HP HSMH-C191 Surface mount chip led Datasheet

Surface Mount Chip LEDs
Technical Data
HSMx-C110/C120/C150/
C170/C177/C190/C191/
C197/C265
Features
Description
•
•
•
•
•
These chip LEDs are designed
in an industry standard package
for ease of handling and use.
Various different LED colors are
available in nine compact, single
color packages.
Small Size
Industry Standard Footprint
Compatible with IR Solder
Diffused Optics
Operating Temperature
Range of -30°C to +85°C
• Right Angle & Reverse
Mount Package Available
• Various Colors Available
• Available in 8 mm Tape on
7 in. (178 mm) Diameter
Reels
Applications
•
•
•
•
•
Keypad Backlighting
Push-Button Backlighting
LCD Backlighting
Symbol Backlighting
Front Panel Indicator
The HSMx-C150 has the industry
standard 3.2 x 1.6 mm footprint
that is excellent for all around use.
The HSMx-C170 has the widely
used 2.0 x 1.25 mm footprint with
0.8 mm profile. The HSMx-C177
has the widely used 2.0 x 1.25 mm
footprint with 0.4 mm profile. The
HSMx-C19x series has the industry
standard 1.6 x 0.8 mm footprint
with varying profile to suit
designers needs, the HSMx-C190
has 0.8 mm profile, the HSMxC191 has a low profile of 0.6 mm,
and the HSMx-C197 has the ultra
low profile of 0.4 mm. This family
with its thin profile and wide
viewing angle makes this LED
exceptional for backlighting
applications.
The HSMx-C110 is a right angle
package with the universally
accepted dimensions of 3.2 x 1.0
x 1.5 mm. The HSMx-C120 is a
smaller right angle package with
industry standard 1.6 x 0.6 x 1.0
mm. HSMx-C265 is a reverse
mount package with dimensions
of 3.4 x 1.25 x 1.1 mm. These
devices are ideal for LCD
backlighting and sidelighting
applications.
In order to facilitate pick and
place operation, these chip LEDs
are shipped in tape and reel with
4000 units per reel for HSMxC120, C170, C177, C190, C191,
C197 packages, and 3000 units
per reel for HSMx-C110, C150,
C265 packages.
All packages are compatible with
IR reflow solder processes. The
small size and wide viewing angle
make these LEDs prime choices
for backlighting applications and
front panel illumination especially
where space is a premium.
2
Device Selectiion Guide
GaP
Green
HSMG-C110
HSMG-C120
HSMG-C150
HSMG-C170
HSMG-C177
HSMG-C190
HSMG-C191
HSMG-C197
HSMG-C265
As AlGaAs
Red
HSMH-C110
HSMH-C120
HSMH-C150
HSMH-C170
HSMH-C190
HSMH-C191
HSMH-C265
HER
HSMS-C110
HSMS-C120
HSMS-C150
HSMS-C170
HSMS-C177
HSMS-C190
HSMS-C191
HSMS-C197
–
Orange
HSMD-C110
HSMD-C120
HSMD-C150
HSMD-C170
HSMD-C177
HSMD-C190
HSMD-C191
HSMD-C197
–
Description
Untinted, Non-Diffused
Untinted, Non-Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Non-Diffused
Yellow
HSMY-C110
–
HSMY-C150
HSMY-C170
–
HSMY-C190
HSMY-C191
HSMY-C197
–
Description
Untinted, Non-Diffused
Untinted, Non-Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Non-Diffused
3
Package Dimensions
CATHODE (ANODE MARK FOR
MARK
HSMH-C170)
CATHODE (ANODE MARK FOR
HSMH-C150)
MARK
LED DIE
LED DIE
1.25 (0.049)
1.6 (0.063)
0.8 (0.031)
0.62 (0.024)
2.0 (0.079 )
3.2 (0.126 )
DIFFUSED
EPOXY
POLARITY[3]
2.0 (0.079)
0.6 (0.024)
POLARITY[3]
1.4
(0.055)
DIFFUSED
EPOXY
0.3 (0.012)
1.1 (0.043)
PC BOARD
PC BOARD
0.8 (0.031)
CATHODE LINE
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
0.50 ± 0.2
(0.020 ± 0.008)
0.3 (0.012)
CATHODE LINE
0.4 ± 0.15
(0.016 ± 0.006)
0.4 ± 0.15
(0.016 ± 0.006)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C150
HSMx-C170
CATHODE (ANODE MARK FOR
HSMH-C190)
MARK
LED DIE
CATHODE
LINE
LED DIE
(ANODE MARK
FOR HSMH-C110)
1.0 (0.039)
0.8 (0.031)
2.6 (0.102 )
0.4 (0.016)
1.6
(0.063 )
3.2 (0.126 )
1.0
(0.039)
POLARITY[3]
POLARITY
CLEAR
EPOXY
0.3 (0.012)
1.5 (0.059)
DIFFUSED EPOXY
PC BOARD
PC BOARD
CATHODE LINE
1.6 (0.063 )
0.8 (0.031)
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.5 (0.020)
3.2 (0.126 )
0.8 (0.031)
CATHODE LINE
1.0 (0.039)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
HSMx-C190
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings.
