AVAGO HF15-317ETZ The versatile fiber optic connection Datasheet

HFBR-0500ETZ Series
Versatile Link
The Versatile Fiber Optic Connection
Data Sheet
Description
Features
The Versatile Link series is a complete family of fiber
optic link components for applications requiring a low
cost solution. The HFBR-0500ETZ series includes transmitters, receivers, connectors and cable specified for
easy design. This series of components is ideal for
solving problems with voltage isolation/insulation,
EMI/RFI immunity or data security. The optical link
design is simplified by the logic compatible receivers
and complete specifi-cations for each component. The
key optical and electrical parameters of links configured
with the HFBR-0500ETZ family are fully guaranteed from
-40° to 85° C.










A wide variety of package configurations and connectors
provide the designer with numerous mechanical solutions
to meet application requirements. The transmitter and
receiver components have been designed for use in high
volume/low cost assembly processes such as auto insertion and wave soldering.
Transmitters incorporate a 660 nm LED. Receivers
include a monolithic dc coupled, digital IC receiver
with open collector Schottky output transistor. An
internal pullup resistor is avail able for use in the
HFBR-25X1ETZ and HFBR-25X2ETZ receivers. A shield has
been integrated into the receiver IC to provide additional,
localized noise immunity.
Internal optics have been optimized for use with 1 mm
diameter plastic optical fiber. Versatile Link specifications
incorporate all connector interface losses. Therefore,
optical calculations for common link applications are
simplified.
Extended temperature range -40 to +85° C
RoHS-compliant
Low cost fiber optic components
Enhanced digital links: dc-5 MBd
Link distance up to 43m at 1MBd and 20m at 5MBd
Low current link: 6 mA peak supply current
Horizontal and vertical mounting
Interlocking feature
High noise immunity
Easy connectoring: simplex, duplex, and latching
connectors
 Flame retardant
 Transmitters incorporate a 660 nm red LED for easy
visibility
 Compatible with standard TTL circuitry
Applications
 Industrial Drives/Frequency Inverters
 Renewable Energies (Wind Turbines, Solar PV farms)
Power electronics
 Reduction of lightning/voltage transient susceptibility
 Motor controller triggering
 Data communications and local area networks
 Electromagnetic Compatibility (EMC) for regulated
systems: FCC, VDE, CSA, etc.
 Tempest-secure data processing equipment
 Isolation in test and measurement instruments
 Error free signalling for industrial and manufacturing
equipment
 Automotive communications and control networks
 Noise immune communication in audio and video
equipment
HFBR-0500ETZ Series Part Number Guide
HFBR-X5XXETZ
1 = Transmitter
2 = Receiver
ET = extended temperature range
Z = RoHS compliant
5 = 600 nm Transmitter and
Receiver Products
1 = 5 MBd High Performance Link
2 = 1 MBd High Performance Link
6 = 155 MBd Receiver
7 = 155 MBd Transmitter
2 = Horizontal Package
3 = Vertical Package
4 = 30° Tilted Package
Available option – Horizontal Package
HFBR-x521ETZ
HFBR-x522ETZ
Available option – Vertical Package
HFBR-x531ETZ
HFBR-x532ETZ
Available option – 30° Tilted Package
HFBR-x541ETZ
HFBR-x542ETZ
Link Selection Guide
(Links specified from -40° to 85° C, for plastic optical fiber unless specified.)
Signal Rate
Distance (m) 25° C
Distance (m)
Transmitter
Receiver
1 MBd
67
43
HFBR-15x2ETZ
HFBR-25x2ETZ
5 Mbd
38
20
HFBR-15x1ETZ
HFBR-25x1ETZ
2
Application Literature
Handling
Application Note 1035 (Versatile Link)
Versatile Link components are auto-insertable. When
wave soldering is performed with Versatile Link components, the optical port plug should be left in to prevent
contamination of the port. Do not use reflow solder
processes (i.e., infrared reflow or vapor-phase reflow).
Nonhalogenated water soluble fluxes (i.e., 0% chloride),
not rosin based fluxes, are recommended for use with
Versatile Link components.
