Agilent HFCT-5963xxx Single Mode Laser Small Form Factor Transceivers for ATM, SONET OC-3/SDH STM-1 Part of the Agilent METRAK family Data Sheet Description The HFCT-5963xxx are high performance, cost effective modules for serial optical data communications applications specified for a signal rate of 155 Mb/s. They are designed to provide SONET/SDH compliant intermediate and long reach links at 155 Mb/s. All modules are designed for single mode fiber and operate at a nominal wavelength of 1300 nm. They incorporate high performance, reliable, long wavelength optical devices and proven circuit technology to give long life and consistent service. The transmitter section of the HFCT-5963xxx incorporates a 1300 nm Fabry Perot (FP) laser. The transmitter has full IEC 825 and CDRH Class 1 eye safety. The receiver section uses an MOVPE grown planar PIN photodetector for low dark current and excellent responsivity. These transceivers are supplied in the new industry standard 2 x 5 DIP style package with the LC fiber connector interface and is footprint compatible with SFF Multi Source Agreement (MSA). Features • HFCT-5963TL/ATL Links of 15 km with 9/125 µm single mode fiber (S1.1) • HFCT-5963NL Links of 40 km with 9/125 µm single mode fiber (L1.1) • Multisourced 2 x 5 package style with LC receptacle • Single +3.3 V power supply • Temperature range: HFCT-5963TL 0 °C to +70 °C HFCT-5963ATL: -40 °C to +85 °C HFCT-5963NL: -5 °C to +70 °C • Wave solder and aqueous wash process compatible • Manufactured in an ISO9002 certified facility • Fully Class 1 CDRH/IEC 825 compliant • +3.3 V TTL signal detect output • Transceivers are available with and without EMI nose shield (see ordering information details) Applications • SONET/SDH equipment interconnect, OC-3/SDH STM-1 rate • Long and intermediate reach ATM/SONET links • Suitable for Fast Ethernet Applications Functional Description Receiver Section Design The receiver section for the HFCT-5963xxx contains an InGaAs/InP photo detector and a preamplifier mounted in an optical subassembly. This optical subassembly is coupled to a postamp/decision circuit on a circuit board. The design of the optical assembly is such that it provides better than 14 dB Optical Return Loss (ORL). Figure 1 also shows a filter function which limits the bandwidth of the preamp output signal. The filter is designed to bandlimit the preamp output noise and thus improve the receiver sensitivity. These components will reduce the sensitivity of the receiver as the signal bit rate is increased above 155 Mb/s. The postamplifier is ac coupled to the preamplifier as illustrated in Figure 1. The coupling capacitors are large enough to pass the SONET/SDH test pattern at 155 Mb/s without significant distortion or performance penalty. If a lower signal rate, or a code which has significantly more low frequency content is used, sensitivity, jitter and pulse distortion could be degraded. Figure 1. Receiver Block Diagram 2 LVPECL OUTPUT BUFFER AMPLIFIER GND The Signal Detect Circuit The signal detect circuit works by sensing the level of the received signal and comparing this level to a reference. The SD output is +3.3 V TTL. DATA OUT FILTER TRANSIMPEDANCE PREAMPLIFIER Noise Immunity The receiver includes internal circuit components to filter power supply noise. However under some conditions of EMI and power supply noise, external power supply filtering may be necessary (see Application Section). SIGNAL DETECT CIRCUIT LVTTL OUTPUT BUFFER DATA OUT SD Functional Description Transmitter Section Design A schematic diagram for the transmitter is shown in Figure 2. The HFCT-5963xxx incorporates an FP laser as its optical source. All part numbers have been designed to be compliant with IEC 825 eye safety requirements under any single fault condition and CDRH under normal operating conditions. The optical output is controlled by a custom IC that detects the laser output via the monitor photodiode. This IC provides both dc and ac current drive to the laser to ensure correct modulation, eye diagram and extinction ratio over temperature, supply voltage and operating life. FP LASER DATA LASER MODULATOR DATA LVPECL INPUT LASER BIAS DRIVER LASER BIAS CONTROL Figure 2. Simplified Transmitter Schematic 3 PHOTODIODE (rear facet monitor) Package The overall package concept for these devices consists of the following basic elements; two optical subassemblies, two electrical subassemblies and the housing as illustrated in the block diagram in Figure 3. The package outline drawing and pin out are shown in Figures 4 and 5. The details of this package outline and pin out are compliant with the multisource definition of the 2 x 5 DIP. The low profile of the Agilent transceiver design complies with the maximum height allowed for the LC connector over the entire length of the package. The electrical subassemblies consist of high volume multilayer printed circuit boards on which the IC and various surface-mounted passive circuit elements are attached. encased with a metal EMI protective shield. The case is connected to signal ground and we recommend soldering the four ground tabs to host card signal ground. The receiver electrical subassembly includes an internal shield for the electrical and optical subassembly to ensure high immunity to external EMI fields. The PCBs for the two electrical subassemblies both carry the signal pins that exit from the bottom of the transceiver. The solder posts are fastened into the molding of the device and are designed to provide the mechanical strength required to withstand the loads imposed on the transceiver by mating with the LC connectored fiber cables. Although they are not connected electrically to the transceiver, it is recommended to connect them to chassis ground. The optical subassemblies are each attached to their respective transmit or receive electrical subassemblies. These two units are then fitted within the outer housing of the transceiver that is molded of filled nonconductive plastic to provide mechanical strength. The housing is then RX SUPPLY NOTE DATA OUT PIN PHOTODIODE PREAMPLIFIER SUBASSEMBLY QUANTIZER IC DATA OUT RX GROUND SIGNAL DETECT LC RECEPTACLE TX GROUND DATA IN DATA IN Tx DISABLE LASER BIAS MONITORING LASER DRIVER AND CONTROL CIRCUIT TX SUPPLY LASER DIODE MODULATOR LASER OPTICAL SUBASSEMBLY CASE NOTE: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION. Figure 3. Block Diagram 4 15.0 ± 0.2 (0.591 ± 0.008) 13.59 + 0 - 0.2 0.535 +0 -0.008 ( 13.59 (0.535) MAX ) TOP VIEW 48.2 (1.898) 6.25 (0.246) 9.8 (0.386) MAX 10.8 ± 0.2 9.6 ± 0.2 (0.425 ± 0.008)(0.378 ±0.008) 3.81 (0.15) 10.16 (0.4) Ø 1.07 (0.042) 19.5 ±0.3 (0.768 ±0.012) FRONT VIEW 1 (0.039) 10 x 0.5 (0.02) 1.78 (0.07) 4.06 (0.16) 0.25 (0.01) 1 (0.039) BACK VIEW SIDE VIEW 48.2 (1.898) 9.8 (0.386) MAX G MODULE - NO EMI NOSE SHIELD Ø 1.07 (0.042) 19.5 ±0.3 (0.768 ±0.012) 1 (0.039) 1.78 (0.07) 10 x 0.5 (0.02) 3.81 (0.15) 0.25 (0.01) SIDE VIEW 10 x 0.25 (PIN THICKNESS) (0.01) NOTE: END OF PINS CHAMFERED BOTTOM VIEW DIMENSIONS IN MILLIMETERS (INCHES) DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA. Figure 4. HFCT-5963xxx Package Outline Drawing 5 Connection Diagram RX TX Mounting Studs/ Solder Posts Package Grounding Tabs Top View RECEIVER SIGNAL GROUND RECEIVER POWER SUPPLY SIGNAL DETECT RECEIVER DATA OUT BAR RECEIVER DATA OUT o o o o o 1 2 3 4 5 10 9 8 7 6 o o o o o TRANSMITTER DATA IN BAR TRANSMITTER DATA IN TRANSMITTER DISABLE TRANSMITTER SIGNAL GROUND TRANSMITTER POWER SUPPLY Figure 5. Pin Out Diagram (Top View) Pin Descriptions: Pin 1 Receiver Signal Ground VEE RX: Directly connect this pin to the receiver ground plane. Pin 2 Receiver Power Supply VCC RX: Provide +3.3 V dc via the recommended receiver power supply filter circuit. Locate the power supply filter circuit as close as possible to the VCC RX pin. Note: the filter circuit should not cause VCC to drop below minimum specification. Pin 3 Signal Detect SD: Normal optical input levels to the receiver result in a logic “1” output. Low optical input levels to the receiver result in a logic “0” output. This Signal Detect output can be used to drive a +3.3 V TTL input on an upstream circuit, such as Signal Detect input or Loss of Signal-bar. 6 Pin 4 Receiver Data Out Bar RD-: No internal terminations are provided. See recommended circuit schematic. Pin 9 Transmitter Data In TD+: No internal terminations are provided. See recommended circuit schematic. Pin 5 Receiver Data Out RD+: No internal terminations are provided. See recommended circuit schematic. Pin 10 Transmitter Data In Bar TD-: No internal terminations are provided. See recommended circuit schematic. Pin 6 Transmitter Power Supply VCC TX: Provide +3.3 V dc via the recommended transmitter power supply filter circuit. Locate the power supply filter circuit as close as possible to the VCC TX pin. Mounting Studs/Solder Posts The two mounting studs are provided for transceiver mechanical attachment to the circuit board. It is recommended that the holes in the circuit board be connected to chassis ground. Pin 7 Transmitter Signal Ground VEE TX: Directly connect these pins to the transmitter signal ground plane. Package Grounding Tabs Connect four package grounding tabs to signal ground. Pin 8 Transmitter Disable TDIS: Optional feature, connect this pin to +3.3 V TTL logic high “1” to disable module. To enable module connect to TTL logic low “0”. Application Information The Applications Engineering Group at Agilent is available to assist you with technical understanding and design tradeoffs associated with these transceivers. You can contact them through your Agilent sales representative. The following information is provided to answer some of the most common questions about the use of the parts. minimum transmitter output optical power (dBm avg) and the lowest receiver sensitivity (dBm avg). This OPB provides the necessary optical signal range to establish a working fiber-optic link. The OPB is allocated for the fiber-optic cable length and the corresponding link penalties. For proper link performance, all penalties that affect the link performance must be accounted for within the link optical power budget. Optical Power Budget and Link Penalties The worst-case Optical Power Budget (OPB) in dB for a fiberoptic link is determined by the difference between the Electrical and Mechanical Interface Recommended Circuit Figures 6a and 6b show recommended dc and ac coupled circuits for deploying the Agilent transceivers in +3.3 V systems. Data Line Interconnections Agilent’s HFCT-5963xxx fiberoptic transceivers are designed to couple to +3.3 V PECL signals. The transmitter driver circuit regulates the output optical power. The regulated light output will maintain a constant output optical power provided the data pattern is reasonably balanced in duty cycle. If the data duty cycle has long, continuous state times (low or high data duty cycle), then the output optical power will gradually change its average output optical power level to its preset value. PHY DEVICE TERMINATE AT TRANSCEIVER INPUTS Z = 50 W VCC (+3.3 V) TDIS (LVTTL) 130 W 100 W TD- Z = 50 W LVPECL 130 W 1 7 6 TDIS o VEE TX o VCC TX o o RD+ TD+ o 2 8 o SD o V CC RX RX o VEE RX TX 9 TD- o 10 o RD- TD+ 3 4 1 µH C2 C5 * 10 µF VCC (+3.3 V) C3 10 µF VCC (+3.3 V) 1 µH C1 5 RD+ C4 * 10 µF Z = 50 W 100 W LVPECL RD- Z = 50 W 130 W 130 W Z = 50 W Note: C1 = C2 = C3 = 10 nF or 100 nF * C4 AND C5 ARE OPTIONAL BYPASS CAPACITORS FOR ADDITIONAL LOW FREQUENCY NOISE FILTERING. Figure 6a. Recommended dc coupled interface circuit 7 SD TERMINATE AT DEVICE INPUTS LVTTL VCC (+3.3 V) 82 Ω 100 nF 100 nF TDIS (LVTTL) BMON- 82 Ω Z = 50 Ω VCC (+3.3 V) 130 Ω 130 Ω 100 nF BMON+ Z = 50 Ω TD130 Ω 130 Ω PMON- NOTE A TD+ PMON+ o RD- VCC TX o o SD 5 6 7 8 9 10 1 µH C2 C3 C1 VCC (+3.3 V) 10 µF 1 µH VCCRX (+3.3 V) 200 Ω NOTE C C5 * 10 µF VCC (+3.3 V) 100 nF o RD+ TD+ o o VCC RX 4 TDIS o TD- o o VEE RX VEE TX o BMON- o 3 VEE TX o o DNC 2 o VEERX BMON+ o 1 o DNC RX o VEE RX PMON- o TX o VpdR PMON+ o 20 19 18 17 16 15 14 13 12 11 VCC (+3.3 V) 82 Ω 82 Ω RD+ C4 * 10 µF 100 nF Z = 50 Ω 130 ΩW NOTE B RD- 10 nF 100 nF 130 Ω 130 Ω Z = 50 Ω Z = 50 Ω VCC (+3.3 V) 100 nF 130 Ω 130 Ω SD LVPECL 82 Ω Note: C1 = C2 = C3 = 10 nF or 100 nF Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT Note B: WHEN INTERNAL BIAS IS PROVIDED REPLACE SPLIT RESISTORS WITH 100 Ω TERMINATION Note C: THE BIAS RESISTOR FOR VpdR SHOULD NOT EXCEED 200 Ω * C4 AND C5 ARE OPTIONAL BYPASS CAPACITORS FOR ADDITIONAL LOW FREQUENCY NOISE FILTERING. Figure 6b. Recommended ac coupled interface circuit The HFCT-5963xxx have a transmit disable function which is a single-ended +3.3 V TTL input which is dc-coupled to pin 8. As for the receiver section, it is internally ac-coupled between the preamplifier and the postamplifier stages. The actual Data and Data-bar outputs of the postamplifier are dc-coupled to their respective output pins (pins 4, 5). The two data outputs of the receiver should be terminated with identical load circuits. Signal Detect is a single-ended, +3.3 V TTL output signal that is dc-coupled to pin 3 of the module. Signal Detect should not be ac-coupled externally to the follow-on circuits because of its infrequent state changes. 8 Power Supply Filtering and Ground Planes It is important to exercise care in circuit board layout to achieve optimum performance from these transceivers. Figures 6a and 6b show the power supply circuit which complies with the small form factor multisource agreement. It is further recommended that a continuous ground plane be provided in the circuit board directly under the transceiver to provide a low inductance ground for signal return current. This recommendation is in keeping with good high frequency board layout practices. Package footprint and front panel considerations The Agilent transceivers comply with the circuit board “Common Transceiver Footprint” hole pattern defined in the current multisource agreement which defined the 2 x 5 package style. This drawing is reproduced in Figure 7 with the addition of ANSI Y14.5M compliant dimensioning to be used as a guide in the mechanical layout of your circuit board. Figure 8 shows the front panel dimensions associated with such a layout. Eye Safety Circuit For an optical transmitter device to be eye-safe in the event of a single fault failure, the transmitter must either maintain eye-safe operation or be disabled. The HFCT-5963xxx is intrinsically eye safe and does not require shut down circuitry. Signal Detect The Signal Detect circuit provides a deasserted output signal when the optical link is broken (or when the remote transmitter is OFF). The Signal Detect threshold is set to transition from a high to low state between the minimum receiver input optical power and -45 dBm avg. input optical power indicating a definite optical fault (e.g. unplugged connector for the receiver or transmitter, broken fiber, or failed far-end transmitter or data source). The Signal Detect does not detect receiver data error or error-rate. Data errors can be determined by signal processing offered by upstream PHY ICs. Electromagnetic Interference (EMI) One of a circuit board designer’s foremost concerns is the control of electromagnetic emissions from electronic equipment. Success in controlling generated Electromagnetic