SOLDERING
TERMINAL
HSMx-C110
4
CATHODE MARK
CATHODE
MARK
LED DIE
LED DIE
0.8 (0.031)
1.25
(0.049)
0.4 (0.016)
1.6
(0.063 )
0.62
(0.025)
2.00 (0.079)
1.0
(0.039)
POLARITY
POLARITY
DIFFUSED EPOXY
0.40 (0.016)
0.3 (0.012)
DIFFUSED EPOXY
PC BOARD
PC BOARD
0.16 (0.006)
0.8 (0.031)
0.26 (0.010)
CATHODE LINE
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.40 ± 0.15
(0.016 ± 0.006)
0.40 ± 0.15
(0.016 ± 0.006)
0.7 (0.028) MIN.
1.10 (0.043) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C177
HSMx-C191
3.4 (0.134)
CATHODE
MARK (ETCHED)
[ANODE MARK FOR HSMH-C265]
LED DIE
CATHODE MARK
LED DIE
1.25 (0.049)
0.80
(0.031)
GREEN SOLDER MASK
1.60
(0.063)
POLARITY
1.2
(0.047)
UNDIFFUSED
EPOXY
1.1 (0.043)
0.40 (0.016)
POLARITY
DIFFUSED
EPOXY
1.1 (0.043)
0.40 (0.016)
PC BOARD
PC BOARD
0.16 (0.006)
0.3 (0.012)
CATHODE LINE
CATHODE LINE
0.50 ± 0.15
(0.020 ± 0.006)
0.50 ± 0.15
(0.020 ± 0.006)
0.30 ± 0.15
(0.012 ± 0.006)
0.70 (0.028) MIN.
SOLDERING
TERMINAL
HSMx-C265
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings.
SOLDERING
TERMINAL
HSMx-C197
5
CATHODE MARK
(ANODE MARK FOR HSMH-C120)
LED DIE
0.3 (0.012)
0.6 (0.024)
1.6 (0.063)
POLARITY
1.2 (0.047)
CLEAR EPOXY
1.0 (0.039)
PC BOARD
0.4 (0.016)
3 – 0.3 (0.012)
CATHODE LINE
SOLDERING
TERMINAL
HSMx-C120
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
3. Polarity for HSMH-C1x0 will be the opposite of what is shown on above drawings.
6
Absolute Maximum Ratings for GaP at TA=25°C
Parameter
DC Forward Current [1]
Peak Pulsing Current[2]
Power Dissipation
Reverse Voltage (I R=100 µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
C110/150/265
25
100
65
5
95
-30 to +85
-40 to +85
C120/170/177/190/191/197
Units
20
mA
100
mA
52
mW
5
V
95
°C
-30 to +85
°C
-40 to +85
°C
See reflow soldering profile (Figure 9 & 10)
Absolute Maximum Ratings for AlGaAs at TA=25°C
Parameter
DC Forward Current[1]
Peak Pulsing Current[2]
Power Dissipation
Reverse Voltage (IR =100µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
C110/150
30
100
78
5
95
-30 to +85
-40 to +85
C120/170/177/190/191/197/265
25
100
65
5
95
-30 to +85
-40 to +85
See reflow soldering profile (Figure 9 & 10)
Units
mA
mA
mW
V
°C
°C
°C
Notes:
1. Derate linearly as shown in Figure 4 for temperature above 25°C.
2. Pulse condition of 1/10 duty and 0.1 msec. width.
Electrical Characteristics at TA=25°C
Reverse
Capacitance
Forward Voltage Breakdown
C(pF),
Thermal
Part Number
Color
VF(Volts)
VR(Volts)
@ VF = 0 V, Resistance
@ IF = 20 mA @ IR = 100 µA f = 1 MHz RθJ-P (°C/W)
Typ.
Max.
Min.
Typ.
Typ.
