HSMC HI32C Pnp epitaxial planar transistor Datasheet

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9002
Issued Date : 1994.03.02
Revised Date : 2002.01.17
Page No. : 1/3
HI32C
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HI32C is designed for use in general purpose amplifier and low
speed switching applications.
Absolute Maximum Ratings (Ta=25°C)
TO-251
• Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 °C
Junction Temperature .................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) ...................................................................................... 15W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage.................................................................................... -100 V
BVCEO Collector to Emitter Voltage................................................................................. -100 V
BVEBO Emitter to Base Voltage........................................................................................... -5 V
IC Collector Current ............................................................................................................. -3 A
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
ICES
ICEO
IEBO
*VCE(sat)
*VBE(on)
*hFE1
*hFE2
fT
Min.
-100
-100
25
10
3
Typ.
-
Max.
-20
-50
-1
-1.2
-1.8
50
-
Unit
V
V
uA
uA
mA
V
V
MHz
Test Conditions
IC=-1mA, IE=0
IC=-30mA, IB=0
VCE=-100V, VBE=0
VCE=-60V, IB=0
VEB=-5V, IC=0
IC=-3A, IB=-375mA
VCE=-4V, IC=-3A
VCE=-4V, IC=-1A
VCE=-4V, IC=-3A
VCE=-10V, IC=-500mA, f=1MHz
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
HI32C
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE9002
Issued Date : 1994.03.02
Revised Date : 2002.01.17
Page No. : 2/3
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
1000
100
o
o
75 C
Saturation Voltage (mV)
125 C
hFE
o
25 C
o
75 C
o
125 C
o
25 C
hFE @ VCE=4V
VCE(sat) @ IC=8IB
10
100
1
10
100
1000
10000
1
10
Collector Current IC (mA)
100
1000
10000
Collector Current IC (mA)
ON Voltage & Collector Current
Switching Time & Collector Current
10.00
10000
Switching Times (us)..
ON Voltage (mV)
VCC=30V, IC=10IB1=-10IB2
o
1000
25 C
o
o
125 C
75 C
1.00
Ton
Tstg
0.10
Tf
VBE(ON) @ VCE=4V
100
0.01
1
10
100
1000
10000
0.1
Collector Current IC (mA)
Capacitance & Reverse-Biased Voltage
10000
Collector Current (mA)
Capacitance (pF)
10.0
Safe Operating Area
1000
100
1000
PT=1ms
PT=100ms
100
PT=1s
10
Cob
1
10
0.1
1
10
Reverse-Biased Voltage (V)
HI32C
1.0
Collector Current (A)
100
1
10
100
1000
Forward Voltage (V)
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE9002
Issued Date : 1994.03.02
Revised Date : 2002.01.17
Page No. : 3/3
MICROELECTRONICS CORP.
TO-251 Dimension
A
B
Marking:
C
H
3 2 C
D
Date Code
F
I
Control Code
G
Style: Pin 1.Base 2.Collector 3.Emitter
3
I
K
E
H
2
1
J
3-Lead TO-251 Plastic Package
HSMC Package Code: I
*: Typical
Inches
Min.
Max.
0.0177 0.0217
0.0354 0.0591
0.0177 0.0236
0.0866 0.0945
0.2520 0.2677
0.2677 0.2835
DIM
A
B
C
D
E
F
Millimeters
Min.
Max.
0.45
0.55
0.90
1.50
0.45
0.60
2.20
2.40
6.40
6.80
6.80
7.20
DIM
G
H
I
J
K
Inches
Min.
Max.
0.2559
*0.1811
0.0354
0.0315
0.2047 0.2165
Millimeters
Min.
Max.
6.50
*4.60
0.90
0.80
5.20
5.50
Notes: 1.Dimension and tolerance based on our Spec. dated May. 24,1995.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HI32C
HSMC Product Specification
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