Interference (EMI) enables the designer to pass a governmental agency’s EMI regulatory standard and more importantly, it reduces the possibility of interference to neighboring equipment. Agilent has designed the HFCT-5963xxx to provide excellent EMI performance. The EMI performance of a chassis is dependent on physical design and features which help improve EMI suppression. Agilent encourages using standard RF suppression practices and avoiding poorly EMI-sealed enclosures. Agilent’s OC-3 LC transceivers (HFCT-5963xxx) have nose shields which provide a convenient chassis connection to the nose of the transceiver. This 9 2 x Ø 2.29 MAX. 2 x Ø 1.4 ±0.1 (0.09) (0.055 ±0.004) 17.8 (0.700) 2 x Ø 1.4 ±0.1 7.11 (0.055 ±0.004) (0.28) 3.56 (0.14) 4 x Ø 1.4 ±0.1 (0.055 ±0.004) 13.34 (0.525) 10.16 (0.4) 7.59 (0.299) 9.59 (0.378) 3 (0.118) 4 x 1.78 (0.07) 3 (0.118) 6 (0.236) 2 (0.079) 2 2 x Ø 2.29 (0.079) (0.09) 4.57 (0.18) 3.08 (0.121) 10 x Ø 0.81 ±0.1 (0.032 ±0.004) DIMENSIONS IN MILLIMETERS (INCHES) NOTES: 1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER. 2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR GROUND CONNECTION IN KEEP-OUT AREAS. 3. 2 x 5 TRANSCEIVER MODULE REQUIRES 16 PCB HOLES (10 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE GROUNDING TABS). PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND. 4. THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS. 5. HOLES FOR HOUSING LEADS MUST BE TIED TO SIGNAL GROUND. Figure 7. Recommended Board Layout Hole Pattern nose shield improves system EMI performance by effectively closing off the LC aperture. Localized shielding is also improved by tying the four metal housing package grounding tabs to signal ground on the PCB. Though not obvious by inspection, the nose shield and metal housing are electrically separated for customers who do not wish to directly tie chassis and signal grounds together. The recommended transceiver position, PCB layout and panel opening for these devices are the same, making them mechanically drop-in compatible. Figure 8 shows the recommended positioning of the transceivers with respect to the PCB and faceplate. Package and Handling Instructions Flammability The HFCT-5963xxx transceiver housing consists of high strength, heat resistant and UL 94 V-0 flame retardant plastic and metal packaging. Recommended Solder and Wash Process The HFCT-5963xxx are compatible with industrystandard wave solder processes. Process plug This transceiver is supplied with a process plug for protection of the optical port within the LC connector receptacle. This process plug prevents contamination during wave solder and aqueous rinse as well as during handling, shipping and storage. It is made of a hightemperature, molded sealing material that can withstand +85°C and a rinse pressure of 110 lbs per square inch. The process plug should only be used once. After removing it from the transceiver, it must not be used again as a process plug; however, if it has not been contaminated it can be reused as a dust cover. 000 000 000 15.24 (0.6) 10.16 ±0.1 (0.4 ±0.004) TOP OF PCB 000 000 000 000 000 000 000 000000000 000000000 000000000 000000000 000000000 B B DETAIL A 15.24 (0.6) 1 (0.039) 000 000 000 0000000000000000000000000000 0000000000000000000000000000 14.22 ±0.1 (0.56 ±0.004) A SOLDER POSTS 000 00000000000 00000000000000000000000000000000000000000 000000000000000000000000000000 000 000 15.75 MAX. 15.0 MIN. (0.62 MAX. 0.59 MIN.) SECTION B - B Recommended Solder fluxes Solder fluxes used with the HFCT-5963xxx should be water-soluble, organic fluxes. Recommended solder fluxes include Lonco 3355-11 from London Chemical West, Inc. of Burbank, CA, and 100 Flux from Alpha-Metals of Jersey City, NJ. Recommended Cleaning/Degreasing Chemicals Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane, heptane Other: naphtha. Do not use partially halogenated hydrocarbons such as 1,1.1 trichloroethane, ketones such as MEK, acetone, chloroform, ethyl acetate, methylene dichloride, phenol, methylene chloride, or N-methylpyrolldone. Also, Agilent does not recommend the use of cleaners that use halogenated hydrocarbons because of their potential environmental harm. 10 DIMENSIONS IN MILLIMETERS (INCHES) 1. 