HSMS-C110/150
HER
2.1
2.6
5
5
400
HSMS-C120
350
HSMS-C170/177/190/191/197
250
HSMD-C110/150
Orange
2.2
2.6
5
7
400
HSMD-C120
350
HSMD-C170/177/190/191/197
250
HSMY-C110/150
Yellow
2.1
2.6
5
6
400
HSMY-C170/190/191/197
250
HSMG-C110/150
Green
2.2
2.6
5
9
400
HSMG-C120
350
HSMG-C170/177/190191/197/265
250
HSMH-C110/150
AlGaAs
1.8
2.6
5
18
460
HSMH-C120
400
HSMH-C170/190/191/265
300
7
Optical Characteristics at TA=25°C
Part Number
HSMG-C110/177/197
HSMG-C120
HSMG-C150/170/190/191/265
HSMS-C110/177/197
HSMS-C120
HSMS-C150/170/190/191
HSMD-C110/177/197
HSMD-C120
HSMD-C150/170/190/191
HSMY-C110/197
HSMY-C150/170/190/191
HSMH-C110
HSMH-C120
HSMH-C150/170/190/191/265
Luminous
Peak
Dominant
Intensity[1]
Wavelength Wavelength
Viewing
Color Iv(mcd)@20mA lpeak(nm)
ld(nm)
Angle 2u1/2(°)[2]
Min.
Typ.
Typ.
Typ.
Typ.
Green
4.5
15.0
570
572
130
155
170
HER
2.8
10.0
630
626
130
155
170
Orange
2.8
8.0
605
604
130
155
170
Yellow
2.8
8.0
589
586
130
170
AlGaAs
7.2
17.0
660
639
130
155
170
Notes:
1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of
the lamp package.
2. u1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Color Bin Limits [1]
Green Color Bins[1]
Dom. Wavelength (nm)
Min.
Max.
561.5
564.5
564.5
567.5
567.5
570.5
570.5
573.5
573.5
576.5
Bin ID
A
B
C
D
E
Tolerance: ± 0.5 nm
Yellow/Amber Color Bins[1]
Bin ID
A
B
C
D
E
F
Dom. Wavelength (nm)
Min.
Max.
582.0
584.5
584.5
587.0
587.0
589.5
589.5
592.0
592.0
594.5
594.5
597.0
Tolerance: ± 0.5 nm
Orange Color
Bin ID
A
B
C
D
E
F
Tolerance: ± 1 nm
Bins[1]
Dom. Wavelength (nm)
Min.
Max.
597.0
600.0
600.0
603.0
603.0
606.0
606.0
609.0
609.0
612.0
612.0
615.0
8
Light Intensity (Iv) Bin Limits[1]
Intensity
Min.
0.11
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
Bin ID
A
B
C
D
E
F
G
H
J
K
L
M
(mcd)
Max.
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
28.50
Intensity
Min.
28.50
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
Bin ID
N
P
Q
R
S
T
U
V
W
X
Y
(mcd)
Max.
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
4500.00
Note:
1. Bin categories are established for classification of products. Products may not
be available in all categories. Please contact your Agilent representative for information on currently available bins.
Tolerance: ± 15%
1.0
RELATIVE INTENSITY
GREEN
AlGaAs
YELLOW
0.5
ORANGE
0
500
HER
550
600
650
700
750
WAVELENGTH – nm
1.6
AlGaAs
HER
AlGaAs
GREEN
10
1
YELLOW
0.1
1.7
1.9
1.2
0.8
0.4
GaP
ORANGE
1.5
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
IF – FORWARD CURRENT – mA
100
2.1
VF – FORWARD VOLTAGE – V
Figure 2. Forward Current vs.
Forward Voltage.
2.3
0
0
10
20
30
IF – FORWARD CURRENT – mA
Figure 3. Luminous Intensity vs.
Forward Current.
40
IF MAX. – MAXIMUM FORWARD CURRENT – mA
Figure 1. Relative Intensity vs. Wavelength.
35
C110/C150 AlGaAs
30
C110/C150/C265
HER, ORANGE,
YELLOW, GREEN
C120/C170/C177/
C190/C191/C197/
C265 AlGaAs
25
20
10
5
0
RθJ-A =
600°C/W
C120/C170/
C177/C190/
C191/C197
HER,
ORANGE,
YELLOW,
GREEN
15
0
20
RθJ-A =
800°C/W
40
60
80
100
TA – AMBIENT TEMPERATURE – °C
Figure 4. Maximum Forward Current
vs. Ambient Temperature.
9
1.00
RELATIVE INTENSITY – %
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
1.00
RELATIVE INTENSITY – %
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative Intensity vs. Angle for HSMx-C110.
100
RELATIVE INTENSITY
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
ANGLE
100
RELATIVE INTENSITY
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 6. Relative Intensity vs. Angle for HSMx-C120.
