HD74LS30 8-input Positive NAND Gate REJ03D0404–0200 Rev.2.00 Feb.18.2005 Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS30P DILP-14 pin PRDP0014AB-B (DP-14AV) P — HD74LS30FPEL SOP-14 pin (JEITA) PRSP0014DF-B (FP-14DAV) FP EL (2,000 pcs/reel) HD74LS30RPEL SOP-14 pin (JEDEC) PRSP0014DE-A (FP-14DNV) RP EL (2,500 pcs/reel) Note: Please consult the sales office for the above package availability. Pin Arrangement A 1 14 VCC B 2 13 NC C 3 12 H D 4 11 G E 5 10 NC F 6 9 NC GND 7 8 Y (Top view) Rev.2.00, Feb.18.2005, page 1 of 5 HD74LS30 Circuit Schematic VCC 17k 75 8k Inputs A B C 4.5k D Output Y E F 1.5k G 3k H GND Absolute Maximum Ratings Item Supply voltage Input voltage Power dissipation Storage temperature Symbol VCC VIN PT Tstg Ratings 7 7 400 –65 to +150 Unit V V mW °C Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Recommended Operating Conditions Item Supply voltage Output current Operating temperature Rev.2.00, Feb.18.2005, page 2 of 5 Symbol VCC IOH IOL Topr Min 4.75 — — –20 Typ 5.00 — — 25 Max 5.25 –400 8 75 Unit V µA mA °C HD74LS30 Electrical Characteristics (Ta = –20 to +75 °C) Item II min. 2.0 — 2.7 — — — — — Short-circuit output current IOS –20 — –100 mA VCC = 5.25 V Supply current ICCH ICCL — — — 0.35 0.6 — 0.5 1.1 –1.5 mA mA V VCC = 5.25 V VCC = 5.25 V VCC = 4.75 V, IIN = –18 mA Input voltage Output voltage Input current Symbol VIH VIL VOH VOL IIH IIL Input clamp voltage VIK Note: * VCC = 5 V, Ta = 25°C typ.* — — — — — — — — max. — 0.8 — 0.5 0.4 20 –0.4 0.1 Unit V V V µA mA mA VCC = 4.75 V, VIL = 0.8 V, IOH = –400 µA IOL = 8 mA VCC = 4.75 V, VIH = 2 V IOL = 4 mA VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V V Condition Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Propagation delay time Symbol tPLH tPHL min. — — typ. 8 13 max. 15 20 Unit ns ns Condition CL = 15 pF, RL = 2 kΩ Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D00050100)". Rev.2.00, Feb.18.2005, page 3 of 5 HD74LS30 Package Dimensions JEITA Package Code P-DIP14-6.3x19.2-2.54 RENESAS Code PRDP0014AB-B MASS[Typ.] 0.97g Previous Code DP-14AV D 8 E 14 1 7 b3 Z A1 A Reference Symbol Nom e1 7.62 D 19.2 E 6.3 L A θ bp e Dimension in Millimeters Min e1 A1 0.51 bp 0.40 JEITA Package Code P-SOP14-5.5x10.06-1.27 RENESAS Code PRSP0014DF-B *1 Previous Code FP-14DAV D 0.48 0.56 c 0.19 θ 0° e 2.29 0.25 0.31 2.54 2.79 15° 2.39 L 2.54 MASS[Typ.] 0.23g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 14 7.4 1.30 Z ( Ni/Pd/Au plating ) 20.32 5.06 b3 c Max 8 c HE *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) 1 Z *3 Nom Max D 10.06 10.5 E 5.50 A2 7 e A1 bp Dimension in Millimeters Min x M 0.00 0.10 0.20 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 A L1 2.20 bp b1 c A c A1 θ y L Detail F 1 θ 0° HE 7.50 e 1.27 x 0.12 y 0.15 1.42 Z L L Rev.2.00, Feb.18.2005, page 4 of 5 8° 0.50 1 0.70 1.15 0.90 HD74LS30 JEITA Package Code P-SOP14-3.95x8.65-1.27 RENESAS Code PRSP0014DE-A *1 MASS[Typ.] 0.13g Previous Code FP-14DNV NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F D 14 8 c *2 Index mark HE E bp Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) Dimension in Millimeters Min Nom Max D 8.65 9.05 E 3.95 A2 A1 7 1 Z e *3 bp x M 0.14 A c A1 θ L Detail F 0.34 0.40 0.46 0.15 0.20 0.25 6.10 6.20 b1 c y 0.25 1.75 bp L1 1 θ 0° HE 5.80 e 8° 1.27 0.25 x y 0.15 Z 0.635 L L Rev.2.00, Feb.18.2005, page 5 of 5 0.10 A 0.40 1 0.60 1.08 1.27 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. 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