2. FIGURE DESCRIBES THE RECOMMENDED FRONT PANEL OPENING FOR A LC OR SG SFF TRANSCEIVER. SFF TRANSCEIVER PLACED AT 15.24 mm (0.6) MIN. SPACING. Figure 8. Recommended Panel Mounting LC SFF Cleaning Recommendations In the event of contamination of the optical ports, the recommended cleaning process is the use of forced nitrogen. If contamination is thought to have remained, the optical ports can be cleaned using a NTT international Cletop stick type (diam. 1.25mm) and HFE7100 cleaning fluid. Regulatory Compliance The Regulatory Compliance for transceiver performance is shown in Table 1. The overall equipment design will determine the certification level. The transceiver performance is offered as a figure of merit to assist the designer in considering their use in equipment designs. The second case to consider is static discharges to the exterior of the equipment chassis containing the transceiver parts. To the extent that the LC connector receptacle is exposed to the outside of the equipment chassis it may be subject to whatever system-level ESD test criteria that the equipment is intended to meet. Electrostatic Discharge (ESD) There are two design cases in which immunity to ESD damage is important. Electromagnetic Interference (EMI) Most equipment designs utilizing these high-speed transceivers from Agilent will be required to meet FCC regulations in the United States, CENELEC EN55022 (CISPR 22) in Europe and VCCI in Japan. Refer to EMI section (page 9) for more details. The first case is during handling of the transceiver prior to mounting it on the circuit board. It is important to use normal ESD handling precautions for ESD sensitive devices. These precautions include using grounded wrist straps, work benches, and floor mats in ESD controlled areas. Immunity Transceivers will be subject to radio-frequency electromagnetic fields following the IEC 61000-4-3 test method. Eye Safety These laser-based transceivers are classified as AEL Class I (U.S. 21 CFR(J) and AEL Class 1 per EN 60825-1 (+A11). They are eye safe when used within the data sheet limits per CDRH. They are also eye safe under normal operating conditions and under all reasonably foreseeable single fault conditions per EN60825-1. Agilent has tested the transceiver design for compliance with the requirements listed below under normal operating conditions and under single fault conditions where applicable. TUV Rheinland has granted certification to these transceivers for laser eye safety and use in EN 60825-2 applications. Their performance enables the transceivers to be used without concern for eye safety up to 3.5 V transmitter VCC. Table 1: Regulatory Compliance - Targeted Specification Feature Test Method Electrostatic Discharge (ESD) MIL-STD-883 to the Performance Class 1 (>500 V). Method 3015 Electrical Pins Electrostatic Discharge (ESD) Variation of IEC 61000-4-2 Tested to 8 kV contact discharge. to the LC Receptacle Electromagnetic Interference FCC Class B Margins are dependent on customer board and chassis designs. (EMI) Immunity Variation of IEC 61000-4-3 Typically show no measurable effect from a 10 V/m field swept from 27 to 1000 MHz applied to the transceiver Laser Eye Safety FDA CDRH 21-CFR 1040 and Equipment Type Testing Class 1 without a chassis enclosure. Accession Number: HFCT-5961NL/NG ) 9521220-46 HFCT-5961TL/TG/ATL/ATG ) 9521220-47 IEC 60825-1 Amendment 2 2001-01 Component Recognition Underwriters Laboratories and Canadian Standards Association Joint Component Recognition for Information Technology Equipment Including Electrical Business Equipment. 