HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6626-B Issued Date : 1994.12.07 Revised Date : 2000.10.01 Page No. : 1/3 HSC2682 NPN EPITAXIAL PLANAR TRANSISTOR Description Audio frequency power amplifier, high frequency power amplifier. Absolute Maximum Ratings (Ta=25°C) • Maximum Temperatures Storage Temperature ............................................................................................ -50 ~ +150 °C Junction Temperature ................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ................................................................................... 1.2 W Total Power Dissipation (Tc=25°C) ...................................................................................... 8 W • Maximum Voltages and Currents BVCBO Collector to Base Voltage .................................................................................... 180 V BVCEO Collector to Emitter Voltage................................................................................. 180 V BVEBO Emitter to Base Voltage ........................................................................................... 5 V IC Collector Current ....................................................................................................... 100 mA Electrical Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. 180 180 5 90 100 - Typ. 120 0.8 200 200 - Max. 1 1 500 1.5 320 5 Unit V V V uA uA mV V MHz pF Test Conditions IC=1mA IC=10mA IE=10uA VCB=180V VEB=3V IC=50mA, IB=5mA IC=50mA, IB=5mA IC=1mA, VCE=5V IC=10mA, VCE=5V IC=20mA, VCE=10V VCB=10V *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE2 Rank Range O 100-200 Y 160-320 HSMC Product Specification HI-SINCERITY Spec. No. : HE6626-B Issued Date : 1994.12.07 Revised Date : 2000.10.01 Page No. : 2/3 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 1000 1 100 Saturation Voltage (mV) VBE(sat) @ IC=10IB hFE VCE=5V 10 0.1 VCE(sat) @ IC=10IB 0.01 1 0.01 0.1 1 10 0.01 100 0.1 1 10 100 1000 10000 Collector Current (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage Cutoff Freuency & Collector Current 10 Cutoff Freqiemcu (MHz) Capacitance (pF) 1000 Cob 1 VCE=10 V 100 10 1 0.1 1 10 100 Reverse-Biased Voltage (V) 1 10 100 Collector Current (mA) Safe Operating Area Collector Current (mA) 10000 1000 100 PT=1 ms PT=100 ms 10 PT=1 s 1 1 10 100 1000 Forward Voltage (V) HSMC Product Specification HI-SINCERITY Spec. No. : HE6626-B Issued Date : 1994.12.07 Revised Date : 2000.10.01 Page No. : 3/3 MICROELECTRONICS CORP. TO-126ML Dimension Marking : A HSMC Logo Part Number Date Code B D F C Rank O H E Product Series Ink Marking 3 2 I Style : Pin 1.Emitter 2.Collector 3.Base G N 1 J M L K 3-Lead TO-126ML Plastic Package HSMC Package Code : D *:Typical Inches Min. Max. 0.1356 0.1457 0.0170 0.0272 0.0344 0.0444 0.0501 0.0601 0.1131 0.1231 0.0737 0.0837 0.0294 0.0494 0.0462 0.0562 DIM A B C D E F G H Millimeters Min. Max. 3.44 3.70 0.43 0.69 0.87 1.12 1.27 1.52 2.87 3.12 1.87 2.12 0.74 1.25 1.17 1.42 DIM I J K L M N O Inches Min. Max. *0.1795 0.0268 0.0331 0.5512 0.5906 0.2903 0.3003 0.1378 0.1478 0.1525 0.1625 0.0740 0.0842 Millimeters Min. Max. *4.56 0.68 0.84 14.00 15.00 7.37 7.62 3.50 3.75 3.87 4.12 1.88 2.14 Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification