verification completed?
Yes
Clear PV1 bit in FLMCR1
Reprogram
Wait (η) µs
*6
No
N1 ≥ n?
Yes
Successively write 128-byte data from additional1
programming data area in RAM to flash memory *
RAM
Program data storage
area (128 bytes)
Sub-Routine-Call
Apply Write Pulse (Additional programming) z2μs *6
Reprogram data storage
area (128 bytes)
No
m=0?
n ≥ (N1 + N2)?
Yes
Clear SWE1 bit in FLMCR1
Additional-programming
data storage area
(128 bytes)
Wait (θ) µs
No
Yes
Clear SWE1 bit in FLMCR1
Wait (θ) µs
*6
End of programming
Programming failure
Notes: 1. Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80.
A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses.
2. Verify data is read in 16-bit (word) units.
3. Reprogram data is determined by the operation shown in the table below (comparison between the data stored in the program data area and the verify data). Bits for
which the reprogram data is 0 are programmed in the next reprogramming loop. Therefore, even bits for which programming has been completed will be subjected to
programming once again if the result of the subsequent verify operation is NG.
4. A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional data must be provided in RAM.
The contents of the reprogram data area and additional data area are modified as programming proceeds.
5. A write pulse of z0 or z1 is applied according to the progress of the programming operation. See note 7 for details of the pulse widths. When writing of additionalprogramming data is executed, a z2 write pulse should be applied. Reprogram data X' means reprogram data when the write pulse is applied.
6. x, y, z0, z1, z2, α, β, γ, ε, η, θ, N1, and N2 are shown in section 22.7, Flash Memory Characteristics.
Additional-Programming Data Computation Table
Reprogram Data Computation Table
Original Data
Verify Data
Reprogram Data
(D)
0
(V)
0
(X)
1
0
1
0
1
0
1
1
1
1
Comments
Reprogram Data
(X')
Verify Data
Additional(V)
Programming Data (Y)
Programming completed
0
0
0
Programming incomplete;
reprogram
0
1
1
1
0
1
1
1
1
Still in erased state; no action
Comments
Additional programming
to be executed
Additional programming
not to be executed
Additional programming
not to be executed
Additional programming
not to be executed
Figure 17.12 Program/Program-Verify Flowchart
Rev.6.00 Jun. 03, 2008 Page 580 of 698
REJ09B0074-0600
*6
Section 17 Flash Memory (F-ZTAT Version)
17.8.2
Erase/Erase-Verify
When erasing flash memory, the erase/erase-verify flowchart shown in figure 17.13 should be
followed.
1. Prewriting (setting erase block data to all 0s) is not necessary.
2. Erasing is performed in block units. Make only a single-bit specification in the erase block
register 1, 2 (EBR1, EBR2). To erase multiple blocks, each block must be erased in turn.
3. The time during which the E1 bit is set to 1 is the flash memory erase time.
4. The watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc.
An overflow cycle of approximately (y+z+α+β) ms is allowed.
5. For a dummy write to a verify address, write 1-byte data H'FF to an address whose lower 1 bit
is B'0. Verify data can be read in longwords from the address to which a dummy write was
performed.
6. If the read data is unerased, set erase mode again, and repeat the erase/erase-verify sequence as
before. The maximum number of repetitions of the erase/erase-verify sequence is N.
Rev.6.00 Jun. 03, 2008 Page 581 of 698
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Section 17 Flash Memory (F-ZTAT Version)
Start
*1
Set SWE1 bit in FLMCR1
Wait (x) μs
*2
n=1
Set EBR1 (2)
*4
Enable WDT
Set ESU1 bit in FLMCR1
Wait (y) μs
*2
Set E1 bit in FLMCR1
Start erasing
Wait (z) μs
*2
Clear E1 bit in FLMCR1
Halt erasing
Wait (α) μs
*2
Clear ESU1 bit in FLMCR1
Wait (β) μs
*2
Disable WDT
Set EV1 bit in FLMCR1
Wait (γ) μs
*2
Set block start address as verify address
H'FF dummy write to verify address
Wait (ε) μs
*2
Read verify data
*3
Verify data = all 1s?
Increment address
n←n+1
No
Yes
No
Last address of block?
Yes
Clear EV1 bit in FLMCR1
Clear EV1 bit in FLMCR1
Wait (η) μs
No
Wait (η) μs
*5
All erase block erased?
Yes
Notes: 1.
2.
3.
4.
5.
*2
n ≥ (N)?
*2
No
Yes
Clear SWE1 bit in FLMCR1
Clear SWE1 bit in FLMCR1
Wait (θ) μs
Wait (θ) μs
End of erasing
Erase failure
Pre-write (clearing data in the block to be erased to 0) isn not required.
x, y, z, α, β, γ, ε, η, θ, and N are shown in section 22.7, Flash Memory Characteristics.
Veryfy data is read in 16 bits.
Only 1 bit in the EBR register must be set. Two or more bits in EBR cannot be set.
Erasure is performed in block units. To erase multiple blocks, each block must be erased sequentially.
Figure 17.13 Erase/Erase-Verify Flowchart
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Section 17 Flash Memory (F-ZTAT Version)
17.9
Program/Erase Protection
There are three kinds of flash memory program/erase protection: hardware protection, software
protection, and error protection.
17.9.1
Hardware Protection
Hardware protection refers to a state in which programming/erasing of flash memory is forcibly
disabled or aborted because of a transition to reset or standby mode. Flash memory control
register 1 (FLMCR1), flash memory control register 2 (FLMCR2), erase block register 1 (EBR1),
and erase block register 2 (EBR2) are initialized. In a reset via the RES pin, the reset state is not
entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of
a reset during operation, hold the RES pin low for the RES pulse width specified in the AC
Characteristics section.
17.9.2
Software Protection
Software protection can be implemented against programming/erasing of all flash memory blocks
by clearing the SWE1 bit in FLMCR1. When software protection is in effect, setting the P1 or E1
bit in FLMCR1 does not cause a transition to program mode or erase mode. By setting the erase
block register 1 (EBR1), and erase block register 2 (EBR2), erase protection can be set for
individual blocks. When EBR1 and EBR2 are set to H'00, erase protection is set for all blocks.
17.9.3
Error Protection
In error protection, an error is detected when the CPU's runaway occurs during flash memory
programming/erasing, or operation is not performed in accordance with the program/erase
algorithm, and the program/erase operation is aborted. Aborting the program/erase operation
prevents damage to the flash memory due to overprogramming or overerasing.
When the following errors are detected during programming/erasing of flash memory, the FLER
bit in FLMCR2 is set to 1, and the error protection state is entered.
Setting Conditions of FLER Bit (Erase Protection)
• When the flash memory of the relevant address area is read during programming/erasing
(including vector read and instruction fetch)
• Immediately after exception handling (excluding a reset) during programming/erasing
• When a SLEEP instruction is executed during programming/erasing
• When the CPU releases the bus mastership to the DMAC during programming/erasing
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Section 17 Flash Memory (F-ZTAT Version)
The FLMCR1, FLMCR2, EBR1 and EBR2 settings are retained, but program mode or erase mode
is aborted at the point at which the error occurred. Program mode or erase mode cannot be reentered by re-setting the P1 or E1 bit. However, PV1 and EV1 bit setting is enabled, and a
transition can be made to verify mode.
17.10
Interrupt Handling when Programming/Erasing Flash Memory
All interrupts, including NMI interrupt is disabled when flash memory is being programmed or
erased (when the P1 or E1 bit is set in FLMCR1), and while the boot program is executing in boot
mode*1, to give priority to the program or erase operation. There are three reasons for this:
1. Interrupt during programming or erasing might cause a violation of the programming or
erasing algorithm, with the result that normal operation could not be assured.
2. In the interrupt exception handling sequence during programming or erasing, the vector would
not be read correctly*2 , possibly resulting in CPU runaway.
3. If interrupt occurred during boot program execution, it would not be possible to execute the
normal boot mode sequence.
Notes: 1. Interrupt requests must be disabled inside and outside the CPU until the programming
control program has completed programming.
2.
The vector may not be read correctly in this case for the following two reasons:
• If flash memory is read while being programmed or erased (while the P1 or E1 bit is
set in FLMCR1), correct read data will not be obtained (undetermined values will
be returned).
• If the interrupt entry in the vector table has not been programmed yet, interrupt
exception handling will not be executed correctly.
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Section 17 Flash Memory (F-ZTAT Version)
17.11
Programmer Mode
In programmer mode, a PROM programmer can perform programming/erasing via a socket
adapter, just like for a discrete flash memory. Use a PROM programmer that supports the Renesas
Technology 128-kbyte or 64-kbyte flash memory on-chip MCU device type. Memory map in
programmer mode is shown in figure 17.14.
MCU mode
Programmer mode
H'000000
H'00000
MCU mode
Programmer mode
H'000000
H'0000
On-chip ROM space
64 kbytes
On-chip ROM space
128 kbytes
H'01FFFF
H'00FFFF
H'FFFF
H'1FFFF
Figure 17.14 Memory Map in Programmer Mode
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Section 17 Flash Memory (F-ZTAT Version)
17.12
Power-Down States for Flash Memory
In user mode, the flash memory will operate in either of the following states:
• Normal operating mode
The flash memory can be read and written to.
• Standby mode
All flash memory circuits are halted.
• Power-down state
The flash memory can be read when part of the power supply circuit is halted and the LSI
operates by subclocks.
Table 17.8 shows the correspondence between the operating modes of this LSI and the flash
memory. When the flash memory returns to normal operation from a power-down state, a power
supply circuit stabilization period is needed. When the flash memory returns to its normal
operating state from watch mode or standby mode, bits STS2 to STS0 in SBYCR must be set to
provide a wait time of at least 100 μs; when returns from flash memory module stop mode, the
software wait state should be set.
Table 17.8 Flash Memory Operating States
LSI Operating State
Flash Memory Operating State
Active mode
Normal operating mode
Sleep mode
Watch mode
Standby mode
Standby mode
(Before entering to the normal operation mode, wait time of at least
100 µs is required.)
Flash memory module stop
mode
Subactive mode
Power-down mode (read only)
Subsleep mode
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Section 17 Flash Memory (F-ZTAT Version)
17.13
Flash Memory Programming and Erasing Precautions
Precautions concerning the use of on-board programming mode, the RAM emulation function, and
PROM mode are summarized below.
• Use the specified voltages and timing for programming and erasing.
Applied voltages in excess of the rating can permanently damage the device. Use a PROM
programmer that supports the Renesas Technology microcomputer device type with on-chip
flash memory (FZTAT128V3A, FZTAT64V3A).
Do not select the HN27C4096 setting for the PROM programmer, and only use the specified
socket adapter. Failure to observe these points may result in damage to the device.
• Powering on and off
Do not apply a high level to the FWE pin until VCC has stabilized. Also, drive the FWE pin
low before turning off VCC. When applying or disconnecting VCC power, fix the FWE pin
low and place the flash memory in the hardware protection state. The power-on and power-off
timing requirements should also be satisfied in the event of a power failure and subsequent
recovery.
• FWE application/disconnection
FWE application should be carried out when MCU operation is in a stable condition. If MCU
operation is not stable, fix the FWE pin low and set the protection state. The following points
must be observed concerning FWE application and disconnection to prevent unintentional
programming or erasing of flash memory:
• Apply FWE when the VCC voltage has stabilized within its rated voltage range.
• In boot mode, apply and disconnect FWE during a reset.
• In user program mode, FWE can be switched between high and low level regardless of the
reset state. FWE input can also be switched during execution of a program in flash
memory.
• Do not apply FWE if program runaway has occurred.
• Disconnect FWE only when the SWE1, ESU1, PSU1, EV1, PV1, P1, and E1 bits in
FLMCR1 are cleared. Make sure that the SWE1, ESU1, PSU1, EV1, PV1, P1, and E1 bits
are not set by mistake when applying or disconnecting FWE.
• Do not apply a constant high level to the FWE pin.
Apply a high level to the FWE pin only when programming or erasing flash memory. A system
configuration in which a high level is constantly applied to the FWE pin should be avoided.
Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to
prevent overprogramming or overerasing due to program runaway, etc.
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Section 17 Flash Memory (F-ZTAT Version)
• Use the recommended algorithm when programming and erasing flash memory.
The recommended algorithm enables programming and erasing to be carried out without
subjecting the device to voltage stress or sacrificing program data reliability. When setting the
P1 or E1 bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against
program runaway, etc.
• Do not set or clear the SWE1 bit during execution of a program in flash memory.
Wait at least θ µs* after clearing the SWE1 bit before executing a program or reading data in
flash memory. When the SWE1 bit is set, data in flash memory can be rewritten, but access
flash memory only for verify operations (verification during programming/erasing). Also, do
not clear the SWE1 bit during programming, erasing, or verifying. Similarly, when using
emulation by RAM with a high level applied to the FWE pin, the SWE1 bit should be cleared
before executing a program or reading data in flash memory. However, read/write accesses can
be performed in the RAM area overlapping the flash memory space regardless of whether the
SWE1 bit is set or cleared.
Note: * Refer to section 22.7, Flash Memory Characteristics.
• Do not use interrupts while flash memory is being programmed or erased.
All interrupt requests, including NMI, should be disabled during FWE application to give
priority to program/erase operations.
• Do not perform additional programming. Erase the memory before reprogramming.
In on-board programming, perform only one programming operation on a 128-byte
programming unit block. In programmer mode, too, perform only one programming operation
on a 128-byte programming unit block. Programming should be carried out with the entire
programming unit block erased.
• Before programming, check that the chip is correctly mounted in the PROM programmer.
Overcurrent damage to the device can result if the index marks on the PROM programmer
socket, socket adapter, and chip are not correctly aligned.
• Do not touch the socket adapter or chip during programming.
Touching either of these can cause contact faults and write errors.
• The reset state must be entered after powering on
Apply the reset signal for at least 100 µs during the oscillation setting period.
• When a reset is applied during operation, this should be done while the SWE1 pin is low.
Wait at least θ µs* after clearing the SWE1 bit before applying the reset.
Note: * Refer to section 22.7, Flash Memory Characteristics.
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Section 17 Flash Memory (F-ZTAT Version)
Wait time: x
Programming/
erasing
possible
Wait time: θ
φ
min 0 μs
tOSC1
VCC
tMDS*3
FWE
min 0 μs
MD2 to MD0*1
tMDS*3
RES
SWE1 set
SWE1 cleared
SWE1 bit
Period during which flash memory access is prohibited
(x: Wait time after setting SWE1 bit)*2
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
power-off by pulling the pins up or down.
2. See section 22.7, Flash Memory Characteristics.
3. Mode programming setup time tMDS (min) = 200 ns.
Figure 17.15 Power-On/Off Timing (Boot Mode)
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Section 17 Flash Memory (F-ZTAT Version)
Wait time: x
Programming/
erasing
Wait time: θ
possible
φ
min 0 μs
tOSC1
VCC
FWE
MD2 to MD0*1
tMDS*3
RES
SWE1 set
SWE1 cleared
SWE1 bit
Period during which flash memory access is prohibited
(x: Wait time after setting SWE1 bit)*2
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
power-off by pulling the pins up or down.
2. See section 22.7, Flash Memory Characteristics.
3. Mode programming setup time tMDS (min) = 200 ns.
Figure 17.16 Power-On/Off Timing (User Program Mode)
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*4
*4
Programming/
erasing possible
Wait time: x
Wait time: x
Programming/
erasing possible
Wait time: x
Programming/
erasing possible
Programming/
erasing possible
Wait time: x
Section 17 Flash Memory (F-ZTAT Version)
*4
*4
φ
tOSC1
VCC
min 0μs
FWE
2
tMDS*
tMDS
MD2 to MD0
tMDS
tRESW
RES
SWE1
cleared
SWE1 set
SWE1 bit
Mode
change*1
Boot
mode
Mode
User
change*1 mode
User program mode
User
mode
User program
mode
Period during which flash memory access is prohibited
(x: Wait time after setting SWE1 bit)*3
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations prohibited)
Notes: 1. When entering boot mode or making a transition from boot mode to another mode, mode switching must be
carried out by means of RES input
2. When making a transition from boot mode to another mode, a mode programming setup time tMDS (min) of 200
ns is necessary with respect to RES clearance timing.
