AVAGO HLMP-EG2B-XY0DD New t-1 3/4 (5mm) extra high brightness alingap led lamp Datasheet

HLMP-EGxx, HLMP-ELxx
New T-1¾ (5mm) Extra High Brightness AlInGaP LED Lamps
Data Sheet
Description
Features
These Precision Optical Performance AlInGaP LEDs
provide superior light output for excellent readability in
sunlight and are extremely reliable. AlInGaP LED technology provides extremely stable light output over long
periods of time. Precision Optical Performance lamps
utilize the aluminum indium gallium phosphide (AlInGaP)
technology.
• Viewing angle: 15°, 23°, 30°
• High luminous output
• Colors:
590nm Amber
626nm Red
• Package options:
With or without lead standoff
These LED lamps are untinted, T-1¾ packages incorporating second generation optics producing well defined
spatial radiation patterns at specific viewing cone angles.
These lamps are made with an advanced optical grade
epoxy offering superior high temperature and high
moisture resistance performance in outdoor signal and
sign application. The maximum LED junction temperature limit of +130°C enables high temperature operation
in bright sunlight conditions. The epoxy contains both
uv-a and uv-b inhibitors to reduce the effects of long
term exposure to direct sunlight.
Benefits
• Superior performance for outdoor environments
• Suitable for auto-insertion onto PC board
• Superior resistance to moisture
• Untinted for 15°, 23° and 30° lamps
Applications
• Traffic management:
- Traffic signals
- Pedestrian signals
- Work zone warning lights
- Variable message signs
• Solar Power signs
• Commercial outdoor advertising
- Signs
- Marquees
Package Dimension
B: Standoff
A: Non-standoff
5.00 ± 0.20
(0.197 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
1.14 ±0.20
(0.045 ± 0.008)
8.71 ±0.20
(0.343 ±0.008)
d
0.70 (0.028)
MAX.
8.71 ±0.20
(0.343 ±0.008)
1.14 ±0.20
(0.045 ±0.008)
2.35 (0.093)
MAX.
31.60
MIN.
(1.244)
1.50 ±0.15
(0.059 ±0.006)
31.60
MIN.
(1.244)
0.70 (0.028)
MAX.
CATHODE
LEAD
CATHODE
LEAD
0.50 ±0.10
SQ. TYP.
(0.020 ±0.004)
1.00 MIN.
(0.039)
5.80 ±0.20
(0.228 ±0.008)
CATHODE
FLAT
2.54 ±0.38
(0.100 ±0.015)
Viewing Angle
d
15°
12.39±0.25
(0.476±0.010)
23° & 30°
11.96±0.25
(0.459±0.010)
Notes:
1. All dimensions are in millimeters (inches)
2. Leads are mild steel with tin plating.
3. The epoxy meniscus is 1.21mm max
4. For Identification of polarity after the
leads are trimmed off, please refer to the
illustration below:
CATHODE
ANODE
1.00 MIN.
(0.039)
CATHODE
FLAT
0.50 ±0.10
SQ. TYP.
(0.020 ±0.004)
5.80 ±0.20
(0.228 ±0.008)
2.54 ±0.38
(0.100 ±0.015)
Device Selection Guide
Typical viewing
Angle
2θ1/2 (Deg) [4]
Color and Dominant
Wavelength (nm),
Typ [3]
Lamps without Standoff
on leads
(Package drawing A)
Lamps with Standoff
on leads
(Package drawing B)
Luminous Intensity
Iv (mcd) [1,2,5] at 20 mA
Min
Max
15°
Amber 590
HLMP-EL1A-Z1KDD
HLMP-EL1B-Z1KDD
12000
21000
HLMP-EL1A-Z1LDD
HLMP-EL1B-Z1LDD
12000
21000
Red 626
HLMP-EG1A-Z10DD
HLMP-EG1B-Z10DD
12000
21000
Amber 590
HLMP-EL2A-XYKDD
HLMP-EL2B-XYKDD
7200
12000
HLMP-EL2A-XYLDD
HLMP-EL2B-XYLDD
7200
12000
Red 626
HLMP-EG2A-XY0DD
HLMP-EG2B-XY0DD
7200
12000
Amber 590
HLMP-EL3A-VWKDD
HLMP-EL3B-VWKDD
4200
7200
HLMP-EL3A-VWLDD
HLMP-EL3B-VWLDD
4200
7200
HLMP-EL3A-WXKDD
HLMP-EL3B-WXKDD
5500
9300
HLMP-EL3A-WXLDD
HLMP-EL3B-WXLDD
5500
9300
HLMP-EG3A-VW0DD
HLMP-EG3B-VW0DD
4200
7200
HLMP-EG3A-WX0DD
HLMP-EG3B-WX0DD
5500
7200
23°
30°
Red 626
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each bin limit is ± 15%
Part Numbering System
HLMP – E x xx - x x x xx
Mechanical Options
DD : Ammo Pack
Color Bin Selections
0 : Full color distribution
K : Color Bin 2 & 4
L : Color Bin 4 & 6
Maximum Intensity Bin
0 : No maximum intensity limit (Refer to Selection Guide)
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Lead Standoffs
1A: 15° without lead standoff
1B: 15° with lead standoff
2A: 23° without lead standoff
2B: 23° with lead standoff
3A: 30° without lead standoff
3B: 30° with lead standoff
Color
G : Red 626nm
L : Amber 590nm
Note: Please refer to AB 5337 for complete information on part numbering system.