11 License Number: HFCT-5961NL/NG ) 933/510116/01 26 July 2001 HFCT-5963TL/TG/ATL/ATG ) 933/510201/02 18 Jan. 2002 UL File Number: E173874, 01SC14051 CAUTION: There are no user serviceable parts nor any maintenance required for the HFCT-5963xxx. All adjustments are made at the factory before shipment to our customers. Tampering with or modifying the performance of the parts will result in voided product warranty. It may also result in improper operation of the circuitry, and possible overstress of the laser source. Device degradation or product failure may result. Connection of the devices to a non-approved optical source, operating above the recommended absolute maximum conditions or operating the HFCT-5963xxx in a manner inconsistent with its design and function may result in hazardous radiation exposure and may be considered an act of modifying or manufacturing a laser product. The person(s) performing such an act is required by law to recertify and reidentify the laser product under the provisions of U.S. 21 CFR (Subchapter J). 12 Absolute Maximum Ratings (HFCT-5963xxx) Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Symbol Min. Max. Unit Storage Temperature TS -40 Typ. +85 °C Supply Voltage VCC -0.5 3.6 V Data Input Voltage VI -0.5 VCC V Reference Data Output Current ID 50 mA Relative Humidity RH 85 % Max. Unit Reference Recommended Operating Conditions (HFCT-5963xxx) Parameter Symbol Min. Typ. HFCT-5963TL/TG TA 0 +70 °C 1 HFCT-5963NL/NG TA -5 +70 °C 1 HFCT-5963ATL/ATG Supply Voltage TA VCC -40 3.1 +85 3.5 °C V 1 2 Power Supply Noise Rejection PSNR mVP-P 3 Transmitter Differential Input Voltage VD Data Output Load RDL Transmit Disable Input Voltage - Low TDIS Transmit Disable Input Voltage - High TDIS Ambient Operating Temperature 100 0.3 1.6 V W 50 0.6 2.2 V V Transmit Disable Assert Time TASSERT 10 µs 4 Transmit Disable Deassert Time TDEASSERT 1.0 ms 5 Max. +260/10 Unit °C/sec. Reference 6 Process Compatibility (HFCT-5963xxx) Parameter Wave Soldering and Aqueous Wash Symbol TSOLD/tSOLD Min. Typ. Notes: 1. Ambient operating temperature utilizes air flow of 2 ms-1 over the device. 2. The transceiver is class 1 eye safe up to V CC = 3.5 V. 3. Tested with a sinusoidal signal in the frequency range from 10 Hz to 1 MHz on the VCC supply with the recommended power supply filter in place. Typically less than a 1 dB change in sensitivity is experienced. 4. Time delay from Transmit Disable Assertion to laser shutdown. 5. Time delay from Transmit Disable Deassertion to laser startup. 6. Aqueous wash pressure <110 psi. The transceivers are compliant to OC-3 parametric specification when operating at 125 Mbit/s. 13 Transmitter Electrical Characteristics HFCT-5963TL/TG: TA = 0 °C to +70 °C, VCC = 3.1 V to 3.5 V) HFCT-5963/NL/NG: TA = -5 °C to +70 °C, VCC = 3.1 V to 3.5 V) HFCT-5963ATL/ATG: TA = -40 °C to +85 °C, VCC = 3.1 V to 3.5 V) Parameter Symbol Supply Current ICCT Min. Power Dissipation PDIST Data Input Voltage Swing (single-ended) VIH - VIL 250 Transmitter Differential Data Input Current - Low IIL -350 Typ. Max. Unit 54 140 mA 0.5 W 930 mV Reference µA Transmitter Differential Data Input Current - High IIH 350 µA Typ. Max. Unit Reference 95 140 mA 1 Receiver Electrical Characteristics HFCT-5963TL/TG: TA = 0 °C to +70 °C, VCC = 3.1 V to 3.5 V) HFCT-5963NL/NG: TA = -5 °C to +70 °C, VCC = 3.1 V to 3.5 V) HFCT-5963ATL/ATG: TA = -40 °C to +85 °C, VCC = 3.1 V to 3.5 V) Parameter Symbol Supply Current ICCR Min. 0.5 W 930 mV 2 tr 2.2 ns 3 tf 2.2 ns 3 0.6 V 100 µs 100 µs Power Dissipation PDISR Data Output Voltage Swing (single-ended) VOH - VOL Data Output Rise Time Data Output Fall Time 575 Signal Detect Output Voltage - Low Signal Detect Output Voltage - High 2.2 Signal Detect Assert Time (OFF to ON) ASMAX Signal Detect Deassert Time (ON to OFF) ANSMAX Notes: 1. Includes current for biasing Rx data outputs. 