3. See section 22.7, Flash Memory Characteristics.
4. Wait time: θ.
Figure 17.17 Mode Transition Timing
(Example: Boot Mode → User Mode ↔ User Program Mode)
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Section 17 Flash Memory (F-ZTAT Version)
17.14
Note on Switching from F-ZTAT Version to Masked ROM Version
The masked ROM version does not have the internal registers for flash memory control that are
provided in the F-ZTAT version. Table 17.9 lists the registers that are present in the F-ZTAT
version but not in the masked ROM version. If a register listed in table 17.9 is read in the masked
ROM version, an undefined value will be returned. Therefore, if application software developed on
the F-ZTAT version is switched to a masked ROM version product, it must be modified to ensure
that the registers in table 17.9 have no effect.
Table 17.9 Registers Present in F-ZTAT Version but Absent in Masked ROM Version
Register
Abbreviation
Address
Flash memory control register 1
FLMCR1
H'FFA8
Flash memory control register 2
FLMCR2
H'FFA9
Erase block register 1
EBR1
H'FFAA
Erase block register 2
EBR2
H'FFAB
RAM emulation register
RAMER
H'FEDB
Serial control register x
SCRX
H'FDB4
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Section 18 Masked ROM
Section 18 Masked ROM
This LSI incorporates a masked ROM which has the following features.
18.1
Features
• Size
Product Class
ROM Size
ROM Address (Modes 6 and 7)
H8S/2218 Group
HD6432217
64 kbytes
H'000000 to H'00FFFF
H8S/2212 Group
HD6432211
64 kbytes
H'000000 to H'00FFFF
HD6432210, HD6432210S
32 kbytes
H'000000 to H'007FFF
• Connected to the bus master through 16-bit data bus, enabling one-state access to both byte
data and word data.
Figure 18.1 shows a block diagram of the on-chip masked ROM.
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
H'000000
H'000001
H'000002
H'000003
H'00FFFE
H'00FFFF
Figure 18.1 Block Diagram of On-Chip Masked ROM (64 kbytes)
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Section 18 Masked ROM
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Section 19 Clock Pulse Generator
Section 19 Clock Pulse Generator
This LSI has an on-chip clock pulse generator that generates the system clock (φ), the bus master
clock, and internal clocks. The clock pulse generator consists of a main clock oscillator, duty
adjustment circuit, clock select circuit, medium-speed clock divider, bus master clock selection
circuit, subclock oscillator, waveform shaping circuit, PLL (Phase Locked Loop) circuit, and USB
operating clock selection circuit. A block diagram of clock pulse generator is shown in figure
19.1.
SCKCR
LPWRCR
RFCUT
EXTAL
XTAL
Main
clock
oscillator
SCK2 to SCK0
φ
Duty
adjustment
circuit
φ SUB
Clock
selection
circuit
Mediumspeed
clock divider
φ/2
to φ/32
φ
PLL
circuit
USB
operation
clock
selection circuit
UCKS3 to UCKS0
UCTLR
OSC1
Subclock
oscillator
OSC2
System clock
to φ pin
48MHz
Internal clock
to peripheral
modules
Bus
master
clock
selection
circuit
Bus master clock
to CPU,
DMAC
USB clock
to USB
USB operation
clock
to USB
Waveform
generation
circuit
Legend:
LPWRCR: Low power control register
SCKCR: System clock control register
UCTLR: USB control register
RTC clock
to RTC
Figure 19.1 Block Diagram of Clock Pulse Generator
The frequency of the main clock oscillator can be changed by software by means of settings in the
low-power control register (LPWRCR) and system clock control register (SCKCR). PLL 48-MHz
clock can be selected by software by means of setting the USB control register (UCTLR). For
details, refer to section 14, Universal Serial Bus (USB).
CPG0600B_000020020900
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Section 19 Clock Pulse Generator
19.1
Register Descriptions
The on-chip clock pulse generator has the following registers.
• System clock control register (SCKCR)
• Low-power control register (LPWRCR)
19.1.1
System Clock Control Register (SCKCR)
SCKCR controls φ clock output and medium-speed mode.
Bit
Bit Name Initial Value R/W
Description
7
PSTOP
φ Clock Output Disable
0
R/W
Controls φ output. The operation of this bit changes
depending on the operating mode. For details, see section
20.11, φ Clock Output Disabling Function.
0: φ output, fixed high, or high impedance
1: Fixed high or high impedance
6
—
0
R/W
Reserved
Although this bit is readable/writable, only 0 should be
written to.
5, 4 —
All 0
—
Reserved
These bits are always read as 0.
3
—
0
R/W
Reserved
Although this bit is readable/writable, only 0 should be
written to.
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Section 19 Clock Pulse Generator
Bit
Bit Name Initial Value R/W
Description
2
SCK2
0
R/W
System Clock Select 2 to 0
1
SCK1
0
R/W
0
SCK0
0
R/W
These bits select the bus master clock. To operate in
subactive mode or watch mode, clear the SCK2 to SCK0
bits to 0.
000: High-speed mode
001: Medium-speed clock is φ/2
010: Medium-speed clock is φ/4
011: Medium-speed clock is φ/8
100: Medium-speed clock is φ/16
101: Medium-speed clock is φ/32
11×: Setting prohibited
Legend:
×: Don’t care
19.1.2
Low Power Control Register (LPWRCR)
LPWRCR performs power-down mode control, selects sampling frequency for eliminating noise,
performs subclock oscillator control, and selects whether or not built-in feedback resistance and
duty adjustment circuit of the system clock generator used.
Bit
Bit Name Initial Value R/W
Description
7
DTON
Direct Transition ON Flag
0
R/W
0: When the SLEEP instruction is executed in high-speed
mode or medium-speed mode, operation shifts to sleep
mode, software standby mode, or watch mode*.
When the SLEEP instruction is executed in subactive
mode, operation shifts to subsleep mode or watch mode.
1: When the SLEEP instruction is executed in high-speed
mode or medium-speed mode, operation shifts directly to
subactive mode, or shifts to sleep mode or software
standby mode.
When the SLEEP instruction is executed in subactive
mode, operation shifts directly to high-speed mode, or
shifts to subsleep mode.
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Section 19 Clock Pulse Generator
Bit
Bit Name Initial Value R/W
Description
6
LSON
Low Speed ON Flag
0
R/W
0: When the SLEEP instruction is executed in high-speed
mode or medium-speed mode, operation shifts to sleep
mode, software standby mode, or watch mode*.
When the SLEEP instruction is executed in subactive
mode, operation shifts to watch mode* or shifts directly
to high-speed mode.
Operation shifts to high-speed mode when watch mode
is cancelled.
1: When the SLEEP instruction is executed in high-speed
mode*, operation shifts to watch mode or subactive
mode*.
When the SLEEP instruction is executed in subactive
mode, operation shifts to subsleep mode or watch mode.
Operation shifts to subactive mode when watch mode is
cancelled.
5
NESEL
0
R/W
Noise Elimination Sampling Frequency Select
This bit selects the sampling frequency of the subclock
(φSUB) generated by the subclock oscillator is sampled by
the clock (φ) generated by the system clock oscillator
0: Sampling using 1/32 x φ
1: Sampling using 1/4 x φ
4
SUBSTP
0
R/W
Subclock Enable
This bit enables/disables subclock generation. This bit
should be set to 1 when subclock is not used.
0: Enables subclock generation.
1: Disables subclock generation.
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Section 19 Clock Pulse Generator
Bit
Bit Name Initial Value R/W
Description
3
RFCUT
Built-in Feedback Resistor Control
0
R/W
Selects whether the oscillator’s built-in feedback resistor
and duty adjustment circuit are used with external clock
input. This bit should not be accessed when a crystal
oscillator is used.
After this bit is set when using external clock input, a
transition should initially be made to software standby
mode. Switching between use and non-use of the
oscillator’s built-in feedback resistor and duty adjustment
circuit is performed when the transition is made to software
standby mode.
0: Main clock oscillator’s built-in feedback resistor and duty
adjustment circuit are used
1: Main clock oscillator’s built-in feedback resistor and duty
adjustment circuit are not used
2
⎯
0
R/W
Reserved
This bit can be read from or written to, but the write value
should always 0.
1
STC1
0
R/W
Frequency Multiplication Factor
0
STC0
0
R/W
Specify the frequency multiplication factor of the PLL circuit
incorporated into the evaluation chip. The specified
frequency multiplication factor is valid after a transition to
software standby mode.
With this LSI, the STC1 and STC0 bits must both be set to
1. After a reset, the STC1 and STC0 bits are both cleared
to 0, and so they must be set to 1.
00: × 1
01: × 2 (Setting prohibited)
10: × 4 (Setting prohibited)
11: PLL is bypassed
Note: * When watch mode or subactive mode is entered, set high-speed mode.
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Section 19 Clock Pulse Generator
19.2
System Clock Oscillator
Clock pulses can be supplied by connecting a crystal resonator, or by input of an external clock.
19.2.1
Connecting a Crystal Resonator
A crystal resonator can be connected as shown in the example in figure 19.2. Select the damping
resistance Rd according to table 19.1. An AT-cut parallel-resonance crystal should be used.
CL1
EXTAL
CL1 = CL2 = 10 to 22 pF
(Recommended value, including
stray capacitance of circuit board)
XTAL
Rd
CL2
Figure 19.2 Connection of Crystal Resonator (Example)
Table 19.1 Damping Resistance Value
Frequency (MHz)
6
8
10
13
16
20
24
Rd (Ω)
300
200
100
0
0
0
0
Figure 19.3 shows the equivalent circuit of the crystal resonator. Use a crystal resonator that has
the characteristics shown in table 19.2.
CL
L
Rs
XTAL
C0
EXTAL
AT-cut parallel-resonance type
Figure 19.3 Crystal Resonator Equivalent Circuit
Table 19.2 Crystal Resonator Characteristics
Frequency (MHz)
6
8
10
13
16
20
24
RS max (Ω)
100
80
60
60
50
40
40
C0 max (pF)
7
7
7
7
7
7
7
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Section 19 Clock Pulse Generator
19.2.2
Inputting External Clock
An external clock signal can be input as shown in an example in figure 19.4. If the XTAL pin is
left open, make sure that stray capacitance is no more than 10 pF. When complementary clock
input to XTAL pin, the external clock input should be fixed high in standby mode, subactive
mode, subsleep mode, or watch mode.
External clock input
EXTAL
Open
XTAL
(a) XTAL pin left open
External clock input
EXTAL
XTAL
(b) Complementary clock input at XTAL pin
Figure 19.4 External Clock Input (Examples)
Table 19.3 shows the input conditions for the external clock.
Table 19.3 External Clock Input Conditions
VCC= 2.4 to 3.6V
VCC = 2.7 to 3.6V
VCC = 3.0 to 3.6V
Test
Item
Symbol
min
max
Min
max
min
max
Unit
Conditions
External clock input low pulse width
tEXL
65
—
25
—
15.5
—
ns
Figure 19.5
External clock input high pulse width
tEXH
65
—
25
—
15.5
—
ns
External clock rise time
tEXr
—
15
—
6.25
—
5.25
ns
External clock fall time
tEXf
—
15
—
6.25
—
5.25
ns
Clock low pulse width level
tCL
0.35
0.65
0.4
0.6
0.4
0.6
tcyc
Clock high pulse width level
tCH
0.35
0.65
0.4
0.6
0.4
0.6
tcyc
Figure 22.3
The external clock input conditions when the duty adjustment circuit is not used are shown in table
19.4. When the duty adjustment circuit is not used, note that the maximum operating frequency
depends on the external clock input waveform. For example, if tEXL = tEXH = 20.8 ns and tEXr = tEXf
= 5.25 ns, the maximum operating frequency becomes 19.2 MHz depending on the clcok cycle
time of 52.1 ns.
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Section 19 Clock Pulse Generator
Table 19.4 External Clock Input Conditions when Duty Adjustment Circuit Is not Used
Test
Item
Symbol
min
max
Min
max
min
max
Unit
Conditions
External clock input low pulse width
tEXL
80
—
31.25
—
20.8
—
ns
Figure 19.5
External clock input high pulse width
tEXH
80
—
31.25
—
20.8
—
ns
External clock rise time
tEXr
—
15
—
6.25
—
5.25
ns
External clock fall time
tEXf
—
15
—
6.25
—
5.25
ns
tEXH
tEXL
VCC × 0.5
EXTAL
tEXr
tEXf
Figure 19.5 External Clock Input Timing
19.3
Duty Adjustment Circuit
When the oscillator frequency is 5 MHz or higher, the duty adjustment circuit adjusts the duty
cycle of the clock signal from the oscillator to generate the system clock (φ).
19.4
Medium-Speed Clock Divider
The medium-speed clock divider divides the system clock to generate φ/2, φ/4, φ/8, φ/16, and φ/32.
19.5
Bus Master Clock Selection Circuit
The bus master clock selection circuit selects the clock supplied to the bus master by setting the
bits SCK2 to SCK0 in SCKCR. The bus master clock can be selected from high-speed mode, or
medium-speed clocks (φ/2, φ/4, φ/8, φ/16, φ/32).
Rev.6.00 Jun. 03, 2008 Page 602 of 698
REJ09B0074-0600
Section 19 Clock Pulse Generator
19.6
Subclock Oscillator
19.6.1
Connecting 32.768-kHz Crystal Resonator
supply a clock to the subclock divider, connect a 32.768-kHz crystal resonator, as shown in figure
19.6. Figure 19.7 shows the equivalence circuit for a 32.768-kHz oscillator.
C1
OSC1
C2
OSC2
C1 = C2 = 15 pF (typ.)
Note: C1 and C2 are reference values including the floating
capacitance of the board.
Figure 19.6 Example Connection of 32.768-kHz Quartz Oscillator
Ls
Cs
Rs
OSC1
OSC2
Co
Co = 1.5 pF (typ.)
Rs = 14 kΩ (typ.)
fw = 32.768 kHz
Type name = C001R (SEIKO EPSON)
Figure 19.7 Equivalence Circuit for 32.768-kHz Oscillator
19.6.2
Handling Pins when Subclock Not Required
If no subclock is required, connect the OSC1 pin to Vss and leave OSC2 open, as shown in figure
19.8. Set the SUBSTP bit of LPWRCR to 1. If this setting is not made, transition to power-down
mode may not complete properly in some cases.
OSC1
OSC2
Open state
Figure 19.8 Pin Handling when Subclock Not Required
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Section 19 Clock Pulse Generator
19.7
Subclock Waveform Generation Circuit
To eliminate noise from the subclock input to OSCI, the subclock is sampled using the dividing
clock φ. The sampling frequency is set using the NESEL bit of LPWRCR. For details, see section
19.1.2, Low Power Control Register (LPWRCR).
No sampling is performed in subactive mode, subsleep mode, or watch mode.
19.8
PLL Circuit for USB
The PLL circuit has the function of doubling or tripling the 16-MHz or 24-MHz clock from the
main oscillator to generate the 48-MHz USB operating clock.
When the PLL circuit is used, set the UCKS3 to UCKS0 bits of UCTLR. For details, refer to
section 14, Universal Serial Bus (USB).
When the PLL circuit is not used, connect the PLVCC pin to Vcc and the PLLVSS pin to the
ground (Vss). Figure 19.9 shows examples of external circuits peripheral to the PLL.
Vcc
RP: 200Ω
PLLVCC
16-MHz or
PLLVCC
EXTAL
24-MHz
crystal
resonator
or external
clock
CPB: 0.1μF*
XTAL
6- to 24-MHz
crystal
resonator
or external
clock
PLLVSS
EXTAL
XTAL
PLLVSS
Vcc
VCC
VCC
CB: 0.1μF*
VSS
VSS
(1) PLL is used
Note: * CB, CPB is laminated ceramic.
Figure 19.9 Example of PLL Circuit
Rev.6.00 Jun. 03, 2008 Page 604 of 698
REJ09B0074-0600
(2) PLL is not used
Section 19 Clock Pulse Generator
19.9
Usage Notes
19.9.1
Note on Crystal Resonator
Since various characteristics related to the crystal resonator are closely linked to the user's board
design, thorough evaluation is necessary on the user's part, using the resonator connection
examples shown in this section as a guide. As the resonator circuit ratings will depend on the
floating capacitance of the resonator and the mounting circuit, the ratings should be determined in
consultation with the resonator manufacturer. The design must ensure that a voltage exceeding the
maximum rating is not applied to the oscillator pin.