10
100
RELATIVE INTENSITY – %
90
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 7. Relative Intensity vs. Angle for HSMx-C177 and C197.
1.00
RELATIVE INTENSITY – %
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 8. Relative Intensity vs. Angle for HSMx-C150, C170, C190, C191 and C265.
10 to 20 SEC.
255 °C (+5/-0)
TEMPERATURE
217 °C
TEMPERATURE
10 SEC. MAX.
230°C MAX.
4°C/SEC. MAX.
140-160°C
3 °C/SEC. MAX.
6 °C/SEC. MAX.
100 - 150 °C
60 to 150 SEC.
MAX. 120 SEC.
3°C/SEC. MAX.
4°C/SEC.
MAX.
TIME
OVER 2 MIN.
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 9. Recommended Reflow Soldering Profile.
Figure 10. Recommended Pb-Free Reflow Soldering Profile.
0.8 (0.031)
1.5 (0.059)
1.2 (0.047)
1.2
(0.047)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
Figure 11. Recommended Soldering
Pattern for HSMx-C150.
1.2
(0.047)
0.9
(0.035)
Figure 12. Recommended Soldering
Pattern for HSMx-C170 and C177.
0.8
(0.031)
0.8
(0.031)
0.7
(0.028)
Figure 13. Recommended Soldering
Pattern for HSMx-C190, C191 and C197.
11
5.0 (0.200)
0.9 (0.035)
0.4 (0.016)
0.9 (0.035)
0.4 (0.016)
1.0 (0.039)
0.2 (0.008)
0.7 (0.028)
0.15 (0.006)
CENTERING
BOARD
1.5
(0.059)
2.0
(0.079)
CENTERING
BOARD
1.5
(0.059)
0.8
(0.031)
Figure 14. Recommended Soldering Pattern
for HSMx-C110.
1.2
(0.047)
0.8
(0.031)
Figure 15. Recommended Soldering Pattern for HSMx-C120.
USER FEED DIRECTION
2.2 (0.087) DIA. PCB HOLE
CATHODE SIDE
1.25 (0.049)
1.4
(0.055)
2.3
(0.091)
1.4
(0.055)
PRINTED LABEL
Figure 16. Recommended Soldering Pattern for
HSMx-C265.
Figure 17. Reeling Orientation.
8.0 ± 1.0 (0.315 ± 0.039)
10.50 ± 1.0 (0.413 ± 0.039)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
3.0 ± 0.5
(0.118 ± 0.020)
59.60 ± 1.00
(2.346 ± 0.039)
178.40 ± 1.00
(7.024 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
6
PS
Figure 18. Reel Dimensions.
Note: All dimensions in millimeters (inches).
5.0 ± 0.5
(0.197 ± 0.020)
12
4.00 (0.157)
DIM. C
(SEE TABLE 1)
CATHODE
1.50 (0.059)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
4.00 (0.157)
HSMx-C110/C120
POSITION IN
CARRIER TAPE
PART NUMBER
HSMx-C110 SERIES
HSMx-C120 SERIES
HSMx-C150 SERIES
HSMx-C170 SERIES
HSMx-C177 SERIES
HSMx-C190 SERIES
HSMx-C191 SERIES
HSMx-C197 SERIES
DIM. A
(SEE TABLE 1)
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
DIM. A
± 0.10 (0.004)
3.40 (0.134)
1.90 (0.075)
3.50 (0.138)
2.30 (0.091)
2.30 (0.091)
1.80 (0.071)
1.86 (0.073)
1.75 (0.069)
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004)
1.70 (0.067) 1.20 (0.047)
1.15 (0.045) 0.80 (0.031)
1.88 (0.074) 1.27 (0.050)
1.45 (0.057) 0.95 (0.037)
1.40 (0.055) 0.60 (0.024)
0.95 (0.037) 0.87 (0.034)
0.89 (0.035) 0.87 (0.034)
0.95 (0.037) 0.60 (0.024)
R 1.0 ± 0.05
(0.039 ± 0.002)
DIM. B
(SEE TABLE 1)
R 0.5 ± 0.05
(0.020 ± 0.002)
4.00 (0.157)
CATHODE
1.50 (0.059)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
CARRIER TAPE
USER FEED
DIRECTION
4.00 (0.157)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
PART NUMBER
DIM. A
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057)
Figure 19. Tape Dimensions.
COVER TAPE
1.30 (0.051)
END
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
START
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
Figure 20. Tape Leader and Trailer Dimensions.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.)unless otherwise specified.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Storage Condition: 5 to 30˚ C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5˚C for 20 hours.
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5988-6271EN
May 17, 2004
5989-0463EN