HI-SINCERITY Spec. No. : HJ200201 Issued Date : 2000.12.21 Revised Date : 2002.01.23 Page No. : 1/3 MICROELECTRONICS CORP. HTL294J PNP EPITAXIAL PLANAR TRANSISTOR Description The HTL294J is designed for application that requires high voltage. Features TO-252 • High Breakdown Voltage: 400(Min.) at IC=1mA • High Current: IC=300mA at 25°C Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature .................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) .................................................................................... 1.5 W • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ...................................................................................... -400 V VCEO Collector to Emitter Voltage ................................................................................... -400 V VEBO Emitter to Base Voltage ............................................................................................. -6 V IC Collector Current ...................................................................................................... -300 mA Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO ICES IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat) *hFE1 *hFE2 *hFE3 ft Cob Min. -400 -400 -6 50 60 50 50 - Typ. - Max. -1 -10 -0.2 -300 -500 -750 250 30 Unit V V V uA uA uA mV mV mV MHz pF Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-400V, IE=0 VCE=-400V, IC=0 VEB=-6V, VBE=0 IC=-10mA, IB=-1mA IC=-50mA, IB=-5mA IC=-10mA, IB=-1mA VCE=-10V, IC=-1mA VCE=-10V, IC=-20mA VCE=-10V, IC=-80mA VCE=-20V, IE=-10mA, f=1MHz VCB=-20V, f=1MHz, IE=0 *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% HTL294J HSMC Product Specification HI-SINCERITY Spec. No. : HJ200201 Issued Date : 2000.12.21 Revised Date : 2002.01.23 Page No. : 2/3 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Sasturation Voltage & Collector Current 10000 Saturation Voltage (mV) hFE 1000 100 hFE @ VCE=10V 1000 VCE(sat) @ IC=20IB VCE(sat) @ IC=10IB 100 10 10 0.1 1 10 100 1 1000 10 Collector Current-IC (mA) 100 1000 Collector Current-IC (mA) Saturation Voltage & Collector Current Capacitance & Reverse-Biased Voltage 1000 100 Capacitance (pF) Saturation Voltage (mV) VBE(sat) @ IC=10IB Cob 10 1 100 1 10 100 0.1 1000 Collector Current-IC (mA) 1 10 100 Reverse Biased Voltage (V) Safe Operating Area Power Derating 10 1.6 1.4 PD(W), Power Dissipation Collector Current-IC (A) PT=1mS 1 PT=100mS PT=1S 0.1 1.2 1 0.8 0.6 0.4 0.2 0.01 0 1 10 100 Forward Biased Voltage-V CE (V) HTL294J 1000 0 50 o 100 150 200 Ta( C) , Ambient Temperature HSMC Product Specification HI-SINCERITY Spec. No. : HJ200201 Issued Date : 2000.12.21 Revised Date : 2002.01.23 Page No. : 3/3 MICROELECTRONICS CORP. TO-252 Dimension Marking: C A H T L 2 9 4 J D B Date Code Control Code G F L Style: Pin 1.Base 2.Collector 3.Emitter 3 H E K 2 I 1 J 3-Lead TO-252 Plastic Surface Mount Package HSMC Package Code: J *: Typical Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2520 0.2677 0.2125 0.2283 DIM A B C D E F Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.40 6.80 5.40 5.80 DIM G H I J K L Inches Min. Max. 0.0866 0.1102 *0.0906 0.0354 0.0315 0.2047 0.2165 0.0551 0.0630 Millimeters Min. Max. 2.20 2.80 *2.30 0.90 0.80 5.20 5.50 1.40 1.60 Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: • Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HTL294J HSMC Product Specification