19.9.2
Note on Board Design
When designing the board, place the crystal resonator and its load capacitors as close as possible to
the XTAL or OSC1 and EXTAL or OSC2 pins. Other signal lines should be routed away from the
oscillator circuit to prevent induction from interfering with correct oscillation. See figure 19.10.
Signal A Signal B
Prohibit
C1
This LSI
EXTAL or
OSC1
C2
XTAL or
OSC2
Figure 19.10 Note on Board Design of Oscillator Circuit
19.9.3
Note on Switchover of External Clock
When two or more external clocks (e.g. 16 MHz and 13 MHz) are used as the system clock,
switchover of the input clock should be carried out in software standby mode.
An example of an external clock switching circuit is shown in figure 19.11, and an example of the
external clock switchover timing in figure 19.12.
Rev.6.00 Jun. 03, 2008 Page 605 of 698
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Section 19 Clock Pulse Generator
This LSI
Request switchover of external clock
Interrupted external signal
Control
cycle
External clock 1
External clock 2
Selector
External clock switchover signal
Ouptut port
External
interrupt
EXTAL
Figure 19.11 Example of External Clock Switching Circuit
External
clock 1
External
clock 2
Operation
Clock switchover
request
SLEEP instruction
execution
Interrupt exception handling
(5)
(1)
Port setting
(2)
External clock
switchover
signal
(3)
EXTAL
Internal
clock φ
Wait time
External
interrupt
200 ns or more(4)
Active (external clock 2)
Software standby mode
Active (external clock 1)
(1)
(2)
(3)
(4)
Port setting (clock switchover)
Software standby mode transition
External clock switchover
External interrupt generation
(Input interrupt at least 200 ns after transition to software standby mode.)
(5) Interrupt exception handling
Figure 19.12 Example of External Clock Switchover Timing
Rev.6.00 Jun. 03, 2008 Page 606 of 698
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Section 20 Power-Down Modes
Section 20 Power-Down Modes
In addition to the normal program execution state, this LSI has five power-down modes in which
operation of the CPU and oscillator is halted and power dissipation is reduced. Low-power
operation can be achieved by individually controlling the CPU, on-chip supporting modules, and
so on.
This LSI's operating modes are high-speed mode and five power down modes:
1. Medium-speed mode
2. Subactive mode
3. Sleep mode
4. Subsleep mode
5. Watch mode
6. Module stop mode
7. Software standby mode
8. Hardware standby mode
1. to 5. are power-down modes. Sleep mode is CPU states, medium-speed mode is a CPU and bus
master state, subactive mode is a CPU, bus master, and on-chip peripheral function state, and
module stop mode is an internal peripheral function (including bus masters other than the CPU)
state. Some of these states can be combined.
After a reset, the LSI is in high-speed mode, flash memory, and module stop mode (other than
DMAC).
Table 20.1 and table 20.2 show the LSI internal states in each mode and the transition conditions
of power-down modes respectively. Figure 20.1 shows the diagram of mode transition.
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Section 20 Power-Down Modes
Table 20.1 LSI Internal States in Each Mode
HighSpeed
MediumSpeed
Sleep
Module
Stop
System clock pulse generator
Functioning
Functioning
Functioning
Subclock pulse generator
Functioning/halted
Functioning/halted
CPU
Function-
Medium-
ing
speed
operation
Function
Instructions
Registers
RAM
I/O
Watch
Subactive
Subsleep
Software
Standby
Hardware
Standby
Functioning
Halted
Halted
Halted
Halted
Halted
Functioning/halted
Functioning/halted
Functioning
Functioning
Functioning
Functioning/halted
Halted
Halted
Function-
Halted
Subclock
Halted
Halted
Halted
Retained
Retained
Undefined
Retained
Retained
Retained
ing
Retained
operation
Retained
Function-
Function-
Function-
Function-
ing
ing
ing
ing
Retained
Function-
Functioning
Functioning
Functioning
Functioning
Retained
Functioning
Functioning
Halted
High
impedance
Halted
ing
External
NMI
Function-
Function-
Function-
Function-
Function-
Function-
Function-
Function-
interrupts
IRQ0 to
IRQ4, IRQ7
ing
ing
ing
ing
ing
ing
ing
ing
Peripheral
functions
DMAC
Functioning
Mediumspeed
operation
Functioning
Halted
(retained)
Halted
(retained)
Halted
(retained)
Halted
(retained)
Halted
(retained)
Halted
(reset)
Function-
Function-
Function-
Function-
Halted
Subclock
Subclock
Halted
Halted
ing
ing
ing
ing
(retained)
operation
operation
(retained)
(reset)
Clock
Subclock
operation operation
Subclock
operation
Subclock
operation
Halted
(retained)
Subclock
operation
Subclock
operation
Subclock
operation
Subclock
Halted
functioning/ (reset)
halted
Free-
Function-
Function-
Halted
Halted
Halted
Halted
Halted
Halted
ing
ing
(retained)
(retained)
(retained)
(retained)
(retained)
(reset)
Functioning
Functioning
Functioning
Halted
(retained)
Halted
(retained)
Halted
(retained)
Halted
(retained)
Halted
(retained)
Halted
(reset)
Functioning
Functioning
Functioning
Halted
(reset)
Halted
(reset)
Halted
(reset)
Halted
(reset)
Halted
(reset)
Halted
(reset)
Function-
Function
Function-
Halted
Function not guaranteed.
Halted
Halted
ing
not
ing
guaranteed
(retained)
(reset)
WDT
RTC
Function-
running
ing
timer
operation
TPU
SCI
A/D
USB
PLL
circuit
(retained)
Halted
Always select module stop mode.
Halted
Notes: "Halted (retained)" means that internal register values are retained. The internal state is
"operation suspended."
"Halted (reset)" means that internal register values and internal states are initialized.
In module stop mode, only modules for which a stop setting has been made are halted
(reset or retained).
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Section 20 Power-Down Modes
Reset execution state
Program-halted state
STBY pin = Low
Manual
reset state
Power-on
reset state
MRES pin = High
Hardware
standby mode
STBY pin = High
RES pin = Low
RES pin = High
SSBY = 0, LSON = 0
Program execution state
Sleep mode
(main clock)
SLEEP instruction
High-speed mode
(main clock)
SCK2 to
SCK0 = 0
SCK2 to
SCK0 ≠ 0
Medium-speed
mode
(main clock)
SLEEP Instruction
SLEEP Instruction
SSBY = 1, PSS = 1,
SSBY = 1, PSS = 1,
DTON = 1, LSON = 0
DTON = 1, LSON = 1
After the oscillation
Clock switching
settling time (STS2 to 0),
exception processing
clock switching exception
processing
Sub-active
mode
(sub clock)
: Transition after exception processing
Notes:
Any interrupt
SLEEP instruction
Interrupt *1
SSBY = 1,
PSS = 0, LSON = 0
Software
standby mode
SLEEP instruction
*1,
Interrupt
LSON bit = 0
SLEEP instruction
Interrupt *1,
LSON bit = 1
SLEEP instruction
Interrupt *2
SSBY = 1,
PSS = 1, DTON = 0
Watch mode
(subclock)
SSBY = 0,
PSS = 1, LSON = 1
Sub-speed mode
(subclock)
: Power-down
When a transition is made between modes by means of an interrupt, the transition cannot be
made on interrupt source generation alone. Ensure that interrupt handling is performed after
accepting the interrupt request.
From any state except hardware standby mode, a transition to the power-on reset state occurs
when RES is driven low. From any state except hardware standby mode and power-on reset, a
transition to the manual reset state occurs when MRES is driven low.
From any state, a transition to hardware standby mode occurs when STBY is driven low.
Always select high-speed mode before making a transition to watch mode or subactive mode.
1. NMI and IRQ0 to IRQ4, IRQ7, RTC interrupt, and USB suspend/resume interrupt
2. NMI and IRQ0 to IRQ4, IRQ7, RTC interrupt, and WDT interrupt
Figure 20.1 Mode Transition Diagram
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Section 20 Power-Down Modes
Table 20.2 Transition Conditions of Power-Down Modes
Pre-Transition
State
High-speed/
Medium-speed
Subactive
Status of Control Bit
at Transition
SSBY PSS
State after Transition
Invoked by SLEEP
LSON DTON Command
State after Transition Back from
Power-Down Mode Invoked by
Interrupt
0
×
0
×
Sleep
High-speed/Medium-speed
0
×
1
×
—
—
1
0
0
×
Software standby
High-speed/Medium-speed
1
0
1
×
—
—
1
1
0
0
Watch
High-speed
1
1
1
0
Watch
Subactive
1
1
0
1
—
—
1
1
1
1
Subactive
—
0
0
×
×
—
—
0
1
0
×
—
—
0
1
1
×
Sub sleep
Subactive
1
0
×
×
—
—
1
1
0
0
Watch
High-speed
1
1
1
0
Watch
Subactive
1
1
0
1
High-speed
—
1
1
1
1
—
—
Legend:
×: Don’t care
—: Do not set
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Section 20 Power-Down Modes
20.1
Register Descriptions
The registers relating to the power down mode are shown below. For details on the low power
control register (LPWRCR), refer to section 19.1.2, Low Power Control Register (LPWRCR). For
details on the system clock control register (SCKCR), refer to section 19.1.1, System Clock
Control Register (SCKCR).
• Standby control register (SBYCR)
• System clock control register (SCKCR)
• Low power control register (LPWRCR)
• Timer control/status register (TCSR_1)
• Module stop control register A (MSTPCRA)
• Module stop control register B (MSTPCRB)
• Module stop control register C (MSTPCRC)
• Extended module stop register (EXMDLSTP)
20.1.1
Standby Control Register (SBYCR)
SBYCR performs software standby mode control.
Bit
Bit Name Initial Value
R/W
Description
7
SSBY
R/W
Software Standby
0
This bit specifies the transition mode after executing the
SLEEP instruction
0: Shifts to sleep mode when the SLEEP instruction is
executed in high-speed mode or medium-speed
mode.
Shifts to subsleep mode when the SLEEP instruction
is executed in subactive mode.
1: Shifts to software standby mode, subactive mode, or
watch mode when the SLEEP instruction is executed
in high-speed mode or medium-speed mode.
Shifts to watch mode or high-speed mode when the
SLEEP instruction is executed in subactive mode.
This bit does not change when clearing software standby
mode by using external interrupts and shifting to normal
operation. 0 should be written to this bit for clearing.
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Section 20 Power-Down Modes
Bit
Bit Name Initial Value
R/W
Description
6
STS2
0
R/W
Standby Timer Select 2 to 0
5
STS1
0
R/W
4
STS0
0
R/W
These bits select the MCU wait time for clock
stabilization when cancel software standby mode, watch
mode, or subactive mode by an external interrupt. With
a crystal oscillator (tables 20.3 and 20.4), select a wait
time of tOSC2 ms (oscillation stabilization time) or more,
depending on the operating frequency. With an external
clock, there are no specific wait requirements. However,
in the F-ZTAT version a standby time of 16 wait states
cannot be used with an external clock. In this case,
select a wait time of 100 μs or more.
000: Standby time = 8192 states
001: Standby time = 16384 states
010: Standby time = 32768 states
011: Standby time = 65536 states
100: Standby time = 131072 states
101: Standby time = 262144 states
110: Standby time = 2048 states
111: Standby time = 16 states
3
OPE
1
R/W
Output Port Enable
This bit selects whether address bus and bus control
signals (CS0 to CS7, AS, RD, HWR, and LWR) are
brought to high impedance state or retained in software
standby mode, watch mode, or direct transition.
0: High impedance state
1: Retained
2 to 0 —
All 0
—
Reserved
These bits are always read as 0, and cannot be
modified.
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Section 20 Power-Down Modes
20.1.2
Timer Control/Status Register (TCSR_1)
TCSR_1 controls the operation in power-down mode transition.
Bit
Bit Name
7 to 5 ⎯
Initial Value
R/W
All 0
⎯
Description
Reserved
The write value should always be 0.
4
PSS
0
R/W
Prescaler Select
0: When the SLEEP instruction is executed in highspeed mode or medium-speed mode, operation
shifts to sleep mode or software standby mode.
1: When the SLEEP instruction is executed in highspeed mode or medium-speed mode, operation
shifts to sleep mode, watch mode, or subactive
mode.
When the SLEEP instruction is executed in
subactive mode, operation shifts to subsleep
mode, watch mode, or high-speed mode
TCSR_1 differs from other registers in being more
difficult to write to. The procedures for writing to
and reading this register are given below.
Write:
TCSR_1 must be written to by a word transfer
instruction. The upper byte of the written word must
contain H′A5 and the lower byte must contain the
write data. (When the PSS bit is set to 1, the upper
byte of the written word must contain H'A510.)
Read:
TCSR_1 is read by the same procedure as for the
general registers.
3 to 0 —
All 0
—
Reserved
The write value should always be 0.
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Section 20 Power-Down Modes
20.1.3
Module Stop Control Registers A to C (MSTPCRA to MSTPCRC)
MSTPCR, comprising three 8-bit readable/writable registers, performs module stop mode control.
Setting a bit to 1, causes the corresponding module to enter module stop mode, while clearing the
bit to 0 clears the module stop mode.
MSTPCRA
Bit
Bit Name
Initial Value
R/W
Module
7
MSTPA7
0
R/W
DMA controller (DMAC)
6
MSTPA6*
0
R/W
⎯
5
MSTPA5
1
R/W
16-bit timer pulse unit (TPU)
4
MSTPA4*
1
R/W
⎯
3
MSTPA3*
1
R/W
⎯
2
MSTPA2*
1
R/W
⎯
1
MSTPA1
1
R/W
A/D converter
0
MSTPA0*
1
R/W
⎯
MSTPCRB
Bit
Bit Name
Initial Value
R/W
Module
7
MSTPB7
1
R/W
Serial communication interface 0 (SCI_0)
6
MSTPB6*
1
R/W
⎯
5
MSTPB5
1
R/W
Serial communication interface 2 (SCI_2)
4
MSTPB4*
1
R/W
⎯
3
MSTPB3*
1
R/W
⎯
2
MSTPB2*
1
R/W
⎯
1
MSTPB1*
1
R/W
⎯
0
MSTPB0
1
R/W
USB
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Section 20 Power-Down Modes
MSTPCRC
Bit
Bit Name
Initial Value
R/W
Module
7
MSTPC7*
1
R/W
⎯
6
MSTPC6*
1
R/W
⎯
5
MSTPC5*
1
R/W
⎯
4
MSTPC4*
1
R/W
⎯
3
MSTPC3*
1
R/W
⎯
2
MSTPC2*
1
R/W
⎯
1
MSTPC1
0
R/W
Flash Memory (This bit is reserved in the masked
ROM version; setting is disabled.)
Note: Setting of the flash memory module stop
mode should be carried out while the
programs in the on-chip RAM and external
memory are executed. If the flash memory is
stopped with the programming in the flash
memory, the program after setting module
stop mode stops and enters to the deadlock
state.
Figure 20.2 shows the example of using
module stop mode.
0
MSTPC0*
1
R/W
⎯
Note: * MSTPA6 are readable/writable bits with an initial value of 0 and should always be written
with 1.
MSTPA4 to MSTPA2, MSTPA0, MSTPB6, MSTPB4 to MSTPB1, MSTPC7 to MSTPC2,
MSTPC0 are readable/writable bits with an initial value of 1 and should always be written
with 1.
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Section 20 Power-Down Modes
Program executed module
Execute flash memory program
Power-down mode
setting required?
No
Flash memory
Yes
For interrupt processing, enable
RAM emulation function of EB0
area in flash memory and copy
part of vector address and
program to on-chip RAM
Branch to on-chip RAM program
Write 1 to flash memory module
stop bit using on-chip RAM
program
Operation in power-down mode
by entering flash memory module
stop mode
Flash memory program
execution is required?
No
On-chip RAM
Yes
Write 0 to flash memory module
stop bit by on-chip RAM program
Wait for longer than
flash memory power supply
stabilization time:
100 μs or longer
No
Yes
Return to flash memory program
Execute flash memory program
Flash memory
Figure 20.2 Example of Flash Memory Module Stop Mode Usage
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Section 20 Power-Down Modes
20.1.4
Extended Module Stop Register (EXMDLSTP)
EXMDLSTP controls the clock supply of the RTC and USB, performs module stop mode control.