Absolute Maximum Ratings
TJ = 25°C
Parameter
Red/Amber
Unit
DC Forward Current [2]
50
mA
Peak Forward Current
100 [1]
mA
Average forward current
30
mA
Power Dissipation
120
mW
Reverse Voltage
5
V
Operating Temperature Range
-40 to +100
°C
Storage Temperature Range
-40 to +100
°C
Notes:
1. Duty Factor 30%, frequency 1KHz.
2. Derate linearly as shown in Figure 4
Electrical / Optical Characteristics
TJ = 25°C
Parameter
Symbol
Min
Typ.
Max
Units
Forward Voltage
Amber
Red
VF
1.8
1.8
2.1
2.1
2.4
2.4
V
Reverse Voltage
VR
5
Dominant Wavelength [1]
ld
Peak Wavelength
Amber
Red
lPEAK
Spectral Halfwidth
Amber
Red
Δl1/2
Thermal resistance
RqJ-PIN
Luminous Efficacy [2]
ηv
Luminous Flux
Amber
Red
Φv
Luminous Efficiency [3]
Amber
Red
ηe
Amber
Red
Amber
Red
Thermal coefficient of ld
Amber
Red
584.5
618.0
590.0
626.0
594
634
13
14
240
500
200
2000
1900
47
45
0.08
0.05
594.5
630.0
Test Conditions
IF = 20 mA
V
IR = 100 μA
nm
IF = 20 mA
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
nm
IF = 20 mA
°C/W
LED junction to anode lead
lm/W
Emitted Luminous Flux/Emitted
Radiant Flux
mlm
IF = 20 mA
lm/W
Emitted Luminous Flux/Electrical
Power
nm/°C
IF = 20 mA ; +25°C ≤ TJ ≤ +100°C
Notes:
1. The dominant wavelength, λd is derived from the CIE Chromaticity Diagram referenced to Illuminant E. Tolerance for each color of dominant
wavelength is +/- 0.5nm.
2. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / ηV where Iv is the luminous intensity in candela and ηV is
the luminous efficacy in lumens/ watt.
