HD74LS368A Hex Bus Drivers (inverted data outputs with three-state outputs) REJ03D0481–0200 Rev.2.00 Feb.18.2005 Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS368AP DILP-16 pin PRDP0016AE-B (DP-16FV) P — HD74LS368AFPEL SOP-16 pin (JEITA) PRSP0016DH-B (FP-16DAV) FP EL (2,000 pcs/reel) PRSP0016DG-A RP (FP-16DNV) Note: Please consult the sales office for the above package availability. HD74LS368ARPEL SOP-16 pin (JEDEC) EL (2,500 pcs/reel) Pin Arrangement G1 1 16 VCC 1A 2 15 G2 1Y 3 14 6A 2A 4 13 6Y 2Y 5 12 5A 3A 6 11 5Y 3Y 7 10 4A GND 8 9 4Y (Top view) Function Table G H L L A X L H Note: H; high level, L; low level, X; irrelevant, Z; off (high-impedance) state of a 3-state output Rev.2.00, Feb.18.2005, page 1 of 5 Y Z H L HD74LS368A Absolute Maximum Ratings Item Symbol Ratings Unit VCC 7 V Supply voltage Input voltage Output voltage (off-state) VIN 7 V VO (off) 5.5 V Power dissipation PT 400 mW Operating temperature Topr –20 to +75 °C Storage temperature Tstg –65 to +150 °C Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Recommended Operating Conditions Item Supply voltage Output current Operating temperature Symbol Min Typ Max Unit VCC 4.75 5.00 5.25 V IOH — — –2.6 mA IOL — — 24 mA Topr –20 25 75 °C Electrical Characteristics (Ta = –20 to +75 °C) Item Input voltage Symbol VIH VIL min. 2.0 — typ.* — — max. — 0.8 VOH 2.4 — — — — — — — — — — — — 0.4 0.5 20 –20 20 µA — — –20 µA — — –0.4 mA — — –40 — — — — — 12 — –0.4 0.1 –225 21 –1.5 mA mA mA mA V Output voltage VOL IOZH IOZL IIH Output current Input current A inputs IIL G inputs Short-circuit output current Supply current** Input clamp voltage II IOS ICC VIK Unit Condition V V µA VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V, IOH = –2.6 mA IOL = 12 mA VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V IOL = 24 mA VO = 2.4 V VCC = 5.25 V, VIH = 2 V, VIL = 0.8 V VO = 0.4 V VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.5 V, G input at 2 V VCC = 5.25 V, VI = 0.4 V, G inputs at 0.4 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V VCC = 5.25 V VCC = 5.25 V VCC = 4.75 V, IIN = –18 mA Notes: * VCC = 5 V, Ta = 25°C ** With all outputs open, ICC is measured with all inputs grounded and all G inputs at 4.5 V. Rev.2.00, Feb.18.2005, page 2 of 5 HD74LS368A Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Propagation delay time Output enable time Output disable time Symbol tPLH tPHL tZH tZL tHZ tLZ min. — — — — — — typ. 7 12 18 28 — — max. 15 18 35 45 32 35 Unit Condition CL = 45 pF, RL = 667 Ω ns CL = 5 pF, RL = 667 Ω Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D00050100)". Rev.2.00, Feb.18.2005, page 3 of 5 HD74LS368A Package Dimensions JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B MASS[Typ.] 1.05g Previous Code DP-16FV D 9 E 16 1 8 b3 0.89 Z A1 A Reference Symbol L e Nom θ c e1 D 19.2 E 6.3 JEITA Package Code P-SOP16-5.5x10.06-1.27 RENESAS Code PRSP0016DH-B *1 Previous Code FP-16DAV 7.4 A1 0.51 b p 0.40 b 3 0.48 0.56 1.30 c 0.19 θ 0° e 2.29 0.25 0.31 2.54 2.79 15° 1.12 L 2.54 MASS[Typ.] 0.24g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. D F 16 20.32 5.06 Z ( Ni/Pd/Au plating ) Max 7.62 1 A bp e Dimension in Millimeters Min 9 c HE *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) 1 Z *3 bp Nom D 10.06 E 5.50 Max 10.5 A2 8 e Dimension in Millimeters Min x A1 M 0.00 0.10 0.20 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 A L1 2.20 bp b1 c A c A1 θ y L Detail F 1 θ 0° HE 7.50 e 1.27 x 0.12 y 0.15 0.80 Z L L Rev.2.00, Feb.18.2005, page 4 of 5 8° 0.50 1 0.70 1.15 0.90 HD74LS368A JEITA Package Code P-SOP16-3.95x9.9-1.27 RENESAS Code PRSP0016DG-A *1 Previous Code FP-16DNV MASS[Typ.] 0.15g D NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 16 9 c *2 Index mark HE E bp Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) Dimension in Millimeters Min Nom Max D 9.90 10.30 E 3.95 A2 8 1 Z e *3 bp x A1 0.10 0.14 0.25 0.34 0.40 0.46 0.15 0.20 0.25 6.10 6.20 1.75 A M L1 bp b1 c A c A1 θ L y Detail F 1 θ 0° HE 5.80 1.27 e x 0.25 y 0.15 0.635 Z 0.40 L L Rev.2.00, Feb.18.2005, page 5 of 5 8° 1 0.60 1.08 1.27 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. 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