Setting a bit to 1, causes the corresponding module to enter module stop mode, while clearing the
bit to 0 clears the module stop mode.
Bit
Bit Name
Initial Value
R/W
Module
7 to
2
⎯
Undefined
⎯
Reserved
1
RTCSTOP
0
R/W
RTC
0
USBSTOP1
0
R/W
USB
20.2
Read is undefined. These bits should not to be
modified.
Medium-Speed Mode
When the SCK2 to SCK0 bits in SCKCR are set to 1, the operating mode changes to mediumspeed mode as soon as the current bus cycle ends. In medium-speed mode, the CPU operates on
the operating clock (φ/2, φ/4, φ/8, φ/16, or φ/32) specified by the SCK2 to SCK0 bits. The bus
masters other than the CPU (DMAC) also operate in medium-speed mode. On-chip supporting
modules other than the bus masters always operate on the high-speed clock (φ).
In medium-speed mode, a bus access is executed in the specified number of states with respect to
the bus master operating clock. For example, if φ/4 is selected as the operating clock, on-chip
memory is accessed in 4 states, and internal I/O registers in 8 states.
Medium-speed mode is cleared by clearing all of bits SCK2 to SCK0 to 0. A transition is made to
high-speed mode and medium-speed mode is cleared at the end of the current bus cycle.
If a SLEEP instruction is executed when the SSBY bit in SBYCR, the LSON bit in LPWRCR are
cleared to 0, a transition is made to sleep mode. When sleep mode is cleared by an interrupt,
medium-speed mode is restored.
When the SLEEP instruction is executed with the SSBY bit = 1 and the LSON bit, and the PSS bit
in TCSR_1 are cleared to 0, operation shifts to the software standby mode. When software standby
mode is cleared by an external interrupt, medium-speed mode is restored.
When the RES or MRES* pin is set low and medium-speed mode is cancelled, operation shifts to
the reset state. The same applies in the case of a reset caused by overflow of the watchdog timer.
When the STBY pin is driven low, a transition is made to hardware standby mode.
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Section 20 Power-Down Modes
Figure 20.3 shows the timing for transition to and clearance of medium-speed mode.
Note: * Supported only by the H8S/2218 Group.
Medium-speed mode
φ,
supporting module clock
Bus master clock
Internal address bus
SCKCR
SCKCR
Internal write signal
Figure 20.3 Medium-Speed Mode Transition and Clearance Timing
20.3
Sleep Mode
20.3.1
Transition to Sleep Mode
When the SLEEP instruction is executed when the SSBY bit in SBYCR and the LSON bit in
LPWRCR are cleared to 0, the CPU enters the sleep mode. In sleep mode, CPU operation stops
but the contents of the CPU's internal registers are retained. Other supporting modules do not stop.
20.3.2
Exiting Sleep Mode
Sleep mode is exited by any interrupt, or signals at the RES, MRES*, or STBY pin.
• Exiting Sleep Mode by Interrupts
When an interrupt occurs, sleep mode is exited and interrupt exception processing starts. Sleep
mode is not exited if the interrupt is disabled, or interrupts other than NMI are masked by the
CPU.
• Exiting Sleep Mode by RES or MRES* Pin
Setting the RES or MRES* pin level Low selects the reset state. After the stipulated reset input
duration, driving the RES or MRES* pin High starts the CPU performing reset exception
processing.
• Exiting Sleep Mode by STBY Pin
When the STBY pin level is driven Low, a transition is made to hardware standby mode.
Note: * Supported only by the H8S/2218 Group.
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Section 20 Power-Down Modes
20.4
Software Standby Mode
20.4.1
Transition to Software Standby Mode
A transition is made to software standby mode when the SLEEP instruction is executed when the
SSBY bit in SBYCR is set to 1 and the LSON bit in LPWRCR and the PSS bit in TCSR_1 are
cleared to 0. In this mode, the CPU, on-chip supporting modules, and oscillator all stop. However,
the contents of the CPU's internal registers, RAM data, and the states of on-chip supporting
modules other than the A/D converter, and the states of I/O ports, are retained. In this mode the
oscillator stops, and therefore power dissipation is significantly reduced.
20.4.2
Clearing Software Standby Mode
Software standby mode is cleared by an external interrupt (NMI pin, IRQ7 pin, or IRQ0 to IRQ4
pins), RTC interrupt (IRQ5 signal), or USB suspend/resume interrupt (IRQ6 signal), or by means
of the RES pin, MRES pin*, or STBY pin.
• Clearing with an interrupt
When an NMI or IRQ0 to IRQ7 interrupt request signal is input, clock oscillation starts, and
after the elapse of the time set in bits STS2 to STS0 in SBYCR, stable clocks are supplied to
the entire chip, software standby mode is cleared, and interrupt exception handling is started.
When clearing software standby mode with an IRQ0 to IRQ7 interrupt, set the corresponding
enable bit to 1 and ensure that no interrupt with a higher priority than interrupts IRQ0 to IRQ5
is generated. Software standby mode cannot be cleared if the interrupt has been masked on the
CPU side.
• Clearing with the RES or MRES* pin
When the RES or MRES* pin is driven low, clock oscillation is started. At the same time as
clock oscillation starts, clocks are supplied to the entire chip. Note that the RES or MRES* pin
must be held low until clock oscillation stabilizes. When the RES or MRES* pin goes high, the
CPU begins reset exception handling.
• Clearing with the STBY pin
When the STBY pin is driven low, a transition is made to hardware standby mode.
Note: * Supported only by the H8S/2218 Group.
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Section 20 Power-Down Modes
20.4.3
Setting Oscillation Stabilization Time after Clearing Software Standby Mode
Bits STS2 to STS0 in SBYCR should be set as described below.
• Using a Crystal Oscillator:
Set bits STS2 to STS0 so that the standby time is at least tOSC2 ms (the oscillation stabilization
time).
Table 20.3 shows the standby times for different operating frequencies and settings of bits
STS2 to STS0.
• Using an External Clock
Set bits STS2 to STS0 as any value. Usually, minimum value is recommended. A standby time
of 100 μs or longer (flash memory power supply stabilization time) should be used in the FZTAT version.
Table 20.3 Oscillation Stabilization Time Settings
STS2 STS1 STS0 Standby Time
0
0
1
1
0
1
24MHz 20MHz 16MHz 13MHz 10MHz 8MHz
6MHz
4MHz
2MHz
Unit
ms
0
8192 states
0.34
0.41
0.51
0.63
0.82
1.0
1.4
2.0
4.1
1
16384 states
0.68
0.82
1.0
1.3
1.6
2.0
2.7
4.1
8.2
0
32768 states
1.4
1.6
2.0
2.5
3.3
4.1
5.5
8.2
16.4
1
65536 states
2.7
3.3
4.1
5.0
6.6
8.2
10.9
16.4
32.8
0
131072 states
5.5
6.6
8.2
10.1
13.1
16.4
21.8
32.8
65.5
1
262144 states
10.9
13.1
16.4
20.2
26.2
32.8
43.7
65.5
131.1
0
2048 states
0.09
0.10
0.13
0.16
0.20
0.26
0.34
0.51
1.0
1
16 states
0.67
0.80
1.0
1.2
1.6
2.0
2.7
4.0
8.0
µs
: Recommended time setting (For conditions, see tOSC2 in table 22.4.)
20.4.4
Software Standby Mode Application Example
Figure 20.4 shows an example in which a transition is made to software standby mode at the
falling edge on the NMI pin, and software standby mode is cleared at the rising edge on the NMI
pin.
In this example, an NMI interrupt is accepted with the NMIEG bit in SYSCR cleared to 0 (falling
edge specification), then the NMIEG bit is set to 1 (rising edge specification), the SSBY bit is set
to 1, and a SLEEP instruction is executed, causing a transition to software standby mode.
Software standby mode is then cleared at the rising edge on the NMI pin.
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Section 20 Power-Down Modes
Oscillator
φ
NMI
NMIEG
SSBY
NMI exception
handling
NMIEG = 1
SSBY = 1
Software standby mode
(power-down mode)
SLEEP instruction
NMI exception
handling
Oscillation
stabilization
time tOSC2
Figure 20.4 Software Standby Mode Application Example
20.5
Hardware Standby Mode
20.5.1
Transition to Hardware Standby Mode
When the STBY pin is driven low, a transition is made to hardware standby mode from any mode.
In hardware standby mode, all functions enter the reset state and stop operation, resulting in a
significant reduction in power dissipation. As long as the prescribed voltage is supplied, on-chip
RAM data is retained. I/O ports are set to the high-impedance state.
In order to retain on-chip RAM data, the RAME bit in SYSCR should be cleared to 0 before
driving the STBY pin low.
Do not change the state of the mode pins (MD2 to MD0) while this LSI is in hardware standby
mode.
20.5.2
Clearing Hardware Standby Mode
Hardware standby mode is cleared by means of the STBY pin and the RES pin. When the STBY
pin is driven high while the RES pin is low, the reset state is set and clock oscillation is started.
Ensure that the RES pin is held low until the clock oscillator stabilizes (at least tosc1—the
oscillation stabilization time—when using a crystal oscillator). When the RES pin is subsequently
driven high, a transition is made to the program execution state via the reset exception handling
state.
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Section 20 Power-Down Modes
20.5.3
Hardware Standby Mode Timing
Figure 20.5 shows an example of hardware standby mode timing.
When the STBY pin is driven low after the RES pin has been driven low, a transition is made to
hardware standby mode. Hardware standby mode is cleared by driving the STBY pin high, waiting
for the oscillation stabilization time, then changing the RES pin from low to high.
Oscillator
RES
STBY
Oscillation
stabilization
time tOSC1
Reset exception
handling
Figure 20.5 Hardware Standby Mode Timing (Example)
20.5.4
Hardware Standby Mode Timings
Timing of Transition to Hardware Standby Mode:
1. To retain RAM contents with the RAME bit set to 1 in SYSCR
Drive the RES signal low at least 10 states before the STBY signal goes low, as shown in
figure 20.6. After STBY has gone low, RES has to wait for at least 0 ns before becoming high.
STBY
t1 ≥ 10 tcyc
t2 ≥ 0 ns
RES
Figure 20.6 Timing of Transition to Hardware Standby Mode
2. To retain RAM contents with the RAME bit cleared to 0 in SYSCR, or when RAM contents do
not need to be retained
RES does not have to be driven low as in the above case.
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Section 20 Power-Down Modes
Timing of Recovery from Hardware Standby Mode:
Drive the RES signal low approximately 100 ns or more before STBY goes high to execute a
power-on reset.
STBY
t ≥100 ns
tOSC
RES
tNMIRH
NMI
Figure 20.7 Timing of Recovery from Hardware Standby Mode
20.6
Module Stop Mode
Module stop mode can be set for individual on-chip supporting modules.
When the corresponding MSTP bit in MSTPCR is set to 1, module operation stops at the end of
the bus cycle and a transition is made to module stop mode. The CPU continues operating
independently.
When the corresponding MSTP bit is cleared to 0, module stop mode is cleared and the module
starts operating at the end of the bus cycle. In module stop mode, the internal states of modules
other than the A/D converter are retained.
After reset clearance, all modules other than DMAC and flash memory are in module stop mode.
When an on-chip supporting module is in module stop mode, read/write access to its registers is
disabled.
When a transition is made to sleep mode with all modules stopped, the bus controller and I/O ports
also stop operating, enabling current dissipation to be further reduced.
Rev.6.00 Jun. 03, 2008 Page 623 of 698
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Section 20 Power-Down Modes
20.7
Watch Mode
20.7.1
Transition to Watch Mode
CPU operation makes a transition to watch mode when the SLEEP instruction is executed in highspeed mode or subactive mode with SBYCR SSBY=1, LPWRCR DTON = 0, and TCSR_1
PSS = 1.
In watch mode, the CPU is stopped and peripheral modules other than RTC are also stopped. The
contents of the CPU’s internal registers, the data in internal RAM, and the statuses of the internal
peripheral modules (excluding the A/D converter) and I/O ports are retained. To make a transition
to watch mode, bits SCK2 to SCK0 in SCKCR must be set to 0.
20.7.2
Exiting Watch Mode
Watch mode is exited by any interrupt (WOVI interrupt, NMI pin, or IRQ0, to IRQ7), or signals at
the RES, MRES*, or STBY pin.
• Exiting Watch Mode by Interrupts
When an interrupt occurs, watch mode is exited and a transition is made to high-speed mode or
medium-speed mode when the LPWRCR LSON bit = 0 or to subactive mode when the LSON
bit = 1. When a transition is made to high-speed mode, a stable clock is supplied to all LSI
circuits and interrupt exception processing starts after the time set in SBYCR STS2 to STS0
has elapsed. In case of IRQ0, to IRQ7 interrupts, no transition is made from watch mode if the
corresponding enable bit/pin function switching bit has been cleared to 0, and, in the case of
interrupts from the internal peripheral modules, the interrupt enable register has been set to
disable the reception of that interrupt, or is masked by the CPU.
See section 20.4.3, Setting Oscillation Stablization Time after Clearing Software Standby
Mode, for how to set the oscillation settling time when making a transition from watch mode to
high-speed mode.
• Exiting Watch Mode by RES or MRES* pin
For exiting watch mode by the RES or MRES* pin, see section 20.4.2, Clearing Software
Standby Mode.
• Exiting Watch Mode by STBY pin
When the STBY pin level is driven low, a transition is made to hardware standby mode.
Note:
* Supported only by the H8S/2218 Group.
Rev.6.00 Jun. 03, 2008 Page 624 of 698
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Section 20 Power-Down Modes
20.8
Subsleep Mode
20.8.1
Transition to Sleep Mode
When the SLEEP instruction is executed with the SBYCR SSBY bit = 0, LPWRCR LSON bit = 1,
and TCSR_1 PSS bit = 1, CPU operation shifts to subsleep mode.
In subsleep mode, the CPU is stopped. Peripheral modules other WDT and RTC are also stopped.
The contents of the CPU's internal registers, the data in internal RAM, and the statuses of the
internal peripheral modules (excluding the A/D converter) and I/O ports are retained.
20.8.2
Exiting Subsleep Mode
Subsleep mode is exited by an interrupt (interrupts from internal peripheral modules, NMI pin, or
IRQ0, to IRQ7), or signals at the RES, MRES*, or STBY pin.
• Exiting Subsleep Mode by Interrupts
When an interrupt occurs, subsleep mode is exited and interrupt exception processing starts.
In case of IRQ0, to IRQ7interrupts, subsleep mode is not cancelled if the corresponding enable
bit/pin function switching bit has been cleared to 0, and, in the case of interrupts from the
internal peripheral modules, the interrupt enable register has been set to disable the reception of
that interrupt, or is masked by the CPU.
• Exiting Subsleep Mode by RES or MRES* pin
For exiting subsleep mode by the RES or MRES* pin, see section 20.4.2, Clearing Software
Standby Mode.
• Exiting Subsleep Mode by STBY Pin
When the STBY pin level is driven low, a transition is made to hardware standby mode.
Note: * Supported only by the H8S/2218 Group.
Rev.6.00 Jun. 03, 2008 Page 625 of 698
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Section 20 Power-Down Modes
20.9
Subactive Mode
20.9.1
Transition to Subactive Mode
When the SLEEP instruction is executed in high-speed mode with the SBYCR SSBY bit = 1,
LPWRCR DTON bit = 1, LSON bit = 1, and TCSR_1 PSS bit = 1, CPU operation shifts to
subactive mode. When an interrupt occurs in watch mode, and if the LSON bit of LPWRCR is 1, a
transition is made to subactive mode. And if an interrupt occurs in subsleep mode, a transition is
made to subactive mode.
In subactive mode, the CPU operates at low speed on the subclock, and the program is executed
step by step. Peripheral modules other than WDT and RTC are also stopped.
When operating the CPU in subactive mode, the SCKCR SCK2 to SCK0 bits must be set to 0.
20.9.2
Exiting Subactive Mode
Subactive mode is exited by the SLEEP instruction or the RES, MRES*, or STBY pin.