Package and Handling Information
The compact Versatile Link package is made of a flame
retardant VALOX® UL 94 V-0 material (UL file # E121562)
and uses the same pad layout as a standard, eight pin
dual-in-line package. Vertical and horizontal mountable
parts are available. These low profile Versatile Link packages are stackable and are enclosed to provide a dust
resistant seal. Snap action simplex, simplex latching,
duplex, and duplex latching connectors are offered with
simplex or duplex cables.
Package Orientation
Performance and pinouts for the vertical and horizontal packages are identical. To provide additional
attachment support for the vertical Versatile Link
housing, the designer has the option of using a selftapping screw through a printed circuit board into a
mounting hole at the bottom of the package. For most
applications this is not necessary.
Package Housing Color
Versatile Link components and simplex connectors are
color coded to eliminate confusion when making connections. Receivers are blue and transmitters are gray.
VALOX is a registered trademark of the General Electric Corporation.
3
Versatile Link components are moisture sensitive
devices and are shipped in a moisture sealed bag. If the
components are exposed to air for an extended period of
time, they may require a baking step before the soldering process. Refer to the special labeling on the shipping
tube for details.
Recommended Chemicals for Cleaning/Degreasing
Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane,
heptane. Other: soap solution, naphtha.
Do not use partially halogenated hydrocarbons such
as 1,1.1 trichloroethane, ketones such as MEK, acetone,
chloroform, ethyl acetate, methylene dichloride, phenol,
methylene chloride, or N-methylpyrolldone. Also, Avago
does not recommend the use of cleaners that use
halogenated hydrocarbons because of their potential
environmental harm.
Mechanical Dimensions
Horizontal Modules
Vertical Modules
2.03
(0.080)
6.86
(0.270)
10.16
(0.400)
18.8
(0.74)
0.64
(0.025)
3.81 (0.150) MAX.
3.56 (0.140) MIN.
5.08
(0.200)
18.80
(0.740)
1.27
(0.050)
2.54
(0.100)
0.51
(0.020)
0.64 (0.025) DIA.
1.85
(0.073)
2.77
(0.109)
DIMENSIONS IN MILLIMETERS (INCHES).
2
(0.08)
30° Tilted Modules
5.2
(0.21)
30q
B
10.2
(0.40)
A
∅0.7
(0.03)
0.4
(0.02)
2.8
(0.11)
4.6
(0.18)
6.6
(0.26)
0.6
(0.03)
15.2
(0.60)
7
18. 4)
(0.7
2.54
(0.100)
0.5
(0.02)
1.3
(0.05)
10.1
(0.40)
19.3
(0.76)
DIMENSIONS IN MILLIMETERS (INCHES).
4
1.1
(0.05)
8.7
(0.34)
2.2
(0.09)
5.08
10.16 (0.200)
(0.400)
6.86
(0.27)
4.19
(0.165)
7.62
(0.30)
7.62
(0.300)
2.03
(0.080)
7.62
(0.300)
18.29
(0.720)
Versatile Link Printed Board Layout Dimensions
Horizontal Module
Vertical Module
7.62
(0.300)
2.54
(0.100)
TOP VIEW
1.01 (0.040) DIA.
4 3 2 1
5
7.62
(0.300)
PCB EDGE
8
1.85 MIN.
(0.073)
DIMENSIONS IN MILLIMETERS (INCHES).
30° Tilted Modules
7.62
(0.300)
1.01
DIA.
(0.040)
2.54
(0.100)
8.7
(0.34)
0.5
(0.02)
1.01
DIA.
(0.040)
Bottom View
DIMENSIONS IN MILLIMETERS (INCHES).
5
Interlocked (Stacked) Assemblies (refer to Figure 1)
Horizontal packages may be stacked by placing units
with pins facing upward. Initially engage the interlocking mechanism by sliding the L bracket body from
above into the L slot body of the lower package. Use
a straight edge, such as a ruler, to bring all stacked
units into uniform alignment. This technique prevents
potential harm that could occur to fingers and hands of
assemblers from the package pins. Stacked horizontal
packages can be disengaged if necessary. Repeated
stacking and unstacking causes no damage to individual
units.
