HV895 Liquid Lens Driver Features General Description ► ► ► ► ► ► ► ► ► The HV895 is designed to drive liquid lenses of up to 200pF with a 1.5kHz waveform at amplitudes up to 60VRMS, controlled via an I2C interface. Drives capacitive loads up to 200pF Programmable drive amplitude (up to 60VRMS) On-chip boost converter No external inductor I2C interface Low operating current (≤20mA) Low standby current (≤1.0µA) Controlled drive edge reduces EMI 1.0mm × 6.0mm flip-chip A single byte (AMP) written to the HV895 controls the operation of the driver. Setting AMP = 01h to FFh controls output amplitude in 255 monotonic steps. Setting AMP = 00h causes the HV895 to go into low power standby mode, consuming less than 1.0µA. When active, the HV895 draws less than 20mA. A charge pump boost converter integrated on-chip provides the high voltage necessary for driving the lens. No external inductors or diodes are needed. Two ceramic 0402 size capacitors are the only external components required for a complete lens driver circuit. The narrow die size and only 2 small external components allow an entire lens driver circuit to be incorporated inside a camera module. Applications ► ► ► ► ► Cell phone and PDA cameras Bar code readers Web and laptop cameras Biometric scanners Ultracompact cameras An H-bridge output stage provides AC drive to the lens, allowing the use of a single high voltage boost converter while providing alternating polarity to the lens. Controlled rising and falling edges on the drive waveform reduces EMI. The HV895 is offered in a 1.0mm × 6.0mm lead-free solderbumped flip-chip. Typical Application Circuit I2C bus VDD 1.7 -2.95V VD D OUT1 SDA SCL VIN 2.65 - 5.5V CIN 2.2μF 6.3V VIN1 VIN2 CHV 4.7nF 100V Liquid Lens 100 -200pF HV895 OUT2 HV GND1 GND2 HV895 Ball Configuration Ordering Information DUM1 Device Die Option HV895BD Lead-free solder-bumped die DUM2 VIN1 GND1 This product is RoHS compliant (‘Green’) VDD VIN2 SDA GND2 SCL HV OUT2 Absolute Maximum Ratings Solder-bumped Die Parameter (bottom view) Value VIN, VDD -0.5V to 6.5V SDA, SCL -0.5V to 6.5V Product Marking -40°C to +85°C H V 8 9 5 B D -65°C to +150°C L L L L L L L Operating temperature Storage temperature OUT1 Device may not meet specifications, but will incur no damage. L Y W L L Y = Year W = Week L = Lot Number Orientation mark Solder-bumped Die (top view) Recommended Operating Conditions Sym Parameter Min Typ Max Units VIN Supply voltage 2.65 - 5.5 V --- VDD I2C logic level reference 1.70 - 2.95 V --- - - 2.0 ms --- - 2.2 - μF --- (1) Conditions tVIN Time for VIN to ramp to 90% CIN Supply bypass capacitor CHV High voltage storage capacitor 24 - - x CLOAD Load (lens) capacitance 100 150 200 pF --- - - 400 kHz --- -25 - +85 CLOAD 2 fSCL I C clock TA Ambient temperature O C 100V rating --- Notes: 1. To assure the driver powers up in standby state. No damage will occur if ramped up slower. Electrical Specifications (Over recommended operating conditions @ 25 C unless otherwise specified) O Sym Parameter Min Typ Max Units Conditions IIN VIN supply current - 8.0 500 20 nA mA AMP = 00h, SDA = VDD, SCL = VDD AMP = FFh, SDA = VDD, SCL = VDD IDD VDD supply current - 9.0 500 12 nA μA AMP = 00h, SDA = VDD, SCL = VDD AMP = FFh, SDA = VDD, SCL = VDD HV Output voltage of internal boost converter 71 75 79 V CLOAD = 0pF 2 HV895 Electrical Specifications (cont.)(Over recommended operating conditions @ 25 C unless otherwise specified) O Sym Parameter Min Typ Max Units Conditions VOUT(AC) AC output voltage 9.0 55.0 0 9.6 59.7 10.0 62.7 VRMS AMP = 00h AMP = 01h AMP = FFh VOUT(DC) DC output offset voltage -2.0 0 +2.0 V --- DNL Differential non-linearity (guaranteed monotonic) -0.5 - +0.5 LSB --- fOUT Output frequency 1.0 1.5 2.0 kHz --- DX Transition time (fraction of period) - 4.7 - % --- Output slope - 4.7 - V/μs - - 20 ms AMP = 00h → FFh, CHV = 4.7nF Over any 1-step AMP increment or decrement (except 00h) dV/dt 1 CLOAD = 150pF, VIN = 3.8V tSU Startup time to 90% amplitude tA Amplitude response time1 - - 5.0 ms VIL Logic low input voltage - - 0.30 x VDD --- VIH Logic high input voltage 0.7 - - x VDD --- VOL Logic low output voltage - - 0.2 x VDD ILOAD = 3.0mA IL Logic low input current - - 10 μA VDD = 1.70 - 2.95V IH Logic high input current - - 10 μA VDD = 1.70 - 2.95V CLI Logic input capacitance - - 10 pF VDD = 1.70 - 2.95V, grounded or open Notes: 1. Measured from the rising edge of the I2C acknowledge bit that terminates transmission of the AMP data byte. Block Diagram and Typical Application CHV 4.7nF 100V HV VIN2 VANA 2.65 – 5.50V VDIG 1.70 – 2.95V VIN1 CIN 2.2µF 6.3V DC/DC GND1 DAC OUT1 VDD Host Controller HV895 8 SDA I2C bus SCL Control H-bridge driver amp CLENS 100 – 200pF enable OUT2 Osc GND2 3 HV895 Output Waveform DX AMP=FFh dV/dt VOUT (all edges) AMP<FFh DX 1 / fOUT Applications Information I2C The HV895 is a write-only fast mode I2C device. Logic voltages are referenced to VDD. Address The HV895 recognizes a 7-bit address. The device is pre-programmed with an I2C address of 0100011b. For other addresses, please contact the factory. Data A single byte written to the HV895 controls the operation of the lens driver. See the Command Table below. The MSB is clocked-in first. Command Table AMP Description Low power standby mode. When in standby mode, the internal boost converter and H-bridge oscillator are shut down, and the OUT pins are held at ground. 00h Any AMP value other than 00h brings the HV895 out of standby mode. The time it takes the HV895 to exit standby mode and achieve full output amplitude is less than 20ms with a 4.7nF capacitor on the HV pin. Faster startup times may be achieved by lowering CHV at the expense of possible waveform distortion. Controls output amplitude according to: 01h-FFh VOUT(RMS) = 9.4VRMS + (AMP • 197mVRMS) where AMP is an integer from 1 to 255 Supplies VIN must be ramped up in less than 2.0ms to assure the driver starts-up in standby mode. If brought up slower, the driver may not start-up in standby mode, with output amplitude at an indeterminate level. In this case, writing AMP = 00h brings the driver to standby mode. No damage will occur if ramped slower than 2.0ms. 4 HV895 Die Dimensions +0 1000–75 500 ±25 DUM2 DUM1 VIN1 GND1 VDD +0 6000 –196 VIN2 SDA GND2 SCL Y HV 124–137 X OUT2 Note: All dimensions in µm OUT1 0 442.8 143.3 0 Orientation mark this end, top side 100 ±25 Side View Bottom View Bump Coordinates and Descriptions (XY coordinates reference center of bump and are in µm. Tolerance is ±15µm.) Bump X Y VIN1 353.4 5201.7 VIN2 675.4 2424.6 VIN1 supplies the DC-DC converter. VIN2 supplies the rest of the IC. They must be tied together. To minimize conducted EMI, bypass with a 2.2µF ceramic capacitor to ground close to the IC. VDD 12.7 2891.0 Externally supplied reference voltage for the I2C logic levels. Connect to the I2C bus supply. GND1 353.4 4397.6 GND2 -14.8 1844.0 GND1 is the ground for the for the DC-DC converter, while GND2 is for the rest of the IC. Connect both to system ground. SCL 12.7 1594.0 Serial clock for the I2C interface. The HV895 is a Fast Mode device (fSCL ≤ 400kHz). SDA 12.7 2171.2 Serial data for the I2C interface. The HV895 is a write-only device, with a single 8-bit command byte (AMP, see page 4). HV 722.4 1006.6 High voltage DC output of the internal boost converter. Connect a 4.7nF, 100V ceramic capacitor to ground close to the IC. OUT1 666.3 0.0 OUT2 0 0 DUM1 3.9 5334.2 DUM2 702.9 5334.2 Description Outputs of the H-bridge driver. The liquid lens connects between these two bumps. When disabled (AMP = 00h), both of these outputs are held at ground. These bumps are for mechanical support only. Provide pads on the PCB for these solder bumps. No electrical connections should be made to these bumps. Doc.# DSFP-HV895 NR031408 5