• Exiting Subactive Mode by SLEEP Instruction
When the SLEEP instruction is executed with the SBYCR SSBY bit = 1, LPWRCR DTON bit
= 0, and TCSR_1 PSS bit = 1, the CPU exits subactive mode and a transition is made to watch
mode. When the SLEEP instruction is executed with the SBYCR SSBY bit = 0, LPWRCR
LSON bit = 1, and TCSR_1 PSS bit = 1, a transition is made to subsleep mode. Finally, when
the SLEEP instruction is executed with the SBYCR SSBY bit = 1, LPWRCR DTON bit = 1,
LSON bit = 0, and TCSR_1 PSS bit = 1, a direct transition is made to high-speed mode (SCK0
to SCK2 all 0).
• Exiting Subactive Mode by RES or MRES* pin
For exiting subactive mode by the RES or MRES* pin, see section 20.4.2, Clearing Software
Standby Mode.
• Exiting Subactive Mode by STBY Pin
When the STBY pin level is driven low, a transition is made to hardware standby mode.
Note: * Supported only by the H8S/2218 Group.
Rev.6.00 Jun. 03, 2008 Page 626 of 698
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Section 20 Power-Down Modes
20.10
Direct Transitions
There are three modes, high-speed, medium-speed, and subactive, in which the CPU executes
programs. When a direct transition is made, there is no interruption of program execution when
shifting between high-speed and subactive modes. Direct transitions are enabled by setting the
LPWRCR DTON bit to 1, then executing the SLEEP instruction. After a transition, direct
transition interrupt exception processing starts.
20.10.1 Direct Transitions from High-Speed Mode to Subactive Mode
Execute the SLEEP instruction in high-speed mode when the SBYCR SSBY bit = 1, LPWRCR
LSON bit = 1, and DTON bit = 1, and TSCR_1 PSS bit = 1 to make a transition to subactive
mode.
20.10.2 Direct Transitions from Subactive Mode to High-Speed Mode
Execute the SLEEP instruction in subactive mode when the SBYCR SSBY bit = 1, LPWRCR
LSON bit = 0, and DTON bit = 1, and TSCR_1 PSS bit = 1 to make a direct transition to highspeed mode after the time set in SBYCR STS2 to STS0 has elapsed.
20.11
φ Clock Output Disabling Function
Output of the φ clock can be controlled by means of the PSTOP bit in SCKCR, and DDR for the
corresponding port. When the PSTOP bit is set to 1, the φ clock stops at the end of the bus cycle,
and φ output goes high. φ clock output is enabled when the PSTOP bit is cleared to 0. When DDR
for the corresponding port is cleared to 0, φ clock output is disabled and input port mode is set.
Table 20.4 shows the state of the φ pin in each processing state.
Table 20.4 φ Pin State in Each Processing State
Register Settings
High-Speed Mode,
Software Standby
Medium-Speed Mode, Sleep Mode, Subsleep Mode, Watch Mode,
Hardware Standby
DDR
PSTOP
Subactive Mode
Mode
Direct Transition
Mode
0
×
High impedance
High impedance
High impedance
High impedance
1
0
φ output
φ output
Fixed high
High impedance
1
1
Fixed high
Fixed high
Fixed high
High impedance
Legend:
×: Don’t care
Rev.6.00 Jun. 03, 2008 Page 627 of 698
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Section 20 Power-Down Modes
20.12
Usage Notes
20.12.1 I/O Port Status
In software standby mode or watch mode, I/O port states are retained. In addition, if the OPE bit is
set to 1, the address bus and bus control signal output are retained. Therefore, there is no reduction
in current dissipation for the output current when a high-level signal is output.
20.12.2 Current Dissipation during Oscillation Stabilization Wait Period
Current dissipation increases during the oscillation stabilization wait period.
20.12.3 Flash Memory Module Stop
Setting of the flash memory module stop mode should be carried out while the programs in the onchip RAM and external memory are executed. For details, see section 20.1.3, Module Stop Control
Registers A to C (MSTPCRA to MSTPCRC).
20.12.4 DMAC Module Stop
Depending on the operating status of the DMAC, the MSTPA7 bit may not be set to 1. Setting of
the DMAC module stop mode should be carried out only when the DMAC is not activated.
For details, section 7, DMA Controller (DMAC).
20.12.5 On-Chip Peripheral Module Interrupt
• Module stop mode
Relevant interrupt operations cannot be performed in module stop mode. Consequently, if
module stop mode is entered when an interrupt has been requested, it will not be possible to
clear the CPU interrupt source or DMAC activation source. Interrupts should therefore be
disabled before setting module stop mode.
• Subactive Mode/Watch Mode
On-chip peripheral modules (DMAC and TPU) that stop operation in subactive mode cannot
clear interrupts in subactive mode. Therefore, if subactive mode is entered when an interrupt is
requested, CPU interrupt factors cannot be cleared.
Interrupts should therefore before executing the SLEEP instruction and entering subactive or
watch mode.
Rev.6.00 Jun. 03, 2008 Page 628 of 698
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Section 20 Power-Down Modes
20.12.6 Entering Subactive/Watch Mode and DMAC and DTC Module Stop
To enter subactive or watch mode, set DMAC to module stop (write 1 to the MSTPA7 bit) and
reading the MSTPA7 bit as 1 before transiting mode. After transiting from subactive mode to
active mode, clear module stop.
When a DMAC activation source is generated in subactive mode, the DMAC is activated when
module stop is cleared following the transition to active mode.
20.12.7 Writing to MSTPCR
MSTPCR should only be written to by the CPU.
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Section 20 Power-Down Modes
Rev.6.00 Jun. 03, 2008 Page 630 of 698
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Section 21 List of Registers
Section 21 List of Registers
The register list gives information on the on-chip I/O register addresses, how the register bits are
configured, and the register states in each operating mode. The information is given as shown
below.
1. Register Addresses (address order)
• Registers are listed from the lower allocation addresses.
• Registers are classified by functional modules.
• The access size is indicated.
2. Register Bits
• Bit configurations of the registers are described in the same order as the Register Addresses
(address order) above.
• Reserved bits are indicated by “⎯” in the bit name column.
• The bit number in the bit-name column indicates that the whole register is allocated as a
counter or for holding data.
• 16-bit or 24-bit registers are indicated from the bit on the MSB side.
3. Register States in Each Operating Mode
• Register states are described in the same order as the Register Addresses (address order) above.
• The register states described here are for the basic operating modes. If there is a specific reset
for an on-chip peripheral module, refer to the section on that on-chip peripheral module.
Rev.6.00 Jun. 03, 2008 Page 631 of 698
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Section 21 List of Registers
21.1
Register Addresses (Address Order)
The data bus width indicates the numbers of bits by which the register is accessed.
The number of access states indicates the number of states based on the specified reference clock.
Register Name
Abbreviation
Number
of Bits
Address
USB reserved area
⎯
⎯
H'C00000 to
Number
Data Bus of Access
Width
States
Module
⎯
⎯
USB
8
3
H'C0007F
USB control register
UCTLR
8
H'C00080
USB test register A
UTSTRA
8
H'C00081
8
3
USB DMAC transfer request register
UDMAR
8
H'C00082
8
3
USB device resume register
UDRR
8
H'C00083
8
3
USB trigger register 0
UTRG0
8
H'C00084
8
3
USB FIFO clear register 0
UFCLR0
8
H'C00086
8
3
USB endpoint stall register 0
UESTL0
8
H'C00088
8
3
USB endpoint stall register 1
UESTL1
8
H'C00089
8
3
USB endpoint data register 0s
UEDR0s
8
H'C00090 to
8
3
8
3
8
3
8
3
8
3
8
3
H'C00093
USB endpoint data register 0i
UEDR0i
8
H'C00094 to
USB endpoint data register 0o
UEDR0o
8
H'C00098 to
USB endpoint data register 3
UEDR3
8
H'C0009C to
USB endpoint data register 1
UEDR1
8
H'C000A0 to
H'C00097
H'C0009B
H'C0009F
H'C000A3
USB endpoint data register 2
UEDR2
8
H'C000A4 to
H'C000A7
Rev.6.00 Jun. 03, 2008 Page 632 of 698
REJ09B0074-0600
Section 21 List of Registers
Register Name
Abbreviation
Number
of Bits
Address
Number
Data Bus of Access
Width
States
Module
USB
USB endpoint receive data size register 0o UESZ0o
8
H'C000BC
8
3
USB endpoint receive data size register 2
UESZ2
8
H'C000BD
8
3
USB interrupt flag register 0
UIFR0
8
H'C000C0
8
3
USB interrupt flag register 1
UIFR1
8
H'C000C1
8
3
USB interrupt flag register 3
UIFR3
8
H'C000C3
8
3
USB interrupt enable register 0
UIER0
8
H'C000C4
8
3
USB interrupt enable register 1
UIER1
8
H'C000C5
8
3
USB interrupt enable register 3
UIER3
8
H'C000C7
8
3
USB interrupt selection register 0
UISR0
8
H'C000C8
8
3
USB interrupt selection register 1
UISR1
8
H'C000C9
8
3
USB interrupt selection register 3
UISR3
8
H'C000CB
8
3
USB data status register
UDSR
8
H'C000CC
8
3
USB configuration value register
UCVR
8
H'C000CF
8
3
USB test register 0
UTSTR0
8
H'C000F0
8
3
USB test register 1
UTSTR1
8
H'C000F1
8
3
USB test register 2
UTSTR2
8
H'C000F2
8
3
USB test register B
UTSTRB
8
H'C000FB
8
3
USB test register C
UTSTRC
8
H'C000FC
8
3
USB test register D
UTSTRD
8
H'C000FD
8
3
USB test register E
UTSTRE
8
H'C000FE
8
3
USB test register F
UTSTRF
8
H'C000FF
8
3
USB reserved area
⎯
⎯
H'C00100 to
H'DFFFFF
⎯
⎯
Serial control register X
SCRX
8
H’FDB4
8
2
FLASH
Rev.6.00 Jun. 03, 2008 Page 633 of 698
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Section 21 List of Registers
Register Name
Abbreviation
Number
of Bits
Address
Number
Data Bus of Access
Width
States
Module
SYSTEM
Standby control register
SBYCR
8
H’FDE4
8
2
System control register
SYSCR
8
H’FDE5
8
2
System clock control register
SCKCR
8
H’FDE6
8
2
Mode control register
MDCR
8
H’FDE7
8
2
Module stop control register A
MSTPCRA
8
H’FDE8
8
2
Module stop control register B
MSTPCRB
8
H’FDE9
8
2
Module stop control register C
MSTPCRC
8
H’FDEA
8
2
Pin function control register
PFCR
8
H’FDEB
8
2
BSC
Low power control register
LPWRCR
8
H’FDEC
8
2
SYSTEM
Clock output control register
OUTCR
8
H’FDEF
8
2
PORT
Serial extended mode register A_0
SEMRA_0
8
H’FDF8
8
2
SCI_0
Serial extended mode register B_0
SEMRB_0
8
H’FDF9
8
2
IRQ sense control register H
ISCRH
8
H’FE12
8
2
IRQ sense control register L
ISCRL
8
H’FE13
8
2
IRQ enable register
IER
8
H’FE14
8
2
IRQ status register
ISR
8
H’FE15
8
2
Port 1 data direction register
P1DDR
8
H’FE30
8
2
Port 3 data direction register
P3DDR
8
H’FE32
8
2
Port 7 data direction register
P7DDR
8
H’FE36
8
2
Port A data direction register
PADDR
8
H'FE39
8
2
Port B data direction register
PBDDR
8
H'FE3A
8
2
Port C data direction register
PCDDR
8
H'FE3B
8
2
Port D data direction register
PDDDR
8
H'FE3C
8
2
Port E data direction register
PEDDR
8
H'FE3D
8
2
Port F data direction register
PFDDR
8
H'FE3E
8
2
Port G data direction register
PGDDR
8
H'FE3F
8
2
Port A pull-up MOS control register
PAPCR
8
H'FE40
8
2
Port B pull-up MOS control register
PBPCR
8
H'FE41
8
2
Port C pull-up MOS control register
PCPCR
8
H'FE42
8
2
Port D pull-up MOS control register
PDPCR
8
H'FE43
8
2
Port E pull-up MOS control register
PEPCR
8
H'FE44
8
2
Port 3 open drain control register
P3ODR
8
H'FE46
8
2
Port A open drain control register
PAODR
8
H'FE47
8
2
Rev.6.00 Jun. 03, 2008 Page 634 of 698
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INT
PORT
Section 21 List of Registers
Register Name
Abbreviation
Number
of Bits
Address
Number
Data Bus of Access
Width
States
Module
TPU
Timer start register
TSTR
8
H'FEB0
16
2
Timer synchro register
TSYR
8
H'FEB1
16
2
Interrupt priority register A
IPRA
8
H'FEC0
8
2
Interrupt priority register B
IPRB
8
H'FEC1
8
2
Interrupt priority register C
IPRC
8
H'FEC2
8
2
Interrupt priority register D
IPRD
8
H'FEC3
8
2
Interrupt priority register E
IPRE
8
H'FEC4
8
2
Interrupt priority register F
IPRF
8
H'FEC5
8
2
Interrupt priority register G
IPRG
8
H'FEC6
8
2
Interrupt priority register J
IPRJ
8
H'FEC9
8
2
INT
Interrupt priority register K
IPRK
8
H'FECA
8
2
Interrupt priority register M
IPRM
8
H'FECC
8
2
Bus width control register
ABWCR
8
H'FED0
8
2
Access state control register
ASTCR
8
H'FED1
8
2
Wait control register H
WCRH
8
H'FED2
8
2
Wait control register L
WCRL
8
H'FED3
8
2
Bus control register H
BCRH
8
H'FED4
8
2
Bus control register L
BCRL
8
H'FED5
8
2
RAM emulation register
RAMER
8
H'FEDB
8
2
FLASH
Memory address register 0A H
MAR0AH
16
H'FEE0
16
2
DMAC
Memory address register 0A L
MAR0AL
16
H'FEE2
16
2
I/O address register 0A
IOAR0A
16
H'FEE4
16
2
Transfer count register 0A
ETCR0A
16
H'FEE6
16
2
Memory address register 0B H
MAR0BH
16
H'FEE8
16
2
Memory address register 0B L
MAR0BL
16
H'FEEA
16
2
I/O address register 0B
IOAR0B
16
H'FEEC
16
2
Transfer count register 0B
ETCR0B
16
H'FEEE
16
2
Memory address register 1A H
MAR1AH
16
H'FEF0
16
2
Memory address register 1A L
MAR1AL
16
H'FEF2
16
2
I/O address register 1A
IOAR1A
16
H'FEF4
16
2
Transfer count register 1A
ETCR1A
16
H'FEF6
16
2
Memory address register 1B H
MAR1BH
16
H'FEF8
16
2
Memory address register 1B L
MAR1BL
16
H'FEFA
16
2
BSC
Rev.6.00 Jun. 03, 2008 Page 635 of 698
REJ09B0074-0600
Section 21 List of Registers
Register Name
Abbreviation
Number
of Bits
Address
Number
Data Bus of Access
Width
States
Module
DMAC
I/O address register 1B
IOAR1B
16
H'FEFC
16
2
Transfer count register 1B
ETCR1B
16
H'FEFE
16
2
Port 1 data register
P1DR
8
H'FF00
8
2
Port 3 data register
P3DR
8
H'FF02
8
2
Port 7 data register
P7DR
8
H'FF06
8
2
Port A data register
PADR
8
H'FF09
8
2
Port B data register
PBDR
8
H'FF0A
8
2
Port C data register
PCDR
8
H'FF0B
8
2
Port D data register
PDDR
8
H'FF0C
8
2
Port E data register
PEDR
8
H'FF0D
8
2
Port F data register
PFDR
8
H'FF0E
8
2
Port G data register
PGDR
8
H'FF0F
8
2
Timer control register_0
TCR_0
8
H'FF10
16
2
Timer mode register_0
TMDR_0
8
H'FF11
16
2
Timer I/O control register H_0
TIORH_0
8
H'FF12
16
2
Timer I/O control register L_0
TIORL_0
8
H'FF13
16
2
Timer interrupt enable register_0
TIER_0
8
H'FF14
16
2
Timer status register_0
TSR_0
8
H'FF15
16
2
Timer counter_0
TCNT_0
16
H'FF16
16
2
Timer general register A_0
TGRA_0
16
H'FF18
16
2
Timer general register B_0
TGRB_0
16
H'FF1A
16
2
Timer general register C_0
TGRC_0
16
H'FF1C
16
2
Timer general register D_0