Stacking Horizontal Modules
Stacking Vertical Modules
Stacking 30° Tilted Modules
Figure 1. Interlocked (stacked) horizontal, vertical or 30° tilted packages
6
To stack vertical packages, hold one unit in each hand,
with the pins facing away and the optical ports on the
bottom. Slide the L bracket unit into the L slot unit. The
straight edge used for horizontal package alignment is
not needed.
5 MBd Link (HFBR-15X1ETZ/25X1ETZ)
System Performance -40° to 85° C unless otherwise specified.
Parameter
High
Performance
5 MBd
Symbol
Data Rate
Link Distance
Typ.
dc
Max.
5
Units
MBd
m
Conditions
Ref.
BER ≤10-9, PRBS:27-1
IFdc = 60 mA
d
17
33
m
IFdc = 60 mA, 25° C
d
20
m
IFdc = 60 mA
(Standard Cable)
Link Distance
Min.
Note 3
Note 3
m
IFdc = 60 mA, 25° C
Propagation
tPLH
90
140
ns
RL = 560 , CL = 30 pF
Fig. 3, 6
Delay
tPHL
50
140
ns
fiber length = 0.5 m
Notes 1, 2
(Improved Cable)
38
-21.6 ≤PR ≤-9.5 dBm
Pulse Width
tD
40
Distortion tPLH-tPHL
Notes:
1. The propagation delay for one metre of cable is typically 5 ns.
2. Typical propagation delay is measured at PR = -15 dBm.
3. Estimated typical link life expectancy at 40° C exceeds 10 years at 60 mA.
Figure 2. Typical 5 MBd interface circuit
Figure 3. 5 MBd propagation delay test circuit
7
ns
PR = -15 dBm
RL = 560 , CL = 30 pF
Fig. 3, 5
Figure 4. Propagation delay test waveforms
100
60
tP - PROPAGATION DELAY - ns
tD - PULSE WIDTH DISTORTION - ns
70
50
40
30
20
X5X1ETZ -40° C
X5X1ETZ 25° C
X5X1ETZ 85° C
10
0
-27
-24
-21
-18
-15
-12
PR - INPUT OPTICAL POWER - dBm
Figure 5. Typical link pulse width distortion vs. optical power
8
-9
-6
80
60
40
20
0
-27
tPLH X5X1ETZ
tPHL X5X1ETZ
-24
-21
-18
-15
-12
PR - INPUT OPTICAL POWER - dBm
Figure 6. Typical link propagation delay vs. optical power
-9
-6
HFBR-15X1ETZ Transmitter
Pin #
Function
1
1
Anode
2
2
Cathode
Ground
GROUND
3
3
4
4
Ground
GROUND
5
Ground
8
Ground
8 GROUND
ANODE
CATHODE
5 GROUND
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
TS
–40
+85
°C
TA
–40
+85
°C
260
°C
Storage Temperature
Operating Temperature
Lead Soldering Cycle
Temp.
Time
Forward Input Current
Reverse Input Voltage
10
sec
IFPK
1000
mA
IFdc
80
VBR
5
Reference
Note 1, 4
Note 2, 3
V
Notes:
1.
2.
3.
4.
1.6 mm below seating plane.
Recommended operating range between 10 and 750 mA.
1 s pulse, 20 s period.
Moisture sensitivity level is MSL-3
All HFBR-15XXETZ LED transmitters are classified as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed
draft scheduled to go into effect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. Contact your local Avago sales
representative for more information.
9
Transmitter Electrical/Optical Characteristics -40° to 85° C unless otherwise specified.
Parameter
Symbol
Transmitter Output
Optical Power
Output Optical Power
PT
Min.
Typ.[5]
Max.
Units
Conditions
-16.8
-7.1
dBm
IFdc = 60 mA
-14.3
-8.0
dBm
IFdc = 60 mA, 25° C
PT /T
-0.85
%/°C
PK
660
nm
Ref.