3. ηe = Φv /IF x VF where Φv is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
100
RELATIVE INTENSITY
0.8
Amber
FORWARD CURRENT-mA
1.0
Red
0.6
0.4
0.2
550
600
WAVELENGTH - nm
650
IFMAX - MAXIMUM FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
20
0
20
40
60
DC FORWARD CURRENT - mA
80
40
30
20
10
100
NORMALIZED INTENSITY
0.8
0.6
0.4
0.2
-30
0
30
60
ANGULAR DISPLACEMENT-DEGREE
0
0
20
40
60
80
TA - AMBIENT TEMPERATURE - C-
100
Figure 4. Maximum Forward Current vs Ambient Temperature
0.8
Figure 5.Radiation Pattern for 15° Viewing Angle Lamp
3
50
1.0
-60
1
2
FORWARD VOLTAGE-V
60
1.0
0.0
-90
0
Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Luminous Intensity vs Forward Current
NORMALIZED INTENSITY
40
700
Figure 1. Relative Intensity vs Peak Wavelength
60
0
0.0
500
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
80
90
0.6
0.4
0.2
0.0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT-DEGREE
Figure 6. Radiation Pattern for 23° Viewing Angle Lamp
60
90
NORMALIZED INTENSITY
1.0
0.8
0.6
0.4
0.2
0.0
-90
-60
-30
0
30
ANGULAR DISPLACEMENT-DEGREE
60
90
Figure 7. Radiation Pattern for 30° Viewing Angle Lamp
Relative Light Output vs Junction Temperature
RELATIVE LIGHT OUTPUT
(NORMALIZED AT T J =25°C)
10
Red
Amber
1
0.1
-40
-20
0
20
40
60
80
T J -JUNCTION TEMPERATURE - °C
100
120
140
Relative Forward Voltage vs Junction Temperature
0.20
Red
Amber
FORWARD VOLTAGE SHIFT - V
0.15
0.10
0.05
0.00
-0.05
-0.10
-0.15
-0.20
-40
-20
0
20
40
60
80
TJ - JUNCTION TEMPERATURE - °C
100
120
140
Intensity Bin Limit Table (1.3:1 Iv bin ratio)
Red Color Range
Intensity (mcd) at 20mA
Bin
Min
Max
Max
Min Dom Dom
V
4200
5500
618
W
5500
7200
X
7200
9300
Y
9300
12000
Z
12000
16000
1
16000
21000
630
X min
Y Min
X max
Y max
0.6872
0.3126
0.6890
0.2943
0.6690
0.3149
0.7080
0.2920
Tolerance for each bin limit is ± 0.5nm
Amber Color Range
Tolerance for each bin limit is ± 15%
Bin
Min
Dom
Max
Dom
Xmin
Ymin
Xmax
Ymax
1
584.5
587
0.5420
0.4580
0.5530
0.4400
0.5370
0.4550
0.5570
0.4420
2
587
589.5
0.5570
0.4420
0.5670
0.4250
0.5530
0.4400
0.5720
0.4270
0.5720
0.4270
0.5820
0.4110
0.5670
0.4250
0.5870
0.4130
0.5870
0.4130
0.5950
0.3980
0.5820
0.4110
0.6000
0.3990
VF Bin Table (V at 20mA)
Bin ID
Min
Max
VD
1.8
2.0
VA
2.0
2.2
VB
2.2
2.4
4
6
Tolerance for each bin limit is ± 0.05V
589.5
592
592
594.5
Tolerance for each bin limit is ± 0.5nm
Note:
All bin categories are established for classification of products. Products
may not be available in all bin categories. Please contact Avago
representative for further information.
Avago Color Bin on CIE 1931 Chromaticity Diagram
0.480
0.460
0.440
0.420
1
Amber
2
4
6
Y
0.400
0.380
0.360
0.340
0.320
Red
0.300
0.280
0.500
0.550
0.600
0.650
X
0.700
0.750
0.800
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 260°C and the solder
contact time does not exceeding 5sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED Configuration
• Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat
source (soldering iron’s tip) to the body is 1.59mm.
Soldering the LED using soldering iron tip closer than
1.59mm might damage the LED.
1.59mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave Soldering Manual Solder
[1, 2]
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
60 sec Max
-
Peak temperature
260 °C Max.
260 °C Max.
Dwell time
5 sec Max.
5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
Anode
Note: Electrical
InGaN connection
Device between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
Note: In order to further assist customer in designing jig accurately
that fit Avago Technologies’ product, 3D model of the product is
available upon request.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
260 °C Max
TEMPERATURE (°C)
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
105 °C Max
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
60sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Ammo Packs Drawing
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
Packaging Box for Ammo Packs
Note: The dimension for ammo pack is applicable for the device with standoff and without standoff.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
STANDARD LABEL LS0002
RoHS Compliant
e3
max temp 260C
(1T) Lot: Lot Number
(Q) QTY: Quantity
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Refer to below information
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID:
Made In: Country of Origin
10
Lamps Baby Label
RoHS Compliant
e3
max temp 260C
DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
Lamps Baby Label
(1P) PART #: Part Number
RoHS Compliant
e3
max temp 260C
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
OR
(ii) Color bin incorporated with VF Bin
BIN: 2VB
VB: VF bin “VB”
(Applicable for part number that have both color
bin and VF bin)
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR
FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE
CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved.
AV02-1687EN - December 12, 2008
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