TGRD_0
16
H'FF1E
16
2
Timer control register_1
TCR_1
8
H'FF20
16
2
Timer mode register_1
TMDR_1
8
H'FF21
16
2
Timer I/O control register _1
TIOR_1
8
H'FF22
16
2
Timer interrupt enable register _1
TIER_1
8
H'FF24
16
2
Timer status register_1
TSR_1
8
H'FF25
16
2
Timer counter_1
TCNT_1
16
H'FF26
16
2
Timer general register A_1
TGRA_1
16
H'FF28
16
2
Timer general register B_1
TGRB_1
16
H'FF2A
16
2
Rev.6.00 Jun. 03, 2008 Page 636 of 698
REJ09B0074-0600
PORT
TPU_0
TPU_1
Section 21 List of Registers
Register Name
Abbreviation
Number
of Bits
Address
Number
Data Bus of Access
Width
States
Module
TPU_2
Timer control register_2
TCR_2
8
H'FF30
16
2
Timer mode register_2
TMDR_2
8
H'FF31
16
2
Timer I/O control register 2
TIOR_2
8
H'FF32
16
2
Timer interrupt enable register 2
TIER_2
8
H'FF34
16
2
Timer status register_2
TSR_2
8
H'FF35
16
2
Timer counter_2
TCNT_2
16
H'FF36
16
2
Timer general register A_2
TGRA_2
16
H'FF38
16
2
Timer general register B_2
TGRB_2
16
H'FF3A
16
2
Extended module stop register
EXMDLSTP
8
H'FF40
8
2
SYSTEM
Second data register/
free running counter data register
RSECDR
8
H'FF48
8
2
RTC
Minute data register
RMINDR
8
H'FF49
8
2
Hour data register
RHRDR
8
H'FF4A
8
2
Day-of-week data register
RWKDR
8
H'FF4B
8
2
RTC control register 1
RTCCR1
8
H'FF4C
8
2
RTC control register 2
RTCCR2
8
H'FF4D
8
2
Clock source select register
RTCCSR
8
H'FF4F
8
2
DMA control register 0A
DMACR0A
8
H'FF62
16
2
DMA control register 0B
DMACR0B
8
H'FF63
16
2
DMA control register 1A
DMACR1A
8
H’FF64
16
2
DMA control register 1B
DMACR1B
8
H’FF65
16
2
DMA band control register
DMABCR
16
H’FF66
16
2
Timer control/status register
TCSR
8
H'FF74
16
2
Timer counter
TCNT
8
H'FF74
(write)
16
2
Timer counter
TCNT
8
H'FF75
(read)
16
2
Reset control/status register
RSTCSR
8
H'FF76
(write)
16
2
Reset control/status register
RSTCSR
8
H'FF77
(read)
16
2
DMAC
WDT
Rev.6.00 Jun. 03, 2008 Page 637 of 698
REJ09B0074-0600
Section 21 List of Registers
Number
Data Bus of Access
Width
States
Module
SCI_0
Register Name
Abbreviation
Number
of Bits
Address
Serial mode register_0
SMR_0
8
H'FF78
8
2
Bit rate register_0
BRR_0
8
H'FF79
8
2
Serial control register_0
SCR_0
8
H'FF7A
8
2
Transmit data register_0
TDR_0
8
H'FF7B
8
2
Serial status register_0
SSR_0
8
H'FF7C
8
2
Receive data register_0
RDR_0
8
H'FF7D
8
2
Smart card mode register_0
SCMR_0
8
H'FF7E
8
2
Serial mode register_2
SMR_2
8
H'FF88
8
2
Bit rate register_2
BRR_2
8
H'FF89
8
2
Serial control register_2
SCR_2
8
H'FF8A
8
2
Transmit data register_2
TDR_2
8
H'FF8B
8
2
Serial status register_2
SSR_2
8
H'FF8C
8
2
Receive data register_2
RDR_2
8
H'FF8D
8
2
Smart card mode register_2
SCMR_2
8
H'FF8E
8
2
A/D data register AH
ADDRAH
8
H'FF90
8
2
A/D data register AL
ADDRAL
8
H'FF91
8
2
A/D data register BH
ADDRBH
8
H'FF92
8
2
A/D data register BL
ADDRBL
8
H'FF93
8
2
A/D data register CH
ADDRCH
8
H'FF94
8
2
A/D data register CL
ADDRCL
8
H'FF95
8
2
A/D data register DH
ADDRDH
8
H'FF96
8
2
SCI_2
A/D
A/D data register DL
ADDRDL
8
H'FF97
8
2
A/D control/status register
ADCSR
8
H'FF98
8
2
A/D control register
ADCR
8
H'FF99
8
2
Timer control/status register
TCSR_1
8
H'FFA2
16
2
SYSTEM
Flash memory control register 1
FLMCR1
8
H'FFA8
8
2
FLASH
Flash memory control register 2
FLMCR2
8
H'FFA9
8
2
Erase block register 1
EBR1
8
H'FFAA
8
2
Erase block register 2
EBR2
8
H'FFAB
8
2
Rev.6.00 Jun. 03, 2008 Page 638 of 698
REJ09B0074-0600
Section 21 List of Registers
Number
Data Bus of Access
Width
States
Module
PORT
Register Name
Abbreviation
Number
of Bits
Address
Port 1 register
PORT1
8
H'FFB0
8
2
Port 3 register
PORT3
8
H'FFB2
8
2
Port 4 register
PORT4
8
H'FFB3
8
2
Port 7 register
PORT7
8
H'FFB6
8
2
Port 9 register
PORT9
8
H'FFB8
8
2
Port A register
PORTA
8
H'FFB9
8
2
Port B register
PORTB
8
H'FFBA
8
2
Port C register
PORTC
8
H'FFBB
8
2
Port D register
PORTD
8
H'FFBC
8
2
Port E register
PORTE
8
H'FFBD
8
2
Port F register
PORTF
8
H'FFBE
8
2
Port G register
PORTG
8
H'FFBF
8
2
Rev.6.00 Jun. 03, 2008 Page 639 of 698
REJ09B0074-0600
Section 21 List of Registers
21.2
Register Bits
Register bit names of the on-chip peripheral modules are described below.
Each line covers eight bits, so 16-bit registers are shown as two lines and 32-bit registers as four
lines.
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
UCTLR
⎯
USPNDE
UCKS3
UCKS2
UCKS1
UCKS0
UIFRST
UDCRST
USB
UTSTRA
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
UDMAR
⎯
⎯
⎯
⎯
EP2T1
EP2T0
EP1T1
EP1T0
UDRR
⎯
⎯
⎯
⎯
⎯
⎯
RWUPs
DVR
UTRG0
⎯
⎯
EP2RDFN
EP1PKTE
EP3PKTE
EP0oRDFN EP0iPKTE EP0sRDFN
UFCLR0
⎯
⎯
EP2CLR
EP1CLR
EP3CLR
EP0oCLR
UESTL0
⎯
⎯
EP2STL
EP1STL
EP3STL
⎯
⎯
EP0STL
UESTL1
SCME
⎯
⎯
⎯
⎯
⎯
⎯
⎯
UEDR0s
D7
D6
D5
D4
D3
D2
D1
D0
UEDR0i
D7
D6
D5
D4
D3
D2
D1
D0
UEDR0o
D7
D6
D5
D4
D3
D2
D1
D0
UEDR3
D7
D6
D5
D4
D3
D2
D1
D0
UEDR1
D7
D6
D5
D4
D3
D2
D1
D0
UEDR2
D7
D6
D5
D4
D3
D2
D1
D0
UESZ0o
⎯
D6
D5
D4
D3
D2
D1
D0
UESZ2
⎯
D6
D5
D4
D3
D2
D1
D0
UIFR0
BRST
⎯
EP3TR
EP3TS
EP0oTS
EP0iTR
EP0iTS
SetupTS
UIFR1
⎯
⎯
⎯
⎯
EP1ALL
EMPTYs
EP2
READY
EP1TR
EP1
EMPTY
UIFR3
CK48
READY
SOF
SETC
⎯
SPRSs
SPRSi
VBUSs
VBUSi
UIER0
BRSTE
⎯
EP3TRE
EP3TSE
EP0oTSE
EP0iTRE
EP0iTSE
SetupTSE
UIER1
⎯
⎯
⎯
⎯
⎯
EP2
READYE
EP1TRE
EP1
EMPTYE
UIER3
CK48
SOFE
SETCE
⎯
⎯
SPRSiE
⎯
VBUSiE
⎯
EP3TRS
EP3TSS
EP0oTSS
EP0iTRS
EP0iTSS
SetupTSS
EP0iCLR
⎯
READYE
UISR0
BRSTS
Rev.6.00 Jun. 03, 2008 Page 640 of 698
REJ09B0074-0600
Section 21 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
UISR1
⎯
⎯
⎯
⎯
⎯
EP2
READYS
EP1TRS
EP1
EMPTYS
USB
UISR3
CK48
READYS
SOFS
SETCS
⎯
⎯
⎯
⎯
VBUSiS
UDSR
⎯
⎯
⎯
⎯
⎯
EP1DE
EP3DE
EP0iDE
UCVR
⎯
⎯
CNFV0
⎯
⎯
⎯
⎯
⎯
UTSTR0
PTSTE
⎯
⎯
⎯
SUSPEND OE
FSE0
VPO
UTSTR1
VBUS
UBPM
⎯
⎯
⎯
RCV
VP
VM
UTSTR2
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
UTSTRB
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
UTSTRC
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
UTSTRD
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
UTSTRE
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
UTSTRF
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
SCRX
⎯
⎯
⎯
⎯
FLSHE
⎯
⎯
⎯
FLASH
SBYCR
SSBY
STS2
STS1
STS0
OPE
⎯
⎯
⎯
SYSTEM
SYSCR
⎯
⎯
INTM1
INTM0
NMIEG
MRESE
⎯
RAME
SCKCR
PSTOP
⎯
⎯
⎯
⎯
SCK2
SCK1
SCK0
MDCR
⎯
⎯
⎯
⎯
FWE
MDS2
MDS1
MDS0
MSTPCRA
MSTPA7
MSTPA6
MSTPA5
MSTPA4
MSTPA3
MSTPA2
MSTPA1
MSTPA0
MSTPCRB
MSTPB7
MSTPB6
MSTPB5
MSTPB4
MSTPB3
MSTPB2
MSTPB1
MSTPB0
MSTPCRC
MSTPC7
MSTPC6
MSTPC5
MSTPC4
MSTPC3
MSTPC2
MSTPC1
MSTPC0
PFCR
⎯
⎯
⎯
⎯
AE3
AE2
AE1
AE0
BSC
LPWRCR
DTON
LSON
NESEL
SUBSTP
RFCUT
⎯
STC1
STC0
SYSTEM
OUTCR
⎯
⎯
⎯
⎯
⎯
PF7OUT2
PF7OUT1
PF7OUT0
PORT
SEMRA_0
SSE
TCS2
TCS1
TCS0
ABCS
ACS2
ACS1
ACS0
SCI_0
SEMRB_0
ACS3
⎯
⎯
⎯
TIOCA2E
TIOCA1E
TIOCC0E
TIOCA0E
ISCRH
IRQ7SCB
IRQ7SCA
IRQ6SCB
IRQ6SCA
IRQ5SCB
IRQ5SCA
IRQ4SCB
IRQ4SCA
ISCRL
IRQ3SCB
IRQ3SCA
IRQ2SCB
IRQ2SCA
IRQ1SCB
IRQ1SCA
IRQ0SCB
IRQ0SCA
IER
IRQ7E
IRQ6E
IRQ5E
IRQ4E
IRQ3E
IRQ2E
IRQ1E
IRQ0E
ISR
IRQ7F
IRQ6F
IRQ5F
IRQ4F
IRQ3F
IRQ2F
IRQ1F
IRQ0F
INT
Rev.6.00 Jun. 03, 2008 Page 641 of 698
REJ09B0074-0600
Section 21 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
P1DDR
P17DDR
P16DDR
P15DDR
P14DDR
P13DDR
P12DDR
P11DDR
P10DDR
PORT
P3DDR
⎯
P36DDR
⎯
⎯
⎯
P32DDR
P31DDR
P30DDR
P7DDR
P77DDR
P76DDR
P75DDR
P74DDR
⎯
⎯
P71DDR
P70DDR
PADDR
⎯
⎯
⎯
⎯
PA3DDR
PA2DDR
PA1DDR
PA0DDR
PBDDR
PB7DDR
PB6DDR
PB5DDR
PB4DDR
PB3DDR
PB2DDR
PB1DDR
PB0DDR
PCDDR
PC7DDR
PC6DDR
PC5DDR
PC4DDR
PC3DDR
PC2DDR
PC1DDR
PC0DDR
PDDDR
PD7DDR
PD6DDR
PD5DDR
PD4DDR
PD3DDR
PD2DDR
PD1DDR
PD0DDR
PEDDR
PE7DDR
PE6DDR
PE5DDR
PE4DDR
PE3DDR
PE2DDR
PE1DDR
PE0DDR
PFDDR
PF7DDR
PF6DDR
PF5DDR
PF4DDR
PF3DDR
PF2DDR
PF1DDR
PF0DDR
PGDDR
⎯
⎯
⎯
PG4DDR
PG3DDR
PG2DDR
PG1DDR
PG0DDR
PAPCR
⎯
⎯
⎯
⎯
PA3PCR
PA2PCR
PA1PCR
PA0PCR
PBPCR
PB7PCR
PB6PCR
PB5PCR
PB4PCR
PB3PCR
PB2PCR
PB1PCR
PB0PCR
PCPCR
PC7PCR
PC6PCR
PC5PCR
PC4PCR
PC3PCR
PC2PCR
PC1PCR
PC0PCR
PDPCR
PD7PCR
PD6PCR
PD5PCR
PD4PCR
PD3PCR
PD2PCR
PD1PCR
PD0PCR
PEPCR
PE7PCR
PE6PCR
PE5PCR
PE4PCR
PE3PCR
PE2PCR
PE1PCR
PE0PCR
P3ODR
⎯
P36ODR
⎯
⎯
⎯
P32ODR
P31ODR
P30ODR
PAODR
⎯
⎯
⎯
⎯
PA3ODR
PA2ODR
PA1ODR
PA0ODR
TSTR
⎯
⎯
⎯
⎯
⎯
CST2
CST1
CST0
TSYR
⎯
⎯
⎯
⎯
⎯
SYNC2
SYNC1
SYNC0
IPRA
⎯
IPRA6
IPRA5
IPRA4
⎯
IPRA2
IPRA1
IPRA0
IPRB
⎯
IPRB6
IPRB5
IPRB4
⎯
IPRB2
IPRB1
IPRB0
IPRC
⎯
IPRC6
IPRC5
IPRC4
⎯
⎯
⎯
⎯
IPRD
⎯
IPRD6
IPRD5
IPRD4
⎯
⎯
⎯
⎯
IPRE
⎯
⎯
⎯
⎯
⎯
IPRE2
IPRE1
IPRE0
IPRF
⎯
IPRF6
IPRF5
IPRF4
⎯
IPRF2
IPRF1
IPRF0
IPRG
⎯
IPRG6
IPRG5
IPRG4
⎯
⎯
⎯
⎯
IPRJ
⎯
IPRJ6
IPRJ5
IPRJ4
⎯
IPRJ2
IPRJ1
IPRJ0
IPRK
⎯
⎯
⎯
⎯
⎯
IPRK2
IPRK1
IPRK0
IPRM
⎯
IPRM6
IPRM5
IPRM4
⎯
⎯
⎯
⎯
Rev.6.00 Jun. 03, 2008 Page 642 of 698
REJ09B0074-0600
TPU
INT
Section 21 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
ABWCR
ABW7
ABW6
ABW5
ABW4
ABW3
ABW2
ABW1
ABW0
BSC
ASTCR
AST7
AST6
AST5
AST4
AST3
AST2
AST1
AST0
WCRH
W71
W70
W61
W60
W51
W50
W41
W40
WCRL
W31
W30
W21
W20
W11
W10
W01
W00
BCRH
ICIS1
ICIS0
BRSTRM
BRSTS1
BRSTS0
RMTS2
RMTS1
RMTS0
BCRL
BRLE
⎯
⎯
⎯
⎯
⎯
⎯
WAITE
RAMER
⎯
⎯
⎯
⎯
RAMS
⎯
RAM1
RAM0
FLASH
MAR0A
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
DMAC
Bit 23
Bit 22
Bit 21
Bit 20
Bit 19
Bit 18
Bit 17
Bit 16
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
IOAR0A
ETCR0A
MAR0B
IOAR0B
ETCR0B
MAR1A
IOAR1A
ETCR1A
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Bit 23
Bit 22
Bit 21
Bit 20
Bit 19
Bit 18
Bit 17
Bit 16
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Bit 23
Bit 22
Bit 21
Bit 20
Bit 19
Bit 18
Bit 17
Bit 16
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Rev.6.00 Jun. 03, 2008 Page 643 of 698
REJ09B0074-0600
Section 21 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
MAR1B
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
DMAC
Bit 23
Bit 22
Bit 21
Bit 20
Bit 19
Bit 18
Bit 17
Bit 16
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
P1DR
P17DR
P16DR
P15DR
P14DR
P13DR
P12DR
P11DR
P10DR
P3DR
⎯
P36DR
⎯
⎯
⎯
P32DR
P31DR
P30DR
P7DR
P77DR
P76DR
P75DR
P74DR
⎯
⎯
P71DR
P70DR
PADR
⎯
⎯
⎯
⎯
PA3DR
PA2DR
PA1DR
PA0DR
PBDR
PB7DR
PB6DR
PB5DR
PB4DR
PB3DR
PB2DR
PB1DR
PB0DR
PCDR
PC7DR
PC6DR
PC5DR
PC4DR
PC3DR
PC2DR
PC1DR
PC0DR
PDDR
PD7DR
PD6DR
PD5DR
PD4DR
PD3DR
PD2DR
PD1DR
PD0DR
PEDR
PE7DR
PE6DR
PE5DR
PE4DR
PE3DR
PE2DR
PE1DR
PE0DR
PFDR
PF7DR
PF6DR
PF5DR
PF4DR
PF3DR
PF2DR
PF1DR
PF0DR
PGDR
⎯
⎯
⎯
PG4DR
PG3DR
PG2DR
PG1DR
PG0DR
IOAR1B
ETCR1B
TCR_0
CCLR2
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
TMDR_0
⎯
⎯
BFB
BFA
MD3
MD2
MD1
MD0
TIORH_0
IOB3
IOB2
IOB1
IOB0
IOA3
IOA2
IOA1
IOA0
TIORL_0
IOD3
IOD2
IOD1
IOD0
IOC3
IOC2
IOC1
IOC0
TIER_0
TTGE
⎯
⎯
TCIEV
TGIED
TGIEC
TGIEB
TGIEA
TSR_0
⎯
⎯
⎯
TCFV
TGFD
TGFC
TGFB
TGFA
TCNT_0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
TGRA_0
TGRB_0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Rev.6.00 Jun. 03, 2008 Page 644 of 698
REJ09B0074-0600
PORT
TPU_0
Section 21 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
TGRC_0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
TPU_0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
TGRD_0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
TCR_1
⎯
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
TMDR_1
⎯
⎯
⎯
⎯
MD3
MD2
MD1
MD0
TIOR_1
IOB3
IOB2
IOB1
IOB0
IOA3
IOA2
IOA1
IOA0
TIER_1
TTGE
⎯
TCIEU
TCIEV
⎯
⎯
TGIEB
TGIEA
TSR_1
TCFD
⎯
TCFU
TCFV
⎯
⎯
TGFB
TGFA
TCNT_1
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
TGRA_1
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
TCR_2
⎯
CCLR1
CCLR0
CKEG1
CKEG0
TPSC2
TPSC1
TPSC0
TMDR_2
⎯
⎯
⎯
⎯
MD3
MD2
MD1
MD0
TIOR_2
IOB3
IOB2
IOB1
IOB0
IOA3
IOA2
IOA1
IOA0
TIER_2
TTGE
⎯
TCIEU
TCIEV
⎯
⎯
TGIEB
TGIEA
TSR_2
TCFD
⎯
TCFU
TCFV
⎯
⎯
TGFB
TGFA
TCNT_2
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
⎯
⎯
⎯
⎯
⎯
⎯
RTCSTOP USBSTOP1 SYSTEM
TGRB_1
TGRA_2
TGRB_2
EXMDLSTP
TPU_1
TPU_2
Rev.6.00 Jun. 03, 2008 Page 645 of 698
REJ09B0074-0600
Section 21 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
RSECDR
BSY
SC12
SC11
SC10
SC03
SC02
SC01
SC00
RTC
RMINDR
BSY
MN12
MN11
MN10
MN03
MN02
MN01
MN00
RHRDR
BSY
⎯
HR11
HR10
HR03
HR02
HR01
HR00
RWKDR
BSY
⎯
⎯
⎯
⎯
WK2
WK1
KWK0
RTCCR1
RUN
12/24
PM
RST
⎯
⎯
⎯
⎯
RTCCR2
⎯
⎯
FOIE
WKIE
DYIE
HRIE
MNIE
SEIE
⎯
RCS6
RCS5
⎯
RCS3
RCS2
RCS1
RCS0
1
DTSZ
DTID
RPE
DTDIR
DTF3
DTF2
DTF1
DTF0
2
DTSZ
SAID
SAIDE
BLKDIR
BLKE
⎯
⎯
⎯
1
DTSZ
DTID
RPE
DTDIR
DTF3
DTF2
DTF1
DTF0
2
DMACR0B*
⎯
DAID
DAIDE
⎯
DTF3
DTF2
DTF1
DTF0
DMACR1A*1
DTSZ
DTID
RPE
DTDIR
DTF3
DTF2
DTF1
DTF0
DMACR1A*2
DTSZ
SAID
SAIDE
BLKDIR
BLKE
⎯
⎯
⎯
1
DTSZ
DTID
RPE
DTDIR
DTF3
DTF2
DTF1
DTF0
2
⎯
DAID
DAIDE
⎯
DTF3
DTF2
DTF1
DTF0
FAE1
FAE0
⎯
⎯
DTA1B
DTA1A
DTA0B
DTA0A
DTE1B
DTE1A
DTE0B
DTE0A
DTIE1B
DTIE1A
DTIE0B
DTIE0A
DMABCR*
FAE1
FAE0
⎯
⎯
DTA1
⎯
DTA0
⎯
DTME1
DTE1
DTME0
DTE0
DTIE1B
DTIE1A
DTIE0B
DTIE0A
TCSR
OVF
WT/IT
TME
⎯
⎯
CKS2
CKS1
CKS0
TCNT
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
RSTCSR
WOVF
RSTE
RSTS
⎯
⎯
⎯
⎯
⎯
SMR_0
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
SMR_0*
GM
BLK
PE
O/E
BCP1
BCP0
CKS1
CKS0
BRR_0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SCR_0
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
RTCCSR
DMACR0A*
DMACR0A*
DMACR0B*
DMACR1B*
DMACR1B*
1
DMABCR*
2
3
TDR_0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SSR_0
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
SSR_0*
TDRE
RDRF
ORER
ERS
PER
TEND
MPB
MPBT
RDR_0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SCMR_0
⎯
⎯
⎯
⎯
SDIR
SINV
⎯
SMIF
3
Rev.6.00 Jun. 03, 2008 Page 646 of 698
REJ09B0074-0600
DMAC
WDT
SCI_0
Section 21 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
C/A
CHR
PE
O/E
STOP
MP
CKS1
CKS0
SCI_2
SMR_2*
GM
BLK
PE
O/E
BCP1
BCP0
CKS1
CKS0
BRR_2
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SCR_2
TIE
RIE
TE
RE
MPIE
TEIE
CKE1
CKE0
TDR_2
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
TDRE
RDRF
ORER
FER
PER
TEND
MPB
MPBT
SSR_2*
TDRE
RDRF
ORER
ERS
PER
TEND
MPB
MPBT
RDR_2
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
SCMR_2
⎯
⎯
⎯
⎯
SDIR
SINV
⎯
SMIF
ADDRAH
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
ADDRAL
AD1
AD0
⎯
⎯
⎯
⎯
⎯
⎯
ADDRBH
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
ADDRBL
AD1
AD0
⎯
⎯
⎯
⎯
⎯
⎯
ADDRCH
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
ADDRCL
AD1
AD0
⎯
⎯
⎯
⎯
⎯
⎯
ADDRDH
AD9
AD8
AD7
AD6
AD5
AD4
AD3
AD2
ADDRDL
AD1
AD0
⎯
⎯
⎯
⎯
⎯
⎯
ADCSR
ADF
ADIE
ADST
SCAN
⎯
CH2
CH1
CH0
ADCR
TRGS1
TRGS0
⎯
⎯
CKS1
CKS0
⎯
⎯
TCSR_1
⎯
⎯
⎯
PSS
⎯
⎯
⎯
⎯
SYSTEM
FLMCR1
FWE
SWE1
ESU1
PSU1
EV1
PV1
E1
P1
FLASH
FLMCR2
FLER
⎯
⎯
⎯
⎯
⎯
⎯
⎯
EBR1
EB7
EB6
EB5
EB4
EB3
EB2
EB1
EB0
EBR2
⎯
⎯
⎯
⎯
⎯
⎯
EB9
EB8
SMR_2
3
SSR_2
3
A/D
Rev.6.00 Jun. 03, 2008 Page 647 of 698