Notes 1, 2
Temperature Coefficient
Peak Emission
Wavelength
1.43
1.67
2.05
V
IFdc = 60 mA
Forward Voltage
VF
Forward Voltage
VF /T
-1.37
mV/°C
D
1
mm
11.0
V
Fig. 7
Temperature Coefficient
Effective Diameter
Reverse Input Breakdown
VBR
5.0
IFdc = 10 A,
TA = 25° C
Voltage
Diode Capacitance
CO
86
pF
VF = 0, f = MHz
Rise Time
tr
20
ns
Fall Time
tf
20
ns
10% to 90%,
IF = 60 mA
Note 3
Notes:
1. Optical power measured at the end of 0.5 m of 1 mm diameter POF (NA = 0.5) with a large area detector.
2. Optical power, P (dBm) = 10 Log [P(W)/1000 W].
3. Rise and fall times are measured with a voltage pulse driving the transmitter driver IC (75451). A wide bandwidth optical to electrical waveform
analyzer, terminated to a 50  input of a wide bandwidth oscilloscope, is used for this response time measurement.
5
PT - NORMALIZED OUTPUT POWER - dB
1.8
VF - VORWARD VOLTAGE - V
1.75
1.7
1.65
1.6
1.55
1.5
-40° C
25° C
85° C
1.45
-5
-10
-40° C
25° C
85° C
-15
-20
1.4
1
10
IFdc - TRANSMITTER DRIVE CURRENT (mA)
Figure 7. Typical forward voltage vs. drive current
10
0
100
1
10
IFdc - TRANSMITTER DRIVE CURRENT (mA)
Figure 8. Normalized typical output power vs. drive current
100
HFBR-25X1ETZ Receiver
GROUND 5
1000 Ω
Pin #
Function
1
VO
2
Ground
3
VCC
4
RL
3
VCC
4
RL
GROUND
5
Ground
8
Ground
2
1
VO
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
GROUND 8
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
TS
–40
+85
°C
Operating Temperature
TA
–40
+85
°C
Lead Soldering Cycle
Temp.
260
°C
Time
10
sec
Supply Voltage
VCC
Output Collector Current
IOAV
–0.5
7
V
25
mA
Output Collector Power Dissipation
POD
40
mW
Output Voltage
VO
–0.5
18
V
Pull-up Voltage
VP
–5
VCC
V
Fan Out (TTL)
N
Reference
Note 1, 3
Note 2
5
Notes:
1. 1.6 mm below seating plane.
2. It is essential that a bypass capacitor 0.1 F be connected from pin 2 to pin 3 of the receiver. Total lead length between both ends of the capacitor
and the pins should not exceed 20 mm.
3. Moisture sensitivity level is MSL-3
Receiver Electrical/Optical Characteristics -40° to 85° C, 4.75 V ≤VCC ≤5.25 V unless otherwise specified.
Parameter
Input Optical Power
Level for Logic “0”
Symbol
Min.
PR(L)
Input Optical Power
Level for Logic “1”
High Level Output Current
Low Level Output Voltage
PR(H)
IOH
VOL
High Level Supply
Current
Low Level Supply Current
Effective Diameter
Internal Pull-up Resistor
Typ.
Max.
Units
Conditions
Ref.
–21.6
–9.5
dBm
Notes 1,
2, 4
–21.6
–8.7
VOL = 0.5 V
IOL = 8 mA
VOL = 0.5 V
IOL = 8 mA, 25° C
VOL = 5.25 V
IOH ≤250 μA
VO = 18 V, PR = 0
IOL = 8 mA,
PR = PR(L)MIN
VCC = 5.25 V,
PR = 0
VCC = 5.25 V
PR = -12.5 dBm
–43
dBm
5
0.4
250
0.5
A
V
ICCH
3.5
6.3
mA
ICCL
6.2
10
mA
1
1000
1700
mm

D
RL
680
Note 1
Note 3
Note 3
Note 3
Note 3
Notes:
1.
2.
3.
4.
Optical flux, P (dBm) = 10 Log [P (μW)/1000 μW].
Optical power measured at the end of 1 mm diameter POF (NA = 0.5) with a large area detector.