2. These outputs are compatible with low voltage PECL inputs. 3. These are 20-80% values. 14 2.3 V Transmitter Optical Characteristics HFCT-5963TL/TG: TA = 0 °C to +70 °C, VCC = 3.1 V to 3.5 V) HFCT-5963ATL/ATG: TA = -40 °C to +85 °C, VCC = 3.1 V to 3.5 V) Parameter Symbol Min. Max. Unit Reference Output Optical Power 9 µm SMF POUT -15 Typ. -8 dBm 1 Center Wavelength lC 1261 1360 nm Spectral Width - rms s 7.7 nm rms 2 Optical Rise Time tr 2 ns 3 Optical Fall Time tf 2 ns 3 Extinction Ratio ER Output Optical Eye Compliant with eye mask Telcordia GR-253-CORE and ITU-T G.957 8.2 dB Transmitter Optical Characteristics HFCT-5963NL/NG: TA = -5 °C to +70 °C, VCC = 3.1 V to 3.5 V) Parameter Symbol Min. Max. Unit Reference Output Optical Power 9 µm SMF POUT -5 Typ. 0 dBm 1 Center Wavelength lC 1270 1360 nm Spectral Width - rms s 3 nm rms 2 Optical Rise Time tr 2 ns 3 Optical Fall Time tf 2 ns 3 Extinction Ratio ER Output Optical Eye Compliant with eye mask Telcordia GR-253-CORE and ITU-T G.957 10 dB Receiver Optical Characteristics HFCT-5963TL/TG: TA = 0 °C to +70 °C, VCC = 3.1 V to 3.5 V) HFCT-5963NL/NG: TA = -5 °C to +70 °C, VCC = 3.1 V to 3.5 V) HFCT-5963ATL/ATG: TA = -40 °C to +85 °C, VCC = 3.1 V to 3.5 V) Parameter Symbol Typ. Max. Unit Reference Receiver Sensitivity HFCT-5963TL/TG/ATL/ATG PIN MIN Min. -38 -31 dBm avg. 4 Receiver Sensitivity HFCT-5963NL/NG Receiver Overload -34 PIN MAX -8 -38 0 dBm avg. dBm avg. 4 4 Input Operating Wavelength l 1261 1580 nm Signal Detect - Asserted PA -34 dBm avg. Signal Detect - Deasserted PD -45 -42.2 Signal Detect - Hysteresis PH 0.5 1.89 -40.3 dBm avg. 4 dB Notes: 1. The output power is coupled into a 1 m single-mode fiber. Minimum output optical level is at end of life. 2. The relationship between FWHM and RMS values for spectral width can be derived from the assumption of a Gaussian shaped spectrum which results in RMS = FWHM/2.35. 3. These are unfiltered 10-90% values. 4. PIN represents the typical optical input sensitivity of the receiver. Sensitivity (PINMIN ) and saturation (PINMAX) levels for a 223 -1 PRBS with 72 ones and 72 zeros inserted. Over the range the receiver is guaranteed to provide output data with a Bit Error Rate better than or equal to 1 x 10-10. 15 Ordering Information 1300 nm FP Laser (Temperature range 0 °C to +70 °C, HFCT-5963TL = 2 x 5 LC connector, IR, +3.3 V TTL SD with EMI nose shield HFCT-5963TG = 2 x 5 LC connector, IR, +3.3 V TTL SD without EMI nose shield 1300 nm FP Laser (Temperature range -5 °C to +70 °C, HFCT-5963NL = 2 x 5 LC connector. LR, +3.3 V TTL SD with EMI nose shield HFCT-5963NG = 2 x 5 LC connector. LR, +3.3 V TTL SD without EMI nose shield 1300 nm FP Laser (Temperature range -40°C to +85 °C, HFCT-5963ATL = 2 x 5 LC connector. IR, +3.3 V TTL SD with EMI nose shield HFCT-5963ATG = 2 x 5 LC connector, IR, +3.3 V TTL SD without EMI nose shield Related Products Other single mode HFCT-5961xxx = HFCT-5962xxx = HFCT-5964xxx = OC-3 transceivers in this product family are:2 x 5 LC connector, LR/IR, LVPECL SD 2 x 10 LC connector. LR/IR, LVPECL SD 2 x 10 LC connector, LR/IR, +3.3 V TTL SD Class 1 Laser Product: This product conforms to the applicable requirements of 21 CFR 1040 at the date of manufacture Date of Manufacture: Agilent Technologies Inc., No 1 Yishun Ave 7, Singapore Handling Precautions 1. The HFCT-5963xxx can be damaged by current surges or overvoltage. Power supply transient precautions should be taken. 2. Normal handling precautions for electrostatic sensitive devices should be taken. www.agilent.com/ semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. Obsoletes: 5988-7874EN December 18, 2002 5988-8394EN