REJ09B0074-0600
Section 21 List of Registers
Register
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Module
PORT1
P17
P16
P15
P14
P13
P12
P11
P10
PORT
PORT3
⎯
P36
⎯
⎯
⎯
P32
P31
P30
PORT4
⎯
⎯
⎯
⎯
P43
P42
P41
P40
PORT7
P77
P76
P75
P74
⎯
⎯
P71
P70
PORT9
P97
P96
⎯
⎯
⎯
⎯
⎯
⎯
PORTA
⎯
⎯
⎯
⎯
PA3
PA2
PA1
PA0
PORTB
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
PORTC
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
PORTD
PD7
PD6
PD5
PD4
PD3
PD2
PD1
PD0
PORTE
PE7
PE6
PE5
PE4
PE3
PE2
PE1
PE0
PORTF
PF7
PF6
PF5
PF4
PF3
PF2
PF1
PF0
PORTG
⎯
⎯
⎯
PG4
PG3
PG2
PG1
PG0
Notes: 1. Short address mode
2. Full address mode
3. Smart card interface
Rev.6.00 Jun. 03, 2008 Page 648 of 698
REJ09B0074-0600
Section 21 List of Registers
21.3
Register States in Each Operating Mode
Register
Power-on
Manual
High-
Medium-
Software
Hardware
Name
Reset
Reset
Speed
Speed
Sleep
Module
Stop
Watch
Subactive
Subsleep
Standby
Standby
Module
UCTLR
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
USB
UTSTRA
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UDMAR
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UDRR
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UTRG0
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UFCLR0
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UESTL0
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UESTL1
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UEDR0s
⎯*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
UEDR0i
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UEDR0o
⎯*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
UEDR3
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UEDR1
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UEDR2
⎯*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
UESZ0o
⎯*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
UESZ2
⎯*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
UIFR0
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UIFR1
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UIFR3
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UIER0
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UIER1
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UIER3
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UISR0
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UISR1
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UISR3
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UDSR
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UCVR
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
Rev.6.00 Jun. 03, 2008 Page 649 of 698
REJ09B0074-0600
Section 21 List of Registers
Register
Power-on
Manual
High-
Medium-
Software
Hardware
Name
Reset
Reset
Speed
Speed
Sleep
Module
Stop
Watch
Subactive
Subsleep
Standby
Standby
Module
UTSTR0
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
USB
UTSTR1
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UTSTR2
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UTSTRB
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UTSTRC
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UTSTRD
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UTSTRE
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
UTSTRF
Initialized*
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
SCRX
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
FLASH
SBYCR
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
SYSTEM
SYSCR
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
SCKCR
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
MDCR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
MSTPCRA
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
MSTPCRB
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
MSTPCRC
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PFCR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
BSC
LPWRCR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
SYSTEM
OUTCR
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PORT
SEMRA_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
SCI_0
SEMRB_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
ISCRH
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
ISCRL
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
IER
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
ISR
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
P1DDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
P3DDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
P7DDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PADDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PBDDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PCDDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
Rev.6.00 Jun. 03, 2008 Page 650 of 698
REJ09B0074-0600
INT
PORT
Section 21 List of Registers
Register
Power-on
Manual
High-
Medium-
Software
Hardware
Name
Reset
Reset
Speed
Speed
Sleep
Module
Stop
Watch
Subactive
Subsleep
Standby
Standby
Module
PDDDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PORT
PEDDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PFDDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PGDDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PAPCR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PBPCR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PCPCR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PDPCR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PEPCR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
P3ODR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PAODR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TSTR
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TSYR
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
IPRA
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
IPRB
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
IPRC
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
IPRD
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
IPRE
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
IPRF
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
IPRG
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
IPRJ
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
IPRK
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
IPRM
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
ABWCR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
ASTCR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
WCRH
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
WCRL
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
BCRH
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
BCRL
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
RAMER
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TPU
INT
BSC
FLASH
Rev.6.00 Jun. 03, 2008 Page 651 of 698
REJ09B0074-0600
Section 21 List of Registers
Register
Power-on
Manual
High-
Medium-
Software
Hardware
Name
Reset
Reset
Speed
Speed
Sleep
Module
Stop
Watch
Subactive
Subsleep
Standby
Standby
Module
MAR0A
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
DMAC
IOAR0A
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
ETCR0A
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
MAR0B
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
IOAR0B
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
ETCR0B
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
MAR1A
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
IOAR1A
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
ETCR1A
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
MAR1B
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
IOAR1B
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
ETCR1B
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
P1DR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
P3DR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
P7DR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PADR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PBDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PCDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PDDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PEDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PFDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
PGDR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TCR_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TMDR_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TIORH_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TIORL_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TIER_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TSR_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TCNT_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TGRA_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TGRB_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TGRC_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TGRD_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
Rev.6.00 Jun. 03, 2008 Page 652 of 698
REJ09B0074-0600
PORT
TPU_0
Section 21 List of Registers
Register
Power-on
Manual
High-
Medium-
Software
Hardware
Name
Reset
Reset
Speed
Speed
Sleep
Module
Stop
Watch
Subactive
Subsleep
Standby
Standby
Module
TPU_1
TCR_1
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TMDR_1
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TIOR_1
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TIER_1
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TSR_1
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TCNT_1
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TGRA_1
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TGRB_1
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TCR_2
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TMDR_2
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TIOR_2
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TIER_2
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TSR_2
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TCNT_2
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TGRA_2
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TGRB_2
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
SYSTEM
RTC
EXMDLSTP Initialized
RSECDR
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
RMINDR
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
RHRDR
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
RWKDR
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
RTCCR1
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
RTCCR2
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
RTCCSR
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
DMACR0A
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
DMACR0B
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
DMACR1A
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
DMACR1B
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
DMABCR
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TCSR
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TCNT
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
RSTCSR
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TPU_2
DMAC
WDT
Rev.6.00 Jun. 03, 2008 Page 653 of 698
REJ09B0074-0600
Section 21 List of Registers
Register
Power-on
Manual
High-
Medium-
Software
Hardware
Name
Reset
Reset
Speed
Speed
Sleep
Module
Stop
Watch
Subactive
Subsleep
Standby
Standby
Module
SMR_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
SCI_0
BRR_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
SCR_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TDR_0
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
SSR_0
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
RDR_0
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
SCMR_0
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
SMR_2
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
BRR_2
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
SCR_2
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
TDR_2
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
SSR_2
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
RDR_2
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
SCMR_2
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
ADDRAH
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
ADDRAL
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
ADDRBH
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
ADDRBL
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
ADDRCH
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
ADDRCL
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
ADDRDH
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
ADDRDL
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
ADCSR
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
ADCR
Initialized
Initialized
⎯
⎯
⎯
Initialized
Initialized
Initialized
Initialized
Initialized
Initialized
⎯
⎯
SCI_2
A/D
TCSR_1
Initialized
Initialized
⎯
⎯
⎯
⎯
⎯
Initialized
Initialized
SYSTEM
FLMCR1
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
Initialized
FLASH
FLMCR2
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
Initialized
EBR1
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
Initialized
EBR2
Initialized
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Initialized
Initialized
Rev.6.00 Jun. 03, 2008 Page 654 of 698
REJ09B0074-0600
Section 21 List of Registers
Register
Power-on
Manual
High-
Medium-
Software
Hardware
Name
Reset
Reset
Speed
Speed
Sleep
Module
Stop
Watch
Subactive
Subsleep
Standby
Standby
Module
PORT1
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
PORT
PORT3
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
PORT4
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
PORT7
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
PORT9
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
PORTA
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
PORTB
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
PORTC
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
PORTD
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
PORTE
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
PORTF
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
PORTG
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Notes: ⎯ : is not initialized.