RL is open.
Pulsed LED operation at IF > 80 mA will cause increased link tPLH propagation delay time. This extended tPLH time contributes to increased pulse
width distortion of the receiver output signal.
11
1 MBd Link
(High Performance HFBR-15X2ETZ/25X2ETZ)
System Performance Under recommended operating conditions unless otherwise specified.
Parameter
High
Performance
1 MBd
Symbol
Data Rate
Link Distance
Typ.
dc
Max.
1
Units
Conditions
MBd
BER ≤10-9, PRBS:27-1
d
37
58
m
IFdc = 60 mA, 25° C
d
43
m
IFdc = 60 mA
(Standard Cable)
Link Distance
Min.
(Improved Cable)
m
67
IFdc = 60 mA
Ref.
Notes 1,
3, 4
Notes 1,
m
IFdc = 60 mA, 25° C
Propagation
tPLH
100
250
ns
RL = 560 , CL = 30 pF
Fig. 10, 12
Delay
tPHL
80
140
ns
I = 0.5 metre
Notes 2, 4
3, 4
PR = -24 dBm
Pulse Width
tD
Distortion tPLH-tPHL
20
ns
PR = -24 dBm
RL = 560 , CL = 30 pF
Fig. 10, 11
Note 4
Notes:
1. For IFPK > 80 mA, the duty factor must be such as to keep IFdc ≤80 mA. In addition, for IFPK > 80 mA, the following rules for pulse width apply:
IFPK ≤160 mA: Pulse width ≤1 ms
IFPK > 160 mA: Pulse width ≤1 S, period ≥20 S.
2. The propagation delay for one meter of cable is typically 5 ns.
3. Estimated typical link life expectancy at 40° C exceeds 10 years at 60 mA.
4. Pulsed LED operation at IFPK > 80 mA will cause increased link tPLH propagation delay time. This extended tPLH time contributes to increased
pulse width distortion of the receiver output signal.
Figure 9. Required 1 MBd interface circuit
The HFBR-25X2ETZ receiver cannot be overdriven when using the required
interface circuit shown in Figure 9
12
Figure 10. 1 MBd propagation delay test circuit
120
80
70
60
50
40
30
X5X2ETZ -40° C
X5X2ETZ 25° C
X5X2ETZ 85° C
20
10
0
-27
-24
-21
-18
-15
-12
PR - INPUT OPTICAL POWER - dBm
Figure 11. Typical link pulse width distortion vs. optical power
Figure 13. Propagation delay test waveforms
13
tP - PROPAGATION DELAY - ns
tD - PULSE WIDTH DISTORTION - ns
90
-9
-6
100
80
60
40
tPLH X5X2ETZ
tPHL X5X2ETZ
20
0
-27
-24
-21
-18
-15
-12
PR - INPUT OPTICAL POWER - dBm
Figure 12. Typical link propagation delay vs. optical power
-9
-6
HFBR-15X2ETZ Transmitters
CATHODE
Function
1
Anode
1
2
Cathode
2
3
Ground
4
Ground
5
Ground
8
Ground
8 GROUND
ANODE
Pin #
GROUND
3
GROUND
4
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
5 GROUND
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
TS
–40
+85
°C
Operating Temperature
TA
–40
+85
°C
Lead Soldering Cycle
Temp.
260
°C
Time
10
sec
IFPK
1000
mA
IFdc
80
VBR
5
Forward Input Current
Reverse Input Voltage
Reference
Note 1, 4
Note 2, 3
V
Notes:
1.
2.
3.
4.
1.6 mm below seating plane.
Recommended operating range between 10 and 750 mA.
1 s pulse, 20 s period.
Moisture sensitivity level is MSL-3
All HFBR15XXETZ LED transmitters are classified as IEC 825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed
draft scheduled to go into effect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. Contact your Avago sales
representative for more information.
Transmitter Electrical/Optical Characteristics -40° to 85° C unless otherwise specified.
For forward voltage and output power vs. drive current graphs.
Parameter
Transmitter Output
Optical Power
Output Optical Power
Temperature Coefficient
Peak Emission Wavelength
Forward Voltage
Forward Voltage
Temperature Coefficient
Effective Diameter
Reverse Input Breakdown
Voltage
Diode Capacitance
Rise Time
Fall Time
Symbol
Min.
PT
–13.9
–11.2
PT /T
PK
VF
VF /T
DT
VBR
CO
tr
tf
Typ.
Max.
Units
Conditions
Ref.
–4.0
–5.1
dBm
IFdc = 60 mA
IFdc = 60 mA, 25° C
Note 1
–0.85
1.43
5.0
660
1.67
–1.37
%/° C
2.05
nm
V
mV/° C
1
11.0
mm
V
86
20
20
pF
ns
ns
IFdc = 60 mA
Fig. 09
IFdc = 10 μA,
TA = 25° C
VF = 0, f = 1 MHz
10% to 90%,
IF = 60 mA
Note 2
Note:
1. Optical power measured at the end of 0.5 m of 1 mm diameter POF (NA = 0.5) with a large area detector.
2. Rise and fall times are measured with a voltage pulse driving the transmitter driver IC (75451). A wide bandwidth optical to electrical waveform
analyzer, terminated to a 50  input of a wide bandwidth oscilloscope, is used for this response time measurement.
14
HFBR-25X2ETZ Receivers
Pin #
Function
1
VO
2
Ground
3
VCC
4
RL
GROUND
5
Ground
VO
8
Ground
GROUND 5
1000 Ω
4
RL
3
VCC
2
1
Note: Pins 5 and 8 are for mounting and retaining purposes
only. Do not electrically connect these pins.
GROUND 8
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Lead Soldering Cycle
Symbol
Min.
Max.
Units
TS
TA
–40
–40
+85
+85
260
10
7
25
40
18
VCC
5
°C
°C
°C
sec
V
mA
mW
V
V
Temp.
Time
Supply Voltage
Output Collector Current
Output Collector Power Dissipation
Output Voltage
Pull-up Voltage
Fan Out (TTL)
VCC
IOAV
POD
VO
VP
N
–0.5
–0.5
–5
Reference
Note 1, 3
Note 2
Notes:
1. 1.6 mm below seating plane.
2. It is essential that a bypass capacitor 0.1 F be connected from pin 2 to pin 3 of the receiver. Total lead length between both ends of the capacitor
and the pins should not exceed 20 mm.
3. Moisture sensitivity level is MSL-3
Receiver Electrical/Optical Characteristics -40° to 85° C, 4.75 V ≤VCC ≤5.25 V unless otherwise specified.
Parameter
Receiver Optical Input
Power Level Logic 0
Optical Input Power
Level Logic 1
High Level Output Current
Low Level Output Voltage
Symbol
Min.
PR(L)
–24
Typ.
PR(H)
Max.
Units
-9.5
dBm
-43
dBm
IOH
VOL
5
0.4
250
0.5
A
V
High Level Supply Current
ICCH
3.5
6.3
mA
Low Level Supply Current
ICCL
6.2
10
mA
1
1000
1700
mm

Effective Diameter
Internal Pull-up Resistor
D
RL
680
Conditions
VOL  0.5 V
IOL = 8 mA
VOH = 5.25 V
IOH = ≤250 μA
VO = 18 V, PR = 0
IOL = 8 mA
PR = PR(L)MIN
VCC = 5.25 V,
PR = 0
VCC = 5.25 V,
PR = -12.5 dBm
Ref.
Notes 1, 2, 3
Note 4
Note 5
Note 5
Note 5
Note 5
Notes:
1. Optical power measured at the end of 1 mm diameter POF (NA = 0.5) with a large area detector.
2. Pulsed LED operation at IF > 80 mA will cause increased link tPLH propagation delay time. This extended tPLH time contributes to increased pulse
width distortion of the receiver output signal.
3. The LED drive circuit of Figure 11 is required for 1 MBd operation of the HFBR-25X2ETZ.
4. Optical flux, P (dBm) = 10 Log [P(W)/1000 W].
5. RL is open.
15
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Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved.
AV02-3283EN - February 23, 2012
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