* The USB registers are no initialized by a power-on reset triggered by the WDT.
Rev.6.00 Jun. 03, 2008 Page 655 of 698
REJ09B0074-0600
Section 21 List of Registers
Rev.6.00 Jun. 03, 2008 Page 656 of 698
REJ09B0074-0600
Section 22 Electrical Characteristics
Section 22 Electrical Characteristics
22.1
Absolute Maximum Ratings
Table 22.1 lists the absolute maximum ratings.
Table 22.1 Absolute Maximum Ratings
Item
Symbol
Value
Unit
Power supply voltage
VCC,
PLLVCC,
DrVCC
–0.3 to +4.3
V
Input voltage
Vin
–0.3 to VCC +0.3
V
Reference voltage
Vref
–0.3 to VCC +0.3
V
Analog input voltage
VAN
–0.3 to VCC +0.3
V
Operating temperature
Topr
Regular specifications: –20 to +75
°C
Wide-range specifications: –40 to +85*
°C
–55 to +125
°C
Storage temperature
Tstg
Caution: Permanent damage to the chip may result if absolute maximum rating are exceeded.
Note: * The operating temperature ranges for flash memory programming/erasing are Ta = –20°C
to +75°C.
Rev.6.00 Jun. 03, 2008 Page 657 of 698
REJ09B0074-0600
Section 22 Electrical Characteristics
22.2
Power Supply Voltage and Operating Frequency Range
Power supply voltage and operating frequency ranges (shaded areas) are shown in figure 22.1.
(1) Mask ROM versions (except for D32210S)
Frequency f
System clock
24 MHz
16 MHz
6 MHz
Sub clock
32.768 kHz
0
2.4
2.7
3.6
3.0
Power ssupply voltage Vcc, PLLVcc, DrVcc (V)
(2) Masked ROM version (D32210S)
Frequency f
System clock
24 MHz
16 MHz
6 MHz
Condition A: Vcc = PLLVcc = DrVcc = 2.4 to 3.6V
Vref = 2.4V to Vcc
Vss = PLLVss = DrVss = 0V
f = 32.768 kHz, 6 MHz
Ta = -20 to +75 (Regular specifications)
Ta = -40 to +85 (Wide-range specifications)
Condition B: Vcc = PLLVcc = DrVcc = 2.7 to 3.6V
Vref = 2.7V to Vcc
Vss = PLLVss = DrVss = 0V
f = 32.768 kHz, 6 to 16 MHz
Ta = -20 to +75 (Regular specifications)
Ta = -40 to +85 (Wide-range specifications)
Condition C: Vcc = PLLVcc = DrVcc = 3.0 to 3.6V
Vref = 3.0V to Vcc
Vss = PLLVss = DrVss = 0V
f = 32.768 kHz, 6 to 24 MHz
Ta = -20 to +75 (Regular specifications)
Ta = -40 to +85 (Wide-range specifications)
Condition D: Vcc = PLLVcc = DrVcc = 3.0 to 3.6V
Vref = 3.0V to Vcc
Vss = PLLVss = DrVss = 0V
f = 32.768 kHz, 16 to 24 MHz
Ta = -20 to +75 (Regular specifications)
Ta = -40 to +85 (Wide-range specifications)
Sub clock
32.768 kHz
0
2.4
2.7
3.6
3.0
Power ssupply voltage Vcc, PLLVcc, DrVcc (V)
(3) F-ZTAT version
Frequency f
System clock
24 MHz
Condition A: None
Condition B: Vcc = PLLVcc = DrVcc = 2.7 to 3.6V
Vref = 2.7V to Vcc
Vss = PLLVss = DrVss = 0V
f = 32.768 kHz, 6 to 16 MHz
Ta = -20 to +75 (Regular specifications)
Ta = -40 to +85 (Wide-range specifications)
16 MHz
6 MHz
Sub clock
32.768 kHz
0
2.4
2.7
3.6
3.0
Power ssupply voltage Vcc, PLLVcc, DrVcc (V)
Condition C: Vcc = PLLVcc = DrVcc = 3.0 to 3.6V
Vref = 3.0V to Vcc
Vss = PLLVss = DrVss = 0V
f = 32.768 kHz, 6 to 24 MHz
Ta = -20 to +75 (Regular specifications)
Ta = -40 to +85 (Wide-range specifications)
(4) When using the on-chip USB
Frequency f
System clock
24 MHz
System clock
16 MHz
6 MHz
Sub clock
32.768 kHz
0
2.4
2.7
3.0
3.6
Power ssupply voltage Vcc, PLLVcc, DrVcc (V)
Figure 22.1 Power Supply Voltage and Operating Ranges
Rev.6.00 Jun. 03, 2008 Page 658 of 698
REJ09B0074-0600
Section 22 Electrical Characteristics
22.3
DC Characteristics
Table 22.2 lists the DC characteristics. Table 22.3 lists the permissible output currents.
Table 22.2 DC Characteristics
Condition A: VCC = PLL VCC = Dr VCC = 2.4 V to 3.6 V, Vref = 2.4 V to VCC, VSS = PLLVSS =
Dr VSS = 0 V, f = 32.768 kHz, 6 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = PLL VCC = Dr VCC = 2.7 V to 3.6 V, Vref = 2.7 V to VCC, VSS = PLLVSS =
Dr VSS = 0 V, f = 32.768 kHz, 6 MHz to 16 MHz, Ta = −20°C to +75°C (regular
specifications), Ta = −40°C to +85°C (wide-range specifications)
Condition C: VCC = PLL VCC = Dr VCC = 3.0 V to 3.6 V, Vref = 3.0 V to VCC, VSS = PLLVSS =
Dr VSS = 0 V, f = 32.768 kHz, 6 MHz to 24 MHz, Ta = −20°C to +75°C (regular
specifications), Ta = −40°C to +85°C (wide-range specifications)
Condition D: VCC = PLL VCC = Dr VCC = 3.0 V to 3.6 V, Vref = 3.0 V to VCC, VSS = PLLVSS =
Dr VSS = 0 V, f = 32.768 kHz, 16 MHz to 24 MHz, Ta = −20°C to +75°C (regular
specifications), Ta = −40°C to +85°C (wide-range specifications)
Item
Symbol
Min.
Typ.
Max.
Unit
Schmitt
IRQ0 to IRQ4 VT
–
VCC × 0.2
—
—
V
trigger input
IRQ7
+
—
—
VCC × 0.8
V
VCC × 0.05 —
—
V
RES, STBY, VIH
NMI,
MD2 to MD0,
TRST, TCK,
TMS, TDI,
EMLE, VBUS,
4
UBPM, FWE*
VCC × 0.9
—
VCC + 0.3
V
EXTAL, ports
1, 3, 4, 7, 9,
and A to G
VCC × 0.8
—
VCC + 0.3
V
+
voltage
Input high
voltage
VT
VT – VT
–
Test
Conditions
Rev.6.00 Jun. 03, 2008 Page 659 of 698
REJ09B0074-0600
Section 22 Electrical Characteristics
Symbol
Test
Conditions
Min.
Typ.
Max.
Unit
RES, STBY, VIL
MD2 to MD0,
TRST, TCK,
TMS, TDI,
EMLE, VBUS,
4
UBPM, FWE*
–0.3
—
VCC × 0.1
V
EXTAL, NMI,
ports 1, 3, 4,
7, 9, and
A to G
–0.3
—
VCC × 0.2
V
Output high
voltage
All output pins VOH
VCC – 0.5
—
—
V
IOH = –200 µA
VCC – 1.0
—
—
V
IOH = –1 mA
Output low
voltage
All output pins VOL
—
—
0.4
V
IOL = 0.8 mA
—
—
1.0
µA
Vin = 0.5 to
VCC – 0.5 V
| ITSI |
—
—
1.0
µA
Vin = 0.5 to
VCC – 0.5 V
– IP
10
—
300
µA
Vin = 0 V
Cin
—
—
30
pF
Vin = 0 V
—
—
15
pF
Ta = 25°C
—
22
35
mA
VCC = 3.3 V VCC = 3.6 V
f = 16 MHz
—
31
50
mA
VCC = 3.3 V VCC = 3.6 V
f = 24 MHz
Item
Input low
voltage
Input leakage RES, VBUS, | Iin |
current
UBPM, STBY,
NMI, EMLE,
MD2 to MD0,
4
FWE* ,
ports 4, 9
Three-state
leakage
current (off
state)
Ports 1, 3, 7,
and A to G
Input pull-up Ports A to E
MOS current TDI, TCK,
TMS, TRST
Input
capacitance
RES, NMI
f = 1 MHz
All input pins
other than
RES, NMI
Current
1
dissipation*
Normal
operation
(USB halts)
2
ICC*
Rev.6.00 Jun. 03, 2008 Page 660 of 698
REJ09B0074-0600
Section 22 Electrical Characteristics
Symbol
Current
1
dissipation*
Typ.
—
30
45
mA
VCC = 3.3 V VCC = 3.6 V
(USB
operates)
f = 16 MHz,
When PLL3 is
used
—
41
60
mA
VCC = 3.3 V VCC = 3.6 V
f = 24 MHz,
When PLL2 is
used
Sleep mode
—
16
30
mA
VCC = 3.3 V VCC = 3.6 V
f = 16 MHz,
When
USB and PLL
are halted
—
22
45
mA
VCC = 3.3 V VCC = 3.6 V
f = 24 MHz,
When
USB and PLL
are halted
—
16
—
VCC = 3.3 V
mA
f = 16 MHz
(reference
value)
—
24
—
VCC = 3.3 V
mA
f = 24 MHz
(reference
value)
—
45
µA
Vcc = 3.3 V,
EMLE = 0
When crystal
resonator
(32.768 kHz)
is used
Normal
operation
2
ICC*
All modules
other than
flash memory
stopped
Subactive
mode
Subsleep
mode
Max.
180
5
—
30*
—
—
35
100
5
Unit
Test
Conditions
Min.
Item
µA
—
20*
—
Watch mode
—
5
40
µA
Standby
3
mode*
—
1.0
10
µA
Ta ≤ 50°C
32.768 kHz
RTC halted
EMLE = 0
—
—
50
µA
50°C < Ta
32.768 kHz
RTC halted
EMLE = 0
—
1.3
2.5
mA
Vref = 3.3 V
—
0.01
5.0
µA
2.0
—
—
V
Reference
During A/D
power supply conversion
current
Idle
AlCC
RAM standby voltage
VRAM
Notes: If the A/D converter is not used, the Vref pin should not be open. Even if the A/D converter
is not used, connect the Vref pin to Vcc.
Rev.6.00 Jun. 03, 2008 Page 661 of 698
REJ09B0074-0600
Section 22 Electrical Characteristics
1. Current dissipation values are for VIH min. = VCC – 0.2 V and VIL max. = 0.2 V, with all
output pins unloaded and the on-chip MOS pull-up transistors in the off state.
2. ICC depends on VCC and f as follows (Reference):
ICC max. = 5 (mA) + 0.52 (mA/(MHz x V)) × VCC × f (normal operation, USB halted)
ICC max. = 9 (mA) + 0.60 (mA/(MHz x V)) × VCC × f (normal operation, USB operated)
ICC max. = 1 (mA) + 0.51 (mA/(MHz x V)) × VCC × f (sleep mode)
3. The values are for VRAM < VCC < 2.7 V, VIH min. = VCC × 0.9, and VIL max. = 0.3 V.
4. The FWE pin is effective only in the F-ZTAT version.
5. Reference value when setting the flash memory module stop mode is carried out while
the on-chip RAM program is executed. The value is effective in the F-ZTAT version.
Table 22.3 Permissible Output Currents
Condition A: VCC = PLL VCC = Dr VCC = 2.4 V to 3.6 V, Vref = 2.4 V to VCC, VSS = PLLVSS =
Dr VSS = 0 V, f = 32.768 kHz, 6 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = PLL VCC = Dr VCC = 2.7 V to 3.6 V, Vref = 2.7 V to VCC, VSS = PLLVSS =
Dr VSS = 0 V, f = 32.768 kHz, 6 MHz to 16 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition C: VCC = PLL VCC = Dr VCC = 3.0 V to 3.6 V, Vref = 3.0 V to VCC, VSS = PLLVSS =
Dr VSS = 0 V, f = 32.768 kHz, 6 MHz to 24 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition D: VCC = PLL VCC = Dr VCC = 3.0 V to 3.6 V, Vref = 3.0 V to VCC, VSS = PLLVSS =
Dr VSS = 0 V, f = 32.768 kHz, 16 MHz to 24 MHz, Ta = −20°C to +75°C (regular
specifications), Ta = −40°C to +85°C (wide-range specifications)
Item
Symbol Min.
Typ.
Max.
Unit
Permissible output
low current (per pin)
All output pins
IOL
—
—
1.0
mA
Permissible output
low current (total)
Total of all output pins
∑ IOL
—
—
60
mA
Permissible output
All output pins
high current (per pin)
–IOH
—
—
1.0
mA
Permissible output
high current (total)
∑ –IOH
—
—
30
mA
Total of all output pins
Note: To protect chip reliability, do not exceed the output current values in table 22.3.
Rev.6.00 Jun. 03, 2008 Page 662 of 698
REJ09B0074-0600
Section 22 Electrical Characteristics
22.4
AC Characteristics
Figure 22.2 shows, the test conditions for the AC characteristics.
3V
RL
LSI output pin
C
RH
C=30 pF
RL= 2.4 kΩ
RH=12 kΩ
Input/output timing measurement levels
• Low level : 1.3 V (2.4 V ≤ Vcc < 2.7 V)
: 0.8 V (2.7 V ≤ Vcc ≤ 3.6 V)
• High level : 1.3 V (2.4 V ≤ Vcc < 2.7 V)
: 2.0 V (2.7 V ≤ Vcc ≤ 3.6 V)
Figure 22.2 Output Load Circuit
Rev.6.00 Jun. 03, 2008 Page 663 of 698
REJ09B0074-0600
Section 22 Electrical Characteristics
22.4.1
Clock Timing
Table 22.4 lists the clock timing
Table 22.4 Clock Timing
Condition A: VCC = PLL VCC = Dr VCC = 2.4 V to 3.6 V, Vref = 2.4 V to VCC, VSS = PLLVSS =
Dr VSS = 0 V, f = 32.768 kHz, 6 MHz, Ta = –20°C to +75°C (regular specifications),
Ta = –40°C to +85°C (wide-range specifications)
Condition B: VCC = PLL VCC = Dr VCC = 2.7 V to 3.6 V, Vref = 2.7 V to VCC, VSS = PLLVSS =
Dr VSS = 0 V, f = 32.768 kHz, 6 MHz to 16 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition C: VCC = PLL VCC = Dr VCC = 3.0 V to 3.6 V, Vref = 3.0 V to VCC, VSS = PLLVSS =
Dr VSS = 0 V, f = 32.768 kHz, 6 MHz to 24 MHz, Ta = –20°C to +75°C (regular
specifications), Ta = –40°C to +85°C (wide-range specifications)
Condition D: VCC = PLL VCC = Dr VCC = 3.0 V to 3.6 V, Vref = 3.0 V to VCC, VSS = PLLVSS =
Dr VSS = 0 V, f = 32.768 kHz, 16 MHz to 24 MHz, Ta = −20°C to +75°C (regular
specifications), Ta = −40°C to +85°C (wide-range specifications)
Condition A Condition B Condition C Condition D
Item
Symbol Min.
Clock cycle time
tcyc
Max. Min.
Max. Min.
Max. Min.
Max. Unit